WO2023137850A1 - Detection method and system for crimping state of connector, and controller and storage medium - Google Patents

Detection method and system for crimping state of connector, and controller and storage medium Download PDF

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Publication number
WO2023137850A1
WO2023137850A1 PCT/CN2022/080742 CN2022080742W WO2023137850A1 WO 2023137850 A1 WO2023137850 A1 WO 2023137850A1 CN 2022080742 W CN2022080742 W CN 2022080742W WO 2023137850 A1 WO2023137850 A1 WO 2023137850A1
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Prior art keywords
crimping
connector
parameter
parameters
state
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PCT/CN2022/080742
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French (fr)
Chinese (zh)
Inventor
李丹霞
马军华
王峰
董典桥
汪志坤
杨政凯
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中兴通讯股份有限公司
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Publication of WO2023137850A1 publication Critical patent/WO2023137850A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/21Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/211Selection of the most significant subset of features
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the embodiments of the present application relate to but are not limited to the technical field of device detection, and in particular, relate to a method for detecting a crimped state of a connector, a controller, a system for detecting a crimped state of a connector, and a computer-readable storage medium.
  • Connector crimping is a process technology that uses elastic deformable pins or hard pins to cooperate with PCB metallized holes to form close contact points between pins and metallized holes to achieve electrical interconnection.
  • the current detection methods mainly include visual inspection, 3D X-ray test and ICT test.
  • problems such as poor stability, high cost, slow detection speed or detection errors.
  • Embodiments of the present application provide a method for detecting a crimping state of a connector, a controller, a system for detecting a crimping state of a connector, and a computer-readable storage medium.
  • an embodiment of the present application provides a detection method for a crimping state of a connector, which is applied to a controller in a detection system.
  • the detection system further includes a crimping device, and the controller communicates with the crimping device.
  • the detection method includes: acquiring a displacement parameter and a crimping force parameter of a crimping head of the crimping device during crimping the connector; performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain a feature parameter; comparing the feature parameter with a preset feature parameter, and determining the crimping state of the connector according to the comparison result.
  • the embodiment of the present application also provides a controller, a memory, a processor, and a computer program stored on the memory and operable on the processor, and the processor implements the connector crimping state detection method described in the first aspect when executing the computer program.
  • an embodiment of the present application further provides a detection system for a crimping state of a connector, including a crimping device and the controller described in the second aspect above, where the controller communicates with the crimping device.
  • the embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions, the computer-executable instructions being used to execute the connector crimping state detection method described in the first aspect above.
  • Figure 1 is a schematic diagram of a connector crimping process
  • Fig. 2 is a schematic diagram of a situation where the connector falls off
  • FIG. 3 is a schematic diagram of a system architecture for performing a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 4 is a flow chart of a method for detecting a connector crimping state provided by an embodiment of the present application
  • FIG. 5 is a flowchart of obtaining a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 6 is a flow chart of performing feature extraction processing on crimping curves to obtain characteristic parameters in the detection method of connector crimping state provided by an embodiment of the present application;
  • Fig. 7 is a flowchart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by an embodiment of the present application;
  • Fig. 8 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
  • FIG. 9 is a flowchart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application.
  • FIG. 10 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
  • Fig. 11 is a flow chart of obtaining preset characteristic parameters in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • FIG. 12 is a flow chart of correcting preset characteristic parameters in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 13 is a schematic diagram of a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 14 is a schematic diagram of the size of the pins protruding from the PCB board surface in the method for detecting the crimping state of the connector provided by one embodiment of the present application;
  • FIG. 15 is a schematic structural diagram of a detection system for a connector crimping state provided by an embodiment of the present application.
  • Fig. 16 is a data block diagram of a detection system for a connector crimping state provided by an embodiment of the present application
  • Fig. 17 is a schematic diagram of crimping standard curves P 1 and P 2 in the detection method of connector crimping state provided by an embodiment of the present application;
  • FIG. 18 is a comparative schematic diagram of connector crimping incomplete curves in the detection method of connector crimping state provided by an embodiment of the present application.
  • connector crimping is a process technology that uses elastic deformable pins or hard pins to cooperate with PCB (Printed Circuit Board, printed circuit board) metallized holes to form close contact points between pins and metallized holes to realize electrical interconnection.
  • PCB printed Circuit Board, printed circuit board
  • the current detection methods mainly include visual inspection, 3D X-ray (Three-Dimensional X-ray, three-dimensional X-ray) test and ICT (In Circuit Tester, automatic online tester) test, etc.
  • Visual inspection mainly relies on manual observation, which cannot accurately detect hidden defects such as kneeling stitches, and is affected by individual differences among inspectors, making it difficult to guarantee the consistency and stability of crimping quality.
  • 3D X-ray testing technology uses X-rays to penetrate the device and PCB, and uses layered technology imaging to check whether the pins are inserted into the holes to detect whether the connector is crimped well. 3D X-ray equipment is expensive.
  • ICT testing technology judges whether the connector crimping is normal by detecting whether the connector and the PCB are electrically interconnected, which is currently the most widely used detection method.
  • This solution needs to develop a test fixture separately, and the detection effect is greatly affected by the precision of the fixture, and it is difficult to locate after the same network fault, especially for the fault that there is electrical interconnection but incomplete crimping cannot be effectively identified when the pin is connected to the PCB hole.
  • connector crimping curves are currently in its infancy. More and more crimping equipment supports crimp curve feedback. Some crimping equipment tries to optimize the crimping program settings through the crimping curve, and carry out early warning and interception of the bad crimping process. However, due to the introduction of tolerances such as PCB thickness, PCB warpage, and molds, the crimping curve will fluctuate, and the actual application effect is not good.
  • embodiments of the present application provide a method for detecting a crimping state of a connector, a controller, a system for detecting a crimping state of a connector, and a computer-readable storage medium, wherein the method for detecting a crimping state of a connector is applied to a controller in the detection system, and the detection system further includes a crimping device, and the controller communicates with the crimping device. parameter to determine the crimp state of the connector based on the comparison result.
  • the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector.
  • it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and have important practicability in the quality control of connector crimping.
  • FIG. 3 is a schematic diagram of a system architecture 100 for performing a method for detecting a crimping state of a connector provided by an embodiment of the present application.
  • the system architecture 100 is provided with a processor 110 and a memory 120 , wherein the processor 110 and the memory 120 may be connected via a bus or in other ways, and in FIG. 3 the connection via a bus is taken as an example.
  • the memory 120 can be used to store non-transitory software programs and non-transitory computer-executable programs.
  • the memory 120 may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices.
  • the memory 120 may include memory 120 located remotely relative to the processor 110 , and these remote memories may be connected to the system architecture 100 through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
  • system architecture 100 can be applied to 3G communication network systems, LTE communication network systems, 5G communication network systems and subsequent evolved mobile communication network systems, etc., which is not specifically limited in this embodiment.
  • system architecture 100 shown in FIG. 3 does not limit the embodiment of the present application, and may include more or less components than shown in the figure, or combine some components, or arrange different components.
  • the processor 110 can call the detection program of the connector crimping state stored in the memory 120 , so as to execute the detection method of the connector crimping state.
  • FIG. 4 is a flowchart of a method for detecting a crimping state of a connector provided by an embodiment of the present application; the method for detecting a crimping state of a connector in an embodiment of the present application is applied to a controller in a detection system.
  • the detection system also includes a crimping device, and the controller communicates with the crimping device.
  • the controller may include the processor and memory in FIG. 3, and the detection method includes but is not limited to steps S100, S200, and S300.
  • Step S100 obtaining displacement parameters and crimping force parameters of the crimping head of the crimping equipment during the process of crimping the connector;
  • Step S200 performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameter
  • Step S300 comparing the characteristic parameters with preset characteristic parameters, and determining the crimping state of the connector according to the comparison result.
  • the controller will obtain the displacement parameter and crimping force parameter during the crimping process of the connector, and then, the controller will perform feature extraction processing on the displacement parameter and crimping force parameter to obtain the characteristic parameter; finally, the controller will compare the characteristic parameter with the preset characteristic parameter to obtain the comparison result, and determine the crimping state of the connector according to the comparison result.
  • the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and have important practicability in the quality control of connector crimping.
  • the above characteristic parameters may include at least one of the following: the absolute distance of the connector pin sliding in the PCB hole; the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation; the corresponding crimping force of the connector pin at the maximum deformation; the corresponding maximum crimping force of the connector during the crimping process.
  • FIG. 5 is a flow chart of obtaining a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application; after the above step S100, the above step S200 specifically includes, but is not limited to, steps S410 and S420.
  • Step S410 generating a crimping curve according to the displacement parameter and the crimping force parameter, wherein the crimping curve is a distribution curve in which the crimping force parameter changes with the displacement parameter;
  • Step S420 performing feature extraction processing based on the crimping curve to obtain feature parameters.
  • the controller will obtain the distribution curve of the crimping force parameter changing with the displacement parameter during the crimping process of the connector, that is, the crimping curve, and then perform feature extraction processing based on the crimping curve to obtain the characteristic parameters.
  • FIG. 6 is a flow chart of performing feature extraction processing on the crimping curve to obtain characteristic parameters in the method for detecting the crimping state of a connector provided by an embodiment of the present application; regarding the feature extraction processing of the displacement parameters and crimping force parameters in the above step S200 to obtain the characteristic parameters, it specifically includes but is not limited to step S500.
  • Step S500 performing feature extraction processing on the crimping curve to obtain feature parameters.
  • the controller performs feature extraction processing on the crimping curve to obtain feature parameters.
  • FIG. 7 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by an embodiment of the present application; when the characteristic parameters include the absolute distance of the pin of the connector sliding in the PCB hole; regarding the comparison of the characteristic parameters and the preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, which specifically includes but is not limited to step S600.
  • Step S600 when the absolute distance that the pins of the connector slide in the PCB hole is less than the first preset distance, determine that the crimping state of the connector is incomplete crimping.
  • the controller when the crimping head of the crimping device crimps the connector to the PCB hole, the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole with the first preset distance. If the absolute distance of the connector pin sliding in the PCB hole is smaller than the first preset distance, then the controller will determine the connection The crimping status of the device is incomplete crimping.
  • FIG. 8 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the absolute distance that the pin of the connector slides in the PCB hole after the maximum deformation and the corresponding crimping force when the pin of the connector is at the maximum deformation; with regard to the comparison of the characteristic parameters and preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S700.
  • Step S700 when the absolute distance that the pins of the connector slide in the PCB hole after the maximum deformation is less than the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, determine that the crimping state of the connector is the crimping kneeling pin.
  • the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation and the corresponding crimping force of the connector pin at the maximum deformation; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation with the second preset distance, and comparing the corresponding crimping force and the first preset crimping force of the pins of the connector at the maximum deformation, if the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is less than the second preset distance, and the crimping force corresponding to the pins of the connector at the maximum deformation is less than the first preset crimping force, then the controller will determine that
  • FIG. 9 is a flow chart of judging the crimping state of the connector in the detection method of the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the absolute distance that the pin of the connector slides in the PCB hole after the maximum deformation and the crimping force corresponding to the pin of the connector at the maximum deformation; with regard to the comparison of the characteristic parameters and preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S800.
  • Step S800 when the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, determine that the crimping state of the connector is that the size of the pins of the connector does not match the aperture of the PCB.
  • the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation and the corresponding crimping force of the connector pin at the maximum deformation; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation with the second preset distance, and comparing the corresponding crimping force and the first preset crimping force of the pins of the connector at the maximum deformation, if the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector at the maximum deformation is less than the first preset crimping force, then the controller
  • FIG. 10 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the corresponding maximum crimping force of the connector during the crimping process; regarding the comparison of the characteristic parameters and the preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S900.
  • Step S900 when the corresponding maximum crimping force of the connector during the crimping process is greater than the second preset crimping force, determine that the crimping state of the connector is an over-pressed state.
  • the controller when the crimping head of the crimping device crimps the connector to the PCB hole, the controller will obtain the displacement parameter and the crimping force parameter during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameter and the crimping force parameter to obtain the corresponding maximum crimping force of the connector during the crimping process; finally, the controller will compare the corresponding maximum crimping force of the connector during the crimping process with the second preset crimping force. If the corresponding maximum crimping force of the connector during the crimping process is greater than the second preset crimping force, then the controller will determine The crimp state of the connector is an overpressure state.
  • FIG. 11 is a flow chart of obtaining preset characteristic parameters in the detection method of the connector crimping state provided by an embodiment of the present application; before the above step S100, the embodiment of the present application also includes but is not limited to step S1010, step S1020 and step S1030.
  • Step S1010 obtaining batch sample displacement parameters and sample crimping force parameters of the connectors in the crimping normal state
  • Step S1020 performing feature extraction processing on the sample displacement parameters and the sample crimping force parameters to obtain batches of sample feature parameters
  • Step S1030 obtaining preset characteristic parameters according to the batch sample characteristic parameter analysis.
  • the preset characteristic parameters of the connector can be obtained through big data analysis of a large number of standard crimping curve characteristic parameters, such as statistical analysis models such as 3 ⁇ normal distribution.
  • FIG. 12 is a flow chart of correcting the preset characteristic parameters in the detection method of the connector crimping state provided by an embodiment of the present application; after comparing the characteristic parameters and the preset characteristic parameters in the above step S300, and determining the crimping state of the connector according to the comparison result, the detection method of the embodiment of the present application also includes but is not limited to step S1100.
  • Step S1100 using the characteristic parameters to modify the preset characteristic parameters to obtain the corrected preset characteristic parameters.
  • the embodiment of the present application can continuously modify and converge preset characteristic parameters, so as to further improve the accuracy of system judgment.
  • Step 1 Use the pressure sensor and the distance sensor of the crimping equipment to obtain the distribution curve of the pressure changing with the distance during the crimping process of the connector, that is, the crimping curve.
  • Step 2 Design connector crimping DOE (Design Of Experiment, Design of Experiments) tests according to different types of crimping failures, analyze the difference between crimping good products, crimping bad products and their corresponding crimping curves, and obtain the connector crimping curve characteristic parameters h 0 , h 1 , f 1 , f 2 , as shown in Figure 13.
  • h 0 is the absolute distance that the connector pin slides in the PCB hole, which can effectively indicate whether the crimping is complete.
  • the size of h 0 should be close to the size of the pin protruding from the PCB surface during pre-insertion (as shown in Figure 14).
  • the starting position P 1 of h 0 is confirmed, and the effects of PCB warpage, PCB thickness tolerance, crimping mold tolerance, and crimping equipment mechanical coupling during the crimping process are eliminated as much as possible;
  • the ending position P 2 is the crimping stop position. Both the connector and the PCB have dimensional tolerances, so the starting position can fluctuate slightly from side to side.
  • h 1 is the absolute distance that the connector pin slides in the PCB hole after the maximum deformation
  • the starting position P 3 is the peak position of the curve
  • the end position P 4 is the valley position of the curve.
  • h 1 decreases, indicating that the connector may be raised; f 1 is the crimping force at the maximum deformation of the connector pin, that is, the crimping force at the peak of the curve. The decrease of f 1 indicates that the number of pins at the maximum deformation of the pins may be reduced or the PCB aperture/pin size is abnormal. Combining h 1 and f 1 can effectively characterize whether the connector pins are kneeling. f 2 is the maximum crimping force during the crimping process, which can effectively indicate whether the connector is over-pressed.
  • Step 3 Through big data analysis of a large number of standard crimping curve characteristic parameters h 0 , h 1 , f 1 , f 2 , such as statistical analysis models such as 3 ⁇ normal distribution, obtain connector crimping quality control thresholds H 0 , H 1 , F 1 , F 2 , which are the above-mentioned preset characteristic parameters.
  • Step 4 Calculate and compare whether the characteristic parameters of the crimping curve meet the threshold after the connector crimping is completed, and determine whether the quality of the connector crimping is good.
  • the process of extracting crimping curve characteristic parameters from DOE tests is as follows: First, select appropriate influencing factors according to product characteristics, equipment characteristics, and fault principles, and use different influencing factors as gradient variables. Secondly, analyze the curve difference between complete crimping and incomplete crimping in the DOE test, and decompose the curve to obtain the characteristic parameter h 0 of incomplete crimping. Finally, the complete crimping h 0 in the DOE test is extracted in batches, and the threshold H 0 is obtained through statistical analysis of data, such as 3 ⁇ normal distribution. Use H 0 to judge the incomplete crimping curve in the test and verify its effectiveness.
  • FIG. 15 is a schematic structural diagram of a connector crimping state detection system provided by an embodiment of the present application
  • FIG. 16 is a data block diagram of a connector crimping state detection system provided by an embodiment of the present application.
  • the system consists of a scanning device 10 , a crimping device 20 , a data analysis system 30 and a defect control system 40 .
  • the crimping equipment 20 can be a common servo-driven crimping machine or any other type of crimping machine, which can control the speed, displacement and applied force of the indenter 21 in the vertical direction with a certain program; the pressure sensor 22 is used to detect the crimping force during the crimping process, and can realize crimping curve feedback.
  • the data analysis system 30 including data collection module 31, the deployment data of the header position and the corresponding pressure force data during the collection process, and the pressure connection curve of the displacement-pressure connection force; parameter analysis module 32, the built-in pressure connection curve feature parameter extraction algorithm, quickly calculate the feature parameters of the output pressure connecting curve; verify the transfer module 33, the feature parameters are compared with the threshold, and the system judges the system judgment. Determine whether the pressure connection is poor; the threshold self -learning module 34, read the batch pressure connection standard curve, calculate the initial threshold of the feature parameter, and learn the maintenance data.
  • the data analysis system can be connected with any number of crimping devices 20 that meet the functions. It should be noted that the data analysis system 30 in the embodiment of the present application may include the above-mentioned controller.
  • the defect control system 40 includes the NG buffer area 41, where the system determines that products with abnormal crimping quality will be alerted and intercepted; the maintenance input area 42 is used to input the actual maintenance results of the crimping process; the data query area 43 supports all crimping process data queries such as time, program, and curve.
  • Step 1 The product enters the crimping process through the scanning device 10, and scans to obtain product information, including product barcode, name, and crimping program (the crimping program includes settings such as crimping device, crimping position, speed and pressure).
  • Step 2 The crimping device 20 controls the indenter 21 to complete one connector crimping according to the crimping procedure.
  • the pressure sensor 22 detects the crimping force in the process in real time, and the equipment records the crimping data in real time.
  • Step 3 The data acquisition module 31 collects the crimping data recorded by the crimping equipment, and generates a displacement-crimping force curve; at the same time, it reads crimping product information, including product name, barcode, crimping device, crimping position, etc., to ensure that the crimping curve corresponds to the crimping process one by one.
  • Step 4 The characteristic parameter analysis module 32 reads the collected crimping data in real time, and calculates the characteristic parameters h 0 , h 1 , f 1 , f 2 of the crimping curve after each crimping is completed.
  • Step 5 The parameter verification transfer module 33 reads the result of the parameter analysis module 32 and compares it with the standard thresholds H 0 , H 1 , F 1 , and F 2 . If h 0 ⁇ H 0 , judge “incomplete crimping"; if h 1 ⁇ H 1 and f 1 ⁇ F 1 , judge “crimping kneeling pin”; if h 1 ⁇ H 1 and f 1 ⁇ F 1 , judge “abnormal PCB aperture/connector pin size"; if f 2 >F 2 , judge “connector overvoltage”;
  • Step 6 The system judges that the abnormal crimping data enters the NG buffer area 41, performs an alarm and locks, and prohibits entering the next process.
  • the alarm is specific to the product barcode and the specific location of the fault.
  • the standard thresholds H 0 , H 1 , F 1 , and F 2 are derived from the threshold self-learning module 34 .
  • This module reads batch crimping standard curves to obtain a large number of normal crimping h 0 , h 1 , f 1 , f 2 , and obtains thresholds H 0 , H 1 , F 1 , and F 2 through 3 ⁇ normal distribution or other quality analysis models.
  • Step 8 The self-learning function of the threshold self-learning module 34 collects the maintenance data of the crimping process by reading the interface of the maintenance entry area 42, and continuously corrects and converges the standard thresholds H 0 , H 1 , F 1 , and F 2 to further improve the accuracy of system judgment.
  • Step 9 The data query area 43 is used as a query application, including information such as the corresponding crimping procedure, crimping time, and crimping curve during product crimping, and supports daily crimping process optimization or product failure analysis.
  • the crimping equipment in the embodiment of the present application is not limited to the driving method, and the pressure sensor can be other devices with the same function, as long as it can support real-time and accurate feedback of the crimping force and the displacement of the indenter.
  • characteristic parameters of the crimping curve may be other effective parameters that can characterize the quality of the crimping process, such as the slope of the curve.
  • the functions of data acquisition, analysis, handover and learning modules can be freely combined or split without affecting the system operation.
  • the detection system for the crimping state of the connector described in this application judges the crimping quality by extracting the characteristic parameters of the crimping curve and doing big data analysis.
  • Each set of crimping curves corresponds to the crimping process, and the abnormal alarm is specific to the product barcode and crimping position.
  • the following steps may be included but not limited to intercepting a high-speed connector that is not crimped in place through the crimping curve:
  • the dimension L (as shown in Figure 14) of the connector pin protruding from the board surface when calculating the pre-insertion is about 0.6mm.
  • the specific value of L is different for different connector pin designs and PCB aperture designs.
  • P 2 is the position where the curve ends
  • P 1 -P 2 L to calculate the position of P 1 , and obtain the crimping force at P 1 as 100lbf.
  • the connector pin design is different
  • the PCB aperture design is different
  • the crimping process is different
  • the crimping force at P 1 is different.
  • P 1 and P 2 are shown in Figure 17 below.
  • H0 can also be obtained using any other suitable mathematical statistical model or practical empirical model.
  • the parameter analysis module reads the crimping curves of all connectors of the product.
  • the price of the backplane ICT test fixture is 6-8W, and the average test time for a single board is 2-10 minutes. Each product needs to develop a fixture separately, and the development period is 2-3 months; the price of 3D X-RAY equipment is between 200-800W, and the average test time for a single board is 2-10 minutes.
  • this application requires less hardware equipment (only small equipment such as scanning guns and office computers), and the input cost is low. Scan the system after the crimping is completed, and the bad feedback time does not exceed 1 minute.
  • an embodiment of the present application provides a controller, the controller includes: a memory, a processor, and a computer program stored in the memory and operable on the processor, and the processor implements the above detection method when executing the computer program.
  • processor and the memory can be connected through a bus or in other ways.
  • controller in this embodiment may include the processor and the memory shown in FIG. 3 , both of which belong to the same inventive concept, so they have the same implementation principle and beneficial effect, and will not be described in detail here.
  • the non-transitory software programs and instructions required to implement the detection method of the above-mentioned embodiment are stored in the memory, and when executed by the processor, the detection method of the connector crimping state of the above-mentioned embodiment is executed, for example, the method steps in Fig. 4 to Fig. 12 described above are executed.
  • an embodiment of the present application provides a connector crimping state detection system
  • the connector crimping state detection system includes but not limited to crimping equipment and the above-mentioned controller, the controller communicates with the crimping equipment.
  • the detection system of the connector crimping state in the embodiment of the present application includes the above-mentioned controller, and the above-mentioned controller can execute the above-mentioned detection method of the connector crimping state, therefore, the specific implementation manner and technical effect of the detection system of the connector crimping state in the embodiment of the present application can correspond to the specific implementation manner and technical effect of the above-mentioned connector crimping state detection method.
  • an embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are used to perform the above-mentioned method for detecting the connector crimping state, for example, perform the method steps in FIGS. 4 to 12 described above.
  • the embodiment of the present application includes: firstly, obtaining the displacement parameter and the crimping force parameter of the crimping head of the crimping device during crimping the connector; then, performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameter; finally, comparing the feature parameter with a preset feature parameter, and determining the crimping state of the connector according to the comparison result.
  • the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and has important practicability in the quality control of connector crimping.
  • Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and that can be accessed by a computer.
  • communication media typically embody computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media, as are known to those of ordinary skill in the art.

Abstract

A detection method and system for a crimping state of a connector, and a controller and a storage medium. The detection method is applied to a controller in a detection system. The detection system further comprises a crimping device. The detection method comprises: acquiring a displacement parameter and a crimping force parameter of a pressure head of a crimping device during the process of crimping a connector (S100); performing feature extraction processing on the displacement parameter and the crimping force parameter, so as to obtain a feature parameter (S200); and comparing the feature parameter with a preset feature parameter, and determining a crimping state of the connector according to a comparison result (S300).

Description

连接器压接状态的检测方法、控制器、系统和存储介质Method, controller, system and storage medium for detecting connector crimping state
相关申请的交叉引用Cross References to Related Applications
本申请基于申请号为202210060011.3、申请日为2022年1月19日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。This application is based on a Chinese patent application with application number 202210060011.3 and a filing date of January 19, 2022, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.
技术领域technical field
本申请实施例涉及但不限于器件检测技术领域,尤其涉及一种连接器压接状态的检测方法、控制器、连接器压接状态的检测系统和计算机可读存储介质。The embodiments of the present application relate to but are not limited to the technical field of device detection, and in particular, relate to a method for detecting a crimped state of a connector, a controller, a system for detecting a crimped state of a connector, and a computer-readable storage medium.
背景技术Background technique
连接器压接,是使用弹性可变形插针或硬性插针与PCB金属化孔配合,在插针与金属化孔之间形成紧密的接触点而实现电气互联的一种工艺技术。随着信息通讯和电子制造行业的迅速发展,电子产品不断升级,连接器的高密度、高精度和高可靠性要求提升,压接工艺应用越来越广泛,逐渐成为连接器的主要装联方式。Connector crimping is a process technology that uses elastic deformable pins or hard pins to cooperate with PCB metallized holes to form close contact points between pins and metallized holes to achieve electrical interconnection. With the rapid development of information communication and electronic manufacturing industries, electronic products are constantly upgraded, and the requirements for high density, high precision and high reliability of connectors are increasing. The application of crimping technology is becoming more and more extensive, and it has gradually become the main assembly method of connectors.
同时,随着电子产品对信号传输速率的要求越来越高,系统对无源通道要求不断提高,压接连接器的结构愈发复杂,针脚朝着细、短、软、薄的趋势发展,压接难度和压接不良倍增。在整机测试和客户使用过程中,都有出现由于连接器压接跪针、压接不完全等导致的产品功能异常甚至连接器脱落。At the same time, as electronic products have higher and higher requirements for signal transmission rates, and the system has continuously improved requirements for passive channels, the structure of crimped connectors has become more and more complicated, and the pins have become thinner, shorter, softer, and thinner. The difficulty of crimping and poor crimping have doubled. During the testing of the whole machine and the use of customers, there were abnormal product functions and even connector drop-offs due to connector crimping, incomplete crimping, etc.
对于连接器压接不良问题,目前的检测手段主要包括目检、3D X-ray测试和ICT测试等。但是,对于目前上述的检测手段,往往会存在稳定性差、成本高、检测速度慢或者检测错误等问题。For the problem of bad connector crimping, the current detection methods mainly include visual inspection, 3D X-ray test and ICT test. However, for the above-mentioned detection methods at present, there are often problems such as poor stability, high cost, slow detection speed or detection errors.
发明内容Contents of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.
本申请实施例提供了一种连接器压接状态的检测方法、控制器、连接器压接状态的检测系统和计算机可读存储介质。Embodiments of the present application provide a method for detecting a crimping state of a connector, a controller, a system for detecting a crimping state of a connector, and a computer-readable storage medium.
第一方面,本申请实施例提供了一种连接器压接状态的检测方法,应用于检测系统中的控制器,所述检测系统还包括压接设备,所述控制器与所述压接设备通信,所述检测方法包括:获取所述压接设备的压头在压接所述连接器的过程中的位移参数和压接力参数;对所述位移参数和所述压接力参数进行特征提取处理,得到特征参数;比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态。In a first aspect, an embodiment of the present application provides a detection method for a crimping state of a connector, which is applied to a controller in a detection system. The detection system further includes a crimping device, and the controller communicates with the crimping device. The detection method includes: acquiring a displacement parameter and a crimping force parameter of a crimping head of the crimping device during crimping the connector; performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain a feature parameter; comparing the feature parameter with a preset feature parameter, and determining the crimping state of the connector according to the comparison result.
第二方面,本申请实施例还提供了一种控制器,存储器、处理器及存储在所述存储器上并可在所述处理器上运行的计算机程序,所述处理器执行所述计算机程序时实现如上述第一方面所述的连接器压接状态检测方法。In the second aspect, the embodiment of the present application also provides a controller, a memory, a processor, and a computer program stored on the memory and operable on the processor, and the processor implements the connector crimping state detection method described in the first aspect when executing the computer program.
第三方面,本申请实施例还提供了一种连接器压接状态的检测系统,包括压接设备和上述第二方面所述的控制器,所述控制器与所述压接设备通信。In a third aspect, an embodiment of the present application further provides a detection system for a crimping state of a connector, including a crimping device and the controller described in the second aspect above, where the controller communicates with the crimping device.
第四方面,本申请实施例还提供了一种计算机可读存储介质,存储有计算机可执行指令,所述计算机可执行指令用于执行如上述第一方面所述的连接器压接状态检测方法。In a fourth aspect, the embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions, the computer-executable instructions being used to execute the connector crimping state detection method described in the first aspect above.
本申请的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。Additional features and advantages of the application will be set forth in the description which follows, and, in part, will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
附图说明Description of drawings
附图用来提供对本申请技术方案的进一步理解,并且构成说明书的一部分,与本申请的实施例一起用于解释本申请的技术方案,并不构成对本申请技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solution of the present application, and do not constitute a limitation to the technical solution of the present application.
图1是连接器压接工艺的示意图;Figure 1 is a schematic diagram of a connector crimping process;
图2是连接器脱落情况的示意图;Fig. 2 is a schematic diagram of a situation where the connector falls off;
图3是本申请一个实施例提供的用于执行连接器压接状态的检测方法的系统架构的示意图;FIG. 3 is a schematic diagram of a system architecture for performing a method for detecting a crimping state of a connector provided by an embodiment of the present application;
图4是本申请一个实施例提供的连接器压接状态的检测方法的流程图;Fig. 4 is a flow chart of a method for detecting a connector crimping state provided by an embodiment of the present application;
图5是本申请一个实施例提供的连接器压接状态的检测方法中获取压接曲线的流程图;FIG. 5 is a flowchart of obtaining a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
图6是本申请一个实施例提供的连接器压接状态的检测方法中对压接曲线进行特征提取处理以得到特征参数的流程图;Fig. 6 is a flow chart of performing feature extraction processing on crimping curves to obtain characteristic parameters in the detection method of connector crimping state provided by an embodiment of the present application;
图7是本申请一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;Fig. 7 is a flowchart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by an embodiment of the present application;
图8是本申请另一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;Fig. 8 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
图9是本申请另一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;FIG. 9 is a flowchart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
图10是本申请另一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;FIG. 10 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
图11是本申请一个实施例提供的连接器压接状态的检测方法中获取预设特征参数的流程图;Fig. 11 is a flow chart of obtaining preset characteristic parameters in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
图12是本申请一个实施例提供的连接器压接状态的检测方法中对预设特征参数进行修正的流程图;FIG. 12 is a flow chart of correcting preset characteristic parameters in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
图13是本申请一个实施例提供的连接器压接状态的检测方法中压接曲线的示意图;Fig. 13 is a schematic diagram of a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
图14是本申请一个实施例提供的连接器压接状态的检测方法中插针突出PCB板面的尺寸的示意图;Fig. 14 is a schematic diagram of the size of the pins protruding from the PCB board surface in the method for detecting the crimping state of the connector provided by one embodiment of the present application;
图15是本申请一个实施例提供的连接器压接状态的检测系统的结构示意图;FIG. 15 is a schematic structural diagram of a detection system for a connector crimping state provided by an embodiment of the present application;
图16是本申请一个实施例提供的连接器压接状态的检测系统的数据框图;Fig. 16 is a data block diagram of a detection system for a connector crimping state provided by an embodiment of the present application;
图17是本申请一个实施例提供的连接器压接状态的检测方法中压接标准曲线P 1和P 2的示意图; Fig. 17 is a schematic diagram of crimping standard curves P 1 and P 2 in the detection method of connector crimping state provided by an embodiment of the present application;
图18是本申请一个实施例提供的连接器压接状态的检测方法中连接器压接不完全曲线的对比示意图。FIG. 18 is a comparative schematic diagram of connector crimping incomplete curves in the detection method of connector crimping state provided by an embodiment of the present application.
具体实施方式Detailed ways
为了使本申请的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本申请,并不用于限定本申请。In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.
需要说明的是,虽然在装置示意图中进行了功能模块划分,在流程图中示出了逻辑顺序,但是在某些情况下,可以以不同于装置中的模块划分,或流程图中的顺序执行所示出或描述的步骤。说明书、权利要求书或上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。It should be noted that although the functional modules are divided in the schematic diagram of the device, and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the flow chart. The terms "first", "second" and the like in the specification, claims or the above-mentioned drawings are used to distinguish similar objects, and not necessarily used to describe a specific order or sequential order.
在相关的技术方案中,如图1所示,连接器压接是使用弹性可变形插针或硬性插针与PCB(Printed Circuit Board,印制电路板)金属化孔配合,在插针与金属化孔之间形成紧密的接触点而实现电气互联的一种工艺技术。随着信息通讯和电子制造行业的迅速发展,电子产品不断升级,连接器的高密度、高精度和高可靠性要求提升,压接工艺应用越来越广泛,逐渐成为连接器的主要装联方式。In related technical solutions, as shown in Figure 1, connector crimping is a process technology that uses elastic deformable pins or hard pins to cooperate with PCB (Printed Circuit Board, printed circuit board) metallized holes to form close contact points between pins and metallized holes to realize electrical interconnection. With the rapid development of information communication and electronic manufacturing industries, electronic products are constantly upgraded, and the requirements for high density, high precision and high reliability of connectors are increasing. The application of crimping technology is becoming more and more extensive, and it has gradually become the main assembly method of connectors.
同时,随着电子产品对信号传输速率的要求越来越高,系统对无源通道要求不断提高, 压接连接器的结构愈发复杂,针脚朝着细、短、软、薄的趋势发展,压接难度和压接不良倍增。在整机测试和客户使用过程中,都有出现由于连接器压接跪针、压接不完全等导致的产品功能异常甚至连接器脱落,其中,连接器脱落可以如图2所示。At the same time, as electronic products have higher and higher requirements for signal transmission rates, and the system has continuously improved requirements for passive channels, the structure of crimped connectors has become more and more complex, and the pins have become thinner, shorter, softer, and thinner. The difficulty of crimping and poor crimping have doubled. During the whole machine test and the customer's use process, there are abnormal product functions and even connector drop-offs due to connector crimping and incomplete crimping. Among them, the connector drop-off can be shown in Figure 2.
对于连接器压接不良问题,目前的检测手段主要包括目检、3D X-ray(Three-Dimensional X-ray,三维X射线)测试和ICT(In Circuit Tester,自动在线测试仪)测试等。目检主要依靠人工观察,无法准确检测跪针等隐性不良,且受检测者的个体差异影响,压接质量的一致性和稳定性难以保证。3D X-ray测试技术通过X射线穿透器件和PCB,运用分层技术成像查看插针是否入孔来检测连接器压接是否良好。3D X-ray设备价格昂贵,对于结构复杂的连接器因成像不清晰容易误判,且检测速度慢,对生产节拍影响很大,故车间普及率较低。ICT测试技术通过检测连接器与PCB是否实现电气互联判断连接器压接是否正常,是目前应用最广发的检测方式。该方案需要单独开发测试夹具,检测效果受夹具精度影响较大,相同网络故障后定位困难,尤其对插针与PCB孔有连接即存在电气互联但压接不完全的故障无法有效识别。会出现厂内功能测试正常,发到用户处功能异常,甚至连接器脱落的可靠性问题。For the problem of bad connector crimping, the current detection methods mainly include visual inspection, 3D X-ray (Three-Dimensional X-ray, three-dimensional X-ray) test and ICT (In Circuit Tester, automatic online tester) test, etc. Visual inspection mainly relies on manual observation, which cannot accurately detect hidden defects such as kneeling stitches, and is affected by individual differences among inspectors, making it difficult to guarantee the consistency and stability of crimping quality. 3D X-ray testing technology uses X-rays to penetrate the device and PCB, and uses layered technology imaging to check whether the pins are inserted into the holes to detect whether the connector is crimped well. 3D X-ray equipment is expensive. For connectors with complex structures, it is easy to misjudge due to unclear imaging, and the detection speed is slow, which has a great impact on the production cycle, so the penetration rate in the workshop is low. ICT testing technology judges whether the connector crimping is normal by detecting whether the connector and the PCB are electrically interconnected, which is currently the most widely used detection method. This solution needs to develop a test fixture separately, and the detection effect is greatly affected by the precision of the fixture, and it is difficult to locate after the same network fault, especially for the fault that there is electrical interconnection but incomplete crimping cannot be effectively identified when the pin is connected to the PCB hole. There will be reliability problems that the function test in the factory is normal, the function is abnormal when it is sent to the user, and even the connector falls off.
此外,关于连接器压接曲线的应用,目前处于萌芽阶段。越来越多的压接设备支持压接曲线反馈。部分压接设备尝试通过压接曲线优化压接程序设置,对压接过程不良进行预警拦截。但是由于PCB板厚、PCB翘曲、模具等公差的引入,会导致压接曲线浮动,实际应用效果不佳。In addition, the application of connector crimping curves is currently in its infancy. More and more crimping equipment supports crimp curve feedback. Some crimping equipment tries to optimize the crimping program settings through the crimping curve, and carry out early warning and interception of the bad crimping process. However, due to the introduction of tolerances such as PCB thickness, PCB warpage, and molds, the crimping curve will fluctuate, and the actual application effect is not good.
基于上述情况,本申请实施例提供了一种连接器压接状态的检测方法、控制器、连接器压接状态的检测系统和计算机可读存储介质,其中,连接器压接状态的检测方法应用于检测系统中的控制器,检测系统还包括压接设备,控制器与压接设备通信,检测方法包括如下步骤:获取压接设备的压头在压接连接器的过程中的位移参数和压接力参数;对位移参数和压接力参数进行特征提取处理,得到特征参数;比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态。根据本申请实施例的技术方案,本申请实施例只需要根据位移参数和压接力参数提取出特征参数,并将特征参数和预设特征参数进行对比即可以得到连接器的压接状态,相对于现有的检测手段,能够快速、准确的检测出连接器压接不良,解决由于连接器压接不完全导致的连接器应用可靠性问题,在连接器压接质量管控上有重要的实用性。Based on the foregoing, embodiments of the present application provide a method for detecting a crimping state of a connector, a controller, a system for detecting a crimping state of a connector, and a computer-readable storage medium, wherein the method for detecting a crimping state of a connector is applied to a controller in the detection system, and the detection system further includes a crimping device, and the controller communicates with the crimping device. parameter to determine the crimp state of the connector based on the comparison result. According to the technical solution of the embodiment of the present application, the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and have important practicability in the quality control of connector crimping.
下面结合附图,对本申请实施例作进一步阐述。The embodiments of the present application will be further described below in conjunction with the accompanying drawings.
如图3所示,图3是本申请一个实施例提供的用于执行连接器压接状态的检测方法的系统架构100的示意图。As shown in FIG. 3 , FIG. 3 is a schematic diagram of a system architecture 100 for performing a method for detecting a crimping state of a connector provided by an embodiment of the present application.
在图3的示例中,该系统架构100设置有处理器110和存储器120,其中,处理器110和存储器120可以通过总线或者其他方式连接,图3中以通过总线连接为例。In the example of FIG. 3 , the system architecture 100 is provided with a processor 110 and a memory 120 , wherein the processor 110 and the memory 120 may be connected via a bus or in other ways, and in FIG. 3 the connection via a bus is taken as an example.
存储器120作为一种非暂态计算机可读存储介质,可用于存储非暂态软件程序以及非暂态性计算机可执行程序。此外,存储器120可以包括高速随机存取存储器,还可以包括非暂态存储器,例如至少一个磁盘存储器件、闪存器件、或其他非暂态固态存储器件。在一些实施方式中,存储器120可包括相对于处理器110远程设置的存储器120,这些远程存储器可以通过网络连接至该系统架构100。上述网络的实例包括但不限于互联网、企业内部网、局域网、移动通信网及其组合。The memory 120, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory 120 may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some implementations, the memory 120 may include memory 120 located remotely relative to the processor 110 , and these remote memories may be connected to the system architecture 100 through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
本领域技术人员可以理解的是,该系统架构100可以应用于3G通信网络系统、LTE通信网络系统、5G通信网络系统以及后续演进的移动通信网络系统等,本实施例对此并不作具体限定。Those skilled in the art can understand that the system architecture 100 can be applied to 3G communication network systems, LTE communication network systems, 5G communication network systems and subsequent evolved mobile communication network systems, etc., which is not specifically limited in this embodiment.
本领域技术人员可以理解的是,图3中示出的系统架构100并不构成对本申请实施例的限定,可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置。Those skilled in the art can understand that the system architecture 100 shown in FIG. 3 does not limit the embodiment of the present application, and may include more or less components than shown in the figure, or combine some components, or arrange different components.
在图3所示的系统架构100中,处理器110可以调用储存在存储器120中的连接器压接状态的检测程序,从而执行连接器压接状态的检测方法。In the system architecture 100 shown in FIG. 3 , the processor 110 can call the detection program of the connector crimping state stored in the memory 120 , so as to execute the detection method of the connector crimping state.
基于上述系统架构100,下面提出本申请的连接器压接状态的检测方法的各个实施例。Based on the system architecture 100 above, various embodiments of the method for detecting the crimping state of the connector of the present application are proposed below.
如图4所示,图4是本申请一个实施例提供的连接器压接状态的检测方法的流程图;本 申请实施例的连接器压接状态的检测方法应用于检测系统中的控制器,具体地,检测系统还包括压接设备,控制器与压接设备通信,其中,控制器可以包括图3中的处理器和存储器,该检测方法包括但不限于有步骤S100、步骤S200和步骤S300。As shown in FIG. 4, FIG. 4 is a flowchart of a method for detecting a crimping state of a connector provided by an embodiment of the present application; the method for detecting a crimping state of a connector in an embodiment of the present application is applied to a controller in a detection system. Specifically, the detection system also includes a crimping device, and the controller communicates with the crimping device. The controller may include the processor and memory in FIG. 3, and the detection method includes but is not limited to steps S100, S200, and S300.
步骤S100、获取压接设备的压头在压接连接器的过程中的位移参数和压接力参数;Step S100, obtaining displacement parameters and crimping force parameters of the crimping head of the crimping equipment during the process of crimping the connector;
步骤S200、对位移参数和压接力参数进行特征提取处理,得到特征参数;Step S200, performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameter;
步骤S300、比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态。Step S300, comparing the characteristic parameters with preset characteristic parameters, and determining the crimping state of the connector according to the comparison result.
具体地,在压接设备的压头将连接器压接至PCB孔的过程中,控制器会获取连接器压接过程中的位移参数和压接力参数,接着,控制器会对位移参数和压接力参数进行特征提取处理,得到特征参数;最后,控制器会比较特征参数和预设特征参数,得到比较结果,并根据比较结果确定连接器的压接状态。根据本申请实施例的技术方案,本申请实施例只需要根据位移参数和压接力参数提取出特征参数,并将特征参数和预设特征参数进行对比即可以得到连接器的压接状态,相对于现有的检测手段,能够快速、准确的检测出连接器压接不良,解决由于连接器压接不完全导致的连接器应用可靠性问题,在连接器压接质量管控上有重要的实用性。Specifically, in the process of crimping the connector to the PCB hole by the pressure head of the crimping equipment, the controller will obtain the displacement parameter and crimping force parameter during the crimping process of the connector, and then, the controller will perform feature extraction processing on the displacement parameter and crimping force parameter to obtain the characteristic parameter; finally, the controller will compare the characteristic parameter with the preset characteristic parameter to obtain the comparison result, and determine the crimping state of the connector according to the comparison result. According to the technical solution of the embodiment of the present application, the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and have important practicability in the quality control of connector crimping.
值得注意的是,关于上述的特征参数,可以包括如下至少之一:连接器的插针在PCB孔内滑行的绝对距离;连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离;连接器的插针在最大形变时对应的压接力;连接器在压接过程中对应的最大压接力。It is worth noting that the above characteristic parameters may include at least one of the following: the absolute distance of the connector pin sliding in the PCB hole; the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation; the corresponding crimping force of the connector pin at the maximum deformation; the corresponding maximum crimping force of the connector during the crimping process.
另外,如图5所示,图5是本申请一个实施例提供的连接器压接状态的检测方法中获取压接曲线的流程图;在上述步骤S100之后,关于上述步骤S200,具体包括但不限于有步骤S410和步骤S420。In addition, as shown in FIG. 5, FIG. 5 is a flow chart of obtaining a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application; after the above step S100, the above step S200 specifically includes, but is not limited to, steps S410 and S420.
步骤S410、根据位移参数和压接力参数生成压接曲线,其中,压接曲线为压接力参数随位移参数变化的分布曲线;Step S410, generating a crimping curve according to the displacement parameter and the crimping force parameter, wherein the crimping curve is a distribution curve in which the crimping force parameter changes with the displacement parameter;
步骤S420、基于压接曲线进行特征提取处理,得到特征参数。Step S420, performing feature extraction processing based on the crimping curve to obtain feature parameters.
具体地,在压接设备的压头将连接器压接至PCB孔的过程中,控制器会获取连接器压接过程中的压接力参数随位移参数变化的分布曲线,即压接曲线,接着再基于压接曲线进行特征提取处理以得到特征参数。Specifically, during the process of crimping the connector to the PCB hole by the crimping head of the crimping device, the controller will obtain the distribution curve of the crimping force parameter changing with the displacement parameter during the crimping process of the connector, that is, the crimping curve, and then perform feature extraction processing based on the crimping curve to obtain the characteristic parameters.
另外,如图6所示,图6是本申请一个实施例提供的连接器压接状态的检测方法中对压接曲线进行特征提取处理以得到特征参数的流程图;关于上述步骤S200中的对位移参数和压接力参数进行特征提取处理,得到特征参数,具体包括但不限于有步骤S500。In addition, as shown in FIG. 6 , FIG. 6 is a flow chart of performing feature extraction processing on the crimping curve to obtain characteristic parameters in the method for detecting the crimping state of a connector provided by an embodiment of the present application; regarding the feature extraction processing of the displacement parameters and crimping force parameters in the above step S200 to obtain the characteristic parameters, it specifically includes but is not limited to step S500.
步骤S500、对压接曲线进行特征提取处理,得到特征参数。Step S500, performing feature extraction processing on the crimping curve to obtain feature parameters.
具体地,当获取到压接曲线之后,控制器会对压接曲线进行特征提取处理,得到特征参数。Specifically, after the crimping curve is obtained, the controller performs feature extraction processing on the crimping curve to obtain feature parameters.
另外,如图7所示,图7是本申请一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;当特征参数包括连接器的插针在PCB孔内滑行的绝对距离;关于上述步骤S300中的比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态,具体包括但不限于有步骤S600。In addition, as shown in FIG. 7, FIG. 7 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by an embodiment of the present application; when the characteristic parameters include the absolute distance of the pin of the connector sliding in the PCB hole; regarding the comparison of the characteristic parameters and the preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, which specifically includes but is not limited to step S600.
步骤S600、当连接器的插针在PCB孔内滑行的绝对距离小于第一预设距离,确定连接器的压接状态为压接不完全。Step S600 , when the absolute distance that the pins of the connector slide in the PCB hole is less than the first preset distance, determine that the crimping state of the connector is incomplete crimping.
具体地,在压接设备的压头将连接器压接至PCB孔的过程中,控制器会获取连接器压接过程中的位移参数和压接力参数,接着,控制器会对位移参数和压接力参数进行特征提取处理,得到连接器的插针在PCB孔内滑行的绝对距离;最后,控制器会比较连接器的插针在PCB孔内滑行的绝对距离和第一预设距离,如果连接器的插针在PCB孔内滑行的绝对距离小于第一预设距离,那么,控制器会确定连接器的压接状态为压接不完全。Specifically, when the crimping head of the crimping device crimps the connector to the PCB hole, the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole with the first preset distance. If the absolute distance of the connector pin sliding in the PCB hole is smaller than the first preset distance, then the controller will determine the connection The crimping status of the device is incomplete crimping.
另外,如图8所示,图8是本申请另一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;当特征参数包括连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离以及连接器的插针在最大形变时对应的压接力;关于上述步骤S300 中的比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态,具体包括但不限于有步骤S700。In addition, as shown in FIG. 8 , FIG. 8 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the absolute distance that the pin of the connector slides in the PCB hole after the maximum deformation and the corresponding crimping force when the pin of the connector is at the maximum deformation; with regard to the comparison of the characteristic parameters and preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S700.
步骤S700、当连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离小于第二预设距离,并且连接器的插针在最大形变时对应的压接力小于第一预设压接力,确定连接器的压接状态为压接跪针。Step S700, when the absolute distance that the pins of the connector slide in the PCB hole after the maximum deformation is less than the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, determine that the crimping state of the connector is the crimping kneeling pin.
具体地,在压接设备的压头将连接器压接至PCB孔的过程中,控制器会获取连接器压接过程中的位移参数和压接力参数,接着,控制器会对位移参数和压接力参数进行特征提取处理,得到连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离以及连接器的插针在最大形变时对应的压接力;最后,控制器会比较连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离和第二预设距离,以及比较连接器的插针在最大形变时对应的压接力和第一预设压接力,如果连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离小于第二预设距离,并且连接器的插针在最大形变时对应的压接力小于第一预设压接力,那么,控制器会确定连接器的压接状态为压接跪针。Specifically, in the process of crimping the connector to the PCB hole by the crimping head of the crimping equipment, the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation and the corresponding crimping force of the connector pin at the maximum deformation; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation with the second preset distance, and comparing the corresponding crimping force and the first preset crimping force of the pins of the connector at the maximum deformation, if the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is less than the second preset distance, and the crimping force corresponding to the pins of the connector at the maximum deformation is less than the first preset crimping force, then the controller will determine that the crimping state of the connector is a crimping pin.
另外,如图9所示,图9是本申请另一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;当特征参数包括连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离以及连接器的插针在最大形变时对应的压接力;关于上述步骤S300中的比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态,具体包括但不限于有步骤S800。In addition, as shown in FIG. 9, FIG. 9 is a flow chart of judging the crimping state of the connector in the detection method of the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the absolute distance that the pin of the connector slides in the PCB hole after the maximum deformation and the crimping force corresponding to the pin of the connector at the maximum deformation; with regard to the comparison of the characteristic parameters and preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S800.
步骤S800、当连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离大于等于第二预设距离,并且连接器的插针在最大形变时对应的压接力小于第一预设压接力,确定连接器的压接状态为连接器的插针尺寸和PCB孔径不匹配。Step S800, when the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, determine that the crimping state of the connector is that the size of the pins of the connector does not match the aperture of the PCB.
具体地,在压接设备的压头将连接器压接至PCB孔的过程中,控制器会获取连接器压接过程中的位移参数和压接力参数,接着,控制器会对位移参数和压接力参数进行特征提取处理,得到连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离以及连接器的插针在最大形变时对应的压接力;最后,控制器会比较连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离和第二预设距离,以及比较连接器的插针在最大形变时对应的压接力和第一预设压接力,如果连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离大于等于第二预设距离,并且连接器的插针在最大形变时对应的压接力小于第一预设压接力,那么,控制器会确定连接器的压接状态为连接器的插针尺寸和PCB孔径不匹配。Specifically, in the process of crimping the connector to the PCB hole by the crimping head of the crimping equipment, the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation and the corresponding crimping force of the connector pin at the maximum deformation; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation with the second preset distance, and comparing the corresponding crimping force and the first preset crimping force of the pins of the connector at the maximum deformation, if the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector at the maximum deformation is less than the first preset crimping force, then the controller will determine that the crimping state of the connector is that the size of the pins of the connector does not match the aperture of the PCB.
另外,如图10所示,图10是本申请另一个实施例提供的连接器压接状态的检测方法中对连接器的压接状态进行判断的流程图;当特征参数包括连接器在压接过程中对应的最大压接力;关于上述步骤S300中的比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态,具体包括但不限于有步骤S900。In addition, as shown in FIG. 10, FIG. 10 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the corresponding maximum crimping force of the connector during the crimping process; regarding the comparison of the characteristic parameters and the preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S900.
步骤S900、当连接器在压接过程中对应的最大压接力大于第二预设压接力,确定连接器的压接状态为过压状态。Step S900, when the corresponding maximum crimping force of the connector during the crimping process is greater than the second preset crimping force, determine that the crimping state of the connector is an over-pressed state.
具体地,在压接设备的压头将连接器压接至PCB孔的过程中,控制器会获取连接器压接过程中的位移参数和压接力参数,接着,控制器会对位移参数和压接力参数进行特征提取处理,得到连接器在压接过程中对应的最大压接力;最后,控制器会比较连接器在压接过程中对应的最大压接力和第二预设压接力,如果连接器在压接过程中对应的最大压接力大于第二预设压接力,那么,控制器会确定连接器的压接状态为过压状态。Specifically, when the crimping head of the crimping device crimps the connector to the PCB hole, the controller will obtain the displacement parameter and the crimping force parameter during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameter and the crimping force parameter to obtain the corresponding maximum crimping force of the connector during the crimping process; finally, the controller will compare the corresponding maximum crimping force of the connector during the crimping process with the second preset crimping force. If the corresponding maximum crimping force of the connector during the crimping process is greater than the second preset crimping force, then the controller will determine The crimp state of the connector is an overpressure state.
另外,如图11所示,图11是本申请一个实施例提供的连接器压接状态的检测方法中获取预设特征参数的流程图;在上述步骤S100之前,本申请实施例还包括但不限于有步骤S1010、步骤S1020和步骤S1030。In addition, as shown in FIG. 11 , FIG. 11 is a flow chart of obtaining preset characteristic parameters in the detection method of the connector crimping state provided by an embodiment of the present application; before the above step S100, the embodiment of the present application also includes but is not limited to step S1010, step S1020 and step S1030.
步骤S1010、获取连接器在压接正常状态下批量的样本位移参数和样本压接力参数;Step S1010, obtaining batch sample displacement parameters and sample crimping force parameters of the connectors in the crimping normal state;
步骤S1020、对样本位移参数和样本压接力参数进行特征提取处理,得到批量的样本特征参数;Step S1020, performing feature extraction processing on the sample displacement parameters and the sample crimping force parameters to obtain batches of sample feature parameters;
步骤S1030、根据批量的样本特征参数分析得到预设特征参数。Step S1030, obtaining preset characteristic parameters according to the batch sample characteristic parameter analysis.
具体地,本申请实施例可以通过大量标准压接曲线特征参数的大数据分析,比如3σ正态分布等统计分析模型,获得连接器的预设特征参数。Specifically, in the embodiment of the present application, the preset characteristic parameters of the connector can be obtained through big data analysis of a large number of standard crimping curve characteristic parameters, such as statistical analysis models such as 3σ normal distribution.
另外,如图12所示,图12是本申请一个实施例提供的连接器压接状态的检测方法中对预设特征参数进行修正的流程图;在上述步骤S300中的比较特征参数和预设特征参数,根据比较结果确定连接器的压接状态之后,本申请实施例的检测方法还包括但不限于有步骤S1100。In addition, as shown in FIG. 12, FIG. 12 is a flow chart of correcting the preset characteristic parameters in the detection method of the connector crimping state provided by an embodiment of the present application; after comparing the characteristic parameters and the preset characteristic parameters in the above step S300, and determining the crimping state of the connector according to the comparison result, the detection method of the embodiment of the present application also includes but is not limited to step S1100.
步骤S1100、采用特征参数对预设特征参数进行修正,得到修正后的预设特征参数。Step S1100, using the characteristic parameters to modify the preset characteristic parameters to obtain the corrected preset characteristic parameters.
具体地,本申请实施例可以不断修正和收敛预设特征参数,使系统判断准确率进一步提升。Specifically, the embodiment of the present application can continuously modify and converge preset characteristic parameters, so as to further improve the accuracy of system judgment.
基于上述图4至图12的连接器压接状态的检测方法,下面提出本申请的总体实施例,具体可以包括如下四个步骤:Based on the detection method of the crimping state of the connector in Fig. 4 to Fig. 12 above, the general embodiment of the present application is proposed below, which may specifically include the following four steps:
步骤一:利用压接设备的压力传感器和距离传感器获得连接器压接过程中压力随距离变化的分布曲线,即压接曲线。Step 1: Use the pressure sensor and the distance sensor of the crimping equipment to obtain the distribution curve of the pressure changing with the distance during the crimping process of the connector, that is, the crimping curve.
步骤二:根据不同压接故障类型设计连接器压接DOE(Design Of Experiment,试验设计)试验,分析压接良品、压接不良品与其对应压接曲线之间的差异,获得连接器压接曲线特征参数h 0、h 1、f 1、f 2,如图13所示。h 0为连接器插针在PCB孔内滑行的绝对距离,能有效表征压接是否完全。h 0的大小应与预插时,插针突出PCB板面的尺寸(如图14所示)接近。根据该原则确认h 0起始位置P 1,尽量排除压接过程中PCB翘曲、PCB板厚公差、压接模具公差、压接设备机械耦合的影响;结束位置P 2为压接停止位。连接器和PCB都有尺寸公差,故起始位置可以左右轻微浮动。h 1为连接器插针完成最大变形后在PCB孔内滑行的绝对距离,起始位置P 3为曲线波峰位置,终止位置P 4为曲线波谷位置。h 1减小,说明连接器可能被垫高;f 1为连接器插针最大变形时压接力的大小,即曲线波峰处压接力大小。f 1减小,说明插针最大变形时的插针数量可能减少或PCB孔径/插针尺寸异常,综合h 1与f 1能有效表征连接器插针是否跪针。f 2为压接过程中的最大压接力,能有效表征连接器是否过压。 Step 2: Design connector crimping DOE (Design Of Experiment, Design of Experiments) tests according to different types of crimping failures, analyze the difference between crimping good products, crimping bad products and their corresponding crimping curves, and obtain the connector crimping curve characteristic parameters h 0 , h 1 , f 1 , f 2 , as shown in Figure 13. h 0 is the absolute distance that the connector pin slides in the PCB hole, which can effectively indicate whether the crimping is complete. The size of h 0 should be close to the size of the pin protruding from the PCB surface during pre-insertion (as shown in Figure 14). According to this principle, the starting position P 1 of h 0 is confirmed, and the effects of PCB warpage, PCB thickness tolerance, crimping mold tolerance, and crimping equipment mechanical coupling during the crimping process are eliminated as much as possible; the ending position P 2 is the crimping stop position. Both the connector and the PCB have dimensional tolerances, so the starting position can fluctuate slightly from side to side. h 1 is the absolute distance that the connector pin slides in the PCB hole after the maximum deformation, the starting position P 3 is the peak position of the curve, and the end position P 4 is the valley position of the curve. h 1 decreases, indicating that the connector may be raised; f 1 is the crimping force at the maximum deformation of the connector pin, that is, the crimping force at the peak of the curve. The decrease of f 1 indicates that the number of pins at the maximum deformation of the pins may be reduced or the PCB aperture/pin size is abnormal. Combining h 1 and f 1 can effectively characterize whether the connector pins are kneeling. f 2 is the maximum crimping force during the crimping process, which can effectively indicate whether the connector is over-pressed.
步骤三:通过大量标准压接曲线特征参数h 0、h 1、f 1、f 2的大数据分析,比如3σ正态分布等统计分析模型,获得连接器压接质量管控阈值H 0,H 1,F 1,F 2,即上述的预设特征参数。 Step 3: Through big data analysis of a large number of standard crimping curve characteristic parameters h 0 , h 1 , f 1 , f 2 , such as statistical analysis models such as 3σ normal distribution, obtain connector crimping quality control thresholds H 0 , H 1 , F 1 , F 2 , which are the above-mentioned preset characteristic parameters.
步骤四:计算并比对连接器压接完成后压接曲线特征参数是否满足阈值,判定连接器压接质量是否良好。Step 4: Calculate and compare whether the characteristic parameters of the crimping curve meet the threshold after the connector crimping is completed, and determine whether the quality of the connector crimping is good.
若h 0<H 0,则判定“压接不完全”; If h 0 <H 0 , it is judged that "crimping is not complete";
若h 1<H 1且f 1<F 1,则判定“压接跪针”; If h 1 <H 1 and f 1 <F 1 , it is judged as "crimping kneeling needle";
若h 1≥H 1且f 1<F 1,则判定“PCB孔径/连接器插针尺寸异常”; If h 1 ≥ H 1 and f 1 < F 1 , it is determined that "PCB aperture/connector pin size is abnormal";
若f 2>F 2,则判定“连接器过压”; If f 2 >F 2 , then determine "connector overvoltage";
若特征参数数据缺失则判定“连接器漏压”。If the characteristic parameter data is missing, it is judged as "connector leakage pressure".
在一些示例中,对于连接器压接质量管控阈值即预设特征参数的获取和验证,如下表1所示,以故障类型“压接不完全”为例,DOE试验提取压接曲线特征参数过程如下:首先,根据产品特征、设备特点、故障原理等选取合适的影响因子,以不同影响因子作为梯度变量,进行多次压接完全与压接不完全的对比试验,收集其对应的压接曲线。其次,分析DOE试验中压接完全与压接不全的曲线差异,分解曲线获得压接不全的特征参数h 0。最后,批量提取DOE试验中压接完全的h 0,通过数据统计分析,比如3σ正态分布获得阈值H 0。使用H 0对试验中压接不完全的曲线进行判定,验证其有效性。 In some examples, for the acquisition and verification of the threshold value of connector crimping quality control, that is, the preset characteristic parameters, as shown in Table 1 below, taking the fault type "incomplete crimping" as an example, the process of extracting crimping curve characteristic parameters from DOE tests is as follows: First, select appropriate influencing factors according to product characteristics, equipment characteristics, and fault principles, and use different influencing factors as gradient variables. Secondly, analyze the curve difference between complete crimping and incomplete crimping in the DOE test, and decompose the curve to obtain the characteristic parameter h 0 of incomplete crimping. Finally, the complete crimping h 0 in the DOE test is extracted in batches, and the threshold H 0 is obtained through statistical analysis of data, such as 3σ normal distribution. Use H 0 to judge the incomplete crimping curve in the test and verify its effectiveness.
Figure PCTCN2022080742-appb-000001
Figure PCTCN2022080742-appb-000001
Figure PCTCN2022080742-appb-000002
Figure PCTCN2022080742-appb-000002
表1Table 1
基于上述的连接器压接状态的检测方法,下面提出支撑本申请的检测方法的连接器压接状态的检测系统。Based on the above detection method for the crimping state of the connector, a detection system for the crimping state of the connector supporting the detection method of the present application is proposed below.
如图15和图16所示,图15是本申请一个实施例提供的连接器压接状态的检测系统的结构示意图,图16是本申请一个实施例提供的连接器压接状态的检测系统的数据框图。本系统由扫描设备10、压接设备20、数据分析系统30和不良控制系统40构成。As shown in FIG. 15 and FIG. 16 , FIG. 15 is a schematic structural diagram of a connector crimping state detection system provided by an embodiment of the present application, and FIG. 16 is a data block diagram of a connector crimping state detection system provided by an embodiment of the present application. The system consists of a scanning device 10 , a crimping device 20 , a data analysis system 30 and a defect control system 40 .
具体地,关于压接设备20,可为常见伺服驱动式压接机或其它任意类型压接机,能以一定的程序控制压头21在垂直方向运动的速度、位移和施加力;压力传感器22,用于检测压接过程中的压接力,能实现压接曲线反馈。Specifically, the crimping equipment 20 can be a common servo-driven crimping machine or any other type of crimping machine, which can control the speed, displacement and applied force of the indenter 21 in the vertical direction with a certain program; the pressure sensor 22 is used to detect the crimping force during the crimping process, and can realize crimping curve feedback.
另外,关于数据分析系统30,包括数据采集模块31,收集压接过程中压头位移数据和对应的压接力数据,同步生成位移-压接力的压接曲线;参数分析模块32,内置压接曲线特征参数提取算法,快速计算输出压接曲线的特征参数;验证转交模块33,特征参数与阈值进行比较,系统判定是否压接不良;阈值自学习模块34,读取批量压接标准曲线,计算特征参数初始阈值,并对维修数据进行自学习。数据分析系统可连接任意多台满足功能的压接设备20。需要说明的是,本申请实施例的数据分析系统30可以包括有上述的控制器。In addition, about the data analysis system 30, including data collection module 31, the deployment data of the header position and the corresponding pressure force data during the collection process, and the pressure connection curve of the displacement-pressure connection force; parameter analysis module 32, the built-in pressure connection curve feature parameter extraction algorithm, quickly calculate the feature parameters of the output pressure connecting curve; verify the transfer module 33, the feature parameters are compared with the threshold, and the system judges the system judgment. Determine whether the pressure connection is poor; the threshold self -learning module 34, read the batch pressure connection standard curve, calculate the initial threshold of the feature parameter, and learn the maintenance data. The data analysis system can be connected with any number of crimping devices 20 that meet the functions. It should be noted that the data analysis system 30 in the embodiment of the present application may include the above-mentioned controller.
另外,关于不良控制系统40,包括NG缓存区41,系统判定压接质量异常的产品进行告警和拦截;维修录入区42,对压接工序实际维修结果进行录入;数据查询区43,支持时间、程序、曲线等所有压接过程数据查询。In addition, regarding the defect control system 40, it includes the NG buffer area 41, where the system determines that products with abnormal crimping quality will be alerted and intercepted; the maintenance input area 42 is used to input the actual maintenance results of the crimping process; the data query area 43 supports all crimping process data queries such as time, program, and curve.
基于上述的连接器压接状态的检测系统,其具体实现和操作方式可以包括如下九个步骤:Based on the detection system of the above-mentioned connector crimping state, its specific implementation and operation method may include the following nine steps:
步骤一、产品经过扫描设备10进入压接工序,扫描获取产品信息,包括产品条码、名称、压接程序(压接程序包含压接器件、压接位置、速度和压力等设置)。Step 1. The product enters the crimping process through the scanning device 10, and scans to obtain product information, including product barcode, name, and crimping program (the crimping program includes settings such as crimping device, crimping position, speed and pressure).
步骤二、压接设备20按照压接程序,控制压头21完成一次连接器压接。压力传感器22,实时检测该过程中的压接力,设备实时记录压接数据。Step 2: The crimping device 20 controls the indenter 21 to complete one connector crimping according to the crimping procedure. The pressure sensor 22 detects the crimping force in the process in real time, and the equipment records the crimping data in real time.
步骤三、数据采集模块31采集压接设备记录的压接数据,生成位移-压接力曲线;同时读取压接产品信息,包括产品名称、条码、压接器件、压接位置等等,保障压接曲线与压接过程一一对应。Step 3: The data acquisition module 31 collects the crimping data recorded by the crimping equipment, and generates a displacement-crimping force curve; at the same time, it reads crimping product information, including product name, barcode, crimping device, crimping position, etc., to ensure that the crimping curve corresponds to the crimping process one by one.
步骤四、特征参数分析模块32实时读取采集到的压接数据,计算每一次压接完成后压接曲线的特征参数h 0、h 1、f 1、f 2Step 4: The characteristic parameter analysis module 32 reads the collected crimping data in real time, and calculates the characteristic parameters h 0 , h 1 , f 1 , f 2 of the crimping curve after each crimping is completed.
步骤五、参数验证转交模块33读取参数分析模块32的结果,与标准阈值H 0,H 1,F 1,F 2进行对比。若h 0<H 0,则判定“压接不完全”;若h 1<H 1且f 1<F 1,则判定“压接跪针”;若h 1≥H 1且f 1<F 1,则判定“PCB孔径/连接器插针尺寸异常”;若f 2>F 2,则判定“连接器过压”;若特征参数数据缺失则判定“连接器漏压”。 Step 5: The parameter verification transfer module 33 reads the result of the parameter analysis module 32 and compares it with the standard thresholds H 0 , H 1 , F 1 , and F 2 . If h 0 <H 0 , judge "incomplete crimping"; if h 1 <H 1 and f 1 <F 1 , judge "crimping kneeling pin"; if h 1 ≥ H 1 and f 1 <F 1 , judge "abnormal PCB aperture/connector pin size"; if f 2 >F 2 , judge "connector overvoltage";
步骤六、系统判定异常的压接数据进入NG缓存区41,进行告警和锁定,禁止进入下工序。告警具体到产品条码和故障具体位置。Step 6: The system judges that the abnormal crimping data enters the NG buffer area 41, performs an alarm and locks, and prohibits entering the next process. The alarm is specific to the product barcode and the specific location of the fault.
步骤七、额外的,标准阈值H 0,H 1,F 1,F 2来源于阈值自学习模块34。该模块读取批量压接标准曲线获得大量正常压接的h 0、h 1、f 1、f 2,通过3σ正态分布或其它质量分析模型获得阈值H 0,H 1,F 1,F 2Step 7. In addition, the standard thresholds H 0 , H 1 , F 1 , and F 2 are derived from the threshold self-learning module 34 . This module reads batch crimping standard curves to obtain a large number of normal crimping h 0 , h 1 , f 1 , f 2 , and obtains thresholds H 0 , H 1 , F 1 , and F 2 through 3σ normal distribution or other quality analysis models.
步骤八、阈值自学习模块34的自学习功能,通过读取维修录入区42界面收集压接工序维修数据,不断修正和收敛标准阈值H 0,H 1,F 1,F 2,使系统判断准确率进一步提升。 Step 8. The self-learning function of the threshold self-learning module 34 collects the maintenance data of the crimping process by reading the interface of the maintenance entry area 42, and continuously corrects and converges the standard thresholds H 0 , H 1 , F 1 , and F 2 to further improve the accuracy of system judgment.
步骤九、数据查询区43作为查询应用,包括产品压接时对应的压接程序、压接时间和压接曲线等信息,支撑日常压接工艺优化或产品故障分析。Step 9: The data query area 43 is used as a query application, including information such as the corresponding crimping procedure, crimping time, and crimping curve during product crimping, and supports daily crimping process optimization or product failure analysis.
值得注意的是,本申请实施例中的压接设备不限驱动方式,压力传感器可以是有相同功能的其它装置,能支持实时准确反馈压接力和压头位移即可。It is worth noting that the crimping equipment in the embodiment of the present application is not limited to the driving method, and the pressure sensor can be other devices with the same function, as long as it can support real-time and accurate feedback of the crimping force and the displacement of the indenter.
另外,压接曲线的特征参数可以为能表征压接过程质量的其它有效参数,如曲线斜率等。 数据采集、分析、移交和学习模块功能可以自由组合或拆分,不影响系统运作。In addition, the characteristic parameters of the crimping curve may be other effective parameters that can characterize the quality of the crimping process, such as the slope of the curve. The functions of data acquisition, analysis, handover and learning modules can be freely combined or split without affecting the system operation.
本申请阐述的连接器压接状态的检测系统,通过提取压接曲线特征参数,做大数据分析,对压接质量进行判定。每一组压接曲线与压接过程一一对应,异常告警具体到产品条码和压接位置。The detection system for the crimping state of the connector described in this application judges the crimping quality by extracting the characteristic parameters of the crimping curve and doing big data analysis. Each set of crimping curves corresponds to the crimping process, and the abnormal alarm is specific to the product barcode and crimping position.
基于上述的连接器压接状态的检测方法和连接器压接状态的检测系统,下面提出本申请的通过压接曲线拦截某高速连接器压接不到位的具体实施例。Based on the above-mentioned connector crimping state detection method and connector crimping state detection system, a specific embodiment of this application for intercepting a certain high-speed connector crimping failure through crimping curves is proposed below.
在一些示例中,对于通过压接曲线拦截某高速连接器压接不到位的情况,具体可以包括但不限于如下步骤:In some examples, the following steps may be included but not limited to intercepting a high-speed connector that is not crimped in place through the crimping curve:
(1)根据A代码高速连接器插针尺寸和PCB孔径设计,计算预插件时连接器插针突出板面的尺寸L(如图14示意)约为0.6mm。连接器插针设计不同、PCB孔径设计不同,L的具体数值不同。(1) According to the A-code high-speed connector pin size and PCB aperture design, the dimension L (as shown in Figure 14) of the connector pin protruding from the board surface when calculating the pre-insertion is about 0.6mm. The specific value of L is different for different connector pin designs and PCB aperture designs.
(2)取连接器压接标准曲线一条,P 2为曲线结束的位置,P 1-P 2=L推算出P 1的位置,获得P 1处压接力大小为100lbf。连接器插针设计不同、PCB孔径设计不同,压接工艺不同,P 1处压接力大小不同。P 1,P 2如下图17所示。 (2) Take a connector crimping standard curve, P 2 is the position where the curve ends, P 1 -P 2 = L to calculate the position of P 1 , and obtain the crimping force at P 1 as 100lbf. The connector pin design is different, the PCB aperture design is different, the crimping process is different, and the crimping force at P 1 is different. P 1 and P 2 are shown in Figure 17 below.
(3)取连接器压接正常的批量压接曲线(比如100个),以第一个压接力大于等于100lbs为起始点P 1,压接结束位置为P 2,计算h 0=P 1-P 2,获得批量h 0。具体曲线数量可根据实际情况调整。 (3) Take the normal batch crimping curves of connectors (for example, 100 pieces), take the first crimping force greater than or equal to 100lbs as the starting point P 1 , and the crimping end position is P 2 , calculate h 0 =P 1 -P 2 , and obtain the batch h 0 . The number of specific curves can be adjusted according to the actual situation.
(4)对获得的批量h 0做3σ正态分布统计,获得A代码连接器阈值H 0,录入本系统作为压接是否到位的评判标准。H 0的获得也可以使用任意其它合适的数学统计模型或实践经验模型。 (4) Make 3σ normal distribution statistics on the obtained batch h 0 , obtain the A-code connector threshold H 0 , and input it into this system as the criterion for judging whether the crimping is in place. H0 can also be obtained using any other suitable mathematical statistical model or practical empirical model.
(5)假设工厂加工时,产品使用到该高速连接器。压接前,扫描产品条码X获取该产品信息,包括压接连接器代码A及其在PCB板上的位置,根据代码匹配到阈值H 0(5) It is assumed that the high-speed connector is used in the product during factory processing. Before crimping, scan the product barcode X to obtain the product information, including the code A of the crimping connector and its position on the PCB, and match the code to the threshold H 0 .
(6)压接完成后,参数分析模块读取产品所有连接器的压接曲线。A代码连接器的压接曲线按步骤(3)描述规则提取P 1,P 2,计算获得对应的h 0=P 1-P 2(6) After the crimping is completed, the parameter analysis module reads the crimping curves of all connectors of the product. The crimping curve of the A-code connector is extracted according to the rules described in step (3), and P 1 and P 2 are calculated to obtain the corresponding h 0 =P 1 -P 2 .
(7)取该产品上所有A代码连接器h 0与标准阈值H 0做比较。若Y位置处h 0<H 0,则判定该位置的压接不完全,对产品进行告警和拦截。若h 0≥H 0,则判定压接完全,不告警。如下图18,为连接器压接不完全曲线对比示意图。 (7) Take all A-code connectors h 0 on the product and compare it with the standard threshold H 0 . If h 0 <H 0 at the Y position, it is determined that the crimping at this position is incomplete, and an alarm and interception are performed on the product. If h 0H 0 , it is determined that the crimping is complete and no alarm is given. As shown in Figure 18 below, it is a schematic diagram of the comparison of incomplete curves of connector crimping.
(8)告警描述:X条码的Y位置处A器件压接不完全。(8) Alarm description: The crimping of the A device at the Y position of the X barcode is not complete.
基于本申请实施例的技术方案,可以具备如下技术效果:Based on the technical solutions of the embodiments of the present application, the following technical effects can be obtained:
一、低成本高效:在一些示例中,背板ICT测试夹具价格在6-8W,平均单块板测试时长2-10分钟。每个产品需单独研发治具,研发周期2-3个月;3D X-RAY设备价格在200-800W之间,平均单块板测试时长2-10分钟。而本申请在现有支持曲线反馈的压接设备基础上,硬件配备要求少(仅扫描枪、办公电脑等小型设备),投入成本低。压接完成后扫描系统,不良反馈时间不超过1分钟。1. Low cost and high efficiency: In some examples, the price of the backplane ICT test fixture is 6-8W, and the average test time for a single board is 2-10 minutes. Each product needs to develop a fixture separately, and the development period is 2-3 months; the price of 3D X-RAY equipment is between 200-800W, and the average test time for a single board is 2-10 minutes. However, based on the existing crimping equipment that supports curve feedback, this application requires less hardware equipment (only small equipment such as scanning guns and office computers), and the input cost is low. Scan the system after the crimping is completed, and the bad feedback time does not exceed 1 minute.
二、填补连接器测试漏洞:对于漏压和压接不完全,人工目检管控难度大,ICT包括整机测试都无法有效拦截,通过本申请能有效拦截,彻底解决漏压或压接不到位导致的外场可靠性问题。2. Fill in the loopholes in connector testing: for pressure leakage and incomplete crimping, manual visual inspection is difficult to control, and ICT, including the whole machine test, cannot be effectively intercepted. This application can effectively intercept and completely solve the field reliability problems caused by leakage or incomplete crimping.
基于上述的连接器压接状态的检测方法,下面提出本申请的控制器、连接器压接状态的检测系统和计算机可读存储介质的各个实施例。Based on the above method for detecting the crimping state of the connector, various embodiments of the controller, the system for detecting the crimping state of the connector and the computer-readable storage medium of the present application are proposed below.
另外,本申请的一个实施例提供了一种控制器,该控制器包括:存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序,处理器执行计算机程序时实现如上述的检测方法。In addition, an embodiment of the present application provides a controller, the controller includes: a memory, a processor, and a computer program stored in the memory and operable on the processor, and the processor implements the above detection method when executing the computer program.
可以理解的是,处理器和存储器可以通过总线或者其他方式连接。It can be understood that the processor and the memory can be connected through a bus or in other ways.
需要说明的是,本实施例中的控制器,可以包括图3中的处理器和存储器,两者属于相同的发明构思,因此两者具有相同的实现原理以及有益效果,此处不再详述。It should be noted that the controller in this embodiment may include the processor and the memory shown in FIG. 3 , both of which belong to the same inventive concept, so they have the same implementation principle and beneficial effect, and will not be described in detail here.
实现上述实施例的检测方法所需的非暂态软件程序以及指令存储在存储器中,当被处理 器执行时,执行上述实施例的连接器压接状态的检测方法,例如,执行以上描述的图4至图12中的方法步骤。The non-transitory software programs and instructions required to implement the detection method of the above-mentioned embodiment are stored in the memory, and when executed by the processor, the detection method of the connector crimping state of the above-mentioned embodiment is executed, for example, the method steps in Fig. 4 to Fig. 12 described above are executed.
值得注意的是,本申请实施例的控制器的具体实施方式和技术效果,可对应参照上述连接器压接状态的检测方法的具体实施方式和技术效果。It should be noted that, for the specific implementation manner and technical effect of the controller in the embodiment of the present application, reference may be made to the specific implementation manner and technical effect of the method for detecting the crimping state of the connector described above.
另外,本申请的一个实施例提供了一种连接器压接状态的检测系统,该连接器压接状态的检测系统包括但不限于有压接设备和上述的控制器,控制器与压接设备通信。In addition, an embodiment of the present application provides a connector crimping state detection system, the connector crimping state detection system includes but not limited to crimping equipment and the above-mentioned controller, the controller communicates with the crimping equipment.
值得注意的是,由于本申请实施例的连接器压接状态的检测系统包括有上述的控制器,而上述的控制器能够执行上述的连接器压接状态的检测方法,因此,本申请实施例的连接器压接状态的检测系统的具体实施方式和技术效果,可对应参照上述连接器压接状态的检测方法的具体实施方式和技术效果。It is worth noting that since the detection system of the connector crimping state in the embodiment of the present application includes the above-mentioned controller, and the above-mentioned controller can execute the above-mentioned detection method of the connector crimping state, therefore, the specific implementation manner and technical effect of the detection system of the connector crimping state in the embodiment of the present application can correspond to the specific implementation manner and technical effect of the above-mentioned connector crimping state detection method.
此外,本申请的一个实施例还提供了一种计算机可读存储介质,该计算机可读存储介质存储有计算机可执行指令,当计算机可执行指令用于执行上述的连接器压接状态的检测方法,例如,执行以上描述的图4至图12中的方法步骤。In addition, an embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are used to perform the above-mentioned method for detecting the connector crimping state, for example, perform the method steps in FIGS. 4 to 12 described above.
本申请实施例包括:首先,获取所述压接设备的压头在压接所述连接器的过程中的位移参数和压接力参数;接着,对所述位移参数和所述压接力参数进行特征提取处理,得到特征参数;最后,比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态。根据本申请实施例的技术方案,本申请实施例只需要根据位移参数和所述压接力参数提取出特征参数,并将特征参数和预设特征参数进行对比即可以得到连接器的压接状态,相对于现有的检测手段,能够快速、准确的检测出连接器压接不良,解决由于连接器压接不完全导致的连接器应用可靠性问题,在连接器压接质量管控上有重要的实用性。The embodiment of the present application includes: firstly, obtaining the displacement parameter and the crimping force parameter of the crimping head of the crimping device during crimping the connector; then, performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameter; finally, comparing the feature parameter with a preset feature parameter, and determining the crimping state of the connector according to the comparison result. According to the technical solution of the embodiment of the present application, the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and has important practicability in the quality control of connector crimping.
本领域普通技术人员可以理解,上文中所公开方法中的全部或某些步骤、系统可以被实施为软件、固件、硬件及其适当的组合。某些物理组件或所有物理组件可以被实施为由处理器,如中央处理器、数字信号处理器或微处理器执行的软件,或者被实施为硬件,或者被实施为集成电路,如专用集成电路。这样的软件可以分布在计算机可读介质上,计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的,术语计算机存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于RAM、ROM、EEPROM、闪存或其他存储器技术、CD-ROM、数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。此外,本领域普通技术人员公知的是,通信介质通常包括计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据,并且可包括任何信息递送介质。Those skilled in the art can understand that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware and an appropriate combination thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). As is well known to those of ordinary skill in the art, the term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and that can be accessed by a computer. In addition, communication media typically embody computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media, as are known to those of ordinary skill in the art.
以上是对本申请的一些实施进行了具体说明,但本申请并不局限于上述实施方式,熟悉本领域的技术人员在不违背本申请范围的共享条件下还可作出种种等同的变形或替换,这些等同的变形或替换均包括在本申请权利要求所限定的范围内。The above is a specific description of some implementations of the present application, but the application is not limited to the above-mentioned embodiments. Those skilled in the art can also make various equivalent deformations or replacements without violating the sharing conditions of the scope of the application. These equivalent deformations or replacements are all included in the scope defined by the claims of the application.

Claims (12)

  1. 一种连接器压接状态的检测方法,应用于检测系统中的控制器,所述检测系统还包括压接设备,所述控制器与所述压接设备通信,所述检测方法包括:A method for detecting a crimping state of a connector, applied to a controller in a detection system, the detection system further comprising crimping equipment, the controller communicating with the crimping equipment, the detection method comprising:
    获取所述压接设备的压头在压接所述连接器的过程中的位移参数和压接力参数;Obtaining displacement parameters and crimping force parameters of the crimping head of the crimping device during crimping the connector;
    对所述位移参数和所述压接力参数进行特征提取处理,得到特征参数;performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain feature parameters;
    比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态。The characteristic parameter is compared with the preset characteristic parameter, and the crimping state of the connector is determined according to the comparison result.
  2. 根据权利要求1所述的检测方法,其中,所述方法还包括:The detection method according to claim 1, wherein the method further comprises:
    在获取所述压接设备的压头在压接所述连接器的过程中的位移参数和压接力参数之后,根据所述位移参数和所述压接力参数生成压接曲线,其中,所述压接曲线为所述压接力参数随所述位移参数变化的分布曲线;After obtaining the displacement parameter and the crimping force parameter of the crimping head of the crimping device during crimping the connector, generate a crimping curve according to the displacement parameter and the crimping force parameter, wherein the crimping curve is a distribution curve of the crimping force parameter changing with the displacement parameter;
    对所述位移参数和所述压接力参数进行特征提取处理,得到特征参数包括:基于所述压接曲线进行特征提取处理,得到特征参数。Performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameters includes: performing feature extraction processing based on the crimping curve to obtain the feature parameters.
  3. 根据权利要求2所述的检测方法,其中,所述对所述位移参数和所述压接力参数进行特征提取处理,得到特征参数,包括:The detection method according to claim 2, wherein said performing feature extraction processing on said displacement parameter and said crimping force parameter to obtain feature parameters includes:
    对所述压接曲线进行特征提取处理,得到所述特征参数。Perform feature extraction processing on the crimping curve to obtain the feature parameters.
  4. 根据权利要求1所述的检测方法,其中,所述特征参数包括如下至少之一:The detection method according to claim 1, wherein the characteristic parameters include at least one of the following:
    所述连接器的插针在PCB孔内滑行的绝对距离;The absolute distance that the pin of the connector slides in the PCB hole;
    所述连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离;The absolute distance that the pin of the connector slides in the PCB hole after completing the maximum deformation;
    所述连接器的插针在最大形变时对应的压接力;The crimping force corresponding to the pin of the connector at the time of maximum deformation;
    所述连接器在压接过程中对应的最大压接力。The maximum crimping force corresponding to the connector during the crimping process.
  5. 根据权利要求4所述的检测方法,其中,当所述特征参数包括所述连接器的插针在PCB孔内滑行的绝对距离;所述比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态,包括:The detection method according to claim 4, wherein, when the characteristic parameter includes the absolute distance that the pin of the connector slides in the PCB hole; the comparison of the characteristic parameter and the preset characteristic parameter, and determining the crimping state of the connector according to the comparison result include:
    当所述连接器的插针在PCB孔内滑行的绝对距离小于第一预设距离,确定所述连接器的压接状态为压接不完全。When the absolute distance that the pins of the connector slide in the PCB hole is less than the first preset distance, it is determined that the crimping state of the connector is incomplete crimping.
  6. 根据权利要求4所述的检测方法,其中,当所述特征参数包括所述连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离以及所述连接器的插针在最大形变时对应的压接力;所述比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态,包括如下之一:The detection method according to claim 4, wherein when the characteristic parameters include the absolute distance that the pins of the connector slide in the PCB hole after the maximum deformation and the crimping force corresponding to the pins of the connector at the maximum deformation; the comparison of the characteristic parameters and the preset characteristic parameters, and determining the crimping state of the connector according to the comparison results include one of the following:
    当所述连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离小于第二预设距离,并且所述连接器的插针在最大形变时对应的压接力小于第一预设压接力,确定所述连接器的压接状态为压接跪针;When the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is less than the second preset distance, and the corresponding crimping force of the pins of the connector is less than the first preset crimping force when the pins are deformed at the maximum, it is determined that the crimping state of the connector is a crimping kneeling pin;
    当所述连接器的插针在完成最大形变之后在PCB孔内滑行的绝对距离大于等于第二预设距离,并且所述连接器的插针在最大形变时对应的压接力小于第一预设压接力,确定所述连接器的压接状态为所述连接器的插针尺寸和PCB孔径不匹配。When the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, it is determined that the crimping state of the connector is that the size of the pins of the connector does not match the aperture of the PCB.
  7. 根据权利要求4所述的检测方法,其中,当所述特征参数包括所述连接器在压接过程中对应的最大压接力;所述比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态,包括:The detection method according to claim 4, wherein, when the characteristic parameters include the corresponding maximum crimping force of the connector during the crimping process; comparing the characteristic parameters with preset characteristic parameters, and determining the crimping state of the connector according to the comparison result, include:
    当所述连接器在压接过程中对应的最大压接力大于第二预设压接力,确定所述连接器的压接状态为过压状态。When the corresponding maximum crimping force of the connector in the crimping process is greater than the second preset crimping force, it is determined that the crimping state of the connector is an over-pressed state.
  8. 根据权利要求1所述的检测方法,其中,在所述获取所述压接设备的压头在压接所述连接器的过程中的位移参数和压接力参数之前,所述方法还包括:The detection method according to claim 1, wherein, before acquiring the displacement parameters and crimping force parameters of the indenter of the crimping device during crimping the connector, the method further comprises:
    获取所述连接器在压接正常状态下批量的样本位移参数和样本压接力参数;Obtaining batch sample displacement parameters and sample crimping force parameters of the connectors in a normal state of crimping;
    对所述样本位移参数和所述样本压接力参数进行特征提取处理,得到批量的样本特征参数;performing feature extraction processing on the sample displacement parameter and the sample crimping force parameter to obtain batch sample feature parameters;
    根据批量的所述样本特征参数分析得到所述预设特征参数。The preset characteristic parameters are obtained according to the batch analysis of the sample characteristic parameters.
  9. 根据权利要求1所述的检测方法,其中,在比较所述特征参数和预设特征参数,根据比较结果确定所述连接器的压接状态之后,所述检测方法还包括:The detection method according to claim 1, wherein, after comparing the characteristic parameters with preset characteristic parameters and determining the crimping state of the connector according to the comparison result, the detection method further comprises:
    采用所述特征参数对所述预设特征参数进行修正,得到修正后的预设特征参数。The preset characteristic parameters are corrected by using the characteristic parameters to obtain the corrected preset characteristic parameters.
  10. 一种控制器,包括,存储器、处理器及存储在所述存储器上并可在所述处理器上运行的计算机程序,其中,所述处理器执行所述计算机程序时实现如权利要求1至9中任意一项所述的检测方法。A controller, comprising a memory, a processor, and a computer program stored on the memory and operable on the processor, wherein the detection method according to any one of claims 1 to 9 is realized when the processor executes the computer program.
  11. 一种连接器压接状态的检测系统,包括压接设备和如权利要求10所述的控制器,其中,所述控制器与所述压接设备通信。A detection system for a crimping state of a connector, comprising a crimping device and a controller according to claim 10, wherein the controller communicates with the crimping device.
  12. 一种计算机可读存储介质,存储有计算机可执行指令,其中,所述计算机可执行指令用于执行如权利要求1至9中任意一项所述的检测方法。A computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the detection method according to any one of claims 1-9.
PCT/CN2022/080742 2022-01-19 2022-03-14 Detection method and system for crimping state of connector, and controller and storage medium WO2023137850A1 (en)

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Publication number Priority date Publication date Assignee Title
US20190237926A1 (en) * 2018-01-31 2019-08-01 Abb Schweiz Ag Crimping tool with wireless communication system
CN109548309A (en) * 2019-01-02 2019-03-29 浪潮商用机器有限公司 A kind of pressure curve setting method and device
CN212085412U (en) * 2020-03-23 2020-12-04 东莞立讯技术有限公司 Crimping apparatus
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