WO2023137850A1 - Procédé et système de détection pour état de sertissage de connecteur, dispositif de commande et support d'enregistrement - Google Patents

Procédé et système de détection pour état de sertissage de connecteur, dispositif de commande et support d'enregistrement Download PDF

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WO2023137850A1
WO2023137850A1 PCT/CN2022/080742 CN2022080742W WO2023137850A1 WO 2023137850 A1 WO2023137850 A1 WO 2023137850A1 CN 2022080742 W CN2022080742 W CN 2022080742W WO 2023137850 A1 WO2023137850 A1 WO 2023137850A1
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Prior art keywords
crimping
connector
parameter
parameters
state
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PCT/CN2022/080742
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English (en)
Chinese (zh)
Inventor
李丹霞
马军华
王峰
董典桥
汪志坤
杨政凯
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中兴通讯股份有限公司
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Publication of WO2023137850A1 publication Critical patent/WO2023137850A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/211—Selection of the most significant subset of features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the embodiments of the present application relate to but are not limited to the technical field of device detection, and in particular, relate to a method for detecting a crimped state of a connector, a controller, a system for detecting a crimped state of a connector, and a computer-readable storage medium.
  • Connector crimping is a process technology that uses elastic deformable pins or hard pins to cooperate with PCB metallized holes to form close contact points between pins and metallized holes to achieve electrical interconnection.
  • the current detection methods mainly include visual inspection, 3D X-ray test and ICT test.
  • problems such as poor stability, high cost, slow detection speed or detection errors.
  • Embodiments of the present application provide a method for detecting a crimping state of a connector, a controller, a system for detecting a crimping state of a connector, and a computer-readable storage medium.
  • an embodiment of the present application provides a detection method for a crimping state of a connector, which is applied to a controller in a detection system.
  • the detection system further includes a crimping device, and the controller communicates with the crimping device.
  • the detection method includes: acquiring a displacement parameter and a crimping force parameter of a crimping head of the crimping device during crimping the connector; performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain a feature parameter; comparing the feature parameter with a preset feature parameter, and determining the crimping state of the connector according to the comparison result.
  • the embodiment of the present application also provides a controller, a memory, a processor, and a computer program stored on the memory and operable on the processor, and the processor implements the connector crimping state detection method described in the first aspect when executing the computer program.
  • an embodiment of the present application further provides a detection system for a crimping state of a connector, including a crimping device and the controller described in the second aspect above, where the controller communicates with the crimping device.
  • the embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions, the computer-executable instructions being used to execute the connector crimping state detection method described in the first aspect above.
  • Figure 1 is a schematic diagram of a connector crimping process
  • Fig. 2 is a schematic diagram of a situation where the connector falls off
  • FIG. 3 is a schematic diagram of a system architecture for performing a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 4 is a flow chart of a method for detecting a connector crimping state provided by an embodiment of the present application
  • FIG. 5 is a flowchart of obtaining a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 6 is a flow chart of performing feature extraction processing on crimping curves to obtain characteristic parameters in the detection method of connector crimping state provided by an embodiment of the present application;
  • Fig. 7 is a flowchart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by an embodiment of the present application;
  • Fig. 8 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
  • FIG. 9 is a flowchart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application.
  • FIG. 10 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application;
  • Fig. 11 is a flow chart of obtaining preset characteristic parameters in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • FIG. 12 is a flow chart of correcting preset characteristic parameters in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 13 is a schematic diagram of a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application;
  • Fig. 14 is a schematic diagram of the size of the pins protruding from the PCB board surface in the method for detecting the crimping state of the connector provided by one embodiment of the present application;
  • FIG. 15 is a schematic structural diagram of a detection system for a connector crimping state provided by an embodiment of the present application.
  • Fig. 16 is a data block diagram of a detection system for a connector crimping state provided by an embodiment of the present application
  • Fig. 17 is a schematic diagram of crimping standard curves P 1 and P 2 in the detection method of connector crimping state provided by an embodiment of the present application;
  • FIG. 18 is a comparative schematic diagram of connector crimping incomplete curves in the detection method of connector crimping state provided by an embodiment of the present application.
  • connector crimping is a process technology that uses elastic deformable pins or hard pins to cooperate with PCB (Printed Circuit Board, printed circuit board) metallized holes to form close contact points between pins and metallized holes to realize electrical interconnection.
  • PCB printed Circuit Board, printed circuit board
  • the current detection methods mainly include visual inspection, 3D X-ray (Three-Dimensional X-ray, three-dimensional X-ray) test and ICT (In Circuit Tester, automatic online tester) test, etc.
  • Visual inspection mainly relies on manual observation, which cannot accurately detect hidden defects such as kneeling stitches, and is affected by individual differences among inspectors, making it difficult to guarantee the consistency and stability of crimping quality.
  • 3D X-ray testing technology uses X-rays to penetrate the device and PCB, and uses layered technology imaging to check whether the pins are inserted into the holes to detect whether the connector is crimped well. 3D X-ray equipment is expensive.
  • ICT testing technology judges whether the connector crimping is normal by detecting whether the connector and the PCB are electrically interconnected, which is currently the most widely used detection method.
  • This solution needs to develop a test fixture separately, and the detection effect is greatly affected by the precision of the fixture, and it is difficult to locate after the same network fault, especially for the fault that there is electrical interconnection but incomplete crimping cannot be effectively identified when the pin is connected to the PCB hole.
  • connector crimping curves are currently in its infancy. More and more crimping equipment supports crimp curve feedback. Some crimping equipment tries to optimize the crimping program settings through the crimping curve, and carry out early warning and interception of the bad crimping process. However, due to the introduction of tolerances such as PCB thickness, PCB warpage, and molds, the crimping curve will fluctuate, and the actual application effect is not good.
  • embodiments of the present application provide a method for detecting a crimping state of a connector, a controller, a system for detecting a crimping state of a connector, and a computer-readable storage medium, wherein the method for detecting a crimping state of a connector is applied to a controller in the detection system, and the detection system further includes a crimping device, and the controller communicates with the crimping device. parameter to determine the crimp state of the connector based on the comparison result.
  • the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector.
  • it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and have important practicability in the quality control of connector crimping.
  • FIG. 3 is a schematic diagram of a system architecture 100 for performing a method for detecting a crimping state of a connector provided by an embodiment of the present application.
  • the system architecture 100 is provided with a processor 110 and a memory 120 , wherein the processor 110 and the memory 120 may be connected via a bus or in other ways, and in FIG. 3 the connection via a bus is taken as an example.
  • the memory 120 can be used to store non-transitory software programs and non-transitory computer-executable programs.
  • the memory 120 may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices.
  • the memory 120 may include memory 120 located remotely relative to the processor 110 , and these remote memories may be connected to the system architecture 100 through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
  • system architecture 100 can be applied to 3G communication network systems, LTE communication network systems, 5G communication network systems and subsequent evolved mobile communication network systems, etc., which is not specifically limited in this embodiment.
  • system architecture 100 shown in FIG. 3 does not limit the embodiment of the present application, and may include more or less components than shown in the figure, or combine some components, or arrange different components.
  • the processor 110 can call the detection program of the connector crimping state stored in the memory 120 , so as to execute the detection method of the connector crimping state.
  • FIG. 4 is a flowchart of a method for detecting a crimping state of a connector provided by an embodiment of the present application; the method for detecting a crimping state of a connector in an embodiment of the present application is applied to a controller in a detection system.
  • the detection system also includes a crimping device, and the controller communicates with the crimping device.
  • the controller may include the processor and memory in FIG. 3, and the detection method includes but is not limited to steps S100, S200, and S300.
  • Step S100 obtaining displacement parameters and crimping force parameters of the crimping head of the crimping equipment during the process of crimping the connector;
  • Step S200 performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameter
  • Step S300 comparing the characteristic parameters with preset characteristic parameters, and determining the crimping state of the connector according to the comparison result.
  • the controller will obtain the displacement parameter and crimping force parameter during the crimping process of the connector, and then, the controller will perform feature extraction processing on the displacement parameter and crimping force parameter to obtain the characteristic parameter; finally, the controller will compare the characteristic parameter with the preset characteristic parameter to obtain the comparison result, and determine the crimping state of the connector according to the comparison result.
  • the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and have important practicability in the quality control of connector crimping.
  • the above characteristic parameters may include at least one of the following: the absolute distance of the connector pin sliding in the PCB hole; the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation; the corresponding crimping force of the connector pin at the maximum deformation; the corresponding maximum crimping force of the connector during the crimping process.
  • FIG. 5 is a flow chart of obtaining a crimping curve in a method for detecting a crimping state of a connector provided by an embodiment of the present application; after the above step S100, the above step S200 specifically includes, but is not limited to, steps S410 and S420.
  • Step S410 generating a crimping curve according to the displacement parameter and the crimping force parameter, wherein the crimping curve is a distribution curve in which the crimping force parameter changes with the displacement parameter;
  • Step S420 performing feature extraction processing based on the crimping curve to obtain feature parameters.
  • the controller will obtain the distribution curve of the crimping force parameter changing with the displacement parameter during the crimping process of the connector, that is, the crimping curve, and then perform feature extraction processing based on the crimping curve to obtain the characteristic parameters.
  • FIG. 6 is a flow chart of performing feature extraction processing on the crimping curve to obtain characteristic parameters in the method for detecting the crimping state of a connector provided by an embodiment of the present application; regarding the feature extraction processing of the displacement parameters and crimping force parameters in the above step S200 to obtain the characteristic parameters, it specifically includes but is not limited to step S500.
  • Step S500 performing feature extraction processing on the crimping curve to obtain feature parameters.
  • the controller performs feature extraction processing on the crimping curve to obtain feature parameters.
  • FIG. 7 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by an embodiment of the present application; when the characteristic parameters include the absolute distance of the pin of the connector sliding in the PCB hole; regarding the comparison of the characteristic parameters and the preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, which specifically includes but is not limited to step S600.
  • Step S600 when the absolute distance that the pins of the connector slide in the PCB hole is less than the first preset distance, determine that the crimping state of the connector is incomplete crimping.
  • the controller when the crimping head of the crimping device crimps the connector to the PCB hole, the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole with the first preset distance. If the absolute distance of the connector pin sliding in the PCB hole is smaller than the first preset distance, then the controller will determine the connection The crimping status of the device is incomplete crimping.
  • FIG. 8 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the absolute distance that the pin of the connector slides in the PCB hole after the maximum deformation and the corresponding crimping force when the pin of the connector is at the maximum deformation; with regard to the comparison of the characteristic parameters and preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S700.
  • Step S700 when the absolute distance that the pins of the connector slide in the PCB hole after the maximum deformation is less than the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, determine that the crimping state of the connector is the crimping kneeling pin.
  • the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation and the corresponding crimping force of the connector pin at the maximum deformation; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation with the second preset distance, and comparing the corresponding crimping force and the first preset crimping force of the pins of the connector at the maximum deformation, if the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is less than the second preset distance, and the crimping force corresponding to the pins of the connector at the maximum deformation is less than the first preset crimping force, then the controller will determine that
  • FIG. 9 is a flow chart of judging the crimping state of the connector in the detection method of the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the absolute distance that the pin of the connector slides in the PCB hole after the maximum deformation and the crimping force corresponding to the pin of the connector at the maximum deformation; with regard to the comparison of the characteristic parameters and preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S800.
  • Step S800 when the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector when the maximum deformation is less than the first preset crimping force, determine that the crimping state of the connector is that the size of the pins of the connector does not match the aperture of the PCB.
  • the controller will obtain the displacement parameters and crimping force parameters during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameters and crimping force parameters to obtain the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation and the corresponding crimping force of the connector pin at the maximum deformation; finally, the controller will compare the absolute distance of the connector pin sliding in the PCB hole after the maximum deformation with the second preset distance, and comparing the corresponding crimping force and the first preset crimping force of the pins of the connector at the maximum deformation, if the absolute distance of the pins of the connector sliding in the PCB hole after the maximum deformation is greater than or equal to the second preset distance, and the crimping force corresponding to the pins of the connector at the maximum deformation is less than the first preset crimping force, then the controller
  • FIG. 10 is a flow chart of judging the crimping state of the connector in the method for detecting the crimping state of the connector provided by another embodiment of the present application; when the characteristic parameters include the corresponding maximum crimping force of the connector during the crimping process; regarding the comparison of the characteristic parameters and the preset characteristic parameters in the above step S300, the crimping state of the connector is determined according to the comparison result, specifically including but not limited to step S900.
  • Step S900 when the corresponding maximum crimping force of the connector during the crimping process is greater than the second preset crimping force, determine that the crimping state of the connector is an over-pressed state.
  • the controller when the crimping head of the crimping device crimps the connector to the PCB hole, the controller will obtain the displacement parameter and the crimping force parameter during the crimping process of the connector. Then, the controller will perform feature extraction processing on the displacement parameter and the crimping force parameter to obtain the corresponding maximum crimping force of the connector during the crimping process; finally, the controller will compare the corresponding maximum crimping force of the connector during the crimping process with the second preset crimping force. If the corresponding maximum crimping force of the connector during the crimping process is greater than the second preset crimping force, then the controller will determine The crimp state of the connector is an overpressure state.
  • FIG. 11 is a flow chart of obtaining preset characteristic parameters in the detection method of the connector crimping state provided by an embodiment of the present application; before the above step S100, the embodiment of the present application also includes but is not limited to step S1010, step S1020 and step S1030.
  • Step S1010 obtaining batch sample displacement parameters and sample crimping force parameters of the connectors in the crimping normal state
  • Step S1020 performing feature extraction processing on the sample displacement parameters and the sample crimping force parameters to obtain batches of sample feature parameters
  • Step S1030 obtaining preset characteristic parameters according to the batch sample characteristic parameter analysis.
  • the preset characteristic parameters of the connector can be obtained through big data analysis of a large number of standard crimping curve characteristic parameters, such as statistical analysis models such as 3 ⁇ normal distribution.
  • FIG. 12 is a flow chart of correcting the preset characteristic parameters in the detection method of the connector crimping state provided by an embodiment of the present application; after comparing the characteristic parameters and the preset characteristic parameters in the above step S300, and determining the crimping state of the connector according to the comparison result, the detection method of the embodiment of the present application also includes but is not limited to step S1100.
  • Step S1100 using the characteristic parameters to modify the preset characteristic parameters to obtain the corrected preset characteristic parameters.
  • the embodiment of the present application can continuously modify and converge preset characteristic parameters, so as to further improve the accuracy of system judgment.
  • Step 1 Use the pressure sensor and the distance sensor of the crimping equipment to obtain the distribution curve of the pressure changing with the distance during the crimping process of the connector, that is, the crimping curve.
  • Step 2 Design connector crimping DOE (Design Of Experiment, Design of Experiments) tests according to different types of crimping failures, analyze the difference between crimping good products, crimping bad products and their corresponding crimping curves, and obtain the connector crimping curve characteristic parameters h 0 , h 1 , f 1 , f 2 , as shown in Figure 13.
  • h 0 is the absolute distance that the connector pin slides in the PCB hole, which can effectively indicate whether the crimping is complete.
  • the size of h 0 should be close to the size of the pin protruding from the PCB surface during pre-insertion (as shown in Figure 14).
  • the starting position P 1 of h 0 is confirmed, and the effects of PCB warpage, PCB thickness tolerance, crimping mold tolerance, and crimping equipment mechanical coupling during the crimping process are eliminated as much as possible;
  • the ending position P 2 is the crimping stop position. Both the connector and the PCB have dimensional tolerances, so the starting position can fluctuate slightly from side to side.
  • h 1 is the absolute distance that the connector pin slides in the PCB hole after the maximum deformation
  • the starting position P 3 is the peak position of the curve
  • the end position P 4 is the valley position of the curve.
  • h 1 decreases, indicating that the connector may be raised; f 1 is the crimping force at the maximum deformation of the connector pin, that is, the crimping force at the peak of the curve. The decrease of f 1 indicates that the number of pins at the maximum deformation of the pins may be reduced or the PCB aperture/pin size is abnormal. Combining h 1 and f 1 can effectively characterize whether the connector pins are kneeling. f 2 is the maximum crimping force during the crimping process, which can effectively indicate whether the connector is over-pressed.
  • Step 3 Through big data analysis of a large number of standard crimping curve characteristic parameters h 0 , h 1 , f 1 , f 2 , such as statistical analysis models such as 3 ⁇ normal distribution, obtain connector crimping quality control thresholds H 0 , H 1 , F 1 , F 2 , which are the above-mentioned preset characteristic parameters.
  • Step 4 Calculate and compare whether the characteristic parameters of the crimping curve meet the threshold after the connector crimping is completed, and determine whether the quality of the connector crimping is good.
  • the process of extracting crimping curve characteristic parameters from DOE tests is as follows: First, select appropriate influencing factors according to product characteristics, equipment characteristics, and fault principles, and use different influencing factors as gradient variables. Secondly, analyze the curve difference between complete crimping and incomplete crimping in the DOE test, and decompose the curve to obtain the characteristic parameter h 0 of incomplete crimping. Finally, the complete crimping h 0 in the DOE test is extracted in batches, and the threshold H 0 is obtained through statistical analysis of data, such as 3 ⁇ normal distribution. Use H 0 to judge the incomplete crimping curve in the test and verify its effectiveness.
  • FIG. 15 is a schematic structural diagram of a connector crimping state detection system provided by an embodiment of the present application
  • FIG. 16 is a data block diagram of a connector crimping state detection system provided by an embodiment of the present application.
  • the system consists of a scanning device 10 , a crimping device 20 , a data analysis system 30 and a defect control system 40 .
  • the crimping equipment 20 can be a common servo-driven crimping machine or any other type of crimping machine, which can control the speed, displacement and applied force of the indenter 21 in the vertical direction with a certain program; the pressure sensor 22 is used to detect the crimping force during the crimping process, and can realize crimping curve feedback.
  • the data analysis system 30 including data collection module 31, the deployment data of the header position and the corresponding pressure force data during the collection process, and the pressure connection curve of the displacement-pressure connection force; parameter analysis module 32, the built-in pressure connection curve feature parameter extraction algorithm, quickly calculate the feature parameters of the output pressure connecting curve; verify the transfer module 33, the feature parameters are compared with the threshold, and the system judges the system judgment. Determine whether the pressure connection is poor; the threshold self -learning module 34, read the batch pressure connection standard curve, calculate the initial threshold of the feature parameter, and learn the maintenance data.
  • the data analysis system can be connected with any number of crimping devices 20 that meet the functions. It should be noted that the data analysis system 30 in the embodiment of the present application may include the above-mentioned controller.
  • the defect control system 40 includes the NG buffer area 41, where the system determines that products with abnormal crimping quality will be alerted and intercepted; the maintenance input area 42 is used to input the actual maintenance results of the crimping process; the data query area 43 supports all crimping process data queries such as time, program, and curve.
  • Step 1 The product enters the crimping process through the scanning device 10, and scans to obtain product information, including product barcode, name, and crimping program (the crimping program includes settings such as crimping device, crimping position, speed and pressure).
  • Step 2 The crimping device 20 controls the indenter 21 to complete one connector crimping according to the crimping procedure.
  • the pressure sensor 22 detects the crimping force in the process in real time, and the equipment records the crimping data in real time.
  • Step 3 The data acquisition module 31 collects the crimping data recorded by the crimping equipment, and generates a displacement-crimping force curve; at the same time, it reads crimping product information, including product name, barcode, crimping device, crimping position, etc., to ensure that the crimping curve corresponds to the crimping process one by one.
  • Step 4 The characteristic parameter analysis module 32 reads the collected crimping data in real time, and calculates the characteristic parameters h 0 , h 1 , f 1 , f 2 of the crimping curve after each crimping is completed.
  • Step 5 The parameter verification transfer module 33 reads the result of the parameter analysis module 32 and compares it with the standard thresholds H 0 , H 1 , F 1 , and F 2 . If h 0 ⁇ H 0 , judge “incomplete crimping"; if h 1 ⁇ H 1 and f 1 ⁇ F 1 , judge “crimping kneeling pin”; if h 1 ⁇ H 1 and f 1 ⁇ F 1 , judge “abnormal PCB aperture/connector pin size"; if f 2 >F 2 , judge “connector overvoltage”;
  • Step 6 The system judges that the abnormal crimping data enters the NG buffer area 41, performs an alarm and locks, and prohibits entering the next process.
  • the alarm is specific to the product barcode and the specific location of the fault.
  • the standard thresholds H 0 , H 1 , F 1 , and F 2 are derived from the threshold self-learning module 34 .
  • This module reads batch crimping standard curves to obtain a large number of normal crimping h 0 , h 1 , f 1 , f 2 , and obtains thresholds H 0 , H 1 , F 1 , and F 2 through 3 ⁇ normal distribution or other quality analysis models.
  • Step 8 The self-learning function of the threshold self-learning module 34 collects the maintenance data of the crimping process by reading the interface of the maintenance entry area 42, and continuously corrects and converges the standard thresholds H 0 , H 1 , F 1 , and F 2 to further improve the accuracy of system judgment.
  • Step 9 The data query area 43 is used as a query application, including information such as the corresponding crimping procedure, crimping time, and crimping curve during product crimping, and supports daily crimping process optimization or product failure analysis.
  • the crimping equipment in the embodiment of the present application is not limited to the driving method, and the pressure sensor can be other devices with the same function, as long as it can support real-time and accurate feedback of the crimping force and the displacement of the indenter.
  • characteristic parameters of the crimping curve may be other effective parameters that can characterize the quality of the crimping process, such as the slope of the curve.
  • the functions of data acquisition, analysis, handover and learning modules can be freely combined or split without affecting the system operation.
  • the detection system for the crimping state of the connector described in this application judges the crimping quality by extracting the characteristic parameters of the crimping curve and doing big data analysis.
  • Each set of crimping curves corresponds to the crimping process, and the abnormal alarm is specific to the product barcode and crimping position.
  • the following steps may be included but not limited to intercepting a high-speed connector that is not crimped in place through the crimping curve:
  • the dimension L (as shown in Figure 14) of the connector pin protruding from the board surface when calculating the pre-insertion is about 0.6mm.
  • the specific value of L is different for different connector pin designs and PCB aperture designs.
  • P 2 is the position where the curve ends
  • P 1 -P 2 L to calculate the position of P 1 , and obtain the crimping force at P 1 as 100lbf.
  • the connector pin design is different
  • the PCB aperture design is different
  • the crimping process is different
  • the crimping force at P 1 is different.
  • P 1 and P 2 are shown in Figure 17 below.
  • H0 can also be obtained using any other suitable mathematical statistical model or practical empirical model.
  • the parameter analysis module reads the crimping curves of all connectors of the product.
  • the price of the backplane ICT test fixture is 6-8W, and the average test time for a single board is 2-10 minutes. Each product needs to develop a fixture separately, and the development period is 2-3 months; the price of 3D X-RAY equipment is between 200-800W, and the average test time for a single board is 2-10 minutes.
  • this application requires less hardware equipment (only small equipment such as scanning guns and office computers), and the input cost is low. Scan the system after the crimping is completed, and the bad feedback time does not exceed 1 minute.
  • an embodiment of the present application provides a controller, the controller includes: a memory, a processor, and a computer program stored in the memory and operable on the processor, and the processor implements the above detection method when executing the computer program.
  • processor and the memory can be connected through a bus or in other ways.
  • controller in this embodiment may include the processor and the memory shown in FIG. 3 , both of which belong to the same inventive concept, so they have the same implementation principle and beneficial effect, and will not be described in detail here.
  • the non-transitory software programs and instructions required to implement the detection method of the above-mentioned embodiment are stored in the memory, and when executed by the processor, the detection method of the connector crimping state of the above-mentioned embodiment is executed, for example, the method steps in Fig. 4 to Fig. 12 described above are executed.
  • an embodiment of the present application provides a connector crimping state detection system
  • the connector crimping state detection system includes but not limited to crimping equipment and the above-mentioned controller, the controller communicates with the crimping equipment.
  • the detection system of the connector crimping state in the embodiment of the present application includes the above-mentioned controller, and the above-mentioned controller can execute the above-mentioned detection method of the connector crimping state, therefore, the specific implementation manner and technical effect of the detection system of the connector crimping state in the embodiment of the present application can correspond to the specific implementation manner and technical effect of the above-mentioned connector crimping state detection method.
  • an embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are used to perform the above-mentioned method for detecting the connector crimping state, for example, perform the method steps in FIGS. 4 to 12 described above.
  • the embodiment of the present application includes: firstly, obtaining the displacement parameter and the crimping force parameter of the crimping head of the crimping device during crimping the connector; then, performing feature extraction processing on the displacement parameter and the crimping force parameter to obtain the feature parameter; finally, comparing the feature parameter with a preset feature parameter, and determining the crimping state of the connector according to the comparison result.
  • the embodiment of the present application only needs to extract the characteristic parameters according to the displacement parameters and the crimping force parameters, and compare the characteristic parameters with the preset characteristic parameters to obtain the crimping state of the connector. Compared with the existing detection means, it can quickly and accurately detect the poor crimping of the connector, solve the problem of connector application reliability caused by incomplete crimping of the connector, and has important practicability in the quality control of connector crimping.
  • Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and that can be accessed by a computer.
  • communication media typically embody computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media, as are known to those of ordinary skill in the art.

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Theoretical Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Computational Biology (AREA)
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  • Manufacturing Of Electrical Connectors (AREA)

Abstract

Procédé et système de détection pour un état de sertissage d'un connecteur, dispositif de commande et support d'enregistrement. Le procédé de détection est appliqué à un dispositif de commande dans un système de détection. Le système de détection comprend en outre un dispositif de sertissage. Le procédé de détection consiste à : acquérir un paramètre de déplacement et un paramètre de force de sertissage d'une tête de pression d'un dispositif de sertissage pendant le processus de sertissage d'un connecteur (S100) ; exécuter un traitement d'extraction de caractéristiques sur le paramètre de déplacement et le paramètre de force de sertissage, de façon à obtenir un paramètre de caractéristique (S200) ; et comparer le paramètre de caractéristique à un paramètre de caractéristique prédéfini, et déterminer un état de sertissage du connecteur en fonction d'un résultat de comparaison (S300).
PCT/CN2022/080742 2022-01-19 2022-03-14 Procédé et système de détection pour état de sertissage de connecteur, dispositif de commande et support d'enregistrement WO2023137850A1 (fr)

Applications Claiming Priority (2)

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CN202210060011.3A CN116520202A (zh) 2022-01-19 2022-01-19 连接器压接状态的检测方法、控制器、系统和存储介质
CN202210060011.3 2022-01-19

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109548309A (zh) * 2019-01-02 2019-03-29 浪潮商用机器有限公司 一种压力曲线设定方法及装置
US20190237926A1 (en) * 2018-01-31 2019-08-01 Abb Schweiz Ag Crimping tool with wireless communication system
CN212085412U (zh) * 2020-03-23 2020-12-04 东莞立讯技术有限公司 压接设备
CN112858847A (zh) * 2021-01-04 2021-05-28 苏州华兴源创科技股份有限公司 一种测试装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190237926A1 (en) * 2018-01-31 2019-08-01 Abb Schweiz Ag Crimping tool with wireless communication system
CN109548309A (zh) * 2019-01-02 2019-03-29 浪潮商用机器有限公司 一种压力曲线设定方法及装置
CN212085412U (zh) * 2020-03-23 2020-12-04 东莞立讯技术有限公司 压接设备
CN112858847A (zh) * 2021-01-04 2021-05-28 苏州华兴源创科技股份有限公司 一种测试装置

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