WO2023119998A1 - Procédé de production d'un stratifié ayant un motif conducteur, composition photosensible et film de transfert - Google Patents

Procédé de production d'un stratifié ayant un motif conducteur, composition photosensible et film de transfert Download PDF

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Publication number
WO2023119998A1
WO2023119998A1 PCT/JP2022/043073 JP2022043073W WO2023119998A1 WO 2023119998 A1 WO2023119998 A1 WO 2023119998A1 JP 2022043073 W JP2022043073 W JP 2022043073W WO 2023119998 A1 WO2023119998 A1 WO 2023119998A1
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photosensitive composition
polymerizable compound
mass
composition layer
layer
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PCT/JP2022/043073
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English (en)
Japanese (ja)
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邦彦 児玉
壮二 石坂
悠 鬼塚
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富士フイルム株式会社
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Publication of WO2023119998A1 publication Critical patent/WO2023119998A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • Conductor patterns are applied to various articles such as printed circuit boards and display devices. For example, a conductor pattern is formed at a desired position by plating using a resist pattern (see, for example, JP-A-2016-139154).
  • An object of an embodiment of the present disclosure is to provide a method for manufacturing a laminate having a conductor pattern with improved resolution of a resist pattern used for forming the conductor pattern.
  • An object of another embodiment of the present disclosure is to provide a photosensitive composition that forms a resist pattern with excellent resolution.
  • An object of another embodiment of the present disclosure is to provide a transfer film that forms a resist pattern with excellent resolution.
  • the present disclosure includes the following aspects. ⁇ 1> Prepare a laminate containing a substrate and a conductive layer in this order, and prepare a photosensitive composition layer containing a resin containing a structural unit represented by the following formula B1 and a structural unit having an alkali-soluble group. , providing on the conductive layer, exposing the photosensitive composition layer, developing the photosensitive composition layer to form a resist pattern, and disposing the resist pattern. performing a plating process on the conductive layer in a region not exposed to the conductive layer; removing the resist pattern; and removing the conductive layer exposed by removing the resist pattern to form a conductive pattern. , in this order.
  • X B1 and X B2 each independently represent —O— or —NR N —
  • R N represents a hydrogen atom or an alkyl group
  • L is a divalent group containing no hydroxy group.
  • R B1 and R B2 each independently represent a hydrogen atom or an alkyl group.
  • Providing the photosensitive composition layer includes preparing a transfer film containing a temporary support and the photosensitive composition layer in this order, and the photosensitive composition layer and the conductive layer of the transfer film.
  • a method for producing a laminate having a conductor pattern according to ⁇ 1> comprising: ⁇ 3> Further comprising peeling the temporary support between bonding the photosensitive composition layer and the conductive layer and exposing the photosensitive composition layer, ⁇ 2>
  • ⁇ 7> The method for producing a laminate having a conductor pattern according to ⁇ 5> or ⁇ 6>, wherein the polymerizable compound contains a radically polymerizable compound having at least two polymerizable groups.
  • the polymerizable compound contains a radically polymerizable compound having two polymerizable groups, and the ratio of the content of the radically polymerizable compound having two polymerizable groups to the content of the polymerizable compound is A method for producing a laminate having the conductor pattern according to ⁇ 5> or ⁇ 6>, which is 80% by mass or more.
  • the polymerizable compound contains a polymerizable compound having a bisphenol structure, and the ratio of the content of the polymerizable compound having a bisphenol structure to the content of the polymerizable compound is 50% by mass or more.
  • 5> A method for producing a laminate having a conductor pattern according to any one of ⁇ 8>.
  • ⁇ 11> A resin containing a structural unit represented by the following formula B1 and a structural unit having an alkali-soluble group, a photopolymerization initiator, and a polymerizable compound, wherein the photopolymerization initiator is hexaarylbiimidazole
  • a photosensitive composition which is a compound.
  • a transfer film comprising a photopolymerization initiator and a polymerizable compound, wherein the photopolymerization initiator comprises a hexaarylbiimidazole compound.
  • step includes not only independent steps but also steps that cannot be clearly distinguished from other steps as long as the intended purpose is achieved.
  • the content of metal elements is measured using an inductively coupled plasma (ICP) spectroscopic analyzer.
  • ICP inductively coupled plasma
  • (Meth)acrylic in the present disclosure is a concept that includes both acrylic and methacrylic.
  • (meth)acryloyloxy group is a concept that includes both acryloyloxy groups and methacryloyloxy groups.
  • (Meth)acrylate in the present disclosure is a concept that includes both acrylate and methacrylate.
  • alkali-soluble means the property of having a solubility of 0.1 g or more in 100 g of a 1% by mass sodium carbonate aqueous solution having a liquid temperature of 22°C.
  • water-soluble means the property of having a solubility of 0.1 g or more in 100 g of water having a pH of 7.0 and a liquid temperature of 22°C.
  • Solid content in the present disclosure means all components excluding solvent.
  • a method for manufacturing a laminate having a conductor pattern according to an embodiment of the present disclosure includes the following (1) to (7) in this order.
  • (1) Preparing a laminate including a substrate and a conductive layer in this order (hereinafter referred to as "laminate preparation step”).
  • X B1 and X B2 each independently represent —O— or —NR N —
  • R N represents a hydrogen atom or an alkyl group
  • L is a divalent group containing no hydroxy group.
  • R B1 and R B2 each independently represent a hydrogen atom or an alkyl group.
  • resin (A) containing a structural unit represented by formula B1 and a structural unit having an alkali-soluble group
  • a method for manufacturing a laminate having a conductor pattern in which the resolution of the resist pattern used for forming the conductor pattern is improved is due to the chemical structure of the structural unit represented by formula B1 contained in the resin (A).
  • the divalent group not containing a hydroxy group represented by L in Formula B1 contributes to the improvement of the resolution of the resist pattern.
  • L in formula B1 does not contain a hydroxy group. Therefore, according to the photosensitive composition layer containing the resin (A), expansion of the photosensitive composition layer due to permeation of the developer is reduced or prevented, and the resolution of the resist pattern is improved.
  • the laminate preparation step is to prepare a laminate including a substrate and a conductive layer in this order.
  • the laminate may be a commercially available product.
  • the laminate may be manufactured by a process independent of the method of manufacturing the laminate having the conductor pattern.
  • the laminate may be manufactured in a laminate preparation process.
  • substrates include resin substrates, glass substrates, ceramic substrates, and semiconductor substrates.
  • Preferred substrates include, for example, those described in paragraph [0140] of WO2018/155193.
  • the substrate is preferably a resin substrate.
  • the resin substrate preferably contains polyethylene terephthalate, cycloolefin polymer or polyimide.
  • Examples of conductive layers include metal layers.
  • a metal layer is a layer containing a metal.
  • Main components of the metal layer include, for example, copper, chromium, lead, nickel, gold, silver, tin and zinc.
  • a "main component" means the metal with the maximum content among the metals contained in the object.
  • the conductive layer is preferably a layer containing copper as a main component.
  • the average thickness of the conductive layer is preferably 50 nm or more, more preferably 100 nm or more.
  • the average thickness of the conductive layer is preferably 2 ⁇ m or less.
  • the average thickness of the conductive layer is obtained by a method according to the above-described method for calculating the average thickness of the substrate.
  • the laminate may include multiple conductive layers.
  • the laminate may include a conductive layer on each side of the substrate.
  • the laminate may include the first conductive layer, the substrate, and the second conductive layer in this order.
  • Examples of methods for forming the conductive layer include a method of sintering a coating film formed by applying a dispersion liquid containing fine metal particles, sputtering, and vapor deposition.
  • X B1 and X B2 are preferably -O-.
  • L is preferably a divalent group consisting only of carbon atoms and hydrogen atoms, ie, a divalent unsubstituted hydrocarbon group.
  • L is preferably an unsubstituted alkylene group or an unsubstituted arylene group, more preferably an unsubstituted alkylene group.
  • the unsubstituted alkylene group may be an unsubstituted linear alkylene group.
  • the unsubstituted alkylene group may be an unsubstituted branched alkylene group.
  • the unsubstituted alkylene group may be an unsubstituted cyclic alkylene group.
  • the number of carbon atoms in the alkyl group represented by R 1 B1 is preferably 1 to 3, more preferably 1 or 2.
  • the number of carbon atoms in the alkyl group represented by R 2 B2 is preferably 1 to 3, more preferably 1 or 2.
  • R B1 and R B2 are each independently preferably a hydrogen atom or a methyl group.
  • Examples of the monomer forming the structural unit represented by Formula B1 include a monomer represented by Formula B2 below and a monomer represented by Formula B3 below.
  • a monomer represented by formula B2 or formula B3 below forms a structural unit represented by formula B1 through polymerization and an elimination reaction using a basic compound.
  • An elimination reaction using a basic compound forms an ethylenically unsaturated group in a structural unit derived from a monomer represented by the following formula B2 or the following formula B3.
  • R B1 , X B1 , X B2 and L in formulas B2 and B3 are synonymous with R B1 , X B1 , X B2 and L in formula B1, respectively.
  • R B4 and R B5 in formulas B2 and B3 are synonymous with R B2 in formula B1.
  • a B1 and A B2 each independently represent a halogen atom.
  • a B1 and A B2 are each independently preferably a chlorine atom, a bromine atom or an iodine atom
  • Examples of basic compounds used in the elimination reaction include inorganic base compounds and organic base compounds.
  • Inorganic base compounds include, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, potassium carbonate and potassium bicarbonate.
  • Organic base compounds include, for example, metal alkoxides (eg, sodium methoxide, sodium ethoxide and potassium tert-butoxide), triethylamine, pyridine and diazabicycloundecene (DBU).
  • the resin (A) may contain one or more structural units represented by Formula B1.
  • the content of the structural unit represented by formula B1 is preferably 15% by mass to 80% by mass, more preferably 20% by mass to 70% by mass, relative to the total mass of the resin (A). , more preferably 25% by mass to 60% by mass
  • alkali-soluble groups include acid groups.
  • Acid groups include, for example, carboxy groups, sulfo groups, phosphoric acid groups and phosphonic acid groups.
  • the acid group is preferably a carboxy group.
  • the constituent unit having an alkali-soluble group is preferably a constituent unit derived from a monomer having a carboxy group.
  • monomers having a carboxy group include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid and 4-vinylbenzoic acid.
  • the structural unit derived from the monomer having a carboxy group is preferably a structural unit derived from acrylic acid or a structural unit derived from methacrylic acid.
  • Rb represents a hydrogen atom, a methyl group, --CH 2 OH or --CF 3 .
  • Rb is preferably a hydrogen atom or a methyl group.
  • the resin (A) may contain one or more structural units having an alkali-soluble group.
  • the resin (A) may further contain other structural units in addition to the structural unit represented by Formula B1 and the structural unit having an alkali-soluble group.
  • monomers having an aromatic hydrocarbon group examples include monomers having an aralkyl group, styrene and polymerizable styrene derivatives (e.g., methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinyl benzoic acid, styrene dimers and styrene trimers).
  • a monomer having an aralkyl group or styrene is preferred, and styrene is more preferred.
  • Examples of monomers having a phenylalkyl group include phenylethyl (meth)acrylate.
  • the content of structural units derived from benzyl (meth)acrylate is from 10% by mass to the total mass of the resin (A). It is preferably 80% by mass, more preferably 20% to 60% by mass, even more preferably 25% to 55% by mass.
  • the content of structural units derived from a monomer having an aromatic hydrocarbon group is preferably 10% by mass or more, more preferably 20% by mass or more, relative to the total mass of the resin (A). It is preferably 25% by mass or more, and more preferably 25% by mass or more.
  • the content of structural units derived from a monomer having an aromatic hydrocarbon group is preferably 80% by mass or less, more preferably 60% by mass or less, relative to the total mass of the resin (A). It is preferably 55% by mass or less, and more preferably 55% by mass or less.
  • the mass average content of structural units derived from the monomer having an aromatic hydrocarbon group is preferably within the above range. .
  • the resin (A) may further contain a structural unit derived from a monomer having no acid group and having a polymerizable group.
  • the polymerizable group may be selected from the polymerizable groups of the polymerizable compounds described below.
  • Examples of monomers having no acid group and having a polymerizable group include (meth)acrylate compounds.
  • (Meth)acrylate compounds include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate and 2-ethylhexyl (meth)acrylate.
  • Examples of monomers having no acid group and having a polymerizable group include ester compounds of vinyl alcohol.
  • Vinyl alcohol ester compounds include, for example, vinyl acetate.
  • Examples of the monomer having a group having a branched structure include isopropyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, and (meth)acrylate. Isoamyl acrylate, tert-amyl (meth)acrylate, sec-amyl (meth)acrylate, 2-octyl (meth)acrylate, 3-octyl (meth)acrylate and tert-octyl (meth)acrylate. be done.
  • Isopropyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl methacrylate is preferred, and isopropyl methacrylate or tert-butyl methacrylate is more preferred.
  • Cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-adamantyl (meth)acrylate, fenchyl (meth)acrylate , 1-menthyl (meth)acrylate or tricyclodecane (meth)acrylate is preferable, cyclohexyl (meth)acrylate, (nor)bornyl (meth)acrylate, isobornyl (meth)acrylate, (meth)acrylic acid -2-adamantyl or tricyclodecane (meth)acrylate is more preferred.
  • 2,4,5-triarylimidazole dimer examples include, for example, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di (Methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer and 2-( p-Methoxyphenyl)-4,5-diphenylimidazole dimer.
  • photocationic polymerization initiators examples include ionic photocationic polymerization initiators and nonionic photocationic polymerization initiators.
  • Ionic photocationic polymerization initiators include, for example, onium salt compounds such as diaryliodonium salts and triarylsulfonium salts.
  • Examples of ionic photocationic polymerization initiators include quaternary ammonium salts.
  • Examples of the ionic photocationic polymerization initiator include ionic photocationic polymerization initiators described in paragraphs [0114] to [0133] of JP-A-2014-085643.
  • the photosensitive composition layer may contain one or more photopolymerization initiators.
  • the content of the photopolymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, relative to the total mass of the photosensitive composition layer.
  • the content of the photopolymerization initiator is preferably 20% by mass or less, more preferably 15% by mass or less, and 10% by mass or less with respect to the total mass of the photosensitive composition layer. More preferred.
  • the ratio of the content of the hexaarylbiimidazole compound to the content of the photopolymerization initiator is preferably 80% by mass to 100% by mass, more preferably 90% by mass to 100% by mass, even more preferably 95% by mass to 100% by mass, and 100% by mass. Especially preferred.
  • the polymerizable compound preferably contains a radically polymerizable compound having at least two polymerizable groups. Furthermore, the polymerizable compound is preferably a radically polymerizable compound having at least two polymerizable groups.
  • the polymerizable group of the radical polymerizable compound is preferably an acryloyl group or a methacryloyl group.
  • n1+n2+n3+n4 is preferably 2-20, more preferably 2-16, and even more preferably 4-12.
  • n2+n4 is preferably 0 to 10, more preferably 0 to 4, even more preferably 0 to 2, and particularly preferably 0.
  • polymerizable compounds having a bisphenol structure examples include compounds described in paragraphs [0072] to [0080] of JP-A-2016-224162. The contents of the above documents are incorporated herein by reference.
  • the polymerizable compound having a bisphenol structure is preferably 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.
  • 1,9-nonanediol diacrylate e.g., A-NOD-N, Shin-Nakamura Chemical Co., Ltd.
  • 1,6-hexanediol diacrylate e.g., A-HD-N, Shin-Nakamura Chemical Co., Ltd.
  • ethylene glycol dimethacrylate 1,10-decanediol diacrylate and neopentyl glycol di(meth)acrylate.
  • polyalkylene glycol di(meth)acrylates examples include polyethylene glycol di(meth)acrylate (e.g., NK Ester 4G, Shin-Nakamura Chemical Co., Ltd.), dipropylene glycol diacrylate, tripropylene glycol diacrylate and polypropylene glycol diacrylate. (Meth)acrylates (eg, Aronix M-270, Toagosei Co., Ltd.).
  • Urethane di(meth)acrylates include, for example, propylene oxide-modified urethane di(meth)acrylates, ethylene oxide-modified urethane di(meth)acrylates, and propylene oxide-modified urethane di(meth)acrylates.
  • Examples of commercially available urethane di(meth)acrylates include 8UX-015A (Taisei Fine Chemical Co., Ltd.), UA-32P (Shin-Nakamura Chemical Co., Ltd.) and UA-1100H (Shin-Nakamura Chemical Co., Ltd.).
  • the polymerizable compound may contain a compound having one polymerizable group.
  • compounds having one polymerizable group include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, 2-(meth) acryloyloxyethyl succinate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylates and phenoxyethyl (meth)acrylates.
  • the content of the compound having one polymerizable group is preferably 0% by mass to 10% by mass, more preferably 0% by mass to 5% by mass, based on the content of the polymerizable compound. More preferably, it is from 3% by mass to 3% by mass.
  • the polymerizable compound may contain compounds having three or more polymerizable groups.
  • compounds having three or more polymerizable groups include dipentaerythritol (tri/tetra/penta/hexa) (meth) acrylate, pentaerythritol (tri/tetra) (meth) acrylate, trimethylolpropane tri(meth) ) acrylate, ditrimethylolpropane tetra(meth)acrylate, trimethylolethane tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate and alkylene oxide modified products thereof.
  • (tri/tetra/penta/hexa)(meth)acrylates includes tri(meth)acrylates, tetra(meth)acrylates, penta(meth)acrylates and hexa(meth)acrylates.
  • (tri/tetra)(meth)acrylates” includes tri(meth)acrylates and tetra(meth)acrylates.
  • alkylene oxide-modified compounds having three or more polymerizable groups include, for example, caprolactone-modified (meth)acrylate compounds (e.g., KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and Shin-Nakamura Chemical Industry A-9300-1CL manufactured by Co., Ltd.), alkylene oxide-modified (meth) acrylate compounds (for example, KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E manufactured by Shin-Nakamura Chemical Co., Ltd., Shin-Nakamura Chemical Industry A-9300 manufactured by Co., Ltd.
  • caprolactone-modified (meth)acrylate compounds e.g., KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and Shin-Nakamura Chemical Industry A-9300-1CL manufactured by Co., Ltd.
  • alkylene oxide-modified (meth) acrylate compounds for
  • EBECRYL registered trademark 135 manufactured by Daicel Allnex Co., Ltd.
  • ethoxylated glycerin triacrylate for example, A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.
  • Aronix registered trademark
  • TO-2349 Toagosei Co., Ltd.
  • Aronix M-520 Toagosei Co., Ltd.
  • Aronix M-510 Toagosei Co., Ltd.
  • SR454 Tomoe Kogyo Co., Ltd.
  • the polymerizable compound may be a polymerizable compound having an acid group.
  • acid groups include carboxy groups.
  • the acid groups may form acid anhydride groups.
  • examples of the polymerizable compound having an acid group include Aronix (registered trademark) TO-2349 (Toagosei Co., Ltd.), Aronix (registered trademark) M-520 (Toagosei Co., Ltd.) and Aronix (registered trademark) M-510. (Toagosei Co., Ltd.).
  • Aronix registered trademark
  • TO-2349 Toagosei Co., Ltd.
  • Aronix registered trademark M-520
  • Aronix registered trademark
  • M-510 Toagosei Co., Ltd.
  • As the polymerizable compound having an acid group for example, paragraphs [0025] to [0030] of JP-A-2004-239942 Polymerizable compounds described in.
  • the molecular weight of the polymerizable compound is preferably from 200 to 3,000, more preferably from 280 to 2,200, even more preferably from 300 to 2,200.
  • the photosensitive composition layer may contain one or more polymerizable compounds.
  • the photosensitive composition layer may contain three or more polymerizable compounds.
  • at least one polymerizable compound is preferably a polymerizable compound having a bisphenol structure.
  • the content of the polymerizable compound is preferably 10% by mass to 70% by mass, more preferably 15% by mass to 70% by mass, and 20% by mass with respect to the total mass of the photosensitive composition layer. More preferably, it is up to 70% by mass.
  • the aspect of "the maximum absorption wavelength changes with an acid, a base or a radical” is an aspect in which a dye in a colored state is decolored by an acid, a base or a radical, and a dye in a decolored state is colored by an acid, a base or a radical.
  • Embodiments and embodiments in which a dye in a coloring state changes to a coloring state of another hue are included.
  • the dye N may be a compound that changes from a decolored state to develop color upon exposure or a compound that changes from a colored state to decolor upon exposure.
  • the dye N may be a dye that changes its coloring or decoloring state by the action of an acid, a base or a radical generated in the photosensitive composition layer upon exposure.
  • the dye N may be a dye that changes its coloring or decoloring state when the state (for example, pH) of the photosensitive composition layer is changed by an acid, a base, or a radical.
  • the dye N may be a dye that changes its coloring or decoloring state by the action of an acid, a base, or a radical without exposure.
  • the dye N is preferably a dye whose maximum absorption wavelength is changed by radicals, and a dye that develops color by radicals. is more preferable.
  • the maximum absorption wavelength in the wavelength range of 400 nm to 780 nm when the dye N develops is preferably 550 nm or more, more preferably 550 nm to 700 nm, and 550 nm. ⁇ 650 nm is more preferred.
  • the number of maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm during color development of the dye N may be one or two or more.
  • the maximum absorption wavelength with the highest absorbance among the two or more maximum absorption wavelengths is 450 nm or more.
  • the content of the dye N is 0.1% by mass with respect to the total mass of the photosensitive composition layer. It is preferably at least 0.1% by mass to 10% by mass, more preferably 0.1% by mass to 5% by mass, and 0.1% by mass to 1% by mass. is particularly preferred.
  • the absorbance of each solution at 25° C. is measured in an air atmosphere to create a calibration curve.
  • the absorbance of the solution in which all of the dye N is developed is measured in the same manner as described above except that instead of the dye N, the photosensitive composition layer (3 g) is dissolved in methyl ethyl ketone.
  • the content of dye N contained in the photosensitive composition layer is calculated based on the calibration curve from the absorbance of the solution containing the photosensitive composition layer.
  • Photosensitive composition layer (3 g) is synonymous with the total solid content (3 g) of the photosensitive composition.
  • a thermally crosslinkable compound having an ethylenically unsaturated group is treated as a thermally crosslinkable compound rather than a polymerizable compound.
  • thermally crosslinkable compounds examples include methylol compounds and blocked isocyanate compounds.
  • the thermally crosslinkable compound may be a blocked isocyanate compound.
  • a "blocked isocyanate compound” means a compound having a structure in which the isocyanate group of isocyanate is protected with a blocking agent.
  • the dissociation temperature of the blocked isocyanate compound may be 100°C to 160°C.
  • the dissociation temperature of the blocked isocyanate compound may be 130°C to 150°C.
  • the dissociation temperature of the blocked isocyanate compound is measured by DSC (Differential scanning calorimetry) analysis using a differential scanning calorimeter (for example, DSC6200, Seiko Instruments Inc.). In the DSC analysis, the temperature of the endothermic peak accompanying the deprotection reaction of the blocked isocyanate compound is employed as the dissociation temperature of the blocked isocyanate compound.
  • the blocked isocyanate compound may have a polymerizable group.
  • the polymerizable group include the polymerizable groups in the polymerizable compound described above.
  • the content of the polymerization inhibitor is preferably 0.001% by mass to 5.0% by mass, and is 0.01% by mass to 3.0% by mass, based on the total mass of the photosensitive composition layer. is more preferable, and 0.02% by mass to 2.0% by mass is even more preferable.
  • the content of the radical polymerization inhibitor is preferably 0.005% by mass to 5.0% by mass, and 0.01% by mass to 3.0% by mass, based on the total mass of the polymerizable compound. is more preferable, and 0.01% by mass to 1.0% by mass is even more preferable.
  • the fluorosurfactant may be a block polymer.
  • silicone-based surfactants examples include DOWSIL 8032 ADDITIVE manufactured by Dow Corning Toray Co., Ltd., Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 may be mentioned.
  • silicone surfactants include X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, KF-945 and KF manufactured by Shin-Etsu Chemical Co., Ltd. -640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001 and KF-6002.
  • Purine bases include, for example, adenine.
  • Other components include, for example, metal oxide particles, chain transfer agents, antioxidants, dispersants, acid multipliers, development accelerators, conductive fibers, ultraviolet absorbers, thickeners, cross-linking agents, and organic precipitates. Inhibitors and inorganic suspending agents are included.
  • a method for adjusting the content of the organic solvent includes a method for adjusting the drying conditions in the process of forming the photosensitive composition layer.
  • Method for forming photosensitive composition layer examples include a method using a photosensitive composition.
  • Providing the photosensitive composition layer over the conductive layer may comprise forming the photosensitive composition layer by applying the photosensitive composition over the conductive layer.
  • the photosensitive composition applied on the conductive layer may be dried as necessary. Drying methods include, for example, drying by heating and drying under reduced pressure.
  • the drying temperature is preferably 60° C. or higher, more preferably 70° C. or higher, and even more preferably 80° C. or higher.
  • the drying temperature is preferably 130° C. or lower, more preferably 120° C. or lower.
  • the drying temperature may be varied continuously.
  • the drying time is preferably 20 seconds or longer, more preferably 40 seconds or longer, and even more preferably 60 seconds or longer.
  • the drying time is preferably 600 seconds or less, more preferably 450 seconds or less, and even more preferably 300 seconds or less.
  • a method of providing a photosensitive composition layer on the conductive layer includes, for example, a method of using a transfer film containing a photosensitive composition layer.
  • Providing a photosensitive composition layer on the conductive layer involves preparing a transfer film containing a temporary support and a photosensitive composition layer in this order, and attaching the photosensitive composition layer and the conductive layer of the transfer film. It preferably includes combining and.
  • a laminate is formed which includes the substrate, the conductive layer, the photosensitive composition layer and the temporary support in this order.
  • transfer film> The detailed aspects of the transfer film are described in the section " ⁇ transfer film>" below.
  • a preferred embodiment of the transfer film used in the method for producing a laminate having a conductor pattern may be selected from the preferred embodiments of the transfer film described in the section " ⁇ Transfer Film>” below.
  • light sources include lasers, light-emitting diodes (LEDs), ultrahigh-pressure mercury lamps, high-pressure mercury lamps, and metal halide lamps.
  • the light source is preferably a light source that emits light having at least one wavelength selected from the group consisting of 365 nm and 405 nm.
  • the dominant wavelength of the light with which the photosensitive composition layer is irradiated is preferably 365 nm.
  • dominant wavelength is meant the wavelength with the highest intensity.
  • the exposure dose is preferably 5 mJ/cm 2 to 200 mJ/cm 2 and more preferably 10 mJ/cm 2 to 200 mJ/cm 2 .
  • the development step is to develop the photosensitive composition layer to form a resist pattern. According to the development step, the exposed portion or the non-exposed portion of the photosensitive composition layer is removed to form a resist pattern.
  • the resist pattern may be a cured product of a photosensitive composition layer.
  • the development process is preferably carried out using a developer.
  • Preferred developers include, for example, alkaline developers.
  • the alkaline developer is preferably an alkaline aqueous solution containing an alkali metal salt or an ammonium salt.
  • the alkali metal salt is preferably a compound that dissolves in water and exhibits alkalinity.
  • Alkali metal salts include, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate and potassium hydrogen carbonate.
  • Ammonium salts include, for example, tetramethylammonium hydroxide and tetrabutylammonium hydroxide
  • the developer may contain one or more alkali metal salts.
  • the developer may contain one or more ammonium salts.
  • the developer may contain both alkali metal salts and ammonium salts.
  • the content of water is preferably 50% by mass or more and less than 100% by mass, more preferably 90% by mass or more and less than 100% by mass, relative to the total mass of the developer.
  • a preferable developing method includes, for example, the developing method described in paragraph [0195] of WO 2015/093271.
  • the liquid remaining after the developing process or rinsing process may be removed by drying process.
  • the position and size of the resist pattern are not limited.
  • the line width of the resist pattern is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, even more preferably 10 ⁇ m or less, and particularly preferably 5 ⁇ m or less.
  • the line width of the resist pattern may be 0.5 ⁇ m or more.
  • the plating process is to plate the conductive layer in the area where the resist pattern is not arranged.
  • the “conductive layer in the region where the resist pattern is not arranged” means the conductive layer that is not covered with the resist pattern in a plan view in which the conductive layer is observed along the thickness direction of the laminate.
  • a layer is formed by plating on the conductive layer in the region where the resist pattern is not arranged.
  • a layer formed by plating may be referred to as a "plated layer”.
  • metals can be used as components of the plating layer.
  • Metals include, for example, copper, chromium, lead, nickel, gold, silver, tin and zinc.
  • the metal contained in the plating layer may be an alloy. From the viewpoint of excellent conductivity of the conductive pattern, the plating layer preferably contains copper or a copper alloy.
  • the plated layer preferably contains copper as a main component.
  • the average thickness of the plating layer is preferably 0.1 ⁇ m or more, more preferably 1 ⁇ m or more.
  • the average thickness of the plating layer is preferably 20 ⁇ m or less.
  • the average thickness of the plated layer is obtained by a method according to the above-described method for calculating the average thickness of the substrate.
  • Step of removing resist pattern The step of removing the resist pattern is to remove the resist pattern.
  • a method of removing the resist pattern includes, for example, a method of removing the resist pattern by chemical treatment.
  • a method of removing the resist pattern using a stripper is preferred.
  • the resist pattern may be removed by a spray method, a shower method, or a puddle method using a remover.
  • the temperature of the stripping solution is preferably 23°C to 80°C, more preferably 30°C to 80°C, and even more preferably 50°C to 80°C.
  • a specific example of the method of removing the resist pattern includes a method of immersing the laminate having the resist pattern in a stripper at 50°C to 80°C for 1 minute to 30 minutes.
  • the stripping solution preferably has a property of not dissolving the metal layer.
  • the stripping solution remaining after the resist pattern removal process may be removed by a rinse process.
  • solvents used for rinsing include water.
  • the liquid remaining after the resist pattern removal step or rinse treatment may be removed by drying treatment.
  • Step of removing conductive layer is to remove the conductive layer exposed by removing the resist pattern to form a conductive pattern. According to the step of removing the conductive layer, the conductive layer that is not protected by the plated layer formed by plating is removed, and the remaining conductive layer and the plated layer form the conductive pattern.
  • a method of removing the conductive layer includes, for example, a method of removing the conductive layer using an etchant.
  • a known etchant may be used in the step of removing the conductive layer.
  • the etchant include ferric chloride solution, cupric chloride solution, ammonia alkali solution, sulfuric acid-hydrogen peroxide mixed solution and phosphoric acid-hydrogen peroxide mixed solution.
  • the etchant remaining after the step of removing the conductive layer may be removed by rinsing.
  • solvents used for rinsing include water.
  • the liquid remaining after the step of removing the conductive layer or the rinsing process may be removed by a drying process.
  • the line width of the conductor pattern is preferably 8 ⁇ m or less, more preferably 6 ⁇ m or less.
  • the line width of the conductor pattern may be 0.5 ⁇ m or more.
  • the method of manufacturing a laminate having a conductor pattern may further include exposing the resist pattern between the developing step and the plating step.
  • the method for manufacturing a laminate having a conductor pattern may further include exposing the resist pattern and heating the resist pattern between the developing step and the plating step. Heating of the resist pattern is preferably performed after exposure of the resist pattern.
  • the exposure dose is preferably 100 mJ/cm 2 to 5000 mJ/cm 2 and more preferably 200 mJ/cm 2 to 3000 mJ/cm 2 .
  • the heating temperature is preferably 80°C to 250°C, more preferably 90°C to 160°C.
  • the heating time is preferably 1 to 180 minutes, more preferably 10 to 60 minutes.
  • the method for manufacturing a laminate having a conductor pattern may further include forming a protective layer on the plating layer between the plating process and the resist pattern removing process.
  • the component of the protective layer is preferably a component that is resistant to stripping solutions and etching solutions.
  • Components of the protective layer include, for example, metals (eg, nickel, chromium, tin, zinc, magnesium, gold, silver and alloys thereof) and resins. Nickel or chromium are preferred.
  • Examples of methods for forming the protective layer include electroless plating and electroplating. Electroplating is preferred.
  • the lower limit of the thickness of the protective layer is preferably 0.3 ⁇ m, more preferably 0.5 ⁇ m.
  • the upper limit of the thickness of the protective layer is preferably 3.0 ⁇ m, more preferably 2.0 ⁇ m.
  • the method of manufacturing a laminate having a conductor pattern may further include performing a treatment for reducing the visible light reflectance of at least a portion of the conductor pattern.
  • oxidation treatment An example of a treatment that reduces the visible light reflectance is oxidation treatment.
  • the visible light reflectance of the conductor pattern can be reduced by oxidizing the copper to form copper oxide and blackening the conductor pattern.
  • the treatment for reducing the visible light reflectance is, for example, paragraphs [0017] to [0025] of JP-A-2014-150118 and paragraphs [0041], [0042], [0048] of JP-A-2013-206315 and [0058].
  • the contents of these documents are incorporated herein by reference.
  • a method for manufacturing a laminate having a conductor pattern includes forming an insulating film on the surface of the laminate having the conductor pattern, and forming a new conductive layer (for example, a conductor pattern) on the surface of the insulating film. It may further contain: For example, methods such as those described above can form a first conductor pattern and a second conductor pattern insulated from the first conductor pattern.
  • Examples of methods for forming the insulating film include methods for forming a known permanent film.
  • a method of forming an insulating film a method of forming an insulating film having a desired pattern by photolithography using a photosensitive composition having an insulating property can be mentioned.
  • a method of forming a new conductive layer on the surface of the insulating film includes, for example, a method of forming a new conductive layer having a desired pattern by photolithography using a conductive photosensitive composition.
  • Laminates having conductor patterns include, for example, production process films for interposer rewiring layers, semiconductor packages, and printed circuit boards.
  • Laminates with conductor patterns may be used as components in various devices.
  • Devices including laminates having conductor patterns include, for example, input devices.
  • the input device is preferably a touch panel, more preferably a capacitive touch panel.
  • the input device may be applied to display devices such as an organic EL display device and a liquid crystal display device.
  • a photosensitive composition according to one embodiment of the present disclosure includes a resin (A), that is, a resin including a structural unit represented by formula B1 and a structural unit having an alkali-soluble group. According to the above embodiments, a photosensitive composition is provided that forms a resist pattern with excellent resolution.
  • the aspect of the resin (A) in the photosensitive composition is the same as the aspect of the resin (A) described in the above section " ⁇ Method for producing laminate having conductor pattern>".
  • Preferred components of the photosensitive composition are the same as the preferred components of the photosensitive composition layer described in the above section " ⁇ Method for producing laminate having conductor pattern>".
  • the “total mass of the photosensitive composition layer” is replaced with "photosensitive "total mass of the solid content of the photosensitive composition” and applied to aspects relating to the content of components other than the solvent in the photosensitive composition.
  • the photosensitive composition may further contain a solvent.
  • the solvent may be selected from solvents capable of dissolving or dispersing components contained in the photosensitive composition layer.
  • solvents examples include alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (e.g. methanol and ethanol), ketone solvents (e.g. acetone and methyl ethyl ketone), aromatic hydrocarbon solvents (e.g. toluene), aprotic polar solvents (eg N,N-dimethylformamide), cyclic ether solvents (eg tetrahydrofuran), ester solvents (eg n-propyl acetate), amide solvents and lactone solvents.
  • alcohol solvents e.g. methanol and ethanol
  • ketone solvents e.g. acetone and methyl ethyl ketone
  • aromatic hydrocarbon solvents e.g. toluene
  • aprotic polar solvents eg N,N-dimethylformamide
  • cyclic ether solvents eg tetrahydrofuran
  • the solvent preferably contains at least one solvent selected from the group consisting of alkylene glycol ether solvents and alkylene glycol ether acetate solvents.
  • the solvent contains at least one solvent selected from the group consisting of alkylene glycol ether solvents and alkylene glycol ether acetate solvents, and at least one solvent selected from the group consisting of ketone solvents and cyclic ether solvents. is more preferable. More preferably, the solvent contains at least one solvent selected from the group consisting of alkylene glycol ether solvents and alkylene glycol ether acetate solvents, and a ketone solvent.
  • Alkylene glycol ether solvents include, for example, ethylene glycol monoalkyl ether, ethylene glycol dialkyl ether, propylene glycol monoalkyl ether (e.g., propylene glycol monomethyl ether), propylene glycol dialkyl ether, diethylene glycol dialkyl ether, dipropylene glycol monoalkyl ether and Dipropylene glycol dialkyl ethers may be mentioned.
  • Alkylene glycol ether acetate solvents include, for example, ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate and dipropylene glycol monoalkyl ether acetate.
  • Examples of the solvent include the solvents described in paragraphs [0092] to [0094] of International Publication No. 2018/179640 and the solvents described in paragraph [0014] of JP-A-2018-177889. The contents of these documents are incorporated herein by reference.
  • the photosensitive composition may contain one or more solvents.
  • the content of the solvent is preferably 50 parts by mass to 1900 parts by mass, more preferably 100 parts by mass to 1200 parts by mass, with respect to 100 parts by mass of the total solid content of the photosensitive composition. parts to 900 parts by mass is more preferable.
  • a transfer film according to an embodiment of the present disclosure includes a temporary support and a photosensitive composition layer in this order.
  • the photosensitive composition layer of the transfer film contains a resin (A), that is, a resin containing a structural unit represented by formula B1 and a structural unit having an alkali-soluble group. According to the above embodiments, a transfer film is provided that forms a resist pattern with excellent resolution.
  • FIG. 1 is a schematic cross-sectional view of a transfer film according to one embodiment.
  • the transfer film 10 shown in FIG. 1 includes a temporary support 11, an intermediate layer 13, a photosensitive composition layer 15, and a protective film 19 in this order.
  • the intermediate layer 13 and the photosensitive composition layer 15 constitute a transfer layer 17 .
  • the transfer layer 17 of the transfer film 10 is arranged on the substrate by laminating the transfer film 10 and the substrate.
  • the structure of the transfer film 10 may be a structure without the protective film 19 .
  • the temporary support supports the photosensitive composition layer on the transfer film.
  • the temporary support is preferably a film, more preferably a resin film.
  • Preferred temporary supports include, for example, films that are flexible and do not undergo significant deformation, shrinkage, or elongation under pressure or under pressure and heat.
  • a preferred temporary support includes, for example, a film free from deformation such as wrinkles and flaws.
  • films examples include polyethylene terephthalate film (eg, biaxially stretched polyethylene terephthalate film), polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film and polycarbonate film.
  • the film is a polyethylene terephthalate film.
  • the temporary support preferably has transparency.
  • a temporary support having transparency allows exposure of the photosensitive composition layer through the temporary support.
  • the transmittance of the temporary support at a wavelength of 365 nm is preferably 60% or more, more preferably 70% or more.
  • the transmittance of the temporary support at a wavelength of 365 nm is preferably less than 100%.
  • the haze of the temporary support is small.
  • the haze of the temporary support is preferably 2% or less, more preferably 0.5% or less, and even more preferably 0.1% or less.
  • the haze of the temporary support may be 0% or more.
  • the number of fine particles, foreign matters and defects in the temporary support is small.
  • the number of fine particles (for example, fine particles having a diameter of 1 ⁇ m), foreign matter and defects in the temporary support is preferably 50/10 mm 2 or less, more preferably 10/10 mm 2 or less, and 3 It is more preferably less than 1 piece/10 mm 2 , and particularly preferably less than 1 piece/10 mm 2 .
  • the number of fine particles, foreign matter and defects in the temporary support may be 0/10 mm 2 or more.
  • the temporary support may have a single-layer structure and a multilayer structure.
  • the average thickness of the temporary support is preferably 5 ⁇ m to 200 ⁇ m.
  • the average thickness of the temporary support is preferably 5 ⁇ m to 150 ⁇ m, more preferably 5 ⁇ m to 50 ⁇ m, even more preferably 5 ⁇ m to 25 ⁇ m, from the viewpoints of ease of handling and versatility.
  • the average thickness of the temporary support is obtained by a method according to the above-described method for calculating the average thickness of the substrate.
  • a layer containing fine particles may be arranged on one or both sides of the temporary support.
  • the fine particles contained in the lubricant layer preferably have a diameter of 0.05 ⁇ m to 0.8 ⁇ m.
  • the average thickness of the lubricant layer is preferably 0.05 ⁇ m to 1.0 ⁇ m.
  • the average thickness of the lubricant layer is obtained by a method according to the above-described method for calculating the average thickness of the substrate.
  • the surface of the temporary support in contact with the photosensitive composition layer may be modified.
  • Modification treatments include, for example, ultraviolet irradiation, corona discharge, and plasma treatment.
  • the exposure amount in ultraviolet irradiation is preferably 10 mJ/cm 2 to 2000 mJ/cm 2 , more preferably 50 mJ/cm 2 to 1000 mJ/cm 2 .
  • a light source for ultraviolet irradiation includes, for example, a light source that emits light in the wavelength range of 150 nm to 450 nm.
  • light sources include low pressure mercury lamps, high pressure mercury lamps, ultra high pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, electrodeless discharge lamps and light emitting diodes (LEDs).
  • Examples of the temporary support include a biaxially stretched polyethylene terephthalate film with a thickness of 16 ⁇ m, a biaxially stretched polyethylene terephthalate film with a thickness of 12 ⁇ m, and a biaxially stretched polyethylene terephthalate film with a thickness of 9 ⁇ m.
  • Examples of commercially available temporary supports include Lumirror 16KS40 and Lumirror 16FB40 manufactured by Toray Industries, Inc.
  • Commercial products of the temporary support include, for example, Cosmoshine A4100, Cosmoshine A4300 and Cosmoshine A8300 manufactured by Toyobo Co., Ltd.
  • the aspect of the photosensitive composition layer in the transfer film is the same as the aspect of the photosensitive composition layer described in the above section " ⁇ Method for producing laminate having conductor pattern>".
  • Examples of the method for forming the photosensitive composition layer include a method using a photosensitive composition.
  • a photosensitive composition layer is formed by applying a photosensitive composition onto a temporary support.
  • the aspect of the photosensitive composition and the method of applying the photosensitive composition are described in the above section " ⁇ Method for producing a laminate having a conductor pattern>" and the above " ⁇ Photosensitive composition>".
  • the transfer film preferably further comprises an intermediate layer between the temporary support and the photosensitive composition layer.
  • An example of the intermediate layer is a water-soluble resin layer.
  • Examples of the intermediate layer include an oxygen-blocking layer having an oxygen-blocking function described as a "separation layer" in JP-A-5-072724.
  • a preferred intermediate layer includes, for example, an oxygen blocking layer.
  • the oxygen barrier layer can reduce the time load of the exposing machine by improving the sensitivity during exposure. As a result, productivity is improved.
  • the oxygen-blocking layer is preferably an oxygen-blocking layer that exhibits low oxygen permeability and is dispersed or dissolved in water or an alkaline aqueous solution (for example, a 1% by weight sodium carbonate aqueous solution at 22° C.).
  • the intermediate layer may contain a water-soluble resin.
  • water-soluble resins include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, polyether-based resins, gelatin, and polyamide-based resins.
  • Cellulose-based resins include, for example, water-soluble cellulose derivatives.
  • Water-soluble cellulose derivatives include, for example, hydroxyethylcellulose, hydroxypropylmethylcellulose, hydroxypropylcellulose, carboxymethylcellulose, methylcellulose and ethylcellulose.
  • Polyether-based resins include, for example, polyethylene glycol, polypropylene glycol, and alkylene oxide side adducts thereof.
  • Examples of polyether-based resins include vinyl ether-based resins.
  • polyamide-based resins examples include acrylamide-based resins, vinylamide-based resins, and allylamide-based resins.
  • water-soluble resins examples include copolymers of (meth)acrylic acid and vinyl compounds.
  • the copolymer of (meth)acrylic acid and the vinyl compound is preferably a copolymer of (meth)acrylic acid and allyl (meth)acrylate, and is a copolymer of methacrylic acid and allyl methacrylate. is more preferable.
  • the ratio of (meth)acrylic acid mol%/vinyl compound mol% is preferably 90/10 to 20/80, It is more preferably 80/20 to 30/70.
  • the weight average molecular weight of the water-soluble resin is preferably 5,000 or more, more preferably 7,000 or more, and even more preferably 10,000 or more.
  • the weight average molecular weight of the water-soluble resin is preferably 200,000 or less, more preferably 100,000 or less, even more preferably 50,000 or less.
  • the degree of dispersion of the water-soluble resin is preferably 1-10, more preferably 1-5, even more preferably 1-3.
  • the intermediate layer may contain one or more water-soluble resins.
  • the content of the water-soluble resin is preferably 50% by mass or more, more preferably 70% by mass or more, relative to the total mass of the intermediate layer.
  • the content of the water-soluble resin is preferably 100% by mass or less, more preferably 99.99% by mass or less, and preferably 99.9% by mass or less with respect to the total mass of the intermediate layer. More preferred.
  • the intermediate layer may contain other ingredients.
  • Other components are preferably polyhydric alcohols, alkylene oxide adducts of polyhydric alcohols, phenol derivatives or amide compounds, more preferably polyhydric alcohols, phenol derivatives or amide compounds.
  • polyhydric alcohols examples include glycerin, diglycerin and diethylene glycol.
  • the number of hydroxy groups in the polyhydric alcohols is preferably 2-10.
  • alkylene oxide adducts of polyhydric alcohols include compounds obtained by adding ethyleneoxy groups to polyhydric alcohols and compounds obtained by adding propyleneoxy groups to polyhydric alcohols.
  • the average number of alkyleneoxy groups to be added is preferably 1-100, preferably 2-50, more preferably 2-20.
  • phenol derivatives examples include bisphenol A and bisphenol S.
  • amide compounds include N-methylpyrrolidone.
  • the molecular weight of the other component is preferably less than 5,000, more preferably 4,000 or less, even more preferably 3,000 or less, and particularly preferably 2,000 or less, Most preferably, it is 1,500 or less.
  • the molecular weight of other components is preferably 60 or more.
  • the intermediate layer may contain one or more other components.
  • the content of other components is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and preferably 1% by mass or more, relative to the total mass of the intermediate layer. More preferred.
  • the content of other components is preferably less than 30% by mass, more preferably 10% by mass or less, and even more preferably 5% by mass or less, relative to the total mass of the intermediate layer.
  • the intermediate layer comprises water-soluble cellulose derivatives, polyhydric alcohols, alkylene oxide adducts of polyhydric alcohols, polyether resins, polyamide resins, polyvinylamide resins, polyallylamide resins, phenol derivatives and amide compounds. It preferably contains at least one compound selected from the group consisting of:
  • the intermediate layer may contain impurities.
  • Impurities include, for example, the impurities described in the above section “ ⁇ Method for producing laminate having conductor pattern>”.
  • the average thickness of the intermediate layer is preferably 3.0 ⁇ m or less, more preferably 2.0 ⁇ m or less.
  • the average thickness of the intermediate layer is preferably 0.3 ⁇ m or more, more preferably 1.0 ⁇ m or more.
  • the average thickness of the intermediate layer is obtained by a method according to the above-described method for calculating the average thickness of the substrate.
  • Examples of methods for forming the intermediate layer include a method using a composition for forming an intermediate layer.
  • the intermediate layer may be formed by applying an intermediate layer-forming composition onto the temporary support.
  • the components of the intermediate layer-forming composition are selected according to the target intermediate layer components.
  • the intermediate layer-forming composition may contain a solvent.
  • the solvent may be selected from solvents capable of dissolving or dispersing components contained in the intermediate layer.
  • the solvent is preferably at least one solvent selected from the group consisting of water and water-miscible organic solvents, more preferably a solvent containing water and a water-miscible organic solvent.
  • water-miscible organic solvents include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol and glycerin.
  • the water-miscible organic solvent is preferably an alcohol having 1 to 3 carbon atoms, more preferably methanol or ethanol.
  • the intermediate layer-forming composition may contain one or more solvents.
  • the content of the solvent is preferably 50 parts by mass to 2500 parts by mass, more preferably 50 parts by mass to 1900 parts by mass, based on 100 parts by mass of the total solid content of the composition for forming an intermediate layer. It is more preferably 100 parts by mass to 900 parts by mass.
  • Examples of methods for applying the intermediate layer forming composition include slit coating, spin coating, curtain coating and inkjet coating.
  • the applied intermediate layer forming composition may be dried as necessary.
  • the drying method is preferably heat drying or reduced pressure drying.
  • the drying temperature is preferably 80° C. or higher, more preferably 90° C. or higher, and even more preferably 100° C. or higher.
  • the drying temperature is preferably 130° C. or lower, more preferably 120° C. or lower.
  • the drying temperature may be varied continuously.
  • the drying time is preferably 20 seconds or longer, more preferably 40 seconds or longer, and even more preferably 60 seconds or longer.
  • the drying time is preferably 600 seconds or less, more preferably 450 seconds or less, and even more preferably 300 seconds or less.
  • the transfer film may further contain other layers.
  • Other layers include, for example, protective films.
  • protective films include resin films.
  • the resin film preferably has heat resistance and solvent resistance.
  • resin films include polyolefin films (eg polypropylene films and polyethylene films), polyester films (eg polyethylene terephthalate films), polycarbonate films and polystyrene films.
  • the protective film is preferably a polyolefin film, more preferably a polypropylene film or a polyethylene film.
  • the protective film may be a resin film having the same composition as the temporary support.
  • the average thickness of the protective film is preferably 1 ⁇ m to 100 ⁇ m, more preferably 5 ⁇ m to 50 ⁇ m, even more preferably 5 ⁇ m to 40 ⁇ m, and particularly preferably 15 ⁇ m to 30 ⁇ m. From the viewpoint of mechanical strength, the average thickness of the protective film is preferably 1 ⁇ m or more. From the viewpoint of relatively low cost, the average thickness of the protective film is preferably 100 ⁇ m or less.
  • the average thickness of the protective film is obtained by a method according to the above-described method for calculating the average thickness of the substrate.
  • the number of fish eyes with a diameter of 80 ⁇ m or more contained in the protective film is preferably 5/m 2 or less.
  • the number of fish eyes with a diameter of 80 ⁇ m or more contained in the protective film may be 0/m 2 or more.
  • "Fish eye” refers to foreign matter, undissolved matter, and oxidatively deteriorated materials taken into the film in the process of producing the film by methods such as heat melting, kneading, extrusion, biaxial stretching, and casting. Denotes a formed defect.
  • the number of particles having a diameter of 3 ⁇ m or more contained in the protective film is preferably 30 particles/mm 2 or less, more preferably 10 particles/mm 2 or less, and 5 particles/mm 2 or less. is more preferred. When the number of particles is within the above range, defects caused by the unevenness caused by the particles contained in the protective film being transferred to the photosensitive composition layer or the conductive layer are suppressed.
  • the number of particles having a diameter of 3 ⁇ m or more contained in the protective film may be 0/mm 2 or more.
  • the surface arithmetic mean roughness Ra of the protective film is preferably 0.01 ⁇ m or more, more preferably 0.02 ⁇ m or more, and even more preferably 0.03 ⁇ m or more.
  • the arithmetic mean roughness Ra of the surface of the protective film is preferably less than 0.50 ⁇ m, more preferably 0.40 ⁇ m or less, even more preferably 0.30 ⁇ m or less.
  • a method of introducing a protective film into a transfer film includes, for example, a method of bonding a protective film and a photosensitive composition layer together.
  • Apparatuses for bonding the protective film and the photosensitive composition layer include, for example, known laminators such as a vacuum laminator and an autocut laminator.
  • the laminator preferably includes a heatable roller, such as a rubber roller, and has the function of applying pressure and heat to the object to be treated.
  • the maximum width of the undulation of the transfer film is preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, and even more preferably 60 ⁇ m or less.
  • the maximum width of the undulations of the transfer film is preferably 0 ⁇ m or more, more preferably 0.1 ⁇ m or more, and even more preferably 1 ⁇ m or more.
  • the maximum width of the undulation of the transfer film is measured by the following procedure.
  • the transfer film is cut in a direction perpendicular to the main surface of the transfer film to prepare a sample having a size of 20 cm long and 20 cm wide.
  • the transfer film contains a protective film
  • the protective film is peeled off. Place the sample on a smooth and horizontal platform.
  • the surface of the temporary support of the sample faces the table.
  • a laser microscope eg, VK-9700SP manufactured by KEYENCE CORPORATION
  • a 10 cm square range in the central portion of the surface of the sample is scanned to obtain a three-dimensional surface image.
  • the above operation is performed using 10 samples, and the arithmetic average of the measured values is taken as the maximum waviness width of the transfer film.
  • Preferred uses of the transfer film include, for example, a method for producing a conductor pattern using a resist pattern.
  • Examples of the method for producing the conductor pattern include the method for producing the laminate having the already-described conductor pattern.
  • the transfer film is preferably used for forming plated wiring. That is, the transfer film is preferably a transfer film for forming plated wiring.
  • the plated wiring may be the already-described conductor pattern.
  • Resins A2 and A3 were obtained by the same method as that for synthesizing resin A1, except that the types and amounts of monomers added were appropriately changed according to the structure of the target resin.
  • Resins A5 to A9 were obtained by the same method as that for synthesizing resin A4, except that the types and amounts of monomers added were appropriately changed according to the structure of the target resin.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de production d'un stratifié ayant un motif conducteur, ledit procédé comprenant, dans l'ordre suivant : la préparation d'un stratifié comprenant un substrat et une couche conductrice dans cet ordre ; la disposition, sur la couche conductrice, d'une couche de composition photosensible contenant une résine qui comprend un motif constitutif représenté par la formule B1 et un motif constitutif ayant un groupe soluble dans un alcali ; l'exposition de la couche de composition photosensible ; la réalisation d'un processus de développement sur la couche de composition photosensible pour former un motif de réserve ; le placage de la couche conductrice dans une région où le motif de réserve n'est pas situé ; l'élimination du motif de réserve ; et la formation d'un motif conducteur en éliminant la couche conductrice exposée par l'élimination du motif de réserve. La présente invention concerne également une technologie associée audit procédé.
PCT/JP2022/043073 2021-12-24 2022-11-21 Procédé de production d'un stratifié ayant un motif conducteur, composition photosensible et film de transfert WO2023119998A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012209392A (ja) * 2011-03-29 2012-10-25 Fujifilm Corp パターン状金属膜を有する積層体の製造方法、被めっき層形成用組成物
JP2012214895A (ja) * 2011-03-29 2012-11-08 Fujifilm Corp パターン状金属膜を有する積層体の製造方法、被めっき層形成用組成物
JP2012234013A (ja) * 2011-04-28 2012-11-29 Fujifilm Corp 金属パターン材料及びその製造方法
JP2015175923A (ja) * 2014-03-13 2015-10-05 Jsr株式会社 硬化性樹脂組成物、表示素子用硬化膜、その形成方法及び表示素子
JP2016213299A (ja) * 2015-05-07 2016-12-15 日立化成株式会社 金属パターンの形成方法及び金属パターン付き基板
JP2019101322A (ja) * 2017-12-06 2019-06-24 富士フイルム株式会社 感光性組成物、転写フィルム、硬化膜、並びに、タッチパネル及びその製造方法
JP2021060539A (ja) * 2019-10-09 2021-04-15 東洋インキＳｃホールディングス株式会社 感光性着色組成物、カラーフィルタおよび表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012209392A (ja) * 2011-03-29 2012-10-25 Fujifilm Corp パターン状金属膜を有する積層体の製造方法、被めっき層形成用組成物
JP2012214895A (ja) * 2011-03-29 2012-11-08 Fujifilm Corp パターン状金属膜を有する積層体の製造方法、被めっき層形成用組成物
JP2012234013A (ja) * 2011-04-28 2012-11-29 Fujifilm Corp 金属パターン材料及びその製造方法
JP2015175923A (ja) * 2014-03-13 2015-10-05 Jsr株式会社 硬化性樹脂組成物、表示素子用硬化膜、その形成方法及び表示素子
JP2016213299A (ja) * 2015-05-07 2016-12-15 日立化成株式会社 金属パターンの形成方法及び金属パターン付き基板
JP2019101322A (ja) * 2017-12-06 2019-06-24 富士フイルム株式会社 感光性組成物、転写フィルム、硬化膜、並びに、タッチパネル及びその製造方法
JP2021060539A (ja) * 2019-10-09 2021-04-15 東洋インキＳｃホールディングス株式会社 感光性着色組成物、カラーフィルタおよび表示装置

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