WO2023119347A1 - めっき装置のメンテナンス方法 - Google Patents

めっき装置のメンテナンス方法 Download PDF

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Publication number
WO2023119347A1
WO2023119347A1 PCT/JP2021/046934 JP2021046934W WO2023119347A1 WO 2023119347 A1 WO2023119347 A1 WO 2023119347A1 JP 2021046934 W JP2021046934 W JP 2021046934W WO 2023119347 A1 WO2023119347 A1 WO 2023119347A1
Authority
WO
WIPO (PCT)
Prior art keywords
tank
catholyte
anolyte
plating
anode
Prior art date
Application number
PCT/JP2021/046934
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
正輝 富田
Original Assignee
株式会社荏原製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社荏原製作所 filed Critical 株式会社荏原製作所
Priority to JP2022507852A priority Critical patent/JP7041795B1/ja
Priority to PCT/JP2021/046934 priority patent/WO2023119347A1/ja
Priority to KR1020227025386A priority patent/KR102549747B1/ko
Priority to CN202180011192.4A priority patent/CN115087764B/zh
Publication of WO2023119347A1 publication Critical patent/WO2023119347A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
PCT/JP2021/046934 2021-12-20 2021-12-20 めっき装置のメンテナンス方法 WO2023119347A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022507852A JP7041795B1 (ja) 2021-12-20 2021-12-20 めっき装置のメンテナンス方法
PCT/JP2021/046934 WO2023119347A1 (ja) 2021-12-20 2021-12-20 めっき装置のメンテナンス方法
KR1020227025386A KR102549747B1 (ko) 2021-12-20 2021-12-20 도금 장치의 메인터넌스 방법
CN202180011192.4A CN115087764B (zh) 2021-12-20 2021-12-20 镀覆装置的维护方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/046934 WO2023119347A1 (ja) 2021-12-20 2021-12-20 めっき装置のメンテナンス方法

Publications (1)

Publication Number Publication Date
WO2023119347A1 true WO2023119347A1 (ja) 2023-06-29

Family

ID=81214348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/046934 WO2023119347A1 (ja) 2021-12-20 2021-12-20 めっき装置のメンテナンス方法

Country Status (4)

Country Link
JP (1) JP7041795B1 (zh)
KR (1) KR102549747B1 (zh)
CN (1) CN115087764B (zh)
WO (1) WO2023119347A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
US20230313405A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002220698A (ja) * 2001-01-29 2002-08-09 Tokyo Electron Ltd 液処理装置
JP2007291419A (ja) * 2006-04-21 2007-11-08 Nec Electronics Corp メッキ処理装置
US20150068911A1 (en) * 2013-09-12 2015-03-12 Kabushiki Kaisha Toshiba Copper plating apparatus, copper plating method and method for manufacturing semiconductor device
JP2016117918A (ja) * 2014-12-18 2016-06-30 三菱マテリアル株式会社 電解めっき方法及び電解めっき装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6821407B1 (en) 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
JP2008019496A (ja) * 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
CN202925116U (zh) * 2012-09-27 2013-05-08 兰州交通大学 一种用于金属氯化物精炼的膜电积槽
US10760178B2 (en) * 2018-07-12 2020-09-01 Lam Research Corporation Method and apparatus for synchronized pressure regulation of separated anode chamber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002220698A (ja) * 2001-01-29 2002-08-09 Tokyo Electron Ltd 液処理装置
JP2007291419A (ja) * 2006-04-21 2007-11-08 Nec Electronics Corp メッキ処理装置
US20150068911A1 (en) * 2013-09-12 2015-03-12 Kabushiki Kaisha Toshiba Copper plating apparatus, copper plating method and method for manufacturing semiconductor device
JP2016117918A (ja) * 2014-12-18 2016-06-30 三菱マテリアル株式会社 電解めっき方法及び電解めっき装置

Also Published As

Publication number Publication date
KR102549747B1 (ko) 2023-07-03
JPWO2023119347A1 (zh) 2023-06-29
CN115087764B (zh) 2023-02-28
CN115087764A (zh) 2022-09-20
JP7041795B1 (ja) 2022-03-24

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