Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/08—Metals
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
  • B29C48/154—Coating solid articles, i.e. non-hollow articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C48/25—Component parts, details or accessories; Auxiliary operations
  • B29C48/30—Extrusion nozzles or dies
  • B29C48/32—Extrusion nozzles or dies with annular openings, e.g. for forming tubular articles
  • B29C48/34—Cross-head annular extrusion nozzles, i.e. for simultaneously receiving moulding material and the preform to be coated
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C48/25—Component parts, details or accessories; Auxiliary operations
  • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
  • B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
  • B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
• • C—CHEMISTRY; METALLURGY
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  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
  • C08K13/02—Organic and inorganic ingredients
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/014—Stabilisers against oxidation, heat, light or ozone
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/016—Flame-proofing or flame-retarding additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/16—Halogen-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K3/2279—Oxides; Hydroxides of metals of antimony
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/005—Stabilisers against oxidation, heat, light, ozone
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0066—Flame-proofing or flame-retarding additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/02—Halogenated hydrocarbons
  • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/05—Alcohols; Metal alcoholates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/13—Phenols; Phenolates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
  • C08K5/3432—Six-membered rings
  • C08K5/3435—Piperidines
• • C—CHEMISTRY; METALLURGY
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  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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  • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
  • C08K5/3445—Five-membered rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
  • C08K5/3472—Five-membered rings
  • C08K5/3475—Five-membered rings condensed with carbocyclic rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
  • C08K5/3477—Six-membered rings
  • C08K5/3492—Triazines
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
  • C08K5/37—Thiols
  • C08K5/372—Sulfides, e.g. R-(S)x-R'
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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  • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
  • C08K5/37—Thiols
  • C08K5/378—Thiols containing heterocyclic rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
  • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L23/04—Homopolymers or copolymers of ethene
  • C08L23/08—Copolymers of ethene
  • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
  • C08L23/0853—Ethylene vinyl acetate copolymers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
  • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
  • H01B3/448—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from other vinyl compounds
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C48/25—Component parts, details or accessories; Auxiliary operations
  • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
  • B29C48/50—Details of extruders
  • B29C48/505—Screws
  • B29C48/64—Screws with two or more threads
  • B29C48/655—Screws with two or more threads having three or more threads
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
  • B29K2023/04—Polymers of ethylene
  • B29K2023/06—PE, i.e. polyethylene
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
  • B29K2023/04—Polymers of ethylene
  • B29K2023/08—Copolymers of ethylene
  • B29K2023/083—EVA, i.e. ethylene vinyl acetate copolymer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/08—Metals
  • C08K2003/0875—Antimony
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2201/00—Properties
  • C08L2201/02—Flame or fire retardant/resistant
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/20—Applications use in electrical or conductive gadgets
  • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2312/00—Crosslinking

Definitions

• the present invention relates to a resin composition, a resin coating material, an insulated wire, a wire harness for automobiles, and a method for producing an insulated wire used for wire harnesses for automobiles.
• Flame-retardant insulated wires are widely used in various white goods, OA equipment, and the like. Insulated wires used in automobiles and the like are also required to have various properties such as flame resistance, heat resistance, flexibility, and mechanical properties. So far, many reports have been made on resin compositions that realize insulated wires with flame retardance, heat resistance, flexibility, and mechanical properties by using them as coating materials for conductors. There is Resin compositions based on resins such as polyethylene and ethylene-vinyl acetate copolymers are widely used as resin compositions for insulated wires having such desired characteristics.
• an ethylene-vinyl acetate copolymer, a specific flame retardant, a plurality of specific anti-aging agents, a copper damage inhibitor, and a cross-linking aid are contained in respective specific amounts.
• This resin composition contains 90 to 100 parts by mass of an ethylene-vinyl acetate copolymer, 15 to 30 parts by mass of a brominated flame retardant, 5 to 15 parts by mass of antimony trioxide, and 6 parts by mass of a benzimidazole antioxidant. ⁇ 12 parts by mass, 2 to 4 parts by mass of phenol antioxidant, 2 to 4 parts by mass of thioether antioxidant, 0.5 to 2 parts by mass of copper damage inhibitor, 3 to 6 parts by mass of cross-linking aid part is included.
• Patent Document 2 discloses that by using it as a conductor coating material, it has excellent heat resistance life, flame retardancy, and compatibility with polyvinyl chloride (PVC), and at the time of disposal such as landfill and incineration, it does not contain heavy metal compounds.
• a flame-retardant resin composition is described that can provide an insulated wire that does not cause problems such as elution, large amounts of smoke, and generation of corrosive gas.
• This flame-retardant resin composition contains 100 parts by mass of a mixture of an ethylene/vinyl acetate copolymer or an ethylene/vinyl acetate copolymer with a vinyl acetate content of 10% by mass or more and less than 40% by mass, and a polyolefin.
• 50 to 160 parts by mass of metal hydrate, 2 to 10 parts by mass of phenolic antioxidant, 10 to 25 parts by mass of benzimidazole antioxidant, and 0 to 10 parts by mass of thioether antioxidant. contains.
• Patent Document 3 discloses that it has excellent flame retardancy, tensile properties, heat resistance, and electrical properties, and at the time of disposal such as landfilling or incineration, elution of heavy metal compounds, large amounts of smoke, and corrosive gas.
• An insulated wire with no generation is described. This insulated wire contains 150 to 300 parts by mass of a metal hydrate, 1 to 6 parts by mass of a phenolic antioxidant, and 1 to 6 parts by mass of a phenolic antioxidant and a thioether-based oxidation
• a conductor is coated with a crosslinked product of a composition containing 12 to 30 parts by mass of an inhibitor and having a vinyl acetate content of 40% by mass or more in the base resin.
• Patent Document 4 describes non-halogen flame-retardant wires and cables that are highly resistant to corrosive gases such as NOx and SOx.
• This non-halogen flame retardant wire/cable contains a non-halogen flame retardant in the insulator or sheath, and the insulator or the sheath contains 300 parts by weight or less of the non-halogen flame retardant per 100 parts by weight of rubber or plastic,
• the composition is characterized by adding 0.1 to 10 parts by weight each of a hindered phenol antioxidant and a thioether antioxidant.
• the present invention provides excellent heat resistance and excellent cross-linking properties in the insulating film by using it for forming an insulating film (resin coating material layer) of an insulated wire, and the resulting insulated wire can be used at high temperatures.
• An object of the present invention is to provide a resin composition that can provide an insulated wire that is also excellent in lineability (slipperiness) in an environment.
• the present invention also provides a resin coating material using the resin composition, an insulated wire having the resin coating material around a conductor, an automotive wire harness having the insulated wire, and a method for producing an insulated wire used in the automotive wire harness.
• the task is to provide
• the present inventors have made intensive studies to solve the above problems, and found that an ethylene-vinyl acetate copolymer resin is used as a base resin, and an imidazole compound, a phenol compound, and a thioether compound are blended in specific amounts, Further, by blending each specific amount of the bromine compound and the antimony compound, the resin composition obtained has excellent heat resistance, high cross-linking property, and wire conductivity by using this for forming the insulating film of the insulated wire. It has been found that it is possible to provide an insulated wire that is also excellent. The present invention has been completed through further studies based on these findings.
• a resin composition containing an ethylene-vinyl acetate copolymer resin as a resin component contains an imidazole compound, a phenol compound and a thioether compound as antioxidants, and a bromine compound and an antimony compound as flame retardants,
• the content of the imidazole compound is 14 to 24 parts by mass
• the content of the phenol compound is 1.0 to 2.0 parts by mass
• the content of the bromine compound is 15 to 30 parts by mass
• the content of the antimony compound is 5 to 15 parts by mass.
• ⁇ 2> The resin composition according to ⁇ 1> above, wherein the resin composition contains 0.5 to 6.0 parts by mass of a dispersant with respect to 100 parts by mass of the total content of the resin components in the resin composition. . ⁇ 3>
• ⁇ 4> The resin composition according to any one of ⁇ 1> to ⁇ 3>, wherein the proportion of the vinyl acetate component in the ethylene-vinyl acetate copolymer resin is 30% by mass or less.
• ⁇ 5> The resin according to any one of ⁇ 1> to ⁇ 4>, wherein the total content of the antioxidant with respect to 100 parts by mass of the total content of the resin components in the resin composition is 20 to 26 parts by mass.
• Composition. ⁇ 6> The resin composition according to any one of ⁇ 1> to ⁇ 5> above, wherein the resin composition contains at least one of a crosslinking aid and a processing aid.
• ⁇ 7> The resin composition according to any one of ⁇ 1> to ⁇ 6>, which is used for a wire harness for automobiles.
• ⁇ 8> A resin coating material obtained by cross-linking the resin composition according to any one of ⁇ 1> to ⁇ 7>.
• ⁇ 9> An insulated wire, wherein the insulating film has the resin coating material according to ⁇ 8>.
• a wiring harness for an automobile comprising the insulated wire according to ⁇ 9>.
• the resin composition according to any one of ⁇ 1> to ⁇ 7> is extrusion-coated on the conductor to provide a layer of the resin composition, and the layer of the resin composition is irradiated with an electron beam of 80 to 250 kGy.
• a numerical range represented using " ⁇ " means a range that includes the numerical values described before and after it as lower and upper limits.
• the resin composition of the present invention When the resin composition of the present invention is used to form an insulating film (resin coating material layer) for an insulated wire, it has excellent heat resistance, excellent cross-linking properties in the insulating film, and good wire connection between the obtained insulated wires. An excellent insulated wire can also be obtained.
• the resin coating material of the present invention as a constituent material of an insulating film of an insulated wire, an insulated wire exhibiting the above desired excellent properties can be obtained.
• the insulated wires constituting the wire harness for automobiles have the above-mentioned resin coating material in the insulating film, are excellent in heat resistance, are excellent in cross-linking property in the insulating film, and furthermore, It also has excellent wiring performance underneath. According to the method of manufacturing an insulated wire used in a wire harness for automobiles of the present invention, an insulated wire having the above-described excellent properties can be obtained.
• the resin composition of the present invention contains an ethylene-vinyl acetate copolymer resin as a base resin, an imidazole compound, a phenol compound and a thioether compound as antioxidants, and a bromine compound and an antimony compound as flame retardants in specific amounts. .
• an ethylene-vinyl acetate copolymer resin as a base resin
• an imidazole compound as antioxidants
• a phenol compound and a thioether compound as antioxidants
• a bromine compound and an antimony compound as flame retardants in specific amounts.
• the resin composition of the present invention contains at least an ethylene-vinyl acetate copolymer resin as a resin component constituting the base resin.
• the form of polymerization of the ethylene-vinyl acetate copolymer resin used in the present invention may be block, random or graft.
• the content ratio of the vinyl acetate component constituting the ethylene-vinyl acetate copolymer is determined from the viewpoint of the adhesion between the resin coating material and the conductor, and the wire harness (slipperiness) between the wire harness member and the electric cable or wires. , preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less in the ethylene-vinyl acetate copolymer. From the same viewpoint as above, the content of the vinyl acetate component is preferably 7% by mass or more, more preferably 9% by mass or more.
• the resin coating material produced using the resin composition of the present invention can acquire sufficient mechanical properties such as tensile strength and tensile elongation, and furthermore, it can provide insulation.
• the flame retardancy of the electric wire can be further improved.
• the content ratio of the vinyl acetate component can be determined, for example, from the mass ratio of raw materials (monomers) during synthesis.
• the melt flow rate (MFR) of the ethylene-vinyl acetate copolymer resin used in the present invention is preferably 0.1 to 10 g/10 minutes (load 2.16 kg, temperature 190° C.), and 0.5 to 5 g/10 minutes. is more preferred.
• MFR melt flow rate
• a melt flow rate (MFR) can be measured by a method based on JIS K 7210:2014.
• the ethylene-vinyl acetate copolymer resin used in the present invention can be synthesized by a conventional method, and commercial products may be used. Specific examples of commercially available products include Evaflex V5274 and Evaflex V422 (both trade names) manufactured by Mitsui DuPont Polychemicals.
• the content of the ethylene-vinyl acetate copolymer resin is 80% by mass or more from the viewpoint of improving flame retardancy and improving crosslinkability. , more preferably 85% by mass or more, and even more preferably 90% by mass or more. Also, all of the resin components contained in the resin composition of the present invention may be an ethylene-vinyl acetate copolymer resin.
• the resin composition of the present invention may contain a polyethylene resin as a resin component other than the ethylene-vinyl acetate copolymer resin.
• polyethylene resins include maleic acid-modified polyethylene resins and low-density polyethylene resins.
• Such polyethylene resins may be used singly or in combination of two or more.
• the content of the polyethylene resin is preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 12% by mass or less. Preferably, it can be 1 to 10% by mass, 2 to 8% by mass, or 3 to 5% by mass.
• maleic acid-modified polyethylene resin When the resin composition of the present invention contains a maleic acid-modified polyethylene resin component as a resin component, the content of the maleic acid-modified polyethylene resin in the resin components constituting the resin composition of the present invention is 20% by mass or less. is preferably 15% by mass or less, more preferably 12% by mass or less, can be 1 to 10% by mass, can be 2 to 8% by mass, and can be 3 to It can also be 5% by mass.
• the content of the maleic acid-modified polyethylene resin within the above preferred range, sufficient flexibility can be imparted to the insulated wire having the resin coating material produced using the resin composition of the present invention. .
• the resin composition hardly adheres to the processing machine (excellent adhesion during processing), the residual amount of the composition in the processing machine can be suppressed.
• the compatibility between the resin component and the fillers in the composition can be enhanced, and the wear resistance of the obtained insulated wire can be further improved.
• low density polyethylene resin means polyethylene resin having a density of 0.929 g/cm 3 or less. Therefore, the "low density polyethylene resin” in the present invention includes “very low density polyethylene (VLDPE)” and the like in addition to “low density polyethylene (LDPE)".
• VLDPE very low density polyethylene
• LDPE low density polyethylene
• the low density polyethylene resin used in the present invention preferably has a density range of 0.870-0.929 g/cm 3 , more preferably a density range of 0.910-0.929 cm 3 .
• the density of the polyethylene resin can be determined according to JIS K 7112:1999.
• the low-density polyethylene resin may be, for example, a high-pressure radical method (high-pressure method) low-density polyethylene resin or a metallocene-catalyzed linear low-density polyethylene resin. Details of such a polyethylene resin can be referred to, for example, the description of Japanese Patent Application No. 2016-072380.
• the content of the low-density polyethylene resin in the resin components constituting the resin composition of the present invention is preferably 20% by mass or less, It is more preferably 15% by mass or less, more preferably 12% by mass or less, can be 1 to 10% by mass, can be 2 to 8% by mass, and can be 3 to 5% by mass. You can also
• Polyethylene resins such as maleic acid-modified polyethylene resins and low-density polyethylene resins that can be used in the present invention can be synthesized by conventional methods, and commercially available products can be used.
• Commercially available products include Petrothene 180R, Petrothene 170R, and Petrothene 173R manufactured by Tosoh Corporation, Sumikasen F218-0, Sumikasen F200, and Sumikasen G401 manufactured by Sumitomo Chemical Co., Ltd., Novatec UE320 manufactured by Japan Polyethylene Corporation, Novatec LF443, Novatec LF280H, Novatec LF448K1, Adtex L6100M, NUC-9060 and ENGAGE-8100 manufactured by NUC, and NUCG-5130 manufactured by Dow Elastomer (all trade names).
• the total content of the resin components contained in the resin composition of the present invention is usually 30-80% by mass, can be 40-75% by mass, and can be 50-75% by mass.
• the resin composition of the present invention contains an imidazole compound (imidazole antioxidant), a phenol compound (phenol antioxidant), and a thioether compound (thioether antioxidant) as antioxidants (antiaging agents). Contains a specific amount. By blending each specific amount of each of these antioxidants, it is possible to further improve the heat resistance, crosslinkability, and slipperiness while suppressing the occurrence of bleeding in the resulting resin coating material.
• an imidazole antioxidant imidazole antioxidant
• phenol compound phenol antioxidant
• thioether compound thioether antioxidant
• the imidazole compound (compound having a benzimidazole skeleton) used in the resin composition of the present invention includes 2-sulfanylbenzimidazole, 2-sulfanylmethylbenzimidazole, 4-sulfanylmethylbenzimidazole, 5-sulfanylmethylbenzimidazole and these zinc salts and the like, and 2-sulfanylbenzimidazole and zinc salts thereof are preferred.
• a commercially available imidazole compound may be used in the present invention.
• Commercially available products include, for example, Nocrac MBZ (trade name, manufactured by Ouchi Shinko Kagaku Kogyo Co., Ltd.).
• the content of the imidazole compound is 14 to 24 parts by mass with respect to 100 parts by mass of the total content of the resin components constituting the resin composition of the present invention.
• the content is preferably 16 to 24 parts by mass, more preferably 16 to 20 parts by mass, from the viewpoint of further improving the heat resistance and crosslinkability, and from the viewpoint of suppressing the dispersibility in the resin and the occurrence of bleeding. is more preferable.
• Phenolic compounds used in the resin composition of the present invention include, for example, triethylene glycol-bis(3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate), 1 ,6-hexanediol-bis(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate), pentaerythrityl-tetrakis(3-(3,5-di-t-butyl-4- hydroxyphenyl)propionate), octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 1,3,5-trimethyl-2,4,6-tris(3,5,-di -t-butyl-4-hydroxybenzyl)benzene, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanuric acid, isoo
• a 3,5-di-t-butyl-4-hydroxyphenyl group or a 3,5-di-t-butyl-4-hydroxybenzyl group is used from the viewpoint of imparting high heat resistance to wire harnesses for automobiles.
• Those having two or more are preferred, and 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanuric acid and pentaerythrityl-tetrakis(3-(3,5-di-t -butyl-4-hydroxyphenyl)propionate) is particularly preferred.
• a compound having a phenol skeleton corresponds to a triazole compound, an N,N'-diacylhydrazine compound, or a dihydrazide compound, and is used as a copper damage inhibitor.
• these compounds are treated as copper damage inhibitors, not as phenolic compounds.
• a commercially available phenol compound may be used in the present invention. Examples of commercially available products include Irganox 1010 (trade name, manufactured by BASF) and ADEKA STAB AO-20 (trade name, manufactured by ADEKA).
• the content of the phenol compound is 1.0 to 2.0 parts by mass with respect to 100 parts by mass of the total content of the resin components constituting the resin composition of the present invention.
• the content is preferably 1.5 to 2.0 parts by mass from the viewpoint of further improving heat resistance and crosslinkability and from the viewpoint of suppressing the occurrence of bleeding.
• Thioether compounds used in the resin composition of the present invention include thioether compounds used as antioxidants for electric wire coating materials.
• thioether compounds used as antioxidants for electric wire coating materials.
• thioether compound may be used in the resin composition of the present invention.
• Commercially available products include, for example, ADEKA STAB AO-412S (trade name, manufactured by ADEKA).
• the content of the thioether compound is 0.3 to 0.9 parts by mass with respect to the total content of 100 parts by mass of the resin components constituting the resin composition of the present invention.
• the thioether compound tends to bleed to the surface of the insulating coating.
• the slipperiness is significantly impaired (the coefficient of dynamic friction is significantly increased), which hinders assembly of the wire. Therefore, by setting the content of the thioether compound within the above range, it is possible to obtain a resin composition having excellent heat resistance and slipperiness.
• the content is preferably 0.3 to 0.6 parts by mass from the viewpoint of further improving heat resistance, improving slipperiness, and suppressing inhibition of cross-linking.
• antioxidants In addition to the imidazole compound, phenol compound, and thioether compound, the resin composition of the present invention may contain antioxidants other than these. Such antioxidants include, for example, copper damage inhibitors and zinc compounds, and one or more of these can be used. Specific examples of zinc compounds include zinc sulfide and zinc oxide.
• copper damage inhibitor examples include triazole compounds, N,N'-diacylhydrazine compounds, dihydrazide compounds and the like.
• Commercially available products include, for example, heavy metal deactivator ADEKA STAB CDA series (CDA-1, CDA-6, CDA-10 (all trade names)) manufactured by ADEKA, and Irganox MD1024 (trade name) manufactured by BASF. etc.
• the content of the copper damage inhibitor is, from the viewpoint of reducing heat resistance due to contact with metal ions such as copper, relative to the total content of 100 parts by mass of the resin components. is preferably 0.5 to 2.0 parts by mass.
• zinc compound examples of zinc compounds that can be used in the resin composition of the present invention include zinc sulfide and zinc oxide.
• the resin composition of the present invention preferably contains zinc sulfide and/or zinc oxide.
• Commercial products of such zinc sulfide and zinc oxide include, for example, SachtolithHD-S (trade name) manufactured by Sachtleben Chemie Gmbh and Zinc sulfide manufactured by Taizhou ATS Optical Material.
• zinc compounds do not include zinc salts with imidazole compounds used as imidazole compounds and zinc stearate used as processing aids (lubricants).
• the content of the zinc compound is 1.0 to 10 parts by mass with respect to 100 parts by mass of the total resin component content from the viewpoint of heat resistance. It is preferably from 3.0 to 5.0 parts by mass.
• the total content of the antioxidant is preferably 10 to 35 parts by mass, preferably 15 to 30 parts by mass, with respect to the total content of 100 parts by mass of the resin components constituting the resin composition of the present invention. More preferably, it is 20 to 26 parts by mass.
• the resin composition of the present invention contains a bromine compound (bromine-based flame retardant) and an antimony compound (antimony-based flame retardant) as flame retardants.
• the amount ratio of the bromine compound and the antimony compound in the resin composition is preferably such that the amount of bromine element is 2 to 5 times the amount of bromine element per 1 mol of antimony element.
• the total content of the flame retardant in the resin composition of the present invention is preferably 20 to 45 parts by mass, more preferably 30 to 45 parts by mass, and 31 to 42 parts by mass with respect to 100 parts by mass of the total resin content. Parts by mass are more preferred.
• the bromine compound used as the flame retardant in the present invention includes, for example, brominated N,N'-ethylenebisphthalimide or compounds derived therefrom (collectively referred to as "brominated N,N'-ethylenebisphthalimide compounds”). ), N,N'-bis(bromophenyl)terephthalamide or compounds derived therefrom (collectively referred to as “N,N'-bis(bromophenyl)terephthalamide compounds”), brominated bisphenols or Compounds to be derived (these are collectively referred to as "brominated bisphenol compounds”) and organic bromine-containing flame retardants such as 1,2-bis(bromophenyl)alkanes.
• brominated N,N'-ethylenebisphthalimide and/or 1,2-bis(bromophenyl)ethane are preferably used.
• a commercially available bromine compound may be used as the bromine compound used in the resin composition of the present invention.
• Examples of commercially available products include Cytex 8010 (trade name, manufactured by Albemarle).
• the content of the bromine compound in the resin composition of the present invention is 15 to 30 parts by mass with respect to 100 parts by mass of the total content of the resin components. From the viewpoint of flame retardancy, the content is preferably 20 to 30 parts by mass, more preferably 24 to 30 parts by mass.
• Antimony compounds include, for example, antimony trioxide, antimony tetroxide, antimony pentoxide, and sodium antimonate. It is believed that antimony reacts with chlorine (halogen), and the generated gas blocks oxygen, thereby promoting the formation of a carbonized layer and trapping free radicals (thermal decomposition chain reaction stopping action).
• antimony trioxide is preferably contained in the present invention from the viewpoint of forming a more stable carbonized layer.
• Commercially available antimony trioxide may be used in the present invention. Examples of commercially available products include PATOX-C (trade name, manufactured by Nippon Seiko Co., Ltd.).
• the resin composition of the present invention contains an antimony compound, it is 5 to 15 parts by mass with respect to 100 parts by mass of the total resin component content. From the viewpoint of flame retardancy, the content is preferably 8 to 13 parts by mass, more preferably 9 to 12 parts by mass, even more preferably 10 to 12 parts by mass.
• the resin composition of the present invention may contain a flame retardant that can be normally used for insulating coatings of insulated wires.
• flame retardants include metal hydroxides (hydroxide flame retardants) such as magnesium hydroxide and aluminum hydroxide.
• hydroxide-based flame retardant it is preferably 5 parts by mass or less, more preferably 3 parts by mass or less with respect to 100 parts by mass of the total content of the resin components.
• the resin composition of the present invention may contain other components such as the following cross-linking aids and processing aids within a range that does not impair the effects of the present invention.
• it may contain components such as plasticizers, fillers, and pigments, if necessary.
• the resin composition of the present invention preferably also contains a cross-linking aid.
• cross-linking aids include polyfunctional compounds, and compounds having two or more (preferably three or more, more preferably three to six) ethylenically unsaturated bonds (carbon-carbon double bonds) in the molecule. preferable.
• Specific examples of cross-linking aids include (meth)acrylate compounds such as polypropylene glycol di(meth)acrylate and trimethylolpropane tri(meth)acrylate, allyl compounds such as triallyl cyanurate, maleimide compounds, and divinyl compounds. mentioned.
• a commercially available cross-linking aid may be used in the present invention.
• the resin composition of the present invention preferably contains 2 to 6 parts by mass, more preferably 3 to 5 parts by mass, of a cross-linking aid per 100 parts by mass of the total resin component content.
• the resin composition of the present invention preferably also contains a processing aid.
• processing aids include metallic soaps (lubricants).
• metal soaps (lubricants) that can be used in the resin composition of the present invention include calcium stearate, zinc stearate and magnesium stearate.
• Commercially available metal soaps may be used in the present invention.
• Commercially available products include, for example, Shinakared ZS-101 (trade name, manufactured by Shinagawa Kako Co., Ltd.).
• the resin composition of the present invention contains a lubricant, it preferably contains 0.5 to 2 parts by mass with respect to 100 parts by mass of the total content of the resin components.
• the resin composition of the present invention preferably also contains a dispersant.
• a dispersant in the resin composition of the present invention, additives such as flame retardants and antioxidants can be prevented from reaggregating, and the dispersibility of each component in the polymer can be improved.
• the compound production processability using a Ruder or a twin-screw extruder can be made excellent, and the heat resistance can be further improved.
• the dispersant that can be used in the present invention is not particularly limited, and a dispersant that is usually blended in a resin composition can be used. From the viewpoint of further suppressing reaggregation of the additive, the dispersant is preferably a wet dispersant.
• a wetting and dispersing agent has both a function as a wetting agent that acts as a surfactant to increase the wettability of the dispersoid to the resin component, and a function that prevents the aggregation of the dispersoid through actions such as electrical repulsion and steric hindrance. It is an additive that has both.
• the function as a wetting agent is carried out by a chain compatible with the resin component, and the function of preventing aggregation of the dispersoid is carried out by an adsorptive group to the dispersoid.
• Examples of commercial products of wetting and dispersing agents include BYK-MAX D4221 and BYK-MAX P4102 (both trade names, manufactured by BYK-Chemie Japan).
• the dispersant is 0.5 to 0.5 parts per 100 parts by mass of the total resin component content.
• the content is preferably 6.0 parts by mass, more preferably 1.0 to 6.0 parts by mass.
• additives such as ultraviolet absorbers, plasticizers, fillers, pigments, etc.
• Various additives can be added to the resin composition of the present invention as necessary within a range that does not impair the effects of the present invention.
• the resin composition of the present invention is prepared by blending each component such as a resin, an antioxidant, a flame retardant, etc. and, if necessary, the optional components described above, and mixing them with a batch type kneader such as a roll, a kneader, a Banbury mixer or a twin-screw kneader. It can be obtained by melt-kneading with a commonly used kneading device such as an extruder.
• a batch type kneader such as a roll, a kneader, a Banbury mixer or a twin-screw kneader. It can be obtained by melt-kneading with a commonly used kneading device such as an extruder.
• the insulated wire of the present invention has a layer made of a resin coating material obtained by cross-linking the resin composition of the present invention on the surface of a conductor (including conductor bundles and fiber core wires).
• the insulated wire of the present invention may have an intermediate layer or a shielding layer between the conductor and the layer made of the resin coating material.
• the shape and material of the conductor may be of any shape and material that are generally used for insulated wires used in wiring harnesses for automobiles.
• the conductor may be solid or stranded, and may be bare, tinned or enamel-coated.
• metal materials for forming conductors include annealed copper, copper alloys, and aluminum.
• the thickness of the layer made of the resin coating material formed around the conductor is not particularly limited, but is usually about 0.15 to 5 mm. When the resin composition of the present invention is used, there is an advantage that an insulated wire having excellent flexibility, hardness, cross-linking degree, flame retardancy, cold resistance and heat resistance can be obtained even if the thickness of the resin coating layer is reduced. .
• the term "automotive wire harness” is a general term for electric wire bundles arranged in various parts of a vehicle such as an engine room, an instrument panel, and inside a door according to environmental performance.
• the wiring harness for automobiles of the present invention has the insulated wire of the present invention.
• the resin composition of the present invention has an excellent appearance, flame retardancy and mechanical properties. Therefore, a wire harness incorporating an insulated wire having a layer made of a resin coating material obtained by cross-linking the resin composition of the present invention can be suitably used for automobiles.
• the wire harness for automobiles may be simply referred to as "wire harness”.
• the insulated wire used in the wiring harness for automobiles of the present invention is provided with a layer of the resin composition by extrusion coating the resin composition of the present invention on the conductor, and the layer of the resin composition is irradiated with an electron beam of 80 to 250 kGy. It can be obtained through a step of irradiation.
• This electron beam irradiation causes a cross-linking reaction in the resin composition layer to form a resin coating material layer.
• the cross-linking reaction by electron beam irradiation can be carried out by usual methods and conditions.
• the electron beam irradiation conditions are preferably an irradiation dose of 80 to 200 kGy, more preferably 80 to 160 kGy.
• the acceleration voltage is preferably 300 to 3000 keV, more preferably 500 to 2500 keV.
• a multi-layered structure may be employed in which an intermediate layer or shielding layer is provided between the conductor and the covering layer or between the covering layers.
• the conditions for extruding the resin composition of the present invention are not particularly limited as long as the resin composition of the present invention can be extruded.
• the extrusion temperature (head portion) is preferably 100 to 230°C, more preferably 120 to 200°C, in that it can also ensure the Other conditions for extrusion molding can be appropriately set according to the purpose.
• the screw configuration of the extruder is not particularly limited, and a normal full-flight screw, double-flight screw, tip double-flight screw, Maddock screw, or the like can be used.
• Examples 1 to 13 and Comparative Examples 1 to 12 Materials for preparing the resin compositions of Examples 1-13 and Comparative Examples 1-12 are shown in Tables 1 and 2 below. Details of the materials used are as follows. (1) to (14) below correspond to (1) to (14) in Tables 1 and 2 below.
• Antioxidant Zinc salt of 2-mercaptobenzimidazole, Nocrac MBZ (trade name), manufactured by Ouchi Shinko Kagaku Kogyo Co., Ltd.
• crosslinking aid Trimethylolpropane trimethacrylate, Ogmont T200 (trade name), manufactured by Shin-Nakamura Chemical Co., Ltd.
• JASO Japan Society of Automotive Engineers Standard
• the percentage of the mass of the sample after immersion in xylene and after drying relative to the mass of the sample before immersion in xylene ([mass of sample after immersion in xylene and after drying/mass of sample before immersion in xylene] ⁇ 100) is defined as the gel fraction, and the following: The crosslinkability was evaluated by applying the standard. -Evaluation criteria- A: Gel fraction 70% or more B: Gel fraction 50% or more and less than 70% C: Gel fraction less than 50%
• the temperature at which the heat resistance was reached was obtained and defined as the heat resistance life temperature.
• the heat resistance was evaluated by applying the heat resistance life temperature to the following criteria. -Evaluation criteria- A: 151°C or higher B: 150°C or higher and lower than 151°C C: lower than 150°C
• the resin composition sheet using the resin composition that did not meet the requirements of the present invention was inferior in at least one evaluation item of slipperiness, crosslinkability, and heat resistance.
• the resin composition sheet produced using the resin composition of the present invention was excellent in all evaluation items. From this, it can be seen that the resin composition of the present invention can realize excellent properties as a resin coating material layer for wire harnesses for automobiles.

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• 2022
  • 2022-11-28 JP JP2023506533A patent/JPWO2023100798A1/ja active Pending
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