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  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
  • C09K5/08—Materials not undergoing a change of physical state when used
  • C09K5/14—Solid materials, e.g. powdery or granular
• • C—CHEMISTRY; METALLURGY
  • C01—INORGANIC CHEMISTRY
  • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
  • C01B21/00—Nitrogen; Compounds thereof
  • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
  • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/04—Acids; Metal salts or ammonium salts thereof
  • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/38—Boron-containing compounds
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
  • C08L43/04—Homopolymers or copolymers of monomers containing silicon
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
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  • C01—INORGANIC CHEMISTRY
  • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
  • C01P2004/00—Particle morphology
  • C01P2004/60—Particles characterised by their size
  • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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  • C01—INORGANIC CHEMISTRY
  • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
  • C01P2004/00—Particle morphology
  • C01P2004/60—Particles characterised by their size
  • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
• • C—CHEMISTRY; METALLURGY
  • C01—INORGANIC CHEMISTRY
  • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
  • C01P2006/00—Physical properties of inorganic compounds
  • C01P2006/12—Surface area
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  • C01—INORGANIC CHEMISTRY
  • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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  • C01P2006/32—Thermal properties
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/38—Boron-containing compounds
  • C08K2003/382—Boron-containing compounds and nitrogen
  • C08K2003/385—Binary compounds of nitrogen with boron
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/003—Additives being defined by their diameter
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/006—Additives being defined by their surface area
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K9/00—Use of pretreated ingredients
  • C08K9/08—Ingredients agglomerated by treatment with a binding agent
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2310/00—Masterbatches

Definitions

• the present invention relates to an inorganic filler and a heat dissipation member containing the inorganic filler.
• a circuit board used in an on-board power supply system for an electric vehicle generally generates a large amount of heat due to a large voltage and current. An increase in the amount of heat generated causes circuit malfunctions and failures.
• a battery pack that supplies power to an electric motor of an electric vehicle generates heat as it is repeatedly charged and discharged. Continuing to use the battery pack at a high temperature may reduce the performance and life of the battery pack.
• heat generation problems are not limited to electric vehicles, but also occur in electronic devices.
• the heat density inside electronic devices, which are becoming more sophisticated and smaller in size, is increasing year by year.
• the heat-removing method is adopted by bringing the heat-generating part and the cooling member into contact. At this time, if there is a gap between the heat-generating member and the cooling member, the heat removal efficiency is reduced. Therefore, generally, the heat-generating portion and the cooling member are indirectly brought into contact with each other through a heat-dissipating member to remove the heat. .
• Such heat dissipating members generally contain inorganic fillers in resin. At this time, it is necessary to uniformly disperse the inorganic filler in the resin.
• inorganic fillers tend to agglomerate due to attractive forces acting between the surfaces of the inorganic fillers (for example, van der Waals force). Therefore, in order to disperse the inorganic filler in the resin, for example, it is necessary to introduce a repulsive force against the attractive force between the particles.
• Repulsive forces include, for example, electrostatic repulsive forces and steric hindrance repulsive forces.
• Methods for introducing repulsive force between particles of an inorganic filler include, for example, a method of surface-treating an inorganic filler with a silane coupling agent (see, for example, Patent Document 1).
• the silane coupling agent introduces a specific functional group to the surface of the inorganic filler, and can increase the repulsive force between the inorganic fillers.
• an inorganic filler with a stable surface such as boron nitride
• there are few functional groups such as OH groups present on the surface.
• the surface of the inorganic filler is not sufficiently modified by the silane coupling agent, and the inorganic filler cannot be sufficiently dispersed in the resin. there were.
• the present invention has been made in view of the above problems, and an object of the present invention is to provide an inorganic filler having good dispersibility in a resin and a heat dissipation member containing the inorganic filler.
• the present inventors have made intensive studies to solve the above problems. As a result, the inventors have found that the above problems can be solved by increasing the zeta potential of the inorganic filler to the negative side, and have completed the present invention. That is, the present invention is as follows. [1] An inorganic filler having a zeta potential of -15 mV or less at pH 7. [2] The inorganic filler according to [1] above, which has a specific surface area of 0.1 to 20 m 2 /g. [3] The inorganic filler according to [1] or [2] above, which has an average particle size of 0.1 to 150 ⁇ m.
• an inorganic filler with good dispersibility in a resin and a heat dissipation member containing the inorganic filler.
• this embodiment an embodiment of the present invention (hereinafter referred to as “this embodiment”) will be described in detail, but the present invention is not limited to this, and various modifications are possible without departing from the gist thereof. is.
• the inorganic filler of this embodiment has a zeta potential of -15 mV or less when the pH is 7. If the zeta potential of the inorganic filler is greater than ⁇ 15 mV when the pH of the inorganic filler is 7, the electrostatic repulsive force acting between the surfaces of the inorganic filler becomes weak, and as a result, the inorganic filler tends to aggregate. It can be difficult to distribute evenly throughout. From this point of view, the zeta potential when the inorganic filler has a pH of 7 is preferably ⁇ 18 mV or less, more preferably ⁇ 20 mV or less.
• the lower limit of the zeta potential range when the pH of the inorganic filler of the present embodiment is 7 is not particularly limited, but is usually -50 mV or higher.
• the zeta potential when the inorganic filler has a pH of 7 can be measured by the method described in Examples below.
• the specific surface area of the inorganic filler of the present embodiment is preferably 0.1 to 20 m 2 /g, more preferably 0.2 to 15 m 2 /g, and 0.3 to 12 m 2 /g. is more preferred.
• the specific surface area of the inorganic filler is 0.1 m 2 /g or more, the electrostatic repulsive force acting between the surfaces of the inorganic filler becomes strong, and the inorganic filler becomes more difficult to agglomerate.
• the attractive force for example, van der Waals force
• the specific surface area of the inorganic filler can be measured by the method described in Examples below.
• the inorganic filler of the present embodiment preferably has an average particle size of 0.1 to 150 ⁇ m, more preferably 0.5 to 125 ⁇ m, even more preferably 1.0 to 100 ⁇ m.
• the average particle size of the inorganic filler can be measured by the method described in Examples below.
• the inorganic filler of the present embodiment may be a mixture of inorganic fillers having a plurality of average particle sizes.
• the gaps between the large-diameter inorganic fillers are filled with small-diameter inorganic fillers. be able to. Therefore, by using a mixture of inorganic fillers having a plurality of average particle sizes, it becomes possible to fill the resin composition with the inorganic filler at a higher level.
• the viscosity is significantly increased, which may cause problems such as difficulty in handling and inability to uniformly disperse the inorganic filler.
• the zeta potential is set to ⁇ 15 mV or less when the pH of the inorganic filler is 7, such problems associated with high filling can be suppressed. And thereby, it becomes possible to improve more the thermal conductivity which improves according to the filling amount of an inorganic filler.
• the inorganic filler of the present embodiment is not particularly limited, but includes, for example, an inorganic filler having high thermal conductivity.
• examples of such inorganic fillers include one or more selected from boron nitride powder, aluminum nitride powder, aluminum oxide powder, silicon nitride powder, silicon oxide powder, magnesium oxide powder, metal aluminum powder, and zinc oxide powder. is mentioned. Among these, boron nitride powder and aluminum oxide powder are preferred, and boron nitride powder is more preferred. The use of such an inorganic filler tends to further improve the thermal conductivity of the heat dissipating member.
• the zeta potential of the inorganic filler is ⁇ 15 mV or less when the pH of the inorganic filler is 7, it becomes possible to fill the heat dissipating member with the inorganic filler at a higher rate. This makes it possible to further improve the thermal conductivity, which is improved according to the filling amount of the inorganic filler.
• the inorganic filler of the present embodiment includes, for example, a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, a (meth)acrylic monomer unit Including a polymer having a (meth)acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B, and the content of the polymer is 0.01 to 10% by mass.
• the zeta potential at pH 7 can be easily reduced to -15 mV or less.
• the above copolymer is adsorbed to the inorganic filler, and the zeta potential of the inorganic filler is -15 mV or less due to the anionic groups of the copolymer adsorbed to the inorganic filler.
• (meth)acrylic monomer units mean both methacrylic acid monomer units and acrylic monomer units.
• the term “monomer” refers to a monomer having a polymerizable unsaturated bond before polymerization
• the term “monomer unit” refers to a repeating unit that constitutes a part of the copolymer after polymerization, A unit derived from a given monomer.
• (meth)acrylic monomer unit A” is also simply referred to as "unit A”
• (meth)acrylic monomer unit B” is simply referred to as “unit B”
• (Meth)acrylic monomer unit C” is also simply referred to as “unit C”.
• the (meth)acrylic monomer unit A is a repeating unit having an anionic group.
• anionic groups include, but are not limited to, carboxy groups, phosphoric acid groups, phenolic hydroxy groups, and sulfonic acid groups. Among these, one or more selected from the group consisting of a carboxy group, a phosphoric acid group, and a phenolic hydroxy group is preferable, and a carboxy group is more preferable.
• the unit A preferably further has an electron-withdrawing group bonded to the anionic group.
• an electron-withdrawing group is not particularly limited as long as it has the effect of stabilizing the anion of the anionic group.
• an acrylic monomer containing an electron-withdrawing substituent such as a halogen element on the ⁇ -position carbon atom of the carboxy group may be used. Having such a group tends to further improve the dispersibility of the inorganic filler.
• Unit A preferably does not have an electron-donating group bonded to an anionic group or has a group with low electron-donating property.
• Such an electron-donating group is not particularly limited as long as it has the effect of destabilizing the anion of the anionic group.
• an acrylic monomer that does not contain an electron-donating group substituent such as a methyl group on the ⁇ -position carbon atom of the carboxy group may be used. Such a structure tends to further improve the dispersibility of the inorganic filler.
• Examples of such (meth)acrylic monomers include, but are not limited to, acrylic acid, methacrylic acid, acid phosphoxypropyl methacrylate, acid phosphoxypolyoxyethylene glycol monomethacrylate, acid phosphoxypoly Oxypropylene glycol monomethacrylate, phosphoric acid-modified epoxy acrylate, 2-acryloyloxyethyl acid phosphate, 2-methacryloyloxyethyl acid phosphate, 4-hydroxyphenyl acrylate, 4-hydroxyphenyl methacrylate, 2-methacryloyloxyethyl succinic acid, 2 -acrylamido-2-methylpropanesulfonic acid and the like.
• acrylic acid 2-methacryloyloxyethyl phosphate, 4-hydroxyphenyl methacrylate, and 2-acrylamido-2-methylpropanesulfonic acid are preferred, and acrylic acid is more preferred.
• the affinity of the copolymer for the inorganic filler tends to be further improved, and the dispersibility of the inorganic filler tends to be further improved.
• Unit A may be used singly or in combination of two or more.
• the (meth)acrylic monomer unit B is a repeating unit having a cationic group.
• the cationic group is not particularly limited, but for example, the cationic group is one or more selected from the group consisting of primary amino groups, secondary amino groups, tertiary amino groups, and quaternary ammonium salts. is preferred. Among these, a tertiary amino group is more preferable. By having such a group, the copolymer becomes more likely to be adsorbed on the inorganic filler, and the dispersibility of the inorganic filler is further improved.
• the unit B preferably further has an electron-donating group bonded to the cationic group.
• an electron-donating group is not particularly limited as long as it has the effect of stabilizing the cation of the cationic group.
• an acrylic monomer containing an electron-donating substituent such as a methyl group on the ⁇ -position carbon atom of the amino group may be used. Having such a group tends to further improve the dispersibility of the inorganic filler.
• Unit B preferably does not have an electron-withdrawing group bonded to a cationic group, or preferably has a group with low electron-withdrawing properties.
• an electron-withdrawing group is not particularly limited as long as it has the effect of destabilizing the cation of the cationic group.
• an acrylic monomer that does not contain an electron-withdrawing group substituent such as a carboxyl group on the ⁇ -position carbon atom of an amino group may be used. Such a structure tends to further improve the dispersibility of the inorganic filler.
• Examples of such (meth)acrylic monomers include, but are not limited to, 1-aminoethyl acrylate, 1-aminopropyl acrylate, 1-aminoethyl methacrylate, 1-aminopropyl methacrylate, dimethylaminoethyl methacrylate, Diethylaminoethyl methacrylate, t-butylaminoethyl (meth)acrylate, dimethylaminoethyl methacrylate quaternary salt, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl- 4-piperidyl methacrylate, dimethylaminoethyl acrylate benzyl chloride quaternary salt and the like.
• 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate and 2,2,6,6-tetramethyl-4-piperidyl methacrylate are preferred, and 1,2,2,6,6- Pentamethyl-4-piperidyl methacrylate is more preferred.
• Unit B may be used singly or in combination of two or more.
• ((Meth)acrylic monomer unit C) (Meth)acrylic monomer unit C is a (meth)acrylic monomer unit other than unit A and unit B, and is a (meth)acrylic monomer unit containing no cationic or anionic group in the molecule. Quantity. By including the (meth)acrylic monomer unit C in the copolymer, the steric hindrance repulsive force of the inorganic filler is increased, and the dispersibility of the inorganic filler is improved.
• the (meth)acrylic monomer C is the resin used in the resin composition.
• a skeleton with high affinity or compatibility with Such a skeleton is not particularly limited, but for example, an amphipathic skeleton such as an oxyalkylene skeleton, a siloxane skeleton such as dimethylsiloxane, a hydrophobic skeleton such as a hydrocarbon skeleton such as alkyl or aryl, or a phosphate diester skeleton. and other hydrophilic skeletons.
• an oxyalkylene skeleton, a siloxane skeleton, and a hydrocarbon skeleton are preferred, a siloxane skeleton and a hydrocarbon skeleton are more preferred, and a siloxane skeleton is even more preferred.
• Examples of such (meth)acrylic monomers include, but are not limited to, ethoxycarbonylmethyl (meth)acrylate, phenol ethylene oxide-modified (meth)acrylate, phenol (ethylene oxide 2 mol modified) (meth)acrylate , phenol (modified by 4 moles of ethylene oxide) (meth)acrylate, paracumylphenol ethylene oxide-modified (meth)acrylate, nonylphenol ethylene oxide-modified (meth)acrylate, nonylphenol (modified by 4 moles of ethylene oxide) (meth)acrylate, nonylphenol (ethylene oxide 8 mol modified) (meth) acrylate, nonylphenol (propylene oxide 2.5 mol modified) acrylate, 2-ethylhexyl carbitol (meth) acrylate, ethylene oxide modified phthalic acid (meth) acrylate, ethylene oxide modified succinic acid (meth) (meth)acrylic monomers having an oxyalkylene skeleton such as
• (meth) Acrylic monomer 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (Meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate and other hydroxyl group-containing (meth)acrylic monomers; N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide , N-isopropyl (meth)acrylamide, diacetone (meth)acrylamide, or (meth)acrylic monomer having an amide bond such as acryloylmorpholine; ⁇ -butyl- ⁇ -(3-methacryloxypropyl)polydimethylsiloxane (Meth) acrylic monomers having a siloxane skeleton such as; (meth) acrylic monomers having a phosphoric acid diester skeleton such
• Unit C may be used singly or in combination of two or more.
• (meth)acrylic monomers having a siloxane skeleton such as ⁇ -butyl- ⁇ -(3-methacryloxypropyl)polydimethylsiloxane are preferred.
• the (meth)acrylic monomer C preferably has a weight average molecular weight of 2,000 to 9,000.
• the weight-average molecular weight of the (meth)acrylic monomer C is 2,000 or more, the affinity of the copolymer to the resin is further improved, and the steric hindrance repulsive force of the inorganic filler is increased. Dispersibility is improved. Further, when the weight average molecular weight of the (meth)acrylic monomer C is 9,000 or less, the copolymer is more easily dissolved in the resin or solvent.
• the weight average molecular weight of the (meth)acrylic monomer C is more preferably 2,500 to 7,000, still more preferably 3,000 to 6,000, and still more preferably 3,500 to 5,500.
• the weight average molecular weight of the (meth)acrylic monomer C is the weight average molecular weight of the (meth)acrylic monomer unit C.
• the content of unit A is preferably 30 to 80 mol%, more preferably 40 to 65 mol%, relative to the total 100 mol% of unit A, unit B, and unit C.
• the content of the unit A is 30 mol % or more, the zeta potential of the inorganic filler increases on the negative side, and the dispersibility of the inorganic filler is further improved.
• the copolymer can contain the unit B and the unit C in sufficient content.
• the content of unit B is preferably 0.1 to 5 mol%, more preferably 0.5 to 3 mol%, relative to the total 100 mol% of unit A, unit B, and unit C. preferable.
• the content of the unit B is preferably 0.1 to 5 mol%, more preferably 0.5 to 3 mol%, relative to the total 100 mol% of unit A, unit B, and unit C. preferable.
• the total content of unit A and unit B is preferably 30.1 to 85 mol%, preferably 35 to 75 mol%, relative to the total 100 mol% of unit A, unit B, and unit C. is more preferred.
• the total content of the units A and B is 30.1 mol% or more, the dispersibility of the inorganic filler is further improved.
• the unit C can be contained in the copolymer in a sufficient content.
• the molar ratio of unit A to unit B is preferably 6-800, more preferably 20-400.
• the dispersibility of the inorganic filler tends to be further improved.
• the content of unit C is preferably 20 to 70 mol%, more preferably 30 to 55 mol%, relative to the total 100 mol% of unit A, unit B, and unit C.
• the content of unit C is preferably 20 to 70 mol%, more preferably 30 to 55 mol%, relative to the total 100 mol% of unit A, unit B, and unit C.
• the weight average molecular weight of the copolymer is preferably 40,000 to 80,000, more preferably 50,000 to 70,000.
• the weight-average molecular weight of the copolymer is 40,000 or more, the inorganic filler is less likely to aggregate due to the steric hindrance repulsive force of the copolymer, and the dispersibility of the inorganic filler in the resin composition is further improved.
• the weight average molecular weight of the copolymer is 80,000 or less, it becomes easier to dissolve the copolymer in the resin or solvent.
• the weight average molecular weight can be determined by GPC (gel permeation chromatography).
• the copolymer is preferably a copolymer represented by the following general formula (1).
• the copolymer represented by formula (1) may be a random copolymer or a block copolymer.
• the unit A of the copolymer represented by the following general formula (1) is derived from acrylic acid, and the anionic group is a carboxy group.
• the unit B of the copolymer represented by the following general formula (1) is derived from 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, and the cationic group is a tertiary amino group. be.
• the unit C of the copolymer represented by the following general formula (1) is derived from ⁇ -butyl- ⁇ -(3-methacryloxypropyl)polydimethylsiloxane and has a siloxane skeleton.
• s is, when the weight average molecular weight of the copolymer is 40,000 to 80,000, the content of unit A is 30 to 30 to 100 mol% of the total of unit A, unit B, and unit C t is an integer such that it is 80 mol %, and t is the total content of unit A, unit B, and unit C when the weight average molecular weight of the copolymer is 40,000 to 80,000 is an integer such that it is 20 to 70 mol% with respect to 100 mol%, u is when the weight average molecular weight of the copolymer is 40,000 to 80,000, the content of unit B is unit A, It is an integer such that it is 0.1 to 5.0 mol % with respect to 100 mol % of the total of units B and C. Further, v is an integer such that the weight average molecular weight of unit C is 2,000 to 9,000.
• the above copolymer Since the above copolymer has a relatively large weight average molecular weight, it has many anchor portions that adsorb to inorganic fillers. Therefore, it has good adsorption properties even for inorganic fillers such as boron nitride, which have stable surfaces and poor reactivity. have Therefore, the copolymer can sufficiently improve the dispersibility of the inorganic filler with a stable surface such as boron nitride, and is more suitable for the surface treatment of the inorganic filler with a stable surface such as boron nitride. Used.
• the method for producing the above copolymer is not particularly limited, and a known polymerization method for (meth)acrylic monomers can be used.
• Examples of the polymerization method include radical polymerization and anionic polymerization. Among these, radical polymerization is preferred.
• the thermal polymerization initiator used for radical polymerization is not particularly limited, and examples thereof include azo compounds such as azobisisobutyronitrile; organic peroxides such as benzoyl peroxide, tert-butyl hydroperoxide and di-tert-butyl peroxide; things, etc.
• the photopolymerization initiator used for radical polymerization is not particularly limited, but a benzoin derivative can be used.
• known polymerization initiators used for living radical polymerization such as ATRP and RAFT can also be used.
• the polymerization conditions are not particularly limited, and can be appropriately adjusted depending on the initiator used, the boiling point of the solvent, and the type of other monomers.
• the order of addition of the monomers is not particularly limited.
• the monomers may be mixed to initiate polymerization.
• the monomers may be added sequentially to the polymerization system.
• the content of the copolymer in the inorganic filler is preferably 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, and 0.10 to 6% by mass. More preferred.
• the content of the copolymer in the inorganic filler is 0.01% by mass or more, the zeta potential of the inorganic filler at a pH of 7 can be easily set to -15 mV or less.
• the content of the copolymer is 10% by mass or less, it is possible to suppress a decrease in the thermal conductivity of the inorganic filler that accompanies an increase in the content of the copolymer.
• the heat dissipating member of this embodiment contains the inorganic filler and resin of this embodiment, and may contain any additive as necessary.
• the heat dissipating member of the present embodiment can uniformly disperse the inorganic filler in the resin, and as a result, the inorganic filler can be highly filled in the heat dissipating member. , the thermal conductivity of the heat dissipation member can be further improved.
• the content of the inorganic filler is preferably 45-90% by volume, more preferably 55-85% by volume, based on the total 100% by volume of the inorganic filler and resin.
• the content of the inorganic filler is 45% by volume or more, the thermal conductivity of the heat dissipating member tends to be further improved.
• the content of the inorganic filler is 90% by volume or less, the dispersibility of the inorganic filler in the heat dissipating member is improved.
• the resin is not particularly limited, but examples include thermosetting resins such as silicone resins, epoxy resins, phenol resins, cyanate resins, melamine resins, urea resins, thermosetting polyimides, and unsaturated polyester resins; acrylic resins and polyolefin resins. , polycarbonate resins, polyester resins, vinyl chloride resins, urethane resins, polyamide resins, and ABS (acrylonitrile-butadiene-styrene) resins. Among these, one or more resins selected from the group consisting of silicone-based resins and epoxy-based resins are preferable.
• Optional additives are not particularly limited, but include, for example, silane coupling agents, antioxidants, and metal corrosion inhibitors.
• the heat dissipating member of the present embodiment can be manufactured by molding a resin composition obtained by kneading an inorganic filler and a resin using, for example, a planetary stirrer, a universal mixer, a kneader, a hybrid mixer, or the like. can be done.
• the heat dissipation member of this embodiment is arranged, for example, between the electronic component and the heat sink. Thereby, it is possible to suppress the generation of a gap between the electronic component and the heat sink. As a result, heat generated by the electronic component can be efficiently conducted to the heat sink.
• the electronic parts are not particularly limited, but include, for example, motors, battery packs, circuit boards used in in-vehicle power supply systems, power transistors, and heat-generating electronic parts such as microprocessors. Among these, electronic parts used in vehicle-mounted power supply systems are preferable.
• the heat sink is not particularly limited as long as it is a component configured for the purpose of heat radiation or heat absorption.
• the heat dissipating member of the present embodiment is not particularly limited as long as it contains the inorganic filler and resin of the present embodiment, but is preferably a heat dissipating sheet.
• the heat-dissipating sheet can be produced, for example, by sheet-molding a resin composition slurry containing the inorganic filler of the present embodiment, a resin, and a solvent by a doctor blade method.
• Copolymer 1 The copolymer was prepared by the following method. First, acrylic acid: 48.4 mol%, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate: 1.6 mol%, ⁇ -butyl- ⁇ -(3- 100 parts by mass of a (meth)acrylic monomer consisting of 50.0 mol % of methacryloxypropyl)polydimethylsiloxane (weight average molecular weight: 5,000) was added.
• acrylic acid 48.4 mol%
• 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate 1.6 mol%
• ⁇ -butyl- ⁇ -(3- 100 parts by mass of a (meth)acrylic monomer consisting of 50.0 mol % of methacryloxypropyl)polydimethylsiloxane (weight average molecular weight: 5,000) was added.
• the polymerization rate for 100% of the charged amount of monomer was 98% or more when analyzed by gas chromatography analysis. From this, it was estimated that the ratio of each monomer unit in the copolymer was approximately the same as the charging ratio of the monomers.
• the weight average molecular weight of the obtained copolymer 1 was obtained as a weight average molecular weight in terms of standard polystyrene using GPC (gel permeation chromatography) method.
• the measurement conditions are as follows. High-speed GPC device: "HLC-8020" manufactured by Tosoh Corporation Column: Tosoh Corporation "TSK guardcolumn MP (x L)" 6.0 mm ID ⁇ 4.0 cm 1 piece, and Tosoh Corporation "TSK-GELMULTIPOREHXL-M” 7.8 mm ID ⁇ 30.0 cm (theoretical plate number 16,000 plates ) 2, 3 in total (32,000 theoretical plates in total) Developing solvent: Tetrahydrofuran Detector: RI (differential refractometer)
• the polymerization rate of the obtained copolymer 2 was 98% or more, and the ratio of each monomer unit in the copolymer was estimated to be approximately the same as the charging ratio of the monomers. Also, the weight average molecular weight was determined in the same manner as described above. Since the weight average molecular weight of ⁇ -butyl- ⁇ -(3-methacryloxypropyl)polydimethylsiloxane was 10,000, the weight average molecular weight of unit C is 10,000.
• Copolymer 3 is a high-molecular amine compound ("Esleem AD-374M” manufactured by NOF Corporation).
• composition of the monomers shown in Table 1 is expressed in molar ratio (%).
• the molar ratio was calculated from the added amount and molecular weight of each monomer. Also, the molar ratio of ⁇ -butyl- ⁇ -(3-methacryloxypropyl)polydimethylsiloxane was calculated based on the weight average molecular weight.
• compositions and weight-average molecular weights of copolymers 1 and 2 synthesized as described above are shown in Table 1 below.
• Inorganic filler 2 Inorganic filler 2 was obtained in the same manner as inorganic filler 1, except that the blending amount of copolymer 1 was changed from 2 parts by mass to 5 parts by mass.
• Inorganic filler 3 (Inorganic filler 3) Inorganic filler 3 was obtained in the same manner as inorganic filler 1 except that copolymer 1 was changed to copolymer 2.
• Inorganic filler 4 Inorganic filler 3 was obtained in the same manner as inorganic filler 1 except that copolymer 1 was changed to copolymer 3.
• Inorganic filler 5 was made of boron nitride that was not subjected to the surface treatment described above.
• inorganic fillers Physical properties of inorganic fillers were measured by the following methods.
• Zeta potential The zeta potential of the inorganic filler was measured by electrophoresis.
• the electrophoretic velocity was measured by laser Doppler method.
• a sample for measurement was prepared.
• the pH of the measurement sample was measured using a pH meter ("pH meter D-51" manufactured by Horiba, Ltd.).
• the specific surface area of the inorganic filler was measured by the BET one-point method using a specific surface area measuring device (Cantersorb, manufactured by Yuasa Ionics). In the measurement, 1 g of the sample was dried and degassed at 300° C. for 15 minutes before being subjected to the measurement.
• the average particle size of the inorganic filler was measured using a "laser diffraction particle size distribution analyzer SALD-20" manufactured by Shimadzu Corporation. An evaluation sample was obtained by adding 50 ml of pure water and 5 g of an inorganic filler to be measured to a glass beaker, stirring with a spatula, and then performing dispersion treatment with an ultrasonic cleaner for 10 minutes. The dispersed liquid of the inorganic filler subjected to the dispersion treatment was added drop by drop to the sampler section of the device using a dropper, and the measurement was performed when the absorbance was stabilized. D50 (median diameter) was adopted as the average particle size.
• Heat-dissipating sheet 1 Inorganic filler 1 and silicone resin (main agent (manufactured by Momentive, trade name “TSE3033 (A)”) and curing agent (manufactured by Momentive, trade name “TSE3033 (B)”) mixed at 1:1 (mass ratio)) 50% by volume of inorganic filler and 50% by volume of silicone resin for a total of 100% by volume, and 50% by mass of toluene with respect to a total of 100% by mass of the above raw materials are added to a stirrer (manufactured by HEIDON, trade name " Three one motor”) and mixed for 15 hours using a turbine type stirring blade to prepare a slurry of the resin composition.
• a stirrer manufactured by HEIDON, trade name " Three one motor
• the slurry is coated on a PET film (carrier film) with a thickness of 0.05 mm to a thickness of 0.5 mm, dried at 75 ° C. for 5 minutes, and formed into a sheet with a PET film. made the body.
• a PET film was laminated on the resin composition surface of the sheet-shaped molding with the PET film to prepare a laminate.
• the obtained laminate is subjected to a heat press for 1 hour under vacuum (pressure 3.5 kPa) at a temperature of 150 ° C. and a pressure of 15 MPa, and the PET film on both sides is peeled off to a thickness of 0.3 mm. sheet. Subsequently, it was subjected to secondary heating at normal pressure and 150° C. for 4 hours to obtain heat-dissipating sheet 1 .
• Heat-dissipating sheet 2 was produced in the same manner as heat-dissipating sheet 1 except that inorganic filler 2 was used instead of inorganic filler 1 .
• Heat-dissipating sheet 3 was produced in the same manner as heat-dissipating sheet 1 except that inorganic filler 3 was used instead of inorganic filler 1 .
• Heat-dissipating sheet 4 was produced in the same manner as heat-dissipating sheet 1 except that inorganic filler 4 was used instead of inorganic filler 1 .
• Heat-dissipating sheet 5 was produced in the same manner as heat-dissipating sheet 1 except that inorganic filler 5 was used instead of inorganic filler 1 .
• the dispersibility of the inorganic filler was evaluated by the relative density of the heat dissipation sheet. If the dispersibility of the inorganic filler is poor, the inorganic filler is agglomerated with each other, so that the resin does not wet and spread between the particles, leaving voids, which lowers the relative density.
• the dispersibility of the inorganic filler is evaluated as good ( ⁇ ), and when the relative density of the heat-dissipating sheet is less than 95%, the dispersibility of the inorganic filler is evaluated as poor ( ⁇ ). and evaluated.
• the relative density of the heat dissipation sheet is calculated by the following formula.
• Relative density density of heat-dissipating sheet/theoretical density of heat-dissipating sheet
• the density of the heat-dissipating sheet was measured by the Archimedes method. Specifically, an electronic balance was used to measure the weight of the heat-dissipating sheet in air and the weight of the heat-dissipating sheet in water. Then, the density was calculated by the following formula.
• the dispersibility of the inorganic filler in the heat dissipation sheet can be improved by setting the zeta potential to -15 mV or less when the pH of the inorganic filler is 7.
• the dispersibility of the inorganic filler in the heat-dissipating sheet deteriorates when the zeta potential of the inorganic filler at a pH of 7 is greater than -15 mV.

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