CN118234794A - 无机填料及散热构件 - Google Patents

无机填料及散热构件 Download PDF

Info

Publication number
CN118234794A
CN118234794A CN202280075815.9A CN202280075815A CN118234794A CN 118234794 A CN118234794 A CN 118234794A CN 202280075815 A CN202280075815 A CN 202280075815A CN 118234794 A CN118234794 A CN 118234794A
Authority
CN
China
Prior art keywords
inorganic filler
meth
unit
copolymer
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280075815.9A
Other languages
English (en)
Chinese (zh)
Inventor
和田光祐
深尾健司
小野冢正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN118234794A publication Critical patent/CN118234794A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/06Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04Homopolymers or copolymers of monomers containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/32Thermal properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • C08K2003/382Boron-containing compounds and nitrogen
    • C08K2003/385Binary compounds of nitrogen with boron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/006Additives being defined by their surface area
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/08Ingredients agglomerated by treatment with a binding agent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2310/00Masterbatches

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280075815.9A 2021-11-17 2022-11-10 无机填料及散热构件 Pending CN118234794A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-186964 2021-11-17
JP2021186964 2021-11-17
PCT/JP2022/041856 WO2023090241A1 (ja) 2021-11-17 2022-11-10 無機フィラー及び放熱部材

Publications (1)

Publication Number Publication Date
CN118234794A true CN118234794A (zh) 2024-06-21

Family

ID=86396926

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280075815.9A Pending CN118234794A (zh) 2021-11-17 2022-11-10 无机填料及散热构件

Country Status (5)

Country Link
US (1) US20250002771A1 (https=)
EP (1) EP4417645A1 (https=)
JP (1) JP7392204B2 (https=)
CN (1) CN118234794A (https=)
WO (1) WO2023090241A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070180A1 (ja) * 2023-09-26 2025-04-03 株式会社レゾナック 窒化アルミニウムフィラー、窒化アルミニウムフィラーの製造方法、樹脂組成物、及び樹脂組成物の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1190352B (it) * 1985-04-05 1988-02-16 Montefluos Spa Procedimento per la produzione di un materiale composito a base di una matrice polimerica
US5663224A (en) * 1991-12-03 1997-09-02 Rohm And Haas Company Process for preparing an aqueous dispersion
JP2001192500A (ja) * 2000-01-12 2001-07-17 Edison Polymer Innovation Corp 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法
JP5781366B2 (ja) 2011-05-16 2015-09-24 東洋アルミニウム株式会社 樹脂被覆メタリック顔料
JP2013126287A (ja) * 2011-12-14 2013-06-24 Mitsubishi Electric Corp 高放熱性モータおよびその製造方法
JP6093213B2 (ja) * 2013-03-15 2017-03-08 株式会社トクヤマデンタル 無機凝集粒子、有機無機複合フィラー、及びそれらの製造方法
JP7009753B2 (ja) * 2017-03-16 2022-01-26 住友ゴム工業株式会社 空気入りタイヤ
KR102338611B1 (ko) * 2017-07-14 2021-12-13 후지필름 가부시키가이샤 표면 수식 무기 질화물, 조성물, 열전도 재료, 열전도층 부착 디바이스
JP7348745B2 (ja) * 2019-04-25 2023-09-21 株式会社日本触媒 複合体の製造方法
WO2021070690A1 (ja) 2019-10-07 2021-04-15 Jfeスチール株式会社 窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂材料、および樹脂材料の製造方法
KR102291138B1 (ko) * 2020-01-13 2021-08-23 엔트리움 주식회사 방열 및 절연 특성을 갖는 페이스트 제조 방법

Also Published As

Publication number Publication date
EP4417645A1 (en) 2024-08-21
WO2023090241A1 (ja) 2023-05-25
US20250002771A1 (en) 2025-01-02
JP7392204B2 (ja) 2023-12-05
JPWO2023090241A1 (https=) 2023-05-25

Similar Documents

Publication Publication Date Title
TWI742609B (zh) 共聚物、分散劑、及樹脂組合物
JP7466062B2 (ja) 共重合体、界面活性剤、樹脂組成物及び放熱シート
TWI905389B (zh) 含有具有聚氧伸烷基鏈之化合物及(甲基)丙烯醯胺化合物之組成物
JP7144644B2 (ja) 熱伝導性樹脂組成物及び電子機器
TWI905388B (zh) 含有具有聚氧伸烷基鏈之化合物及具有聚(甲基)丙烯酸酯鏈之化合物之組成物
CN118234794A (zh) 无机填料及散热构件
JP7764581B2 (ja) 二液硬化型組成物セット、硬化物及び電子機器
JP7144645B2 (ja) 熱伝導性樹脂組成物及び電子機器
JP7262699B1 (ja) 放熱グリース
JP7577126B2 (ja) 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
WO2024171646A1 (ja) 二液硬化型組成物セット、硬化物及び電子機器
CN118900897A (zh) 树脂组合物、绝缘性树脂固化体、层叠体、及电路基板
WO2023090240A1 (ja) 放熱グリース
WO2024204366A1 (ja) 放熱グリース
WO2024204398A1 (ja) 放熱グリース
JP7676022B2 (ja) 熱伝導シート
WO2024204365A1 (ja) 放熱グリース
WO2024042956A1 (ja) 放熱グリース
JP2023064208A (ja) 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
JP2023095001A (ja) 組成物及び放熱シート
WO2024247845A1 (ja) 熱伝導性放熱組成物及び電子機器
WO2024042955A1 (ja) 放熱グリース
WO2023190439A1 (ja) 二液硬化型組成物セット、硬化物及び電子機器
WO2025205291A1 (ja) 熱伝導性スペーサー及び熱伝導性組成物
JP2020090556A (ja) 熱伝導性シート

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination