WO2023087454A1 - 电源管理芯片数据配置方法、配置架构及显示面板 - Google Patents

电源管理芯片数据配置方法、配置架构及显示面板 Download PDF

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Publication number
WO2023087454A1
WO2023087454A1 PCT/CN2021/138188 CN2021138188W WO2023087454A1 WO 2023087454 A1 WO2023087454 A1 WO 2023087454A1 CN 2021138188 W CN2021138188 W CN 2021138188W WO 2023087454 A1 WO2023087454 A1 WO 2023087454A1
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Prior art keywords
power management
management chip
board
architecture
configuration
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PCT/CN2021/138188
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English (en)
French (fr)
Inventor
王凯
Original Assignee
惠州华星光电显示有限公司
Tcl华星光电技术有限公司
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Priority to US17/623,561 priority Critical patent/US20240045600A1/en
Publication of WO2023087454A1 publication Critical patent/WO2023087454A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601—Interfaces specially adapted for storage systems
    • G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
    • G06F3/0625—Power saving in storage systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601—Interfaces specially adapted for storage systems
    • G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
    • G06F3/0629—Configuration or reconfiguration of storage systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601—Interfaces specially adapted for storage systems
    • G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
    • G06F3/0655—Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601—Interfaces specially adapted for storage systems
    • G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
    • G06F3/0671—In-line storage system
    • G06F3/0673—Single storage device
    • G06F3/0679—Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F8/00—Arrangements for software engineering
    • G06F8/70—Software maintenance or management
    • G06F8/76—Adapting program code to run in a different environment; Porting
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters

Definitions

  • the invention relates to the field of display technology, in particular to a power management chip data configuration method, a configuration framework and a display panel.
  • the driver board flash memory or the charged erasable programmable read-only memory (EEPROM) on the driver board (X-Board).
  • EEPROM charged erasable programmable read-only memory
  • TCON timing control chip
  • TCON When TCON is applied in different models, it is necessary to select which memory to load according to the architecture type of the current model (C-Board Flash, X-Board Flash or EEPROM), and change the storage address of the PMIC data in the memory according to the size of the memory, so that multiple modifications will be involved when preparing the TCON code (Code) for different models.
  • the type of PMIC when the type of PMIC is different, the device address and register address of the PMIC will also change, and the TCON Code needs to be modified accordingly. When the number of models increases, these situations will affect the TCON Code maintenance brings trouble.
  • the embodiment of the present application provides a power management chip data configuration method, configuration architecture and display panel to solve the problem of difficulty in transplanting TCON Code between different models.
  • An embodiment of the present application provides a data configuration method for a power management chip, including:
  • the step of reading the configuration information to confirm the circuit board architecture type further includes: determining whether the circuit board architecture type is a split architecture; if the determination result is no, confirming that the circuit board architecture type is a combined architecture.
  • the step of reading the configuration information to confirm the circuit board architecture type further includes: determining whether the circuit board architecture type is a split architecture; if the determination result is yes, confirming that the circuit board architecture type is a split architecture.
  • the step of reading the configuration information to confirm the circuit board architecture type further includes: confirming the type of the drive board storage module according to the type information of the drive board storage module in the configuration information.
  • the step of reading the configuration information to confirm the circuit board architecture type further includes: checking the configuration information and/or the modification of the configuration data of the power management chip according to the cyclic redundancy check value in the configuration information.
  • the embodiment of the present application also provides a power management chip data configuration framework, including: a circuit board; a storage module, set on the circuit board, the storage module stores configuration information and power management chip configuration data, the The configuration information includes circuit board architecture type information for displaying the circuit board architecture type; the reading loading module is arranged on the circuit board, and the reading loading module is electrically connected to the storage module to read configuration information and load The power management chip configuration data; the power management chip is arranged on the circuit board, the power management chip is electrically connected to the reading and loading module, and the reading and loading module configures the data by the power management chip Configured to the power management chip to realize configuration of data in the power management chip.
  • the circuit board includes a control board and a driver board; the structure type of the circuit board is a combined structure or a separated structure.
  • the merged architecture is that the control board and the driver board are merged, the storage module is a flash memory of the control board, and the configuration information and the configuration data of the power management chip are stored in the flash memory of the control board. at least one sector.
  • the separated architecture is that the control board and the driver board are separated; the storage module includes a control board flash memory arranged on the control board and a driver board storage module arranged on the driver board
  • the reading and loading module is arranged on the control board, and the flash memory of the control board and the storage module of the driving board are respectively electrically connected to the reading and loading module.
  • the configuration information is stored in at least one sector of the flash memory of the control board; the configuration information stores driver board storage module type information for displaying the type of the driver board storage module; the power management Chip configuration data is stored in the drive board storage module.
  • An embodiment of the present application further provides a display panel, the display panel includes a power management chip and the power management chip data configuration structure described above, and the power management chip data configuration structure is electrically connected to the power management chip.
  • the provided power management chip data configuration method stores the configuration information in the storage module of the circuit board, so that after the circuit board is powered on, the reading loading module first reads the configuration information, reads the loading module Determine the circuit board architecture type according to the circuit board architecture type information contained in the configuration information, read the loading module to load the power management chip configuration data from the storage module corresponding to the circuit board architecture, and then configure the loaded power management chip configuration data to Power management chip, so as to reduce the number of rewriting times of reading and loading module codes between different machine architectures; the same configuration format is adopted for each reading and loading module model, which is convenient for the transplantation of storage modules or reading and loading modules between different models. Different models only need to rewrite the configuration information, and the reading and loading module will take corresponding actions according to the corresponding settings, which is convenient for product management and control.
  • FIG. 1 is a schematic structural diagram of a combined architecture
  • FIG. 2 is a schematic structural diagram of a split architecture
  • FIG. 3 is a flow chart of a method for configuring power management chip data in an exemplary embodiment of the present invention
  • FIG. 4 is a flow chart of a method for configuring power management chip data in an exemplary embodiment of the present invention
  • FIG. 5 is a flow chart of a data configuration method for a power management chip in an exemplary embodiment of the present invention
  • the power management chip data configuration method stores configuration information in the storage module of the circuit board, so that after the circuit board is powered on, the reading and loading module first reads the configuration information, and the reading and loading module reads the configuration information according to the circuit included in the configuration information.
  • the board architecture type information determines the circuit board architecture type, and the reading loading module loads the power management chip configuration data from the storage module corresponding to the circuit board architecture, and then configures the loaded power management chip configuration data to the power management chip, thereby reducing the number of different machine configurations.
  • the power management chip data configuration method can be applied to display panels, such as TFT For an LCD liquid crystal display panel, the data in the power management chip of the display panel is configured by using the above power management chip data configuration method.
  • the display panel can be applied to a mobile terminal, and the mobile terminal includes a terminal body and a display panel.
  • the above-mentioned mobile terminal can be any product or component with realistic functions such as a mobile phone, a tablet computer, a television set, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.
  • the configuration framework 100 includes a circuit board 110, a storage module 120, and a reading and loading module 130.
  • the storage module 120 is arranged on the circuit board 110, and configuration information and power management chip configuration data are stored in the storage module 120.
  • the configuration information includes circuit board architecture type information
  • the reading loading module 130 is arranged on the circuit board 110, and the reading loading module 130 is connected to the storage module 120, so as to read the loading module after the circuit board 110 is powered on.
  • 130 reads the configuration information in the storage module 120 to confirm the circuit board architecture type, and after confirming the circuit board architecture type, the reading and loading module 130 loads the configuration data of the power management chip from the corresponding storage module.
  • the power management chip 140 When performing data configuration on the power management chip 140, the power management chip 140 is arranged on the circuit board 110, the power management chip 140 is electrically connected to the reading loading module 130, and the reading loading module 130 configures the loaded power management chip configuration data.
  • the power management chip 140 generates various operating voltages required for the operation of the display panel (not shown in the figure) according to the received configuration data of the power management chip, such as the digital operating voltage provided to each chip in the display panel (DVDD), the analog voltage (AVDD) provided to the gamma chip and VCOM circuit, the gate open voltage (Vgh or Von) and the close voltage (Vgl or Voff) provided to the scan driver integrated circuit, etc.
  • the circuit board 110 includes a control board (C-Borard) 111 and a driver board (X-Board) 112.
  • the circuit board architecture type is a combined architecture or a separate architecture. Referring to FIG. 1, the integrated architecture Among them, the control board 111 and the driving board 112 are combined to form a circuit board 110, the storage module 120 is a control board flash memory 121 arranged on the circuit board 110, the power management chip configuration data is stored in the control board flash memory 121, and the power management chip 140 is set in On the circuit board 110; with reference to Fig.
  • the control board 111 and the driver board 112 are separated to form the circuit board 110, and the storage module 120 includes a control board flash memory 121' arranged on the control board 111 and a control board flash memory 121' arranged on the driver board 112.
  • the driver board storage module 1121, the reading loading module 130 is arranged on the control board 111, the power management chip 140 is arranged on the control board 111, the driving board 112 is connected with the reading loading module 130 through the driving board storage module 1121, the power management chip Configuration data is stored in the driver board storage module 1121 .
  • the reading and loading module 130 is a chip having a reading function and a data loading function, and in this embodiment, the reading and loading module 130 is a timing control chip (TCON).
  • TCON timing control chip
  • the configuration information is stored in a fixed location in the control board flash memory 121 , for example, in the last sector of the control board flash memory 121 .
  • the configuration information also includes type information recording the type of the driver board storage module 1121, the type of the driver board storage module 1121 is the driver board flash memory (X-Board Flash) (not shown in the figure) or the charged erasable programmable only Read memory (EEPROM) (not shown in the figure), the read and load module 130 reads the type information to confirm the type of the drive board storage module.
  • X-Board Flash driver board flash memory
  • EEPROM charged erasable programmable only Read memory
  • the method for configuring data of a power management chip using the configuration architecture 100 provided in this embodiment includes the following steps:
  • the circuit board 110 is powered on
  • the reading loading module 130 reads the circuit board architecture type information in the configuration information in the control board flash memory 121;
  • the reading and loading module 130 determines whether the circuit board structure is a split structure according to the type information of the circuit board structure
  • the reading loading module 130 loads the power management chip configuration data from the control board flash memory 121;
  • Reading and loading module 130 configures the loaded power management chip configuration data to power management chip 140;
  • the data configuration of the power management chip 140 is completed.
  • the reading and loading module 130 If the judgment result of the reading and loading module 130 is yes (indicating that the architecture type is a separate architecture), the reading and loading module 130 reads the type information of the driver board storage module in the configuration information, and determines the type of the driver board storage module;
  • the reading and loading module 130 determines that the drive board storage module type is the drive board flash memory, the reading and loading module 130 loads the second power management chip configuration data from the drive board flash memory through the SPI bus;
  • the reading and loading module 130 configures the loaded second power management chip configuration data to the power management chip 140;
  • the data configuration of the power management chip 140 is completed.
  • the reading loading module 130 determines that the type of the drive board storage module is a charged erasable programmable read-only memory, the reading loading module 130 loads the configuration data of the second power management chip from the charged erasable programmable read-only memory through the I2C bus;
  • the reading and loading module 130 configures the loaded second power management chip configuration data to the power management chip 140;
  • the data configuration of the power management chip 140 is completed.
  • the configuration information also includes power management chip address information and power management chip configuration data length information
  • the read loading module 130 reads the power management chip address information and power supply information in the configuration information.
  • Manage the chip configuration data length information generate the configuration code (Code) of the corresponding power management chip (PMIC), so that when the reading and loading module 130 configures the loaded configuration data to the power management chip 140, it can be configured according to the configuration code of the power management chip Corresponding length of power management chip configuration data.
  • the power management chip 140 is provided with a register 141 , and the reading and loading module 130 configures the generated configuration code (Code) of the power management chip (PMIC) into the register 141 .
  • the configuration information also includes the power management chip configuration data Disable Code (Disable Code). If the judgment result of reading the loading module 130 is yes (indicating that the architecture type is a separate architecture), The reading and loading module 130 reads the power management chip configuration data Disable code in the configuration information, the reading and loading module 130 loads the power management chip configuration data from the control board flash memory 121, and configures the loaded power management chip configuration data to the power management chip 140. Complete data configuration of the power management chip 140.
  • Disable Code Disable Code
  • the second power management chip configuration data Disable code is added in the configuration information, so that when the circuit board architecture type is a split architecture, the reading and loading module 130 does not load the power management from the driver board storage module 1121 chip configuration data, but load the power management chip configuration data from the control board flash memory 121 to meet the requirements of different machine types.
  • the configuration information also includes a cyclic redundancy (CRC) check value to reflect information changes in the configuration information.
  • CRC cyclic redundancy
  • the power management chip data configuration method and configuration framework provided by the present invention reduce the number of TCON Code rewrites between different models by setting the configuration information mechanism; the same configuration format is used for each TCON model, which is convenient for different models. Transplantation; only need to rewrite the configuration information on different models, TCON will take corresponding actions according to the corresponding settings to facilitate product management and control.
  • the domain (Disable Code) for other function selection can be added in the configuration information to facilitate the maintenance of the configuration information.
  • the model information will be reflected in the configuration information, and the cyclic redundancy (CRC) check value will be added to the configuration information. When there is any change in the PMIC data or model information, it can be reflected from the cyclic redundancy (CRC) check value Come out to facilitate the maintenance of PMIC data and model information.

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Abstract

本申请公开了一种电源管理芯片数据配置方法、配置架构及显示面板，所述数据配置方法可减少不同机种架构间读取加载模块代码的改写次数；采用相同的配置格式，方便存储模块或读取加载模块在不同机种间的移植，在不同的机种上只需要改写配置信息，读取加载模块会根据对应的设定采取相对应的动作，方便对产品的管控。

Description

电源管理芯片数据配置方法、配置架构及显示面板 技术领域
本发明涉及显示技术领域，特别涉及一种电源管理芯片数据配置方法、配置架构及显示面板。
 背景技术
在显示面板驱动电路中，需要对电源管理芯片(PMIC)中的数据进行配置，PMIC的配置数据主要存储在控制板（C-Board）上的控制板闪存、驱动板（X-Board）上的驱动板闪存或驱动板（X-Board）上的带电可擦可编程只读存储器（EEPROM）中。当前显示设备（机种）主要有两种架构，X-Board、C-Board分离的分离式架构和X-Board、C-Board合并的合并式架构。对于合并式架构，只存在C-Board Flash，时序控制芯片（TCON）会将C-Board Flash中的数据配置到PMIC；对于分离式架构，TCON会优先将X-Board Flash或X-Board EEPROM中的数据配置到PMIC。
由于TCON在不同机种中应用时，需要根据当前机种的架构类型来选择加载哪个存储器（C-Board Flash、X-Board Flash或EEPROM）中的数据，同时根据存储器的大小来改变PMIC数据在存储器内的存储地址，这样在为不同机种准备TCON代码（Code）时会涉及到多次修改。此外，当PMIC的类型不一样时，PMIC的器件地址和寄存器地址会也会有改动，也需要对TCON Code做相应修改。当机种数量增多时，这些情况就会对TCON Code维护带来麻烦。
 技术问题
本申请实施例提供一种电源管理芯片数据配置方法、配置架构及显示面板，以解决在不同机种之间TCON Code移植困难的问题。
 技术解决方案
本申请实施例提供了一种电源管理芯片数据配置方法，包括：
读取配置信息以确认电路板架构类型；
加载电源管理芯片配置数据；以及
将所加载的电源管理芯片配置数据配置到电源管理芯片。
可选的，所述读取配置信息以确认电路板架构类型的步骤还包括：判定电路板架构类型是否为分离式架构；若判定结果为否，确认所述电路板架构类型为合并式架构。
可选的，所述读取配置信息以确认电路板架构类型的步骤还包括：判定电路板架构类型是否为分离式架构；若判定结果为是，确认所述电路板架构类型为分离式架构。
可选的，所述读取配置信息以确认电路板架构类型的步骤还包括：根据所述配置信息中的驱动板存储模块类型信息确认驱动板存储模块的类型。
可选的，所述读取配置信息确认电路板架构类型的步骤还包括：根据所述配置信息中的循环冗余校验值查看所述配置信息和/或电源管理芯片配置数据的改动。
本申请的实施例还提供一种电源管理芯片数据配置架构，包括：电路板；存储模块，设置于所述电路板上，所述存储模块内存储有配置信息和电源管理芯片配置数据，所述配置信息包括用于显示电路板架构类型的电路板架构类型信息；读取加载模块，设置于所述电路板上，所述读取加载模块与所述存储模块电连接以读取配置信息和加载所述电源管理芯片配置数据；电源管理芯片，设置于所述电路板上，所述电源管理芯片与所述读取加载模块电连接，所述读取加载模块通过将所述电源管理芯片配置数据配置到所述电源管理芯片以实现对所述电源管理芯片内数据的配置。
可选的，所述电路板包括控制板和驱动板；所述电路板架构类型为合并式架构或分离式架构。
可选的，所述合并式架构为所述控制板和所述驱动板合并，所述存储模块为控制板闪存，所述配置信息和所述电源管理芯片配置数据存储于所述控制板闪存的至少一个扇区内。
可选的，所述分离式架构为所述控制板和所述驱动板分离；所述存储模块包括设置于所述控制板上的控制板闪存和设置于所述驱动板上的驱动板存储模块，所述读取加载模块设置于所述控制板上，所述控制板闪存和所述驱动板存储模块分别与所述读取加载模块电连接。
可选的，所述配置信息存储于所述控制板闪存的至少一个扇区内；所述配置信息内存储有用于显示所述驱动板存储模块类型的驱动板存储模块类型信息；所述电源管理芯片配置数据存储于所述驱动板存储模块内。
本申请的实施例还提供一种显示面板，所述显示面板包括电源管理芯片和如前所述的电源管理芯片数据配置架构，所述电源管理芯片数据配置架构与所述电源管理芯片电连接。
 有益效果
本申请的有益效果为：所提供的电源管理芯片数据配置方法通过在电路板的存储模块内存储配置信息，从而在电路板上电后，读取加载模块首先读取配置信息，读取加载模块根据配置信息中所包含的电路板架构类型信息确定电路板架构类型，读取加载模块从与电路板架构对应的存储模块中加载电源管理芯片配置数据，然后将加载的电源管理芯片配置数据配置到电源管理芯片，从而减少不同机种架构间读取加载模块代码的改写次数；在各个读取加载模块型号采用相同的配置格式，方便存储模块或读取加载模块在不同机种间的移植，在不同的机种上只需要改写配置信息，读取加载模块会根据对应的设定采取相对应的动作，方便对产品的管控。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1是合并式架构的结构示意图；
图2是分离式架构的结构示意图；
图3是采用本发明一示例性实施例中的电源管理芯片数据配置方法的流程图；
图4是采用本发明一示例性实施例中的电源管理芯片数据配置方法的流程图；
图5是采用本发明一示例性实施例中的电源管理芯片数据配置方法的流程图；
图中部件编号如下：
100、配置架构，110、电路板，111、控制板，112、驱动板，1121、驱动板存储模块，120、存储模块，121、121’、驱动板闪存，130、读取加载模块，140、电源管理芯片，141、寄存器。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
所述电源管理芯片数据配置方法通过在电路板的存储模块内存储配置信息，从而在电路板上电后，读取加载模块首先读取配置信息，读取加载模块根据配置信息中所包含的电路板架构类型信息确定电路板架构类型，读取加载模块从与电路板架构对应的存储模块中加载电源管理芯片配置数据，然后将加载的电源管理芯片配置数据配置到电源管理芯片，从而减少不同机种架构间TCON 代码的改写次数；在各个TCON型号采用相同的配置格式，方便存储模块或TCON在不同机种间的移植，在不同的机种上只需要改写配置信息，TCON会根据对应的设定采取相对应的动作，方便对产品的管控。作为典型应用，所述电源管理芯片数据配置方法可应用于显示面板，例如TFT LCD液晶显示面板，采用上述电源管理芯片数据配置方法对显示面板的电源管理芯片内的数据进行配置，所述显示面板可被应用于移动终端上，所述移动终端包括终端主体和显示面板，所述移动终端可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有现实功能的产品或部件。
本发明的一个实施例中，配置架构100包括电路板110、存储模块120、读取加载模块130，存储模块120设置于电路板110上，存储模块120内存储有配置信息以及电源管理芯片配置数据，所述配置信息包括电路板架构类型信息，读取加载模块130设置于所述电路板110上，读取加载模块130与存储模块120连接，以在电路板110上电后，读取加载模块130读取存储模块120内的配置信息以确认电路板架构类型，在确认电路板架构类型后，读取加载模块130从相应的存储模块中加载电源管理芯片配置数据。
在对电源管理芯片140进行数据配置时，将电源管理芯片140设置于电路板110上，电源管理芯片140与读取加载模块130电连接，读取加载模块130将加载的电源管理芯片配置数据配置到电源管理芯片140中，电源管理芯片140根据接收的电源管理芯片配置数据产生显示面板（图中未示出）工作所需要的各种工作电压，如提供给显示面板内各芯片的数字工作电压(DVDD)、提供给伽玛芯片和VCOM电路的模拟电压(AVDD)、提供给扫描驱动集成电路的栅开启电压(Vgh或Von)和关闭电压(Vgl或Voff)等。
在本实施例中，电路板110包括控制板（C-Borard）111和驱动板（X-Board）112，所述电路板架构类型为合并式架构或分离式架构，参照图1，合并式架构中，控制板111和驱动板112合并形成电路板110，存储模块120为设置于电路板110上的控制板闪存121，电源管理芯片配置数据存储于控制板闪存121内，电源管理芯片140设置于电路板110上；参照图2，分离式架构中，控制板111和驱动板112分离组成电路板110，存储模块120包括设置于控制板111上的控制板闪存121’和设置于驱动板112上的驱动板存储模块1121，读取加载模块130设置于控制板111上，电源管理芯片140设置于控制板111上，驱动板112通过驱动板存储模块1121与读取加载模块130连接，电源管理芯片配置数据存储于驱动板存储模块1121内。
其中，所述读取加载模块130为具有读取功能和加载数据功能的芯片，在本实施例中，所述读取加载模块130为时序控制芯片（TCON）。
具体地，配置信息存储于控制板闪存121内的固定位置，例如控制板闪存121的最后一个扇区中。配置信息还包括记录所述驱动板存储模块1121类型的类型信息，所述驱动板存储模块1121的类型为驱动板闪存（X-Board Flash）（图中未示出）或带电可擦可编程只读存储器（EEPROM）（图中未示出），所述读取加载模块130读取所述类型信息，确认所述驱动板存储模块的类型。
参照图3，采用本实施例所提供的配置架构100对电源管理芯片进行数据配置的方法包括如下步骤：
电路板110上电；
读取加载模块130读取控制板闪存121内配置信息中的电路板架构类型信息；
读取加载模块130根据电路板架构类型信息判定电路板架构是否为分离式架构；
若读取加载模块130的判定结果为否（表明电路板架构类型为合并式架构），读取加载模块130从控制板闪存121加载电源管理芯片配置数据；
读取加载模块130将加载的电源管理芯片配置数据配置到电源管理芯片140；
完成对电源管理芯片140的数据配置。
若读取加载模块130的判定结果为是（表明架构类型为分离式架构），读取加载模块130读取配置信息中的驱动板存储模块类型信息，判定驱动板存储模块类型；
若读取加载模块130判定驱动板存储模块类型为驱动板闪存，读取加载模块130通过SPI总线从驱动板闪存加载第二电源管理芯片配置数据；
读取加载模块130将加载的第二电源管理芯片配置数据配置到电源管理芯片140；
完成对电源管理芯片140的数据配置。
若读取加载模块130判定驱动板存储模块类型为带电可擦可编程只读存储器，读取加载模块130通过I2C总线从带电可擦可编程只读存储器加载第二电源管理芯片配置数据；
读取加载模块130将加载的第二电源管理芯片配置数据配置到电源管理芯片140；
完成对电源管理芯片140的数据配置。
作为一种改进方式，参照图4，所述配置信息还包括电源管理芯片地址信息以及电源管理芯片配置数据长度信息，所述读取加载模块130读取配置信息中的电源管理芯片地址信息以及电源管理芯片配置数据长度信息，生成相应的电源管理芯片（PMIC）的配置代码（Code），使得读取加载模块130将加载的配置数据配置到电源管理芯片140时，可依据电源管理芯片配置代码配置对应长度的电源管理芯片配置数据。其中，电源管理芯片140内设置有寄存器141，读取加载模块130将生成的电源管理芯片（PMIC）的配置代码（Code）配置到寄存器141内。
作为另一种改进方式，参照图5，所述配置信息还包括电源管理芯片配置数据Disable代码（Disable Code），若读取加载模块130的判定结果为是（表明架构类型为分离式架构），读取加载模块130读取配置信息中的电源管理芯片配置数据Disable代码，读取加载模块130从控制板闪存121加载电源管理芯片配置数据，并将加载的电源管理芯片配置数据配置到电源管理芯片140，完成对电源管理芯片140的数据配置。在本实施例中，在配置信息内增加第二电源管理芯片配置数据Disable代码，可使得当电路板架构类型为分离式架构时，读取加载模块130不从驱动板存储模块1121内加载电源管理芯片配置数据，而是从控制板闪存121加载电源管理芯片配置数据，以适用不同机种类型的要求。
作为一种优选方式，所述配置信息还包括用以体现所述配置信息中信息改动的循环冗余（CRC）校验值，当配置信息改动和/或电源管理芯片配置数据改动，可以通过循环冗余校验值体现出来。
本发明所提供的电源管理芯片数据配置方法及配置架构，通过设定配置信息机制，减少不同机种间TCON Code的改写次数；在各个TCON型号采用相同的配置格式，方便在不同机种间的移植；在不同的机种上只需要改写配置信息，TCON会根据对应的设定采取相对应的动作，方便对产品的管控。可在配置信息中增加其他功能选择的域（Disable Code），便于对配置信息的维护。机种信息会体现在配置信息中，并在配置信息中增加循环冗余（CRC）校验值，当PMIC数据或机种信息有任何改动，都可以从循环冗余（CRC）校验值体现出来，方便对PMIC数据和机种信息的维护。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种电源管理芯片数据配置方法，其中，包括：
    读取配置信息以确认电路板架构类型；
    加载电源管理芯片配置数据；以及
    将所加载的电源管理芯片配置数据配置到电源管理芯片。
  2. 如权利要求1所述的电源管理芯片数据配置方法，其中，
    所述读取配置信息以确认电路板架构类型的步骤还包括：
    判定电路板架构类型是否为分离式架构；
    若判定结果为否，确认所述电路板架构类型为合并式架构。
  3. 如权利要求2所述的电源管理芯片数据配置方法，其中，
    所述读取配置信息以确认电路板架构类型的步骤还包括：
    判定电路板架构类型是否为分离式架构；
    若判定结果为是，确认所述电路板架构类型为分离式架构。
  4. 如权利要求3所述的电源管理芯片数据配置方法，其中，
    所述读取配置信息以确认电路板架构类型的步骤还包括：
    根据所述配置信息中的驱动板存储模块类型信息确认驱动板存储模块的类型。
  5. 如权利要求4所述的电源管理芯片数据配置方法，其中，
    所述读取配置信息确认电路板架构类型的步骤还包括：
    根据所述配置信息中的循环冗余校验值查看所述配置信息和/或电源管理芯片配置数据的改动。
  6. 一种电源管理芯片数据配置架构，其中，包括：
    电路板；
    存储模块，设置于所述电路板上，所述存储模块内存储有配置信息和电源管理芯片配置数据，所述配置信息包括用于显示电路板架构类型的电路板架构类型信息；
    读取加载模块，设置于所述电路板上，所述读取加载模块与所述存储模块电连接以读取配置信息和加载所述电源管理芯片配置数据。
  7. 如权利要求6所述的电源管理芯片数据配置架构，其中，
    所述电路板包括控制板和驱动板；
    所述电路板架构类型为合并式架构或分离式架构。
  8. 如权利要求7所述的电源管理芯片数据配置架构，其中，所述合并式架构为所述控制板和所述驱动板合并，所述存储模块为控制板闪存，所述配置信息和所述电源管理芯片配置数据存储于所述控制板闪存的至少一个扇区内。
  9. 如权利要求7所述的电源管理芯片数据配置架构，其中，
    所述分离式架构为所述控制板和所述驱动板分离；
    所述存储模块包括设置于所述控制板上的控制板闪存和设置于所述驱动板上的驱动板存储模块，所述读取加载模块设置于所述控制板上，所述控制板闪存和所述驱动板存储模块分别与所述读取加载模块电连接。
  10. 如权利要求9所述的电源管理芯片数据配置架构，其中，
    所述配置信息存储于所述控制板闪存的至少一个扇区内；
    所述配置信息内存储有用于显示所述驱动板存储模块类型的驱动板存储模块类型信息；
    所述电源管理芯片配置数据存储于所述驱动板存储模块内。
  11. 如权利要求10所述的显示面板，其中，所述驱动板存储模块类型包括驱动板闪存和带电可擦可编程只读存储器。
  12. 一种显示面板，其中，包括：
    电源管理芯片；
    电源光临芯片数据配置架构，与所述电源管理芯片电连接，所述电源光临芯片数据配置架构包括：
    电路板；
    存储模块，设置于所述电路板上，所述存储模块内存储有配置信息和电源管理芯片配置数据，所述配置信息包括用于显示电路板架构类型的电路板架构类型信息；
    读取加载模块，设置于所述电路板上，所述读取加载模块与所述存储模块电连接以读取配置信息和加载所述电源管理芯片配置数据；
    所述电源管理芯片设置于所述电路板上，所述读取加载模块与所述电源管理芯片电连接。
  13. 如权利要求12所述的显示面板，其中，所述电源管理芯片内设置有寄存器，所述读取加载模块将加载的所述电源管理芯片配置数据配置于所述寄存器内。
  14. 如权利要求12所述的显示面板，其中，
    所述电路板包括控制板和驱动板；
    所述电路板架构类型为合并式架构或分离式架构。
  15. 如权利要求14所述的显示面板，其中，所述合并式架构为所述控制板和所述驱动板合并，所述存储模块为控制板闪存，所述配置信息和所述电源管理芯片配置数据存储于所述控制板闪存的至少一个扇区内。
  16. 如权利要求14所述的显示面板，其中，
    所述分离式架构为所述控制板和所述驱动板分离；
    所述存储模块包括设置于所述控制板上的控制板闪存和设置于所述驱动板上的驱动板存储模块，所述读取加载模块设置于所述控制板上，所述控制板闪存和所述驱动板存储模块分别与所述读取加载模块电连接；
    所述电源管理芯片设置于所述控制板上。
  17. 如权利要求16所述的显示面板，其中，
    所述配置信息存储于所述控制板闪存的至少一个扇区内；
    所述配置信息内存储有用于显示所述驱动板存储模块类型的驱动板存储模块类型信息；
    所述电源管理芯片配置数据存储于所述驱动板存储模块内。
  18. 如权利要求17所述的显示面板，其中，所述驱动板存储模块类型包括驱动板闪存和带电可擦可编程只读存储器。
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