WO2023067849A1 - 樹脂成形装置、及び樹脂成形品の製造方法 - Google Patents

樹脂成形装置、及び樹脂成形品の製造方法 Download PDF

Info

Publication number
WO2023067849A1
WO2023067849A1 PCT/JP2022/024267 JP2022024267W WO2023067849A1 WO 2023067849 A1 WO2023067849 A1 WO 2023067849A1 JP 2022024267 W JP2022024267 W JP 2022024267W WO 2023067849 A1 WO2023067849 A1 WO 2023067849A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
plunger
pressure sensor
pressure
pot
Prior art date
Application number
PCT/JP2022/024267
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
慎 竹内
良太 岡本
侑扶 石川
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020237044516A priority Critical patent/KR20240012545A/ko
Priority to CN202280045442.0A priority patent/CN117561154A/zh
Publication of WO2023067849A1 publication Critical patent/WO2023067849A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material

Definitions

  • the present invention relates to technology for a resin molding apparatus and a method for manufacturing a resin molded product.
  • Patent Document 1 discloses a resin molding apparatus provided with a pressure sensor for measuring the resin pressure inside the cavity (cavity pressure). Specifically, Patent Literature 1 discloses a configuration in which pressure sensors are arranged in the vicinity of a gate in a cavity and at positions away from the gate. By controlling the operation of the transfer mechanism based on the resin pressure measured by the pressure sensor, the resin pressure and the resin filling speed can be adjusted.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin molding apparatus and a method of manufacturing a resin molded product that can grasp the resin pressure in detail. be.
  • the resin molding apparatus comprises a lower mold formed with a pot in which a resin material is accommodated; An upper die provided to face the pot and having a cull portion formed in a portion facing the pot, a plunger capable of transferring the resin material contained in the pot, and a position of the upper die facing the plunger or a first sensor that is provided at the tip of the plunger and detects a value related to pressure.
  • a method for manufacturing a resin molded product according to the present invention uses the resin molding apparatus to resin mold an object to be molded.
  • the resin pressure can be grasped in detail.
  • FIG. 2 is a front cross-sectional view showing the configuration of the molding die
  • FIG. 4 is a schematic diagram showing the arrangement of a transfer mechanism, pressure sensors, and load cells; The figure which showed an example of the time change of resin pressure.
  • Fig. 4 is a front cross-sectional view schematically showing a state in which dirt adheres inside the pot;
  • FIG. 5 is a front cross-sectional view showing the configuration of a mold according to a second embodiment;
  • the resin molding apparatus 1 manufactures a resin molded product by resin-sealing an electronic element such as a semiconductor chip (hereinafter simply referred to as "chip 2a").
  • the present embodiment exemplifies a resin molding apparatus 1 that performs resin molding using a transfer molding method.
  • the resin molding apparatus 1 comprises a supply module 10, a resin molding module 20, and an unloading module 30 as components. Each component is removable and replaceable with respect to other components.
  • the supply module 10 supplies the resin molding module 20 with a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which the chip 2a is mounted, and the resin tablet T.
  • substrate 2 is one embodiment of the molding object according to the present invention.
  • a lead frame is exemplified as the substrate 2, but various substrates other than the lead frame (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) can be used. is possible.
  • the supply module 10 mainly includes a frame delivery section 11 , a frame supply section 12 , a resin delivery section 13 , a resin supply section 14 , a loader 15 and a control section 16 .
  • the frame sending section 11 sends out the substrate 2 that is not resin-sealed and housed in an in-magazine unit (not shown) to the frame supplying section 12 .
  • the frame supply unit 12 receives the substrates 2 from the frame delivery unit 11 , properly aligns the received substrates 2 , and delivers them to the loader 15 .
  • the resin delivery unit 13 receives resin tablets T from a stocker (not shown) and delivers the resin tablets T to the resin supply unit 14 .
  • the resin supply unit 14 receives the resin tablets T from the resin delivery unit 13 , properly aligns the received resin tablets T, and delivers them to the loader 15 .
  • the loader 15 transports the substrate 2 and the resin tablet T received from the frame supply section 12 and the resin supply section 14 to the resin molding module 20 .
  • the control unit 16 controls the operation of each module of the resin molding apparatus 1.
  • the controller 16 controls the operations of the supply module 10 , the resin molding module 20 and the unloading module 30 . Also, the operation of each module can be arbitrarily changed (adjusted) using the control unit 16 .
  • control unit 16 is provided in the supply module 10 , but it is also possible to provide the control unit 16 in another module. It is also possible to provide a plurality of control units 16 . For example, it is possible to provide the control unit 16 for each module or for each device, and individually control the operations of each module or the like while interlocking them.
  • the resin-molded module 20 seals the chip 2a mounted on the substrate 2 with resin.
  • two resin molding modules 20 are arranged side by side. By carrying out the resin sealing of the substrate 2 in parallel with the two resin molding modules 20, the production efficiency of the resin molded product can be improved.
  • the resin molding module 20 mainly includes a mold (lower mold 110 and upper mold 120) and a mold clamping mechanism 21. As shown in FIG.
  • the mold (lower mold 110 and upper mold 120) seals the chip 2a mounted on the substrate 2 using a molten resin material.
  • the mold comprises a pair of upper and lower molds, that is, a lower mold 110 and an upper mold 120 (see FIG. 3).
  • the molding die is provided with a heating portion (not shown) such as a heater.
  • the mold clamping mechanism 21 clamps or opens the molds (lower mold 110 and upper mold 120) by moving the lower mold 110 up and down.
  • the unloading module 30 receives the resin-sealed substrate 2 from the resin molding module 20 and unloads it.
  • the carry-out module 30 mainly includes an unloader 31 and a substrate accommodation section 32 .
  • the unloader 31 holds the resin-sealed substrate 2 and unloads it to the substrate storage section 32 .
  • the substrate housing part 32 houses the substrate 2 sealed with resin.
  • the method for manufacturing a resin molded product according to the present embodiment mainly includes a carry-in step S10, a resin molding step S20, and a carry-out step S30.
  • the loading step S10 is a step of loading the substrate 2 and the resin tablet T into the resin molding module 20.
  • the frame delivery section 11 delivers the substrate 2 accommodated in the in-magazine unit (not shown) to the frame supply section 12.
  • the frame supply unit 12 properly aligns the received substrates 2 and delivers them to the loader 15 .
  • the resin delivery unit 13 delivers the resin tablet T received from the stocker (not shown) to the resin supply unit 14 .
  • the resin supply unit 14 transfers the required number of the received resin tablets T to the loader 15 .
  • the loader 15 transports the received substrate 2 and resin tablet T to the mold of the resin molding module 20 . After the substrate 2 and the resin tablet T are conveyed to the mold, the process proceeds from the carrying-in step S10 to the resin molding step S20.
  • the resin molding step S20 is a step of sealing the chip 2a mounted on the substrate 2 with resin.
  • the mold clamping mechanism 21 raises the lower mold 110 to clamp the mold. Then, the resin tablet T is heated and melted by a heating portion (not shown) of the molding die, and the substrate 2 is resin-sealed using the generated molten resin. After a predetermined time (curing time) until the resin material hardens has passed, the process proceeds from the resin molding step S20 to the unloading step S30.
  • the cure time is the time from when the transfer shaft 131 (to be described later) stops rising until the resin material hardens to such an extent that the resin molded product can be properly released from the mold at least when the mold is opened.
  • the unloading step S30 is a step of receiving the resin-sealed substrate 2 from the resin molding module 20 and unloading it.
  • the mold clamping mechanism 21 opens the mold. Then, the resin-sealed substrate 2 is released from the mold. After that, the unloader 31 unloads the substrate 2 from the molding die and stores it in the substrate storage section 32 of the unloading module 30 . At this time, unnecessary portions (culls, runners, etc.) of the resin-molded substrate 2 are appropriately removed.
  • the resin molding module 20 mainly includes a lower mold 110, an upper mold 120, a transfer mechanism 130, a pressure sensor 140, a load cell 150 and a mold clamping mechanism 21. As shown in FIG. 3, the resin molding module 20 mainly includes a lower mold 110, an upper mold 120, a transfer mechanism 130, a pressure sensor 140, a load cell 150 and a mold clamping mechanism 21. As shown in FIG. 3, the resin molding module 20 mainly includes a lower mold 110, an upper mold 120, a transfer mechanism 130, a pressure sensor 140, a load cell 150 and a mold clamping mechanism 21. As shown in FIG.
  • the lower mold 110 forms the lower part of the mold.
  • the lower mold 110 mainly comprises a pot block 111 and a lower mold cavity block 112 .
  • the pot block 111 is a portion in which the resin tablet T supplied from the supply module 10 is accommodated.
  • the pot block 111 is formed with a plurality (five in this embodiment) of through-holes (pots 111a) for accommodating the resin tablets T (see FIG. 1).
  • the lower mold cavity block 112 forms the bottom surface of the cavity C.
  • the lower die cavity blocks 112 are arranged on the left and right sides of the pot block 111, respectively.
  • a recess having a shape corresponding to the substrate 2 is appropriately formed on the upper surface of the lower mold cavity block 112 .
  • the substrate 2 can be placed in the concave portion of the lower mold cavity block 112 .
  • the upper mold 120 forms the upper part of the mold.
  • the upper mold 120 mainly comprises a cull block 121 and an upper mold cavity block 122 .
  • the cull block 121 is arranged at a position facing the pot block 111 of the lower die 110 .
  • a groove-shaped cull portion 121a and a runner portion 121b for guiding the resin material to the cavity C are formed on the lower surface of the cull block 121 .
  • the cull portion 121a is formed at a position facing each pot 111a of the lower mold 110 vertically.
  • the upper mold cavity block 122 forms the upper surface of the cavity C.
  • the upper die cavity blocks 122 are arranged on the left and right sides of the cull block 121, respectively.
  • the upper mold cavity block 122 is arranged at a position facing the lower mold cavity block 112 .
  • the bottom surface of the upper die cavity block 122 is appropriately formed with a concave portion having a shape corresponding to the resin molded product.
  • the present embodiment shows an example in which the runner portion 121b and the upper surface of the cavity C are formed in the upper mold 120, the present invention is not limited to this.
  • the lower surface of the runner portion and the cavity C may be formed in the lower die cavity block 112 of the lower die 110 or the like.
  • a cavity C having a shape corresponding to the resin molded product is formed. Also, the lower mold 110 can be moved up and down by the mold clamping mechanism 21 .
  • the transfer mechanism 130 shown in FIGS. 3 and 4 supplies the resin material to the cavity C.
  • the transfer mechanism 130 mainly includes a transfer shaft 131 , a mounting portion 132 , a plunger 133 and a load cell 134 .
  • the transfer shaft 131 is a vertically movable member.
  • the transfer shaft 131 can be arbitrarily moved up and down by power transmitted from a drive source (not shown) such as a servomotor or an air cylinder.
  • a plurality of transfer shafts 131 are provided so as to line up in the front-rear direction with respect to one mold (lower mold 110) (see FIG. 4).
  • the attachment portion 132 is for attaching the plunger 133 to the transfer shaft 131 .
  • the mounting portion 132 is formed in a substantially rectangular parallelepiped shape.
  • the mounting portion 132 is provided over the upper portions of the plurality of transfer shafts 131 .
  • the plunger 133 injects the resin tablet T (resin material) contained in the pot 111a of the pot block 111 and transfers it to the cavity C.
  • the plunger 133 is arranged so as to be vertically movable (liftable) within the pot 111a.
  • a lower portion of the plunger 133 is attached to an upper portion of the attachment portion 132 via a load cell 150 which will be described later.
  • a plurality of plungers 133 (five in this embodiment) are provided so as to line up in the front-rear direction (see FIG. 4).
  • the load cell 134 is for detecting the load applied to the transfer shaft 131.
  • the load cell 134 is provided above the transfer shaft 131 (between the transfer shaft 131 and the mounting portion 132).
  • the load cell 134 of this embodiment is provided on one transfer shaft 131 among the plurality of transfer shafts 131 .
  • the pressure sensor 140 is for detecting the pressure of the resin material transferred to the cavity C. As shown in FIG.
  • the pressure sensor 140 is an embodiment of the first sensor that detects pressure-related values according to the present invention.
  • the pressure sensor 140 can detect the pressure applied to the detection surface based on the amount of deformation of the elastically deformable detection surface (diaphragm) provided on the end face.
  • a thermosetting resin mold internal pressure sensor (model: 6167A) manufactured by Kistler Japan Co., Ltd. can be used.
  • the pressure sensor 140 is provided at a position facing the plunger 133 in the cull portion 121 a of the cull block 121 . More specifically, the pressure sensor 140 is provided at a position overlapping the plunger 133 when viewed from the moving direction of the plunger 133 (the vertical direction in this embodiment). In this embodiment, the pressure sensor 140 is provided coaxially with the plunger 133 . That is, the pressure sensor 140 is positioned on a vertical straight line passing through the center of the plunger 133 in the cross-sectional view shown in FIG. At this time, the pressure sensor 140 is positioned directly above the plunger 133 . The pressure sensor 140 is provided so as to be embedded in the cull block 121 with its detection surface facing downward.
  • a lower end surface (detection surface) of the pressure sensor 140 is arranged substantially on the same plane as the lower surface of the cull portion 121a. By arranging in this way, the detection surface of the pressure sensor 140 can directly touch the resin material transferred to the cavity C. As shown in FIG. That is, the pressure sensor 140 can directly detect the pressure of the resin material without using other members.
  • a plurality of pressure sensors 140 are provided to correspond to the plurality of plungers 133 .
  • one pressure sensor 140 is provided above each of the five plungers 133 .
  • the resin pressure for each plunger 133 can be detected individually, and the detection result can be used to control the operation of the resin molding apparatus 1. It can be used for grasping the state during resin molding.
  • the load cell 150 is for detecting the load applied to the plunger 133.
  • the load cell 150 is an embodiment of the second sensor that detects force-related values according to the present invention.
  • the load cell 150 is provided below the plunger 133 (between the plunger 133 and the mounting portion 132).
  • a plurality of load cells 150 of this embodiment are provided so as to correspond to a plurality of plungers 133 .
  • one load cell 150 is provided below each of the five plungers 133 .
  • FIG. 5 shows an example of the change over time of the detection value of the pressure sensor 140 when the resin material is transferred to the cavity C and the substrate 2 is resin-sealed in the resin molding step S20 (see FIG. 2). ing.
  • the horizontal axis of FIG. 5 indicates the elapsed time from the start of transfer of the resin material by the transfer mechanism 130 .
  • the vertical axis in FIG. 5 indicates the detection value of the pressure sensor 140 (that is, the pressure of the resin material).
  • the pressure of the resin material detected by the pressure sensor 140 is hereinafter referred to as "resin pressure".
  • the transfer mechanism 130 starts to lift the transfer shaft 131, and the transfer of the resin material is started. Then, the resin material pushed out from the pot block 111 by the plunger 133 immediately comes into contact with the pressure sensor 140 located just above the plunger 133 (see FIG. 3). Therefore, the pressure sensor 140 can detect the resin pressure immediately after the start of transfer of the resin material as shown in FIG. Note that the three lines shown in FIG. 5 indicate, as an example, the results of detection by three pressure sensors 140 out of the five pressure sensors 140 provided.
  • the resin material is supplied to the cavity C through the cull portion 121a and the runner portion 121b. As shown in FIG. 5, from the start of transfer of the resin material to time t1, the resin pressure gradually rises while fluctuating up and down according to the flow resistance when the resin material flows in the runner portion 121b and the like.
  • the transfer mechanism 130 moves the transfer shaft 131 while applying a predetermined pressure to the injected resin material until the cure time elapses after time t1. Stop rising and maintain this state. After the curing time has elapsed (after reaching time t2 in the example of FIG. 5), the process proceeds to the unloading step S30 (see FIG. 2), and the resin-sealed substrate 2 is unloaded from the mold.
  • an appropriate curing time can be determined based on the resin pressure detected by the pressure sensor 140 .
  • the resin pressure gradually decreases. This is because the resin material gradually hardens and shrinks, and the pressure applied to the pressure sensor 140 decreases. After a certain amount of time has passed (after time t2), the resin pressure becomes substantially constant. This is because curing of the resin material is almost completed and shrinkage of the resin material is finished.
  • the resin material can be transferred to the unloading step S30 without waiting for a long time after the curing of the resin material is completed. can be migrated.
  • the cure time can be determined in advance by performing resin molding on a trial basis and detecting the time change of the resin pressure before starting the actual manufacture of the resin molded product.
  • control unit 16 can automatically determine the cure time. For example, based on the detection result of the pressure sensor 140 shown in FIG. 5, the control unit 16 sets the curing time from the time t1 when the injection of the resin material into the cavity C is completed to the time t2 when the resin pressure becomes substantially constant. can be determined automatically.
  • FIG. 6 schematically shows a state in which dirt A adheres inside the pot 111a (inner surface of the pot 111a).
  • dirt A due to the resin material adheres to the inside of the pot 111a by repeatedly performing resin molding. If the dirt A adheres to the inside of the pot 111a, there is a possibility that the sliding of the plunger 133 will be hindered and the transfer of the resin material to the cavity C will not be performed normally. Therefore, it is desirable to detect the presence or absence of dirt A in the pot 111a and perform cleaning at an appropriate timing.
  • the presence or absence of dirt A in the pot 111a can be detected by comparing the detection values of the pressure sensor 140 and the load cell 150. Specifically, when the pot 111a is not contaminated with dirt A, the pressure sensor 140 detects the value when the plunger 133 is raised to inject the resin material into the cavity C (until time t1 in FIG. 5). , and the detected value of the load cell 150 corresponding to this pressure sensor 140 have a certain relationship.
  • the control unit 16 compares the detection values of the pressure sensor 140 and the load cell 150 and detects changes in the sliding resistance of the plunger 133 during the manufacture of the resin molded product, thereby quickly removing the dirt A from the pot 111a. can be detected immediately and the cleaning of the pot 111a can be carried out at an appropriate timing.
  • the time of manufacturing the resin molded product is, for example, the time when the plunger 133 is raised to inject the resin material into the cavity C. As shown in FIG.
  • the pressure sensor 140 is arranged directly above the plunger 133 (on the extension line of the sliding direction of the plunger 133), the pressure of the resin material pushed out by the plunger 133 is applied to the runner portion 121b and the like. It is detected by the pressure sensor 140 without intervening. Therefore, the detected value of the pressure sensor 140 is less likely to be affected by the flow resistance of the resin material, and the relationship between the pressure sensor 140 and the detected value of the load cell 150 can be clearly grasped. Therefore, dirt A can be detected with high accuracy.
  • the pressure sensor 140 is arranged at the center of the plunger 133 (on the axis of the plunger 133).
  • the pressure sensor 140 is provided so as to be embedded in the plunger 133 with its detection surface facing upward.
  • the upper end surface (detection surface) of pressure sensor 140 is arranged substantially on the same plane as the upper surface of plunger 133 . By arranging in this way, the detection surface of the pressure sensor 140 can directly touch the resin material transferred to the cavity C. As shown in FIG.
  • the resin pressure can be detected immediately after the transfer of the resin material by the transfer mechanism 130 is started, as in the first embodiment. Further, similarly to the first embodiment, the pressure sensor 140 can be used to determine the curing time and detect the dirt A in the pot 111a.
  • the resin molding apparatus 1 includes a lower mold 110 formed with a pot 111a in which a resin material is accommodated, and a portion provided to face the lower mold 110 and facing the pot 111a.
  • an upper mold 120 having a cull portion 121a formed therein; a plunger 133 capable of transferring the resin material contained in the pot 111a; a position of the upper mold 120 facing the plunger 133 (see FIG. 3);
  • a pressure sensor 140 (first sensor) is provided at the tip of the plunger 133 (see FIG. 7) and detects a value related to pressure.
  • a pressure sensor 140 provided at a position facing the plunger 133 or at the tip of the plunger 133 can detect the resin pressure immediately after the plunger 133 transfers the resin material. Based on the resin pressure detected in this way, it is possible to determine the curing time, the cleaning timing of the pot 111a, and the like.
  • a pressure sensor is provided directly in the cavity C to detect the resin pressure
  • traces of the pressure sensor will be formed on the surface of the product after resin molding.
  • a resin-encapsulated product is separated into individual pieces and becomes the final product, if there are some that have traces of the pressure sensor on the outside and others that do not, there is a possibility that they will not be recognized as products of the same quality. , unfavorable.
  • the pressure sensor 140 since the pressure sensor 140 is not provided directly in the cavity C, the quality of the product is not affected.
  • a configuration is also conceivable in which a pressure sensor is provided on the ejector pin provided facing the cavity C and the resin pressure is detected by detecting the pressure applied to the ejector pin.
  • a pressure sensor is provided on the ejector pin provided facing the cavity C and the resin pressure is detected by detecting the pressure applied to the ejector pin.
  • an error occurs between the actual resin pressure and the detected value of the pressure sensor, so it is difficult to detect the correct resin pressure.
  • the pressure sensor 140 since the pressure sensor 140 is provided at a portion (such as the tip of the plunger 133) that directly contacts the resin material, errors do not occur and the resin material Pressure can be detected with high accuracy.
  • a plurality of pressure sensors 140 are provided corresponding to the plurality of plungers 133 provided.
  • the resin molding apparatus 1 further includes a control section 16 that determines the curing time based on the detection value of the pressure sensor 140 .
  • the resin pressure detected in detail by the pressure sensor 140 can be used to determine the cure time, so an appropriate cure time can be set.
  • the resin molding apparatus 1 further includes a load cell 150 (second sensor) provided at a portion of the plunger 133 different from the tip portion and detecting a value related to the force applied to the plunger 133.
  • the unit 16 compares the detection value of the pressure sensor 140 and the detection value of the load cell 150 .
  • this configuration it is possible to compare and grasp what value the resin pressure has with respect to the load applied to the plunger 133 . Moreover, this comparison result can be used as information for grasping the state of the resin molding apparatus 1 (for example, whether or not there is an abnormality in the resin pressure).
  • control unit 16 detects the sliding resistance of the plunger 133 by comparing the detection value of the pressure sensor 140 and the detection value of the load cell 150 .
  • a plurality of the load cells 150 are provided corresponding to the plurality of the plungers 133 provided.
  • each plunger 133 can be individually detected. This makes it possible to individually detect whether each pot 111a is dirty.
  • the method for manufacturing a resin molded product according to the present embodiment uses the resin molding apparatus 1 to resin mold an object to be molded.
  • the resin pressure can be grasped in detail. Moreover, since it is possible to determine an appropriate curing time and detect whether or not the pot 111a is soiled, it is possible to improve the quality of the resin molded product and improve the production efficiency.
  • the components (supply module 10, etc.) used in the resin molding apparatus 1 of the above-described embodiment are examples, and can be detached or replaced as appropriate.
  • the configuration and operation of the components (supply module 10, etc.) used in the resin molding apparatus 1 of the present embodiment are examples, and can be changed as appropriate.
  • a tablet-shaped resin material (resin tablet T) was shown, but the present invention is not limited to this. That is, as the resin material, it is possible to use not only a tablet-like material, but also an arbitrary form such as powder (including granules and powder) and liquid.
  • the number of transfer shafts 131, plungers 133, pots 111a, etc. exemplified in the above embodiment is not limited, and can be arbitrarily changed.
  • the number of various sensors is not particularly limited, and can be arbitrarily changed.
  • a plurality of pressure sensors 140 are provided so as to correspond to a plurality of plungers 133
  • the present invention is not limited to this. That is, it is not necessary to provide the same number of pressure sensors 140 as the plungers 133 , and the number of pressure sensors 140 can be less than or greater than the number of plungers 133 . For example, it is possible to provide only one pressure sensor 140 so as to correspond to any one plunger 133 . Likewise, the load cells 150 need not be provided in the same number as the plurality of plungers 133, and the number can be set arbitrarily.
  • the pressure sensor 140 is provided in the cull block 121 (cull portion 121a) is shown, but the present invention is not limited to this.
  • the pressure sensor 140 is provided at a position facing the plunger 133 or at the tip of the plunger 133, and the member to be attached is not limited as long as it can detect the resin pressure immediately after the start of resin transfer.
  • the pressure sensor 140 is provided at a position (cull block 121) facing the plunger 133 (see FIG. 3), and the pressure sensor 140 is provided at the tip of the plunger 133 (see FIG. 3). 7), respectively, but the present invention is not limited to this. That is, instead of providing the pressure sensor 140 only on either the cull block 121 or the plunger 133, it is possible to provide both.
  • control unit 16 determines the cure time and detects the sliding resistance of the plunger 133 (presence or absence of dirt A), but the present invention is not limited to this. etc. may be determined by human judgment.
  • the control unit 16 outputs the detection value of the pressure sensor 140 or the like and the comparison result of the detection values of the pressure sensor 140 and the load cell 150 to an output device such as a display, thereby determining the curing time. It is also possible to adopt a configuration in which important information is notified to a person.
  • the pressure sensor 140 is used, but it is also possible to calculate the pressure from the value and area detected by using a sensor that detects force.
  • the load cell 134 that detects the load is used, but instead of this, it is also possible to use a sensor that detects the force.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
PCT/JP2022/024267 2021-10-22 2022-06-17 樹脂成形装置、及び樹脂成形品の製造方法 WO2023067849A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020237044516A KR20240012545A (ko) 2021-10-22 2022-06-17 수지 성형장치, 및 수지 성형품의 제조 방법
CN202280045442.0A CN117561154A (zh) 2021-10-22 2022-06-17 树脂成形装置、及树脂成形品的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-173526 2021-10-22
JP2021173526A JP2023063177A (ja) 2021-10-22 2021-10-22 樹脂成形装置、及び樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
WO2023067849A1 true WO2023067849A1 (ja) 2023-04-27

Family

ID=86058974

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/024267 WO2023067849A1 (ja) 2021-10-22 2022-06-17 樹脂成形装置、及び樹脂成形品の製造方法

Country Status (5)

Country Link
JP (1) JP2023063177A (zh)
KR (1) KR20240012545A (zh)
CN (1) CN117561154A (zh)
TW (1) TWI809934B (zh)
WO (1) WO2023067849A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008114393A (ja) * 2006-11-01 2008-05-22 Toyota Motor Corp 樹脂封止方法及びモータ
JP2018117021A (ja) * 2017-01-17 2018-07-26 エムテックスマツムラ株式会社 樹脂成形金型及び樹脂成形装置
JP2020090010A (ja) * 2018-12-05 2020-06-11 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486557B2 (ja) * 1998-07-30 2004-01-13 宮崎沖電気株式会社 トランスファ成形装置及び半導体装置の製造方法
BR112017011755B1 (pt) * 2014-12-04 2022-08-09 Extrude To Fill, LLC Sistema de moldagem por injeção, e, método para fabricação de um componente
JP6907044B2 (ja) 2017-06-19 2021-07-21 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008114393A (ja) * 2006-11-01 2008-05-22 Toyota Motor Corp 樹脂封止方法及びモータ
JP2018117021A (ja) * 2017-01-17 2018-07-26 エムテックスマツムラ株式会社 樹脂成形金型及び樹脂成形装置
JP2020090010A (ja) * 2018-12-05 2020-06-11 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Also Published As

Publication number Publication date
JP2023063177A (ja) 2023-05-09
TWI809934B (zh) 2023-07-21
TW202317384A (zh) 2023-05-01
CN117561154A (zh) 2024-02-13
KR20240012545A (ko) 2024-01-29

Similar Documents

Publication Publication Date Title
JP6087859B2 (ja) 樹脂成形装置及び樹脂成形方法
CN111216302B (zh) 树脂成形装置及树脂成形品的制造方法
JP7084349B2 (ja) 樹脂成形装置及び樹脂成形品の製造方法
KR20200068582A (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
TW201725632A (zh) 壓機、致動器組以及以至少二個可個別控制的致動器來封裝電子元件的方法
WO2023067849A1 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
TWI656006B (zh) Resin forming device
TWI403000B (zh) 直接模塑的設備及方法
WO2020217702A1 (ja) 樹脂成形装置及び樹脂成形品の製造方法
JP7447050B2 (ja) 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP7417496B2 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
JP7430125B2 (ja) 成形型、樹脂成形装置、及び樹脂成形品の製造方法
WO2022163062A1 (ja) クリーニング機構、樹脂成形装置及び樹脂成形品の製造方法
TWI834055B (zh) 樹脂成形裝置及樹脂成形品的製造方法
JP7447047B2 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
JP7084226B2 (ja) 樹脂成形装置および樹脂成形品の製造方法
JPS61290017A (ja) 成形装置
JP2007109772A (ja) 樹脂成型方法、及び樹脂成型装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22883161

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20237044516

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 1020237044516

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 202280045442.0

Country of ref document: CN