WO2023037684A1 - 樹脂組成物および成形品 - Google Patents
樹脂組成物および成形品 Download PDFInfo
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- WO2023037684A1 WO2023037684A1 PCT/JP2022/023902 JP2022023902W WO2023037684A1 WO 2023037684 A1 WO2023037684 A1 WO 2023037684A1 JP 2022023902 W JP2022023902 W JP 2022023902W WO 2023037684 A1 WO2023037684 A1 WO 2023037684A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- xylylenediamine
- resin composition
- mol
- derived
- polyamide resin
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 62
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 84
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 claims abstract description 57
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000696 magnetic material Substances 0.000 claims abstract description 34
- 150000004985 diamines Chemical class 0.000 claims abstract description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 13
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 11
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 claims description 19
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 17
- 239000000155 melt Substances 0.000 claims description 15
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims description 12
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 9
- 239000001361 adipic acid Substances 0.000 claims description 6
- 235000011037 adipic acid Nutrition 0.000 claims description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 150000002910 rare earth metals Chemical class 0.000 claims description 6
- 239000000470 constituent Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000000465 moulding Methods 0.000 description 13
- 229920002292 Nylon 6 Polymers 0.000 description 10
- 230000005415 magnetization Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 229920002302 Nylon 6,6 Polymers 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000004953 Aliphatic polyamide Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 229920003231 aliphatic polyamide Polymers 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000006247 magnetic powder Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 4
- 229910052712 strontium Inorganic materials 0.000 description 4
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 4
- 238000000071 blow moulding Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910001172 neodymium magnet Inorganic materials 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 235000011148 calcium chloride Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- PNDQMTHVYOUHCS-ISFAVVKVSA-N (1E,3E,5E,7E,9E)-1-methoxydodeca-1,3,5,7,9-pentaene Chemical compound CC\C=C\C=C\C=C\C=C\C=C\OC PNDQMTHVYOUHCS-ISFAVVKVSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- HASUJDLTAYUWCO-UHFFFAOYSA-N 2-aminoundecanoic acid Chemical compound CCCCCCCCCC(N)C(O)=O HASUJDLTAYUWCO-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- WTKWFNIIIXNTDO-UHFFFAOYSA-N 3-isocyanato-5-methyl-2-(trifluoromethyl)furan Chemical compound CC1=CC(N=C=O)=C(C(F)(F)F)O1 WTKWFNIIIXNTDO-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical group C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 229920006152 PA1010 Polymers 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- WPWNSTTVSOUHRP-UHFFFAOYSA-N [1-(aminomethyl)naphthalen-2-yl]methanamine Chemical group C1=CC=CC2=C(CN)C(CN)=CC=C21 WPWNSTTVSOUHRP-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- CHDRADPXNRULGA-UHFFFAOYSA-N naphthalene-1,3-dicarboxylic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC(C(O)=O)=C21 CHDRADPXNRULGA-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- JSKSILUXAHIKNP-UHFFFAOYSA-N naphthalene-1,7-dicarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=CC(C(=O)O)=CC=C21 JSKSILUXAHIKNP-UHFFFAOYSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- BBMHARZCALWXSL-UHFFFAOYSA-M sodium dihydrogenphosphate monohydrate Chemical compound O.[Na+].OP(O)([O-])=O BBMHARZCALWXSL-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Natural products OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
- H01F1/04—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys
- H01F1/047—Alloys characterised by their composition
- H01F1/053—Alloys characterised by their composition containing rare earth metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
- H01F1/10—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure
- H01F1/11—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure in the form of particles
- H01F1/113—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites, e.g. [(Ba,Sr)O(Fe2O3)6] ferrites with hexagonal structure in the form of particles in a bonding agent
Definitions
- the present invention relates to resin compositions and molded articles.
- bonded magnets also called resin-bonded magnets or plastic magnets
- bonded magnets can be manufactured by injection molding into magnets with more complex shapes, and their productivity is also improved. It is widely used in various electronic parts, including small motors, due to its high thermal conductivity.
- Polyamide resins such as polyamide 6 and polyamide 12, which are crystalline and excellent in fluidity, are used for such bonded magnets.
- Patent Document 1 describes a composition for synthetic resin magnets in which magnetic powder is dispersed and mixed in a resin binder.
- a composition for a synthetic resin magnet is disclosed, which is characterized by:
- a specific example using polyamide 6 as the main resin is shown.
- An object of the present invention is to solve such problems, and to provide a resin composition capable of providing a molded article having excellent magnetization, and a molded article formed from the resin composition.
- ⁇ 1> Contains 10 to 90 parts by mass of a polyamide resin and 90 to 10 parts by mass of a magnetic material, wherein the polyamide resin contains a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, and the diamine-derived structural unit
- a resin composition for a bonded magnet comprising: ⁇ 2> The resin composition according to ⁇ 1>, wherein the xylylenediamine contains 10 to 90 mol% of meta-xylylenediamine and 90 to 10 mol% of para-xylylenediamine.
- the xylylenediamine contains 10 to 90 mol% of meta-xylylenediamine and 90 to 10 mol% of paraxylylenediamine, and the ⁇ , ⁇ -linear aliphatic dicarboxylic acid having 4 to 12 carbon atoms is , the resin composition according to ⁇ 1>, which contains dodecanedioic acid.
- the resin composition according to ⁇ 1> wherein 70 mol% or more of the diamine-derived structural units are derived from m-xylylenediamine, and 70 mol% or more of the dicarboxylic acid-derived structural units are derived from adipic acid. thing.
- ⁇ 6> Any one of ⁇ 1> to ⁇ 5>, wherein the xylylenediamine-based polyamide resin has an apparent shear rate of 121.6 sec ⁇ 1 and a melt viscosity of 10 to 600 Pa s measured at a measurement temperature of 260 ° C.
- ⁇ 7> The resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the magnetic material includes a ferrite magnet and/or a rare earth magnet.
- the xylylenediamine-based polyamide resin has a melt viscosity of 10 to 600 Pa s measured at 121.6 sec ⁇ 1 and a measurement temperature of 260° C.
- the magnetic material includes a ferrite magnet and/or a rare earth magnet.
- ⁇ 9> A molded article formed from the resin composition according to any one of ⁇ 1> to ⁇ 8>.
- the resin composition for a bonded magnet of the present embodiment contains 10 to 90 parts by mass of a polyamide resin and 90 to 10 parts by mass of a magnetic material, and the polyamide resin is , comprising a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, 70 mol% or more of the diamine-derived structural unit is derived from xylylenediamine, and 70 mol% or more of the dicarboxylic acid-derived structural unit has a carbon number It is characterized by containing a xylylenediamine-based polyamide resin derived from ⁇ , ⁇ -straight-chain aliphatic dicarboxylic acids of 4 to 12.
- a resin composition with high magnetization can be obtained.
- the reason for this is presumed to be that the xylylenediamine-based polyamide resin has a xylylenediamine skeleton, and this skeleton has excellent adhesion to metals.
- the excellent performance inherent in the xylylenediamine-based polyamide resin can be maintained.
- high magnetization can be exhibited without impairing the excellent chemical resistance and low water absorption inherent in xylylenediamine-based polyamide resins.
- the resin composition of the present embodiment contains a polyamide resin, the polyamide resin contains a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, and 70 mol% or more of the diamine-derived structural unit is xylylenediamine. containing a xylylenediamine-based polyamide resin derived from ⁇ , ⁇ -straight-chain aliphatic dicarboxylic acid having 4 to 12 carbon atoms in which 70 mol % or more of the structural units derived from the dicarboxylic acid are derived.
- the diamine-derived structural unit of the xylylenediamine-based polyamide resin is preferably 75 mol% or more, more preferably 80 mol% or more, still more preferably 85 mol% or more, still more preferably 90 mol% or more, still more preferably 95 At least 98 mol %, even more preferably at least 98 mol %, is derived from xylylenediamine. Further, 100 mol % of the diamine-derived constitutional units of the xylylenediamine-based polyamide resin may be derived from xylylenediamine. Xylylenediamine preferably contains at least one of meta-xylylenediamine and para-xylylenediamine.
- It preferably contains 20 to 80 mol% of meta-xylylenediamine and 80 to 20 mol% of para More preferably, it contains xylylenediamine, more preferably 60-80 mol % meta-xylylenediamine and 40-20 mol % para-xylylenediamine.
- it is desirable to lower the mold temperature when molding the resin composition in order to suppress a decrease in the oriented magnetic field.
- a polyamide resin having a high crystallization rate can be used.
- the dicarboxylic acid-derived structural unit of the xylylenediamine-based polyamide resin is preferably 75 mol% or more, more preferably 80 mol% or more, still more preferably 85 mol% or more, still more preferably 90 mol% or more, still more preferably At least 95 mol %, even more preferably at least 98 mol %, is derived from ⁇ , ⁇ -straight chain aliphatic dicarboxylic acids with 4 to 12 carbon atoms. Further, 100 mol % of the dicarboxylic acid-derived structural units of the xylylenediamine-based polyamide resin may be derived from an ⁇ , ⁇ -straight-chain aliphatic dicarboxylic acid having 4 to 12 carbon atoms.
- Adipic acid, sebacic acid, suberic acid, dodecanedioic acid, and the like can be preferably used as the ⁇ , ⁇ -straight-chain aliphatic dicarboxylic acid having 4 to 12 carbon atoms, and adipic acid, sebacic acid, and dodecanedioic acid can be preferably used. More preferred, dodecanedioic acid is even more preferred.
- dodecanedioic acid By using dodecanedioic acid, the melt viscosity of the xylylenediamine-based polyamide resin can be lowered, the magnetic material can be more effectively dispersed in the polyamide resin, and the magnetization of the resulting molded article can be increased. .
- diamines other than xylylenediamine that can be used as raw material diamine components for xylylenediamine-based polyamide resins include tetramethylenediamine, pentamethylenediamine, 2-methylpentanediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, Aliphatic diamines such as nonamethylenediamine, decamethylenediamine, dodecamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane , 1,4-bis(aminomethyl)cyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, bis(4-aminocyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane
- dicarboxylic acid components other than the ⁇ , ⁇ -straight-chain aliphatic dicarboxylic acids having 4 to 12 carbon atoms include phthalic acid compounds such as isophthalic acid, terephthalic acid and orthophthalic acid, 1,2-naphthalenedicarboxylic acid, 1,3 -naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalene Naphthalenedicarboxylic acid isomers such as dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and 2,7-naphthalenedicarboxylic acid can be exemplified, and one or a mixture of two or more thereof can be used.
- phthalic acid compounds such as isophthalic acid
- the xylylenediamine-based polyamide resin used in the present embodiment is composed mainly of diamine-derived structural units and dicarboxylic acid-derived structural units, but does not completely exclude structural units other than these. - Needless to say, structural units derived from lactams such as caprolactam and laurolactam, and aliphatic aminocarboxylic acids such as aminocaproic acid and aminoundecanoic acid may be included.
- the term "main component" as used herein means that among the constituent units constituting the xylylenediamine-based polyamide resin, the total number of constituent units derived from diamine and constituent units derived from dicarboxylic acid is the largest among all constituent units.
- the sum of diamine-derived structural units and dicarboxylic acid-derived structural units in the xylylenediamine-based polyamide resin preferably accounts for 90% by mass or more of all structural units, and preferably 95% by mass or more. is more preferred, and it is even more preferred that it accounts for 99.9% by mass or more of all structural units excluding terminal groups.
- a first example of the xylylenediamine-based polyamide resin in the present embodiment includes xylylenediamine containing 10 to 90 mol% of meta-xylylenediamine and 90 to 10 mol% of para-xylylenediamine (preferably meta-xylylenediamine).
- the sum of diamine and paraxylylenediamine is 95 mol% or more)
- the ⁇ , ⁇ -linear aliphatic dicarboxylic acid having 4 to 12 carbon atoms contains dodecanedioic acid (preferably a structure derived from dicarboxylic acid 95 mol % or more of the units are dodecanedioic acid) is a xylylenediamine-based polyamide resin.
- the crystallization rate can be increased and the mold temperature during molding can be lowered. Therefore, there is a tendency to obtain a resin composition with higher magnetization. Further, by using dodecanedioic acid as the dicarboxylic acid, the melt viscosity of the polyamide resin can be lowered, and the magnetic material can be more effectively dispersed in the polyamide resin.
- xylylenediamine-based polyamide resin in the present embodiment 70 mol% or more (preferably 95 mol% or more) of the constituent units derived from the diamine are derived from meta-xylylenediamine, and the dicarboxylic acid-derived It is a xylylenediamine-based polyamide resin in which 70 mol % or more (preferably more than 95 mol %) of the structural units are derived from adipic acid.
- the xylylenediamine-based polyamide resin of the first example is particularly preferably used.
- the xylylenediamine-based polyamide resin preferably has an apparent shear rate of 121.6 sec ⁇ 1 and a melt viscosity measured at a measurement temperature of 260° C. of 600 Pa s or less, preferably 450 Pa s or less. is more preferably 300 Pa ⁇ s or less, even more preferably 250 Pa ⁇ s or less, even more preferably 150 Pa ⁇ s or less, and even more preferably 149 Pa ⁇ s or less.
- the amount equal to or less than the above upper limit, it becomes possible to more effectively disperse the magnetic material in the polyamide resin.
- the lower limit of the melt viscosity of the xylylenediamine-based polyamide resin is preferably 10 Pa s or more, more preferably 30 Pa s or more, further preferably 40 Pa s or more, and 45 Pa s. s or more is more preferable.
- the content is at least the above lower limit, the occurrence of burrs during various moldings such as injection molding is suppressed, and the impact resistance of the molded product tends to be improved.
- the polyamide resin in the resin composition of the present embodiment contains two or more xylylenediamine-based polyamide resins, and/or when it includes both a xylylenediamine-based polyamide resin and another polyamide resin, the polyamide resin of the mixture
- the resin composition of the present embodiment may contain only the xylylenediamine-based polyamide resin as the polyamide resin, or may contain one or more polyamide resins other than the xylylenediamine-based polyamide resin. may contain.
- polyamide resins known polyamide resins can be used, and semi-aromatic polyamide resins and/or aliphatic polyamide resins are preferably included, and aliphatic polyamide resins are more preferably included.
- the semi-aromatic polyamide resin is composed of diamine-derived structural units and dicarboxylic acid-derived structural units, and 20 to 80 mol% of the total structural units of the diamine-derived structural units and dicarboxylic acid-derived structural units have an aromatic ring.
- semi-aromatic polyamide resin is a structural unit containing By using such a semi-aromatic polyamide resin, the mechanical strength of the resulting molded article can be increased.
- semi-aromatic polyamide resins include terephthalic acid-based polyamide resins (polyamide 6T, polyamide 9T, polyamide 10T, polyamide 6T/6I).
- aliphatic polyamide resins include polymers having structural units linked by amide bonds, such as acid amides obtained by ring-opening polymerization of lactams, polycondensation of aminocarboxylic acids, and polycondensation of diamines and dibasic acids, More than 80 mol % (preferably 90 mol % or more) of the raw material monomer is a non-aromatic compound.
- Aliphatic polyamide resins include polyamide 6, polyamide 11, polyamide 12, polyamide 46, polyamide 66, polyamide 610, polyamide 612, polyamide 6/66, polyamide 1010, and polyamide 6/66, polyamide 66 and polyamide 6. Polyamide 66 and polyamide 6 are more preferred.
- the proportion of the xylylenediamine-based polyamide resin in the polyamide resin is preferably 85% by mass or more, more preferably 90% by mass or more, more preferably 95% by mass of the total amount of the polyamide resin. % or more, more preferably 97 mass % or more, and may be 99 mass % or more.
- the upper limit is 100% by mass.
- the resin composition of this embodiment contains a magnetic material. By including a magnetic material, it can function as a resin composition for a bonded magnet.
- a magnetic material conventionally known magnetic materials used for bond magnets can be used. Magnetic materials are typically powders.
- Magnetic materials preferably used in this embodiment include ferrite magnets and/or rare earth magnets. Examples of ferrite magnets include strontium ferrite magnets and barium ferrite magnets, with strontium ferrite magnets being preferred. Examples of rare earth magnets include Sm/Co magnets, Sm/FeN magnets, Nd/Fe/B magnets (neodymium magnets), and Ce/Co magnets, with neodymium magnets being preferred.
- the magnetic material used in the present embodiment usually has a number average particle diameter of 0.05 to 300 ⁇ m, particularly 0.05 to 300 ⁇ m, from the viewpoint of the melt fluidity of the resin composition, the orientation of the magnetic powder, the filling rate, and the like. It is preferably about 1 to 100 ⁇ m.
- the magnetic material (preferably magnetic powder) can be blended with the polyamide resin after subjecting it to a known pretreatment as necessary. In this case, although not particularly limited, it is preferable to perform a coupling treatment using a known coupling agent such as a silane coupling agent or a titanate-based coupling agent, and such a coupling treatment is performed. By using a magnetic material, it is possible to more effectively improve the melt fluidity at the time of high filling.
- a silane coupling agent described in paragraph 0020 of JP-A-2001-123067 and a titanate-based coupling agent described in paragraph 0021 of the same document can be used. incorporated into.
- magnetic powders described in paragraphs 0041 to 0047 of JP-A-2005-072564 can also be used, the contents of which are incorporated herein.
- the resin composition of the present embodiment contains 90 to 10 parts by mass of the magnetic material with respect to 10 to 90 parts by mass of the polyamide resin.
- the proportion of the polyamide resin is preferably 20 parts by mass or more, more preferably 30 parts by mass or more. It is more preferably 40 parts by mass or more, still more preferably 45 parts by mass or more, and even more preferably 50 parts by mass or more.
- the proportion of the polyamide resin is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, when the total of the polyamide resin and the magnetic material is 100 parts by mass. It is preferably 65 parts by mass or less, more preferably 60 parts by mass or less, and even more preferably 55 parts by mass or less. When the content is equal to or less than the upper limit, the magnetic properties of the bonded magnet tend to be further improved.
- the resin composition of the present embodiment may contain only one kind of polyamide resin (xylylenediamine-based polyamide resin, other polyamide resin) and magnetic material, or may contain two or more kinds thereof. .
- the total amount is preferably within the above range.
- the total amount of the polyamide resin and the magnetic material is preferably 85% by mass or more of the total resin composition, more preferably 90% by mass or more, and 95% by mass or more. It is more preferably 97% by mass or more, and may be 99% by mass or more.
- the upper limit of the total amount of the polyamide resin and the magnetic material is 100 mass % or less of the entire resin composition.
- the resin composition of the present embodiment may consist only of the polyamide resin and the magnetic material, or may contain other components.
- the resin composition of the present embodiment may contain other components within the scope of the present embodiment.
- additives include thermoplastic resins other than polyamide resins, elastomers, fillers, ultraviolet absorbers, antioxidants, hydrolysis resistance modifiers, weather stabilizers, matting agents, fluorescent brighteners, dripping Antistatic agents, antistatic agents, antifogging agents, antiblocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, flame retardants and the like. These components may be used alone or in combination of two or more. For details of the other components, the description of paragraphs 0130 to 0155 of Japanese Patent No.
- thermoplastic resin described in paragraph 0012 of JP-A-2001-123067 the description of the elastomer described in paragraphs 0014-0015 of the same document, and the elastomer described in paragraphs 0016-0040 of JP-A-2004-285096.
- the descriptions can also be considered, and the contents thereof are incorporated herein.
- the resin composition of the present embodiment is prepared so that the total amount of the polyamide resin, the magnetic material, and other components blended as necessary is 100% by mass.
- the method for producing the resin composition of the present embodiment is not particularly limited, but a method using a single-screw or twin-screw extruder having equipment for devolatilization from a vent port as a kneader is preferred.
- the polyamide resin, the magnetic material, and other components to be blended as necessary may be supplied to the kneader all at once, or after the polyamide resin component is supplied, the other blending components are sequentially supplied. may Also, two or more components selected from each component may be mixed and kneaded in advance.
- the resin composition (for example, pellets) described above is molded by various molding methods to obtain molded articles. That is, the molded article of this embodiment is formed from the resin composition of this embodiment.
- the shape of the molded product is not particularly limited and can be appropriately selected according to the use and purpose of the molded product. , odd-shaped products, hollow products, frame-shaped products, box-shaped products, panel-shaped products, button-shaped products, and the like. Among them, film-shaped, frame-shaped, panel-shaped, and button-shaped ones are preferable, and the thickness of the frame-shaped and panel-shaped ones is, for example, about 1 mm to 5 mm.
- the method for molding the molded article is not particularly limited, and conventionally known molding methods can be employed, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, blow molding, Gas-assisted blow molding method, blow molding method, extrusion blow molding method, IMC (in-mold coating molding) method, rotational molding method, multi-layer molding method, two-color molding method, insert molding method, sandwich molding method, foam molding method , pressure molding, and the like.
- the resin composition of the present embodiment is suitable for molded articles obtained by injection molding, injection compression molding, and extrusion molding, and is further suitable for molded articles obtained by extrusion (extrusion molding).
- the resin composition of the present embodiment is not limited to the molded articles obtained therefrom.
- the resin composition or molded article of the present embodiment is preferably used for resin members that require magnetic properties.
- Examples include servo motors, stepping motors, buzzers, reed switches, electrical components, magnet bars, magnet rolls, HDD spindle motors, mobile phone vibration motors, video camera motors, reel motors, magnetic seals, deflection yokes, generators, and shutters.
- the internal temperature was increased, and when the temperature reached 240°C, the pressure inside the reaction vessel was reduced, and the internal temperature was further increased to continue the melt polycondensation reaction at 250°C for 10 minutes. Thereafter, the inside of the system was pressurized with nitrogen, and the resulting polymer was taken out from the strand die and pelletized to obtain a polyamide resin (MP12).
- the obtained MP12 had a melt viscosity of 146 Pa ⁇ s.
- MXD6 Polyamide resin synthesized from meta-xylylenediamine and adipic acid, manufactured by Mitsubishi Gas Chemical Company, #6000, melt viscosity of 150 Pa s
- PA6 Polyamide 6, manufactured by Ube Industries, Ltd., 1022B, melt viscosity of 772 Pa s
- melt viscosity of the polyamide resin was measured under the conditions of an apparent shear rate of 121.6 sec -1 , a measurement temperature of 260°C, a preheating time of 6 minutes, and a moisture content of the polyamide resin of 0.06% by mass or less.
- the unit is Pa ⁇ s.
- a Capillograph D-1 manufactured by Toyo Seiki Co., Ltd. was used, and the measurement was performed under the conditions of a die of 1 mm diameter and a length of 10 mm.
- Magnetic material Strontium ferrite Strontium ferrite magnet, manufacturer: DOWA Electronics Co., Ltd., product number: OP-71 Nd/Fe/B: Neodymium magnet, manufacturer: Aichi Steel Co., Ltd., product number: MFP-12
- ⁇ Chemical resistance test> The pellets obtained above were injection molded using an injection molding machine (manufactured by Sumitomo Heavy Industries, Ltd., SE130DU-HP) under the conditions of a cylinder temperature of 270°C, a mold temperature of 30°C, and a molding cycle of 55 seconds. , ISO multi-purpose specimens (thickness: 4 mm) were molded. The flexural modulus (unit: GPa) was measured according to JIS K 7171. In addition, the ISO multi-purpose test piece was immersed in a 10% by mass CaCl 2 aqueous solution at 23° C. for 90 days, and then the flexural modulus (unit: GPa) was measured according to JIS K 7171.
- the ISO multi-purpose test piece was immersed in a 10% by mass H 2 SO 4 aqueous solution at 23° C. for 90 days, and then the flexural modulus (unit: GPa) was measured according to JIS K 7171.
- the flexural modulus retention rate was calculated from the following formula.
- Elastic modulus retention (%) (A/B) x 100 (A: flexural modulus after immersion in CaCl2 aqueous solution or H2SO4 aqueous solution ( GPa ), B: flexural modulus before immersion in CaCl2 aqueous solution or H2SO4 aqueous solution (GPa))
- Magnetic properties of the resin composition were measured at room temperature using a DC self-recording magnetometer (TRF-5AH, manufactured by Toei Industry Co., Ltd.).
- the residual magnetic flux density Br (G), the coercive forces bHc (Oe) and iHc (Oe), and the maximum energy product BHmax (MGOe) were determined from the obtained BH curve.
- the resin composition of the present invention had high magnetization performance. Furthermore, it was possible to exhibit the excellent performance that the xylylenediamine-based polyamide resin inherently has without hindering it. In particular, by using MP12 as the xylylenediamine-based polyamide resin, remarkably high magnetization performance could be achieved.
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Abstract
Description
本発明はかかる課題を解決することを目的とするものであって、磁化に優れた成形品を提供可能な樹脂組成物、および、前記樹脂組成物から形成された成形品を提供することを目的とする。
<1>ポリアミド樹脂10~90質量部と、磁性材料90~10質量部とを含み、前記ポリアミド樹脂が、ジアミン由来の構成単位とジカルボン酸由来の構成単位を含み、前記ジアミン由来の構成単位の70モル%以上がキシリレンジアミンに由来し、前記ジカルボン酸由来の構成単位の70モル%以上が炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸に由来するキシリレンジアミン系ポリアミド樹脂を含む、ボンド磁石用樹脂組成物。
<2>前記キシリレンジアミンが10~90モル%のメタキシリレンジアミンと90~10モル%のパラキシリレンジアミンを含む、<1>に記載の樹脂組成物。
<3>前記炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸が、ドデカン二酸を含む、<1>または<2>に記載の樹脂組成物。
<4>前記キシリレンジアミンが10~90モル%のメタキシリレンジアミンと90~10モル%のパラキシリレンジアミンを含み、前記炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸が、ドデカン二酸を含む、<1>に記載の樹脂組成物。
<5>前記ジアミン由来の構成単位の70モル%以上がメタキシリレンジアミンに由来し、前記ジカルボン酸由来の構成単位の70モル%以上がアジピン酸に由来する、<1>に記載の樹脂組成物。
<6>前記キシリレンジアミン系ポリアミド樹脂の見かけのせん断速度121.6sec-1、測定温度260℃で測定した溶融粘度が10~600Pa・sである、<1>~<5>のいずれか1つに記載の樹脂組成物。
<7>前記磁性材料がフェライト磁石および/または希土類磁石を含む、<1>~<6>のいずれか1つに記載の樹脂組成物。
<8>前記キシリレンジアミン系ポリアミド樹脂の121.6sec-1、測定温度260℃で測定した溶融粘度が10~600Pa・sであり、前記磁性材料がフェライト磁石および/または希土類磁石を含む、<1>~<7>のいずれか1つに記載の樹脂組成物。
<9><1>~<8>のいずれか1つに記載の樹脂組成物から形成された成形品。
なお、本明細書において「~」とはその前後に記載される数値を下限値および上限値として含む意味で使用される。
本明細書において、各種物性値および特性値は、特に述べない限り、23℃におけるものとする。
本明細書で示す規格が年度によって、測定方法等が異なる場合、特に述べない限り、2021年1月1日時点における規格に基づくものとする。
また、キシリレンジアミン系ポリアミド樹脂に磁性材料を配合しても、キシリレンジアミン系ポリアミド樹脂が本来的に有する優れた性能を維持することができる。特に、キシリレンジアミン系ポリアミド樹脂が本来的に有する優れた耐薬品性や低吸水率を阻害することなく、高い磁化を発揮させることができる。
本実施形態の樹脂組成物は、ポリアミド樹脂を含み、前記ポリアミド樹脂が、ジアミン由来の構成単位とジカルボン酸由来の構成単位を含み、前記ジアミン由来の構成単位の70モル%以上がキシリレンジアミンに由来し、前記ジカルボン酸由来の構成単位の70モル%以上が炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸に由来するキシリレンジアミン系ポリアミド樹脂を含む。
キシリレンジアミンは、メタキシリレンジアミンおよびパラキシリレンジアミンの少なくとも1種を含むことが好ましく、キシリレンジアミンが10~90モル%のメタキシリレンジアミンと90~10モル%のパラキシリレンジアミンを含むことが好ましく(ただし、メタキシリレンジアミンとパラキシリレンジアミンの合計が100モル%を超えることはない、以下同じ)、20~80モル%のメタキシリレンジアミンと80~20モル%のパラキシリレンジアミンを含むことがさらに好ましく、60~80モル%のメタキシリレンジアミンと40~20モル%のパラキシリレンジアミンを含むことが一層好ましい。
本実施形態の樹脂組成物においては、配向磁界の低下を抑制するために、樹脂組成物を成形する際の金型温度を低くすることが望ましい。金型温度を低くする手段の1つとして、結晶化速度が速いポリアミド樹脂を用いることができる。本実施形態においては、キシリレンジアミンとして、メタキシリレンジアミンとパラキシリレンジアミンの両方を用いることにより、結晶化速度を早くすることができ好ましい。
炭素数が4~12のα,ω-直鎖脂肪族ジカルボン酸は、アジピン酸、セバシン酸、スベリン酸、ドデカン二酸などが好適に使用でき、アジピン酸、セバシン酸、および、ドデカン二酸がより好ましく、ドデカン二酸がさらに好ましい。ドデカン二酸を用いると、キシリレンジアミン系ポリアミド樹脂の溶融粘度を低くでき、磁性材料をより効果的にポリアミド樹脂中に分散させることができ、得られる成形品の磁化をより高くすることができる。
本実施形態においては、特に、第一の例のキシリレンジアミン系ポリアミド樹脂が好ましく用いられる。
本実施形態の樹脂組成物におけるポリアミド樹脂が、キシリレンジアミン系ポリアミド樹脂を2種以上含む場合、および/または、キシリレンジアミン系ポリアミド樹脂と他のポリアミド樹脂の両方を含む場合、混合物のポリアミド樹脂の溶融粘度が上記範囲を満たすことが好ましい。
溶融粘度は後述する実施例の記載に従って測定される。
他のポリアミド樹脂を含む場合、公知のポリアミド樹脂を使用でき、半芳香族ポリアミド樹脂および/または脂肪族ポリアミド樹脂を含むことが好ましく、脂肪族ポリアミド樹脂を含むことがより好ましい。
半芳香族ポリアミド樹脂とは、ジアミン由来の構成単位とジカルボン酸由来の構成単位から構成され、ジアミン由来の構成単位およびジカルボン酸由来の構成単位の合計構成単位の20~80モル%が芳香環を含む構成単位であることをいう。このような半芳香族ポリアミド樹脂を用いることにより、得られる成形品の機械的強度を高くすることができる。
半芳香族ポリアミド樹脂としては、テレフタル酸系ポリアミド樹脂(ポリアミド6T、ポリアミド9T、ポリアミド10T、ポリアミド6T/6I)が例示される。
脂肪族ポリアミド樹脂としては、ラクタムの開環重合、アミノカルボン酸の重縮合、ジアミンと二塩基酸の重縮合により得られる酸アミド等のアミド結合で連結した構成単位を有する高分子であって、原料モノマーの80モル%超(好ましくは90モル%以上)が非芳香族化合物であるものをいう。
脂肪族ポリアミド樹脂としては、ポリアミド6、ポリアミド11、ポリアミド12、ポリアミド46、ポリアミド66、ポリアミド610、ポリアミド612、ポリアミド6/66、ポリアミド1010が挙げられ、ポリアミド6/66、ポリアミド66およびポリアミド6が好ましく、ポリアミド66およびポリアミド6がより好ましい。
本実施形態の樹脂組成物は、磁性材料を含む。磁性材料を含むことにより、ボンド磁石用樹脂組成物として機能させることができる。
磁性材料としては、従来から、ボンド磁石に用いられている公知の磁性材料を用いることができる。磁性材料は、通常、粉末である。
本実施形態で好ましく用いられる磁性材料としては、フェライト磁石および/または希土類磁石が挙げられる。フェライト磁石としては、ストロンチウムフェライト磁石およびバリウムフェライト磁石が例示され、ストロンチウムフェライト磁石が好ましい。また、希土類磁石としては、Sm/Co磁石、Sm/FeN磁石、Nd/Fe/B磁石(ネオジウム磁石)、Ce/Co磁石が例示され、ネオジウム磁石が好ましい。
磁性材料(好ましくは磁性粉)は、必要に応じて公知の前処理を施して、ポリアミド樹脂とブレンドすることができる。この場合、特に制限されるものではないが、シランカップリング剤やチタネート系カップリング剤などの公知のカップリング剤を用いてカップリング処理を施すことが好ましく、このようなカップリング処理を施した磁性材料を用いることにより、高充填時の溶融流動性をより効果的に向上させることができる。カップリング剤としては、特開2001-123067号公報の段落0020に記載のシランカップリング剤、同文献の段落0021に記載のチタネート系カップリング剤を用いることができ、これらの内容は本明細書に組み込まれる。
上記の他、磁性材料としては、特開2005-072564号公報の段落0041~0047に記載の磁性粉も用いることができ、この内容は本明細書に組み込まれる。
本実施形態の樹脂組成物、ポリアミド樹脂10~90質量部に対し、磁性材料90~10質量部を含む。本実施形態の樹脂組成物は、ポリアミド樹脂と磁性材料の合計を100質量部としたとき、ポリアミド樹脂の割合が20質量部以上であることが好ましく、30質量部以上であることがより好ましく、40質量部以上であることがさらに好ましく、45質量部以上であることが一層好ましく、50質量部以上であることがより一層好ましい。前記下限値以上とすることにより、流動性が良くなり、混練性や成形性が向上する傾向にある。また、本実施形態の樹脂組成物は、ポリアミド樹脂と磁性材料の合計を100質量部としたとき、ポリアミド樹脂の割合が80質量部以下であることが好ましく、70質量部以下であることがより好ましく、65質量部以下であることがさらに好ましく、60質量部以下であることが一層好ましく、55質量部以下であることがより一層好ましい。前記上限値以下とすることにより、ボンド磁石の磁気特性がより向上する傾向にある。
本実施形態の樹脂組成物は、ポリアミド樹脂と磁性材料の合計量が、樹脂組成物全体の85質量%以上であることが好ましく、90質量%以上であることがより好ましく、95質量%以上であることがさらに好ましく、97質量%以上であることが一層好ましく、99質量%以上であってもよい。前記ポリアミド樹脂と磁性材料の合計量の上限は、樹脂組成物全体の100質量%以下である。
本実施形態の樹脂組成物は、ポリアミド樹脂と磁性材料のみからなっていてもよいし、他の成分を含んでいてもよい。
本実施形態の樹脂組成物は、本実施形態の趣旨を逸脱しない範囲で他の成分を含んでいてもよい。このような添加剤としては、ポリアミド樹脂以外の熱可塑性樹脂、エラストマー、充填材、紫外線吸収剤、酸化防止剤、耐加水分解性改良剤、耐候安定剤、艶消剤、蛍光増白剤、滴下防止剤、帯電防止剤、防曇剤、アンチブロッキング剤、流動性改良剤、可塑剤、分散剤、抗菌剤、難燃剤などが挙げられる。これらの成分は、1種のみを用いてもよいし、2種以上を併用してもよい。
上記他の成分の詳細は、特許第4894982号公報の段落0130~0155の記載、特開2010-281027号公報の段落0021の記載、特開2016-223037号公報の段落0036の記載を参酌でき、これらの内容は本明細書に組み込まれる。また、特開2001-123067号公報の段落0012に記載の熱可塑性樹脂、同文献の段落0014~0015に記載のエラストマーの記載、特開2004-285096号公報の段落0016~0040に記載のエラストマーの記載も参酌でき、これらの内容は本明細書に組み込まれる。
本実施形態の樹脂組成物は、上記ポリアミド樹脂、磁性材料、および、必要に応じて配合される他の成分の合計が100質量%となるように調製される。
本実施形態の樹脂組成物の製造方法は、特に制限されないが、ベント口から脱揮できる設備を有する単軸または2軸の押出機を混練機として使用する方法が好ましい。上記ポリアミド樹脂、磁性材料、および、必要に応じて配合される他の成分を、混練機に一括して供給してもよいし、ポリアミド樹脂成分を供給した後、他の配合成分を順次供給してもよい。また、各成分から選ばれた2種以上の成分を予め混合、混練しておいてもよい。
上記した樹脂組成物(例えば、ペレット)は、各種の成形法で成形して成形品とされる。すなわち、本実施形態の成形品は、本実施形態の樹脂組成物から形成される。成形品の形状としては、特に制限はなく、成形品の用途、目的に応じて適宜選択することができ、例えば、フィルム状、ロッド状、円筒状、環状、円形状、楕円形状、多角形形状、異形品、中空品、枠状、箱状、パネル状、ボタン状のもの等が挙げられる。中でも、フィルム状、枠状、パネル状、ボタン状のものが好ましく、厚さは例えば、枠状、パネル状の場合1mm~5mm程度である。
本実施形態の樹脂組成物ないし成形品は、磁気特性が要求される樹脂部材に好ましく用いられる。例えば、サーボモーター、ステッピングモーター、ブザー、リードスイッチ、電装部品、マグネットバー、マグネットロール、HDDスピンドルモーター、携帯電話の振動モーター、ビデオカメラ用モーター、リールモーター、磁気シール、偏向ヨーク、発電機、シャッター、回転子、プリンター部品、スピンドルモーター、トルクリミッタ、ホール素子、オイルクリーナー、リニアモーター、リング、タコメーカーなどに用いられる。
実施例で用いた測定機器等が廃番等により入手困難な場合、他の同等の性能を有する機器を用いて測定することができる。
ポリアミド樹脂
MP12:下記合成例に従って合成した。
<MP12の合成>
撹拌機、分縮器、全縮器、温度計、滴下ロートおよび窒素導入管、ストランドダイを備えた反応容器に、1,12-ドデカン二酸11377g(49.4mol)および酢酸ナトリウム/次亜リン酸ナトリウム・一水和物(モル比=1/1.5)11.66gを仕込み、十分に窒素置換した後、さらに少量の窒素気流下で系内を撹拌しながら170℃まで加熱溶融した。
メタキシリレンジアミンとパラキシリレンジアミンのモル比が70/30である混合キシリレンジアミン6647g(メタキシリレンジアミン34.16mol、パラキシリレンジアミン14.64mol、三菱ガス化学社製)を、反応容器内の溶融物に撹拌下で滴下し、生成する縮合水を系外に排出しながら、内温を連続的に2.5時間かけて235℃まで昇温した。滴下終了後、内温を上昇させ、240℃に達した時点で反応容器内を減圧にし、さらに内温を上昇させて250℃で10分間、溶融重縮合反応を継続した。その後、系内を窒素で加圧し、得られた重合物をストランドダイから取り出して、ペレット化することにより、ポリアミド樹脂(MP12)を得た。
得られたMP12の溶融粘度は、146Pa・sであった。
PA6:ポリアミド6、宇部興産社製、1022B、溶融粘度は772Pa・s
ポリアミド樹脂の溶融粘度は、見かけのせん断速度121.6sec-1、測定温度260℃、予熱時間を6分、ポリアミド樹脂の水分率0.06質量%以下の条件で測定した。単位は、Pa・sで示した。
具体的には、(株)東洋精機(Toyoseiki Seisaku-sho,Ltd.)製のキャピログラフ(Capillograph)D-1を使用し、ダイ:1mmφ×10mm長さの条件で測定した。
ストロンチウムフェライト:ストロンチウムフェライト磁石、製造元:DOWAエレクトロニクス(株)、品番:OP-71
Nd/Fe/B:ネオジウム磁石、製造元:愛知製鋼(株)、品番:MFP-12
<コンパウンド>
後述する表1(各成分は質量%で示した)に示す組成となるように、各成分をそれぞれ秤量し、ドライブレンドした後、二軸押出機(芝浦機械社製、TEM26SS)のスクリュー根元から2軸スクリュー式カセットウェイングフィーダ(クボタ社製、CE-W-1-MP)を用いて投入して溶融混練し、樹脂組成物(ペレット)を得た。押出機の温度設定は、280℃とした。
上記で得られたペレットを、射出成形機(住友重機械工業(株)製、SE130DU-HP)を用いて、シリンダー温度270℃、金型温度30℃、成形サイクル55秒の条件で射出成形し、ISO多目的試験片(厚み:4mm)を成形した。JIS K 7171に従い、曲げ弾性率(単位:GPa)を測定した。
また、ISO多目的試験片を、23℃の10質量%のCaCl2水溶液に90日間浸漬した後、JIS K 7171に従い、曲げ弾性率(単位:GPa)を測定した。
また、ISO多目的試験片を、23℃の10質量%のH2SO4水溶液に90日間浸漬した後、JIS K 7171に従い、曲げ弾性率(単位:GPa)を測定した。
下記式より、曲げ弾性率保持率を算出した。
弾性率保持率(%)=(A/B)×100
(A:CaCl2水溶液またはH2SO4水溶液に浸漬後の曲げ弾性率(GPa)、B:CaCl2水溶液またはH2SO4水溶液に浸漬する前の曲げ弾性率(GPa))
上記で得られたISO多目的試験片を、23℃の純水に120日間浸漬した。浸漬前後の試験片の質量から、吸水率を下記式算出した。
吸水率(%)=[(水浸漬後の試験片の質量-水浸漬前の試験片の質量)/水浸漬前の試験片の質量]×100
樹脂組成物の磁気特性の測定については、直流自記磁束計(東英工業(株)製、TRF-5AH)を用い、常温で測定した。得られたB-H曲線から残留磁束密度Br(G)、保磁力bHc(Oe)およびiHc(Oe)、最大エネルギー積BHmax(MGOe)をそれぞれ求めた。
Claims (9)
- ポリアミド樹脂10~90質量部と、磁性材料90~10質量部とを含み、
前記ポリアミド樹脂が、ジアミン由来の構成単位とジカルボン酸由来の構成単位を含み、前記ジアミン由来の構成単位の70モル%以上がキシリレンジアミンに由来し、前記ジカルボン酸由来の構成単位の70モル%以上が炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸に由来するキシリレンジアミン系ポリアミド樹脂を含む、ボンド磁石用樹脂組成物。 - 前記キシリレンジアミンが10~90モル%のメタキシリレンジアミンと90~10モル%のパラキシリレンジアミンを含む、請求項1に記載の樹脂組成物。
- 前記炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸が、ドデカン二酸を含む、請求項1または2に記載の樹脂組成物。
- 前記キシリレンジアミンが10~90モル%のメタキシリレンジアミンと90~10モル%のパラキシリレンジアミンを含み、
前記炭素数4~12のα,ω-直鎖脂肪族ジカルボン酸が、ドデカン二酸を含む、請求項1に記載の樹脂組成物。 - 前記ジアミン由来の構成単位の70モル%以上がメタキシリレンジアミンに由来し、前記ジカルボン酸由来の構成単位の70モル%以上がアジピン酸に由来する、請求項1に記載の樹脂組成物。
- 前記キシリレンジアミン系ポリアミド樹脂の121.6sec-1、測定温度260℃で測定した溶融粘度が10~600Pa・sである、請求項1~5のいずれか1項に記載の樹脂組成物。
- 前記磁性材料がフェライト磁石および/または希土類磁石を含む、請求項1~6のいずれか1項に記載の樹脂組成物。
- 前記キシリレンジアミン系ポリアミド樹脂の121.6sec-1、測定温度260℃で測定した溶融粘度が10~600Pa・sであり、前記磁性材料がフェライト磁石および/または希土類磁石を含む、請求項1~7のいずれか1項に記載の樹脂組成物。
- 請求項1~8のいずれか1項に記載の樹脂組成物から形成された成形品。
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JP2016223037A (ja) | 2015-06-02 | 2016-12-28 | 宇部興産株式会社 | モノフィラメント |
WO2020250564A1 (ja) * | 2019-06-11 | 2020-12-17 | 三菱瓦斯化学株式会社 | フィラメントおよび釣り糸 |
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2022
- 2022-06-15 WO PCT/JP2022/023902 patent/WO2023037684A1/ja active Application Filing
- 2022-06-15 CN CN202280060203.2A patent/CN117940514A/zh active Pending
- 2022-06-15 JP JP2023546778A patent/JPWO2023037684A1/ja active Pending
- 2022-08-30 TW TW111132616A patent/TW202321348A/zh unknown
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JP2004285096A (ja) | 2003-03-19 | 2004-10-14 | Daicel Degussa Ltd | ポリアミド樹脂組成物及びボンド磁石 |
JP2005072564A (ja) | 2003-08-01 | 2005-03-17 | Sumitomo Metal Mining Co Ltd | ボンド磁石用組成物およびボンド磁石 |
JP2007003223A (ja) * | 2005-06-21 | 2007-01-11 | Nsk Ltd | 磁気エンコーダ及び前記磁気エンコーダを備える転がり軸受ユニット |
JP2010281027A (ja) | 2010-08-30 | 2010-12-16 | Mitsubishi Chemicals Corp | ポリアミドフィラメント |
JP4894982B1 (ja) | 2011-04-12 | 2012-03-14 | 三菱瓦斯化学株式会社 | ポリアミド樹脂系複合材およびその製造方法 |
JP2014101494A (ja) * | 2012-10-22 | 2014-06-05 | Unitika Ltd | 半芳香族ポリアミド樹脂組成物およびそれを成形してなる成形体 |
JP2016223037A (ja) | 2015-06-02 | 2016-12-28 | 宇部興産株式会社 | モノフィラメント |
WO2020250564A1 (ja) * | 2019-06-11 | 2020-12-17 | 三菱瓦斯化学株式会社 | フィラメントおよび釣り糸 |
Also Published As
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CN117940514A (zh) | 2024-04-26 |
JPWO2023037684A1 (ja) | 2023-03-16 |
TW202321348A (zh) | 2023-06-01 |
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