WO2023026161A1 - 遮光装置 - Google Patents
遮光装置 Download PDFInfo
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- WO2023026161A1 WO2023026161A1 PCT/IB2022/057827 IB2022057827W WO2023026161A1 WO 2023026161 A1 WO2023026161 A1 WO 2023026161A1 IB 2022057827 W IB2022057827 W IB 2022057827W WO 2023026161 A1 WO2023026161 A1 WO 2023026161A1
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- 230000000903 blocking effect Effects 0.000 title abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 39
- 238000012545 processing Methods 0.000 claims description 21
- 238000004804 winding Methods 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000012937 correction Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 65
- 239000010410 layer Substances 0.000 description 494
- 239000000463 material Substances 0.000 description 127
- 239000010408 film Substances 0.000 description 116
- 229920005989 resin Polymers 0.000 description 87
- 239000011347 resin Substances 0.000 description 87
- 230000006870 function Effects 0.000 description 70
- 239000000758 substrate Substances 0.000 description 70
- 239000004065 semiconductor Substances 0.000 description 49
- 238000010586 diagram Methods 0.000 description 38
- 239000000126 substance Substances 0.000 description 37
- 239000012044 organic layer Substances 0.000 description 36
- 229910052751 metal Inorganic materials 0.000 description 31
- 239000002184 metal Substances 0.000 description 31
- -1 polyethylene terephthalate Polymers 0.000 description 27
- 238000002347 injection Methods 0.000 description 20
- 239000007924 injection Substances 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 239000011241 protective layer Substances 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 150000002894 organic compounds Chemical class 0.000 description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 11
- 239000003086 colorant Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000005525 hole transport Effects 0.000 description 10
- 230000032258 transport Effects 0.000 description 10
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910044991 metal oxide Inorganic materials 0.000 description 8
- 150000004706 metal oxides Chemical class 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229910052738 indium Inorganic materials 0.000 description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000009719 polyimide resin Substances 0.000 description 7
- 239000004800 polyvinyl chloride Substances 0.000 description 7
- 229920000915 polyvinyl chloride Polymers 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229920006122 polyamide resin Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 230000000295 complement effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052733 gallium Inorganic materials 0.000 description 5
- 230000002452 interceptive effect Effects 0.000 description 5
- 238000004768 lowest unoccupied molecular orbital Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000004695 Polyether sulfone Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- WZJYKHNJTSNBHV-UHFFFAOYSA-N benzo[h]quinoline Chemical class C1=CN=C2C3=CC=CC=C3C=CC2=C1 WZJYKHNJTSNBHV-UHFFFAOYSA-N 0.000 description 4
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 229920002678 cellulose Polymers 0.000 description 4
- 239000001913 cellulose Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910000449 hafnium oxide Inorganic materials 0.000 description 4
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000004770 highest occupied molecular orbital Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 150000002484 inorganic compounds Chemical class 0.000 description 4
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920006393 polyether sulfone Polymers 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 238000004549 pulsed laser deposition Methods 0.000 description 4
- 239000002096 quantum dot Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- XESMNQMWRSEIET-UHFFFAOYSA-N 2,9-dinaphthalen-2-yl-4,7-diphenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC(C=2C=C3C=CC=CC3=CC=2)=NC2=C1C=CC1=C(C=3C=CC=CC=3)C=C(C=3C=C4C=CC=CC4=CC=3)N=C21 XESMNQMWRSEIET-UHFFFAOYSA-N 0.000 description 3
- DHDHJYNTEFLIHY-UHFFFAOYSA-N 4,7-diphenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC=NC2=C1C=CC1=C(C=3C=CC=CC=3)C=CN=C21 DHDHJYNTEFLIHY-UHFFFAOYSA-N 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 3
- 240000004050 Pentaglottis sempervirens Species 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 150000001454 anthracenes Chemical class 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 3
- 150000001716 carbazoles Chemical class 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 150000001925 cycloalkenes Chemical class 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229910001195 gallium oxide Inorganic materials 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Chemical group 0.000 description 3
- 239000002121 nanofiber Substances 0.000 description 3
- 150000002790 naphthalenes Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 229920005749 polyurethane resin Polymers 0.000 description 3
- 239000005033 polyvinylidene chloride Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 150000003222 pyridines Chemical class 0.000 description 3
- 229940083082 pyrimidine derivative acting on arteriolar smooth muscle Drugs 0.000 description 3
- 150000003230 pyrimidines Chemical class 0.000 description 3
- 150000003252 quinoxalines Chemical class 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical class N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 235000015842 Hesperis Nutrition 0.000 description 2
- 235000012633 Iberis amara Nutrition 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910000583 Nd alloy Inorganic materials 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229940027991 antiseptic and disinfectant quinoline derivative Drugs 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000002484 cyclic voltammetry Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 150000004826 dibenzofurans Chemical class 0.000 description 2
- IYYZUPMFVPLQIF-ALWQSETLSA-N dibenzothiophene Chemical class C1=CC=CC=2[34S]C3=C(C=21)C=CC=C3 IYYZUPMFVPLQIF-ALWQSETLSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002220 fluorenes Chemical class 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- 150000002240 furans Chemical class 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- 150000002390 heteroarenes Chemical class 0.000 description 2
- 238000003702 image correction Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical class [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002605 large molecules Chemical class 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000004702 methyl esters Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 150000004866 oxadiazoles Chemical class 0.000 description 2
- 150000007978 oxazole derivatives Chemical class 0.000 description 2
- 125000002971 oxazolyl group Chemical class 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 150000005041 phenanthrolines Chemical class 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 125000003373 pyrazinyl group Chemical group 0.000 description 2
- 150000003220 pyrenes Chemical class 0.000 description 2
- 125000000714 pyrimidinyl group Chemical group 0.000 description 2
- 150000003248 quinolines Chemical class 0.000 description 2
- 125000002943 quinolinyl group Chemical class N1=C(C=CC2=CC=CC=C12)* 0.000 description 2
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 150000007979 thiazole derivatives Chemical class 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 150000003577 thiophenes Chemical class 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 125000005580 triphenylene group Chemical group 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical group [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical class C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 1
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical group C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000004105 2-pyridyl group Chemical group N1=C([*])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- AEJARLYXNFRVLK-UHFFFAOYSA-N 4H-1,2,3-triazole Chemical group C1C=NN=N1 AEJARLYXNFRVLK-UHFFFAOYSA-N 0.000 description 1
- JWBHNEZMQMERHA-UHFFFAOYSA-N 5,6,11,12,17,18-hexaazatrinaphthylene Chemical compound C1=CC=C2N=C3C4=NC5=CC=CC=C5N=C4C4=NC5=CC=CC=C5N=C4C3=NC2=C1 JWBHNEZMQMERHA-UHFFFAOYSA-N 0.000 description 1
- RSRXYYMFVWHYBW-UHFFFAOYSA-N 9,10-bis(methylcarbamoyl)perylene-3,4-dicarboxylic acid Chemical compound C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(=O)NC)C2=C1C3=CC=C2C(=O)NC RSRXYYMFVWHYBW-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 235000002673 Dioscorea communis Nutrition 0.000 description 1
- 241000544230 Dioscorea communis Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910012294 LiPP Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 208000035753 Periorbital contusion Diseases 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004373 Pullulan Substances 0.000 description 1
- 229920001218 Pullulan Polymers 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- 238000004847 absorption spectroscopy Methods 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 1
- 229940054051 antipsychotic indole derivative Drugs 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 210000001367 artery Anatomy 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical group [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- YVVVSJAMVJMZRF-UHFFFAOYSA-N c1cncc(c1)-c1cccc(c1)-c1cccc(c1)-c1nc(nc(n1)-c1cccc(c1)-c1cccc(c1)-c1cccnc1)-c1cccc(c1)-c1cccc(c1)-c1cccnc1 Chemical compound c1cncc(c1)-c1cccc(c1)-c1cccc(c1)-c1nc(nc(n1)-c1cccc(c1)-c1cccc(c1)-c1cccnc1)-c1cccc(c1)-c1cccc(c1)-c1cccnc1 YVVVSJAMVJMZRF-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 1
- 229910000024 caesium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical group [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001893 coumarin derivatives Chemical class 0.000 description 1
- 150000001907 coumarones Chemical class 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000005331 diazinyl group Chemical group N1=NC(=CC=C1)* 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004424 eye movement Effects 0.000 description 1
- 210000000744 eyelid Anatomy 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical group [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- VVVPGLRKXQSQSZ-UHFFFAOYSA-N indolo[3,2-c]carbazole Chemical class C1=CC=CC2=NC3=C4C5=CC=CC=C5N=C4C=CC3=C21 VVVPGLRKXQSQSZ-UHFFFAOYSA-N 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002361 inverse photoelectron spectroscopy Methods 0.000 description 1
- 210000000554 iris Anatomy 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical group [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 238000004776 molecular orbital Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical class N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical group [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- CRLLGLJOPXYTLX-UHFFFAOYSA-N neodymium silver Chemical compound [Ag].[Nd] CRLLGLJOPXYTLX-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- FVDOBFPYBSDRKH-UHFFFAOYSA-N perylene-3,4,9,10-tetracarboxylic acid Chemical class C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(O)=O)C2=C1C3=CC=C2C(=O)O FVDOBFPYBSDRKH-UHFFFAOYSA-N 0.000 description 1
- 150000002987 phenanthrenes Chemical class 0.000 description 1
- 150000005359 phenylpyridines Chemical class 0.000 description 1
- 238000001420 photoelectron spectroscopy Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Chemical class 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 150000004033 porphyrin derivatives Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical class [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 150000003518 tetracenes Chemical class 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical group [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 208000008918 voyeurism Diseases 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
- B60J3/00—Antiglare equipment associated with windows or windscreens; Sun visors for vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
- B60J3/00—Antiglare equipment associated with windows or windscreens; Sun visors for vehicles
- B60J3/02—Antiglare equipment associated with windows or windscreens; Sun visors for vehicles adjustable in position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/21—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/55—Instruments with parts that can change their shape or position to configure an active screen, e.g. by folding or by rolling
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F21/00—Mobile visual advertising
- G09F21/04—Mobile visual advertising by land vehicles
- G09F21/049—Mobile visual advertising by land vehicles giving information to passengers inside the vehicles
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/40—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G5/00—Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
- G09G5/36—Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators characterised by the display of a graphic pattern, e.g. using an all-points-addressable [APA] memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/77—Instrument locations other than the dashboard
- B60K2360/785—Instrument locations other than the dashboard on or in relation to the windshield or windows
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2380/00—Specific applications
- G09G2380/10—Automotive applications
Definitions
- One aspect of the present invention relates to a mobile object.
- One aspect of the present invention relates to a vehicle.
- One aspect of the present invention relates to a light shielding device for a moving object such as a vehicle.
- Another aspect of the present invention relates to a control method for a light shielding device for a moving body such as a vehicle.
- Another aspect of the present invention relates to a display device included in a light shielding device for a moving body such as a vehicle.
- Another aspect of the present invention relates to a lighting device included in a light shielding device for a moving body such as a vehicle.
- Another aspect of the present invention relates to a power generation device included in a light shielding device for a moving object such as a vehicle.
- one aspect of the present invention is not limited to the above technical field.
- a technical field of one embodiment of the invention disclosed in this specification and the like relates to a product, a method, or a manufacturing method.
- one aspect of the invention relates to a process, machine, manufacture, or composition of matter. Therefore, technical fields of one embodiment of the present invention disclosed in this specification more specifically include vehicles, semiconductor devices, display devices, light-emitting devices, lighting devices, power storage devices, storage devices, driving methods thereof, or Methods for their production can be cited as an example.
- moving objects include trains, monorails, ships, flying objects (helicopters, airplanes, rockets), and the like.
- flying objects examples include automobiles, buses, and trucks.
- a detachable sunshade that is fixed with a suction cup or the like is sometimes used as a sunshade that covers the vehicle window.
- this configuration is complicated to attach, and it is necessary to secure a storage space after removal. Therefore, it has been proposed to equip a vehicle with a light shielding device that can be deployed and retracted (Patent Document 1).
- Patent document 1 shows an example in which a vehicle roof has a light shielding device storage section.
- the light shielding device disclosed in Patent Document 1 only has a function as a light shielding device, and does not have means for displaying an image or the like.
- the light shielding device disclosed in Patent Document 1 is intended to be used on the rear window, and has a structure that is difficult to use in a vehicle equipped with a rearview mirror (also called an inside mirror) on the front window. be.
- a rearview mirror also called an inside mirror
- a light shielding device that is divided between the driver's seat side and the passenger's seat side creates a gap, it is difficult to sufficiently shield the front window from light.
- the air heated between the front window and the shading device diffuses into the vehicle through the gaps in the shading device, so the temperature inside the vehicle tends to rise.
- the display device when the display device is installed on the surface of the light shielding device on the inside of the vehicle (also referred to as the inner surface of the vehicle), or when the surface of the light shielding device on the inner side of the vehicle is used as the projection surface of the projector device, The display quality is degraded in the structure in which the side panel and the passenger side panel are separated.
- the display device disclosed in Patent Document 2 can provide a large-screen display device in a vehicle, but there is no disclosure of a function as a light shielding device provided in the vehicle.
- One aspect of the present invention is a light shielding device used in a vehicle, the light shielding device includes a light shielding portion, a storage portion, and a driving means, and the light shielding portion has a display portion on an inner surface of the vehicle.
- the storage unit is located on the roof of the vehicle, and the drive unit has a first function of deploying the light shielding unit to the first position and a second function of deploying the light shielding unit to the second position. and a third function of storing the light shielding part in a third position inside the storage part, the first position being a position where the light shielding part does not block the driver's forward vision, and the second function.
- the position of 1 is the light shielding device where the light shielding portion covers 80% or more of the area of the front window of the vehicle.
- the light shielding part has a reflective layer on the outer surface of the vehicle, the reflective layer has an aluminum layer and a silicon nitride layer on the aluminum layer, and the reflectance of the reflective layer is is preferably 80% or more.
- the light shielding part has a solar cell on the outer surface of the vehicle, and the solar cell has a silicon solar cell, a CIGS solar cell, or a perovskite solar cell. is preferred.
- the display unit is electrically connected to the image output unit, and the image output unit has an image processing unit that performs correction processing on an image to be output to the display unit.
- the section preferably has a function of stretching the image in the vertical direction and correcting it into a trapezoidal shape with a wider width on the lower side.
- the light shielding portion has a spring portion connected to the display portion and a support portion connected to the spring portion, and the support portion is provided inside the pillar of the vehicle. It is connected to a movable portion of the driving means, the movable portion is connected to the first winding portion and the second winding portion, and in the first function, the second function and the third function, the second Either one or both of the first winding section and the second winding section perform a rotating operation.
- the storage section has a transmission section, and that the transmission section and the display section overlap when the light shielding section is at the third position.
- one aspect of the present invention is a light shielding device used in a vehicle
- the light shielding device includes a light shielding portion, a storage portion, and a driving means
- the storage portion is positioned in a roof portion of the vehicle.
- the light shielding portion has a first portion having an opening, a second portion connected to the first portion, and a third portion connected to the second portion, wherein the opening is The size is larger than the size of the rearview mirror of the vehicle
- the driving means moves the light shielding portion to the roof in the first state where the first portion, the second portion, and the third portion overlap.
- a first mechanism that expands downward from the portion a second mechanism that tilts the light shielding portion in the first state substantially parallel to the front window of the vehicle without contacting the rearview mirror, and the light shielding portion that tilts. and a third mechanism for deploying the second portion and the third portion so as to be substantially parallel to the front window.
- a light shielding device having a display device which is used in a moving object such as a vehicle.
- a moving object such as a vehicle equipped with a light shielding device having a display device.
- a method for developing a light shielding device having a display device it is possible to provide a light shielding device that can be deployed and retracted by driving means such as an electric motor.
- driving means such as an electric motor.
- a display device that can be included in the light shielding device.
- a display method of a display device that can be included in the light shielding device is possible to provide.
- a light shielding device used for a front window of a vehicle it is possible to provide a light shielding device that is not divided between the driver's seat side and the passenger seat side as a light shielding device used for the front window of a vehicle. Further, as a light shielding device used for a front window of a vehicle, it is possible to provide a light shielding device capable of reducing the space between the front window and the light shielding device. Further, it is possible to provide a configuration in which the light shielding device is provided with a display device.
- a light shielding device for use in a vehicle having a front window with a rearview mirror. Further, it is possible to provide a light shielding device that is not divided between the driver's seat side and the passenger's seat side as a light shielding device for use in a vehicle having a rearview mirror on the front window. Further, as a light shielding device for use in a vehicle having a rearview mirror on the front window, it is possible to provide a light shielding device capable of reducing the space between the front window and the light shielding device. Further, it is possible to provide a configuration in which the light shielding device is provided with a display device.
- 1A and 1B are diagrams for explaining a configuration example of a light shielding device according to an embodiment.
- 2A to 2D are diagrams illustrating configuration examples of the light shielding device according to the embodiment.
- 3A and 3B are diagrams for explaining a configuration example of a light shielding device according to an embodiment.
- 4A to 4C are diagrams illustrating configuration examples of the light shielding device according to the embodiment.
- 5A to 5C are diagrams for explaining a configuration example of the light shielding device according to the embodiment.
- 6A and 6B are diagrams for explaining a configuration example of a light shielding device according to an embodiment.
- 7A to 7E are diagrams for explaining image correction according to the embodiment.
- 8A and 8B are diagrams for explaining a configuration example of a light shielding device according to an embodiment.
- 9A1 to 9D2 are diagrams illustrating configuration examples of the light shielding device according to the embodiment.
- 10A1 to 10D2 are diagrams illustrating configuration examples of the light shielding device according to the embodiment.
- 11A to 11C are diagrams for explaining a configuration example of the light shielding device according to the embodiment.
- 12A to 12C are diagrams illustrating configuration examples of display devices.
- 13A to 13F are diagrams showing configuration examples of pixels.
- FIG. 14 is a diagram illustrating a configuration example of a display device.
- 15A and 15B are diagrams illustrating configuration examples of display devices.
- 16A to 16F are diagrams showing configuration examples of light emitting devices.
- 17A and 17B are diagrams showing configuration examples of light receiving devices.
- 17C to 17E are diagrams showing configuration examples of display devices.
- 18A and 18B are top views showing configuration examples of the display panel.
- 19A to 19C are top views showing configuration examples of the display panel.
- 20A and 20B are cross-sectional views showing configuration examples of the display panel.
- 21A to 21C are diagrams for explaining the display panel and the display device of Example 1.
- FIG. 22A and 22B are diagrams illustrating the display device of Example 1.
- FIG. 23 is an appearance photograph of the display device of Example 1.
- film and the term “layer” may be interchangeable.
- conductive layer to the term “conductive film.”
- insulating film to the term “insulating layer”.
- FIG. 1A and 1B show an example of a light shielding device of one embodiment of the present invention.
- FIG. 1A shows a schematic bird's-eye view of the exterior of a vehicle 60A
- FIG. 1B shows a perspective view of the vehicle 60A from the inside.
- the light shielding device 50 having the light shielding portion 51 deployed near the front window 61 inside the vehicle 60A is installed on the roof portion 59 (also referred to as the roof portion) of the vehicle 60A.
- the light shielding device 50 has a light shielding portion 51 and a storage portion 52 .
- the storage part 52 has a function of storing the light shielding part 51 and a function of expanding it.
- the light shielding portion 51 and the display portion 53 have flexibility.
- the light shielding part 51 preferably has a flexible substrate (also called sheet, film or screen). Moreover, when the light shielding part 51 has the display part 53 , the display part 53 may be used as the substrate of the light shielding part 51 .
- flexible substrates include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, and polyether resins.
- Sulfone (PES) resin polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene Flexible materials such as (PTFE) resins, ABS resins, cellulose nanofibers, etc. can be used.
- the light shielding part 51 preferably has a function of blocking light from outside the vehicle on the surface on the vehicle exterior side (also referred to as a vehicle exterior surface), and more preferably has a function of reflecting light from the vehicle exterior.
- the transmittance of the light blocking portion 51 to visible light is preferably 20% or less, more preferably 10% or less, and 5% or less. It is more preferably 0%, more preferably 0%.
- the light shielding portion 51 when the light shielding portion 51 has a function of reflecting light from the outside of the vehicle, the light shielding portion 51 is formed of a metal layer such as aluminum, titanium, silver, an aluminum-titanium alloy, an aluminum-neodymium alloy, or a silver-neodymium alloy. It can have a reflective layer used. Methods for forming the metal layer include vapor deposition, sputtering, CVD (Chemical Vapor Deposition), PLD (Pulsed Laser Deposition), ALD (Atomic Layer Deposition), MCVD (Metal CVD), MOCVD (Metal Organic CVD). ) method can be used.
- the metal layer may be formed directly on the substrate of the light shielding portion 51 or may be formed on another substrate and then attached to the light shielding portion 51 .
- the reflective layer may also have a transparent inorganic layer such as silicon oxide, silicon nitride, silicon oxynitride, and silicon oxynitride on a metal layer such as aluminum.
- a transparent inorganic layer such as silicon oxide, silicon nitride, silicon oxynitride, and silicon oxynitride on a metal layer such as aluminum.
- the inorganic layer prevents deterioration (such as oxidation) of the surface of the metal layer, thereby suppressing a decrease in the reflectance of the reflective layer, which is preferable.
- a vapor phase method such as a vapor deposition method, a sputtering method, a CVD method, a PLD method, an ALD method, or a liquid phase method such as a sol-gel method can be used.
- a reflective layer having an inorganic layer on a metal layer for example, a structure in which a silicon nitride layer is provided on an aluminum layer can be used.
- the reflectance of the reflective layer to visible light is preferably 50% or more, more preferably 80% or more, more preferably 90% or more, and more preferably 95% or more.
- the light shielding part 51 may have a power generation device.
- a photoelectric conversion device such as a solar cell or a temperature difference power generation device can be used as the power generation device.
- a photoelectric conversion device such as a solar cell is preferably provided on the surface of the light shielding portion 51 on the vehicle exterior side.
- the power generator included in the light shielding part 51 also has flexibility.
- a thin-film solar cell may be used as the flexible solar cell.
- the thin-film solar cell it is preferable to use a silicon-type solar cell using silicon such as amorphous silicon, polysilicon, and single-crystal silicon.
- a CIGS-type solar cell using a semiconductor material CIGS made of copper (Cu), indium (In), gallium (Ga), and selenium (Se).
- a perovskite solar cell using a material having a perovskite structure (NH 3 CH 3 PbI 3 or the like).
- FIG. 2A to 2D are diagrams explaining the deployment and storage of the light blocking device 50.
- FIG. FIG. 2A is a cross-sectional schematic diagram showing a state in which the light shielding unit 51 is stored in the storage unit 52 in the light shielding device 50 of the vehicle 60A.
- 2B and 2C are cross-sectional schematic diagrams showing a state in which the light shielding device 50 of the vehicle 60A has the light shielding portion 51 deployed near the front window 61.
- FIG. 2A by storing the light shielding part 51 in the storage part 52 in the roof part 59 of the vehicle 60A, the internal space of the roof part 59, which is conventionally rarely used, can be effectively utilized. It is preferable because
- the light shielding device 50 can have a plurality of deployment positions as the deployment positions of the lower end portion of the light shielding portion 51 .
- the light shielding portion 51 can be used as a sun visor during driving by the driver.
- FIG. 2D is a schematic view from the inside of the vehicle 60A showing a state in which the lower end portion of the light shielding portion 51 shown in FIG. 2B is deployed to the first deployment position P1. In the first deployed position P1, the light blocking portion 51 does not obstruct the driver's forward vision, so the driver can drive in this state.
- the lower end of the light shielding portion 51 is within 50% or less of the vertical length of the front window 61 from the upper end of the front window 61 as seen from the driver.
- the display part 53 is displayed by a camera provided outside the vehicle body when the light shielding part 51 is deployed at the first deployment position P1.
- map information In addition to displaying captured images, map information, traffic information, vehicle position information, route to destination, distance, traveling direction, estimated time of arrival, time, speed, direction, temperature, humidity, air pressure, inclination angle, Various information such as altitude can be displayed to assist driving.
- the light blocking portion 51 is positioned so as to overlap the front window 61 from the upper end to the lower end. Therefore, when the light shielding portion 51 is deployed to the second deployed position P2, when the vehicle is stopped, parked, reversed, and driven by the driving automation system at level 4 (advanced driving automation) and level 5 (complete driving automation). time, etc.
- the light blocking portion 51 is deployed at the second deployment position P2, it is preferable to cover 80% or more of the area of the front window 61, more preferably 90% or more, and more preferably 95% or more. More preferably, 100% coverage is more preferred.
- the display unit 53 when the display unit 53 is provided on the vehicle interior side of the light shielding unit 51, the display unit 53 can display images captured by a camera provided outside the vehicle body, as well as map information, traffic information, and information about the vehicle itself. It can display various information to support driving, such as location information, route to destination, distance, direction of travel, estimated time of arrival, time, speed, direction, temperature, humidity, atmospheric pressure, angle of inclination, altitude, etc. can. In addition, the display unit 53 displays television broadcasts, images recorded on various media, images transmitted from information terminals such as notebook PCs, tablet terminals, mobile phones, smart phones, portable game machines, and the like. be able to.
- information terminals such as notebook PCs, tablet terminals, mobile phones, smart phones, portable game machines, and the like.
- FIG. 3A and 3B show an example of a block diagram of a vehicle 60 in which a light shielding device 50 having a display section 53 is incorporated.
- the vehicle 60 has, for example, a shading device 50, an image output section 67, an operation section 66, and the like.
- the light shielding device 50 has a light shielding section 51, a driving means 54, etc.
- the light shielding section 51 has a display section 53
- the display section 53 has a display panel 55.
- the display panel 55 preferably has flexibility. When the display panel 55 has flexibility, it can be deformed into a state in which the display surface is flat or curved, a state in which the display panel 55 is rolled up and stored, or a state in which the display panel 55 is folded and stored. Note that the display device described in Embodiment 2 is preferably used as the display panel 55 .
- the driving means 54 of the light shielding device 50 can expand and retract the light shielding portion 51 having the display portion 53 .
- the driving means 54 can be operated by an operating portion 66, for example.
- ⁇ Development and storage method 1 of the light shielding device> 4A to 6B an example of a method for unfolding and storing the light shielding device 50 and the driving means 54 will be described.
- FIG. 4A is a schematic diagram of a region 81 indicated by a dashed line in FIG. 2D.
- the light shielding portion 51 has a display portion 53 , a spring portion 57 and a support portion 58 . Inside the opening 65 of the pillar 70 , the support portion 58 is connected to a movable portion 71 of the driving means 54 , which will be described later.
- the pillar 70 refers to a portion of the vehicle indicated by a two-dot chain line shown in FIGS. 2D and 4A.
- the movable portion 71 has a function of expanding the light shielding portion 51 in the direction of the solid line arrow in the drawing and of retracting the light shielding portion 51 in the direction of the broken line arrow.
- the support portion 58 is connected to the display portion 53 via the spring portion 57 .
- the spring portion 57 By connecting the supporting portion 58 and the display portion 53 via the spring portion 57, it is possible to suppress the bending of the display portion 53 when the light shielding portion 51 is unfolded.
- the spring portion 57 it is not limited to the spring as long as it is configured to apply a constant force (tension) toward the outside so that the display portion 53 does not bend.
- an elastic body such as rubber may be used.
- FIGS. 4B and 4C are cross-sectional schematic diagrams of the roof portion 59 and the pillar 70 shown in FIG. 4A.
- the driving means 54 will be described with reference to FIGS. 4B and 4C.
- the driving means 54 has a movable portion 71 and a plurality of guide portions 72 .
- the movable portion 71 is connected to the support portion 58 in the fixed region 73A, the movable portion 71 is connected to part of the display portion 53 in the fixed region 73B, and the movable portion 71 is connected to the image output portion 67 in the fixed region 73B.
- One or more of the guide portions 72 are connected to a motor.
- the light shielding section 51 has a display section 53, a reflective layer 56, a spring section 57, and a support section 58, and has a region connected to the image output section 67.
- the support portion 58 connected to the display portion 53 via the spring portion 57 is connected to the movable portion 71 in the fixed area 73A.
- the display portion 53 is connected to the movable portion 71 in a fixed region 73B opposite to the side connected to the spring portion 57 .
- the movable portion 71 is in contact with a plurality of guide portions 72, and one or more of the guide portions 72 are connected to a motor.
- the movable portion 71 can move in the direction of the solid line arrow in the drawing when the light shielding portion 51 is deployed, and in the direction of the broken line arrow in the drawing when the light shielding portion 51 is retracted, by the rotating operation of the motor.
- a constant force (tension) is applied to the display section 53 even when the movable section 71 moves, so that the display section 53 is bent. can be suppressed.
- the driving means 54 shown in FIG. 4C is an example of driving means different from that in FIG. 4B.
- the drive means 54 has a movable portion 71, a plurality of guide portions 72, and winding portions 74 (74A, 74B).
- the movable portion 71 is connected to the support portion 58 in the fixed region 73A
- the movable portion 71 is connected to part of the display portion 53 in the fixed region 73B
- the movable portion 71 is connected to the image output portion 67 in the fixed region 73B.
- One or more of the winding units 74 (74A, 74B) are connected to a motor.
- the light shielding section 51 has a display section 53, a reflective layer 56, a spring section 57, and a support section 58, and has a region connected to the image output section 67.
- the support portion 58 connected to the display portion 53 via the spring portion 57 is connected to the movable portion 71 in the fixed region 73A.
- the display portion 53 is connected to the movable portion 71 in a fixed region 73B opposite to the side connected to the spring portion 57 .
- the movable portion 71 is connected to the winding portion 74A and the winding portion 74B, and at least one of the winding portion 74A and the winding portion 74B is connected to a motor.
- the movable portion 71 is in contact with a plurality of guide portions 72, and due to the rotation of the motor, moves in the direction of the solid line arrow in the figure when the light shielding portion 51 is deployed, and in the direction of the broken line arrow in the figure when the light shielding portion 51 is retracted. can do.
- the fixed region 73A and the fixed region 73B as described above are provided, a constant force (tension) is applied to the display section 53 even when the movable section 71 moves, so that the display section 53 is bent. can be suppressed.
- the drive means 54 shown in FIGS. 4B and 4C is preferably provided inside the pillar 70, but may be provided outside the pillar 70. Moreover, although not shown, it is preferable to have the drive means 54 on both the left pillar 70 and the right pillar 70 of the vehicle 60 . Moreover, the spring portion 57 is not limited to one location, and it is preferable to connect the display portion 53 and the support portion 58 at two or more locations.
- FIGS. 5A to 5C show an example in which the support portion 58 is connected to the display portion 53 via the spring portion 57, but a structure without the spring portion 57 is shown in the example shown in FIGS. 5A to 5C. may be
- FIGS. 6A and 6B show modifications of the region 75 of FIGS. 4C and 5C.
- 6A and 6B show an example in which the light shielding device 50 has a rotation mechanism 77 corresponding to the winding section 74B in FIGS. 4C and 5C, a shaft section 76, and an image output section 67 inside the shaft section 76. is shown.
- the thickness of the light shielding portion 51 can be, for example, 10 ⁇ m or more and 5 mm or less, preferably 20 ⁇ m or more and 4 mm or less, more preferably 50 ⁇ m or more and 3 mm or less, typically 100 ⁇ m or more and 2 mm or less. As the thickness of the light shielding portion 51 is thinner, the size of the light shielding device 50 when the light shielding portion 51 is wound can be made more compact. strength may decrease. Further, by having an appropriate thickness of, for example, about 0.5 mm or more and 5 mm or less, it is possible to suppress problems such as waviness of the display surface even when the light shielding portion 51 is unfolded. Further, a material having stretchability may be used as the light shielding portion 51 .
- the shaft portion 76 has a function of fixing one end of the light shielding portion 51 .
- an image output portion 67 having a ribbon cable electrically connected to the display portion 53, an FPC (Flexible Printed Circuit), and the like is arranged.
- a connector and wiring for electrically connecting to the image output unit 67 are provided in the shaft portion 76 .
- the shaft portion 76 preferably includes circuitry for supplying signals and voltages to the light shielding portion 51 .
- a structure having one or more of an antenna, a wireless receiver, a wireless transmitter, a power supply line, a battery, a printed circuit board on which ICs such as an arithmetic unit and a storage device are mounted, an external connection port, etc. good too.
- the diameter of the shaft portion 76 the smaller the size of the light shielding device 50 when the light shielding portion 51 is wound up.
- the diameter of the shaft portion 76 may be determined according to the curvature allowed when the light shielding portion 51 is bent.
- the diameter of the shaft portion 76 can be 0.1 mm or more and 50 mm or less, preferably 0.5 mm or more and 30 mm or less, more preferably 1 mm or more and 20 mm or less, and more preferably 2 mm or more and 10 mm or less.
- the diameter of the shaft portion 76 By setting the diameter of the shaft portion 76 to 0.1 mm or more, bending of the shaft portion 76 due to the weight of the light shielding portion 51 can be suppressed. Further, by setting the diameter of the shaft portion 76 to 50 mm or less, the size of the winding portion 74B can be made sufficiently compact.
- the rotating mechanism 77 has a function of rotating the shaft portion 76 .
- the bearing portion 78 has a function of supporting the shaft portion 76 .
- the rotating mechanism 77 may be configured to rotate the shaft portion 76 by a combination of power such as a motor and gears, for example.
- the display unit 53 included in the light shielding device 50 shown in FIG. 1B and the like has a display panel 55 as shown in FIG. 3A, and an image output unit 67 can be connected to the display panel 55 .
- Video and images output from the image output unit 67 can be displayed on the display surface of the display panel 55 .
- the display panel 55 can display images taken by a camera provided outside the vehicle body via an image output unit 67, as well as map information, traffic information, vehicle position information, route to the destination, distance, and progress.
- various other information such as time, speed, direction, temperature, humidity, air pressure, angle of inclination, and altitude can be displayed.
- an image output unit 67 such as a television broadcast receiver (tuner), a media reproducing device for reproducing video information recorded in a storage device such as a CD, a DVD, a memory card, etc.
- a television broadcast receiver tuner
- a media reproducing device for reproducing video information recorded in a storage device such as a CD, a DVD, a memory card, etc.
- the television Various images such as John's broadcast can also be displayed on the display panel 55 .
- Information terminals such as notebook PCs, tablet terminals, mobile phones, smart phones, portable game machines, etc., and the image output unit 67 are connected wirelessly or by wire. An image or the like can also be displayed on the display panel 55 via the image output section 67 .
- the display panel 55 may have a function as a touch panel. At this time, it is preferable that the display panel 55 displays an application and an icon linked to the operation of the application. By doing so, intuitive operation can be facilitated. For example, a touch operation may be used to move, enlarge, or reduce the map.
- the display unit 53 of the light shielding device 50 is deployed near the front window 61 of the vehicle body. ing. That is, the upper side of the display panel 55 is located near the driver's viewpoint, and the lower side of the display panel 55 is located far from the driver's viewpoint. From the viewpoint of the driver, the vertical width (also referred to as height) of the display panel 55 is narrow, and the horizontal width (also referred to as horizontal width) on the lower side of the display panel 55 is seen as an image 92 (FIG. 7B). Such a way of viewing may impair the display quality and visibility of the image displayed on the display panel 55 .
- an image processing unit 68 may be provided in addition to the configuration shown in FIG. 3A.
- FIG. 3B shows an example in which the image output section 67 has an image processing section 68 .
- the image processing unit 68 performs correction processing on the image data so that the image is vertically stretched so that the length of the image in the height direction becomes longer, and that the image has a trapezoidal shape with a wider horizontal width on the lower side.
- FIG. 7C shows a conceptual schematic diagram of the correction processing performed by the image processing unit 68.
- the image processing unit 68 preferably has a function of correcting the image displayed on the display unit 53 so that it appears to be positioned at the virtual display position 53IM.
- the image output unit 67 in FIG. 3B has a function of outputting the image 93 (FIG. 7D) obtained by the correction of the image processing unit 68 to the display panel 55.
- FIG. 7E an image 94 equivalent to the image data before correction can be viewed from the driver's viewpoint.
- FIG. 3B shows an example in which the image output unit 67 includes the image processing unit 68, but one aspect of the present invention is not limited to this configuration, and the image processing unit 68 may be provided separately from the image output unit 67. good.
- FIGS. 7A to 7E schematically show an image displayed on the display panel 55 and a visually recognized image, but for the sake of explanation, the difference between the displayed image and the visually recognized image is emphasized more than the actual image. is shown.
- FIGS. 8A-10D2 An example of a shading device 50 according to one aspect of the present invention is shown in FIGS. 8A-10D2.
- 2A and the like show an example in which the light shielding device 50 is installed in the vehicle 60A with the rearview mirror 62 attached to the roof 59, but in FIGS. 8A to 10D2, the rearview mirror 62 is attached to the front window 61.
- An example of installing a light shielding device 50B in a vehicle 60B in which the vehicle 60B is located is shown.
- FIG. 8A shows a schematic bird's-eye view of the appearance of vehicle 60B
- FIG. 8B shows a perspective view of vehicle 60B from the inside.
- the light shielding device 50B having the light shielding portion 51 deployed near the front window 61 inside the vehicle 60B is installed on the roof portion 59 of the vehicle 60B.
- the vehicle 60B shown in FIG. 8A and the like has a rearview mirror 62 attached to the front window 61. Therefore, when the light shielding device 50 is installed in the vehicle 60B and the unfolding operation and the retracting operation are performed as shown in FIGS. 2A to 2C, the light shielding portion 51 and the rearview mirror 62 interfere with each other. Therefore, it is preferable that the light blocking device 50B in the vehicle 60B shown in FIG. 8A and the like has a function of performing the deployment operation and the storage operation as shown in FIGS. 9A1 to 9D2 (deployment storage method 1). Alternatively, the light shielding device 50B in the vehicle 60B shown in FIG. 8A and the like preferably has a function of performing the deployment operation and the storage operation as shown in FIGS. 10A1 to 10D2 (deployment storage method 2).
- 9A1 to 9D2 show an example of a vehicle 60B equipped with a shading device.
- 9A1, 9B1, 9C1, and 9D1 are cross-sectional schematic diagrams showing the unfolding operation of the light shielding portion 51B-1.
- 9A2, 9B2, 9C2 and 9D2 are schematic diagrams of the vehicle interior corresponding to FIGS. 9A1, 9B1, 9C1 and 9D1, respectively.
- FIGS. 9A1 and 9A2 show a state in which the light shielding part 51B-1 (not shown) of the light shielding device 50B-1 (not shown) is stored in the storage part 52.
- FIG. 9B1 and 9B2 step S2 shown in FIGS. 9C1 and 9C2, and step S3 shown in FIGS. 9D1 and 9D2.
- the light shielding portion 51B-1 includes a first portion PT1, a second portion PT2 connected to the first portion PT1, and a third portion PT3 connected to the second portion PT2. and have The first portion PT1 has an opening PT1K at a position overlapping the rearview mirror 62, as shown in FIG. 9B2 and the like.
- the light blocking portion 51B-1 is expanded downward from the roof portion 59 in a state where the first portion PT1, the second portion PT2, and the third portion PT3 overlap each other.
- the light shielding portion 51B-1 is made substantially parallel to the front window 61 while the first portion PT1, the second portion PT2, and the third portion PT3 overlap each other. After being inclined so as to (also called as being close to), the second portion PT2 and the third portion PT3 are deployed so as to be substantially parallel to the front window 61 .
- the light shielding portion 51B-1 is unfolded so that the first portion PT1, the second portion PT2 and the third portion PT3 of the light shielding portion 51B-1 are close to the front window 61. can do.
- the housing of the light shielding portion 51B-1 can be performed in the reverse order of the above.
- the light shielding device 50B-1 develops the light shielding portion 51B-1 downward from the roof portion 59 in a state where the first portion PT1, the second portion PT2, and the third portion PT3 overlap each other. It has a first mechanism for Further, the light shielding device 50B-1 moves the light shielding portion 51B-1 substantially parallel to the front window 61 while the first portion PT1, the second portion PT2, and the third portion PT3 are overlapped with each other. It has a second mechanism that tilts (also referred to as proximate) to. The light shielding device 50B-1 also has a third mechanism that deploys the second portion PT2 and the third portion PT3 so as to be substantially parallel to the front window 61 while the first portion PT1 remains inclined.
- the light shielding part 51B-1 can be deployed without interfering with the room mirror 62 installed on the front window 61.
- FIG. 9B1 to 9D1 the light shielding part 51B-1 can be deployed without interfering with the dashboard 64 and the steering wheel 63 of the vehicle body.
- substantially parallel means, for example, a state in which two straight lines are arranged at an angle of -30° or more and 30° or less. Therefore, the case of ⁇ 20° or more and 20° or less is included, the case of ⁇ 10° or more and 10° or less is included, the case of ⁇ 5° or more and 5° or less is included, and the case of 0° is also included.
- FIGS. 10A1 to 10D2 An example of the shading device 50 is shown in FIGS. 10A1 to 10D2.
- 10A1, 10B1, 10C1 and 10D1 are cross-sectional schematic diagrams showing the unfolding operation of the light shielding part 51B-2 (not shown) of the light shielding device 50B-2 (not shown).
- 10A2, 10B2, 10C2 and 10D2 are schematic diagrams of the vehicle interior corresponding to FIGS. 10A1, 10B1, 10C1 and 10D1, respectively.
- FIGS. 10A1 and 10A2 show a state in which the light shielding part 51B-2 of the light shielding device 50B-2 is stored in the storage part 52.
- the light shielding portion 51B-2 has a first portion PT1 and a second portion PT2 connected to the first portion PT1.
- the first portion PT1 has an opening PT1K at a position overlapping the rearview mirror 62, as shown in FIG. 10B2 and the like.
- step S1 shown in FIG. 10B1 the first portion PT1 is deployed downward from the roof portion 59 while the second portion PT2 is curled.
- step S2 shown in FIG. 9C1 the light shielding portion 51B-2 is tilted so as to approach the front window 61 while the second portion PT2 is curled, and then the second portion PT2 is moved toward the front window 61. Expand towards the bottom edge.
- the light shielding portion 51B-2 can be unfolded so that the first portion PT1 and the second portion PT2 of the light shielding portion 51B-2 are close to the front window 61 in step S3 shown in FIG. 10D1.
- the housing of the light shielding portion 51B-2 can be performed in the reverse order of the above.
- the light shielding part 51B-2 can be deployed without interfering with the room mirror 62 installed on the front window 61.
- FIG. 10B1 to 10D1 the light blocking part 51B-2 can be deployed without interfering with the dashboard 64 and the steering wheel 63.
- FIG. 10B in addition, the housing of the light shielding portion 51B-2 can be performed in the reverse order of the above.
- the light shielding device 50B-1 and the light shielding device 50B-2 shown in the structure example 2 of the light shielding device have the same configuration as the light shielding device 50 shown in the structure example 1 of the light shielding device except for the difference in the deployment and storage method. can be done.
- FIG. 11A to 11C show examples in which the front window side (50F), the side window side (50S1, 50S2, 50S), and the rear window side (50R) each have a light shielding device. show.
- FIG. 11B is a diagram showing a state in which the light blocking devices 50F, 50S1, 50S2, 50S3, and 50R are being deployed
- FIG. 11C is a diagram showing a modification of the vehicle 60 including the light blocking device 50.
- a configuration of (50, 50B, 50B-1, 50B-2) can be used.
- the transmission portions 69 (69F, 69S2) are provided in the storage portions 52F, 52S2 of the light shielding devices 50F, 50S2, and the light shielding portion 51 is stored (for example, the light shielding portion is placed at the position shown in FIG. 2A). 51)
- the display portions 53F and 53S2 of the light shielding portion 51 overlap the transmission portions 69F and 69S2, the displays on the display portions 53F and 53S2 may be visible from inside the vehicle.
- the light shielding device 50F when the storage portion 52F of the light shielding device 50F has a transmission portion 69F and an image of the vehicle 60D above (image captured by an imaging means (not shown)) is displayed on the display portion 53F, the light shielding device 50F is used as a substitute for the sunroof.
- the appearance of the vehicle 60D can be improved.
- the use of the light shielding device 50F as a substitute for the sunroof is preferable because the light shielding device 50F is lighter than a general glass sunroof.
- a vehicle is described as an example of a mobile object in the present embodiment, the mobile object is not limited to a vehicle.
- moving objects include trains, monorails, ships, flying objects (helicopters, airplanes, rockets), and the like.
- flying objects include automobiles, buses, and trucks.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- Embodiment 2 In this embodiment, a structural example of a display device that can be used for the light shielding device of one embodiment of the present invention will be described. A display device exemplified below can be applied to the display panel 55 of the first embodiment.
- One embodiment of the present invention is a display device including a light-emitting element (also referred to as a light-emitting device).
- a display device has two or more light-emitting elements that emit light of different colors. Each light-emitting element has a pair of electrodes and an EL layer therebetween.
- the light-emitting element is preferably an organic EL element (organic electroluminescence element). Two or more light-emitting elements that emit different colors have EL layers each containing a different light-emitting material.
- a full-color display device can be realized by using three types of light-emitting elements that emit red (R), green (G), and blue (B) light.
- island-like layers containing at least light-emitting materials with different emission colors.
- a method of forming an island-shaped organic film by a vapor deposition method using a shadow mask such as a metal mask is known.
- various influences such as the precision of the metal mask, the misalignment between the metal mask and the substrate, the bending of the metal mask, and the broadening of the contour of the film to be formed due to the scattering of vapor, etc. cause island-like organic films.
- the layer profile may be blurred and the edge thickness may be reduced.
- the thickness of the island-shaped light-emitting layer may vary depending on the location.
- countermeasures have been taken to artificially increase the definition (also called pixel density) by adopting a special pixel arrangement method such as a pentile arrangement.
- an island shape indicates a state in which two or more layers using the same material formed in the same process are physically separated.
- an island-shaped light-emitting layer means that the light-emitting layer is physically separated from an adjacent light-emitting layer.
- an EL layer is processed into a fine pattern by photolithography without using a shadow mask such as a fine metal mask (FMM).
- a shadow mask such as a fine metal mask (FMM).
- FMM fine metal mask
- the EL layers can be separately formed, a display device with extremely vivid, high contrast, and high display quality can be realized.
- the EL layer may be processed into a fine pattern using both a metal mask and photolithography.
- part or all of the EL layer can be physically separated. Accordingly, leakage current between light-emitting elements can be suppressed through a layer (also referred to as a common layer) used in common between adjacent light-emitting elements. Thereby, crosstalk due to unintended light emission can be prevented, and a display device with extremely high contrast can be realized. In particular, a display device with high current efficiency at low luminance can be realized.
- One embodiment of the present invention can also be a display device in which a light-emitting element that emits white light and a color filter are combined.
- light-emitting elements having the same structure can be applied to light-emitting elements provided in pixels (sub-pixels) that emit light of different colors, and all layers can be common layers. Further, part or all of each EL layer is divided by photolithography. As a result, leakage current through the common layer is suppressed, and a high-contrast display device can be realized.
- a device having a tandem structure in which a plurality of light-emitting layers are stacked via a highly conductive intermediate layer, it is possible to effectively prevent leakage current through the intermediate layer, resulting in high brightness and high definition. , and high contrast.
- an insulating layer covering at least the side surface of the island-shaped light emitting layer.
- the insulating layer may cover part of the top surface of the island-shaped EL layer.
- a material having barrier properties against water and oxygen is preferably used for the insulating layer.
- an inorganic insulating film that hardly diffuses water or oxygen can be used. Accordingly, deterioration of the EL layer can be suppressed, and a highly reliable display device can be realized.
- a phenomenon occurs in which the common electrode is divided by a step at the end of the EL layer (also referred to as step disconnection). may insulate. Therefore, it is preferable to adopt a structure in which a local step located between two adjacent light emitting elements is filled with a resin layer functioning as a planarization film (also called LFP: Local Filling Planarization).
- the resin layer has a function as a planarizing film.
- FIG. 12A shows a schematic top view of the display device 100 of one embodiment of the present invention.
- the display device 100 includes, on a substrate 101, a plurality of red light emitting elements 110R, green light emitting elements 110G, and blue light emitting elements 110B.
- the light emitting region of each light emitting element is labeled with R, G, and B. As shown in FIG.
- the light emitting elements 110R, 110G, and 110B are arranged in a matrix.
- FIG. 12A shows a so-called stripe arrangement in which light emitting elements of the same color are arranged in one direction.
- the arrangement method of the light emitting elements is not limited to this, and an arrangement method such as an S-stripe arrangement, a delta arrangement, a Bayer arrangement, or a zigzag arrangement may be applied, or a pentile arrangement, a diamond arrangement, or the like may be used.
- an OLED Organic Light Emitting Diode
- a QLED Quadratum-dot Light Emitting Diode
- Examples of light-emitting substances that EL devices have include substances that emit fluorescence (fluorescent materials), substances that emit phosphorescence (phosphorescent materials), inorganic compounds (quantum dot materials, etc.), and substances that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF) material).
- connection electrode 111C electrically connected to the common electrode 113.
- FIG. 111 C of connection electrodes are given the electric potential (for example, anode electric potential or cathode electric potential) for supplying to the common electrode 113.
- FIG. The connection electrode 111C is provided outside the display area where the light emitting elements 110R and the like are arranged.
- connection electrodes 111C can be provided along the periphery of the display area. For example, it may be provided along one side of the periphery of the display area, or may be provided over two or more sides of the periphery of the display area. That is, when the top surface shape of the display area is rectangular, the top surface shape of the connection electrode 111C can be strip-shaped (rectangular), L-shaped, U-shaped (square bracket-shaped), square, or the like. .
- FIGS. 12B and 12C are schematic cross-sectional views corresponding to dashed-dotted lines A1-A2 and dashed-dotted lines A3-A4 in FIG. 12A, respectively.
- FIG. 12B shows a schematic cross-sectional view of the light emitting elements 110R, 110G, and 110B
- FIG. 12C shows a schematic cross-sectional view of the connection portion 140 where the connection electrode 111C and the common electrode 113 are connected. ing.
- the light emitting element 110R has a pixel electrode 111R, an organic layer 112R, a common layer 114, and a common electrode 113.
- the light emitting element 110G has a pixel electrode 111G, an organic layer 112G, a common layer 114, and a common electrode 113.
- the light emitting element 110B has a pixel electrode 111B, an organic layer 112B, a common layer 114, and a common electrode 113.
- the common layer 114 and the common electrode 113 are commonly provided for the light emitting elements 110R, 110G, and 110B.
- the organic layer 112R of the light-emitting element 110R has a light-emitting organic compound that emits light having an intensity in at least the red wavelength range.
- the organic layer 112G included in the light-emitting element 110G includes a light-emitting organic compound that emits light having an intensity in at least the green wavelength range.
- the organic layer 112B included in the light-emitting element 110B contains a light-emitting organic compound that emits light having an intensity in at least a blue wavelength range.
- Each of the organic layer 112R, the organic layer 112G, and the organic layer 112B can also be called an EL layer and has at least a layer containing a light-emitting organic compound (light-emitting layer).
- the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B may be referred to as the light-emitting element 110 when describing matters common to them.
- the symbols omitting the letters may be used. be.
- the organic layer 112 and the common layer 114 may each independently have one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.
- the organic layer 112 may have a layered structure of a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer from the pixel electrode 111 side, and the common layer 114 may have an electron injection layer. .
- a pixel electrode 111R, a pixel electrode 111G, and a pixel electrode 111B are provided for each light emitting element.
- the common electrode 113 and the common layer 114 are provided as a continuous layer common to each light emitting element.
- a conductive film having a property of transmitting visible light is used for one of the pixel electrodes and the common electrode 113, and a conductive film having a reflective property is used for the other.
- a protective layer 121 is provided on the common electrode 113 to cover the light emitting elements 110R, 110G, and 110B.
- the protective layer 121 has a function of preventing impurities such as water from diffusing into each light emitting element from above.
- the end portions of the pixel electrodes 111 preferably have a tapered shape.
- the organic layer 112 provided along the side surface of the pixel electrode also has a tapered shape.
- the side surface of the pixel electrode is tapered because foreign matter (eg, dust or particles) in the manufacturing process can be easily removed by a treatment such as cleaning.
- the tapered shape refers to a shape in which at least a part of the side surface of the structure is inclined with respect to the substrate surface.
- the organic layer 112 is processed into an island shape by photolithography. Therefore, the organic layer 112 has a shape in which the angle formed by the top surface and the side surface is close to 90 degrees at the end.
- an organic film formed using FMM (Fine Metal Mask) or the like tends to gradually decrease in thickness closer to the end. Since it is formed in a slope shape, it is difficult to distinguish between the top surface and the side surface.
- An insulating layer 125, a resin layer 126, and a layer 128 are provided between two adjacent light emitting elements.
- the resin layer 126 is positioned between two adjacent light emitting elements and is provided so as to fill the end portions of the respective organic layers 112 and the area between the two organic layers 112 .
- the resin layer 126 has a smooth convex upper surface, and a common layer 114 and a common electrode 113 are provided to cover the upper surface of the resin layer 126 .
- the resin layer 126 functions as a flattening film that fills the steps located between the two adjacent light emitting elements. By providing the resin layer 126, a phenomenon in which the common electrode 113 is divided by a step at the end of the organic layer 112 (also referred to as step disconnection) occurs, and the common electrode on the organic layer 112 is prevented from being insulated. be able to.
- the resin layer 126 can also be called LFP (Local Filling Planarization).
- An insulating layer containing an organic material can be suitably used as the resin layer 126 .
- acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene-based resin, phenolic resin, and precursors of these resins are applied as the resin layer 126. can do.
- an organic material such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin may be used.
- a photosensitive resin can be used as the resin layer 126 .
- a photoresist may be used as the photosensitive resin.
- a positive material or a negative material can be used for the photosensitive resin.
- the resin layer 126 may contain a material that absorbs visible light.
- the resin layer 126 itself may be made of a material that absorbs visible light, or the resin layer 126 may contain a pigment that absorbs visible light.
- a resin that transmits red, blue, or green light and can be used as a color filter that absorbs other light, or a resin that contains carbon black as a pigment and functions as a black matrix, or the like. can be used.
- the insulating layer 125 is provided in contact with the side surface of the organic layer 112 . Also, the insulating layer 125 is provided to cover the upper end portion of the organic layer 112 . A part of the insulating layer 125 is provided in contact with the upper surface of the substrate 101 .
- the insulating layer 125 is located between the resin layer 126 and the organic layer 112 and functions as a protective film to prevent the resin layer 126 from contacting the organic layer 112 .
- the organic layer 112 may be dissolved by an organic solvent or the like used when forming the resin layer 126 . Therefore, by providing the insulating layer 125 between the organic layer 112 and the resin layer 126 as shown in this embodiment mode, the side surface of the organic layer can be protected.
- the insulating layer 125 can be an insulating layer containing an inorganic material.
- an inorganic insulating film such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used, for example.
- the insulating layer 125 may have a single-layer structure or a laminated structure.
- the oxide insulating film includes a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, and an oxide film.
- Examples include a hafnium film and a tantalum oxide film.
- Examples of the nitride insulating film include a silicon nitride film and an aluminum nitride film.
- As the oxynitride insulating film a silicon oxynitride film, an aluminum oxynitride film, or the like can be given.
- nitride oxide insulating film a silicon nitride oxide film, an aluminum nitride oxide film, or the like can be given.
- a metal oxide film such as a hafnium oxide film, or an inorganic insulating film such as a silicon oxide film to the insulating layer 125, pinholes are reduced and the EL layer can be protected.
- a superior insulating layer 125 can be formed.
- an oxynitride refers to a material whose composition contains more oxygen than nitrogen
- a nitride oxide refers to a material whose composition contains more nitrogen than oxygen. point to the material.
- silicon oxynitride refers to a material whose composition contains more oxygen than nitrogen
- silicon nitride oxide refers to a material whose composition contains more nitrogen than oxygen. indicates
- a sputtering method, a CVD method, a PLD method, an ALD method, or the like can be used to form the insulating layer 125 .
- the insulating layer 125 is preferably formed by an ALD method with good coverage.
- a reflective film for example, a metal film containing one or more selected from silver, palladium, copper, titanium, and aluminum
- a reflective film is provided between the insulating layer 125 and the resin layer 126 so that A configuration may be adopted in which emitted light is reflected by the reflecting film.
- the light extraction efficiency can be improved.
- the layer 128 is part of a protective layer (also referred to as a mask layer or a sacrificial layer) for protecting the organic layer 112 when the organic layer 112 is etched.
- a protective layer also referred to as a mask layer or a sacrificial layer
- any of the materials that can be used for the insulating layer 125 can be used.
- an aluminum oxide film, a metal oxide film such as a hafnium oxide film, or an inorganic insulating film such as a silicon oxide film formed by an ALD method has few pinholes. It can be suitably used for
- a protective layer 121 is provided to cover the common electrode 113 .
- the protective layer 121 can have, for example, a single layer structure or a laminated structure including at least an inorganic insulating film.
- inorganic insulating films include oxide films and nitride films such as silicon oxide films, silicon oxynitride films, silicon nitride oxide films, silicon nitride films, aluminum oxide films, aluminum oxynitride films, and hafnium oxide films.
- a semiconductor material or a conductive material such as indium gallium oxide, indium zinc oxide, indium tin oxide, or indium gallium zinc oxide may be used for the protective layer 121 .
- a laminated film of an inorganic insulating film and an organic insulating film can also be used as the protective layer 121 .
- a structure in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable.
- the organic insulating film functions as a planarizing film.
- the upper surface of the organic insulating film can be flattened, so that the coverage of the inorganic insulating film thereon can be improved, and the barrier property can be enhanced.
- the upper surface of the protective layer 121 is flat, when a structure (for example, a color filter, an electrode of a touch sensor, or a lens array) is provided above the protective layer 121, an uneven shape due to the structure below may be formed. This is preferable because it can reduce the impact.
- a structure for example, a color filter, an electrode of a touch sensor, or a lens array
- FIG. 12C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected.
- the connecting portion 140 an opening is provided in the insulating layer 125 and the resin layer 126 above the connecting electrode 111C.
- the connection electrode 111C and the common electrode 113 are electrically connected through the opening.
- FIG. 12C shows the connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected. good.
- the common layer 114 is located at the connection portion 140 because the electrical resistivity of the material used for the common layer 114 is sufficiently low and the thickness can be made thin. Often times there are no problems. As a result, the common electrode 113 and the common layer 114 can be formed using the same shielding mask, so the manufacturing cost can be reduced.
- FIG. 12A A pixel layout different from that in FIG. 12A will be mainly described below.
- the arrangement of the light emitting elements (sub-pixels) is not particularly limited, and various methods can be applied.
- top surface shapes of sub-pixels include triangles, quadrilaterals (including rectangles and squares), polygons such as pentagons, shapes with rounded corners of these polygons, ellipses, and circles.
- the top surface shape of the sub-pixel corresponds to the top surface shape of the light emitting region of the light emitting element.
- a pixel 150 shown in FIG. 13A is composed of three sub-pixels of light emitting elements 110a, 110b, and 110c.
- the light emitting element 110a may be a blue light emitting element
- the light emitting element 110b may be a red light emitting element
- the light emitting element 110c may be a green light emitting element.
- the pixel 150 shown in FIG. 13B includes a light emitting element 110a having a substantially trapezoidal top surface shape with rounded corners, a light emitting element 110b having a substantially triangular top surface shape with rounded corners, and a substantially square or substantially hexagonal top surface shape with rounded corners. and a light emitting element 110c having Further, the light emitting element 110a has a larger light emitting area than the light emitting element 110b. Thus, the shape and size of each light emitting element can be determined independently. For example, a more reliable light-emitting element can be made smaller.
- the light emitting element 110a may be a green light emitting element
- the light emitting element 110b may be a red light emitting element
- the light emitting element 110c may be a blue light emitting element.
- FIG. 13C shows an example in which pixels 124a having light-emitting elements 110a and 110b and pixels 124b having light-emitting elements 110b and 110c are alternately arranged.
- the light emitting element 110a may be a red light emitting element
- the light emitting element 110b may be a green light emitting element
- the light emitting element 110c may be a blue light emitting element.
- the pixel 124a has two light emitting elements (light emitting elements 110a and 110b) in the upper row (first row) and one light emitting element (light emitting element 110c) in the lower row (second row).
- the pixel 124b has one light emitting element (light emitting element 110c) in the upper row (first row) and two light emitting elements (light emitting elements 110a and 110b) in the lower row (second row).
- the light emitting element 110a may be a red light emitting element
- the light emitting element 110b may be a green light emitting element
- the light emitting element 110c may be a blue light emitting element.
- FIG. 13D is an example in which each light emitting element has a substantially square top surface shape with rounded corners
- FIG. 13E is an example in which each light emitting element has a circular top surface shape.
- FIG. 13F is an example in which light emitting elements of each color are arranged in a zigzag pattern. Specifically, when viewed from above, the upper sides of two light emitting elements (for example, light emitting elements 110a and 110b, or light emitting elements 110b and 110c) aligned in the column direction are displaced.
- the light emitting element 110a may be a red light emitting element
- the light emitting element 110b may be a green light emitting element
- the light emitting element 110c may be a blue light emitting element.
- the top surface shape of the light emitting element may be a polygonal shape with rounded corners, an elliptical shape, a circular shape, or the like.
- the EL layer is processed into an island shape using a resist mask.
- the resist film formed on the EL layer needs to be cured at a temperature lower than the heat resistance temperature of the EL layer. Therefore, curing of the resist film may be insufficient depending on the heat resistance temperature of the EL layer material and the curing temperature of the resist material.
- An insufficiently hardened resist film may take a shape away from the desired shape during processing.
- the top surface shape of the EL layer may be a polygon with rounded corners, an ellipse, or a circle. For example, when a resist mask having a square top surface is formed, a resist mask having a circular top surface is formed, and the EL layer may have a circular top surface.
- a technique for correcting the mask pattern in advance so that the design pattern and the transfer pattern match.
- OPC Optical Proximity Correction
- a pattern for correction is added to a corner portion of a figure on a mask pattern.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- the display device of the present embodiment is, for example, a television device, a desktop or notebook personal computer, a computer monitor, digital signage, a large game machine such as a pachinko machine, or other electronic device having a relatively large screen.
- a television device for example, a desktop or notebook personal computer, a computer monitor, digital signage, a large game machine such as a pachinko machine, or other electronic device having a relatively large screen.
- it can be used for display parts of digital cameras, digital video cameras, digital photo frames, mobile phones, mobile game machines, smart phones, wristwatch terminals, tablet terminals, personal digital assistants, and sound reproducing devices.
- Display device 400 14 shows a perspective view of the display device 400, and FIG. 15A shows a cross-sectional view of the display device 400. As shown in FIG.
- the display device 400 has a configuration in which a substrate 452 and a substrate 451 are bonded together.
- the substrate 452 is clearly indicated by dashed lines.
- the display device 400 has a display section 462, a circuit 464, wiring 465, and the like.
- FIG. 14 shows an example in which an IC 473 and an FPC 472 are mounted on the display device 400 . Therefore, the configuration shown in FIG. 14 can also be called a display module including the display device 400, an IC (integrated circuit), and an FPC.
- a scanning line driving circuit for example, can be used as the circuit 464 .
- the wiring 465 has a function of supplying signals and power to the display section 462 and the circuit 464 .
- the signal and power are input to the wiring 465 from the outside through the FPC 472 or input to the wiring 465 from the IC 473 .
- FIG. 14 shows an example in which an IC 473 is provided on a substrate 451 by a COG (Chip On Glass) method, a COF (Chip on Film) method, or the like.
- IC 473 for example, an IC having a scanning line driver circuit, a signal line driver circuit, or the like can be applied.
- the display device 400 and the display module may be configured without an IC.
- the IC may be mounted on the FPC by the COF method or the like.
- FIG. 15A shows an example of a cross section of the display device 400 when part of the region including the FPC 472, part of the circuit 464, part of the display portion 462, and part of the region including the connection portion are cut. show.
- FIG. 15A shows an example of a cross section of the display section 462, in particular, a region including the light emitting element 430b that emits green light and the light emitting element 430c that emits blue light.
- a display device 400 illustrated in FIG. 15A includes a transistor 202, a transistor 210, a light-emitting element 430b, a light-emitting element 430c, and the like between a substrate 453 and a substrate 454.
- the light-emitting elements exemplified in Embodiment 2 can be applied to the light-emitting elements 430b and 430c.
- the three sub-pixels are red (R), green (G), and blue (B) sub-pixels. , yellow (Y), cyan (C), and magenta (M) sub-pixels.
- the four sub-pixels include R, G, B, and white (W) sub-pixels, and R, G, B, and Y four-color sub-pixels. be done.
- the substrate 454 and the protective layer 416 are adhered via the adhesive layer 442 .
- the adhesive layer 442 is provided so as to overlap each of the light emitting elements 430b and 430c, and the display device 400 has a solid sealing structure.
- the light-emitting elements 430b and 430c have conductive layers 411a, 411b, and 411c as pixel electrodes.
- the conductive layer 411b reflects visible light and functions as a reflective electrode.
- the conductive layer 411c is transparent to visible light and functions as an optical adjustment layer.
- the conductive layer 411 a is connected to the conductive layer 222 b included in the transistor 210 through an opening provided in the insulating layer 214 .
- the transistor 210 has a function of controlling driving of the light emitting element.
- An EL layer 412G or an EL layer 412B is provided to cover the pixel electrodes.
- An insulating layer 421 is provided in contact with a side surface of the EL layer 412G and a side surface of the EL layer 412B, and a resin layer 422 is provided so as to fill recesses of the insulating layer 421.
- FIG. A layer 424 is provided between the EL layer 412G and the insulating layer 421 and between the EL layer 412B and the insulating layer 421, respectively.
- a common layer 414, a common electrode 413, and a protective layer 416 are provided to cover the EL layers 412G and 412B.
- the light emitted by the light emitting element is emitted to the substrate 452 side.
- a material having high visible light transmittance is preferably used for the substrate 452 .
- the transistors 202 and 210 can be manufactured using the same material and the same process.
- the substrate 453 and the insulating layer 212 are bonded together by an adhesive layer 455 .
- the display device 400 As a method for manufacturing the display device 400 , first, a manufacturing substrate on which the insulating layer 212 , each transistor, each light emitting element, etc. are provided and the substrate 454 are bonded together with an adhesive layer 442 . Then, the formation substrate is peeled off and a substrate 453 is attached to the exposed surface, so that each component formed over the formation substrate is transferred to the substrate 453 .
- Each of the substrates 453 and 454 preferably has flexibility. Thereby, the flexibility of the display device 400 can be enhanced.
- An inorganic insulating film that can be used for the insulating layers 211 and 215 can be used for the insulating layer 212 .
- a connecting portion 204 is provided in a region of the substrate 453 where the substrate 454 does not overlap.
- the wiring 465 is electrically connected to the FPC 472 through the conductive layer 466 and the connection layer 242 .
- the conductive layer 466 can be obtained by processing the same conductive film as the pixel electrode. Thereby, the connecting portion 204 and the FPC 472 can be electrically connected via the connecting layer 242 .
- the transistors 202 and 210 each include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a semiconductor layer having a channel formation region 231i and a pair of low-resistance regions 231n, and one of the pair of low-resistance regions 231n.
- a connecting conductive layer 222a, a conductive layer 222b connecting to the other of the pair of low-resistance regions 231n, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and an insulating layer 215 covering the conductive layer 223 are provided.
- the insulating layer 211 is located between the conductive layer 221 and the channel formation region 231i.
- the insulating layer 225 is located between the conductive layer 223 and the channel formation region 231i.
- the conductive layers 222a and 222b are each connected to the low resistance region 231n through openings provided in the insulating layer 215.
- One of the conductive layers 222a and 222b functions as a source and the other functions as a drain.
- FIG. 15A shows an example in which the insulating layer 225 covers the upper and side surfaces of the semiconductor layer.
- the conductive layers 222a and 222b are connected to the low-resistance region 231n through openings provided in the insulating layers 225 and 215, respectively.
- the insulating layer 225 overlaps the channel formation region 231i of the semiconductor layer 231 and does not overlap the low resistance region 231n.
- the structure shown in FIG. 15B can be manufactured by processing the insulating layer 225 using the conductive layer 223 as a mask.
- the insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the conductive layers 222a and 222b are connected to the low resistance region 231n through openings in the insulating layer 215, respectively.
- an insulating layer 218 may be provided to cover the transistor.
- the structure of the transistor included in the display device of this embodiment there is no particular limitation on the structure of the transistor included in the display device of this embodiment.
- a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used.
- the transistor structure may be either a top-gate type or a bottom-gate type.
- gates may be provided above and below a semiconductor layer in which a channel is formed.
- a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates is applied to the transistors 202 and 210 .
- a transistor may be driven by connecting two gates and applying the same signal to them.
- the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and applying a potential for driving to the other.
- the crystallinity of the semiconductor material used for the semiconductor layer of the transistor is not particularly limited, either.
- a semiconductor having a crystalline region in the semiconductor) may be used.
- a single crystal semiconductor or a crystalline semiconductor is preferably used because deterioration in transistor characteristics can be suppressed.
- a semiconductor layer of a transistor preferably includes a metal oxide (also referred to as an oxide semiconductor).
- the display device of this embodiment preferably uses a transistor including a metal oxide for a channel formation region (hereinafter referred to as an OS transistor).
- the bandgap of the metal oxide used for the semiconductor layer of the transistor is preferably 2 eV or more, more preferably 2.5 eV or more.
- the metal oxide preferably contains at least indium or zinc, and more preferably contains indium and zinc.
- metal oxides include indium and M (where M is gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium). , hafnium, tantalum, tungsten, magnesium, and cobalt) and zinc.
- the semiconductor layer of the transistor may contain silicon.
- silicon examples include amorphous silicon and crystalline silicon (low-temperature polysilicon, monocrystalline silicon, etc.).
- the transistor included in the circuit 464 and the transistor included in the display portion 462 may have the same structure or different structures.
- the plurality of transistors included in the circuit 464 may all have the same structure, or may have two or more types.
- the plurality of transistors included in the display portion 462 may all have the same structure, or may have two or more types.
- the insulating layer can function as a barrier layer. With such a structure, diffusion of impurities from the outside into the transistor can be effectively suppressed, and the reliability of the display device can be improved.
- Inorganic insulating films are preferably used as the insulating layer 211, the insulating layer 212, the insulating layer 215, the insulating layer 218, and the insulating layer 225, respectively.
- As the inorganic insulating film for example, a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, an aluminum nitride film, or the like can be used.
- a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, a neodymium oxide film, or the like may be used.
- two or more of the inorganic insulating films described above may be laminated and used.
- An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer.
- materials that can be used for the organic insulating film include acrylic resins, polyimide resins, epoxy resins, polyamide resins, polyimideamide resins, siloxane resins, benzocyclobutene-based resins, phenolic resins, precursors of these resins, and the like.
- optical members can be arranged along the inner or outer surface of the substrate 454 .
- optical members include a light shielding layer, a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an antireflection layer, a microlens array, and a light collecting film.
- an antistatic film that suppresses adhesion of dust, a water-repellent film that prevents adhesion of dirt, a hard coat film that suppresses the occurrence of scratches due to use, a shock absorption layer, etc. are arranged. may
- the protective layer 416 that covers the light-emitting element By providing the protective layer 416 that covers the light-emitting element, it is possible to prevent impurities such as water from entering the light-emitting element and improve the reliability of the light-emitting element.
- the connecting part 228 is shown in FIG. 15A. At the connecting portion 228, the common electrode 413 and the wiring are electrically connected.
- FIG. 15A shows an example in which the wiring has the same laminated structure as that of the pixel electrode.
- the substrates 453 and 454 glass, quartz, ceramics, sapphire, resins, metals, alloys, semiconductors, etc. can be used, respectively.
- a material that transmits the light is used for the substrate on the side from which the light from the light-emitting element is extracted.
- the flexibility of the display device can be increased.
- a polarizing plate may be used as the substrate 453 or the substrate 454 .
- polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, and polyether resins are used, respectively.
- PES resin Sulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, or the like can be used.
- PES polyamide resin
- aramid polysiloxane resin
- polystyrene resin polyamideimide resin
- polyurethane resin polyvinyl chloride resin
- polyvinylidene chloride resin polypropylene resin
- PTFE resin polytetrafluoroethylene
- ABS resin cellulose nanofiber, or the like
- One or both of the substrates 453 and 454 may be made of glass having a thickness sufficient to be flexible.
- various curable adhesives such as photocurable adhesives such as ultraviolet curable adhesives, reaction curable adhesives, thermosetting adhesives, and anaerobic adhesives can be used.
- These adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like.
- a material with low moisture permeability such as epoxy resin is preferable.
- a two-liquid mixed type resin may be used.
- an adhesive sheet or the like may be used.
- connection layer 242 an anisotropic conductive film (ACF: Anisotropic Conductive Film), an anisotropic conductive paste (ACP: Anisotropic Conductive Paste), or the like can be used.
- ACF Anisotropic Conductive Film
- ACP Anisotropic Conductive Paste
- materials that can be used for conductive layers such as various wirings and electrodes constituting display devices include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, Examples include metals such as tantalum and tungsten, and alloys containing these metals as main components. A film containing these materials can be used as a single layer or as a laminated structure.
- conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide containing gallium, or graphene can be used.
- metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing such metal materials can be used.
- a nitride of the metal material eg, titanium nitride
- it is preferably thin enough to have translucency.
- a stacked film of any of the above materials can be used as the conductive layer.
- a laminated film of a silver-magnesium alloy and indium tin oxide because the conductivity can be increased.
- conductive layers such as various wirings and electrodes that constitute a display device, and conductive layers (conductive layers functioning as pixel electrodes or common electrodes) of light-emitting elements.
- Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resins and epoxy resins, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- a device manufactured using a metal mask or FMM may be referred to as a device with an MM (metal mask) structure.
- a device manufactured without using a metal mask or FMM may be referred to as a device with an MML (metal maskless) structure.
- a structure in which a light-emitting layer is separately formed or a light-emitting layer is separately painted in each color light-emitting device is referred to as SBS (Side By Side) structure.
- SBS Side By Side
- a light-emitting device capable of emitting white light is sometimes referred to as a white light-emitting device.
- a white light emitting device can be combined with a colored layer (for example, a color filter) to realize a full-color display device.
- Light-emitting devices can be broadly classified into single structures and tandem structures.
- a single structure device has one light emitting unit between a pair of electrodes.
- the light-emitting unit is configured to include one or more light-emitting layers.
- the luminescent color of the first luminescent layer and the luminescent color of the second luminescent layer have a complementary color relationship, it is possible to obtain a configuration in which the entire light emitting device emits white light.
- the light-emitting device as a whole may emit white light by combining the respective light-emitting colors of the three or more light-emitting layers.
- a device with a tandem structure has a plurality of light-emitting units between a pair of electrodes.
- Each light-emitting unit is configured to include one or more light-emitting layers.
- luminance per predetermined current can be increased, and a light-emitting device with higher reliability than a single structure can be obtained.
- the light emitting device with the SBS structure can consume less power than the white light emitting device.
- the manufacturing process of the white light emitting device is simpler than that of the SBS structure light emitting device, so that the manufacturing cost can be lowered and the manufacturing yield can be increased.
- the light emitting device has an EL layer 790 between a pair of electrodes (lower electrode 791, upper electrode 792).
- EL layer 790 can be composed of multiple layers such as layer 720 , light-emitting layer 711 , and layer 730 .
- the layer 720 can have, for example, a layer containing a highly electron-injecting substance (electron-injecting layer) and a layer containing a highly electron-transporting substance (electron-transporting layer).
- the light-emitting layer 711 contains, for example, a light-emitting compound.
- Layer 730 can have, for example, a layer containing a highly hole-injecting substance (hole-injection layer) and a layer containing a highly hole-transporting substance (hole-transporting layer).
- a structure having a layer 720, a light-emitting layer 711, and a layer 730 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 16A is referred to herein as a single structure.
- the light emitting device shown in FIG. 16B has layers 730 - 1 , 730 - 2 , a light emitting layer 711 , layers 720 - 1 , 720 - 2 and an upper electrode 792 on the lower electrode 791 .
- the lower electrode 791 is the anode and the upper electrode 792 is the cathode.
- the layer 730-1 functions as a hole injection layer
- the layer 730-2 functions as a hole transport layer
- the layer 720-1 functions as an electron transport layer
- the layer 720-2 functions as an electron injection layer.
- the layer 730-1 is an electron injection layer
- the layer 730-2 is an electron transport layer
- the layer 720-1 is a hole transport layer
- the layer 720-2 is Each functions as a hole injection layer.
- a configuration in which a plurality of light-emitting layers (light-emitting layers 711, 712, and 713) are provided between layers 720 and 730 as shown in FIGS. 16C and 16D is also a variation of the single structure.
- tandem structure a structure in which a plurality of light-emitting units (EL layers 790a and 790b) are connected in series via an intermediate layer (charge-generating layer) 740 is herein referred to as a tandem structure.
- a tandem structure may be called a stack structure. Note that the tandem structure enables a light-emitting device capable of emitting light with high luminance.
- the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713 may be made of a light-emitting material that emits light of the same color, or even the same light-emitting material. By stacking light-emitting layers, luminance can be increased.
- different light-emitting materials may be used for the light-emitting layers 711, 712, and 713.
- white light emission can be obtained.
- FIG. 16D shows an example in which a colored layer 795 functioning as a color filter is provided. A desired color of light can be obtained by passing the white light through the color filter.
- light-emitting materials that emit light of the same color may be used for the light-emitting layer 711 and the light-emitting layer 712 .
- light-emitting materials that emit different light may be used for the light-emitting layer 711 and the light-emitting layer 712 .
- white light emission is obtained.
- FIG. 16F shows an example in which a colored layer 795 is further provided.
- the layer 720 and the layer 730 may have a laminated structure of two or more layers as shown in FIG. 16B.
- light-emitting materials that emit light of the same color may be used for the light-emitting layers 711, 712, and 713.
- the light-emitting layer 711 and the light-emitting layer 712 may be made of a light-emitting material that emits light of the same color. At this time, by using a color conversion layer instead of the coloring layer 795, light of a desired color different from that of the light-emitting material can be obtained.
- blue light-emitting material for each light-emitting layer and allowing blue light to pass through the color conversion layer, it is possible to obtain light with a wavelength longer than that of blue (eg, red, green, etc.).
- a fluorescent material, a phosphorescent material, quantum dots, or the like can be used as the color conversion layer.
- the emission color of the light-emitting device can be red, green, blue, cyan, magenta, yellow, white, or the like, depending on the material forming the EL layer 790 . Further, the color purity can be further enhanced by providing the light-emitting device with a microcavity structure.
- a light-emitting device that emits white light may have a structure in which a light-emitting layer contains two or more kinds of light-emitting substances, or two or more light-emitting layers having different light-emitting substances may be laminated. At this time, light-emitting substances may be selected so that the light emitted from each of the light-emitting substances has a complementary color relationship.
- a light-emitting device has at least a light-emitting layer. Further, in the light-emitting device, layers other than the light-emitting layer include a substance with high hole-injection property, a substance with high hole-transport property, a hole-blocking material, a substance with high electron-transport property, an electron-blocking material, and a layer with high electron-injection property. A layer containing a substance, a bipolar substance (a substance with high electron-transport properties and high hole-transport properties), or the like may be further included.
- Both low-molecular-weight compounds and high-molecular-weight compounds can be used in the light-emitting device, and inorganic compounds may be included.
- Each of the layers constituting the light-emitting device can be formed by a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like.
- the light-emitting device may have one or more layers selected from a hole injection layer, a hole transport layer, a hole block layer, an electron block layer, an electron transport layer, and an electron injection layer.
- the hole-injecting layer is a layer that injects holes from the anode into the hole-transporting layer, and contains a material with high hole-injecting properties.
- highly hole-injecting materials include aromatic amine compounds and composite materials containing a hole-transporting material and an acceptor material (electron-accepting material).
- the hole-transporting layer is a layer that transports holes injected from the anode to the light-emitting layer by means of the hole-injecting layer.
- a hole-transporting layer is a layer containing a hole-transporting material.
- the hole-transporting material a substance having a hole mobility of 1 ⁇ 10 ⁇ 6 cm 2 /Vs or more is preferable. Note that substances other than these can be used as long as they have a higher hole-transport property than electron-transport property.
- hole-transporting materials include ⁇ -electron-rich heteroaromatic compounds (e.g., carbazole derivatives, thiophene derivatives, furan derivatives, etc.), aromatic amines (compounds having an aromatic amine skeleton), and other highly hole-transporting materials. is preferred.
- ⁇ -electron-rich heteroaromatic compounds e.g., carbazole derivatives, thiophene derivatives, furan derivatives, etc.
- aromatic amines compounds having an aromatic amine skeleton
- other highly hole-transporting materials is preferred.
- the electron-transporting layer is a layer that transports electrons injected from the cathode to the light-emitting layer by the electron-injecting layer.
- the electron-transporting layer is a layer containing an electron-transporting material.
- an electron-transporting material a substance having an electron mobility of 1 ⁇ 10 ⁇ 6 cm 2 /Vs or more is preferable. Note that substances other than these substances can be used as long as they have a higher electron-transport property than hole-transport property.
- electron-transporting materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, ⁇ electron deficient including oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives with quinoline ligands, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other nitrogen-containing heteroaromatic compounds
- a material having a high electron transport property such as a type heteroaromatic compound can be used.
- the electron injection layer is a layer that injects electrons from the cathode to the electron transport layer, and is a layer that contains a material with high electron injection properties.
- Alkali metals, alkaline earth metals, or compounds thereof can be used as materials with high electron injection properties.
- a composite material containing an electron-transporting material and a donor material (electron-donating material) can also be used as a material with high electron-injecting properties.
- the electron injection layer examples include lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF 2 ), 8-(quinolinolato)lithium (abbreviation: Liq), 2- (2-pyridyl)phenoratritium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatritium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenoratritium (abbreviation: LiPPy) LiPPP), lithium oxide (LiO x ), alkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used.
- the electron injection layer may have a laminated structure of two or more layers. As the laminated structure, for example, lithium fluoride can be used for the first layer and ytterbium can be used for the second layer.
- a material having an electron transport property may be used as the electron injection layer described above.
- a compound having a lone pair of electrons and an electron-deficient heteroaromatic ring can be used as the electron-transporting material.
- a compound having at least one of a pyridine ring, diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and triazine ring can be used.
- the lowest unoccupied molecular orbital (LUMO) level of the organic compound having an unshared electron pair is preferably -3.6 eV or more and -2.3 eV or less.
- CV cyclic voltammetry
- photoelectron spectroscopy optical absorption spectroscopy
- inverse photoelectron spectroscopy etc. are used to determine the highest occupied molecular orbital (HOMO) level and LUMO level of an organic compound. can be estimated.
- BPhen 4,7-diphenyl-1,10-phenanthroline
- NBPhen 2,9-di(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline
- HATNA diquinoxalino [2,3-a:2′,3′-c]phenazine
- TmPPPyTz 2,4,6-tris[3′-(pyridin-3-yl)biphenyl-3-yl]-1,3 , 5-triazine
- a light-emitting layer is a layer containing a light-emitting substance.
- the emissive layer can have one or more emissive materials.
- a substance exhibiting emission colors such as blue, purple, violet, green, yellow-green, yellow, orange, and red is used as appropriate.
- a substance that emits near-infrared light can be used as the light-emitting substance.
- Examples of light-emitting substances include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.
- fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives. be done.
- Examples of phosphorescent materials include organometallic complexes (especially iridium complexes) having a 4H-triazole skeleton, 1H-triazole skeleton, imidazole skeleton, pyrimidine skeleton, pyrazine skeleton, or pyridine skeleton, and phenylpyridine derivatives having an electron-withdrawing group.
- organometallic complexes especially iridium complexes
- platinum complexes, rare earth metal complexes, etc. which are used as ligands, can be mentioned.
- the light-emitting layer may contain one or more organic compounds (host material, assist material, etc.) in addition to the light-emitting substance (guest material).
- One or both of a hole-transporting material and an electron-transporting material can be used as the one or more organic compounds.
- Bipolar materials or TADF materials may also be used as one or more organic compounds.
- the light-emitting layer preferably includes, for example, a phosphorescent material and a combination of a hole-transporting material and an electron-transporting material that easily form an exciplex.
- ExTET Exciplex-Triplet Energy Transfer
- a combination that forms an exciplex that emits light that overlaps with the wavelength of the absorption band on the lowest energy side of the light-emitting substance energy transfer becomes smooth and light emission can be efficiently obtained. With this configuration, high efficiency, low-voltage driving, and long life of the light-emitting device can be realized at the same time.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- a pn-type or pin-type photodiode can be used as the light receiving device.
- a light-receiving device functions as a photoelectric conversion device (also referred to as a photoelectric conversion element) that detects light incident on the light-receiving device and generates an electric charge. The amount of charge generated from the light receiving device is determined based on the amount of light incident on the light receiving device.
- organic photodiode having a layer containing an organic compound as the light receiving device.
- Organic photodiodes can be easily made thinner, lighter, and larger, and have a high degree of freedom in shape and design, so that they can be applied to various display devices.
- the light receiving device has a layer 765 between a pair of electrodes (bottom electrode 761 and top electrode 762).
- Layer 765 has at least one active layer and may have other layers.
- FIG. 17B is a modification of the layer 765 included in the light receiving device shown in FIG. 17A. Specifically, the light-receiving device shown in FIG. have.
- the active layer 767 functions as a photoelectric conversion layer.
- the layer 766 has one or both of a hole transport layer and an electron blocking layer.
- Layer 768 also includes one or both of an electron-transporting layer and a hole-blocking layer.
- a layer shared by the light-receiving device and the light-emitting device (which can be said to be a continuous layer shared by the light-receiving device and the light-emitting device) may exist.
- Such layers may have different functions in light-emitting devices than in light-receiving devices.
- Components are sometimes referred to herein based on their function in the light emitting device.
- a hole-injecting layer functions as a hole-injecting layer in light-emitting devices and as a hole-transporting layer in light-receiving devices.
- an electron-injecting layer functions as an electron-injecting layer in light-emitting devices and as an electron-transporting layer in light-receiving devices.
- a layer shared by the light-receiving device and the light-emitting device may have the same function in the light-emitting device as in the light-receiving device.
- a hole-transporting layer functions as a hole-transporting layer in both a light-emitting device and a light-receiving device
- an electron-transporting layer functions as an electron-transporting layer in both a light-emitting device and a light-receiving device.
- Both low-molecular-weight compounds and high-molecular-weight compounds can be used in the light-receiving device, and inorganic compounds may be included.
- the layers constituting the light-receiving device can be formed by methods such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, and a coating method.
- the active layer of the light receiving device contains a semiconductor.
- the semiconductor include inorganic semiconductors such as silicon and organic semiconductors including organic compounds.
- an organic semiconductor is used as the semiconductor included in the active layer.
- the light-emitting layer and the active layer can be formed by the same method (for example, a vacuum deposition method), and a manufacturing apparatus can be shared, which is preferable.
- Electron-accepting organic semiconductor materials such as fullerenes (eg, C 60 , C 70 , etc.) and fullerene derivatives can be used as n-type semiconductor materials for the active layer.
- fullerene derivatives include [6,6]-phenyl-C71-butylic acid methyl ester (abbreviation: PC70BM), [6,6]-phenyl-C61-butylic acid methyl ester (abbreviation: PC60BM), 1′, 1′′,4′,4′′-tetrahydro-di[1,4]methanonaphthaleno[1,2:2′,3′,56,60:2′′,3′′][5,6]fullerene- and C 60 (abbreviation: ICBA).
- n-type semiconductor materials include perylenetetracarboxylic acid derivatives such as N,N′-dimethyl-3,4,9,10-perylenetetracarboxylic acid diimide (abbreviation: Me-PTCDI), and 2 ,2′-(5,5′-(thieno[3,2-b]thiophene-2,5-diyl)bis(thiophene-5,2-diyl))bis(methan-1-yl-1-ylidene) Dimalononitrile (abbreviation: FT2TDMN) can be mentioned.
- Me-PTCDI N,N′-dimethyl-3,4,9,10-perylenetetracarboxylic acid diimide
- FT2TDMN 2 ,2′-(5,5′-(thieno[3,2-b]thiophene-2,5-diyl)bis(thiophene-5,2-diyl))bis(methan-1-yl-1-ylid
- Materials for the n-type semiconductor include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, Oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinones derivatives and the like.
- Materials for the p-type semiconductor of the active layer include copper (II) phthalocyanine (CuPc), tetraphenyldibenzoperiflanthene (DBP), zinc phthalocyanine (ZnPc), and tin phthalocyanine. (SnPc), quinacridone, and electron-donating organic semiconductor materials such as rubrene.
- Examples of p-type semiconductor materials include carbazole derivatives, thiophene derivatives, furan derivatives, and compounds having an aromatic amine skeleton.
- materials for p-type semiconductors include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazole derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinacridone derivatives, rubrene derivatives, tetracene derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives.
- the HOMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the HOMO level of the electron-accepting organic semiconductor material.
- the LUMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the LUMO level of the electron-accepting organic semiconductor material.
- a spherical fullerene as the electron-accepting organic semiconductor material, and use an organic semiconductor material with a shape close to a plane as the electron-donating organic semiconductor material. Molecules with similar shapes tend to gather together, and when molecules of the same type aggregate, the energy levels of the molecular orbitals are close to each other, so the carrier transportability can be enhanced.
- poly[[4,8-bis[5-(2-ethylhexyl)-2-thienyl]benzo[1,2-b:4,5-b']dithiophene-2, which functions as a donor, is added to the active layer.
- 6-diyl]-2,5-thiophenediyl[5,7-bis(2-ethylhexyl)-4,8-dioxo-4H,8H-benzo[1,2-c:4,5-c′]dithiophene-1 ,3-diyl]]polymer (abbreviation: PBDB-T) or a polymer compound such as a PBDB-T derivative can be used.
- a method of dispersing an acceptor material in PBDB-T or a PBDB-T derivative can be used.
- the active layer is preferably formed by co-depositing an n-type semiconductor and a p-type semiconductor.
- the active layer may be formed by laminating an n-type semiconductor and a p-type semiconductor.
- three or more kinds of materials may be mixed in the active layer.
- a third material may be mixed in addition to the n-type semiconductor material and the p-type semiconductor material.
- the third material may be a low-molecular compound or a high-molecular compound.
- the light-receiving device further includes, as layers other than the active layer, a layer containing a highly hole-transporting substance, a highly electron-transporting substance, a bipolar substance (substances having high electron-transporting and hole-transporting properties), or the like. may have.
- the layer is not limited to the above, and may further include a layer containing a highly hole-injecting substance, a hole-blocking material, a highly electron-injecting material, an electron-blocking material, or the like.
- materials that can be used in the above-described light-emitting device can be used.
- polymer compounds such as poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonic acid) (PEDOT/PSS), molybdenum oxide, and iodide Inorganic compounds such as copper (CuI) can be used.
- Inorganic compounds such as zinc oxide (ZnO) and organic compounds such as polyethyleneimine ethoxylate (PEIE) can be used as the electron-transporting material or the hole-blocking material.
- the light receiving device may have, for example, a mixed film of PEIE and ZnO.
- Display Device Having Photodetection Function
- light-emitting devices are arranged in matrix in the display portion, and an image can be displayed on the display portion.
- light receiving devices are arranged in a matrix in the display section, and the display section has one or both of an imaging function and a sensing function in addition to an image display function.
- the display part can be used for an image sensor or a touch sensor. That is, by detecting light on the display portion, an image can be captured, or proximity or contact of an object (a finger, hand, pen, or the like) can be detected.
- the display device of one embodiment of the present invention can use a light-emitting device as a light source of a sensor.
- the light-receiving device can detect the reflected light (or scattered light).
- imaging or touch detection is possible.
- a display device of one embodiment of the present invention includes a light-emitting device and a light-receiving device in a pixel.
- a display device of one embodiment of the present invention uses an organic EL device as a light-emitting device and an organic photodiode as a light-receiving device.
- An organic EL device and an organic photodiode can be formed on the same substrate. Therefore, an organic photodiode can be incorporated in a display device using an organic EL device.
- a display device having a light-emitting device and a light-receiving device in a pixel, since the pixel has a light-receiving function, it is possible to detect contact or proximity of an object while displaying an image. For example, not only can an image be displayed by all the sub-pixels of the display device, but also some sub-pixels can emit light as a light source and the remaining sub-pixels can be used to display an image.
- the display device can capture an image using the light receiving device.
- the display device of this embodiment can be used as a scanner.
- an image sensor can be used to capture images for personal authentication using fingerprints, palm prints, irises, pulse shapes (including vein shapes and artery shapes), or faces.
- an image sensor can be used to capture an image around the eye, the surface of the eye, or the inside of the eye (such as the fundus) of the user of the wearable device. Therefore, the wearable device can have a function of detecting any one or more selected from the user's blink, black eye movement, and eyelid movement.
- the light receiving device can be used as a touch sensor (also referred to as a direct touch sensor) or a near touch sensor (also referred to as a hover sensor, hover touch sensor, non-contact sensor, or touchless sensor).
- a touch sensor also referred to as a direct touch sensor
- a near touch sensor also referred to as a hover sensor, hover touch sensor, non-contact sensor, or touchless sensor.
- the touch sensor or near-touch sensor can detect the proximity or contact of an object (finger, hand, pen, etc.).
- a touch sensor can detect an object by bringing the display device into direct contact with the object.
- the near-touch sensor can detect the object even if the object does not touch the display device.
- the display device can detect the object when the distance between the display device and the object is 0.1 mm or more and 300 mm or less, preferably 3 mm or more and 50 mm or less.
- the display device can be operated without direct contact with the object, in other words, the display device can be operated without contact.
- the risk of staining or scratching the display device can be reduced, or the object can be displayed without directly touching the stain (for example, dust or virus) attached to the display device. It becomes possible to operate the device.
- the display device of one embodiment of the present invention can have a variable refresh rate.
- the power consumption can be reduced by adjusting the refresh rate (for example, in the range of 1 Hz to 240 Hz) according to the content displayed on the display device.
- the drive frequency of the touch sensor or the near-touch sensor may be changed according to the refresh rate. For example, when the refresh rate of the display device is 120 Hz, the driving frequency of the touch sensor or the near-touch sensor can be higher than 120 Hz (typically 240 Hz). With this structure, low power consumption can be achieved and the response speed of the touch sensor or the near touch sensor can be increased.
- the display device 105 shown in FIGS. 17C to 17E has a layer 353 having a light receiving device, a functional layer 355, and a layer 357 having a light emitting device between a substrate 351 and a substrate 359.
- FIG. 17C to 17E has a layer 353 having a light receiving device, a functional layer 355, and a layer 357 having a light emitting device between a substrate 351 and a substrate 359.
- the functional layer 355 has a circuit for driving the light receiving device and a circuit for driving the light emitting device.
- One or more of switches, transistors, capacitors, resistors, wirings, terminals, and the like can be provided in the functional layer 355 . Note that in the case of driving the light-emitting device and the light-receiving device by a passive matrix method, a structure in which the switch and the transistor are not provided may be employed.
- a finger 352 touching the display device 105 reflects light emitted by a light-emitting device in a layer 357 having a light-emitting device, so that a light-receiving device in a layer 353 having a light-receiving device reflects the light. Detect light. Thereby, it is possible to detect that the finger 352 touches the display device 105 .
- FIGS. 17D and 17E it may have a function of detecting or imaging an object that is close to (not in contact with) the display device.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- One embodiment of the present invention is a display panel that can be enlarged by arranging a plurality of display panels so that they partially overlap each other.
- at least the display panel located on the display surface side (upper side) has a portion that is adjacent to the display section and transmits visible light.
- the pixels of the display panel arranged on the lower side and the portion transmitting visible light of the display panel arranged on the upper side are provided so as to overlap each other. Accordingly, when the two display panels are viewed from the display surface side (in a plan view), the images displayed on them can be displayed seamlessly and continuously.
- a display panel of one embodiment of the present invention is a laminated panel including a first display panel and a second display panel.
- the first display panel has a first region, and the first region has first pixels and second pixels.
- the second display panel has a second area, a third area, and a fourth area.
- the second region has a third pixel, the third region has a function of transmitting visible light, and the fourth region has a function of blocking visible light.
- the second pixel of the first display panel and the third region of the second display panel have regions that overlap each other.
- the aperture ratio of the second pixel is preferably higher than that of the first pixel.
- the above-described display device including the light emitting element and the light receiving element can be used.
- the first pixel, the second pixel, and the third pixel has a light-emitting element and a light-receiving element.
- FIG. 18A is a schematic top view of a display panel 500 included in the display panel of one embodiment of the present invention.
- the structure of the display panel 500 the structure of the display device 100 shown in the above embodiment can be applied.
- the display panel 500 includes a display section 501, an area 510 adjacent to the display section 501 that transmits visible light, and an area 520 that has a portion that blocks visible light.
- an image can be displayed on the display unit 501 even if the display panel 500 is a single unit. Furthermore, even if the display panel 500 is a single unit, an image can be captured by the display portion 501 .
- a pair of substrates constituting the display panel 500 and a sealing material or the like for sealing a display element sandwiched between the pair of substrates may be provided.
- a material that transmits visible light is used for the member provided in the region 510 .
- W be the width of the region 510 .
- the area 520 is provided with wiring electrically connected to the pixels included in the display section 501, for example.
- a driver circuit for driving pixels a scanning line driver circuit, a signal line driver circuit, or the like
- a circuit such as a protection circuit may be provided.
- the region 520 also includes a region provided with a terminal (also referred to as a connection terminal) that is electrically connected to an external terminal or a wiring layer, a wiring that is electrically connected to the terminal, or the like.
- FIG. 18B is a schematic top view showing a configuration example of a display panel 550 having the display panel 500 shown in FIG. 18A.
- FIG. 18B shows an example in which the display panel 550 has three display panels 500 .
- a display panel 550 shown in FIG. 18B includes a display panel 500a, a display panel 500b, and a display panel 500c.
- a part of the display panel 500b is arranged to overlap the upper side (display surface side) of the display panel 500a. Specifically, the display portion 501a of the display panel 500a and the visible light transmitting region 510b of the display panel 500b overlap each other, and the display portion 501a of the display panel 500a and the visible light blocking region 520b of the display panel 500b are overlapped. are arranged so that they do not overlap.
- the display panel 500c is partially overlapped on the upper side (display surface side) of the display panel 500b. Specifically, the display portion 501b of the display panel 500b and the visible light transmitting region 510c of the display panel 500c overlap each other, and the display portion 501b of the display panel 500b and the visible light blocking region 520c of the display panel 500c are overlapped. are arranged so that they do not overlap.
- the entire display portion 501a can be viewed from the display surface side.
- the entire display portion 501b can be viewed from the display surface side by overlapping the area 510c. Therefore, it is possible to use a region in which the display portions 501 a , 501 b , and 501 c are seamlessly arranged as the display portion 551 of the display panel 550 .
- the display panel 550 can enlarge the display portion 551 by the number of the display panels 500 .
- a display panel having an imaging function that is, a display panel having pixels each having a light-emitting element and a light-receiving element
- the entire display portion 551 can be used as an imaging region. can.
- FIG. 18B shows a configuration in which a plurality of display panels 500 are stacked in one direction
- the plurality of display panels 500 may be stacked in two directions, ie, the vertical direction and the horizontal direction.
- FIG. 19A is a schematic top view showing an example of a display panel 500 in which the shape of the region 510 is different from that of FIG. 18A.
- a display panel 500 shown in FIG. 19A has regions 510 that transmit visible light along two sides of a display portion 501 .
- FIG. 19B is a schematic perspective view of a display panel 550 in which two display panels 500 shown in FIG. 19A are arranged vertically and two horizontally.
- FIG. 19C is a schematic perspective view of the display panel 550 viewed from the side opposite to the display surface side.
- a region along the short side of the display portion 501a of the display panel 500a and a portion of the region 510b of the display panel 500b are provided so as to overlap each other.
- a region along the long side of the display portion 501a of the display panel 500a and a portion of the region 510c of the display panel 500c are provided so as to overlap each other.
- a region 510d of the display panel 500d is provided so as to overlap a region along the long side of the display portion 501b of the display panel 500b and a region along the short side of the display portion 501c of the display panel 500c.
- FIG. 19B it is possible to use an area in which the display sections 501a, 501b, 501c, and 501d are seamlessly arranged as the display section 551 of the display panel 550.
- FIG. 19B it is possible to use an area in which the display sections 501a, 501b, 501c, and 501d are seamlessly arranged as the display section 551 of the display panel 550.
- a flexible material be used for the pair of substrates used for the display panel 500 so that the display panel 500 is flexible.
- a part of the display panel 500a can be curved and arranged so as to overlap the lower side of the display portion 501b of the adjacent display panel 500b. can.
- the height of the upper surface of the display portion 501b of the display panel 500b is adjusted to match the height of the upper surface of the display portion 501a of the display panel 500a. can be gently curved. Therefore, the heights of the display portions can be the same except for the vicinity of the region where the display panels 500a and 500b overlap each other, and the display quality of an image displayed on the display portion 551 of the display panel 550 can be improved. .
- the thickness of the display panel 500 is thin.
- the thickness of the display panel 500 is preferably 1 mm or less, preferably 300 ⁇ m or less, more preferably 100 ⁇ m or less.
- a substrate may be provided to protect the display portion 551 of the display panel 550 .
- the substrate may be provided for each display panel, or one substrate may be provided over a plurality of display panels.
- the contour shape of the display portion of the laminated panel can be made into various shapes such as non-rectangular shapes such as circles, ellipses, and polygons.
- the display panel 500 in a three-dimensional manner, it is possible to realize a laminated panel having a display portion having a three-dimensional shape such as a columnar shape, a spherical shape, a hemispherical shape, or the like.
- FIG. 20A is a cross-sectional view illustrating a configuration example of a display panel 650 of one embodiment of the present invention.
- the display panel 650 can be configured such that the display panel 600a and the display panel 600b are sandwiched between the substrates 601a and 601b, and the adhesive layer 619 is filled.
- polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, and polyethersulfone resins are used.
- PES resin polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, or the like can be used.
- various curable adhesives such as photocurable adhesives such as ultraviolet curable adhesives, reaction curable adhesives, thermosetting adhesives, and anaerobic adhesives can be used.
- These adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like.
- a material with low moisture permeability such as epoxy resin is preferable.
- a two-liquid mixed type resin may be used.
- an adhesive sheet or the like may be used.
- the configuration of the display panel 600a and the display panel 600b the configuration of the display device 100 shown in the above embodiment can be applied.
- the display panel 600 has flexibility similarly to the display panel 500 .
- FIG. 20B is an enlarged view of the configuration shown in FIG. 20A.
- the display panel 600a and the display panel 600b are bonded together by an adhesive layer 618 so that the edge of the display panel 600a and the edge of the display panel 600b overlap each other.
- the display panel 600a and the display panel 600b are bonded together by the adhesive layer 618 so that the end of the display portion of the display panel 600a and the end of the display portion of the display panel 600b overlap each other.
- the display panel 650 can have a structure in which the display panel 600a and the display panel 600b are stacked.
- a material similar to the material that can be used for the adhesive layer 619 can be used for the adhesive layer 618 .
- the display panel 650 can be a large display panel like the display panel 600 by configuring a plurality of display panels 600 stacked. Moreover, the display panel 650 may have a structure in which three or more display panels 600 are stacked. By increasing the number of display panels 600 included in the display panel 650, the size of the display panel 650 can be further increased.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- Example 1 In this example, the results of manufacturing a display device of one embodiment of the present invention will be described.
- the display device manufactured in this example is a kawara-type multidisplay.
- FIG. 21A shows a schematic diagram of the display panel of this embodiment.
- the display panel shown in FIG. 21A is an active matrix organic EL display in which the size of the light emitting portion 1250 is 13.5 inches diagonally, the number of effective pixels is 1280 ⁇ 720, and the resolution is 108 ppi.
- the display panel incorporates a demultiplexer (DeMUX) 1253, which functions as a source driver.
- the display panel also incorporates a scan driver 1255 .
- Two sides of the light emitting section 1250 are in contact with a region 1251 that transmits visible light.
- Leading wiring 1257 is provided around the remaining two sides.
- a channel-etch transistor using CAAC-OS (c-axis aligned crystal oxide semiconductor) was applied to the transistor of the display panel.
- An In-Ga-Zn-based oxide was used for the CAAC-OS.
- a tandem (laminated) organic EL element that emits white light was used as the light emitting element.
- the light emitting element has a top emission structure, and light from the light emitting element is extracted to the outside of the display panel through the color filter.
- FIG. 21B shows a schematic diagram of a display device in which two display panels are arranged in the horizontal direction. Further, FIG. 21C shows a schematic diagram of a cross section of the display device shown in FIG. 21B along the dashed-dotted line XY.
- the display device of this embodiment is configured by overlapping a plurality of display panels so that the non-display area between the display areas becomes small. Specifically, a light-transmitting layer 1103 is provided between a region 1251 transmitting visible light in the upper display panel and a light-emitting portion 1250 in the lower display panel.
- the four display panels are flexible.
- the vicinity of the FPC 1373a of the lower display panel is curved, and a portion of the lower display panel and the FPC 1373a are placed below the light-emitting portion 1250 of the upper display panel adjacent to the FPC 1373a. Some can be placed.
- the FPC 1373a can be arranged without physically interfering with the rear surface of the upper display panel.
- other display panels can be arranged on the four sides of the display panel, making it easy to increase the area.
- an adsorption film having adsorption layers on both sides of a base material was used as the translucent layer 1103 .
- the adsorption film By using the adsorption film, two display panels constituting a display device can be detachably bonded together.
- the adsorption layer on one side of the light-transmitting layer 1103 is attached to the substrate 1211a, and the adsorption layer on the other side of the light-transmitting layer 1103 is attached to the substrate 1201b.
- the light-transmitting layer 1103 has not only a portion overlapping with the region 1251 transmitting visible light but also a portion overlapping with the light-emitting portion 1250 .
- the light-transmitting layer 1103 overlaps the entire region 1251 that transmits visible light from the edge of the substrate 1201b, and even partially overlaps the region 1155b including the display element. Note that the light-transmitting layer 1103 is not provided in the curved portion of the display panel near the portion to which the FPC 1373a is connected in FIG. 21C. However, depending on the thickness or flexibility of the light-transmitting layer 1103, the light-transmitting layer 1103 may be provided in a curved portion of the display panel.
- Each display panel was produced by bonding the substrate and the element layer together with an adhesive layer.
- the substrate 1201a and the element layer 1153a, the substrate 1211a and the element layer 1153a, the substrate 1201b and the element layer 1153b, and the substrate 1211b and the element layer 1153b are bonded together with the adhesive layer 1157, respectively.
- the element layer 1153a has a region 1155a including a display element and a region 1156a including a wiring electrically connected to the display element.
- the element layer 1153b has a region 1155b including a display element and a region 1156b including a wiring electrically connected to the display element.
- ⁇ Display device> 22A and 22B are diagrams for explaining a display device in which three display panels shown in FIG. 21A are arranged in the horizontal direction.
- FIG. 22A is a diagram showing how three display panels described in FIGS. 21A to 21C are arranged in the horizontal direction.
- the display panel 1100A overlaps part of the display panel 1100B, and the display panel 1100B partly overlaps the display panel 1100C, whereby the display panels 1100A, 1100B, and 1100C display seamlessly.
- FIG. 22A shows a structure in which the display surfaces of the display panel 1100A, the display panel 1100B, and the display panel 1100C are curved so as to be concave; It is possible.
- FIG. 22B is a schematic bird's-eye view of the display device 1110 in which three display panels are arranged in the horizontal direction as shown in FIG. 22A.
- display panels 1100A, 1100B, and 1100C are attached to one surface of a support 1376.
- FIG. The support 1376, the display panels 1100A, 1100B, and the display panel 1100C are fixed in a curved shape with a radius of curvature R of 900 mm, and are designed to give a high sense of immersion when viewing.
- FIG. 23 is an appearance photograph of the display device 1110 described in FIG. 22B.
- the overlapping portions of the three display panels of the display device 1110 are inconspicuous and the seams are difficult to see. Therefore, since the three display panels included in the display device 1110 are curved with a radius of curvature R of 900 mm and the seams are hardly visible, a display device with a very high sense of immersion when viewed can be manufactured. was made.
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Abstract
Description
図2A乃至図2Dは、実施の形態に係る遮光装置の構成例を説明する図である。
図3A及び図3Bは、実施の形態に係る遮光装置の構成例を説明する図である。
図4A乃至図4Cは、実施の形態に係る遮光装置の構成例を説明する図である。
図5A乃至図5Cは、実施の形態に係る遮光装置の構成例を説明する図である。
図6A及び図6Bは、実施の形態に係る遮光装置の構成例を説明する図である。
図7A乃至図7Eは、実施の形態に係る画像補正を説明する図である。
図8A及び図8Bは、実施の形態に係る遮光装置の構成例を説明する図である。
図9A1乃至図9D2は、実施の形態に係る遮光装置の構成例を説明する図である。
図10A1乃至図10D2は、実施の形態に係る遮光装置の構成例を説明する図である。
図11A乃至図11Cは、実施の形態に係る遮光装置の構成例を説明する図である。
図12A乃至図12Cは、表示装置の構成例を示す図である。
図13A乃至図13Fは、画素の構成例を示す図である。
図14は、表示装置の構成例を示す図である。
図15A及び図15Bは、表示装置の構成例を示す図である。
図16A乃至図16Fは、発光デバイスの構成例を示す図である。
図17A及び図17Bは、受光デバイスの構成例を示す図である。図17C乃至図17Eは、表示装置の構成例を示す図である。
図18A及び図18Bは、表示パネルの構成例を示す上面図である。
図19A乃至図19Cは、表示パネルの構成例を示す上面図である。
図20A及び図20Bは、表示パネルの構成例を示す断面図である。
図21A乃至図21Cは、実施例1の表示パネル及び表示装置を説明する図である。
図22A及び図22Bは、実施例1の表示装置を説明する図である。
図23は、実施例1の表示装置の外観写真である。
本実施の形態では、本発明の一態様の遮光装置の構成例について、図面を参照して説明する。
図1A及び図1Bに本発明の一態様の遮光装置の一例を示す。本発明の一態様の遮光装置を備えた車両の一例として、車両60Aの外観の鳥瞰模式図を図1Aに示し、車両60Aの内側からの斜視図を図1Bに示す。ここでは、車両60Aの内部においてフロントウィンドウ61付近に展開される遮光部51を有する遮光装置50を、車両60Aの屋根部59(ルーフ部ともいう)に設置する例を示している。
図4A乃至図6Bを用いて、遮光装置50の展開収納方法及び駆動手段54の一例を説明する。
図1B等に示す遮光装置50が有する表示部53は、図3Aに示すように表示パネル55を有し、表示パネル55には画像出力部67を接続することが可能である。画像出力部67から出力される映像及び画像を、表示パネル55の表示面に表示することができる。表示パネル55には、画像出力部67を介して車体外部に設けられたカメラで撮影した映像を表示できるほか、地図情報、交通情報、自車の位置情報、目的地までの経路、距離、進行方向、到着予想時間などの情報のほか、時刻、速度、方位、温度、湿度、気圧、傾斜角、標高などの様々な情報を表示することができる。また、テレビジョン放送受信機(チューナー)、CD、DVD、メモリカードなどの記憶装置に記録された映像情報を再生するメディア再生装置などの画像出力部67を遮光装置50に接続することにより、テレビジョン放送などの様々な映像などを表示パネル55に表示することもできる。また、ノート型PC、タブレット端末、携帯電話、スマートフォンなどの情報端末、携帯型ゲーム機などと、画像出力部67とを無線または有線で接続することにより、これら情報端末、ゲーム機から送信された映像等を、画像出力部67を介して表示パネル55に表示することもできる。
なお、図1B等に示すように、遮光装置50が有する表示部53は車体のフロントウィンドウ61に近接して展開されているため、表示部53が有する表示パネル55は運転者の視点では傾斜している。つまり、表示パネル55の上側は運転者の視点から近い位置にあり、表示パネル55の下側は運転者の視点から遠い位置にあるため、表示パネル55に表示される画像91(図7A)を運転者の視点で見ると、表示パネル55の上下幅(高さともいう)は狭く、かつ表示パネル55の下側における左右幅(横幅ともいう)が狭い画像92として見える(図7B)。このような見え方では、表示パネル55に表示される画像の表示品位及び視認性が損なわれてしまう場合がある。
図8A乃至図10D2に、本発明の一態様の遮光装置50の一例を示す。図2A等では、ルームミラー62が屋根部59に取り付けられている車両60Aに遮光装置50を設置する例を示したが、図8A乃至図10D2においてはルームミラー62がフロントウィンドウ61に取り付けられている車両60Bに遮光装置50Bを設置する例を示す。車両60Bの外観の鳥瞰模式図を図8Aに示し、車両60Bの内側からの斜視図を図8Bに示す。ここでは、車両60Bの内部においてフロントウィンドウ61付近に展開される遮光部51を有する遮光装置50Bを、車両60Bの屋根部59に設置する例を示している。
図9A1乃至図9D2に遮光装置を備える車両60Bの一例を示す。図9A1、図9B1、図9C1及び図9D1は遮光部51B−1の展開動作を示す断面模式図である。また、図9A1、図9B1、図9C1及び図9D1のそれぞれに対応する車内模式図を、図9A2、図9B2、図9C2及び図9D2に示す。
図10A1乃至図10D2に遮光装置50の一例を示す。図10A1、図10B1、図10C1及び図10D1は遮光装置50B−2(図示せず)の遮光部51B−2(図示せず)の展開動作を示す断面模式図である。また、図10A1、図10B1、図10C1及び図10D1のそれぞれに対応する車内模式図を、図10A2、図10B2、図10C2及び図10D2に示す。
遮光装置の構成例1および遮光装置の構成例2において、車両60(車両60A、車両60B)のフロントウィンドウ61側に遮光装置(50、50B、50B−1、50B−2)を備える例を示しているが、本発明の一態様は、フロントウィンドウ61側に設置する場合に限られることはなく、車両のサイドウィンドウ側およびリアウィンドウ側に遮光装置を有してもよい。図11A乃至図11Cの車両60C、車両60Dの内部斜視図は、フロントウィンドウ側(50F)、サイドウィンドウ側(50S1、50S2、50S)、リアウィンドウ側(50R)のそれぞれに遮光装置を有する例を示す。図11Bは遮光装置50F、50S1、50S2、50S3、50Rの展開動作中の状態を示す図であり、図11Cは遮光装置50を備える車両60の変形例を示す図である。図11A乃至図11Cに示す遮光装置50S1、遮光装置50S2、遮光装置50S3及び遮光装置50Rは、車両における設置位置は異なるが、遮光装置の構成例1または遮光装置の構成例2に示した遮光装置(50、50B、50B−1、50B−2)の構成を用いることができる。
本実施の形態では、本発明の一態様の遮光装置に用いることのできる表示装置の構成例について説明する。以下で例示する表示装置は、上記実施の形態1の表示パネル55に適用することができる。
図12Aに、本発明の一態様の表示装置100の上面概略図を示す。表示装置100は、基板101上に、赤色を呈する発光素子110R、緑色を呈する発光素子110G、及び青色を呈する発光素子110Bをそれぞれ複数有する。図12Aでは、各発光素子の区別を簡単にするため、各発光素子の発光領域内にR、G、Bの符号を付している。
以下では、主に、図12Aとは異なる画素レイアウトについて説明する。発光素子(副画素)の配列に特に限定はなく、様々な方法を適用することができる。
本実施の形態では、本発明の一態様の表示装置の構成例について説明する。
図14に、表示装置400の斜視図を示し、図15Aに、表示装置400の断面図を示す。
本実施の形態では、本発明の一態様である表示装置に用いることができる発光素子(発光デバイスともいう)について説明する。
発光デバイスは、シングル構造と、タンデム構造とに大別することができる。シングル構造のデバイスは、一対の電極間に1つの発光ユニットを有する。当該発光ユニットは、1以上の発光層を含む構成とする。シングル構造で白色発光を得るには、2の発光層の各々の発光が補色の関係となるような発光層を選択すればよい。例えば、第1の発光層の発光色と第2の発光層の発光色を補色の関係になるようにすることで、発光デバイス全体として白色発光する構成を得ることができる。また、発光層を3以上有する発光デバイスの場合、3以上の発光層のそれぞれの発光色が合わさることで、発光デバイス全体として白色発光することができる構成とすればよい。
図16Aに示すように、発光デバイスは、一対の電極(下部電極791、上部電極792)の間に、EL層790を有する。EL層790は、層720、発光層711、層730などの複数の層で構成することができる。層720は、例えば電子注入性の高い物質を含む層(電子注入層)および電子輸送性の高い物質を含む層(電子輸送層)などを有することができる。発光層711は、例えば発光性の化合物を有する。層730は、例えば正孔注入性の高い物質を含む層(正孔注入層)および正孔輸送性の高い物質を含む層(正孔輸送層)を有することができる。
ここで、発光デバイスの具体的な構成例について説明する。
本実施の形態では、本発明の一態様の表示装置に用いることができる受光デバイスと、受発光機能を有する表示装置と、について説明する。
図17Aに示すように、受光デバイスは、一対の電極(下部電極761及び上部電極762)の間に層765を有する。層765は、少なくとも1層の活性層を有し、さらに他の層を有していてもよい。
本発明の一態様の表示装置は、表示部に、発光デバイスがマトリクス状に配置されており、当該表示部で画像を表示することができる。また、当該表示部には、受光デバイスがマトリクス状に配置されており、表示部は、画像表示機能に加えて、撮像機能及びセンシング機能の一方または双方を有する。表示部は、イメージセンサまたはタッチセンサに用いることができる。つまり、表示部で光を検出することで、画像を撮像すること、または、対象物(指、手、またはペンなど)の近接もしくは接触を検出することができる。
本実施の形態では、本発明の一態様の表示パネルについて説明する。
図18Aは、本発明の一態様の表示パネルに含まれる表示パネル500の上面概略図である。表示パネル500の構成として、上記実施の形態で示した表示装置100の構成を適用することができる。
図18Bでは一方向に複数の表示パネル500を重ねて配置する構成を示したが、縦方向及び横方向の二方向に複数の表示パネル500を重ねて配置してもよい。
まず、本実施例にて作製した表示装置に用いた表示パネルの詳細を示す。
図22A及び図22Bは図21Aで示した表示パネルを、横方向に3枚並べた表示装置を説明する図である。
Claims (7)
- 車両に用いられる遮光装置であって、
前記遮光装置は、遮光部と、収納部と、駆動手段と、を有し、
前記遮光部は、前記車両の内側の面に表示部を有し、
前記収納部は、前記車両の屋根部に位置し、
前記駆動手段は、前記遮光部を第1の位置に展開する第1の機能と、前記遮光部を第2の位置に展開する第2の機能と、前記遮光部を前記収納部の内部の第3の位置に収納する第3の機能と、を有し、
前記第1の位置は、前記遮光部が運転者の前方視界を妨げない位置であって、
前記第2の位置は、前記遮光部が前記車両のフロントウィンドウの面積の80%以上を覆う位置である、
遮光装置。 - 請求項1において、
前記遮光部は、前記車両の外側の面に反射層を有し、
前記反射層は、アルミニウム層と、前記アルミニウム層上の窒化シリコン層と、を有し、
前記反射層の反射率が80%以上である、
遮光装置。 - 請求項1において、
前記遮光部は、前記車両の外側の面に太陽電池を有し、
前記太陽電池は、シリコン型太陽電池、CIGS型太陽電池、又はペロブスカイト型太陽電池を有する、
遮光装置。 - 請求項1において、
前記表示部は、画像出力部と電気的に接続し、
前記画像出力部は、前記表示部へ出力する画像を補正処理する画像処理部を有し、
前記画像処理部は、前記画像を縦方向に引き伸ばし、かつ下側の左右幅が広い台形形状へと補正する機能を有する、
遮光装置。 - 請求項1乃至請求項4のいずれか一において、
前記遮光部は、前記表示部と接続されるバネ部と、前記バネ部と接続される支持部と、を有し、
前記支持部は、前記車両のピラーの内部において前記駆動手段が有する可動部と接続され、
前記可動部は、第1の巻取り部と、第2の巻取り部と、接続され、
前記第1の機能、前記第2の機能及び前記第3の機能において、前記第1の巻取り部および前記第2の巻取り部の何れか一または両方が回転動作を行う、
遮光装置。 - 請求項5において、
前記収納部は、透過部を有し、
前記遮光部が、前記第3の位置にあるとき、前記透過部と、前記表示部と、が重なる、
遮光装置。 - 車両に用いられる遮光装置であって、
前記遮光装置は、遮光部と、収納部と、駆動手段と、を有し、
前記収納部は、前記車両の屋根部に位置し、
前記遮光部は、開口部を有する第1の部分と、前記第1の部分と連結された第2の部分と、前記第2の部分と連結された第3の部分と、を有し、
前記開口部の大きさは、前記車両が有するルームミラーの大きさよりも大きく、
前記駆動手段は、
前記遮光部を、前記第1の部分と、前記第2の部分と、前記第3の部分と、が重なる第1の状態で、前記屋根部から下方に展開する第1の機構と、
前記遮光部を、前記第1の状態のまま、前記ルームミラーと接することなく前記車両が有するフロントウィンドウと略平行に傾斜させる第2の機構と、
前記遮光部が傾斜した状態で、前記第2の部分及び前記第3の部分を、前記フロントウィンドウと略平行になるように展開する第3の機構と、を有する、
遮光装置。
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