WO2023011665A1 - 图像采集模组的底座、图像采集模组及摄像头模组 - Google Patents

图像采集模组的底座、图像采集模组及摄像头模组 Download PDF

Info

Publication number
WO2023011665A1
WO2023011665A1 PCT/CN2022/115409 CN2022115409W WO2023011665A1 WO 2023011665 A1 WO2023011665 A1 WO 2023011665A1 CN 2022115409 W CN2022115409 W CN 2022115409W WO 2023011665 A1 WO2023011665 A1 WO 2023011665A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
acquisition module
image acquisition
installation groove
image sensor
Prior art date
Application number
PCT/CN2022/115409
Other languages
English (en)
French (fr)
Inventor
李东
Original Assignee
深圳市群晖智能科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市群晖智能科技股份有限公司 filed Critical 深圳市群晖智能科技股份有限公司
Priority to US18/263,841 priority Critical patent/US20240121489A1/en
Publication of WO2023011665A1 publication Critical patent/WO2023011665A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics

Definitions

  • the invention relates to the technical field of photoelectric equipment, in particular to a base of an image acquisition module, an image acquisition module and a camera module.
  • FPC Flexible Printed Circuit, flexible circuit board
  • resistors, capacitors, connectors, drivers /Memory chips and other components are mounted on the surface of the substrate and fixed by soldering, and then the image sensor is mounted on the substrate through special packaging equipment, and the image sensor is electrically connected to the substrate by means of gold wires or solder balls, and then the filter Components such as light sheets and mirror mounts are assembled with the substrate to obtain a camera module.
  • the surface flatness of FPC is generally poor.
  • the assembly accuracy of the camera module is difficult to control, and the defect rate is high.
  • An image acquisition module comprising:
  • a base including a base body and a conductor injection-molded on the base body, the base is used for assembling the mirror base;
  • the image sensor is arranged on the base and electrically connected with the conductor.
  • the base includes opposite first sides and second sides, the base is provided with a through hole, the through hole extends from the first side to the second side, the first side One side is used for assembling the mirror base, and the image sensor is arranged on the second side and covers one end of the through hole.
  • a first installation groove is opened on the second side, the through hole extends to the bottom of the first installation groove, and the image sensor is embedded in the first installation groove.
  • the second side is provided with a second installation groove spaced apart from the first installation groove;
  • the image acquisition module includes electronic components, and the electronic components are arranged in the first installation groove.
  • the second mounting slot is electrically connected with the conductor.
  • the base includes an opposite first end and a second end, the first end and the second end are located between the first side and the second side, and the conductive The body is exposed to the first installation groove, the second installation groove, the first end and the second end.
  • a third installation groove is opened on the first side, the through hole extends to the bottom of the third installation groove, the image acquisition module includes a filter, and the filter The sheet is embedded in the third installation groove and covers the opposite end of the through hole.
  • the base is provided with a limiting structure on the first side, and the limiting structure is used for assembling and positioning with the mirror base, and the third installation groove is opened in the limiting structure.
  • the conductor includes a bent wire base material and a coating layer plated on the surface of the wire base material, and the material of the coating layer includes at least nickel and gold.
  • a camera module including a mirror base and the above-mentioned image acquisition module.
  • the mirror base includes a lens barrel and a mounting seat sleeved on the lens barrel, and the mounting seat is connected to the base.
  • the above-mentioned image acquisition module and camera module are injection-molded with conductors electrically connected to the image sensor on the base, and the mirror base can be assembled on the base.
  • the base has higher structural rigidity, and its surface flatness, It is easier to guarantee the positional accuracy, and when the image sensor and the mirror holder are assembled on the base, higher assembly accuracy can be obtained.
  • the above-mentioned image acquisition module has a higher integration level, which can reduce the investment in high-precision production equipment, and has fewer production processes and quality control. Less difficult and less expensive.
  • the image sensor is electrically connected to the conductor that is injection-molded on the base, this arrangement simplifies the assembly and electrical connection process of the image sensor and the base, and ensures the reliability of the electrical connection between the image sensor and the base.
  • the conductor can be used Compared with the high-purity gold wire of FPC, the conductor has better structural stability and lower cost, and can ensure the reliability of the electrical connection of the image sensor.
  • An image acquisition module comprising:
  • a base including a base body and a conductor integrally formed on the base body, the base is used for assembling the mirror base;
  • the image sensor is arranged on the base and electrically connected with the conductor.
  • the base includes opposite first sides and second sides, the base is opened with a through hole, the through hole extends from the first side to the second side, and the first side
  • the image sensor is disposed on the second side and covers one end of the through hole.
  • a first installation groove is opened on the second side, the through hole extends to the bottom of the first installation groove, and the image sensor is embedded in the first installation groove.
  • the second side is provided with a second installation groove spaced apart from the first installation groove;
  • the image acquisition module includes electronic components, and the electronic components are arranged in the first installation groove.
  • the second mounting slot is electrically connected with the conductor.
  • a third installation groove is opened on the first side, the through hole extends to the bottom of the third installation groove, the image acquisition module includes a filter, and the filter The sheet is embedded in the third installation groove and covers the opposite end of the through hole.
  • the base is provided with a positioning boss on the first side, and the positioning boss is used for assembling and positioning with the positioning groove of the mirror base, and the third mounting groove is opened on the The above positioning boss.
  • the conductor includes a bent wire base material and a coating layer plated on the surface of the wire base material, and the material of the coating layer includes at least nickel and gold.
  • a camera module including a mirror base and the above-mentioned image acquisition module.
  • a base of an image acquisition module includes a base and a conductor injection-molded on the base, the first side of the base is used for assembling a mirror base, and the opposite second side of the base is It is used for setting the image sensor, and the conductor is used for electrically connecting the image sensor and external lines.
  • the base of the above-mentioned image acquisition module, the image acquisition module and the camera module are integrally formed with conductors for electrical connection with the image sensor, and the mirror base can be assembled on the base.
  • the base has a higher structure Rigidity, surface flatness, position accuracy, etc. are easier to guarantee, and higher assembly accuracy can be obtained when the image sensor and mirror holder are assembled on the base.
  • the above-mentioned image acquisition module has a higher integration level, which can reduce the investment in high-precision production equipment, and has fewer production processes and quality control. Less difficult and less expensive.
  • the image sensor is electrically connected to the conductor integrally formed on the base, this arrangement simplifies the assembly and electrical connection process of the image sensor and the base, and ensures the reliability of the electrical connection between the image sensor and the base.
  • the conductor can be used Compared with the high-purity gold wire of FPC, the conductor has better structural stability and lower cost, and can ensure the reliability of the electrical connection of the image sensor.
  • FIG. 1 is a schematic diagram of a camera module in the related art
  • FIG. 2 is a schematic diagram of another camera module in the related art
  • Fig. 3 is an exploded schematic diagram of a camera module of an embodiment
  • Fig. 4 is the bottom view of the image acquisition module of an embodiment
  • FIG. 5 is a schematic diagram of a processing method of an image acquisition module of an embodiment
  • FIG. 6 is a schematic diagram of a processing method of an image acquisition module according to another embodiment
  • Fig. 7 is a cross-sectional view of a position of the image acquisition module of an embodiment
  • FIG. 8 is a schematic diagram of a viewing angle of a camera module according to an embodiment
  • FIG. 9 is a schematic diagram of another viewing angle of the camera module shown in FIG. 8;
  • Fig. 10 is a cross-sectional view of another position of the image acquisition module of an embodiment
  • Fig. 11 is a top view of an image acquisition module according to an embodiment.
  • Positioning structure 300 Image acquisition module 301. Wire substrate
  • a COB (Chip on Board, chip on board) type camera module generally includes a flexible circuit board 11, an image sensor 12, an optical filter 13, a mount 14, a lens barrel 15 and a connector 16 , the flexible circuit board 11 is provided with electronic components 17 such as capacitors and resistors, the image sensor 12 is stacked on one side of the flexible circuit board 11 and is electrically connected to the flexible circuit board 11 through a gold wire 18, and the mounting seat 14 is stacked on the flexible circuit board 11
  • the circuit board 11 also covers the image sensor 12 .
  • the lens barrel 15 is connected to the mount 14 , and a lens group for converging light to the image sensor 12 is disposed in the lens barrel 15 .
  • the optical filter 13 is arranged on the mounting base 14 and is arranged between the lens group and the image sensor 12.
  • the optical filter 13 is used for filtering infrared light to improve the quality of shooting.
  • the connector 16 is electrically connected to the flexible circuit board 11 , and the camera module can be electrically connected to an external circuit such as a mainboard of a mobile phone through the connector 16 to realize a communication connection between the camera module and the mainboard.
  • a CSP (Chip Scale Package, chip size package) type camera module generally includes a flexible circuit board 11, an image sensor 12, a mount 14, a lens barrel 15 and a connector 16, and the flexible circuit board 11 is set There are electronic components 17 such as capacitors and resistors. Different from the COP camera module, the image sensor 12 of the CSP camera module is generally electrically connected to the flexible circuit board 11 by solder balls 19 .
  • the combination of the lens barrel 15 and the mounting base 14 can be called a lens base.
  • the lens barrel 15 and the mounting base 14 can be assembled, for example, the lens barrel 15 and the mounting base 14 can be screwed together.
  • the lens barrel 15 can also be integrally formed with the mount 14 .
  • the above COB/CSP type camera module in the processing process of the camera module, generally uses the flexible circuit board 11 as the substrate, and uses the surface mount process to mount the electronic components 17 such as resistors, capacitors, drive/storage chips, and connectors. 16 is mounted on the surface of the substrate and fixed by soldering, and then the image sensor 12 is installed on the substrate through special packaging equipment, and the electrical connection between the image sensor 12 and the substrate is realized by means of gold wires 18 or solder balls 19, etc., and then the filter Components such as the sheet 13, the mounting base 14, and the lens barrel 15 are assembled with the substrate to obtain a camera module.
  • the electronic components 17 such as resistors, capacitors, drive/storage chips, and connectors. 16 is mounted on the surface of the substrate and fixed by soldering
  • the image sensor 12 is installed on the substrate through special packaging equipment, and the electrical connection between the image sensor 12 and the substrate is realized by means of gold wires 18 or solder balls 19, etc.
  • the filter Components such as the sheet 13, the mounting base
  • the flatness of the surface of the flexible circuit board 11 is generally poor.
  • the flexible circuit board 11 is used as the substrate to assemble the image sensor 12, the lens holder and other structures, it is difficult to control the assembly accuracy of the camera module and the defective rate is high.
  • the present invention discloses a camera module 10 .
  • the camera module 10 includes a lens base 100 and an image acquisition module 300 .
  • the lens base 100 is assembled in the image acquisition module 300 .
  • the image acquisition module 300 includes a base 310 and an image sensor 320
  • the base 310 includes a base 311 and a conductor 313 injection-molded on the base 311
  • the base 310 is used for assembling the mirror base 100 .
  • the lens base 100 may include a lens barrel 110 and a mount 120 connected to the lens barrel 110
  • the mount 120 is assembled on the base 310
  • the lens barrel 110 is provided with a lens group for converging light.
  • the image sensor 320 is disposed on the base body 311 and electrically connected to the conductor 313 .
  • the base 310 is roughly in the shape of a rectangular block, and the base 310 includes a plurality of conductors 313 arranged at intervals, and the plastic material of the base 310 can ensure electrical insulation between adjacent conductors 313 . An end of the conductor 313 or a portion for electrical connection with an external device may be exposed to the outside.
  • the conductor 313 uses copper as the base material, that is, as the main part of the conductive circuit, and its surface can be plated with a metal coating to improve surface wear resistance and electrical conductivity.
  • the conductor 313 is used to electrically connect the image sensor 320 of the camera module 10, and can be used to electrically connect external circuit boards such as the mainboards of electronic devices such as mobile phones and tablet computers, so as to realize the camera module. 10 Communication connection with external motherboard.
  • the base material of the conductor 313 may also be silver wire or other alloy materials.
  • the copper foil 30 can be punched and bent using a knife die to obtain a wire base material 301, which is approximately Curved, which may include more than two wires, one end of the wire substrate 301 can be used to electrically connect to the image sensor 320, and the other end can be used to connect to external lines.
  • a wire base material 301 which is approximately Curved, which may include more than two wires
  • one end of the wire substrate 301 can be used to electrically connect to the image sensor 320, and the other end can be used to connect to external lines.
  • other connection points can be set between the two ends of the line substrate 301, and these connection points can be used to electrically connect to electronic components 330 such as resistors, capacitors, and drive/storage chips of the camera module 10, so as to realize the camera module.
  • Group 10 works fine.
  • a coating can also be formed on the surface of the wire substrate 301 to improve the surface properties, such as improving the wear resistance and electrical conductivity of the surface, thereby obtaining a surface-modified conductor 313.
  • the plating material includes at least nickel and gold. In some embodiments, the plating material may also include tin. Of course, it can be understood that the plating layer on the surface of the conductor 313 can be omitted.
  • a spot plating process can be used to form a coating on the surface of the online substrate 301.
  • the spot plating process is a kind of electroplating process. Its principle is to spray the plating solution from the anode water bag at high pressure to the plated area, Under the action, the metal ions in the plating solution are deposited on the plated area to form a plating layer.
  • the spot plating process can obtain accurate plating areas, that is, the specified position can be electroplated by using the spot plating process.
  • the conductor 313 can be placed in the pre-fabricated mold cavity through an insert molding process, and then molten plastic is injected into the mold cavity. After the plastic cools, the base 310 can be formed. , the conductor 313 of the base 310 is wrapped in plastic material. In some embodiments, both ends of the conductor 313 can be exposed to the base 310, so as to facilitate the electrical connection between the conductor 313 and the image sensor 320, and to facilitate the electrical connection between the conductor 313 and an external circuit.
  • the conductor 313 does not need to be exposed to the injection molded base 310 , and a part of the plastic covering the conductor 313 can be melted or removed in other ways during the assembly process of the image sensor 320 and the conductor 313 .
  • the conductor 313 may be integrally formed on the base 310 in other ways, for example, the conductor 313 may be formed on the base 310 by powder metallurgy or the like.
  • the base 310 includes opposite first sides 310a and second sides 310b, the base 310 is provided with a through hole 310c, the cross section of the through hole 310c may be rectangular, and the through hole 310c extends from the first side 310a to the second side 310b, the first side 310a is used for assembling the mirror base 100, and the image sensor 320 is disposed on the second side 310b and covers one end of the through hole 310c.
  • Ambient light can be incident from the lens barrel 110 of the mirror base 100 , pass through the lens group in the lens barrel 110 , and then enter the image sensor 320 from the through hole 310c, and the image sensor 320 can convert the light signal into an electrical signal.
  • the position-limiting structure 311 a may be directly molded or processed on the first side 310 a of the base 310 .
  • the limiting structure 311 a is used for mounting and positioning the mirror base 100 on the base 310 .
  • the mounting base 120 of the mirror base 100 may also be provided with a positioning structure 121 for matching with the limiting structure 311 a of the base 310 .
  • the base 310 is provided with a positioning boss on the first side 310a
  • the mounting seat 120 of the mirror base 100 is provided with a positioning groove.
  • the mirror base 100 can pass through the positioning boss. Cooperate with the positioning groove to realize assembly positioning, so as to improve the efficiency of assembly.
  • the limiting structure 311a may be more than two protrusions or protrusions
  • the positioning structure 121 may be more than two groove structures adapted to the protrusions or protrusions.
  • the mirror base 100 can be assembled to the image acquisition module 300 by HM (Holder Mount, base 310 mounting) equipment, and then manually adjust the position of the mirror base 100 on the base 310 to achieve clear focus of the camera module 10 .
  • the mirror base 100 can also be automatically adjusted to clear focus through an AA (Active Alignment, active adjustment) device.
  • AA Active Alignment, active adjustment
  • the second side 310b is provided with a first installation groove 310d, that is, the side of the base 310 facing away from the mirror holder 100 is provided with a first installation groove 310d.
  • the through hole 310c extends to the bottom of the first installation groove 310d, that is, the through hole 310c communicates with the first installation groove 310d, and the image sensor 320 is embedded in the first installation groove 310d.
  • the shape of the first installation groove 310d matches the shape of the image sensor 320.
  • the first installation groove 310d is roughly in the shape of a rectangular groove, that is, the cross section of the first installation groove 310d Rectangular.
  • the first installation groove 310 d is beneficial to the assembly and positioning of the image sensor 320 on the base 310 .
  • conductive particles 340 may be provided on the image sensor 320 first, and the conductive particles 340 are used to realize the electrical connection between the image sensor 320 and the conductor 313 .
  • a gold wire ball bonding machine can be used to place conductive particles 340 at the position of the image sensor 320 for electrical connection, that is, the image sensor 320 is planted with gold ball particles, and can be cleaned and dried by centrifugal cleaning, so that The purpose is to realize the electrical connection between the image sensor 320 and the conductor 313 through the gold ball particles, and ensure the reliability of the electrical connection.
  • a laser solder ball welding machine can be used to set conductive particles 340 at the position of the image sensor 320 for electrical connection, that is, to solder solder balls on the image sensor 320, so as to facilitate passing through the solder balls.
  • the electrical connection between the image sensor 320 and the conductor 313 is realized, and the reliability of the electrical connection is ensured.
  • the image sensor 320 after the image sensor 320 is provided with conductive particles 340 , it can be assembled on the base 310 and undergo corresponding processing (such as reflow soldering, etc.), so that the image sensor 320 and the conductor 313 are electrically connected reliably.
  • the image sensor 320 provided with the conductive particles 340 is attached to the base 310 using a flip-chip packaging process.
  • Flip chip Flip Chip
  • Flip Chip is to connect the conductive contacts of the chip to the circuit of the substrate, circuit board and other devices. During the connection process, because the bump of the chip is connected downward, it is called flip chip.
  • Electronic devices manufactured by flip-chip packaging technology have high integration, small volume, and high performance.
  • the image sensor 320 After the image sensor 320 provided with the conductive particles 340 is pasted on the base 310 by a flip-chip packaging process, the image sensor 320 can form a reliable electrical connection with the base 310 after corresponding processing.
  • the image sensor 320 can further be electrically connected to an external circuit board through the conductor 313 to realize communication with the external circuit board.
  • the image sensor 320 can also be called a photosensitive chip or a photosensitive element, and can convert received light signals into electrical signals.
  • the purpose of this application is to provide a base, an image acquisition module and a camera module that can improve assembly accuracy and yield, and does not limit the specific type of image sensor 320, so any type of photoelectric sensor that can capture optical signals and generate electrical signals All conversion devices can be applied to this application.
  • the image sensor 320 may include but not limited to CCD (Charged Coupled Device), CMOS (Complementary Metal-Oxide Semiconductor), CIS (Contact Image Sensor) devices.
  • the second side 310b of the base 310 may be provided with a second installation groove 310e spaced apart from the first installation groove 310d, the image acquisition module 300 includes an electronic component 330, and the electronic component 330 is disposed on the second installation groove 310d.
  • the slot 310e is installed and electrically connected to the conductor 313 .
  • the second side 310b of the base 310 may be provided with more than two second installation grooves 310e arranged at intervals, and more than two second installation grooves 310e may be arranged around the periphery of the first installation groove 310d, each second installation The slot 310e is spaced apart from the first installation slot 310d.
  • Each second installation slot 310 e can install more than one electronic component 330 such as resistors, capacitors, etc., so that these electronic components 330 are physically isolated from the installation area of the image sensor 320 .
  • the installation area of the image sensor 320 can be smaller, and it can effectively prevent dust and other foreign objects from polluting the installation area of the image sensor 320 during the installation process of the electronic components 330, thereby improving the yield rate of the product.
  • solder paste can be injected into the base 310 first, and the electronic components 330 can be pasted on the base 310, and the electronic components 330 can be fixed on the base 310 through reflow soldering, and the electronic components can be guaranteed The reliability of the electrical connection between the device 330 and the conductor 313 .
  • the base 310 may include an opposite first end 310f and a second end 310g, the first end 310f and the second end 310g are located between the first side 310a and the second side 310b, and the conductor 313 is exposed on the first side.
  • the conductor 313 exposed to the first installation groove 310d can facilitate the electrical connection between the image sensor 320 and the conductor 313; the conductor 313 exposed to the second installation groove 310e can facilitate the electrical connection between the electronic component 330 and the conductor 313
  • the conductor 313 exposed on the first end 310f and the second end 310g facilitates the electrical connection between the image capture module 300 and the external circuit.
  • the first side 310a of the base 310 may also be provided with a third installation groove 310h, and the through hole 310c extends to the bottom of the third installation groove 310h, that is, the through hole 310c communicates with the third installation groove 310h,
  • the image acquisition module 300 includes a filter 350 embedded in the third mounting groove 310h and covering the opposite end of the through hole 310c.
  • the base 310 can respectively define a first installation groove 310d and a third installation groove 310h at opposite ends of the through hole 310c, and the first installation groove 310d is used to install the image sensor 320, the second installation groove 310d
  • the three installation slots 310h are used for installing the optical filter 350 .
  • the shape of the third mounting groove 310h matches the shape of the optical filter 350.
  • the third mounting groove 310h is roughly rectangular, that is, the third mounting groove 310h
  • the cross section is rectangular.
  • the third installation groove 310 h is beneficial to the assembly and positioning of the filter 350 on the base 310 .
  • the operations of drawing glue, pasting the optical filter 350, baking and curing, centrifugal cleaning, and drying are sequentially performed. After that, the reliable fixing of the filter 350 on the base 310 can be realized.
  • the third installation groove 310h may be opened on the limiting structure 311a such as a positioning boss, as shown in FIG. 11 .
  • the above-mentioned image acquisition module 300, the conductor 313 used for electrical connection with the image sensor 320 is injection molded or integrally formed on the base 310, and the mirror base 100 and the image sensor 320 can be assembled on the base 310.
  • the base 310 has more With high structural rigidity, it is easier to guarantee the surface flatness and positional accuracy.
  • higher assembly accuracy can be obtained.
  • the above-mentioned image acquisition module 300 has a higher degree of integration, can reduce the investment in high-precision production equipment, and has fewer production processes , Quality control is less difficult and the cost is lower.
  • the image sensor 320 is electrically connected to the conductor 313 that is injection molded or integrally formed on the base 310, this arrangement simplifies the assembly and electrical connection process of the image sensor 320 and the base 310, and can ensure the connection between the image sensor 320 and the base 310. Reliability of electrical connections.
  • Conductor 313 can be made of lower-cost materials such as copper foil 30. Compared with the high-purity gold wire of FPC, conductor 313 has better structural stability and lower cost, and can ensure the electrical connection of image sensor 320. reliability.
  • the connection method can shorten the circuit length, effectively reduce electrical impedance and signal interference, and further improve the performance and stability of the product.
  • the image acquisition module 300 of the present invention its processing process has been further optimized, and a large number of assembly processes that require precision equipment or imported equipment have been reduced in the process, greatly reducing equipment input costs and labor costs, and greatly improving production. efficiency.
  • the cumulative tolerance of the process can be further reduced, so as to improve the processing and assembly accuracy of the product, so that the yield rate of the product is greatly improved .
  • the image acquisition module 300 disclosed in the embodiment of the present invention can adaptably improve the forming mold of the base 310, and form multiple bases 310 or even multiple image acquisition modules 300 at one time, so as to achieve large-scale, batch, and standardization Production operations, realize the standardized packaging of the camera module 10, and carry out long-term, long-term, batch production without changing the line, so that the stability, yield and production efficiency of the product are greatly improved.
  • the conductor 313 used is injection molded or integrally formed on the base 310, the conductor 313 can have a certain structural rigidity, or a male structure for electrical connection can be formed on the base 310 by welding, etc., and the external circuit board only needs to be provided with a corresponding
  • the female base structure can realize the convenient insertion and insertion of the image acquisition module 300 and the external circuit board, so as to shorten the path of electrical connection, and improve the efficiency of assembly and the working performance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)

Abstract

本发明涉及一种图像采集模组的底座、图像采集模组及摄像头模组。图像采集模组包括底座和图像传感器，底座包括座体和注塑成型于座体的导电体，底座用于组装镜座，图像传感器设于座体且与导电体电性连接。上述图像采集模组及摄像头模组，相比FPC，底座具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器、镜座组装于底座时，可获得更高的装配精度，且上述图像采集模组具有更高的集成度，可减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。由于图像传感器与注塑成型于底座的导电体电性连接，这种设置方式简化了图像传感器与底座的组装及电气连接过程，并保证图像传感器与底座的电连接的可靠性。

Description

图像采集模组的底座、图像采集模组及摄像头模组 技术领域
本发明涉及光电设备技术领域，特别是涉及一种图像采集模组的底座、图像采集模组及摄像头模组。
背景技术
相关技术中，在摄像头模组的加工过程中，一般以FPC(Flexible Printed Circuit，柔性线路板)为基板，采用SMT(Surface Mounted Technology，表面贴装技术)工艺将电阻、电容、连接器、驱动/存储芯片等元器件贴装于基板表面并焊接固定，再通过专用封装设备将图像传感器安装于基板，并以金线或锡球等方式实现图像传感器与基板的电性连接，之后再将滤光片、镜座等器件与基板进行组装以获得摄像头模组。
然而，FPC的表面平整度一般较差，以FPC为基板组装图像传感器、镜座等结构时造成摄像头模组的装配精度难以控制，不良率高。
发明内容
基于此，有必要提供一种图像采集模组的底座、图像采集模组及摄像头模组，提升产品的良率。
一种图像采集模组，包括：
底座，包括座体和注塑成型于所述座体的导电体，所述底座用于组装镜座；及
图像传感器，设于所述座体且与所述导电体电性连接。
在其中一个实施例中，所述底座包括相对的第一侧和第二侧，所述底座开设有通孔，所述通孔从所述第一侧延伸至所述第二侧，所述第一侧用于组装所述镜座，所述图像传感器设置于所述第二侧且覆盖于所述通孔的一端。
在其中一个实施例中，所述第二侧开设有第一安装槽，所述通孔延伸至所述第一安装槽的槽底，所述图像传感器嵌设于所述第一安装槽内。
在其中一个实施例中，所述第二侧开设有与所述第一安装槽间隔设置的第二安装槽；所述图像采集模组包括电子元器件，所述电子元器件设置于所述第二安装槽并与所述导电体电性连接。
在其中一个实施例中，所述底座包括相对的第一端和第二端，所述第一端与所述第二端位于所述第一侧与所述第二侧之间，所述导电体暴露于所述第一安装槽、所述第二安装槽、所述第一端和所述第二端。
在其中一个实施例中，所述第一侧开设有第三安装槽，所述通孔延伸至所述第三安装槽的槽底，所述图像采集模组包括滤光片，所述滤光片嵌设于所述第三安装槽并覆盖所述通孔的相对的另一端。
在其中一个实施例中，所述底座于所述第一侧设有限位结构，所述限位结构用于与所述镜座组装定位，所述第三安装槽开设于所述限位结构。
在其中一个实施例中，所述导电体包括弯折成型的线基材以及镀设于所述线基材表面的镀层，所述镀层的材料至少包括镍和金。
一种摄像头模组，包括镜座及上述的图像采集模组。
在其中一个实施例中，所述镜座包括镜筒和套设于所述镜筒的安装座，所述安装座连接于所述底座。
上述图像采集模组及摄像头模组，用于与图像传感器电性连接的导电体注塑成型于底座，镜座可组装于底座，相比FPC，底座具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器、镜座组装于底座时，可获得更高的装配精度。相比于相关技术中图像传感器封装于FPC、镜座叠置于FPC的结构，上述图像采集模组具有更高的集成度，可减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。由于图像传感器与注塑成型于底座的导电体电性连接，这种设置方式简化了图像传感器与底座的组装及电气连接过程，并保证图像传感器与底座的电性连接的可靠性，导电体可以采用铜箔等成本较低的材料制成，相比FPC的高纯度金线，导电体的结构稳定性更好且成本更低，并可保证图像传感器的电性连接的可靠性。
一种图像采集模组，包括：
底座，包括座体和一体成型于所述座体的导电体，所述底座用于组装镜座；及
图像传感器，设于所述座体且与所述导电体电性连接。
在其中一个实施例中，底座包括相对的第一侧和第二侧，所述底座开设有通孔，所述通孔从所述第一侧延伸至所述第二侧，所述第一侧用于组装所述镜座，所述图像传感器设置于所述第二侧且覆盖于所述通孔的一端。
在其中一个实施例中，所述第二侧开设有第一安装槽，所述通孔延伸至所述第一安装槽的槽底，所述图像传感器嵌设于所述第一安装槽内。
在其中一个实施例中，所述第二侧开设有与所述第一安装槽间隔设置的第二安装槽；所述图像采集模组包括电子元器件，所述电子元器件设置于所述第二安装槽并与所述导电体电性连接。
在其中一个实施例中，所述第一侧开设有第三安装槽，所述通孔延伸至所述第三安装槽的槽底，所述图像采集模组包括滤光片，所述滤光片嵌设于所述第三安装槽并覆盖所述通孔的相对的另一端。
在其中一个实施例中，所述底座于所述第一侧设有定位凸台，所述定位凸台用于与所述镜座的定位凹槽组装定位，所述第三安装槽开设于所述定位凸台。
在其中一个实施例中，所述导电体包括弯折成型的线基材以及镀设于所述线基材表面的镀层，所述镀层的材料至少包括镍和金。
一种摄像头模组，包括镜座及上述的图像采集模组。
一种图像采集模组的底座，所述底座包括座体和注塑成型于所述座体的导电体，所述座体的第一侧用于组装镜座，所述座体的相对第二侧用于设置图像传感器，所述导电体用于电性连接所述图像传感器和外部线路。
上述图像采集模组的底座、图像采集模组及摄像头模组，用于与图像传感器电性连接的导电体一体成型于底座，镜座可组装于底座，相比FPC，底座具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器、镜座组装于底座时，可获得更高的装配精度。相比于相关技术中图像传感器封装于FPC、镜座叠置于FPC的结构，上述图像采集模组具有更高的集成度，可 减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。由于图像传感器与一体成型于底座的导电体电性连接，这种设置方式简化了图像传感器与底座的组装及电气连接过程，并保证图像传感器与底座的电性连接的可靠性，导电体可以采用铜箔等成本较低的材料制成，相比FPC的高纯度金线，导电体的结构稳定性更好且成本更低，并可保证图像传感器的电性连接的可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术中一种摄像头模组的示意图；
图2为相关技术中另一种摄像头模组的示意图；
图3为一实施例的摄像头模组的爆炸示意图；
图4为一实施例的图像采集模组的仰视图；
图5为一实施例的图像采集模组的加工方法示意图；
图6为另一实施例的图像采集模组的加工方法示意图；
图7为一实施例的图像采集模组的一位置的剖视图；
图8为一实施例的摄像头模组的一视角的示意图；
图9为图8所示摄像头模组的另一视角的示意图；
图10为一实施例的图像采集模组的另一位置的剖视图；
图11为一实施例的图像采集模组的俯视图。
附图标记：
11、柔性线路板         12、图像传感器       13、滤光片
14、安装座             15、镜筒             16、连接器
17、电子元器件         18、金线             19、锡球
100、镜座              110、镜筒            120、安装座
121、定位结构          300、图像采集模组    301、线基材
310、底座              310a、第一侧         310b、第二侧
310c、通孔             310d、第一安装槽     310e、第二安装槽
310f、第一端           310g、第二端         310h、第三安装槽
311、座体              311a、限位结构       313、导电体
320、图像传感器        330、电子元器件      340、导电颗粒
350、滤光片
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
参考图1，相关技术中，COB(Chip on Board，板上芯片封装)型摄像头模组一般包括柔性线路板11、图像传感器12、滤光片13、安装座14、镜筒15和连接器16，柔性线路板11设置有电容、电阻等电子元器件17，图像传感器12叠置于柔性线路板11的一侧且通过金线18与柔性线路板11电性连接，安装座14叠置于柔性线路板11并覆盖图像传感器12。镜筒15连接于安装座14，镜筒15内设有用于将光线汇聚至图像传感器12的透镜组。滤光片13设 置于安装座14并设置于透镜组与图像传感器12之间，滤光片13用于过滤红外光，以提升拍摄的质量。连接器16电性连接于柔性线路板11，摄像头模组可通过连接器16电性连接至外部电路例如手机的主板等，以实现摄像头模组与主板的通信连接。
参考图2，相关技术中，CSP(Chip Scale Package，芯片尺寸封装)型摄像头模组一般包括柔性线路板11、图像传感器12、安装座14、镜筒15以及连接器16，柔性线路板11设置有电容、电阻等电子元器件17，区别于COP摄像头模组，CSP型摄像头模组的图像传感器12一般采用锡球19与柔性线路板11电性连接。
镜筒15与安装座14的组合可以称为镜座。镜筒15与安装座14可以组装成型，例如镜筒15与安装座14可以螺纹连接。镜筒15也可以和安装座14一体成型。
以上的COB/CSP型摄像头模组，在摄像头模组的加工过程中，一般以柔性线路板11为基板，采用表面贴装工艺将电阻、电容、驱动/存储芯片等电子元器件17以及连接器16贴装于基板表面并焊接固定，再通过专用封装设备将图像传感器12安装于基板，并以金线18或锡球19等方式实现图像传感器12与基板的电性连接，之后再将滤光片13、安装座14、镜筒15等器件与基板进行组装以获得摄像头模组。
然而，柔性线路板11的表面平整度一般较差，以柔性线路板11为基板组装图像传感器12、镜座等结构时造成摄像头模组的装配精度难以控制，不良率高。
参考图3和图4，本发明公开了一种摄像头模组10，摄像头模组10包括镜座100及图像采集模组300，镜座100组装于图像采集模组300。图像采集模组300包括底座310和图像传感器320，底座310包括座体311和注塑成型于座体311的导电体313，底座310用于组装镜座100。镜座100可包括镜筒110及连接于镜筒110的安装座120，安装座120组装于底座310，镜筒110设置有用于汇聚光线的透镜组。图像传感器320设于座体311且与导电体313电性连接。
在一些实施方式中，底座310大致呈矩形块状，底座310包括多个间隔设置的导电体313，底座310的塑胶材料可以保证相邻导电体313之间的电绝缘。导电体313的末端或者用于与外部器件电连接的部分可以暴露于外界。在一些实施方式中，导电体313采用铜作为基材，即作为导电线路的主要部分，其表面可镀上金属镀层以改善表面耐磨性能和导电性能等。在本发明实施方式中，导电体313用于电性连接摄像头模组10的图像传感器320，并可用于电性连接外部的电路板例如手机、平板电脑等电子设备的主板，以实现摄像头模组10与外部主板的通信连接。采用铜作为导电体313的基材时，相对于金线、银线等，成本相对较低。当然，在其他实施方式中，导电体313的基材也可以采用银线或者其他合金材料。
结合图5和图6，在导电体313的基材为铜的实施方式中，可以采用刀模对铜箔30进行冲切和折弯加工后，获得线基材301，线基材301大致呈曲线状，其可以包括两条以上，线基材301的一端可用于电性连接于图像传感器320，另一端可用于连接外部线路。当然，在线基材301的两端之间，可以设置其他连接点，这些连接点可用于电性连接至摄像头模组10的电阻、电容、驱动/存储芯片等电子元器件330，以实现摄像头模组10的正常工作。
在冲切铜箔30并弯折成线基材301后，还可以在线基材301表面形成镀层，以改善表面特性，例如改善表面的耐磨性能和导电性能，从而获得表面改性的导电体313，镀层材料至少包括镍和金。在一些实施方式中，镀层材料还可包括锡。当然，可以理解的是，导电体313表面的镀层可缺省。
在一些实施方式中，可以采用点镀工艺在线基材301的表面形成镀层，点镀工艺属于电镀工艺的一种，其原理是将镀液从阳极水囊高压喷出至被镀区，在电场作用下，镀液中的金属离子沉积于被镀区而形成镀层。点镀工艺可以获得精确的镀区，也即采用点镀工艺可以对指定位置进行电镀。
导电体313成型后，可以通过嵌件成型(insert molding)工艺，将导电体313置于预先制好的模腔内，然后将熔融状态的塑胶注入模腔，塑胶冷却后，即可形成底座310，底座310的导电体313包覆于塑胶材料内。在一些实施方式中，导电体313的两端可以暴露于底座310，以便于导电体313与图像 传感器320的电性连接，且便于导电体313与外部电路的电性连接。在另一些实施方式中，导电体313无需暴露于注塑成型的底座310，在图像传感器320与导电体313的组装过程中再将覆盖导电体313的一部分塑胶熔融或采用其他方式去除即可。
在其他实施方式中，导电体313可以采用其他方式一体成型于底座310，例如，导电体313可以采用粉末冶金等方式形成于底座310。
参考图7，底座310包括相对的第一侧310a和第二侧310b，底座310开设有通孔310c，通孔310c的横截面可以为矩形，通孔310c从第一侧310a延伸至第二侧310b，第一侧310a用于组装镜座100，图像传感器320设置于第二侧310b且覆盖于通孔310c的一端。环境光线可以从镜座100的镜筒110入射，经镜筒110内的透镜组后从通孔310c入射至图像传感器320，图像传感器320进而可以将光信号转化为电信号。
参考图8，在一些实施方式中，底座310注塑成型后，还可以在底座310的第一侧310a直接成型或加工成型限位结构311a。限位结构311a用于镜座100在底座310的安装定位。结合图9，镜座100的安装座120也可以设置有用于与底座310的限位结构311a相适配的定位结构121。示例性地，底座310于第一侧310a设有定位凸台，镜座100的安装座120设有定位凹槽，在镜座100与底座310的组装过程中，镜座100可以通过定位凸台与定位凹槽的配合实现装配定位，以提升组装的效率。在其他实施方式中，限位结构311a可以是两个以上的凸柱或凸点，定位结构121可以为两个以上的与凸柱或凸点适配的凹槽结构。在一些实施方式中，镜座100可通过HM(Holder Mount，底座310贴装)设备组装至图像采集模组300，再手动调整镜座100在底座310的位置以实现摄像头模组10的清晰对焦。在另一些实施方式中，镜座100也可通过AA(Active Alignment，主动调整)设备自动调整至清晰对焦。
参考图10和图11，在一些实施方式中，第二侧310b开设有第一安装槽310d，也即底座310的背向镜座100的一侧设有第一安装槽310d。通孔310c延伸至第一安装槽310d的槽底，也即通孔310c与第一安装槽310d连通，图像传感器320嵌设于第一安装槽310d内。第一安装槽310d的形状与图像传感 器320的形状匹配，例如，在图像传感器320呈矩形块状的实施方式中，第一安装槽310d大致呈矩形槽状，即第一安装槽310d的横截面呈矩形。第一安装槽310d有利于图像传感器320在底座310的装配定位。
再参考图5，在将图像传感器320组装于底座310的过程中，可以先在图像传感器320设置导电颗粒340，导电颗粒340用于实现图像传感器320与导电体313的电性连接。在一些实施方式中，可采用金丝球焊机在图像传感器320的用于电性连接的位置设置导电颗粒340，即在图像传感器320植上金球微粒，并可采用离心清洗甩干，以便于通过金球微粒实现图像传感器320与导电体313的电性连接，并保证电性连接的可靠性。
再参考图6，在另一些实施方式中，可以采用激光锡球焊接机在图像传感器320的用于电性连接的位置设置导电颗粒340，即在图像传感器320焊接锡球，以便于通过锡球实现图像传感器320与导电体313的电性连接，并保证电性连接的可靠性。
参考图5，图像传感器320设置导电颗粒340后，即可组装于底座310，并进行相应的处理(例如回流焊等)，使得图像传感器320与导电体313实现可靠的电性连接。在一些实施方式中，采用倒装芯片封装工艺，将设置有导电颗粒340的图像传感器320贴于底座310。倒装芯片(Flip Chip)是将芯片的导电触点与基板、电路板等器件的电路相连，在相连的过程中，由于芯片的凸点是朝下连接，因此称为倒装。采用倒装芯片封装工艺制得的电子器件，具有较高的集成度和较小体积，且具有较高的性能。采用倒装芯片封装工艺将设置有导电颗粒340的图像传感器320贴于底座310后，经过相应的处理，图像传感器320可与底座310形成可靠的电性连接。图像传感器320进而可通过导电体313电性连接至外部电路板，以实现与外部电路板的通信。
图像传感器320也可以称为感光芯片或感光元件，可将接收的光信号转换成电信号。本申请旨在提供一种能提高装配精度进而提升良率的底座、图像采集模块及摄像头模组，并不限制图像传感器320的具体类型，因此可捕捉光信号并生成电信号的任何类型的光电转换器件均可应用至本申请中。作为示例，图像传感器320可以包括但不限于CCD(Charged Coupled Device)、CMOS (Complementary Metal-Oxide Semiconductor)、CIS(Contact Image Sensor)器件。
进一步，参考图10，底座310的第二侧310b可以开设有与第一安装槽310d间隔设置的第二安装槽310e，图像采集模组300包括电子元器件330，电子元器件330设置于第二安装槽310e并与导电体313电性连接。具体地，底座310的第二侧310b可以设置两个以上间隔设置的第二安装槽310e，且两个以上的第二安装槽310e可以环绕第一安装槽310d的外周布置，每一第二安装槽310e与第一安装槽310d间隔设置。每个第二安装槽310e可以安装一个以上的电子元器件330例如电阻、电容等，以使这些电子元器件330与图像传感器320的安装区域实现物理上的隔离。这种结构设置，图像传感器320的安装区域可以较小，并可有效防止电子元器件330安装过程中的灰尘等异物对图像传感器320安装区域的污染，从而提升产品的良率。
结合图6，在底座310组装电子元器件330的过程中，可以先在底座310注入锡膏，并贴上电子元器件330，经回流焊使得电子元器件330固定于底座310，并保证电子元器件330与导电体313的电性连接的可靠性。进一步，在图像传感器320焊接锡球的实施方式中，由于图像传感器320及电子元器件330均采用锡与底座310的导电体313电性连接，在底座310注入锡膏并贴上电子元器件330且在将设置有锡球的图像传感器320组装于底座310后，可以统一进行回流焊，使得电子元器件330与图像传感器320与底座310的导电体313形成可靠的电性连接。这种加工方式，可以节省加工步骤，提升加工效率。
继续参考图10，底座310可以包括相对的第一端310f和第二端310g，第一端310f与第二端310g位于第一侧310a与第二侧310b之间，导电体313暴露于第一安装槽310d、第二安装槽310e、第一端310f和第二端310g。暴露于第一安装槽310d的导电体313可便于图像传感器320与导电体313的电性连接；暴露于第二安装槽310e的导电体313可便于电子元器件330与导电体313的电性连接；暴露于第一端310f和第二端310g的导电体313则便于图像采集模组300与外部电路的电性连接。
在一些实施方式中，底座310的第一侧310a还可以开设有第三安装槽310h，通孔310c延伸至第三安装槽310h的槽底，也即通孔310c与第三安装槽310h连通，图像采集模组300包括滤光片350，滤光片350嵌设于第三安装槽310h并覆盖通孔310c的相对的另一端。换言之，在这种实施方式中，底座310于通孔310c的相对的两端，可以分别开设第一安装槽310d和第三安装槽310h，且第一安装槽310d用于安装图像传感器320，第三安装槽310h用于安装滤光片350。第三安装槽310h的形状与滤光片350的形状匹配，例如，在滤光片350呈矩形块状的实施方式中，第三安装槽310h大致呈矩形槽状，即第三安装槽310h的横截面呈矩形。第三安装槽310h有利于滤光片350在底座310的装配定位。
在一些实施方式中，在通孔310c的用于组装滤光片350的一端即第三安装槽310h内，依次经画胶、贴滤光片350、烘烤固化、离心清洗、甩干的操作后，即可实现滤光片350在底座310的可靠固定。在底座310的第一侧310a设有限位结构311a例如定位凸台的实施方式中，第三安装槽310h可以开设于限位结构311a例如定位凸台，如图11所示。
上述图像采集模组300，用于与图像传感器320电性连接的导电体313注塑成型或一体成型于底座310，镜座100、图像传感器320可组装于底座310，相比FPC，底座310具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器320、镜座100组装于底座310时，可获得更高的装配精度。相比于相关技术中图像传感器320封装于FPC、镜座100叠置于FPC的结构，上述图像采集模组300具有更高的集成度，可减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。由于图像传感器320与注塑成型或一体成型于底座310的导电体313电性连接，这种设置方式简化了图像传感器320与底座310的组装及电气连接过程，并可保证图像传感器320与底座310的电性连接的可靠性。导电体313可以采用铜箔30等成本较低的材料制成，相比FPC的高纯度金线，导电体313的结构稳定性更好且成本更低，并可保证图像传感器320的电性连接的可靠性。
在本发明实施方式中，由于不再采用FPC作为图像传感器320、镜座100 的组装基板，可节省昂贵的镍钯金FPC材料，使产品的成本大幅降低，性能大幅提升，并具有更高的性价比和市场竞争优势。
由于取消了图像传感器320与FPC的金线连接方式，采用本发明的图像采集模组300时，电子元器件330(电容、电阻、图像传感器320等)通过导电体313实现电性连接，这种连接方式可以缩短电路长度，有效降低电性阻抗及信号干扰，进一步提高产品的性能和稳定性。
本发明的图像采集模组300，其加工工艺流程得到了进一步优化，制程中也减少了大量需要精密设备或进口设备才能完成的组装工序，大大降低了设备投入成本和人力成本，大幅提高了生产效率。
在图像采集模组300的生产加工过程中，由于底座310结构刚性的保证以及位置精度的提高，工序的累计公差可以进一步降低，以提升产品的加工和装配精度，使得产品的良率得到大幅提升。
进一步，本发明实施方式公开的图像采集模组300，对底座310的成型模具可进行适应性改进，一次成型多个底座310甚至多个图像采集模组300，以实现大规模、批量化、标准化生产作业，实现摄像头模组10的标准化封装，进行长单、长期、不换线批量生产，使产品的稳定性、良率和生产效率得到大幅提高。
由于采用的导电体313注塑成型或一体成型于底座310，导电体313可以具一定的结构刚性，或者可以采用焊接等方式在底座310形成电连接用的公头结构，外部电路板只需设置相应的母座结构，即可实现图像采集模组300与外部电路板的便捷插装，以缩短电连接的路径，提升组装的效率及工作性能。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所 附权利要求为准。

Claims (19)

  1. 一种图像采集模组，其特征在于，包括：
    底座，包括座体和注塑成型于所述座体的导电体，所述底座用于组装镜座；及
    图像传感器，设于所述座体且与所述导电体电性连接。
  2. 根据权利要求1所述的图像采集模组，其特征在于，所述底座包括相对的第一侧和第二侧，所述底座开设有通孔，所述通孔从所述第一侧延伸至所述第二侧，所述第一侧用于组装所述镜座，所述图像传感器设置于所述第二侧且覆盖于所述通孔的一端。
  3. 根据权利要求2所述的图像采集模组，其特征在于，所述第二侧开设有第一安装槽，所述通孔延伸至所述第一安装槽的槽底，所述图像传感器嵌设于所述第一安装槽内。
  4. 根据权利要求3所述的图像采集模组，其特征在于，所述第二侧开设有与所述第一安装槽间隔设置的第二安装槽；所述图像采集模组包括电子元器件，所述电子元器件设置于所述第二安装槽并与所述导电体电性连接。
  5. 根据权利要求4所述的图像采集模组，其特征在于，所述底座包括相对的第一端和第二端，所述第一端与所述第二端位于所述第一侧与所述第二侧之间，所述导电体暴露于所述第一安装槽、所述第二安装槽、所述第一端和所述第二端。
  6. 根据权利要求2所述的图像采集模组，其特征在于，所述第一侧开设有第三安装槽，所述通孔延伸至所述第三安装槽的槽底，所述图像采集模组包括滤光片，所述滤光片嵌设于所述第三安装槽并覆盖所述通孔的相对的另一端。
  7. 根据权利要求6所述的图像采集模组，其特征在于，所述底座于所述第一侧设有限位结构，所述限位结构用于与所述镜座组装定位，所述第三安装槽开设于所述限位结构。
  8. 根据权利要求1-7任一项所述的图像采集模组，其特征在于，所述导电体包括弯折成型的线基材以及镀设于所述线基材表面的镀层，所述镀层的材料至少包括镍和金。
  9. 一种摄像头模组，其特征在于，包括镜座及权利要求1-8任一项所述的 图像采集模组。
  10. 根据权利要求9所述的摄像头模组，其特征在于，所述镜座包括镜筒和套设于所述镜筒的安装座，所述安装座连接于所述底座。
  11. 一种图像采集模组，其特征在于，包括：
    底座，包括座体和一体成型于所述座体的导电体，所述底座用于组装镜座；及
    图像传感器，设于所述座体且与所述导电体电性连接。
  12. 根据权利要求11所述的图像采集模组，其特征在于，底座包括相对的第一侧和第二侧，所述底座开设有通孔，所述通孔从所述第一侧延伸至所述第二侧，所述第一侧用于组装所述镜座，所述图像传感器设置于所述第二侧且覆盖于所述通孔的一端。
  13. 根据权利要求12所述的图像采集模组，其特征在于，所述第二侧开设有第一安装槽，所述通孔延伸至所述第一安装槽的槽底，所述图像传感器嵌设于所述第一安装槽内。
  14. 根据权利要求13所述的图像采集模组，其特征在于，所述第二侧开设有与所述第一安装槽间隔设置的第二安装槽；所述图像采集模组包括电子元器件，所述电子元器件设置于所述第二安装槽并与所述导电体电性连接。
  15. 根据权利要求12所述的图像采集模组，其特征在于，所述第一侧开设有第三安装槽，所述通孔延伸至所述第三安装槽的槽底，所述图像采集模组包括滤光片，所述滤光片嵌设于所述第三安装槽并覆盖所述通孔的相对的另一端。
  16. 根据权利要求15所述的图像采集模组，其特征在于，所述底座于所述第一侧设有定位凸台，所述定位凸台用于与所述镜座的定位凹槽组装定位，所述第三安装槽开设于所述定位凸台。
  17. 根据权利要求11-16任一项所述的图像采集模组，其特征在于，所述导电体包括弯折成型的线基材以及镀设于所述线基材表面的镀层，所述镀层的材料至少包括镍和金。
  18. 一种摄像头模组，其特征在于，包括镜座及权利要求11-17任一项所 述的图像采集模组。
  19. 一种图像采集模组的底座，其特征在于所述底座包括座体和注塑成型于所述座体的导电体，所述座体的第一侧用于组装镜座，所述座体的相对第二侧用于设置图像传感器，所述导电体用于电性连接所述图像传感器和外部线路。
PCT/CN2022/115409 2021-08-03 2022-08-29 图像采集模组的底座、图像采集模组及摄像头模组 WO2023011665A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/263,841 US20240121489A1 (en) 2021-08-03 2022-08-29 Base of image acquisition module, image acquisition module, and camera module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202110885902.8A CN113629086A (zh) 2021-08-03 2021-08-03 Fcm封装片机制作方法及封装片机及摄像头模组产品
CN202110885902.8 2021-08-03
CN202210514520.9 2022-05-12
CN202210514520.9A CN114784031A (zh) 2021-08-03 2022-05-12 图像采集模组的底座、图像采集模组及摄像头模组

Publications (1)

Publication Number Publication Date
WO2023011665A1 true WO2023011665A1 (zh) 2023-02-09

Family

ID=78382580

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/CN2021/129338 WO2023010703A1 (zh) 2021-08-03 2021-11-08 Fcm封装片机制作方法及封装片机及摄像头模组产品
PCT/CN2022/115442 WO2023011666A1 (zh) 2021-08-03 2022-08-29 摄像头模组、图像采集模组及其底座的加工方法
PCT/CN2022/115409 WO2023011665A1 (zh) 2021-08-03 2022-08-29 图像采集模组的底座、图像采集模组及摄像头模组

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/CN2021/129338 WO2023010703A1 (zh) 2021-08-03 2021-11-08 Fcm封装片机制作方法及封装片机及摄像头模组产品
PCT/CN2022/115442 WO2023011666A1 (zh) 2021-08-03 2022-08-29 摄像头模组、图像采集模组及其底座的加工方法

Country Status (3)

Country Link
US (2) US20240121489A1 (zh)
CN (4) CN113629086A (zh)
WO (3) WO2023010703A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113629086A (zh) * 2021-08-03 2021-11-09 深圳市群晖智能科技股份有限公司 Fcm封装片机制作方法及封装片机及摄像头模组产品
CN115473992A (zh) * 2022-09-23 2022-12-13 安徽光阵光电科技有限公司 一种不需要电路板和连接器的小型摄像头
CN115295065B (zh) * 2022-10-09 2022-12-13 南京邮电大学 一种基于灵活可配置模块的芯粒测试电路

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120113536A1 (en) * 2010-11-04 2012-05-10 Largan Precision Co., Ltd. Autofocus module
CN105611135A (zh) * 2015-11-13 2016-05-25 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
CN210780990U (zh) * 2019-11-01 2020-06-16 昆山丘钛微电子科技有限公司 摄像头模组和电子设备
CN113629086A (zh) * 2021-08-03 2021-11-09 深圳市群晖智能科技股份有限公司 Fcm封装片机制作方法及封装片机及摄像头模组产品

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100483655C (zh) * 2005-09-09 2009-04-29 鸿富锦精密工业（深圳）有限公司 数码相机模组的制程
CN100468665C (zh) * 2005-12-02 2009-03-11 鸿富锦精密工业（深圳）有限公司 影像感测晶片封装制程
KR101294419B1 (ko) * 2006-03-10 2013-08-08 엘지이노텍 주식회사 카메라 모듈 및 그 제조 방법
JP2009095000A (ja) * 2007-09-20 2009-04-30 Hitachi Maxell Ltd カメラモジュール及び撮像装置の製造方法
US8299589B2 (en) * 2010-07-26 2012-10-30 TDK Taiwan, Corp. Packaging device of image sensor
CN204332960U (zh) * 2015-01-24 2015-05-13 江苏金成光电科技有限公司 一种手机摄像头模组感光芯片封装结构
CN105721749B (zh) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
CN107071238A (zh) * 2016-12-23 2017-08-18 江苏正桥影像科技股份有限公司 一种超薄高清摄像头模组及其制造工艺
CN107591421B (zh) * 2017-08-15 2023-08-04 苏州昀冢电子科技股份有限公司 摄像头模组芯片封装底座组件及其制备方法
CN112349604A (zh) * 2020-11-30 2021-02-09 常州银河世纪微电子股份有限公司 一种环保高效的超薄封装元件制作工艺

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120113536A1 (en) * 2010-11-04 2012-05-10 Largan Precision Co., Ltd. Autofocus module
CN105611135A (zh) * 2015-11-13 2016-05-25 宁波舜宇光电信息有限公司 系统级摄像模组及其电气支架和制造方法
CN210780990U (zh) * 2019-11-01 2020-06-16 昆山丘钛微电子科技有限公司 摄像头模组和电子设备
CN113629086A (zh) * 2021-08-03 2021-11-09 深圳市群晖智能科技股份有限公司 Fcm封装片机制作方法及封装片机及摄像头模组产品
CN114784031A (zh) * 2021-08-03 2022-07-22 深圳市群晖智能科技股份有限公司 图像采集模组的底座、图像采集模组及摄像头模组

Also Published As

Publication number Publication date
WO2023010703A1 (zh) 2023-02-09
CN114784031A (zh) 2022-07-22
WO2023011666A1 (zh) 2023-02-09
CN113629086A (zh) 2021-11-09
CN218939685U (zh) 2023-04-28
US20240171841A1 (en) 2024-05-23
CN114784032A (zh) 2022-07-22
US20240121489A1 (en) 2024-04-11

Similar Documents

Publication Publication Date Title
WO2023011665A1 (zh) 图像采集模组的底座、图像采集模组及摄像头模组
EP1774453B1 (en) System and method for mounting an image capture device on a flexible substrate
US20100328525A1 (en) Camera module
CN102782574B (zh) 具有成型带倒装成像器底座的照相机模块及制造方法
CN101490786B (zh) 具有预先模制好的透镜壳体的相机模块及制造方法
CN101611468A (zh) 折叠封装照相机模块及其制造方法
US7556504B2 (en) Camera module and camera module assembly
CN105530413A (zh) 摄像模组及其电气支架和线路导通方法
US20110001857A1 (en) Photographing module
US10771666B2 (en) Image capturing module and electrical support thereof
US9997554B2 (en) Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same
CN105450914B (zh) 摄像模组和电气支架及其电路设置方法
US9848111B1 (en) Imager module with molded packaging
CN105516557B (zh) 摄像模组和电气支架及其导通方法
CN114731358B (zh) 线路板组件、感光组件、摄像模组以及线路板组件和感光组件的制备方法
KR101070918B1 (ko) 카메라 모듈 및 그 제조 방법
CN208724030U (zh) 一种双摄摄像头模组
CN212305436U (zh) 电路板、摄像模组及电子设备
CN210246873U (zh) 基板结构和摄像头模组
KR100780189B1 (ko) 무수축 저온 세라믹을 적용한 카메라 모듈
CN111083344A (zh) Ccm模组镜头座贴合方法及ccm模组
KR20160075464A (ko) 센서용 칩 패키지 제조방법
CN115424303A (zh) 一种可smt的超薄光学屏下指纹模组和方法
CN205081850U (zh) 一种摄像设备的成像模组
CN113630526A (zh) 电路板、摄像模组及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22852375

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 18263841

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE