WO2023011666A1 - 摄像头模组、图像采集模组及其底座的加工方法 - Google Patents

摄像头模组、图像采集模组及其底座的加工方法 Download PDF

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Publication number
WO2023011666A1
WO2023011666A1 PCT/CN2022/115442 CN2022115442W WO2023011666A1 WO 2023011666 A1 WO2023011666 A1 WO 2023011666A1 CN 2022115442 W CN2022115442 W CN 2022115442W WO 2023011666 A1 WO2023011666 A1 WO 2023011666A1
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Prior art keywords
base
image sensor
conductor
processing method
acquisition module
Prior art date
Application number
PCT/CN2022/115442
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English (en)
French (fr)
Inventor
李东
Original Assignee
深圳市群晖智能科技股份有限公司
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Application filed by 深圳市群晖智能科技股份有限公司 filed Critical 深圳市群晖智能科技股份有限公司
Priority to US18/550,251 priority Critical patent/US20240171841A1/en
Publication of WO2023011666A1 publication Critical patent/WO2023011666A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics

Definitions

  • the invention relates to the technical field of optoelectronic equipment, in particular to a camera module, an image acquisition module and a processing method for a base thereof.
  • FPC Flexible Printed Circuit, flexible circuit board
  • resistors, capacitors, connectors, drivers /Memory chips and other components are mounted on the surface of the substrate and fixed by soldering, and then the image sensor is mounted on the substrate through special packaging equipment, and the image sensor is electrically connected to the substrate by means of gold wires or solder balls, and then the filter Components such as light sheets and mirror mounts are assembled with the substrate to obtain a camera module.
  • the surface flatness of FPC is generally poor.
  • the assembly accuracy of the camera module is difficult to control, and the defective rate is high.
  • a processing method for a base of an image acquisition module comprising the following steps:
  • it also includes:
  • the electronic components include at least resistors and capacitors;
  • the step of providing the conductor includes:
  • the step of die-cutting the copper foil and bending it into a wire substrate it further includes:
  • a plating layer is formed on the surface of the wire base material to obtain a conductor, and the plating layer material includes at least nickel and gold.
  • a processing method for a base of an image acquisition module comprising the following steps:
  • the conductor and the plastic are integrally molded into a base, wherein one side of the base is used for assembling a mirror base, and the other side is used for electrically connecting and installing an image sensor through the conductor.
  • a processing method for an image acquisition module comprising the following steps:
  • the base includes a base and a conductor injection-molded on the base;
  • the image sensor is assembled on the base, and the image sensor is electrically connected with the conductor.
  • the step of assembling the image sensor on the base it also includes:
  • Conductive particles are provided on the image sensor, and the conductive particles are used to realize the electrical connection between the image sensor and the conductor.
  • the step of assembling the image sensor on the base includes:
  • the image sensor provided with the conductive particles is attached to the base.
  • any of the following schemes is included:
  • a laser solder ball welding machine is used to place conductive particles on the image sensor.
  • the base is made by any one of the processing methods mentioned above.
  • a processing method for an image acquisition module comprising the following steps:
  • the base includes a base body and a conductor integrally formed on the base body;
  • the image sensor is assembled on the base, and the image sensor is electrically connected with the conductor.
  • a processing method for a camera module comprising the following steps:
  • An image acquisition module includes a base, a conductor injection-molded on the base, and an image sensor, the image sensor is arranged on one side of the base and is electrically connected to the conductor connection;
  • a mirror mount is provided, which is attached to the other side of the base.
  • the image acquisition module is made by any one of the above-mentioned processing methods.
  • the base has a through hole, after the step of injection molding the conductor into the base, and before the step of assembling the mirror base on the base, further comprising:
  • a filter is assembled on the base and covers one end of the through hole, and the opposite end of the through hole is used to cover the image sensor.
  • the base has a first installation groove and a second installation groove, the first installation groove is located on one side of the base and communicates with the through hole, and the first installation groove is used for The filter is accommodated; the second mounting groove is located on the opposite side of the base and communicates with the through hole, and the second mounting groove is used to accommodate the image sensor.
  • it also includes electronic components, wherein solder paste is injected into the base and the electronic components are electrically connected to the conductor by means of solder paste through reflow soldering.
  • the side where the sensor is located has a second installation groove and a third installation groove arranged at intervals, the second installation groove is used for accommodating the image sensor, and the third installation groove is used for accommodating the electronic components.
  • the base, image acquisition module and camera module prepared by the above processing method because the conductor electrically connected to the image sensor is injection-molded on the base, the mirror base and the image sensor can be assembled on the base.
  • the base has higher The structural rigidity, surface flatness and positional accuracy are easier to guarantee.
  • the image sensor and mirror holder are assembled on the base, higher assembly accuracy can be obtained.
  • the above-mentioned image acquisition module has a higher integration level, which can reduce the investment in high-precision production equipment, and has fewer production processes and quality control. Less difficult and less expensive.
  • the image sensor is electrically connected to the conductor that is injection-molded on the base, this arrangement simplifies the assembly and electrical connection process of the image sensor and the base, and ensures the reliability of the electrical connection between the image sensor and the base.
  • the conductor can be used Compared with the high-purity gold wire of FPC, the conductor has better structural stability and lower cost, and can ensure the reliability of the electrical connection of the image sensor.
  • FIG. 1 is a schematic diagram of a camera module in the related art
  • FIG. 2 is a schematic diagram of another camera module in the related art
  • Fig. 3 is a schematic diagram of a processing method of an image acquisition module of an embodiment
  • Fig. 4 is a flow chart of the processing method of the image acquisition module of an embodiment
  • Fig. 5 is an exploded schematic diagram of a camera module of an embodiment
  • Fig. 6 is the bottom view of the image acquisition module of an embodiment
  • FIG. 7 is a schematic diagram of a processing method of an image acquisition module in another embodiment
  • Fig. 8 is a cross-sectional view of a position of the image acquisition module of an embodiment
  • Fig. 9 is a top view of an image acquisition module of an embodiment
  • Fig. 10 is a cross-sectional view of another position of the image acquisition module of an embodiment
  • FIG. 11 is a schematic diagram of a viewing angle of a camera module according to an embodiment
  • FIG. 12 is a schematic diagram of another viewing angle of the camera module shown in FIG. 11 .
  • Positioning structure 300 Positioning structure 300. Image acquisition module 301. Conductor
  • a COB (Chip on Board, chip on board) type camera module generally includes a flexible circuit board 11, an image sensor 12, an optical filter 13, a mount 14, a lens barrel 15 and a connector 16 , the flexible circuit board 11 is provided with electronic components 17 such as capacitors and resistors, the image sensor 12 is stacked on one side of the flexible circuit board 11 and is electrically connected to the flexible circuit board 11 through a gold wire 18, and the mounting seat 14 is stacked on the flexible circuit board 11
  • the circuit board 11 also covers the image sensor 12 .
  • the lens barrel 15 is connected to the mount 14 , and a lens group for converging light to the image sensor 12 is disposed in the lens barrel 15 .
  • the filter 13 is disposed on the mount 14 and between the lens group and the image sensor 12 , the filter 13 is used to filter infrared light to improve the quality of shooting.
  • the connector 16 is electrically connected to the flexible circuit board 11 , and the camera module can be electrically connected to an external circuit such as a mainboard of a mobile phone through the connector 16 to realize a communication connection between the camera module and the mainboard.
  • a CSP (Chip Scale Package, chip size package) type camera module generally includes a flexible circuit board 11, an image sensor 12, a mount 14, a lens barrel 15 and a connector 16, and the flexible circuit board 11 is set There are electronic components 17 such as capacitors and resistors. Different from the COP camera module, the image sensor 12 of the CSP camera module is generally electrically connected to the flexible circuit board 11 by solder balls 19 .
  • the combination of the lens barrel 15 and the mounting base 14 can be called a lens base.
  • the lens barrel 15 and the mounting base 14 can be assembled, for example, the lens barrel 15 and the mounting base 14 can be screwed together.
  • the lens barrel 15 can also be integrally formed with the mount 14 .
  • the above COB/CSP type camera module in the processing process of the camera module, generally uses the flexible circuit board 11 as the substrate, and uses the surface mount process to mount the electronic components 17 such as resistors, capacitors, drive/storage chips, and connectors. 16 is mounted on the surface of the substrate and fixed by soldering, and then the image sensor 12 is installed on the substrate through special packaging equipment, and the electrical connection between the image sensor 12 and the substrate is realized by means of gold wires 18 or solder balls 19, etc., and then the filter Components such as the sheet 13, the mounting base 14, and the lens barrel 15 are assembled with the substrate to obtain a camera module.
  • the electronic components 17 such as resistors, capacitors, drive/storage chips, and connectors. 16 is mounted on the surface of the substrate and fixed by soldering
  • the image sensor 12 is installed on the substrate through special packaging equipment, and the electrical connection between the image sensor 12 and the substrate is realized by means of gold wires 18 or solder balls 19, etc.
  • the filter Components such as the sheet 13, the mounting base
  • the flatness of the surface of the flexible circuit board 11 is generally poor.
  • the flexible circuit board 11 is used as the substrate to assemble the image sensor 12, the lens holder and other structures, it is difficult to control the assembly accuracy of the camera module and the defective rate is high.
  • the invention discloses a processing method for a camera module, an image acquisition module and a base thereof.
  • the image acquisition module can be applied to the camera module to improve the production yield of the camera module.
  • the processing method of image acquisition module 300 comprises the following steps:
  • the conductor 301 uses copper as the base material, that is, as the main part of the conductive circuit, and its surface can be plated with a metal coating to improve surface wear resistance and electrical conductivity.
  • the conductor 301 is used to electrically connect the image sensor 320 of the camera module, and can be used to electrically connect external circuit boards such as mainboards of electronic devices such as mobile phones and tablet computers, so as to realize the connection between the camera module and Communication connection to external motherboard.
  • copper is used as the base material of the conductor 301 , the cost is relatively low compared to the gold wire 18 , silver wire, and the like.
  • the base material of the conductor 301 may also be silver wire or other alloy materials.
  • step S100 of providing the conductor 301 specifically, the following steps may be included:
  • the wire base material can be obtained after punching and bending the copper foil 30 with a knife die, and the wire base material is roughly curved, which may include more than two wire base materials
  • One end of the material can be used to electrically connect to the image sensor 320, and the other end can be used to connect to external lines.
  • other connection points can be set between the two ends of the line substrate, and these connection points can be used to electrically connect to electronic components 17 such as resistors, capacitors, and drive/storage chips of the camera module, so as to realize the connection of the camera module. normal work.
  • step S110 of punching the copper foil 30 and bending it into a wire substrate the following steps may also be included:
  • S130 forming a plating layer on the surface of the wire base material to obtain a conductor 301, and the plating layer material includes at least nickel and gold.
  • the coating can improve the surface properties of the conductor 301 , for example, improve the wear resistance and conductivity of the surface of the conductor 301 .
  • the plating material may also include tin.
  • the plating layer on the surface of the conductor 301 can be omitted.
  • the spot plating process is used to form a coating on the surface of the wire substrate.
  • the spot plating process is a kind of electroplating process. Its principle is to spray the plating solution from the anode water bag at high pressure to the plated area. , the metal ions in the plating solution are deposited on the area to be plated to form a coating.
  • the spot plating process can obtain accurate plating areas, that is, the specified position can be electroplated by using the spot plating process.
  • the conductor 301 is placed in a prefabricated mold cavity through an insert molding process, and then molten plastic is injected into the mold cavity. After the plastic cools, the base 310 can be formed. The conductor 301 of the base 310 is wrapped in plastic material. In some embodiments, both ends of the conductor 301 may be exposed to the base 310 , so as to facilitate the electrical connection between the conductor 301 and the image sensor 320 , and to facilitate the electrical connection between the conductor 301 and an external circuit.
  • the conductor 301 does not need to be exposed to the injection-molded base 310 , and a part of the plastic covering the conductor 301 can be melted or removed in other ways during the assembly process of the image sensor 320 and the conductor 301 .
  • the structure diagram of the mirror base 100 for assembling with the base 310 is shown in FIG. 5 , the mirror base 100 may include a connected lens barrel 110 and a mount 120, and the lens barrel 110 may include a plurality of lens groups for converging light, The mount 120 can be used to assemble with the base 310 .
  • the conductor 301 can be integrally formed on the base 310 in other ways, for example, the conductor 301 can be formed on the base 310 by powder metallurgy or the like.
  • a step S300 may also be included.
  • S300 Inject solder paste into the base 310, and paste the electronic components 330, where the electronic components 330 at least include resistors and capacitors.
  • the electronic components 330 can be fixed to the base 310 by reflow soldering, and the electrical connection between the electronic components 330 and the conductor 301 can be ensured. The reliability of the sexual connection.
  • step S400 may also be included.
  • the conductor 301 for electrical connection with the image sensor 320 can be exposed to the base 310, and before the image sensor 320 is assembled on the base 310 and electrically connected with the conductor 301, it can be placed on the position of the image sensor 320 for electrical connection.
  • Conductive particles 340 are provided, and the conductive particles 340 are used to realize the electrical connection between the image sensor 320 and the conductor 301 .
  • the image sensor 320 can also be called a photosensitive chip or a photosensitive element, and can convert received light signals into electrical signals.
  • This application aims to provide an improved processing method to improve the yield rate of the base, image acquisition module, and camera module. It does not limit the specific type of image sensor 320, so any type of image sensor 320 can capture optical signals and generate electrical signals. All photoelectric conversion devices can be applied to the processing method of the present application.
  • the image sensor 320 may include but not limited to CCD (Charged Coupled Device), CMOS (Complementary Metal-Oxide Semiconductor), CIS (Contact Image Sensor) devices.
  • a gold wire ball bonder can be used to place conductive particles 340 at the position of the image sensor 320 for electrical connection, that is, the image sensor 320 is planted with gold ball particles, and a centrifuge can be used to Cleaning and drying are performed to facilitate the electrical connection between the image sensor 320 and the conductor 301 through the gold ball particles, and to ensure the reliability of the electrical connection. It can be understood that, in this implementation manner, step S300 and step S400 may be performed simultaneously, or step S400 may also be performed prior to step S300.
  • a laser solder ball welding machine can be used to set conductive particles 340 at the position of the image sensor 320 for electrical connection, that is, to solder solder balls on the image sensor 320, so as to realize the connection between the image sensor 320 and the image sensor 320 through solder balls.
  • the electrical connection of the conductor 301 and ensure the reliability of the electrical connection.
  • step S300 and step S400 can be performed simultaneously, or step S400 can also be performed prior to step S300. Referring to FIG.
  • S500 Assemble the image sensor 320 on the base 310 , and electrically connect the image sensor 320 to the conductor 301 .
  • the image sensor 320 can be assembled on the base 310 , and corresponding processing (such as reflow soldering, etc.) can be performed to electrically connect the image sensor 320 to the conductor 301 of the base 310 .
  • the image sensor 320 can further be electrically connected to an external circuit board through the conductor 301 to realize communication with the external circuit board.
  • step S500 of assembling the image sensor 320 on the base 310 it may include:
  • S510 Attach the image sensor 320 provided with the conductive particles 340 to the base 310 by using a flip-chip packaging process.
  • Flip chip is to connect the conductive contacts of the chip to the circuit of the substrate, circuit board and other devices. During the connection process, because the bump of the chip is connected downward, it is called flip chip. Electronic devices manufactured by flip-chip packaging technology have high integration, small volume, and high performance.
  • the image sensor 320 After the image sensor 320 provided with the conductive particles 340 is pasted on the base 310 by a flip-chip packaging process, the image sensor 320 can form a reliable electrical connection with the base 310 after corresponding processing.
  • step S510 the following step S520 may also be performed.
  • S520 Test the base 310 on which the image sensor 320 is pasted, fill the base with glue and bake and cure after passing the test, so as to obtain the image acquisition module 300 .
  • the base 310 has a through hole 310a, after the step S200 of injection molding the conductor 301 into the base 310, and before the step of assembling the mirror base 100 on the base 310, you can also Step S600 is included.
  • S600 Assemble the filter 350 on the base 310 and cover one end of the through hole 310a, and the opposite end of the through hole 310a is used to cover the image sensor 320.
  • the optical filtering can be realized after the operations of drawing glue, attaching the optical filter 350, baking and curing, centrifugal cleaning, and drying in sequence. Reliable fixation of the sheet 350 on the base 310.
  • the base 310 has a first installation groove 310b and a second installation groove 310c
  • the first installation groove 310b is located on one side of the base 310 and communicates with the through hole 310a
  • the first installation groove 310b Used to accommodate the filter 350.
  • the second installation groove 310c is located on the opposite side of the base 310 and communicates with the through hole 310a, and the second installation groove 310c is used for accommodating the image sensor 320 .
  • the base 310 can respectively define a first installation groove 310b and a second installation groove 310c at opposite ends of the through hole 310a, and the first installation groove 310b is used to install the optical filter 350, The second installation groove 310c is used for installing the image sensor 320 .
  • the first installation groove 310 b is beneficial to the assembly and positioning of the filter 350 on the base 310
  • the second installation groove 310 c is beneficial to the assembly and positioning of the image sensor 320 on the base 310 .
  • the filter 350 is located between the lens group of the mirror base 100 and the image sensor 320. And incident to the image sensor 320 , and then imaged on the image sensor 320 .
  • the optical filter 350 can be installed on the base 310 before the image sensor 320, that is, step S600 can be performed before step S500.
  • the optical filter 350 may be omitted, that is, step S600 may be omitted.
  • the base 310 has a third installation groove 310d spaced apart from the second installation groove 310c on the side where the image sensor 320 is located, and the third installation groove 310d is used for accommodating the electronic component 330 .
  • the third installation groove 310d may be arranged at intervals of more than two, and may be arranged around the second installation groove 310c.
  • Each third installation slot 310 d can install more than one electronic component 330 such as a resistor, capacitor, etc., so that these electronic components 330 are physically isolated from the installation area of the image sensor 320 .
  • the installation area of the image sensor 320 can be smaller, and can effectively prevent dust and other foreign objects from polluting the installation area of the image sensor 320 during the installation of electronic components, thereby improving the yield rate of the product.
  • the limiting structure 311 may be directly formed or processed on the base 310 .
  • a camera module including a mirror base 100 and an image acquisition module 300 is shown in FIG. 11 and FIG. 12 .
  • the limiting structure 311 is used for installing and positioning the mirror base 100 on the base 310 .
  • the mirror base 100 includes a lens barrel 110 and a mounting base 120, the lens barrel 110 is mounted on the base 310 through the mounting base 120, and the mounting base 120 of the camera module can also be provided with a positioning structure adapted to the limiting structure 311 of the base 310 121.
  • the limiting structure 311 of the base 310 may be a boss provided on the base 310
  • the positioning structure 121 of the mounting seat 200 may be a groove adapted to the boss.
  • the mounting base 200 can be assembled to the image acquisition module 300 by HM (Holder Mount) equipment, and then manually adjust the mounting base 110 of the mirror base 100 and the position of the lens barrel 120 on the base 310 to achieve The sharp focus of the camera module.
  • the mirror base 100 can also be automatically adjusted to clear focus through an AA (Active Alignment, active adjustment) device.
  • AA Active Alignment, active adjustment
  • the conductor 301 used for electrical connection with the image sensor 320 is injection molded or integrally formed on the base 310, and the mirror base 100 and the image sensor 320 can be assembled on the
  • the base 310 has higher structural rigidity than the FPC, and its surface flatness and position accuracy are easier to ensure.
  • higher assembly accuracy can be obtained.
  • the above-mentioned image acquisition module 300 has a higher degree of integration, can reduce the investment in high-precision production equipment, and has fewer production processes , Quality control is less difficult and the cost is lower.
  • the image sensor 320 is electrically connected to the conductor 301 that is injection molded or integrally formed on the base 310, this arrangement simplifies the assembly and electrical connection process of the image sensor 320 and the base 310, and can ensure the connection between the image sensor 320 and the base 310. Reliability of electrical connections.
  • Conductor 301 can be made of low-cost materials such as copper foil 30. Compared with high-purity gold wire 18 of FPC, conductor 301 has better structural stability and lower cost, and can ensure the electrical performance of image sensor 320. connection reliability.
  • the FPC is no longer used as the assembly substrate of the image sensor 320 and the mirror holder 100, the expensive nickel-palladium-gold FPC material can be saved, the cost of the product is greatly reduced, the performance is greatly improved, and it has a higher Cost performance and market competitive advantage.
  • the gold wire 18 connection mode between the image sensor 320 and the FPC is cancelled, when the processing method of the image acquisition module 300 of the present invention is adopted, the electronic components (capacitors, resistors, image sensors, etc.) realize electrical performance through the conductor 301. Connection, this connection method can shorten the circuit length, effectively reduce electrical impedance and signal interference, and further improve the performance and stability of the product.
  • the image acquisition module 300 produced by the processing method of the image acquisition module 300 of the present invention has a further optimized process flow, and also reduces a large number of assembly processes that require precision equipment or imported equipment to complete, greatly reducing equipment investment Cost and labor costs, greatly improving production efficiency.
  • the cumulative tolerance of the process can be further reduced, so as to improve the processing and assembly accuracy of the product, so that the yield rate of the product is greatly improved .
  • the processing method of the image acquisition module 300 disclosed in the embodiment of the present invention can adaptably improve the forming mold of the base 310, and form multiple bases 310 or even multiple image acquisition modules 300 at one time, so as to realize large-scale, batch Standardized and standardized production operations, standardized packaging of camera modules, and long-term, long-term, batch production without changing lines have greatly improved product stability, yield and production efficiency.
  • the conductor 301 used is injection molded or integrally formed on the base 310, the conductor 301 can have a certain structural rigidity, or a male structure for electrical connection can be formed on the base 310 by means of welding, and the external circuit board only needs to be provided with a corresponding
  • the female base structure can realize the convenient insertion and insertion of the image acquisition module 300 and the external circuit board, so as to shorten the path of electrical connection, and improve the efficiency of assembly and the working performance.

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Abstract

本发明涉及一种摄像头模组、图像采集模组及其底座的加工方法。该底座的加工方法包括以下步骤：提供导电体；将导电体置于模腔并将熔融状态的塑胶注入模腔以形成所述底座，其中所述底座的一侧用于组装镜座，另一侧用于通过所述导电体电性连接安装图像传感器。上述加工方法中，用于与图像传感器电性连接的导电体注塑成型于底座，镜座、图像传感器可组装于底座，相比FPC，底座具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器、镜座组装于底座时，可获得更高的装配精度。上述图像采集模组具有更高的集成度，可减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。

Description

摄像头模组、图像采集模组及其底座的加工方法 技术领域
本发明涉及光电设备技术领域，特别是涉及一种摄像头模组、图像采集模组及其底座的加工方法。
背景技术
相关技术中，在摄像头模组的加工过程中，一般以FPC(Flexible Printed Circuit，柔性线路板)为基板，采用SMT(Surface Mounted Technology，表面贴装技术)工艺将电阻、电容、连接器、驱动/存储芯片等元器件贴装于基板表面并焊接固定，再通过专用封装设备将图像传感器安装于基板，并以金线或锡球等方式实现图像传感器与基板的电性连接，之后再将滤光片、镜座等器件与基板进行组装以获得摄像头模组。
然而，FPC的表面平整度一般较差，以FPC为基板组装图像传感器、镜座等结构时造成摄像头模组的装配精度难以控制，不良率高。
发明内容
基于此，有必要提供一种摄像头模组、图像采集模组及其底座的加工方法，提升产品的良率。
一种图像采集模组的底座的加工方法，包括以下步骤：
提供导电体；
将所述导电体置于模腔并将熔融状态的塑胶注入模腔以形成所述底座，其中所述底座的一侧用于组装镜座，另一侧用于通过所述导电体电性连接安装图像传感器。
在其中一个实施例中，还包括：
在所述底座注入锡膏，并贴上电子元器件，所述电子元器件至少包括电阻和电容；以及
回流焊，以使所述电子元器件通过所述锡膏与所述导电体电性连接。
在其中一个实施例中，在提供导电体的步骤中，包括：
冲切铜箔并弯折成线基材。
在其中一个实施例中，在冲切铜箔并弯折成线基材的步骤后，还包括：
在所述线基材表面形成镀层，获得导电体，所述镀层材料至少包括镍和金。
一种图像采集模组的底座的加工方法，包括以下步骤：
提供导电体；
将所述导电体与塑胶一体成型成底座，其中所述底座的一侧用于组装镜座，另一侧用于通过所述导电体电性连接安装图像传感器。
一种图像采集模组的加工方法，包括以下步骤：
提供底座，其中所述底座包括座体和注塑成型于所述座体的导电体；以及
将图像传感器组装于所述底座，并使所述图像传感器与所述导电体电性连接。
在其中一个实施例中，在将图像传感器组装于所述底座的步骤之前，还包括：
在所述图像传感器设置导电颗粒，所述导电颗粒用于实现所述图像传感器与所述导电体的电性连接。
在其中一个实施例中，在将图像传感器组装于所述底座的步骤中，包括：
采用倒装芯片封装工艺，将设置有所述导电颗粒的所述图像传感器贴于所述底座。
在其中一个实施例中，在所述图像传感器设置导电颗粒的步骤中，包括以下任一种方案：
采用金丝球焊机在所述图像传感器设置导电颗粒；
采用激光锡球焊接机在所述图像传感器设置导电颗粒。
在其中一个实施例中，所述底座由上述任意一种中的加工方法制得。
一种图像采集模组的加工方法，包括以下步骤：
提供底座，其中所述底座包括座体和一体成型于所述座体的导电体；以及
将图像传感器组装于所述底座，并使所述图像传感器与所述导电体电性连接。
一种摄像头模组的加工方法，包括以下步骤：
提供图像采集模组，其中所述图像采集模组包括底座、注塑成型于所述底座的导电体，以及图像传感器，所述图像传感器设于所述底座的一侧且与所述导电体电性连接；及
提供镜座，将镜座连接于所述底座的另一侧。
在其中一个实施例中，所述图像采集模组由上述任意一种的加工方法制得。
在其中一个实施例中，所述底座具有通孔，在将所述导电体注塑成型成底座的步骤之后，以及将镜座组装于所述底座的步骤之前，还包括：
将滤光片组装于所述底座并覆盖所述通孔的一端，所述通孔的相对的另一端用于覆盖所述图像传感器。
在其中一个实施例中，所述底座具有第一安装槽和第二安装槽，所述第一安装槽位于所述底座的一侧并与所述通孔连通，所述第一安装槽用于容置所述滤光片；所述第二安装槽位于所述底座的相对的另一侧并与所述通孔连通，所述第二安装槽用于容置所述图像传感器。
在其中一个实施例中，还包括电子元器件，其中在所述底座注入锡膏并通过回流焊将所述电子元器件借助锡膏与所述导电体电性连接，所述底座于所述图像传感器所在侧具有间隔设置的第二安装槽和第三安装槽，所述第二安装槽用于容置所述图像传感器，所述第三安装槽用于容置所述电子元器件。
上述加工方法制得的底座、图像采集模组和摄像头模组，由于与图像传感器电性连接的导电体注塑成型于底座，镜座、图像传感器可组装于底座，相比FPC，底座具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器、镜座组装于底座时，可获得更高的装配精度。相比于相关技术中图像传感器封装于FPC、镜座叠置于FPC的结构，上述图像采集模组具有更高的集成度，可减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。由于图像传感器与注塑成型于底座的导电体电性连接，这种设置方式简化了图像传感器与底座的组装及电气连接过程，并保证图像传感器与底座的电性连接的可靠性，导电体可以采用铜箔等成本较低的材料制成，相比FPC的高纯度金线，导电体的结构稳定性更好且成本更低，并可保证图像传感器的电 性连接的可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术中一种摄像头模组的示意图；
图2为相关技术中另一种摄像头模组的示意图；
图3为一实施例的图像采集模组的加工方法示意图；
图4为一实施例的图像采集模组的加工方法流程图；
图5为一实施例的摄像头模组的爆炸示意图；
图6为一实施例的图像采集模组的仰视图；
图7为另一实施例的图像采集模组的加工方法示意图；
图8为一实施例的图像采集模组的一位置的剖视图；
图9为一实施例的图像采集模组的俯视图；
图10为一实施例的图像采集模组的另一位置的剖视图；
图11为一实施例的摄像头模组的一视角的示意图；
图12为图11所示摄像头模组的另一视角的示意图。
附图标记：
11、柔性线路板        12、图像传感器      13、滤光片
14、安装座            15、镜筒            16、连接器
17、电子元器件        18、金线            19、锡球
100、镜座             110、镜筒           120、安装座
121、定位结构         300、图像采集模组   301、导电体
310、底座             311、限位结构       320、图像传感器
330、电子元器件       340、导电颗粒       350、滤光片
310a、通孔            310b、第一安装槽    310c、第二安装槽
310d、第三安装槽      30、铜箔
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
参考图1，相关技术中，COB(Chip on Board，板上芯片封装)型摄像头模组一般包括柔性线路板11、图像传感器12、滤光片13、安装座14、镜筒15和连接器16，柔性线路板11设置有电容、电阻等电子元器件17，图像传感器12叠置于柔性线路板11的一侧且通过金线18与柔性线路板11电性连接，安装座14叠置于柔性线路板11并覆盖图像传感器12。镜筒15连接于安装座14，镜筒15内设有用于将光线汇聚至图像传感器12的透镜组。滤光片13设置于安装座14并设置于透镜组与图像传感器12之间，滤光片13用于过滤红外光，以提升拍摄的质量。连接器16电性连接于柔性线路板11，摄像头模组可通过连接器16电性连接至外部电路例如手机的主板等，以实现摄像头模组与主板的通信连接。
参考图2，相关技术中，CSP(Chip Scale Package，芯片尺寸封装)型摄像头模组一般包括柔性线路板11、图像传感器12、安装座14、镜筒15以及连 接器16，柔性线路板11设置有电容、电阻等电子元器件17，区别于COP摄像头模组，CSP型摄像头模组的图像传感器12一般采用锡球19与柔性线路板11电性连接。
镜筒15与安装座14的组合可以称为镜座。镜筒15与安装座14可以组装成型，例如镜筒15与安装座14可以螺纹连接。镜筒15也可以和安装座14一体成型。
以上的COB/CSP型摄像头模组，在摄像头模组的加工过程中，一般以柔性线路板11为基板，采用表面贴装工艺将电阻、电容、驱动/存储芯片等电子元器件17以及连接器16贴装于基板表面并焊接固定，再通过专用封装设备将图像传感器12安装于基板，并以金线18或锡球19等方式实现图像传感器12与基板的电性连接，之后再将滤光片13、安装座14、镜筒15等器件与基板进行组装以获得摄像头模组。
然而，柔性线路板11的表面平整度一般较差，以柔性线路板11为基板组装图像传感器12、镜座等结构时造成摄像头模组的装配精度难以控制，不良率高。
为提升摄像头模组的生产良率，本发明公开了一种摄像头模组、图像采集模组及其底座的加工方法。图像采集模组可应用于摄像头模组，以提升摄像头模组的生产良率。
参考图3和图4，图像采集模组300的加工方法包括以下步骤：
S100：提供导电体301。
在一些实施方式中，导电体301采用铜作为基材，即作为导电线路的主要部分，其表面可镀上金属镀层以改善表面耐磨性能和导电性能等。在本发明实施方式中，导电体301用于电性连接摄像头模组的图像传感器320，并可用于电性连接外部的电路板例如手机、平板电脑等电子设备的主板，以实现摄像头模组与外部主板的通信连接。采用铜作为导电体301的基材时，相对于金线18、银线等，成本相对较低。当然，在其他实施方式中，导电体301的基材也可以采用银线或者其他合金材料。
在提供导电体301的步骤S100中，具体可以包括如下步骤：
S110：冲切铜箔30并弯折成线基材。
参考图3，在一些实施方式中，采用刀模对铜箔30进行冲切和折弯加工后，即可获得线基材，线基材大致呈曲线状，其可以包括两条以上，线基材的一端可用于电性连接于图像传感器320，另一端可用于连接外部线路。当然，在线基材的两端之间，可以设置其他连接点，这些连接点可用于电性连接至摄像头模组的电阻、电容、驱动/存储芯片等电子元器件17，以实现摄像头模组的正常工作。
在冲切铜箔30并弯折成线基材的步骤S110后，还可以包括以下步骤：
S130：在线基材表面形成镀层，获得导电体301，镀层材料至少包括镍和金。
镀层可改善导电体301的表面特性，例如改善导电体301表面的耐磨性能和导电性能。在一些实施方式中，镀层材料还可包括锡。当然，可以理解的是，导电体301表面的镀层可缺省。
在一些实施方式中，采用点镀工艺在线基材的表面形成镀层，点镀工艺属于电镀工艺的一种，其原理是将镀液从阳极水囊高压喷出至被镀区，在电场作用下，镀液中的金属离子沉积于被镀区而形成镀层。点镀工艺可以获得精确的镀区，也即采用点镀工艺可以对指定位置进行电镀。
S200：将导电体301注塑成型成底座310，底座310用于组装镜座100。
在一些实施方式中，通过嵌件成型(insert molding)工艺，将导电体301置于预先制好的模腔内，然后将熔融状态的塑胶注入模腔，塑胶冷却后，即可形成底座310，底座310的导电体301包覆于塑胶材料内。在一些实施方式中，导电体301的两端可以暴露于底座310，以便于导电体301与图像传感器320的电性连接，且便于导电体301与外部电路的电性连接。在另一些实施方式中，导电体301无需暴露于注塑成型的底座310，在图像传感器320与导电体301的组装过程中再将覆盖导电体301的一部分塑胶熔融或采用其他方式去除即可。用于与底座310组装的镜座100的结构示意如图5所示，镜座100可包括相连接的镜筒110和安装座120，镜筒110可包括多个用于汇聚光线的透镜组，安装座120可用于和底座310组装。在其他实施方式中，导电体301可以采用其他方式一体成型于底座310，例如，导电体301可以采用粉末冶金等方式形成于底 座310。
在将导电体301注塑成型成底座310的步骤S200之后，还可以包括步骤S300。
S300：在底座310注入锡膏，并贴上电子元器件330，电子元器件330至少包括电阻和电容。
结合图6，在一些实施方式中，底座310注入锡膏并贴上电子元器件330后，可通过回流焊使得电子元器件330固定于底座310，并保证电子元器件330与导电体301的电性连接的可靠性。
在步骤S300之后，还可以包括步骤S400。
S400：在图像传感器320设置导电颗粒340，导电颗粒340用于实现图像传感器320与导电体301的电性连接。
用于与图像传感器320电性连接的导电体301可暴露于底座310，在图像传感器320组装于底座310并与导电体301电性连接之前，可在图像传感器320的用于电性连接的位置设置导电颗粒340，导电颗粒340用于实现图像传感器320与导电体301的电性连接。
图像传感器320也可以称为感光芯片或感光元件，可将接收的光信号转换成电信号。本申请旨在提供一种改进的加工方法以使得底座、图像采集模块、摄像头模组的良率提升，并不限制图像传感器320的具体类型，因此可捕捉光信号并生成电信号的任何类型的光电转换器件均可应用至本申请的加工方法中。作为示例，图像传感器320可以包括但不限于CCD(Charged Coupled Device)、CMOS(Complementary Metal-Oxide Semiconductor)、CIS(Contact Image Sensor)器件。
继续参考图3，在一些实施方式中，可采用金丝球焊机在图像传感器320的用于电性连接的位置设置导电颗粒340，即在图像传感器320植上金球微粒，并可采用离心清洗甩干，以便于通过金球微粒实现图像传感器320与导电体301的电性连接，并保证电性连接的可靠性。可以理解的是，在这种实施方式中，步骤S300和步骤S400可以同时进行，或者步骤S400也可以先于步骤S300进行。
在另一些实施方式中，可以采用激光锡球焊接机在图像传感器320的用于电性连接的位置设置导电颗粒340，即在图像传感器320焊接锡球，以便于通过锡球实现图像传感器320与导电体301的电性连接，并保证电性连接的可靠性。在这种实施方式中，由于步骤S300和步骤S400均采用锡，步骤S300和步骤S400可以同时进行，或者步骤S400也可以先于步骤S300进行。结合图7，在底座310注入锡膏并贴上电子元器件330且在图像传感器320设置锡球后，可以等待将图像传感器320组装于底座310后，即在以下步骤S500中，统一进行回流焊，使得电子元器件330与图像传感器320与底座310的导电体301形成可靠的电性连接。这种加工方式，可以节省加工步骤，提升加工效率。
S500：将图像传感器320组装于底座310，并使图像传感器320与导电体301电性连接。
步骤S300和步骤S400完成后，可将图像传感器320组装于底座310，并进行相应的处理(例如回流焊等)，以使图像传感器320与底座310的导电体301电性连接。图像传感器320进而可通过导电体301电性连接至外部电路板，以实现与外部电路板的通信。
在将图像传感器320组装于底座310的步骤S500中，可以包括：
S510：采用倒装芯片封装工艺，将设置有导电颗粒340的图像传感器320贴于底座310。
倒装芯片(Flip Chip)是将芯片的导电触点与基板、电路板等器件的电路相连，在相连的过程中，由于芯片的凸点是朝下连接，因此称为倒装。采用倒装芯片封装工艺制得的电子器件，具有较高的集成度和较小体积，且具有较高的性能。
采用倒装芯片封装工艺将设置有导电颗粒340的图像传感器320贴于底座310后，经过相应的处理，图像传感器320可与底座310形成可靠的电性连接。
在步骤S510之后，还可以进行下述步骤S520。
S520：对贴有图像传感器320的底座310进行测试，测试通过后再填充胶并烘烤固化，以获得图像采集模组300。
参考图8和图9，在一些实施方式中，底座310具有通孔310a，在将导电 体301注塑成型成底座310的步骤S200之后，以及将镜座100组装于底座310的步骤之前，还可以包括步骤S600。
S600：将滤光片350组装于底座310并覆盖通孔310a的一端，通孔310a的相对的另一端用于覆盖图像传感器320。
在一些实施方式中，在通孔310a的用于组装滤光片350的一端，依次经画胶、贴滤光片350、烘烤固化、离心清洗、甩干的操作后，即可实现滤光片350在底座310的可靠固定。
进一步，参考图10，在一些实施方式中，底座310具有第一安装槽310b和第二安装槽310c，第一安装槽310b位于底座310的一侧并与通孔310a连通，第一安装槽310b用于容置滤光片350。第二安装槽310c位于底座310的相对的另一侧并与通孔310a连通，第二安装槽310c用于容置图像传感器320。换言之，在这种实施方式中，底座310于通孔310a的相对的两端，可以分别开设第一安装槽310b和第二安装槽310c，且第一安装槽310b用于安装滤光片350，第二安装槽310c用于安装图像传感器320。第一安装槽310b有利于滤光片350在底座310的装配定位，第二安装槽310c有利于图像传感器320在底座310的装配定位。
可以理解的是，在镜座100与底座310组装后，滤光片350位于镜座100的透镜组与图像传感器320之间，在拍摄过程中，环境光线依次经镜座100、滤光片350并入射至图像传感器320，进而在图像传感器320成像。
在一些实施方式中，滤光片350可以先于图像传感器320安装于底座310，也即步骤S600可以在步骤S500之前进行。
当然，在一些实施方式中，滤光片350可以缺省，也即步骤S600可以缺省。
进一步，参考图10，在一些实施方式中，底座310于图像传感器320所在侧具有与第二安装槽310c间隔设置的第三安装槽310d，第三安装槽310d用于容置电子元器件330。第三安装槽310d可以间隔设置为两个以上，且可以环绕第二安装槽310c布置。每个第三安装槽310d可以安装一个以上的电子元器件330例如电阻、电容等，以使这些电子元器件330与图像传感器320的安装区域实现物理上的隔离。这种结构设置，图像传感器320的安装区域可以较小，并 可有效防止电子元器件安装过程中的灰尘等异物对图像传感器320安装区域的污染，从而提升产品的良率。
参考图11和图12，在一些实施方式中，底座310注塑成型后，还可以在底座310直接成型或加工成型限位结构311。在图11和图12示出了一种包括镜座100和图像采集模组300的摄像头模组。限位结构311用于镜座100在底座310的安装定位。镜座100包括镜筒110和安装座120，镜筒110通过安装座120安装于底座310，摄像头模组的安装座120也可以设置有用于与底座310的限位结构311相适配的定位结构121。示例性地，底座310的限位结构311可以是设置于底座310的凸台，安装座200的定位结构121可以是与凸台适配的凹槽。在一些实施方式中，安装座200可通过HM(Holder Mount，底座贴装)设备组装至图像采集模组300，再手动调整镜座100的安装座110、镜筒120在底座310的位置以实现摄像头模组的清晰对焦。在另一些实施方式中，镜座100也可通过AA(Active Alignment，主动调整)设备自动调整至清晰对焦。
上述图像采集模组300的加工方法制得的图像采集模组300，用于与图像传感器320电性连接的导电体301注塑成型或一体成型于底座310，镜座100、图像传感器320可组装于底座310，相比FPC，底座310具有更高的结构刚性，其表面平整度、位置精度等更容易保证，在图像传感器320、镜座100组装于底座310时，可获得更高的装配精度。相比于相关技术中图像传感器320封装于FPC、镜座100叠置于FPC的结构，上述图像采集模组300具有更高的集成度，可减少高精度生产设备的投入，且生产工序较少、品控难度更低、成本也更低。由于图像传感器320与注塑成型或一体成型于底座310的导电体301电性连接，这种设置方式简化了图像传感器320与底座310的组装及电气连接过程，并可保证图像传感器320与底座310的电性连接的可靠性。导电体301可以采用铜箔30等成本较低的材料制成，相比FPC的高纯度金线18，导电体301的结构稳定性更好且成本更低，并可保证图像传感器320的电性连接的可靠性。
在本发明实施方式中，由于不再采用FPC作为图像传感器320、镜座100的组装基板，可节省昂贵的镍钯金FPC材料，使产品的成本大幅降低，性能大幅提升，并具有更高的性价比和市场竞争优势。
进一步，由于取消了图像传感器320与FPC的金线18连接方式，采用本发明的图像采集模组300的加工方法时，电子元器件(电容、电阻、图像传感器等)通过导电体301实现电性连接，这种连接方式可以缩短电路长度，有效降低电性阻抗及信号干扰，进一步提高产品的性能和稳定性。
本发明的图像采集模组300的加工方法制得的图像采集模组300，工艺流程得到了进一步优化，制程中也减少了大量需要精密设备或进口设备才能完成的组装工序，大大降低了设备投入成本和人力成本，大幅提高了生产效率。
在图像采集模组300的生产加工过程中，由于底座310结构刚性的保证以及位置精度的提高，工序的累计公差可以进一步降低，以提升产品的加工和装配精度，使得产品的良率得到大幅提升。
进一步，本发明实施方式公开的图像采集模组300的加工方法，对底座310的成型模具可进行适应性改进，一次成型多个底座310甚至多个图像采集模组300，以实现大规模、批量化、标准化生产作业，实现摄像头模组的标准化封装，进行长单、长期、不换线批量生产，使产品的稳定性、良率和生产效率得到大幅提高。
由于采用的导电体301注塑成型或一体成型于底座310，导电体301可以具一定的结构刚性，或者可以采用焊接等方式在底座310形成电连接用的公头结构，外部电路板只需设置相应的母座结构，即可实现图像采集模组300与外部电路板的便捷插装，以缩短电连接的路径，提升组装的效率及工作性能。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (16)

  1. 一种图像采集模组的底座的加工方法，其特征在于，包括以下步骤：
    提供导电体；
    将所述导电体置于模腔并将熔融状态的塑胶注入模腔以形成所述底座，其中所述底座的一侧用于组装镜座，另一侧用于通过所述导电体电性连接安装图像传感器。
  2. 根据权利要求1所述的加工方法，其特征在于，还包括：
    在所述底座注入锡膏，并贴上电子元器件，所述电子元器件至少包括电阻和电容；以及
    回流焊，以使所述电子元器件通过所述锡膏与所述导电体电性连接。
  3. 根据权利要求1所述的加工方法，其特征在于，在提供导电体的步骤中，包括：
    冲切铜箔并弯折成线基材。
  4. 根据权利要求3所述的加工方法，其特征在于，在冲切铜箔并弯折成线基材的步骤后，还包括：
    在所述线基材表面形成镀层，获得导电体，所述镀层材料至少包括镍和金。
  5. 一种图像采集模组的底座的加工方法，其特征在于，包括以下步骤：
    提供导电体；
    将所述导电体与塑胶一体成型成底座，其中所述底座的一侧用于组装镜座，另一侧用于通过所述导电体电性连接安装图像传感器。
  6. 一种图像采集模组的加工方法，其特征在于，包括以下步骤：
    提供底座，其中所述底座包括座体和注塑成型于所述座体的导电体；以及
    将图像传感器组装于所述底座，并使所述图像传感器与所述导电体电性连接。
  7. 根据权利要求6所述的加工方法，其特征在于，在将图像传感器组装于所述底座的步骤之前，还包括：
    在所述图像传感器设置导电颗粒，所述导电颗粒用于实现所述图像传感器与所述导电体的电性连接。
  8. 根据权利要求7所述的加工方法，其特征在于，在将图像传感器组装于所述底座的步骤中，包括：
    采用倒装芯片封装工艺，将设置有所述导电颗粒的所述图像传感器贴于所述底座。
  9. 根据权利要求7所述的加工方法，其特征在于，在所述图像传感器设置导电颗粒的步骤中，包括以下任一种方案：
    采用金丝球焊机在所述图像传感器设置导电颗粒；
    采用激光锡球焊接机在所述图像传感器设置导电颗粒。
  10. 根据权利要求6-9任意一项所述的加工方法，其特征在于，所述底座由权利要求1-4任意一项中的加工方法制得。
  11. 一种图像采集模组的加工方法，其特征在于，包括以下步骤：
    提供底座，其中所述底座包括座体和一体成型于所述座体的导电体；以及
    将图像传感器组装于所述底座，并使所述图像传感器与所述导电体电性连接。
  12. 一种摄像头模组的加工方法，其特征在于，包括以下步骤：
    提供图像采集模组，其中所述图像采集模组包括底座、注塑成型于所述底座的导电体，以及图像传感器，所述图像传感器设于所述底座的一侧且与所述导电体电性连接；及
    提供镜座，将镜座连接于所述底座的另一侧。
  13. 根据权利要求12所述的加工方法，其特征在于，所述图像采集模组由权利要求6-11任意一项所述的加工方法制得。
  14. 根据权利要求13所述的加工方法，其特征在于，所述底座具有通孔，在将所述导电体注塑成型成底座的步骤之后，以及将镜座组装于所述底座的步骤之前，还包括：
    将滤光片组装于所述底座并覆盖所述通孔的一端，所述通孔的相对的另一端用于覆盖所述图像传感器。
  15. 根据权利要求14所述的加工方法，其特征在于，所述底座具有第一安装槽和第二安装槽，所述第一安装槽位于所述底座的一侧并与所述通孔连通， 所述第一安装槽用于容置所述滤光片；所述第二安装槽位于所述底座的相对的另一侧并与所述通孔连通，所述第二安装槽用于容置所述图像传感器。
  16. 根据权利要求15所述的加工方法，其特征在于，还包括电子元器件，其中在所述底座注入锡膏并通过回流焊将所述电子元器件借助锡膏与所述导电体电性连接，所述底座于所述图像传感器所在侧具有间隔设置的第二安装槽和第三安装槽，所述第二安装槽用于容置所述图像传感器，所述第三安装槽用于容置所述电子元器件。
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