WO2023005822A1 - 压力传感器模组及电子装置 - Google Patents
压力传感器模组及电子装置 Download PDFInfo
- Publication number
- WO2023005822A1 WO2023005822A1 PCT/CN2022/107274 CN2022107274W WO2023005822A1 WO 2023005822 A1 WO2023005822 A1 WO 2023005822A1 CN 2022107274 W CN2022107274 W CN 2022107274W WO 2023005822 A1 WO2023005822 A1 WO 2023005822A1
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- WIPO (PCT)
- Prior art keywords
- pressure sensor
- pressure
- sensor module
- circuit board
- receiving part
- Prior art date
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- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000003571 electronic cigarette Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Definitions
- the present application relates to the technical field of electronic equipment, in particular to a pressure sensor module and an electronic device.
- the present application provides a pressure sensor module and an electronic device to reduce assembly difficulty and facilitate automatic assembly.
- the embodiment of the present application provides a pressure sensor module.
- the pressure sensor module includes a pressure receiving part, a pressure sensor and at least two conductive pins.
- the pressure sensor is arranged on the pressure receiving part and deforms in the pressure receiving part. When a pressure signal is generated, at least two conductive pins are electrically connected to the pressure sensor and used for electrical connection with an external circuit board.
- the embodiment of the present application also provides an electronic device, including the above-mentioned pressure sensor module, circuit board and housing, the pressure sensor module and the circuit board are arranged in the housing, and the conductive pins of the pressure sensor module are welded to the circuit plate.
- the pressure sensor module provided by this application can fix the pressure sensor on the circuit board through conductive pins and realize the electrical connection between the pressure sensor and the circuit board, without the need to attach the pressure sensor separately to the housing of the electronic device , it can be assembled together with the circuit board in the casing, which reduces the difficulty of assembly and facilitates the realization of automatic assembly.
- the pressure sensor module is installed in the electronic device, when the user touches the pressure, the pressure receiving part is deformed under pressure and the pressure sensor produces a corresponding Pressure signals to trigger corresponding touch operations.
- FIG. 1 is a structural schematic diagram of a pressure sensor module provided in an embodiment of the present application installed on a circuit board;
- Fig. 2 is a structural schematic diagram of the pressure sensor module shown in Fig. 1 at a first viewing angle
- Fig. 3 is a structural schematic diagram of the pressure sensor module shown in Fig. 1 under a second viewing angle;
- Fig. 4 is a schematic structural diagram of another pressure sensor module provided by the embodiment of the present application.
- Fig. 5 is a structural schematic diagram of the pressure sensor shown in Fig. 4 at a first viewing angle
- FIG. 6 is a schematic structural view of the pressure sensor shown in 5 in a disassembled state
- FIG. 7 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
- FIG. 8 is a schematic diagram of the axial structure of the housing, the pressure sensor module and the circuit board in the electronic device shown in FIG. 7 in an assembled state;
- FIG. 9 is a schematic structural diagram of a housing in the electronic device shown in FIG. 8 .
- FIG. 10 is a schematic structural diagram of another housing of an electronic device provided by an embodiment of the present application.
- the embodiment of the present application provides a pressure sensor module 100 , the pressure sensor module 100 includes a pressure sensor 120 , at least two conductive pins 131 and a pressure receiving part 140 .
- the pressure sensor module 100 can be assembled on the circuit board 110 , and at least two conductive pins 131 are electrically connected to the pressure sensor 120 and used for electrical connection with the circuit board 110 .
- the pressure sensor module 100 provided by this application can directly fix the pressure sensor 120 on the circuit board 110 through the conductive pin 131, so as to realize the electrical connection between the pressure sensor 120 and the circuit board 110, without separately connecting the pressure sensor 120 to the circuit board 110.
- 120 is attached to the housing of the electronic device, and the pressure sensor module 100 can be assembled in the housing together with the circuit board 110, which reduces the difficulty of assembly and facilitates automatic assembly.
- the pressure sensor module 100 is arranged on the inner wall of the housing of the electronic device, When the user touches a corresponding position, the pressure receiving portion 140 is deformed by pressure and causes the pressure sensor 120 to generate a corresponding pressure signal to trigger a corresponding touch operation.
- the pressure receiving part 140 can be a plate-like structure, wherein the pressure receiving part 140 can be made of elastic material, and when it is under pressure, the pressure receiving part 140 can produce a large degree of deformation to drive The pressure sensor 120 is deformed to generate a corresponding pressure signal; when the external force acting on the pressure receiving part 140 disappears, the pressure receiving part 140 can reset under its own restoring force.
- the pressure receiving part 140 may include a mounting surface 141, a mounting back 142, and a side 143 that are away from each other. The side 143 is connected between the mounting surface 141 and the mounting back 142.
- the mounting surface 141 can be used to install the pressure sensor 120, and the mounting back 142 can be used to receive external forces.
- the mounting back surface 142 can be abutted against the inner wall of the casing of the electronic device to receive the pressure generated by the user when performing pressure touch operations on the electronic device. force.
- the pressure receiving portion 140 may be in a regular shape or an irregular shape, for example, the pressure receiving portion 140 may be in a circle, a rectangle, an ellipse, a semi-ellipse, a “T” shape or other shapes.
- the pressure receiving portion 140 is provided with a pressure receiving protrusion 144, and the pressure receiving protrusion 144 is arranged on the installation back surface 142, that is, the pressure receiving protrusion 144 and the pressure sensor are arranged on the Two opposite surfaces of the pressure receiving part.
- the pressure-receiving protrusion 144 may be in the form of a cylinder, a hemisphere or the like.
- the pressure protrusion 144 can be made of hard material, because The pressure protrusion 144 is made of hard material, so that the pressure protrusion 144 will not form a buffer. When the user presses the corresponding position of the shell, the pressing force directly passes through the pressure protrusion 144 to quickly make the pressure receiving part 140 Deformation occurs, and at the same time, the pressure sensor 120 deforms and generates an obvious electrical signal, thereby increasing the feedback speed of the electronic device.
- the pressure protrusion 144 can also be made of elastic material, such as rubber or plastic, which can be set according to actual needs.
- the pressure receiving part 140 may be a metal structure, and an insulating glue layer 151 may be provided between the pressure receiving part 140 and the pressure sensor 120 .
- the pressure receiving part 140 and the pressure sensor 120 can be bonded together by setting the insulating adhesive layer 151, which facilitates the fast fixing of the two.
- the pressure receiving part 140 and the pressure sensor 120 can be electrically isolated from each other through the insulating adhesive layer 151 In order to prevent the pressure sensor 120 from leakage and short circuit.
- the conductive pin 131 is made of a material having a conductive function, for example, the conductive pin 131 may be a metal structure.
- At least two conductive pins 131 include a first conductive pin 1311 and a second conductive pin 1312, and the first conductive pin 1311 and the second conductive pin 1312 respectively connected to opposite sides of the pressure sensor 120 .
- the first conductive pin 1311 and the second conductive pin 1312 can be solder feet, which can be soldered to the circuit board 110 .
- one end of the first conductive pin 1311 and one end of the second conductive pin 1312 may be connected to one of the upper surface, lower surface or side surface of the pressure sensor 120, and electrically connected to the pressure sensor 120, the first The other end of the conductive pin 1311 and the other end of the second conductive pin 1312 can be soldered to the pad of the circuit board 110 to conduct with the internal circuit of the circuit board 110 .
- the first conductive pin 1311 and the second conductive pin 1312 By arranging the first conductive pin 1311 and the second conductive pin 1312 on the opposite sides of the pressure sensor 120, the opposite sides of the pressure sensor 120 can be supported, so that the pressure sensor 120 is more firmly fixed on the circuit board 110 superior.
- the conductive pin 131 may include a connecting end 1314 and a supporting end 1313 , the connecting end 1314 is electrically connected to the pressure sensor 120 , and the supporting end 1313 is used for soldering to the circuit board 110 .
- the connecting end 1314 and the supporting end 1313 can be integrally formed, and the connecting end 1314 can be fixed on the installation surface 141 and electrically connected to the pressure sensor 120 .
- An included angle is formed between the supporting end 1313 and the connecting end 1314 to support the pressure sensor 120 on the connecting end 1314 .
- the above included angle is the bending angle of the supporting end 1313 relative to the connecting end 1314, and the bending angle may be greater than or equal to 90° to provide better support.
- the supporting end 1313 may be approximately in an "L" shape, one side of the “L” shape is connected to the connecting end 1314 , and the other side is used for soldering to the circuit board 110 .
- the lower surface of the supporting end 1313 can be roughly attached to the circuit board 110 , so that the lower surface of the supporting end 1313 can cover the pad on the circuit board 110 to form a good electrical contact and facilitate soldering.
- the pressure receiving portion 140 includes a board body 145 and at least two mounting feet 146 , and the pressure sensor 120 is disposed on the board body 145 .
- the pressure receiving part is a metal structure
- both the pressure sensor 120 and the insulating adhesive layer 151 are disposed on the board body 145 , specifically, the pressure sensor 120 is pasted on the board body 145 through the insulating adhesive layer 151 .
- one end of each mounting foot 146 is connected to the board body 145 , and the other end is connected to the circuit board 110 .
- a part of the mounting feet 146 can be connected to the first side of the board body 145, and the rest of the mounting feet 146 can be connected to the second side of the board body 145, wherein the first side and the second side They may intersect or be parallel, for example, the first side and the second side may be oppositely arranged along the width direction or the length direction of the plate body 145 .
- the mounting feet 146 and the board body 145 can be integrally formed.
- the plurality of mounting feet 146 can be divided into two groups, and the two groups of mounting feet 146 are located on opposite sides of the pressure sensor 120, wherein a portion of the conductive pins 131 can be located with one of the mounting feet 146 on the pressure sensor.
- another partial number of conductive pins 131 may be located on the other side of pressure sensor 120 with another set of mounting feet 146 .
- the conductive pins 131 and the mounting feet 146 may be respectively located on different sides of the pressure sensor 120 .
- the board body 145 can be supported by setting the mounting feet 146 , and when the board body 145 is deformed under pressure, the mounting feet 146 and the conductive pins 131 can share the pressure to avoid the conductive pins 131 being deformed due to excessive pressure.
- the pressure receiving portion 140 may be an insulator, and the above-mentioned at least two conductive pins 131 are disposed on the pressure receiving portion 140 .
- one end of each conductive pin 131 is disposed on the mounting surface 141 and electrically connected to the pressure sensor 120 , and the other end is used to connect to the circuit board 110 .
- the pressure receiving portion 140 By setting the pressure receiving portion 140 as an insulator, it can effectively electrically isolate adjacent conductive pins 131 and avoid short circuit.
- FIG. 1 As an example, as shown in FIG.
- the mounting surface 141 is provided with at least two mounting grooves 1411, each conductive pin 131 is respectively embedded in a mounting groove 1411, and the depth of the mounting groove 1411 is less than or equal to that of the conductive pin 131. thickness, so that the position of the conductive pin 131 embedded in the installation groove 1411 can be exposed on the installation surface 141, so as to be electrically connected with the corresponding electrical contact on the pressure sensor 120, and the corresponding electrical contact of the pressure sensor 120
- the dots can be directly soldered to the structures where the corresponding conductive pins 131 are exposed on the mounting surface 141 .
- each conductive pin 131 is electrically connected to the pressure sensor 120 can be flush with the installation surface 141, so that the entire pressure sensor 120 can be completely flatly attached to the installation surface 141, so that when the pressure receiving part 140 is deformed,
- the installation surface 141 can directly transmit a large deformation to the pressure sensor 120 , so that the pressure sensor 120 is deformed to a large extent.
- the surface of each conductive pin 131 electrically connected to the pressure sensor 120 may also protrude from the mounting surface 141 .
- the conductive pin 131 and the pressure receiving portion 140 may also be fixed by means of adhesion, screw connection or clamping.
- the pressure sensor module 100 fixes the pressure sensor 120 on the circuit board 110 through the conductive pin 131 to realize the electrical connection between the pressure sensor 120 and the circuit board 110, and the conductive pin 131 can also play a role in supporting the pressure.
- the functions of the sensor 120 and the pressure receiving part 140 are formed by forming the pressure sensor 120, the pressure receiving part 140 and the conductive pin 131 into a module, instead of attaching the pressure sensor 120 separately to the housing of the electronic device, only the circuit
- the board 110 is assembled together in the casing, which reduces the difficulty of assembly and facilitates the realization of automatic assembly.
- the embodiment of the present application also provides an electronic device 200, including the above-mentioned pressure sensor module 100, circuit board 110, and housing 210.
- the pressure sensor module 100 and circuit board 110 are all set on Inside the housing 210.
- the housing 210 When the user presses the corresponding position of the housing 210 , the housing 210 will be deformed to a certain extent and the pressure receiving portion 140 will be deformed, so that the pressure sensor 120 will generate a corresponding pressure signal.
- the above-mentioned electronic device 200 may be an earphone, an electronic cigarette, a recording pen, etc., and the electronic device 200 is an earphone as an example for illustration below.
- the pressure sensor 120 and the circuit board 110 are arranged at intervals relative to each other, the circuit board 110 and the pressure sensor 120 are respectively connected to the two ends of each conductive pin 131, and the pressure receiving part 140 is arranged on the side of the pressure sensor 120 away from the circuit board.
- the conductive pin 131 of the pressure sensor 120 is soldered to the circuit board 110 . Since the pressure sensor 120 and the circuit board 110 are relatively spaced apart, a larger heat dissipation space can be formed between the pressure sensor 120 and the circuit board 110 to facilitate heat dissipation and avoid overheating of the pressure sensor 120 and the circuit board 110 during operation.
- the pressure receiving portion 140 is configured to be disposed adjacent to the housing 210 , so that the housing 210 abuts against the pressure receiving portion 140 when it is pressurized.
- the housing 210 may include an earplug part 211 and an extension part 212.
- the earplug part 211 is configured as a structure adapted to the ear.
- the earplug part 211 is provided with a sounding element, and the earplug part 211 can be plugged into the user's ear to Hang the entire earphone on the user's ear, the extension part 212 can be a hollow structure, and the extension part 212 can be used to install the above-mentioned components such as the pressure sensor module 100, the battery, and the control circuit.
- the outside of the extension part 212 can also be set There are touch keys or press keys for the user to manipulate.
- the extension part 212 can be a hollow cylindrical structure
- the housing 210 has an inner wall 2121
- the inner wall 2121 can be provided with a limiting part 2122
- the circuit board 110 can be assembled on the limiting part 2122 .
- the limiting portion 2122 can be a convex rib, and the convex rib can be arranged on the inner wall 2121 parallel to the central axis of the housing 210, and the circuit board 110 can be against the limiting portion 2122,
- the circuit board 110 can be inserted into the housing 210 roughly along the axial direction of the housing 210 , and the limiting portion 2122 abuts against the circuit board 110 to fix the circuit board 110 and prevent the circuit board 110 from moving up and down relative to the housing 210 .
- the number of ribs is two, and the two ribs are arranged on the inner wall 2121 at intervals.
- the two ribs can be arranged along the axial direction of the housing 210 and continue to the annular end surface of the housing 210.
- the two ends of the circuit board 110 can be fixed
- the protruding rib is fixed on the shell 210 and can be pressed against the inner wall 2121 .
- the limiting portion 2122 may also be a slot, wherein the slot may extend substantially along the axis of the housing 210 , and the circuit board 110 may be inserted into the slot along the axial direction of the housing 210 .
- the pressing part 240 can be a pressing mark, which is used to guide the user to press the corresponding position on the housing 210.
- the pressing part 240 can be used as a "key” of the electronic device, and the pressing part 240 triggers the pressure sensor 120 when pressed.
- the user controls the electronic device 200 to perform the corresponding key operation function by touching the "key”, and by setting the pressing part 240 instead of the traditional mechanical key, the user can perform the touch operation by touching and pressing, so that the electronic device performs the corresponding operation Function.
- the pressing part 240 can be used as a "power button” or a "volume button”, or other function buttons, which are not specifically limited here.
- the pressure-receiving protrusion 144 when the pressure sensor module 100 provided with the pressure-receiving protrusion 144 is disposed in the housing 210 , the pressure-receiving protrusion 144 can abut against the housing 210 . When the area corresponding to the position of the pressure-receiving protrusion 144 is deformed under pressure, it can drive the pressure-receiving protrusion 144 to drive the pressure-receiving part 140 to deform.
- the pressure-receiving protrusion 144 can also be interference fit with the housing 210, and the pressure-receiving part 140 will produce a certain pre-deformation, so that the pressure-receiving part 140
- the pressure sensor 120 can be slightly deformed, so that when the shell 210 is stressed, the pressure sensor 120 can be deformed synchronously at the first time, avoiding signal delay and improving the sensitivity of the pressure sensor 120.
- the housing 210 may further include a pressing protrusion 2123 disposed on the inner wall 2121, and the pressing protrusion 2123 is disposed toward the pressed portion 140, so that the housing 210 When pressed, the pressing protrusion 2123 abuts against the pressed portion 140 . The corresponding operation can be triggered only when the corresponding location area of the housing 210 is pressed.
- the pressing protrusion 2123 of the housing 210 is pressed, the pressing protrusion 2123 displaces and drives the pressure receiving portion 140 to deform, so that the pressure sensor 120 generates a pressure signal.
- the housing 210 may not be provided with the above-mentioned pressure contact protrusion 2123, or, when the pressure receiving part 140 of the pressure sensor module 100 is not provided with the pressure receiving protrusion 144
- the pressure protrusion 144, the above-mentioned pressure-contact protrusion 2123 can be provided in the housing 210, or the pressure sensor module 100 can be provided with the pressure-receiving protrusion 144, and at the same time, the housing 210 can also be provided with the above-mentioned pressure-contact protrusion 2123 , the pressure contact protrusion 2123 is arranged opposite to the pressure receiving protrusion 144 of the pressure sensor module 100, when the pressure contact protrusion 2123 of the housing 210 is pressed, the contact pressure protrusion 2123 can transmit the pressure to the pressure sensor module 100
- the protrusion 144 is pressed to deform the pressure sensor 120 and generate a corresponding electrical signal.
- the electronic device 200 can also include a wireless communication module 230 (as shown in FIG. 6 ), the wireless communication module 230 is used to establish wireless communication with the mobile terminal, wherein the wireless communication module 230 can be a Bluetooth module, Wi-Fi module or ZigBee module, etc.
- the end of the extension part 212 may also be provided with a charging structure, wherein the charging structure may be a charging post or a metal contact for electrical connection with a charging connector of a charging device.
- the electronic device 200 provided by the embodiment of the present application is equipped with the above-mentioned pressure sensor module 100.
- the housing 210 is forced to drive the pressure-receiving part 140 to deform, and the pressure-receiving part 140 The deformation occurs and drives the pressure sensor 120 to deform to a greater extent, so that the pressure sensor 120 generates a corresponding pressure signal to trigger a corresponding touch-press operation.
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Abstract
一种压力传感器模组（100）及电子装置（200），压力传感器模组（100）包括受压部（140）、压力传感器（120）以及至少两个导电引脚（131），压力传感器（120）设置于受压部（140），并在受压部（140）形变时产生压力信号，至少两个导电引脚（131）与压力传感器（120）电连接且用于与外部的电路板（110）电连接。电子装置（200）包括压力传感器模组（100）。
Description
相关申请的交叉引用
本申请要求于2021年7月26日提交的申请号为2021217068882的中国申请的优先权，其在此处于所有目的通过引用将其全部内容并入本文。
本申请涉及电子设备技术领域，具体涉及一种压力传感器模组及电子装置。
随着科技的不断发展，电子装置的种类越来越多，例如耳机、电子烟等产品，目前多数的电子装置采用压力感应键接受外部的触控操作，具有更好的体验功能，但是由于现有电子装置的用于安装压力传感器的结构多为弧面，限制了压力传感器的安装，使得压力传感器在自动化装配方面有较大难度。
发明内容
鉴于以上问题，本申请提供一种压力传感器模组及电子装置，以降低装配难度和便于实现自动化装配。
第一方面，本申请实施例提供了一种压力传感器模组，压力传感器模组包括受压部、压力传感器以及至少两个导电引脚，压力传感器设置于受压部，并在受压部形变时产生压力信号，至少两个导电引脚与压力传感器电连接且用于 与外部的电路板电连接。
第二方面，本申请实施例还提供一种电子装置，包括上述的压力传感器模组、电路板以及外壳，压力传感器模组与电路板设置于外壳内，压力传感器模块的导电引脚焊接于电路板。
本申请提供的压力传感器模组，可以通过导电引脚将压力传感器固定于电路板上并实现压力传感器与电路板之间的电连接，而不需要单独将压力传感器贴合在电子装置的外壳内，其可以与电路板一起装配于外壳内，降低装配难度，便于实现自动化装配，当压力传感器模组设于电子装置时，用户触压时，受压部受压形变并使压力传感器产生相应的压力信号，以触发对应的触控操作。
本申请的这些方面或其他方面在以下实施例的描述中会更加简明易懂。
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，而不是全部的实施例。基于本申请实施例，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例及附图，都属于本发明保护的范围。
图1为本申请实施例提供的一种压力传感器模组安装在电路板上的结构示意图；
图2为如图1所示的压力传感器模组在第一视角下的结构示意图；
图3为如图1所示的压力传感器模组在第二视角下的结构示意图；
图4为本申请实施例提供的另一种压力传感器模组的结构示意图；
图5为如图4所示的压力传感器在第一视角下的结构示意图；
图6为如5所示的压力传感器在拆分状态下的结构示意图；
图7为本申请实施例提供的一种电子装置的结构示意图；
图8为如图7所示电子装置中的外壳、压力传感器模组以及电路板在组装状态下的轴向结构示意图；
图9为如图8所示的电子装置中的外壳的结构示意图。
图10为本申请实施例提供的另一种电子装置的外壳的结构示意图。
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。应当理解，此处描述的具体实施例仅用于解释本申请，并不用于限定本申请。
下面将通过具体实施例对本申请实施例提供的压力传感器模组和电子装置进行详细说明。
请参阅图1，本申请实施例提供了一种压力传感器模组100，压力传感器模组100包括压力传感器120、至少两个导电引脚131以及受压部140。该压力传感器模组100可以装配在电路板110上，至少两个导电引脚131与压力传感器120电连接且用于与电路板110电连接。
本申请提供的压力传感器模组100，可以通过导电引脚131直接将压力传感器120固定于电路板110上，以实现压力传感器120与电路板110之间的电连接，而不需要单独将压力传感器120贴合在电子装置的外壳内，压力传感器模组100可以与电路板110一起装配于外壳内，降低装配难度，便于实现自动化装配，当压力传感器模组100设于电子装置的外壳内壁时，用户触压相应的位置时，受压部140受压形变并使压力传感器120产生相应的压力信号，以触 发对应的触控操作。
在本实施例中，受压部140可以为板状结构，其中，受压部140可以由具有弹性的材料制成，在受压时，受压部140能够产生较大程度的形变，以带动压力传感器120发生形变使其产生相应的压力信号；当作用于受压部140的外力消失时，受压部140可以在自身回复力作用下复位。受压部140可以包括相互背离的安装表面141、安装背面142以及侧面143，侧面143连接于安装表面141和安装背面142之间，安装表面141可以用于安装压力传感器120，安装背面142可以用于接收外部的作用力。例如，当压力传感器模组与电路板被装配至电子装置的壳体内部时，安装背面142可以与电子装置的壳体内壁抵接，以接收用户在对电子装置进行压力触控操作时产生的作用力。受压部140可以为规则形状或者为不规则形状，例如，受压部140可以为圆形、矩形、椭圆形、半椭圆形、“T”字型或者其它的形状。
在一些实施方式中，如图1和图2所示，受压部140设有受压凸起144，受压凸起144设于安装背面142，也即受压凸起144与压力传感器设于受压部的相背对的两个表面。可选地，受压凸起144可以是柱体、半球体等结构。当压力传感器模组100装配于电子装置的外壳时，受压凸起144可以用于与外壳接触，并与外壳预设的操作位置对应，受压凸起144可以由硬质材料制成，由于受压凸起144是硬质材料制成，这样使得受压凸起144不会形成缓冲，当用户在按压外壳的对应位置时，按压力直接通过受压凸起144快速地使受压部140发生形变，在此同时，压力传感器120发生形变并产生明显的电信号，进而提高电子装置的反馈速度。此外，受压凸起144也可以是弹性材料制成，例如，橡胶或者塑胶，具体可以根据实际需求设置。
在一些实施方式中，受压部140可以为金属结构，受压部140与压力传感 器120之间可以设有绝缘胶层151。通过设置绝缘胶层151可以将受压部140与压力传感器120粘接于一体，便于两者的快速固定，同时，通过绝缘胶层151可以使得受压部140与压力传感器120彼此电性隔离，以防止压力传感器120漏电而发生短路。
在本实施例中，导电引脚131由具有导电功能的材料制成，例如，导电引脚131可以为金属结构。
在一些实施方式中，如图1和图3所示，至少两个导电引脚131包括第一导电引脚1311和第二导电引脚1312，第一导电引脚1311和第二导电引脚1312分别连接于压力传感器120的相对两侧。第一导电引脚1311和第二导电引脚1312可以为焊脚，能够焊接到电路板110。其中，第一导电引脚1311的一端和第二导电引脚1312的其中一端可以连接于压力传感器120的上表面、下表面或者侧表面其中的一者，并电连接于压力传感器120，第一导电引脚1311的另一端和第二导电引脚1312的另一端可以焊接于电路板110的焊盘，以与电路板110的内部电路导通。通过将第一导电引脚1311和第二导电引脚1312设置于压力传感器120的相对两侧，可以对压力传感器120的相对两侧形成支撑，从而使得压力传感器120更加稳固地固定在电路板110上。
在一些实施方式中，如图1所示，导电引脚131可以包括连接端1314和支撑端1313，连接端1314电连接于压力传感器120，支撑端1313用于焊接至电路板110。其中连接端1314与支撑端1313可以为一体成型结构，连接端1314可以固定于安装表面141并与压力传感器120电连接。支撑端1313与连接端1314之间形成夹角，以对连接端1314上的压力传感器120进行支撑。上述夹角即为支撑端1313相对于连接端1314的弯折角度，弯折角度可以大于或等于90°，以起到更好的支撑作用。进一步地，支撑端1313可以大致呈“L”形， “L”形的一边与连接端1314相连，另一边用于焊接至电路板110。如此，支撑端1313的下表面可以与电路板110大致贴合，从而使得支撑端1313的下表面能够覆盖在电路板110上的焊盘上以形成良好的电性接触，便于焊接。
在一些实施方式中，如图3所示，受压部140包括板体145以及至少两个安装脚146，压力传感器120设于板体145。当受压部为金属结构时，压力传感器120以及绝缘胶层151均设置于板体145，具体地，压力传感器120通过绝缘胶层151粘贴于板体145。其中，每个安装脚146的一端连接于板体145，另一端连接于电路板110。作为一种示例，部分数量的安装脚146可以连接于板体145的第一侧边，其余的安装脚146可以连接于板体145的第二侧边，其中第一侧边和第二侧边可以相交或者平行，例如，第一侧边与第二侧边可以沿板体145的宽度方向或长度方向相对设置。安装脚146与板体145可以为一体成型结构。作为又一种示例，多个安装脚146可以分成两组，两组安装脚146分别位于压力传感器120的相对两侧，其中部分数量的导电引脚131可以与其中一组安装脚146位于压力传感器120的同一侧，另外部分数量的导电引脚131可以与另一组安装脚146位于压力传感器120的另一侧。在另一种示例中，导电引脚131与安装脚146可以分别位于压力传感器120的不同侧边。通过设置安装脚146可以对板体145进行支撑，板体145在受压形变时，安装脚146和导电引脚131可以共同承担压力，以避免导电引脚131受压过重而变形。
在一些实施方式中，如图4和图5所示，受压部140可以为绝缘体，上述的至少两个导电引脚131设置于受压部140。作为一种示例，每个导电引脚131的一端设置于安装表面141且与压力传感器120电连接，另一端用于连接电路板110。通过将受压部140设置为绝缘体，这样可以有效地对相邻导电引脚131之间进行电性隔离，避免短路。作为一种示例，如图6所示，安装表面141 设有至少两个安装槽1411，每个导电引脚131分别嵌设于一安装槽1411，安装槽1411的深度小于或等于导电引脚131的厚度，这样使得嵌设于安装槽1411内的导电引脚131的部位能够外露于安装表面141，以便与压力传感器120上的对应的电触点进行电连接，压力传感器120的对应的电触点可以直接焊接于对应的导电引脚131外露于安装表面141的结构。其中，每个导电引脚131与压力传感器120电连接的表面可以与安装表面141平齐，以使得整个压力传感器120可以完全平整地贴合于安装表面141，这样在受压部140形变时，安装表面141可以将较大的形变直接传递至压力传感器120，从而使得压力传感器120发生较大程度的变形。此外，每个导电引脚131与压力传感器120电连接的表面也可以突出于安装表面141。此外，在一些实施方式中，导电引脚131与受压部140也可以通过粘接、螺纹连接或者卡接等方式形成固定。
本申请提供的压力传感器模组100，通过导电引脚131将压力传感器120固定于电路板110上以实现压力传感器120与电路板110之间的电连接，导电引脚131同时可以起到支撑压力传感器120和受压部140的作用，通过将压力传感器120、受压部140以及导电引脚131形成模组，而不需要单独将压力传感器120贴合在电子装置的外壳内，只需与电路板110一起装配于外壳内，降低装配难度，便于实现自动化装配，当压力传感器模组100设于电子装置的外壳内时，用户触压相应的位置时，受压部140受压形变并使压力传感器120产生相应的压力信号，以触发对应的触控操作。
请一并参阅图7和图8，本申请实施例还提供一种电子装置200，包括上述的压力传感器模组100、电路板110以及外壳210，压力传感器模组100以及电路板110均设置于外壳210内。当用户按压外壳210对应的位置时，外壳210发生一定的形变并驱使受压部140发生形变，从而使压力传感器120产生 相应的压力信号。
可选地，上述电子装置200可以为耳机、电子烟、录音笔等，以下以电子装置200为耳机为例进行阐述。
在本实施例中，压力传感器120与电路板110相对间隔设置，电路板110和压力传感器120分别连接于每个导电引脚131的两端，受压部140设于压力传感器120的远离电路板110的一侧，压力传感器120的导电引脚131焊接于电路板110。由于压力传感器120与电路板110相对间隔设置，在压力传感器120与电路板110之间能够形成较大的散热空间，便于散热，避免压力传感器120以及电路板110在工作时温度过高。
在一些实施方式中，受压部140被配置为邻近外壳210设置，以使外壳210在受压时与受压部140相抵。
在一些实施例中，外壳210的至少部分结构为空心结构，压力传感器模组100嵌设于空心结构内，空心结构的外壁设有与受压部140对应的按压部240。请参阅图7，外壳210可以包括耳塞部211和外延部212，耳塞部211配置成与耳适配的结构，耳塞部211内设有发声元件，耳塞部211可以塞入用户的耳部，以将整个耳机挂在用户的耳部，外延部212可以为空心结构，外延部212可以用于安装上述的压力传感器模组100、电池以及控制电路等器件，此外，外延部212的外部还可以设有触压键或者按压键，以供用户进行操控。例如，外延部212可以为中空柱体结构，外壳210具有内壁2121，内壁2121可以设有限位部2122，电路板110可装配于限位部2122。
作为一种示例，如图8和图9所示，限位部2122可以为凸肋，凸肋可沿平行于外壳210的中心轴设置于内壁2121，电路板110可以与限位部2122相抵，电路板110可以大致沿外壳210的轴向嵌入外壳210内，限位部2122与 电路板110相抵以固定电路板110，防止电路板110相对于外壳210上下移动。其中，凸肋的数量为两个，两个凸肋相对间隔设置于内壁2121，两个凸肋可以沿外壳210的轴向设置并延续至外壳210的环形端面，电路板110的两端可以固定在凸肋上以固设于外壳210，并可以与内壁2121抵紧。
此外，作为另一种示例，限位部2122也可以为插槽，其中插槽可以大致沿外壳210的轴线延伸设置,电路板110可以沿着外壳210的轴向嵌入插槽内。
作为一种示例，按压部240可以为按压标识，用于指引用户按压外壳210上的对应位置，按压部240可以作为电子装置的“按键”，按压部240在受压时触发压力传感器120。用户通过触按“按键”控制电子装置200执行相应的按键操作功能，通过设置按压部240替代传统的机械按键，用户可以通过触压的方式来进行触压操作，以使电子装置执行相应的操作功能。例如，按压部240可以作为“开关机键”或者“音量键”，或者其他的功能按键，在此，不作特别限定。
在一些实施方式中，如图8所示，当设有受压凸起144的压力传感器模组100设于外壳210内时，受压凸起144可以与外壳210抵接，当外壳210的与受压凸起144位置对应的区域受压形变时，其可以驱动受压凸起144带动受压部140形变。此外，在一些实施方式中，当压力传感器120装配于外壳210时，受压凸起144也可以与外壳210过盈配合，受压部140会产生一定的预形变，使得设于受压部140的压力传感器120可以产生轻微的形变，这样当外壳210受力时，压力传感器120可第一时间同步受力变形，避免出现信号延迟的情况，提高压力传感器120的灵敏度。
在一些实施方式中，如图10所示，外壳210还可以包括触压凸起2123，触压凸起2123设置于内壁2121，且触压凸起2123朝向受压部140设置，以 使外壳210在受压时，触压凸起2123与受压部140相抵。只需在按压外壳210对应的位置区域时，可以触发对应的操作。当外壳210的触压凸起2123受压时，触压凸起2123位移并驱动受压部140形变，以使压力传感器120产生压力信号。当压力传感器模组100的受压部140设有受压凸起144时，外壳210可以不用设置上述的触压凸起2123，或者，当压力传感器模组100的受压部140未设有受压凸起144，外壳210内可以设有上述的触压凸起2123，或者，压力传感器模组100可以设有受压凸起144，同时，外壳210也可以设有上述的触压凸起2123，触压凸起2123与压力传感器模组100的受压凸起144相对设置，当外壳210的触压凸起2123受压时，触压凸起2123可以将压力传递至压力传感器模组100的受压凸起144，以使压力传感器120发生形变并产生相应的电信号。
在一些实施方式中，电子装置200还可以包括无线通讯模块230(如图6所示)，无线通讯模块230用于与移动终端建立无线通讯，其中无线通讯模块230可以是蓝牙模块、Wi-Fi模块或者ZigBee模块等。此外，在一些实施方式中，外延部212的端部还可以设有充电结构，其中充电结构可以是充电柱或者金属触点，以用于与充电设备的充电接头进行电连接。
综上，本申请实施例提供的电子装置200，通过设置上述的压力传感器模组100，当用户按压外壳210对应的按压区域时，外壳210受力驱动受压部140形变时，受压部140发生变形并带动压力传感器120发生较大程度的形变，使得压力传感器120产生对应的压力信号，以触发对应的触压操作。
上面结合附图对本申请各实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本申请宗旨和权利要求所保 护的范围情况下，还可做出很多形式，均属于本申请的保护范围之内。
Claims (12)
- 一种压力传感器模组，其特征在于，包括：受压部；压力传感器，所述压力传感器设置于所述受压部，并在所述受压部形变时产生压力信号；以及至少两个导电引脚，与所述压力传感器电连接且用于与外部的电路板电连接。
- 根据权利要求1所述的压力传感器模组，其特征在于，至少两个所述导电引脚包括第一导电引脚和第二导电引脚，所述第一导电引脚和所述第二导电引脚分别连接于所述压力传感器的相对两侧。
- 根据权利要求1所述的压力传感器模组，其特征在于，所述受压部为绝缘体，所述至少两个所述导电引脚设置于所述受压部。
- 根据权利要求3所述的压力传感器模组，其特征在于，所述受压部包括朝向所述压力传感器的安装表面，每个所述导电引脚的一端设置于所述安装表面且与所述压力传感器连接，另一端用于连接所述电路板。
- 根据权利要求4所述的压力传感器模组，其特征在于，所述安装表面设有至少两个安装槽，每个所述导电引脚分别嵌设于一所述安装槽，所述安装槽的深度小于或等于所述导电引脚的厚度。
- 根据权利要求1所述的压力传感器模组，其特征在于，所述受压部为金属结构，所述受压部与所述压力传感器之间设有绝缘胶层。
- 根据权利要求6所述的压力传感器模组，其特征在于，所述受压部包括板体以及至少两个安装脚，所述绝缘胶层和所述压力传感器设置于所述板 体，每个所述安装脚的一端连接于所述板体，另一端用于连接所述电路板。
- 根据权利要求1-7中任一项所述的压力传感器模组，其特征在于，所述导电引脚包括连接端和支撑端，所述连接端电连接于所述压力传感器，所述支撑端与所述连接端之间形成夹角，并用于焊接至所述电路板。
- 根据权利要求1-7中任一项所述的压力传感器模组，其特征在于，所述受压部设有受压凸起，所述受压凸起与所述压力传感器设于所述受压部的相背对的两个表面。
- 一种电子装置，其特征在于，包括如权利要求1-9中任一项所述的压力传感器模组、电路板以及外壳，所述压力传感器模组与所述电路板设置于所述外壳内，所述压力传感器模组的导电引脚焊接于所述电路板。
- 根据权利要求10所述的电子装置，其特征在于，所述受压部邻近所述外壳设置，以使所述外壳在受压时与所述受压部相抵。
- 根据权利要求11所述的电子装置，其特征在于，所述外壳包括内壁以及触压凸起，所述触压凸起设置于所述内壁，且所述触压凸与所述受压部相对设置。
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