WO2022170527A1 - 压力检测模组及电子设备 - Google Patents

压力检测模组及电子设备 Download PDF

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Publication number
WO2022170527A1
WO2022170527A1 PCT/CN2021/076377 CN2021076377W WO2022170527A1 WO 2022170527 A1 WO2022170527 A1 WO 2022170527A1 CN 2021076377 W CN2021076377 W CN 2021076377W WO 2022170527 A1 WO2022170527 A1 WO 2022170527A1
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WO
WIPO (PCT)
Prior art keywords
electrode
circuit board
pressure detection
detection module
module according
Prior art date
Application number
PCT/CN2021/076377
Other languages
English (en)
French (fr)
Inventor
冯林
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to EP21782430.9A priority Critical patent/EP4067850A1/en
Priority to KR1020217033088A priority patent/KR20220116384A/ko
Priority to PCT/CN2021/076377 priority patent/WO2022170527A1/zh
Priority to CN202121077964.8U priority patent/CN214591927U/zh
Priority to KR1020217030406A priority patent/KR20220116382A/ko
Priority to EP21769869.5A priority patent/EP4068800A1/en
Priority to PCT/CN2021/094710 priority patent/WO2022170688A1/zh
Priority to CN202121923949.0U priority patent/CN216284032U/zh
Priority to PCT/CN2021/112765 priority patent/WO2022170749A1/zh
Priority to US17/481,041 priority patent/US20220252469A1/en
Priority to US17/497,197 priority patent/US20220256272A1/en
Publication of WO2022170527A1 publication Critical patent/WO2022170527A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0447—Position sensing using the local deformation of sensor cells
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/16—Sound input; Sound output
    • G06F3/165—Management of the audio stream, e.g. setting of volume, audio stream path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/965—Switches controlled by moving an element forming part of the switch
    • H03K17/975—Switches controlled by moving an element forming part of the switch using a capacitive movable element
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/965—Switches controlled by moving an element forming part of the switch
    • H03K2217/9651—Switches controlled by moving an element forming part of the switch the moving element acting on a force, e.g. pressure sensitive element

Definitions

  • the embodiments of the present application relate to the field of electronic technology, and in particular, to a pressure detection module and an electronic device.
  • Electronic devices such as earphones can detect whether they are pressed through the pressure detection module installed inside, so as to perform operation control corresponding to the pressing. For example, the pressure detection module installed in the earphone determines whether the earphone is pressed, so as to control the earphone to play music.
  • the pressure detection module in order to install the pressure detection module inside the electronic device and realize the above-mentioned functions, the pressure detection module usually needs to be provided with a special bracket to support the two electrodes of the pressure detection module. Usually it is very small, and setting up a special bracket will lead to complicated production and assembly processes of the pressure detection module, thus limiting the application and promotion of the pressure detection module in electronic equipment.
  • one of the technical problems solved by the embodiments of the present invention is to provide a pressure detection module and an electronic device to partially or completely solve the technical problems existing in the prior art.
  • the pressure detection module is arranged on the inner surface of the casing of the electronic device, the pressure detection module is arranged on the inner surface of the outer casing of the electronic device, and the pressure detection module includes:
  • a first circuit board a second circuit board, a force transmission member, a first electrode, and a second electrode;
  • the first circuit board and the second circuit board are fixedly connected by a fixing member; the first electrode is fixed on the first circuit board, the second electrode is fixed on the second circuit board, and the The first electrode and the second electrode are arranged opposite to each other, so that the first electrode and the second electrode form a capacitance;
  • the force transmission member is located between the force input area of the housing and the first circuit board, so as to transmit the external pressure received by the force input area to the first circuit board and drive the first circuit board
  • the first electrode on the circuit board moves in the direction of the second electrode, so that the capacitance between the first electrode and the second electrode changes, so as to determine the pressure detection of the external pressure according to the capacitance change result.
  • an embodiment of the present application provides an electronic device, wherein a pressure detection module according to any one of the first aspects is provided inside a housing of the electronic device.
  • the first circuit board and the second circuit board are fixedly connected by a fixing member; the first electrode is fixed on the first circuit board, and the second electrode is fixed on the second circuit board, The first electrode and the second electrode are arranged opposite to each other, so that the first electrode and the second electrode form a capacitance; the force transmission member is located between the force input area of the casing and the first circuit board.
  • the pressure detection module of the embodiment of the present application relies on the first circuit board provided with the first electrode and the second circuit board provided with the second electrode, and can achieve accurate pressure detection with a simple force transmission member, without the need for a bracket and additional other components, simplify the design, production and assembly process of the pressure detection module, and the cost is low.
  • FIG. 1 is a schematic structural diagram of a pressure detection module provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the working principle of the pressure detection module provided by the embodiment of the present application.
  • FIG. 3 and FIG. 4 are respectively a top view and a cross-sectional view of an exemplary arrangement position of the first electrode in the pressure detection module provided by the embodiment of the present application;
  • 5 and 6 are respectively a top view and a cross-sectional view of an exemplary arrangement position of the first electrode in the pressure detection module provided by the embodiment of the present application;
  • FIG. 7 and 8 are schematic diagrams of the arrangement positions of the first welding part and the second welding part in the pressure detection module provided by the embodiment of the application, respectively;
  • FIG. 9 and FIG. 10 are schematic diagrams of the arrangement positions of the first welding part and the second welding part in the pressure detection module provided by the embodiment of the present application respectively;
  • 11 and 12 are a schematic structural diagram and a cross-sectional view of an electronic device with a pressure detection module provided by an embodiment of the present application.
  • a pressure detection module may be set inside the electronic device, and the electronic device is controlled to perform operation control corresponding to the pressing by detecting whether the electronic device is pressed by the pressure detection module.
  • the pressure sensing detection scheme has the advantage of low false touch compared with the touch and tap detection scheme, the interaction experience is better, and it is more and more favored by users.
  • Capacitive pressure sensing scheme and resistive pressure detection scheme are the current mainstream pressure detection schemes.
  • resistive pressure detection schemes which require additional metal strain gauges, or semiconductor pressure sensors, are costly and can only be used in high-end markets.
  • the capacitive pressure detection scheme in the related art has high requirements on the design, production and assembly process of the sensor, and is difficult to produce. For example, it is usually necessary to arrange a bracket in a small internal space of an electronic device to support the two electrodes of the pressure detection module, which leads to complicated production and assembly processes of the pressure detection module, thus limiting the application and application of the pressure detection module in electronic devices. Moreover, even if a bracket is provided, the electrodes for detecting the capacitance are very easily affected by the related assembly process, which affects the performance of capacitance detection and affects the yield of the product.
  • the embodiments of the present application provide a pressure detection module and an electronic device, and the specific implementation of the embodiments of the present invention will be further described below with reference to the accompanying drawings of the embodiments of the present invention.
  • FIG. 1 is a structural diagram of a pressure detection module provided by an embodiment of the present application.
  • the pressure detection module 10 is disposed on the inner surface of the casing 20 of the electronic device.
  • the pressure detection module 10 includes: a first electrode 101 , a second electrode 103 , a first circuit board 102 , a second circuit board 104 and a force transmission member 106 .
  • the first circuit board 102 and the second circuit board 104 are fixedly connected by the fixing member 105; the first electrode 101 is fixed on the first circuit board 102, the second electrode is fixed on the second circuit board 104, and the first electrode 101 and the second electrode 102 are arranged opposite to each other, so that the first electrode 101 and the second electrode 102 form a capacitance;
  • the force transmission member 106 is located between the force input area of the housing and the first circuit board 102 for transmitting the external pressure received by the force input area to the first circuit board 102 and driving the first electrode 101 on the first circuit board 102 Moving in the direction of the second electrode 102 makes the capacitance between the first electrode 101 and the second electrode 102 change, so as to determine the pressure detection result of the external pressure according to the capacitance change.
  • the fixing member 105 forms an air gap between the first electrode and the second electrode, so that the first electrode and the second electrode form a capacitance.
  • the first electrode and the second electrode The distance between the electrodes is the height of the fixture.
  • the force input area of the housing is an area of any shape, and any mark may be used for the force input area to indicate that the user can apply pressure on this area.
  • This causes the force input area of the casing to be deformed by the external pressure, and the force transmission member 106 transmits pressure to the first circuit board 102 along with the deformation of the casing, so that the first circuit board 102 drives the first electrode 101 to move closer to the second electrode.
  • Move in the direction of 103 The first electrode 101 moves toward the direction close to the second electrode 103, so that the distance between the first electrode 101 and the second electrode 103 is reduced, so that the capacitance between the first electrode 101 and the second electrode 103 changes, according to the The change in capacitance can determine the pressure detection result of the external pressure.
  • the first electrode 101 and the second electrode 103 form a capacitance for pressure detection.
  • the pressure detection capacitor has a base capacitance value Cbase.
  • the force input area of the housing is deformed, so that the force transmitting member 106 transmits external pressure to the first circuit board 102 , causing the first circuit board 102 to deform.
  • the deformation of the first circuit board 102 reduces the distance between the first electrode 101 and the second electrode 103, thereby increasing the capacitance value of the pressure detection capacitor formed by the first electrode 101 and the second electrode 103, for example, increasing ⁇ C, the capacitance value of the pressure detection capacitor at this time is Cbase+ ⁇ C.
  • the pressure detection module of the embodiment of the present application relies on the first circuit board provided with the first electrode and the second circuit board provided with the second electrode, and the first circuit board and the second circuit board are fixedly connected, and the coordination is simple. It can realize accurate pressure detection without bracket and additional other components, which simplifies the design, production and assembly process of the pressure detection module, and the cost is low, and these processes are relatively conventional, and can also Reduce the impact of these processes on product yield and consistency.
  • the sizes of the first electrode 101 and the second electrode 103 may be set according to the size of the internal cavity of the casing of the electronic device.
  • the first electrode 101 and the The lengths of the second electrodes 103 are both less than or equal to 5 mm, and the widths of the first electrodes 101 and the second electrodes 103 are both less than or equal to 1.5 mm.
  • the sizes of the first electrode 101 and the second electrode 103 are both 1.5mm*5mm, so as to make full use of the internal cavity of the electronic device (eg, earphone) and improve the sensitivity of pressure detection.
  • the first electrode 101 and the second electrode 103 may be adjusted according to the size of the installation space inside the electronic device, which is not limited in this embodiment.
  • the first circuit board 102 may be a printed circuit board (PCB, Printed Circuit Board), or a flexible circuit board (FPC, Flexible Printed Circuit).
  • PCB printed circuit board
  • FPC Flexible Printed Circuit
  • the first circuit board 102 has a preset thickness, and the preset thickness is set so that when the first circuit board 102 is subjected to any Deformation occurs when the force transmission member 106 transmits the external pressure.
  • the thickness of the first circuit board is greater than or equal to 0.6 mm and less than or equal to 1.2 mm.
  • the preset thickness may be 0.8mm. Therefore, it is ensured that the first circuit board can reliably support the first electrode, and at the same time, a large deformation occurs when receiving the external pressure transmitted by the force transmission member, and the sensitivity of pressure detection is improved.
  • the thickness of the first circuit board 102 may be selected according to the size of the first circuit board 102 .
  • a relatively thick first circuit board 102 may be selected.
  • a relatively thin first circuit board 102 may be selected, which is not limited in this embodiment.
  • the second circuit board 104 may be a printed circuit board (PCB, Printed Circuit Board), or a flexible circuit board (FPC, Flexible Printed Circuit).
  • the second circuit board 104 may be any suitable circuit board that is disposed inside the housing of the electronic device and does not move within the electronic device when the user presses the housing of the electronic device.
  • the second circuit board 104 may be fixed to the casing of the electronic device, and the second circuit board 104 may also be fixed to other components in the electronic device, which is not limited in this embodiment.
  • the second circuit board 104 can support the first circuit board 102, and further support the first electrode 101 and the second electrode 103, so that there is no need for the electronic device
  • a bracket for supporting the pressure detection module is arranged in the narrow space, which simplifies the production and assembly difficulty of the pressure detection module, and greatly improves the production efficiency of electronic equipment.
  • the pressure detection module can use conventional low-cost first circuit boards and second circuit boards, the cost of the pressure detection module is also relatively low, and the pressure detection module as a whole can also be directly It is installed in electronic equipment to further reduce the assembly process and the yield and cost caused by the assembly process; moreover, the circuit board where the electrode used to detect the capacitance is located can reuse the existing circuit board of the electronic equipment to achieve simplification The electrical connection mode between the electrodes and the capacitance detection circuit, and even the main control board, and the arrangement of related electrical connectors are reduced, thereby reducing the space of the electronic equipment and reducing the electrical interference received by the electronic equipment.
  • the pressure detection module can be inserted into the earphone stem from the end of the earphone, which is convenient for installation/assembly.
  • the headphone rod is detachable (that is, the headphone rod includes an upper shell and a lower shell)
  • the headphone rod includes an upper shell and a lower shell
  • the headphone rod includes an upper shell and a lower shell
  • the headphone rod includes an upper shell and a lower shell
  • the headphone rod includes an upper shell and a lower shell
  • the above-mentioned pressure detection module is installed on the lower shell (or upper shell) of the headphone rod
  • the The upper shell (or the lower shell) is covered and closed on the lower shell (or the upper shell) of the earphone rod to realize the assembly of the pressure detection module in the earphone.
  • the circuit board where the electrodes used to detect the capacitance are located can reuse the existing circuit boards in the earphone, so as to simplify the electrical connection between the electrodes and the capacitance detection circuit and even the main control board and reduce related electrical connections.
  • the arrangement of the components saves the internal space of the earphone, provides convenience for the installation of other electronic components such as the antenna of
  • the second circuit board 104 is disposed on the circuit board mainboard 30 of the electronic device.
  • the second circuit board 104 can be fixedly connected to the circuit board main board 30 through the pads and the adhesive layer, so that the second circuit board 104 does not need to be fixed to the casing of the electronic device, nor does it need to be the second circuit board 104 Providing the supporting parts simplifies the assembly process and reduces the space of the electronic equipment occupied by the pressure detection module.
  • the second circuit board 104 is a circuit board mainboard 30 of an electronic device.
  • the main board 30 of the circuit board is fixedly connected to the casing by, for example, screws, glue and buckles.
  • a sensor area 301 is disposed on the main board 30 of the circuit board, and the second electrode 103 is disposed in the sensor area 301 .
  • the second surface of the second electrode 103 is fixed to the sensor area 301, and the first surface of the second electrode 103 is opposite to the first electrode 101 to form a capacitance for pressure detection. Since the second electrode 103 is directly disposed on the main board of the circuit board, the space occupied by the electronic device can be minimized.
  • the first circuit board 102 and the second circuit board 104 are fixedly connected by the fixing member 105 .
  • the positions such as the ends, corners or edges of the first circuit board 102 and the second circuit board 104 can be fixed by the fixing member 105 , so that the second surface of the first electrode 101 and the first surface of the second electrode 103 are fixed.
  • a predetermined distance between the surfaces forms a capacitance for pressure detection.
  • the first circuit board 102 and the second circuit board 104 are fixedly connected by soldering parts.
  • Welded parts are a specific implementation of fixing parts.
  • soldering points can be arranged at the edge position of the first circuit board 102 or the first electrode 101
  • pads matching the soldering points can be arranged at the edge position of the second circuit board 104 or the second electrode 102.
  • SMT Surface Mounted Technology
  • the four corners of the first electrode 101 are provided with soldering points
  • the four corners of the second electrode 102 are provided with pads matching the soldering points
  • the first circuit board 102 and the The second circuit board 104 is fixed as a whole by soldering points and pads. Soldering points are arranged at each corner of the first circuit board 102.
  • the force transmission member 106 transmits the same external pressure to the first circuit board 102
  • the first circuit board 102 takes the four corners of the first electrode 101 as the The direction of the support point toward the second circuit board 104 can be greatly deformed, thereby improving the sensitivity of pressure detection.
  • first electrode 101 two opposite ends of the first electrode 101 are provided with welding points
  • two opposite ends of the second electrode 103 are provided with pads matching the welding points
  • the first electrode 103 is provided with pads matching the welding points.
  • the first circuit board 102 and the second circuit board 104 are fixed as a whole by being fixedly connected to the 101 and the second electrode 103 through the pads and the soldering points.
  • soldering points are provided at each corner of the first circuit board 102 , when the force transmission member 106 transmits the same external pressure to the first circuit board 102 , the first circuit board 102 uses two ends of the first electrode 101
  • the direction of the support point facing the second circuit board 104 can be greatly deformed, so that the sensitivity of pressure detection can be improved.
  • soldering points and pads can be respectively arranged on the first circuit board 103 and the second circuit board 104 , and the specific location and number of the soldering points and soldering pads can be arranged on the first electrode 101 and the second electrode 102 Similarly, in order to avoid redundant description, detailed description is omitted here.
  • the soldering point is provided on the first circuit board 102 and on the periphery of the first electrode 101
  • the pad is provided on the second circuit board 104 and on the periphery of the second electrode 103 .
  • the location to match the weld point is provided.
  • the size of the first circuit board 102 and the second circuit board 104 can be minimized while improving the sensitivity of pressure detection.
  • the number of the solder joints 105a and the pads 105b is four.
  • the four soldering points 105a are respectively arranged on the first circuit board 102 and are close to the four corners of the first electrode 101.
  • the four bonding pads 105b are respectively arranged on the second circuit board 104 and are close to the second electrode. At the positions of the four corners of 103, the four pads correspond to the four soldering points respectively.
  • the first circuit board 102 when the force transmission member transmits the same external pressure to the first circuit board 102 , the first circuit board 102 can be greatly deformed in the direction toward the second circuit board 104 , so that the The sensitivity of pressure detection is improved while minimizing the size of the first circuit board 102 and the second circuit board 104 .
  • the number of solder joints 105a and pads 105b are both two, and the two solder joints 105a are respectively disposed on the first circuit board and close to two opposite ends of the first electrode , two pads 105b are disposed on the second circuit board and are close to two opposite ends of the second electrode.
  • the 2 soldering points and the 2 bonding pads are respectively close to the positions of the two end portions having the shorter side lengths of the first electrode and the second electrode.
  • the 2 pads correspond to the 2 solder joints respectively.
  • the first circuit board 102 can use the two ends with the shorter side lengths as support points to face the direction of the second circuit board 104 . A large deformation occurs, so that the sensitivity of pressure detection can be improved while the size of the first circuit board 102 and the second circuit board 104 can be minimized.
  • solder joints 105a and pads 105b are only examples, and in other implementations, more solder joints 105a and pads 105b may be provided as required, which is not limited in this embodiment.
  • the pads form an air gap between the first electrode and the second electrode, so that the first electrode and the second electrode form a capacitance.
  • the first electrode and the second electrode The distance between them is the height of the pads.
  • the first electrode and the second electrode are reliably supported by a simple process through the pad and the welding point, and the first electrode and the second electrode are separated by a certain distance, so that the first electrode and the second electrode are separated from each other by a certain distance. There is electrical insulation therebetween so that the first electrode and the second motor form electrodes for pressure detection.
  • the distance between the first electrode and the second electrode is the height of the pad
  • the distance between the first electrode and the second electrode can be adjusted by controlling the height of the pad.
  • the thickness of the solder paste coated on the pad 105b is controlled by controlling the size of the stencil, thereby controlling the height of the pad, thereby controlling the gap between the first electrode 101 and the second electrode 103 through a simple process the distance.
  • an air gap may be formed between the first electrode 101 and the second electrode 103, or a soft filler may be filled, which is not limited in this embodiment.
  • the capacitance formed by the first electrode 101 and the second electrode 103 can reflect the external pressure and minimize the distance between the first electrode 101 and the second electrode 103, so as to occupy a smaller internal space of the electronic device, in this application
  • the distance between the first electrode 101 and the second electrode 103 is greater than or equal to 0.1 mm and less than or equal to 0.4 mm.
  • the detected pressure signal can reach a certain amount of signal, so as to avoid undetectable signal or weak detected signal which affects the accuracy of the detected pressure, and can also reduce the volume and thickness of the pressure detection module.
  • the fixing member 105 includes at least two first adhesive members having a preset height.
  • the first adhesive member may be gelatin, or a double-sided adhesive tape with adhesive force on the upper and lower sides.
  • the first adhesive member is disposed between the first circuit board 102 and the second circuit board 104, so as to fix the ends of the first circuit board 102 and the second circuit board 104.
  • the height is set so that the first electrode 101 and the second electrode 103 form a capacitance.
  • the first adhesive member is disposed between the first circuit board 102 and the second circuit board 104 and at the periphery of the first electrode 101 and the second electrode 103 .
  • the first adhesive member is disposed between the first circuit board 102 and the second circuit board 104 and at the periphery of the first electrode 101 and the second electrode 103.
  • first adhesive member may be disposed between the first electrode 101 and the second electrode 103 for fixing the ends of the first electrode 101 and the second electrode 103 .
  • the number and arrangement position of the first adhesive members are similar to those of the welding point 105a, and in order to avoid redundant description, detailed description is omitted here.
  • the distance between the first electrode 101 and the second electrode 103 can be adjusted correspondingly by adjusting the preset height of the first adhesive member, so that the distance between the first electrode 101 and the second electrode 103 can ensure the detected pressure
  • the signal reaches a certain amount of signal, so as to avoid the failure of the detected signal or the weak detected signal to affect the accuracy of the detected pressure, and also to reduce the volume and thickness of the pressure detection module.
  • the force transmission member 106 is located between the force input area of the casing and the first circuit board, and specifically, is disposed on the inner surface of the force input area of the casing and the surface of the first circuit board 102 away from the first electrode 101 in between, so as to accurately transmit the external pressure applied to the force input area of the housing 20 to the first circuit board 102 .
  • the surface of the first circuit board 102 on which the first electrodes 101 are disposed is referred to as the first surface of the first circuit board 102
  • the surface of the first circuit board 102 away from the first electrodes 101 is referred to as The second surface of the first circuit board 102 .
  • This embodiment does not limit the manner in which the force transmission member is disposed between the force input area of the housing and the first circuit board.
  • both ends of the force transmitting member 106 may be respectively fixed to the first circuit board and the inner surface of the force input area of the housing by means of bonding or welding.
  • one end of the force transmission member 106 is fixed on the first circuit board, and the other end of the force transmission member abuts against the force input area of the housing.
  • one end of the force transmission member 106 can be fixed on the second surface of the first circuit board 102 by means of bonding or welding, while the other end abuts against the inner surface of the force input area of the casing, and is connected to the force input area of the casing.
  • the inner surface of the device is rigidly connected, which makes it possible to install the pressure detection module in the housing of the electronic device as a whole, which is convenient for installation and/or assembly, and is suitable for the case where the housing of the electronic device is removable or non-removable.
  • the force transmission member abuts against the shell of the earphone stem instead of the shell that does not fix the earphone stem, which makes it possible to detect the pressure
  • the module is inserted into the stem of the earphone as a whole, which is convenient for installation/assembly.
  • the pressure detection module can be inserted into the earphone stem as a whole (for example, from the tail of the earphone) after assembling the pressure detection module.
  • the upper and lower shells of the earphone rod can be covered, and the pressure detection module can be arranged in the earphone rod, so that the pressure detection module is suitable for the inseparable part of the earphone rod (that is, the earphone rod).
  • the case where the outer shell of the earphone stem is an integral non-detachable part) and the case where the earphone stem is detachable ie, the earphone stem portion includes an upper case and a lower case).
  • the force transmission member 106 is located at the center of the force input area, that is, the position where the force transmission member 106 contacts the force input area of the housing is the center position of the force input area. Therefore, when the force input area of the housing is deformed by receiving external pressure, the center position of the force input area deforms the most, which can maximize the transfer of the received external pressure to the first circuit board 102 .
  • the force transmission member 106 is an elastic member, and when the force input area is not subjected to force, the elastic member is in a compressed state, so that the elastic member abuts against the force input area of the housing through tension. This enables the force transmission member 106 to absorb assembly tolerances and/or material tolerances when the pressure detection module is assembled with the housing of the electronic device, thereby further improving the accuracy and consistency of pressure detection.
  • the distance between the second surface of the first circuit board 102 in the pressure detection module (ie the surface where the force transmission member 106 is located) and the force input area of the housing should be 1.5mm.
  • the distance between the second surface of the first circuit board 102 and the force input area of the housing is only 1.2 mm due to assembly tolerances and/or material tolerances.
  • the force transmission member 106 can be installed between the second surface of the first circuit board 102 and the force input area of the housing without causing the first circuit board 102 to deform , that is, the assembly tolerance and/or material tolerance of the absorption pressure detection module and the housing of the electronic device.
  • the force transmitting member 106 should also have a certain rigidity, thereby ensuring that the external pressure applied by the user to the force input area of the housing is accurately transmitted to the first circuit board 102 .
  • the force transmission member 106 can be a dome, a spring, a thimble or a silicone pad. It should be understood that this is only an example, and in other embodiments, the force transmitting member 106 may be other components with similar elasticity and rigidity, which is not limited in this embodiment.
  • An embodiment of the present application provides an electronic device, and a housing of the electronic device has the pressure detection module provided in any of the foregoing embodiments.
  • the electronic device may be any suitable electronic device that requires pressure detection.
  • the electronic device may be an earphone, such as a True Wireless Stereo (TWS) earphone, a neckband earphone, a headphone.
  • the electronic device may also be a wearable device, such as a smart watch, smart glasses, and the like.
  • the electronic device may also be an electric toothbrush, a remote control, an electronic cigarette, and the like.
  • the pressure detection module of this embodiment can be arranged in any suitable position inside the casing of the electronic device.
  • the pressure detection module may be located in the rod portion of the earphone.
  • the pressure detection module may be located on the rod portion connected to the lens on the smart glasses. It should be understood that this is only an example for illustration, and is not limited in this embodiment.
  • the following describes in detail the setting position and assembling process of the pressure detection module with reference to FIG. 11 and FIG. 12 , taking the electronic device as an earphone as an example.
  • the pressure detection module 10 is arranged inside the casing of the rod portion 21 of the earphone.
  • the first surface of the first electrode is fixed to the first circuit board 102
  • the second surface of the first electrode is opposite to the first surface of the second electrode
  • the first electrode and the The second electrode forms a capacitor.
  • the second surface of the second electrode is fixed to the second circuit board 104 .
  • the first circuit board 102 and the second circuit board 104 are fixedly connected by a fixing member 105 .
  • the force transmitting member 106 is disposed on the surface of the first circuit board 102 away from the first electrode.
  • the earphone stem can be inserted directly from the end of the earphone, so that the force transmission member 106 is disposed between the first circuit board and the inner surface of the force input area of the earphone stem shell.
  • the upper casing (or lower casing) of the earphone rod can be covered with the lower casing (or lower casing) of the earphone rod. or upper shell), ensure that the force transmission element is rigidly connected to the inner surface of the rod housing.
  • the above installation and assembly processes are conventional production processes, the assembly is simple and the steps are few, which greatly improves the production efficiency.
  • two electrodes are arranged on the second circuit board and the first circuit board in the pressure detection module, and then a simple force transmission part can be used to achieve accurate pressure detection, without the need for brackets and additional other components, which simplifies pressure detection Module design, production and assembly process.
  • the pressure detection module adopts the first circuit board and the second circuit board with low cost, the cost of the pressure detection module is also relatively low.

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Abstract

提供了压力检测模组和电子设备。压力检测模组设置于电子设备的外壳的内表面上且包括：第一电路板、第二电路板、力传递件、第一电极、及第二电极；第一电路板与第二电路板通过固定件固定连接；第一电极固定于第一电路板，第二电极固定于第二电路板，且第一电极与第二电极相对设置，以使第一电极与第二电极形成电容；力传递件位于外壳的力输入区域与第一电路板之间，以用于将力输入区域接受的外界压力传递至第一电路板并带动第一电路板上的第一电极向第二电极的方向移动，令第一电极与第二电极之间的电容变化，以根据电容变化确定对外界压力的压力检测结果。本申请的压力检测模组的设计、生产和装配工艺简单，且成本低廉。

Description

压力检测模组及电子设备 技术领域
本申请实施例涉及电子技术领域，尤其涉及一种压力检测模组及电子设备。
背景技术
耳机等电子设备可以通过内部安装的压力检测模组检测其是否被按压，从而进行与按压对应的操作控制。例如，通过安装在耳机中的压力检测模组判断耳机是否被按压，从而控制耳机进行音乐播放。
相关技术中，为了使压力检测模组安装在电子设备的内部并实现上述功能，压力检测模组通常需要设置有专门的支架来支撑压力检测模组的两个电极，然而，电子设备的内部空间通常非常狭小，设置专门的支架会导致压力检测模组生产和装配工艺复杂，从而限制了压力检测模组在电子设备的应用和推广。
因此，如何提供一种生产和装配工艺简单的压力检测模组成为亟需解决的技术问题。
发明内容
有鉴于此，本实用新型实施例所解决的技术问题之一在于提供一种压力检测模组和电子设备，用以部分或者全部解决现有技术中存在的技术问题。
第一方面，所述压力检测模组设置于电子设备的外壳的内表面上，所述压力检测模组设置于电子设备的外壳的内表面上，所述压力检测模组包括：
第一电路板、第二电路板、力传递件、第一电极、及第二电极；
所述第一电路板与所述第二电路板通过固定件固定连接；所述第一电极固定于所述第一电路板，所述第二电极固定于所述第二电路板，且所述第一电极与所述第二电极相对设置，以使所述第一电极与所述第二电极形成电容；
所述力传递件位于所述外壳的力输入区域与所述第一电路板之间，以用于将所述力输入区域接受的外界压力传递至所述第一电路板并带动所述第一电路板上的第一电极向所述第二电极的方向移动，令所述第一电极与所述第二电极之间的电容变化，以根据所述电容变化确定对所述外界压力的压力检测结果。
第二方面，本申请实施例提供一种电子设备，所述电子设备的外壳内部 设置有如第一方面任一项所述的压力检测模组。
本申请实施例提供的压力检测模组及电子设备，由于第一电路板与第二电路板通过固定件固定连接；第一电极固定于第一电路板，第二电极固定于第二电路板，且第一电极与第二电极相对设置，以使第一电极与第二电极形成电容；力传递件位于外壳的力输入区域与第一电路板之间。当外壳的力输入区域接受到外界压力时，将该外界压力传递至第一电路板使第一电路板发生形变，以带动第一电路板上的第一电极向第二电极的方向移动，通过第一电极与第二电极之间的电容变化确定对对外界压力的压力检测结果。因此，本申请实施例的压力检测模组依托设置有第一电极的第一电路板和设置有第二电极的第二电路板，配合简单的力传递件即可实现精确的压力检测，无需支架和额外的其他部件，简化了压力检测模组的设计、生产和装配工艺，且成本低廉。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本申请实施例的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比值绘制的。附图中：
图1为本申请实施例提供的一种压力检测模组的结构示意图；
图2为本申请实施例提供的压力检测模组的工作原理示意图；
图3和图4分别为本申请实施例提供的压力检测模组中第一电极的示例性设置位置的俯视图和剖视图；
图5和图6分别为本申请实施例提供的压力检测模组中第一电极的示例性设置位置的俯视图和剖视图；
图7和图8分别为本申请实施例提供的压力检测模组中第一焊接部和第二焊接部的布置位置示意图；
图9和图10分别为本申请实施例提供的压力检测模组中第一焊接部和第二焊接部的布置位置示意图；
图11和图12为本申请实施例提供的具有压力检测模组的电子设备的结构示意图和截面图。
具体实施方式
电子设备小型化和智能化已成为发展趋势，并且电子设备的人机交互体 验也受到越来越多用户的关注。通常，可以在电子设备内部设置压力检测模组，通过压力检测模组检测电子设备是否被按压来控制电子设备执行与按压对应的操作控制。对于压力检测模组而言，由于压力感应检测方案相对于触摸以及敲击检测方案具有低误触的优势，交互体验更佳，越来越受到用户的青睐。电容式压感方案和电阻式压力检测方案是当前的主流压力检测方案。然而，电阻式压力检测方案，需要额外的金属应变片，或半导体压力传感器，成本高，只能在高端市场上应用。相关技术中的电容式压力检测方案对传感器的设计、生产和装配工艺要求高，生产难度高。例如，通常需要在电子设备的狭小内部空间设置支架来支撑压力检测模组的两个电极，这导致压力检测模组的生产和装配工艺复杂，从而限制了压力检测模组在电子设备的应用和推广；而且，即使设置了支架，检测电容的电极也极容易受到相关装配工艺的影响而影响电容检测的性能以及影响产品的良率。
为了解决上述问题，本申请实施例提供一种压力检测模组及电子设备，下面结合本实用新型实施例附图进一步说明本实用新型实施例具体实现。
本申请实施例提供一种压力检测模组，如图1所示，图1为本申请实施例提供的一种压力检测模组的结构图。压力检测模组10设置于电子设备的外壳20的内表面上，压力检测模组10包括：第一电极101、第二电极103、第一电路板102、第二电路板104和力传递件106。
第一电路板102与第二电路板104通过固定件105固定连接；第一电极101固定于第一电路板102，第二电极固定于第二电路板104，且第一电极101与第二电极102相对设置，以使第一电极101与第二电极102形成电容；
力传递件106位于外壳的力输入区域与第一电路板102之间，以用于将力输入区域接受的外界压力传递至第一电路板102并带动第一电路板102上的第一电极101向第二电极102的方向移动，令第一电极101与第二电极102之间的电容变化，以根据电容变化确定对外界压力的压力检测结果。
本实施例中，固定件105使得第一电极和第二电极之间形成空气间隙，以使第一电极和第二电极形成电容，在压力检测模组未受压时，第一电极和第二电极之间的距离为固定件的高度。
本实施例中，外壳的力输入区域为任意形状的区域，力输入区域可以采用任何标识以指示用户可在此区域施加压力。这使得当外壳的力输入区域接受到外界压力而发生形变，力传递件106随着外壳的形变向第一电路板102传递 压力，使得第一电路板102带动第一电极101向靠近第二电极103的方向移动。第一电极101向靠近第二电极103的方向移动，使得第一电极101与第二电极103之间的距离减小，从而令第一电极101与第二电极103之间的电容变化，根据该电容的变化可以确定对外界压力的压力检测结果。
具体地，如图2所示，第一电极101与第二电极103形成压力检测的电容。在未对外壳的力输入区域施加外界压力时，该压力检测电容具有基础电容值Cbase。当对外壳的力输入区域施加压力时，外壳的力输入区域发生形变，使得力传递件106向第一电路板102传递外界压力，引起第一电路板102发生形变。第一电路板102的形变使得第一电极101与第二电极103之间的距离减小，由此使得第一电极101与第二电极103形成的压力检测电容的电容值增大，例如增大ΔC，此时压力检测电容的电容值为Cbase+ΔC。通过设置电容检测控制器40检测第一电极101与第二电极103之间的电容变化量，并将该电容变化量与指示按压的预设电容变化阈值进行比较，即可准确地识别是否存在针对外壳的力输入区域的按压操作。
因此，本申请实施例的压力检测模组依托设置有第一电极的第一电路板和设置有第二电极的第二电路板，通过将第一电路板与第二电路板固定连接，配合简单的力传递件即可实现准确的压力检测，无需支架和额外的其他部件，简化了压力检测模组的设计、生产和装配工艺，且成本低廉，且这些工艺都为较常规的工艺，也可以减少这些工艺对于产品的良率和一致性的影响。
本实施例中，第一电极101和第二电极103的尺寸可以根据电子设备的外壳的内部腔体的大小进行设置，例如，在本申请实施例的一种具体方式中，第一电极101和第二电极103的长度均小于或等于5毫米，且第一电极101和第二电极103的宽度均小于或等于1.5毫米。示例性地，第一电极101和第二电极103的尺寸均为1.5mm*5mm，以便充分利用电子设备(例如，耳机)的内部腔体，同时提高压力检测的灵敏度。
应理解，在其他类型的电子设备中，第一电极101和第二电极103可以根据电子设备内部的安装空间的大小进行调整，本实施例对此不做限定。
本实施例中，第一电路板102可以采用印刷电路板(PCB，Printed Circuit Board)，也可以采用柔性电路板(FPC，Flexible Printed Circuit)。
为了保证压力检测模组的感测灵敏度，在本申请实施例的一种具体实现中，第一电路板102具有预设厚度，预设厚度被设置成使得在所述第一电路板 102受到所述力传递件106传递的外界压力时发生形变。
在本实施例的一种具体实现中，第一电路板的厚度为大于或等于0.6毫米，且小于或等于1.2毫米。示例性地，该预设厚度可以为0.8mm。由此，使得确保第一电路板可以可靠地支撑第一电极，同时在接受到力传递件传递的外界压力时发生较大形变，提高压力检测的灵敏度。
应理解，第一电路板102的厚度可以根据第一电路板102的尺寸进行选择。例如，当第一电路板102的尺寸较大时，可以选择相对较厚的第一电路板102。当第一电路板102的尺寸较小时，可以选择相对较薄的第一电路板102，本实施例对此不做限定。
本实施例中，第二电路板104可以采用印刷电路板(PCB，Printed Circuit Board)，也可以采用柔性电路板(FPC，Flexible Printed Circuit)。第二电路板104可以是设置在电子设备的外壳内部且在用户按压电子设备的外壳时在电子设备内不发生移动的任何合适的电路板。例如，第二电路板104可以是固定至电子设备的外壳上，第二电路板104也可以固定在电子设备内的其他部件上，本实施例对此不做限定。由于第一电路板102与第二电路板104固定连接，这使得第二电路板104可以支撑第一电路板102，进而可以支撑第一电极101和第二电极103，由此无需在电子设备的狭小空间内设置用于支撑压力检测模组的支架，简化了压力检测模组的生产和装配难度，极大地提高了电子设备的生产效率。此外，由于压力检测模组可以采用常规的成本低廉的第一电路板和第二电路板，这使得该压力检测模组的成本也较为低廉，且这样还可以使得压力检测模组作为一个整体直接安装于电子设备内，以进一步减少了装配工序及降低了装配工序引起的良率和成本；而且，用于检测电容的电极所在的电路板可以复用电子设备已有的电路板，以实现简化所述电极与电容检测电路、乃至主控板之间的电连接方式及减少相关电连接件的设置，进而减少电子设备的空间和减少电子设备受到的电干扰。
具体地，以电子设备为耳机且压力检测模组设置于耳机杆部为例，由于在上述压力检测模组组装完成之后，对于耳机杆不可拆件(即，耳机杆部的外壳为一个整体不可拆卸)的情况，可以将压力检测模组从耳机尾部塞入耳机杆部，有利于安装/组装。同时对于耳机杆可拆件(即，耳机杆部包括上壳和下壳)的情况，可以在上述压力检测模组安装在耳机杆部的下壳(或上壳)之后，将耳机杆部的上壳(或下壳)盖合在耳机杆部的下壳(或上壳)上来实现压力检 测模组在耳机内的装配。此外，由于用于检测电容的电极所在的电路板可以复用耳机内已有的电路板，以实现简化所述电极与电容检测电路、乃至主控板之间的电连接方式及减少相关电连接件的设置，节约了耳机的内部空间，为耳机的天线等其他电子部件的安装提供了便利且避免了压力检测模组对这些电子部件的干扰。
在本申请实施例的一种实现方式中，如图3和图4所示，第二电路板104设置于电子设备的电路板主板30上。具体地，第二电路板104可以通过焊盘和胶层与电路板主板30固定连接，由此即不需要将第二电路板104固定于电子设备的外壳，也不需要为第二电路板104设置支撑部件，简化了装配工艺，同时减少了压力检测模组所占有的电子设备的空间。
可选地，在本申请实施例的一种具体实现中，如图5和图6所示，第二电路板104是电子设备的电路板主板30。电路板主板30例如通过螺丝、胶材和卡扣与外壳固定连接。电路板主板30上设置有传感器区域301，第二电极103设置于传感器区域301。具体地，第二电极103的第二表面固定至传感器区域301，第二电极103的第一表面与第一电极101相对，以形成用于压力检测的电容。由于将第二电极103直接设置于电路板主板上，可以最大化减小所占用的电子设备的空间。
本实施例中，第一电路板102与第二电路板104通过固定件105固定连接。具体地，可以通过固定件105将第一电路板102与第二电路板104的端部、角部或边缘等位置进行固定，使得第一电极101的第二表面与第二电极103的第一表面之间具有预定距离，形成用于压力检测的电容。
在本申请实施例的一种具体实现中，第一电路板102与第二电路板104通过焊接件固定连接。焊接件为固定件的一种具体实现方式。例如，可以在第一电路板102或第一电极101的边缘位置设置焊接点，并且在第二电路板104或第二电极102的边缘位置设置与焊接点匹配的焊盘，通过表面组装技术(Surface Mounted Technology，SMT)将焊接点和焊盘焊接在一起，从而将第一电路板102与第二电路板104固定为一体。焊接点与焊盘位置匹配可以确保在装配时第一电极101与第二电极103正对，提高压力检测模组的装配精度。
例如，在一种具体的实现方式中，第一电极101的四个角部设置有焊接点，第二电极102的四个角部设置有与焊接点匹配的焊盘，第一电路板102和第二电路板104通过焊接点和焊盘固定为一个整体。在第一电路板102的每个 角部设置焊接点，在力传递件106将相同的外界压力传递至第一电路板102时，第一电路板102以第一电极101的四个角部为支撑点朝向第二电路板104的方向可以发生较大形变，由此可以提高压力检测的灵敏度。
又例如，在一种具体的实现方式中，第一电极101的相对两个端部设置有焊接点，第二电极103相对的两个端部设置有与焊接点匹配的焊盘，第一电极101和第二电极103通过焊盘和焊接点固定连接，从而使第一电路板102和第二电路板104固定为一个整体。例如，在第一电路板102的每个角部设置焊接点，在力传递件106将相同的外界压力传递至第一电路板102时，第一电路板102以第一电极101的两个端部为支撑点朝向第二电路板104的方向可以发生较大形变，由此可以提高压力检测的灵敏度。
应理解，焊接点和焊盘可以分别设置于第一电路板103和第二电路板104上，具体的设置位置和数量可以与焊接点和焊盘设置于第一电极101和第二电极102上类似，为了避免赘述，此处不再详细描述。
优选地，在本申请的一种实现方式中，焊接点设置于第一电路板102上且在第一电极101的外围，焊盘设置于第二电路板104上且在第二电极103的外围与焊接点匹配的位置。由此，可以实现第一电路板102和第二电路板104的尺寸最小化，同时提高压力检测的灵敏度。
例如，如图7和图8所示，焊接点105a和焊盘105b的数量均为4个。4个焊接点105a分别设置于第一电路板102上且靠近第一电极101的四个角部的位置，相应地，4个焊盘105b分别设置于第二电路板104上且靠近第二电极103的四个角部的位置，4个焊盘分别与4个焊接点对应。在图6和图7的示例中，在力传递件将相同的外界压力传递至第一电路板102时，第一电路板102朝向第二电路板104的方向可以发生较大形变，从而可以在实现第一电路板102和第二电路板104的尺寸最小化的同时提高了压力检测的灵敏度。
又例如，图9和图10所示，焊接点105a和焊盘105b的数量均为2个，2个焊接点105a分别设置于第一电路板上且靠近第一电极的两个相对的端部的位置，2个焊盘105b设置于第二电路板上且靠近第二电极的两个相对的端部的位置。具体地，2个焊接点和2个焊盘分别靠近第一电极和第二电极的具有较短边长的两个端部的位置。2个焊盘分别与2个焊接点对应。在力传递件106将相同的外界压力传递至第一电路板102时，第一电路板102以2个在具有较短边长的两个端部为支撑点朝向第二电路板104的方向可以发生较大形变，从 而可以在实现第一电路板102和第二电路板104的尺寸最小化的同时提高了压力检测的灵敏度。
应理解，上述焊接点105a和焊盘105b的数量和位置仅为示例，在其他实现方式中可以根据需要设置更多的焊接点105a和焊盘105b，本实施例对此不做限定。
本实施例中，焊盘使得第一电极和第二电极之间形成空气间隙，以使第一电极和第二电极形成电容，在压力检测模组未受压时，第一电极和第二电极之间的距离为焊盘的高度。本实施例中通过焊盘和焊接点以简单的工艺实现对第一电极和第二电极的可靠支撑，并使第一电极与第二电极间隔开一定距离，令第一电极与第二电极间之间具有电绝缘，由此使得第一电极与第二电机形成用于压力检测的电极。
由于第一电极和第二电极之间的距离为焊盘的高度，由此可以通过控制焊盘的高度来调整第一电极和第二电极之间的距离。例如，在SMT时通过控制钢网的尺寸来控制在焊盘105b涂覆的锡膏的厚度，由此控制焊盘的高度，从而通过简单的工艺控制第一电极101与第二电极103之间的距离。
应理解，第一电极101与第二电极103之间可以是空气间隙，也可以填充有软质填充物，本实施例对此不做限定。
为了实现第一电极101与第二电极103形成的电容可以反映外界压力且尽量减小第一电极101与第二电极103之间的距离，从而能够占用更小的电子设备内部空间，在本申请的一种具体实现中，第一电极101与第二电极103之间的距离大于或者等于0.1毫米，且小于或者等于0.4毫米。这样既可以保障检测到的压力信号达到的一定的信号量，以避免检测不到信号或检测的信号较弱而影响检测的压力的准确性，还可以减少压力检测模组的体积和厚度。
在本申请实施例的一种具体实现中，固定件105包括至少两个具有预设高度的第一粘附件。第一粘附件可以是明胶，也可以是上下两面具有粘附力的双面胶等。
在本申请的一种具体实现中，第一粘附件设置于第一电路板102与第二电路板104之间，以用于固定第一电路板102和第二电路板104的端部，预设高度被设置成使得第一电极101与第二电极103形成电容。优选地，第一粘附件设置于第一电路板102与第二电路板104之间且位于第一电极101和第二电极103的外围。例如，第一粘附件设置于第一电路板102与第二电路板104之 间且位于第一电极101和第二电极103的外围。
应理解，第一粘附件可以设置于第一电极101与第二电极103之间，以用于固定第一电极101和第二电极103的端部。本实施例中，第一粘附件的数量和设置位置与焊接点105a类似，为了避免赘述，此处不再详细描述。
应理解，可以通过调整第一粘附件的预设高度来相应地调整第一电极101与第二电极103之间的距离，使得第一电极101与第二电极103距离既可以保障检测到的压力信号达到的一定的信号量，以避免检测不到信号或检测的信号较弱而影响检测的压力的准确性，还可以减少压力检测模组的体积和厚度。
本实施例中，力传递件106位于外壳的力输入区域与第一电路板之间，具体地，设置于外壳的力输入区域的内表面与第一电路板102上远离第一电极101的表面之间，以用于将施加于外壳20的力输入区域的外界压力准确地传递至第一电路板102。为了便于描述，下文中，将第一电路板102上设置有第一电极101的表面称为第一电路板102的第一表面，将第一电路板102上远离第一电极101的表面称为第一电路板102的第二表面。本实施例对力传递件设置外壳的力输入区域与第一电路板之间的方式不做限定。例如，力传递件106的两端可以通过粘合或焊接等方式分别固定于第一电路板和外壳的力输入区域的内表面。
可选地，在本申请的另一种具体实现中，力传递件106的一端固定在第一电路板上，力传递件的另一端抵靠在外壳的力输入区域。具体地，力传递件106的一端可以通过粘合或焊接等方式固定于第一电路板102的第二表面上，同时另一端抵靠外壳的力输入区域的内表面，与外壳的力输入区域的内表面刚性连接，这使得可以将压力检测模组作为整体安装于电子设备的外壳内，便于安装和/或组装，且适用于电子设备的外壳可拆件或不可拆件的情况。
具体地，以电子设备为耳机且压力检测模组设置于耳机的杆部为例，力传递件抵靠耳机杆部的壳体而非不固定耳机杆部的壳体，这使得可以将压力检测模组在组装完成之后作为一个整体塞入耳机的杆部，有利于安装/组装。此外，由于不需要将力传递件固定至耳机杆部的壳体的内表面，因此可以在将压力检测模组组装完成之后作为一个整体(例如从耳机的尾部)塞入耳机的杆部，也可以在将压力检测模组组装完成之后盖合耳机杆部的上壳和下壳，将压力检测模组设置在耳机杆部内，使得压力检测模组适用于耳机杆不可拆件(即，耳机杆部的外壳为一个整体不可拆卸)的情况和耳机杆可拆件(即，耳机杆部包括 上壳和下壳)的情况。
在本申请的一种具体实现中，力传递件106位于力输入区域的中心位置，即，力传递件106与外壳的力输入区域接触的位置为力输入区域的中心位置。由此，当外壳的力输入区域接受到外界压力而发生形变，力输入区域的中心位置形变最大，这可以最大化地将接受到的外界压力传递至第一电路板102。
在本申请的一种实施例中，力传递件106是弹性件，且力输入区域未受力时，弹性件处于压缩状态，以使弹性件通过张力抵靠在外壳的力输入区域。这使得力传递件106可以吸收压力检测模组与电子设备的外壳装配时的装配公差和/或材料公差，进而进一步的提高压力检测的准确性和一致性。
例如，在装配设计中，压力检测模组中第一电路板102的第二表面(即力传递件106所在的表面)与外壳的力输入区域的距离应当为1.5mm。然而，在实际装配过程中，由于装配公差和/或材料公差的存在，第一电路板102的第二表面距离外壳的力输入区域的距离仅为1.2mm。此时，由于力传递件106一定的弹性强度，因此力传递件106可以安装在第一电路板102的第二表面与外壳的力输入区域之间，且不会导致第一电路板102产生变形，即吸收压力检测模组与电子设备的外壳的装配公差和/或材料公差。
应理解，力传递件106还应当具有一定刚性，由此确保将用户施加于外壳的力输入区域的外界压力准确地传递至第一电路板102。
为了实现更加简单且低成本的安装，力传递件106可以为弹片、弹簧、顶针或硅胶垫。应理解，此处仅是举例说明，在其他实施例中，力传递件106可以是具有类似弹性和刚性的其他部件，本实施例对此不做限定。
本申请实施例提供了一种电子设备，电子设备的外壳内部具有上述任一实施例提供的压力检测模组。
本实施例中，电子设备可以是需要压力检测的任何适用电子设备。例如，电子设备可以是耳机，例如真正无线立体声(True Wireless Stereo，TWS)耳机、颈挂式耳机、头戴式耳机。又例如，电子设备也可以是可穿戴设备，例如智能手表、智能眼镜等。又例如，电子设备也可以是电动牙刷、遥控器、电子烟等。
本实施例的压力检测模组可以设置在电子设备的外壳内部的任何合适位置。例如，在电子设备为耳机时，压力检测模组可以位于耳机的杆部中。在电子设备为智能眼镜时，压力检测模组可以位于智能眼镜上与镜片连接的杆部。 应理解，此处仅是举例说明，本实施例对此不做限定。
为了便于理解，下面参照图11和图12以电子设备为耳机为例对压力检测模组的设置位置以及装配过程进行详细说明。在本示例中，压力检测模组10设置在耳机的杆部21的外壳内部。
具体地，如图11和图12所示，第一电极的第一表面固定于第一电路板102，第一电极的第二表面与第二电极的第一表面相对，且使第一电极与第二电极形成电容。第二电极的第二表面固定于第二电路板104。第一电路板102与第二电路板104通过固定件105固定连接。力传递件106设置于第一电路板102上远离第一电极的表面。在上述压力检测模组组装完成之后，可以直接从耳机的尾部插入耳机杆部，使得力传递件106设置于第一电路板与耳机杆部外壳的力输入区域的内表面之间。对于揭盖式耳机，可以在上述压力检测模组安装在耳机杆部的下壳(或上壳)之后，将耳机杆部的上壳(或下壳)盖合在耳机杆部的下壳(或上壳)上，确保力传递件与杆部外壳的内表面刚性连接。
上述安装和装配工艺均为常规生产工艺、装配简单且步骤少，极大地提高了生产效率。此外，由于压力检测模组中依托第二电路板和第一电路板设置两个电极，然后配合简单的力传递件即可实现精确的压力检测，无需支架和额外的其他部件，简化了压力检测模组的设计、生产和装配工艺。同时由于压力检测模组采用了成本低廉的第一电路板和第二电路板，这使得该压力检测模组的成本也较为低廉。
本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于系统实施例而言，由于其基本相似于方法实施例，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (18)

  1. 一种压力检测模组，应用于电子设备，其特征在于，所述压力检测模组设置于电子设备的外壳的内表面上，所述压力检测模组包括：
    第一电路板、第二电路板、力传递件、第一电极、及第二电极；
    所述第一电路板与所述第二电路板通过固定件固定连接；所述第一电极固定于所述第一电路板，所述第二电极固定于所述第二电路板，且所述第一电极与所述第二电极相对设置，以使所述第一电极与所述第二电极形成电容；
    所述力传递件位于所述外壳的力输入区域与所述第一电路板之间，以用于将所述力输入区域接受的外界压力传递至所述第一电路板并带动所述第一电路板上的第一电极向所述第二电极的方向移动，令所述第一电极与所述第二电极之间的电容变化，以根据所述电容变化确定对所述外界压力的压力检测结果。
  2. 根据权利要求1所述的压力检测模组，其特征在于，所述力传递件位于所述力输入区域的中心位置。
  3. 根据权利要求1所述的压力检测模组，其特征在于，所述力传递件的一端固定在所述第一电路板上，所述力传递件的另一端抵靠在外壳的所述力输入区域。
  4. 根据权利要求1至3中任一项所述的压力检测模组，其特征在于，所述力传递件为弹性件，且所述力输入区域未受力时，所述弹性件处于压缩状态，以使所述弹性件通过张力抵靠在所述外壳的所述力输入区域。
  5. 根据权利要求4所述的压力检测模组，其特征在于，所述力传递件是弹片、弹簧、顶针或硅胶垫。
  6. 根据权利要求1至3中任一项所述的压力检测模组，其特征在于，所述第一电路板与所述第二电路板通过焊接件固定连接。
  7. 根据权利要求6所述的压力检测模组，其特征在于，所述第一电路板上且在所述第一电极的外围设置有焊接点，所述第二电路板上且在所述第二电极的外围设置有与所述焊接点匹配的焊盘，所述第一电路板和所述第二电路板通过所述焊接点和所述焊盘固定为一个整体。
  8. 根据权利要求6所述的压力检测模组，其特征在于，所述第一电极或所述第一电路板的四个角部设置有焊接点，所述第二电路板或所述第二电极的四个角部设置有与所述焊接点匹配的焊盘；或者，
    所述第一电极或所述第一电路板相对的两个端部设置有焊接点，所述第二电路板或所述第二电极相对的两个端部设置有与所述焊接点匹配的焊盘；
    所述第一电路板和所述第二电路板通过所述焊接点和所述焊盘固定为一个整体。
  9. 根据权利要求8所述的压力检测模组，其特征在于，所述焊盘使得所述第一电极和第二电极之间形成空气间隙，以使第一电极和第二电极形成电容，在所述压力检测模组未受压时，所述第一电极和第二电极之间的距离为所述焊盘的高度。
  10. 根据权利要求1所述的压力检测模组，其特征在于，所述固定件包括至少两个具有预设高度的第一粘附件，所述第一粘附件设置于所述第一电路板与所述第二电路板之间，以用于固定所述第一电路板和所述第二电路板的端部，或者，所述第一粘附件设置于所述第一电极与所述第二电极之间，以用于固定所述第一电极和所述第二电极的端部；
    所述预设高度被设置成使得所述第一电极与所述第二电极形成电容。
  11. 根据权利要求10所述的压力检测模组，其特征在于，所述第一粘附件设置于所述第一电路板与所述第二电路板之间且位于所述第一电极和所述第二电极的外围。
  12. 根据权利要求1-3中任一项所述的压力检测模组，其特征在于，所述第二电路板是所述电子设备的电路板主板，或者
    所述第二电路板固定于所述电子设备的电路板主板上。
  13. 根据权利要求1-3中任一项所述的压力检测模组，其特征在于，所述第一电极与所述第二电极之间的距离大于或者等于0.1毫米，且小于或者等于0.4毫米。
  14. 根据权利要求1-3中任一项所述的压力检测模组，其特征在于，所述第一电路板的厚度为大于或等于0.6毫米，且小于或等于1.2毫米。
  15. 根据权利要求14所述的压力检测模组，其特征在于，所述第一电路板的厚度为0.8毫米。
  16. 根据权利要求1-3中任一项所述的压力检测模组，其特征在于，所述第一电极和所述第二电极的长度均小于或等于5毫米，且所述第一电极和所述第二电极的宽度均小于或等于1.5毫米。
  17. 一种电子设备，其特征在于，所述电子设备的外壳内部设置有如权利要求1-16中任一项所述的压力检测模组。
  18. 根据权利要求17所述的电子设备，其特征在于，所述电子设备为耳机， 所述压力检测模组设置在所述耳机的杆部的外壳内部。
PCT/CN2021/076377 2021-02-09 2021-02-09 压力检测模组及电子设备 WO2022170527A1 (zh)

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