WO2022170688A1 - 压力检测模组及电子设备 - Google Patents

压力检测模组及电子设备 Download PDF

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Publication number
WO2022170688A1
WO2022170688A1 PCT/CN2021/094710 CN2021094710W WO2022170688A1 WO 2022170688 A1 WO2022170688 A1 WO 2022170688A1 CN 2021094710 W CN2021094710 W CN 2021094710W WO 2022170688 A1 WO2022170688 A1 WO 2022170688A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
pressure detection
detection module
electrode
module according
Prior art date
Application number
PCT/CN2021/094710
Other languages
English (en)
French (fr)
Inventor
黄瑞朗
肖鹏
蔡军
徐兴浪
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to KR1020217030406A priority Critical patent/KR20220116382A/ko
Priority to EP21769869.5A priority patent/EP4068800A1/en
Priority to CN202121923949.0U priority patent/CN216284032U/zh
Priority to PCT/CN2021/112765 priority patent/WO2022170749A1/zh
Priority to US17/481,041 priority patent/US20220252469A1/en
Publication of WO2022170688A1 publication Critical patent/WO2022170688A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0447—Position sensing using the local deformation of sensor cells
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/16—Sound input; Sound output
    • G06F3/165—Management of the audio stream, e.g. setting of volume, audio stream path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/965—Switches controlled by moving an element forming part of the switch
    • H03K17/975—Switches controlled by moving an element forming part of the switch using a capacitive movable element
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/965—Switches controlled by moving an element forming part of the switch
    • H03K2217/9651—Switches controlled by moving an element forming part of the switch the moving element acting on a force, e.g. pressure sensitive element

Definitions

  • the present application relates to the field of electronic technology, and in particular, to a pressure detection module and an electronic device.
  • Electronic devices such as earphones can detect whether they are pressed through the pressure detection module installed inside, so as to perform operation control corresponding to the pressing.
  • the pressure detection module installed in the earphone determines whether the earphone is pressed, so as to control the playback of music in the earphone.
  • the pressure detection module is usually installed in a small space of an electronic device. How to reduce the internal space of the electronic device occupied by the pressure detection module, especially the thickness of the electronic device, has become an urgent technical problem to be solved.
  • one of the technical problems solved by the embodiments of the present application is to provide a pressure detection module and an electronic device to partially or completely solve the technical problems existing in the prior art.
  • an embodiment of the present application provides a pressure detection module, the pressure detection module is disposed on the inner surface of a casing of an electronic device, and the pressure detection module includes: a first electrode, a second electrode, a first a circuit board, a second circuit board, and at least two solder fixing parts for fixing the first circuit board and the second circuit board; the first surface of the first circuit board is fixed to the force input of the casing the inner surface of the area, the second surface of the first circuit board is fixed to the first surface of the first electrode, the first surface of the second circuit board is fixed to the second surface of the second electrode; The two end sides of the second surface of a circuit board and the two end sides of the first surface of the second circuit board are disposed opposite to each other through the at least two solder fixing parts, and the second There is a compressible insulating layer between the surface and the first surface of the second electrode to make the first electrode and the second electrode form a capacitance; the force input area of the casing drives the first electrode according to the received external
  • an embodiment of the present application provides an electronic device, wherein a housing of the electronic device has at least one pressure detection module as described above.
  • the second surface of the first circuit board is fixed to the first surface of the first electrode.
  • the first surface of an electrode, the first surface of the second circuit board is fixed to the second surface of the second electrode, the two end sides of the second surface of the first circuit board and the two ends of the first surface of the second circuit board.
  • the sides are arranged opposite to each other through the solder fixing part, and a compressible insulating layer is formed between the second surface of the first electrode and the first surface of the second electrode, so that the first electrode and the second electrode form a capacitance.
  • the force input area of the casing When the force input area of the casing receives the external pressure, it drives the first electrode to move in the direction of the second electrode, and the pressure detection result of the external pressure is determined by the change of the capacitance between the first electrode and the second electrode. Therefore, the pressure detection module of the embodiment of the present application only needs to be installed on the inner surface of the force input area of the housing to realize pressure detection, without the need for a bracket and the thickness of the pressure detection module is small, thereby facilitating the installation of other components inside the electronic device. In addition, the relative arrangement of the first electrode and the second electrode does not need to occupy the area of the two, which improves the accuracy of sensing the external pressure and provides a better adhesive bond between the first circuit board and the second circuit board. attached effect.
  • FIG. 1 is a structural diagram of a pressure detection module provided by an embodiment of the application.
  • FIG. 2 is a structural diagram of another pressure detection module provided by an embodiment of the present application.
  • FIG. 3 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 4 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 5 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 6 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 7 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 8 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 9 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application.
  • FIG. 10 is a structural diagram of yet another pressure detection module provided by an embodiment of the application.
  • FIG. 11 is a schematic diagram of the installation of an earphone provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of the internal structure of an earphone according to an embodiment of the application.
  • FIG. 13 is a schematic diagram of installation of another earphone according to an embodiment of the present application.
  • the embodiments of the present application provide a pressure detection module and an electronic device, and the specific implementation of the embodiments of the present invention will be further described below with reference to the accompanying drawings of the embodiments of the present invention.
  • FIG. 1 is a structural diagram of a pressure detection module provided by the first embodiment of the present application.
  • the pressure detection module 10 is disposed on the inner surface of the casing 20 of the electronic device.
  • the pressure detection module 10 includes: a first electrode 101, a second electrode 102, a first circuit board 103, a second circuit board 104, and a first electrode 101, a second electrode 102, a first circuit board 103, and a second circuit board 104.
  • the first surface of the first circuit board 103 is fixed to the inner surface of the force input area of the housing 20
  • the second surface of the first circuit board 103 is fixed to the first surface of the first electrode 101
  • the first surface of the second circuit board 104 is fixed The second surface of the second electrode 102 .
  • the two end sides of the second surface of the first circuit board 103 and the two end sides of the first surface of the second circuit board 104 are disposed opposite to each other through the solder fixing portion 105 , and the second surface of the first electrode 101 There is a compressible insulating layer between the first surface of the second electrode 102 and the first electrode 101 to form a capacitance between the first electrode 101 and the second electrode 102 .
  • the force input area of the housing 20 drives the first electrode 101 to move in the direction of the second electrode 102 according to the received external pressure, so as to change the capacitance between the first electrode 101 and the second electrode 102 to determine the pressure against the external pressure Test results.
  • the force input area of the housing 20 is an area of any shape
  • the force input area can use any sign to indicate that the user can apply pressure on this area
  • the position of the center of the force input area corresponds to the position of the center of the first electrode, so that the user can
  • the external pressure exerted by the force input area drives the first electrode to move in the direction of the second electrode.
  • the compressible insulating layer is air.
  • the embodiments of the present application are based on the above arrangement and the compressible insulating layer is air, so that assembly difficulty and production cost can be reduced.
  • the center of the force input area deforms the most, and the center of the force input area corresponds to the center of the first electrode 101 .
  • the force input area of the casing 20 receives an external force
  • the first electrode 101 fixed to the casing 20 is deformed along with the deformation of the casing 20
  • the deformation of the first electrode 101 will be consistent with the casing 20
  • the second electrode 102 is fixed on the second
  • the circuit board 104, the two end sides of the second circuit board 104 are fixed to the first circuit board 103 by the solder fixing parts, and there is a compressible insulating layer between the first electrode 101 and the second electrode 102, so the second electrode 102 will deform following the deformation of the second circuit board 104 .
  • the deformation displacement of the pressing center is larger than that of the two ends, that is, the deformation displacement of the first electrode 101 is larger than that of the second electrode 102, the distance between the first electrode 101 and the second electrode 102 will change, resulting in The capacitance changes, and the pressure detection result of the external pressure can be determined according to the capacitance change.
  • the two end sides of the second surface of the first circuit board 103 refer to the parts where the first electrode is not fixed and located on both sides of the first electrode; the two end sides of the first surface of the second circuit board 104 refer to The part where the second electrode is not fixed and is located on both sides of the second electrode.
  • the pressure detection module of the embodiment of the present application only needs to be installed on the inner surface of the force input area of the casing to realize pressure detection, without the need for a bracket and the thickness of the pressure detection module is reduced, thereby facilitating the installation of other components inside the electronic device, and is convenient for Reduce the interference effect of pressure detection module and other electronic components in miniaturized electronic equipment.
  • the two end sides of the second surface of the first circuit board and the two end sides of the first surface of the second circuit board in the embodiment of the present application are disposed opposite to each other through the solder fixing parts, so that the second surface of the first circuit board is placed opposite to each other.
  • the first electrode of the circuit board is opposite to the second electrode on the first surface of the second circuit board, and does not occupy the area of the first electrode and the second electrode, but only occupies a smaller area of the first circuit board and the second circuit board, and It is beneficial to set larger first electrodes and second electrodes on the pressure detection module, thereby improving the accuracy of sensing external pressure by the first electrodes and the second electrodes, facilitating component assembly and saving costs.
  • the embodiment of the present application provides a better adhesion effect of relatively fixing the first circuit board and the second circuit board through the solder fixing portion, so that when the electronic device is not subjected to external pressure, the first circuit board on the first circuit board is not subjected to external pressure.
  • the relative position of the electrode and the second electrode on the second circuit board is more stable and reliable, and it is also beneficial for the pressure detection module to be installed in the casing of the electronic device as a whole.
  • the solder fixing part does not need glue dispensing, the solder fixing part is not easy to age, and the production process of the solder fixing part adopts the surface mount technology, which is convenient for automation and saves manpower.
  • the solder fixing part is more stable and reliable than the dispensing connection, which is more conducive to improving the accuracy and consistency of pressure detection.
  • the adhesion effect of the solder fixing part is better than that of dispensing or double-sided tape, so when the same adhesion effect is required, a smaller solder fixing part can be used, which can reduce the occupation of the solder fixing part. space and increase the area of the first electrode and the second electrode, so as to improve the signal quantity and accuracy of pressure detection.
  • the solder fixing portion 105 is provided on the edge sides of the first circuit board 103 and the second circuit board 104 away from the first electrode 101 and the second electrode 102 .
  • the solder fixing portion 105 Based on the above arrangement and the arrangement of the solder fixing portion 105 on the edge side away from the first electrode 101 and the second electrode 102 in the embodiment of the present application, it is possible to further prevent the solder fixing portion 105 from affecting the first electrode 101 and the second electrode.
  • the influence of 102 improves the accuracy of the first electrode 102 and the second electrode 103 in sensing the external pressure.
  • the distance between the first electrode and the second electrode is very short and the area of the two electrodes is very small, which may lead to a small amount of capacitance signal, so that the back-end detection circuit cannot detect it properly.
  • the capacitive signal or the detected signal is very weak.
  • the first electrode and the second electrode in the pressure detection module set in the smaller earphone space can be set larger, thereby increasing the signal amount of the capacitive signal between the first electrode and the second electrode , in order to improve the accuracy of pressure sensing.
  • the position of the solder fixing portion 105 on one end side of the first circuit board 103 and the second circuit board 104 is symmetrical with the position of the other end side; and/or the solder fixing portion 105
  • the number on one end side of the first circuit board 103 and the second circuit board 104 is the same as the number on the other end side.
  • the embodiments of the present application are based on the above arrangement and the positional or quantitatively symmetric arrangement of the solder fixing portions 105 , which can provide a better adhesion effect of relatively fixing the first circuit board 103 and the second circuit board 104 .
  • the height of the solder fixing portion 105 is greater than or equal to 0.05 mm to less than or equal to 0.15 mm.
  • the embodiments of the present application are based on the above settings and the height of the solder fixing portion 105 , so that a certain signal amount of the detected pressure signal can be ensured, so as to avoid the undetected signal or the detected signal being weak and affecting the accuracy of the detected pressure It can also reduce the volume and thickness of the pressure detection module, simplify the manufacturing process and improve the consistency and yield of products, which is more conducive to the miniaturization of electronic equipment.
  • the pads of the solder fixing portion 105 in contact with the first circuit board 103 and the second circuit board 104 are rectangles with a single side greater than or equal to 0.3 mm.
  • the embodiments of the present application can achieve a good fixing effect between the first circuit board 103 and the second circuit board 104 based on the above settings and the pad area.
  • the number of the solder fixing parts 105 on each end side is two or three, so as to ensure a good fixing effect between the first circuit board 103 and the second circuit board 104 and avoid occupying too much
  • the area of the first circuit board 103 and the second circuit board 104 is increased.
  • the second electrode 102 is electrically connected to the chip through the solder fixing portion 105 , so that the solder fixing portion 105 can be adhered and fixed, and can also be electrically connected to The area occupied by the second circuit board 104 is further saved, and the wiring can be reduced, thereby reducing the interference of the wiring to the electronic device.
  • the pressure detection module 10 further includes: a first adhesive layer 106 .
  • the first surface of the first circuit board 103 is fixed to the inner surface of the force input area of the housing 20 by the first adhesive layer 106 .
  • the first circuit board is adhered to the inner surface of the force input area of the housing 20 through the first adhesive layer, which makes the installation easier.
  • the first adhesive layer 106 is a layered structure having adhesive force on both upper and lower surfaces, so as to easily realize the adhesion between the first circuit board 103 and the inner surface of the force input area of the housing 20 .
  • the first adhesive layer 106 is a double-sided tape.
  • the thickness of the double-sided adhesive tape is less than or equal to 0.15 mm.
  • the thickness of the double-sided adhesive tape is 0.1 mm.
  • the first circuit board in order to better attach the first electrode to the second surface of the first circuit board, may use a rigid printed circuit board; It is preferably attached to the first surface of the second circuit board, and the second circuit board can be a rigid printed circuit board.
  • the pressure detection module further includes: a first reinforcing plate 107 , and the first reinforcing plate 107 is fixed on the first surface of the first circuit board 103 .
  • the first reinforcing plate 107 is disposed on the first surface of the first circuit board 103, so that the pressure detection module can be disposed inside the casing of the electronic device as a whole, so that the pressure detection provided by this embodiment can be achieved.
  • the module can be applied to electronic equipment whose casing cannot be disassembled, for example, that the pull rod of the earphone is a cylindrical integral structure, which can improve the convenience of installation of the pressure detection module on the electronic equipment.
  • the supporting function of the first reinforcing plate also enables the first circuit board to have better flatness.
  • the outer shell of the pull rod can be disassembled, that is, the shell of the pull rod is divided into an upper shell and the lower casing, the pressure detection module is first arranged inside the lower casing of the tie rod, and then the upper casing of the tie rod is fastened on the lower casing.
  • the pressure detection module with the first reinforcing plate since the strength of the first reinforcing plate is increased, it is not necessary to disassemble the shell of the tie rod, and the whole can be directly arranged inside the cylindrical shell.
  • the first reinforcing plate is made of insulating material, so that the pressure detection module provided by the embodiment of the present application can realize pressure detection and touch detection at the same time.
  • the pressure detection module 10 further includes: a first reinforcing pressing layer 108 , and the first reinforcing plate 107 is fixed to the first circuit board 103 through the first reinforcing pressing layer 108 on the first surface.
  • the first reinforcing plate is fixed on the first surface of the first circuit board through the first reinforcing pressing layer, which improves the adhesion between the first reinforcing plate and the first surface of the first circuit board. fit and flatness.
  • the first reinforcement plate 107 and the first reinforcement pressing layer 108 are less than or equal to 0.2 mm.
  • the total thickness of the first reinforcement plate 107 and the first reinforcement pressing layer 108 is 0.2 mm.
  • the pressure detection module 10 further includes: a second reinforcing plate 109 , and the second reinforcing plate 109 is fixed on the second surface of the second circuit board 104 .
  • the second reinforcing plate is arranged on the second surface of the second circuit board, so that the second circuit board is more closely attached to the second surface of the second electrode, and the supporting effect of the second reinforcing plate is It also makes the second electrode have better flatness.
  • the second reinforcing plate 109 is a steel plate, which can provide better support, better flatness, and a simple and convenient manufacturing process.
  • the pressure detection module further includes: a second reinforcing pressing layer 110 , and the second reinforcing plate 109 is fixed to the second circuit board 104 through the second reinforcing pressing layer 110 . on the second surface.
  • the second reinforcing plate is fixed on the second surface of the second circuit board through the second reinforcing pressing layer, which improves the fit and flatness between the second reinforcing plate and the second circuit board.
  • the second reinforcement plate 109 and the second reinforcement pressing layer 110 are less than or equal to 0.15 mm.
  • the total thickness of the second reinforcement plate 109 and the second reinforcement pressing layer 110 is 0.15 mm.
  • the first surface of the first circuit board 103 also has at least one touch sensor 30 .
  • the first surface of the first circuit board 103 also has at least one touch sensor 30, and the first reinforcing plate 107 is an insulating reinforcing plate, so that the The touch sensor detects the user's touch.
  • both the touch sensor and the first electrode are installed on the first circuit board in the embodiment of the present application
  • the first electrode for detecting pressure and the touch sensor for detecting touch can both be located on the same side of the casing and at the same position on the same side (that is, the casing where the force input area is located), so that the first circuit board can pass
  • the force input area of the housing simultaneously senses the user's touch and the pressure exerted by the user. Its structure is simple, the installation process can also be simplified, and the simple structure and simplified process can further improve product consistency and improve product yield. .
  • the embodiments of the present application can further save the internal space of the electronic device and facilitate the installation of other internal components.
  • the length of the first circuit board is greater than or equal to 5 mm, so as to better enable at least one touch sensor on the first circuit board to realize touch sensing.
  • the embodiment of the present application provides an electronic device, and the housing of the electronic device has the pressure detection module in any of the above embodiments.
  • the thickness of the casing is less than or equal to 1 mm. Therefore, the present embodiment can reduce the weight of the casing as much as possible while satisfying the strength of the casing.
  • the electronic devices include: wireless Bluetooth headsets, smart glasses, and the like.
  • the pressure detection module of the embodiment of the present application is installed in the pull rod of the wireless Bluetooth headset or smart glasses, and the pull rod is a rod-shaped part connected to the earpiece or the lens.
  • the electronic device is an earphone or smart glasses
  • the pressure detection module is detachably disposed inside the casing of the pull rod of the earphone or smart glasses.
  • the pressure detection module 10 is arranged in the pull rod 40 .
  • the pressure detection module is detachably arranged in the pull rod 40 .
  • the pressure detection module is detachably arranged in the middle of the pull rod 40 . It is convenient for the replacement and maintenance of the pressure detection module.
  • the pressure detection module 10 with the first reinforcing plate is suitable for being non-removably installed inside the casing of the pull rod 40 of the wireless Bluetooth headset as a whole, and the pull rod 40 does not need to be disassembled, which is convenient for installation, replacement and maintenance .
  • the pressure detection module of the embodiment of the present application only needs to be installed on the inner surface of the force input area of the casing to realize pressure detection, without the need for a bracket and the thickness of the pressure detection module is reduced, thereby facilitating the installation of other components inside the electronic device, and is convenient for Reduce the interference effect of pressure detection module and other electronic components in miniaturized electronic equipment.
  • the two end sides of the second surface of the first circuit board and the two end sides of the first surface of the second circuit board in the embodiment of the present application are disposed opposite to each other through the solder fixing parts, so that the second surface of the first circuit board is placed opposite to each other.
  • the first electrode is opposite to the second electrode on the first surface of the second circuit board, and does not occupy the area of the first electrode and the second electrode, but only occupies a smaller area of the first circuit board and the second circuit board, improving the The accuracy of sensing the external pressure by the first electrode and the second electrode is improved, the assembly of components is more convenient, and the cost of components is saved.
  • the embodiment of the present application provides a better adhesion effect of relatively fixing the first circuit board and the second circuit board, does not require glue dispensing, is not easy to age, and the production process adopts surface mount technology, which is convenient for automation and saves manpower. .

Abstract

本申请提供一种压力检测模组及电子设备，涉及电子技术领域，其中，压力检测模组包括：第一电极、第二电极、第一电路板、第二电路板，以及至少两个焊锡固定部；第一电路板的第一表面固定于外壳的力输入区域的内表面，第一电路板的第二表面固定第一电极的第一表面，第二电路板的第一表面固定第二电极的第二表面；第一电路板的第二表面的两个端侧和第二电路板的第一表面的两个端侧通过焊锡固定部相对设置，且第一电极与第二电极形成电容；外壳的力输入区域根据接收到的外界压力，带动第一电极向第二电极的方向移动，令第一电极以及第二电极之间的电容变化，以确定对外界压力的压力检测结果。本申请实施例的压力检测模组无需支架且厚度较小。

Description

压力检测模组及电子设备 技术领域
本申请涉及电子技术领域，尤其涉及一种压力检测模组及电子设备。
背景技术
耳机等电子设备可以通过内部安装的压力检测模组检测其是否被按压，从而进行与按压对应的操作控制。例如，通过安装在耳机中的压力检测模组判断耳机是否被按压，从而控制耳机中音乐的播放。压力检测模组通常设置在电子设备的狭小空间中，如何减少压力检测模组所占用的电子设备的内部空间，尤其是电子设备的厚度，成为亟待解决的技术问题。
实用新型内容
有鉴于此，本申请实施例所解决的技术问题之一在于提供一种压力检测模组及电子设备，用以部分或者全部解决现有技术中存在的技术问题。
第一方面，本申请实施例提供一种压力检测模组，所述压力检测模组设置于电子设备的外壳的内表面上，所述压力检测模组包括：第一电极、第二电极、第一电路板、第二电路板，以及至少两个固定所述第一电路板与所述第二电路板的焊锡固定部；所述第一电路板的第一表面固定于所述外壳的力输入区域的内表面，所述第一电路板的第二表面固定所述第一电极的第一表面，所述第二电路板的第一表面固定所述第二电极的第二表面；所述第一电路板的第二表面的两个端侧和所述第二电路板的第一表面的两个端侧通过所述至少两个焊锡固定部相对设置，且令所述第一电极的第二表面与所述第二电极的第一表面之间具有可压缩的绝缘层以使第一电极与第二电极形成电容；所述外壳的力输入区域根据接收到的外界压力，带动所述第一电极向所述第二电极的方向移动，令所述第一电极以及所述第二电极之间的电容变化，以确定对所述外界压力的压力检测结果。
第二方面，本申请实施例提供一种电子设备，所述电子设备的外壳内部具有至少一上述压力检测模组。
本申请实施例提供的压力检测模组及电子设备，由于压力检测模组所包括的第一电极的第一表面固定于外壳的力输入区域的内表面，第一电路板的第二 表面固定第一电极的第一表面，第二电路板的第一表面固定第二电极的第二表面，第一电路板的第二表面的两个端侧和第二电路板的第一表面的两个端侧通过焊锡固定部相对设置，且令第一电极的第二表面与第二电极的第一表面之间具有可压缩的绝缘层以使第一电极与第二电极形成电容。当外壳的力输入区域接收到外界压力，则带动第一电极向第二电极的方向移动，通过第一电极以及第二电极之间的电容发生的变化确定外界压力的压力检测结果。因此，本申请实施例的压力检测模组仅需要安装在外壳的力输入区域的内表面即可实现压力检测，无需支架且压力检测模组厚度较小，从而便于电子设备内部其他元件的安装。并且，第一电极以及第二电极相对设置无需占用两者的面积，提高了两者感测外界压力的准确性，并提供更佳地将第一电路板与第二电路板相对固定设置的粘附效果。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本申请实施例的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比值绘制的。附图中：
图1为本申请实施例提供的一种压力检测模组的结构图；
图2为本申请实施例提供的另一种压力检测模组的结构图；
图3为本申请实施例提供的再一种压力检测模组的结构图；
图4为本申请实施例提供的再一种压力检测模组的结构图；
图5为本申请实施例提供的再一种压力检测模组的结构图；
图6为本申请实施例提供的再一种压力检测模组的结构图；
图7为本申请实施例提供的再一种压力检测模组的结构图；
图8为本申请实施例提供的再一种压力检测模组的结构图；
图9为本申请实施例提供的再一种压力检测模组的结构图；
图10为本申请实施例提供的再一种压力检测模组的结构图；
图11本申请实施例提供的一种耳机的安装示意图；
图12为本申请实施例提供的一种耳机的内部结构示意图；
图13为本申请实施例提供的另一种耳机的安装示意图。
具体实施方式
为了解决上述问题，本申请实施例提供一种压力检测模组及电子设备，下面结合本实用新型实施例附图进一步说明本实用新型实施例具体实现。
本申请实施例提供一种压力检测模组，如图1所示，图1为本申请实施例一提供的一种压力检测模组的结构图。压力检测模组10设置于电子设备的外壳20内表面上，压力检测模组10包括：第一电极101、第二电极102、第一电路板103、第二电路板104，以及固定所述第一电路板与所述第二电路板的至少两个焊锡固定部105。
第一电路板103的第一表面固定于外壳20的力输入区域的内表面，第一电路板103的第二表面固定第一电极101的第一表面，第二电路板104的第一表面固定第二电极102的第二表面。
第一电路板103的第二表面的两个端侧和所述第二电路板104的第一表面的两个端侧通过所述焊锡固定部105相对设置，且第一电极101的第二表面与第二电极102的第一表面之间具有可压缩的绝缘层以使第一电极101与第二电极102形成电容。
外壳20的力输入区域根据接收到的外界压力，带动第一电极101向第二电极102的方向移动，令第一电极101以及第二电极102之间的电容变化，以确定对外界压力的压力检测结果。
具体地，外壳20的力输入区域为任意形状的区域，力输入区域可以采用任意标识以指示用户可在此区域施加压力，力输入区域中心的位置对应于第一电极中心所在的位置，令用户通过力输入区域施加的外界压力带动第一电极向第二电极的方向移动。
具体地，所述可压缩的绝缘层为空气。
本申请实施例基于上述设置以及可压缩的绝缘层为空气，从而可以降低装配难度，降低生产成本。
当外壳20的力输入区域接收外力而发生形变，力输入区域的中心形变最大，力输入区域的中心对应的即为第一电极101的中心。当外壳20的力输入区域接收外力，固定于外壳20的第一电极101随着外壳20的形变而发生形变，第一电极101的形变将与外壳20一致，而第二电极102固定在第二电路板104，第二电路板104的两个端侧通过焊锡固定部与第一电路板103固定设置，且第一电极101与第二电极102之间具有可压缩的绝缘层，因此第二电极102将跟随第二电路板104形变而形变。由于按压中心的形变位移比两端大， 也就是第一电极101比第二电极102发生的形变位移要大，因此第一电极101与第二电极102之间的距离将发生变化，从而产生了电容变化，根据该电容的变化可以确定对外界压力的压力检测结果。
具体地，第一电路板103的第二表面的两个端侧是指未固定第一电极且位于第一电极两侧的部分；第二电路板104的第一表面的两个端侧是指未固定第二电极且位于第二电极两侧的部分。
本申请实施例的压力检测模组仅需要安装在外壳的力输入区域的内表面即可实现压力检测，无需支架且压力检测模组厚度减小，从而便于电子设备内部其他元件的安装，且便于在小型化的电子设备内减少压力检测模组与其它电子部件的干涉影响。并且，本申请实施例第一电路板的第二表面的两个端侧和第二电路板的第一表面的两个端侧通过焊锡固定部相对设置，从而令在第一电路板第二表面的第一电极与第二电路板第一表面的第二电极相对设置，且并未占用第一电极和第二电极的面积，仅占用较小的第一电路板与第二电路板面积，且有利于在压力检测模组上设置更大的第一电极和第二电极，进而提高了第一电极与第二电极感测外界压力的准确性，也更便于元件装配，节约成本。并且，本申请实施例通过焊锡固定部提供更佳地将第一电路板与第二电路板相对固定设置的粘附效果，进而使得电子设备未受外界压力时，第一电路板上的第一电极与第二电路板上的第二电极的相对位置更加稳定可靠，也有利于使得压力检测模组作为一个整体安装于电子设备的外壳内。而且焊锡固定部无需点胶处理，焊锡固定部不易老化且焊锡固定部的生产工艺采用表面贴装技术，便于自动化，可以节省人力。焊锡固定部相比点胶连接的更稳定可靠，更有利于提高压力检测的准确性和一致性。进一步的，焊锡固定部的粘附效果比点胶或双面胶的粘附效果更好，所以在需要相同的粘附效果时，可以采用更小的焊锡固定部，进而可以减少焊锡固定部占据的空间及提高第一电极和第二电极的面积，以提高压力检测的信号量和准确性。
具体地，参见图2，所述焊锡固定部105设置在所述第一电路板103和所述第二电路板104的远离所述第一电极101和所述第二电极102的边缘侧。
本申请实施例基于上述设置以及将焊锡固定部105设置在远离所述第一电极101和所述第二电极102的边缘侧能够进一步避免焊锡固定部105对第一电极101和所述第二电极102的影响，提高第一电极102与第二电极103感测外界压力的准确性。尤其是在耳机等体积较小的电子设备内，第一电极与第二电 极之间的距离很短且两者的面积很小，则可能导致电容信号量很小，以致后端检测电路检测不到电容信号或者检测的信号很弱。所以本实施例可以使得设置在较小的耳机空间里的压力检测模组里的第一电极和第二电极设置的更大，进而提高第一电极与第二电极之间的电容信号的信号量，以有利于提高感测压力的准确性。
具体地，所述焊锡固定部105位于所述第一电路板103和所述第二电路板104一个端侧的位置与另一个端侧的位置对称设置；和/或，所述焊锡固定部105位于所述第一电路板103和所述第二电路板104一个端侧的数量与另一个端侧的数量相同。
本申请实施例基于上述设置以及将焊锡固定部105进行位置对称设置或者数量对称设置，能够提供更佳地将第一电路板103与第二电路板104相对固定设置的粘附效果。
具体地，所述焊锡固定部105的高度为大于或者等于0.05毫米至小于或者等于0.15毫米。
本申请实施例基于上述设置以及焊锡固定部105的高度，这样既可以保障检测到的压力信号达到的一定的信号量，以避免检测不到信号或检测的信号较弱而影响检测的压力的准确性，还可以减少压力检测模组的体积和厚度，简化制作工序和提高产品的一致性和良率，更有利于电子设备的小型化。
具体地，所述焊锡固定部105与所述第一电路板103和所述第二电路板104接触的焊盘为单边大于或者等于0.3毫米的矩形。
本申请实施例基于上述设置以及焊盘面积能够实现对第一电路板103和第二电路板104之间的良好的固定效果。
具体地，每个端侧的所述焊锡固定部105的数量为两个或者三个，以保证对第一电路板103和第二电路板104之间的良好的固定效果的同时也避免占用过多第一电路板103和第二电路板104的面积。
在本申请一具体实现中，参见图3，所述第二电极102通过所述焊锡固定部105电连接芯片，从而可以令焊锡固定部105实现粘附固定的同时，还可以进行电连接，以进一步节约其占用第二电路板104的面积，且可以减少走线，进而减少走线对电子设备的干扰。
在本申请实施例一具体实现中，参见图4，压力检测模组10还包括：第一粘附层106。
第一电路板103的第一表面通过第一粘附层106固定于外壳20的力输入区域的内表面。
本申请实施例通过第一粘附层将第一电路板粘附至外壳20的力输入区域的内表面，令安装更加简便。
具体地，第一粘附层106为上下两个表面均具有粘附力的层状结构，从而简便地实现第一电路板103与外壳20的力输入区域的内表面之间的粘附。
为实现更加简便且低成本的安装，第一粘附层106为双面胶。
为了令第一粘附层实现粘附效果的同时尽量减小第一粘附层的厚度，从而能够占用更小的电子设备内部空间，双面胶的厚度为小于或者等于0.15毫米。
为了实现粘附效果的同时尽量减小第一粘附层的厚度，双面胶的厚度为0.1毫米。
在本申请实施例另一具体实现中，为了实现第一电极更佳地贴附于第一电路板的第二表面，所述第一电路板可以采用硬性印刷电路板；为了实现第二电极更佳地贴附于第二电路板的第一表面，所述第二电路板可以采用硬性印刷电路板。
在本申请另一具体实施例中，参见图5，在压力检测模组中还包括：第一补强板107，第一补强板107固定于第一电路板103的第一表面上。
本申请实施例通过在第一电路板103的第一表面上设置第一补强板107，从而令压力检测模组可作为整体设置在电子设备的外壳内部，以使得本实施例提供的压力检测模块可以适用于壳体不可以拆分的电子设备，例如适用于耳机的拉杆为一筒状的整体的结构，进而可以提高压力检测模组在电子设备上的安装的便捷性。第一补强板的支撑作用也令第一电路板具有更佳的平整度。
因此，将不具有第一补强板的压力检测模组安装于耳机等电子设备的拉杆(即耳机的杆部)内时，可将拉杆的外壳进行拆件，即拉杆的外壳分成上壳体和下壳体，先将压力检测模组设置在拉杆的下壳体内部，再将拉杆的上壳体扣合在下壳体上。具有第一补强板的压力检测模组，因第一补强板增加了强度，则无需将拉杆的外壳进行拆件，可以整个直接设置在筒状的外壳内部。
具体地，第一补强板采用绝缘材质制作，这样才能使得本申请实施例提供的压力检测模组可以同时实现压力检测和触摸检测。
在本申请再一具体实现中，参见图6，压力检测模组10还包括：第一补 强压合层108，第一补强板107通过第一补强压合层108固定于第一电路板103的第一表面上。
本申请实施例通过第一补强压合层将第一补强板固定于第一电路板的第一表面上，提高了第一补强板与第一电路板的第一表面上之间的贴合度和平整度。
为了实现补强作用的同时令尽量减小第一补强板107与第一补强压合层108的厚度，从而能够占用更小的电子设备内部空间，第一补强板107与第一补强压合层108的总厚度为小于或者等于0.2毫米。
为了实现最佳地补强作用的同时令尽量减小第一补强板107与第一补强压合层108的厚度，第一补强板107与第一补强压合层108的总厚度为0.2毫米。
在本申请再一具体实现中，参见图7，压力检测模组10还包括：第二补强板109，第二补强板109固定于第二电路板104的第二表面上。
本申请实施例通过在第二电路板的第二表面上设置第二补强板，从而令第二电路板更加紧密贴附于第二电极的第二表面上，第二补强板的支撑作用也令第二电极具有更佳的平整度。
具体地，第二补强板109为钢板，其能提供较好的支撑作用、较好的平整度、且制作工艺简单方便。
在本申请再一具体实现中，参见图8，压力检测模组还包括：第二补强压合层110，第二补强板109通过第二补强压合层110固定于第二电路板104的第二表面上。
本申请实施例通过第二补强压合层将第二补强板固定于第二电路板的第二表面，提高了第二补强板与第二电路板之间的贴合度和平整度。
为了实现补强作用的同时令尽量减小第二补强板109与第二补强压合层110的厚度，从而能够占用更小的电子设备内部空间，第二补强板109与第二补强压合层110的总厚度为小于或者等于0.15毫米。
为了实现最佳地补强作用的同时令尽量减小第二补强板109与第二补强压合层110的厚度，第二补强板109与第二补强压合层110的总厚度为0.15毫米。
在本申请实施例另一具体实现中，参见图9，对于所有不具有第一补强板107的技术方案，第一电路板103的第一表面还具有至少一触摸传感器30。
参见图10，对于具有第一补强板107的技术方案，第一电路板103的第一表面还具有至少一触摸传感器30，所述第一补强板107为绝缘补强板，这样才能使得触摸传感器检测用户的触摸。
由于本申请实施例第一电路板的第一表面具有至少一触摸传感器，第二表面固定于第一电极的第一表面，本申请实施例将触摸传感器与第一电极均安装在第一电路板上，可以使得检测压力的第一电极和检测触摸的触摸传感器都位于壳体的同一侧且为所述同一侧的同一位置(即力输入区域所在的壳体)，进而第一电路板可通过外壳的力输入区域同时感测用户的触摸与用户施加的压力，其结构简单、安装工序也可以被简化、且简单的结构和简化的工序可以进一步的提升产品的一致性和提升产品的良率。本申请实施例还可进一步节约了电子设备的内部空间，便于内部其他元件的安装。
具体地，第一电路板的长度为大于或者等于5毫米，从而更佳地令第一电路板上的至少一触摸传感器实现触摸感测。
在本申请再一具体实施例中，本申请实施例提供一种电子设备，电子设备的外壳内部具有上述任一实施例中压力检测模组。
本申请实施例中，外壳的厚度小于或者等于1毫米。因此，本实施例在满足外壳的强度的情况下，还能够尽可能地减轻外壳的重量。
具体地，电子设备包括：无线蓝牙耳机、智能眼镜等。本申请实施例的压力检测模组安装于无线蓝牙耳机或者智能眼镜的拉杆中，拉杆为与听筒或者镜片连接的杆状部分。
具体地，电子设备为耳机或者智能眼镜，所述压力检测模组可拆卸地设置于所述耳机或者智能眼镜的拉杆的外壳内部。
示例性地，参见图11、图12电子设备为无线蓝牙耳机时，压力检测模组10设置在拉杆40中。
另外，参见图11、图12，该压力检测模组可拆卸地设置于拉杆40中。
可选地，该压力检测模组可拆卸地设置于拉杆40的中部。便于压力检测模组的更换和维修。
因此，参见图13，具有第一补强板的压力检测模组10适用于作为整体不可拆卸地安装在无线蓝牙耳机的拉杆40的外壳内部，无需对拉杆40进行拆件，便于安装以及更换维修。
本申请实施例的压力检测模组仅需要安装在外壳的力输入区域的内表面即 可实现压力检测，无需支架且压力检测模组厚度减小，从而便于电子设备内部其他元件的安装，且便于在小型化的电子设备内减少压力检测模组与其它电子部件的干涉影响。并且，本申请实施例第一电路板的第二表面的两个端侧和第二电路板的第一表面的两个端侧通过焊锡固定部相对设置，从而令在第一电路板第二表面的第一电极与第二电路板第一表面的第二电极相对设置，且并未占用第一电极和第二电极的面积，仅占用较小的第一电路板与第二电路板面积，提高了第一电极与第二电极感测外界压力的准确性，也更便于元件装配，节约元件成本。并且，本申请实施例提供更佳地将第一电路板与第二电路板相对固定设置的粘附效果，无需点胶处理，不易老化，生产工艺采用表面贴装技术，便于自动化，可以节省人力。
还需要说明的是，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个”限定的要素，并不排除在包括要素的过程、方法、商品或者设备中还存在另外的相同要素。
本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于系统实施例而言，由于其基本相似于方法实施例，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
以上仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (28)

  1. 一种压力检测模组，其特征在于，所述压力检测模组设置于电子设备的外壳的内表面上，所述压力检测模组包括：第一电极、第二电极、第一电路板、第二电路板，以及至少两个焊锡固定部；
    所述第一电路板的第一表面固定于所述外壳的力输入区域的内表面，所述第一电路板的第二表面固定所述第一电极的第一表面，所述第二电路板的第一表面固定所述第二电极的第二表面；
    所述第一电路板的第二表面的两个端侧和所述第二电路板的第一表面的两个端侧通过所述至少两个焊锡固定部相对设置，且令所述第一电极的第二表面与所述第二电极的第一表面之间具有可压缩的绝缘层以使第一电极与第二电极形成电容；
    所述外壳的力输入区域根据接收到的外界压力，带动所述第一电极向所述第二电极的方向移动，令所述第一电极以及所述第二电极之间的电容变化，以确定对所述外界压力的压力检测结果。
  2. 根据权利要求1所述的压力检测模组，其特征在于，所述焊锡固定部设置在所述第一电路板和所述第二电路板的远离所述第一电极和所述第二电极的边缘侧。
  3. 根据权利要求1所述的压力检测模组，其特征在于，所述焊锡固定部位于所述第一电路板和所述第二电路板一个端侧的位置与另一个端侧的位置对称设置；和/或，所述焊锡固定部位于所述第一电路板和所述第二电路板一个端侧的数量与另一个端侧的数量相同。
  4. 根据权利要求1所述的压力检测模组，其特征在于，所述焊锡固定部的高度为大于或者等于0.05毫米至小于或者等于0.15毫米。
  5. 根据权利要求1所述的压力检测模组，其特征在于，所述焊锡固定部与所述第一电路板和所述第二电路板接触的焊盘为单边大于或者等于0.3毫米的矩形。
  6. 根据权利要求1所述的压力检测模组，其特征在于，每个端侧的所述焊锡固定部的数量为两个或者三个。
  7. 根据权利要求1所述的压力检测模组，其特征在于，所述第二电极通过所述焊锡固定部电连接芯片。
  8. 根据权利要求1所述的压力检测模组，其特征在于，所述压力检测模组还包括：第一粘附层，
    所述第一电路板的第一表面通过所述第一粘附层固定于所述外壳的力输入区域的内表面。
  9. 根据权利要求8所述的压力检测模组，其特征在于，所述第一粘附层为上下两个表面均具有粘附力的层状结构。
  10. 根据权利要求9述的压力检测模组，其特征在于，所述第一粘附层为双面胶。
  11. 根据权利要求10所述的压力检测模组，其特征在于，所述双面胶的厚度为小于或者等于0.15毫米。
  12. 根据权利要求1所述的压力检测模组，其特征在于，所述第一电路板和/或所述第二电路板为硬性印刷电路板。
  13. 根据权利要求1所述的压力检测模组，其特征在于，如所述第一电路板为柔性印刷电路板，所述压力检测模组还包括：第一补强板，
    所述第一补强板固定于所述第一电路板的第一表面上。
  14. 根据权利要求13所述的压力检测模组，其特征在于，所述压力检测模组还包括：第一补强压合层，
    所述第一补强板通过所述第一补强压合层固定于所述第一电路板的第一表面上。
  15. 根据权利要求14所述的压力检测模组，其特征在于，所述第一补强板与所述第一补强压合层的总厚度为小于或者等于0.2毫米。
  16. 根据权利要求1所述的压力检测模组，其特征在于，如所述第二电路板为柔性印刷电路板，所述压力检测模组还包括：第二补强板，
    所述第二补强板固定于所述第二电路板的第二表面上。
  17. 根据权利要求16所述的压力检测模组，其特征在于，所述压力检测模组还包括：第二补强压合层，
    所述第二补强板通过所述第二补强压合层固定于所述第二电路板的第二表面上。
  18. 根据权利要求17所述的压力检测模组，其特征在于，所述第二补强板与所述第二补强压合层的总厚度为小于或者等于0.15毫米。
  19. 根据权利要求16所述的压力检测模组，其特征在于，所述第二补强板为钢板。
  20. 根据权利要求1所述的压力检测模组，其特征在于，所述可压缩的绝 缘层为空气。
  21. 根据权利要求1至12以及16至20中任一项所述的压力检测模组，其特征在于，所述第一电路板的第一表面还具有至少一触摸传感器。
  22. 根据权利要求21所述的压力检测模组，其特征在于，所述第一电路板的长度为小于或者等于10毫米。
  23. 根据权利要求13至15中任一项所述的压力检测模组，其特征在于，所述第一电路板的第一表面还具有至少一触摸传感器，所述第一补强板为绝缘补强板。
  24. 根据权利要求23所述的压力检测模组，其特征在于，所述第一电路板的长度为大于或者等于5毫米。
  25. 一种电子设备，其特征在于，所述电子设备的外壳内部具有至少一权利要求1-24中任一压力检测模组。
  26. 根据权利要求25所述的电子设备，其特征在于，所述外壳的厚度小于或者等于1毫米。
  27. 根据权利要求26所述的电子设备，其特征在于，所述电子设备为耳机或者智能眼镜，所述压力检测模组可拆卸地设置于所述耳机或者智能眼镜的拉杆的外壳内部。
  28. 根据权利要求27所述的电子设备，其特征在于，所述压力检测模组可拆卸地设置于所述拉杆的中部。
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CN214591927U (zh) 2021-11-02
WO2022170527A1 (zh) 2022-08-18

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