WO2022267989A1 - Monomère oxétane contenant du silicium à base biologique d'eugénol et son procédé de préparation - Google Patents
Monomère oxétane contenant du silicium à base biologique d'eugénol et son procédé de préparation Download PDFInfo
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- WO2022267989A1 WO2022267989A1 PCT/CN2022/099400 CN2022099400W WO2022267989A1 WO 2022267989 A1 WO2022267989 A1 WO 2022267989A1 CN 2022099400 W CN2022099400 W CN 2022099400W WO 2022267989 A1 WO2022267989 A1 WO 2022267989A1
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- Prior art keywords
- compound
- formula
- alkyl
- alkylene
- alkoxy
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- 239000000178 monomer Substances 0.000 title claims abstract description 43
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 title abstract description 20
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 title abstract description 10
- 239000005770 Eugenol Substances 0.000 title abstract description 10
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 title abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 10
- 229960002217 eugenol Drugs 0.000 title abstract description 10
- 229910052710 silicon Inorganic materials 0.000 title abstract description 10
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 title abstract description 9
- 239000010703 silicon Substances 0.000 title abstract description 9
- 238000002360 preparation method Methods 0.000 title description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 82
- 239000000203 mixture Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims description 233
- 229910052760 oxygen Inorganic materials 0.000 claims description 47
- 125000005842 heteroatom Chemical group 0.000 claims description 45
- 229910052717 sulfur Inorganic materials 0.000 claims description 44
- 239000003054 catalyst Substances 0.000 claims description 43
- 229910052739 hydrogen Inorganic materials 0.000 claims description 36
- 125000002947 alkylene group Chemical group 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 32
- 125000004432 carbon atom Chemical group C* 0.000 claims description 32
- 125000005529 alkyleneoxy group Chemical group 0.000 claims description 30
- 229910052736 halogen Inorganic materials 0.000 claims description 27
- 150000002367 halogens Chemical class 0.000 claims description 27
- 125000005647 linker group Chemical group 0.000 claims description 23
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 22
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 18
- 125000003161 (C1-C6) alkylene group Chemical group 0.000 claims description 16
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 125000004642 (C1-C12) alkoxy group Chemical group 0.000 claims description 11
- 125000004767 (C1-C4) haloalkoxy group Chemical group 0.000 claims description 9
- 125000004765 (C1-C4) haloalkyl group Chemical group 0.000 claims description 9
- 125000002853 C1-C4 hydroxyalkyl group Chemical group 0.000 claims description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- 125000004737 (C1-C6) haloalkoxy group Chemical group 0.000 claims description 7
- 125000000171 (C1-C6) haloalkyl group Chemical group 0.000 claims description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 7
- 125000006577 C1-C6 hydroxyalkyl group Chemical group 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052794 bromium Inorganic materials 0.000 claims description 7
- 239000000976 ink Substances 0.000 claims description 7
- 125000000962 organic group Chemical group 0.000 claims description 7
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 7
- 229910000104 sodium hydride Inorganic materials 0.000 claims description 7
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000012312 sodium hydride Substances 0.000 claims description 6
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011630 iodine Substances 0.000 claims description 4
- 229910052740 iodine Inorganic materials 0.000 claims description 4
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 3
- 125000002091 cationic group Chemical group 0.000 abstract description 12
- 238000006116 polymerization reaction Methods 0.000 abstract description 12
- 230000002209 hydrophobic effect Effects 0.000 abstract description 7
- -1 1-methylpentyl Chemical group 0.000 description 90
- 239000002904 solvent Substances 0.000 description 34
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- 239000000047 product Substances 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- 238000005481 NMR spectroscopy Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000012535 impurity Substances 0.000 description 8
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 7
- 230000003666 anti-fingerprint Effects 0.000 description 7
- 229940125904 compound 1 Drugs 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000002390 rotary evaporation Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- 238000000016 photochemical curing Methods 0.000 description 6
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 5
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 5
- 229940125782 compound 2 Drugs 0.000 description 5
- 229940126214 compound 3 Drugs 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000010186 staining Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000003712 anti-aging effect Effects 0.000 description 3
- 238000005119 centrifugation Methods 0.000 description 3
- 238000004440 column chromatography Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 238000005292 vacuum distillation Methods 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- 101100129500 Caenorhabditis elegans max-2 gene Proteins 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 101100083446 Danio rerio plekhh1 gene Proteins 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001335 aliphatic alkanes Chemical group 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 125000004438 haloalkoxy group Chemical group 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000012433 hydrogen halide Substances 0.000 description 2
- 229910000039 hydrogen halide Inorganic materials 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- VQVGJEIVVJBMCV-UHFFFAOYSA-N (4-octoxyphenyl)-phenyliodanium Chemical compound C1=CC(OCCCCCCCC)=CC=C1[I+]C1=CC=CC=C1 VQVGJEIVVJBMCV-UHFFFAOYSA-N 0.000 description 1
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 description 1
- 125000004643 (C1-C12) haloalkoxy group Chemical group 0.000 description 1
- 125000004641 (C1-C12) haloalkyl group Chemical group 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000005919 1,2,2-trimethylpropyl group Chemical group 0.000 description 1
- JCERKCRUSDOWLT-UHFFFAOYSA-N 1-bromopropan-1-ol Chemical compound CCC(O)Br JCERKCRUSDOWLT-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- 125000006218 1-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- FODCFYIWOJIZQL-UHFFFAOYSA-N 1-methylsulfanyl-3,5-bis(trifluoromethyl)benzene Chemical compound CSC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 FODCFYIWOJIZQL-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- UKLWXKWTXHHMFK-UHFFFAOYSA-N 3-(chloromethyl)-3-ethyloxetane Chemical compound CCC1(CCl)COC1 UKLWXKWTXHHMFK-UHFFFAOYSA-N 0.000 description 1
- 125000003542 3-methylbutan-2-yl group Chemical group [H]C([H])([H])C([H])(*)C([H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005917 3-methylpentyl group Chemical group 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 125000006003 dichloroethyl group Chemical group 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical class C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D305/00—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms
- C07D305/02—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings
- C07D305/04—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
- C07D305/06—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
- C07F7/0872—Preparation and treatment thereof
- C07F7/0876—Reactions involving the formation of bonds to a Si atom of a Si-O-Si sequence other than a bond of the Si-O-Si linkage
- C07F7/0878—Si-C bond
- C07F7/0879—Hydrosilylation reactions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
Definitions
- the invention relates to the field of photocurable materials, in particular to a eugenol bio-based silicon-containing oxetane monomer.
- the present invention also relates to a preparation method of the monomer, a photocurable composition comprising the monomer and a photocurable material obtained from the photocurable composition.
- Photopolymerization technology is the process of using light to initiate the conversion of liquid oligomers or monomers with active substances into solid products. Compared with traditional thermal polymerization technology, photopolymerization can achieve efficient and pollution-free production without using volatile organic solvents, saving a lot of energy. Therefore, photopolymerization technology is regarded as a green process because of its unique low energy consumption requirements, fast curing, solvent-free formula, no pollution, room temperature treatment and environmental protection, so it is widely used in photocuring coatings, adhesives and printing inks. and other fields are widely used.
- oxetane monomer is a cationic photocuring system.
- Oxycyclane monomer is the main raw material of high-end cationic photocurable products. This system not only has low viscosity and low toxicity.
- people have put forward higher requirements for the heat resistance, water repellency, surface anti-staining, corrosion resistance and anti-fingerprint of photo-curing materials. Require. Consumers are increasingly demanding the appearance of products. In addition to beautiful colors and comfortable handles, they also require the surface to have anti-fingerprint and anti-stain properties. was wiped clean.
- the base material is prepared from the base material, with fast polymerization rate. After photocuring, it has the advantages of good tensile properties, good heat resistance, excellent hydrophobic properties, anti-staining, and anti-fingerprints.
- the present inventors unexpectedly found that the cationic photopolymerizable eugenol bio-based silicon-containing oxetane monomer of formula (I) of the present invention has good polymerization rate and conversion rate and promotes the synthesis of other cationic monomers. Polymerization, and the photocurable material obtained therefrom has good mechanical properties, especially tensile properties and thermal stability, excellent hydrophobic properties and anti-staining and anti-fingerprints.
- the monomer has a good polymerization rate and conversion rate and promotes the polymerization of other cationic monomers, and the photocurable material obtained therefrom has good mechanical properties, especially tensile properties and heat resistance, excellent hydrophobic properties, and Stain, anti-fingerprint, anti-chemical corrosion, strong anti-aging performance.
- Another object of the present invention is to provide a method for preparing the eugenol bio-based silicon-containing oxetane monomer of the present invention.
- the preparation method is simple and easy, the conditions are mild, the raw materials are readily available and the price is low.
- Yet another object of the present invention is to provide a photocurable composition comprising the eugenol bio-based silicone-containing oxetane monomer according to the present invention.
- Another object of the present invention is to provide a photocurable material obtained from the photocurable composition of the present invention.
- Another object of the present invention is to provide the use of the compound of formula (I) of the present invention in photocurable coatings, adhesives and inks.
- n 1-50;
- L is a direct bond or a divalent linking group with 1-30 carbon atoms
- R 1 , R 2 , R 3 , R 4 , R 5 are the same or different, and are independently organic groups with 1-12 carbon atoms;
- R 6 is H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy.
- n 1-30;
- R 1 is C 1 -C 12 alkyl or C 1 -C 12 alkoxy
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 alkoxy, and are independently represented by one or more C 2 -C 12 alkyl separated by non-adjacent heteroatoms selected from NR a , O, S, or C separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S 2 -C 12 alkoxy, and
- L is a direct bond, C 1 -C 30 alkylene, C 1 -C 30 alkyleneoxy, C 2 - separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S C 30 alkylene, or C 2 -C 30 alkyleneoxy interrupted by one or more non-adjacent heteroatoms independently selected from NR a , O, S,
- R a is H or C 1 -C 4 alkyl.
- - m is 1-20, preferably 2-15;
- R 1 is C 1 -C 6 alkyl or C 1 -C 6 alkoxy; R 1 is preferably C 1 -C 4 alkyl or C 1 -C 4 alkoxy;
- R a is H or C 1 -C 4 alkyl; preferably, R 2 , R 3 , R 4 , R 5 , the same or different, and independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy, or one or more independently selected from NR a , O, S C 2 -C 4 alkyl interspersed by non-adjacent heteroatoms, wherein R a is H or C 1 -C 4 alkyl;
- -R 6 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy ;
- -L is C 2 -C 30 alkylene, C 2 -C 30 alkyleneoxy, C 2 -C 30 separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S Alkylene, or C 2 -C 30 alkyleneoxy interrupted by one or more non-adjacent heteroatoms independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkane base.
- n 1-9;
- R 1 is C 1 -C 4 alkyl or C 1 -C 4 alkoxy
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy, or one or more independently selected from NR a , C 1 -C 4 alkyl separated by non-adjacent heteroatoms of O, S, wherein R a is H or C 1 -C 4 alkyl;
- R 6 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; as well as
- L is L 1 -OL 2 , wherein L 1 and L 2 are independently a divalent linking group with 1-20, preferably 1-15 carbon atoms, more preferably C 1 -C 15 alkylene;
- n 3-9;
- R 1 is C 1 -C 4 alkyl
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently C 1 -C 4 alkyl;
- R 6 is H or C 1 -C 4 alkyl
- L is L 1 -OL 2 , wherein L 1 and L 2 are independently C 1 -C 6 alkylene.
- L is L 1 -OL 2 , wherein L 1 and L 2 are independently of each other a divalent linking group having 1-20, preferably 1-15 carbon atoms, more preferably C 1 -C 15 alkylene, especially C 1 -C 6 alkylene.
- L is a divalent linking group having 1-20 , preferably 1-15 carbon atoms, more preferably C 1 -C 15 alkylene, especially C 1 -C 6 alkylene, and X is halogen , such as fluorine, chlorine, bromine or iodine,
- L 2 is a divalent linking group having 1-20, preferably 1-15 carbon atoms, more preferably a C 1 -C 15 alkylene group, especially a C 1 -C 6 alkylene group, R 6 is as in paragraph as defined in any one of items 1-5, and X is halogen, such as chlorine, bromine or iodine.
- reaction of the compound of formula (II) with the compound of formula (III) is carried out in the presence of a basic catalyst, preferably sodium hydride, sodium hydroxide, potassium hydroxide, triethylamine, potassium carbonate or any mixture thereof, More preferably, the molar ratio of the compound of formula (II) to the basic catalyst is 1:1-1:5;
- reaction between the compound of formula (II) and the compound of formula (III) is carried out at 30-120°C, preferably 40-70°C;
- reaction between the compound of formula (II) and the compound of formula (III) is carried out for 3-16 hours, preferably 4-10 hours.
- reaction of the compound of formula (IV) with the compound of formula (VI) is carried out in the presence of a basic catalyst, preferably sodium hydride, sodium hydroxide, potassium hydroxide, triethylamine, potassium carbonate or any mixture thereof, More preferably, the molar ratio of the compound of formula (IV) to the basic catalyst is 1:1-1:5;
- reaction between the compound of formula (IV) and the compound of formula (VI) is carried out at 40-100°C, preferably at 60-90°C; preferably, the reaction is carried out for 3-24 hours, preferably 4-10 hours.
- reaction of the compound of formula (VI) with the compound of formula (VII) is carried out in the presence of Karstedt catalyst or SpeIer catalyst, preferably, the amount of catalyst is 2-500ppm based on the weight of formula (VII);
- reaction between the compound of formula (VI) and the compound of formula (VII) is carried out at 80-110°C, preferably 85-100°C;
- reaction between the compound of formula (VI) and the compound of formula (VII) is carried out for 3-6 hours, preferably 3.5-5.5 hours.
- a photocurable composition comprising a compound of formula (I) according to any one of items 1-5 as a polymerizable monomer.
- Fig. 1 is a graph showing the change of E4221 conversion rate with irradiation time in the system containing compound 1 prepared in Example 1.
- Fig. 2 is a graph showing the change of E4221 conversion rate with irradiation time in the system containing compound 2 prepared in Example 2.
- Fig. 3 is a graph showing the change of E4221 conversion rate with irradiation time in the system containing compound 3 prepared in Example 3.
- FIG. 4 is a graph showing the conversion rate of Compound 1 in the system containing Compound 1 prepared in Example 1 as a function of irradiation time.
- Fig. 5 is a graph of the conversion of compound 2 in the system containing compound 2 prepared in Example 2 as a function of irradiation time.
- Fig. 6 is a graph showing the conversion of compound 3 in the system containing compound 3 prepared in Example 3 as a function of irradiation time.
- Fig. 7 is a contact angle graph of a blank E4221 cured film and a cured film of a system comprising compounds 1-3 prepared in each of Examples 1-3.
- Fig. 8 is a thermogravimetric graph of cured films of blank E4221 and cured films of systems comprising compounds 1-3 prepared in each of Examples 1-3.
- Fig. 9 is a graph showing the mechanical properties of a blank E4221 cured film and a cured film of a system containing compounds 1-3 prepared in each of Examples 1-3.
- a numerical range is used to indicate a range in which the numerical values described before and after are taken as the minimum value and the maximum value, respectively.
- n 1-50;
- L is a direct bond or a divalent linking group with 1-30 carbon atoms
- R 1 , R 2 , R 3 , R 4 , R 5 are the same or different, and are independently organic groups with 1-12 carbon atoms;
- R 6 is H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy.
- the prefix "C n -C m " indicates in each case that the number of carbon atoms contained in the group is nm.
- Halogen refers to fluorine, chlorine, bromine and iodine. In the present invention, it is preferred that the halogen includes fluorine, chlorine or a combination thereof.
- C n -C m alkyl refers to a branched or unbranched saturated hydrocarbon group having nm, such as 1-12, preferably 1-6, particularly preferably 1-4 carbon atoms, such as Methyl, ethyl, propyl, 1-methylethyl, butyl, 1-methylpropyl, 2-methylpropyl, 1,1-dimethylethyl, pentyl, 1-methyl Butyl, 2-methylbutyl, 3-methylbutyl, 2,2-dimethylpropyl, 1-ethylpropyl, hexyl, 1,1-dimethylpropyl, 1,2- Dimethylpropyl, 1-methylpentyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl, 1,1-dimethylbutyl, 1,2-dimethyl Dimethylbutyl, 1,3-dimethylbutyl, 2,2-dimethylbutyl, 2,3-dimethylbutyl, 3,
- the C 1 -C 6 alkyl group may be methyl, ethyl, propyl, isopropyl, n-butyl, 2-butyl, tert-butyl, pentyl, isopentyl, hexyl and isomers thereof.
- C 1 -C 4 Alkyl can be methyl, ethyl, propyl, 1-methylethyl, butyl, 1-methylpropyl, 2-methylpropyl, 1,1-dimethylethyl groups and their isomers.
- C 6 -C m aryl refers to a monocyclic, bicyclic or multicyclic aromatic hydrocarbon group containing 6-m carbon atoms, for example 6-10 carbon atoms.
- C 6 -C m aryl groups mention may be made of phenyl, tolyl, ethylphenyl, propylphenyl, butylphenyl, xylyl, methylethylphenyl, diethylphenyl, Methyl-propylphenyl and naphthyl, etc.; preferably phenyl or naphthyl, especially phenyl.
- C n -C m alkoxy refers to a C n -C m alkyl corresponding to any carbon atom of an open chain C n -C m alkane bonded with an oxygen atom as a linking group C n -C m alkyl, such as C 1 -C 12 alkoxy, more preferably C 1 -C 6 alkoxy, especially preferably C 1 -C 4 alkoxy.
- C 1 -C 6 alkoxy can be methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, 2-butoxy, tert-butoxy, pentyloxy, isopentyloxy group, hexyloxy group and its isomers.
- C 1 -C 4 alkoxy can be methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, sec-butoxy, isobutoxy, tert-butoxy and its isomers body.
- C n -C m haloalkyl refers to C n -C m alkyl substituted by one or more same or different halogen atoms, such as C 1 -C 12 haloalkyl, preferably C 1 -C 6 Haloalkyl, particularly preferably C 1 -C 4 haloalkyl.
- Cn- Cm haloalkyl groups mention may be made of monochloromethyl, monochloroethyl, dichloroethyl, trichloroethyl, monochloropropyl, 1-chloromethylethyl, monochlorobutyl Base, 1-chloromethylpropyl, 2-chloromethylpropyl, 1,1-dichloromethylethyl, 1-chloropentyl, 1-chloromethylbutyl, 2-chloromethylbutyl, 3-chloromethylbutyl, 2,2-dichloromethylpropyl, 1-chloroethylpropyl, monochlorohexyl, 1,1-dichloromethylpropyl, 1,2-dichloromethyl Propyl, 1-chloromethylpentyl, 2-chloromethylpentyl, 3-chloromethylpentyl, 4-chloromethylpentyl, 1,1-dichloromethylbutyl, 1,
- C n -C m haloalkoxy refers to C n -C m alkoxy substituted by one or more same or different halogen atoms, such as C 1 -C 12 haloalkoxy, more preferably C 1 -C 6 haloalkoxy, especially preferably C 1 -C 4 haloalkoxy.
- C n -C m haloalkoxy mention may be made of monochloromethoxy, 2-chloroethoxy, 3-chloropropoxy, 2-chloroisopropoxy, 4-chloro-n-butoxy , 3-chloro-sec-butoxy, 2-chloro-tert-butoxy, 5-chloropentyloxy, 4-chloroisoamyloxy, 6-chlorohexyloxy and its isomers.
- C n -C m hydroxyalkyl refers to a C n -C m that has a hydroxyl group bonded to any carbon atom of an open chain C n -C m alkane corresponding to a C n -C m alkyl group.
- Alkyl such as C 1 -C 6 hydroxyalkyl, especially preferably C 1 -C 4 hydroxyalkyl, such as hydroxymethyl, hydroxyethyl, hydroxypropyl, hydroxyisopropyl, hydroxybutyl, hydroxypentyl, Hydroxyhexyl and its isomers.
- C 1 -C 30 alkylene as used herein includes C 1 -C 26 alkylene, C 1 -C 18 alkylene, C 1 -C 12 alkylene, C 1 -C 6 alkylene, C 2 -C 26 alkylene, C 2 -C 18 alkylene, C 2 -C 12 alkylene, C 2 -C 6 alkylene, C 3 -C 26 alkylene, C 3 -C 18 alkylene Alkyl, C 3 -C 12 alkylene or C 3 -C 6 alkylene.
- C 1 -C 30 alkyleneoxy as used herein includes C 1 -C 26 alkyleneoxy, C 1 -C 18 alkyleneoxy, C 1 -C 12 alkyleneoxy, C 1 -C 6 alkylene Alkoxy, C 2 -C 26 Alkyleneoxy, C 2 -C 18 Alkyleneoxy, C 2 -C 12 Alkyleneoxy, C 2 -C 6 Alkyleneoxy, C 3 -C 26 Alkylene Alkoxy, C 3 -C 18 alkyleneoxy, C 3 -C 12 alkyleneoxy or C 3 -C 6 alkyleneoxy.
- the propylene group between the silicon and the benzene ring in the compound of formula (I) may be -CH 2 -CH 2 -CH 2 - or -CH(CH 3 )-CH 2 -, and is preferably -CH( CH3 ) -CH2- .
- m is generally 1-50, such as 1-40, 1-30, 1-20, 1-18, 1-15, 1-12, 1-9, 2-40, 2-30, 2- 20, 2-18, 2-15, 2-12, 2-9, 3-40, 3-30, 3-20, 3-18, 3-15, 3-12 or 3-9, such as 3, 4, 5, 6, 7, 8 or 9.
- R 1 , R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently an organic group with 1-12 carbon atoms, such as an organic group with 1-6 or 1-4 carbon atoms .
- R 1 is usually C 1 -C 12 alkyl or C 1 -C 12 alkoxy.
- R 1 is C 1 -C 6 alkyl or C 1 -C 6 alkoxy.
- R 1 is C 1 -C 4 alkyl or C 1 -C 4 alkoxy.
- R 1 is C 1 -C 4 alkyl.
- R 1 is methyl, ethyl, n-propyl, i-propyl, n-butyl, sec-butyl or tert-butyl.
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are usually independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 Alkoxy or C 1 -C 12 alkyl interrupted by one or more non-adjacent heteroatoms independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkyl.
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 6 alkyl, C 1 -C 6 alkoxy or replaced by one or multiple non-adjacent heteroatom-interrupted C 1 -C 6 alkyl groups independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkyl.
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy, or replaced by one or more independently A C 1 -C 4 alkyl group selected from NR a , O, S with non-adjacent heteroatom intervals, wherein R a is H or C 1 -C 4 alkyl.
- R 2 , R 3 , R 4 , R 5 are the same or different, and are independently C 1 -C 4 alkyl.
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently phenyl, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, Methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, sec-butoxy or tert-butoxy.
- non-adjacent heteroatom means that there is a non-adjacent heteroatom between two carbon atoms, for example, two carbon atoms of the divalent linking group.
- an ethylene group interrupted by O can be represented as: -CH2 - O-CH2-.
- R 6 is usually H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy.
- R 6 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 Haloalkoxy. It is particularly preferred that R 6 is H or C 1 -C 4 alkyl.
- R can be H, chloro, bromo, methyl, ethyl, n - propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, methoxy, ethoxy, n-propoxy , isopropoxy, n-butoxy, sec-butoxy, tert-butoxy, hydroxymethyl, hydroxyethyl, hydroxy-n-propyl, hydroxyisopropyl, hydroxy-n-butyl, hydroxy-sec-butyl or hydroxy tert-butyl.
- L is a direct bond or a divalent linking group with 1-30 carbon atoms, for example with 1-28, 1-18, 1-12, 2-30, 2-28, 2-18 or 2 - a divalent linking group of 12 carbon atoms, for example a divalent linking group having 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12 carbon atoms.
- the divalent linking group has one or more non-adjacent heteroatoms independently selected from NR a , O, S, preferably O, wherein R a is H or C 1 -C 4 alkyl.
- L is a direct bond, C 1 -C 30 alkylene, C 1 -C 30 alkyleneoxy, non-adjacent by one or more independently selected from NR a , O, S A C 2 -C 30 alkylene group separated by heteroatoms, or a C 2 -C 30 alkylene group separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkyl.
- L is a direct bond, C 1 -C 18 alkylene, C 1 -C 18 alkyleneoxy, non-adjacent by one or more independently selected from NR a , O, S A C 2 -C 18 alkylene group interrupted by heteroatoms, or a C 2 -C 18 alkyleneoxy group separated by one or more non-adjacent heteroatoms independently selected from NR a , O, and S, wherein R a is H or C 1 -C 4 alkyl.
- L is a direct bond, C 1 -C 12 alkylene, C 1 -C 12 alkyleneoxy, non-adjacent by one or more independently selected from NR a , O, S A C 2 -C 12 alkylene group interrupted by heteroatoms, or a C 2 -C 12 alkyleneoxy group separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkyl.
- L is a direct bond, C 2 -C 12 alkylene, C 2 -C 12 alkyleneoxy, non-adjacent by one or more independently selected from NR a , O, S
- L is L 1 -OL 2
- L 1 and L 2 are independently 1-20, preferably 1-15, 1-12, 1-6, 2-20, 2-15, A divalent linking group of 2-12 or 2-6 carbon atoms.
- L 1 and L 2 independently of each other are C 1 -C 15 alkylene, preferably C 1 -C 10 alkylene, preferably C 1 -C 6 alkylene, such as methylene, ethylene, propylene group, butylene, pentylene or hexylene.
- L 1 is C 1 -C 6 alkylene, preferably C 2 -C 6 alkylene and L 2 is C 1 -C 6 alkylene, preferably C 1 -C 4 alkylene.
- the propylene group between the silicon and the benzene ring in the compound of formula (I) is -CH 2 -CH 2 -CH 2 - or -CH(CH 3 )-CH 2 -, preferably is -CH(CH 3 )-CH 2 -.
- each variable in the compound of formula (I) is defined as follows:
- n 1-30;
- L is a direct bond or a divalent linking group with 1-12 carbon atoms
- R 1 , R 2 , R 3 , R 4 , R 5 are the same or different, and are independently organic groups with 1-6 carbon atoms;
- R 6 is H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy.
- each variable in the compound of formula (I) is defined as follows:
- n 1-15;
- L is a direct bond or a divalent linking group with 1-12 carbon atoms
- R 1 , R 2 , R 3 , R 4 , R 5 are the same or different, and are independently organic groups with 1-6 carbon atoms;
- R 6 is H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy.
- each variable in the compound of formula (I) is defined as follows:
- n 1-30;
- R 1 is C 1 -C 12 alkyl or C 1 -C 12 alkoxy
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 alkoxy, and are independently represented by one or more C 2 -C 12 alkyl separated by non-adjacent heteroatoms selected from NR a , O, S, or C separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S 2 -C 12 alkoxy, and
- L is a direct bond, C 1 -C 30 alkylene, C 1 -C 30 alkyleneoxy, C 2 - separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S C 30 alkylene, or C 2 -C 30 alkyleneoxy interrupted by one or more non-adjacent heteroatoms independently selected from NR a , O, S,
- R a is H or C 1 -C 4 alkyl.
- the compound of formula (I) of the present invention satisfies at least one of the following definitions, preferably all:
- - m is 1-20, preferably 2-15;
- R 1 is C 1 -C 6 alkyl or C 1 -C 6 alkoxy; R 1 is preferably C 1 -C 4 alkyl or C 1 -C 4 alkoxy;
- R a is H or C 1 -C 4 alkyl; preferably, R 2 , R 3 , R 4 , R 5 , the same or different, and independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy, or one or more independently selected from NR a , O, S C 2 -C 4 alkyl interspersed by non-adjacent heteroatoms, wherein R a is H or C 1 -C 4 alkyl;
- -R 6 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy ;
- -L is C 2 -C 30 alkylene, C 2 -C 30 alkyleneoxy, C 2 -C 30 separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S Alkylene, or C 2 -C 30 alkyleneoxy interrupted by one or more non-adjacent heteroatoms independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkane base.
- n 1-20;
- R 1 is C 1 -C 12 alkyl or C 1 -C 12 alkoxy
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 alkoxy, and are independently represented by one or more C 2 -C 12 alkyl separated by non-adjacent heteroatoms selected from NR a , O, S, or C separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S 2 -C 12 alkoxy, wherein R a is H or C 1 -C 4 alkyl, and
- L is a direct bond, C 1 -C 30 alkylene, C 1 -C 30 alkyleneoxy, C 2 - separated by one or more non-adjacent heteroatoms independently selected from NR a , O, S C 30 alkylene, or C 2 -C 30 alkyleneoxy interrupted by one or more non-adjacent heteroatoms independently selected from NR a , O, S, wherein R a is H or C 1 -C 4 alkyl.
- each variable in the compound of formula (I) has the following definitions:
- n 1-9;
- R 1 is C 1 -C 4 alkyl or C 1 -C 4 alkoxy
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy, or one or more independently selected from NR a , C 1 -C 4 alkyl separated by non-adjacent heteroatoms of O, S, wherein R a is H or C 1 -C 4 alkyl;
- R 6 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; as well as
- L is L 1 -OL 2 , wherein L 1 and L 2 are independently a divalent linking group having 1-20, preferably 1-15 carbon atoms, more preferably C 1 -C 15 alkylene.
- n 1-12;
- R 1 is C 1 -C 4 alkyl or C 1 -C 4 alkoxy
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy, or one or more independently selected from NR a , C 1 -C 4 alkyl separated by non-adjacent heteroatoms of O, S, wherein R a is H or C 1 -C 4 alkyl;
- R 6 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy; as well as
- L is L 1 -OL 2 , wherein L 1 and L 2 are independently C 1 -C 15 alkylene.
- n 3-9;
- R 1 is C 1 -C 4 alkyl
- R 2 , R 3 , R 4 , and R 5 are the same or different, and are independently C 1 -C 4 alkyl;
- R 6 is H or C 1 -C 4 alkyl, especially H or ethyl, and
- L is L 1 -OL 2 , wherein L 1 and L 2 are independently C 1 -C 6 alkylene.
- the compound of formula (I) is one or more compounds selected from the group consisting of:
- L in the compound of formula (I) is L 1 -OL 2 , wherein L 1 and L 2 are as defined above, preferably C 1 -C 15 alkylene, more preferably C 1 -C 6 alkylene.
- the compound of formula (VI) can be prepared by the following steps:
- L is a divalent linking group having 1-20 , preferably 1-15 carbon atoms, more preferably C 1 -C 15 alkylene, especially C 1 -C 6 alkylene, and X is halogen, such as fluorine, chlorine, bromine or iodine,
- L 2 is a divalent linking group having 1-20, preferably 1-15 carbon atoms, more preferably a C 1 -C 15 alkylene group, especially a C 1 -C 6 alkylene group and R 6 is as above for the formula (I)
- X is halogen such as chlorine, bromine or iodine.
- step (1) the reaction of the phenolic hydroxyl group in the compound of formula (II) with the halogen in the compound of formula (III) belongs to the type of reaction known in the art, and the reaction produces hydrogen halide.
- the reaction is carried out in the presence of a basic catalyst.
- basic catalysts suitable for this reaction mention may be made of sodium hydride, sodium hydroxide, potassium hydroxide, triethylamine, potassium carbonate or any mixture thereof.
- the amount of catalyst used is also conventional.
- the molar ratio of the compound of formula (II) to the basic catalyst is 1:1-1:5, preferably 1:1-1:3.
- the reaction of the compound of formula (II) with the compound of formula (III) is usually carried out in a solvent.
- the solvent is also conducive to the precipitation of the product, that is, the compound of formula (IV).
- an organic solvent is usually used, preferably toluene, acetone, methyl ethyl ketone, toluene, tetrahydrofuran, cyclohexane, 1,4-dioxane, dichloromethane, acetonitrile or any mixture thereof.
- the amount of solvent used is also conventional, generally speaking, the amount of solvent used is 1.0-3 times the total weight of the compound of formula (II) and compound of formula (III).
- the compound of formula (II) and the compound of formula (III) are usually used in approximately equimolar amounts.
- the molar ratio of the compound of formula (II) to that of formula (III) is 1:0.75-1:1.5, or 1:1-1:1.3.
- the compound of formula (II) is usually dissolved in a solvent, a basic catalyst is added, and then the compound of formula (III) is added. After the addition is complete, the resulting reaction mixture is stirred evenly, and then the temperature is raised to 30-120° C., preferably to 40-70°C.
- the reaction is usually continued for 3-16 hours, preferably for 4-10 hours. Of course, the reaction is advantageously carried out with stirring.
- the compound of formula (IV) can be obtained through conventional post-treatment.
- the post-treatment usually includes extraction or washing (such as washing with water, after which water-absorbing compounds such as magnesium sulfate or sodium sulfate are advantageously used to remove water), filtration or centrifugation to remove solid impurities, rotary evaporation to remove solvents, and vacuum distillation to further remove solvents. If a higher purity product is to be obtained, the product can also be obtained by recrystallization or column chromatography.
- step (2) the reaction of the terminal hydroxyl group in the compound of formula (IV) with the halogen in the compound of formula (V) is known to produce hydrogen halide.
- the reaction is carried out in the presence of a catalyst.
- a catalyst As suitable catalysts for this reaction, mention may be made of sodium hydride, sodium hydroxide, potassium hydroxide, triethylamine, potassium carbonate or any mixture thereof.
- the amount of catalyst used is also conventional.
- the molar ratio of the compound of formula (IV) to the catalyst is 1:1-1:5, preferably 1:1-1:3.
- the reaction of the compound of formula (IV) with the compound of formula (V) is usually carried out in a solvent.
- the type of solvent there is no special limitation, as long as the compound of formula (IV), compound of formula (V) and corresponding catalyst can be dissolved and do not participate in the reaction between the compound of formula (IV) and compound of formula (V), preferably
- the solvent also facilitates the precipitation of the product, namely the compound of formula (VI).
- an organic solvent is usually used, preferably toluene, acetone, methyl ethyl ketone, toluene, tetrahydrofuran, cyclohexane, 1,4-dioxane, dichloromethane, acetonitrile or any mixture thereof.
- the amount of solvent used is also conventional, generally speaking, the amount of solvent used is 1.0-3 times the total weight of the compound of formula (IV) and compound of formula (V).
- the compound of formula (IV) and the compound of formula (V) are usually used in approximately equimolar amounts.
- the molar ratio of the compound of formula (IV) to the compound of formula (IV) is 1:0.75-1:1.5, or 1:1-1:1.2.
- the compound of formula (IV) and the catalyst are usually dissolved in a solvent, and then the solution of the compound of formula (V) in the solvent is added. After the addition, the temperature is raised to 40-100° C., preferably to 60-90° C.
- the reaction is usually continued for 3-24 hours, preferably for 4-10 hours. Of course, the reaction is advantageously carried out with stirring.
- the compound of formula (VI) can be obtained through conventional post-treatment.
- the post-treatment usually includes extraction or washing (such as washing with water, after which water-absorbing compounds such as magnesium sulfate or sodium sulfate are advantageously used to remove water), filtration or centrifugation to remove solid impurities, rotary evaporation to remove solvents, and vacuum distillation to further remove solvents. If a higher purity product is to be obtained, impurities can also be separated by recrystallization or column chromatography.
- the silicon atom of the compound of formula (VII) contains hydrogen atoms, therefore, the compound of formula (VII) can be called hydrogen-containing silicone oil.
- Addition reactions of silicon-bonded hydrogen atoms in compounds of formula (VII) to unsaturated carbon-carbon double bonds in compounds of formula (VI) are of the type known in the art.
- the reaction is carried out in the presence of a catalyst.
- a catalyst suitable for this reaction a Karstedt catalyst or a Speier catalyst is generally used.
- the amount of catalyst used is also conventional.
- the catalyst is used in an amount of 2-500 ppm, preferably 10-300 ppm.
- the reaction of the compound of formula (VI) with the compound of formula (VII) is usually carried out in a solvent.
- a solvent As the type of solvent, there is no particular limitation, as long as the compound of formula (VI), the compound of formula (VII) and the catalyst can be dissolved and it does not participate in the reaction between the compound of formula (VI) and the compound of formula (VII).
- the solvent also facilitates the precipitation of the product, the compound of formula (I).
- an organic solvent is usually used, preferably petroleum ether, dichloromethane, toluene, xylene or any mixture thereof.
- the amount of solvent used is also conventional, generally speaking, the amount of solvent used is 1.5-3 times the total weight of the compound of formula (VI) and compound of formula (VII).
- the compound of formula (VI) and the compound of formula (VII) are usually used in approximately equimolar amounts.
- the molar ratio of the compound of formula (VI) to the compound of formula (VII) is 1:0.75-1:1.5.
- the compound of formula (VI) and the catalyst are usually dissolved in a solvent and aged for a period of time, then contacted with the compound of formula (VII), and then heated to the reaction temperature for a period of time to obtain the compound of formula (I). Aging is usually carried out at elevated temperature, usually at 40-70°C. The aging time is usually 30-60 minutes.
- the reaction temperature between the compound of formula (VI) and the compound of formula (VII) is usually 80-110°C, preferably 85-100°C.
- the holding time of the reaction between the compound of formula (VI) and the compound of formula (VII) at the reaction temperature is usually 3-6 hours, preferably 3.5-5.5 hours.
- the reaction is advantageously carried out with stirring.
- the product of the compound of formula (I) can be obtained through conventional post-treatment.
- the post-treatment usually includes filtration or centrifugation to remove solid impurities, rotary evaporation to remove solvent, and vacuum distillation to further remove solvent. If a higher purity product is to be obtained, it can also be recrystallized.
- the compound of formula (I) of the present invention is a cationic photocurable monomer, which has fast polymerization rate, high conversion rate and can promote the polymerization of other cationic monomers.
- the photocurable material obtained after photocuring polymerization has mechanical properties, especially tensile properties. Good, excellent hydrophobic performance, anti-stain, anti-fingerprint, anti-chemical corrosion, strong anti-aging performance, good heat resistance.
- a photocurable composition comprising the compound of formula (I) of the present invention as a polymerizable monomer.
- the photocurable composition may also contain a cationic photoinitiator for ring-opening polymerization (a photoinitiator capable of initiating cationic polymerization) and optionally other photoinitiators containing cationic photocurable groups Groups such as vinyl ether double bonds, alicyclic epoxy, oxiranyl or oxetanyl monomers, oligomers, such as 3,4-epoxycyclohexylmethyl3,4- Epoxycyclohexyl carboxylate (E4221).
- a cationic photoinitiator for ring-opening polymerization a photoinitiator capable of initiating cationic polymerization
- other photoinitiators containing cationic photocurable groups Groups such as vinyl ether double bonds, alicyclic epoxy, oxiranyl or oxetanyl monomers, oli
- the amount of the compound of formula (I) of the present invention may be at least 0.5 mol%, at least 1 mol%, at least 2 mol%, for example 0.5-12 mol%, based on the total amount of polymerized monomers, Or 0.5-10mol%, or 1-10mol%.
- the photocurable composition of the present invention may be a photocurable coating composition, a photocurable ink composition, a photoresist composition, and the like. After the composition is cured, the obtained cured product has good tensile properties, excellent hydrophobic properties, stain resistance, fingerprint resistance, chemical corrosion resistance and strong aging resistance.
- iodonium salts and sulfonium salts are commonly used.
- the iodonium salt photoinitiator and the sulfonium salt photoinitiator have the following general formulas (A) and (B) respectively
- R a , R b , R c , R d , R e are each independently unsubstituted C 6 -C 10 aryl, or are selected from halogen, nitro, carbonyl, C 1 -C 12 alkyl, C 1 C 6 -C 10 aryl substituted by substituents of -C 12 alkoxy, phenylthio, phenyl and substituted phenyl, preferably phenyl or naphthyl, or selected from halogen, nitro, C 1 - C 6 alkyl and substituted phenyl or naphthyl substituted by substituents of phenyl, wherein the substituted phenyl contains one or more substituents selected from halogen, nitro, C 1 -C 6 alkyl and C 1 -C 6 alkoxy radicals; and
- Y and Z are non-nucleophilic anions, such as trifluoromethanesulfonate, BF 4 - , ClO 4 - , PF 6 - , AsF 6 - , SbF 6 - .
- a photoinitiator one or more selected from the group consisting of 4-(phenylthio)phenyl diphenylsulfonium hexafluorophosphate, 4-(phenylthio)phenyl ⁇ Diphenylsulfonium hexafluoroantimonate, bis(4-(diphenylsulfonium)phenyl)sulfide bishexafluorophosphate, bis(4-(diphenylsulfonium)phenyl)sulfide bishexafluorophosphate Fluoroantimonate, 10-(4-biphenyl)-2-isopropylthioxanthone-10-sulfonium hexafluorophosphate, 10-(4-biphenyl)-2-isopropylthioxanthone Keto-10-sulfonium hexafluoroantimonate, diphenyliodonium hexafluoroantimonate
- the photocurable composition of the present invention may also contain a sensitizer.
- a sensitizer mention may be made, for example, of 2-isopropylthioxanthone.
- the amount of photoinitiator used is conventional. Based on the total molar amount of polymerized monomers in the photocurable composition of the present invention, the content of the photoinitiator is generally 0.5-5 mol%, preferably 1-3 mol%.
- a photocurable material obtained from the photocurable composition of the present invention is obtained by photocuring the photocurable composition of the invention.
- the light-curing material has good mechanical properties, especially tensile properties, excellent hydrophobic properties, and has the advantages of anti-staining, anti-fingerprint, anti-chemical corrosion, strong anti-aging performance and good heat resistance.
- the compounds of formula (I) according to the invention can also be used in photocurable coatings, adhesives, inks and photoresists. Accordingly, the present invention also relates to the use of compounds of formula (I) in photocurable coatings, adhesives, inks and photoresists.
- the purpose of this example is to illustrate the photopolymerizable properties of the compounds of the present invention.
- the preparation process of photocurable composition is as follows:
- the preparation method of the photocurable composition containing compound 2-3 is consistent with that of compound 1.
- X 1 of the compounds 1, 2 and 3 of the present invention ie Eugenol-Si 3 , Eugenol-Si 6 and Eugenol-Si 9
- Table 1-3 The mole percentage X 1 of the compounds 1, 2 and 3 of the present invention (ie Eugenol-Si 3 , Eugenol-Si 6 and Eugenol-Si 9 ) in each photocomposition is shown in Table 1-3 below, and X 1 +X 2 as mentioned above Fixed at 100, X 3 and X 4 remain the same.
- a mixture of photoinitiator diphenyliodonium hexafluorophosphate (810) and 2-isopropylthioxanthone (ITX, sensitizer) in a molar ratio of 2:1 was used as the photoinitiation system, and real-time infrared
- the (RT-IR) method was used to test the photopolymerization kinetics of compounds 1-3, and to investigate the effects of each of them on the photopolymerization performance of E4221 at different contents.
- the vibration absorption peak of the COC of the three-membered oxygen heterocycle of the monomer E4221 used is located at 750 cm -1
- the vibration absorption peak of the COC of the four-membered oxygen heterocycle of compound 1-3 as a polymerized monomer is 980 cm -1 .
- the photocurable liquid composed of the precursor and the photoinitiator is evenly spread on the potassium bromide salt sheet (take a little photocurable liquid with a thin tube, click it on the potassium bromide salt sheet, and then spread it evenly), and irradiate it with a high-pressure mercury lamp Liquid sample 900s, in which the main emission wavelength of the mercury lamp is 365nm, and it has an optical fiber with a diameter of 5mm.
- the distance between one end of the optical fiber and the test sample is 10cm, and the radiation intensity is 20mW cm - 2 .
- the purpose of this example is to illustrate that the compound of the present invention can improve the surface hydrophobicity of the photocured film.
- a water contact angle test was performed.
- the surface hydrophobicity of the photocured film was characterized by a DSA25 water contact angle measuring instrument, and the test temperature was 25°C. At the same time, use the same method to prepare a blank E4221 cured film as a reference. The results for reference and compounds 1-3 are shown in Figure 7.
- the respective cured films of compounds 1-3 were prepared in exactly the same manner as described in Example 6. Then, the heat resistance of each photocured film was measured using a thermogravimetric analyzer (DTG-60AH Shimadzu Enterprise Management (China) Co., Ltd.). The test conditions are: under nitrogen protection, the temperature range is 25-700°C, and the heating rate is 10°C/min. At the same time, use the same method to prepare a blank E4221 cured film as a reference. The results are shown in Figure 8 and Table 4.
- the initial decomposition temperature (T 5% ) and the maximum thermal weight loss temperature of the cured film are the decomposition temperature (T max1 ) and the first stage of the fastest weight loss.
- the decomposition temperature (T max2 ) is obviously increased when the weight loss is the fastest in the second stage, so the heat resistance is obviously improved.
- the purpose of this example is to illustrate that the compounds of the present invention can improve the tensile properties of photocured films.
- the respective cured films of compounds 1-3 were prepared in exactly the same manner as described in Example 6. Then, the electronic universal testing machine (E44.304, Meters Industrial Systems (China) Co., Ltd.) was used to test the tensile properties of the light-cured film according to the international standard ISO 1184-1983 "Determination of Tensile Properties of Plastic Films". The test temperature is 25°C, the humidity is 60%, and the test speed is 1mm/min. At the same time, use the same method to prepare a blank E4221 cured film as a reference. The results are shown in Figure 9 and Table 5.
- E44.304 Meters Industrial Systems (China) Co., Ltd.
- the tensile strength of the pure E4221 light-cured film is 6.10 MPa, and the elongation at break is 1.7%.
- the tensile strength and elongation at break of the light-cured film gradually increased after the addition of compound 1-3 monomers.
- the compounds of the present invention are able to significantly improve the tensile properties of cured films.
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Abstract
La présente invention concerne un monomère oxétane contenant du silicium à base biologique d'eugénol, un procédé de préparation du monomère, une composition photodurcissable contenant le monomère, et un matériau photodurcissable préparé à partir de la composition photodurcissable. Le monomère oxétane contenant du silicium à base biologique d'eugénol selon la présente invention est bon en termes de vitesse de polymérisation et de taux de conversion et favorise la polymérisation d'autres monomères cationiques ; de plus, le matériau photodurcissable préparé à partir de celui-ci a de bonnes propriétés mécaniques et une bonne stabilité thermique, d'excellentes propriétés hydrophobes, et est résistant aux taches et résistant aux empreintes digitales.
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