WO2020253839A1 - Monomère d'oxétane contenant du polysilicium photodurcissable pouvant être mélangé ainsi que sa préparation et son application - Google Patents
Monomère d'oxétane contenant du polysilicium photodurcissable pouvant être mélangé ainsi que sa préparation et son application Download PDFInfo
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- WO2020253839A1 WO2020253839A1 PCT/CN2020/097175 CN2020097175W WO2020253839A1 WO 2020253839 A1 WO2020253839 A1 WO 2020253839A1 CN 2020097175 W CN2020097175 W CN 2020097175W WO 2020253839 A1 WO2020253839 A1 WO 2020253839A1
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- 239000000178 monomer Substances 0.000 title claims description 26
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title description 7
- 229920005591 polysilicon Polymers 0.000 title description 7
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 title description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 145
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000000016 photochemical curing Methods 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims description 53
- 229910052739 hydrogen Inorganic materials 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 27
- 239000003054 catalyst Substances 0.000 claims description 26
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 21
- 229910052736 halogen Inorganic materials 0.000 claims description 19
- 150000002367 halogens Chemical class 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- 229910052801 chlorine Inorganic materials 0.000 claims description 12
- 239000000460 chlorine Substances 0.000 claims description 12
- 230000008014 freezing Effects 0.000 claims description 12
- 238000007710 freezing Methods 0.000 claims description 12
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 12
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 11
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 125000005842 heteroatom Chemical group 0.000 claims description 10
- 229910052717 sulfur Inorganic materials 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 8
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052794 bromium Inorganic materials 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 6
- 125000004642 (C1-C12) alkoxy group Chemical group 0.000 claims description 5
- 125000004737 (C1-C6) haloalkoxy group Chemical group 0.000 claims description 5
- 125000000171 (C1-C6) haloalkyl group Chemical group 0.000 claims description 5
- 125000006577 C1-C6 hydroxyalkyl group Chemical group 0.000 claims description 5
- 125000004767 (C1-C4) haloalkoxy group Chemical group 0.000 claims description 4
- 125000004765 (C1-C4) haloalkyl group Chemical group 0.000 claims description 4
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 4
- 125000002853 C1-C4 hydroxyalkyl group Chemical group 0.000 claims description 4
- 239000011630 iodine Substances 0.000 claims description 4
- 229910052740 iodine Inorganic materials 0.000 claims description 4
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 claims description 3
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 3
- 238000001723 curing Methods 0.000 abstract description 27
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000003712 anti-aging effect Effects 0.000 abstract description 7
- 230000002209 hydrophobic effect Effects 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 7
- 230000003666 anti-fingerprint Effects 0.000 abstract description 5
- 238000010186 staining Methods 0.000 abstract description 4
- -1 Siloxane chain Chemical group 0.000 description 84
- 239000002904 solvent Substances 0.000 description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 14
- 239000000047 product Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000005481 NMR spectroscopy Methods 0.000 description 9
- 229940125904 compound 1 Drugs 0.000 description 9
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 125000003566 oxetanyl group Chemical group 0.000 description 8
- 229920002545 silicone oil Polymers 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 125000002091 cationic group Chemical group 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 239000005457 ice water Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- 238000004611 spectroscopical analysis Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000012467 final product Substances 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000012952 cationic photoinitiator Substances 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000012949 free radical photoinitiator Substances 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 3
- REAYFGLASQTHKB-UHFFFAOYSA-N [2-[3-(1H-pyrazol-4-yl)phenoxy]-6-(trifluoromethyl)pyridin-4-yl]methanamine Chemical compound N1N=CC(=C1)C=1C=C(OC2=NC(=CC(=C2)CN)C(F)(F)F)C=CC=1 REAYFGLASQTHKB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- UKLWXKWTXHHMFK-UHFFFAOYSA-N 3-(chloromethyl)-3-ethyloxetane Chemical compound CCC1(CCl)COC1 UKLWXKWTXHHMFK-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 238000004440 column chromatography Methods 0.000 description 2
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 239000012433 hydrogen halide Substances 0.000 description 2
- 229910000039 hydrogen halide Inorganic materials 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 2
- GVOISEJVFFIGQE-YCZSINBZSA-N n-[(1r,2s,5r)-5-[methyl(propan-2-yl)amino]-2-[(3s)-2-oxo-3-[[6-(trifluoromethyl)quinazolin-4-yl]amino]pyrrolidin-1-yl]cyclohexyl]acetamide Chemical compound CC(=O)N[C@@H]1C[C@H](N(C)C(C)C)CC[C@@H]1N1C(=O)[C@@H](NC=2C3=CC(=CC=C3N=CN=2)C(F)(F)F)CC1 GVOISEJVFFIGQE-YCZSINBZSA-N 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000002390 rotary evaporation Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000005292 vacuum distillation Methods 0.000 description 2
- VQVGJEIVVJBMCV-UHFFFAOYSA-N (4-octoxyphenyl)-phenyliodanium Chemical compound C1=CC(OCCCCCCCC)=CC=C1[I+]C1=CC=CC=C1 VQVGJEIVVJBMCV-UHFFFAOYSA-N 0.000 description 1
- 125000004643 (C1-C12) haloalkoxy group Chemical group 0.000 description 1
- 125000004641 (C1-C12) haloalkyl group Chemical group 0.000 description 1
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 description 1
- 125000005919 1,2,2-trimethylpropyl group Chemical group 0.000 description 1
- 125000005918 1,2-dimethylbutyl group Chemical group 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- 125000006218 1-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- 125000003542 3-methylbutan-2-yl group Chemical group [H]C([H])([H])C([H])(*)C([H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005917 3-methylpentyl group Chemical group 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 125000000041 C6-C10 aryl group Chemical group 0.000 description 1
- VYMSZQUUORIIEM-UHFFFAOYSA-N CC(C)([N](CCCOCCOC(C=C)=O)(N)N)[N](C(C)(C)O[N](CCCOCCOCC1COC1)(N)N)(N)N Chemical compound CC(C)([N](CCCOCCOC(C=C)=O)(N)N)[N](C(C)(C)O[N](CCCOCCOCC1COC1)(N)N)(N)N VYMSZQUUORIIEM-UHFFFAOYSA-N 0.000 description 1
- QAHUHMYOHCCLGJ-UHFFFAOYSA-N CC1=CC(C)=C(C(C(C=CC=C2)=C2OP(O)=O)=O)C(C)=C1 Chemical compound CC1=CC(C)=C(C(C(C=CC=C2)=C2OP(O)=O)=O)C(C)=C1 QAHUHMYOHCCLGJ-UHFFFAOYSA-N 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006003 dichloroethyl group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000004438 haloalkoxy group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- SWYHWLFHDVMLHO-UHFFFAOYSA-N oxetan-3-ylmethanol Chemical compound OCC1COC1 SWYHWLFHDVMLHO-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000006000 trichloroethyl group Chemical group 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D305/00—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms
- C07D305/02—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings
- C07D305/04—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
- C07F7/0872—Preparation and treatment thereof
- C07F7/0889—Reactions not involving the Si atom of the Si-O-Si sequence
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
Definitions
- the technical field of the present invention is the field of light-curable materials, and specifically relates to a polysilicon-containing oxetane monomer that can be mixed with light-curable.
- the invention also relates to a preparation method of the monomer, a photocurable composition containing the monomer and a photocurable material obtained by photocuring the photocurable composition.
- Ultraviolet curing refers to the process in which a photoinitiator is excited to become free radicals or cations under ultraviolet radiation, thereby initiating polymerization and curing reactions between monomers to form high molecular polymers.
- ultraviolet light curing technology Compared with thermal curing, ultraviolet light curing technology has the advantages of low environmental pollution, high film quality, and low energy consumption. Therefore, it is widely used in light-curing coatings, adhesives, and ink printing. Moreover, as the emission control of organic volatile components becomes stricter, UV curing technology will have a broader development prospect.
- the free radical light curing system has the advantages of fast curing speed and easy adjustment of performance, but also has the problems of serious shrinkage, low precision, and poor adhesion.
- the development of cationic curing system is relatively late. It has the advantages of small volume shrinkage, strong adhesion, wear resistance, high hardness, etc. It is especially suitable for laser rapid prototyping technology (stereolithography) that requires high precision and optical discs that require strong adhesion and wear resistance. It also has the disadvantages of slow curing speed, few types of oligomers and reactive diluents, high price, and difficult adjustment of cured product performance, which limits its practical application.
- Oxycycloalkane monomers belong to cationic light curing system monomers. Oxycycloalkane monomers are the main raw materials for high-end cationic light curing products. This system not only has low viscosity, low toxicity, and fast polymerization speed, but also has excellent thermal stability and mechanical properties. However, while UV curing has developed rapidly with the advantages of energy saving, environmental protection and high efficiency, people have proposed higher standards for the heat resistance, water repellency, surface stain resistance, corrosion resistance and fingerprint resistance of photocurable materials. Claim. Consumers are increasingly demanding the appearance of products.
- the surface is also required to have anti-fingerprint and stain-resistant performance, that is, it is not easy to leave fingerprints and other traces on the surface of the product during use, or it is easy to leave traces Be wiped clean.
- photocurable monomers that can meet the aforementioned requirements, have fast curing speed and easily adjustable performance, and there is no such photocurable monomer on the market, so development is urgently needed.
- the inventors of the present invention have conducted extensive and in-depth research on oxetane cationic photopolymerizable monomers in order to discover a new type of photocurable monomers.
- the body After curing, the body not only has the advantages of good tensile properties, excellent hydrophobic properties, anti-staining, anti-fingerprint, anti-chemical corrosion, and strong anti-aging properties, but also has fast curing speed and easy adjustment of performance.
- the present inventors discovered that the hybrid light-curable monomer compound obtained by combining the organosiloxane with the oxetane moiety and the acrylate group has the aforementioned advantages.
- one object of the present invention is to provide a hybrid photocurable polysilicon-containing oxetane monomer, which not only contains cationic photocurable oxetane groups, but also contains polysilicon Siloxane chain and free radical light-curable acrylate group.
- the monomer with such a structure not only has good tensile properties after light curing, excellent hydrophobic properties, anti-staining, anti-fingerprint, anti-chemical corrosion, strong anti-aging properties, good heat resistance, but also has fast curing speed and easy adjustment of performance. This broadens the application range of the light curing system.
- Another object of the present invention is to provide a method for preparing the hybrid light-curable polysilicon-containing oxetane monomer of the present invention.
- the preparation process is simple and feasible, the conditions are mild, the raw materials are readily available, and the price is low.
- Another object of the present invention is to provide a photocurable composition comprising the hybrid photocurable polysilicon-containing oxetane monomer according to the present invention.
- the last object of the present invention is to provide a photocurable material which is obtained by photocuring the photocurable composition of the present invention.
- n is an integer from 1-50;
- n is an integer of 1-10;
- z is an integer of 0-10;
- p is an integer of 1-6;
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 alkoxy or A C 1 -C 12 alkyl group with one or more heteroatoms independently selected from N, O and S inserted between two carbon atoms;
- R 8 is H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy; as well as
- R 9 is H or C 1 -C 12 alkyl.
- n is an integer of 1-15, preferably an integer of 1-12;
- n is an integer of 1-6, preferably an integer of 2-4;
- z is an integer of 1-6, preferably an integer of 0-3;
- p is an integer of 1-4, preferably an integer of 1-3;
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 6 alkyl, C 1 -C 6 alkoxy or A C 1 -C 6 alkyl group with one or more heteroatoms selected from NR b , O, and S inserted between two carbon atoms, wherein R b is H or C 1 -C 4 alkyl, preferably R 2 , R 3 , R 4 , R 5 , R 6 , R 7 are the same or different and are independently a phenyl group, a C 1 -C 4 alkyl group, a C 1 -C 4 alkoxy group, or one interposed between two carbon atoms Or more C 1 -C 4 alkyl groups independently selected from heteroatoms of NR b , O, and S, wherein R b is H or C 1 -C 4 alkyl; and/or
- R 8 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 haloalkoxy, Preferably H or C 1 -C 4 alkyl; and/or
- R 9 is H or C 1 -C 6 alkyl, preferably H or C 1 -C 4 alkyl.
- n is an integer from 1-12;
- n 2, 3 or 4;
- z 0, 1, 2 or 3;
- p 1, 2 or 3;
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently C 1 -C 4 alkyl groups; and/or
- R 8 is H or C 1 -C 4 alkyl
- R 9 is H or C 1 -C 4 alkyl, especially H or methyl.
- n, m, z, R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are as defined in any one of items 1-4,
- p and R 8 are as defined in any one of items 1 to 4, and X is halogen, such as fluorine, chlorine, bromine or iodine,
- n, m, z, p, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are defined in any one of items 1-4;
- R 9 is as defined in any one of items 1-4, and Y is halogen, such as fluorine, chlorine, bromine or iodine.
- the reaction of the compound of formula (II) with the compound of formula (III) is carried out in the presence of a basic catalyst.
- the basic catalyst is preferably sodium hydroxide, potassium hydroxide, triethylamine, potassium carbonate or any mixture thereof, more preferably ,
- the molar ratio of the compound of formula (II) to the basic catalyst is 1:1-1:5; and/or
- the molar ratio of the compound of formula (II) to the compound of formula (III) is 1:1-1:1.5; and/or
- the reaction between the compound of formula (II) and the compound of formula (III) is first carried out at the freezing temperature, and then the temperature is increased to 25-60°C, preferably to 35-60°C; preferably, the reaction at the freezing temperature proceeds to 0.5 -3 hours, preferably 0.5-1 hour; and/or, continue the reaction for 6-24 hours after raising the temperature, preferably 8-24 hours.
- the reaction between the compound of formula (IV) and the compound of formula (V) is carried out in the presence of a basic catalyst.
- the basic catalyst is preferably triethylamine, potassium carbonate or any mixture thereof, and more preferably, the compound of formula (IV) and the catalyst
- the molar ratio of is 1:1-1:3 (the example does not use a basic catalyst); and/or
- the molar ratio of the compound of formula (IV) to the compound of formula (IV) is 1:1-1:1.2; and/or
- the reaction between the compound of formula (IV) and the compound of formula (IV) is first carried out at freezing temperature, and then the temperature is raised to 25-60°C, preferably to 25-35°C; preferably, the reaction at the freezing point temperature is carried out 0.5 -3 hours, preferably 0.5-1 hour; and/or continue the reaction for 6-24 hours, preferably 8-12 hours after raising the temperature.
- a photocurable composition comprising the compound of formula (I) according to any one of items 1 to 4 as a polymerizable monomer.
- Fig. 1 is a graph showing the change of double bond conversion rate of compound 1 prepared in Example 1 with irradiation time.
- Example 2 is a graph showing the change of the oxetane ring conversion rate of Compound 1 prepared in Example 1 with the irradiation time.
- n is an integer from 1-50;
- n is an integer of 1-10;
- z is an integer of 0-10;
- p is an integer of 1-6;
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 alkoxy or A C 1 -C 12 alkyl group with one or more heteroatoms independently selected from N, O and S inserted between two carbon atoms;
- R 8 is H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy; as well as
- R 9 is H or C 1 -C 12 alkyl.
- the compound of formula (I) contains both a cationic photocurable oxetane structure, a radical photocurable acrylate structure part, and a polysiloxane structure part.
- the compound with such a structure has the advantages of both cationic curing and free radical curing. It not only has fast curing speed and easy adjustment of performance, but also has the advantages of small volume shrinkage, strong adhesion, wear resistance and high hardness. In addition, it has tensile properties after light curing. Good, excellent hydrophobic performance, stain resistance, fingerprint resistance, chemical corrosion resistance, strong anti-aging performance, and good heat resistance.
- C n -C m indicates that the number of carbon atoms contained in the group is nm.
- Halogen refers to fluorine, chlorine, bromine and iodine. In the present invention, it is preferable that the halogen includes fluorine, chlorine or a combination thereof.
- C n -C m alkyl group refers to a monovalent branched or unbranched saturated hydrocarbon group having nm, for example 1-12, preferably 1-6, particularly preferably 1-4 carbon atoms .
- C n -C m alkyl groups mention may be made of methyl, ethyl, propyl, 1-methylethyl, butyl, 1-methylpropyl, 2-methylpropyl, 1,1 -Dimethylethyl, pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 2,2-dimethylpropyl, 1-ethylpropyl, hexyl, 1,1-dimethylpropyl, 1,2-dimethylpropyl, 1-methylpentyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl, 1, 1-dimethylbutyl, 1,2-dimethylbutyl, 1,3-dimethylbutyl, 2,2-dimethylbutyl, 2,3-dimethylbutyl, 3, 3-dimethylbutyl, 1-ethylbutyl, 2-ethylbutyl, 1,1,2-trimethylpropyl, 1,2,2-trimethylpropyl,
- C 6 -C m aryl group refers to a monocyclic, bicyclic or multicyclic aromatic hydrocarbon group containing 6 to m carbon atoms, for example, 6 to 10 carbon atoms.
- C 6 -C m aryl groups mention may be made of phenyl, tolyl, ethylphenyl, propylphenyl, butylphenyl, xylyl, methyl ethyl phenyl, diethyl phenyl, Methyl ⁇ propylphenyl, naphthyl, etc.; preferably phenyl or naphthyl, especially phenyl.
- C n -C m alkoxy refers to a C n -C m alkyl group corresponding to any carbon atom of the open chain C n -C m alkane bonded with an oxygen atom as a linking group C n -C m alkyl, for example C 1 -C 12 alkoxy, more preferably C 1 -C 6 alkoxy, especially preferably C 1 -C 4 alkoxy.
- C n -C m alkoxy groups mention may be made of methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, 2-butoxy, tert-butoxy, pentoxy Group, isopentyloxy, hexyloxy and its isomers.
- C n -C m haloalkyl refers to a C n -C m alkyl group substituted with one or more identical or different halogen atoms, such as C 1 -C 12 haloalkyl, preferably C 1 -C 6 haloalkyl, C 1 -C 4 haloalkyl is particularly preferred.
- haloalkyl groups here, mention may be made of monochloromethyl, monochloroethyl, dichloroethyl, trichloroethyl, monochloropropyl, 1-chloromethylethyl, monochlorobutyl, 1 -Chloromethylpropyl, 2-chloromethylpropyl, 1,1-dichloromethylethyl, monochloropentyl, 1-chloromethylbutyl, 2-chloromethylbutyl, 3-chloro Methylbutyl, 2,2-dichloromethylpropyl, 1-chloroethylpropyl, monochlorohexyl, 1,1-dichloromethylpropyl, 1,2-dichloromethylpropyl, 1-chloromethylpentyl, 2-chloromethylpentyl, 3-chloromethylpentyl, 4-chloromethylpentyl, 1,1-dichloromethylbutyl, 1,
- C n -C m haloalkoxy refers to a C n -C m alkoxy group substituted by one or more identical or different halogen atoms, such as C 1 -C 12 haloalkoxy, more preferably C 1 -C 6 haloalkoxy, especially C 1 -C 4 haloalkoxy.
- C n -C m halogenated alkoxy groups mention may be made of monochloromethoxy, 2-chloroethoxy, 3-chloropropoxy, 2-chloroisopropoxy, 4-chloro-n-butoxy , 3-chloro-sec-butoxy, 2-chloro-tert-butoxy, 5-chloropentyloxy, 4-chloroisopentyloxy, 6-chlorohexyloxy and its isomers.
- hydroxyalkyl C n -C m alkyl means any carbon atom in the C n -C m alkyl corresponding open-chain alkanes C n -C m hydroxyl group bonded to a C n -C m Alkyl groups, such as C 1 -C 6 hydroxyalkyl groups, particularly preferably C 1 -C 4 hydroxyalkyl groups, such as hydroxymethyl, hydroxyethyl, hydroxypropyl, hydroxyisopropyl, hydroxybutyl, hydroxypentyl, Hydroxyhexyl and its isomers.
- n is usually an integer of 1-50, preferably an integer of 1-15, and particularly preferably an integer of 1-12, such as 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12.
- m is usually an integer of 1-10, preferably an integer of 1-6, particularly preferably an integer of 2-4, such as 2, 3, or 4.
- z is usually an integer of 0-10, preferably an integer of 1-6, and particularly preferably an integer of 0-3, such as 0, 1, 2 or 3.
- p is usually an integer of 1-6, preferably an integer of 1-4, particularly preferably an integer of 1-3, such as 1, 2, or 3.
- R 2 , R 3 , R 4 , R 5 , R 6 , R 7 are the same or different, and are usually independently C 6 -C 10 aryl, C 1 -C 12 alkyl, C 1 -C 12 alkoxy or C 1 -C 12 alkyl with one or more heteroatoms independently selected from NR b , O, S inserted between two carbon atoms, wherein R b is H or C 1- C 4 alkyl.
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different and are independently C 6 -C 10 aryl, C 1 -C 6 alkyl, C 1 -C 6 An alkoxy group or a C 1 -C 6 alkyl group with one or more heteroatoms selected from NR b , O, and S inserted between two carbon atoms, wherein R b is H or a C 1 -C 4 alkyl group.
- R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are the same or different, and are independently phenyl, C 1 -C 4 alkyl, C 1 -C 4 alkoxy or A C 1 -C 4 alkyl group with one or more heteroatoms independently selected from NR b , O, and S inserted between two carbon atoms, wherein R b is H or a C 1 -C 4 alkyl group.
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently C 1 -C 4 alkyl groups.
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently H, phenyl, methyl, ethyl, n-propyl, isopropyl, n-butyl, S-butyl, t-butyl, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, s-butoxy or t-butoxy.
- R 8 is usually H, halogen, C 1 -C 6 alkyl, C 1 -C 6 haloalkyl, C 1 -C 6 hydroxyalkyl, C 1 -C 6 alkoxy or C 1 -C 6 haloalkoxy.
- R 8 is H, halogen, C 1 -C 4 alkyl, C 1 -C 4 haloalkyl, C 1 -C 4 hydroxyalkyl, C 1 -C 4 alkoxy or C 1 -C 4 Haloalkoxy. It is particularly preferred that R 8 is H or C 1 -C 4 alkyl.
- R 8 can be H, chlorine, bromine, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, methoxy, ethoxy, n-propoxy , Isopropoxy, n-butoxy, sec-butoxy, tert-butoxy, hydroxymethyl, hydroxyethyl, hydroxy-n-propyl, hydroxyisopropyl, hydroxy-n-butyl, hydroxy-sec-butyl or hydroxy Tert-butyl.
- R 9 is usually H or C 1 -C 12 alkyl.
- R 9 is H or C 1 -C 6 alkyl. It is particularly preferred that R 9 is H or C 1 -C 4 alkyl.
- R 9 can be H, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, especially H or methyl.
- n is an integer of 1-12;
- n 2, 3 or 4;
- z 0, 1, 2 or 3;
- p 1, 2 or 3;
- R 2 , R 3 , R 4 , R 5 , R 6 , and R 7 are the same or different, and are independently C 1 -C 4 alkyl groups;
- R 8 is H or C 1 -C 4 alkyl
- R 9 is H or C 1 -C 4 alkyl, especially H or methyl.
- the compound of formula (I) is one or more compounds selected from the following group:
- n, m, z, R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are as defined for the compound of formula (I),
- p and R 8 are as defined for the compound of formula (I), and X is halogen, such as fluorine, chlorine, bromine or iodine,
- n, m, z, p, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are as defined for the compound of formula (I);
- R 9 is as defined for the compound of formula (I), and Y is halogen, such as fluorine, chlorine, bromine or iodine.
- step (1) the reaction between the terminal hydroxyl group in the compound of formula (II) and the halogen in the compound of formula (III) belongs to a type of reaction known in the art, and the reaction produces hydrogen halide.
- this reaction is carried out in the presence of a basic catalyst.
- a basic catalyst suitable for this reaction sodium hydroxide, potassium hydroxide, triethylamine, potassium carbonate or any mixtures thereof can be mentioned.
- the amount of catalyst is also conventional.
- the molar ratio of the compound of formula (II) to the basic catalyst is 1:1 to 1:5.
- the reaction of the compound of formula (II) with the compound of formula (III) is usually carried out in a solvent.
- the type of solvent is not particularly limited, as long as it can dissolve the compound of formula (II), the compound of formula (III) and the corresponding basic catalyst and does not participate in the reaction between the compound of formula (II) and the compound of formula (III).
- the solvent also facilitates the precipitation of the product, that is, the compound of formula (IV).
- an organic solvent is generally used, and toluene, acetone, methyl ethyl ketone, toluene, tetrahydrofuran, cyclohexane, 1,4-dioxane, dichloromethane, acetonitrile, or any mixtures thereof are preferably used.
- the amount of solvent is also conventional.
- the amount of solvent is 1.0 to 3 times the total weight of the compound of formula (II) and compound of formula (III).
- the amount of the compound of formula (II) and the compound of formula (III) is usually used in approximately equimolar amounts.
- the molar ratio of the compound of formula (II) to the compound of formula (III) is 1:1-1:1.2.
- the compound of formula (II) and a basic catalyst are dissolved in a solvent, the temperature is lowered to the freezing point (about 0°C), and then the compound of formula (III) is added.
- the resulting reaction mixture is first heated to the freezing temperature ( (Approximately 0°C) the reaction is stirred for 0.5-3 hours, preferably 0.5-1 hour, and then the temperature is increased to 25-60°C, preferably to 35-60°C. After the temperature is raised, the reaction is usually continued for 6-24 hours, preferably for 8-24 hours. Of course, the reaction is advantageously carried out under stirring. After the reaction is completed, the compound of formula (IV) can be obtained through conventional post-treatment.
- This post-treatment usually includes extraction or washing (for example, washing with water, which advantageously uses water-absorbing compounds such as magnesium sulfate or sodium sulfate to remove water), filtration or centrifugation to remove solid impurities, rotary evaporation to remove the solvent, and vacuum distillation to further remove the solvent. If you want to obtain a higher purity product, you can also recrystallization or column chromatography to separate impurities.
- extraction or washing for example, washing with water, which advantageously uses water-absorbing compounds such as magnesium sulfate or sodium sulfate to remove water
- filtration or centrifugation to remove solid impurities
- rotary evaporation to remove the solvent
- vacuum distillation to further remove the solvent.
- step (2) the reaction between the terminal hydroxyl group in the compound of formula (IV) and the acid halide in the compound of formula (V) belongs to a type of reaction known in the art, and the reaction produces hydrogen halide.
- the reaction is carried out in the presence of a catalyst.
- a catalyst suitable for this reaction triethylamine, potassium carbonate or any mixture thereof can be mentioned.
- the amount of catalyst is also conventional.
- the molar ratio of the compound of formula (IV) to the catalyst is 1:1 to 1:3.
- the reaction of the compound of formula (IV) with the compound of formula (V) is usually carried out in a solvent.
- the type of solvent is not particularly limited, as long as it can dissolve the compound of formula (IV), the compound of formula (V) and the corresponding catalyst and does not participate in the reaction between the compound of formula (IV) and the compound of formula (V), preferably
- the solvent also facilitates the precipitation of the product, that is, the compound of formula (I).
- an organic solvent is generally used, and toluene, acetone, methyl ethyl ketone, toluene, tetrahydrofuran, cyclohexane, 1,4-dioxane, dichloromethane, acetonitrile, or any mixtures thereof are preferably used.
- the amount of solvent is also conventional.
- the amount of solvent is 1.0 to 3 times the total weight of the compound of formula (IV) and compound of formula (V).
- the amount of the compound of formula (IV) and the compound of formula (V) is usually used in approximately equimolar amounts.
- the molar ratio of the compound of formula (IV) to the compound of formula (IV) is 1:1-1:1.2.
- the compound of formula (IV) and the catalyst are dissolved in a solvent, the temperature is lowered to the freezing point (about 0°C), and then a solution of the compound of formula (V) in the solvent is added.
- the resulting reaction mixture is stirred at freezing temperature (about 0°C) for 0.5-3 hours, preferably 0.5-1 hour, then the temperature is raised to 25-60°C, preferably to 25-35°C, and the reaction is continued for 6-24 hours, preferably 8-12 hours.
- the reaction is advantageously carried out under stirring.
- the compound of formula (I) can be obtained through conventional post-treatment.
- This post-treatment usually includes extraction or washing (for example, washing with water, which advantageously uses water-absorbing compounds such as magnesium sulfate or sodium sulfate to remove water), filtration or centrifugation to remove solid impurities, rotary evaporation to remove the solvent, and vacuum distillation to further remove the solvent. If you want to obtain a higher purity product, you can also recrystallization or column chromatography to separate impurities.
- the compound of formula (I) of the present invention is a polysilicon-containing oxetane monomer that can be mixed with light curing. It has a fast curing speed, good tensile properties after light curing, excellent hydrophobic properties, stain resistance, and Fingerprint, chemical corrosion resistance, strong anti-aging performance, good heat resistance.
- the synthetic method is simple and feasible, and the conditions are mild; the raw materials are easily available and the price is low.
- a photocurable composition comprising the compound of formula (I) of the present invention as a polymerizable monomer.
- the photocurable composition usually contains a cationic photoinitiator for ring-opening polymerization (a photoinitiator that can initiate cationic polymerization) and a free radical photoinitiator (which can initiate free radicals). Photoinitiator for polymerization).
- the cationic photoinitiator for ring-opening polymerization initiates the ring-opening polymerization of the oxetane structure in the compound of formula (I) under ultraviolet light irradiation, and the free radical photoinitiator initiates the formula (I) under ultraviolet light irradiation Polymerization of olefinic double bonds in compounds.
- the photocurable composition can also contain other monomers containing vinyl ether double bonds, alicyclic epoxy groups, oxiranyl groups or oxetanyl groups and other cationic photocurable groups, low Polymers, such as 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate (E4221).
- the photocurable composition of the present invention may be a photocurable coating composition, a photocurable ink composition, a photoresist composition, and the like. After the composition is cured, the resulting cured product has good tensile properties, excellent hydrophobic properties, anti-staining, anti-fingerprint, anti-chemical corrosion, and strong anti-aging properties.
- iodonium salts and sulfonium salts are commonly used.
- the iodonium salt photoinitiator and the sulfonium salt photoinitiator have the following general formulas (A) and (B), respectively
- R a , R b , R c , R d , R e are each independently an unsubstituted C 6 -C 10 aryl group, or are selected from halogen, nitro, carbonyl, C 1 -C 12 alkyl, C 1 C 6 -C 10 aryl substituted with substituents of -C 12 alkoxy, thiophenyl, phenyl and substituted phenyl, preferably phenyl or naphthyl, or selected from halogen, nitro, C 1- C 6 alkyl and substituted phenyl substituted phenyl or naphthyl, wherein the substituted phenyl contains one or more substituents selected from halogen, nitro, C 1 -C 6 alkyl and C 1- C 6 alkoxy group; and
- Y and Z are non-nucleophilic anions, such as trifluoromethanesulfonate, BF 4 — , ClO 4 — , PF 6 — , AsF 6 — , SbF 6 — .
- one or more selected from the following group can be used: 4-(phenylthio)phenyl ⁇ diphenylsulfonium hexafluorophosphate, 4-(phenylthio)phenyl ⁇ Diphenylsulfonium hexafluoroantimonate, bis(4-(diphenylsulfonium)phenyl)sulfide bishexafluorophosphate, bis(4-(diphenylsulfonium)phenyl)sulfide bishexa Fluorantimonate, 10-(4-biphenyl)-2-isopropylthioxanthone-10-sulfonium hexafluorophosphate, 10-(4-biphenyl)-2-isopropylthioxanthone Ketone-10-sulfonium hexafluoroantimonate, diphenyliodonium hexafluorophosphate (8
- free radical photoinitiators there are usually 2-isopropylthioxanthone (ITX), 2-hydroxy-2-methyl-1-phenylacetone (1173), 1-hydroxycyclohexylphenyl ketone ( 184), 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone (907), 2,4,6-trimethylbenzyl Acyl-diphenylphosphine oxide (TPO), 2,4,6-trimethylbenzoylphenyl phosphonate (TPO-L), 2-dimethylamino-2-benzyl-1-[4 -(4-morpholinyl)phenyl]-1-butanone (IHT-PI 910), 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1 -Acetone (659), methyl benzoylformate (MBF), etc.
- IHT-PI 910 2-isopropylthioxanthone
- the amount of photoinitiator is conventional.
- the content of the cationic photoinitiator for ring-opening polymerization is usually 0.5-5%, preferably 1-3%.
- the content of the free radical photoinitiator is usually 0.5-3%, preferably 1-2%.
- a photocurable material is provided, which is obtained by photocuring the photocurable composition of the present invention. Because the photocurable material contains the compound of formula (I) of the present invention as a photocurable monomer, the curing speed is fast, the performance is easy to adjust, and after curing, it has good tensile properties, excellent hydrophobic properties, stain resistance, and fingerprint resistance. , Anti-chemical corrosion, strong anti-aging performance, good heat resistance.
- Example 1 was repeated, but 22 mmol of acryloyl chloride was replaced by 22 mmol of methacryloyl chloride.
- the resulting final product was characterized by hydrogen nuclear magnetic spectroscopy and silicon spectroscopy and identified as compound 2, sometimes referred to as BODSi-2 hereinafter.
- the purpose of this example is to illustrate the photopolymerization properties of the compounds of the present invention.
- the asymmetric deformation vibration absorption peak of the COC bond of the oxetanyl group is located at 980 cm -1
- Fig. 1 is a graph showing the change of double bond conversion rate with irradiation time
- Fig. 2 is a graph showing the change of double bond conversion rate with irradiation time
- each of the compounds 2-6 has an initiation system with four concentrations of 0.75% 810+0.38% ITX, 1.50% 810+0.75% ITX, 3.00% 810+1.50% ITX, and 4.50% 810+2.25% ITX.
- the conversion rate of the quaternary oxygen heterocyclic ring of the monomer will increase with the increase of the initiator concentration, and the maximum conversion rate of the quaternary oxygen heterocyclic ring of the monomer has reached at least 60%.
- the maximum conversion rate of carbon double bonds reached at least 75%.
- the respective concentrations of 810 and ITX are based on the respective weight of compound 1-6. Therefore, the compound of the present invention has good photopolymerization performance.
- the purpose of this example is to show that the compound of the present invention can improve the surface hydrophobicity of the photocurable film.
- Compounds 1-6 were each mixed with 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate (E4221) epoxy monomer in a mass ratio of 15:85, based on E4221 and compound 1
- the total weight of each of -6 is 3.0wt% 810 and 1.5wt% ITX as initiators, and they are mixed uniformly to obtain a photosensitive liquid.
- OCA20 German dataphysics company
- the purpose of this example is to show that the compound of the present invention can improve the tensile properties of the photocurable film.
- the cured film of compound 1-6 was prepared in exactly the same way as described in Example 8. Then, an Instron-1211 electronic tensile machine (Instron-1211, Instron, USA) was used to test the tensile properties of the light-cured film at a test temperature of 25°C and a test speed of 50 mm/min. At the same time, use the same method to prepare a blank E4221 cured film as a reference.
- Instron-1211 electronic tensile machine Instron-1211, Instron, USA
- the tensile strength of the pure E4221 light-cured film is 7.02MPa, and the elongation at break is 7.5%; and after adding 15% of compound 1, the tensile strength of the cured film of E4221 reaches 11.9MPa and the elongation at break is 15.7. %.
- the tensile strength of the cured film obtained by additionally adding one of the compounds 2-6 all exceeded 11.0 MPa, and the elongation at break all exceeded 15.2%. Therefore, the compound of the present invention can significantly improve the tensile properties of the cured film.
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Abstract
La présente invention concerne un composé représenté par la formule (I), les variables n, m, z, p, R2, R3, R4, R5, R6, R7, R8 et R9 étant telles que définies dans la description. Le composé représenté par la formule (I) non seulement présente, après photodurcissement, de bonnes propriétés de traction, d'excellentes propriétés hydrophobes, et des propriétés anti-coloration, anti-empreintes digitales et anti-corrosion chimique, de bonnes propriétés anti-vieillissement, et une bonne résistance à la chaleur, mais il présente également une vitesse de durcissement rapide et un ajustement de performance aisé, élargissant ainsi l'éventail d'application d'un système photodurcissable. La présente invention concerne en outre la préparation du composé représenté par la formule (I), une composition photodurcissable contenant le composé représenté par la formule (I), et un matériau photodurci obtenu par photopolymérisation de la composition photodurcissable.
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US5463084A (en) * | 1992-02-18 | 1995-10-31 | Rensselaer Polytechnic Institute | Photocurable silicone oxetanes |
US5747172A (en) * | 1995-08-30 | 1998-05-05 | General Electric Company | Ultraviolet and electron beam curable propenyl-ether silicone release compositions |
JP2002030268A (ja) * | 2000-07-14 | 2002-01-31 | Kansai Paint Co Ltd | 内装材の表面汚染防止方法 |
WO2004094435A2 (fr) * | 2003-04-16 | 2004-11-04 | Rensselaer Polytechnic Institute | Monomeres et oligomeres de siloxane |
CN101448917B (zh) * | 2006-04-10 | 2013-04-10 | 新日本石油株式会社 | 具有改进的粘附性的液晶组合物、包含该组合物的液晶薄膜和配备有该薄膜的液晶显示器件 |
US20160060398A1 (en) * | 2014-09-02 | 2016-03-03 | Solip Tech Co., Ltd. | Method of manufacturing cationic polymerization resin with enhanced uv stability and cationic polymerization resin manufactured by the same |
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FR2805273B1 (fr) * | 2000-02-18 | 2006-08-11 | Rhodia Chimie Sa | Traitement de surface de materiau plastique avec une composition a fonctions reactives polymerisable et/ou reticulable |
CN107621752B (zh) * | 2016-07-13 | 2019-11-12 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
CN106279241A (zh) * | 2016-07-16 | 2017-01-04 | 北京化工大学 | 一种含硅氧烷结构的单官能度丙烯酸酯单体及其制备方法 |
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US5463084A (en) * | 1992-02-18 | 1995-10-31 | Rensselaer Polytechnic Institute | Photocurable silicone oxetanes |
US5747172A (en) * | 1995-08-30 | 1998-05-05 | General Electric Company | Ultraviolet and electron beam curable propenyl-ether silicone release compositions |
JP2002030268A (ja) * | 2000-07-14 | 2002-01-31 | Kansai Paint Co Ltd | 内装材の表面汚染防止方法 |
WO2004094435A2 (fr) * | 2003-04-16 | 2004-11-04 | Rensselaer Polytechnic Institute | Monomeres et oligomeres de siloxane |
CN101448917B (zh) * | 2006-04-10 | 2013-04-10 | 新日本石油株式会社 | 具有改进的粘附性的液晶组合物、包含该组合物的液晶薄膜和配备有该薄膜的液晶显示器件 |
US20160060398A1 (en) * | 2014-09-02 | 2016-03-03 | Solip Tech Co., Ltd. | Method of manufacturing cationic polymerization resin with enhanced uv stability and cationic polymerization resin manufactured by the same |
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