WO2022267201A1 - 显示面板及显示面板制作方法 - Google Patents

显示面板及显示面板制作方法 Download PDF

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Publication number
WO2022267201A1
WO2022267201A1 PCT/CN2021/112718 CN2021112718W WO2022267201A1 WO 2022267201 A1 WO2022267201 A1 WO 2022267201A1 CN 2021112718 W CN2021112718 W CN 2021112718W WO 2022267201 A1 WO2022267201 A1 WO 2022267201A1
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Prior art keywords
light
resistance
layer
color
refractive index
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PCT/CN2021/112718
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English (en)
French (fr)
Inventor
翁德志
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Wuhan China Star Optoelectronics Technology Co Ltd
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US17/608,143 priority Critical patent/US12089469B2/en
Publication of WO2022267201A1 publication Critical patent/WO2022267201A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present application relates to the field of display technology, in particular to a display panel and a method for manufacturing the display panel.
  • the polarizer can effectively reduce the reflectivity of the panel under strong light, but loses nearly 58% of the light output, which greatly increases the light-emitting burden of the diode for the organic light-emitting diode (OLED) display panel, resulting in its The lifespan is reduced; on the other hand, the thickness of the polarizer is large and the material is brittle, which is not conducive to the development of dynamic bending products. Therefore, in order to develop dynamic bending products based on OLED display technology, new materials, new technologies and new processes must be introduced to replace polarizers.
  • the use of color filters to replace polarizers is classified as POL-less technology, which can not only reduce the thickness of the polarizing functional layer from nearly 100 microns to less than 5 microns, but also reduce the thickness of the display panel. Light yield increased from 42% to 60%.
  • the POL-less technology based on color film is considered to be one of the key technologies to realize the development of dynamic bending products.
  • the use of a color film to replace the polarizer has many advantages above, it will lead to an increase in the overall reflectivity of the display panel, making the reflectivity reach more than 6%, thereby reducing the display contrast of the display panel.
  • the current display panel based on the non-polarizer technology has a technical problem of high reflectivity.
  • the present application provides a display panel and a manufacturing method of the display panel, which are used to alleviate the technical problem of high reflectivity existing in the current display panel based on the non-polarizer technology.
  • the application provides a display panel, which includes:
  • an encapsulation layer disposed on the light-emitting surface of the light-emitting layer
  • a color filter layer disposed on the encapsulation layer, the color filter layer includes a plurality of color resists and a light shielding member located between the color resists, the refractive index of the color resists is n;
  • a light-transmitting layer disposed on the color filter layer and located on a side of the color filter layer away from the encapsulation layer;
  • the thickness d of the color resistance and the refractive index n of the color resistance satisfy the following relationship:
  • K is a constant
  • ⁇ is the wavelength of light corresponding to the color of the color resist.
  • the color resistance includes a red resistance, the refractive index of the red resistance is n 1 , and the thickness of the red resistance is d 1 ;
  • the thickness d 1 of the red resistance and the refractive index n 1 of the red resistance satisfy the following relationship:
  • ⁇ 1 is the wavelength of red light.
  • the refractive index n 1 of the red color barrier is 1.52.
  • the color resistance includes a green resistance, the refractive index of the green resistance is n 2 , and the thickness of the green resistance is d 2 ;
  • the thickness d2 of the green resistance and the refractive index n2 of the green resistance satisfy the following relationship:
  • ⁇ 2 is the wavelength of green light.
  • the refractive index n 2 of the green resist is 1.52.
  • the green resist comprises a mixture of 2-(2-butoxyethoxy) ethyl (alcohol) acetate and an exposure resin.
  • the color resistance includes a blue resistance, the refractive index of the blue resistance is n 3 , and the thickness of the blue resistance is d 3 ;
  • the thickness d3 of the blue resistance and the refractive index n3 of the blue resistance satisfy the following relationship:
  • ⁇ 3 is the wavelength of blue light.
  • the refractive index n 3 of the blue resist is 1.52.
  • the size of the side of the color resistance close to the transparent layer is larger than the size of the side of the color resistance close to the encapsulation layer.
  • the size of the color resistance gradually decreases from a side close to the light-transmitting layer to a side close to the encapsulation layer.
  • the encapsulation layer includes a first encapsulation layer close to the color resist, the refraction index of the first encapsulation layer is n 4 , and the refraction index of the transparent layer is n 5 ;
  • the refractive index n of the color resist, the refractive index n 4 of the first encapsulation layer, and the refractive index n 5 of the light-transmitting layer satisfy the following relationship:
  • n 2 n 4 .n 5 .
  • the encapsulation layer further includes: a third encapsulation layer disposed on the light-emitting layer, a second encapsulation layer disposed on the third encapsulation layer, and the first encapsulation layer is set on the second encapsulation layer.
  • the first encapsulation layer and the third encapsulation layer include an inorganic encapsulation layer, and the second encapsulation layer includes an organic encapsulation layer.
  • the light-emitting layer includes a plurality of light-emitting units, and the color resists are arranged in one-to-one correspondence with the light-emitting units.
  • the present application also provides a method for manufacturing a display panel, which includes:
  • a color filter layer comprising a plurality of color resists and a light-shielding member between the color resists on the encapsulation layer, so that the thickness d of the color resists and the refractive index n of the color resists satisfy:
  • K is a constant
  • ⁇ is the wavelength of light corresponding to the color of the color resistance
  • a light-transmitting layer is fabricated on the color filter layer.
  • the step of manufacturing a color filter layer comprising a plurality of color resists and a light-shielding member between the color resists on the encapsulation layer further includes:
  • the multiple color resistances include red resistance, green resistance and blue resistance
  • the step of manufacturing the color resistance in the opening also includes:
  • ⁇ 1 is the wavelength of red light
  • ⁇ 2 is the wavelength of green light
  • ⁇ 3 is the wavelength of blue light.
  • the encapsulation layer 113 includes: a third encapsulation layer disposed on the light-emitting layer, a second encapsulation layer disposed on the third encapsulation layer, and a second encapsulation layer disposed on the The first encapsulation layer on the second encapsulation layer.
  • the refractive index of the first encapsulation layer is n 4
  • the refractive index of the light-transmitting layer is n 5 ;
  • the refractive index n of the color resist, the refractive index n 4 of the first encapsulation layer, and the refractive index n 5 of the light-transmitting layer satisfy the following relationship:
  • n 2 n 4 .n 5 .
  • the present application also provides a display panel, which includes:
  • an encapsulation layer disposed on the light-emitting surface of the light-emitting layer
  • a light-transmitting layer disposed on the color filter layer and located on a side of the color filter layer away from the encapsulation layer;
  • the thickness d 1 of the red resistance and the refractive index n 1 of the red resistance satisfy the following relationship:
  • K is a constant, and ⁇ 1 is the wavelength of red light
  • the thickness d2 of the green resistance and the refractive index n2 of the green resistance satisfy the following relationship:
  • K is a constant, and ⁇ 2 is the wavelength of green light
  • the thickness d3 of the blue resistance and the refractive index n3 of the blue resistance satisfy the following relationship:
  • K is a constant
  • ⁇ 3 is the wavelength of blue light
  • the present application provides a display panel and a method for manufacturing the display panel.
  • the display panel includes a light-emitting layer, an encapsulation layer disposed on the light-emitting layer, a color filter layer disposed on the encapsulation layer, and a transparent light-transmitting layer disposed on the color filter layer.
  • the optical layer, the color filter layer includes a color resist and a light-shielding member located between the color resist, and the thickness d of the color resist and its refractive index n satisfy Where K is a constant, and ⁇ is the wavelength of light corresponding to the color of the color resist.
  • This application designs the thickness of the color resistance according to the refractive index of the color resistance, so that when the light passes through the color resistance, the reflected light emitted from the upper and lower interfaces of the color resistance will interfere and destruct, thereby reducing the light emitted from the surface of the color resistance.
  • the amount of reflected light thereby reducing the reflectivity of the display panel and improving its display contrast.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a partial structure of the light emitting layer and the layer above the light emitting layer of the display panel shown in FIG. 1 .
  • Embodiments of the present application provide a display panel and a method for manufacturing the display panel.
  • the display panel includes a light-emitting layer, an encapsulation layer disposed on the light-emitting layer, a color filter layer disposed on the encapsulation layer, and a light-emitting layer disposed on the encapsulation layer.
  • the light-transmitting layer on the color filter layer, the color filter layer includes a color resistance and a light shielding member located between the color resistance, the thickness d of the color resistance and its refractive index n satisfy Where K is a constant, and ⁇ is the wavelength of light corresponding to the color of the color resist.
  • the thickness of the color resistance is designed according to the refractive index of the color resistance, so that when the light passes through the color resistance, the reflected light emitted from the upper and lower interfaces of the color resistance will have interference and destructive effects, thereby reducing the thickness of the color resistance caused by the color resistance.
  • the amount of reflected light emitted from the surface reduces the reflectivity of the display panel and improves its display contrast.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application
  • FIG. 2 is a schematic partial structural diagram of the light-emitting layer and the layers above the light-emitting layer of the display panel shown in FIG.
  • the display panel includes: a light-emitting layer L, an encapsulation layer 113 disposed on the light-emitting surface of the light-emitting layer L, a color filter layer 114 disposed on the encapsulation layer 113, and a The transparent layer 115 on the color filter layer 114 ; wherein, the encapsulation layer 113 and the transparent layer 115 are disposed on opposite sides of the color filter layer 114 respectively.
  • a plurality of light-emitting units are arranged in the light-emitting layer L, and the light emitted by the light-emitting units passes through the encapsulation layer 113 , the color filter layer 114 and the light-transmitting layer 115 sequentially and exits the display panel.
  • the encapsulation layer 113 is a light-transmitting structure, and the encapsulation layer 113 includes: a third encapsulation layer 1133 disposed on the light emitting layer L, a second encapsulation layer 1133 disposed on the third encapsulation layer 1133 layer 1132 , and the first encapsulation layer 1131 disposed on the second encapsulation layer 1132 , the color filter layer 114 is disposed on the first encapsulation layer 1131 .
  • the first encapsulation layer 1131 and the third encapsulation layer 1133 are inorganic encapsulation layers, which can be made by a chemical vapor deposition process, for example, can be a silicon nitride film deposited by a chemical vapor deposition process layer; the second encapsulation layer 1132 is an organic encapsulation layer, which can be made by coating and other processes.
  • the color filter layer 114 is provided with a plurality of color resists, and a light shielding member BM is disposed between adjacent color resists; wherein, the color resists only allow light of a specific wavelength to pass through, for example, the Light within a specific wavelength range emitted by the light-emitting unit will be emitted through the color resist; the light-shielding member BM is a non-light-transmitting structure, and neither the light emitted by the light-emitting unit nor the natural light from the outside can penetrate the light-shielding Component BM.
  • the color resistance can be divided into red resistance C1, green resistance C2, and blue resistance C3, and the red resistance C1 only allows red light wavelength range
  • the green light barrier C2 only allows light in the green wavelength range to penetrate
  • the blue light barrier C3 only allows light in the blue wavelength range to penetrate.
  • the light emitting units located in the light emitting layer L also include red light emitting units, green light emitting units and blue light emitting units.
  • the red light emitting unit is set up and down corresponding to the red resistor C1, the light emitted by the red light emitting unit passes through the red resistor C1 and exits the display panel; the green light emitting unit is vertically connected to the green resistor C2 Correspondingly arranged, the light emitted by the green light-emitting unit is emitted from the display panel through the green resistor C2;
  • the blue resist C3 is projected out of the display panel.
  • the color resistance is a light-transmitting structure, it has a refractive index n.
  • the thickness d of the color resistance and the refractive index n of the color resistance satisfy the following relationship:
  • ⁇ is the wavelength of light corresponding to the color of the color resistance
  • K is a constant determined according to the production process.
  • the production process of the color resistance and the production process of other corresponding structures in the panel are comprehensively considered.
  • the value of K can be chosen to be 8.
  • this embodiment considers a scheme of interfering and destructing the reflected light generated by the upper and lower interfaces of the color resist.
  • the condition for interference and destructive interference of reflected light from the upper and lower interfaces of the color resistance is that the following interference equation needs to be satisfied between the thickness d of the color resistance and the refractive index n of the color resistance:
  • K is a constant
  • ⁇ is the wavelength of light corresponding to the color of the color resist.
  • the thickness d of the color resistance is set as: Bringing this thickness value into the above interference equation can realize the establishment of the equation, that is, the color resistance in the display panel provided by the embodiment of the present application can realize the interference and destructive effect of the reflected light generated by the upper and lower interfaces of the color resistance, thereby reducing The amount of reflected light emitted from the surface of the color resist is reduced, thereby reducing the reflectivity of the display panel and improving its display contrast.
  • the upper and lower film layers in contact with the color resist are respectively: the first encapsulation layer 1131 and the light-transmitting layer 115 .
  • the transmission path of external light is: from the transparent layer 115 to the color resist, and then to the first encapsulation layer 1131 .
  • the refractive index of the first encapsulation layer is n 4
  • the refractive index of the transparent layer is n 5
  • the incident angle of external light to the color resist is ⁇
  • the external light is between the color resist and the transparent
  • the reflectance at the interface between the optical layers 115 is R 1
  • the reflectance at the interface between the color resist and the first encapsulation layer 1131 is R 2
  • the total reflectance of natural light on the above two interfaces is R
  • the minimum reflectance R min of the color resistance in the display panel can be obtained as:
  • the refractive index of the red resist C1 is n 1
  • the thickness of the red resist C1 is d 1 ;
  • the thickness d 1 of the red resistance and the refractive index n 1 of the red resistance satisfy the following relationship:
  • ⁇ 1 is the wavelength of red light
  • the refractive index n 1 of the red light barrier C1 is 1.52. According to these data and the above relational formula, the minimum reflectance R min of the red light barrier C1 to light provided by this embodiment can be obtained to be approximately 0.5%.
  • the refractive index of the green resist C2 is n 2
  • the thickness of the green resist C2 is d 2 ;
  • the thickness d2 of the green resistance and the refractive index n2 of the green resistance satisfy the following relationship:
  • ⁇ 2 is the wavelength of green light.
  • the green resist C2 comprises a mixture of 2-( 2 -butoxyethoxy) ethyl (alcohol) acetate and exposure resin, its refractive index n is 1.52, and the wavelength range of green light is It is 500nm to 560nm. According to these data and the above relational formula, it can be obtained that the thickness d 2 of the green resist C2 provided in this embodiment is about 1.5 microns, and the minimum reflectance R min of the green resist C2 to light is about 0.8%.
  • the refractive index of the blue resist C3 is n 3
  • the thickness of the blue resist C3 is d 3 ;
  • the thickness d3 of the blue resistance and the refractive index n3 of the blue resistance satisfy the following relationship:
  • ⁇ 3 is the wavelength of blue light
  • the refractive index n 3 of the blue barrier C3 is 1.52. According to these data and the above relational formula, the minimum reflectance R min of the blue barrier C3 to light can be obtained in this embodiment About 0.5%.
  • the overall reflectance of the display panel provided by the embodiment of the present application to light is reduced to about 5% after calculation, compared with the overall reflectance of the display panel in a common design of 6%.
  • the display panel provided by the present application reduces the reflectivity, which is beneficial to improve the display contrast.
  • the refractive index n of the color resist, the refractive index n 4 of the first encapsulation layer 1131 , and the refractive index n 5 of the transparent layer 115 satisfy the following relationship:
  • n 2 n 4 .n 5 ;
  • the size of the side of the color resistance close to the transparent layer 115 is set to be larger than the size of the side of the color resistance close to the first encapsulation layer 1131 size of.
  • the display panel provided in this embodiment further includes: a base substrate 101, a buffer layer 102 disposed on the base substrate 101, a semiconductor layer 103 disposed on the buffer layer 102, and a layer covering the semiconductor layer.
  • the light emitting layer L is disposed on the flat layer 108 .
  • the base substrate 101 may be a composite structure composed of a first polyimide layer, an intermediate buffer layer and a second polyimide layer.
  • the source and drain electrodes 107 are connected to opposite ends of the semiconductor layer 103 through the via holes on the gate insulating layer 104 and the interlayer insulating layer 106, the semiconductor layer 103, the gate 105 and The source and drain 107 constitute a thin film transistor device.
  • the light-emitting layer L includes: an anode 109 disposed on the planar layer 108, a pixel definition layer 110 disposed on the planar layer 108 and having an opening corresponding to the anode 109, disposed on the pixel
  • the light-emitting functional layer 111 in the opening of the definition layer 110 the cathode 112 disposed on the light-emitting functional layer 111 and the pixel definition layer 110 .
  • the anode 109 is electrically connected to the source and drain 107 through the via hole on the planar layer 108, and receives the driving signal transmitted by the source and drain 107.
  • the light-emitting functional layer 111 includes a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer, so as to realize the separation of the holes generated by the anode 109 and the electrons generated by the cathode 112. injected, and combined in the organic light-emitting layer to emit light.
  • the encapsulation layer 113 is disposed on the cathode 112 .
  • the display panel provided by the embodiment of the present application includes: a light-emitting layer, an encapsulation layer disposed on the light-emitting layer, a color filter layer disposed on the encapsulation layer, and a color filter layer disposed on the color filter layer.
  • a light-transmitting layer on the layer, the color filter layer includes a color resistance and a light shielding member located between the color resistance, the thickness d of the color resistance and its refractive index n satisfy Where K is a constant, and ⁇ is the wavelength of light corresponding to the color of the color resist.
  • the thickness of the color resistance is designed according to the refractive index of the color resistance, so that when the light passes through the color resistance, the reflected light emitted from the upper and lower interfaces of the color resistance will have interference and destructive effects, thereby reducing the thickness of the color resistance caused by the color resistance.
  • the amount of reflected light emitted from the surface reduces the reflectivity of the display panel and improves its display contrast.
  • the embodiment of the present application also provides a method for manufacturing a display panel, which can be used for manufacturing the display panel shown in FIG. 1 , please refer to FIG. 1 and FIG. 2 .
  • the manufacturing method of the display panel includes the following steps:
  • Step S101 fabricating a light-emitting layer L.
  • the display panel manufacturing method may also include manufacturing the following film layers of the display panel: the buffer layer 102 disposed on the base substrate 101, the buffer layer 102 disposed on the buffer The semiconductor layer 103 on the layer 102, the gate insulating layer 104 covering the semiconductor layer 103, the gate 105 disposed on the gate insulating layer 104, the interlayer insulating layer 106 covering the gate 105, setting The source and drain electrodes 107 on the interlayer insulating layer 106 and the planar layer 108 covering the source and drain electrodes 107 .
  • the step S101 includes: making an anode 109 on the planar layer 108; making a pixel definition layer 110 with an opening corresponding to the anode 109 on the planar layer 108; A luminescent functional layer 111 is fabricated in the opening, and a cathode 112 is fabricated on the luminescent functional layer 111 and the pixel definition layer 110 .
  • the anode 109 is electrically connected to the source and drain 107 through the via hole on the planar layer 108 .
  • the light-emitting functional layer 111 includes a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer, so as to realize the separation of the holes generated by the anode 109 and the electrons generated by the cathode 112. injected, and combined in the organic light-emitting layer to emit light.
  • Step S102 fabricating an encapsulation layer 113 on the light-emitting surface of the light-emitting layer L.
  • the encapsulation layer 113 includes: a third encapsulation layer 1133 disposed on the light-emitting layer L, a second encapsulation layer 1132 disposed on the third encapsulation layer 1133 , and a second encapsulation layer 1132 disposed on the second encapsulation layer 1132 on the first encapsulation layer 1131 .
  • the first encapsulation layer 1131 and the third encapsulation layer 1133 are inorganic encapsulation layers, which can be made by a chemical vapor deposition process, for example, can be nitrided Silicon film layer; the second encapsulation layer 1132 is an organic encapsulation layer, which can be made by coating and other processes.
  • Step S103 fabricating a color filter layer 114 on the encapsulation layer 113 comprising a plurality of color resists and a light shielding member BM located between the color resists, so that the thickness d of the color resists is related to the refraction of the color resists
  • the rate n satisfies between: Wherein, K is a constant, and ⁇ is the wavelength of light corresponding to the color of the color resist.
  • the step S103 includes: making an original light-shielding layer on the encapsulation layer 113, and the original light-shielding layer is made of an opaque material; making a plurality of openings on the original light-shielding layer to form the The light shielding member BM; the color resistance is fabricated in the opening, and the thickness d of the color resistance satisfies:
  • the color resistance can be divided into red resistance C1, green resistance C2, and blue resistance C3.
  • the red resistance C1 only allows light in the red wavelength range to pass through.
  • the green barrier C2 only allows light in the wavelength range of green light to penetrate, and the blue barrier C3 only allows light in the wavelength range of blue light to penetrate.
  • the step of manufacturing the color resistance includes: manufacturing the red resistance C1 in part of the openings, so that the thickness d 1 of the red resistance C1 and the refractive index n 1 of the red resistance C1 satisfy: Wherein, ⁇ 1 is the wavelength of red light; Make described green resistance C2 in part described opening, make the thickness d 2 of described green resistance C2 and the refractive index n 2 of described green resistance C2 satisfy: Wherein, ⁇ 2 is the wavelength of green light; Make described blue resistance C3 in part described opening, make the thickness d 3 of described blue resistance C3 and the refractive index n 3 of described blue resistance C3 satisfy : Wherein, ⁇ 3 is the wavelength of blue light.
  • Step S104 fabricating a transparent layer 115 on the color filter layer 114 .
  • the refractive index of the first encapsulation layer is n 4
  • the refractive index of the light-transmitting layer is n 5
  • the incident angle of external light to the color resist is ⁇
  • the external light is between the color resist and the color resist.
  • the reflectance at the interface between the light-transmitting layers 115 is R 1
  • the reflectance at the interface between the color resist and the first encapsulation layer 1131 is R 2
  • the total amount of natural light on the above two interfaces is The reflectivity is R, then there is the following equation relationship:
  • the minimum reflectance R min of the color resistance in the display panel manufactured in this embodiment can be obtained as:
  • the overall reflectance of the display panel produced in this embodiment to light is about 5% through calculation, it can be seen that the reflectance of the display panel produced in this embodiment is reduced, which is beneficial to Increase the contrast of this display panel.
  • the refractive index n of the color resistance and the refractive index n of the first encapsulation layer 1131 can be selected.
  • n 2 n 4 .n 5 ;
  • the display panel manufacturing method designed the thickness of the color resistance according to the refractive index of the color resistance, so that when the light passes through the color resistance, the reflected light emitted from the upper and lower interfaces of the color resistance occurs. Interference and destructive effect, thereby reducing the amount of reflected light emitted from the surface of the color resist, thereby reducing the reflectivity of the manufactured display panel and improving its display contrast.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种显示面板及显示面板制作方法。显示面板包括发光层(L)、设置在发光层(L)上的封装层(113)、设置在封装层(113)上的彩色滤光层(114)、以及设置在彩色滤光层(114)上的透光层(115)；彩色滤光层(114)包括色阻(C1,C2,C3)和位于色阻(C1,C2,C3)之间的遮光构件(BM)；色阻(C1,C2,C3)的厚度d与其折射率n之间满足特定关系式。

Description

显示面板及显示面板制作方法
本申请要求于2021年06月23日提交中国专利局、申请号为202110696524.9、发明名称为“显示面板及显示面板制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及显示面板制作方法。
背景技术
偏光片(POL)能够有效地降低强光下面板的反射率，却损失了接近58％的出光，这对于有机发光二极管(OLED)显示面板来说，极大地增加了二极管的发光负担，导致其寿命减少；另一方面，偏光片厚度较大、材质脆，不利于动态弯折产品的开发。因此，为了开发基于OLED显示技术的动态弯折产品，必须导入新材料、新技术以及新工艺替代偏光片。
目前，使用彩膜(Color Filter)替代偏光片被归属为无偏光片技术(POL-less)，它不仅能将偏光功能层的厚度从接近100微米降低至小于5微米，而且能够将显示面板的出光率从42％提高至60％。基于彩膜的POL-less技术被认为是实现动态弯折产品开发的关键技术之一。虽然使用彩膜替代偏光片具有以上诸多优势，但是却会导致显示面板的整体反射率升高，使其反射率达到了6％以上，进而使得显示面板的显示对比度下降。
技术问题
目前的基于无偏光片技术的显示面板存在反射率高的技术问题。
技术解决方案
本申请提供一种显示面板及显示面板制作方法，用于缓解目前基于无偏光片技术的显示面板存在的反射率高的技术问题。
本申请提供一种显示面板，其包括：
发光层；
封装层，设置于所述发光层的出光面上；
彩色滤光层，设置于所述封装层上，所述彩色滤光层包括多个色阻和位于所述色阻之 间的遮光构件，所述色阻的折射率为n；
透光层，设置于所述彩色滤光层上，且位于所述彩色滤光层远离所述封装层的一侧；
所述色阻的厚度d与所述色阻的折射率n之间满足下列关系式：
Figure PCTCN2021112718-appb-000001
其中，K为常数，λ为与所述色阻的颜色相对应的光线的波长。
在本申请的显示面板中，所述色阻包括红色阻，所述红色阻的折射率为n 1，所述红色阻的厚度为d 1；
所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足下列关系式：
Figure PCTCN2021112718-appb-000002
其中，λ 1为红光的波长。
在本申请的显示面板中，所述红色阻的折射率n 1为1.52。
在本申请的显示面板中，所述色阻包括绿色阻，所述绿色阻的折射率为n 2，所述绿色阻的厚度为d 2；
所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足下列关系式：
Figure PCTCN2021112718-appb-000003
其中，λ 2为绿光的波长。
在本申请的显示面板中，所述绿色阻的折射率n 2为1.52。
在本申请的显示面板中，所述绿色阻包含乙酸-2-(2-丁氧基乙氧基)乙(醇)酯和曝光性树酯的混合物。
在本申请的显示面板中，所述色阻包括蓝色阻，所述蓝色阻的折射率为n 3，所述蓝色阻的厚度为d 3；
所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足下列关系式：
Figure PCTCN2021112718-appb-000004
其中，λ 3为蓝光的波长。
在本申请的显示面板中，所述蓝色阻的折射率n 3为1.52。
在本申请的显示面板中，所述色阻靠近所述透光层一侧的尺寸大于所述色阻靠近所述 封装层一侧的尺寸。
在本申请的显示面板中，所述色阻的尺寸由靠近所述透光层一侧至靠近所述封装层一侧逐渐减小。
在本申请的显示面板中，所述封装层包括靠近所述色阻的第一封装层，所述第一封装层的折射率为n 4，所述透光层的折射率为n 5；
所述色阻的折射率n与所述第一封装层的折射率n 4、透光层的折射率n 5之间满足下列关系式：
n 2＝n 4.n 5。
在本申请的显示面板中，所述封装层还包括：设置于所述发光层上的第三封装层、设置于所述第三封装层上的第二封装层，所述第一封装层设置于所述第二封装层上。
在本申请的显示面板中，所述第一封装层和所述第三封装层包括无机封装层，所述第二封装层包括有机封装层。
在本申请的显示面板中，所述发光层包括多个发光单元，所述色阻与所述发光单元一一对应设置。
本申请还提供一种显示面板制作方法，其包括：
制作发光层；
在所述发光层的出光面上制作封装层；
在所述封装层上制作包含多个色阻和位于所述色阻之间的遮光构件的彩色滤光层，使得所述色阻的厚度d与所述色阻的折射率n之间满足：
Figure PCTCN2021112718-appb-000005
其中，K为常数，λ为与所述色阻的颜色相对应的光线的波长；
在所述彩色滤光层上制作透光层。
在本申请的显示面板制作方法中，所述在所述封装层上制作包含多个色阻和位于所述色阻之间的遮光构件的彩色滤光层的步骤，还包括：
在所述封装层上制作原始遮光层；
在所述原始遮光层上制作多个开口，形成所述遮光构件；
在所述开口中制作所述色阻，使所述色阻的厚度d满足：
Figure PCTCN2021112718-appb-000006
在本申请的显示面板制作方法中，多个所述色阻包括红色阻、绿色阻和蓝色阻，所述 在所述开口中制作所述色阻的步骤，还包括：
在部分所述开口中制作所述红色阻，使所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足：
Figure PCTCN2021112718-appb-000007
其中，λ 1为红光的波长；
在部分所述开口中制作所述绿色阻，使所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足：
Figure PCTCN2021112718-appb-000008
其中，λ 2为绿光的波长；
在部分所述开口中制作所述蓝色阻，使所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足：
Figure PCTCN2021112718-appb-000009
其中，λ 3为蓝光的波长。
在本申请的显示面板制作方法中，所述封装层113包括：设置于所述发光层上的第三封装层、设置于所述第三封装层上的第二封装层、以及设置于所述第二封装层上的第一封装层。
在本申请的显示面板制作方法中，所述第一封装层的折射率为n 4，所述透光层的折射率为n 5；
所述色阻的折射率n与所述第一封装层的折射率n 4、透光层的折射率n 5之间满足下列关系式：
n 2＝n 4.n 5。
本申请还提供一种显示面板，其包括：
发光层；
封装层，设置于所述发光层的出光面上；
彩色滤光层，设置于所述封装层上，所述彩色滤光层包括多个色阻和位于所述色阻之间的遮光构件，所述色阻包括红色阻、绿色阻和蓝色阻，所述红色阻的折射率为n 1，所述绿色阻的折射率为n 2，所述蓝色阻的折射率为n 3；
透光层，设置于所述彩色滤光层上，且位于所述彩色滤光层远离所述封装层的一侧；
所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足下列关系式：
Figure PCTCN2021112718-appb-000010
其中，K为常数，λ 1为红光的波长；
所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足下列关系式：
Figure PCTCN2021112718-appb-000011
其中，K为常数，λ 2为绿光的波长；
所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足下列关系式：
Figure PCTCN2021112718-appb-000012
其中，K为常数，λ 3为蓝光的波长。
有益效果
本申请提供一种显示面板及显示面板制作方法，该显示面板包括发光层、设置在发光层上的封装层、设置在封装层上的彩色滤光层、以及设置在彩色滤光层上的透光层，彩色滤光层包括色阻和位于色阻之间的遮光构件，色阻的厚度d与其折射率n之间满足
Figure PCTCN2021112718-appb-000013
其中K为常数，λ为与色阻的颜色相对应的光线的波长。本申请根据色阻的折射率对色阻的厚度进行设计，使得光线在穿过色阻时，由色阻的上下两界面射出的反射光发生干涉相消作用，从而减小由色阻表面射出的反射光的量，进而降低显示面板的反射率，提高其显示对比度。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示面板的结构示意图。
图2是图1所示的显示面板的发光层及发光层以上膜层的局部结构示意图。
本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请实施例提供一种显示面板及显示面板制作方法，所述显示面板包括发光层、设置在所述发光层上的封装层、设置在所述封装层上的彩色滤光层、以及设置在所述彩色滤光层上的透光层，所述彩色滤光层包括色阻和位于所述色阻之间的遮光构件，所述色阻的厚度d与其折射率n之间满足
Figure PCTCN2021112718-appb-000014
其中K为常数，λ为与所述色阻的颜色相对应的光线的波长。本申请实施例根据色阻的折射率对色阻的厚度进行设计，使得光线在穿过色阻时，由色阻的上下两界面射出的反射光发生干涉相消作用，从而减小由色阻表面射出的反射光的量，进而降低显示面板的反射率，提高其显示对比度。
下面结合具体实施例对本申请提供的显示面板的结构特征进行说明。
请参阅图1和图2，图1是本申请实施例提供的显示面板的结构示意图，图2是图1所示的显示面板的发光层及发光层以上膜层的局部结构示意图。
在一种实施例中，所述显示面板包括：发光层L、设置于所述发光层L的出光面上的封装层113、设置于所述封装层113上的彩色滤光层114、以及设置于所述彩色滤光层114上的透光层115；其中，所述封装层113和所述透光层115分别设置于所述彩色滤光层114的相对两侧。
所述发光层L中设置有多个发光单元，所述发光单元发出的光线依次经过所述封装层113、所述彩色滤光层114和所述透光层115射出所述显示面板。
可选地，所述封装层113为透光结构，所述封装层113包括：设置于所述发光层L上的第三封装层1133、设置于所述第三封装层1133上的第二封装层1132、以及设置于所述第二封装层1132上的第一封装层1131，所述彩色滤光层114设置于所述第一封装层1131上。其中，所述第一封装层1131和所述第三封装层1133是无机封装层，其可以通过化学气相沉积工艺制作而成，例如，可以是利用化学气相沉积工艺沉积而成的氮化硅膜层；所述第二封装层1132是有机封装层，其可以是通过涂布等工艺制作而成。
所述彩色滤光层114上设置有多个色阻，相邻的所述色阻之间设置有遮光构件BM；其中，所述色阻仅允许特定波长的光线的穿过，比如，所述发光单元发出的特定波长范围内的光线会通过所述色阻射出；所述遮光构件BM为非透光结构，无论是所述发光单元发出的光线，还是外界的自然光均不能穿透所述遮光构件BM。
可选地，根据所述色阻允许透过的光线的波长不同，可以将所述色阻划分为红色阻C1、绿色阻C2、蓝色阻C3，所述红色阻C1仅允许红光波长范围内的光线穿透，所述绿色阻C2仅允许绿光波长范围内的光线穿透，所述蓝色阻C3仅允许蓝光波长范围内的光线穿透。
与之对应地，位于所述发光层L中的发光单元也包括红光发光单元、绿光发光单元和蓝光发光单元。所述红光发光单元与所述红色阻C1上下对应设置，所述红光发光单元发出的光线经过所述红色阻C1射出所述显示面板；所述绿光发光单元与所述绿色阻C2上下对应设置，所述绿光发光单元发出的光线经过所述绿色阻C2射出所述显示面板；所述蓝光发光单元与所述蓝色阻C3上下对应设置，所述蓝光发光单元发出的光线经过所述蓝色阻C3射出所述显示面板。
进一步地，由于所述色阻是透光结构，因此其具有折射率n，在本实施例中，所述色阻的厚度d与该色阻的折射率n之间满足下列关系式：
Figure PCTCN2021112718-appb-000015
其中，λ为与所述色阻的颜色相对应的光线的波长，K为根据生产工艺所确定的常数，在本申请实施例中，综合考虑色阻制作工艺及面板中其它相应结构的制作工艺，可以选取K的值为8。
为了减小所述色阻上下两界面对外界自然光的反射量，本实施例考虑采用将所述色阻上下两界面产生的反射光发生彼此干涉相消的方案。所述色阻上下两界面的反射光发生干涉相消的条件是，所述色阻的厚度d与所述色阻的折射率n之间需要满足下列干涉方程：
2nd＝(K+1/2)λ；
其中，K为常数，λ为与所述色阻的颜色相对应的光线的波长。
本实施例将所述色阻的厚度d设置为：
Figure PCTCN2021112718-appb-000016
将该厚度值带入上述干涉方程即可以实现等式成立，即本申请实施例提供的显示面板中的色阻可以实现所述色阻上下两界面产生的反射光发生干涉相消作用，从而减小由色阻表面射出的反射光的量，进而降低显示面板的反射率，提高其显示对比度。
进一步地，在本申请实施例提供的显示面板中，与所述色阻相接触的上下两膜层分别是：第一封装层1131和透光层115。外界光线的透射路径是：由所述透光层115到所述色阻，进而到所述第一封装层1131。所述第一封装层的折射率为n 4，所述透光层的折射率为n 5，外界光线射向所述色阻的入射角为θ，外界光线在所述色阻与所述透光层115之间的界面上的反射率为R 1，在所述色阻与所述第一封装层1131之间的界面上的反射率为R 2，自然光在上述两界面上的总反射率为R，则存在下列等式关系：
Figure PCTCN2021112718-appb-000017
Figure PCTCN2021112718-appb-000018
Figure PCTCN2021112718-appb-000019
Figure PCTCN2021112718-appb-000020
将等式：
Figure PCTCN2021112718-appb-000021
与上述等式结合，可以得到本实施例提供的显示面板中的色阻的最小反射率R min为：
Figure PCTCN2021112718-appb-000022
进一步地，在本实施例中，所述红色阻C1的折射率为n 1，所述红色阻C1的厚度为d 1；
所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足下列关系式：
Figure PCTCN2021112718-appb-000023
其中，λ 1为红光的波长，所述红色阻C1的折射率n 1为1.52，根据这些数据及上面的关系式可得到本实施例提供的红色阻C1对光线的最小反射率R min约为0.5％。
进一步地，在本实施例中，所述绿色阻C2的折射率为n 2，所述绿色阻C2的厚度为d 2；
所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足下列关系式：
Figure PCTCN2021112718-appb-000024
其中，λ 2为绿光的波长。
可选地，所述绿色阻C2包含乙酸-2-(2-丁氧基乙氧基)乙(醇)酯和曝光性树酯的混合物，其折射率n 2为1.52，绿光的波长范围为500纳米至560纳米，根据这些数据及上面的关系式可得到本实施例提供的绿色阻C2的厚度d 2约为1.5微米，绿色阻C2对光线的最小反射率R min约为0.8％。
进一步地，在本实施例中，所述蓝色阻C3的折射率为n 3，所述蓝色阻C3的厚度为d 3；
所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足下列关系式：
Figure PCTCN2021112718-appb-000025
其中，λ 3为蓝光的波长，所述蓝色阻C3的折射率n 3为1.52，根据这些数据及上面的关系式可得到本实施例提供的蓝色阻C3对光线的最小反射率R min约为0.5％。
综合以上各个色阻对光线的最小反射率，经过测算得到本申请实施例提供的显示面板对光线的整体反射率降低到5％左右，相较于普通设计时显示面板的整体反射率为6％以上的情况，本申请提供的显示面板降低了反射率，有利于提高显示对比度。
在一种实施例中，所述色阻的折射率n与所述第一封装层1131的折射率n 4、所述透光层115的折射率n 5之间满足下列关系式：
n 2＝n 4.n 5；
根据所述显示面板中的色阻的最小反射率R min为：
Figure PCTCN2021112718-appb-000026
可知，当n 2＝n 4.n 5时，所述色阻的最小反射率R min达到最小值，即为0，从而使所述显示面板的反射率进一步降低。
进一步地，为了方便所述色阻的制作，在本实施中，将所述色阻靠近所述透光层115一侧的尺寸设置为大于所述色阻靠近所述第一封装层1131一侧的尺寸。
进一步地，本实施例提供的显示面板还包括：衬底基板101、设置于所述衬底基板101上的缓冲层102、设置于所述缓冲层102上的半导体层103、覆盖所述半导体层103的栅极绝缘层104、设置于所述栅极绝缘层104上的栅极105、覆盖所述栅极105的层间绝缘层106、设置于所述层间绝缘层106上的源漏极107、以及覆盖所述源漏极107的平坦层108。所述发光层L设置于所述平坦层108上。
所述衬底基板101可以是由第一聚酰亚胺层、中间缓冲层和第二聚酰亚胺层组成的复合结构。所述源漏极107通过所述栅极绝缘层104和所述层间绝缘层106上的过孔连接至所述半导体层103的相对两端，所述半导体层103、所述栅极105和所述源漏极107构成薄膜晶体管器件。
进一步地，所述发光层L包括：设置于所述平坦层108上的阳极109、设置于所述平坦层108上且具有对应所述阳极109的开口的像素定义层110、设置于所述像素定义层110的开口中的发光功能层111、设置于所述发光功能层111和所述像素定义层110上的阴极112。所述阳极109通过所述平坦层108上的过孔电性连接至所述源漏极107，并接收由所 述源漏极107传输的驱动信号。所述发光功能层111包括空穴注入层、空穴传输层、有机发光层、电子传输层和电子注入层，以实现由所述阳极109产生的空穴和由所述阴极112产生的电子的注入，并在所述有机发光层结合发光。所述发光功能层111和与其相连的所述阳极109、所述阴极112共同组成所述发光单元。所述封装层113设置于所述阴极112上。
综上所述，本申请实施例提供的显示面板包括：发光层、设置在所述发光层上的封装层、设置在所述封装层上的彩色滤光层、以及设置在所述彩色滤光层上的透光层，所述彩色滤光层包括色阻和位于所述色阻之间的遮光构件，所述色阻的厚度d与其折射率n之间满足
Figure PCTCN2021112718-appb-000027
其中K为常数，λ为与所述色阻的颜色相对应的光线的波长。本申请实施例根据色阻的折射率对色阻的厚度进行设计，使得光线在穿过色阻时，由色阻的上下两界面射出的反射光发生干涉相消作用，从而减小由色阻表面射出的反射光的量，进而降低显示面板的反射率，提高其显示对比度。
本申请实施例还提供一种显示面板制作方法，该显示面板制作方法可用于图1所示的显示面板的制作，请参阅图1和图2所示。
所述显示面板制作方法包括以下步骤：
步骤S101，制作发光层L。
可选地，在制作所述发光层L的步骤之前，所述显示面板制作方法还可以包括制作该显示面板的下列膜层：设置于衬底基板101上的缓冲层102、设置于所述缓冲层102上的半导体层103、覆盖所述半导体层103的栅极绝缘层104、设置于所述栅极绝缘层104上的栅极105、覆盖所述栅极105的层间绝缘层106、设置于所述层间绝缘层106上的源漏极107、以及覆盖所述源漏极107的平坦层108。
进一步地，所述步骤S101包括：在所述平坦层108上制作阳极109；在所述平坦层108上制作具有对应所述阳极109的开口的像素定义层110、在所述像素定义层110的开口中制作发光功能层111、在所述发光功能层111和所述像素定义层110上制作阴极112。其中，所述阳极109通过所述平坦层108上的过孔电性连接至所述源漏极107。所述发光功能层111包括空穴注入层、空穴传输层、有机发光层、电子传输层和电子注入层，以实现由所述阳极109产生的空穴和由所述阴极112产生的电子的注入，并在所述有机发光层结合发光。
步骤S102，在所述发光层L的出光面上制作封装层113。
其中，所述封装层113包括：设置于所述发光层L上的第三封装层1133、设置于所述第三封装层1133上的第二封装层1132、以及设置于所述第二封装层1132上的第一封装层1131。
可选地，所述第一封装层1131和所述第三封装层1133是无机封装层，其可以通过化学气相沉积工艺制作而成，例如，可以是利用化学气相沉积工艺沉积而成的氮化硅膜层；所述第二封装层1132是有机封装层，其可以是通过涂布等工艺制作而成。
步骤S103，在所述封装层113上制作包含多个色阻和位于所述色阻之间的遮光构件BM的彩色滤光层114，使得所述色阻的厚度d与所述色阻的折射率n之间满足：
Figure PCTCN2021112718-appb-000028
其中，K为常数，λ为与所述色阻的颜色相对应的光线的波长。
具体地，所述步骤S103包括：在所述封装层113上制作原始遮光层，所述原始遮光层由不透光材料制作而成；在所述原始遮光层上制作多个开口，形成所述遮光构件BM；在所述开口中制作所述色阻，并使所述色阻的厚度d满足：
Figure PCTCN2021112718-appb-000029
本实施例将所述色阻的厚度d设置为：
Figure PCTCN2021112718-appb-000030
将该厚度值带入干涉方程：2nd＝(K+1/2)λ，可以实现该干涉方程等式成立，即本申请实施例制作的色阻可以实现色阻上下两界面产生的反射光发生干涉相消作用，从而减小由色阻表面射出的反射光的量，有利于降低显示面板的反射率。
根据所述色阻允许透过的光线的波长不同，可以将所述色阻划分为红色阻C1、绿色阻C2、蓝色阻C3，所述红色阻C1仅允许红光波长范围内的光线穿透，所述绿色阻C2仅允许绿光波长范围内的光线穿透，所述蓝色阻C3仅允许蓝光波长范围内的光线穿透。
具体地，制作所述色阻的步骤包括：在部分所述开口中制作所述红色阻C1，使所述红色阻C1的厚度d 1与所述红色阻C1的折射率n 1之间满足：
Figure PCTCN2021112718-appb-000031
其中，λ 1为红光的波长；在部分所述开口中制作所述绿色阻C2，使所述绿色阻C2的厚度d 2与所述绿色阻C2的折射率n 2之间满足：
Figure PCTCN2021112718-appb-000032
其中，λ 2为绿光的波长；在部分所述开口中制作所述蓝色阻C3，使所述蓝色阻C3的厚度d 3与所述蓝色阻C3的折射率n 3之间满足：
Figure PCTCN2021112718-appb-000033
其中，λ 3为蓝光的波长。
步骤S104，在所述彩色滤光层114上制作透光层115。
其中，所述第一封装层的折射率为n 4，所述透光层的折射率为n 5，外界光线射向所述色阻的入射角为θ，外界光线在所述色阻与所述透光层115之间的界面上的反射率为R 1，在所述色阻与所述第一封装层1131之间的界面上的反射率为R 2，自然光在上述两界面上的总反射率为R，则存在下列等式关系：
Figure PCTCN2021112718-appb-000034
Figure PCTCN2021112718-appb-000035
Figure PCTCN2021112718-appb-000036
Figure PCTCN2021112718-appb-000037
将等式：
Figure PCTCN2021112718-appb-000038
与上述等式结合，可以得到本实施例制作的显示面板中的色阻的最小反射率R min为：
Figure PCTCN2021112718-appb-000039
在所述色阻具有最小反射率的情况下，经过测算得到本实施例制作的显示面板对光线的整体反射率为5％左右，可见本实施例降低了制得的显示面板反射率，有利于提高该显示面板的对比度。
可选地，在选择制作所述第一封装层1131、所述色阻、和所述透光层115的材料时，可以选取所述色阻的折射率n与所述第一封装层1131的折射率n 4、所述透光层115的折射率n 5之间满足下列关系式的材料：
n 2＝n 4.n 5；
根据所述显示面板中的色阻的最小反射率R min为：
Figure PCTCN2021112718-appb-000040
可知，当 n 2＝n 4.n 5时，所述色阻的最小反射率R min达到最小值，即为0，从而使制得的显示面板的反射率进一步降低。
综上所述，本申请实施例提供的显示面板制作方法根据色阻的折射率对色阻的厚度进行设计，使得光线在穿过色阻时，由色阻的上下两界面射出的反射光发生干涉相消作用，从而减小由色阻表面射出的反射光的量，进而降低制得的显示面板的反射率，提高其显示对比度。
需要说明的是，虽然本申请以具体实施例揭露如上，但上述实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，其包括：
    发光层；
    封装层，设置于所述发光层的出光面上；
    彩色滤光层，设置于所述封装层上，所述彩色滤光层包括多个色阻和位于所述色阻之间的遮光构件，所述色阻的折射率为n；
    透光层，设置于所述彩色滤光层上，且位于所述彩色滤光层远离所述封装层的一侧；
    所述色阻的厚度d与所述色阻的折射率n之间满足下列关系式：
    Figure PCTCN2021112718-appb-100001
    其中，K为常数，λ为与所述色阻的颜色相对应的光线的波长。
  2. 根据权利要求1所述的显示面板，其中，所述色阻包括红色阻，所述红色阻的折射率为n 1，所述红色阻的厚度为d 1；
    所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足下列关系式：
    Figure PCTCN2021112718-appb-100002
    其中，λ 1为红光的波长。
  3. 根据权利要求2所述的显示面板，其中，所述红色阻的折射率n 1为1.52。
  4. 根据权利要求1所述的显示面板，其中，所述色阻包括绿色阻，所述绿色阻的折射率为n 2，所述绿色阻的厚度为d 2；
    所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足下列关系式：
    Figure PCTCN2021112718-appb-100003
    其中，λ 2为绿光的波长。
  5. 根据权利要求4所述的显示面板，其中，所述绿色阻的折射率n 2为1.52。
  6. 根据权利要求4所述的显示面板，其中，所述绿色阻包含乙酸-2-(2-丁氧基乙氧基)乙(醇)酯和曝光性树酯的混合物。
  7. 根据权利要求1所述的显示面板，其中，所述色阻包括蓝色阻，所述蓝色阻的折射率为n 3，所述蓝色阻的厚度为d 3；
    所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足下列关系式：
    Figure PCTCN2021112718-appb-100004
    其中，λ 3为蓝光的波长。
  8. 根据权利要求7所述的显示面板，其中，所述蓝色阻的折射率n 3为1.52。
  9. 根据权利要求1所述的显示面板，其中，所述色阻靠近所述透光层一侧的尺寸大于所述色阻靠近所述封装层一侧的尺寸。
  10. 根据权利要求9所述的显示面板，其中，所述色阻的尺寸由靠近所述透光层一侧至靠近所述封装层一侧逐渐减小。
  11. 根据权利要求1所述的显示面板，其中，所述封装层包括靠近所述色阻的第一封装层，所述第一封装层的折射率为n 4，所述透光层的折射率为n 5；
    所述色阻的折射率n与所述第一封装层的折射率n 4、透光层的折射率n 5之间满足下列关系式：
    n 2＝n 4.n 5。
  12. 根据权利要求11所述的显示面板，其中，所述封装层还包括：设置于所述发光层上的第三封装层、设置于所述第三封装层上的第二封装层，所述第一封装层设置于所述第二封装层上。
  13. 根据权利要求12所述的显示面板，其中，所述第一封装层和所述第三封装层包括无机封装层，所述第二封装层包括有机封装层。
  14. 根据权利要求1所述的显示面板，其中，所述发光层包括多个发光单元，所述色阻与所述发光单元一一对应设置。
  15. 一种显示面板制作方法，其包括：
    制作发光层；
    在所述发光层的出光面上制作封装层；
    在所述封装层上制作包含多个色阻和位于所述色阻之间的遮光构件的彩色滤光层，使得所述色阻的厚度d与所述色阻的折射率n之间满足：
    Figure PCTCN2021112718-appb-100005
    其中，K为常数，λ为与所述色阻的颜色相对应的光线的波长；
    在所述彩色滤光层上制作透光层。
  16. 根据权利要求15所述的显示面板制作方法，其中，所述在所述封装层上制作包含 多个色阻和位于所述色阻之间的遮光构件的彩色滤光层的步骤，还包括：
    在所述封装层上制作原始遮光层；
    在所述原始遮光层上制作多个开口，形成所述遮光构件；
    在所述开口中制作所述色阻，使所述色阻的厚度d满足：
    Figure PCTCN2021112718-appb-100006
  17. 根据权利要求16所述的显示面板制作方法，其中，多个所述色阻包括红色阻、绿色阻和蓝色阻，所述在所述开口中制作所述色阻的步骤，还包括：
    在部分所述开口中制作所述红色阻，使所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足：
    Figure PCTCN2021112718-appb-100007
    其中，λ 1为红光的波长；
    在部分所述开口中制作所述绿色阻，使所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足：
    Figure PCTCN2021112718-appb-100008
    其中，λ 2为绿光的波长；
    在部分所述开口中制作所述蓝色阻，使所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足：
    Figure PCTCN2021112718-appb-100009
    其中，λ 3为蓝光的波长。
  18. 根据权利要求15所述的显示面板制作方法，其中，所述封装层113包括：设置于所述发光层上的第三封装层、设置于所述第三封装层上的第二封装层、以及设置于所述第二封装层上的第一封装层。
  19. 根据权利要求15所述的显示面板制作方法，其中，所述第一封装层的折射率为n 4，所述透光层的折射率为n 5；
    所述色阻的折射率n与所述第一封装层的折射率n 4、透光层的折射率n 5之间满足下列关系式：
    n 2＝n 4.n 5。
  20. 一种显示面板，其包括：
    发光层；
    封装层，设置于所述发光层的出光面上；
    彩色滤光层，设置于所述封装层上，所述彩色滤光层包括多个色阻和位于所述色阻之间的遮光构件，所述色阻包括红色阻、绿色阻和蓝色阻，所述红色阻的折射率为n 1，所述 绿色阻的折射率为n 2，所述蓝色阻的折射率为n 3；
    透光层，设置于所述彩色滤光层上，且位于所述彩色滤光层远离所述封装层的一侧；
    所述红色阻的厚度d 1与所述红色阻的折射率n 1之间满足下列关系式：
    Figure PCTCN2021112718-appb-100010
    其中，K为常数，λ 1为红光的波长；
    所述绿色阻的厚度d 2与所述绿色阻的折射率n 2之间满足下列关系式：
    Figure PCTCN2021112718-appb-100011
    其中，K为常数，λ 2为绿光的波长；
    所述蓝色阻的厚度d 3与所述蓝色阻的折射率n 3之间满足下列关系式：
    Figure PCTCN2021112718-appb-100012
    其中，K为常数，λ 3为蓝光的波长。
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