WO2022259786A1 - 熱伝導性樹脂組成物、硬化物 - Google Patents
熱伝導性樹脂組成物、硬化物 Download PDFInfo
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- WO2022259786A1 WO2022259786A1 PCT/JP2022/019492 JP2022019492W WO2022259786A1 WO 2022259786 A1 WO2022259786 A1 WO 2022259786A1 JP 2022019492 W JP2022019492 W JP 2022019492W WO 2022259786 A1 WO2022259786 A1 WO 2022259786A1
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- component
- meth
- thermally conductive
- acrylate
- resin composition
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- 239000011342 resin composition Substances 0.000 title claims abstract description 139
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 173
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 44
- 229920000570 polyether Polymers 0.000 claims abstract description 44
- 239000000843 powder Substances 0.000 claims abstract description 41
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 36
- 239000004014 plasticizer Substances 0.000 claims abstract description 31
- 239000000178 monomer Substances 0.000 claims abstract description 28
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 43
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- 238000001723 curing Methods 0.000 description 41
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- 238000012360 testing method Methods 0.000 description 39
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- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- RVXKJRWBHPHVOV-UHFFFAOYSA-L zinc;oct-2-enoate Chemical compound [Zn+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O RVXKJRWBHPHVOV-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/285—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
- C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Definitions
- the present invention relates to thermally conductive resin compositions and cured products.
- thermally conductive resin composition has been used between the heating elements of electric/electronic parts such as semiconductors and heat dissipation members such as heat dissipation fins for the purpose of dissipating heat generated from electric/electronic parts to the outside.
- a thermally conductive resin composition a thermally conductive resin composition is often used because it can achieve both adhesiveness and thermal conductivity.
- JP-A-2015-212325 discloses a polyurethane having a (meth)acryloyl group and a polyoxyalkylene skeleton, a polymerizable monomer containing (meth)acrylic acid, a thermally conductive filler, and a polymerization initiator.
- a thermally conductive resin composition is disclosed.
- the thermally conductive resin composition disclosed in JP-A-2015-212325 adds a large amount of thermally conductive filler to obtain thermal conductivity, so the cured product is hard and brittle. end up Therefore, there is a problem that it is difficult to conform to members such as electric/electronic parts.
- the present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a thermally conductive resin composition that can provide a cured product having excellent tensile strength and elongation while maintaining thermal conductivity. aim.
- component urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end
- component monofunctional (meth)acrylic having a polyether skeleton and no urethane skeleton
- Monomer C
- component radical polymerization initiator
- component plasticizer
- E component: thermally conductive powder.
- Agent A A composition containing the following components (A) to (E).
- component urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end
- component monofunctional (meth)acrylic having a polyether skeleton and no urethane skeleton
- component thermally conductive powder Agent B: composition containing at least a curing accelerator.
- the addition amount (blended amount) of the component (A) is in the range of 20 to 90 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B) [1] Or the thermally conductive resin composition according to [2].
- the addition amount (blending amount) of the component (D) is in the range of 10 to 200 parts by mass with respect to a total of 100 parts by mass of the components (A) and (B) [1] The thermally conductive resin composition according to any one of [3]. [5] The thermally conductive resin composition according to any one of [1] to [4], wherein the component (D) is a polyether plasticizer.
- the component (E) is (E1) a thermally conductive powder having an average particle size of 0.01 ⁇ m or more and less than 2.0 ⁇ m; (E2) a thermally conductive powder having an average particle size of 2.0 ⁇ m or more and less than 20 ⁇ m; (E3) The thermally conductive resin composition according to any one of [1] to [5], containing thermally conductive powder having an average particle size of 20 ⁇ m or more and less than 150 ⁇ m. [7] The (E) component has a mass ratio of (E1)/(E3) of 0.08 to 1.00 and a mass ratio of (E2)/(E3) of 0.15 to 1.50, [ 6], the thermally conductive resin composition.
- thermally conductive resin composition according to any one of [1] to [7], wherein the cured product has an elongation percentage of 60 to 1500%.
- a cured product obtained from the thermally conductive resin composition according to any one of [1] to [8].
- the tensile strength of the cured product is 0.40 MPa or more, and the elongation of the cured product is 60 to 1500% A thermally conductive resin composition.
- (A) component urethane (meth)acrylate (B") component: monofunctional (meth)acrylic monomer having no urethane skeleton (C) component: radical polymerization initiator (E) component: thermally conductive powder .
- the addition amount (blended amount) of the (A′′) component is in the range of 20 to 90 parts by mass with respect to a total of 100 parts by mass of the (A′′) component and the (B′′) component.
- (D) Component Plasticizer.
- the addition amount (blending amount) of the component (D) is in the range of 10 to 200 parts by mass with respect to a total of 100 parts by mass of the component (A'') and the component (B'') [ 13], the thermally conductive resin composition.
- the component (E) is (E1) a thermally conductive powder having an average particle size of 0.01 ⁇ m or more and less than 2.0 ⁇ m; (E2) a thermally conductive powder having an average particle size of 2.0 ⁇ m or more and less than 20 ⁇ m; (E3) The thermally conductive resin composition according to any one of [11] to [15], containing thermally conductive powder having an average particle size of 20 ⁇ m or more and less than 150 ⁇ m.
- Component (E) has a mass ratio of (E1)/(E3) of 0.08 to 1.00 and a mass ratio of (E2)/(E3) of 0.15 to 1.50, [ 16], the thermally conductive resin composition.
- a first aspect of the present invention provides a thermally conductive resin composition
- a thermally conductive resin composition comprising the following components (A) to (E): (A) component: urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end (B) component: monofunctional (meth)acrylic having a polyether skeleton and no urethane skeleton Monomer component (C): radical polymerization initiator component (D): plasticizer component (E): thermally conductive powder.
- a thermally conductive resin composition comprising the following agents A and B: Agent A: A composition containing the following components (A) to (E).
- Agent A A composition containing the following components (A) to (E).
- component urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end
- component monofunctional (meth)acrylic having a polyether skeleton and no urethane skeleton
- Agent B A composition containing at least a curing accelerator.
- the following components (A''), (B''), (C) and (E) are included, the tensile strength of the cured product is 0.40 MPa or more, and the cured product Provided is a thermally conductive resin composition having an elongation of 60 to 1500%: (A") component: urethane (meth)acrylate (B") component: monofunctional (meth)acrylic monomer having no urethane skeleton (C) component: radical polymerization initiator (E) component: thermally conductive powder .
- thermoly conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining thermal conductivity.
- X to Y is used to include the numerical values (X and Y) described before and after it as lower and upper limits, and means “X or more and Y or less”.
- (meth)acrylate in the present invention means both acrylate and methacrylate.
- the (A) component contained in the thermally conductive resin composition of the present invention is a urethane (meth)acrylate having a polyether skeleton and having a (meth)acryloyl group at one end.
- the (A) component is a urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end” means that the (A) component has a (meth)acryloyl group only at one end.
- the component (A) has a (meth)acryloyl group at one end but is a urethane (meth)acrylate with a polyether skeleton having no (meth)acryloyl group at the other end Intend. Therefore, urethane (meth)acrylate having a polyether skeleton having (meth)acryloyl groups at both ends is not included in component (A).
- Component (A) is not particularly limited as long as it is a urethane (meth)acrylate with a polyether skeleton having a (meth)acryloyl group at one end, but is combined with other components of the present invention to maintain thermal conductivity.
- the urethane (meth)acrylate is a compound having a urethane bond obtained by reacting an isocyanate group and a hydroxy group, and a (meth)acryloyl group.
- the polyether skeleton means, for example, a skeleton having an alkylene oxide such as polyethylene oxide, polypropylene oxide, and polybutylene glycol.
- the method for producing the component (A) is not particularly limited, but for example, urethane (meth)acrylate consisting of a reaction product of a polyol compound having a hydroxyl group and a (meth)acrylate having an isocyanate group, or a polyol having a hydroxyl group urethane (meth)acrylate, which is a reaction product of a compound, a polyisocyanate compound, and a (meth)acrylate having a hydroxyl group;
- the polyol compound having a hydroxyl group is, for example, polyethylene oxide, polypropylene oxide, polybutylene glycol, and the repeating number of the alkylene oxide is not particularly limited, but is, for example, 3 to 500, more preferably 5 to 100.
- (meth)acrylates having an isocyanate group include 2-isocyanatoethyl (meth)acrylate and 2-(2-(meth)acryloyloxyethyloxy)ethyl isocyanate.
- the polyisocyanate compound is not particularly limited, but includes, for example, aromatic polyisocyanates, alicyclic polyisocyanates, aliphatic polyisocyanates and the like. Polyisocyanates and alicyclic polyisocyanates are preferred. These may be used singly or in combination.
- aromatic polyisocyanates examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, tetramethylxylylene diisocyanate, diphenylmethane diisocyanate, naphthalene- 1,5-diisocyanate, triphenylmethane triisocyanate and the like.
- Alicyclic polyisocyanates include isophorone diisocyanate, bis(4-isocyanatocyclohexyl)methane, 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane, norbornane diisocyanate, bicycloheptane triisocyanate and the like.
- Aliphatic polyisocyanates include hexamethylene diisocyanate, 1,3,6-hexamethylene triisocyanate, 1,6,11-undecatriisocyanate and the like.
- Examples of (meth)acrylates containing a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxycyclohexyl (meth)acrylate, 1,6-hexanediol mono(meth)acrylate, neopentyl glycol mono(meth)acrylate, (poly)ethylene glycol mono(meth)acrylate, (poly)propylene glycol mono(meth)acrylate, pentaerythritol tri(meth)acrylate etc.
- 2-hydroxyethyl (meth) acrylate 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxycyclohexyl (meth) Acrylates are preferred. These may be used singly or in combination.
- catalysts used in the synthesis of component (A) include lead oleate, antimony trichloride, triphenylaluminum, trioctylaluminum, tetrabutyltin, dibutyltin dilaurate, copper naphthenate, zinc naphthenate, and zinc octylate. , zinc octoate, zirconium naphthenate, cobalt naphthenate, tetra-n-butyl-1,3-diacetyloxydistanoxane, triethylamine, 1,4-diaza[2,2,2]bicyclooctane, N-ethylmorpholine etc. can be mentioned.
- dibutyltin dilaurate, zinc naphthenate, zinc octylate, and zinc octenoate are preferably used because they yield a thermally conductive resin composition that gives a cured product having excellent tensile strength and elongation. It is preferable to use 0.0001 to 10 parts by mass of these catalysts per 100 parts by mass of the total amount of reactants.
- the reaction temperature is usually 10 to 100°C, preferably 30 to 90°C.
- a monofunctional urethane (meth)acrylate can be obtained by blocking excess isocyanate groups during the synthesis of the component (A) with a capping agent.
- capping agents include methanol, ethanol, isopropanol, normal propanol, 1-butanol, 1-heptanol, 1-hexanol, normal octyl alcohol and the like.
- the weight-average molecular weight of the component (A) in the present invention is not particularly limited, but since a thermally conductive resin composition that provides a cured product having excellent tensile strength and elongation can be obtained, the weight-average molecular weight is, for example, 0. It is preferably 30,000 to 200,000, more preferably 50,000 to 100,000, and particularly preferably 10,000 to 50,000.
- the weight average molecular weight was calculated by a standard polystyrene conversion method using size exclusion chromatography (SEC) unless otherwise specified.
- the component (A) is not particularly limited, but can be obtained, for example, from Rahn AG, Neagari Kogyo Co., Ltd., and the like. Specifically, Rahn AG GENOMER4188, 4312, 4316, 4590, etc. are mentioned.
- the amount of component (A) added is preferably in the range of 20 to 90 parts by mass, more preferably in the range of 100 parts by mass in total of component (A) and component (B) described later. , 25 to 80 parts by mass, more preferably 30 to 75 parts by mass, even more preferably in the range of 40 to 70 parts by mass, particularly preferably more than 45 parts by mass and less than 65 parts by mass .
- the thermally conductive resin composition contains two or more components (A)
- the amount of component (A) added (mixed amount) is 100 parts by mass in total of component (A) and component (B). is the total amount of the component (A).
- the addition amount (blended amount) of the component (A) is preferably in the range of 3 to 15 parts by mass with respect to the total 100 parts by mass of the thermally conductive resin composition, and 5.0 to 9.0 parts by mass. It is more preferably 0 parts by mass, and particularly preferably more than 5.0 parts by mass and 8.5 parts by mass or less. By being within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining thermal conductivity.
- the amount of addition (blended amount) of the (A) component is A) is the total amount of ingredients.
- the (B) component contained in the thermally conductive resin composition of the present invention is a monofunctional (meth)acrylic monomer having a polyether skeleton and no urethane skeleton. It is not particularly limited as long as it is a monofunctional (meth)acrylic monomer having a polyether skeleton and not having a urethane skeleton, which is the component (B) contained in the thermally conductive resin composition of the present invention.
- a cured product having excellent tensile strength and elongation while maintaining thermal conductivity can be obtained.
- the polyether skeleton means, for example, a skeleton having an alkylene oxide such as polyethylene oxide, polypropylene oxide, and polybutylene glycol.
- the polyether in the component (B) The skeleton is preferably a skeleton with polyethylene oxide.
- the number of repeating alkylene oxide moieties is not particularly limited, it is, for example, 2 to 300, and a cured product having excellent tensile strength and elongation (especially elongation) can be obtained while maintaining thermal conductivity.
- it is preferably 2 to 9, more preferably 5 to 9.
- the monofunctional (meth)acrylic monomer means a compound having only one (meth)acryloyl group in one molecule.
- the component (B) is not particularly limited, but examples include methoxydiethylene glycol mono(meth)acrylate, methoxytriethylene glycol mono(meth)acrylate, methoxytetraethyleneglycol mono(meth)acrylate, methoxypentaethylene glycol mono(meth)acrylate, ) acrylate, methoxyhexaethylene glycol mono (meth) acrylate, methoxyheptaethylene glycol mono (meth) acrylate, methoxyoctaethylene glycol mono (meth) acrylate, methoxynonaethylene glycol mono (meth) acrylate, methoxydecaethylene glycol mono (meth) acrylate ) acrylate, methoxytripropylene glycol mono(meth)acrylate, methoxytetrapropylene glycol mono(meth)acrylate, methoxypentapropylene glycol mono(meth)acrylate, methoxyhexapropylene glycol mono(meth)acrylate,
- the component (B) is methoxy Diethylene glycol mono (meth) acrylate, methoxytriethylene glycol mono (meth) acrylate, methoxytetraethylene glycol mono (meth) acrylate, methoxypentaethylene glycol mono (meth) acrylate, methoxyhexaethylene glycol mono (meth) acrylate, methoxyheptaethylene Glycol mono(meth)acrylate, methoxyoctaethyleneglycol mono(meth)acrylate, methoxynonaethyleneglycol mono(meth)acrylate, ethoxydiethyleneglycol mono(meth)acrylate, ethoxytriethyleneglycol mono(meth)acrylate, ethoxytetraethyleneglycol mono(meth)acrylate (meth)acrylate,
- the amount (blended amount) of the component (B) added is preferably a mixing ratio with the component (A) as defined for the component (A). By being within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining thermal conductivity.
- the thermally conductive resin composition contains two or more components (B)
- the amount of component (B) added (mixed amount) is based on the total of 100 parts by mass of component (A) and component (B). , is the total amount of the (B) component.
- the addition amount (blended amount) of the component (B) is preferably in the range of 1 to 10 parts by mass, and 3.0 parts by mass or more, with respect to the total 100 parts by mass of the thermally conductive resin composition. It is more preferably less than 6.5 parts by mass, and particularly preferably 4.0 parts by mass or more and 6.0 parts by mass or less. By being within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining thermal conductivity.
- the amount of addition (blended amount) of the component (B) is B) is the total amount of ingredients.
- the (C) component that can be used in the present invention is a radical polymerization initiator.
- component (C) include photoradical polymerization initiators (hereinafter also referred to as photoradical initiators), organic peroxides, and the like.
- the curing form of the thermally conductive resin composition of the present invention can be selected from photocuring, heat curing, or redox curing by selecting the component (C) of the present invention. For example, if you want to impart "photocurability" to the thermally conductive resin composition, select a photoradical polymerization initiator, and if you want to impart "hardening by heat curing or redox reaction", select an organic peroxide. do it. These radical polymerization initiators may be used alone or in combination.
- the addition amount (blended amount) of the component (C) is not particularly limited, but is, for example, 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). , more preferably 0.1 to 15 parts by mass, even more preferably 0.5 to 10 parts by mass, particularly preferably more than 2.5 parts by mass and less than 7.0 parts by mass is. By setting it within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having even more excellent tensile strength and elongation can be obtained.
- the amount of component (C) added is based on a total of 100 parts by mass of component (A) and component (B). , is the total amount of the (C) component.
- the addition amount (blended amount) of the component (C) is preferably in the range of 0.1 to 5 parts by mass, more preferably 0.2 parts by mass, with respect to the total 100 parts by mass of the thermally conductive resin composition. It is at least 1.0 part by mass and preferably at least 0.3 part by mass and not more than 0.8 part by mass. By being within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining thermal conductivity.
- the amount of component (C) added (blending amount) is 100 parts by mass of the total thermally conductive resin composition (C ) is the total amount of the ingredients.
- the photoradical initiator that is the component (C) used in the present invention is not limited as long as it is a compound that generates radicals upon irradiation with active energy rays.
- component (C) include acetophenone-based photoradical initiators, benzoin-based photoradical initiators, benzophenone-based photoradical initiators, thioxanthone-based photoradical initiators, acylphosphine oxide-based photoradical initiators, and titanocene-based photoradical initiators.
- acetophenone-based photoradical initiators and acylphosphine oxide-based photoradical initiators are preferred from the viewpoint of excellent photocurability, and acetophenone-based photoradical initiators are particularly preferred. Moreover, these may be used independently and 2 or more types may be used together.
- acetophenone photoradical initiator examples include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 4-(2-hydroxyethoxy)phenyl-(2- hydroxy-2-propyl)ketone, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-2-morpholino(4-thiomethylphenyl)propan-1-one, 2-benzyl-2-dimethylamino-1-( 4-morpholinophenyl)butanone, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone oligomers, etc., but not limited thereto.
- Commercially available products include IRGACURE 184, DAROCUR 1173 (manufactured by BASF), and Double Cure 173 (manufactured by DOUBLE BOND CHEMICAL IND. CO., LTD.).
- acylphosphine oxide photoradical initiator examples include bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. , but not limited to this.
- the organic peroxide which is the component (C) used in the present invention, is a compound that generates radical species by heating at 50°C or higher or by a redox reaction.
- the use of a redox reaction is preferred because radical species can be generated at room temperature.
- Component (C) is not particularly limited, but examples include methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methylacetoacetate peroxide, and acetylacetone peroxide.
- organic peroxides may be used alone or in combination.
- dialkyl peroxide compounds, peroxydicarbonate compounds, and peroxyester compounds are preferably used from the viewpoint of curability.
- organic peroxides suitable for redox reactions include dialkyl peroxide compounds.
- a curing accelerator can be blended for the purpose of promoting the redox reaction.
- the thermally conductive resin composition of the present invention can be used as a one-liquid composition.
- curing accelerators are not particularly limited, but are preferably saccharin (o-benzoixsulphimide), hydrazine compounds, amine compounds, mercaptan compounds, thiourea compounds, metal organic compounds, and the like.
- the curing accelerators may be used alone or in combination. It is preferable to use them together from the viewpoint of curing acceleration.
- the curing accelerator is preferably a combination of a hydrazine-based compound or a thiourea compound and a metal organic compound, and most preferably a combination of a hydrazine-based compound and a metal organic compound.
- hydrazine compounds include 1-acetyl-2-phenylhydrazine, 1-acetyl-2(p-tolyl)hydrazine, 1-benzoyl-2-phenylhydrazine, 1-(1',1',1' -trifluoro)acetyl-2-phenylhydrazine, 1,5-diphenyl-carbohydrazine, 1-formyl-2-phenylhydrazine, 1-acetyl-2-(p-bromophenyl)hydrazine, 1-acetyl-2-( p-nitrophenyl)hydrazine, 1-acetyl-2-(2'-phenylethylhydrazine), ethyl carbazate, p-nitrophenylhydrazine, p-trisulfonylhydrazide and the like.
- amine compound examples include heterocyclic secondary amines such as 2-ethylhexylamine, 1,2,3,4-tetrahydroquinone and 1,2,3,4-tetrahydroquinaldine; quinoline, methylquinoline, quinaldine; , heterocyclic tertiary amines such as quinoxalinephenazine; aromatic tertiary amines such as N,N-dimethyl-para-toluidine, N,N-dimethyl-anisidine, N,N-dimethylaniline; -Azole compounds such as triazole, oxazole, oxadiazole, thiadiazole, benzotriazole, hydroxybenzotriazole, benzoxazole, 1,2,3-benzothiadiazole, and 3-mercaptobenzotriazole.
- heterocyclic secondary amines such as 2-ethylhexylamine, 1,2,3,4-tetrahydroquinone and 1,2,3,4-
- Examples of the mercaptan compound include n-dodecyl mercaptan, ethyl mercaptan, butyl mercaptan, tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, pentaerythritol tetrakis(3-mercaptopropionate), dipenta Erythritol hexakis(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthioglycolate and the like.
- thiourea compound examples include ethylenethiourea, diethylthiourea, tetramethylthiourea, monoacetylthiourea, monobenzoylthiourea, diphenylthiourea, N,N'-dibutylthiourea, and N,N'-dioctylthiourea. etc.
- metal organic compound examples include pentadione iron, pentadione cobalt, neodecanoate cobalt, pentadione copper, propylenediamine copper, ethylenediamine copper, neodecanoate copper, iron naphtate, nickel naphtate, cobalt naphtate, copper naphtate, and copper octate. , iron hexoate, iron propionate, acetylacetone vanadium and the like.
- the addition amount (blended amount) of the curing accelerator is not particularly limited, but for example, the curing accelerator is added in an amount of 0.001 to 20 parts by mass with respect to a total of 100 parts by mass of the components (A) and (B). , more preferably 0.002 to 15 parts by mass, still more preferably 0.003 to 10 parts by mass, and particularly preferably 0.3 to 2.0 parts by mass.
- the curing accelerator is added in an amount of 0.001 to 20 parts by mass with respect to a total of 100 parts by mass of the components (A) and (B). , more preferably 0.002 to 15 parts by mass, still more preferably 0.003 to 10 parts by mass, and particularly preferably 0.3 to 2.0 parts by mass.
- the amount of the curing accelerator added is the total of 100 parts by mass of the components (A) and (B). is the total amount of accelerator. Therefore, for example, when a hydrazine-based compound and a metal organic compound are used in combination as a curing accelerator, the amount of the curing accelerator added (mixed amount) is 100 in total for the components (A) and (B). It is the total amount of the hydrazine-based compound and the metal organic compound relative to parts by mass.
- the plasticizer which is the component (D) contained in the thermally conductive resin composition of the present invention, is combined with the other components of the present invention to provide a cured product having excellent tensile strength and extensibility while maintaining thermal conductivity.
- a thermally conductive resin composition can be obtained.
- the component (D) is not particularly limited, but examples include polyether plasticizers, (meth)acrylic polymer plasticizers, phthalate plasticizers, polycarboxylic acid ester plasticizers, and polybutadiene plasticizers. , polyisoprene-based plasticizers, and the like.
- polyether-based plasticizers and (meth)acrylic polymer-based plasticizers are preferred, and polyether-based plasticizers are particularly preferred.
- the said (D) component is a compound which does not have a (meth)acryloyl group.
- the polyether-based plasticizer is a compound having a polyether skeleton.
- the polyether skeleton means a skeleton having an alkylene oxide such as polyethylene oxide, polypropylene oxide, polybutylene glycol, etc. Among them, polypropylene oxide is preferable.
- the repeating number of the alkylene oxide is not particularly limited, but is, for example, 3-300, more preferably 5-100, particularly preferably 10-60.
- the number average molecular weight of component (D) is not particularly limited, it is, for example, in the range of 200 to 30,000, preferably in the range of 350 to 10,000, and particularly preferably in the range of 500 to 5,000.
- the number average molecular weight was calculated by a standard polystyrene conversion method using size exclusion chromatography (SEC) unless otherwise specified.
- SEC size exclusion chromatography
- polyether-based plasticizers for component (D) are not particularly limited, but examples include PEG#300, PEG#400, PEG#600, PEG#1000, PEG#1500, PEG#15400, and PEG#. 2000, PEG#4000, PEG#6000, PEG#1100, PEG#2000, Uniol D-700, D-1000, D-1200, D-2000, D-4000, PB-500, PB-700, PB-1000 , PB-2000 (manufactured by NOF Corporation) and the like.
- the addition amount (blending amount) of the component (D) is not particularly limited. , more preferably 15 to 150 parts by mass, particularly preferably 20 to 100 parts by mass. By being within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and extensibility can be obtained while maintaining thermal conductivity.
- the thermally conductive resin composition contains two or more types of component (D)
- the amount of component (D) added (blending amount) is based on a total of 100 parts by mass of component (A) and component (B). , is the total amount of the (D) component.
- the addition amount (blended amount) of the component (D) is preferably in the range of 1 to 10 parts by mass, more preferably 3 to 5 parts by mass, with respect to the total 100 parts by mass of the thermally conductive resin composition. is. By being within the above range, it is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining thermal conductivity.
- the thermally conductive resin composition contains two or more types of (D) component
- the amount of (D) component added (blended amount) is ) is the total amount of the ingredients.
- the (E) component of the present invention is not particularly limited as long as it is heat conductive powder.
- Component is preferably (E1) thermally conductive powder having an average particle size of 0.01 ⁇ m or more and less than 2.0 ⁇ m, (E2) thermally conductive powder having an average particle size of 2.0 ⁇ m or more and less than 20 ⁇ m, (E3 ) A mixture of thermally conductive powders having an average particle size of 20 ⁇ m or more and less than 150 ⁇ m.
- the component (E) comprises (E1) a thermally conductive powder having an average particle size of 0.01 ⁇ m or more and less than 2.0 ⁇ m, and (E2) an average particle size of 2.0 ⁇ m or more and less than 20 ⁇ m. and (E3) a thermally conductive powder having an average particle size of 20 ⁇ m or more and less than 150 ⁇ m.
- the average particle diameter of the component (E1) is preferably 0.01 ⁇ m or more and less than 2.0 ⁇ m, more preferably 0.1 ⁇ m or more and 1.9 ⁇ m or less, and 0.2 ⁇ m or more and 1 from the viewpoint of excellent tensile strength and extensibility. 0.8 ⁇ m or less is even more preferable, and 0.3 ⁇ m or more and 1.7 ⁇ m or less is particularly preferable.
- the average particle size of the component (E2) is preferably 2.0 ⁇ m or more and less than 20 ⁇ m (or 2.0 ⁇ m or more and less than 20.0 ⁇ m) from the viewpoint of excellent tensile strength and extensibility, and is 2.1 ⁇ m or more. 15 ⁇ m or less (or 2.1 ⁇ m or more and 15.0 ⁇ m or less) is more preferable, 2.2 ⁇ m or more and 8 ⁇ m or less (or 2.2 ⁇ m or more and 8.0 ⁇ m or less) is even more preferable, and 2.3 ⁇ m or more and 5 ⁇ m or less (or 2.3 ⁇ m or more and 5.0 ⁇ m or less) is particularly preferable.
- the average particle size of the component (E3) is preferably 20 ⁇ m or more and 150 ⁇ m or less, more preferably 23 ⁇ m or more and 100 ⁇ m or less, from the viewpoint of excellent tensile strength and extensibility while maintaining thermal conductivity, and 25 ⁇ m It is more preferably 70 ⁇ m or more, and particularly preferably 27 ⁇ m or more and less than 50 ⁇ m.
- the average particle size of the components (E1) to (E3) is the particle size (D50) at a cumulative volume ratio of 50% in the particle size distribution determined by the laser diffraction scattering method.
- the average particle size of the shortest length is taken as the average particle size.
- the mass ratio ((E1)/(E3)) of the (E1) component to the (E3) component is not particularly limited, but is, for example, 0.08 to 1.00. , preferably 0.09 to 0.90, more preferably 0.10 to 0.80, still more preferably 0.11 to 0.70, still more preferably 0.12 to 0.65 and particularly preferably 0.13 to 0.20.
- the tensile strength and extensibility are further improved while maintaining the thermal conductivity.
- the mass ratio ((E2)/(E3)) of the (E2) component to the (E3) component is not particularly limited, but is, for example, 0.15 to 1.50. , preferably 0.17 to 1.20, more preferably 0.18 to 1.00, still more preferably 0.20 to 1.00, still more preferably 0.23 to 0.95 and particularly preferably 0.25 to 0.30.
- the tensile strength and extensibility are further improved while maintaining the thermal conductivity.
- (E1) / (E3) is 0.08 to 1.0 (or 0.08 to 1.00) and ( E2)/(E3) is 0.15 to 1.5 (or 0.15 to 1.50), preferably (E1)/(E3) is 0.09 to 0.9 (or 0.09 to 0.90) and (E2)/(E3) is 0.17-1.2 (or 0.17-1.20), more preferably (E1)/(E3) is 0.10-0.
- the amount (blended amount) of component (E1) added is preferably 5 to 60 parts by mass, more preferably 5 to 30 parts by mass, with respect to a total of 100 parts by mass of (E1), (E2) and (E3), Still more preferably 7 to 28 parts by mass, particularly preferably 8 to 15 parts by mass.
- the amount of component (E2) added (blended amount) is preferably 10 to 65 parts by mass, more preferably 10 to 50 parts by mass, with respect to a total of 100 parts by mass of (E1), (E2) and (E3), Even more preferably 15 to 40 parts by weight, particularly preferably more than 15 parts by weight and less than 25 parts by weight.
- the amount of component (E3) added is preferably 30 to 85 parts by mass, more preferably 30 to 80 parts by mass, with respect to a total of 100 parts by mass of (E1), (E2) and (E3), Even more preferably 40 to 75 parts by mass, particularly preferably 65 parts by mass or more and less than 75 parts by mass.
- amount of the components (E1) to (E3) added (blended amount) is within the above range, the tensile strength and extensibility are further improved while maintaining the thermal conductivity.
- the mixing ratio of the components (E1) to (E3) is 5 to 60% by mass for the component (E1), and 10 to 65% by mass, and (E3) component is preferably 30 to 85% by mass, (E1) component is 5 to 30% by mass, (E2) component is 10 to 50% by mass, and (E3) component is more preferably 30 to 80% by mass, the (E1) component is 7 to 28% by mass, the (E2) component is 15 to 40% by mass, and the (E3) component is 40 to 75% by mass. Even more preferably, the component (E1) is 8 to 15% by mass, the component (E2) is more than 15% by mass and less than 25% by mass, and the component (E3) is 65% by mass or more and less than 75% by mass. preferable. When the mixing ratio of the components (E1) to (E3) is within the above range, the tensile strength and extensibility are further improved while maintaining the thermal conductivity.
- the content of the component (E1) is, for example, 60 to 400 parts by mass with respect to a total of 100 parts by mass of the components (A) and (B), and is preferably is 70 to 300 parts by mass, more preferably 80 to 250 parts by mass, and particularly preferably more than 80 parts by mass and less than 100 parts by mass.
- the content of component (E2) is preferably 110 to 400 parts by mass, more preferably 120 to 350 parts by mass, with respect to 100 parts by mass of components (A) and (B) combined. and particularly preferably 125 parts by mass or more and less than 200 parts by mass.
- the content of component (E3) is preferably 400 to 1200 parts by mass, more preferably 450 to 1000 parts by mass, with respect to the total 100 parts by mass of components (A) and (B). parts, particularly preferably more than 450 parts by mass and less than 600 parts by mass.
- the content of the component (E) (that is, the total content of the components (E1) to (E3)) is not particularly limited, but for example, the total content of the thermally conductive resin composition of the present invention (100% by mass) , preferably 55 to 99% by mass, more preferably 70 to 95% by mass, even more preferably 75 to 93% by mass, and particularly preferably 80 to 90% by mass.
- the tensile strength and extensibility are further improved while maintaining the thermal conductivity.
- the components (E1) to (E3) are each independently at least one thermally conductive powder selected from the group consisting of alumina, zinc oxide, aluminum nitride, boron nitride, carbon and diamond. More preferably, it is at least one thermally conductive powder independently selected from the group consisting of alumina, aluminum nitride and boron nitride, since it has excellent thermal conductivity. From the viewpoint of further improving the effects of the present invention, at least one of the components (E1) to (E3) is preferably alumina, and it is particularly preferred that all of the components (E1) to (E3) are alumina. . Moreover, the (E) component may be surface-treated. Moreover, these may be used alone or in combination of two or more.
- the shape of the components (E1) to (E3) is preferably spherical or amorphous.
- spherical includes not only perfect spheres but also shapes such as almost spherical and elliptical. More specifically, “spherical” means that the average circularity is 0.4 or more.
- amorphous refers to a shape having corners other than a spherical shape (eg, needle-like, fibrous, scale-like, dendritic, flat plate-like, crushed shape, etc.). More specifically, “irregular” means that the average circularity is less than 0.4.
- component (E) is a mixture containing spherical thermally conductive powder and amorphous thermally conductive powder, it is possible to obtain a cured product with further improved thermal conductivity.
- the degree of circularity is obtained by obtaining a projected particle image using, for example, a flow-type particle image analyzer FPIA-3000 (manufactured by Malvern Co., Ltd.), and X is the perimeter of a circle having a projected area equal to that of the projected particle image. It is a value expressed by X/Y, where Y is the length of the contour line of the particle projection image. Furthermore, the average circularity is calculated by summing the circularity of each particle and dividing by the total number of particles.
- the shape of the component (E1) is preferably spherical.
- the shape of the component (E1) is preferably amorphous.
- the shape of the (E2) component is preferably spherical. Further, from the viewpoint of excellent tensile strength and extensibility, the shape of the component (E3) is preferably spherical. Therefore, in one embodiment of the invention, the (E2) and (E3) components are spherical thermally conductive powders.
- the (E1) component is spherical or amorphous thermally conductive powder
- the (E2) and (E3) components are spherical thermally conductive powders.
- the (E1) component is amorphous thermally conductive powder
- the (E2) and (E3) components are spherical thermally conductive powders.
- component (E) Commercial products of the component (E) are not particularly limited, but can be obtained, for example, from Showa Denko Co., Ltd., Nippon Light Metal Co., Ltd., Nippon Steel & Sumikin Materials Co., Ltd., Denka Co., Ltd., and the like.
- thermoly conductive resin composition of the present invention within a range that does not impair the object of the present invention, polyfunctional (meth)acrylic monomers having two or more functions, various elastomers such as styrene copolymers, silane coupling agents, Inorganic fillers (excluding component (E) above), organic fillers (excluding component (E) above), flame retardants, storage stabilizers, antioxidants, light stabilizers, rust inhibitors, solvents, pigments, dyes , tackifiers and surfactants can be used.
- polyfunctional (meth)acrylic monomers having two or more functions various elastomers such as styrene copolymers, silane coupling agents, Inorganic fillers (excluding component (E) above), organic fillers (excluding component (E) above), flame retardants, storage stabilizers, antioxidants, light stabilizers, rust inhibitors, solvents, pigments, dyes , tackifiers and surfactants can be used.
- thermoly conductive resin composition of the present invention there is no particular limitation as long as it is a bifunctional or higher polyfunctional (meth)acrylic monomer contained in the thermally conductive resin composition of the present invention. Among them, tetrafunctional or higher (meth)acrylic monomers are preferred.
- the tetrafunctional or higher (meth)acrylic monomer is not particularly limited, and examples thereof include ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, and alkyl-modified dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate and the like. These polymerizable monomers can be used alone or as a mixture of two or more.
- the tetrafunctional or higher polyfunctional (meth)acrylic monomer is preferably in the range of 0.1 to 15 parts by mass, more preferably 0 0.2 to 5 parts by mass, particularly preferably 0.3 to 3 parts by mass. Within the above range, the tensile strength and extensibility are further improved.
- the addition amount (blended amount) of the tetrafunctional or higher polyfunctional (meth)acrylic monomer is the total amount of tetrafunctional or higher polyfunctional (meth)acrylic monomers with respect to a total of 100 parts by mass of components (A) and (B).
- the inorganic filler examples include, but are not particularly limited to, glass, fumed silica, talc, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum hydroxide, kaolin clay, dried clay mineral, and dried diatomaceous earth. Among them, glass, fumed silica, talc, and mica are preferred.
- the fumed silica can be blended for the purpose of improving the mechanical strength of the cured product of the thermally conductive resin composition.
- those subjected to hydrophobic treatment with organochlorosilanes, polyorganosiloxane, hexamethyldisilazane, or the like can be used.
- Specific examples of silica include commercially available products such as Aerosil R974, R972, R972V, R972CF, R805, R812, R812S, R816, R8200, RY200, RX200, RY200S and R202 manufactured by Nippon Aerosil. These may be used singly or in combination.
- organic filler examples include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate.
- Organic hollow fillers such as MMA-AN-MAN copolymers are also included.
- the amount of the filler to be added is not particularly limited. .1 to 300 parts by mass, particularly preferably 0.5 to 150 parts by mass. These may be used singly or in combination.
- the addition amount of the above filler intends the total amount of the inorganic filler and the organic filler. Therefore, when the thermally conductive resin composition contains two or more inorganic fillers, two or more organic fillers, or a combination of one or more inorganic fillers and one or more organic fillers, the above The amount of the filler added is the total amount of the filler per 100 parts by mass of the components (A) and (B).
- Examples of the flame retardant include aluminum hydroxide and magnesium hydroxide.
- aluminum hydroxide or magnesium hydroxide is treated as a flame retardant rather than the component (E) of the present invention.
- the thermally conductive resin composition of the present invention can be produced by a conventionally known method.
- predetermined amounts of components (A) to (E) and other optional components are blended and mixed using a mixer such as a planetary mixer at a temperature of preferably 10 to 70°C, more preferably 10 to 70°C.
- a mixer such as a planetary mixer at a temperature of preferably 10 to 70°C, more preferably 10 to 70°C.
- a mixer such as a planetary mixer at a temperature of preferably 10 to 70°C, more preferably 10 to 70°C.
- defoaming treatment may be performed after the above mixing.
- the curing form of the thermally conductive resin composition of the present invention can be selected from photocuring, heat curing, or redox curing by selecting the component (C) of the present invention.
- a photoradical polymerization initiator is selected, and when it is desired to impart curing by heat curing or redox reaction, an organic peroxide may be selected.
- the curing conditions for imparting photocurability to the thermally conductive resin composition of the present invention are as follows. Not particularly limited, for example, low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, ultra high pressure mercury lamp, black light lamp, microwave excited mercury lamp, metal halide lamp, sodium lamp, halogen lamp, xenon lamp, LED, fluorescent lamp, sunlight, An electron beam irradiation device and the like can be mentioned.
- the amount of light irradiation is preferably 10 kJ/m 2 or more, more preferably 15 kJ/m 2 or more, from the viewpoint of the properties of the cured product.
- the curing conditions when heat curing is imparted to the thermally conductive resin composition of the present invention are not particularly limited. °C.
- the curing time is not particularly limited, but when the temperature is 45° C. or more and less than 200° C., it is preferably 3 minutes or more and less than 5 hours, more preferably 10 minutes or more and 3 hours or less.
- the curing conditions for the thermally conductive resin composition of the present invention containing a curing accelerator are not particularly limited. be.
- the curing time is not particularly limited, but is preferably 24 hours or more and 100 hours or less, more preferably 36 hours or more and 90 hours or less.
- a cured product obtained by curing the thermally conductive resin composition of the present invention is also part of the embodiment of the present invention.
- a joined body formed by bonding with the thermally conductive resin composition of the present invention is also a part of the embodiment of the present invention.
- the present invention also provides a cured product obtained from the thermally conductive resin composition of the present invention.
- the present invention also provides a joined body formed by bonding with the thermally conductive resin composition of the present invention.
- the thermally conductive resin composition of the present invention can be used as a one-component composition, but can also be used as a two-component composition.
- the components are divided into an A component and a B component, with the A component containing at least the component (C) and the B component containing at least a curing accelerator.
- the present invention also provides a thermally conductive resin composition containing the following agents A and B:
- Agent A a composition containing the following components (A) to (E);
- component urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end
- component monofunctional (meth)acrylic having a polyether skeleton and no urethane skeleton
- D) Plasticizer Component
- E Thermally conductive powder
- Agent B A composition containing at least a curing accelerator.
- the two liquids can be mixed or applied separately and brought into contact with each other to cure at room temperature (25° C.).
- components other than the component (C) and the curing accelerator can be divided at any ratio and included in any liquid.
- thermally conductive resin compositions containing the following agents A and B examples include thermally conductive resin compositions containing the following agents A and B.
- Agent A a composition containing the following components (A) to (E); (A) component: urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end (B) component: monofunctional (meth)acrylic having a polyether skeleton and no urethane skeleton Monomer (C) component: radical polymerization initiator (D) component: plasticizer (E) component: thermally conductive powder B agent: containing at least a curing accelerator, optionally (A), (B), (D) , (E) component.
- the (A) component, (B) component, (C) component and curing accelerator, (D) component, and (E) component are the above ⁇ (A) component> and ⁇ (B) component, respectively. >, ⁇ (C) component>, ⁇ (D) component>, and ⁇ (E) component> can be used.
- the same amount as defined above can be applied to the addition amount (compound amount) of each component.
- agents A and B can similarly contain the additives specified in the above ⁇ optional ingredients>.
- agent A and agent B contain optional components
- the same compounds as defined in the above ⁇ optional component> can be used as optional components.
- the same amount as defined above can be applied to the addition amount (blended amount) of the optional component.
- the mixing ratio of agent A and agent B is not particularly limited, and it is preferable that the ratio is such that each component has an appropriate amount as described above.
- the mixing ratio of agent A and agent B (mixing mass ratio of agent A: agent B) is preferably from 0.1:1 to 10:1, more preferably from 0.3:1 to 3:1, particularly preferably 0.5:1 to 1.5:1. With the above mixing ratio, it is possible to obtain a thermally conductive resin composition from which a cured product excellent in tensile strength and elongation can be obtained while maintaining thermal conductivity.
- cured material which is excellent in tensile strength and extensibility is obtained, maintaining thermal conductivity. That is, the present invention comprises components (A''), (B''), (C) and (E), the tensile strength of the cured product is 0.40 MPa or more, and the elongation of the cured product is 60 to 1500.
- the (A'') component includes, in addition to the urethane (meth)acrylate defined in ⁇ (A) component> above, a urethane (meth)acrylate having a polybutadiene skeleton having (meth)acryloyl groups at both ends.
- Hydrogenated polybutadiene skeleton urethane (meth)acrylate having (meth)acryloyl groups at both ends polycarbonate skeleton urethane (meth)acrylate having (meth)acryloyl groups at both ends, (meth)acryloyl groups at both ends urethane (meth)acrylate having a polyether skeleton, urethane (meth)acrylate having a polyester skeleton having (meth)acryloyl groups at both ends, urethane (meth)acrylate having a castor oil skeleton having (meth)acryloyl groups at both ends, Polybutadiene skeleton urethane (meth)acrylate having a (meth)acryloyl group at one end, hydrogenated polybutadiene skeleton urethane (meth)acrylate having a (meth)acryloyl group at one end, polycarbonate having a (meth)acryloyl group at one end
- Examples include urethan
- urethane (meth)acrylate having a polyether skeleton having a (meth)acryloyl group at one end defined in the above ⁇ (A) component> is preferably used. It is possible to obtain a thermally conductive resin composition from which a cured product having excellent tensile strength and elongation can be obtained while maintaining the properties.
- A) Component> the same amounts can be applied by replacing (A) component with (A'') component.
- the (B′′) component includes, in addition to the monofunctional (meth)acrylic monomer defined in ⁇ (B) component> above, ethyl (meth)acrylate, n-butyl (meth)acrylate, ter - butyl (meth)acrylate, isobutyl methacrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, glycidyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxy (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, benzyl (meth)acryl
- monofunctional (meth)acrylic monomers having a polyether skeleton defined in ⁇ (B) component> above but not having a urethane skeleton are preferably used.
- the amount (blending amount) of the component (B'') to be added can be the same as that in ⁇ (B) component> above by replacing the component (B) with the component (B'').
- the same compounds as defined in ⁇ (C) component> and ⁇ (E) component> can be used as the (C) component and the (E) component, respectively.
- the amounts of the components (C) and (E) to be added can be the same amounts as defined in the above ⁇ (C) component> and ⁇ (E) component>, respectively.
- the thermally conductive resin composition according to the above aspect may contain a plasticizer in addition to the above components (A''), (B''), (C) and (E).
- the plasticizer can be the same compound as defined in ⁇ (D) component> above.
- the amount of the plasticizer to be added (compounded amount) at this time can be the same amount as defined in ⁇ (D) component> above.
- the thermally conductive resin composition according to the above aspect may contain other additives in addition to or instead of the plasticizer.
- the other additives may be the same compounds as those defined in ⁇ Optional components> above.
- the amount of other additives to be added can also be the same amount as defined in ⁇ Optional Components> above.
- the elongation of the cured product of the thermally conductive resin composition of the present invention is preferably 60 to 1500%, more preferably 65 to 1000%, and still more preferably 70 to 500% from the viewpoint of high elongation, Particularly preferably, it is 80 to 500%.
- a method for measuring the elongation of the cured product is, for example, as follows.
- the thermally conductive resin composition is set so that the thickness (thickness after curing) is 1 mm, heated at 120 ° C. for 20 minutes, and cured to form a sheet-like cured product. to make.
- a No. 3 dumbbell is punched to prepare a test piece, and marked lines at intervals of 20 mm are drawn on the test piece. Both ends of the test piece are fixed to chucks so that the long axis of the test piece and the center of the chuck are aligned, and the test piece is pulled at a tensile speed of 500 mm/min until the test piece is cut.
- the distance between the marked lines is measured with a vernier caliper until the test piece is cut.
- the rate of elongation is defined as "elongation rate (%)" based on the initial gauge line spacing.
- the tensile strength of the cured product of the thermally conductive resin composition of the present invention is preferably 0.40 MPa or more, more preferably 0.50 MPa or more, and particularly 0.60 MPa or more, from the viewpoint of high strength. preferable.
- the method for measuring the tensile strength of the cured product is, for example, as follows.
- the thermally conductive resin composition was set to have a thickness (thickness after curing) of 1 mm, heated at 120° C. for 20 minutes, and cured to produce a sheet-like cured product.
- a test piece was produced by punching with a No. 3 dumbbell. Fix both ends of the test piece to the chuck so that the long axis of the test piece and the center of the chuck are aligned.
- the test piece is pulled with a universal testing machine (Tensilon manufactured by Orientec Co., Ltd.) at a tensile speed of 500 mm/min to measure the maximum load.
- the strength at the maximum load is defined as "tensile strength (MPa)".
- the cured product of the thermally conductive resin composition of the present invention can maintain high thermal conductivity.
- the thermal conductivity of the cured product is preferably 1.5 W/m ⁇ k or more, more preferably 1.9 W/m ⁇ k or more, and 2.0 W/m ⁇ k or more. is particularly preferred.
- a method for measuring the thermal conductivity of the cured product is, for example, as follows.
- thermal conductivity of cured product A thermally conductive resin composition is applied to a thickness of 500 ⁇ m and heated at 120°C for 20 minutes to prepare a test piece. Thermal conductivity is measured at 25° C. using an ai-Phase Mobile 1u thermal diffusivity/thermal conductivity measuring device manufactured by iPhase.
- ⁇ Application method> As a method for applying the thermally conductive resin composition of the present invention to a substrate, a known method for applying an adhesive or paint is used. For example, methods such as dispensing using an automatic coating machine, spraying, inkjet, screen printing, gravure printing, dipping, and spin coating can be used.
- the thermally conductive resin composition of the present invention can be used in various fields such as the field of automobiles, the field of electric and electronic parts, and the field of aerospace.
- the heat dissipation method using the thermally conductive resin composition of the present invention is to apply the thermally conductive resin composition of one aspect of the present invention to an electronic component or an electric/electronic component. Examples include those that dissipate heat generated from components to the outside.
- Electronic devices such as personal computers; lighting devices such as LEDs; optical pickup modules; camera modules; sensing devices; power semiconductors; Converter for EV; HEV, FCV, ECU parts for EV, etc.
- the present invention provides an electronic component or electric/electronic component characterized by heat dissipation by means of a thermally conductive resin composition.
- ⁇ (D) Component> d1 Polypropylene glycol having a number average molecular weight of 2000 and a repeating number of alkylene oxide of 34 (Uniol D-2000 manufactured by NOF Corporation)
- e2 Spherical alumina powder with an average particle size of 3.0 ⁇ m (manufactured by Nippon Steel & Sumikin Materials Co., Ltd.)
- e3 Spherical alumina powder with an average particle size of 35.0 ⁇ m (manufactured by Nippon Steel & Sumikin Materials Co., Ltd.)
- the test methods of tests (1) to (3) used in Examples and Comparative Examples in Table 1 are as follows.
- Thermal conductivity measurement> Each thermally conductive resin composition in Table 1 was applied to a thickness of 500 ⁇ m and heated at 120° C. for 20 minutes to prepare a test piece. Thermal conductivity was measured at 25° C. using an ai-Phase Mobile 1u thermal diffusivity/thermal conductivity measuring device manufactured by iPhase. The higher the thermal conductivity, the easier it is for heat to be conducted, which is preferable. In particular, in the present invention, it is preferably 1.5 W/m ⁇ k or more, more preferably 1.9 W/m ⁇ k or more, and particularly preferably 2.0 W/m ⁇ k or more.
- Each thermally conductive resin composition in Table 1 was set to have a thickness (thickness after curing) of 1 mm, heated at 120° C. for 20 minutes, and cured to prepare a sheet-like cured product.
- a test piece was produced by punching with a No. 3 dumbbell. Both ends of the test piece were fixed to the chuck so that the long axis of the test piece and the center of the chuck were aligned. The test piece was pulled with a universal testing machine (Tensilon manufactured by Orientec Co., Ltd.) at a tensile speed of 500 mm/min to measure the maximum load. The strength at the maximum load was defined as "tensile strength (MPa)".
- the tensile strength is preferably 0.40 MPa or more, more preferably 0.50 MPa or more, and particularly preferably 0.60 MPa or more.
- Each thermally conductive resin composition in Table 1 was set to have a thickness (thickness after curing) of 1 mm, heated at 120° C. for 20 minutes, and cured to prepare a sheet-like cured product.
- a test piece was produced by punching with a No. 3 dumbbell, and marked lines at intervals of 20 mm were drawn on the test piece. It is fixed to a chuck in the same manner as the measurement of tensile strength, and pulled with a universal testing machine (Tensilon manufactured by Orientec Co., Ltd.) at a tensile speed of 500 mm/min until the test piece is cut.
- the rate of elongation was defined as "elongation rate (%)" based on the initial interval between gauge lines. Evaluation was made based on the following criteria, and the results are shown in Table 1.
- the elongation percentage is preferably 60 to 1500%, more preferably 65 to 1000%, even more preferably 70 to 500%, and particularly preferably 80 to 500%, from the viewpoint of high elongation.
- the present invention is a thermally conductive resin composition that provides a cured product with excellent tensile strength and elongation while maintaining thermal conductivity.
- Comparative Example 1 in Table 1 is a thermally conductive resin composition that does not contain the component (D) of the present invention, but it is found to be a cured product with poor extensibility.
- Comparative Examples 2 and 3 are thermally conductive resin compositions using a'1 and a'2 components that are not the (A) component of the present invention, but it can be seen that the cured products are inferior in extensibility.
- Comparative Examples 4 to 6 are thermally conductive resin compositions using b'1 to b'3 components that are not the (B) component of the present invention, but Comparative Example 4 is a cured product with poor elongation. It can be seen that the cured products of Comparative Examples 5 and 6 are inferior in tensile strength.
- thermally conductive resin composition was examined as a two-component composition.
- a agent and B agent of the thermally conductive resin composition of Example 6 55 parts by mass of the a1 component as the A component (A), 35 parts by mass of the b1 component as the (B) component, 30 parts by mass of the d1 component as the (D) component, and (c3 ) and 80 parts by mass of the e1 component, 120 parts by mass of the e2 component, and 440 parts by mass of the e3 component as the component (E). and mixed with a mixer for 60 minutes to obtain agent A.
- a1 component as the B agent (A) component 55 parts by mass of the a1 component as the B agent (A) component, 35 parts by mass of the b1 component as the (B) component, 30 parts by mass of the d1 component as the (D) component, and 1-acetyl as the curing accelerator -2-Phenylhydrazine (Aldrich reagent) 1 part by mass, 0.1 part by mass of copper neodecanoate (manufactured by Chuo Kagaku Sangyo Co., Ltd.) having an active ingredient ratio of 5% by mass, and the e1 component as the (E) component 80 parts by mass of , 120 parts by mass of the e2 component, and 440 parts by mass of the e3 component were added and mixed in a mixer at room temperature (25°C) for 60 minutes to obtain a B agent.
- Aldrich reagent 1 part by mass
- copper neodecanoate manufactured by Chuo Kagaku Sangyo Co.,
- Agent B' 55 parts by mass of the a'1 component as a comparative component of the (A) component, 35 parts by mass of the b1 component as the (B) component, 30 parts by mass of the d1 component as the (D) component, and curing acceleration As agents, 1-acetyl-2-phenylhydrazine (reagent) 1 part by mass, 0.1 parts by mass of copper neodecanoate (manufactured by Chuo Kagaku Sangyo Co., Ltd.) having an active ingredient ratio of 5% by mass, and component (E) 80 parts by mass of the e1 component, 120 parts by mass of the e2 component, and 440 parts by mass of the e3 component were added and mixed at room temperature (25° C.) with a mixer for 60 minutes to obtain agent B'.
- 1-acetyl-2-phenylhydrazine (reagent) 1 part by mass
- 0.1 parts by mass of copper neodecanoate manufactured by Chuo Kagaku Sang
- Example 6 The results were 2.0 W/m ⁇ k for Example 6 and 1.9 W/m ⁇ k for Comparative Example 7. Note that the higher the thermal conductivity, the easier the heat is transmitted, so it is preferable. In particular, it is preferably 1.5 W/m ⁇ k or more in the present invention.
- test piece was pulled with a universal testing machine (Tensilon manufactured by Orientec Co., Ltd.) at a tensile speed of 500 mm/min to measure the maximum load.
- the strength at the maximum load was defined as "tensile strength (MPa)". Details comply with JIS K 6251 (2010).
- the tensile strength is preferably 0.40 MPa or more, more preferably 0.50 MPa or more, and particularly preferably 0.60 MPa or more.
- the elongation percentage is preferably 60% or more, more preferably 65% or more, and particularly preferably 70% or more from the viewpoint of high elongation.
- the present invention is a thermally conductive resin composition that provides a cured product with excellent tensile strength and elongation while maintaining thermal conductivity, and is industrially useful because it can be used in various fields. .
Abstract
Description
[1]下記の(A)~(E)成分を含む、熱伝導性樹脂組成物。
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体。
[2]下記のA剤とB剤を含む、熱伝導性樹脂組成物。
A剤:下記の(A)~(E)成分を含む組成物。
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体
B剤:少なくとも硬化促進剤を含む組成物。
[3]前記(A)成分の添加量(配合量)が、前記(A)成分および前記(B)成分の合計100質量部に対して、20~90質量部の範囲である、[1]又は[2]に記載の熱伝導性樹脂組成物。
[4]前記(D)成分の添加量(配合量)が、前記(A)成分および前記(B)成分の合計100質量部に対して、10~200質量部の範囲である、[1]~[3]のいずれか1項に記載の熱伝導性樹脂組成物。
[5]前記(D)成分が、ポリエーテル系可塑剤である、[1]~[4]のいずれか1項に記載の熱伝導性樹脂組成物。
[6]前記(E)成分が、
(E1)平均粒径0.01μm以上2.0μm未満の熱伝導性粉体と、
(E2)平均粒径2.0μm以上20μm未満の熱伝導性粉体と、
(E3)平均粒径20μm以上150μm未満の熱伝導性粉体と、を含む、[1]~[5]のいずれか1項に記載の熱伝導性樹脂組成物。
[7]前記(E)成分の(E1)/(E3)の質量比が0.08~1.00かつ(E2)/(E3)の質量比が0.15~1.50である、[6]に記載の熱伝導性樹脂組成物。
[8]硬化物の伸び率が60~1500%である、[1]~[7]のいずれか1項に記載の熱伝導性樹脂組成物。
[9][1]~[8]のいずれか1項に記載の熱伝導性樹脂組成物から得られる硬化物。
[10][1]~[8]のいずれか1項に記載の熱伝導性樹脂組成物により放熱することを特徴とする電子部品。
[11]下記の(A”)、(B”)、(C)および(E)成分を含み、硬化物の引張強さが0.40MPa以上でありかつ硬化物の伸び率が60~1500%である、熱伝導性樹脂組成物。
(A”)成分:ウレタン(メタ)アクリレート
(B”)成分:ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(E)成分:熱伝導性粉体。
[12]前記(A”)成分の添加量(配合量)が、前記(A”)成分および前記(B”)成分の合計100質量部に対して、20~90質量部の範囲である、[11]に記載の熱伝導性樹脂組成物。
[13]さらに下記の(D)成分を含む、[11]または[12]に記載の熱伝導性樹脂組成物。
(D)成分:可塑剤。
[14]前記(D)成分の添加量(配合量)が、前記(A”)成分および前記(B”)成分の合計100質量部に対して、10~200質量部の範囲である、[13]に記載の熱伝導性樹脂組成物。
[15]前記(D)成分が、ポリエーテル系可塑剤である、[13]または[14]に記載の熱伝導性樹脂組成物。
[16]前記(E)成分が、
(E1)平均粒径0.01μm以上2.0μm未満の熱伝導性粉体と、
(E2)平均粒径2.0μm以上20μm未満の熱伝導性粉体と、
(E3)平均粒径20μm以上150μm未満の熱伝導性粉体とを含む、[11]~[15]のいずれか1項に記載の熱伝導性樹脂組成物。
[17]前記(E)成分の(E1)/(E3)の質量比が0.08~1.00かつ(E2)/(E3)の質量比が0.15~1.50である、[16]に記載の熱伝導性樹脂組成物。
[18][11]~[17]のいずれか1項に記載の熱伝導性樹脂組成物から得られる硬化物。
[19][11]~[17]のいずれか1項に記載の熱伝導性樹脂組成物により放熱することを特徴とする電子部品。
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体。
A剤:下記の(A)~(E)成分を含む組成物。
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体
B剤:少なくとも硬化促進剤を含む組成物。
(A”)成分:ウレタン(メタ)アクリレート
(B”)成分:ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(E)成分:熱伝導性粉体。
<(A)成分>
本発明の熱伝導性樹脂組成物に含まれる(A)成分は、片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレートである。ここで、「(A)成分が片末端に(メタ)アクリロイル基を有するポリエーテル骨格のウレタン(メタ)アクリレートである」とは、(A)成分が一方の末端にのみ(メタ)アクリロイル基を有すること、すなわち、(A)成分が一方の末端には(メタ)アクリロイル基を有するが、他方の末端には(メタ)アクリロイル基を持たないポリエーテル骨格のウレタン(メタ)アクリレートであることを意図する。このため、両末端に(メタ)アクリロイル基を有するポリエーテル骨格のウレタン(メタ)アクリレートは(A)成分には含まれない。(A)成分は、片末端に(メタ)アクリロイル基を有するポリエーテル骨格のウレタン(メタ)アクリレートであれば、特に制限されないが、本発明のその他成分と組み合わせることにより、熱伝導性を維持しつつ、引張り強さ、伸張性に優れる硬化物が得られる。前記ウレタン(メタ)アクリレートとは、イソシアネート基とヒドロキシ基を反応させたウレタン結合と(メタ)アクリロイル基とを有する化合物である。前記ポリエーテル骨格とは、例えば、ポリエチレンオキサイド、ポリプロピレンオキサイド、ポリブチレングリコールなどのアルキレンオキサイドを有する骨格を意味する。
本発明の熱伝導性樹脂組成物に含まれる(B)成分は、ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマーである。本発明の熱伝導性樹脂組成物に含まれる(B)成分である、ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマーであれば、特に制限されないが、本発明のその他成分と組み合わせることにより、熱伝導性を維持しつつ、引張り強さ、伸張性に優れる硬化物が得られる。前記ポリエーテル骨格とは、例えば、ポリエチレンオキサイド、ポリプロピレンオキサイド、ポリブチレングリコールなどのアルキレンオキサイドを有する骨格を意味する。より一層、熱伝導性を維持しつつ、引張り強さ、伸張性(特に伸張性)に優れる硬化物が得られる熱伝導性樹脂組成物を得られるとの観点から、(B)成分におけるポリエーテル骨格は、ポリエチレンオキサイドを有する骨格であることが好ましい。アルキレンオキサイド部位の繰り返し数は特に制限されないが、例えば、2~300であり、より一層、熱伝導性を維持しつつ、引張り強さ、伸張性(特に伸張性)に優れる硬化物が得られる熱伝導性樹脂組成物を得られるとの観点から、好ましくは2~9であり、より好ましくは5~9である。なお、単官能性(メタ)アクリルモノマーとは、1分子中に(メタ)アクリロイル基をひとつだけ有する化合物を意味する。
本発明で使用することができる(C)成分は、ラジカル重合開始剤である。このような(C)成分としては、光ラジカル重合開始剤(以下、光ラジカル開始剤とも称する)、有機過酸化物等が挙げられる。本発明の熱伝導性樹脂組成物の硬化形態は、本発明の(C)成分の選択により、光硬化、加熱硬化又はレドックス硬化を選択することが可能である。例えば、熱伝導性樹脂組成物に関して「光硬化性」を付与したい場合は、光ラジカル重合開始剤を選択し、「加熱硬化又はレドックス反応による硬化」を付与したい場合は、有機過酸化物を選択すればよい。これらのラジカル重合開始剤は単独で使用されてもよく、又は複数併用されてもよい。
本発明の熱伝導性樹脂組成物に含まれる(D)成分である可塑剤は、本発明のその他成分と組み合わせることで、熱伝導性を維持しつつ、引張り強さ、伸張性に優れる硬化物が得られる熱伝導性樹脂組成物を得ることができる。前記(D)成分としては、特に制限されないが、例えば、ポリエーテル系可塑剤、(メタ)アクリルポリマー系可塑剤、フタル酸エステル系可塑剤、多価カルボン酸エステル系可塑剤、ポリブタジエン系可塑剤、ポリイソプレン系可塑剤等が挙げられ、中でも、ポリエーテル系可塑剤、(メタ)アクリルポリマー系可塑剤が好ましく、特に好ましくは、ポリエーテル系可塑剤である。なお、前記(D)成分は、(メタ)アクリロイル基を有さない化合物である。これらの可塑剤は単独で使用されてもよく、又は複数併用されてもよい。
本発明の(E)成分は、熱伝導性粉体であれば特に制限されない。(E)成分は好ましくは、(E1)平均粒径0.01μm以上2.0μm未満の熱伝導性粉体、(E2)平均粒径2.0μm以上20μm未満の熱伝導性粉体、(E3)平均粒径20μm以上150μm未満の熱伝導性粉体の混合物である。すなわち、本発明の好ましい形態では、前記(E)成分が、(E1)平均粒径0.01μm以上2.0μm未満の熱伝導性粉体と、(E2)平均粒径2.0μm以上20μm未満の熱伝導性粉体と、(E3)平均粒径20μm以上150μm未満の熱伝導性粉体と、を含む。当該(E1)~(E3)成分を併用し、本発明のその他成分と組み合わせることにより、熱伝導性を維持しつつ、引張り強さ、伸張性に優れるという顕著な効果を有する。
本発明の熱伝導性樹脂組成物に対し、本発明の目的を損なわない範囲で、2官能以上の多官能性(メタ)アクリルモノマー、スチレン系共重合体等の各種エラストマー、シランカップリング剤、無機充填剤(前記(E)成分を除く)、有機充填剤(前記(E)成分を除く)、難燃剤、保存安定剤、酸化防止剤、光安定剤、防錆剤、溶剤、顔料、染料、タッキファイヤー及び界面活性剤等の添加剤を使用することができる。
本発明の熱伝導性樹脂組成物は、従来公知の方法により製造することができる。例えば、(A)成分~(E)成分並びにその他の任意成分の所定量を配合して、プラネタリーミキサー等のミキサー等の混合手段を使用して、好ましくは10~70℃の温度、より好ましくは20~50℃、特に好ましくは常温(25℃)で、好ましくは0.1~5時間、より好ましくは30分~3時間、特に好ましくは60分前後混合することにより製造することができる。なお、上記混合後、必要であれば、脱泡処理を施してもよい。
本発明の熱伝導性樹脂組成物の硬化形態は、本発明の(C)成分の選択により、光硬化、加熱硬化又はレドックス硬化を選択することが可能である。例えば、熱伝導性樹脂組成物に関して光硬化性を付与したい場合は、光ラジカル重合開始剤を選択し、加熱硬化又はレドックス反応による硬化を付与したい場合は、有機過酸化物を選択すればよい。
本発明の熱伝導性樹脂組成物は、一液型組成物として使用することもできるが、二液型組成物としても使用できる。二液型組成物とする際、A剤及びB剤に分け、A剤が少なくとも(C)成分を含有してなり、B剤が少なくとも硬化促進剤を含有してなることが好ましい。すなわち、本発明は、下記のA剤とB剤を含む、熱伝導性樹脂組成物をも提供する:
A剤:下記の(A)~(E)成分を含む組成物;
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体
B剤:少なくとも硬化促進剤を含む組成物。
A剤:下記の(A)~(E)成分を含む組成物;
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体
B剤:少なくとも硬化促進剤を含み、任意で(A)、(B)、(D)、(E)成分を含む組成物。
本発明によれば、熱伝導性を維持しつつ、引張り強さ、伸張性に優れる硬化物が得られる。すなわち、本発明は、(A”)、(B”)、(C)および(E)成分を含み、硬化物の引張強さが0.40MPa以上でありかつ硬化物の伸び率が60~1500%である、熱伝導性樹脂組成物をも提供する:
(A”)成分:ウレタン(メタ)アクリレート
(B”)成分:ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(E)成分:熱伝導性粉体。
熱伝導性樹脂組成物を厚さ(硬化後の厚さ)が1mmになるように設定し、120℃で20分間加熱し、硬化させてシート状の硬化物を作製する。3号ダンベルで打ち抜いてテストピースを作製し、20mm間隔の標線をテストピースに記入する。テストピースの長軸とチャックの中心が一直線になる様に、テストピースの両端をチャックに固定して、引張速度500mm/minで試験片の切断に至るまで引っ張る。測定時にテストピースが伸びて標線の間隔が広がるため、テストピースが切断されるまでノギスにより標線の間隔を計測する。初期の標線間隔を基準として、伸びた割合を「伸び率(%)」とする。
硬化物の引張強さは、JIS K6251(2010)に従う。詳細には、熱伝導性樹脂組成物を厚さ(硬化後の厚さ)が1mmになるように設定し、120℃で20分間加熱し、硬化させてシート状の硬化物を作製した。3号ダンベルで打ち抜いてテストピースを作製した。テストピースの長軸とチャックの中心が一直線になる様に、テストピースの両端をチャックに固定する。引張速度500mm/minでテストピースを万能試験機(オリエンテック社製テンシロン)で引張り、最大荷重を測定する。当該最大荷重時の強度を「引張強さ(MPa)」とする。
熱伝導性樹脂組成物を厚さが500μmになるように塗布し、120℃にて20分間加熱し試験片を作製する。熱伝導率の測定は、熱拡散率をアイフェイズ社製 ai-Phase Mobile 1u熱拡散率・熱伝導率測定装置を用いて25℃で測定する。
本発明の熱伝導性樹脂組成物を基材へ塗布する方法としては、公知の接着剤、塗料の塗布方法が用いられる。例えば、自動塗布機を用いたディスペンシング、スプレー、インクジェット、スクリーン印刷、グラビア印刷、ディッピング、スピンコートなどの方法を用いることができる。
本発明の熱伝導性樹脂組成物は、自動車分野、電気電子部品分野、航空宇宙分野等様々な分野で使用可能であるが、伝導性(特に熱伝導性)を維持しつつ、引張り強さ、伸張性に優れる硬化物が得られることから、電子基板の放熱;携帯電話、パソコンなどの電子機器の放熱;LED等の照明の放熱;光ピックアップモジュールの放熱;カメラモジュールの放熱;センシングデバイスの放熱;パワー半導体の放熱;ハイブリッド自動車、燃料電池自動車、電気自動車用インバーターの放熱;;ハイブリッド自動車、燃料電池自動車、電気自動車用コンバーターの放熱:電池パック、;ハイブリッド自動車、燃料電池自動車、電気自動車用ECU部品の放熱などの各種用途で使用可能である。
本発明の熱伝導性樹脂組成物の硬化物は、高い熱伝導性を発揮・維持できる。このため、本発明の熱伝導性樹脂組成物を用いた放熱方法は、本発明の一態様である熱伝導性樹脂組成物を電子部品または電気電子部品に塗布することにより、電子部品または電気電子部品から発生した熱を外部へ放熱させるものなどが挙げられる。前記電気電子部品としては、電子基板;携帯電話;パソコンなどの電子機器;LED等の照明機器;光ピックアップモジュール;カメラモジュール;センシングデバイス;パワー半導体;HEV、FCV、EV用インバーター;HEV、FCV、EV用コンバーター;HEV、FCV、EV用ECU部品などが挙げられる。
実施例1~5、比較例1~6
各成分を表1に示す質量部で採取し、遮光下で常温(25℃)にてミキサーで60分混合し、その後脱泡し熱伝導性樹脂組成物を得た。なお、詳細な添加量は表1に従い、数値は全て質量部で表記するものとする。なお、表1中の各成分は下記のとおりである。
a1:重量平均分子量が2.1万である片末端にアクリロイル基を有するポリエーテル系ウレタンアクリレート(根上工業株式会社製)
a2:重量平均分子量が3万である片末端にアクリロイル基を有するポリエーテル系ウレタンアクリレート(根上工業株式会社製)
<(A)成分の比較成分>
a’1:重量平均分子量が4万である両末端にアクリロイル基を有するポリエーテル系ウレタンアクリレート(三菱ケミカル株式会社製紫光UV-3700B)
a’2:重量平均分子量が2.4万である両末端にアクリロイル基を有するポリ(メタ)アクリル重合体(カネカ株式会社製RC-100C)
<(B)成分>
b1:エトキシジエチレングリコールモノアクリレート(共栄社化学株式会社製ライトアクリレートEC-A)
b2:メトキシノナエチレングリコールモノアクリレート(新中村化学工業株式会社製AM-90G)
<(B)成分の比較成分>
b’1:イソボルニルアクリレ-ト(大阪有機化学工業株式会社製IBXA)
b’2:フェノキシエチルアクリレート(共栄社化学株式会社製ライトアクリレートPO-A)
b’3:イソノニルアクリレート(大阪有機化学工業株式会社製INAA)
<(C)成分>
c1:t-ブチルペルオキシ-2-エチルヘキサノエート(日本油脂株式会社製パーブチルO)
c2:2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン(DOUBLE BOND CHEMICAL IND.CO.,LTD.製ダブルキュア173)
<(D)成分>
d1:数平均分子量2000であり、アルキレンオキサイドの繰り返し数が34であるポリプロピレングリコール(日油株式会社製ユニオールD-2000)
<(E)成分>
e1:平均粒径0.5μmの不定形アルミナ粉(日本軽金属株式会社製)
e2:平均粒径3.0μmの球状アルミナ粉(新日鉄住金マテリアルズ株式会社製)
e3:平均粒径35.0μmの球状アルミナ粉(新日鉄住金マテリアルズ株式会製)
表1の実施例、比較例において使用した試験(1)~(3)の試験方法は下記の通りである。
表1の各熱伝導性樹脂組成物を厚さが500μmになるように塗布し、120℃にて20分間加熱し試験片を作製した。熱伝導率の測定は熱拡散率をアイフェイズ社製 ai-Phase Mobile 1u熱拡散率・熱伝導率測定装置を用いて25℃で測定した。熱伝導率は大きいほど熱が伝わりやすいことから好ましい。特に、本発明において1.5W/m・k以上であることが好ましく、1.9W/m・k以上であることがより好ましく、2.0W/m・k以上であることが特に好ましい。
表1の各熱伝導性樹脂組成物を厚さ(硬化後の厚さ)が1mmになるように設定し、120℃で20分間加熱し、硬化させてシート状の硬化物を作製した。3号ダンベルで打ち抜いてテストピースを作製した。テストピースの長軸とチャックの中心が一直線になる様に、テストピースの両端をチャックに固定した。引張速度500mm/minでテストピースを万能試験機(オリエンテック社製テンシロン)で引張り、最大荷重を測定した。当該最大荷重時の強度を「引張強さ(MPa)」とした。結果を表1に示す。詳細はJIS K 6251(2010)に従う。なお、本発明において高強度であるとの観点から、引張強さは0.40MPa以上が好ましく、0.50MPa以上がより好ましく、0.60MPa以上が特に好ましい。
表1の各熱伝導性樹脂組成物を厚さ(硬化後の厚さ)が1mmになるように設定し、120℃で20分間加熱し、硬化させてシート状の硬化物を作製した。3号ダンベルで打ち抜いてテストピースを作製し、20mm間隔の標線をテストピースに記入した。引張強さの測定と同じ要領でチャックに固定して、引張速度500mm/minで試験片の切断に至るまで万能試験機(オリエンテック社製テンシロン)で引っ張る。測定時にテストピースが伸びて標線の間隔が広がるため、テストピースが切断されるまでノギスにより標線の間隔を計測した。初期の標線間隔を基準として、伸びた割合を「伸び率(%)」とした。下記の基準に基づき評価し、結果を表1に示す。なお、伸び率は高伸張性の観点から60~1500%が好ましく、より好ましくは65~1000%であり、さらに好ましくは70~500%であり、特に好ましくは80~500%である。
・A剤
(A)成分として前記a1成分が55質量部と、(B)成分として前記b1成分35質量部、(D)成分として前記d1成分が30質量部、(C)成分として、(c3)であるクメンヒドロペルオキシド1質量部と、(E)成分として前記e1成分が80質量部、前記e2成分が120質量部、前記e3成分が440質量部とを添加し、常温(25℃)にてミキサーで60分混合し、A剤を得た。
(A)成分として前記a1成分が55質量部と、(B)成分として前記b1成分35質量部、(D)成分として前記d1成分が30質量部、硬化促進剤として、1-アセチル-2-フェニルヒドラジン(アルドリッチ製試薬)1質量部と、有効成分割合が5質量%であるネオデカン酸銅(中央化学産業株式会社製)0.1質量部と、(E)成分として前記e1成分が80質量部、前記e2成分が120質量部、前記e3成分が440質量部とを添加し、常温(25℃)にてミキサーで60分混合し、B剤を得た。
・A’剤
(A)成分の比較成分として前記a’1成分が55質量部と、(B)成分として前記b1成分35質量部、(D)成分として前記d1成分が30質量部、(C)成分として、(c3)であるクメンヒドロペルオキシド1質量部と、(E)成分として前記e1成分が80質量部、前記e2成分が120質量部、前記e3成分が440質量部とを添加し、常温(25℃)にてミキサーで60分混合し、A’剤を得た。
(A)成分の比較成分として前記a’1成分が55質量部と、(B)成分として前記b1成分35質量部、(D)成分として前記d1成分が30質量部、硬化促進剤として、1-アセチル-2-フェニルヒドラジン(試薬)1質量部と、有効成分割合が5質量%であるネオデカン酸銅(中央化学産業株式会社製)0.1質量部と、(E)成分として前記e1成分が80質量部、前記e2成分が120質量部、前記e3成分が440質量部とを添加し、常温(25℃)にてミキサーで60分混合し、B’剤を得た。
実施例6、比較例7の各熱伝導性樹脂組成物のA剤100質量部とB剤100質量部をポリエチレン製容器に投入し、25℃環境下で、木製の棒を用いて10分間混合し、その後脱泡した。次いで、厚さが500μmになるように塗布し、25℃雰囲気下で72時間養生し試験片を作製した。熱伝導率の測定は熱拡散率をアイフェイズ社製 ai-Phase Mobile 1u熱拡散率・熱伝導率測定装置を用いて25℃で測定した。
実施例6、比較例7の各熱伝導性樹脂組成物のA剤100質量部とB剤100質量部をポリエチレン製容器に投入し、25℃環境下で、木製の棒を用いて10分間混合し、その後脱泡した。次いで、厚さ(硬化後の厚さ)が1mmになるように設定し、25℃雰囲気下で72時間養生し、硬化させてシート状の硬化物を作製した。3号ダンベルで打ち抜いてテストピースを作製した。テストピースの長軸とチャックの中心が一直線になる様に、テストピースの両端をチャックに固定した。引張速度500mm/minでテストピースを万能試験機(オリエンテック社製テンシロン)で引張り、最大荷重を測定した。当該最大荷重時の強度を「引張強さ(MPa)」とした。詳細はJIS K 6251(2010)に従う。
実施例6、比較例7の各熱伝導性樹脂組成物のA剤100質量部とB剤100質量部をポリエチレン製容器に投入し、25℃環境下で、木製の棒を用いて10分間混合した。次いで、厚さ(硬化後の厚さ)が1mmになるように設定し、25℃で雰囲気下で72時間養生し、硬化させてシート状の硬化物を作製した。3号ダンベルで打ち抜いてテストピースを作製し、20mm間隔の標線をテストピースに記入した。
Claims (11)
- 下記の(A)~(E)成分を含む、熱伝導性樹脂組成物。
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体。 - 下記のA剤とB剤を含む、熱伝導性樹脂組成物。
A剤:下記の(A)~(E)成分を含む組成物。
(A)成分:片末端に(メタ)アクリロイル基を有する、ポリエーテル骨格のウレタン(メタ)アクリレート
(B)成分:ポリエーテル骨格を有し、ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(D)成分:可塑剤
(E)成分:熱伝導性粉体
B剤:少なくとも硬化促進剤を含む組成物。 - 前記(A)成分と(B)成分の合計100質量部に対して、前記(A)成分が20~90質量部含む、請求項1又は2に記載の熱伝導性樹脂組成物。
- 前記(A)成分と(B)成分の合計100質量部に対して、前記(D)成分を10~200質量部含む、請求項1又は2に記載の熱伝導性樹脂組成物。
- 前記(D)成分が、ポリエーテル系可塑剤であることを特徴とする請求項1又は2に記載の熱伝導性樹脂組成物。
- 下記の(A”)、(B”)、(C)および(E)成分を含み、硬化物の引張強さが0.40MPa以上でありかつ硬化物の伸び率が60~1500%である、熱伝導性樹脂組成物。
(A”)成分:ウレタン(メタ)アクリレート
(B”)成分:ウレタン骨格を有さない単官能性(メタ)アクリルモノマー
(C)成分:ラジカル重合開始剤
(E)成分:熱伝導性粉体。 - 前記(E)成分が、
(E1)平均粒径0.01μm以上2.0μm未満の熱伝導性粉体と、
(E2)平均粒径2.0μm以上20μm未満の熱伝導性粉体と、
(E3)平均粒径20μm以上150μm未満の熱伝導性粉体とを含む、
請求項1又は2又は6に記載の熱伝導性樹脂組成物。 - 前記(E)成分の(E1)/(E3)の質量比が0.08~1.00かつ(E2)/(E3)の質量比が0.15~1.50である、請求項7に記載の熱伝導性樹脂組成物。
- 硬化物の伸び率が60~1500%である、請求項1又は2に記載の熱伝導性樹脂組成物。
- 請求項1又は2又は6に記載の熱伝導性樹脂組成物から得られる硬化物。
- 請求項1又は2又は6に記載の熱伝導性樹脂組成物により放熱することを特徴とする電子部品。
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JP2021097713A (ja) | 2018-04-09 | 2021-07-01 | ショット アクチエンゲゼルシャフトSchott AG | バイオリアクタに画像捕捉装置を支持する装置、および画像捕捉装置を支持する装置を備えたバイオリアクタ、ならびに生物学的材料を繁殖させるまたは培養する方法 |
JP2021178950A (ja) * | 2020-05-07 | 2021-11-18 | 株式会社スリーボンド | 光硬化性樹脂組成物、硬化物および積層体 |
JP2022076993A (ja) * | 2020-11-10 | 2022-05-20 | 株式会社スリーボンド | 光硬化性樹脂組成物、硬化物および積層体 |
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2022
- 2022-05-02 WO PCT/JP2022/019492 patent/WO2022259786A1/ja active Application Filing
- 2022-05-02 JP JP2023527564A patent/JPWO2022259786A1/ja active Pending
- 2022-05-02 KR KR1020237035802A patent/KR20240018419A/ko unknown
- 2022-05-02 EP EP22819972.5A patent/EP4353761A1/en active Pending
- 2022-05-02 CN CN202280035880.9A patent/CN117355548A/zh active Pending
Patent Citations (8)
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JPH07292048A (ja) * | 1994-04-28 | 1995-11-07 | Denki Kagaku Kogyo Kk | 硬化性樹脂組成物 |
JPH1161086A (ja) * | 1997-08-19 | 1999-03-05 | Sumitomo Bakelite Co Ltd | 半導体用ダイアタッチ樹脂ペースト |
JP2000344844A (ja) * | 1999-06-02 | 2000-12-12 | Shin Etsu Chem Co Ltd | 液状放射線硬化型樹脂組成物、光ファイバ用被覆組成物及び光ファイバ |
JP2009191214A (ja) * | 2008-02-18 | 2009-08-27 | Sumitomo Bakelite Co Ltd | 熱伝導性樹脂組成物、接着剤層、及びそれらを用いて作製した半導体装置。 |
JP2015212325A (ja) | 2014-05-02 | 2015-11-26 | 昭和電工株式会社 | 放熱性絶縁接着剤組成物 |
JP2021097713A (ja) | 2018-04-09 | 2021-07-01 | ショット アクチエンゲゼルシャフトSchott AG | バイオリアクタに画像捕捉装置を支持する装置、および画像捕捉装置を支持する装置を備えたバイオリアクタ、ならびに生物学的材料を繁殖させるまたは培養する方法 |
JP2021178950A (ja) * | 2020-05-07 | 2021-11-18 | 株式会社スリーボンド | 光硬化性樹脂組成物、硬化物および積層体 |
JP2022076993A (ja) * | 2020-11-10 | 2022-05-20 | 株式会社スリーボンド | 光硬化性樹脂組成物、硬化物および積層体 |
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JPWO2022259786A1 (ja) | 2022-12-15 |
CN117355548A (zh) | 2024-01-05 |
KR20240018419A (ko) | 2024-02-13 |
EP4353761A1 (en) | 2024-04-17 |
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