WO2022244034A1 - Dispositif de transfert de composant - Google Patents

Dispositif de transfert de composant Download PDF

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Publication number
WO2022244034A1
WO2022244034A1 PCT/JP2021/018533 JP2021018533W WO2022244034A1 WO 2022244034 A1 WO2022244034 A1 WO 2022244034A1 JP 2021018533 W JP2021018533 W JP 2021018533W WO 2022244034 A1 WO2022244034 A1 WO 2022244034A1
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WIPO (PCT)
Prior art keywords
unit
movement
component
interference
camera
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PCT/JP2021/018533
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English (en)
Japanese (ja)
Inventor
大介 春日
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ヤマハ発動機株式会社
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Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to JP2023521984A priority Critical patent/JPWO2022244034A1/ja
Priority to PCT/JP2021/018533 priority patent/WO2022244034A1/fr
Publication of WO2022244034A1 publication Critical patent/WO2022244034A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a component transfer device that includes a component transfer unit that picks a component from a component placement area and a camera unit that captures an image of the component in the component area.
  • a component mounting apparatus that picks up a die (bare chip) from a diced wafer and mounts it on a substrate is known.
  • a wafer camera takes an image of a wafer carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. The action of doing is repeated. That is, both the wafer camera and the head perform their respective required operations above the wafer carried into the machine. Therefore, there is a problem of interference between the camera unit having the wafer camera and the head unit having the head.
  • Patent Literature 1 discloses a component mounting apparatus that includes two component mounting heads whose movement regions overlap each other, and that can avoid interference between these component mounting heads.
  • this component mounting apparatus when one head starts moving into an interference area where both heads interfere with each other, and the other head is present in the interference area, the entering movement of the one head is performed. to stop
  • Patent Document 1 if the technology of Patent Document 1 is applied to prevent interference between units with different roles, such as the camera unit and head unit described above, the tact loss increases. In other words, while one of the camera unit and the head unit is in the interference area, if control is performed to make the other unit wait outside the interference area, the waiting time of the other unit becomes a bottleneck, The work cycle from imaging to component picking cannot be sped up.
  • An object of the present invention is to reduce tact loss in a component transfer device that includes a component transfer unit that picks components from a component placement area and a camera unit that captures images of components in the component area.
  • a component transfer apparatus provides a component supply unit having a component placement area in which a plurality of components are arranged, and a space above the component placement area and a predetermined component transfer unit.
  • a component transfer unit that can move horizontally along a movement axis, picks the component in the component placement area, and moves the component to the component transfer unit;
  • one of the component transfer unit and the camera unit is used as a reference to set an interference limit line that defines the accessible range of the other unit,
  • the movement range of the other unit is regulated so as not to exceed the interference limit line.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic perspective view showing a head unit and a push-up unit.
  • FIG. 3 is a block diagram showing the control configuration of the component mounting apparatus.
  • FIG. 4 is a diagram showing the interference area between the head unit and the camera unit.
  • FIGS. 5A to 5E are schematic diagrams showing a series of steps from imaging the wafer by the wafer camera to picking and mounting the die by the head unit.
  • 6A to 6D are schematic diagrams showing operations of the head unit and the camera unit.
  • 7A to 7D are schematic diagrams showing operations of the head unit and the camera unit.
  • 8A to 8D are schematic diagrams showing operations of the head unit and the camera unit.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic perspective view showing a head unit and a push-up unit
  • FIG. 9 is a flowchart of component mounting processing by the component mounting apparatus.
  • FIG. 10 is a flowchart of component mounting processing by the component mounting apparatus.
  • 11A to 11C are diagrams showing movement control of the head unit and camera unit in the first embodiment.
  • FIG. 12 is a graph showing movement control of the head unit and camera unit in the second embodiment.
  • FIGS. 13A to 13C are diagrams for explaining movement speed settings of the head unit and the camera unit in the second embodiment.
  • FIG. 14 is a graph showing movement control of the head unit and camera unit in the third embodiment.
  • FIGS. 15A to 15D are schematic diagrams for explaining movement control of the head unit and camera unit in the fourth embodiment.
  • the component transfer apparatus includes, for example, a taping apparatus that accommodates a die diced from a wafer on a tape, a die bonder that wire-bonds the die to a substrate, or a component mounting apparatus that mounts the die on a substrate.
  • a taping apparatus that accommodates a die diced from a wafer on a tape
  • a die bonder that wire-bonds the die to a substrate
  • a component mounting apparatus that mounts the die on a substrate.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus 1 according to an embodiment of the present invention.
  • the component mounting apparatus 1 is an apparatus that mounts a die 7a (component) diced from a wafer 7 on a substrate P.
  • FIG. The component mounting apparatus 1 includes a base 2, a conveyor 3, a head unit 4 (component transfer unit), a component supply unit 5 (component placement area), a wafer supply unit 6, a camera unit 32U, and a push-up unit 40.
  • FIG. 2 is a schematic perspective view showing the head unit 4 and the push-up unit 40 not shown in FIG.
  • the base 2 is a mounting base for various devices provided in the component mounting apparatus 1 .
  • the conveyor 3 is a transport line for the substrate P installed on the base 2 so as to extend in the X direction.
  • the conveyor 3 carries the board P from outside the machine to a predetermined mounting work position (predetermined component transfer section/board placement section), and carries the board P out of the machine from the work position after the mounting work.
  • the conveyor 3 has a clamping mechanism (not shown) that holds the substrate P at the mounting position.
  • the position where the substrate P is shown in FIG. 1 is the mounting work position.
  • the component supply unit 5 supplies a plurality of dies 7a arranged by dicing from the wafer 7 .
  • the head unit 4 picks the die 7a in the component supply unit 5, moves to the mounting work position, and mounts the die 7a on the board P.
  • the head unit 4 is provided with a plurality of heads 4H for sucking and holding the die 7a during the picking and releasing the held die 7a during the mounting.
  • the head 4H can move back and forth (up and down) in the Z direction with respect to the head unit 4 and can rotate about its axis.
  • the head unit 4 is equipped with a substrate recognition camera 31 that captures an image of the substrate P. As shown in FIG.
  • the feducial mark Fid (FIG. 6) attached to the substrate P is recognized from the photographed image of the substrate recognition camera 31 .
  • the positional deviation of the board P is recognized, and the positional deviation is corrected when the component is mounted.
  • the component mounting apparatus 1 can move the head unit 4 in at least the upper space between the component supply unit 5 and the board P held at the mounting position in the horizontal direction (X and Y directions).
  • a drive mechanism D1 is provided.
  • the first drive mechanism D1 includes a pair of Y-axis fixed rails 13, a first Y-axis servomotor 14, and a ball screw shaft 15 (first movement axis) on the +X side and the -X side, respectively. one of).
  • a pair of Y-axis fixed rails 13 are fixed on the base 2 and extend parallel to each other in the Y-direction at a predetermined interval in the X-direction.
  • the ball screw shaft 15 is arranged so as to extend in the Y direction at a position close to the Y-axis fixed rail 13 .
  • a first Y-axis servomotor 14 rotationally drives a ball screw shaft 15 .
  • a support frame 16 that supports the head unit 4 is installed between the pair of Y-axis fixed rails 13 .
  • Nuts 17 to be screwed onto the respective ball screw shafts 15 are assembled to the +X side end and -X side end of the support frame 16 .
  • the first drive mechanism D1 includes a guide member (not shown) mounted on the support frame 16, a first X-axis servomotor 18, and a ball screw shaft 19 (one of the first movement axes) as a mechanism for moving the head unit 4 in the X direction. ).
  • the guide member is a member that guides the movement of the head unit 4 in the X direction, and is fixed on the +Y side surface of the support frame 16 so as to extend in the X direction.
  • the ball screw shaft 19 is arranged in the vicinity of the guide member so as to extend in the X direction.
  • a first X-axis servomotor 18 rotationally drives a ball screw shaft 19 .
  • a nut (not shown) is attached to the head unit 4 , and the nut is screwed onto the ball screw shaft 19 .
  • the first Y-axis servomotor 14 operates to rotate the ball screw shaft 15, thereby moving the head unit 4 together with the support frame 16 in the Y direction. do. Also, the head unit 4 moves in the X direction with respect to the support frame 16 by operating the first X-axis servomotor 18 to rotate the ball screw shaft 19 .
  • the component supply unit 5 includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7 to a predetermined component extraction work position (wafer stage 10).
  • the wafer 7 is a disk-shaped semiconductor wafer on which circuit patterns and the like are already formed.
  • the wafer feeder 6 includes a wafer holding frame 8 that holds a wafer sheet 8a. An assembly of a large number of dies 7a, 7a, .
  • the wafer feeder 6 feeds the dies 7a to the component extraction work position in such a manner that the wafer holding frame 8 is replaced.
  • the component supply unit 5 may include a tape feeder for supplying components in the form of a component storage tape containing electronic components.
  • the wafer supply device 6 includes a wafer storage elevator 9, a wafer stage 10 and a wafer conveyor 11.
  • the wafer storage elevator 9 stores the wafer sheets 8a to which the wafers 7 are adhered on the wafer holding frame 8 in multiple stages.
  • a wafer stage 10 is installed on the base 2 at a position on the -Y side of the wafer storage elevator 9 .
  • the wafer stage 10 is arranged at a position aligned on the +Y side with respect to the mounting work position where the substrate P is stopped.
  • the wafer stage 108 which is the area where the diced wafer 7 is placed on the base 2, is the component placement area.
  • a wafer conveyor 11 draws the wafer holding frame 8 from the wafer storage elevator 9 onto the wafer stage 10 .
  • the camera unit 32U is a unit that is movable in the X and Y directions, and includes the wafer camera 32. Wafer camera 32 images a portion of wafer 7 positioned on wafer stage 10, that is, die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized.
  • the component mounting apparatus 1 includes a second drive mechanism D2 that allows the camera unit 32U to move in at least the upper space between the component supply section 5 and a predetermined standby position in the horizontal direction (X and Y directions).
  • the second drive mechanism D2 is a drive system that is separate and independent from the first drive mechanism D1 that drives the head unit 4. As shown in FIG. In this embodiment, the standby position is a position away from the wafer stage 10 on the +Y side.
  • the second drive mechanism D2 includes a pair of Y-axis fixed rails 33 on the +X side and the -X side, and a second Y-axis servomotor 34 and a ball screw shaft arranged on the +X side as a mechanism for moving the camera unit 32U in the Y direction. 35 (one of the second movement axes).
  • a pair of Y-axis fixed rails 33 are fixed on the base 2 and extend parallel to each other in the Y-direction at a predetermined interval in the X-direction.
  • the ball screw shaft 35 is arranged so as to extend in the Y direction at a position close to the Y-axis fixed rail 33 on the +X side.
  • a second Y-axis servomotor 34 rotationally drives a ball screw shaft 35 .
  • a support frame 36 that supports the camera unit 32U is installed between the pair of Y-axis fixed rails 33 .
  • a nut 37 that is screwed onto the ball screw shaft 35 is attached to the +X side end of the support frame 36 .
  • the second drive mechanism D2 includes a guide member (not shown) mounted on the support frame 36, a second X-axis servomotor 38, and a ball screw shaft 39 (one of the second movement axes) as a mechanism for moving the camera unit 32U in the X direction. ).
  • the guide member is a member that guides movement of the camera unit 32U in the X direction, and is fixed to the -Y side surface of the support frame 36 so as to extend in the X direction.
  • the ball screw shaft 39 is arranged in the vicinity of the guide member so as to extend in the X direction.
  • a second X-axis servomotor 38 rotationally drives a ball screw shaft 39 .
  • a nut (not shown) is attached to the camera unit 32U, and the nut is screwed onto the ball screw shaft 39. As shown in FIG.
  • the second Y-axis servomotor 34 operates to rotate the ball screw shaft 35, thereby moving the camera unit 32U integrally with the support frame 36 in the Y direction. do. Also, the camera unit 32U moves in the X direction with respect to the support frame 36 by operating the second X-axis servomotor 38 to rotationally drive the ball screw shaft 39 .
  • the second X-axis and Y-axis servomotors 34 and 38 which are the driving sources of the second driving mechanism D2, have motor specifications different from those of the first X-axis and Y-axis servomotors 14 and 18, which are the driving sources of the first driving mechanism D1.
  • the first X-axis and Y-axis servomotors 14 and 18 have higher outputs. Therefore, the head unit 4 has a higher acceleration and a higher maximum moving speed than the camera unit 32U. Therefore, when moving both units at the same time, speed control may be required to avoid interference between them. This point will be described in detail later.
  • the push-up unit 40 is arranged below the component supply unit 5, and pushes up the die 7a to be picked up by the head 4H from the lower surface side of the wafer sheet 8a.
  • the push-up unit 40 is arranged on the base 2 so as to be movable in the XY directions over a range corresponding to the wafer stage 10 .
  • the push-up unit 40 is movably supported in the X direction by a support frame 42 movable along a pair of guide rails 41 extending in the Y direction.
  • a ball screw shaft 43 screwed into a nut portion (not shown) provided inside the support frame 42 is rotationally driven by a third Y-axis servomotor 44 .
  • the push-up unit 40 moves together with the support frame 42 in the Y direction.
  • the support frame 42 is provided with a ball screw shaft 45 that is screwed with a nut portion (not shown) provided inside the push-up unit 40 .
  • the ball screw shaft 45 is rotationally driven by the third X-axis servomotor 46 to move the push-up unit 40 in the X-axis direction.
  • the push-up unit 40 has a push-up pin 47 for pushing up the die 7a. When the die 7a is sucked by the head 4H, the push-up pin 47 rises to push up the die 7a through the wafer sheet 8a.
  • the push-up pin 47 is driven up and down by a pin elevating motor 48 (FIG. 3).
  • a component recognition camera 30 is installed on the base 2 .
  • the component recognition camera 30 images the die 7a sucked by the head 4H of the head unit 4 from below before being mounted on the substrate P. As shown in FIG. Based on this captured image, it is determined whether the head 4H has picked up the die 7a abnormally or picked up incorrectly.
  • FIG. 3 is a block diagram showing the control configuration of the component mounting apparatus 1.
  • the component mounting apparatus 1 includes a control section 20 that controls the operation of each section of the component mounting apparatus 1 .
  • the controller 20 is electrically connected to the devices of the head unit 4, the camera unit 32U, and the push-up unit 40, the wafer feeder 6, and the component recognition camera 30.
  • the control unit 20 functionally includes an overall control unit 21, an axis control unit 22 (movement control unit), an imaging control unit 23, an image processing unit 24, and a storage unit 25 by executing a predetermined program. to work.
  • the overall control unit 21 comprehensively controls the operation of each functional unit included in the control unit 20, and executes various arithmetic processing.
  • the axis control unit 22 is a driver that drives the servo motors provided in each unit, and operates each drive motor according to instructions from the overall control unit 21 .
  • the axis control unit 22 controls the drive of the first Y-axis servomotor 14 and the first X-axis servomotor 18 in relation to the head unit 4, thereby moving along the ball screw axes 15 and 19 (first movement axis). It controls the movement of the head unit 4 in the XY direction.
  • the axis control unit 22 also controls the driving of the Z-axis servomotor 401 to control the Z-direction movement (lifting movement) of the head 4H, and controls the driving of the R-axis servomotor 402 to move the head 4H itself. Controls rotational movement around an axis.
  • the axis control unit 22 controls the driving of the second Y-axis servomotor 34 and the second X-axis servomotor 38 to move the camera unit 32U along the ball screw axes 35 and 39 (second movement axes). to control the movement of the XY directions.
  • the axis control section 22 controls the drive of the third Y-axis servomotor 44 and the third X-axis servomotor 46 in relation to the push-up unit 40 to move the push-up unit 40 along the ball screw shafts 43 and 45 in the XY directions. Control movement.
  • the shaft control unit 22 controls the vertical movement of the push-up pin 47 by controlling the driving of the pin lifting motor 48 .
  • the imaging control unit 23 controls the imaging operations of the component recognition camera 30, board recognition camera 31, and wafer camera 32. Specifically, the imaging control unit 23 controls the operation of the component recognition camera 30 to image the die 7a or other components that are attracted to the head 4H. The imaging control unit 23 also controls the operation of the substrate recognition camera 31 to image the feducial mark Fid of the substrate P. FIG. Furthermore, the imaging control unit 23 controls the operation of the wafer camera 32 to image the die 7a within the wafer stage 10 .
  • the image processing unit 24 performs various types of image processing, including edge extraction processing, on image data input from the component recognition camera 30, board recognition camera 31, and wafer camera 32. Based on the image data after the image processing, processes such as recognition of the sucked attitude of the die 7a to the head 4H, positional recognition of the substrate P, and positional recognition of the die 7a to be sucked on the wafer stage 10 are executed.
  • the storage unit 25 stores various programs such as implementation programs and various data.
  • the storage unit 25 stores positional information of the interference area CA, information regarding the setting of the interference limit line CL, and information regarding the acceleration and movement speed of the head unit 4 and the camera unit 32U, which will be described later.
  • FIG. 4 is a top view of the component mounting apparatus 1 shown in FIG. 1, with movement ranges of the head unit 4 and the camera unit 32U added.
  • the head unit 4 has a head unit movement area A1 corresponding to the installation range of the ball screw shafts 15 and 19 extending in the XY directions.
  • the camera unit 32U has a wafer camera movement area A2 corresponding to the installation range of the ball screw shafts 35 and 39 extending in the XY directions.
  • the head unit movement area A1 has a size from the space above the component supply unit 5 (wafer stage 10) to the space above the component recognition camera 30 through the conveyor 3 in the Y direction. This is performed by the head unit 4 picking the die 7a from the wafer 7 on the wafer stage 10, recognizing the component with the component recognition camera 30, and then mounting the die 7a on the board P on the conveyor 3. according to.
  • the wafer camera movement area A2 has a size from the space above the component supply unit 5 to the space above the wafer storage elevator 9 on the +Y side in the Y direction. This is because the wafer camera 32 performs an imaging operation of the wafer 7 on the wafer stage 10 and a withdrawal operation from the wafer stage 10 to the +Y side.
  • the head unit movement area A1 and the wafer camera movement area A2 are located at heights overlapping each other in the Z direction.
  • FIG. 4 shows an interference area CA where both areas A1 and A2 overlap.
  • the interference area CA is an area where interference occurs between the head unit 4 and the camera unit 32U when they coexist. Therefore, it is necessary to control the movement of the head unit 4 and the camera unit 32U so that no collision occurs in the interference area CA.
  • FIGS. 5A to 5E are schematic diagrams showing basic operations from imaging of the wafer 7 by the wafer camera 32 to picking and mounting of the die 7a by the head unit 4.
  • 5A shows a state in which the head unit 4 is located on the most -Y side of the head unit movement area A1 shown in FIG. 4, and the wafer camera 32 is located on the most +Y side of the wafer camera movement area A2. is shown.
  • FIG. 5(B) shows a state in which the wafer camera 32 takes an image of the wafer 7 within the interference area CA, and the head 4H of the head unit 4 mounts the die 7a on the substrate P.
  • FIG. The imaging by the wafer camera 32 here is for recognizing the group of dies 7a to be picked up by the head 4H in the next picking operation.
  • the mounting operation by the head 4H here is an operation for mounting the die 7a sucked by the picking operation this time on the substrate P. As shown in FIG.
  • FIG. 5(C) shows a state in which the wafer camera 32 moves away from the interference area CA while the head unit 4 moves into the interference area CA.
  • the entry movement of the head unit 4 is movement for picking the die 7a group recognized by the imaging by the wafer camera 32 immediately before from the wafer 7.
  • FIG. The retraction movement of the wafer camera 32 is movement for avoiding interference with the head unit 4 .
  • FIG. 5C shows a state in which the head 4H is picking the die 7a.
  • FIG. 5(D) shows a state in which the head unit 4 moves away from the interference area CA while the wafer camera 32 moves into the interference area CA.
  • the retraction movement of the head unit 4 is an operation for mounting the group of dies 7a sucked by the picking operation shown in FIG.
  • the advancing movement of the wafer camera 32 is movement for imaging the group of dies 7a to be picked up by the head 4H in the next picking operation.
  • the die 7a recognition-picking-mounting cycle is executed such that the head unit 4 and the wafer camera 32 are sequentially switched in the interference area CA.
  • the other unit should not enter the interference area CA.
  • the waiting time of the other unit becomes a bottleneck, resulting in tact loss, and the cycle cannot be sped up.
  • an interference limit line CL is set in the interference area CA, with one of the head unit 4 and the camera unit 32U as a reference, which defines the accessible range of the other unit. Then, the movement range of the other unit is not prohibited from entering the interference area CA, but is restricted to a range that does not exceed the interference limit line CL, thereby reducing tact loss.
  • a mounting operation example for setting the interference limit line CL will be described below.
  • FIGS. 6A to 8D are schematic diagrams showing operations of the head unit 4 and the camera unit 32U in the mounting operation for setting the interference limit line CL.
  • the interference limit line CL set with the camera unit 32U (wafer camera 32) as a reference is indicated as "CL1”
  • the interference limit line CL set with the head unit 4 as a reference is indicated as "CL2”.
  • CL1 the interference limit line CL set with the camera unit 32U (wafer camera 32) as a reference
  • CL2 the interference limit line CL set with the head unit 4 as a reference
  • CL2 is the position to which the head unit 4 moves to the +Y side most by mounting the dies 7a for this time, or with respect to the mounting of the dies.
  • the interference limit lines CL1 and CL2 are appropriately set by the axis control section 22 according to the operating states of both units.
  • FIG. 6(A) shows a state in which the wafer camera 32 (one unit) enters the interference area CA and takes an image of the wafer 7 for the first die recognition.
  • position recognition of a group of dies 7a to be picked up by the head unit 4 in the first picking operation is performed.
  • the head unit 4 (the other unit) is away from the interference area CA and stands by at the position closest to the -Y side.
  • the interference limit line CL1 is set in the interference area CA with the wafer camera 32 as a reference.
  • the interference limit line CL1 is set with reference to the position to which the wafer camera 32 moves most to the -Y side when performing imaging for die recognition this time.
  • the movement range of the head unit 4 is restricted to a range that does not exceed the interference limit line CL1.
  • the head unit 4 can freely move on the -Y side of the interference limit line CL1, and can enter the interference area CA.
  • the substrate recognition camera 31 mounted on the head unit 4 may be caused to perform an imaging operation for recognizing the feducial mark Fid of the substrate P.
  • FIG. 6(B) shows how the head unit 4 is approaching the interference limit line CL1 in preparation for the first picking operation while the wafer camera 32 is performing imaging for die recognition. A portion of the head unit 4 has entered the interference area CA.
  • FIG. 6(C) shows a state in which the wafer camera 32 completes die recognition and retreats from the interference area CA to the +Y side, while the head unit 4 moves into the interference area CA.
  • the head unit 4 is moved aiming at the XY coordinates of the die 7a specified by the die recognition. Since the head unit 4 has already approached the interference limit line CL1, the movement time to the target coordinates is shortened. Also, if both units are moved synchronously, the tact loss can be further reduced.
  • the die 7a targeted by the first picking operation is attracted to the head 4H.
  • the wafer camera 32 waits until the work of the head unit 4 is completed.
  • the head unit 4 completes the picking operation and retreats from the interference area CA to the -Y side, while the wafer camera 32 moves into the interference area CA for the next die recognition. showing the situation.
  • an interference limit line CL2 is set with the head unit 4 as a reference. It is desirable to synchronously move both units.
  • the wafer camera 32 can enter the interference area CA, it cannot enter the interference area CA on the -Y side of the interference limit line CL2.
  • the head unit 4 is in a state of transporting the die 7a held by the head 4H to the substrate P by the picking operation.
  • FIG. 7A shows a state in which the wafer camera 32 is performing an imaging operation and the head unit 4 is performing a mounting operation. That is, the wafer camera 32 enters the interference area CA and takes an image of the wafer 7 for the next die recognition.
  • the head unit 4 mounts the die 7a, which the head 4H has picked up this time, onto the substrate P. As shown in FIG. Here, a case is illustrated in which the wafer camera 32 can move to the position of the group of dies 7a to be picked up in the next picking operation without exceeding the interference limit line CL2. .
  • FIG. 7(B) shows a state in which the wafer camera 32 is retreating from the interference area CA after the above imaging operation of the wafer camera 32 is completed.
  • the head unit 4 continues the mounting operation.
  • the imaging operation of the wafer camera 32 takes less time than the mounting operation of the head unit 4, so the wafer camera 32 can leave the interference area CA in advance.
  • FIG. 7(C) shows a state in which the head unit 4 completes the mounting operation on the board P and moves into the interference area CA for the next picking operation.
  • the head 4H of the head unit 4 picks up the group of dies 7a recognized in the previous die recognition from the wafer 7.
  • Wafer camera 32 is in a standby state. It should be noted that the wafer camera 32 of FIG. 7B may be retracted at the same time as the head unit 4 is retracted.
  • FIG. 7(D) shows a state in which the head unit 4 finishes the picking operation and moves away from the interference area CA, while the wafer camera 32 moves into the interference area CA.
  • the interference limit line CL2 is set with the head unit 4 as a reference, and the wafer camera 32 can enter the interference area CA within a range not exceeding the interference limit line CL2 to the -Y side.
  • the head unit 4 moves above the substrate P by retracting movement, and the head 4H mounts the sucked die 7a on the substrate P.
  • the wafer camera 32 takes an image of the wafer 7 in order to recognize the die 7a to be picked next time.
  • FIGS. 8(A) and (B) show operations when the mounting operation of the head unit 4 is completed earlier than the imaging operation of the wafer camera 32, contrary to FIG. 7(B).
  • FIG. 8A shows a state in which the wafer camera 32 performs the imaging operation and the head unit 4 performs the mounting operation.
  • the interference limit line CL1 is set with the wafer camera 32 (camera unit 32U) as a reference. While the wafer camera 32 is performing the imaging operation, the head unit 4 approaches the interference limit line CL1 in preparation for the first picking operation. This state is the same as in FIG. 6(B).
  • FIG. 8(C) shows a state in which the head unit 4 is making an additional retraction movement, and the wafer camera 32 is making an additional entry movement into the interference area CA.
  • the additional approach movement of the wafer camera 32 is performed when the next imaging operation for die recognition cannot be performed unless the interference limit line CL2 is exceeded. That is, when the position (second position) of the die 7a scheduled to be picked up in the next picking operation is a position where an image cannot be captured unless the wafer camera 32 moves beyond the interference limit line CL2 to the -Y side, Additional approach moves are performed.
  • the interference limit line CL2 (first interference limit line) set with reference to the head unit 4 (the other unit) in FIG. 8A is changed to the wafer camera 32 ( unit) is updated to the interference limit line CL1 (second interference limit line).
  • the wafer camera 32 performs a required imaging operation.
  • the head unit 4 performs the mounting operation or waits within a range that does not exceed the interference limit line CL1 to the +Y side. If the head unit 4 is within a range that does not exceed the interference limit line CL1, the additional retraction movement is not performed.
  • the imaging operation of the wafer camera 32 is completed, the wafer camera 32 retreats from the interference area CA while the head unit 4 moves into the interference area CA, as shown in FIG. 8(D). This state is the same as in FIG. 6(C).
  • the control unit 20 creates data of a die pickup group, which is a group of dies 7a to be picked up by the head 4H of the head unit 4 in the current and next turn, from the wafer 7 on the wafer stage 10 (step S1). .
  • a die pickup group which is a group of dies 7a to be picked up by the head 4H of the head unit 4 in the current and next turn, from the wafer 7 on the wafer stage 10 (step S1). .
  • the current and next die adsorption group data are created, and from the second turn onward, only the next data are created.
  • the axis control unit 22 sets an interference limit line CL1 with the wafer camera 32 as a reference, as illustrated in FIG. 6A (step S2).
  • the axis controller 22 drives the second Y-axis servomotor 34 and the second X-axis servomotor 38 to move the wafer camera 32 into the interference area CA (step S3).
  • the wafer camera 32 is moved to a position where the die pickup group to be picked up in the current turn enters the imaging field of view.
  • the axis control unit 22 sets a flag that restricts the moving range of the head unit 4 on the +Y side by the first Y-axis servomotor 14 to the interference limit line CL1 or its vicinity.
  • the imaging control unit 23 causes the wafer camera 32 to perform the imaging operation of the wafer 7 (step S4).
  • the image processing unit 24 performs predetermined image processing on the acquired image.
  • the image processing unit 24 recognizes the quality of the die 7a to be sucked existing within the current imaging field and recognizes the coordinates of the die 7a (step S5).
  • the axis control unit 22 determines whether or not there are other dies 7a to be recognized in this turn (step S6). This is because the field of view of the wafer camera 32 is so narrow that it may not be possible to cover all of the dies 7a to be recognized in one shot.
  • the axis control unit 22 drives the first Y-axis servomotor 14 and the first X-axis servomotor 18 to move the die 7a above the remaining die 7a. (return to step S3). If there is no other die 7a to be recognized (YES in step S6), the axis control unit 22 retracts the wafer camera 32 from the interference area CA (step S7).
  • the axis control section 22 confirms whether or not the wafer camera 32 (one unit) exists within the interference area CA (step S11). If the wafer camera 32 exists (YES in step S11), that is, if the wafer camera 32 is performing an imaging operation (required operation), the axis control unit 22 drives the first Y-axis servo motor 14. Then, the head unit 4 (the other unit) is moved to or near the interference limit line CL1 and waited (step S12/see FIG. 6B).
  • the axis control unit 22 confirms whether or not the retraction movement of the wafer camera 32 from the interference area CA has started (step S13).
  • the wafer camera 32 does not start the retraction movement (NO in step S13)
  • the head unit 4 is in a standby state.
  • the axis control unit 22 moves the head unit 4 into the interference area CA for picking the recognized die 7a (step S14). .
  • the retreat movement of the wafer camera 32 in step S7 and the entrance movement of the head unit 4 in step S14 are executed in synchronization.
  • "synchronization” typically means that the retraction movement and the entry movement are performed at the same timing, at the same acceleration, and at the same movement speed, but this embodiment is not limited to this.
  • “Synchronization” also includes the case where the retraction movement and the entry movement are executed at different accelerations and movement speeds during periods in which they partially overlap. If the wafer camera 32 has already left the interference area CA in step S11 (NO in step S11), the axis controller 22 moves the head unit 4 into the interference area CA without waiting.
  • the axis control unit 22 drives the Z-axis servomotor 401 and the R-axis servomotor 402 in addition to the first Y-axis servomotor 14 and the first X-axis servomotor 18, thereby performing a picking operation in which the die 7a is attracted to the head 4H.
  • the operation is executed (step S15).
  • the imaging control unit 23 operates the component recognition camera 30 to image the die 7a attracted to the head 4H.
  • the image processing unit 24 executes a recognition process for detecting a sucking error of the die 7a (step S16).
  • step S17 it is confirmed whether or not there is a sequence for executing the recognition process of the feducial mark Fid of the substrate P (step S17). If it is included in the sequence (YES in step S17), the imaging control unit 23 causes the board recognition camera 31 to image the feducial mark Fid (step S18). The position of the substrate P is recognized based on the image acquired by this imaging.
  • the axis control section 22 next moves the head unit 4 to the position where the die 7a sucked by the head 4H is mounted on the substrate P (step S21). After the movement, the axis control section 22 sets the interference limit line CL2 with the head unit 4 as a reference (step S22/see FIG. 6(D)). Along with the setting of the interference limit line CL2, the axis control unit 22 sets a flag that restricts the ⁇ Y side movement range of the wafer camera 32 by the second Y-axis servomotor 34 to the interference limit line CL2 or its vicinity. .
  • the axis control unit 22 drives the Z-axis servomotor 401 to lower the head 4H and mount the sucked die 7a on the substrate P (step S23). After that, it is checked whether or not the mounting of all the dies 7a sucked in this turn on the substrates P has been completed (step S24), and if not completed (NO in step S24), the process returns to step S21. On the other hand, if the mounting is completed (YES in step S24), it is checked whether the wafer camera 32 is on standby to avoid interference (step S25). If it is not waiting for interference avoidance (NO in step S25), the process returns to step S1 and shifts to the picking operation of the next turn.
  • the axis control unit 22 confirms whether or not the imaging position in the next turn recognition process is a position that does not exceed the interference limit line CL2 set in step S22 (step S31). If the imaging position does not exceed the interference limit line CL2 (YES in step S31), the axis control unit 22 moves the wafer camera 32 to the imaging position (step S32). The movement of the wafer camera 32 in step S32 (movement into the interference area CA) and the movement of the head unit 4 in step S21 (retraction movement from the interference area CA) are as shown in FIG. 7(D). can be run synchronously.
  • the imaging control unit 23 causes the wafer camera 32 to perform imaging operation of the wafer 7 (step S33). Based on the acquired image, the image processing unit 24 performs recognition processing of the die 7a (step S34). After that, it is checked whether or not the die 7a to be recognized in the current turn remains (step S35). The operations of steps S33 to S35 are the same as those of steps S4 to S6 described above.
  • step S35 When the recognition target die 7a does not remain (YES in step S35), the axis control unit 22 retracts the wafer camera 32 from the interference area CA (step S7). After that, the process returns to step S1. On the other hand, if the die 7a to be recognized remains (NO in step S35), the process returns to step S31 and the process is repeated. On the other hand, in step S31, if the imaging position exceeds the interference limit line CL2 (NO in step S31), the axis control unit 22 moves the wafer camera 32 to or near the interference limit line CL2 (step S36). ), wait.
  • the axis control unit 22 retracts the head unit 4 so as to avoid interference with the wafer camera 32. Move (step S26). Then, the current interference limit line CL2 is updated to a new interference limit line CL1 based on the wafer camera 32 (step S27).
  • the retraction movement of the head unit 4 here may be a simple retraction movement of the head unit 4 from the interference area CA, or an additional retraction according to the work area of the wafer camera 32 as shown in FIG. 8(C). Movement can be exemplified. That is, the interference limit line CL2 (first interference limit line) set on the assumption that the wafer camera 32 (one unit) performs an imaging operation at a predetermined position (first position) within the interference area CA is The interference limit line CL1 (second interference limit line) is updated assuming that the imaging operation is performed at a different position (second position) within the interference area CA. Then, the head unit 4 is made to wait at or near the interference limit line CL1 (step S12). By flexibly changing the interference limit line CL in this manner, the optimum interference limit line CL can be set according to the working mode in the interference area CA of the wafer camera 32 .
  • FIG. 11A to 11C are diagrams showing movement control of the head unit 4 and wafer camera 32 in the first embodiment.
  • the wafer camera 32 is on the side (escape side) from the interference area CA
  • the head unit 4 is on the side (chasing side) to enter the interference area CA.
  • the head unit 4 is moved in the XY directions by the first drive mechanism D1
  • the camera unit 32U is moved in the XY directions by the second drive mechanism D2 independent of the first drive mechanism D1.
  • the drive mechanisms D1 and D2 have different unit movement capabilities (acceleration and maximum movement speed), when the head unit 4 and the camera unit 32U are moved synchronously, interference may occur between the two units. That is, if the acceleration and maximum movement speed of one unit are too fast (too slow), it may collide with the other unit that is too slow (too fast).
  • FIG. 11B is a graph showing the relationship between the movement positions of the wafer camera 32 and the head unit 4 and time, showing the axial movement trajectory F11 of the wafer camera 32 and the axial movement trajectory F21 of the head unit 4.
  • the increasing direction of the vertical axis is the direction from the -Y side to the +Y side.
  • Time t11 in the axis movement trajectory F11 is the time when the wafer camera 32 on the escape side starts retracting movement from the entry position p11 in the interference area CA to the +Y side.
  • Time t12 is the time at which wafer camera 32 completes retraction movement to retraction position p12, which is a predetermined distance away from interference area CA to the +Y side.
  • the time t21 is the time when the head unit 4 on the chasing side starts entering movement from the retracted position p21 on the -Y side of the interference area CA to the +Y side.
  • time t22 is the time when the head unit 4 completes the entry movement from the retreat position p21 to the entry position p22 in the interference area CA.
  • the head unit 4 is a heavier structure than the camera unit 32U. Therefore, as the first drive mechanism D1, a mechanism having a higher unit movement capability than the second drive mechanism D2 is adopted. That is, the head unit 4 can move at a faster acceleration and moving speed than the camera unit 32U. Therefore, when the head unit 4 on the chasing side is moved along the axis movement locus Fmax that moves at the original acceleration and movement speed, it may interfere with the camera unit 32U on the escaping side.
  • the acceleration and movement speed when the camera unit 32U is moved by the second drive mechanism D2 are stored in advance in the storage section 25 (FIG. 3). Then, when the retraction movement and the entry movement are executed within an overlapping period, the axis control section 22 acquires the acceleration and movement speed of the camera unit 32U from the storage section 25, and Set the axis movement parameters of the head unit 4.
  • the first drive mechanism D1 originally has the unit movement capability to move the head unit 4 at the acceleration a1 and the movement speed v1.
  • the moving distance of the head unit 4 is the area SA surrounded by the velocity change graph shown in FIG. That is, the moving distance is represented by the following equation.
  • Movement distance v1 (acceleration time/2 + constant speed time + deceleration time/2)
  • the above constant speed time is a period during which the head unit 4 moves at a constant moving speed v1.
  • the second drive mechanism D2 has a unit movement capability to move the camera unit 32U at an acceleration a2 and a movement speed v2 (a1>a2, v1>v2).
  • the axial movement parameters of the head unit 4 are set to the same acceleration a2 and movement speed v2 as the axial movement parameters of the camera unit 32U.
  • the movement time is lengthened by the deceleration setting, and the area SB is the same as the area SA based on the original axis movement parameter.
  • the moving speed of the head unit 4 on the chasing side may be set slower than the moving speed v2 of the camera unit 32U on the escaping side.
  • the second embodiment shows an example in which the head unit 4 on the chasing side moves at the fastest acceleration and movement speed as long as it does not interfere with the wafer camera 32 on the escaping side.
  • FIG. 12 is a graph showing movement control of the head unit 4 and wafer camera 32 in the second embodiment.
  • the acceleration and movement speed of the head unit 4 on the chasing side are set so as to take the fastest axis movement trajectory F22 closest to the axis movement trajectory F11.
  • a minimum margin Ma is set between the axis movement trajectory F11 and the fastest axis movement trajectory F22 in consideration of driving errors and the like.
  • Axis control unit 22 sets acceleration a2 (first acceleration) and movement speed v2 (first movement speed) for wafer camera 32 (one unit) on the escape side, as illustrated in FIG. 11C, for example. , along the axis movement locus F11.
  • the axis control unit 22 sets the fastest acceleration a3 (second acceleration) and movement speed v3 (second movement speed) within a range that does not interfere with the wafer camera 32 and allows for the margin Ma. to move the head unit 4 (a1>a3>a2, v1>v3>v2).
  • the axis control unit 22 acquires from the storage unit 25 the acceleration and movement speed that are set when the wafer camera 32 moves away from the interference area CA. Further, the axis control unit 22 acquires XY coordinate values indicating current position information and movement target position information of the head unit 4 and wafer camera 32 .
  • the current position is the entry position p11 of the wafer camera 32 and the retreat position p21 of the head unit 4 at time t11.
  • the movement target position of the wafer camera 32 is the retreat position p12
  • the movement target position of the head unit 4 is the entry position p22.
  • the axis control unit 22 calculates the acceleration a3 and the movement speed v3 of the head unit 4 that does not interfere with the wafer camera 32 but is closest to it. By moving the head unit 4 into the interference area CA at such acceleration a3 and movement speed v3, the tact loss can be reduced to the utmost limit.
  • FIGS. 13A to 13C are diagrams for explaining the movement speed setting of the head unit 4 and wafer camera 32 in the second embodiment. As shown in FIG. 13A, it is assumed that the wafer camera 32 that has been at the entry position p11 is retracted to the retraction position p12 and the head unit 4 is moved into the interference area CA. A position p13 in the drawing indicates the position of the limit line that interferes with the entry position of the head unit 4 that performs the current picking operation.
  • FIG. 13(B) is a graph showing the relationship between the movement speed of the wafer camera 32 on the fleeing side and time.
  • the wafer camera 32 starts retracting from time T0, accelerates at an acceleration an, and retracts at a constant maximum speed V1 that can be generated by the second drive mechanism D2 from acceleration completion time T1.
  • the current time t that is, the time when the head unit 4 on the chasing side starts moving in, is the time when the wafer camera 32 is moving at the current speed Vt during the acceleration period.
  • Time T2 is the time when the wafer camera 32 exits the interference line (position p13 in FIG. 13A) with respect to the entry position of the head unit 4 this time.
  • time Tr before the time T2 is the deceleration start time Tr at which the chasing head unit 4 starts decelerating.
  • S1, S2, S3, and Sx shown in FIG. 13(B) are explained as if they simply represent distances, but actually represent areas formed by multiplying time and velocity. ing.
  • FIG. 13(C) is a graph showing the settings of the moving speed of the head unit 4 on the chasing side.
  • the head unit 4 is moved so as to have an acceleration period Ta, a constant speed period Tc in which it moves at a constant speed, and a deceleration period Td from the current time t.
  • Vmax indicates the maximum moving speed at which the head unit 4 can be moved fastest by the first drive mechanism D1.
  • the moving speed of the head unit 4 at which the head unit 4 comes closest to the wafer camera 32 is synchronously adjusted. This is the fastest moving speed of the head unit 4 that can be set when moving.
  • the head unit 4 can be moved into the above-described maximum movement speed Vmax.
  • 0.5Td ⁇ Vmax is the movement distance of the head unit 4 corresponding to the area SD of the deceleration period Td in FIG. 13(C).
  • the target moving speed Vn that satisfies the following equation (3) and the acceleration/deceleration based on Vn are the fastest moving speed of the head unit 4 within a range that does not interfere with the wafer camera 32 .
  • the target moving speed Vn may be set to a speed considering a required margin Ma, instead of being set within the limit range where interference does not occur.
  • ⁇ Third Embodiment of Movement Control> a preferred example of movement control for a unit that retreats from the interference area CA is shown.
  • high-speed movement is no longer necessary. Rather, high-speed movement may interfere with the original operation of the unit.
  • the component recognition camera 30 recognizes the die (step S16 in FIG. 9), and the substrate recognition camera 31 captures the feducial mark Fid.
  • the operation of (step S18) is pending. During these operations, if the head unit 4 shakes due to high-speed movement, there may be a case where the die 7a and the feducial mark Fid cannot be accurately recognized.
  • the axis control unit 22 performs a retraction movement of either the head unit 4 or the wafer camera 32, and in a section until the unit escapes from the interference limit line CL or the interference area CA, a predetermined
  • a high retraction speed is set, and in a section after escaping from the interference limit line CL or the interference area CA, a retraction speed lower than the high speed is set.
  • FIG. 14 is a graph showing movement control of the head unit 4 and wafer camera 32 in the third embodiment.
  • the wafer camera 32 is a unit that moves into the interference area CA (chasing side)
  • the head unit 4 is a unit that moves away from the interference area CA (escape side).
  • FIG. 14 shows an axial movement trajectory F31 of the wafer camera 32 and an axial movement trajectory F41 of the head unit 4. As shown in FIG.
  • Time t31 in the axis movement trajectory F31 is the time when the wafer camera 32 on the chasing side starts moving toward the -Y side from the retreat position p31 outside the interference area CA.
  • the wafer camera 32 is moved at a predetermined acceleration and movement speed, and reaches the target position p32 within the interference area CA.
  • Time t32 is the arrival completion time to the target position p32.
  • Time t31 in the axis movement trajectory F41 is the time when the head unit 4 on the escape side starts retreating from the entry position p41 in the interference area CA to the -Y side.
  • Time t33 is the time when the head unit 4 completes the retraction movement to the retraction position p42, which is a predetermined distance away from the interference area CA to the -Y side.
  • time t3A is the time when the head unit 4 escapes from the interference area CA (interference limit line CL1).
  • the movement speed of the head unit 4 is set to a predetermined high retraction movement speed V11 until time t3A, but is set to a retraction movement speed V12 lower than V11 after time t3A.
  • An axial movement trajectory F42 indicated by a dotted line in FIG. 14 is a movement trajectory when the head unit 4 is moved with the high evacuation movement speed V11 set for the entire period of the evacuation movement.
  • the use of the axis movement trajectory F42 leads to the retracted position p42 faster than the case of the use of the axis movement trajectory F41.
  • the head unit 4 moves at high speed even after escaping from the interference area CA, which may interfere with operations such as die recognition and feducial mark Fid recognition.
  • the operation performed by the head unit 4 after escaping from the interference area CA can be stably executed in a low speed movement state.
  • the fourth embodiment shows a specific example similar to the additional retreat movement of the head unit 4 and the additional approach movement of the wafer camera 32 shown in FIG. 8(C).
  • a recognition error caused by floating of the die 7a or the detection of a die 7a designated as a "defective die” in a pre-created wafer map can be used to identify a "non-defective die" on the wafer 7.
  • the consumption of "die” may progress. Therefore, the imaging position of the wafer 7 by the wafer camera 32 may shift to the -Y side (the side closer to the head unit 4) than planned. In this case, if the head unit 4 is on standby at the position of the interference limit line CL1, interference between both units may occur. Therefore, an additional retraction movement of the head unit 4 and an additional entry movement of the wafer camera 32 are required.
  • FIGS. 15A to 15D are schematic diagrams for explaining movement control of the head unit 4 (the other unit) and the wafer camera 32 (the one unit) in the fourth embodiment.
  • FIG. 15A schematically shows the position of a group of dies 7a on the wafer 7 to be imaged (die recognition processing/required operation) by the wafer camera 32 next.
  • An interference limit line CL1 (first interference limit line) for avoiding interference with the head unit 4 is set with the wafer camera 32 as a reference based on these XY coordinates (first position) of the die 7a to be imaged.
  • FIG. 15(B) shows a state in which the wafer camera 32 and the head unit 4 are performing operations based on the interference limit line CL1.
  • the wafer camera 32 picks up an image of the die 7a as planned, and the head unit 4 is on standby at a position where it does not exceed the +Y side of the interference limit line CL1.
  • FIG. 15(C) shows a state in which a defective die 7a-Bad is detected in the group of dies 7a to be imaged. If the substitute die for the defective die 7a-Bad does not exist in the same row as the die 7a that was scheduled to be imaged, the die 7a-N arranged in the next row on the -Y side of the wafer 7 becomes the imaging target. That is, the imaging position initially planned by the wafer camera 32 is shifted to the -Y side to the position of the XY coordinates (second position) of the die 7a-N. A new interference limit line CL1 (second interference limit line) is set according to this shift.
  • CL1 second interference limit line
  • FIG. 15(D) shows a state in which the wafer camera 32 and the head unit 4 are performing operations based on the interference limit line CL1 updated to shift to the -Y side. That is, the wafer camera 32 picks up an image of the alternative die 7a-N, and the head unit 4 waits at the last position where it does not exceed the updated interference limit line CL1 on the +Y side.
  • the optimum interference limit line CL1 can be set according to the change of the working area of the wafer camera 32.
  • a component transfer apparatus provides a component supply unit having a component placement area in which a plurality of components are arranged, and a space above the component placement area and a predetermined component transfer unit.
  • a component transfer unit that can move horizontally along a movement axis, picks the component in the component placement area, and moves the component to the component transfer unit; the component placement area and a predetermined standby a camera unit that is horizontally movable along a second movement axis in an upper space between a position and a camera unit that captures an image of the part in the part placement area; and a movement control section for controlling movement of the camera unit along the second movement axis, wherein the movement control section controls movement of the component transfer unit and the camera in a space above the component placement area.
  • one of the component transfer unit and the camera unit is used as a reference to set an interference limit line that defines the accessible range of the other unit,
  • the movement range of the other unit is regulated so as not to exceed the interference limit line.
  • the component transfer unit horizontally moves along the first movement axis, and the camera unit horizontally moves along the second movement axis. Furthermore, since both units can move above the component arrangement area, an interference area occurs where both units interfere with each other.
  • the movement control section sets an interference limit line within the interference area to regulate the movement range of the other unit. In other words, when one unit is present in the interference area, the other unit is allowed to move up to the interference limit line instead of being prevented from entering the interference area. Therefore, when a sequence is set in which the one unit is followed by the other unit at a predetermined work position in the interference area, the other unit can reach the work position more quickly. It becomes possible. Therefore, tact loss can be suppressed while avoiding interference between both units.
  • the movement control section moves the other unit to the interference limit line or its vicinity to wait while the one unit is performing a required operation in the interference area. It is desirable to
  • the other unit which next performs a required operation in the interference area, can be moved to the interference limit line or its vicinity and made to stand by. Therefore, tact loss can be minimized.
  • the movement control section executes evacuation movement of the one unit from the interference area and movement of the other unit into the interference area within periods that overlap each other. and the acceleration and acceleration of each of the retreat movement and the approach movement so that the component transfer unit that moves along the first movement axis and the camera unit that moves along the second movement axis do not interfere with each other. It is desirable to set the movement speed.
  • the other unit enters the interference area while chasing the one unit that is retreating from the interference area. Therefore, it is possible to quickly perform the work transition from one unit to the other unit in the interference area. Also, by setting the acceleration and movement speed for both units, it is possible to prevent the other unit chasing the one unit from interfering with the one unit.
  • the movement control unit sets the same acceleration and movement speed for the retreat movement and the entry movement.
  • both units move at the same acceleration and movement speed, so it is possible to reliably prevent interference between one unit and the other unit chasing it.
  • the movement control section sets a predetermined first acceleration and a first movement speed for the retraction movement of the one unit, and the movement of the other unit to the first movement as the entering movement. It is desirable to set a second acceleration and a second movement speed that are the fastest acceleration and movement speed within a range that does not interfere with the one unit that moves at the acceleration and the first movement speed.
  • the other unit chasing the one unit is moved at an acceleration and movement speed that are on the verge of interfering with the one unit. Therefore, it is possible to reduce the tact loss to the limit.
  • the movement control section sets the evacuation movement speed to a predetermined high speed in the interval until the one unit escapes from the interference limit line or the interference area in the evacuation movement of the one unit. It is desirable to set the evacuation movement speed to be lower than the high speed in the section after escaping from the interference limit line or the interference area.
  • one unit escapes from the interference area at high speed, while moving at low speed after escaping from the interference limit line or interference area. Therefore, it is possible to cause the other unit to quickly enter the interference limit line or the interference area, and to stably perform the necessary operation for the one unit after escaping from the area while moving at a low speed. .
  • the movement control section sets a first interference limit line for avoiding interference with the other unit when the one unit performs a required operation at the first position in the interference area. Then, when the one unit performs a required operation at a second position different from the first position in the interference area, a second interference limit line is set at a position different from the first interference limit line. It is preferable that the other unit is moved to the second interference limit line or its vicinity to be in a standby state.
  • the interference limit line is flexibly changed according to the working position within the interference area of one unit. That is, it is possible to set the optimum interference limit line according to the working mode in the interference area of the one unit.
  • the component placement area is an area in which a diced wafer is placed, and the component is a die.
  • the component transfer unit is a head unit having a head that attracts the die
  • the camera unit is a wafer camera that captures an image of the wafer
  • the component transfer unit is mounted with the die. It is desirable that it is a substrate placement portion where the substrate is placed.
  • this component transfer device it is possible to reduce tact loss without causing interference between the head unit and the wafer camera in the component mounting device that picks up the dies from the diced wafer and mounts the dies on the substrate. .
  • the component transfer apparatus including the component transfer unit for picking the component from the component placement area and the camera unit for capturing the image of the component in the component area can reduce the tact loss. can be reduced.

Abstract

L'invention concerne un dispositif de transfert de composant comprenant : une partie d'alimentation en composant qui a une zone de placement de composant ; une unité de transfert de composant qui se déplace le long d'un premier axe de mouvement entre la zone de placement de composant et une partie de transfert de composant prescrite, capture un composant dans la zone de placement de composant, et déplace le composant vers la partie de transfert de composant ; et une unité de caméra qui se déplace le long d'un second axe de mouvement entre la zone de placement de composant et une position de veille prescrite, et image le composant dans la zone de placement de composant. Un ensemble de parties de commande de mouvement, dans une zone d'interférence dans un espace supérieur de la zone de placement de composant et en utilisant l'une de l'unité de transfert de composant et de l'unité de caméra en tant que référence, une ligne de limite d'interférence pour définir la plage pouvant être ouverte de l'autre des unités, et régule la plage de déplacement de l'autre unité dans une plage ne dépassant pas la ligne de limite d'interférence.
PCT/JP2021/018533 2021-05-17 2021-05-17 Dispositif de transfert de composant WO2022244034A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP2003059955A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2007053271A (ja) * 2005-08-19 2007-03-01 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2009238873A (ja) * 2008-03-26 2009-10-15 Panasonic Corp 部品実装方法
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JP2018064045A (ja) * 2016-10-13 2018-04-19 富士機械製造株式会社 装着処理の最適化装置

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