WO2024084703A1 - Machine de montage de composants et ligne de montage - Google Patents

Machine de montage de composants et ligne de montage Download PDF

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Publication number
WO2024084703A1
WO2024084703A1 PCT/JP2022/039356 JP2022039356W WO2024084703A1 WO 2024084703 A1 WO2024084703 A1 WO 2024084703A1 JP 2022039356 W JP2022039356 W JP 2022039356W WO 2024084703 A1 WO2024084703 A1 WO 2024084703A1
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WO
WIPO (PCT)
Prior art keywords
mounting
component
heads
head
mounting head
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PCT/JP2022/039356
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English (en)
Japanese (ja)
Inventor
勇介 山蔭
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株式会社Fuji
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Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/039356 priority Critical patent/WO2024084703A1/fr
Publication of WO2024084703A1 publication Critical patent/WO2024084703A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • This disclosure relates to a component mounting machine and mounting line that has multiple mounting heads that mount components on a circuit board.
  • Patent Document 1 describes a component mounting machine equipped with multiple multi-mounting heads that mount components on a board.
  • the multi-mounting head in Patent Document 1 has multiple suction nozzles, and each suction nozzle picks up a component from a component cassette and mounts it on the board.
  • the component mounting machine restricts the operation of the multi-mounting heads other than the multi-mounting head that mounts the components that require high mounting accuracy during mounting of the components that require high mounting accuracy.
  • Patent Document 1 In a device in which multiple mounting heads operate, as in Patent Document 1 mentioned above, when any mounting head performs a mounting operation, there is a risk that vibrations and the like generated by the operation of the other mounting heads may affect the mounting accuracy.
  • the component mounting machine in Patent Document 1 has two multi-mounting heads that face each other in the Y-axis direction with a transport rail that transports the board between them, and while one multi-mounting head is performing mounting, the operation of the other multi-mounting head is restricted. However, there is room for improvement in terms of improving mounting accuracy.
  • This disclosure was made in light of these circumstances, and aims to provide a parts mounting machine and mounting line that can improve mounting accuracy.
  • the component mounting machine of the present disclosure includes a plurality of mounting heads having gripping members for gripping components and mounting the components gripped by the gripping members onto a board, a supply device for supplying the components to each of the plurality of mounting heads, a moving device for moving each of the plurality of mounting heads, and a control device for restricting the operation of the other mounting heads to an acquisition operation for acquiring the components from the supply device in response to any one of the plurality of mounting heads performing a mounting operation.
  • the contents of this disclosure are not limited to implementation as a component mounting machine, but are also extremely effective when implemented as a mounting line equipped with multiple component mounting machines.
  • the component mounting machine and mounting line disclosed herein can improve mounting accuracy by controlling which of multiple mounting heads performs the mounting operation.
  • FIG. 1 is a plan view showing a component mounting machine according to a first embodiment
  • 1 is a schematic diagram showing a configuration of a component mounting machine according to a first embodiment, as viewed from an X direction
  • FIG. 2 is a block diagram showing a control device.
  • FIG. FIG. 2 is a schematic diagram illustrating an internal structure of a mounting head.
  • 10 is a flowchart showing a determination process for determining the operation of the mounting head according to the second embodiment.
  • FIG. 11 is a plan view of a mounting line according to a third embodiment.
  • FIG. 1 shows a component mounting machine 10 of the first embodiment.
  • FIG. 2 shows an outline of the configuration of the component mounting machine 10 as viewed from the X direction.
  • the component mounting machine 10 mounts electronic components 13 (see FIG. 2) on a board 12, and includes a board transport and holding device 20, a moving device 22, a pair of mounting heads 26, 28, a pair of supply devices 30, 32, a pair of mark cameras 34, 36, and a pair of part cameras 38, 40.
  • the electronic components 13 are an example of the components of the present disclosure, and are semiconductor elements such as IC chips.
  • the components of the present disclosure are not limited to semiconductor elements, and may be other components mounted on the board 12, such as passive components such as resistors and capacitors, and mechanical components such as switches and relays.
  • the board transport and holding device 20 is disposed on the upper surface of the base 16 of the component mounting machine 10, and has a conveyor device 41.
  • the conveyor device 41 has a pair of guide rails 43, 44.
  • a conveyor belt (not shown) is provided on each of the guide rails 43, 44.
  • the pair of guide rails 43, 44 are disposed parallel to each other.
  • the direction in which the guide rails 43, 44 extend is referred to as the X direction
  • the direction horizontally perpendicular to the X direction is referred to as the Y direction
  • the direction perpendicular to both the X direction and the Y direction is referred to as the Z direction.
  • the conveyor belt is wound around pulleys (not shown) provided on each of the guide rails 43, 44, and rotates by the drive of an electromagnetic motor 46 (see Figure 3).
  • the board 12 is transported by the conveyor belt along the X direction.
  • the conveyor device 41 also transports the board 12 that has been brought into the component mounting machine 10 along the X direction to a predetermined work position 47.
  • the board transport and holding device 20 is equipped with a clamper 49 (see FIG. 3) that fixes the transported board 12 at the work position 47.
  • the component mounting machine 10 uses the mounting heads 26, 28 to mount electronic components 13 on the board 12 fixed at the work position 47 by the clamper 49.
  • FIG. 4 shows a side view of the moving device 22.
  • the moving device 22 has an X-direction slide mechanism 51, a Y-direction slide mechanism 52, and a Z-direction slide mechanism 53.
  • the Y-direction slide mechanism 52 has a pair of Y-direction guide rails 55.
  • the pair of Y-direction guide rails 55 are arranged above the base 16 so as to be parallel to each other and extend in the Y direction.
  • the X-direction slide mechanism 51 has a pair of X-direction guide rails 57.
  • the pair of X-direction guide rails 57 are suspended above the pair of Y-direction guide rails 55 so as to be parallel to each other and extend in the X direction.
  • the Y-direction slide mechanism 52 has an electromagnetic motor 59 (see FIG. 3), which is driven to move each X-direction guide rail 57 to any position in the Y direction.
  • Each X-direction guide rail 57 holds an X-direction slider 61 so that it can move along its own axis.
  • the X-direction slide mechanism 51 has an electromagnetic motor 63 (see FIG. 3), which is driven to move each X-direction slider 61 to any position in the X direction.
  • the Z-direction slide mechanism 53 has a pair of Z-direction sliders 65. Each of the pair of Z-direction sliders 65 is held by each of the pair of X-direction sliders 61 so that it can slide in the Z direction.
  • the Z-direction slide mechanism 53 has an electromagnetic motor 67 (see FIG. 3), which is driven to move each Z-direction slider 65 to any position in the Z direction.
  • the mounting heads 26, 28 are detachably attached to each of the Z-direction sliders 65. With this structure, the mounting heads 26, 28 can be moved to any position on the base 16 in the X and Y directions by the X-direction slide mechanism 51 and the Y-direction slide mechanism 52, and raised and lowered in the Z direction (up and down) by the Z-direction slide mechanism 53.
  • each of the mounting heads 26, 28 includes a frame 71 attached to a Z-direction slider 65 (see FIG. 4), a head body 75 in which multiple nozzle holders 73 are arranged at intervals of a predetermined angle (e.g., 30 degrees) in the circumferential direction, and a suction nozzle 77 attached to the lower end of each nozzle holder 73.
  • the mounting heads 26, 28 also include an R-axis motor 79 (see FIG. 3) that rotates the head body 75 to rotate (revolve) the multiple nozzle holders 73, a Q-axis motor 80 that rotates (spins) the multiple nozzle holders 73, and a lifting device 81 that raises and lowers the nozzle holders 73.
  • the head body 75 comprises a shaft 83 rotatably supported by the frame 71, and a cylindrical holder holder 85 with a larger diameter than the shaft 83.
  • the holder holder 85 holds multiple rod-shaped nozzle holders 73 in a position extending in the Z direction so that they can slide in the Z direction.
  • the upper end of the shaft 83 is connected to the R-axis motor 79, and when the R-axis motor 79 is driven, the shaft 83 and holder holder 85 rotate, causing the multiple nozzle holders 73 to rotate (revolve).
  • the head body 75 also has a first gear 87 that is coaxial with the shaft 83 and supported so as to be rotatable relative to the shaft 83, a second gear 88 that rotates with the rotation of the first gear 87, and a third gear 89 that is attached to the rotating shaft of the Q-axis motor 80.
  • the first gear 87 meshes with the third gear 89, and the rotational driving force of the Q-axis motor 80 is transmitted to the first gear 87.
  • the second gear 88 meshes with a fourth gear 90 that is attached to each nozzle holder 73.
  • each nozzle holder 73 and the suction nozzles 77 attached to each nozzle holder 73 all rotate (spin) in the same direction by the same amount of rotation (rotation angle).
  • a coil spring 91 is arranged in a compressed state between the lower surface of the fourth gear 90 and the upper surface of the holder holding body 85.
  • each nozzle holder 73 is biased upward by the elastic force of the coil spring 91, but the upward bias is restricted at a certain height by a stopper (not shown).
  • the lifting device 81 also includes a linear motor 93 and a pusher 95 that moves up and down in the Z direction by the drive of the linear motor 93.
  • the pusher 95 engages with the upper end of the nozzle holder 73 that is located at a predetermined lifting position (for example, the position on the left side of FIG. 5) among the multiple nozzle holders 73. Then, the pusher 95 is lowered by the drive of the linear motor 93, and the nozzle holder 73 that is located at the predetermined lifting position among the multiple nozzle holders 73 moves down against the elastic force of the coil spring 91.
  • the pusher 95 is raised by the drive of the linear motor 93, and the nozzle holder 73 located at the lifting position rises due to the elastic force of the coil spring 91.
  • the nozzle holder 73 located at the lifting position moves up and down by the drive of the linear motor 93.
  • the suction nozzle 77 of the nozzle holder 73 located at the lifting position also moves up and down.
  • the multiple nozzle holders 73 move sequentially to the lifting position by revolving around the drive of the R-axis motor 79.
  • each of the mounting heads 26, 28 is equipped with a positive/negative pressure supply device 97 (see FIG. 3).
  • the multiple suction nozzles 77 of each mounting head 26, 28 are connected to the positive/negative pressure supply device 97 via negative pressure air and positive pressure air passages (not shown). This allows the suction nozzles 77 to suction and hold the electronic components 13 by negative pressure, and to release the held electronic components 13 by positive pressure.
  • a pair of supply devices 30, 32 are arranged on both sides of the base 16 with the substrate transport and holding device 20 sandwiched between them in the Y direction.
  • Each supply device 30, 32 can be equipped with a plurality of tape feeders 99.
  • Each tape feeder 99 accommodates taped components in a wound state.
  • the taped components are electronic components 13 that have been taped.
  • the tape feeder 99 is equipped with a feed device 100 (see Figure 3) having, for example, a motor, a sprocket, etc., and the taped components are fed out by driving the feed device 100.
  • the tape feeder 99 of each supply device 30, 32 feeds out the taped components to supply the electronic components 13 at a predetermined supply position 101 (see Figure 1).
  • Each mounting head 26, 28 sucks and holds the electronic components 13 fed to the supply position 101 with the suction nozzle 77.
  • the supply device 30 corresponds to the mounting head 26, which holds the electronic components 13 from the tape feeder 99 of the supply device 30, and the supply device 32 corresponds to the mounting head 28, which holds the electronic components 13 from the tape feeder 99 of the supply device 32.
  • the mark camera 34 is attached to the X-direction slider 61 that mounts the mounting head 26 while facing downward, and moves in the X and Y directions together with the mounting head 26.
  • the mark camera 36 is attached to the X-direction slider 61 that mounts the mounting head 28 while facing downward, and moves in the X and Y directions together with the mounting head 28.As a result, each mark camera 34, 36 can be moved to any position by operation of the moving device 22, and can capture an image of any position on the base 16.
  • the part camera 38 is disposed between the board conveying and holding device 20 and the supply device 30 in the Y direction, facing upward.
  • the mounting head 26 that holds the electronic component 13 moves above the part camera 38 by the operation of the moving device 22, and the electronic component 13 held by the mounting head 26 is imaged by the part camera 38.
  • the component mounting machine 10 is capable of performing so-called on-the-fly imaging, in which the electronic component 13 is imaged by the part camera 38 while the mounting head 26 is moved.
  • the part camera 40 is disposed between the board conveying and holding device 20 and the supply device 32 in the Y direction, facing upward.
  • the mounting head 28 that holds the electronic component 13 moves above the part camera 40 by the operation of the moving device 22, and the electronic component 13 held by the mounting head 28 is imaged by the part camera 40.
  • the component mounting machine 10 is also capable of performing so-called on-the-fly imaging of the mounting head 28.
  • the component mounting machine 10 is equipped with a control device 103.
  • the control device 103 is equipped with a controller 105, multiple drive circuits 107, an image processing device 109, and a storage device 111.
  • the multiple drive circuits 107 are connected to the electromagnetic motors 46, 59, 63, 67, the positive and negative pressure supply device 97, the R-axis motor 79, the Q-axis motor 80, the linear motor 93, and the feed device 100.
  • the controller 105 is equipped with a CPU, RAM, etc., and is mainly a computer, and is connected to the multiple drive circuits 107 and the image processing device 109.
  • the storage device 111 includes, for example, a ROM, a flash memory, a hard disk, etc.
  • the configuration of the storage device 111 is not limited to the above configuration, and may include, for example, an SSD instead of a hard disk.
  • the storage device 111 may also be an external storage medium provided separately from the control device 103, such as a USB memory or a DVD.
  • the controller 105 controls each device connected to the drive circuit 107 and the image processing device 109 by executing the control program 113 stored in the storage device 111 with the CPU. As a result, the substrate transport and holding device 20, the moving device 22, the mounting heads 26, 28, the supply devices 30, 32, the mark cameras 34, 36, the part cameras 38, 40, etc. are controlled by the controller 105.
  • the controller 105 controls the X-direction slide mechanism 51, the Y-direction slide mechanism 52, the Z-direction slide mechanism 53, and the mounting heads 26, 28 based on the control program 113.
  • the controller 105 controls the X-direction slide mechanism 51 and the like to move each of the mounting heads 26 and 28 to the mounting position set in the control program 113 and perform the mounting operation, or to the supply position 101 and perform the suction operation.
  • the control program 113 includes a so-called recipe, and includes data instructing the work content, such as which coordinate position on the board 12 the electronic components 13 supplied from which tape feeder 99 should be mounted for each of the mounting heads 26, 28.
  • the control program 113 includes, for example, the mounting order, the XYZ coordinates of the mounting position, the XYZ coordinates of the supply position 101, the rotation angle of the component, the component type, and the component shape.
  • the control program 113 also includes control information required for camera control, such as the XYZ coordinates and image capture timing of the mounting heads 26, 28 when capturing images with the mark cameras 34, 36, and the XYZ coordinates and image capture timing of the mounting heads 26, 28 when capturing images with the parts cameras 38, 40.
  • the control program 113 also includes control information related to the control of suction and removal, such as the control timing of the positive and negative pressure supply device 97.
  • the control program 113 also includes, for example, control programs required for displaying the display panel 115 and accepting input. Therefore, the control program 113 contains various information necessary for controlling the component mounting machine 10.
  • the image processing device 109 processes the image data obtained by the mark cameras 34 and 36 and the part cameras 38 and 40.
  • the controller 105 acquires various information from the image data processed by the image processing device 109.
  • the controller 105 acquires various information such as identification information written on the board 12, information on the holding position of the board 12 by the clamper 49, and information on the attitude of the electronic component 13 mounted on the board 12 from the image data of the mark cameras 34 and 36.
  • the controller 105 acquires various information such as the holding position error and holding attitude information of the electronic component 13 held by the mounting heads 26 and 28 from the image data of the part cameras 38 and 40.
  • the control device 103 is also connected to the display panel 115.
  • the display panel 115 is arranged on, for example, the outer wall surface of the component mounting machine 10, and includes a touch panel and multiple operation switches to accept operation input from the user.
  • the display panel 115 also changes the display content of the touch panel based on the control of the control device 103.
  • the component mounting machine 10 performs the task of mounting electronic components 13 using the mounting heads 26, 28 on the board 12 held by the board transport and holding device 20.
  • the controller 105 controls the conveyor device 41 of the board transport and holding device 20 to transport the board 12 to the work position 47.
  • the controller 105 controls the clamper 49 of the board transport and holding device 20 to hold the board 12 fixedly at the work position 47.
  • the controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to move the pair of mark cameras 34, 36, for example the mark camera 34, above the board 12 to capture an image of the board 12. Based on the image data captured by the mark camera 34, the controller 105 acquires the identification information marked on the board 12, information on the holding position of the board 12, etc. Also, the pair of supply devices 30, 32 supply the electronic components 13 to the supply position 101 of the tape feeder 99 based on the control of the controller 105.
  • the controller 105 executes the operation of mounting the electronic components 13 on the board 12 using the mounting heads 26, 28.
  • the operations of the mounting heads 26, 28 mainly include “suction operation,” “moving to mounting position operation,” “mounting operation,” and “moving to supply position operation” (hereinafter, sometimes referred to as four operations).
  • the component mounting machine 10 also executes operations by operating the two mounting heads 26, 28 in coordination.
  • the operation of the mounting head 26 will be mainly explained.
  • the operation of the mounting head 28 is the same as that of the mounting head 26. However, as described below, the operation of the mounting heads 26, 28 is restricted in the high-precision mode so as not to affect each other's mounting operation.
  • the controller 105 When the controller 105 starts the operation of mounting the electronic component 13 on the board 12, it controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to move the mounting head 26 above the supply position 101 of the supply device 30. When the controller 105 positions the mounting head 26 above the supply position 101, it starts the suction operation.
  • the "suction operation" is, for example, the operation from the point in time when the mounting head 26 is positioned above the supply position 101 of the tape feeder 99 until the suction nozzle 77 picks up the electronic component 13 and holds the picked up electronic component 13 and is ready to start moving to the next destination.
  • the controller 105 executes at least one of the operations of controlling the Z-direction slide mechanism 53 to lower the mounting head 26 and controlling the lifting device 81 to lower the suction nozzle 77, thereby lowering the suction nozzle 77 from the lifting position of the mounting head 26.
  • the controller 105 controls the positive and negative pressure supply device 97 to supply negative pressure, and causes the suction nozzle 77 in the lifting position to suction and hold the electronic component 13 at the supply position 101.
  • the controller 105 controls at least one of the Z-direction slide mechanism 53 and the lifting device 81 to raise the suction nozzle 77.
  • the controller 105 may start an operation to move the mounting head 26 to the next destination while raising the suction nozzle 77, or may start an operation to move the mounting head 26 to the next destination after raising the suction nozzle 77 to a predetermined height. When moving while being raised, the suction operation is performed until the movement starts.
  • the next destination is the mounting position of the board 12 on which the picked up electronic component 13 is to be mounted, or a supply position 101 for picking up the electronic component 13 onto another suction nozzle 77.
  • the supply positions 101 of the multiple tape feeders 99 in this embodiment are arranged side by side along the X direction.
  • the controller 105 controls the X-direction slide mechanism 51 to change the X-direction position of the mounting head 26, and drives the R-axis motor 79 to switch the suction nozzle 77 in the raised/lowered position, so that the electronic component 13 is picked up by the replaced suction nozzle 77 from the other tape feeder 99.
  • the controller 105 causes the mounting head 26 to start a "mounting position movement operation" to move to a mounting position on the board 12.
  • the "mounting position movement operation” is, for example, an operation of moving the mounting head 26, 28 from the supply position 101 of the supply device 30, 32 to the mounting position on the board 12, and during this operation, the electronic component 13 is imaged by the part cameras 38, 40 while moving the mounting head 26, 28.
  • the controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to move the mounting head 26 from the supply position 101 to the mounting position while passing above the part camera 38.
  • the controller 105 may also decelerate or stop the mounting head 26 above the part camera 38.
  • the controller 105 moves the mounting head 28 to the mounting position while passing above the part camera 40, for example.
  • the controller 105 may control at least one of the Z-direction slide mechanism 53 and the lifting device 81 during shooting to adjust the height of the electronic component 13 so that the electronic component 13 is located within the depth of field of the part camera 38.
  • the depth of field here refers to the distance range between the camera and the subject at which the camera is focused.
  • the controller 105 images the electronic component 13 with the part camera 38 in accordance with the timing at which the electronic component 13 held by the suction nozzle 77 enters the depth of field of the part camera 38.
  • the controller 105 obtains information regarding the holding attitude of the electronic component 13 based on the image data.
  • the controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to move the mounting head 26 above the mounting position on the board 12 fixed to the work position 47 by the board transport and holding device 20.
  • the controller 105 When the controller 105 places the mounting head 26 at the mounting position, it causes the mounting head 26 to start a "mounting operation."
  • the “mounting operation” is, for example, an operation from the time when the mounting head 26 arrives above the mounting position of the board 12 until it mounts the electronic component 13 and is ready to start moving to the next destination.
  • the controller 105 controls at least one of the Z-direction slide mechanism 53 and the lifting device 81 to lower the suction nozzle 77 at the lifting position.
  • the controller 105 controls the positive and negative pressure supply device 97 to, for example, supply positive pressure to the suction nozzle 77 placed at the lifting position, and mounts the electronic component 13 held by the suction nozzle 77 at the lifting position at the intended mounting position.
  • the controller 105 corrects the orientation, posture, etc. of the electronic component 13 held by the suction nozzle 77 based on the fixed position of the board 12 and the holding posture of the electronic component 13, and mounts it.
  • the controller 105 may start an operation to move the mounting head 26 to the next destination (such as the next mounting position) while raising the suction nozzle 77, or may start an operation to move the mounting head 26 to the next destination after raising the suction nozzle 77 to a predetermined height. When moving while raising, the mounting operation is completed up to the start of the movement.
  • the controller 105 causes the mounting head 26 to start a "supply position movement operation".
  • the "supply position movement operation” is, for example, an operation of moving from the mounting position to a supply position 101 of the tape feeder 99 that next picks up the electronic component 13.
  • the controller 105 controls the X-direction slide mechanism 51 and the Y-direction slide mechanism 52 to move the mounting head 26 to the next supply position 101.
  • the controller 105 moves the mounting head 26, for example, on a straight line (shortest distance) connecting the mounting position and the supply position 101. That is, unlike the above-mentioned "mounting position movement operation", the controller 105 does not perform image capture by the part camera 38, so moves the mounting head 26 the shortest distance.
  • the controller 105 may move the mounting head 26 on a path other than the shortest distance, such as a path that passes above the part camera 38.
  • the controller 105 moves the mounting head 26 to the supply position 101, it causes the mounting head 26 to start the suction operation.
  • the component mounting machine 10 controls the mounting head 28 in the same manner as the above-mentioned control of the mounting head 26, and the two mounting heads 26, 28 work together to mount the electronic components 13.
  • a component mounting machine 10 equipped with multiple mounting heads 26, 28 as in this embodiment, if any of the mounting heads 26, 28 operates while the other mounting heads 26, 28 are performing a mounting operation, vibrations generated by the operation of the other mounting heads 26, 28 may be transmitted to the mounting heads 26, 28 performing the mounting operation, which may reduce the mounting accuracy.
  • the vibrations may be transmitted to the mounting head 26, which may reduce the mounting accuracy.
  • the controller 105 of this embodiment limits the operation of one of the two mounting heads 26, 28 to the suction operation while the other mounting head 26, 28 is performing the mounting operation. This reduces vibrations generated by the operation of the other mounting head 26, 28 during the mounting operation, improving mounting accuracy.
  • the controller 105 controls the mounting heads 26, 28, etc. based on the control program 113 to execute each operation such as the mounting operation.
  • the control program 113 is set (programmed) to limit the operation of one of the two mounting heads 26, 28 to a pickup operation while the other mounting head 26, 28 is executing a mounting operation.
  • the controller 105 can limit operations and improve mounting accuracy simply by executing control based on the control program 113.
  • the suction operation does not correct the posture of the electronic components 13 that have been picked up, so there are fewer operations compared to the mounting operation.
  • the time for the "mounting position movement operation” is longer than the time for the "supply position movement operation” which moves linearly. Therefore, the relationship between the operation times of the four operations is generally shorter in the order of the mounting operation, suction operation, mounting position movement operation, and supply position movement operation. Therefore, by performing the suction operation, which has the next longest operation time, during the mounting operation, which has a relatively long operation time, it is possible to suppress the decrease in production efficiency due to the operation restriction process. Furthermore, in the four operations in one cycle, the number of mounting operations performed consecutively and the number of suction operations performed consecutively are basically the same.
  • the control program 113 is set with the XYZ coordinates to which the two mounting heads 26, 28 are moved, the mounting order, the component type (information for determining which tape feeder 99 will acquire the components), and the like.
  • the order, timing, position, and the like are set so that the mounting head 28 arrives at the supply position 101 and performs the suction operation in accordance with the timing when the mounting head 26 arrives at the mounting position and performs the mounting operation. If the control content is such that the suction operation of the mounting head 28 is completed first, the mounting head 28 is set to wait at the supply position 101 until the mounting operation of the mounting head 26 is completed.
  • the mounting head 26 is set to complete the mounting operation first and start the supply position movement operation. If the mounting head 28 is performing an operation other than the suction operation at the timing when the mounting head 26 starts the mounting operation, the mounting head 26 is set to wait at the mounting position. That is, the control program 113 is set based on the type, number, and arrangement of electronic components 13 to be mounted on the board 12, the type of components on the tape feeder 99, the supply position 101, the positions of the part cameras 38, 40, etc., so that one of the mounting heads 26, 28 is limited to a suction operation in accordance with the mounting operation of the other, and is set to optimize work efficiency.
  • control program 113 can be set to correspond one mounting operation to one suction operation, and while one mounting head 26 performs one mounting operation, the other mounting head 28 performs one suction operation.
  • the control program 113 can be set to correspond multiple consecutive mounting operations to multiple consecutive suction operations. That is, for example, the control program 113 can be set so that while the mounting head 26 performs multiple mounting operations while moving to multiple mounting positions, the mounting head 28 performs multiple suction operations while moving to multiple supply positions 101. In this case, the mounting head 28 is allowed to move from any supply position 101 to another supply position 101 in addition to the suction operation in response to the multiple mounting operations of the mounting head 26.
  • the controller 105 may allow the other mounting head 26, 28 to perform an operation (one example of an acquisition operation of the present disclosure) by controlling the X-direction slide mechanism 51 to move the mounting head 26, 28 in the X direction, and perform a suction operation to acquire the electronic component 13 from the supply position 101 on each of the multiple tape feeders 99 to each of the multiple suction nozzles 77.
  • the Y-direction slide mechanism 52 moves the X-direction guide rail 57 extending in the X-direction in the Y-direction (an example of the second direction of the present disclosure).
  • the X-direction slide mechanism 51 moves the X-direction slider 61 in the X-direction (an example of the first direction of the present disclosure).
  • the X-direction slider 61 is a member that is large enough to mount the mounting heads 26 and 28 and is smaller than the X-direction guide rail 57.
  • the mass of the member (X-direction guide rail 57) moved by the Y-direction slide mechanism 52 is heavier than the mass of the member (X-direction slider 61) moved by the X-direction slide mechanism 51.
  • the mass of the X-direction guide rail 57 is about four to five times the mass of the X-direction slider 61. Therefore, the vibration generated when the X-direction slide mechanism 51 is operated is significantly smaller than the vibration generated when the Y-direction slide mechanism 52 is operated.
  • the operation of moving in the X direction between the multiple supply positions 101 in the multiple consecutive pick-up operations described above is performed at a location away from the mounting position in the Y direction.
  • the degree to which the mounting accuracy is reduced due to vibrations generated by multiple consecutive pick-up operations is extremely small compared to the degree to which the mounting accuracy is reduced due to vibrations generated by other operations. Therefore, by allowing multiple pick-up operations and movement in the X direction during the mounting operation, it is possible to achieve both improved mounting accuracy and improved production efficiency.
  • the controller 105 restricts the operation of the other mounting heads 26, 28 to suction operation from the time when any of the mounting heads 26, 28 arrives above the mounting position until the suction nozzle 77 is lowered and suction by the suction nozzle 77 is released to complete mounting of the electronic component 13.
  • the controller 105 does not need to restrict the operation of the other mounting heads 26, 28 after the mounting is completed and the operation of raising the suction nozzle 77 is started.
  • the mounting operation can be divided into two parts, the operation until the mounting is completed and the operation after the mounting is completed, and the restriction process can be performed only for the operation until the mounting is completed, and the restriction process can be not executed after the mounting is completed. This shortens the time during which the other mounting heads 26, 28 are restricted, thereby improving production efficiency.
  • the controller 105 may not restrict the operation of any of the mounting heads 26, 28 until the mounting head 26, 28 arrives above the mounting position and completes the descent of the suction nozzle 77.
  • the controller 105 also restricts the operation of the other mounting heads 26, 28 to suction operation while the suction nozzle 77 that has been lowered is being released from suction.
  • the controller 105 does not restrict the operation of the other mounting heads 26, 28 after the suction nozzle 77 has released suction and the suction nozzle 77 has begun to rise.
  • the controller 105 executes the restriction process only during the mounting operation when the suction nozzle 77 has completed its descent and is releasing the electronic component 13, and does not execute the restriction process before or after that. This makes it possible to greatly shorten the time during which the other mounting heads 26, 28 are restricted, thereby further improving production efficiency.
  • the controller 105 may also use, for each electronic component 13, a process that performs the restriction process during the entire period of the above-mentioned mounting operation, a process that performs the restriction process only during lowering and mounting, and a process that performs the control process only during mounting.
  • the controller 105 may use three types of processes depending on the accuracy required for the electronic component 13 to be mounted. This can improve the mounting accuracy and production efficiency to be more optimal.
  • the controller 105 may also execute the above-mentioned restriction process depending on the mode of the component mounting machine 10.
  • the component mounting machine 10 of this embodiment has, for example, a normal mode and a high-precision mode.
  • the controller 105 executes the above-mentioned restriction process, and when the normal mode is set, the controller 105 may not execute the restriction process.
  • the high-precision mode here is a mode that improves the mounting accuracy compared to the normal mode. For example, in the high-precision mode, the upper limit value of the operating speed (movement speed and lifting speed) of the mounting heads 26, 28 is made smaller than the upper limit value in the normal mode.
  • the acceleration of the mounting heads 26, 28 is made smaller than the acceleration in the normal mode.
  • This can improve the mounting accuracy.
  • two types of control programs 113 one in which the restriction process is not set and one in which the restriction process is set, are stored in the storage device 111.
  • the controller 105 executes the control program 113 in which the restriction process is not set
  • the high-precision mode is set
  • the controller 105 executes the control program 113 in which the restriction process is set.
  • the high-precision mode is set in this way, that is, when the user desires high precision
  • the above-mentioned restriction process may be executed. This allows the system to prioritize production efficiency without executing the restriction process, or prioritize placement precision by executing the restriction process, depending on the mode set by the user.
  • backlash control in which a preparation position is set when the mounting heads 26, 28 are moved from the current position to a predetermined processing position (such as a mounting position), and the mounting heads 26, 28 are moved to the processing position after being temporarily stopped at the preparation position, or the moving speed from the preparation position to the processing position is limited.
  • a mechanism that connects teeth such as a ball screw mechanism is used as the X-direction slide mechanism 51 or the Y-direction slide mechanism 52, instead of a linear motor, there is a risk that an error of about several ⁇ m will occur in the stop position of the destination due to backlash or lost motion.
  • a preparation position may be set between the source and destination, and the stop position may be corrected by adjusting the moving speed at the preparation position.
  • the above-mentioned limiting process can be performed to improve the mounting accuracy according to the user's request.
  • the component mounting machine 10 does not need to have a normal mode, a high-precision mode, or the like, and does not need to switch whether or not to execute the restriction process depending on the mode.
  • the component mounting machine 10 may be configured to always execute the restriction process.
  • the electronic component 13 is an example of a component of the present disclosure.
  • the suction nozzle 77 is an example of a gripping member.
  • the X-direction slide mechanism 51 is an example of a first moving device.
  • the Y-direction slide mechanism 52 is an example of a second moving device.
  • the tape feeder 99 is an example of a feeder.
  • the controller 105 of the control device 103 which is one aspect of this embodiment, limits the operation of any one of the mounting heads 26, 28 to suction operations in response to the performance of a mounting operation by any one of the mounting heads 26, 28. This makes it possible to reduce vibrations generated by the operation of the other mounting heads 26, 28 while the any one of the mounting heads 26, 28 is performing a mounting operation, thereby improving mounting accuracy.
  • FIG. 6 shows a flowchart of the judgment process for determining the operation of the mounting heads 26, 28 according to the second embodiment.
  • the controller 105 causes each of the mounting heads 26, 28 to execute four operations, namely, the pickup operation, the mounting position movement operation, the mounting operation, and the supply position movement operation, in sequence according to the sequence set in the control program 113.
  • the controller 105 executes the judgment process of FIG. 6 before starting the execution of the next operation, and determines whether or not it is OK to start the next operation. That is, in the second embodiment, instead of setting the start timing and the like in the control program 113 as in the first embodiment, only the order of operations is set in the control program 113, and the controller 105 executes the judgment process of FIG. 6 before starting each operation to judge whether it is OK to execute it.
  • the controller 105 determines whether the next operation is a mounting operation in step (hereinafter simply referred to as S) 11 of FIG. 6.
  • the next operation of the mounting head 26 will be described as an example to be determined.
  • the controller 105 determines whether the next operation of the mounting head 26 is an apparatus operation (S11). If the controller 105 determines that the next operation of the mounting head 26 is an apparatus operation (S11: YES), it determines whether the operation being performed by the other mounting head 28 is a pick-up operation (S13).
  • the controller 105 causes the mounting head 26 to wait for a predetermined time without starting the next operation (mounting operation) even if the mounting head 26 has completed the operation currently being performed, for example, a mounting position movement operation, and is in a state where the mounting head 26 can start the next operation (S15). After executing S15, the controller 105 executes the determination process of S13 again.
  • the controller 105 causes the mounting head 26 to perform the next operation (S17). That is, the controller 105 causes the mounting head 26 to start the mounting operation. Therefore, before starting the mounting operation of the mounting head 26, the controller 105 checks whether the mounting head 28 is performing a suction operation (S13), and if not (S13: NO), causes the mounting head 26 to wait without starting the mounting operation until the mounting head 28 starts the suction operation (S15). This makes it possible to cause the mounting head 26 to perform the mounting operation only when the other mounting head 28 is performing a suction operation, thereby improving mounting accuracy.
  • the controller 105 When the controller 105 starts the next operation in S17, it restarts the process from S11. This causes the controller 105 to execute the determination process from S11 onwards for the next operation of the mounting head 26 (in this case, the operation following the mounting operation started in S17). Furthermore, if the operation being performed (such as the previous operation) has not been completed at the time the controller 105 starts the process of S17, it executes S17 and starts the next operation after all operations being performed or scheduled to be performed are completed.
  • the mounting operation and suction operation to be judged in the second embodiment may be the mounting operation and suction operation of one operation (for one electronic component 13) described in the first embodiment.
  • the mounting operation to be judged may be an operation including multiple mounting operations and an operation of moving between multiple mounting positions, that is, a series of operations to continuously mount multiple electronic components 13 at different mounting positions.
  • the suction operation to be judged may be an operation including multiple suction operations and an operation of moving between multiple supply positions 101, that is, a series of operations to continuously pick up multiple electronic components 13 from the same or different supply positions 101.
  • the controller 105 may judge whether a series of multiple suction operations and movement operations are being performed as the suction operation to be judged in S13.
  • the controller 105 may also start a series of multiple mounting operations and movement operations as the mounting operation to be started in S17.
  • the above-mentioned series of operations may also be used for the following S19, S21, and S23.
  • the controller 105 judges whether the operation being performed by the other mounting head 28 is not a mounting operation (S19). If the operation of the mounting head 28 is not a mounting operation (S19: YES), the controller 105 causes the mounting head 26 to start the next operation (S17). In this way, when judging whether the next operation may be started for any mounting head 26, 28, if the next operation is not a mounting operation and the other operation is not a mounting operation, the controller 105 causes the next operation to be started. Until the two mounting heads 26, 28 start their mounting operations, the controller 105 can cause each of the mounting heads 26, 28 to execute the operations set in the control program 113 in order. Note that when the above-mentioned series of operations is adopted, the controller 105 judges in S19 whether a series of mounting operations (operations including movement of multiple mounting positions) is being executed.
  • the controller 105 determines whether the next operation of the mounting head 26 is a suction operation (S21). If the next operation of the mounting head 26 is a suction operation (S21: YES), the controller 105 causes the mounting head 26 to start the suction operation (S17). This allows the mounting head 26 to perform a suction operation while the other mounting head 28 is performing a mounting operation. When the above-described series of operations is employed, the controller 105 determines in S21 whether a series of suction operations (operations including the movement of multiple supply positions 101) is the next operation.
  • the controller 105 also executes S23 if the next operation of the mounting head 26 is not a pickup operation (S21: NO).
  • the next operation of the mounting head 26 is a "mounting position movement operation” or a "supply position movement operation”
  • the operation being performed by the counterpart mounting head 28 is a mounting operation. Therefore, the controller 105 determines in S23 whether the mounting operation of the mounting head 28 has been completed, and repeats the determination process of S23 while making the mounting head 26 wait for a predetermined time (S25) until the operation is completed (S23: NO), as in S15. Note that when the above-mentioned series of operations is adopted, the controller 105 determines in S23 whether the series of mounting operations (operations including movement of multiple mounting positions) has been completed.
  • the controller 105 causes the mounting head 26 to execute the next operation (mounting position movement operation or supply position movement operation) (S17). For example, consider a case where the controller 105 determines to execute a mounting position movement operation as the next operation of the mounting head 26 while the mounting head 26 is executing a suction operation. In this case, if the mounting head 26 (an example of a second mounting head in the present disclosure) completes the execution of the suction operation while the other mounting head 28 (an example of a first mounting head in the present disclosure) is executing a mounting operation, the controller 105 checks whether the mounting operation of the mounting head 28 is completed before starting the mounting position movement operation, which is the next operation (S23).
  • the controller 105 causes the mounting head 26 to wait until the mounting operation of the mounting head 28 is completed (S25). This makes it possible to prevent an operation that affects mounting accuracy (such as a mounting position movement operation) from being started during the mounting operation. In this way, the controller 105 can adjust the execution timing of the two mounting heads 26, 28 while checking the operation of the other head before any of the mounting heads 26, 28 starts its next operation.
  • the method of controlling the mounting heads 26, 28 shown in FIG. 6 is an example.
  • the controller 105 may execute the determination process of FIG. 6 for only one of the mounting heads 26, 28.
  • the controller 105 may stop the operation of the other mounting head 26, 28.
  • the controller 105 may stop the movement of the mounting head 28, or move it to the mounting position and then stop it. Then, the controller 105 may resume the operation of the mounting head 28 when the mounting operation of the mounting head 26 is completed.
  • the controller 105 may stop the movement of the mounting head 28. The controller 105 may then resume the movement of the mounting head 28 at the timing when the mounting operation of the mounting head 26 is completed. As in the first embodiment, the controller 105 may execute the determination process of FIG. 6 only for the period during which the suction nozzle 77 is lowered and mounted, without executing the restriction during the entire period of the mounting operation. For example, in S19 and S23, the controller 105 may determine whether the operation is being performed or has been completed for the operation from the timing when the other mounting head 28 starts to lower the suction nozzle 77 at the mounting position to the completion of the removal of the electronic component 13.
  • control process may be executed only during mounting.
  • the controller 105 may determine whether the operation is being performed or has been completed for the operation from the timing when the other mounting head 28 completes the descent of the suction nozzle 77 at the mounting position to the completion of the removal of the electronic component 13.
  • the mounting heads 26 and 28 are examples of the first and second mounting heads of the present disclosure.
  • the second embodiment provides the same effects as the first embodiment.
  • the second embodiment provides the following effects.
  • the controller 105 determines the operation of the other mounting head 26, 28 before each of the mounting heads 26, 28 starts its next operation, executes standby processing, and adjusts the start timing. This makes it possible to prevent operations other than the pickup operation that may affect the mounting accuracy from being executed during the mounting operation. Also, it becomes unnecessary to check and set the relationship between the operations of the mounting heads 26, 28 at the stage of setting the control program 113 as in the first embodiment. In other words, the burden associated with creating the control program 113 can be reduced.
  • one component mounting machine 10 restricts the operation of the other mounting heads 26, 28 in response to the mounting operation of any one of the mounting heads 26, 28.
  • the operation of the other component mounting machines 10A, 10B may be restricted in response to the mounting operation of any one of the component mounting machines 10A, 10B.
  • the same reference numerals are used for configurations similar to those in the first embodiment, and the description thereof will be omitted as appropriate.
  • some members such as the mark cameras 34, 36, the part cameras 38, 40, and the Z-direction slide mechanism 53 are omitted from the illustration.
  • the mounting line 120 of the third embodiment includes component mounting machines 10A and 10B arranged on a base 121 in the X direction (an example of the conveying direction of the present disclosure) for conveying the board 12.
  • the component mounting machines 10A and 10B have the same configuration and include a board conveying and holding device 20, a moving device 22A, one mounting head 26, a supply device 30, etc.
  • the component mounting machines 10A and 10B configure one production line by connecting the board conveying and holding devices 20 of each other in the X direction.
  • the moving device 22A has the same configuration as the moving device 22 of the first embodiment, but is configured to move one mounting head 26.
  • the Y-direction slide mechanism 52 of the moving device 22A is provided with one Y-direction guide rail 55
  • the X-direction slide mechanism 51 is provided with one X-direction guide rail 57.
  • the moving device 22A also includes a Z-direction slide mechanism 53 (see FIG. 4) for moving the mounting head 26 in the Z direction.
  • Each of the component mounting machines 10A and 10B holds the board 12 transported in the X direction fixedly at each of the work positions 47A and 47B, and performs mounting of the electronic components 13 using each mounting head 26. Therefore, the mounting line 120 can perform mounting in parallel on separate boards 12 using the two component mounting machines 10A and 10B.
  • Each of the component mounting machines 10A, 10B is provided with a supply device 30 at one end of the base 16 in the Y direction, and multiple tape feeders 99 (see FIG. 1) can be attached.
  • the mounting head 26 of each of the component mounting machines 10A, 10B obtains electronic components 13 from the supply device 30 and performs mounting work on the board 12 at the work position 47A, 47B.
  • vibrations generated by the operation of any one of the component mounting machines 10A, 10B may be transmitted to the other component mounting machines 10A, 10B, reducing the mounting accuracy.
  • a restriction process may be performed in the same manner as in the first embodiment. Specifically, when one of the component mounting machines 10A, 10B performs a mounting operation, the operation of the other component mounting machine 10A, 10B is restricted. For example, while the mounting head 26 of the component mounting machine 10A performs a mounting operation, the operation of the mounting head 26 of the component mounting machine 10B is restricted to a suction operation. This allows for improved mounting accuracy even in the component mounting machines 10A, 10B that operate in parallel.
  • the method of implementing the restriction process in the mounting line 120 is not particularly limited.
  • the control program 113 executed by the control device 103 of each of the two component mounting work machines 10A, 10B may be set in advance with respect to the timing for performing the mounting work and the timing for performing the restriction process.
  • the mounting line 120 may be provided with a host management device that collectively controls the control devices 103 of the two component mounting work machines 10A, 10B. Then, as in the second embodiment, the host management device may determine the start of the next operation of the two component mounting work machines 10A, 10B.
  • the control devices 103 of the two component mounting work machines 10A, 10B may communicate directly to determine the start of the next operation.
  • the operation of the other mounting heads 26, 28 is limited to the suction operation in response to the mounting operation of any one of the mounting heads 26, 28, but this is not limited to this, and the operation may be limited to other operations or multiple operations including the suction operation.
  • the pair of X-direction guide rails 57 do not interfere with each other in the Y direction as in the first embodiment, and the mounting heads 26, 28 do not interfere with each other in the XY direction. That is, the mounting operation of the component mounting work machine 10A does not interfere with the mounting operation of the component mounting work machine 10B, and can be freely performed.
  • the mounting operation does not change the position of the mounting head 26 vibrations generated are smaller than those generated by the mounting position movement operation or the supply position movement operation. For this reason, for example, while the component mounting work machine 10A is performing the mounting operation, the operation of the other component mounting work machine 10B may be limited to the mounting operation, or may be limited to two operations, the suction operation and the mounting operation.
  • the third embodiment provides the same effects as the first and second embodiments.
  • the third embodiment provides the following effects.
  • the mounting line 120 according to one aspect of the present disclosure restricts the operation of any one of the component mounting machines 10A, 10B when the other one of the component mounting machines 10A, 10B performs a mounting operation. This improves mounting accuracy when the multiple component mounting machines 10A, 10B perform mounting operations in parallel.
  • the number of component mounting machines 10 in the mounting line 120 is not limited to two, but may be three or more. Furthermore, the multiple component mounting machines 10A, 10B are not limited to being mounted on a single base 121, but may be independent on separate bases 16. Even in this case, since there is a risk of vibrations being transmitted via the connected board transport and holding device 20, it is effective to perform a restriction process.
  • the configurations of the component mounting machines 10, 10A, 10B in the above embodiments are merely examples.
  • the component mounting machines 10, 10A, 10B may be equipped with three or more mounting heads.
  • the component mounting machine 10 may be equipped with two or more board transport and holding devices 20 (conveyor devices 41) arranged in the Y direction. That is, the component mounting machine 10 may be equipped with two transport paths for transporting electronic components 13 along the X direction.
  • the supply devices 30, 32 may be arranged to sandwich the two transport paths (conveyor devices 41) on both sides in the Y direction.
  • the configuration of the mounting heads 26, 28 in the above-described embodiments is merely an example.
  • the mounting heads 26, 28 may be configured to include only one suction nozzle 77.
  • the moving devices 22 and 22A do not necessarily have to include the Z-direction slide mechanism 53. That is, the moving devices 22 and 22A do not necessarily have to include a mechanism for raising and lowering the mounting heads 26 and 28 in the Z direction.
  • the moving devices 22 and 22A may include the Z-direction slide mechanism 53 on only one of the mounting heads 26 and 28.
  • the suction nozzle 77 is used as a gripping member for gripping the electronic component 13, but this is not limited to this.
  • a chuck member that clamps and holds the electronic component 13 may also be used as the gripping member.
  • the supply devices 30 and 32 of the present disclosure are not limited to the tape feeders 99, and may be tray-type supply devices that supply electronic components 13 arranged on a tray.
  • this specification also discloses the technical idea of changing “the component mounting machine according to claim 1 or claim 2" in claim 5 to “the component mounting machine according to any one of claims 1 to 4".
  • this specification also discloses the technical idea of changing “the component mounting machine according to claim 1 or claim 2" in claim 6 to “the component mounting machine according to any one of claims 1 to 5".
  • this specification also discloses the technical idea of changing "the component mounting machine according to claim 1 or claim 2" in claim 7 to "the component mounting machine according to any one of claims 1 to 6".
  • 10, 10A, 10B component mounting machine
  • 12 circuit board
  • 13 electronic component (component)
  • 22, 22A moving device
  • 26, 28 mounting head (first and second mounting head)
  • 30, 32 supply device
  • 51 X-direction slide mechanism (first moving device)
  • 52 Y-direction slide mechanism (second moving device)
  • 77 suction nozzle (gripping member)
  • 99 tape feeder (feeder)
  • 103 control device
  • 113 control program
  • 120 mounting line.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne une machine de montage de composants et une ligne de montage qui permettent d'améliorer la précision de montage.　Cette machine de montage de composants comprend : une pluralité de têtes de montage qui comprennent chacune un élément de préhension pour saisir un composant, et qui montent le composant saisi par l'élément de préhension sur un substrat ; un dispositif d'alimentation qui fournit un composant à chacune de la pluralité de têtes de montage ; un dispositif de déplacement qui déplace chacune de la pluralité de têtes de montage ; et un dispositif de commande qui, en réponse à une tête de montage parmi la pluralité de têtes de montage effectuant une opération de montage, limite le fonctionnement des autres têtes de montage à une opération d'acquisition pour acquérir des composants à partir du dispositif d'alimentation.
PCT/JP2022/039356 2022-10-21 2022-10-21 Machine de montage de composants et ligne de montage WO2024084703A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2022/039356 WO2024084703A1 (fr) 2022-10-21 2022-10-21 Machine de montage de composants et ligne de montage

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Application Number Priority Date Filing Date Title
PCT/JP2022/039356 WO2024084703A1 (fr) 2022-10-21 2022-10-21 Machine de montage de composants et ligne de montage

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WO2024084703A1 true WO2024084703A1 (fr) 2024-04-25

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165096A (ja) * 1998-11-25 2000-06-16 Matsushita Electric Ind Co Ltd 部品装着装置及び方法
JP2011103317A (ja) * 2009-11-10 2011-05-26 Panasonic Corp 部品実装機
JP2015225921A (ja) * 2014-05-27 2015-12-14 ヤマハ発動機株式会社 部品実装方法、部品実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165096A (ja) * 1998-11-25 2000-06-16 Matsushita Electric Ind Co Ltd 部品装着装置及び方法
JP2011103317A (ja) * 2009-11-10 2011-05-26 Panasonic Corp 部品実装機
JP2015225921A (ja) * 2014-05-27 2015-12-14 ヤマハ発動機株式会社 部品実装方法、部品実装装置

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