WO2022226752A1 - 显示模组及显示设备 - Google Patents

显示模组及显示设备 Download PDF

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Publication number
WO2022226752A1
WO2022226752A1 PCT/CN2021/090080 CN2021090080W WO2022226752A1 WO 2022226752 A1 WO2022226752 A1 WO 2022226752A1 CN 2021090080 W CN2021090080 W CN 2021090080W WO 2022226752 A1 WO2022226752 A1 WO 2022226752A1
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WO
WIPO (PCT)
Prior art keywords
connection pad
sub
display
line segment
substrate
Prior art date
Application number
PCT/CN2021/090080
Other languages
English (en)
French (fr)
Inventor
冯春楠
王伟
刘斌
李硕
刘长波
车春城
张志锋
Original Assignee
京东方科技集团股份有限公司
北京京东方传感技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方传感技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2021/090080 priority Critical patent/WO2022226752A1/zh
Priority to CN202180000951.7A priority patent/CN115769435A/zh
Priority to US17/641,138 priority patent/US20240047851A1/en
Publication of WO2022226752A1 publication Critical patent/WO2022226752A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element

Definitions

  • the present disclosure belongs to the field of display technology, and in particular relates to a display module and a display device.
  • NFC Near Field Communication
  • NFC is a non-contact identification and interconnection technology. It adopts the near-field magnetic field communication method, which has the characteristics of short transmission distance, low energy consumption, and the signal is not easily disturbed. It can be used in mobile devices. , short-range wireless communication between consumer electronic products.
  • NFC communication technology has been widely used in electronic devices for data exchange. To use NFC communication technology, it is necessary to install a communication antenna on the device to send and receive electromagnetic wave signals, and the communication antenna needs to occupy a large space. Most of the existing electronic devices using the NFC communication technology are externally placed on the mainboard of the electronic device by placing an independent NFC communication module on the main board of the electronic device. Therefore, it needs to occupy a large space, which is not conducive to the thin and light design of the device.
  • the present invention aims to solve at least one of the technical problems existing in the prior art, and provides a display module and a display device.
  • embodiments of the present disclosure provide a display module, which includes a display substrate, a flexible printed circuit board, and a near field communication antenna; wherein,
  • the display substrate has a display area and a peripheral area; at least part of the structure of the near field communication antenna is located on the peripheral area of the display substrate and the flexible printed circuit board.
  • the display substrate includes a first substrate; the flexible printed circuit board includes a second substrate; the near field communication antenna includes a first wiring and a second wiring that are electrically connected; the first wiring is located at the The peripheral area is arranged on the first substrate; the second wiring is arranged on the second substrate.
  • the display module further includes a transition board; and the first wiring is electrically connected to the second wiring through the transition board.
  • the adapter board includes a chip-on-film adapter board.
  • the near field communication antenna further includes a first lead terminal and a second lead terminal arranged on the flexible printed circuit board;
  • the second substrate includes a first surface and a second surface arranged oppositely; the first Two wires are arranged on the first surface; the first end of the first wire is connected to the first end of the second wire; the second end of the first wire is connected to the first lead end; The second end of the second wiring is connected to the second lead end.
  • the display substrate further has a first binding area on the side of the peripheral area away from the display area;
  • the adapter board includes a second binding area and a third binding area;
  • the flexible printed circuit the board includes a fourth binding area;
  • a first connection pad and a second connection pad are arranged in the first bonding area; a third connection pad and a fourth connection pad are arranged in the second bonding area; in the third bonding area A fifth connection pad and a sixth connection pad are arranged in the area; a seventh connection pad and an eighth connection pad are arranged in the fourth binding area;
  • the first end of the first trace is connected to the first connection pad, and the first connection pad is bound and connected to the third connection pad; the third connection pad is connected through the first connection lead connected to the fifth connection pad; the first end of the second trace is connected to a seventh connection pad, and the seventh connection pad is bound and connected to the fifth connection pad;
  • the second end of the first trace is connected to the second connection pad, and the second connection pad is bound and connected to the fourth connection pad; the fourth connection pad is connected through the second connection lead connected to the sixth connection pad; the sixth connection pad is bound and connected to the eighth connection pad, and the eighth connection pad is connected to the first lead terminal.
  • a magnetic material layer is disposed on the side of the second trace away from the first surface; the magnetic material layer covers the second trace.
  • the second substrate includes a first surface and a second surface disposed opposite to each other;
  • the second wiring includes a first sub-line segment, a second sub-line segment located on the first surface, and a second sub-line segment located on the second surface a third sub-line segment on the surface;
  • the near field communication antenna further includes a first lead terminal and a second lead terminal disposed on the flexible printed circuit board;
  • the first end of the first wiring is connected to the first end of the first sub-line segment; the second end of the first wiring is connected to the third sub-line through a first via hole passing through the second substrate the first end of the line segment is connected; the second end of the third sub-line segment is connected with the first end of the second sub-line segment through the second via hole passing through the second substrate; the first end of the first sub-line segment Two ends are used as the first lead end; the second end of the second sub-line segment is used as the second lead end.
  • the display substrate further has a first binding area on the side of the peripheral area away from the display area;
  • the adapter board includes a second binding area and a third binding area;
  • the flexible printed circuit the board includes a fourth binding area;
  • a first connection pad and a second connection pad are arranged in the first bonding area; a third connection pad and a fourth connection pad are arranged in the second bonding area; in the third bonding area A fifth connection pad and a sixth connection pad are arranged in the area; a seventh connection pad and an eighth connection pad are arranged in the fourth binding area;
  • the first end of the first trace is connected to the first connection pad, and the first connection pad is bound and connected to the third connection pad; the third connection pad is connected through the first connection lead connected to the fifth connection pad; the first end of the first sub-line segment is connected to a seventh connection pad, and the seventh connection pad is bound and connected to the fifth connection pad;
  • the second end of the first trace is connected to the second connection pad, and the second connection pad is bound and connected to the fourth connection pad; the fourth connection pad is connected through the second connection lead connected to the sixth connection pad; the sixth connection pad is bound and connected to the eighth connection pad, and the eighth connection pad is connected to the The first ends of the three sub-line segments are connected.
  • the orthographic projections of the first sub-line segment and the second sub-line segment on the second substrate overlap with the orthographic projection of the third sub-line segment on the second substrate.
  • a magnetic material layer is provided on the side of the first sub-line segment and the second sub-line segment away from the first surface; the magnetic material layer covers the first sub-line segment and the second sub-line segment ;and / or,
  • a magnetic material layer is provided on the side of the third sub-segment away from the second surface; the magnetic material layer covers the third sub-segment.
  • the extension directions of the first lead end and the second lead end are the same.
  • the near-field communication antenna includes a plurality of the first wirings and a plurality of the second wirings, and one of the first wirings is connected to one of the second wirings to form a sub-coil group, Each of the sub-coils is connected in parallel, the first end of each of the sub-coils is connected to the first lead terminal, and the second end is connected to the second lead terminal.
  • the display substrate further includes a metal layer located on the first substrate; the metal layer includes a first part located in the display area and a second part located in the peripheral area; the second part includes all the Describe the first line.
  • the metal layer includes a first metal layer and a second metal layer;
  • the first wiring includes a first sub-conducting wire and a second sub-conducting wire that are stacked and electrically connected;
  • the first metal layer includes the first sub-conducting lines and gate lines located in the display area;
  • the second metal layer includes second sub-conducting lines and data lines located in the display area.
  • Embodiments of the present disclosure further provide a display device including the above-mentioned display module.
  • FIG. 1 is a schematic diagram of an exemplary display module.
  • FIG. 2 is a circuit diagram of a pixel.
  • 3a is a top view of a flexible circuit board of a display module according to an embodiment of the disclosure when it is not folded.
  • 3b is a top view of a flexible circuit board of a display module after being folded according to an embodiment of the disclosure.
  • Fig. 4 is a cross-sectional view along A-A' of Fig. 1a.
  • Fig. 5 is a cross-sectional view taken along line B-B' of Fig. 1a.
  • 6a is a top view of another flexible circuit board of a display module according to an embodiment of the disclosure when it is not folded.
  • FIG. 6b is a top view of another flexible circuit board of a display module according to an embodiment of the disclosure after being folded.
  • Fig. 7 is a cross-sectional view along C-C' of Fig. 4a.
  • FIG. 8 is a schematic diagram of a near field communication antenna when it is not folded according to an embodiment of the disclosure.
  • FIG. 9 is a schematic diagram of a folded near field communication antenna according to an embodiment of the disclosure.
  • the display module includes a display panel, a chip on film (COF; Chip On Film) adapter board and a flexible printed circuit board 2 (FPCB; Flexible Print Circuit Board); wherein the display panel It includes a display substrate 1 and a cell assembling substrate.
  • the display substrate 1 is connected to the flexible printed circuit board 2 through a chip-on-film transition board 4 .
  • the display substrate 1 has a display area Q1 and a peripheral area Q2.
  • the display substrate 1 is provided with a plurality of gate lines (Gate Lines) extending in the X direction and a plurality of data lines (Data Lines) extending in the Y direction.
  • the plurality of gate lines are electrically connected to the driving circuit DC (Driving Circuit) in the peripheral region Q2.
  • a plurality of gate lines and a plurality of data lines intersect to define a plurality of pixel regions, each pixel region is provided with a pixel P (Pixel), and each pixel P has an organic light-emitting element, such as an organic light-emitting diode OLED (Organic Light-Emitting Diode) . Since the light emitted by the organic light emitting diode can be used to display images, the area where the plurality of pixel areas are located is defined as a display area Q1.
  • the peripheral area Q2 is arranged outside the display area Q1. For example, the peripheral area Q2 may surround the perimeter of the display area Q1, and the peripheral area Q2 cannot display images and is a non-display area.
  • each pixel P includes a pixel circuit PC (Pixel Circuit) connected to the gate line GL and the data line DL of the pixel P, and an organic light emitting diode OLED connected to the pixel circuit PC.
  • the pixel circuit PC includes a driving thin film transistor (Thin-film Transistor, TFT) Td, a switching transistor Ts and a storage capacitor Cst.
  • the switching transistor Ts is connected to the gate line GL and the data line DL, and is configured to transmit the data signal received through the data line DL to the driving transistor Td according to the scan signal received through the gate line GL.
  • the storage capacitor Cst is connected to the switching transistor Ts and the driving voltage line PL, and is configured to store a voltage corresponding to the difference between the voltage received from the switching transistor Ts and the driving voltage ELVDD supplied to the driving voltage line PL.
  • the driving transistor Td is connected to the driving voltage line PL and the storage capacitor Cst, and may be used to control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED according to the voltage value stored in the storage capacitor Cst.
  • the organic light emitting diode OLED can emit light with desired brightness by driving current.
  • Organic light emitting diodes OLEDs can emit, for example, red, green, blue or white light.
  • the pixel circuit PC of the pixel P may include three or more transistors or two or more storage capacitors.
  • the display substrate 1 further includes a first binding area Q3 , and the first binding area Q3 is located on the side of the peripheral area Q2 away from the display area Q1 .
  • the first bonding area Q3 is located on one side of the display area Q1
  • the pad area WA includes a plurality of connection pads (or contact pads), each of which is configured to be electrically connected Signal lines extending from the display area Q1 or the peripheral area.
  • the contact pads may be exposed on the surface of the first bonding area Q3 , ie, not covered by any layer, so as to facilitate the electrical connection of the chip-on-film interposer 4 to be electrically connected to the flexible printed circuit board 2 .
  • the flexible printed circuit board 2 is electrically connected to an external controller, and is configured to transmit a signal or power from the external controller.
  • the connection pads are electrically connected with the data connection lines (the data connection lines are electrically connected with the data lines in the display area Q1).
  • the connection pads are electrically connected with each signal line, so that the signal line and the flexible circuit board can communicate with each other.
  • NFC near field communication technology has been widely used in electronic devices for data exchange.
  • NFC communication technology it is necessary to install a communication antenna on the device to send and receive electromagnetic wave signals, and the communication antenna needs to occupy a large space.
  • Most of the existing electronic devices using the NFC communication technology are externally placed on the mainboard of the electronic device by placing an independent NFC communication module on the main board of the electronic device. Therefore, it needs to occupy a large space, which is not conducive to the thin and light design of the device.
  • a display module is provided in the embodiment of the present disclosure, the coil is integrated on the display substrate 1 and the flexible printed circuit board 2 of the display module, so as to realize the integrated design of the NFC near field communication antenna and the display module, It is beneficial to save space and realize the thin and light design of the display module.
  • An embodiment of the present disclosure provides a display module, which includes a display substrate 1 , an adapter board, a flexible printed circuit board 2 and a near field communication antenna.
  • the adapter plate includes but is not limited to the chip-on-film adapter plate 4, but due to the flexibility of the chip-on-film adapter plate 4, it is easy to fold and can reduce the scratches on the display module.
  • the chip-on-film transfer board 4 is used as an example for the transfer board for description.
  • the display substrate 1 is connected to the flexible circuit board through a chip-on-film transition board 4 .
  • the display substrate 1 has a display area Q1 and a peripheral area Q2 ; at least part of the structure of the near field communication antenna is integrated in the peripheral area Q2 of the display substrate 1 and the flexible printed circuit board 2 .
  • the near field communication antenna is integrated on the peripheral area Q2 of the display substrate 1 and the flexible printed circuit board 2 , which is beneficial to saving space, realizing a thin and light design of the display module, and simultaneously displaying the peripheral area Q2 of the substrate 1 and the flexible printed circuit board 2 .
  • the flexible printed circuit board 2 is a non-display area, so integrating the near field communication antenna into the display module will not affect the display effect of the display module.
  • FIG. 3 a is a top view of a flexible circuit board of a display module according to an embodiment of the disclosure when it is not folded;
  • FIG. 3 b is a folded flexible circuit board of a display module according to an embodiment of the disclosure.
  • Figure 4 is a cross-sectional view of A-A' of Figure 1a;
  • Figure 5 is a cross-sectional view of B-B' of Figure 1a;
  • the near field communication antenna includes The first wiring 31 and the second wiring 32 , and the first lead terminal 33 and the second lead terminal 34 are connected in series.
  • the display substrate 1 includes a first substrate 10; the flexible printed circuit board 2 includes a second substrate 20, and the second substrate 20 has a first surface and a second surface disposed opposite to each other.
  • the second surface is closer to the first substrate 10 than the first surface as an example for illustration.
  • the first wiring 31 is arranged on the first substrate 10 and is arranged around the peripheral area Q2 of the display substrate 1; the second wiring 32 is arranged on the first surface of the second substrate 20; the first lead terminal 33 and the second lead The ends 34 are each disposed on the second substrate 20 .
  • the first end of the first wire 31 is connected to the first end of the second wire 32, the second end of the first wire 31 is connected to the first wire end 33; the second end of the second wire 32 is connected to the first end of the second wire 32.
  • Two lead terminals 34 are connected.
  • the first lead terminal 33 and the second lead terminal 34 can be connected to the control circuit, so that the near field communication antenna and the control circuit form a closed loop, and an induced current can be formed in the near field communication antenna and the control circuit through the peripheral magnetic induction coil loop to complete near field communication.
  • the first lead terminal 33 and the second lead terminal 34 may both be disposed on the first surface of the second substrate 20 , in which case, in order to facilitate the first lead terminal 33 and the second lead terminal 34 and control For circuit connection, the first lead terminal 33 and the second lead terminal 34 can be layer-jumped, that is, an interlayer dielectric layer is formed on the side of the second trace 32 away from the first surface.
  • the second end of the first trace 31 is electrically connected to the first lead terminal 33 through a first connection via penetrating the interlayer dielectric layer, and the second end of the second trace 32 is electrically connected through a second connection through the interlayer dielectric layer.
  • the hole is connected to the second lead terminal 34 .
  • first lead terminal 33 and the second lead terminal 34 may also be disposed on the second surface of the second substrate 20 .
  • the second end of the first trace 31 is connected through the first connection through the second substrate 20 .
  • the hole is electrically connected to the first lead terminal 33
  • the second end of the second trace 32 is connected to the second lead terminal 34 through a second connection via hole passing through the second substrate 20 .
  • the extension directions of the first lead terminal 33 and the second lead terminal 34 may be the same, thereby facilitating the connection of the first lead terminal 33 and the second lead terminal 34 with the control circuit.
  • the first traces 31 are in an open-loop structure, and the second traces 32 are in a spiral structure.
  • the first traces 31 and the second traces form a one-turn coil structure of the near field communication antenna.
  • the first trace 31 is in an open-loop structure.
  • the first trace 31 can also be arranged around the display area Q1 in a spiral structure.
  • the first end of the first trace 31 At least one of the second end and the second end needs to extend toward the direction of the flexible printed circuit board 2 through the jump layer, so as to avoid the problem of short circuit.
  • the first end of the first trace 31 is located in the middle of the first trace 31, an interlayer dielectric layer is formed on the side of the first trace 31 away from the first substrate 10, and the first end of the first trace 31 It extends toward the direction of the flexible printed circuit board 2 through the via hole penetrating the interlayer dielectric layer.
  • the display substrate 1 further has a first binding area Q3 on the side of the peripheral area Q2 away from the display area Q1; the chip-on-film interposer 4 includes a second binding area and a third binding area; flexible printing
  • the circuit board 2 includes a fourth bonding area; a first connection pad 41 and a second connection pad 42 are arranged in the first bonding area Q3; a third connection pad 51 and a fourth connection are arranged in the second bonding area Pad 52; a fifth connection pad 61 and a sixth connection pad 62 are arranged in the third bonding area; a seventh connection pad 71 and an eighth connection pad 72 are arranged in the fourth bonding area.
  • the first end of the first trace 31 of the near field communication antenna is connected to the first connection pad 41, and the first connection pad 41 and the third connection pad 51 can be bonded and connected by ACF glue;
  • the second connection pad 42 is connected to the fifth connection pad 61 through the first connection lead 401;
  • the first end of the second trace 32 is connected to the seventh connection pad 71, and the seventh connection pad 71 and the fifth connection pad 61 can be connected by ACF glue Binding connection;
  • the second end of the first trace 31 is connected to the second connection pad 42, and the second connection pad 42 and the fourth connection pad 52 can be bonded and connected by ACF glue;
  • the two connection leads 402 are connected to the sixth connection pad 62 ;
  • the sixth connection pad 62 and the eighth connection pad 72 can be bonded and connected by ACF glue, and the eighth connection pad 72 is connected to the first lead terminal 33 .
  • the first connection pad 41 and the third connection pad 51 are bonded together, the fifth connection pad 61 and the seventh connection pad 71 are bonded together, and the second connection pad 42 and the fourth connection pad are bonded together.
  • UV glue can also be used for curing, so as to ensure the Between the fifth connection pad 61 and the seventh connection pad 71 , between the second connection pad 42 and the fourth connection pad 52 , and between the sixth connection pad 62 and the eighth connection pad 72 connect.
  • the second traces 32 on the flexible printed circuit board 2 are formed of materials including but not limited to copper.
  • copper material is that copper itself has good electrical conductivity and low impedance.
  • the thickness of the second trace 32 is about 15 ⁇ m-35 ⁇ m, and the line width is about 100 ⁇ m-5 mm.
  • the second trace 32 A magnetic material layer (not shown in the figure) is provided on the side away from the second surface.
  • the magnetic flux of the near field communication antenna is enhanced by disposing the magnetic material layer.
  • the material of the magnetic material layer includes, but is not limited to, magnetic materials such as ferrite.
  • the display substrate 1 further includes a metal layer disposed on the first substrate 10, the metal layer includes a first portion located in the display region Q1 and a second portion located in the peripheral region Q2, and the second portion includes near field communication The first trace 31 of the antenna. That is to say, the first wiring 31 of the near field communication antenna and the structure in the display area Q1 of the display substrate 1 can be fabricated in one process, so the process steps and cost will not be increased.
  • the first wiring 31 of the near field communication antenna may be a single-layer structure or a multi-layer structure.
  • the first wiring 31 includes a two-layer structure as an example, that is, the first wiring 31 includes a first sub-conductive line and a second sub-conductive line arranged in a stack.
  • the metal layer in the display substrate 1 at least includes a first metal layer and a second metal layer that are stacked. For example, as shown in FIG.
  • the first metal layer includes the first sub-conductive line 311 of the first trace 31 and the gate line GL, that is, the first sub-conductive wire 311 of the first trace 31 and the gate line GL They are arranged in the same layer, and the materials are the same, and the two can be prepared in one process, so the process steps and costs will not be increased.
  • the second metal layer includes the second sub-conductive line 312 of the first trace 31 and the data line DL, that is to say, the second sub-conductive wire 312 of the first trace 31 and the data line DL are arranged in the same layer and of the same material, And both can be prepared in one process, so the process steps and cost will not be increased.
  • an insulating layer 13 is provided at the intersection of the data line DL and the gate line GL to avoid short circuit between the two.
  • the materials of the first metal layer and the second metal layer include, but are not limited to, at least one material selected from molybdenum, molybdenum-niobium alloy, aluminum, aluminum-neodymium alloy, titanium, and copper.
  • the so-called same-layer arrangement in the embodiments of the present disclosure is not the same-layer arrangement on a macro level, but refers to the structure formed on the same patterning process, which is called the same-layer arrangement.
  • the thickness thereof is about 2 ⁇ m-5 ⁇ m, and the line width is about 3 ⁇ m-10 ⁇ m.
  • the specific thickness and line width of the first wiring 31 can be specifically set according to the performance parameters of the near field communication antenna.
  • FIG. 6a is a top view of a flexible circuit board of another display module according to an embodiment of the disclosure when it is not folded;
  • FIG. 6b is a folded flexible circuit board of another display module according to an embodiment of the disclosure.
  • Figure 7 is a cross-sectional view of C-C' of Figure 6a; as shown in Figures 6a, 6b and 7, the structure of the display module is roughly the same as the first example, the difference lies in the near field in the display module The second trace 32 in the communication antenna is different from that in the first example.
  • the second substrate 20 includes a first surface and a second surface disposed opposite to each other; the second trace 32 includes a first sub-line segment 321, a second sub-line segment 322 located on the first surface, and a third sub-line segment located on the second surface.
  • the near field communication antenna further includes a first lead terminal 33 and a second lead terminal 34 arranged on the flexible printed circuit board 2; the first end of the first wiring 31 is connected to the first end of the first sub-line segment 321; The second end of the first trace 31 is connected to the first end of the third sub-line segment 323 through the first via hole passing through the second substrate 20 ; the second end of the third sub-line segment 323 The via hole is connected to the first end of the second sub-line segment 322 ; the second end of the first sub-line segment 321 is used as the first lead terminal 33 ; the second end of the second sub-line segment 322 is used as the second lead terminal 34 .
  • the near field communication antenna is integrated in the peripheral area Q2 and the flexible printed circuit board 2 of the display substrate 1 of the display module, the integrated design of the near field communication antenna and the display module can be realized without the need for The near-field communication antenna is separately arranged, so that the space occupied by the near-field communication antenna can be effectively saved, and the light and thin design of the display module can be realized effectively.
  • some traces of the near field communication antenna are integrated on the first surface and the second surface of the flexible printed circuit board 2 .
  • the flexible printed circuit board 2 is a single-layer trace, that is, the driver chip and the The signal lines are all arranged on the first surface of the second substrate 20 of the flexible circuit board, and there is usually no wiring on the second surface of the second substrate 20, that is to say, there is enough space on the second surface of the second substrate 20 to form a coil Therefore, in the embodiment of the present disclosure, part of the wiring of the near field communication antenna (the third sub-line segment 323 ) is arranged on the second surface of the second substrate 20, which can effectively avoid the wiring and flexible printing of the near field communication antenna. Signal lines, driver chips, etc. on the circuit board 2 cause interference.
  • the structure of the first wiring 31 is the same as the structure of the first wiring 31 described above, so the structure and parameters of the first wiring 31 will not be repeated.
  • first sub-line segment 321 , the second sub-line segment 322 and the third sub-line segment 323 of the second trace 32 have the same line width and thickness, and are the same as the line width of the second trace 32 in FIG. 3 a the same thickness. The details are not repeated here.
  • the first wiring 31 , the first sub-line segment 321 , the second sub-line segment 322 and the third sub-line segment 323 of the near field communication antenna may form a single-turn coil or a multi-turn coil.
  • a near field communication antenna with three coils is formed as an example.
  • the first wiring 31 has an open-loop structure, which is the same as that in FIG. 3 b , so the description is not repeated here.
  • the orthographic projection of the third sub-line segment 323 on the second substrate 20 encloses a coil structure
  • the orthographic projection of the first sub-line segment 321 and the third sub-line segment 323 on the second substrate 20 encloses a coil structure.
  • the first wiring 31 , the first sub-line segment 321 , the second sub-line segment 322 and the third sub-line segment 323 form three coils.
  • a near field communication antenna with more coil structures can also be formed, which are not listed here.
  • the first sub-line segment 321 , the second sub-line segment 322 and the third sub-line segment 323 of the near field communication antenna are on the first substrate 10 .
  • the orthographic projection is located within the range defined by the orthographic projection of the first traces 31 on the first substrate 10 .
  • the orthographic projections of the first sub-line segment 321 , the second sub-line segment 322 and the third sub-line segment 323 on the first substrate 10 are located at the first position of the open-loop structure.
  • the traces 31 are in the orthographic projection on the first substrate 10 . That is to say, the first wiring 31 , the first sub-line segment 321 , the second sub-line segment 322 and the third sub-line segment 323 are connected in series to form three coils that are nested in sequence.
  • the orthographic projections of the first sub-line segment 321 and the second sub-line segment 322 of the near field communication antenna on the second substrate 2020 are located at the third sub-line segment 323 is orthographically projected on the second substrate 20 .
  • more coil structures can be formed in a limited wiring space to enhance the communication performance of the near field communication antenna.
  • a magnetic material layer is provided on the side of the first sub-segment 321 and the second sub-segment 322 away from the first surface; and/or, on the third sub-segment 322
  • the side of the line segment 323 facing away from the second surface is provided with a magnetic material layer.
  • the display module not only includes the above structure, but also includes a rear case fixed on the side of the flexible circuit board away from the array substrate. When the flexible printed circuit board 2 is folded to the back side of the display panel, and the distance between the flexible printed circuit board 2 and the display panel is smaller than the preset value, then the third sub-line segment 323 is set on the side away from the second surface.
  • the magnetic material layer includes, but is not limited to, magnetic materials such as ferrite.
  • the display substrate 1 further has a first binding area Q3 on the side of the peripheral area Q2 away from the display area Q1; the chip-on-film interposer 4 includes a second binding area and a third binding area; flexible printing
  • the circuit board 2 includes a fourth bonding area; a first connection pad 41 and a second connection pad 42 are arranged in the first bonding area Q3; a third connection pad 51 and a fourth connection are arranged in the second bonding area Pad 52; a fifth connection pad 61 and a sixth connection pad 62 are arranged in the third bonding area; a seventh connection pad 71 and an eighth connection pad 72 are arranged in the fourth bonding area.
  • the first end of the first trace 31 is connected to the first connection pad 41 , and the first connection pad 41 and the third connection pad 51 can be bonded and connected by ACF glue; the third connection pad 51 is connected by the first connection lead 401 connected to the fifth connection pad 61; the first end of the first sub-line segment 321 is connected to the seventh connection pad 71, and the seventh connection pad 71 and the fifth connection pad 61 can be bonded and connected by ACF glue;
  • the second end of the line 31 is connected to the second connection pad 42 , and the second connection pad 42 is bound and connected to the fourth connection pad 52 ; the fourth connection pad 52 is connected to the sixth connection pad 62 through the second connection lead 402 Connection; the sixth connection pad 62 and the eighth connection pad 72 can be bonded and connected by ACF glue, and the eighth connection pad 72 is connected to the first end of the third sub-line segment 323 through the first via through the second substrate 20 connect.
  • the first connection pad 41 and the third connection pad 51 are bonded together, the fifth connection pad 61 and the seventh connection pad 71 are bonded together, and the second connection pad 42 and the fourth connection pad are bonded together.
  • UV glue can also be used for curing, so as to ensure the Between the fifth connection pad 61 and the seventh connection pad 71 , between the second connection pad 42 and the fourth connection pad 52 , and between the sixth connection pad 62 and the eighth connection pad 72 connect.
  • both the first wiring 31 and the second wiring 32 in the near field communication antenna are taken as an example for description.
  • FIG. 9 is a schematic diagram of the approach antenna after being folded in FIG. 8 ; both the first line 31 and the second line 32 in the near field communication antenna may be multiple , and a first wiring 31 and a second wiring 32 are connected in series to form a sub-coil group, each sub-coil is connected in parallel, the first end of each sub-coil is connected to the first lead terminal 33, and the second The terminal is connected to the second lead terminal 34 . In this way, the total coil impedance of the near field communication antenna can be reduced.
  • the number of connection pads can be set to set the number of the first wiring 31 and the second wiring 32, In one example, the number of the first wiring 31 and the number of the second wiring 32 is four.
  • FIGS. 8 and 9 only illustrate a schematic connection diagram of the first wiring 31 and the second wiring 32 , and the number of the first wiring 31 and the second wiring 32 is not affected in this embodiment of the present disclosure. And the shape of the formed sub-coil is defined.
  • An embodiment of the present disclosure provides an electronic device, the electronic device may include any of the above-mentioned display modules, and the display module may be an organic electroluminescent diode display module.
  • the electronic device provided by the embodiments of the present disclosure may be a wearable device, such as a watch.
  • a wearable device such as a watch
  • it can also be any product or component with a display function, such as a mobile phone, a tablet computer, a TV, a monitor, a notebook computer, a digital photo frame, and a navigator.
  • the NFC near field communication antenna is integrated on the display substrate 1 and the flexible printed circuit board 2 of the display module, so as to realize the integrated design of the near field communication antenna and the display module, which is conducive to saving space to realize the thin and light design of the display module.

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Abstract

一种显示模组及显示设备，属于显示技术领域。该显示模组包括显示基板（1）、柔性印刷电路板（2）和近场通信天线；其中，该显示基板（1）具有显示区（Q1）和周边区（Q2）；该近场通信天线的至少部分结构位于该显示基板（1）的周边区（Q2）和该柔性印刷电路板（2）上。

Description

显示模组及显示设备 技术领域
本公开属于显示技术领域，具体涉及一种显示模组及显示设备。
背景技术
近场通讯技术(Near Field Communication，NFC)是一种非接触式识别和互联技术，其采用近场磁场通信方式，具有传输距离近，能耗低，信号不易被干扰等特点，可在移动设备、消费类电子产品间进行近距离无线通信。
近场通讯技术已普遍应用于电子设备上进行数据交换，要利用NFC通讯技术，需要在设备上安装通讯天线用于收发电磁波信号，而通讯天线需要占据较大的空间。现有的运用NFC通讯技术的电子设备，大多是通过将独立的NFC通讯模块，外置于电子设备的主板上，因此，需要占据较大的空间，不利于设备的轻薄化设计。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一，提供一种显示模组及显示设备。
第一方面，本公开实施例提供一种显示模组，其包括显示基板、柔性印刷电路板和近场通信天线；其中，
所述显示基板具有显示区和周边区；所述近场通信天线的至少部分结构位于所述显示基板的周边区和所述柔性印刷电路板上。
其中，所述显示基板包括第一基底；所述柔性印刷电路板包括第二基底；所述近场通信天线包括电连接的第一走线和第二走线；所述第一走线位于所述周边区，且设置在所述第一基底上；所述第二走线设置在所述第二基底上。
其中，所述显示模组还包括转接板；且所述第一走线通过所述转接板与所述第二走线电连接。
其中，所述转接板包括覆晶薄膜转接板。
其中，所述近场通信天线还包括设置在所述柔性印刷电路板上的第一引 线端和第二引线端；所述第二基底包括相对设置的第一表面和第二表面；所述第二走线设置在所述第一表面；所述第一走线的第一端连接所述第二走线的第一端；所述第一走线的第二端连接第一引线端；所述第二走线的第二端与所述第二引线端连接。
其中，所述显示基板还具有位于所述周边区远离所述显示区一侧的第一绑定区；所述转接板包括第二绑定区和第三绑定区；所述柔性印刷电路板包括第四绑定区；
在所述第一绑定区设置第一连接焊盘和第二连接焊盘；在所述第二绑定区设置有第三连接焊盘和第四连接焊盘；在所述第三绑定区设置有第五连接焊盘和第六连接焊盘；在所述第四绑定区设置有第七连接焊盘和第八连接焊盘；
所述第一走线的第一端连接所述第一连接焊盘，所述第一连接焊盘与所述第三连接焊盘绑定连接；所述第三连接焊盘通过第一连接引线与所述第五连接焊盘连接；所述第二走线的第一端连接第七连接焊盘，第七连接焊盘与所述第五连接焊盘绑定连接；
所述第一走线的第二端连接所述第二连接焊盘，所述第二连接焊盘与所述第四连接焊盘绑定连接；所述第四连接焊盘通过第二连接引线与所述第六连接焊盘连接；第六连接焊盘与所述第八连接焊盘绑定连接，所述第八连接焊盘连接所述第一引线端。
其中，在所述第二走线背离所述第一表面的一侧设置有磁性材料层；所述磁性材料层覆盖所述所述第二走线。
其中，所述第二基底包括相对设置的第一表面和第二表面；所述第二走线包括位于所述第一表面上的第一子线段、第二子线段，以及位于所述第二表面上的第三子线段；所述近场通信天线还包括设置在所述柔性印刷电路板上的第一引线端和第二引线端；
所述第一走线的第一端连接所述第一子线段的第一端；所述第一走线的第二端通过贯穿所述第二基底的第一过孔与所述第三子线段的第一端连接； 所述第三子线段的第二端通过贯穿所述第二基底的第二过孔与所述第二子线段的第一端连接；所述第一子线段的第二端用作所述第一引线端；所述第二子线段的第二端用作所述第二引线端。
其中，所述显示基板还具有位于所述周边区远离所述显示区一侧的第一绑定区；所述转接板包括第二绑定区和第三绑定区；所述柔性印刷电路板包括第四绑定区；
在所述第一绑定区设置第一连接焊盘和第二连接焊盘；在所述第二绑定区设置有第三连接焊盘和第四连接焊盘；在所述第三绑定区设置有第五连接焊盘和第六连接焊盘；在所述第四绑定区设置有第七连接焊盘和第八连接焊盘；
所述第一走线的第一端连接所述第一连接焊盘，所述第一连接焊盘与所述第三连接焊盘绑定连接；所述第三连接焊盘通过第一连接引线与所述第五连接焊盘连接；所述第一子线段的第一端连接第七连接焊盘，第七连接焊盘与所述第五连接焊盘绑定连接；
所述第一走线的第二端连接所述第二连接焊盘，所述第二连接焊盘与所述第四连接焊盘绑定连接；所述第四连接焊盘通过第二连接引线与所述第六连接焊盘连接；第六连接焊盘与所述第八连接焊盘绑定连接，所述第八连接焊盘通过贯穿所述第二基底的第一过孔与所述第三子线段的第一端连接。
其中，所述第一子线段和所述第二子线段在所述第二基底上的正投影与所述第三子线段在所述第二基底上的正投影重叠。
其中，在所述第一子线段和所述第二子线段背离所述第一表面的一侧设置有磁性材料层；所述磁性材料层覆盖所述第一子线段和所述第二子线段；和/或，
在所述第三子线段背离所述第二表面的一侧设置有磁性材料层；所述磁性材料层覆盖所述第三子线段。
其中，所述第一引线端和所述第二引线端的延伸方向相同。
其中，所述近场通信天线包括多条所述第一走线和多条所述第二走线， 且一条所述第一走线连接一条所述第二走线，形成一个子线圈组，各所述子线圈并联连接，各所述子线圈的第一端连接所述第一引线端，第二端连接第二引线端。
其中，所述显示基板还包括位于所述第一基底上的金属层；所述金属层包括位于所述显示区的第一部分和位于所述周边区的第二部分；所述第二部分包括所述第一走线。
其中，所述金属层包括第一金属层和第二金属层；所述第一走线包括叠层设置、且电连接的第一子导电线和第二子导电线；
所述第一金属层包括所述第一子导电线和位于所述显示区的栅线；
所述第二金属层包括第二子导电线和位于所述显示区的数据线。
本公开实施例还提供一种显示设备，其包括上述的显示模组。
附图说明
图1为一种示例性的显示模组的示意图。
图2为一种像素电路图。
图3a为本公开实施例的一种显示模组的柔性线路板未翻折时的俯视图。
图3b为本公开实施例的一种显示模组的柔性线路板翻折后的俯视图。
图4为图1a的A-A＇的截面图。
图5为图1a的B-B＇的截面图。
图6a为本公开实施例的另一种显示模组的柔性线路板未翻折时的俯视图。
图6b为本公开实施例的另一种显示模组的柔性线路板翻折后的俯视图。
图7为图4a的C-C＇的截面图。
图8为本公开实施例的一种近场通信天线未翻折时的示意图。
图9为本公开实施例的一种近场通信天线翻折后的示意图。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
如图1所示，在一个示例中，显示模组包括显示面板、覆晶薄膜(COF；Chip On Film)转接板和柔性印刷电路板2(FPCB；Flexible Print Circuit Board)；其中，显示面板包括显示基板1和对盒基板。显示基板1通过覆晶薄膜转接板4与柔性印刷电路板2连接。显示基板1具有显示区Q1和周边区Q2。例如，显示基板1上设置有沿X方向延伸的多条栅线(Gate Line)和沿Y方向延伸的多个数据线(Data Line)。多个栅线电连接到周边区Q2中的驱动电路DC(Driving Circuit)。多个栅线和多个数据线交叉限定多个像素区，每个像素区中设置有像素P(Pixel)，每个像素P具有有机发光元件，例如有机发光二极管OLED(Organic Light-Emitting Diode)。由于有机发光二极管发射的光可以用于显示图像，多个像素区所在的区域被限定为显示区Q1。周边区Q2布置在显示区Q1的外部。例如，周边区Q2可以围绕显示区Q1的四周，并且周边区Q2不能够显示图像，为非显示区。
如图2所示，每个像素P包括连接到该像素P的栅线GL和数据线DL的像素电路PC(Pixel Circuit)以及连接到像素电路PC的有机发光二极管OLED。像素电路PC包括驱动薄膜晶体管(Thin-film Transistor,TFT)Td、开关晶体管Ts和存储电容器Cst。开关晶体管Ts连接到栅线GL和数据线DL，并且被配置为根据通过栅线GL接收的扫描信号将通过数据线DL接收的数据信号传输到驱动晶体管Td。存储电容器Cst连接到开关晶体管Ts和驱动电压线PL，并且被构造为存储与从开关晶体管Ts接收的电压和供应到驱动电压线PL的驱动电压ELVDD之间的差对应的电压。驱动晶体管Td连接到驱动电压线PL和存储电容器Cst，并且可以用于根据存储在存储电容器Cst中的电压值控制从驱动电压线PL流到有机发光二极管OLED的驱动电流。有机发光二极管OLED可以通过驱动电流来发射具有期望亮度的光。有机发光二极管OLED可以发射例如红光、绿光、蓝光或白光。尽管图2中示出了像素P包括两个TFT和一个存储电容器Cst的情况，但是本公开的示例性实施例可以采用晶体管和存储器的不同设置方式。在其他实施例中，像素P的像素电路PC可以包括三个或更多个晶体管或者两个或更多个存储电容器。
如图1所示，显示基板1还包括第一绑定区Q3，第一绑定区Q3位于周边区Q2远离显示区Q1的一侧。例如，如图1所示，第一绑定区Q3位于显示区Q1的其中一侧上，焊盘区WA包括多个连接焊盘(或称接触垫)，每个接触垫被配置为电连接从显示区Q1或外围区延伸出来的信号线。接触垫可以是暴露在第一绑定区Q3表面的，即不被任何层覆盖，这样便于电连接覆晶薄膜转接板4，以电连接到柔性印刷电路板2。柔性印刷电路板2与外部控制器电连接，被配置为传输来自外部控制器的信号或电力。例如，连接焊盘与数据连接线(数据连接线与显示区Q1中的数据线电连接)电连接。连接焊盘与各个信号线电连接，这样能实现信号线与柔性线路电路板之间相互通信。对于连接焊盘的个数和布置方式此处不做具体限制，可以根据实际需要设置。当对显示模组进行组装时，需要将覆晶薄膜转接板4和柔性印刷电路板2翻折至显示面板的背侧，(通常将柔性显示面板的显示侧默认为前 侧，与显示侧相反的一侧为后侧或背侧)，这样可以提高空间利用率，降低非显示区Q1所占用的面积。
NFC近场通讯技术已普遍应用于电子设备上进行数据交换，要利用NFC通讯技术，需要在设备上安装通讯天线用于收发电磁波信号，而通讯天线需要占据较大的空间。现有的运用NFC通讯技术的电子设备，大多是通过将独立的NFC通讯模块，外置于电子设备的主板上，因此，需要占据较大的空间，不利于设备的轻薄化设计。
鉴于此，在本公开实施例中提供一种显示模组，将线圈集成在显示模组的显示基板1和柔性印刷电路板2上，实现NFC近场通信天线和显示模组的一体化设计，有利于节约空间，实现显示模组的轻薄设计。
以下结合附图和具体实施例对本公开实施例的显示模组进行说明。
本公开实施例提供一种显示模组，其包括显示基板1、转接板、柔性印刷电路板2和近场通信天线。其中，在本公开实施例中，转接板包括但不限于覆晶薄膜转接板4，但由于覆晶薄膜转接板4的柔性特性，便于翻折，且可以降低对显示模组的划伤，本公开实施例中以转接板采用覆晶薄膜转接板4为例进行说明。显示基板1通过覆晶薄膜转接板4与柔性线路板连接。显示基板1具有显示区Q1和周边区Q2；近场通信天线的至少部分结构集成在显示基板1的周边区Q2和柔性印刷电路板2。
在本公开实施例中，将近场通信天线集成在显示基板1的周边区Q2和柔性印刷电路板2上，有利于节约空间，实现显示模组的轻薄设计，同时显示基板1的周边区Q2和柔性印刷电路板2均为非显示区，因此将近场通信天线集成显示模组中，也不会影响显示模组的显示效果。
为了更清楚本公开实施例的显示模组的具体结构，以下结合具体示例进行说明。
第一种示例，图3a为本公开实施例的一种显示模组的柔性线路板未翻折时的俯视图；图3b为本公开实施例的一种显示模组的柔性线路板翻折后的俯视图；图4为图1a的A-A＇的截面图；图5为图1a的B-B＇的截面图； 如图3a、3b、4和5所示，在该显示模组中，近场通信天线包括串接的第一走线31和第二走线32、以及第一引线端33和第二引线端34。显示基板1包括第一基底10；柔性印刷电路板2包括第二基底20，且第二基底20具有相对设置的第一表面和第二表面。在本公开实施例中以柔性印刷电路翻折至显示面板背侧时，第二表面相较第一表面更靠近第一基底10为例进行说明。第一走线31设置在第一基底10上，且绕显示基板1的周边区Q2设置；第二走线32设置在第二基底20的第一表面上；第一引线端33和第二引线端34均设置在第二基底20上。其中，第一走线31的第一端与第二走线32的第一端连接，第一走线31的第二端连接第一引线端33；第二走线32的第二端与第二引线端34连接。第一引线端33和第二引线端34可以与控制电路连接，以使近场通信天线与控制电路形成闭合回路，通过外设的磁感应线圈，可在近场通信天线和控制电路内形成感应电流回路，完成近场通信。
在一些示例中，第一引线端33和第二引线端34可以均设置在第二基底20的第一表面，在该种情况下，为便于第一引线端33和第二引线端34和控制电路连接，可以将第一引线端33和第二引线端34进行跳层，也即在第二走线32背离第一表面的一侧形成层间介质层。第一走线31的第二端通过贯穿层间介质层的第一连接过孔与第一引线端33电连接，第二走线32的第二端通过贯穿层间介质层的第二连接过孔与第二引线端34连接。当然，第一引线端33和第二引线端34也可以设置在第二基底20的第二表面，此时，第一走线31的第二端通过贯穿层第二基底20的第一连接过孔与第一引线端33电连接，第二走线32的第二端通过贯第二基底20的第二连接过孔与第二引线端34连接。以上两种情况，可以第一引线端33和第二引线端34延伸方向一致，从而便于第一引线端33和第二引线端34与控制电路连接。
如图3a所示，第一走线31呈开环结构，第二走线32呈螺旋状结构，当将柔性印刷电路板2翻折显示面板的背侧时，第一走线31和第二走线32组成近场通信天线的一匝线圈结构。需要说明的是，图3a中以第一走线31呈开环结构，实际上第一走线31也可以呈螺旋状结构环绕显示区Q1设置，此时，第一走线31的第一端和第二端中的至少一者需要通过跳层向柔性印 刷电路板2所在方向延伸，以避免出现短路的问题。例如：第一走线31的第一端位于第一走线31的中间位置，在第一走线31背离第一基底10的一侧形成层间介质层，第一走线31的第一端通过贯穿层间介质层的过孔向柔性印刷电路板2所在方向延伸。
在一些示例中，显示基板1还具有位于周边区Q2远离显示区Q1一侧的第一绑定区Q3；覆晶薄膜转接板4包括第二绑定区和第三绑定区；柔性印刷电路板2包括第四绑定区；在第一绑定区Q3设置第一连接焊盘41和第二连接焊盘42；在第二绑定区设置有第三连接焊盘51和第四连接焊盘52；在第三绑定区设置有第五连接焊盘61和第六连接焊盘62；在第四绑定区设置有第七连接焊盘71和第八连接焊盘72。其中，近场通信天线的第一走线31的第一端连接第一连接焊盘41，第一连接焊盘41与第三连接焊盘51可以通过ACF胶绑定连接；第二连接焊盘42通过第一连接引线401与第五连接焊盘61连接；第二走线32的第一端连接第七连接焊盘71，第七连接焊盘71与第五连接焊盘61可以通过ACF胶绑定连接；第一走线31的第二端连接第二连接焊盘42，第二连接焊盘42与第四连接焊盘52可以通过ACF胶绑定连接；第四连接焊盘52通过第二连接引线402与第六连接焊盘62连接；第六连接焊盘62与第八连接焊盘72可以通过ACF胶绑定连接，第八连接焊盘72连接第一引线端33。
在一些示例中，第一连接焊盘41和第三连接焊盘51绑定连接、第五连接焊盘61和第七连接焊盘71绑定连接、第二连接焊盘42和第四连接焊盘52绑定连接、第六连接焊盘62和第八连接焊盘72绑定连接之后，还可以利用UV胶进行固化，以保证第一连接焊盘41和第三连接焊盘51之间、第五连接焊盘61和第七连接焊盘71之间、第二连接焊盘42和第四连接焊盘52之间、第六连接焊盘62和第八连接焊盘72之间可以可靠的连接。
在一些示例中，柔性印刷电路板2上的第二走线32采用包括但不限于铜材料形成。之所以采用铜材料是因为，铜本身的导电性能较好，且阻抗较小。在一些示例中，第二走线32的厚度在15μm-35μm左右，线宽在100μm-5mm。
在一些示例中，为避免在柔性印刷电路板2翻折后第二走线32与显示模组的后壳之间的间距过小，而影响近场通信天线的性能，在第二走线32的背离第二表面的一侧设置有磁性材料层(图中未视)。在本公开实施例中，通过设置磁性材料层以增强近场通信天线的磁通量。在一些示例中，磁性材料层的材料包括但不限于铁氧体等磁性材料。
在一些示例中，显示基板1还包括设置在第一基底10上的金属层，该金属层包括位于显示区Q1的第一部分和位于周边区Q2的第二部分，且第二部分包括近场通信天线的第一走线31。也就是说，近场通信天线的第一走线31和显示基板1中显示区Q1中的结构可以在一次工艺中制备，因此也不会增加工艺步骤和成本。
进一步的，近场通信天线的第一走线31可以是单层结构，也可以是多层结构，在本公开实施例中第一走线31包括两层结构为例，也即第一走线31包括叠层设置的第一子导电线和第二子导电线。显示基板1中的金属层至少包括叠层设置的第一金属层和第二金属层。例如：如图4所示，第一金属层包括第一走线31的第一子导电线311和栅线GL，也就是说，第一走线31的第一子导电线311和栅线GL同层设置，且材料相同，且二者可以在一次工艺中制备，因此也不会增加工艺步骤和成本。第二金属层包括第一走线31的第二子导电线312和数据线DL，也就是说，第一走线31的第二子导电线312和数据线DL同层设置，且材料相同，且二者可以在一次工艺中制备，因此也不会增加工艺步骤和成本。需要说明的是，数据线DL和栅线GL的交叉位置设置有绝缘层13，避免二者短路。其中，第一金属层和第二金属层的材料均包括但不限于采用钼、钼铌合金、铝、铝钕合金、钛和铜中的至少一种材料形成。
在此需要说明的是，本公开实施例中所谓的同层设置并非宏观上的同层设置，而是指在同一构图工艺上形成的结构则称之为同层设置。
在一些示例中，无论第一走线31的单层结构还是多层结构，其厚度在2μm-5μm左右，线宽在3μm-10μm左右。对于第一走线31的具体厚度和线宽可根据近场通信天线的性能参数具体设置。
第二种示例，图6a为本公开实施例的另一种显示模组的柔性线路板未翻折时的俯视图；图6b为本公开实施例的另一种显示模组的柔性线路板翻折后的俯视图；图7为图6a的C-C＇的截面图；如图6a、6b和7所示，该显示模组的结构与第一种示例大致相同，区别在于该显示模组中的近场通信天线中的第二走线32与第一种示例中不同。第二基底20包括相对设置的第一表面和第二表面；第二走线32包括位于第一表面上的第一子线段321、第二子线段322，以及位于第二表面上的第三子线段323；近场通信天线还包括设置在柔性印刷电路板2上的第一引线端33和第二引线端34；第一走线31的第一端连接第一子线段321的第一端；第一走线31的第二端通过贯穿第二基底20的第一过孔与第三子线段323的第一端连接；第三子线段323的第二端通过贯穿第二基底20的第二过孔与第二子线段322的第一端连接；第一子线段321的第二端用作第一引线端33；第二子线段322的第二端用作第二引线端34。
在本公开实施例中，由于将近场通信天线集成在显示模组的显示基板1的周边区Q2和柔性印刷电路板2中，因此可以实现近场通信天线和显示模组的一体化设计，无需单独设置近场通信天线，从而可以有效的节约近场通信天线所占用的空间，有利用实现显示模组的轻薄化设计。而且，在本公开实施例中，将近场通信天线的部分走线集成在柔性印刷电路板2的第一表面和第二表面，通常柔性印刷电路板2为单层走线，也即驱动芯片和信号线均设置在柔性线路板的第二基底20的第一表面，在第二基底20的第二表面通常并无布线，也就是说在第二基底20的第二表面有足够的空间形成线圈结构，因此在本公开实施例中，将近场通信天线的部分走线(第三子线段323)设置在第二基底20的第二表面，可以有效的避免近场通信天线的走线与柔性印刷电路板2上的信号线、驱动芯片等产生干扰。
需要说明的是，在该种示例中，第一走线31的结构与上述的第一走线31结构相同，故对于第一走线31的结构和参数不再重复赘述。
在一些示例中，第二走线32的第一子线段321、第二子线段322和第三子线段323的线宽相同，厚度相同，且与图3a中的第二走线32的线宽和 厚度相同。在此不再重复赘述。
在一些示例中，近场通信天线的第一走线31、第一子线段321、第二子线段322和第三子线段323可以形成单圈线圈，也可以形成多圈线圈。在本公开实施例中，以当将柔性印刷电路板2翻折至显示面板背侧时，形成三圈线圈的近场通信天线为例。其中，第一走线31呈开环结构，与图3b相同，故在此不再重复描述。第三子线段323在第二基底20上的正投影围成一线圈结构，第一子线段321和第三子线段323在第二基底20上的正投影围成一线圈结构，当将柔性印刷电路板2至显示面板背侧时，第一走线31、第一子线段321、第二子线段322和第三子线段323形成三圈线圈。当然，通过第一走线31、第一子线段321、第二子线段322和第三子线段323进行绕线还可以形成更多圈线圈结构的近场通信天线，在此不一一列举。
在一些示例中，当柔性印刷电路板2翻折至显示面板的背侧时，近场通信天线的第一子线段321、第二子线段322和第三子线段323在第一基底10上的正投影位于第一走线31在第一基底10上的正投影所限定的范围内。例如：参照图6b，若第一走线31开环结构，第一子线段321、第二子线段322和第三子线段323在第一基底10上的正投影位于该开环结构的第一走线31在第一基底10上的正投影内。也就是说，第一走线31、第一子线段321、第二子线段322和第三子线段323串联所形成三圈线圈依次嵌套。
在一些示例中，当柔性印刷电路板2翻折至显示面板背侧时，近场通信天线的第一子线段321和第二子线段322在第二基底2020上的正投影位于第三子线段323在第二基底20上正投影上。在该种情况下，可以在有限的布线空间内，形成更多圈线圈结构，以增强近场通信天线的通信性能。
在一些示例中，本公开实施例中的近场通信天线中，在第一子线段321和第二子线段322背离第一表面的一侧设置有磁性材料层；和/或，在第三子线段323背离第二表面的一侧设置有磁性材料层。例如：显示模组不仅包括上述结构，而且还包括固定在柔性线路板背离阵列基板一侧的后壳。当柔性印刷电路板2翻折至显示面板背侧时，柔性印刷电路板2与显示面板之间的距离小于预设值时，此时则在第三子线段323背离第二表面的一侧设置有 磁性材料层；当柔性印刷电路板2与后壳之间的距离小于预设值时，此时则在第一子线段321和第二子线段322背离第一表面的一侧设置有磁性材料层。在本公开实施例中，通过设置磁性材料层以增强近场通信天线的磁通量。在一些示例中，磁性材料层的材料包括但不限于铁氧体等磁性材料。
在一些示例中，显示基板1还具有位于周边区Q2远离显示区Q1一侧的第一绑定区Q3；覆晶薄膜转接板4包括第二绑定区和第三绑定区；柔性印刷电路板2包括第四绑定区；在第一绑定区Q3设置第一连接焊盘41和第二连接焊盘42；在第二绑定区设置有第三连接焊盘51和第四连接焊盘52；在第三绑定区设置有第五连接焊盘61和第六连接焊盘62；在第四绑定区设置有第七连接焊盘71和第八连接焊盘72。第一走线31的第一端连接第一连接焊盘41，第一连接焊盘41与第三连接焊盘51可以通过ACF胶绑定连接；第三连接焊盘51通过第一连接引线401与第五连接焊盘61连接；第一子线段321的第一端连接第七连接焊盘71，第七连接焊盘71与第五连接焊盘61可以通过ACF胶绑定连接；第一走线31的第二端连接第二连接焊盘42，第二连接焊盘42与第四连接焊盘52绑定连接；第四连接焊盘52通过第二连接引线402与第六连接焊盘62连接；第六连接焊盘62与第八连接焊盘72可以通过ACF胶绑定连接，第八连接焊盘72通过贯穿第二基底20的第一过孔与第三子线段323的第一端连接。
在一些示例中，第一连接焊盘41和第三连接焊盘51绑定连接、第五连接焊盘61和第七连接焊盘71绑定连接、第二连接焊盘42和第四连接焊盘52绑定连接、第六连接焊盘62和第八连接焊盘72绑定连接之后，还可以利用UV胶进行固化，以保证第一连接焊盘41和第三连接焊盘51之间、第五连接焊盘61和第七连接焊盘71之间、第二连接焊盘42和第四连接焊盘52之间、第六连接焊盘62和第八连接焊盘72之间可以可靠的连接。
无论上述的第一种示例还是第二种示例均是以近场通信天线中的第一走线31和第二走线32均为一条为例进行说明的。在一些示例中，如图8和9所示，图9位为图8翻折后的进场天线示意图；近场通信天线中的第一走线31和第二走线32均可以为多条，且一条第一走线31和一条第二走线32 串接，形成一个子线圈组，各子线圈并联连接，各子线圈的第一端连接第一引线端33，各子线圈的第二端连接第二引线端34。通过该种方式可以降低近场通信天线的线圈总阻抗。例如：根据第一绑定区Q3、第二绑定区、第三绑定区、第四绑定区可以设置连接焊盘的数量来设置第一走线31和第二走线32的数量，在一个示例中，第一走线31和第二走线32的数量均为4条。
需要说明的，图8和9仅示意出第一走线31和第二走线32的一种连接示意图，在本公开实施例中并不对第一走线31和第二走线32的数量，以及所形成的子线圈的形状进行限定。
本公开实施例中提供一种电子设备，该电子设备可以包括上述的任意一种显示模组，该显示模组可以为有机电致发光二极管显示模组。
本公开实施例提供的电子设备可以为可穿戴设备，例如手表。当然还可以是手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本公开实施例中的电子设备中，将NFC近场通信天线集成在显示模组的显示基板1和柔性印刷电路板2上，实现近场通信天线和显示模组的一体化设计，有利于节约空间，实现显示模组的轻薄设计。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (16)

  1. 一种显示模组，其包括显示基板、柔性印刷电路板和近场通信天线；其中，
    所述显示基板具有显示区和周边区；所述近场通信天线的至少部分结构位于所述显示基板的周边区和所述柔性印刷电路板上。
  2. 根据权利要求1所述的显示模组，其中，所述显示基板包括第一基底；所述柔性印刷电路板包括第二基底；所述近场通信天线包括电连接的第一走线和第二走线；所述第一走线位于所述周边区，且设置在所述第一基底上；所述第二走线设置在所述第二基底上。
  3. 根据权利要求2所述的显示模组，其中，所述显示模组还包括转接板；且所述第一走线通过所述转接板与所述第二走线电连接。
  4. 根据权利要求3所述的显示模组，其中，所述转接板包括覆晶薄膜转接板。
  5. 根据权利要求3所述的显示模组，其中，所述近场通信天线还包括设置在所述柔性印刷电路板上的第一引线端和第二引线端；所述第二基底包括相对设置的第一表面和第二表面；所述第二走线设置在所述第一表面；所述第一走线的第一端连接所述第二走线的第一端；所述第一走线的第二端连接第一引线端；所述第二走线的第二端与所述第二引线端连接。
  6. 根据权利要求5所述的显示模组，其中，所述显示基板还具有位于所述周边区远离所述显示区一侧的第一绑定区；所述转接板包括第二绑定区和第三绑定区；所述柔性印刷电路板包括第四绑定区；
    在所述第一绑定区设置第一连接焊盘和第二连接焊盘；在所述第二绑定区设置有第三连接焊盘和第四连接焊盘；在所述第三绑定区设置有第五连接焊盘和第六连接焊盘；在所述第四绑定区设置有第七连接焊盘和第八连接焊盘；
    所述第一走线的第一端连接所述第一连接焊盘，所述第一连接焊盘与所述第三连接焊盘绑定连接；所述第三连接焊盘通过第一连接引线与所述第五 连接焊盘连接；所述第二走线的第一端连接第七连接焊盘，第七连接焊盘与所述第五连接焊盘绑定连接；
    所述第一走线的第二端连接所述第二连接焊盘，所述第二连接焊盘与所述第四连接焊盘绑定连接；所述第四连接焊盘通过第二连接引线与所述第六连接焊盘连接；第六连接焊盘与所述第八连接焊盘绑定连接，所述第八连接焊盘连接所述第一引线端。
  7. 根据权利要求5所述的显示模组，其中，在所述第二走线背离所述第一表面的一侧设置有磁性材料层；所述磁性材料层覆盖所述所述第二走线。
  8. 根据权利要求3所述的显示模组，其中，所述第二基底包括相对设置的第一表面和第二表面；所述第二走线包括位于所述第一表面上的第一子线段、第二子线段，以及位于所述第二表面上的第三子线段；所述近场通信天线还包括设置在所述柔性印刷电路板上的第一引线端和第二引线端；
    所述第一走线的第一端连接所述第一子线段的第一端；所述第一走线的第二端通过贯穿所述第二基底的第一过孔与所述第三子线段的第一端连接；所述第三子线段的第二端通过贯穿所述第二基底的第二过孔与所述第二子线段的第一端连接；所述第一子线段的第二端用作所述第一引线端；所述第二子线段的第二端用作所述第二引线端。
  9. 根据权利要求8所述的显示模组，其中，所述显示基板还具有位于所述周边区远离所述显示区一侧的第一绑定区；所述转接板包括第二绑定区和第三绑定区；所述柔性印刷电路板包括第四绑定区；
    在所述第一绑定区设置第一连接焊盘和第二连接焊盘；在所述第二绑定区设置有第三连接焊盘和第四连接焊盘；在所述第三绑定区设置有第五连接焊盘和第六连接焊盘；在所述第四绑定区设置有第七连接焊盘和第八连接焊盘；
    所述第一走线的第一端连接所述第一连接焊盘，所述第一连接焊盘与所述第三连接焊盘绑定连接；所述第三连接焊盘通过第一连接引线与所述第五 连接焊盘连接；所述第一子线段的第一端连接第七连接焊盘，第七连接焊盘与所述第五连接焊盘绑定连接；
    所述第一走线的第二端连接所述第二连接焊盘，所述第二连接焊盘与所述第四连接焊盘绑定连接；所述第四连接焊盘通过第二连接引线与所述第六连接焊盘连接；第六连接焊盘与所述第八连接焊盘绑定连接，所述第八连接焊盘通过贯穿所述第二基底的第一过孔与所述第三子线段的第一端连接。
  10. 根据权利要求8所述的显示基板，其中，所述第一子线段和所述第二子线段在所述第二基底上的正投影与所述第三子线段在所述第二基底上的正投影重叠。
  11. 根据权利要求8所述的显示基板，其中，在所述第一子线段和所述第二子线段背离所述第一表面的一侧设置有磁性材料层；所述磁性材料层覆盖所述第一子线段和所述第二子线段；和/或，
    在所述第三子线段背离所述第二表面的一侧设置有磁性材料层；所述磁性材料层覆盖所述第三子线段。
  12. 根据权利要求5-11中任一项所述的显示模组，其中，所述第一引线端和所述第二引线端的延伸方向相同。
  13. 根据权利要求2-11中任一项所述的显示模组，其中，所述近场通信天线包括多条所述第一走线和多条所述第二走线，且一条所述第一走线连接一条所述第二走线，形成一个子线圈组，各所述子线圈并联连接，各所述子线圈的第一端连接所述第一引线端，第二端连接第二引线端。
  14. 根据权利要求2-11中任一项所述的显示模组，其中，所述显示基板还包括位于所述第一基底上的金属层；所述金属层包括位于所述显示区的第一部分和位于所述周边区的第二部分；所述第二部分包括所述第一走线。
  15. 根据权利要求14所述的显示模组，其中，所述金属层包括第一金属层和第二金属层；所述第一走线包括叠层设置、且电连接的第一子导电线和第二子导电线；
    所述第一金属层包括所述第一子导电线和位于所述显示区的栅线；
    所述第二金属层包括第二子导电线和位于所述显示区的数据线。
  16. 一种显示设备，其包括权利要求1-15中任一项所述的显示模组。
PCT/CN2021/090080 2021-04-27 2021-04-27 显示模组及显示设备 WO2022226752A1 (zh)

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