WO2022219857A1 - 接合体及び接合体の製造方法 - Google Patents
接合体及び接合体の製造方法 Download PDFInfo
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- WO2022219857A1 WO2022219857A1 PCT/JP2022/000243 JP2022000243W WO2022219857A1 WO 2022219857 A1 WO2022219857 A1 WO 2022219857A1 JP 2022000243 W JP2022000243 W JP 2022000243W WO 2022219857 A1 WO2022219857 A1 WO 2022219857A1
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- Prior art keywords
- layer
- superconducting layer
- superconducting
- rebco
- substrate
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 230000004888 barrier function Effects 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims description 87
- 238000010438 heat treatment Methods 0.000 claims description 34
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052727 yttrium Inorganic materials 0.000 claims description 10
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 10
- 239000007791 liquid phase Substances 0.000 claims description 9
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 7
- 229910052691 Erbium Inorganic materials 0.000 claims description 7
- 229910052693 Europium Inorganic materials 0.000 claims description 7
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 7
- 229910052689 Holmium Inorganic materials 0.000 claims description 7
- 229910052765 Lutetium Inorganic materials 0.000 claims description 7
- 229910052779 Neodymium Inorganic materials 0.000 claims description 7
- 229910052772 Samarium Inorganic materials 0.000 claims description 7
- 229910052775 Thulium Inorganic materials 0.000 claims description 7
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 7
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 claims description 7
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 7
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims description 7
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 claims description 7
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052746 lanthanum Inorganic materials 0.000 claims description 7
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 7
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 claims description 7
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 7
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 claims description 7
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 7
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 6
- HBAGRTDVSXKKDO-UHFFFAOYSA-N dioxido(dioxo)manganese lanthanum(3+) Chemical compound [La+3].[La+3].[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O HBAGRTDVSXKKDO-UHFFFAOYSA-N 0.000 claims description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 6
- 239000010980 sapphire Substances 0.000 claims description 6
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 6
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 claims description 6
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 5
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical group [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 11
- 150000002894 organic compounds Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001354 calcination Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000002887 superconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005668 Josephson effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
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-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0912—Manufacture or treatment of Josephson-effect devices
- H10N60/0941—Manufacture or treatment of Josephson-effect devices comprising high-Tc ceramic materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/06—Joining of crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0661—Processes performed after copper oxide formation, e.g. patterning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/10—Junction-based devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/10—Junction-based devices
- H10N60/12—Josephson-effect devices
- H10N60/124—Josephson-effect devices comprising high-Tc ceramic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0436—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD]
- H10N60/0464—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD] by metalloorganic chemical vapour deposition [MOCVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/85—Superconducting active materials
- H10N60/855—Ceramic superconductors
- H10N60/857—Ceramic superconductors comprising copper oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Definitions
- the present disclosure relates to a joined body and a method for manufacturing the joined body.
- This application claims priority from Japanese Patent Application No. 2021-067673 filed on April 13, 2021. All the contents described in the Japanese patent application are incorporated herein by reference.
- Patent Document 1 Japanese Patent Application Laid-Open No. 10-652266 describes a joined body.
- the joined body described in Patent Document 1 has a first superconducting layer, a non-superconducting layer, and a second superconducting layer.
- a non-superconducting layer is disposed on the first superconducting layer.
- a second superconducting layer is disposed on the non-superconducting layer.
- the first superconducting layer and the second superconducting layer are made of YBa2Cu3Ox .
- the non - superconducting layer is made of PrBa2Cu3Ox .
- a joined body of the present disclosure includes a first superconducting layer, a barrier layer arranged on the first superconducting layer, and a second superconducting layer arranged on the barrier layer.
- the first superconducting layer, the barrier layer and the second superconducting layer are made of REBCO. Leakage current from one of the first superconducting layer and the second superconducting layer to the other of the first superconducting layer and the second superconducting layer is blocked by the barrier layer.
- a method for manufacturing a joined body includes the steps of forming a first superconducting layer on a first substrate, forming a second superconducting layer on a second substrate, forming the first superconducting layer and the second forming a microcrystalline layer on any one of the superconducting layers; holding the first substrate and the second substrate such that the microcrystalline layer is sandwiched between the first superconducting layer and the second superconducting layer; and heating the first substrate and the second substrate.
- the first superconducting layer and the second superconducting layer are made of REBCO.
- the microcrystalline layer is formed of polycrystalline REBCO.
- FIG. 1 is a cross-sectional view of a joined body 100.
- FIG. 2A to 2D are process diagrams showing a manufacturing method of the joined body 100.
- FIG. FIG. 3 is a cross-sectional view of the second substrate 30 after the microcrystalline layer forming step S3 is performed.
- FIG. 4 is a cross-sectional view of the joined body 200.
- FIG. 5 is a cross-sectional view of a bonded body 100 according to a modification.
- FIG. 6 is a cross-sectional view of the joined body 300. As shown in FIG.
- the yttrium diffused in the non-superconducting layer makes the non-superconducting layer at least partially a superconductor, and a path through which a superconducting current flows in the non-superconducting layer. is formed, leakage current flows between the first superconducting layer and the second superconducting layer. That is, in the joined body described in Patent Document 1, a leak current flows between the first superconducting layer and the second superconducting layer due to the formation of pinholes in the non-superconducting layer. If leakage current flows between the first superconducting layer and the second superconducting layer, the Josephson effect will not occur.
- the present disclosure has been made in view of the problems of the prior art as described above. More specifically, the present disclosure provides a bonded body and a manufacturing method of the bonded body capable of blocking leakage current between the first superconducting layer and the second superconducting layer. [Effect of the present disclosure] According to the bonded body and the manufacturing method of the bonded body of the present disclosure, it is possible to block leakage current between the first superconducting layer and the second superconducting layer.
- a joined body includes a first superconducting layer, a barrier layer arranged on the first superconducting layer, and a second superconducting layer arranged on the barrier layer.
- the first superconducting layer, the barrier layer and the second superconducting layer are made of REBCO. Leakage current from one of the first superconducting layer and the second superconducting layer to the other of the first superconducting layer and the second superconducting layer is blocked by the barrier layer.
- the rare earth element in REBCO constituting the first superconducting layer and the second superconducting layer causes the first superconducting layer and the second superconducting layer to have superconducting properties.
- the rare earth elements in the REBCO that make up the barrier layer may be selected such that the barrier layer does not exhibit superconducting properties.
- leakage current is cut off between the first superconducting layer and the second superconducting layer by changing the rare earth element component in REBCO constituting the barrier layer. It is possible.
- the rare earth elements in REBCO constituting the first superconducting layer and the second superconducting layer are yttrium, lanthanum, neodymium, samarium, europium, gadolinium, dysprosium, and holmium. , erbium, thulium, lutetium and ytterbium.
- the rare earth element in REBCO that constitutes the barrier layer may be praseodymium.
- leakage current is cut off between the first superconducting layer and the second superconducting layer by changing the rare earth element component in REBCO constituting the barrier layer. It is possible.
- the barrier layer may be epitaxially grown from the first superconducting layer and the second superconducting layer.
- leakage current is cut off between the first superconducting layer and the second superconducting layer by changing the rare earth element component in REBCO constituting the barrier layer. It is possible.
- the barrier layer may have a first layer arranged on the first superconducting layer and a second layer arranged on the first layer.
- the c-axis direction of REBCO forming the first layer may be along the c-axis direction of REBCO forming the second layer.
- the a-axis direction of REBCO forming the first layer may be different from the a-axis direction of REBCO forming the second layer.
- the joined body of (5) above by making the a-axis direction of REBCO constituting the first layer and the a-axis direction of REBCO constituting the second layer different, the first superconducting layer and the second superconducting layer It is possible to block leakage current between the two superconducting layers.
- the first layer may be epitaxially grown from the first superconducting layer
- the second layer may be epitaxially grown from the second superconducting layer.
- the c-axis direction of REBCO forming the first superconducting layer may be along the c-axis direction of REBCO forming the second superconducting layer.
- the a-axis direction of REBCO forming the first superconducting layer may be different from the a-axis direction of REBCO forming the second superconducting layer.
- the a-axis direction of REBCO constituting the first superconducting layer and the a-axis direction of REBCO constituting the second superconducting layer are made different to form the first layer. Since the a-axis direction of the REBCO constituting the second layer can be made different from the a-axis direction of the REBCO constituting the second layer, leakage current is cut off between the first superconducting layer and the second superconducting layer. It is possible to
- the REBCO constituting the first superconducting layer, the second superconducting layer, and the barrier layer contains yttrium, lanthanum, neodymium, and samarium. , europium, gadolinium, dysprosium, holmium, erbium, thulium, lutetium and ytterbium.
- the rare earth element in REBCO constituting the first superconducting layer and the second superconducting layer and the rare earth element in REBCO constituting the barrier layer are not different. , it is possible to block the leakage current between the first superconducting layer and the second superconducting layer.
- the bonded bodies of (1) to (7) above may further include a substrate.
- a first superconducting layer may be disposed on the substrate.
- the substrate may be made of at least one oxide selected from cerium oxide, yttria-stabilized zirconia, lanthanum manganate, sapphire, and strontium titanate.
- the bonded body of (8) above by increasing the oxygen permeability of the substrate, it becomes easier to supply oxygen to the first superconducting layer through the substrate.
- the joined bodies of (1) to (7) above may further include a metal substrate and an intermediate layer disposed on the metal substrate.
- a first superconducting layer may be disposed on the intermediate layer.
- the intermediate layer may be made of at least one oxide selected from cerium oxide, yttria-stabilized zirconia, lanthanum manganate, sapphire, and strontium titanate.
- the bonded bodies of (1) to (7) above may further include a substrate.
- a first superconducting layer may be disposed on the substrate.
- the c-axis direction of REBCO forming the first superconducting layer may be along either the direction of the main surface of the substrate on the side of the first superconducting layer or the normal direction of the main surface.
- both an a-axis oriented film and a c-axis oriented film can be used as the substrate on which the first superconducting layer is formed.
- a method for manufacturing a joined body includes the steps of forming a first superconducting layer on a first substrate, forming a second superconducting layer on a second substrate, forming a microcrystalline layer on either the conductive layer or the second superconducting layer; and heating the first substrate and the second substrate while holding the substrates.
- the first superconducting layer and the second superconducting layer are made of REBCO.
- the microcrystalline layer is formed of polycrystalline REBCO.
- At least part of the microcrystalline layer may be in a liquid phase in the step of heating the first substrate and the second substrate.
- FIG. 1 A joined body according to the first embodiment will be described.
- the joined body according to the first embodiment is referred to as a joined body 100.
- FIG. 1 A joined body according to the first embodiment will be described.
- the joined body according to the first embodiment is referred to as a joined body 100.
- FIG. 1 A joined body according to the first embodiment will be described.
- the joined body according to the first embodiment is referred to as a joined body 100.
- FIG. 1 is a cross-sectional view of the joined body 100.
- the joined body 100 has a first substrate 10, a first superconducting layer 20, a second substrate 30, a second superconducting layer 40, and a barrier layer 50.
- the bonded body 100 may not have the second substrate 30 .
- the first substrate 10 has a first major surface 10a.
- the first substrate 10 is preferably made of, for example, at least one oxide selected from the group consisting of cerium oxide, yttria-stabilized zirconia, lanthanum manganate, sapphire, and strontium titanate. That is, it is preferable that the first substrate 10 be made of a material that is permeable to oxygen.
- the first superconducting layer 20 is arranged on the first major surface 10a.
- the first superconducting layer 20 is made of REBCO.
- REBCO is an oxide superconductor denoted by REBa2Cu3Ox .
- RE is a rare earth element.
- the rare earth element in REBCO constituting the first superconducting layer 20 is at least one selected from the group consisting of yttrium, lanthanum, neodymium, samarium, europium, gadolinium, dysprosium, holmium, erbium, thulium, lutetium and ytterbium. It is an element that is more than a species. That is, the rare earth element in REBCO forming first superconducting layer 20 is selected so that first superconducting layer 20 exhibits superconducting properties.
- the direction of the c-axis of REBCO forming the first superconducting layer 20 is, for example, along the normal direction of the first main surface 10a.
- the direction of the c-axis of REBCO may be referred to as the c-axis direction.
- the c-axis direction of REBCO forming the first superconducting layer 20 may be along the direction of the first main surface 10a.
- the second substrate 30 has a second main surface 30a.
- the second main surface 30a faces the first main surface 10a side.
- the second substrate 30 is preferably made of, for example, at least one oxide selected from the group consisting of cerium oxide, yttria-stabilized zirconia, lanthanum manganate, sapphire, and strontium titanate. That is, it is preferable that the second substrate 30 be made of a material that is permeable to oxygen.
- the second superconducting layer 40 is arranged on the second main surface 30a.
- the second superconducting layer 40 is made of REBCO.
- the rare earth element in REBCO constituting the second superconducting layer 40 is at least one selected from the group consisting of yttrium, lanthanum, neodymium, samarium, europium, gadolinium, dysprosium, holmium, erbium, thulium, lutetium and ytterbium. It is an element that is more than a species. That is, the rare earth element in REBCO forming the second superconducting layer 40 is selected so that the second superconducting layer 40 exhibits superconducting properties.
- the c-axis direction of REBCO forming the second superconducting layer 40 is, for example, along the normal direction of the second main surface 30a.
- the c-axis direction of REBCO forming the second superconducting layer 40 may be along the direction of the second main surface 30a.
- the c-axis direction of REBCO forming the second superconducting layer 40 is along the c-axis direction of REBCO forming the first superconducting layer 20 .
- the a-axis direction of REBCO forming the second superconducting layer 40 is along the a-axis direction of REBCO forming the first superconducting layer 20 .
- the direction of the a-axis of REBCO may be referred to as the a-axis direction.
- the barrier layer 50 is sandwiched between the first superconducting layer 20 and the second superconducting layer 40 . Another way of looking at this is that the barrier layer 50 is on the first superconducting layer 20 and the second superconducting layer 40 is on the barrier layer 50 .
- the barrier layer 50 is made of REBCO.
- the rare earth element in REBCO forming the barrier layer 50 is, for example, praseodymium. That is, the rare earth elements in REBCO forming the barrier layer 50 are selected so that the barrier layer 50 does not exhibit superconducting properties.
- the content of rare earth elements other than praseodymium in REBCO constituting the barrier layer 50 is, for example, 1 atomic percent or less.
- the density of pinholes in the barrier layer 50 is, for example, 5% or less.
- the first superconducting layer 20, the second superconducting layer 40 and the barrier layer 50 form a Josephson junction. Another way of looking at this is that the conjugate 100 is a Josephson conjugate.
- the a-axis direction of REBCO forming the barrier layer 50 is along the a-axis direction of REBCO forming the first superconducting layer 20 .
- the c-axis direction of REBCO forming the barrier layer 50 is along the c-axis direction of REBCO forming the first superconducting layer 20 .
- the a-axis direction of REBCO forming the barrier layer 50 is along the a-axis direction of REBCO forming the second superconducting layer 40 .
- the c-axis direction of REBCO forming the barrier layer 50 is along the c-axis direction of REBCO forming the second superconducting layer 40 . That is, the barrier layer 50 is epitaxially grown from the first superconducting layer 20 and the second superconducting layer 40 .
- the thickness of the barrier layer 50 is smaller than the thickness of the first superconducting layer 20 and the thickness of the second superconducting layer 40 .
- the barrier layer 50 is, for example, 100 nm or less.
- FIG. 2 is a process drawing showing a manufacturing method of the joined body 100.
- the method for manufacturing the joined body 100 includes a first substrate preparation step S1, a second substrate preparation step S2, a microcrystalline layer formation step S3, and a heat treatment step S4.
- the first substrate 10 is prepared.
- the first superconducting layer 20 is formed on the first main surface 10a.
- the first superconducting layer 20 is formed by, for example, a MOD (Metal Organic Deposition) method.
- the rare earth elements in REBCO forming the first superconducting layer 20 are selected so that the first superconducting layer 20 exhibits superconducting properties, as described above.
- the temperature at which the first superconducting layer 20 is formed is, for example, 750° C. or higher and 840° C. or lower.
- the c-axis direction of REBCO forming the first superconducting layer 20 is, for example, along the direction of the first main surface 10a or the normal direction of the first main surface 10a.
- the second substrate 30 is prepared.
- the second superconducting layer 40 is formed on the second major surface 30a.
- the second superconducting layer 40 is formed by, for example, the MOD method.
- the rare earth elements in REBCO forming the second superconducting layer 40 are selected so that the second superconducting layer 40 exhibits superconducting properties, as described above.
- the temperature at which the second superconducting layer 40 is formed is, for example, 750° C. or higher and 840° C. or lower.
- the c-axis direction of REBCO forming the second superconducting layer 40 is, for example, along the direction of the second principal surface 30a or the normal direction of the second principal surface 30a.
- the first substrate 10 and the second substrate 30 are arranged such that the c-axis direction and the a-axis direction of the first superconducting layer 20 correspond to the c-axis direction and the a-axis direction of the second superconducting layer 40, respectively. It is held along the axial direction.
- FIG. 3 is a cross-sectional view of the second substrate 30 after the microcrystalline layer forming step S3 has been performed.
- a microcrystalline layer 60 is formed in the microcrystalline layer forming step S3.
- a microcrystalline layer 60 is formed on the second superconducting layer 40 .
- the microcrystalline layer 60 is formed of REBCO polycrystalline. Note that the microcrystalline layer 60 may be formed on the first superconducting layer 20 . That is, the microcrystalline layer 60 may be formed on either the first superconducting layer 20 or the second superconducting layer 40 .
- an organic compound film is formed on the second superconducting layer 40 by, for example, spin coating.
- This organic compound film contains constituent elements of REBCO.
- calcination is performed on the organic compound film.
- the organic compound film becomes a precursor of REBCO.
- the organic compound film that has undergone calcination is referred to as a calcined film.
- heat treatment is performed on the calcined film after the calcination. As a result, carbide contained in the calcined film is decomposed to form a microcrystalline layer 60 containing microcrystals of REBCO.
- a barrier layer 50 is formed in the heat treatment step S4.
- the first substrate 10 and the second substrate 30 are held while the microcrystalline layer 60 is sandwiched between the first superconducting layer 20 and the second superconducting layer 40. 2.
- Heat the substrate 30 Thereby, REBCO contained in the microcrystalline layer 60 is epitaxially grown from the first superconducting layer 20 and the second superconducting layer 40 to form the barrier layer 50 .
- Heating in the heat treatment step S4 is performed in an atmosphere containing oxygen.
- At least part of the microcrystalline layer 60 may be in the liquid phase while the heat treatment step S4 is being performed.
- the melting point of REBCO forming the microcrystalline layer 60 is lowered by lowering the oxygen concentration in the atmosphere in which the heating is performed. Therefore, by adjusting the oxygen concentration in the atmosphere in which the heating is being performed, at least part of the microcrystalline layer 60 can be brought into the liquid phase while the heat treatment step S4 is being performed.
- the heating temperature in the heat treatment step S4 is, for example, 800°C.
- the oxygen concentration in the atmosphere in which the heating is performed in the heat treatment step S4 is, for example, 60 ppm when at least part of the microcrystalline layer 60 is in the liquid phase.
- the oxygen concentration in the atmosphere in which the heating is performed in the heat treatment step S4 is, for example, 150 ppm when the microcrystalline layer 60 is not in the liquid phase.
- the heating time in the heat treatment step S4 is, for example, 1 minute when at least part of the microcrystalline layer 60 is in the liquid phase.
- the heating time in the heat treatment step S4 is, for example, 10 minutes when the microcrystalline layer 60 is not in the liquid phase.
- the second substrate 30 may be removed after the heat treatment step S4 is performed. As described above, the joined body 100 having the structure shown in FIG. 1 is manufactured.
- a joined body according to a comparative example is referred to as a joined body 200.
- FIG. 1 a joined body according to a comparative example is referred to as a joined body 200.
- FIG. 4 is a cross-sectional view of the joined body 200.
- the joined body 200 has a first substrate 10, a first superconducting layer 20, a second superconducting layer 40, and a barrier layer 50, like the joined body 100. .
- the barrier layer 50 is epitaxially grown on the first substrate 10 , and second, the second superconducting layer 40 is formed on the barrier layer 50 .
- the thickness of the second superconducting layer 40 is greater than the thickness of the barrier layer 50, in the manufacturing process of the joined body 200, it takes a long time to heat for forming the second superconducting layer 40.
- the rare earth element in conductive layer 20 and the rare earth element in second superconducting layer 40 diffuse into barrier layer 50 .
- REBCO forming the barrier layer 50 is partially superconducting, and a leak current flows between the first superconducting layer 20 and the second superconducting layer 40 . That is, in the joined body 200 , a leak current flows between the first superconducting layer 20 and the second superconducting layer 40 due to the formation of pinholes in the barrier layer 50 .
- the barrier layer 50 can block leakage current between the first superconducting layer 20 and the second superconducting layer 40 .
- the time required to form the barrier layer 50 is further shortened. Therefore, in this case, the rare earth element in the first superconducting layer 20 and the rare earth element in the second superconducting layer 40 diffuse into the barrier layer 50, and the REBCO constituting the barrier layer 50 becomes superconducting. Being embodied is further reliably prevented.
- FIG. 5 is a cross-sectional view of a bonded body 100 according to a modification.
- the bonded body 100 may further include a first metal substrate 70a and a second metal substrate 70b.
- the first metal substrate 70a and the second metal substrate 70b are, for example, a clad material in which stainless steel, copper and nickel are laminated.
- the first substrate 10 and the second substrate 30 function as the first intermediate layer 80a and the second intermediate layer 80b.
- the first intermediate layer 80a and the second intermediate layer 80b are arranged on the first metal substrate 70a and the second metal substrate 70b, respectively.
- the joined body 100 may not have the second metal substrate 70b and the second intermediate layer 80b.
- a joined body according to the second embodiment will be described. Here, points different from the joined body 100 will be mainly described, and redundant description will not be repeated.
- the joined body according to the second embodiment is referred to as a joined body 300 below.
- FIG. 6 is a cross-sectional view of the joined body 300.
- the joint 300 has a first substrate 10, a first superconducting layer 20, a second substrate 30, a second superconducting layer 40, and a barrier layer 50.
- the configuration of the joined body 300 is common to the configuration of the joined body 100 .
- the structure of the joint 300 differs from the structure of the joint 100 with respect to the details of the first superconducting layer 20, the second superconducting layer 40 and the barrier layer 50.
- the c-axis direction of REBCO forming the second superconducting layer 40 is along the c-axis direction of REBCO forming the first superconducting layer 20.
- the a-axis direction of REBCO forming the second superconducting layer 40 is different from the a-axis direction of REBCO forming the first superconducting layer 20 .
- the barrier layer 50 has a first layer 51 and a second layer 52 .
- the first layer 51 is epitaxially grown from the first superconducting layer 20 .
- a second layer 52 is epitaxially grown from the second superconducting layer 40 .
- the first The a-axis direction of REBCO forming the layer 51 is different from the a-axis direction of REBCO forming the second layer 52 . That is, in the joined body 300 , lattice matching is not achieved at the interface between the first layer 51 and the second layer 52 .
- the rare earth element in the REBCO forming the barrier layer 50 may be selected so that the barrier layer 50 exhibits superconducting properties. That is, in the joined body 300, the rare earth elements in REBCO constituting the first superconducting layer 20, the second superconducting layer 40, and the barrier layer 50 are yttrium, lanthanum, neodymium, samarium, europium, gadolinium, dysprosium, It may be at least one element selected from the group consisting of holmium, erbium, thulium, lutetium and ytterbium. In the joint body 300, the rare earth element in REBCO forming the barrier layer 50 may be praseodymium.
- the manufacturing method of the joined body 300 includes a first substrate preparation step S1, a second substrate preparation step S2, a microcrystalline layer formation step S3, and a heat treatment step S4.
- the manufacturing method of the joined body 300 is common to the manufacturing method of the joined body 100 .
- the second superconducting layer 40 is formed so that the a-axis direction of the second superconducting layer 40 is different from the a-axis direction of the first superconducting layer 20. It is formed.
- the first layer 51 is epitaxially grown from the first superconducting layer 20 and the second layer 52 is epitaxially grown from the second superconducting layer 40, whereby the barrier layer 50 and the Become. Regarding these points, the manufacturing method of the joined body 300 is different from the manufacturing method of the joined body 100 .
- the a-axis direction of REBCO forming the first layer 51 is different from the a-axis direction of REBCO forming the second layer 52 .
- a supercurrent cannot pass between the first layer 51 and the second layer 52 .
- supercurrent flowing through second superconducting layer 40 cannot pass between first layer 51 and second layer 52 . Therefore, the barrier layer 50 can also block leakage current between the first superconducting layer 20 and the second superconducting layer 40 in the joint 300 .
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Abstract
Description
特許文献1に記載の接合体の製造工程では、第1超伝導層上に、非超伝導層がエピタキシャル成長される。特許文献1に記載の接合体の製造方法では、その後に、非超伝導層上に第2超伝導層がエピタキシャル成長される。そのため、第2超伝導層をエピタキシャル成長させる際に、第1超伝導層中のイットリウム及び第2超伝導層中のイットリウムが非超伝導層中へと拡散する。
[本開示の効果]
本開示の接合体及び接合体の製造方法によると、第1超伝導層と第2超伝導層との間でリーク電流を遮断することが可能である。
まず、本開示の実施形態を列記して説明する。
次に、本開示の実施形態の詳細を、図面を参照しながら説明する。以下の図面では、同一又は相当する部分に同一の参照符号を付し、重複する説明は繰り返さないものとする。
第1実施形態に係る接合体を説明する。以下においては、第1実施形態に係る接合体を、接合体100とする。
以下に、接合体100の構成を説明する。
以下に、接合体100の製造方法を説明する。
以下に、接合体100の効果を比較例に係る接合体と対比しながら説明する。以下においては、比較例に係る接合体を、接合体200とする。
図5は、変形例に係る接合体100の断面図である。図5に示されるように、接合体100は、第1金属基板70aと、第2金属基板70bとをさらに有していてもよい。第1金属基板70a及び第2金属基板70bは、例えば、ステンレス鋼、銅及びニッケルを積層したクラッド材である。この例では、第1基板10及び第2基板30が、第1中間層80a及び第2中間層80bとして機能する。第1中間層80a及び第2中間層80bは、それぞれ、第1金属基板70a上及び第2金属基板70b上に配置されている。なお、接合体100は、第2金属基板70b及び第2中間層80bを有していなくてもよい。
第2実施形態に係る接合体を説明する。ここでは、接合体100と異なる点を主に説明し、重複する説明は繰り返さない。以下においては、第2実施形態に係る接合体を、接合体300とする。
以下に、接合体300の構成を説明する。
以下に、接合体300の製造方法を説明する。
接合体300では、第1層51を構成しているREBCOのa軸方向と第2層52を構成しているREBCOのa軸方向とが異なっているため、第1超伝導層20を流れている超伝導電流は、第1層51と第2層52との間を通過することができない。同様に、第2超伝導層40を流れている超伝導電流も、第1層51と第2層52との間を通過することができない。そのため、接合体300によっても、バリア層50により、第1超伝導層20と第2超伝導層40との間でリーク電流を遮断することが可能である。
Claims (12)
- 第1超伝導層と、
前記第1超伝導層上に配置されているバリア層と、
前記バリア層上に配置されている第2超伝導層とを備え、
前記第1超伝導層、前記バリア層及び前記第2超伝導層は、REBCOにより形成されており、
前記第1超伝導層及び前記第2超伝導層の一方から前記第1超伝導層及び前記第2超伝導層の他方へのリーク電流は、前記バリア層により遮断されている、接合体。 - 前記第1超伝導層及び前記第2超伝導層を構成しているREBCO中の希土類元素は、前記第1超伝導層及び前記第2超伝導層が超伝導特性を示すように選択されており、
前記バリア層を構成しているREBCO中の希土類元素は、前記バリア層が超伝導特性を示さないように選択されている、請求項1に記載の接合体。 - 前記第1超伝導層及び前記第2超伝導層を構成しているREBCO中の希土類元素は、イットリウム、ランタン、ネオジム、サマリウム、ユウロピウム、ガドリウム、ジスプロシウム、ホルミウム、エルビウム、ツリウム、ルテチウム及びイッテルビウムからなる群から選択された少なくとも1種以上の元素であり、
前記バリア層を構成しているREBCO中の希土類元素は、プラセオジムである、請求項2に記載の接合体。 - 前記バリア層は、前記第1超伝導層及び前記第2超伝導層からエピタキシャル成長している、請求項2又は請求項3に記載の接合体。
- 前記バリア層は、前記第1超伝導層に配置されている第1層と、前記第1層上に配置されている第2層とを有し、
前記第1層を構成しているREBCOのc軸方向は、前記第2層を構成しているREBCOのc軸方向に沿っており、
前記第1層を構成しているREBCOのa軸方向は、前記第2層を構成しているREBCOのa軸方向と異なる、請求項1に記載の接合体。 - 前記第1層は、前記第1超伝導層からエピタキシャル成長しており、
前記第2層は、前記第2超伝導層からエピタキシャル成長しており、
前記第1超伝導層を構成しているREBCOのc軸方向は、前記第2超伝導層を構成しているREBCOのc軸方向に沿っており、
前記第1超伝導層を構成しているREBCOのa軸方向は、前記第2超伝導層を構成しているREBCOのa軸方向と異なる、請求項5に記載の接合体。 - 前記第1超伝導層、前記第2超伝導層及び前記バリア層を構成しているREBCO中の希土類元素は、イットリウム、ランタン、ネオジム、サマリウム、ユウロピウム、ガドリウム、ジスプロシウム、ホルミウム、エルビウム、ツリウム、ルテチウム及びイッテルビウムからなる群から選択された少なくとも1種以上の元素である、請求項5又は請求項6に記載の接合体。
- 基板をさらに備え、
前記第1超伝導層は、前記基板上に配置されており、
前記基板は、酸化セリウム、イットリア安定化ジルコニア、マンガン酸ランタン、サファイア又はチタン酸ストロンチウムからなる群から選択された少なくとも1種以上の酸化物により形成されている、請求項1から請求項7のいずれか1項に記載の接合体。 - 金属基板と、
前記金属基板上に配置されている中間層とをさらに備え、
前記第1超伝導層は、前記中間層上に配置されており、
前記中間層は、酸化セリウム、イットリア安定化ジルコニア、マンガン酸ランタン、サファイア又はチタン酸ストロンチウムからなる群から選択された少なくとも1種以上の酸化物により形成されている、請求項1から請求項7のいずれか1項に記載の接合体。 - 基板をさらに備え、
前記第1超伝導層は、前記基板上に配置されており、
前記第1超伝導層を構成しているREBCOのc軸方向は、前記基板の前記第1超伝導層側の主面の方向又は前記主面の法線方向に沿っている、請求項1から請求項7のいずれか1項に記載の接合体。 - 第1基板上に第1超伝導層を形成する工程と、
第2基板上に第2超伝導層を形成する工程と、
前記第1超伝導層及び前記第2超伝導層のいずれかの上に微結晶層を形成する工程と、
前記微結晶層が前記第1超伝導層と前記第2超伝導層とに挟み込まれるように前記第1基板及び前記第2基板を保持した状態で、前記第1基板及び前記第2基板を加熱する工程とを備え、
前記第1超伝導層及び前記第2超伝導層は、REBCOにより形成され、
前記微結晶層は、REBCOの多結晶体により形成されている、接合体の製造方法。 - 前記第1基板及び前記第2基板を加熱する工程において、前記微結晶層の少なくとも一部は、液相になっている、請求項11に記載の接合体の製造方法。
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