WO2022217638A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2022217638A1
WO2022217638A1 PCT/CN2021/089302 CN2021089302W WO2022217638A1 WO 2022217638 A1 WO2022217638 A1 WO 2022217638A1 CN 2021089302 W CN2021089302 W CN 2021089302W WO 2022217638 A1 WO2022217638 A1 WO 2022217638A1
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WIPO (PCT)
Prior art keywords
layer
encapsulation layer
crack
light
emitting layer
Prior art date
Application number
PCT/CN2021/089302
Other languages
English (en)
French (fr)
Inventor
王俊媛
Original Assignee
武汉华星光电技术有限公司
武汉华星光电半导体显示技术有限公司
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Filing date
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Application filed by 武汉华星光电技术有限公司, 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US17/297,361 priority Critical patent/US12004407B2/en
Publication of WO2022217638A1 publication Critical patent/WO2022217638A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel, a manufacturing method thereof, and a display device.
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • OLED Organic Light-Emitting Diode
  • O-cut O-type opening
  • the encapsulation layer is continuous in the O-cut area, keeping the encapsulation of the display device intact, but in the existing O-cut type display device, as shown in Figure 1, due to the chamfer formed between the substrate and the array layer, As a result, the angle between the encapsulation layer and the horizontal direction is about 180 degrees, and the encapsulation layer is set too steeply, which causes the encapsulation layer to be prone to breakage at the chamfered corners, resulting in package failure.
  • the existing O-cut display device has the technical problem that the packaging layer at the chamfer is prone to breakage, which leads to the failure of the packaging of the display device.
  • Embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device, which are used to alleviate the technical problem that the packaging layer at the chamfered corner of the existing O-cut display device is prone to breakage.
  • An embodiment of the present application provides a display panel, the display panel includes:
  • a display area and an electronic component setting area, the display panel includes:
  • a substrate comprising grooves located in the display area and the electronic component setting area, the grooves including chamfers located in the display area;
  • a driving circuit layer arranged on one side of the substrate, and the driving circuit layer is arranged in the display area;
  • a light-emitting layer disposed on the side of the driving circuit layer away from the substrate;
  • an encapsulation layer disposed on the side of the light-emitting layer away from the driving circuit layer;
  • the chamfer is arranged between the driving circuit layer and the substrate, a crack prevention structure is arranged in the chamfer, the crack prevention structure is in contact with the encapsulation layer, and the crack prevention structure is used for In order to reduce the angle between the contact plane of the crack prevention structure and the encapsulation layer and the plane where the light-emitting layer is located.
  • the encapsulation layer extends from the light emitting layer to the groove, and the encapsulation layer is disposed within the chamfer.
  • the encapsulation layer extends from the light emitting layer to the groove, and an angle between the contact plane of the encapsulation layer and the crack prevention structure and the plane where the light emitting layer is located is less than or equal to 90 degrees .
  • the anti-crack structure is disposed in the display area, the angle between the contact plane of the encapsulation layer and the anti-crack structure and the plane where the light-emitting layer is located is a right angle, and the encapsulation layer and the The contact plane of the crack prevention structure is arranged at the junction of the display area and the electronic component arrangement area.
  • the crack prevention structure extends from the display area to the electronic component setting region, the encapsulation layer is in contact with the upper side of the crack prevention structure and the left side of the crack prevention structure, so The angle of the two sides of the encapsulation layer in contact with the anti-crack structure is a right angle.
  • the crack prevention structure extends from the display area to the electronic component setting area, and the angle between the contact plane between the encapsulation layer and the crack prevention structure and the plane where the light emitting layer is located is an acute angle.
  • the thickness of the crack prevention structure is less than or equal to the distance between the bottom of the groove and the bottom of the driving circuit layer.
  • the material of the anti-cracking structure includes an organic material doped with a liquid absorber, and the inorganic material is laminated with the organic material.
  • an embodiment of the present application provides a method for manufacturing a display panel.
  • the method for manufacturing a display panel includes:
  • a driving circuit layer is formed on the substrate, and the substrate is etched to form grooves; the grooves are arranged in the display area and the electronic component setting area, and the grooves include inverted grooves located in the display area. corner, the driving circuit layer is disposed in the display area;
  • a light-emitting layer is formed on the driving circuit layer; the light-emitting layer includes a first light-emitting layer located on the driving circuit layer and a second light-emitting layer located in the electronic component setting area;
  • An encapsulation layer is formed on the light emitting layer; the crack prevention structure is used to reduce the angle between the contact plane of the crack prevention structure and the encapsulation layer and the plane where the light emitting layer is located.
  • an embodiment of the present application provides a display device, and the display device includes:
  • a display panel includes a display area and an electronic component setting area
  • the display panel includes: a substrate, a driving circuit layer, a light-emitting layer and an encapsulation layer
  • the substrate includes a recess located in the display area and the electronic component setting area
  • the groove includes a chamfer located in the display area;
  • the driving circuit layer is arranged on one side of the substrate, and the driving circuit layer is arranged in the display area;
  • the light-emitting layer is arranged on the the side of the driving circuit layer away from the substrate;
  • the encapsulation layer is arranged on the side of the light-emitting layer away from the driving circuit layer; wherein, the chamfer is arranged on the driving circuit layer and the substrate
  • an anti-crack structure is arranged in the chamfer, the anti-crack structure is in contact with the encapsulation layer, and the anti-crack structure is used to reduce the contact plane between the anti-crack structure and the encapsulation layer.
  • Electronic components are arranged in the electronic component setting area.
  • the electronic component includes an under-screen camera.
  • the encapsulation layer extends from the light emitting layer to the groove, and the encapsulation layer is disposed within the chamfer.
  • the encapsulation layer extends from the light emitting layer to the groove, and an angle between the contact plane of the encapsulation layer and the crack prevention structure and the plane where the light emitting layer is located is less than or equal to 90 degrees .
  • the anti-crack structure is disposed in the display area, the angle between the contact plane of the encapsulation layer and the anti-crack structure and the plane where the light-emitting layer is located is a right angle, and the encapsulation layer and the The contact plane of the crack prevention structure is arranged at the junction of the display area and the electronic component arrangement area.
  • the crack prevention structure extends from the display area to the electronic component setting region, the encapsulation layer is in contact with the upper side of the crack prevention structure and the left side of the crack prevention structure, so The angle of the two sides of the encapsulation layer in contact with the anti-crack structure is a right angle.
  • the crack prevention structure extends from the display area to the electronic component setting area, and the angle between the contact plane between the encapsulation layer and the crack prevention structure and the plane where the light emitting layer is located is an acute angle.
  • the light-emitting layer includes a first portion disposed in the display area and a second portion disposed in the electronic component setting area, and the crack prevention structure and the light-emitting layer are located in the electronic component setting area. Side contact of the second part.
  • the thickness of the crack prevention structure is less than or equal to the distance between the bottom of the groove and the bottom of the driving circuit layer.
  • the material of the anti-cracking structure includes an organic material doped with a liquid absorber, and the inorganic material is laminated with the organic material.
  • the width of the groove is greater than zero.
  • the present application provides a display panel, a preparation method thereof, and a display device.
  • the display panel includes a display area and an electronic component setting area.
  • the display panel includes a substrate, a driving circuit layer, a light-emitting layer, and an encapsulation layer.
  • the groove of the electronic component setting area includes a chamfer located in the display area, the driving circuit layer is arranged on one side of the substrate, and the driving circuit layer is arranged in the display area; the light-emitting layer is arranged on the side of the driving circuit layer away from the substrate , the encapsulation layer is arranged on the side of the light-emitting layer away from the driving circuit layer, wherein the chamfer is arranged between the driving circuit layer and the substrate, and a crack-proof structure is arranged in the chamfer, and the crack-proof structure is in contact with the encapsulation layer, and the crack-proof structure It is used to reduce the angle between the contact plane of the crack prevention structure and the encapsulation layer and the plane where the light-emitting layer is located.
  • a crack prevention structure is arranged in the chamfer between the driving circuit layer and the substrate, so that the crack prevention structure is in contact with the encapsulation layer, and the crack prevention structure can reduce the contact plane between the crack prevention structure and the encapsulation layer and the plane where the light emitting layer is located.
  • the angle of the encapsulation layer is relatively gentle, which reduces the risk of cracking of the encapsulation layer and avoids the failure of the display panel.
  • FIG. 1 is a schematic diagram of a display device with an existing O-cut design.
  • FIG. 2 is a first schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a second schematic diagram of a display panel according to an embodiment of the present application.
  • FIG. 4 is a third schematic diagram of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a flowchart of a method for fabricating a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a display panel corresponding to each step of the method for manufacturing a display panel provided in an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a display device provided by an embodiment of the present application.
  • a chamfer is formed between the substrate 11 and the array layer 14 .
  • the An entire encapsulation layer 13 is provided.
  • the angle A of the encapsulation layer 13 at the chamfer that is, the angle between the encapsulation layer in the chamfer and the horizontal direction
  • the encapsulation layer 13 is set too steep at this place.
  • the encapsulation layer 13 has stress concentration at the chamfer, and the encapsulation layer 13 is prone to breakage. As shown in FIG.
  • the encapsulation layer 13 has a break 15 at the chamfer, which causes the encapsulation failure. Therefore, the existing O-cut design of the display device has the technical problem that the packaging layer at the chamfer is prone to breakage, which leads to the failure of the packaging of the display device.
  • the embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device, so as to alleviate the above technical problems.
  • an embodiment of the present application provides a display panel, the display panel includes a display area 211 and an electronic component setting area 212 , and the display panel includes:
  • the substrate 21 includes a groove 213 located in the display area 211 and the electronic component setting area 212, and the groove 213 includes a chamfer 214 located in the display area 211;
  • the driving circuit layer 22 is arranged on one side of the substrate 21, and the driving circuit layer 22 is arranged in the display area 211;
  • the light-emitting layer 23 is disposed on the side of the driving circuit layer 22 away from the substrate 21;
  • the encapsulation layer 24 is disposed on the side of the light-emitting layer 23 away from the driving circuit layer 22;
  • the chamfer 214 is disposed between the driving circuit layer 22 and the substrate 21 , and a crack prevention structure 25 is arranged in the chamfer 214 , and the crack prevention structure 25 is in contact with the packaging layer 24 . , the crack prevention structure 25 is used to reduce the angle B between the contact plane of the crack prevention structure 25 and the encapsulation layer 24 and the plane where the light emitting layer 23 is located.
  • An embodiment of the present application provides a display panel.
  • a crack prevention structure is provided in a chamfer between a driving circuit layer and a substrate, so that the crack prevention structure is in contact with the encapsulation layer, and the crack prevention structure can reduce crack prevention.
  • the angle between the contact plane of the structure and the encapsulation layer and the plane where the light-emitting layer is located makes the encapsulation layer set more gently, reduces the risk of breakage of the encapsulation layer, and avoids the failure of the display panel.
  • the encapsulation layer extends from the light-emitting layer to the groove, and the encapsulation layer is disposed in the chamfer.
  • the encapsulation layer is supported by the anti-cracking structure in the chamfer, so that the angle of the encapsulation layer in the chamfer is reduced, so that the angle of the encapsulation layer in the chamfer is slowed down, and the encapsulation is reduced. Risk of layer breakage.
  • the angle of the encapsulation layer is an obtuse angle at this time, but due to the filling of the anti-crack structure, the setting angle of the encapsulation layer is slowed down, which can still reduce the risk of cracking of the encapsulation layer.
  • the encapsulation layer When the encapsulation layer is disposed within the chamfer, the disposition angle of the encapsulation layer is still steep, and the risk of rupture and failure of the encapsulation layer is high.
  • the encapsulation layer extends from the light-emitting layer into the groove, and an angle between the contact plane of the encapsulation layer and the crack prevention structure and the plane where the light-emitting layer is located is less than or equal to 90 degrees.
  • the encapsulation layer By arranging the encapsulation layer outside the chamfer, it is avoided that the encapsulation layer is formed at the chamfer and needs to extend in the opposite direction, resulting in the setting angle of the encapsulation layer being too steep, so that the contact plane between the encapsulation layer and the anti-crack structure and the plane where the light-emitting layer is located If the angle is less than or equal to 90 degrees, the encapsulation layer extends forward in the groove of the substrate and does not extend in the opposite direction, so that the setting angle of the encapsulation layer is relatively gentle, thereby reducing the risk of the encapsulation layer breaking.
  • the angle between the contact plane of the encapsulation layer and the crack prevention structure and the plane where the light-emitting layer is located is greater than 0 degrees.
  • the contact plane between the encapsulation layer and the anti-crack structure should be When the angle of the plane where the light-emitting layer is located is greater than 0 degrees, the angle of the encapsulation layer can be made gentle, and the anti-crack structure will not affect the light transmittance of the electronic component placement area of the display panel.
  • the anti-crack structure 25 is disposed in the display area 211 , and the contact plane between the encapsulation layer 24 and the anti-crack structure 25 and the light-emitting layer 23 are located.
  • the angle B of the plane is a right angle, and the contact plane between the encapsulation layer 24 and the anti-crack structure 25 is disposed at the junction of the display area 211 and the electronic component disposition area 212 .
  • the anti-crack structure When setting the anti-crack structure, the anti-crack structure can be set in the display area, and the anti-crack structure can fill the chamfer so that the encapsulation layer is set outside the chamfer, then the setting angle of the encapsulation layer is relatively slow, and the anti-crack structure will not be set To the electronic component setting area, to avoid the anti-crack structure affecting the light transmittance of the electronic component setting area.
  • the anti-crack structure is arranged in the display area.
  • the anti-crack structure may be a light-shielding material. Since the anti-crack structure is disposed under the light-emitting layer in the display area, it will not affect the light output of the display panel, and the anti-crack structure is disposed under the light-emitting layer. , which can prevent the light leaking downward from the light-emitting layer from being emitted to the electronic components, and affecting the lighting effect of the electronic components.
  • the anti-crack structure is a light-shielding material.
  • the anti-crack structure is made of a reflective material. By making the anti-crack structure a reflective material, when the light irradiates the side of the anti-crack structure, the light will be directed to the side of the anti-crack structure. Instead of being absorbed by the crack-proof structure or other film layers of the display panel, the lighting effect of electronic components is improved.
  • the crack prevention structure extends from the display area to the electronic component setting region, the encapsulation layer is in contact with the upper side of the crack prevention structure and the left side of the crack prevention structure,
  • the angle of the two sides of the encapsulation layer in contact with the anti-crack structure is a right angle.
  • the encapsulation layer is directly arranged on the anti-crack structure, the anti-crack structure supports the encapsulation layer, and the planes where the encapsulation layer and the anti-crack structure are in contact on both sides are at right angles, Then, the angle of the encapsulation layer is further slowed down, and the drop of the encapsulation layer becomes lower, which further reduces the risk of breakage of the encapsulation layer.
  • the anti-crack structure 25 extends from the display area 211 to the electronic component setting area 212 , and the contact plane between the encapsulation layer 24 and the anti-crack structure 25 The angle with the plane where the light-emitting layer 23 is located is an acute angle.
  • the encapsulation layer is arranged on the anti-crack structure, and the setting angle of the encapsulation layer becomes an acute angle, which further reduces the steepness of the encapsulation layer, makes the encapsulation layer slow, and reduces the Risk of breakage of the encapsulation layer.
  • the light-emitting layer includes a first portion disposed in the display area and a second portion disposed in the electronic component setting area, and the crack prevention structure and the light-emitting layer are located in the electronic component setting area The side contacts of the second part.
  • the anti-crack structure can be brought into contact with the second part of the light-emitting layer located in the setting area of the electronic components, then the anti-crack structure and the light-emitting layer enable the encapsulation layer to form a flat plane, so as to avoid bending of the encapsulation layer, thereby preventing the encapsulation layer from being bent. Reduce the risk of breakage of the encapsulation layer.
  • the anti-crack structure is set according to the shape of the electronic component setting area. If the anti-crack structure 25 is disposed in the display area 211, and the anti-crack structure 25 is disposed around the electronic component disposing area 212, the anti-crack structure can reduce the setting angle of the encapsulation layer and reduce the risk of cracking of the encapsulation layer.
  • the embodiment of the present application is not limited to this, and when the electronic component setting area is in other shapes, the crack prevention structure can also be correspondingly arranged around the electronic component setting area, thereby reducing the risk of cracking of the encapsulation layer.
  • the thickness of the crack prevention structure is less than or equal to the distance between the bottom of the groove and the bottom of the driving circuit layer.
  • the anti-crack structure can support the encapsulation layer, so that the setting angle of the encapsulation layer is relatively gentle, and the risk of cracking of the encapsulation layer is reduced.
  • the anti-cracking structure may fill the chamfer, or may have a certain gap, and the embodiment of the present application is not limited thereto.
  • the material of the anti-cracking structure includes an organic material doped with a liquid absorbent, and the inorganic material and the organic material are laminated.
  • the anti-crack structure can block water and oxygen, and the anti-crack structure includes organic materials, so as to avoid the strong rigidity of the anti-crack structure, causing the anti-crack structure to affect the flexibility of the display panel .
  • the minimum width of the groove is greater than zero.
  • the driving circuit layer includes a buffer layer, an active layer, a first gate insulating layer, a first metal layer, a second gate insulating layer, a second metal layer, and an interlayer insulating layer, which are arranged in sequence. layer, source and drain layer, planarization layer, pixel electrode layer.
  • the light emitting layer includes a light emitting material layer, a pixel definition layer and a common electrode layer.
  • the encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer.
  • the display panel includes an OLED display panel and a liquid crystal display panel.
  • an embodiment of the present application provides a method for fabricating a display panel, and the method for fabricating a display panel includes:
  • a driving circuit layer is formed on the substrate, and the substrate is etched to form a groove; the groove is arranged in the display area and the electronic component setting area, and the groove includes a groove located in the display area , the drive circuit layer is arranged in the display area; the structure of the display panel is shown in (a) of FIG. 6 ;
  • the light-emitting layer includes a first light-emitting layer located on the driving circuit layer and a second light-emitting layer located in the electronic component setting area; the structure of the display panel is shown in the figure (b) in 6;
  • the crack prevention structure is used to reduce the angle between the contact plane of the crack prevention structure and the encapsulation layer and the plane where the light-emitting layer is located; the structure of the display panel is shown in Figure 6 shown in (d).
  • An embodiment of the present application provides a method for manufacturing a display device.
  • a crack prevention structure is formed in a chamfer between a driving circuit layer and a substrate before forming an encapsulation layer, so that the crack prevention structure is in contact with the encapsulation layer.
  • the anti-crack structure can reduce the angle between the contact plane of the anti-crack structure and the encapsulation layer and the plane where the light-emitting layer is located, so that the encapsulation layer is set more gently, the risk of cracking of the encapsulation layer is reduced, and the failure of the display panel is avoided.
  • the organic material doped with the liquid absorbent may be printed into the chamfer by means of inkjet printing.
  • an embodiment of the present application provides a display device, and the display device includes:
  • the display panel includes a display area 211 and an electronic component setting area 212, the display panel includes: a substrate 21, a driving circuit layer 22, a light-emitting layer 23 and an encapsulation layer 24, the substrate 21 includes the display area 211 and The groove 213 of the electronic component setting area 212, the groove 213 includes a chamfer 214 located in the display area 211; the driving circuit layer 22 is disposed on one side of the substrate 21, and the driving circuit The layer 22 is arranged on the display area 211; the light-emitting layer 23 is arranged on the side of the driving circuit layer 22 away from the substrate 21; the encapsulation layer 24 is arranged on the light-emitting layer 23 away from the driving circuit One side of the layer 22; wherein, the chamfer 214 is disposed between the driving circuit layer 22 and the substrate 21, and a crack prevention structure 25 is provided in the chamfer 214, and the crack prevention structure 25 is connected with The encapsulation layer 24 is in contact, and the anti-crack structure 25 is used to reduce
  • the electronic components 31 are arranged in the electronic component setting area 212 .
  • An embodiment of the present application provides a display device, the display device includes a display panel and electronic components, the display panel is provided with a crack-proof structure in a chamfer between a driving circuit layer and a substrate, so that the crack-proof structure is in contact with the encapsulation layer , the anti-crack structure can reduce the angle between the contact plane of the anti-crack structure and the encapsulation layer and the plane where the light-emitting layer is located, so that the encapsulation layer is set more gently, the risk of cracking of the encapsulation layer is reduced, and the failure of the display panel is avoided.
  • the electronic component includes an under-screen camera.
  • the encapsulation layer extends from the light-emitting layer to the groove, and the encapsulation layer is disposed in the chamfer.
  • the encapsulation layer extends from the light-emitting layer to the groove, and a contact plane between the encapsulation layer and the crack-prevention structure and a plane where the light-emitting layer is located The angle is less than or equal to 90 degrees.
  • the anti-crack structure is disposed in the display area, the angle between the contact plane between the encapsulation layer and the anti-crack structure and the plane where the light-emitting layer is located is a right angle, and The contact plane between the encapsulation layer and the anti-cracking structure is arranged at the junction of the display area and the electronic component arrangement area.
  • the crack prevention structure extends from the display area to the electronic component setting region, the encapsulation layer and the upper side of the crack prevention structure and the crack prevention structure
  • the left side of the encapsulation layer is in contact with the anti-cracking structure, and the angles of the two sides of the encapsulation layer in contact with the crack prevention structure are right angles.
  • the crack prevention structure extends from the display area to the electronic component setting region, and the contact plane between the encapsulation layer and the crack prevention structure and the light emitting layer are located The angle of the plane is an acute angle.
  • the light-emitting layer includes a first portion disposed in the display area and a second portion disposed in the electronic component setting area, and the crack prevention structure and the light-emitting layer are located in the electronic component setting area The side contacts of the second part.
  • the thickness of the crack prevention structure is less than or equal to the distance between the bottom of the groove and the bottom of the driving circuit layer.
  • the material of the anti-cracking structure includes an organic material doped with a liquid absorbing agent, and the inorganic material and the organic material are stacked.
  • the width of the groove is greater than zero.
  • Embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device.
  • the display panel includes a display area and an electronic component setting area.
  • the display panel includes a substrate, a driving circuit layer, a light-emitting layer, and an encapsulation layer.
  • the groove includes a chamfer located in the display area, the driving circuit layer is arranged on one side of the substrate, and the driving circuit layer is arranged in the display area; the light-emitting layer is arranged on the driving circuit layer away from the substrate.
  • the encapsulation layer is arranged on the side of the light-emitting layer away from the driving circuit layer, wherein the chamfer is arranged between the driving circuit layer and the substrate, and a crack-proof structure is arranged in the chamfer, and the crack-proof structure is in contact with the encapsulation layer to prevent the cracking.
  • the crack structure is used to reduce the angle between the contact plane between the crack prevention structure and the encapsulation layer and the plane where the light emitting layer is located.
  • a crack prevention structure is arranged in the chamfer between the driving circuit layer and the substrate, so that the crack prevention structure is in contact with the encapsulation layer, and the crack prevention structure can reduce the contact plane between the crack prevention structure and the encapsulation layer and the plane where the light emitting layer is located.
  • the angle of the encapsulation layer is relatively gentle, which reduces the risk of cracking of the encapsulation layer and avoids the failure of the display panel.
  • a display panel, a manufacturing method thereof, and a display device provided by the embodiments of the present application have been introduced in detail above.
  • the principles and implementations of the present application are described with specific examples. The descriptions of the above embodiments are only used for Help to understand the technical solution of the present application and its core idea; those of ordinary skill in the art should understand: it can still make modifications to the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some of the technical features; and these modifications Or alternatively, the essence of the corresponding technical solution does not deviate from the scope of the technical solutions of the embodiments of the present application.

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Abstract

本申请提供一种显示面板及其制备方法、显示装置；该显示面板通过在驱动电路层和衬底之间的倒角内设置防裂结构，使防裂结构与封装层接触，则防裂结构能够减小防裂结构和封装层接触平面与发光层所在平面的角度，使封装层设置较平缓，降低封装层断裂的风险，避免显示面板失效。

Description

显示面板及其制备方法、显示装置 技术领域
本申请涉及显示技术领域，尤其是涉及一种显示面板及其制备方法、显示装置。
 背景技术
OLED（Organic Light-Emitting Diode，有机发光二极管）显示器件由于具有自发光、响应速度快、广视角等优点被广泛应用。现有OLED显示器件为了提高屏占比设计了一种O-cut（O型开孔）设计的显示器件，O-cut型显示器件通过对衬底形成开口，使发光层在O-cut区不连续，但封装层在O-cut区连续，保持显示器件的封装完整，但在现有O-cut型显示器件中，如图1所示，由于衬底与阵列层之间形成有倒角，导致封装层与水平方向的角度约为180度，封装层设置过于陡峭，导致封装层在倒角处容易出现断裂，从而导致封装失效。
所以，现有O-cut型显示器件存在倒角处的封装层容易出现断裂，导致显示器件封装失效的技术问题。
 技术问题
本申请实施例提供一种显示面板及其制备方法、显示装置，用以缓解现有O-cut型显示器件存在倒角处的封装层容易出现断裂的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种显示面板，该显示面板包括：
显示区和电子元件设置区，所述显示面板包括：
衬底，包括位于所述显示区和所述电子元件设置区的凹槽，所述凹槽包括位于所述显示区的倒角；
驱动电路层，设置于所述衬底一侧，且所述驱动电路层设置于所述显示区；
发光层，设置于所述驱动电路层远离所述衬底的一侧；
封装层，设置于所述发光层远离所述驱动电路层的一侧；
其中，所述倒角设置于所述驱动电路层与所述衬底之间，所述倒角内设有防裂结构，所述防裂结构与所述封装层接触，所述防裂结构用于减小所述防裂结构和所述封装层的接触平面与所述发光层所在平面的角度。
在一些实施例中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层设置于所述倒角内。
在一些实施例中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度。
在一些实施例中，所述防裂结构设置于所述显示区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为直角，且所述封装层与所述防裂结构的接触平面设置于所述显示区与所述电子元件设置区的交界处。
在一些实施例中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的上侧和所述防裂结构的左侧接触，所述封装层与所述防裂结构接触的两侧的角度为直角。
在一些实施例中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为锐角。
在一些实施例中，所述防裂结构的厚度小于或者等于所述凹槽的底部与所述驱动电路层的底部之间的距离。
在一些实施例中，所述防裂结构的材料包括掺杂吸液剂的有机材料，无机材料与有机材料叠层。
同时，本申请实施例提供一种显示面板制备方法，该显示面板制备方法包括：
提供衬底；
在所述衬底上形成驱动电路层，并对所述衬底进行刻蚀形成凹槽；所述凹槽设置于显示区和电子元件设置区，所述凹槽包括位于所述显示区的倒角，所述驱动电路层设置于所述显示区；
在所述驱动电路层上形成发光层；所述发光层包括位于所述驱动电路层上的第一发光层和位于所述电子元件设置区的第二发光层；
在所述倒角内形成防裂结构；
在所述发光层上形成封装层；所述防裂结构用于减小所述防裂结构和所述封装层接触平面与所述发光层所在平面的角度。
同时，本申请实施例提供一种显示装置，该显示装置包括：
显示面板，包括显示区和电子元件设置区，所述显示面板包括：衬底、驱动电路层、发光层和封装层，所述衬底包括位于所述显示区和所述电子元件设置区的凹槽，所述凹槽包括位于所述显示区的倒角；所述驱动电路层设置于所述衬底一侧，且所述驱动电路层设置于所述显示区；所述发光层设置于所述驱动电路层远离所述衬底的一侧；所述封装层设置于所述发光层远离所述驱动电路层的一侧；其中，所述倒角设置于所述驱动电路层与所述衬底之间，所述倒角内设有防裂结构，所述防裂结构与所述封装层接触，所述防裂结构用于减小所述防裂结构和所述封装层的接触平面与所述发光层所在平面的角度；
电子元件，设置于所述电子元件设置区。
在一些实施例中，所述电子元件包括屏下摄像头。
在一些实施例中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层设置于所述倒角内。
在一些实施例中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度。
在一些实施例中，所述防裂结构设置于所述显示区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为直角，且所述封装层与所述防裂结构的接触平面设置于所述显示区与所述电子元件设置区的交界处。
在一些实施例中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的上侧和所述防裂结构的左侧接触，所述封装层与所述防裂结构接触的两侧的角度为直角。
在一些实施例中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为锐角。
在一些实施例中，所述发光层包括设置于所述显示区的第一部分和设置于所述电子元件设置区的第二部分，所述防裂结构与发光层位于所述电子元件设置区的第二部分的侧面接触。
在一些实施例中，所述防裂结构的厚度小于或者等于所述凹槽的底部与所述驱动电路层的底部之间的距离。
在一些实施例中，所述防裂结构的材料包括掺杂吸液剂的有机材料，无机材料与有机材料叠层。
在一些实施例中，所述凹槽的宽度大于0。
 有益效果
本申请提供一种显示面板及其制备方法、显示装置，该显示面板包括显示区和电子元件设置区，显示面板包括衬底、驱动电路层、发光层和封装层，衬底包括位于显示区和电子元件设置区的凹槽，凹槽包括位于显示区的倒角，驱动电路层设置于衬底一侧，且驱动电路层设置于显示区；发光层设置于驱动电路层远离衬底的一侧，封装层设置于发光层远离驱动电路层的一侧，其中，倒角设置于驱动电路层与衬底之间，倒角内设有防裂结构，防裂结构与封装层接触，防裂结构用于减小防裂结构和封装层的接触平面与发光层所在平面的角度。本申请通过在驱动电路层和衬底之间的倒角内设置防裂结构，使防裂结构与封装层接触，则防裂结构能够减小防裂结构和封装层接触平面与发光层所在平面的角度，使封装层设置较平缓，降低封装层断裂的风险，避免显示面板失效。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为现有O-cut设计的显示器件的示意图。
图2为本申请实施例提供的显示面板的第一种示意图。
图3为本申请实施例提供的显示面板的第二种示意图。
图4为本申请实施例提供的显示面板的第三种示意图。
图5为本申请实施例提供的显示面板制备方法的流程图。
图6为本申请实施例提供的显示面板制备方法的各个步骤对应的显示面板的结构示意图。
图7为本申请实施例提供的显示装置的示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
如图1所示，现有O-cut设计的显示器件中，衬底11与阵列层14之间会形成倒角，在阵列层14上形成发光层12后，为了阻隔水氧的入侵，会设置整层的封装层13。但在封装层13的设置过程中，由于倒角处的封装层13的角度A（即倒角内封装层与水平方向的夹角）接近180度，导致在该处封装层13设置过于陡峭，封装层13在倒角处出现应力集中，封装层13容易出现断裂，如图1所示，封装层13在倒角处出现断裂处15，导致封装失效。所以，现有O-cut设计的显示器件存在倒角处的封装层容易出现断裂，导致显示器件封装失效的技术问题。
本申请实施例针对上述技术问题，提供一种显示面板及其制备方法、显示装置，用以缓解上述技术问题。
如图2、图6所示，本申请实施例提供一种显示面板，该显示面板包括显示区211和电子元件设置区212，所述显示面板包括：
衬底21，包括位于所述显示区211和所述电子元件设置区212的凹槽213，所述凹槽213包括位于所述显示区211的倒角214；
驱动电路层22，设置于所述衬底21一侧，且所述驱动电路层22设置于所述显示区211内；
发光层23，设置于所述驱动电路层22远离所述衬底21的一侧；
封装层24，设置于所述发光层23远离所述驱动电路层22的一侧；
其中，所述倒角214设置于所述驱动电路层22与所述衬底21之间，所述倒角214内设有防裂结构25，所述防裂结构25与所述封装层24接触，所述防裂结构25用于减小所述防裂结构25和所述封装层24的接触平面与所述发光层23所在平面的角度B。
本申请实施例提供一种显示面板，该显示面板通过在驱动电路层和衬底之间的倒角内设置防裂结构，使防裂结构与封装层接触，则防裂结构能够减小防裂结构和封装层接触平面与发光层所在平面的角度，使封装层设置较平缓，降低封装层断裂的风险，避免显示面板失效。
针对显示面板的倒角处的封装层的角度过大，导致封装层在倒角处出现断裂的问题。在一种实施例中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层设置于所述倒角内。通过使封装层设置在倒角内，通过倒角内的防裂结构对封装层进行支撑，减小倒角内的封装层的角度，从而使得倒角内的封装层的角度变缓，降低封装层断裂的风险。由于封装层设置倒角处，此时封装层的角度为钝角，但由于防裂结构的填充，使封装层的设置角度变缓，则仍然可以降低封装层断裂的风险。
针对封装层设置在倒角内时，封装层的设置角度仍然较陡，封装层断裂失效的风险较大。在一种实施例中，所述封装层从所述发光层上延伸至所述凹槽内，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度。通过将封装层设置在倒角外，避免封装层在倒角处形成需要向相反方向延伸，导致封装层的设置角度过陡，使封装层与防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度，则封装层在衬底的凹槽内向前延伸，而不会向反方向延伸，使得封装层的设置角度较缓，从而降低封装层断裂的风险。
在一种实施例中，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度大于0度。为了避免防裂结构整面设置在衬底的凹槽内，导致防裂结构影响电子元件设置区的透光性，且为了降低封装层断裂的风险，使封装层与防裂结构的接触平面与发光层所在平面的角度大于0度，则可以使封装层的设置角度较缓，且防裂结构不会影响显示面板的电子元件设置区的透光性。
在一种实施例中，如图2所示，所述防裂结构25设置于所述显示区211内，所述封装层24与所述防裂结构25的接触平面与所述发光层23所在平面的角度B为直角，且所述封装层24与所述防裂结构25的接触平面设置于所述显示区211与所述电子元件设置区212的交界处。在设置防裂结构时，可以使防裂结构设置在显示区内，且防裂结构填充倒角使封装层设置在倒角外，则封装层的设置角度较缓，且防裂结构不会设置到电子元件设置区，避免防裂结构影响电子元件设置区的透光性。
上述实施例对防裂结构设置在显示区进行了详细描述。在一种实施例中，所述防裂结构可以为遮光材料，由于防裂结构设置在显示区的发光层下方，不会影响到显示面板的光线射出，而将防裂结构设置在发光层下方，可以避免发光层向下泄漏的光发射到电子元件，影响电子元件的采光效果。
上述实施例对防裂结构为遮光材料进行了详细描述。为了进一步提高电子元件设置区的采光性能，在一种实施例，所述防裂结构为反射材料，通过使防裂结构为反射材料，使得光线在照射到防裂结构的侧面时，光线会向下反射，而不是被防裂结构或者显示面板的其他膜层吸收，从而提高电子元件的采光效果。
在一种实施例中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的上侧和所述防裂结构的左侧接触，所述封装层与所述防裂结构接触的两侧的角度为直角。通过使防裂结构在电子元件设置区形成直角，使封装层直接设置在防裂结构上，防裂结构对封装层进行支撑，且封装层与防裂结构接触在两侧接触的平面为直角，则封装层的角度进一步变缓，且封装层的落差变低，进一步降低封装层断裂的风险。
在一种实施例中，如图3所示，所述防裂结构25从所述显示区211延伸至所述电子元件设置区212，所述封装层24与所述防裂结构25的接触平面与所述发光层23所在平面的角度为锐角。通过将防裂结构从显示区延伸至电子元件设置区，使封装层设置在防裂结构上，则封装层的设置角度变为锐角，进一步降低封装层的陡峭程度，使封装层变缓，降低封装层断裂的风险。
在一种实施例中，所述发光层包括设置于所述显示区的第一部分和设置于所述电子元件设置区的第二部分，所述防裂结构与发光层位于所述电子元件设置区的第二部分的侧面接触。在设置防裂结构时，可以使防裂结构与发光层位于电子元件设置区的第二部分接触，则防裂结构和发光层使封装层能够形成平整的平面，避免封装层出现弯曲处，从而降低封装层断裂的风险。
上述实施例对防裂结构的设置位置进行了详细描述。在防裂结构的设置过程中，根据电子元件设置区的形状设置防裂结构，在一种实施例中，例如图4所示，在电子元件设置区为O-cut形状时，防裂结构25设置于显示区211，且防裂结构25围绕所述电子元件设置区212设置，则可以使防裂结构减小封装层的设置角度，降低封装层的断裂风险。但本申请实施例不限于此，在电子元件设置区为其他形状时，也可以使防裂结构相应的围绕电子元件设置区设置，从而降低封装层的断裂风险。
在一种实施例中，所述防裂结构的厚度小于或者等于所述凹槽的底部于所述驱动电路层的底部之间的距离。设置防裂结构时，使防裂结构能够支撑封装层，从而使得封装层的设置角度较缓，降低封装层的断裂风险。防裂结构可以填满所述倒角，也可以是具有一定的空隙，本申请实施例不限于此。
针对防裂结构设置在倒角处时，可能会影响显示面板的阻隔水氧的能力。在一种实施例中，所述防裂结构的材料包括掺杂吸液剂的有机材料，无机材料与有机材料叠层。通过选择具有阻水性能的材料作为防裂结构的材料，使得防裂结构能够阻隔水氧，且防裂结构包括有机材料，避免防裂结构的刚性较强，导致防裂结构影响显示面板的柔性。
在一种实施例中，所述凹槽的最小宽度大于0。
在一种实施例中，所述驱动电路层包括依次设置的缓冲层、有源层、第一栅极绝缘层、第一金属层、第二栅极绝缘层、第二金属层、层间绝缘层、源漏极层、平坦化层、像素电极层。
在一种实施例中，所述发光层包括发光材料层、像素定义层和公共电极层。
在一种实施例中，所述封装层包括第一无机层、有机层和第二无机层。
在一种实施例中，所述显示面板包括OLED显示面板和液晶显示面板。
如图5所示，本申请实施例提供一种显示面板制备方法，该显示面板制备方法包括：
S1，提供衬底；显示面板的结构如图6中的（a）所示；
S2，在所述衬底上形成驱动电路层，并对所述衬底进行刻蚀形成凹槽；所述凹槽设置于显示区和电子元件设置区，所述凹槽包括位于所述显示区的倒角，所述驱动电路层设置于所述显示区；显示面板的结构如图6中的（a）所示；
S3，在所述驱动电路层上形成发光层；所述发光层包括位于所述驱动电路层上的第一发光层和位于所述电子元件设置区的第二发光层；显示面板的结构如图6中的（b）所示；
S4，在所述倒角内形成防裂结构；显示面板的结构如图6中的（c）所示；
S5，在所述发光层上形成封装层；所述防裂结构用于减小所述防裂结构和所述封装层接触平面与所述发光层所在平面的角度；显示面板的结构如图6中的（d）所示。
本申请实施例提供一种显示装置制备方法，该显示装置制备方法通过在形成封装层前，在驱动电路层和衬底之间的倒角内形成防裂结构，使得防裂结构与封装层接触，则防裂结构能够减小防裂结构和封装层接触平面与发光层所在平面的角度，使封装层设置较平缓，降低封装层断裂的风险，避免显示面板失效。
在一种实施例中，在形成防裂结构时，可以通过喷墨打印的方式将掺杂有吸液剂的有机材料打印至倒角内。
如图6、图7所示，本申请实施例提供一种显示装置，该显示装置包括：
显示面板，包括显示区211和电子元件设置区212，所述显示面板包括：衬底21、驱动电路层22、发光层23和封装层24，所述衬底21包括位于所述显示区211和所述电子元件设置区212的凹槽213，所述凹槽213包括位于所述显示区211的倒角214；所述驱动电路层22设置于所述衬底21一侧，且所述驱动电路层22设置于所述显示区211；所述发光层23设置于所述驱动电路层22远离所述衬底21的一侧；所述封装层24设置于所述发光层23远离所述驱动电路层22的一侧；其中，所述倒角214设置于所述驱动电路层22与所述衬底21之间，所述倒角214内设有防裂结构25，所述防裂结构25与所述封装层24接触，所述防裂结构25用于减小所述防裂结构25和所述封装层24的接触平面与所述发光层23所在平面的角度B；
电子元件31，设置于所述电子元件设置区212。
本申请实施例提供一种显示装置，该显示装置包括显示面板和电子元件，该显示面板通过在驱动电路层和衬底之间的倒角内设置防裂结构，使防裂结构与封装层接触，则防裂结构能够减小防裂结构和封装层接触平面与发光层所在平面的角度，使封装层设置较平缓，降低封装层断裂的风险，避免显示面板失效。
在一种实施例中，所述电子元件包括屏下摄像头。
在一种实施例中，在显示装置中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层设置于所述倒角内。
在一种实施例中，在显示装置中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度。
在一种实施例中，在显示装置中，所述防裂结构设置于所述显示区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为直角，且所述封装层与所述防裂结构的接触平面设置于所述显示区与所述电子元件设置区的交界处。
在一种实施例中，在显示装置中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的上侧和所述防裂结构的左侧接触，所述封装层与所述防裂结构接触的两侧的角度为直角。
在一种实施例中，在显示装置中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为锐角。
在一种实施例中，所述发光层包括设置于所述显示区的第一部分和设置于所述电子元件设置区的第二部分，所述防裂结构与发光层位于所述电子元件设置区的第二部分的侧面接触。
在一种实施例中，在显示装置中，所述防裂结构的厚度小于或者等于所述凹槽的底部与所述驱动电路层的底部之间的距离。
在一种实施例中，在显示装置中，所述防裂结构的材料包括掺杂吸液剂的有机材料，无机材料与有机材料叠层。
在一种实施例中，在显示装置中，所述凹槽的宽度大于0。
根据以上实施例可知：
本申请实施例提供一种显示面板及其制备方法、显示装置，该显示面板包括显示区和电子元件设置区，显示面板包括衬底、驱动电路层、发光层和封装层，衬底包括位于显示区和电子元件设置区的凹槽，凹槽包括位于显示区的倒角，驱动电路层设置于衬底一侧，且驱动电路层设置于显示区；发光层设置于驱动电路层远离衬底的一侧，封装层设置于发光层远离驱动电路层的一侧，其中，倒角设置于驱动电路层与衬底之间，倒角内设有防裂结构，防裂结构与封装层接触，防裂结构用于减小防裂结构和封装层的接触平面与发光层所在平面的角度。本申请通过在驱动电路层和衬底之间的倒角内设置防裂结构，使防裂结构与封装层接触，则防裂结构能够减小防裂结构和封装层接触平面与发光层所在平面的角度，使封装层设置较平缓，降低封装层断裂的风险，避免显示面板失效。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板及其制备方法、显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其包括显示区和电子元件设置区，所述显示面板包括：
    衬底，包括位于所述显示区和所述电子元件设置区的凹槽，所述凹槽包括位于所述显示区的倒角；
    驱动电路层，设置于所述衬底一侧，且所述驱动电路层设置于所述显示区；
    发光层，设置于所述驱动电路层远离所述衬底的一侧；
    封装层，设置于所述发光层远离所述驱动电路层的一侧；
    其中，所述倒角设置于所述驱动电路层与所述衬底之间，所述倒角内设有防裂结构，所述防裂结构与所述封装层接触，所述防裂结构用于减小所述防裂结构和所述封装层的接触平面与所述发光层所在平面的角度。
  2. 如权利要求1所述的显示面板，其中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层设置于所述倒角内。
  3. 如权利要求1所述的显示面板，其中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度。
  4. 如权利要求3所述的显示面板，其中，所述防裂结构设置于所述显示区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为直角，且所述封装层与所述防裂结构的接触平面设置于所述显示区与所述电子元件设置区的交界处。
  5. 如权利要求3所述的显示面板，其中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的上侧和所述防裂结构的左侧接触，所述封装层与所述防裂结构接触的两侧的角度为直角。
  6. 如权利要求3所述的显示面板，其中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为锐角。
  7. 如权利要求6所述的显示面板，其中，所述防裂结构的厚度小于或者等于所述凹槽的底部与所述驱动电路层的底部之间的距离。
  8. 如权利要求6所述的显示面板，其中，所述防裂结构的材料包括掺杂吸液剂的有机材料，无机材料与有机材料叠层。
  9. 一种显示面板制备方法，其包括：
    提供衬底；
    在所述衬底上形成驱动电路层，并对所述衬底进行刻蚀形成凹槽；所述凹槽设置于显示区和电子元件设置区，所述凹槽包括位于所述显示区的倒角，所述驱动电路层设置于所述显示区；
    在所述驱动电路层上形成发光层；所述发光层包括位于所述驱动电路层上的第一发光层和位于所述电子元件设置区的第二发光层；
    在所述倒角内形成防裂结构；
    在所述发光层上形成封装层；所述防裂结构用于减小所述防裂结构和所述封装层接触平面与所述发光层所在平面的角度。
  10. 一种显示装置，其包括：
    显示面板，包括显示区和电子元件设置区，所述显示面板包括：衬底、驱动电路层、发光层和封装层，所述衬底包括位于所述显示区和所述电子元件设置区的凹槽，所述凹槽包括位于所述显示区的倒角；所述驱动电路层设置于所述衬底一侧，且所述驱动电路层设置于所述显示区；所述发光层设置于所述驱动电路层远离所述衬底的一侧；所述封装层设置于所述发光层远离所述驱动电路层的一侧；其中，所述倒角设置于所述驱动电路层与所述衬底之间，所述倒角内设有防裂结构，所述防裂结构与所述封装层接触，所述防裂结构用于减小所述防裂结构和所述封装层的接触平面与所述发光层所在平面的角度；
    电子元件，设置于所述电子元件设置区。
  11. 如权利要求10所述的显示装置，其中，所述电子元件包括屏下摄像头。
  12. 如权利要求10所述的显示装置，其中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层设置于所述倒角内。
  13. 如权利要求10所述的显示装置，其中，所述封装层从所述发光层上延伸至所述凹槽，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度小于或者等于90度。
  14. 如权利要求13所述的显示装置，其中，所述防裂结构设置于所述显示区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为直角，且所述封装层与所述防裂结构的接触平面设置于所述显示区与所述电子元件设置区的交界处。
  15. 如权利要求13所述的显示装置，其中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的上侧和所述防裂结构的左侧接触，所述封装层与所述防裂结构接触的两侧的角度为直角。
  16. 如权利要求13所述的显示装置，其中，所述防裂结构从所述显示区延伸至所述电子元件设置区，所述封装层与所述防裂结构的接触平面与所述发光层所在平面的角度为锐角。
  17. 如权利要求16所述的显示装置，其中，所述发光层包括设置于所述显示区的第一部分和设置于所述电子元件设置区的第二部分，所述防裂结构与发光层位于所述电子元件设置区的第二部分的侧面接触。
  18. 如权利要求16所述的显示装置，其中，所述防裂结构的厚度小于或者等于所述凹槽的底部与所述驱动电路层的底部之间的距离。
  19. 如权利要求16所述的显示装置，其中，所述防裂结构的材料包括掺杂吸液剂的有机材料，无机材料与有机材料叠层。
  20. 如权利要求10所述的显示装置，其中，所述凹槽的宽度大于0。
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