WO2022210422A1 - 熱伝導性組成物、熱伝導性部材、バッテリモジュール - Google Patents

熱伝導性組成物、熱伝導性部材、バッテリモジュール Download PDF

Info

Publication number
WO2022210422A1
WO2022210422A1 PCT/JP2022/014659 JP2022014659W WO2022210422A1 WO 2022210422 A1 WO2022210422 A1 WO 2022210422A1 JP 2022014659 W JP2022014659 W JP 2022014659W WO 2022210422 A1 WO2022210422 A1 WO 2022210422A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
conductive composition
agent
measurement
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/014659
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
達矢 岩本
学 北田
俊輝 金子
大知 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Polymatech Co Ltd
Original Assignee
Sekisui Polymatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Polymatech Co Ltd filed Critical Sekisui Polymatech Co Ltd
Priority to KR1020237030994A priority Critical patent/KR20230161957A/ko
Priority to EP22780635.3A priority patent/EP4317322A4/en
Priority to JP2023511202A priority patent/JPWO2022210422A1/ja
Priority to US18/282,650 priority patent/US20240250333A1/en
Priority to CN202280021460.5A priority patent/CN116981739A/zh
Publication of WO2022210422A1 publication Critical patent/WO2022210422A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/651—Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a thermally conductive composition, a thermally conductive member, and a battery module using the thermally conductive member as a gap material.
  • a curable thermally conductive composition is filled between a heating element and a radiator, and then cured to form a cured product that is used as a thermally conductive member that transfers heat generated by the heating element to the radiator. It is Since the curable thermally conductive composition is fluid, it can fill any gap between the heat generating element and the heat dissipating element. Therefore, the formed thermally conductive member can reliably fill the gap even if the gap between the heating element and the radiator is not uniform, and is used as a thermally conductive gap material.
  • a room-temperature-curing thermally conductive composition is used as a gap material for heat dissipation in a lithium-ion battery (for example, Patent Document 1). Specifically, it is used by being filled between a battery cell, which is a heating element, and a module case that stores the battery cell, or between a battery module and a cooling plate. It has been reported that such a thermally conductive composition can control the speed of the curing reaction and prevent peeling from the adherend by adjusting the blending of the catalyst and reaction retardant ( For example, Patent Document 2).
  • the thermally conductive composition can be assembled in a post-process by maintaining a flexible state and compressing it to a desired thickness even after a certain period of time has passed since it was applied (filled).
  • to be in a flexible state means that it is in a hardened state to the extent that it does not have fluidity, and is flexible compared to the ultimate hardness.
  • the reason why such a state is necessary is that while it is preferable to eventually reach a hardness with some rigidity (eg, E20 to E70), it is preferable to be more flexible during assembly. be. Therefore, it is important to appropriately control the curing speed of the thermally conductive composition.
  • the thermally conductive composition cures quickly, the time during which flexibility can be maintained is shortened, so the time during which the work of compressing the composition to the desired thickness described above can be performed is shortened, and the workability is deteriorated.
  • the curing speed of the thermally conductive composition fluctuates depending on the outside temperature, different problems tend to occur depending on the season. For example, when the outside air temperature is high, as in summer, the curing speed tends to increase, and as described above, the problem of deterioration in workability, such as the inability to perform the work of compressing to a desired thickness, tends to occur. On the other hand, when the outside air temperature is low, as in winter, the curing speed is slow, and the reliability of the product tends to decrease due to misalignment of the heating element and the heat radiation element as described above.
  • an object of the present invention is to ensure good workability and reliability as a product in a relatively wide temperature range when a thermally conductive composition is filled into an adherend such as a heating element or a radiator. Another object is to provide a thermally conductive composition that can be maintained. More specifically, from the viewpoint of good workability even in summer, the ratio of the viscosity to the initial viscosity after 6 hours at 25 ° C. after preparation of the composition is a certain value or less (for example, 2 or less). An object is to provide a composition. Furthermore, in addition to this, from the viewpoint of ensuring the reliability of the product even in winter, the composition is prepared and filled into the adherend, and after 18 hours at 18 ° C., there is no positional displacement from the adherend. An object of the present invention is to provide a thermally conductive composition that can be cured to a degree that is difficult to occur.
  • the property of a thermally conductive composition in which the ratio of the viscosity to the initial viscosity after 6 hours at 25°C is a certain value or less is sometimes simply referred to as "low viscosity maintenance ability”.
  • the property of a thermally conductive composition that can be cured to such an extent that displacement from the adherend hardly occurs after 18 hours at 18° C. is sometimes simply referred to as “time-dependent curability”.
  • the present inventors have found (A) an organopolysiloxane having at least two alkenyl groups, (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups, and (C) a thermally conductive filler. and (D) in the thermally conductive composition containing the reaction rate control material, by setting the viscosity at 25 ° C. and the storage modulus at 35 ° C. after 3600 seconds and 7200 seconds after the start of measurement to specific ranges,
  • the inventors have found that the problem can be solved, and completed the following invention. That is, the present invention provides the following [1] to [6].
  • the storage elastic modulus G′1 after 3600 seconds from the start of measurement is 2000 Pa or less.
  • the ratio of the compressive load after standing at 35 ° C. for 1 hour to the initial compressive load is 145% or less, and the compressive load after standing at 18 ° C. for 18 hours against the initial compressive load.
  • the thermally conductive composition according to [1] or [2] above further comprising an alkoxysilane compound.
  • thermoly conductive composition that has good workability and maintains reliability as a product in a relatively wide temperature range.
  • FIG. 1 is a perspective view showing a representative configuration of a battery module according to the present invention
  • FIG. 3 is a perspective view showing a typical configuration of battery cells included in the battery module
  • the thermally conductive composition of the present invention comprises (A) an organopolysiloxane having at least two alkenyl groups, (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups, and (C) a thermally conductive filler. and (D) a storage modulus G′1 after 3600 seconds from the start of measurement, in a measurement using a viscoelasticity measuring device under the conditions of 35° C., shear mode, frequency of 1 Hz, and strain of 10%, including a reaction rate control material. is 2000 Pa or less, the storage elastic modulus G′2 after 7200 seconds from the start of measurement is 4350 Pa or more, and the viscosity measured at 25° C. and a rotation speed of 10 rpm is 220 Pa s or less. .
  • the thermally conductive composition of the present invention has a storage modulus G'1 of 2000 Pa after 3600 seconds from the start of measurement in measurement using a viscoelasticity measuring device under the conditions of 35°C, shear mode, frequency of 1 Hz, and strain of 10%. It is below.
  • the storage modulus G'1 exceeds 2000 Pa, the ability of the thermally conductive composition to maintain a low viscosity is reduced, resulting in poor workability.
  • the storage modulus G'1 is preferably 1800 Pa or less, more preferably 1600 Pa or less. Although the lower limit of the storage elastic modulus G'1 is not particularly limited, it is 100 Pa, for example.
  • the thermally conductive composition of the present invention has a storage elastic modulus G'2 of 4350 Pa after 7200 seconds from the start of measurement in measurement using a viscoelasticity measuring device under the conditions of 35°C, shear mode, frequency of 1 Hz, and strain of 10%. That's it.
  • the storage elastic modulus G'2 is less than 4350 Pa, the time-curing property of the thermally conductive composition deteriorates, making it difficult to ensure reliability as a product.
  • the storage modulus G'2 is preferably 4500 Pa or more, more preferably 5000 Pa or more. Although the upper limit of the storage modulus G'2 is not particularly limited, it is 50000 Pa, for example.
  • These storage elastic moduli G'1 and G'2 can be adjusted by the type and amount of the reaction rate control material contained in the thermally conductive composition. It can be adjusted by the type and amount of reaction-curing silicone as a component, and the type and amount of non-reactive silicone and alkoxysilane compound to be blended as necessary.
  • the thermally conductive composition of the present invention is measured using a viscoelasticity measuring device under the conditions of 35° C., shear mode, frequency of 1 Hz, and strain of 10%. It is preferably 300 Pa or less, more preferably 200 Pa or less, and even more preferably 100 Pa or less.
  • the storage elastic modulus G′0 is set within such a range, the filling property of the thermally conductive composition between the heating element and the radiator is improved.
  • the measurement of a storage elastic modulus is performed immediately after preparation of a heat conductive composition.
  • the thermally conductive composition is a two-liquid type consisting of a first agent and a second agent
  • the first agent and the second agent are mixed to prepare the thermally conductive composition immediately after the preparation.
  • the measurement of the storage modulus is started.
  • the thermally conductive composition of the present invention preferably has a compressive load ratio of 145% or less after standing at 35° C. for 1 hour with respect to the initial compressive load.
  • the ratio of the compressive load after standing at 35° C. for 1 hour to the initial compressive load is more preferably 130% or less, still more preferably 120% or less.
  • the ratio (%) of the compression load (N) after standing at 35°C for 1 hour to the initial compression load (N) is calculated by the following formula: 100 x (compression after 1 hour at 35°C load) / (initial compressive load)
  • the thermally conductive composition of the present invention preferably has a ratio of 820% or more of the compression load after standing at 18° C. for 18 hours to the initial compression load. This improves the curability of the thermally conductive composition and improves the reliability of the product.
  • the ratio of the compressive load after standing at 18° C. for 18 hours to the initial compressive load is more preferably 900% or more, and still more preferably 1000% or more.
  • the ratio (%) of the compression load (N) after standing at 18 ° C. for 18 hours to the initial compression load (N) is calculated by the following formula: 100 ⁇ (compression after 18 hours at 18 ° C. load) / (initial compressive load)
  • Compressive load is measured as follows. Immediately after preparing the thermally conductive composition, 5.75 ⁇ 0.25 g was discharged onto the compression test stage of a universal material testing machine (for example, Strograph manufactured by Toyo Seiki Co., Ltd.), and the discharge was compressed. do the test. When measuring the initial compression load, a compression test is immediately performed on the ejected product. In the case of measuring the compression load after standing at 35°C for 1 hour, the compression test is performed after the discharged product is left at 35°C for 1 hour. When measuring the compression load after standing at 18°C for 18 hours, the compression test is performed after the ejected product is left at 18°C for 18 hours.
  • a universal material testing machine for example, Strograph manufactured by Toyo Seiki Co., Ltd.
  • the discharge was compressed with a 40 mm ⁇ pusher (compression test jig) at a compression speed of 60 mm / min, and the load value was read when the gap between the jigs was compressed to 0.665 mm. is the compressive load.
  • the temperature when performing the compression test is 35 ° C. when measuring the compressive load after standing at 35 ° C. for 1 hour, 18 ° C. when measuring the compressive load after standing at 18 ° C. for 18 hours, and the initial compression
  • the temperature when measuring the load is 22°C.
  • the thermally conductive composition of the present invention has a viscosity of 220 Pa ⁇ s or less measured at 25° C. and a rotation speed of 10 rpm. If the viscosity exceeds 220 Pa ⁇ s, the filling property of the thermally conductive composition between the heating element and the radiator deteriorates. From the viewpoint of enhancing filling properties, the viscosity is preferably 200 Pa ⁇ s or less, more preferably 180 Pa ⁇ s or less.
  • the thermally conductive composition of the present invention comprises (A) an organopolysiloxane having at least two alkenyl groups (hereinafter also referred to as component (A)), and (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups ( (hereinafter also referred to as component (B)).
  • component (A) an organopolysiloxane having at least two alkenyl groups
  • component (B) a hydrogen organopolysiloxane having at least two hydrosilyl groups
  • the (A) component is generally used as a main agent, and the (B) component as a curing agent.
  • Components (A) and (B) react and cure through an addition reaction to form a matrix made of silicone rubber. Since silicone rubber is easily deformed by compression, the thermally conductive member formed from the thermally conductive composition of the present invention can be easily assembled between the heating element and the radiator.
  • Component (A) is not particularly limited as long as it is an organopolysiloxane having at least two alkenyl groups in one molecule.
  • the number of alkenyl groups in one molecule of component (A) is preferably 2-20, more preferably 2-10.
  • alkenyl groups in component (A) include those having 2 to 8 carbon atoms, such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl and octenyl groups.
  • a component may use only 1 type and may use 2 or more types together.
  • Component (B) is not particularly limited as long as it is a hydrogen organopolysiloxane having at least two hydrosilyl groups in one molecule.
  • a hydrosilyl group means a hydrogen atom (SiH group) bonded to a silicon atom.
  • the number of hydrosilyl groups per molecule in component (B) is preferably 2-100, more preferably 2-50.
  • Component may use only 1 type, and can use 2 or more types together.
  • Component (B) preferably contains hydrogen organopolysiloxane (B2) having a hydrosilyl group content of 2 mmol/g or more (hereinafter also referred to as component (B2)).
  • the hydrosilyl group content of component (B2) is preferably 3 mmol/g or more, more preferably 4 mmol/g or more.
  • the content of the component (B2) is the silicone-based When the total amount of the materials is 100 parts by mass, the amount is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 5 parts by mass, and still more preferably 0.3 to 3 parts by mass.
  • the silicone-based material in this specification means a compound having a polysiloxane structure. material.
  • the components (A) and (B) are preferably liquid before curing. Being in a liquid state before curing facilitates high filling of the thermally conductive filler.
  • the term "liquid” refers to a liquid at room temperature (23°C) and 1 atmosphere.
  • the addition reaction of components (A) and (B) is preferably carried out in the presence of an addition reaction catalyst, and the addition reaction catalyst is preferably a platinum catalyst.
  • Non-reactive silicone The thermally conductive composition of the present invention may contain non-reactive silicone in addition to the reaction-curing silicone described above as the silicone material.
  • non-reactive silicone flexibility can be imparted, and the above-described storage elastic moduli G'1 and G'2 can be easily adjusted to desired ranges.
  • non-reactive silicones include straight silicone oils such as dimethyl silicone oil and phenylmethyl silicone oil, main chains having siloxane bonds, side chains bonded to the main chain, or non-reactive organic groups at the ends of the main chain. Introduced, non-reactive modified silicone oil and the like.
  • Non-reactive modified silicone oils include, for example, polyether-modified silicone oils, aralkyl-modified silicone oils, fluoroalkyl-modified silicone oils, long-chain alkyl-modified silicone oils, higher fatty acid ester-modified silicone oils, higher fatty acid amide-modified silicone oils, and phenyl-modified silicone oils.
  • straight silicone oil is preferred as the non-reactive silicone, and among straight silicone oils, dimethyl silicone oil is more preferred.
  • the above non-reactive silicone oils can be used singly or in combination of two or more.
  • the content of the non-reactive silicone is not particularly limited, but is preferably 5 to 60 parts by mass, more preferably 10 to 50 parts by mass, and still more preferably 20 to 60 parts by mass with respect to 100 parts by mass of the silicone-based material. 40 parts by mass.
  • the thermally conductive composition of the present invention contains (C) a thermally conductive filler.
  • C) a thermally conductive filler By containing the thermally conductive filler, the thermal conductivity of the thermally conductive member formed from the thermally conductive composition is improved.
  • Thermally conductive fillers include, for example, metals, metal oxides, metal nitrides, metal hydroxides, carbon materials, oxides other than metals, nitrides, and carbides.
  • the shape of the (C) thermally conductive filler may be spherical or amorphous powder.
  • thermally conductive filler metals such as aluminum, copper, and nickel; metal oxides such as aluminum oxide, magnesium oxide, and zinc oxide represented by alumina; and metal nitrides such as aluminum nitride.
  • Metal hydroxides include aluminum hydroxide.
  • spherical graphite etc. are mentioned as a carbon material.
  • oxides, nitrides, and carbides other than metals include quartz, boron nitride, and silicon carbide.
  • aluminum oxide is preferable from the viewpoint of improving the heat dissipation property of the thermally conductive member, and aluminum hydroxide is preferable when it is desired to improve flame retardancy.
  • Thermally conductive fillers may be used singly or in combination of two or more.
  • the average particle diameter of the thermally conductive filler (C) is preferably 0.1 to 200 ⁇ m, more preferably 0.5 to 100 ⁇ m, even more preferably 1 to 70 ⁇ m.
  • the thermally conductive filler is a combination of a small particle size thermally conductive filler with an average particle size of 0.1 ⁇ m or more and 5 ⁇ m or less and a large particle size thermally conductive filler with an average particle size of more than 5 ⁇ m and 200 ⁇ m or less. preferably.
  • the filling rate can be increased by using thermally conductive fillers with different average particle sizes.
  • the average particle size of the (C) thermally conductive filler can be measured by observing with an electron microscope or the like. More specifically, for example, using an electron microscope or an optical microscope, the particle size of 50 arbitrary (C) thermally conductive fillers is measured, and the average value (arithmetic average value) is taken as the average particle size. can do.
  • the content of the thermally conductive filler is preferably 150 to 3,000 parts by mass, more preferably 200 to 2,000 parts by mass, and still more preferably 300 to 1,000 parts by mass with respect to 100 parts by mass of the silicone-based material. .
  • (C) By setting the content of the thermally conductive filler to the above lower limit or more, a certain thermal conductivity can be imparted to the thermally conductive member. By setting the content of the thermally conductive filler (C) to the above upper limit or less, the thermally conductive filler (C) can be appropriately dispersed in the thermally conductive member. In addition, it is possible to prevent the viscosity of the thermally conductive composition from becoming higher than necessary.
  • the thermally conductive composition of the present invention contains a reaction rate controlling material.
  • the reaction rate control agent is for suppressing the addition reaction between the alkenyl group of component (A) and the hydrosilyl group of component (B), and is generally used in combination with reaction-curing silicone.
  • reaction-curing silicone those that show a constant weight reduction in thermogravimetry as described below can be preferably used.
  • thermogravimetric measurement 50 mg of the reaction rate control material was used as a sample, and the temperature was raised from room temperature (25 ° C.) to 35 ° C. at a heating rate of 4 ° C./min under a nitrogen atmosphere, and then raised at a constant temperature of 35 ° C. Under the condition that the temperature is maintained until 120 minutes have passed since the start of the measurement, W60 -W120 is 0.3 mg or more, where W60 is the weight 60 minutes after the start of measurement and W120 is the weight 120 minutes after the start of measurement. is preferred.
  • the reaction rate controlling material has a certain volatility, so that the thermally conductive composition can be cured from the surface where the reaction rate controlling material volatilizes, and the entire The surface is preferentially cured without increasing the curing speed of the surface. This makes it easier to ensure product reliability.
  • W 60 -W 120 is preferably 1.0 mg or less.
  • a reaction rate control material having a W 60 ⁇ W 120 of 1.0 mg or less has a moderate volatilization rate, so that the thermally conductive composition is suppressed from over-curing, and a certain workability can be secured. .
  • reaction rate controlling material is not particularly limited, it is preferably a reaction rate controlling material having an acetylene site (a reaction rate controlling material having a carbon-carbon triple bond). Moreover, it is preferably a reaction rate controlling material having a silicon atom and an acetylene site. Furthermore, it is more preferable that the reaction rate control material has an electron-withdrawing atom at the ⁇ -position with respect to the acetylene site (acetylene group).
  • Such compounds include, for example, reaction rate control materials in which a hydroxyl group (with an electron-withdrawing oxygen atom at the ⁇ -position) is attached to a carbon or silicon atom to which an acetylene group is attached.
  • the content of the reaction rate controlling material may be appropriately adjusted according to the type of the reaction rate controlling material, but is preferably 0.05 to 3 parts by mass, for example, with respect to 100 parts by mass of the silicone-based material.
  • W 60 ⁇ W 120 is preferably 0.05 to 1 part by mass, more preferably 0.05 to 1 part by mass, based on 100 parts by mass of the silicone-based material. .1 to 0.8 parts by mass is preferably contained. This makes it easier to achieve both low-viscosity retention and curability, and makes it easier to ensure workability and product reliability.
  • the thermally conductive composition of the present invention preferably contains an alkoxysilane compound. Inclusion of the alkoxysilane compound improves the dispersibility of the thermally conductive filler in the composition. Further, by containing an alkoxysilane compound, the storage elastic modulus G'1 can be easily lowered, and workability can be improved.
  • An alkoxysilane compound is a compound having a structure in which 1 to 3 of the 4 bonds of a silicon atom (Si) are bonded to alkoxy groups and the remaining bonds are bonded to organic substituents.
  • alkoxy groups possessed by alkoxysilane compounds include methoxy, ethoxy, propoxy, butoxy, pentoxy, and hexatoxy groups.
  • the alkoxysilane compound may be contained as a dimer in the thermally conductive composition.
  • an alkoxysilane compound having at least one of a methoxy group and an ethoxy group is preferable from the viewpoint of availability.
  • the number of alkoxy groups possessed by the alkoxysilane compound is preferably 2 or 3, more preferably 3, from the viewpoint of compatibility and solubility in the composition.
  • the alkoxysilane compound is preferably at least one selected from trimethoxysilane compounds, triethoxysilane compounds, dimethoxysilane compounds, and diethoxysilane compounds.
  • Examples of the functional group included in the organic substituent of the alkoxysilane compound include an acryloyl group, an alkyl group, a carboxyl group, a vinyl group, a methacrylic group, an aromatic group, an amino group, an isocyanate group, an isocyanurate group, an epoxy group, hydroxyl groups, and mercapto groups.
  • a platinum catalyst as a curing catalyst for the thermally conductive composition, it is preferable to select and use an alkoxysilane compound that hardly affects the curing reaction of the organopolysiloxane.
  • the organic substituent of the alkoxysilane compound should not contain an amino group, an isocyanate group, an isocyanurate group, a hydroxyl group, or a mercapto group. is preferred.
  • the alkoxysilane compound preferably contains an alkylalkoxysilane compound having an alkyl group bonded to a silicon atom, that is, an alkoxysilane compound having an alkyl group as an organic substituent. Therefore, a dialkyldialkoxysilane compound and an alkyltrialkoxysilane compound are preferable, and an alkyltrialkoxysilane compound is particularly preferable.
  • the number of carbon atoms in the alkyl group bonded to the silicon atom is preferably 1-16, for example.
  • the alkyl group preferably has 6 or more carbon atoms, more preferably 8 or more carbon atoms, and 12 carbon atoms. It is preferably 10 or less, more preferably 10 or less.
  • dialkoxysilane compounds such as dimethoxysilane compounds and triethoxysilane compounds
  • the number of carbon atoms in the alkyl group may be 1 or more, preferably 10 or less, more preferably 6 or less, and 4 More preferred are:
  • alkyl group-containing alkoxysilane compounds include methyltrimethoxysilane, dimethyldimethoxysilane, diethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, Di-n-propyldimethoxysilane, di-n-propyldiethoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane , methylcyclohexyldimethoxysilane, methylcyclohexyldiethoxysilane, n-octyltri
  • n-decyltrimethoxysilane, dimethyldimethoxysilane, and n-octyltriethoxysilane are preferred, and n-decyltrimethoxysilane is more preferred, from the viewpoint of improving workability.
  • the content of the alkoxysilane compound is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, based on 100 parts by mass of the silicone-based material. It is more preferably 1 to 3 parts by mass.
  • the content of the alkoxysilane compound is at least these lower limit values, the viscosity can be easily lowered, and the workability is improved.
  • the content of the alkoxysilane compound is below these upper limits, the amount of volatile components remaining after curing does not become excessively large, so changes in the physical properties of the cured product over time can be reduced.
  • the thermally conductive composition of the present invention preferably contains a thixotropic agent.
  • a thixotropy-imparting agent By containing a thixotropy-imparting agent, even if the thermally conductive composition has a high viscosity during storage, the viscosity can be reduced by stirring during use. become.
  • the thixotropy-imparting agent inorganic thixotropy-imparting agents such as fumed silica, calcium carbonate and alumina, and organic thixotropy-imparting agents such as hydrogenated castor oil and stearamide can be used.
  • inorganic thixotropic agents are preferable, and fumed silica or alumina is particularly preferable.
  • the inorganic thixotropic agent is preferably a hydrophobic inorganic thixotropic agent surface-treated with a silane coupling agent or the like, more preferably a surface-treated hydrophobic fumed silica or a surface-treated hydrophobic alumina.
  • the content of the thixotropic agent is preferably 0.5 to 10 parts by mass, more preferably 1 to 5 parts by mass, based on 100 parts by mass of the silicone-based material.
  • the content of the thixotropic agent is at least these lower limits, precipitation of the thermally conductive filler is suppressed, and the storage stability of the thermally conductive composition is improved.
  • the content of the thixotropy-imparting agent is at most these upper limits, the fillability and coatability of the thermally conductive composition are improved.
  • additives can be contained in the thermally conductive composition of the present invention.
  • additives include catalysts, dispersants, flame retardants, plasticizers, antioxidants, colorants and the like.
  • the form of the thermally conductive composition of the present invention may be a one-pack type or a two-pack type consisting of a combination of a first agent and a second agent, but the two-pack type is preferred from the viewpoint of storage stability.
  • the mass ratio of the first agent to the second agent is preferably 1 or a value close to 1, specifically 0.1. 9 to 1.1 are preferred, and 0.95 to 1.05 are more preferred.
  • the viscosity ratio between the first agent and the second agent is also preferably 1 or a value close to 1. Specifically, 0.5 to 2.0 is preferred, and 0.8 to 1.2 is more preferred.
  • the two-part type thermally conductive composition comprises (A) an organopolysiloxane having at least two alkenyl groups (component A) (main agent), and the second agent (B ) containing a hydrogen organopolysiloxane (component B) (curing agent) having at least two hydrosilyl groups;
  • the addition reaction catalyst is contained in the first part and not contained in the second part.
  • the first part and the second part are excellent in storage stability before mixing, and after mixing, the reaction is accelerated and can be rapidly cured, and the thermally conductive member obtained by curing.
  • Various physical properties can be improved. The reason for this is not clear, but it is presumed that the addition reaction catalyst such as a platinum catalyst is coordinated with the alkenyl group, which is the addition reaction site of the component (A), and the curing proceeds easily.
  • the thermally conductive filler is preferably contained in at least one of the first part and the second part, but is preferably contained in both the first part and the second part.
  • Including the thermally conductive filler in both the first part and the second part makes it easier to mix the first part and the second part.
  • the second agent contains the (A) component. The mass ratio and viscosity It becomes easier to adjust the ratio to 1 or a value close to 1.
  • the first agent should not contain component (B), which is a curing agent.
  • the second component preferably contains (D) a reaction rate controlling agent, and the first component preferably does not contain (D) a reaction rate controlling agent.
  • a thermally conductive member can be formed by curing the thermally conductive composition of the present invention.
  • the hardness of the thermally conductive member (that is, the cured product of the thermally conductive composition) is, for example, 20 to 70 as measured by a JIS K 6253 type E hardness tester (hereinafter referred to as "E hardness").
  • the thermal conductivity of the thermally conductive member (that is, the cured product of the thermally conductive composition) is preferably 1.0 W/m ⁇ K or more, more preferably 1.5 W/m ⁇ K or more. , 2.0 W/m ⁇ K or more. By making it more than these lower limits, thermal conductivity becomes favorable. Therefore, when used as a gap material for battery cell modules, for example, heat generated from the battery cells can be efficiently transferred to the module housing via the gap material. rise can be suppressed. The higher the thermal conductivity of the thermally conductive member, the better.
  • a battery module includes an interstitial material made of a thermally conductive member, a plurality of battery cells, and a module housing for storing the plurality of battery cells, wherein the interstitial material is provided inside the module housing. placed.
  • a gap material made of a thermally conductive member is filled between the battery cells and between the battery cell and the module housing, and the filled gap material adheres to the battery cell and the module housing.
  • the gap material between the battery cells has a function of maintaining the separated state between the battery cells.
  • the gap material between the battery cells and the module housing is in close contact with both the battery cells and the module housing, and has the function of transferring heat generated in the battery cells to the module housing.
  • FIG. 1 shows a specific configuration of the battery module.
  • FIG. 2 shows a specific configuration of each battery cell.
  • a plurality of battery cells 11 are arranged inside the battery module 10 .
  • Each battery cell 11 is laminated and enclosed in a flexible outer film, and the overall shape is a flat body that is thin compared to its height and width.
  • the positive electrode 11a and the negative electrode 11b are exposed to the outside, and the central portion 11c of the flat surface is formed thicker than the crimped end portions 11d.
  • each battery cell 11 is arranged such that its flat surfaces face each other.
  • the interstitial material 13 is not filled so as to cover the entire plurality of battery cells 11 stored inside the module housing 12 .
  • the interstitial material 13 is filled so as to fill the interstices present in a portion (bottom side portion) inside the module housing 12 .
  • the gap material 13 is filled between the battery cells 11 and between the battery cells 11 and the module housing 12 , and is in close contact with the surface of the battery cells 11 and the inner surface of the module housing 12 in this portion.
  • the interstitial material 13 filled between the battery cells 11 is adhered to the surfaces of both battery cells 11, and the interstitial material 13 itself has the hardness described above, so that it has appropriate elasticity and flexibility. Therefore, even if an external force displacing the interval between the battery cells 11 is applied, strain deformation due to the external force can be alleviated. Therefore, the gap material 13 has a function of keeping the battery cells 11 separated from each other.
  • a gap material 13 filling a gap between the battery cell 11 and the inner surface of the module housing 12 is also tightly adhered to the surface of the battery cell 11 and the inner surface of the module housing 12 .
  • the heat generated inside the battery cell 11 passes through the interstitial material 13 adhered to the surface of the battery cell 11 and passes through the module housing 12 which is in close contact with the other surface of the interstitial material 13 . communicated internally.
  • the gap material 13 is formed in the battery module 10 by filling and applying a liquid thermally conductive composition using a general dispenser, and then curing the liquid thermally conductive composition. Good.
  • the thermally conductive composition of the present invention has excellent low-viscosity retention properties and time-dependent curability. will be highly reliable as a product.
  • a two-liquid type thermally conductive composition as described above.
  • the two-liquid type is easy to store, and if it is mixed immediately before use, it is difficult to harden during the work of applying with a dispenser, and can be quickly hardened after application.
  • Application by a dispenser is also preferable in that the liquid thermally conductive composition can be filled relatively deep inside the housing 12 of the battery module 10 .
  • the gap material 13 covering the battery cells 11 preferably covers 20 to 40% of each battery cell 11 on one side of the battery cell 11 . By making it 20% or more, the battery cells 11 can be stably held. In addition, by sufficiently covering the battery cells that generate a large amount of heat, heat radiation efficiency is improved. On the other hand, by making it 40% or less, heat generated from the battery cells 11 can be efficiently radiated, and an increase in weight and deterioration of workability can be prevented. In order to improve heat radiation efficiency, it is preferable to cover the side of the battery cell 11 on which the electrodes 11a and 11b are located with the gap material 13, and it is more preferable to cover the entire electrodes 11a and 11b with the gap material 13. As described above, the battery module 10 can release heat generated from the battery cells 11 to the module housing 12 via the gap material 13 .
  • the interstitial material 13 is also preferably used in a battery pack having a plurality of battery modules 10 inside.
  • a battery pack generally includes a plurality of battery modules 10 and a battery pack housing that accommodates the plurality of battery modules 10 .
  • a gap material 13 can be provided between the battery module 10 and the housing of the battery pack.
  • a storage elastic modulus G'0 after seconds, a storage elastic modulus G'1 after 3600 seconds from the start of measurement, and a storage elastic modulus G'2 after 7200 seconds from the start of measurement were measured. Since the sample started to harden immediately after ejection, the time from ejection to the start of measurement was 30 seconds.
  • the compression load after standing at 18°C for 18 hours was obtained by performing a compression test after allowing the ejected product to stand at 18°C for 18 hours.
  • the discharge was compressed with a 40 mm ⁇ pusher (compression test jig) at a compression speed of 60 mm / min, and the load value was read when the gap between the jigs was compressed to 0.665 mm. was taken as the compressive load.
  • the temperature when performing the compression test is 35 ° C. when measuring the compressive load after standing at 35 ° C. for 1 hour, 18 ° C. when measuring the compressive load after standing at 18 ° C. for 18 hours, and the initial compression
  • the temperature when measuring the load is 22°C.
  • the first part and the second part were filled in two-liquid parallel cartridges of 50 cc each, allowed to stand still for 24 hours, and then released from a PET film (SG2 manufactured by Panac Co., Ltd.) subjected to release treatment with silicone using a static mixer.
  • a small amount of a sample (a thermally conductive composition that is a mixture of the first agent and the second agent (mass ratio: 1:1)) was discharged onto the treated surface.
  • Another PET film (SG2 manufactured by Panac Co.) was placed on the sample so that the release surface was in contact with the sample, and the sample was flattened and fixed so that the thickness of the sample was uniformly 2 mm.
  • a first agent and a second agent were prepared as follows, and the various evaluations described above were performed.
  • First agent (A) first liquid containing organopolysiloxane having at least two alkenyl groups and a trace amount of addition reaction catalyst (platinum catalyst), dimethylpolysiloxane (dimethylsilicone oil), n-decyltrimethoxysilane, thermally conductive filler , and a thixotropy-imparting agent were adjusted according to the formulation shown in Table 1 to obtain a first agent.
  • platinum catalyst platinum catalyst
  • dimethylpolysiloxane dimethylsilicone oil
  • n-decyltrimethoxysilane thermally conductive filler
  • a thixotropy-imparting agent were adjusted according to the formulation shown in Table 1 to obtain a first agent.
  • (Second agent) Second liquid containing (A) organopolysiloxane having at least two alkenyl groups and (B1) hydrogen organopolysiloxane having at least two hydrosilyl groups (hydrosilyl group content of 1 mmol/g or less), (B2) hydrosilyl groups
  • Table 1 shows hydrogen organopolysiloxane, dimethylpolysiloxane (dimethylsilicone oil), n-decyltrimethoxysilane, reaction rate controller, thermally conductive filler, and thixotropic agent with a content of 4 mmol/g.
  • a second agent was prepared by adjusting the composition.
  • As the reaction rate control material a reaction rate control material having silicon atoms and acetylene sites was used. W 60 -W 120 in thermogravimetric measurement of the reaction rate control material was 0.49 mg.
  • the thermally conductive composition of each example having a storage elastic modulus G′1 of 2000 Pa or less and a storage elastic modulus G′2 of 4350 Pa or more showed both the results of a test for curability and a test for confirming workability. It was found that the workability was good and the reliability as a product could be maintained over a wide temperature range. On the other hand, the thermally conductive compositions of Comparative Examples 1 and 2, which did not satisfy the requirement that the storage elastic modulus G′1 be 2000 Pa or less, gave poor results in the workability test. Moreover, it was found that Comparative Examples 3 to 5, which did not satisfy the requirement that the storage elastic modulus G'2 was 4350 Pa or more, gave poor results in the test regarding curability, and the reliability as a product deteriorated.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Algebra (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
PCT/JP2022/014659 2021-03-31 2022-03-25 熱伝導性組成物、熱伝導性部材、バッテリモジュール Ceased WO2022210422A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020237030994A KR20230161957A (ko) 2021-03-31 2022-03-25 열전도성 조성물, 열전도성 부재, 배터리 모듈
EP22780635.3A EP4317322A4 (en) 2021-03-31 2022-03-25 Heat-conductive composition, heat-conductive member, and battery module
JP2023511202A JPWO2022210422A1 (https=) 2021-03-31 2022-03-25
US18/282,650 US20240250333A1 (en) 2021-03-31 2022-03-25 Heat-conductive composition, heat-conductive member, and battery module
CN202280021460.5A CN116981739A (zh) 2021-03-31 2022-03-25 导热性组合物、导热性构件、电池模块

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-061809 2021-03-31
JP2021061809 2021-03-31

Publications (1)

Publication Number Publication Date
WO2022210422A1 true WO2022210422A1 (ja) 2022-10-06

Family

ID=83456242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/014659 Ceased WO2022210422A1 (ja) 2021-03-31 2022-03-25 熱伝導性組成物、熱伝導性部材、バッテリモジュール

Country Status (6)

Country Link
US (1) US20240250333A1 (https=)
EP (1) EP4317322A4 (https=)
JP (1) JPWO2022210422A1 (https=)
KR (1) KR20230161957A (https=)
CN (1) CN116981739A (https=)
WO (1) WO2022210422A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250165499A (ko) * 2024-05-17 2025-11-26 동우 화인켐 주식회사 포팅 조성물

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206733A (ja) * 2004-01-23 2005-08-04 Shin Etsu Chem Co Ltd 熱伝導性シリコーン放熱用組成物及びその使用方法
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2010144130A (ja) * 2008-12-22 2010-07-01 Taika:Kk 硬化性オルガノポリシロキサン組成物
JP2015004043A (ja) * 2013-05-24 2015-01-08 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2015059191A (ja) * 2013-09-20 2015-03-30 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
JP2015212318A (ja) * 2014-05-01 2015-11-26 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2018027997A (ja) * 2016-08-16 2018-02-22 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法
WO2018079215A1 (ja) * 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 １液硬化型熱伝導性シリコーングリース組成物及び電子・電装部品
WO2020213306A1 (ja) * 2019-04-15 2020-10-22 積水ポリマテック株式会社 熱伝導性組成物、熱伝導性部材、バッテリモジュール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103756327A (zh) * 2013-11-07 2014-04-30 杭州硅畅科技有限公司 一种导热硅橡胶电子灌封胶及其制备方法与应用
CN110431710B (zh) 2017-03-22 2023-04-04 积水保力马科技株式会社 电池模块及电池组
WO2019021826A1 (ja) * 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
CN115411404A (zh) * 2018-03-07 2022-11-29 Sk新能源株式会社 电池模块及其制造方法
EP3992252A4 (en) * 2019-06-26 2023-07-19 Sekisui Polymatech Co., Ltd. PACKAGING FOR THERMAL CONDUCTIVE COMPOSITION AND TWO COMPONENT CURING THERMAL COMPOSITION

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206733A (ja) * 2004-01-23 2005-08-04 Shin Etsu Chem Co Ltd 熱伝導性シリコーン放熱用組成物及びその使用方法
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2010144130A (ja) * 2008-12-22 2010-07-01 Taika:Kk 硬化性オルガノポリシロキサン組成物
JP2015004043A (ja) * 2013-05-24 2015-01-08 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2015059191A (ja) * 2013-09-20 2015-03-30 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
JP2015212318A (ja) * 2014-05-01 2015-11-26 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2018027997A (ja) * 2016-08-16 2018-02-22 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法
WO2018079215A1 (ja) * 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 １液硬化型熱伝導性シリコーングリース組成物及び電子・電装部品
WO2020213306A1 (ja) * 2019-04-15 2020-10-22 積水ポリマテック株式会社 熱伝導性組成物、熱伝導性部材、バッテリモジュール

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4317322A4 *

Also Published As

Publication number Publication date
EP4317322A1 (en) 2024-02-07
JPWO2022210422A1 (https=) 2022-10-06
EP4317322A4 (en) 2025-04-23
US20240250333A1 (en) 2024-07-25
KR20230161957A (ko) 2023-11-28
CN116981739A (zh) 2023-10-31

Similar Documents

Publication Publication Date Title
TWI736699B (zh) 熱傳導性矽氧組合物、半導體裝置及半導體裝置的製造方法
KR102176435B1 (ko) 열전도성 실리콘 조성물
JP5155033B2 (ja) 熱伝導性シリコーン組成物
KR20160006689A (ko) 열전도성 실리콘 조성물 및 그 경화물
KR20170040107A (ko) 열전도성 실리콘 조성물 및 반도체 장치
WO2020203299A1 (ja) 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
JP7179398B1 (ja) 熱伝導性組成物、熱伝導性部材、バッテリモジュール
JP2020002236A (ja) 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法
JP7227676B1 (ja) 熱伝導性組成物及び熱伝導性部材
CN109196052B (zh) 导热部件、导热组合物及导热组合物的制造方法
JP7370120B2 (ja) 熱伝導性組成物、及び熱伝導性部材
WO2022230600A1 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2022180701A (ja) 熱伝導性シリコーン組成物及びその硬化物
JPWO2019159753A1 (ja) 熱伝導性湿気硬化型樹脂組成物およびその硬化物
WO2020213306A1 (ja) 熱伝導性組成物、熱伝導性部材、バッテリモジュール
WO2022210422A1 (ja) 熱伝導性組成物、熱伝導性部材、バッテリモジュール
WO2023182459A1 (ja) 熱伝導性組成物、２液硬化型熱伝導性材料、熱伝導性組成物の供給形態、熱伝導性部材、バッテリモジュール、及び熱伝導性組成物の供給形態の製造方法
CN115991936A (zh) 导热性有机硅组合物
JP2018076423A (ja) 熱伝導性シリコーン組成物及びその硬化物、ならびに電子装置及びその製造方法
WO2023054538A1 (ja) 熱伝導性組成物及び熱伝導性部材
US20250026933A1 (en) A polysiloxane composition
US20250304790A1 (en) Thermally conductive composition and thermally conductive member
WO2023120514A1 (ja) 熱伝導性組成物、及び熱伝導性部材
JP2025146817A (ja) 熱伝導性樹脂組成物
US20250376611A1 (en) Silicone composition, heat dissipating member, and electronic apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22780635

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023511202

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 202280021460.5

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 18282650

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2022780635

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2022780635

Country of ref document: EP

Effective date: 20231031

NENP Non-entry into the national phase

Ref country code: DE