WO2022210306A1 - 焼成鉛筆芯 - Google Patents
焼成鉛筆芯 Download PDFInfo
- Publication number
- WO2022210306A1 WO2022210306A1 PCT/JP2022/014179 JP2022014179W WO2022210306A1 WO 2022210306 A1 WO2022210306 A1 WO 2022210306A1 JP 2022014179 W JP2022014179 W JP 2022014179W WO 2022210306 A1 WO2022210306 A1 WO 2022210306A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyether
- pencil lead
- modified silicone
- weight
- organic binder
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 83
- 239000000203 mixture Substances 0.000 claims abstract description 45
- 239000004606 Fillers/Extenders Substances 0.000 claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims description 67
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000004898 kneading Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 36
- 238000005452 bending Methods 0.000 description 31
- 239000000945 filler Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 229910002804 graphite Inorganic materials 0.000 description 14
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 239000010439 graphite Substances 0.000 description 13
- 229910052582 BN Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000010304 firing Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 239000000377 silicon dioxide Substances 0.000 description 12
- 239000013523 DOWSIL™ Substances 0.000 description 11
- 229920013731 Dowsil Polymers 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 239000003921 oil Substances 0.000 description 8
- 150000003377 silicon compounds Chemical class 0.000 description 7
- 239000010455 vermiculite Substances 0.000 description 7
- 229910052902 vermiculite Inorganic materials 0.000 description 7
- 235000019354 vermiculite Nutrition 0.000 description 7
- 229910002012 Aerosil® Inorganic materials 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- -1 silicon organic compound Chemical class 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 239000003610 charcoal Substances 0.000 description 5
- 239000004927 clay Substances 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 5
- 230000002209 hydrophobic effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- PRAKJMSDJKAYCZ-UHFFFAOYSA-N squalane Chemical compound CC(C)CCCC(C)CCCC(C)CCCCC(C)CCCC(C)CCCC(C)C PRAKJMSDJKAYCZ-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 230000001050 lubricating effect Effects 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- NKAADCIRFJPCOM-UHFFFAOYSA-N 125756-69-6 Chemical compound O1[Si](O[Si](O[Si](C)C)(O2)O[Si](O[Si](C)C)(O3)O4)(O[Si](C)C)O[Si]4(O[Si](C)C)O[Si]4(O[Si](C)C)O[Si]1(O[Si](C)C)O[Si]2(O[Si](C)C)O[Si]3(O[Si](C)C)O4 NKAADCIRFJPCOM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- JPNZKPRONVOMLL-UHFFFAOYSA-N azane;octadecanoic acid Chemical class [NH4+].CCCCCCCCCCCCCCCCCC([O-])=O JPNZKPRONVOMLL-UHFFFAOYSA-N 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 239000002734 clay mineral Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000007849 furan resin Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 229940057995 liquid paraffin Drugs 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- JXTPJDDICSTXJX-UHFFFAOYSA-N n-Triacontane Natural products CCCCCCCCCCCCCCCCCCCCCCCCCCCCCC JXTPJDDICSTXJX-UHFFFAOYSA-N 0.000 description 2
- 229910021382 natural graphite Inorganic materials 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229940032094 squalane Drugs 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 244000215068 Acacia senegal Species 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 241000416162 Astragalus gummifer Species 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 239000004801 Chlorinated PVC Substances 0.000 description 1
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 206010042674 Swelling Diseases 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001615 Tragacanth Polymers 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000012648 alternating copolymerization Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011852 carbon nanoparticle Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052617 clay minerals group Inorganic materials 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- ZWCNRMDCQDJIRL-UHFFFAOYSA-N octavinyloctasilasesquioxane Chemical compound O1[Si](O[Si](O2)(O[Si](O3)(O4)C=C)C=C)(C=C)O[Si]4(C=C)O[Si]4(C=C)O[Si]1(C=C)O[Si]2(C=C)O[Si]3(C=C)O4 ZWCNRMDCQDJIRL-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D13/00—Pencil-leads; Crayon compositions; Chalk compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43K—IMPLEMENTS FOR WRITING OR DRAWING
- B43K19/00—Non-propelling pencils; Styles; Crayons; Chalks
- B43K19/16—Making non-propelling pencils
- B43K19/18—Making pencil writing-cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43K—IMPLEMENTS FOR WRITING OR DRAWING
- B43K19/00—Non-propelling pencils; Styles; Crayons; Chalks
- B43K19/02—Pencils with graphite; Coloured pencils
Definitions
- the present disclosure relates to a baked pencil lead containing at least an extender and an organic binder.
- baked pencil cores include fillers such as graphite and boron nitride, vinyl chloride resin, vinylidene chloride resin, vinyl acetate resin, chlorinated polyethylene, polyvinyl alcohol, acrylamide resin, chlorinated paraffin resin, phenolic resin, furan resin, Organic binders such as urea resin and butyl rubber, clay binders such as bentonite and kaolin clay, plasticizers such as phthalates, solvents such as methyl ethyl ketone and water, stabilizers such as stearates, lubricants such as stearic acid, Materials such as fillers such as carbon black are mixed, dispersed, and kneaded, extruded into thin wires, and then heat-treated to the firing temperature. Baked pencil leads impregnated with oils such as oils, squalane, ⁇ -olefin oligomers, and waxes are known.
- oils such as oils, squalane, ⁇ -olefin
- a baked pencil lead exhibiting effects such as improvement in bending strength and suppression of appearance defects, and a method for producing the same are disclosed. Further, a technique of impregnating the pores of the heat-treated core with a lubricating component has been disclosed in order to obtain a smooth writing feel as a function of the fired pencil lead.
- Patent Document 1 a fired pencil lead with high bending strength is produced by firing under a specific temperature and atmosphere using a silicon oxide and/or a silicon organic compound as a compounding material for the fired pencil lead. A method is disclosed. Further, Patent Document 2 describes a method for producing a fired pencil lead that has an excellent balance between bending strength and writing line density without causing poor appearance by using hydrophobic amorphous silica as a compounding material of the fired pencil lead. is disclosed. In Patent Document 3, by using silsesquioxane as a compounding material of the baked pencil lead, the fired pencil lead exhibits higher bending strength and darker handwriting than Patent Document 2 without causing a defective appearance of the baked pencil lead. is disclosed.
- Patent Document 4 carbon nanoparticles and silicon oxide ceramic nanoparticles dispersed in an oil impregnated in the core after heat treatment, rather than as a compounding material of the fired pencil lead, have a bearing effect during writing.
- a method for producing a fired pencil lead that exhibits a smooth writing feel is disclosed.
- JP-A-63-35672 Japanese Patent Application Laid-Open No. 2004-175900 JP 2011-68796 A International publication WO2010/123070
- the silicon oxide and/or organic compound of silicon disclosed in Patent Document 1 has no affinity with the organic binder, and plays a role of binding the filler to the filler independently of the resin carbide.
- heat treatment at the firing temperature improves the strength of the core, it is difficult to achieve uniform dispersion, and the bonding portion with the filler is coarse and dense, so the improvement in bending strength is insufficient. It was a certain writing taste.
- Patent Documents 2 and 3 the concentration of the writing line is maintained and the bending strength is increased by using a silicon compound having a surface treatment and a molecular structure that can improve the dispersion uniformity of the organic binder.
- the bending strength improved, the writing feeling worsened, and it was not possible to obtain a smooth writing feeling without sticking.
- a fired pencil lead is obtained by firing a mixture containing an extender, an organic binder, and a polyether-modified silicone.
- the baked pencil lead is obtained by blending at least an extender, an organic binder, and a polyether-modified silicone, kneading, extruding, and heat-treating to a baking temperature.
- the content of the polyether-modified silicone in the mixture is 0.5% by weight or more and 3% by weight or less with respect to the content of the organic binder in the mixture.
- the polyether-modified silicone is a polyether-modified silicone having a molecular structure with a branched silicone chain as a main chain.
- the kinematic viscosity at 25° C. of the polyether-modified silicone is 100 mm 2 /s or more and 10000 mm 2 /s or less.
- a method for producing a fired pencil lead comprises: mixing at least an extender, an organic binder and a polyether-modified silicone to obtain a mixture; a step of molding the mixture to obtain a molded body; a step of sintering the molded body to obtain a sintered pencil lead; Prepare.
- a fired pencil lead that is capable of improving bending strength and maintaining the density of writing lines, and that has a smooth writing feel.
- a fired pencil lead is obtained by firing a mixture containing an extender, an organic binder, and a polyether-modified silicone.
- the fired pencil lead is obtained by kneading a mixture containing an extender, an organic binder, and a polyether-modified silicone, extruding the mixture, and heat-treating the molded body to a firing temperature.
- a method for producing a baked pencil lead includes the steps of mixing at least an extender, an organic binder, and a polyether-modified silicone to obtain a mixture; and firing the compact to obtain a fired pencil lead; Prepare.
- Polyether-modified silicone is a compound in which at least some of the methyl groups of dimethylpolysiloxane are substituted with polyoxyalkylene groups.
- an adsorption layer is formed in which the polyether-modified silicone is adsorbed to the organic binder.
- the siloxane bond of the polyether-modified silicone adsorption layer is considered to become a compound such as oxide or carbide of silicon as a film of resin carbide.
- the carbonized resin on which the film is formed has a higher strength than the case where the film is not formed, and thus the bending strength is improved.
- Typical examples of the classification of polyether-modified silicones are the side-chain type in which a polyoxyalkylene group is introduced into the side chain of the silicone chain that serves as the main chain, and the side-chain type in which a polyoxyalkylene group is introduced into one end of the silicone chain.
- the side chain type is classified into a straight chain type and a branched type according to the molecular structure of the main chain.
- the polyoxyalkylene group those containing at least a polyoxyethylene group and/or a polyoxypropylene group are more preferable because they have a high bending strength and a small writing resistance value.
- the kinematic viscosity of the polyether-modified silicone at 25° C. is 100 mm 2 /s or more and 10,000 mm 2 /s or less, it becomes easier to disperse in the organic binder during kneading and improves uniformity. Detachment from the organic binder due to low viscosity can be effectively suppressed.
- the kinematic viscosity described above is particularly preferably 500 mm 2 /s or more and 4500 mm 2 /s or less.
- the ratio of the content of the polyether-modified silicone in the mixture to the content of the organic binder in the mixture is preferably 0.5% by weight or more and 3% by weight or less.
- the content is sufficient to form a coating, and the thickness of the coating is appropriate so that the fired pencil lead is easily worn during writing. It is possible to obtain a baked pencil lead with an excellent balance between bending strength and writing line density. More preferably, the aforementioned proportion is 0.8% by weight or more and 2% by weight or less.
- n-type polyether-modified silicone examples include DOWSIL FZ-2203 (kinematic viscosity at 25° C.: 4100 mm 2 /s) and DOWSIL FZ-2222 (kinematic viscosity at 25° C.: 20000 mm 2 ) manufactured by Dow Toray Industries, Inc.
- DOWSIL FZ-2233 kinematic viscosity at 25 ° C.: 5000 mm 2 / s
- Silsoft 860 manufactured by Momentive Performance Materials Japan LLC kinematic viscosity at 25 ° C.: 170 mm 2 / s
- Silsoft 870 25 kinematic viscosity at °C: 220 mm 2 /s
- Silsoft 900 kinematic viscosity at 25 °C: 250 mm 2 /s.
- Linear polyether-modified silicones include KF-351A (kinematic viscosity at 25°C: 70 mm 2 /s) and KF-352A (kinematic viscosity at 25°C: 1600 mm 2 /s) manufactured by Shin-Etsu Chemical Co., Ltd.
- KF-353 Kerman viscosity at 25°C: 430 mm 2 /s
- KF-354L Kinematic viscosity at 25°C: 200 mm 2 /s
- KF-355A Kinematic viscosity at 25°C: 150 mm 2 /s
- KF- 615A Kinematic viscosity at 25°C: 920 mm 2 /s
- KF-945 Kinematic viscosity at 25°C: 130 mm 2 /s
- KF-640 Kematic viscosity at 25°C: 20 mm 2 /s
- KF-642 Kinematic viscosity at 25°C: 50 mm 2 /s
- KF-643 Kinematic viscosity at 25°C: 19 mm 2 /s
- KF-644 Kinematic viscosity at 25°C: 38 mm 2 /s
- KF-6020 25°C Kinematic viscosity at 180 mm 2 / s
- KF-6011P Kinematic viscosity at 25°C: 140 mm 2 /s
- KF-6012 Kinematic viscosity at 25°C: 1600 mm 2 /s
- KF-6015 Kinematic viscosity at 25°C Viscosity: 150 mm 2 /s
- KF-6017 Kinematic viscosity at 25°C: 600 mm 2 /s
- KF-6017P Kinematic viscosity at 25°C: 850 mm 2 /s
- KF-6043 Kinematic viscosity at 25°C: 400 mm 2 /s
- KF-6048 co-modified with alkyl group, kinematic viscosity at 25°C: 2700 mm 2 /s
- X-22-2516 co-modified with alkyl group and aralkyl group, kinematic viscosity at 25°C : 70 mm 2
- KF-1002 co-modified with epoxy group, kinematic viscosity at 25 ° C.: 4500 mm 2 / s
- DOWSIL ES-5612 Formulation Aid manufactured by Dow Toray Industries, Inc. (at 25 ° C.
- branched polyether-modified silicone examples include KF-6028 (kinematic viscosity at 25° C.: 900 mm 2 /s) and KF-6028P (kinematic viscosity at 25° C.: 900 mm 2 /s) manufactured by Shin-Etsu Chemical Co., Ltd., KF -6038 (co-modified with an alkyl group, kinematic viscosity at 25°C: 700 mm 2 /s).
- branched polyether-modified silicones particularly KF-6028 or KF-6028P
- the branched type weakens the intermolecular interaction between the polyether-modified silicones, making it easier to obtain uniformity during kneading and to form a highly smooth coating.
- a fired pencil lead that does not cause catching during writing, has significantly reduced friction during writing compared to conventional fired pencil leads, and exhibits a smooth writing feel.
- the polyether-modified silicone may be used alone or in combination of two or more. It can also be used in combination with other silicone compounds. Examples include, but are not limited to, dimethylpolysiloxane, polyglycerin-modified silicone, amino-modified silicone, and methylphenyl-modified silicone.
- filler materials include graphite, boron nitride, mica, and talc.
- graphite both natural graphite and artificial graphite can be used, but it is preferable to use natural graphite, which has well-developed crystals and good cleavability.
- flake graphite is more preferably used. Graphite flakes have developed crystals, and the developed crystals are laminated to have a high aspect ratio and a smooth surface. Therefore, flake graphite can be oriented in the direction of extrusion to improve the bending strength of the core when the core is formed into a thin wire by extrusion molding. Taste and high writing line density can be obtained.
- Boron nitride includes hexagonal boron nitride (h-BN).
- h-BN hexagonal boron nitride
- a crystal is developed in which boron atoms and nitrogen atoms alternately bear the vertices of a regular hexagon, and the crystals are stacked in many layers to form a single particle of hexagonal boron nitride (h-BN). Therefore, hexagonal boron nitride (h-BN) particles have a plate-like shape like graphite.
- hexagonal boron nitride (h-BN) is highly lubricating. From such properties, hexagonal boron nitride (h-BN) is suitable as a material for fired pencil leads like graphite, and a fired pencil lead obtained using hexagonal boron nitride (h-BN). has high bending strength and density of writing lines.
- Denka Boron Nitride SGP Denka Boron Nitride GP
- Denka Boron Nitride HGP Denka Boron Nitride SP-2 manufactured by Denka Co., Ltd.
- SHP-3 manufactured by Mizushima Ferroalloy Co., Ltd.
- SHP-5, SHP-7 HP-1, HP-2, HP-4W, HP-6, HP-60, HP-P1, FS-1 and the like.
- Organic binders include polyvinyl chloride, polyvinylidene chloride, chlorinated polyvinyl chloride, chlorinated polyethylene, chlorinated paraffin, furan resin, polyvinyl alcohol, polystyrene, polymethyl methacrylate, urea resin, melamine resin, polyester, styrene.
- Synthetic resins such as butadiene copolymer, polyvinyl acetate, polyacrylamide, and butyl rubber, and natural resins such as lignin, cellulose, gum tragacanth, and gum arabic. These organic binders may be used singly or in combination of two or more.
- thermoplastic resins such as polyvinyl chloride are preferable because they are highly processable, inexpensive, and stable in supply.
- polyvinyl chloride TH series, TU series, TE series, TG series manufactured by Taiyo Vinyl Co., Ltd., Kanevinyl S series, Kanevinyl KS series, Kanevinyl K series, Kanevinyl M series manufactured by Kaneka Corporation. , Kanevinyl HM series, Tosoh Co., Ltd. ryuron paste, and Shin-Daiichi Vinyl Co., Ltd. ZEST series.
- the fired pencil lead is made by firing a mixture containing an extender, an organic binder, and a polyether-modified silicone, as well as other materials such as a clay binder and/or various additives. It may be obtained.
- clay binders include bentonite and kaolin clay.
- Plasticizers include dioctyl phthalate (DOP), dibutyl phthalate (DBP), dioctyl adipate, diallyl isophthalate, tricresyl phosphate, dioctyl adipate, and the like.
- solvents include ketones such as methyl ethyl ketone and acetone, alcohols such as ethanol, and water.
- Stabilizers include stearates, organotins, barium-zincs, calcium-zincs, and the like.
- Lubricants include fatty acids such as stearic acid and behenic acid, and fatty acid amides.
- Fillers include metals such as iron, aluminum, titanium, and zinc, their alloys, oxides and nitrides of these metals and alloys, silicon oxides such as silicon dioxide (silica) and silsesquioxane, and carbon black. , and fullerenes. These fillers can be appropriately used in shapes such as spherical, amorphous granular, needle-like, fibrous and plate-like. Moreover, you may combine 1 type(s) or 2 or more types. Among these, plate-like particles are preferable because they are arranged in the core in the same manner as graphite in the extrusion direction during extrusion molding. Examples include plate-like silica and plate-like alumina.
- Examples of plate-like silica include amorphous cleaved plate-like silica obtained by subjecting vermiculite to swelling treatment, followed by acid treatment, washing with water, drying, pulverization and classification.
- Vermiculite is a mineral mainly composed of hydromica classified as vermiculite group clay minerals or mica group clay minerals, and is also called vermiculite.
- the chemical composition of vermiculite varies depending on the place of production, etc., but the typical composition is as follows.
- this plate-like silica (amorphous cleavable plate-like silica) are bonded by hydrogen bonding due to hydroxyl groups, the plate-like silica can be easily cleaved only by applying a light shearing force.
- the layer structure of the plate-like silica (amorphous cleaved plate-like silica) does not change even if it is heat-treated up to 1100° C., it can be suitably used as a fired pencil lead.
- Commercially available products include Silleaf manufactured by Mizusawa Chemical Industry Co., Ltd.
- Examples of plate-like alumina include ⁇ -Al 2 O 3 , ⁇ -Al 2 O 3 and ⁇ -Al 2 O 3 .
- a fired pencil lead according to some embodiments of the present invention is obtained by firing a mixture containing an extender, an organic binder, and a polyether-modified silicone.
- the "baked pencil lead” is obtained through a heat treatment called “baking".
- Baking a heat treatment in a state in which resin molecules are intricately entwined with fillers such as graphite, decomposition and condensation of organic substances occur irregularly, and the core as a whole undergoes complex volumetric shrinkage. It becomes extremely complicated, and the degree and size of bonding of individual compositions after heat treatment are various, and it is not realistic to perform systemized measurement and analysis in which the relationship with the above effects is dominant. It is considered that there are circumstances in which it is impossible or almost impractical to directly identify the object by its structure or properties, because it is necessary to conduct an experiment, etc., for an insignificant number of times.
- a conventionally known oil can be used as the oil to impregnate the pores of the core body after heat treatment.
- oils such as liquid paraffin, ⁇ -olefin oligomers, squalane, spindle oil, silicone oil, fatty acid esters and castor oil, and waxes such as paraffin wax, microcrystalline wax and carnauba wax, but are limited to these. not.
- Example 1 KF-6028 (branched polyether-modified silicone) 0.45 parts by weight Flaky graphite (filler: volume average diameter 15 ⁇ m) 45 parts by weight Polyvinyl chloride (organic binder) 30 parts by weight Dioctyl phthalate (plasticizer) 20 Parts by weight methyl ethyl ketone (solvent) 15 parts by weight stearate (stabilizer) 1.5 parts by weight stearic acid (lubricant) 0.5 parts by weight carbon black (filler) 1 part by weight It is 1.5% by weight with respect to the added amount of the binder. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 2 A baked pencil lead was obtained in the same manner as in Example 1, except that the amount of KF-6028 was changed from 0.45 parts by weight to 0.06 parts by weight.
- the amount of polyether-modified silicone added is 0.2% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 0.2% by weight.
- Example 3 A fired pencil lead was obtained in the same manner as in Example 1, except that the amount of KF-6028 was changed from 0.45 parts by weight to 0.15 parts by weight.
- the amount of polyether-modified silicone added is 0.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 0.5% by weight.
- Example 4 A baked pencil lead was obtained in the same manner as in Example 1, except that the amount of KF-6028 was changed from 0.45 parts by weight to 0.24 parts by weight.
- the amount of polyether-modified silicone added is 0.8% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 0.8% by weight.
- Example 5 A fired pencil lead was obtained in the same manner as in Example 1, except that the amount of KF-6028 was changed from 0.45 parts by weight to 0.9 parts by weight.
- the amount of polyether-modified silicone added is 3% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 3% by weight.
- Example 6 A fired pencil lead was obtained in the same manner as in Example 1, except that the amount of KF-6028 was changed from 0.45 parts by weight to 1.2 parts by weight.
- the amount of polyether-modified silicone added is 4% by weight with respect to the amount of organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 4% by weight.
- Example 7 A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to KF-6017 (linear polyether-modified silicone).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 8> A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to KF-6038 (branched polyether-modified silicone, co-modified with an alkyl group).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 9 A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to KF-6048 (linear polyether-modified silicone, co-modified with an alkyl group).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 10 A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to FZ-2203 ((AB) n-type polyether-modified silicone).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 11 A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to FZ-2123 (linear polyether-modified silicone).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 12 A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to FZ-2222 ((AB) n-type polyether-modified silicone).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 13> A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to Silsoft 900 ((AB) n-type polyether-modified silicone).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 14 A baked pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to FZ-2233 ((AB) n-type polyether-modified silicone).
- the amount of polyether-modified silicone added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the polyether-modified silicone in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 1 ⁇ Comparative Example 1> In Example 1, except that KF-6028 was changed to KF-96-1,000cs (dimethylpolysiloxane, kinematic viscosity at 25 ° C.: 1000 mm / s, manufactured by Shin-Etsu Chemical Co., Ltd.). A fired pencil lead was obtained in the same manner.
- the amount of dimethylpolysiloxane added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the silicon compound in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 2 A baked pencil was prepared in the same manner as in Example 1, except that KF-6028 was changed to Aerosil R972 (hydrophobic amorphous silica (surface group: (CH 3 ) 2 ), manufactured by Nippon Aerosil Co., Ltd.) got the core
- Aerosil R972 hydrophobic amorphous silica (surface group: (CH 3 ) 2 ), manufactured by Nippon Aerosil Co., Ltd.) got the core
- the amount of Aerosil R972 added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the silicon compound in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 4 A fired pencil lead was obtained in the same manner as in Example 1, except that KF-6028 was changed to octakis(dimethylsilyloxy)octasilsesquioxane (manufactured by Tokyo Chemical Industry Co., Ltd.).
- the amount of silsesquioxane added is 1.5% by weight with respect to the amount of the organic binder added. That is, the ratio of the content of the silicon compound in the mixture of the above materials to the content of the organic binder is 1.5% by weight.
- Example 5 In Example 1, diamond nanoparticles (specific surface area 450 m 2 / g, volume average diameter mv value 10 nm, manufactured by Dia Material Co., Ltd.) dispersed in dimethyl silicone oil KF96-30CS (kinematic viscosity at 25 ° C.: 30 mm / s, refractive index 1.401, Shin-Etsu Chemical Co., Ltd. (manufactured) (temperature: 100° C.) for 10 hours, after which excess components on the surface were removed to obtain a fired pencil lead.
- KF96-30CS kinematic viscosity at 25 ° C.: 30 mm / s, refractive index 1.401, Shin-Etsu Chemical Co., Ltd. (manufactured) (temperature: 100° C.) for 10 hours, after which excess components on the surface were removed to obtain a fired pencil lead.
- the bending strength was measured according to JIS S6005.
- the writing resistance value was measured using a friction wear tester Tribogear Type: 40 manufactured by Shinto Kagaku Co., Ltd. The measurement environment was set at a temperature of 23° C. ⁇ 2° C. and a humidity of 65% ⁇ 5%.
- a mechanical pencil P205 manufactured by Pentel Co., Ltd. was used and fixed to a friction and abrasion tester using a dedicated writing instrument holder.
- An underlay of a stainless steel plate and a test paper specified in JIS S 6039 were fixed on the measurement stage, and the frictional force was measured when a mechanical pencil was used to draw a straight line.
- the test paper used was one that had been allowed to stand in a constant temperature and humidity chamber at a temperature of 23° C.
- the device conditions were as follows: writing angle: 75 degrees, vertical load: 200 g, moving speed: 1 cm/sec, sampling speed: 1 KHz, measurement time: 10 seconds.
- the average value of the frictional force from 1.5 seconds to 9.5 seconds in the 10-second measurement time was defined as the dynamic frictional force, and the writing resistance value (dynamic friction coefficient) was calculated by dividing the dynamic frictional force by the vertical load. Calculation of the writing resistance value is automatically performed by special software Tribosoft 6 attached to the device.
- Examples 1 to 14 since polyether-modified silicone is blended, the writing resistance value is low, and a high writing density and an improvement in bending strength can be seen while obtaining a smooth writing feeling with reduced sticking. Furthermore, the content of the polyether-modified silicone is 0.5% by weight or more and 3% by weight or less with respect to the content of the organic binder. A baked pencil lead with excellent balance of concentration and smooth writing is obtained.
- Comparative Example 3 hydrophobic amorphous silica whose surface was treated with silicone oil was added, and although the bending strength was improved, the writing resistance value was high, resulting in a writing feeling with a lot of catching.
- expressions such as “same”, “equal”, and “homogeneous” to express that things are in an equal state not only express a strictly equal state, but also a tolerance or a degree to which the same function can be obtained. It shall also represent the state in which there is a difference between Moreover, in this specification, the expressions “comprising”, “including”, or “having” one component are not exclusive expressions excluding the presence of other components.
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
また、特許文献2には、焼成鉛筆芯の配合材料として疎水性無定形シリカを用いることで、外観不良を生じることなく、曲げ強さと筆記線の濃度のバランスに優れた焼成鉛筆芯の製造方法が開示されている。
特許文献3には、焼成鉛筆芯の配合材料としてシルセスキオキサンを用いることで、焼成鉛筆芯に外観不良を生じることなく、特許文献2よりも曲げ強さが高く濃い筆跡を示す焼成鉛筆芯の製造方法が開示されている。
特許文献4には、焼成鉛筆芯の配合材料としてではなく熱処理後の芯体に含浸する油状物中に分散させたカーボンナノ粒子や珪素の酸化物セラミックナノ粒子が、筆記時にベアリングの効果を果たすことで、滑らかな書き味を示す焼成鉛筆芯の製造方法が開示されている。
特許文献2、特許文献3は有機結合材に対して分散均一性を向上することができる表面処理や分子構造を持つ珪素化合物を使用することにより、筆記線の濃度を維持し、曲げ強さを向上させることが開示されているが、曲げ強さが向上するにつれ筆記感は悪化し、引っ掛かりのない滑らかな書き味を得ることはできなかった。
特許文献4に示された、ナノ粒子を分散させた油状物を含浸させる方法では、熱処理後の芯体に存在する含浸に有効な気孔がナノ粒子によって気孔の開口部が塞がり、含浸に有効な気孔の数が減少してしまう。そのため、含浸した油状物が焼成鉛筆芯に保持される量が減少し、潤滑剤としての効果を充分に発揮できず、滑らかな書き味を損なっていた。
少なくとも、体質材と、有機結合材と、ポリエーテル変性シリコーンと、を混合して混合物を得るステップと、
前記混合物を成形して成形体を得るステップと、
前記成形体を焼成して焼成鉛筆芯を得るステップと、
を備える。
を備える。
したがって、曲げ強さの向上と筆記線の濃度の維持を両立し、かつ、筆記時の摩擦が低下するため、引っ掛かりが低減された、滑らかな書き味の焼成鉛筆芯を得ることができる。
SiO2 35~45重量%
Al2O3 10~20重量%
MgO3 7~30重量%
Fe2O3 5~22重量%
CaO 0~3重量%
Na2O 0~1重量%
K2O 0~10重量%
Fe以外の重金属含有量(Pb、Cr、Cd等) 0.2重量%以下
灼熱原料(1050℃) 3~25重量%
バーミキュライトを硫酸、塩酸、硝酸などで処理することで、MgO3やFe2O3などの有色成分が除去され、バーミキュライトの層構造を維持した板状シリカ(非晶質へき開性板状シリカ)となる。この板状シリカ(非晶質へき開性板状シリカ)の層間は水酸基による水素結合により結ばれているため、板状シリカに軽いせん断力をかけるだけで容易にへき開させることができる。また、1100℃まで熱処理しても板状シリカ(非晶質へき開性板状シリカ)の層構造は変化しないため、焼成鉛筆芯にも好適に使用できる。市販品としては、水澤化学工業(株)製のシルリーフが挙げられる。板状アルミナとしては、α-Al2O3、γ-Al2O3、θ-Al2O3などが挙げられる。板状アルミナの粒子表面は平滑であるため、粒子間の潤滑性が良く、筆記線の濃度と書き味とを損ないにくい。市販品としては、キンセイマテック(株)製のセラフFYA00610、FYA02025、FYA10030や、河合石灰工業(株)製のセラシュールBMMシリーズが挙げられる。また、シルセスキオキサンは、組成式では[R(SiO1.5)n]で表され、単位組成中に1.5個(=sesqui)の酸素を有するシロキサンという意味で、[sil-sesqui-oxane]と称されている。シルセスキオキサンとしては、東京化成工業(株)製のオクタキス(ジメチルシリルオキシ)オクタシルセスキオキサン(R:OSi(CH3)2H)や、オクタビニルオクタシラセスキオキサン(R:CH3-CH=CH2)やその誘導体などが挙げられる。
KF-6028(分岐型ポリエーテル変性シリコーン) 0.45重量部
鱗片状黒鉛(体質材:体積平均径15μm) 45重量部
ポリ塩化ビニル(有機結合材) 30重量部
フタル酸ジオクチル(可塑剤) 20重量部
メチルエチルケトン(溶剤) 15重量部
ステアリン酸塩(安定剤) 1.5重量部
ステアリン酸(滑剤) 0.5重量部
カーボンブラック(充填剤) 1重量部
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
上記の配合材料をヘンシェルミキサーによる分散混合処理、3本ロールミルによる混練処理をした後、単軸押出機にて細線状に押出成形し、空気中で室温から350℃まで約10時間かけて昇温し、350℃で約1時間保持する加熱処理を実施し、さらに、密閉容器内で1100℃を最高とする焼成処理を施し、呼び直径0.5の熱処理後の芯体を得た。この熱処理後の芯体を温度100℃に加熱した流動パラフィン中に10時間浸漬後、表面上の余分な成分を除去することで焼成鉛筆芯を得た。
実施例1において、KF-6028の配合量を0.45重量部から0.06重量部に変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して0.2重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が0.2重量%である。
実施例1において、KF-6028の配合量を0.45重量部から0.15重量部に変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して0.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が0.5重量%である。
実施例1において、KF-6028の配合量を0.45重量部から0.24重量部に変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して0.8重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が0.8重量%である。
実施例1において、KF-6028の配合量を0.45重量部から0.9重量部に変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して3重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が3重量%である。
実施例1において、KF-6028の配合量を0.45重量部から1.2重量部に変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して4重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が4重量%である。
実施例1において、KF-6028を、KF-6017(直鎖型ポリエーテル変性シリコーン)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028を、KF-6038(分岐型ポリエーテル変性シリコーン、アルキル基との共変性)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028を、KF-6048(直鎖型ポリエーテル変性シリコーン、アルキル基との共変性)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028を、FZ-2203((AB)n型ポリエーテル変性シリコーン)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をFZ-2123(直鎖型ポリエーテル変性シリコーン)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をFZ-2222((AB)n型ポリエーテル変性シリコーン)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をSilsoft900((AB)n型ポリエーテル変性シリコーン)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をFZ-2233((AB)n型ポリエーテル変性シリコーン)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ポリエーテル変性シリコーンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中のポリエーテル変性シリコーンの含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をKF-96-1,000cs(ジメチルポリシロキサン、25℃における動粘度:1000mm2/s、信越化学工業(株)製)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
ジメチルポリシロキサンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中の珪素化合物の含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をアエロジルR972(疎水性無定形シリカ(表面基:(CH3)2)、日本アエロジル(株)製)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
アエロジルR972の添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中の珪素化合物の含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をアエロジルR202(疎水性無定形シリカ(シリコーンオイルで表面処理したもの)、日本アエロジル(株)製)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
アエロジルR202の添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中の珪素化合物の含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、KF-6028をオクタキス(ジメチルシリルオキシ)オクタシルセスキオキサン(東京化成工業(株)製)へ変更した以外は、実施例1と同様にして焼成鉛筆芯を得た。
シルセスキオキサンの添加量が、有機結合材の添加量に対して1.5重量%である。すなわち、上述の材料の混合物中の珪素化合物の含有量の、有機結合材の含有量に対する割合が1.5重量%である。
実施例1において、ポリエーテル変性シリコーン(KF-6028)を添加しない配合で混練、押出成形した後、焼成温度まで熱処理して得られた熱処理後の芯体に、ダイヤモンドナノ粒子(比表面積450m2/g、体積平均径mv値10nm、ダイヤマテリアル(株)製)を分散したジメチルシリコーンオイルKF96-30CS(25℃における動粘度:30mm2/s、屈折率1.401、信越化学工業(株)製)(温度100℃)中に、10時間浸漬後、表面上の余分な成分を除去することで焼成鉛筆芯を得た。
曲げ強さの測定は、JIS S 6005に準じて実施した。
筆記線の濃度の測定は、JIS S 6005に準じて実施した。
筆記抵抗値の測定は、新東科学(株)製の摩擦摩耗試験機トライボギアType:40を用いて実施した。測定環境は温度23℃±2℃、湿度65%±5%とした。シャープペンシルには、ぺんてる(株)製のP205を使用し、専用の筆記具用ホルダーを用いて摩擦摩耗試験機に固定した。測定ステージ上に、ステンレス板の下敷きと、JIS S 6039に示された試験用紙を固定し、シャープペンシルで直線上を筆記したときの摩擦力を測定した。試験用紙はあらかじめ、温度23℃湿度65%の恒温恒湿槽に24時間以上静置したものを使用した。装置条件は、筆記角度:75度、垂直荷重:200g、移動速度:1cm/秒、サンプリング速度:1KHz、測定時間:10秒とした。測定時間10秒のうち、1.5秒から9.5秒の摩擦力の平均値を動摩擦力とし、動摩擦力を垂直荷重で除することで筆記抵抗値(動摩擦係数)を算出した。なお、筆記抵抗値の算出は、装置付属の専用ソフトウェアTribosoft6で自動算出される。
また、本明細書において、一の構成要素を「備える」、「含む」、又は、「有する」という表現は、他の構成要素の存在を除外する排他的な表現ではない。
Claims (6)
- 体質材と、有機結合材と、ポリエーテル変性シリコーンと、を含む混合物を焼成して得られる焼成鉛筆芯。
- 前記混合物を混錬し、押出成形して得られた成形体を焼成温度まで熱処理して得られる
請求項1に記載の焼成鉛筆芯。 - 前記混合物中の前記ポリエーテル変性シリコーンの含有量が、前記混合物中の前記有機結合材の含有量に対して0.5重量%以上、3重量%以下であることを特徴とする請求項1又は2に記載の焼成鉛筆芯。
- 前記ポリエーテル変性シリコーンが、分岐したシリコーン鎖を主鎖とする分子構造を有するポリエーテル変性シリコーンであることを特徴とする請求項1乃至3のいずれか一項に記載の焼成鉛筆芯。
- 前記ポリエーテル変性シリコーンの25℃における動粘度が、100mm2/s以上、10000mm2/s以下であることを特徴とする請求項1乃至4のいずれか一項に記載の焼成鉛筆芯。
- 少なくとも、体質材と、有機結合材と、ポリエーテル変性シリコーンと、を混合して混合物を得るステップと、
前記混合物を成形して成形体を得るステップと、
前記成形体を焼成して焼成鉛筆芯を得るステップと、
を備える焼成鉛筆芯の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023511146A JPWO2022210306A1 (ja) | 2021-03-31 | 2022-03-24 | |
DE112022001946.8T DE112022001946T5 (de) | 2021-03-31 | 2022-03-24 | Gebrannte Bleistiftmine |
CN202280024014.XA CN117157365A (zh) | 2021-03-31 | 2022-03-24 | 烧成铅笔芯 |
KR1020237033337A KR20230164676A (ko) | 2021-03-31 | 2022-03-24 | 소성 연필심 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-060923 | 2021-03-31 | ||
JP2021060923 | 2021-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022210306A1 true WO2022210306A1 (ja) | 2022-10-06 |
Family
ID=83458950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/014179 WO2022210306A1 (ja) | 2021-03-31 | 2022-03-24 | 焼成鉛筆芯 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022210306A1 (ja) |
KR (1) | KR20230164676A (ja) |
CN (1) | CN117157365A (ja) |
DE (1) | DE112022001946T5 (ja) |
WO (1) | WO2022210306A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09316384A (ja) * | 1996-05-28 | 1997-12-09 | Mitsubishi Pencil Co Ltd | 焼成鉛筆芯 |
JP2006316141A (ja) * | 2005-05-11 | 2006-11-24 | Pilot Precision Co Ltd | 固形状絵具 |
JP2007138174A (ja) * | 2005-11-19 | 2007-06-07 | Js Staedtler Gmbh & Co Kg | 筆記具、製図具および絵画用具の芯 |
JP2012144615A (ja) * | 2011-01-11 | 2012-08-02 | Sakura Color Products Corp | 固形描画材 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6335672A (ja) | 1986-07-30 | 1988-02-16 | Pentel Kk | 鉛筆芯の製造方法 |
JP4122945B2 (ja) | 2002-11-27 | 2008-07-23 | ぺんてる株式会社 | 鉛筆芯の製造方法 |
AU2010240104B2 (en) | 2009-04-24 | 2013-09-12 | Mitsubishi Pencil Company, Limited | Pencil lead and production process for the same |
JP2011068796A (ja) | 2009-09-28 | 2011-04-07 | Pentel Corp | 焼成鉛筆芯 |
-
2022
- 2022-03-24 JP JP2023511146A patent/JPWO2022210306A1/ja active Pending
- 2022-03-24 KR KR1020237033337A patent/KR20230164676A/ko unknown
- 2022-03-24 DE DE112022001946.8T patent/DE112022001946T5/de active Pending
- 2022-03-24 WO PCT/JP2022/014179 patent/WO2022210306A1/ja active Application Filing
- 2022-03-24 CN CN202280024014.XA patent/CN117157365A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09316384A (ja) * | 1996-05-28 | 1997-12-09 | Mitsubishi Pencil Co Ltd | 焼成鉛筆芯 |
JP2006316141A (ja) * | 2005-05-11 | 2006-11-24 | Pilot Precision Co Ltd | 固形状絵具 |
JP2007138174A (ja) * | 2005-11-19 | 2007-06-07 | Js Staedtler Gmbh & Co Kg | 筆記具、製図具および絵画用具の芯 |
JP2012144615A (ja) * | 2011-01-11 | 2012-08-02 | Sakura Color Products Corp | 固形描画材 |
Also Published As
Publication number | Publication date |
---|---|
CN117157365A (zh) | 2023-12-01 |
JPWO2022210306A1 (ja) | 2022-10-06 |
KR20230164676A (ko) | 2023-12-04 |
DE112022001946T5 (de) | 2024-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6843452B2 (ja) | カーボンブラックを含む組成物を調製する方法 | |
EP1831301B1 (de) | Reaktive kieselsäuresuspensionen | |
US5011870A (en) | Thermally conductive organosiloxane compositions | |
EP2423280B1 (en) | Pencil lead and method for producing same | |
EP2607410A1 (en) | Light-diffusing non-combustible composite member | |
US7262233B2 (en) | Surface treated silicas | |
JP2012172065A (ja) | 鉛筆芯及びその製造方法 | |
KR20180091385A (ko) | 도전성 실리콘 고무 조성물 및 이의 제조방법 | |
US5039736A (en) | Method for the preparation of an organopolysiloxane composition | |
KR101901633B1 (ko) | 도전성 액상 실리콘 고무 조성물, 이를 이용한 성형체 제조방법 및 이를 이용하여 제조된 성형체 | |
WO2022210306A1 (ja) | 焼成鉛筆芯 | |
JP2010116451A (ja) | 鉛筆芯及びその製造方法 | |
CN1269908C (zh) | 振动阻尼硅氧烷组合物 | |
JP4627563B2 (ja) | 鉛筆芯及びその製造方法 | |
JP2024051855A (ja) | 焼成鉛筆芯 | |
CN1191306C (zh) | 振动阻尼型硅氧烷组合物 | |
CA2134042A1 (en) | Mixtures with self-lubricating properties | |
JP2010120813A (ja) | ベーマイトの用途 | |
JP3436574B2 (ja) | サーマルタイプ高ストラクチャーファーネスカーボンブラック | |
KR102639732B1 (ko) | 이형필름 및 이의 제조방법 | |
JP2013245267A (ja) | 鉛筆芯 | |
JP4627564B2 (ja) | 鉛筆芯及びその製造方法 | |
JP4627568B2 (ja) | 鉛筆芯の製造方法 | |
JP4627566B2 (ja) | 鉛筆芯及びその製造方法 | |
Gnanasekaran | Effect of Nanostructured Polyhedral Oligomeric Silsesquioxone on High Performance Poly (urethane-imide) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22780520 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2023511146 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 112022001946 Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22780520 Country of ref document: EP Kind code of ref document: A1 |