WO2022209505A1 - フィルタ - Google Patents
フィルタ Download PDFInfo
- Publication number
- WO2022209505A1 WO2022209505A1 PCT/JP2022/008133 JP2022008133W WO2022209505A1 WO 2022209505 A1 WO2022209505 A1 WO 2022209505A1 JP 2022008133 W JP2022008133 W JP 2022008133W WO 2022209505 A1 WO2022209505 A1 WO 2022209505A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- coupling capacitance
- resonator
- view
- filter
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 101
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 230000008878 coupling Effects 0.000 claims description 430
- 238000010168 coupling process Methods 0.000 claims description 430
- 238000005859 coupling reaction Methods 0.000 claims description 430
- 239000003990 capacitor Substances 0.000 claims description 27
- 230000000052 comparative effect Effects 0.000 description 23
- 238000010586 diagram Methods 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 14
- 230000001965 increasing effect Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
Definitions
- the present invention relates to filters.
- Japanese National Publication of International Patent Application No. 2011-507312 discloses a resonator device in which a coupling adjustment via hole is provided between two resonators. According to Japanese Unexamined Patent Application Publication No. 2011-507312, the inductive coupling (coupling degree) between two resonators can be adjusted by a coupling adjusting via hole.
- Japanese Unexamined Patent Application Publication No. 2020-198482 proposes a compact filter with good characteristics that can solve the problems of the resonator device described in Japanese Patent Application Laid-Open No. 2011-507312. That is, Japanese Patent Application Laid-Open No. 2020-198482 proposes a filter that can solve the problem that the size of the filter increases when the distance between the resonators is increased.
- Japanese Patent Application Laid-Open No. 2020-198482 proposes a structure that can improve the Q value more than conventionally by appropriately securing the distance between the resonators and the distance from the shielding conductor. By applying this structure, it has become possible to consider a filter with a smaller insertion loss and a filter with a larger attenuation than the conventional one.
- An object of the present invention is to provide a compact filter with good characteristics.
- a filter according to an aspect of the present invention includes a dielectric substrate, a plurality of resonators formed in the dielectric substrate and surrounded by a shield conductor, and a first resonator formed in a portion where the shield conductor is not formed. a first resonator that is closest to the first input/output terminal among a plurality of resonators; A second resonator closest to the second input/output terminal has a positional relationship of point symmetry about the center of the dielectric substrate in a plan view, and is one of the plurality of resonators.
- a third resonator and a fourth resonator among the plurality of resonators have a positional relationship of point symmetry with the center of the dielectric substrate in a plan view as a center of symmetry, and the position of the third resonator in the first direction that is the longitudinal direction is between the position of the first resonator in the first direction and the position of the center of the dielectric substrate in the first direction;
- the position of the fourth resonator in the first direction is between the position of the second resonator in the first direction and the position of the center of the dielectric substrate in the first direction.
- FIG. 1 is a perspective view showing a filter according to a first embodiment
- FIG. FIG. 2 is a plan view showing the filter according to the first embodiment
- FIG. 3A is a diagram showing an ideal filter waveform
- FIG. 3B is a diagram showing a filter waveform including variations.
- FIG. 4A is an explanatory diagram showing an example in which a plurality of resonators are arranged line-symmetrically
- FIG. 4B is an explanatory diagram showing an example in which a plurality of resonators are arranged point-symmetrically.
- 5A and 5B are graphs showing variations of the filter waveform according to Comparative Example 1 with respect to the ideal filter waveform
- 6A and 6B are graphs showing variations of the filter waveform according to Example 1 with respect to the ideal filter waveform.
- FIG. 7A is a side view showing a capacitive coupling structure between via electrodes in a filter according to Comparative Example 2
- FIG. 7B is a top view of the capacitive coupling structure
- FIG. 7C is a side view of the capacitive coupling structure.
- 8 is a graph showing frequency characteristics of a filter according to Comparative Example 2.
- FIG. 9A is a side view showing a capacitive coupling structure between via electrodes in a filter according to Example 2
- FIG. 9B is a top view of the capacitive coupling structure
- FIG. 9C is a side view of the capacitive coupling structure.
- FIG. 10 is a graph showing frequency characteristics of the filter according to Example 2.
- FIG. 11A is an equivalent circuit diagram showing a capacitive coupling structure between serially connected via electrode portions
- FIG. 11B is a schematic diagram showing an arrangement example of a plurality of plate electrodes in the case of series connection
- FIG. 10A and 10B are plan views schematically showing an example of position correction of the plate electrode
- FIG. 12A is an equivalent circuit diagram showing a capacitive coupling structure between via electrode portions connected in parallel
- FIG. 12B is a schematic diagram showing an arrangement example of a plurality of plate electrodes in the case of parallel connection
- FIG. 13A is an equivalent circuit diagram showing a capacitive coupling structure between serially connected via electrode portions
- FIG. 13B is a schematic diagram showing another arrangement example of a plurality of plate electrodes in the case of series connection.
- FIG. 13C is an equivalent circuit diagram showing a capacitive coupling structure between via electrode portions connected in parallel
- FIG. 13D is a schematic diagram showing another arrangement example of a plurality of plate electrodes in the case of parallel connection.
- 14 is a plan view showing the arrangement relationship of the capacitor electrodes in Comparative Example 3.
- FIG. 15 is a waveform diagram showing frequency characteristics of Comparative Example 3.
- FIG. 16 is a plan view showing the arrangement relationship of capacitor electrodes in Example 3.
- FIG. FIG. 17 is a waveform diagram showing frequency characteristics of Example 3.
- FIG. FIG. 18 is a perspective view showing a filter according to the second embodiment;
- FIG. FIG. 19 is a plan view showing the filter according to the second embodiment.
- FIG. 20A is a cross-sectional view showing part of the filter according to the second embodiment.
- FIG. 20B is a cross-sectional view showing part of the filter according to the second embodiment.
- FIG. 21 is a perspective view showing a filter according to the second embodiment;
- FIG. FIG. 22 is a perspective view showing a filter according to the second embodiment;
- FIG. FIG. 23 is a plan view showing a filter according to the second embodiment;
- FIG. FIG. 24 is a perspective view showing a filter according to the second embodiment;
- FIG. FIG. 25 is a plan view showing the filter according to the second embodiment.
- FIG. 26 is a perspective view showing a filter according to the second embodiment;
- FIG. FIG. 27 is a plan view showing a filter according to the second embodiment;
- FIG. FIG. 28 is a plan view showing a filter according to the second embodiment;
- FIG. 29 is a plan view showing an example of a filter according to a modified embodiment
- FIG. 30 is a plan view showing an example of a filter according to a modified embodiment
- FIG. 31 is a plan view showing an example of a filter according to a modified embodiment
- FIG. 1 is a perspective view showing a filter 10 according to this embodiment.
- FIG. 2 is a plan view showing the filter 10 according to this embodiment. 1 and 2 show an example in which five resonators 11A to 11E are provided.
- the filter 10 is provided with a dielectric substrate 14 .
- the dielectric substrate 14 is formed in, for example, a rectangular parallelepiped shape, but is not limited to this.
- the dielectric substrate 14 is constructed by laminating a plurality of ceramic sheets (dielectric ceramic sheets).
- the dielectric substrate 14 has two main surfaces 14a, 14b and four side surfaces 14c to 14f.
- the direction along the normal direction of the side surfaces 14c and 14d, more specifically, the normal direction of the side surfaces 14c and 14d is defined as the X direction. That is, let the longitudinal direction of the dielectric substrate 14 in plan view be the X direction.
- the direction along the normal direction of the side surfaces 14e and 14f, more specifically, the normal direction of the side surfaces 14e and 14f is the Y direction.
- a direction along the normal direction of one principal surface (first principal surface) 14a and the other principal surface (second principal surface) 14b of the dielectric substrate 14, more specifically, the normal to the principal surfaces 14a and 14b Let the direction be the Z direction.
- a shield conductor (first main surface side shield conductor, lower shield conductor) 12A is formed on the main surface 14b side of the dielectric substrate 14 . That is, a shield conductor 12A is formed under the dielectric substrate 14 in FIG.
- a shield conductor (second main surface side shield conductor, upper shield conductor) 12B is formed on the main surface 14a side of the dielectric substrate 14 . That is, the shield conductor 12B is formed on the upper side of the dielectric substrate 14 in FIG.
- An input/output terminal 22A is formed on the side surface 14c of the dielectric substrate 14. As shown in FIG. An input/output terminal 22B is formed on the side surface 14d of the dielectric substrate 14. As shown in FIG. Input/output terminal 22A is coupled to shield conductor 12B via connection line 32a. Also, the input/output terminal 22B is coupled to the shield conductor 12B via a connection line 32b. Although FIGS. 1 and 2 show an example in which the input/output terminals 22A and 22B are connected to the shield conductor 12B, the input/output terminals 22A and 22B may be connected to the resonators 11A and 11E, respectively.
- a shield conductor 12Ca is formed on the side surface 14e of the dielectric substrate 14. As shown in FIG. A shield conductor 12Cb is formed on the side surface 14f of the dielectric substrate 14. As shown in FIG. The shield conductors 12Ca and 12Cb are formed in a plate shape.
- Capacitor electrodes (strip lines) 18A to 18E are formed in the dielectric substrate 14 so as to face the shield conductor 12A. Although the capacitor electrodes 18A to 18E are shown as squares in FIG. 1, the shape of the capacitor electrodes 18A to 18E is not limited to squares. For example, the capacitor electrodes 18A-18E may be rectangular in shape. Reference numeral 18 is used when describing capacitor electrodes in general, and reference numerals 18A to 18E are used when describing individual capacitor electrodes.
- a via electrode section 20A Further formed in the dielectric substrate 14 are a via electrode section 20A, a via electrode section 20B, a via electrode section 20C, a via electrode section 20D, and a via electrode section 20E.
- Reference numeral 20 is used when general via electrode portions are described, and reference numerals 20A to 20E are used when individual via electrode portions are described.
- the via electrode section 20 is composed of a plurality of via electrodes 24 .
- the via electrodes 24 are embedded in via holes formed in the dielectric substrate 14 respectively.
- the plurality of via electrodes 24 forming the via electrode portion 20 are arranged along a virtual ring 26 when viewed from above. More specifically, the plurality of via electrodes 24 forming the via electrode portion 20 are arranged along a virtual circle. Since the via electrode section 20 is configured by arranging the plurality of via electrodes 24 along the virtual ring 26 , the via electrode section 20 is a large-diameter via electrode corresponding to the virtual ring 26 . can behave like Since the via electrode portion 20 is composed of a plurality of via electrodes 24 having relatively small diameters, the manufacturing process can be simplified.
- the via electrode portion 20 is composed of a plurality of via electrodes 24 having relatively small diameters, variations in the diameter of the via electrode portion 20 can be reduced.
- the via electrode section 20 is composed of a plurality of via electrodes 24 with relatively small diameters, the amount of material such as silver embedded in the vias can be reduced, and cost reduction can be achieved.
- One end (lower end) of the via electrode portion 20 is connected to the capacitor electrode 18 .
- the other end (upper end) of the via electrode portion 20 is connected to the shield conductor 12B.
- the via electrode portion 20 is formed from the capacitor electrode 18 to the shield conductor 12B.
- a structural body 16A is composed of the capacitor electrode 18A and the via electrode portion 20A.
- a structure 16B is configured by the capacitor electrode 18B and the via electrode portion 20B.
- a structural body 16C is configured by the capacitor electrode 18C and the via electrode portion 20C.
- a structure 16D is configured by the capacitor electrode 18D and the via electrode portion 20D.
- a structure 16E is configured by the capacitor electrode 18E and the via electrode portion 20E.
- Reference numeral 16 is used when describing structures in general, and reference numerals 16A to 16E are used when describing individual structures. A pattern (not shown) may be appropriately provided between each structure 16 .
- the filter 10 is provided with a plurality of resonators each including structures 16A-16E. That is, the filter 10 includes a resonator 11A, a resonator 11B, a resonator 11C, a resonator 11D, and a resonator 11E.
- Reference numeral 11 is used when describing resonators in general, and reference numerals 11A to 11E are used when describing individual resonators.
- the resonators 11A and 11B are arranged adjacent to each other.
- the resonators 11B and 11C are arranged adjacent to each other.
- the resonators 11C and 11D are arranged adjacent to each other.
- the resonators 11D and 11E are arranged adjacent to each other.
- Each of the plurality of resonators 11 is provided with one via electrode portion 20 .
- the via electrode portion 20A, the via electrode portion 20B, the via electrode portion 20C, the via electrode portion 20D, and the via electrode portion 20E are shifted from each other in the X direction.
- the position in the X direction of the center P3 of the via electrode portion 20C is between the position in the X direction of the center P1 of the via electrode portion 20A and the position in the X direction of the center P5 of the via electrode portion 20E.
- the distance between the position of the center P3 of the via electrode portion 20C in the X direction and the position of the center P1 of the via electrode portion 20A in the X direction is equal to the position of the center P3 of the via electrode portion 20C in the X direction, It is equal to the distance between the center P5 of the via electrode portion 20E and the position in the X direction.
- the position of the center P3 of the via electrode portion 20C in the Y direction is between the position of the center P1 of the via electrode portion 20A in the Y direction and the position of the center P5 of the via electrode portion 20E in the Y direction.
- the distance between the position of the center P3 of the via electrode portion 20C in the Y direction and the position of the center P1 of the via electrode portion 20A in the Y direction is equal to the position of the center P3 of the via electrode portion 20C in the Y direction, It is equal to the distance between the center P5 of the via electrode portion 20E and the position in the Y direction.
- the position of the center P1 of the via electrode portion 20A in the Y direction is the same as the position of the center P4 of the via electrode portion 20D in the Y direction.
- the position of the center P2 of the via electrode portion 20B in the Y direction is the same as the position of the center P5 of the via electrode portion 20E in the Y direction.
- the via electrode portion 20 closest to the input/output terminal 22A is the via electrode portion 20A. That is, the distance in the X direction between the position of the center P1 of the via electrode portion 20A and the position of the input/output terminal 22A is the distance in the X direction between the position of the center P2 of the via electrode portion 20B and the position of the input/output terminal 22A. less than the distance in Of the five via electrode portions 20A to 20E, the via electrode portion 20 closest to the input/output terminal 22B is the via electrode portion 20E.
- the distance in the X direction between the position of the center P5 of the via electrode portion 20E and the position of the input/output terminal 22B is the distance in the X direction between the position of the center P4 of the via electrode portion 20D and the position of the input/output terminal 22B. less than The via electrode portion 20A and the via electrode portion 20D are positioned on the side surface 14e. The via electrode portion 20B and the via electrode portion 20E are located on the side surface 14f.
- the filter waveform of the filter including variations has large variations in the intervals between the attenuation poles and also has large variations in the peak values.
- Factors for this include variation in the degree of coupling between resonators, variation in coupling capacitance, variation in interlaced capacitance, and the like.
- Filter 100 according to Comparative Example 1 includes four resonators 11A to 11D, as shown in FIG. 4A. These resonators 11A to 11D are arranged at line-symmetrical positions with the center line of the dielectric substrate 14 in plan view as the axis of symmetry. The resonator 11A and the resonator 11D correspond to each other. The resonator 11B and the resonator 11C correspond to each other. In other words, the filter 100 according to Comparative Example 1 has a structure in which the combination of the via electrode portion 20A and the via electrode portion 20B and the combination of the via electrode portion 20C and the via electrode portion 20D are arranged at line-symmetrical positions. have.
- the filter waveform of the filter 100 according to Comparative Example 1 had large variations with respect to the ideal filter waveform, and the variation directions (+ and -) were also scattered.
- the filter according to Example 1 includes five resonators 11A to 11E, as shown in FIG. 4B. These resonators 11A to 11E are arranged point-symmetrically with respect to the center C (see FIG. 2) of the dielectric substrate 14 in plan view.
- the resonators 11A and 11E correspond to each other. That is, the resonator 11A with the shortest distance from the input/output terminal 22A and the resonator 11E with the shortest distance from the input/output terminal 22B are arranged at point-symmetrical positions. Also, the resonator 11B and the resonator 11D correspond to each other.
- the filter according to the first embodiment has a structure in which the via electrode portion 20A closest to one input/output and the via electrode portion 20E closest to the other input/output are arranged point-symmetrically.
- the via electrode portion 20B and the via electrode portion 20D are also arranged point-symmetrically.
- the filter according to Example 1 had a small variation with respect to the ideal filter waveform, and the variation direction was constant.
- a capacitive coupling structure 52 is provided between the via electrode portions 20 of the filter according to Comparative Example 2, as shown in FIGS. 7A to 7C.
- the tip portion of the flat plate electrode 50A coupled to the via electrode portion 20A and the tip portion of the flat plate electrode 50B coupled to the via electrode portion 20B are separated from each other in side view.
- the tip portion of the flat plate electrode 50A coupled to the via electrode portion 20A and the tip portion of the flat plate electrode 50B coupled to the via electrode portion 20B overlap each other in plan view. . That is, the tip portion of the plate electrode 50A and the tip portion of the plate electrode 50B face each other.
- Reference numeral 50 is used when describing the plate electrode in general, and reference numerals 50A to 50D are used when describing individual plate electrodes.
- the filter according to the second embodiment includes capacitive coupling structures 54 between via electrode portions 20 .
- the capacitive coupling structures 54 are provided between the via electrode portions 20 adjacent to each other.
- An example of capacitive coupling structure 54 provided between via electrode portion 20A and via electrode portion 20B is shown in FIGS. 9A-9C.
- the capacitive coupling structure 54 shown in FIGS. 9A to 9C includes two plate electrodes 50Aa and 50Ab coupled to the via electrode portion 20A, two plate electrodes 50Ba and 50Bb coupled to the via electrode portion 20B, and a plate electrode 50C. and One tip portion 50Ca of the flat plate electrode 50C is positioned between the flat plate electrode 50Aa and the flat plate electrode 50Ab in a side view.
- the tip portion 50Ca of the flat plate electrode 50C and the flat plate electrode 50Aa are separated from each other in a side view.
- the tip portion 50Ca of the flat plate electrode 50C and the flat plate electrode 50Ab are separated from each other in a side view.
- the tip portion 50Ca of the flat plate electrode 50C and the flat plate electrode 50Aa overlap each other in plan view. That is, the tip portion 50Ca of the flat plate electrode 50C and the flat plate electrode 50Aa face each other.
- the tip portion 50Ca of the flat plate electrode 50C and the flat plate electrode 50Ab overlap each other in plan view. That is, the tip portion 50Ca of the flat plate electrode 50C and the flat plate electrode 50Ab face each other.
- the other tip portion 50Cb of the flat plate electrode 50C is positioned between the flat plate electrode 50Ba and the flat plate electrode 50Bb in a side view.
- the tip portion 50Cb of the flat plate electrode 50C and the flat plate electrode 50Ba are separated from each other in a side view.
- the tip portion 50Cb of the flat plate electrode 50C and the flat plate electrode 50Bb are separated from each other in a side view.
- the tip portion 50Cb of the flat plate electrode 50C and the flat plate electrode 50Ba overlap each other in plan view. That is, the tip portion 50Cb of the flat plate electrode 50C and the flat plate electrode 50Ba face each other.
- the tip portion 50Cb of the flat plate electrode 50C and the flat plate electrode 50Bb overlap each other in plan view. That is, the tip portion 50Cb of the flat plate electrode 50C and the flat plate electrode 50Bb face each other.
- the dispersion of the attenuation characteristics in the low frequency region was small. That is, in the filter according to Example 2, there was almost no variation in attenuation characteristics in the low frequency range.
- the capacitive coupling structure 54 provided between the via electrode portions 20 is not limited to the structure described above.
- a capacitive coupling structure 54 as shown in FIG. 11A may be provided between via electrode portions 20 .
- the structure shown in FIG. 11B may be adopted as the capacitive coupling structure 54 in which the capacitance C1 and the capacitance C2 are connected in series.
- the tip portion of the plate electrode 50A extending from the via electrode portion 20A and the tip portion of the plate electrode 50B extending from the via electrode portion 20B are separated from each other.
- the tip portion of the flat plate electrode 50A and the flat plate electrode 50C are separated from each other in a side view.
- the tip portion of the flat plate electrode 50B and the flat plate electrode 50C are separated from each other in a side view.
- the tip portion of the flat plate electrode 50A and the flat plate electrode 50C overlap each other in plan view.
- the tip of the flat plate electrode 50A and the flat plate electrode 50C face each other. Further, in the capacitive coupling structure 54, the tip portion of the flat plate electrode 50B and the flat plate electrode 50C overlap each other in plan view. That is, the tip portion of the flat plate electrode 50B and the flat plate electrode 50C face each other.
- the capacitance C1 formed by the flat plate electrodes 50A and 50C and the capacitance C2 formed by the flat plate electrodes 50B and 50C may be the same or different.
- the upper diagram in FIG. 11C shows an example in which the capacitance C1 and the capacitance C2 are the same.
- the lower diagram in FIG. 11C shows an example in which the capacitance C2 is made larger than the capacitance C1 by shifting the position of the plate electrode 50C. By shifting the position of the plate electrode 50C, the capacitance C1 may be made larger than the capacitance C2.
- the capacitive coupling structure 54 provided between the via electrode portions 20 is not limited to the structure described above.
- a capacitive coupling structure 54 as shown in FIG. 12A may be provided between via electrode portions 20 .
- the structure shown in FIG. 12B may be adopted as the capacitive coupling structure 54 in which the capacitance C1 and the capacitance C2 are connected in parallel.
- the tip portion of the flat plate electrode 50A extending from the via electrode portion 20A and the tip portion of the flat plate electrode 50B extending from the via electrode portion 20B overlap each other in plan view.
- the flat plate electrode 50A and the flat plate electrode 50B are separated from each other in a side view. That is, the tip portion of the plate electrode 50A and the tip portion of the plate electrode 50B face each other.
- the tip portion of the flat plate electrode 50C extending from the via electrode portion 20A and the tip portion of the flat plate electrode 50D extending from the via electrode portion 20B overlap each other in plan view.
- the flat plate electrode 50C and the flat plate electrode 50D are separated from each other in a side view. That is, the tip portion of the plate electrode 50C and the tip portion of the plate electrode 50D face each other.
- the plate electrodes 50A and 50D may be formed on the same layer, and the plate electrodes 50B and 50C may be formed on the same layer. In this case, the layer on which the flat plate electrode 50A and the flat plate electrode 50D are formed and the layer on which the flat plate electrode 50B and the flat plate electrode 50C are formed are different from each other.
- the capacitance C1 between the plate electrodes 50A and 50B may be appropriately adjusted by changing the relative positional relationship between the plate electrodes 50A and 50B.
- the capacitance C2 between the plate electrodes 50C and 50D may be appropriately adjusted by changing the relative positional relationship between the plate electrodes 50C and 50D.
- the capacitance between the plate electrodes 50 can be adjusted by relatively shifting the plate electrodes 50C in one direction (extending direction of the plate electrodes).
- the capacitance between the plate electrodes 50 is adjusted by relatively shifting the plate electrodes 50A and 50D in one direction (extending direction of the plate electrodes). can. Adjustment of the capacitance between the plate electrodes 50 is not limited to the above. For example, as shown in FIGS.
- the capacitance between the plate electrodes 50 can be adjusted by relatively displacing the plate electrodes 50C in two directions (extending direction of the plate electrodes and a direction orthogonal thereto). good.
- one end of the flat plate electrode 50C overlaps at least one corner of the flat plate electrode 50A in plan view.
- the other end of the flat plate electrode 50C overlaps at least one corner of the flat plate electrode 50B in plan view.
- the capacitance between the plate electrodes 50 is reduced. may be adjusted.
- the capacitance between the plate electrodes 50 may be adjusted by relatively shifting the plate electrodes 50C and 50D in two directions (extending direction of the plate electrodes and a direction orthogonal thereto).
- the plate electrode 50A and the plate electrode 50B may be relatively displaced in two directions, and the plate electrode 50C and the plate electrode 50D may be displaced in two directions.
- the flat plate electrode 50A overlaps at least one corner of the flat plate electrode 50B in plan view.
- the flat plate electrode 50D overlaps at least one corner of the flat plate electrode 50C in plan view.
- the filter according to Comparative Example 3 includes capacitive electrodes 60ab, 60ac, 60ba, and 60bc. Further, the filter according to the third embodiment is provided with capacitive electrodes 60ab, 60ac, 60ba, and 60bc, as shown in FIG.
- the via electrode portion 20A has a capacitance electrode 60ab extending toward the via electrode portion 20B and a capacitance electrode 60ac extending toward the via electrode portion 20C.
- the via electrode portion 20B has a capacitance electrode 60ba extending toward the via electrode portion 20A and a capacitance electrode 60bc extending toward the via electrode portion 20C.
- the filter according to Comparative Example 3 is provided with capacitive electrodes 60dc, 60de, 60ec, and 60ed, as shown in FIG.
- the filter according to the third embodiment is provided with capacitive electrodes 60dc, 60de, 60ec, and 60ed, as shown in FIG.
- the via electrode portion 20D has a capacitance electrode 60dc extending toward the via electrode portion 20C and a capacitance electrode 60de extending toward the via electrode portion 20E.
- the via electrode portion 20E has a capacitance electrode 60ec extending toward the via electrode portion 20C and a capacitance electrode 60ed extending toward the via electrode portion 20D.
- the filter according to Comparative Example 3 is provided with capacitive electrodes 60ca, 60cb, 60cd, and 60ce, as shown in FIG.
- the filter according to the third embodiment is provided with capacitive electrodes 60ca, 60cb, 60cd, and 60ce, as shown in FIG.
- the via electrode portion 20C includes a capacitor electrode 60ca extending toward the via electrode portion 20A, a capacitor electrode 60cb extending toward the via electrode portion 20B, a capacitor electrode 60cd extending toward the via electrode portion 20D, and a via electrode portion 20E. and a capacitive electrode 60ce extending toward it.
- reference numeral 60 When describing the capacitive electrodes in general, reference numeral 60 is used, and when describing individual capacitive electrodes, reference numerals 60ab, 60ac, 60ba, 60bc, 60dc, 60de, 60ec, 60ed, 60ca, 60cb, 60cd, and 60ce are used.
- Use Capacitive electrodes 60 that are close to each other are capacitively coupled.
- a capacitive coupling structure 61A is formed by the capacitive electrode 60ac and the capacitive electrode 60ca that are close to each other.
- a capacitive coupling structure 61B is formed by the capacitive electrode 60ec and the capacitive electrode 60ce that are close to each other.
- a capacitive coupling structure 61C is formed by the capacitive electrode 60ab and the capacitive electrode 60ba that are close to each other.
- a capacitive coupling structure 61D is formed by the capacitive electrode 60de and the capacitive electrode 60ed that are close to each other.
- a capacitive coupling structure 61E is formed by the capacitive electrode 60bc and the capacitive electrode 60cb that are close to each other.
- a capacitive coupling structure 61F is formed by the capacitive electrode 60cd and the capacitive electrode 60dc that are close to each other.
- Comparative Example 3 In Comparative Example 3, as shown in FIG. 14, the distance g1 between the capacitive electrodes 60 (the distance in the direction orthogonal to the extending direction of the capacitive electrodes 60) is set to be the same regardless of the sensitivity of the elements constituting the filter. It is That is, in the filter according to Comparative Example 3, regardless of the degree of coupling between the resonators 11, the distance g1 between the capacitive electrodes 60 is set to be the same. In Comparative Example 3, the sensitivity between the capacitive electrode 60ac and the capacitive electrode 60ca was relatively high. That is, in Comparative Example 3, the degree of coupling between the resonators 11A and 11C was relatively high. In Comparative Example 3, the sensitivity between the capacitive electrode 60ec and the capacitive electrode 60ce was relatively high. That is, the degree of coupling between the resonators 11C and 11E was relatively high.
- Example 3 In Example 3, as shown in FIG. 16, the distance between each capacitance electrode 60 was appropriately set according to the sensitivity of the elements forming the filter 10 . That is, in Example 3, the distance between each capacitor electrode 60 was appropriately set according to the degree of coupling between the resonators 11 . In FIG. 16, the distance g2 between the capacitive electrode 60ac and the capacitive electrode 60ca and the distance g2 between the capacitive electrode 60ec and the capacitive electrode 60ce are set larger than the distance g1 between the other capacitive electrodes 60. In FIG.
- Example 3 the distance g2 between the capacitive electrodes 60 in the capacitive coupling structures 61A and 61B is set larger than the distance g1 between the capacitive electrodes 60 in the capacitive coupling structures 61C to 61F.
- the frequency characteristics of the filter according to Example 3 were favorable with almost no variation in the attenuation characteristics in the high frequency range. That is, the filter according to Example 3 can reduce variations in attenuation characteristics.
- the first-stage resonator 11A and the fifth-stage resonator 11E are positioned point-symmetrically with respect to the center of the dielectric substrate 14C in plan view. to be placed.
- the structure of the coupling capacitance and the jump capacitance is not simply facing each other, but sandwiched between two layers of flat plate electrodes 50 and connected in series, so that variations can be suppressed.
- FIG. 18 is a perspective view showing the filter according to this embodiment.
- FIG. 19 is a plan view showing the filter according to this embodiment.
- 20A and 20B are cross-sectional views showing part of the filter according to this embodiment.
- 21 and 22 are perspective views showing the filter according to this embodiment.
- FIG. 23 is a plan view showing the filter according to this embodiment.
- FIG. 24 is a perspective view showing the filter according to this embodiment.
- FIG. 25 is a plan view showing the filter according to this embodiment.
- FIG. 26 is a perspective view showing the filter according to this embodiment.
- 27 and 28 are plan views showing the filter according to this embodiment. For the sake of simplification, some components are omitted as appropriate in FIGS. 18-28.
- the filter 10 according to this embodiment includes four resonators 11 . That is, the filter 10 according to this embodiment includes a resonator 11A, a resonator 11B, a resonator 11D, and a resonator 11E. The filter 10 according to this embodiment does not include the resonator 11C (see FIG. 1).
- the resonator (first resonator) 11A and the resonator (second resonator) 11E are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry.
- the resonator (third resonator) 11B and the resonator (fourth resonator) 11D are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry.
- the position of the resonator 11B in the X direction is between the position of the resonator 11A in the X direction and the position of the center C of the dielectric substrate 14 in the X direction.
- the position of the resonator 11D in the X direction is between the position of the resonator 11E in the X direction and the position of the center C of the dielectric substrate 14 in the X direction.
- the resonators 11A and 11B are arranged adjacent to each other.
- the resonators 11B and 11D are arranged adjacent to each other.
- the resonators 11D and 11E are arranged adjacent to each other.
- the via electrode portion 20A, the via electrode portion 20B, the via electrode portion 20D, and the via electrode portion 20E are shifted from each other in the X direction.
- the position in the X direction of the center P2 of the via electrode portion 20B is between the position in the X direction of the center P1 of the via electrode portion 20A and the position in the X direction of the center P4 of the via electrode portion 20D.
- the position in the X direction of the center P4 of the via electrode portion 20D is between the position in the X direction of the center P2 of the via electrode portion 20B and the position in the X direction of the center P5 of the via electrode portion 20E.
- the position of the center P1 of the via electrode portion 20A in the Y direction is the same as the position of the center P4 of the via electrode portion 20D in the Y direction.
- the position of the center P2 of the via electrode portion 20B in the Y direction is the same as the position of the center P5 of the via electrode portion 20E in the Y direction.
- the via electrode portion 20B and the via electrode portion 20E are shifted in the Y direction with respect to the via electrode portion 20A and the via electrode portion 20D.
- the via electrode portion 20A and the via electrode portion 20D are positioned on the side surface 14e.
- the distance between the via electrode portions 20A, 20D and the shield conductor 12Ca is smaller than the distance between the via electrode portions 20A, 20D and the shield conductor 12Cb.
- the via electrode portions 20B and 20E are located on the side of the side surface 14f. That is, the distance between the via electrode portions 20B, 20E and the shield conductor 12Cb is smaller than the distance between the via electrode portions 20B, 20E and the shield conductor 12Ca.
- the position of the center P1 of the via electrode portion 20A and the position of the center P2 of the via electrode portion 20B are shifted not only in the X direction but also in the Y direction. ing. Therefore, according to this embodiment, the distance between the via electrode portions 20A and 20B can be increased without increasing the distance between the via electrode portions 20A and 20B in the X direction. Further, according to the present embodiment, the position of the center P2 of the via electrode portion 20B and the position of the center P4 of the via electrode portion 20D are not only shifted from each other in the X direction, but also shifted from each other in the Y direction. ing.
- the distance between the via electrode portions 20B and 20D can be increased without increasing the distance between the via electrode portions 20B and 20D in the X direction.
- the position of the center P4 of the via electrode portion 20D and the position of the center P5 of the via electrode portion 20E are shifted not only in the X direction but also in the Y direction. ing. Therefore, according to the present embodiment, the distance between the via electrode portions 20D and 20E can be increased without increasing the distance between the via electrode portions 20D and 20E in the X direction.
- the degree of coupling between adjacent resonators 11 can be reduced without increasing the distance between adjacent resonators 11 in the X direction. Therefore, according to this embodiment, it is possible to obtain the filter 10 having good characteristics while keeping the size of the filter 10 small.
- the via electrode portion 20 closest to the input/output terminal 22A is the via electrode portion 20A.
- the distance in the X direction between the position of the center P1 of the via electrode portion 20A and the position of the input/output terminal 22A is the distance in the X direction between the position of the center P2 of the via electrode portion 20B and the position of the input/output terminal 22A. less than
- the distance in the Y direction between the position of the center P1 of the via electrode portion 20A and the position of the input/output terminal 22A is the distance in the Y direction between the position of the center P2 of the via electrode portion 20B and the position of the input/output terminal 22A. is equivalent to
- the via electrode section 20 closest to the input/output terminal 22B is the via electrode section 20E.
- the distance in the X direction between the position of the center P5 of the via electrode portion 20E and the position of the input/output terminal 22B is the distance in the X direction between the position of the center P4 of the via electrode portion 20D and the position of the input/output terminal 22B. less than
- the distance in the Y direction between the position of the center P5 of the via electrode portion 20E and the position of the input/output terminal 22B is the distance in the Y direction between the position of the center P4 of the via electrode portion 20D and the position of the input/output terminal 22B. is equivalent to
- the resonators 11A, 11B, 11D, and 11E are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. That is, the resonator 11A and the resonator 11E are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. Further, the resonator 11B and the resonator 11D are also arranged point-symmetrically with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In this embodiment, the reason why the resonators 11A, 11B, 11D, and 11E are arranged point-symmetrically is to obtain good frequency characteristics.
- the positions of the center P1 of the via electrode portion 20A and the center P4 of the via electrode portion 20D in the Y direction are located on the side surface 14e side with respect to the position of the center C of the dielectric substrate 14 in the Y direction.
- the positions of the center P2 of the via electrode portion 20B and the center P5 of the via electrode portion 20E in the Y direction are located on the side 14f side with respect to the position of the center C of the dielectric substrate 14 in the Y direction.
- the positions of the center of the input/output terminal 22A and the center of the input/output terminal 22B in the Y direction are set equal to the position of the center C of the dielectric substrate 14 in the Y direction.
- coupling capacitance electrodes (plate electrodes) 70A to 70F are formed in the dielectric substrate .
- a coupling capacitance electrode 70A is provided in the resonator 11A.
- a coupling capacitance electrode 70B is provided in the resonator 11E.
- a coupling capacitance electrode 70C is provided in the resonator 11B.
- a coupling capacitance electrode 70D is provided in the resonator 11D.
- the coupling capacitance electrodes 70E and 70F are provided near the center C (see FIG. 19) of the dielectric substrate 14 in plan view.
- the coupling capacitance electrodes 70A-70F are formed in the same layer.
- the coupling capacitance electrodes 70A-70F are formed on the same ceramic sheet (not shown).
- Reference numeral 70 is used when the individual coupling capacitance electrodes are described without discrimination, and reference numerals 70A to 70F are used when the individual coupling capacitance electrodes are described separately.
- One or more ceramic sheets (not shown) are present between the coupling capacitance electrode 70 and the capacitor electrode 18 .
- the coupling capacitance electrode 70 can be formed by, for example, a printing method.
- the coupling capacitance electrodes 70 are arranged point-symmetrically with the center C of the dielectric substrate 14 in plan view as the center of symmetry. That is, the coupling capacitance electrode 70A and the coupling capacitance electrode 70B are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In addition, the coupling capacitance electrode 70C and the coupling capacitance electrode 70D are also arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In addition, the coupling capacitance electrode 70E and the coupling capacitance electrode 70F are also arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In this embodiment, the reason why the coupling capacitance electrodes 70 are arranged point-symmetrically is to obtain good frequency characteristics.
- the coupling capacitance electrode 70A is connected to the via electrode portion 20A.
- the lower surface of the coupling capacitance electrode 70A is connected to the upper surface of the capacitor electrode 18A via a portion of the via electrode portion 20A.
- the coupling capacitance electrode 70B is connected to the via electrode portion 20E.
- the lower surface of the coupling capacitance electrode 70B is connected to the upper surface of the capacitor electrode 18E via a portion of the via electrode portion 20E.
- the coupling capacitance electrode 70C is connected to the via electrode portion 20B.
- the lower surface of the coupling capacitance electrode 70C is connected to the upper surface of the capacitor electrode 18B through a portion of the via electrode portion 20B.
- the coupling capacitance electrode 70D is connected to the via electrode portion 20D.
- the lower surface of the coupling capacitance electrode 70D is connected to the upper surface of the capacitor electrode 18D through a portion of the via electrode portion 20D.
- the coupling capacitance electrode 70A includes partial patterns (electrode patterns) 70A1 to 70A3.
- Partial pattern 70A1 is connected to via electrode portion 20A.
- One end of the partial pattern 70A2 is connected to the partial pattern 70A1.
- the partial pattern 70A2 protrudes in the +X direction.
- One end of the partial pattern 70A3 is connected to the partial pattern 70A1.
- the partial pattern 70A3 protrudes in the +Y direction.
- the coupling capacitance electrode 70B includes partial patterns 70B1 to 70B3. Partial pattern 70B1 is connected to via electrode portion 20E. One end of the partial pattern 70B2 is connected to the partial pattern 70B1. The partial pattern 70B2 protrudes in the -X direction. One end of the partial pattern 70B3 is connected to the partial pattern 70B1. The partial pattern 70B3 protrudes in the -Y direction.
- the coupling capacitance electrode 70C includes partial patterns 70C1 to 70C3. Partial pattern 70C1 is connected to via electrode portion 20B. One end of the partial pattern 70C2 is connected to the partial pattern 70C1. The partial pattern 70C2 protrudes in the -X direction. One end of the partial pattern 70C3 is connected to the partial pattern 70C1. The partial pattern 70C3 protrudes in the +X direction.
- the coupling capacitance electrode 70D includes partial patterns 70D1 to 70D3. Partial pattern 70D1 is connected to via electrode portion 20D. One end of the partial pattern 70D2 is connected to the partial pattern 70D1. The partial pattern 70D2 protrudes in the +X direction. One end of the partial pattern 70D3 is connected to the partial pattern 70D1. The partial pattern 70D3 protrudes in the -X direction.
- the position of the coupling capacitance electrode 70E in the Y direction is between the positions of the coupling capacitance electrodes 70A and 70D in the Y direction and the positions of the coupling capacitance electrodes 70B and 70C in the Y direction.
- the X-direction position of the coupling capacitance electrode 70E is between the X-direction position of the partial pattern 70A3 provided on the coupling capacitance electrode 70A and the X-direction position of the coupling capacitance electrode 70F.
- the coupling capacitance electrode 70E is connected to the coupling capacitance electrode 70C.
- the position of the coupling capacitance electrode 70F in the Y direction is between the positions of the coupling capacitance electrodes 70A and 70D in the Y direction and the positions of the coupling capacitance electrodes 70B and 70C in the Y direction.
- the X-direction position of the coupling capacitance electrode 70F is between the X-direction position of the partial pattern 70B3 provided on the coupling capacitance electrode 70B and the X-direction position of the coupling capacitance electrode 70E.
- the coupling capacitance electrode 70F is connected to the coupling capacitance electrode 70D.
- coupling capacitance electrodes (plate electrodes) 72A to 72E are further formed.
- the coupling capacitance electrodes 72A-72E are formed in the same layer. In other words, the coupling capacitance electrodes 72A to 72E are formed on the same ceramic sheet (not shown).
- Reference numeral 72 is used when the individual coupling capacitance electrodes are described without discrimination, and reference numerals 72A to 72E are used when the individual coupling capacitance electrodes are described separately.
- One or more ceramic sheets (not shown) are present between the coupling capacitance electrode 72 and the coupling capacitance electrode 70 .
- the coupling capacitance electrode 72 can be formed by, for example, a printing method.
- the coupling capacitance electrodes 72 are arranged point-symmetrically with the center C (see FIG. 19) of the dielectric substrate 14 in plan view as the center of symmetry. That is, the coupling capacitance electrode 72A and the coupling capacitance electrode 72B are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In addition, the coupling capacitance electrode 72C and the coupling capacitance electrode 72D are also arranged point-symmetrically with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In this embodiment, the reason why the coupling capacitance electrodes 72 are arranged point-symmetrically is to obtain good frequency characteristics.
- the longitudinal direction of the coupling capacitance electrode 72A is the Y direction.
- One end of the coupling capacitance electrode 72A overlaps the coupling capacitance electrode 70A in plan view. More specifically, one end of the coupling capacitance electrode 72A overlaps the partial pattern 70A3 in plan view.
- the other end of the coupling capacitance electrode 72A overlaps the coupling capacitance electrode 70C in plan view. More specifically, the other end of the coupling capacitance electrode 72A overlaps the partial pattern 70C2 in plan view.
- a capacitive coupling structure 71A is composed of the coupling capacitance electrode 70A, the coupling capacitance electrode 72A, and the coupling capacitance electrode 70C.
- the longitudinal direction of the coupling capacitance electrode 72B is the Y direction.
- One end of the coupling capacitance electrode 72B overlaps the coupling capacitance electrode 70D in plan view. More specifically, one end of the coupling capacitance electrode 72B overlaps the partial pattern 70D2 in plan view.
- the other end of the coupling capacitance electrode 72B overlaps the coupling capacitance electrode 70B in plan view. More specifically, the other end of the coupling capacitance electrode 72B overlaps the partial pattern 70B3 in plan view.
- a capacitive coupling structure 71B is configured by the coupling capacitance electrode 70B, the coupling capacitance electrode 72B, and the coupling capacitance electrode 70D.
- the longitudinal direction of the coupling capacitance electrode 72C is the X direction.
- One end of the coupling capacitance electrode 72C overlaps the coupling capacitance electrode 70A in plan view. More specifically, one end of the coupling capacitance electrode 72C overlaps the partial pattern 70A2 in plan view.
- the other end of the coupling capacitance electrode 72C overlaps the coupling capacitance electrode 70D in plan view. More specifically, the other end of the coupling capacitance electrode 72C overlaps the partial pattern 70D3 in plan view.
- a capacitive coupling structure 71C is composed of the coupling capacitance electrode 70A, the coupling capacitance electrode 72C, and the coupling capacitance electrode 70D.
- a via electrode portion 20A and a via electrode portion 20D are located on the extended region of the coupling capacitance electrode 72C. That is, the via electrode portion 20A is positioned on the extension region of one end of the coupling capacitance electrode 72C, and the via electrode portion 20D is positioned on the extension region of the other end of the coupling capacitance electrode 72C.
- the longitudinal direction of the coupling capacitance electrode 72D is the X direction.
- One end of the coupling capacitance electrode 72D overlaps the coupling capacitance electrode 70B in plan view. More specifically, one end of the coupling capacitance electrode 72D overlaps the partial pattern 70B2 in plan view.
- the other end of the coupling capacitance electrode 72D overlaps the coupling capacitance electrode 70C in plan view. More specifically, the other end of the coupling capacitance electrode 72D overlaps the partial pattern 70C3 in plan view.
- a capacitive coupling structure 71D is composed of the coupling capacitance electrode 70B, the coupling capacitance electrode 72D, and the coupling capacitance electrode 70C.
- a via electrode portion 20B and a via electrode portion 20E are located on the extended region of the coupling capacitance electrode 72D. That is, the via electrode portion 20E is positioned on the extension region of one end of the coupling capacitance electrode 72D, and the via electrode portion 20B is positioned on the extension region of the other end of the coupling capacitance electrode 72C.
- the longitudinal direction of the coupling capacitance electrode 72E is the X direction.
- One end of the coupling capacitance electrode 72E overlaps the coupling capacitance electrode 70E in plan view.
- the other end of the coupling capacitance electrode 72E overlaps the coupling capacitance electrode 70F in plan view.
- the inter-electrode distance d1 (see FIG. 20A), which is the distance between the coupling capacitance electrode 72 and the coupling capacitance electrode 70 in the thickness direction of the coupling capacitance electrode 72, is, for example, about 0.12 mm, but is not limited to this.
- the inter-electrode distance d1 may be, for example, 0.06 mm.
- the inter-electrode distance d1 is not limited to these values.
- the dimension W12 of the coupling capacitance electrode 72A in the width direction (X direction) of the coupling capacitance electrode 72A is smaller than the dimension W11 of the partial pattern 70A3 in the width direction of the coupling capacitance electrode 72A. That is, the dimension W12 of the coupling capacitance electrode 72A in the X direction is smaller than the dimension W11 of the partial pattern 70A3 in the X direction.
- Regions (portions) 73A2 and 73A3 where the coupling capacitance electrode 72A and the partial pattern 70A3 do not overlap exist on both sides of the region (portion) 73A1 where the coupling capacitance electrode 72A and the partial pattern 70A3 overlap in plan view. .
- the area 73A2 is located on the -X side with respect to the area 73A1.
- the region 73A3 is located on the +X side with respect to the region 73A1.
- a dimension W11 of the partial pattern 70A3 in the width direction of the coupling capacitance electrode 72A is set to 0.54 mm, for example.
- a dimension W12 of the coupling capacitance electrode 72A in the width direction of the coupling capacitance electrode 72A is set to 0.18 mm, for example.
- the dimension W12 of the coupling capacitance electrode 72A in the width direction of the coupling capacitance electrode 72A is smaller than the dimension of the partial pattern 70C2 in the width direction of the coupling capacitance electrode 72A. That is, the dimension W12 of the coupling capacitance electrode 72A in the X direction is smaller than the dimension of the partial pattern 70C2 in the X direction.
- Regions 73B2 and 73B3 where the coupling capacitance electrode 72A and the partial pattern 70C2 do not overlap exist on both sides of the region 73B1 where the coupling capacitance electrode 72A and the partial pattern 70C2 overlap in plan view.
- the region 73B2 is located on the -X side with respect to the region 73B1.
- the region 73B3 is located on the +X side with respect to the region 73B1.
- the dimension W12 of the coupling capacitance electrode 72B in the width direction (X direction) of the coupling capacitance electrode 72B is smaller than the dimension W11 of the partial pattern 70B3 in the width direction of the coupling capacitance electrode 72B. That is, the dimension W12 of the coupling capacitance electrode 72B in the X direction is smaller than the dimension W11 of the partial pattern 70B3 in the X direction.
- Regions 73C2 and 73C3 where the coupling capacitance electrode 72B and the partial pattern 70B3 do not overlap exist on both sides of the region 73C1 where the coupling capacitance electrode 72B and the partial pattern 70B3 overlap in plan view.
- the region 73C2 is located on the -X side with respect to the region 73C1.
- the region 73C3 is located on the +X side with respect to the region 73C1.
- a dimension W11 of the partial pattern 70B3 in the width direction of the coupling capacitance electrode 72B is set to 0.54 mm, for example.
- a dimension W12 of the coupling capacitance electrode 72B in the width direction of the coupling capacitance electrode 72B is set to 0.18 mm, for example.
- the dimension W12 of the coupling capacitance electrode 72B in the width direction of the coupling capacitance electrode 72B is smaller than the dimension W11 of the partial pattern 70D2 in the width direction of the coupling capacitance electrode 72B. That is, the dimension W12 of the coupling capacitance electrode 72B in the X direction is smaller than the dimension W11 of the partial pattern 70D2 in the X direction.
- Regions 73D2 and 73D3 where the coupling capacitance electrode 72B and the partial pattern 70D2 do not overlap exist on both sides of the region 73D1 where the coupling capacitance electrode 72B and the partial pattern 70D2 overlap in plan view.
- the region 73D2 is located on the -X side with respect to the region 73D1.
- the region 73D3 is positioned on the +X side with respect to the region 73D1.
- the dimension W22 of the coupling capacitance electrode 72C in the width direction (Y direction) of the coupling capacitance electrode 72C is smaller than the dimension W21 of the partial pattern 70A2 in the width direction of the coupling capacitance electrode 72C. That is, the dimension W22 of the coupling capacitance electrode 72C in the Y direction is smaller than the dimension W21 of the partial pattern 70A2 in the Y direction.
- Regions 73E2 and 73E3 where the coupling capacitance electrode 72C and the partial pattern 70A2 do not overlap exist on both sides of the region 73E1 where the coupling capacitance electrode 72C and the partial pattern 70A2 overlap in plan view.
- the region 73E2 is located on the -Y side with respect to the region 73E1.
- the region 73E3 is located on the +Y side with respect to the region 73E1.
- a dimension W21 of the partial pattern 70A2 in the width direction of the coupling capacitance electrode 72C is set to 0.56 mm, for example.
- a dimension W22 of the coupling capacitance electrode 72C in the width direction of the coupling capacitance electrode 72C is set to 0.34 mm, for example.
- the dimension W22 of the coupling capacitance electrode 72C in the width direction of the coupling capacitance electrode 72C is smaller than the dimension W21 of the partial pattern 70D3 in the width direction of the coupling capacitance electrode 72C. That is, the dimension W22 of the coupling capacitance electrode 72C in the Y direction is smaller than the dimension W21 of the partial pattern 70D3 in the Y direction.
- Regions 73F2 and 73F3 where the coupling capacitance electrode 72C and the partial pattern 70D3 do not overlap exist on both sides of the region 73F1 where the coupling capacitance electrode 72C and the partial pattern 70D3 overlap in plan view.
- the region 73F2 is located on the -Y side with respect to the region 73F1.
- the region 73F3 is located on the +Y side with respect to the region 73F1.
- a dimension W21 of the partial pattern 70D3 in the width direction of the coupling capacitance electrode 72C is set to 0.56 mm, for example.
- the dimension W22 of the coupling capacitance electrode 72D in the width direction (Y direction) of the coupling capacitance electrode 72D is smaller than the dimension W21 of the partial pattern 70C3 in the width direction of the coupling capacitance electrode 72D. That is, the dimension W22 of the coupling capacitance electrode 72D in the Y direction is smaller than the dimension W21 of the partial pattern 70C3 in the Y direction.
- Regions 73G2 and 73G3 where the coupling capacitance electrode 72D and the partial pattern 70C3 do not overlap exist on both sides of the region 73G1 where the coupling capacitance electrode 72D and the partial pattern 70C3 overlap in plan view.
- the region 73G2 is located on the -Y side with respect to the region 73G1.
- the region 73G3 is located on the +Y side with respect to the region 73G1.
- a dimension W21 of the partial pattern 70C3 in the width direction of the coupling capacitance electrode 72D is set to 0.56 mm, for example.
- a dimension W22 of the coupling capacitance electrode 72D in the width direction of the coupling capacitance electrode 72D is set to 0.34 mm, for example.
- the dimension W22 of the coupling capacitance electrode 72D in the width direction of the coupling capacitance electrode 72D is smaller than the dimension W21 of the partial pattern 70B2 in the width direction of the coupling capacitance electrode 72D. That is, the dimension W22 of the coupling capacitance electrode 72D in the Y direction is smaller than the dimension W21 of the partial pattern 70B2 in the Y direction.
- Regions 73H2 and 73H3 where the coupling capacitance electrode 72D and the partial pattern 70B2 do not overlap exist on both sides of the region 73H1 where the coupling capacitance electrode 72D and the partial pattern 70B2 overlap in plan view.
- the region 73H2 is located on the -Y side with respect to the region 73H1.
- the region 73H3 is located on the +Y side with respect to the region 73H1.
- a dimension W21 of the partial pattern 70B2 in the width direction of the coupling capacitance electrode 72D is set to 0.56 mm, for example.
- ⁇ W1 is preferably 1.4 times or more the inter-electrode distance d1.
- the dimensional difference ⁇ W1, that is, the dimensional difference (W11 ⁇ W12) is more preferably 2.6 times or more the distance d1 between the electrodes.
- the dimensional difference ⁇ W1 is set to three times the inter-electrode distance d1.
- the dimension difference ⁇ W1 is set relatively large as described above, the dimension L1 in the X direction of the regions 73A2, 73A3, 73B2, 73B3, 73C2, 73C3, 73D2, and 73D3 is relatively large.
- the dimension W11 of the partial patterns 70A3 and 70B3 in the width direction of the coupling capacitance electrodes 72A and 72B is 0.54 mm, and the dimension W12 of the coupling capacitance electrodes 72A and 72B in the width direction of the coupling capacitance electrodes 72A and 72B is 0.18 mm.
- the dimensional difference ⁇ W1 is 0.36 mm.
- the dimension L1 is 0.18 mm.
- the dimension L1 is, for example, 1.5 times the inter-electrode distance d1.
- the dimension L1 is, for example, 1.5 times the inter-electrode distance d1.
- a value obtained by subtracting the dimension W22 of the coupling capacitance electrodes 72C and 72D in the width direction of the coupling capacitance electrodes 72C and 72D from the dimension W21 of the partial patterns 70A2, 70B2, 70C3 and 70D3 in the width direction of the coupling capacitance electrodes 72C and 72D. is preferably 1.4 times or more the inter-electrode distance d1.
- the dimensional difference ⁇ W2, that is, the dimensional difference (W21-W22) is set to 1.84 times the inter-electrode distance d1.
- the dimension L2 in the Y direction of the regions 73E2, 73E3, 73F2, 73F3, 73G2, 73G3, 73H2, and 73H3 is relatively large.
- the dimension W21 of the partial patterns 70A2, 70B2, 70C3, and 70D3 in the width direction of the coupling capacitance electrodes 72C and 72D is 0.56 mm
- the dimension W22 of the coupling capacitance electrodes 72C and 72D in the width direction of the coupling capacitance electrodes 72C and 72D is 0. .34 mm
- the dimensional difference .DELTA.W2 is 0.22 mm.
- the dimension L2 is 0.11 mm.
- the dimension L2 is, for example, 0.92 times the inter-electrode distance d1.
- the dimension L2 is 0.92 times the inter-electrode distance d1.
- the maximum value of misalignment during manufacturing is, for example, about 0.03 mm. If the maximum misalignment during manufacturing is 0.03 mm, the dimensions L1 and L2 can be set to 0.03 mm, for example. In contrast, in this embodiment, the dimensions L1 and L2 are set relatively large.
- the reason why the dimensions L1 and L2 are relatively large in this embodiment is as follows. That is, when the dimensions L1 and L2 are relatively small, the capacitance of the capacitive coupling structures 71A to 71D fluctuates greatly if a certain amount of positional deviation occurs during manufacturing. If the capacitances of the capacitive coupling structures 71A-71D fluctuate greatly, good filter characteristics cannot be obtained.
- the dimensions L1 and L2 are relatively large, the capacitance of the capacitive coupling structures 71A-71D will not change much even if some degree of misalignment occurs during manufacturing. For this reason, the dimensions L1 and L2 are set relatively large in this embodiment.
- the dimension L2 is set smaller than the dimension L1 is as follows. That is, from the viewpoint of suppressing variations in the capacitance of the capacitive coupling structure 71C due to misalignment during manufacturing, it is preferable to make the dimension L2 relatively large.
- the coupling capacitance electrode 72C and the partial patterns 70A2, 70D3, 70B2 and 70C3 overlap each other in plan view to ensure the areas of the regions 73E1, 73F1, 73G1 and 73H1. It is preferable to increase the dimension in the X direction of the capacitance electrodes 72C and 72D.
- the distance in the X direction between the coupling capacitance electrode 72C and the via electrode portion 20A is shortened, and the distance between the coupling capacitance electrode 72C and the via electrode portion 20D is reduced.
- the dimension of the coupling capacitance electrode 72D in the X direction is increased, the distance in the X direction between the coupling capacitance electrode 72D and the via electrode portion 20B is shortened, and the distance between the coupling capacitance electrode 72D and the via electrode portion 20E is reduced.
- the filter characteristics may be adversely affected.
- the filter characteristics are adversely affected.
- none of the via electrode portions 20 are located on the extension regions of at least one ends of the coupling capacitance electrodes 72A and 72B.
- the via electrode portion 20B is arranged at a position spaced apart in the +X direction with respect to the coupling capacitance electrode 72A. Therefore, even if the coupling capacitance electrode 72A is extended in the +Y direction, the distance between the coupling capacitance electrode 72A and the via electrode section 20B does not decrease. Also, the via electrode portion 20D is arranged at a position spaced apart in the -X direction with respect to the coupling capacitance electrode 72B. Therefore, even if the coupling capacitance electrode 72B is extended in the -Y direction, the distance between the coupling capacitance electrode 72B and the via electrode section 20D does not decrease. Extending the coupling capacitance electrode 72A in the +Y direction does not cause any particular problem. Also, extending the coupling capacitance electrode 72B in the -Y direction does not cause any particular problem. For these reasons, the dimension L2 is set smaller than the dimension L1.
- the dimension of the coupling capacitance electrode 72E in the width direction of the coupling capacitance electrode 72E is smaller than the dimension of the coupling capacitance electrode 70E in the width direction of the coupling capacitance electrode 72E. That is, the dimension of the coupling capacitance electrode 72E in the Y direction is smaller than the dimension of the coupling capacitance electrode 70E in the Y direction.
- the dimension of the coupling capacitance electrode 70E in the width direction of the coupling capacitance electrode 72E is set to 0.5 mm, for example.
- the dimension of the coupling capacitance electrode 72E in the width direction of the coupling capacitance electrode 72E is set to 0.29 mm, for example.
- the dimension of the coupling capacitance electrode 72E in the width direction of the coupling capacitance electrode 72E is smaller than the dimension of the coupling capacitance electrode 70F in the width direction of the coupling capacitance electrode 72E. That is, the dimension of the coupling capacitance electrode 72E in the Y direction is smaller than the dimension of the coupling capacitance electrode 70F in the Y direction.
- the dimension of the coupling capacitance electrode 70F in the width direction of the coupling capacitance electrode 72E is set to 0.5 mm, for example.
- the dimension difference ⁇ W3, which is a value obtained by subtracting the dimension W32 of the coupling capacitance electrode 72E in the width direction of the coupling capacitance electrode 72E from the dimension W31 of the coupling capacitance electrodes 70E and 70F in the width direction of the coupling capacitance electrode 72E, It is preferably at least 1.4 times the distance d1.
- the dimensional difference ⁇ W3, that is, the dimensional difference (W31-W32) is set to 1.75 times the inter-electrode distance d1.
- coupling capacitance electrodes (plate electrodes) 74A and 74B are formed in the dielectric substrate 14. As shown in FIG. The coupling capacitance electrodes 74A and 74B are formed in the same layer. In other words, the coupling capacitance electrodes 74A and 74B are formed on the same ceramic sheet (not shown). Reference numeral 74 is used when the individual coupling capacitance electrodes are described without distinction, and reference numerals 74A and 74B are used when the individual coupling capacitance electrodes are described separately. One or more ceramic sheets (not shown) are present between the coupling capacitance electrode 72 and the coupling capacitance electrode 74 .
- the coupling capacitance electrodes 74 are arranged point-symmetrically with the center C (see FIG. 19) of the dielectric substrate 14 in plan view as the center of symmetry. That is, the coupling capacitance electrode 74A and the coupling capacitance electrode 74B are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In this embodiment, the reason why the coupling capacitance electrodes 74 are arranged point-symmetrically is to obtain good frequency characteristics.
- the coupling capacitance electrode 74A includes partial patterns (electrode patterns) 74A1 to 74A3. Partial pattern 74A1 is connected to via electrode portion 20B. The partial pattern 74A3 is located on the -Y side with respect to the partial pattern 74A1. The partial pattern 74A3 is connected to the partial pattern 74A1 via the partial pattern 74A2. The partial pattern 74A3 overlaps the coupling capacitance electrode 70E in plan view. The size of the partial pattern 74A3 is the same as the size of the coupling capacitance electrode 70E. One end of the coupling capacitance electrode 72E is sandwiched between the coupling capacitance electrode 70E and the partial pattern 74A3.
- the coupling capacitance electrode 74B includes partial patterns 74B1 to 74B3. Partial pattern 74B1 is connected to via electrode portion 20D. The partial pattern 74B3 is positioned on the +Y side with respect to the partial pattern 74B1. The partial pattern 74B3 is connected to the partial pattern 74B1 via the partial pattern 74B2. The partial pattern 74B3 overlaps the coupling capacitance electrode 70F in plan view. The size of the partial pattern 74B3 is the same as the size of the coupling capacitance electrode 70F. The other end of the coupling capacitance electrode 72E is sandwiched between the coupling capacitance electrode 70F and the partial pattern 74B3.
- a capacitive coupling structure 71E is composed of the coupling capacitance electrode 70E, the coupling capacitance electrode 70F, the coupling capacitance electrode 72E, the coupling capacitance electrode 74A, and the coupling capacitance electrode 74B.
- coupling capacitance electrodes (comb-teeth electrodes, capacitance electrodes) 76A to 76D are further formed.
- the coupling capacitance electrodes 76A-76D are formed in the same layer.
- the coupling capacitance electrodes 76A to 76D are formed on the same ceramic sheet (not shown).
- Reference numeral 76 is used when the individual coupling capacitance electrodes are described without discrimination, and reference numerals 76A to 76D are used when the individual coupling capacitance electrodes are described separately.
- One or more ceramic sheets (not shown) are present between the coupling capacitance electrode 74 (see FIG. 22) and the coupling capacitance electrode 76 .
- the coupling capacitance electrodes 76 are arranged point-symmetrically with the center C (see FIG. 19) of the dielectric substrate 14 in plan view as the center of symmetry. That is, the coupling capacitance electrode 76A and the coupling capacitance electrode 76B are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In addition, the coupling capacitance electrode 76C and the coupling capacitance electrode 76D are also arranged point-symmetrically with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In this embodiment, the reason why the coupling capacitance electrodes 76 are arranged point-symmetrically is to obtain good frequency characteristics.
- the coupling capacitance electrode 76A includes partial patterns (electrode patterns) 76A1 to 76A4. Partial pattern 76A1 is connected to via electrode portion 20A.
- the longitudinal direction of the partial pattern 76A2 is the X direction.
- One end of the partial pattern 76A2 is connected to the partial pattern 76A1.
- the partial pattern 76A2 protrudes in the +X direction.
- One end of the partial pattern 76A3 is connected to the other end of the partial pattern 76A2.
- the longitudinal direction of the partial pattern 76A3 is the Y direction.
- the partial pattern 76A3 protrudes in the -Y direction. That is, the partial pattern 76A3 protrudes toward the side surface 14e.
- One end of the partial pattern 76A4 is connected to the partial pattern 76A1.
- the longitudinal direction of the partial pattern 76A4 is the Y direction.
- the partial pattern 76A4 protrudes in the +Y direction.
- the partial pattern 76A4 protrudes along the longitudinal direction of the partial pattern 76A3.
- the coupling capacitance electrode 76B includes partial patterns 76B1 to 76B4. Partial pattern 76B1 is connected to via electrode portion 20E.
- the longitudinal direction of the partial pattern 76B2 is the X direction. One end of the partial pattern 76B2 is connected to the partial pattern 76B1.
- the partial pattern 76B2 protrudes in the -X direction.
- One end of the partial pattern 76B3 is connected to the other end of the partial pattern 76B2.
- the longitudinal direction of the partial pattern 76B3 is the Y direction.
- the partial pattern 76B3 protrudes in the +Y direction.
- the partial pattern 76B3 protrudes along the longitudinal direction of the partial pattern 76A3.
- One end of the partial pattern 76B4 is connected to the partial pattern 76B1.
- the longitudinal direction of the partial pattern 76B4 is the Y direction.
- the partial pattern 76B4 protrudes in the -Y direction.
- the partial pattern 76B4 protru
- the coupling capacitance electrode 76C includes partial patterns 76C1 to 76C6.
- Partial pattern 76C1 is connected to via electrode portion 20B.
- the longitudinal direction of the partial pattern 76C2 is the X direction.
- One end of the partial pattern 76C2 is connected to the partial pattern 76C1.
- the partial pattern 76C2 protrudes in the -X direction.
- One end of the partial pattern 76C3 is connected to the other end of the partial pattern 76C2.
- the longitudinal direction of the partial pattern 76C3 is the Y direction.
- the partial pattern 76C3 protrudes in the -Y direction.
- the partial pattern 76C3 protrudes along the longitudinal direction of the partial pattern 76A3.
- the longitudinal direction of the partial pattern 76C4 is connected to the partial pattern 76C1.
- the longitudinal direction of the partial pattern 76C4 is the Y direction.
- the partial pattern 76C4 protrudes in the -Y direction.
- the partial pattern 76C4 protrudes along the longitudinal direction of the partial pattern 76A3.
- the longitudinal direction of the partial pattern 76C5 is the X direction.
- One end of the partial pattern 76C5 is connected to the partial pattern 76C1.
- the partial pattern 76C5 protrudes in the +X direction.
- One end of the partial pattern 76C6 is connected to the other end of the partial pattern 76C5.
- the longitudinal direction of the partial pattern 76C6 is the Y direction.
- the partial pattern 76C6 protrudes in the +Y direction. That is, the partial pattern 76C6 protrudes toward the side surface 14f.
- the partial pattern 76C6 protrudes along the longitudinal direction of the partial pattern 76A3.
- the coupling capacitance electrode 76D includes partial patterns 76D1 to 76D6.
- Partial pattern 76D1 is connected to via electrode portion 20D.
- the longitudinal direction of the partial pattern 76D2 is the X direction.
- One end of the partial pattern 76D2 is connected to the partial pattern 76D1.
- the partial pattern 76D2 protrudes in the +X direction.
- One end of the partial pattern 76D3 is connected to the other end of the partial pattern 76D2.
- the longitudinal direction of the partial pattern 76D3 is the Y direction.
- the partial pattern 76D3 protrudes in the +Y direction.
- the partial pattern 76D3 protrudes along the longitudinal direction of the partial pattern 76A3.
- One end of the partial pattern 76D4 is connected to the partial pattern 76D1.
- the longitudinal direction of the partial pattern 76D4 is the Y direction.
- the partial pattern 76D4 protrudes in the +Y direction.
- the partial pattern 76D4 protrudes along the longitudinal direction of the partial pattern 76A3.
- the longitudinal direction of the partial pattern 76D5 is the X direction.
- One end of the partial pattern 76D5 is connected to the partial pattern 76D1.
- the partial pattern 76D5 protrudes in the -X direction.
- One end of the partial pattern 76D6 is connected to the other end of the partial pattern 76D5.
- the longitudinal direction of the partial pattern 76D6 is the Y direction.
- the partial pattern 76D6 protrudes in the -Y direction. That is, the partial pattern 76D6 protrudes toward the side surface 14e.
- the partial pattern 76A3 and the partial pattern 76D6 are adjacent to each other. Since the partial pattern 76A3 and the partial pattern 76D6 are adjacent to each other, the coupling capacitance electrode 76A and the coupling capacitance electrode 76D are capacitively coupled.
- a capacitive coupling structure 77A is formed by the coupling capacitance electrode 76A and the coupling capacitance electrode 76D.
- the position in the Y direction of the partial pattern 76A2 and the position in the Y direction of the partial pattern 76D5 are equivalent. Both the partial pattern 76A3 and the partial pattern 76D6 protrude in the -Y direction. That is, the partial pattern 76A3 and the partial pattern 76D6 protrude toward the side surface 14e.
- the Y-direction positions of the partial patterns 76A3 and 76D6 are between the Y-direction positions of the partial patterns 76A2 and 76D5 and the Y-direction position of the shield conductor 12Ca.
- both the partial pattern 76A3 and the partial pattern 76D6 protrude toward the side surface 14e is as follows. That is, the reason why both the partial pattern 76A3 and the partial pattern 76D6 protrude in the -Y direction is as follows.
- the partial patterns 76A3 and 76D6 protrude in the +Y direction are close to the partial patterns 76C3 and 76C4.
- the partial patterns 76A3, 76D6 and the partial patterns 76C3, 76C4, etc. come close to each other, the partial patterns 76A3, 76D6 and the partial patterns 76C3, 76C4, etc. are capacitively coupled to each other.
- partial patterns 76A3, 76D6 and partial patterns 76C3, 76C4, etc. are capacitively coupled to each other.
- these partial patterns 76A3 and 76D6 are not close to the partial patterns 76C3 and 76C4. Since the partial patterns 76A3, 76D6 and the partial patterns 76C3, 76C4, etc. are not close to each other, the partial patterns 76A3, 76D6 and the partial patterns 76C3, 76C4 are not capacitively coupled to each other. For this reason, both the partial pattern 76A3 and the partial pattern 76D6 project toward the side surface 14e in this embodiment.
- the partial pattern 76B3 and the partial pattern 76C6 are adjacent to each other. Since partial pattern 76B3 and partial pattern 76C6 are adjacent to each other, coupling capacitance electrode 76B and coupling capacitance electrode 76C are capacitively coupled.
- a capacitive coupling structure 77B is formed by the coupling capacitance electrode 76B and the coupling capacitance electrode 76C.
- the position in the Y direction of the partial pattern 76B2 and the position in the Y direction of the partial pattern 76C5 are equivalent. Both the partial pattern 76B3 and the partial pattern 76C6 protrude in the +Y direction. That is, the partial pattern 76B3 and the partial pattern 76C6 protrude toward the side surface 14f.
- the Y-direction positions of the partial patterns 76B3 and 76C6 are between the Y-direction positions of the partial patterns 76B2 and 76C5 and the Y-direction position of the shield conductor 12Cb.
- both the partial pattern 76B3 and the partial pattern 76C6 protrude toward the side surface 14f is as follows. That is, the reason why both the partial pattern 76B3 and the partial pattern 76C6 protrude in the +Y direction is as follows.
- these partial patterns 76B3 and 76C6 are close to the partial patterns 76D3 and 76D4.
- the partial patterns 76B3, 76C6 and the partial patterns 76D3, 76D4, etc. are close to each other, the partial patterns 76B3, 76C6 and the partial patterns 76D3, 76D4, etc. are capacitively coupled to each other.
- partial patterns 76B3, 76C6 and partial patterns 76D3, 76D4, etc. are capacitively coupled to each other.
- these partial patterns 76B3 and 76C6 are not close to the partial patterns 76D3 and 76D4. Since the partial patterns 76B3, 76C6 and the partial patterns 76D3, 76D4, etc. are not close to each other, the partial patterns 76B3, 76C6 and the partial patterns 76D3, 76D4 are not capacitively coupled to each other. For this reason, both the partial pattern 76B3 and the partial pattern 76C6 protrude toward the side surface 14f in this embodiment.
- the partial pattern 76A4 and the partial pattern 76C3 are adjacent to each other. Since partial pattern 76A4 and partial pattern 76C3 are adjacent to each other, coupling capacitance electrode 76A and coupling capacitance electrode 76C are capacitively coupled.
- a capacitive coupling structure 77C is formed by the coupling capacitance electrode 76A and the coupling capacitance electrode 76C.
- the partial pattern 76B4 and the partial pattern 76D3 are adjacent to each other. Since the partial pattern 76B4 and the partial pattern 76D3 are adjacent to each other, the coupling capacitance electrode 76B and the coupling capacitance electrode 76D are capacitively coupled.
- a capacitive coupling structure 77D is formed by the coupling capacitance electrode 76B and the coupling capacitance electrode 76D.
- the partial pattern 76C4 and the partial pattern 76D4 are adjacent to each other. Since the partial pattern 76C4 and the partial pattern 76D4 are adjacent to each other, the coupling capacitance electrode 76C and the coupling capacitance electrode 76D are capacitively coupled.
- a capacitive coupling structure 77E is formed by the coupling capacitance electrode 76C and the coupling capacitance electrode 76D.
- coupling capacitance electrodes (comb-teeth electrodes, capacitance electrodes) 78A to 78C are further formed in the dielectric substrate .
- the coupling capacitance electrodes 78A-78C are formed in the same layer. In other words, the coupling capacitance electrodes 78A-78C are formed on the same ceramic sheet (not shown).
- Reference numeral 78 is used when the individual coupling capacitance electrodes are described without discrimination, and reference numerals 78A to 78C are used when the individual coupling capacitance electrodes are described separately.
- One or more ceramic sheets (not shown) are present between the coupling capacitance electrode 76 and the coupling capacitance electrode 78 .
- the coupling capacitance electrodes 78 are arranged point-symmetrically with the center C (see FIG. 19) of the dielectric substrate 14 in plan view as the center of symmetry. That is, the coupling capacitance electrode 78A and the coupling capacitance electrode 78B are arranged at point-symmetrical positions with the center C of the dielectric substrate 14 in plan view as the center of symmetry. Further, the coupling capacitance electrode 78C is also formed point-symmetrically with the center C of the dielectric substrate 14 in plan view as the center of symmetry. In this embodiment, the reason why the coupling capacitance electrodes 78 are arranged point-symmetrically is to obtain good frequency characteristics.
- the coupling capacitance electrode 78A includes partial patterns 78A1 and 78A2. Partial pattern 78A1 is connected to via electrode portion 20A. The longitudinal direction of the partial pattern 78A2 is the Y direction.
- the coupling capacitance electrode 78B includes partial patterns 78B1 and 78B2. Partial pattern 78B1 is connected to via electrode portion 20E. The longitudinal direction of the partial pattern 78B2 is the Y direction.
- the coupling capacitance electrode 78C includes partial patterns 78C1 to 78C3.
- the longitudinal direction of the partial pattern 78C1 is the Y direction.
- Partial pattern 78C1 is adjacent to partial pattern 78A2.
- the longitudinal direction of the partial pattern 78C2 is the Y direction.
- the partial pattern 78C2 is adjacent to the partial pattern 78B2.
- One end of the partial pattern (relay pattern) 78C3 is connected to the partial pattern 78C1.
- the other end of the partial pattern 78C3 is connected to the partial pattern 78C2. Since partial pattern 78A2 and partial pattern 78C1 are adjacent to each other, coupling capacitance electrode 78A and coupling capacitance electrode 78C are capacitively coupled. Since the partial pattern 78B2 and the partial pattern 78C2 are adjacent to each other, the coupling capacitance electrode 78B and the coupling capacitance electrode 78C are capacitively coupled.
- Input/output patterns 80A and 80B are further formed in the dielectric substrate 14, as shown in FIG. Input/output patterns 80A and 80B are formed in the same layer. In other words, the input/output patterns 80A and 80B are formed on the same ceramic sheet (not shown). Reference numeral 80 is used when individual input/output patterns are described without distinction, and reference numerals 80A and 80B are used when individual input/output patterns are described separately. One or more ceramic sheets (not shown) are present between the coupling capacitance electrode 78 and the input/output pattern 80 .
- the input/output pattern 80A includes partial patterns 80A1 and 80A2. One end of the partial pattern 80A1 is connected to the input/output terminal 22A. The other end of partial pattern 80A1 is connected to partial pattern 80A2. Partial pattern 80A2 is connected to via electrode portion 20A. Thus, the input/output terminal 22A is connected to the via electrode portion 20A through the input/output pattern 80A.
- the input/output pattern 80B includes partial patterns 80B1 and 80B2. One end of the partial pattern 80B1 is connected to the input/output terminal 22B. The other end of the partial pattern 80B1 is connected to the partial pattern 80B2. Partial pattern 80B2 is connected to via electrode portion 20E. Thus, the input/output terminal 22B is connected to the via electrode portion 20E via the input/output pattern 80B.
- the input/output terminal 22A is electrically connected to the via electrode portion 20A through the input/output pattern 80A
- the input/output terminal 22B is electrically connected to the via electrode portion 20E through the input/output pattern 80B.
- the external Q can be appropriately adjusted by appropriately setting the positions of the input/output patterns 80A and 80B in the Z direction. That is, in the present embodiment, the external Q can be appropriately adjusted by appropriately setting the positions of the input/output patterns 80A and 80B in the longitudinal direction of the via electrode portions 20A and 20E.
- shielding via electrode portions 81A to 81D are formed in the dielectric substrate 14. As shown in FIG. 26, shielding via electrode portions 81A to 81D are formed in the dielectric substrate 14. As shown in FIG. Reference numeral 81 is used when the individual shielded via electrode portions are described without distinction, and reference numerals 81A to 81D are used when the individual shielded via electrode portions are identified and described.
- the shielded via electrode portion 81A is provided with a shielded via electrode 82A and a shielded via electrode 82B.
- the shield via electrode portion 81B is provided with a shield via electrode 82C and a shield via electrode 82D.
- the shield via electrode portion 81C is provided with a shield via electrode 82E and a shield via electrode 82F.
- the shield via electrode portion 81D is provided with a shield via electrode 82G and a shield via electrode 82H.
- Reference numeral 82 is used when describing the individual shielded via electrodes without distinction, and reference numerals 82A to 82H are used when the individual shielded via electrodes are identified and described. In the example shown in FIG. 28 , one shielded via electrode portion 81 is provided with two shielded via electrodes 82 , but one shielded via electrode portion 81 may be composed of one shielded via electrode 82 .
- One end of the shield via electrode portion 81 is connected to the shield conductor 12A.
- the other end of the shield via electrode portion 81 is connected to the shield conductor 12B.
- the shielding via electrode portion 81A is connected to the shielding conductors 12A and 12B within an extension region 84A obtained by extending the region where the via electrode portion 20A is located in the -Y direction. That is, the shielded via electrode portion 81A is connected to the shielded conductors 12A and 12B within an extension region 84A obtained by extending the region where the via electrode portion 20A is located toward the shielded conductor 12Ca. Thus, the shielding via electrode portion 81A is selectively formed within the extension region 84A. The shield via electrode portion 81A is positioned near the shield conductor 12Ca. Note that the region where the via electrode portion 20 is located corresponds to the virtual ring 26 .
- the shield via electrode portion 81B is connected to the shield conductors 12A and 12B in an extension region 84E obtained by extending the region where the via electrode portion 20E is located in the +Y direction. That is, the shielded via electrode portion 81B is connected to the shielded conductors 12A and 12B within an extension region 84E obtained by extending the region where the via electrode portion 20E is located toward the shielded conductor 12Cb.
- the shielding via electrode portion 81B is selectively formed within the extension region 84E.
- the shield via electrode portion 81B is positioned near the shield conductor 12Cb.
- the shield via electrode portion 81C is connected to the shield conductors 12A and 12B in an extension region 84B obtained by extending the region where the via electrode portion 20B is located in the +Y direction. That is, the shielded via electrode portion 81C is connected to the shielded conductors 12A and 12B within an extension region 84B obtained by extending the region where the via electrode portion 20B is located toward the shielded conductor 12Cb.
- the shielding via electrode portion 81C is selectively formed within the extension region 84B.
- the shield via electrode portion 81C is positioned near the shield conductor 12Cb.
- the shield via electrode portion 81D is connected to the shield conductors 12A and 12B within an extension region 84D obtained by extending the region where the via electrode portion 20D is located in the -Y direction. That is, the shielded via electrode portion 81D is connected to the shielded conductors 12A and 12B within an extension region 84D obtained by extending the region where the via electrode portion 20D is located toward the shielded conductor 12Ca.
- the shielding via electrode portion 81D is selectively formed within the extension region 84D.
- the shield via electrode portion 81D is located near the shield conductor 12Ca.
- Reference numeral 84 is used when describing each extension region without distinction, and reference numerals 84A to 84D are used when describing each extension region with distinction.
- the reason why the shielding via electrode portion 81 is formed in this embodiment is as follows. In other words, if the dielectric substrate 14 is cut and misaligned, the distance between the via electrode portion 20 and the side surfaces 14e and 14f varies. When the distance between the via electrode portion 20 and the side surfaces 14e and 14f varies, the distance between the via electrode portion 20 and the shield conductors 12Ca and 12Cb varies. Fluctuations in the distance between the via electrode portion 20 and the shielding conductors 12Ca and 12Cb cause fluctuations in filter characteristics and the like. On the other hand, since the shielding via electrode portion 81 is not formed on the side surfaces 14e and 14f, it is not affected by misalignment when the dielectric substrate 14 is cut. That is, even if a positional deviation occurs when the dielectric substrate 14 is cut, the distance between the shielding via electrode portion 81 and the via electrode portion 20 does not change. For this reason, the shielding via electrode portion 81 is formed in this embodiment.
- the shielding via electrode portion 81 is selectively formed in the extension region 84 in this embodiment is as follows. That is, the shielding via electrode portion 81 can be formed by forming a via hole by irradiating the dielectric substrate 14 with a laser beam and filling the via hole with a conductor. That is, a certain amount of man-hours are required to form the shielding via electrode portion 81 . Therefore, if a large number of shielding via electrode portions 81 are simply arranged along the side surfaces 14e and 14f, good productivity cannot be obtained.
- the shielding via electrode portion 81 is arranged only in the extension region 84 , it is possible to suppress variations in filter characteristics and the like caused by positional deviation when cutting the dielectric substrate 14 . For this reason, the shielding via electrode portion 81 is selectively formed within the extension region 84 in this embodiment.
- the number of resonators 11 provided in the filter 10 is four. According to this embodiment, since the number of resonators 11 is relatively small, it is possible to suppress the degree of coupling between the resonators 11, thereby obtaining the filter 10 having desired characteristics.
- first embodiment and the second embodiment may be combined as appropriate.
- the case where the number of resonators 11 is five was explained as an example, and in the second embodiment, the case where the number of resonators 11 is four was explained as an example, but this is not the case. is not limited to For example, the number of resonators 11 may be six.
- the filter 10 according to the first embodiment may be provided with the shielding via electrode portions 81A to 81D, 81Ea, and 81Eb.
- FIG. 29 is a plan view showing an example of a filter according to a modified embodiment; As shown in FIG. 29, shielding via electrode portions 81A to 81D, 81Ea and 81Eb are formed in the dielectric substrate 14. As shown in FIG. The shielded via electrode portions 81A to 81D are the same as the shielded via electrode portions 81A to 81D provided in the filter 10 according to the second embodiment, and thus description thereof is omitted.
- the shield via electrode portion 81Ea includes a shield via electrode 82I and a shield via electrode 82J.
- the shield via electrode portion 81Eb includes a shield via electrode 82K and a shield via electrode 82L.
- Reference numeral 81 is used when the individual shielded via electrode portions are described without discrimination, and reference numerals 81A to 81D, 81Ea, and 81Eb are used when the individual shielded via electrode portions are described separately.
- One end of the shield via electrode portion 81 is connected to the shield conductor 12A.
- the other end of the shield via electrode portion 81 is connected to the shield conductor 12B.
- the shielding via electrode portion 81Ea is connected to the shielding conductors 12A and 12B within an extension region 84Ca obtained by extending the region where the via electrode portion 20C is located in the -Y direction. That is, the shielded via electrode portion 81Ea is connected to the shielded conductors 12A and 12B within an extension region 84Ca obtained by extending the region where the via electrode portion 20C is located toward the shielded conductor 12Ca.
- the shielding via electrode portion 81Ea is selectively formed within the extension region 84Ca.
- the shield via electrode portion 81Ea is located near the shield conductor 12Ca.
- the shield via electrode portion 81Eb is connected to the shield conductors 12A and 12B in an extension region 84Cb obtained by extending the region where the via electrode portion 20C is located in the +Y direction. That is, the shielded via electrode portion 81Eb is connected to the shielded conductors 12A and 12B within an extension region 84Cb obtained by extending the region where the via electrode portion 20C is located toward the shielded conductor 12Cb. Thus, the shielding via electrode portion 81Eb is selectively formed within the extension region 84Cb. The shield via electrode portion 81Eb is located near the shield conductor 12Cb.
- FIG. 30 is a plan view showing an example of a filter according to a modified embodiment.
- one shielding via electrode portion 81 is composed of one shielding via electrode 82 .
- the shield via electrode portion 81A is configured by a shield via electrode 82A.
- the shield via electrode portion 81B is configured by a shield via electrode 82C.
- the shield via electrode portion 81C is composed of a shield via electrode 82E.
- the shield via electrode portion 81D is configured by a shield via electrode 82G.
- the shield via electrode portion 81Ea is composed of a shield via electrode 82I.
- the shield via electrode portion 81Eb is composed of a shield via electrode 82K. In this manner, one shielded via electrode portion 81 may be configured by one shielded via electrode 82 .
- FIG. 31 is a plan view showing an example of a filter according to a modified embodiment.
- the shielding via electrode portion 81Ea is located at an intermediate portion between the via electrode portion 20C and the shielding conductor 12Ca.
- the shield via electrode portion 81Ea is not positioned near the shield conductor 12Ca.
- the distance in the Y direction between the shielded via electrode portion 81Ea and the shielded conductor 12Ca is greater than the distance in the Y direction between the shielded via electrode portions 81A, 81D and the shielded conductor 12Ca.
- FIG. 31 is a plan view showing an example of a filter according to a modified embodiment.
- the shielding via electrode portion 81Ea is located at an intermediate portion between the via electrode portion 20C and the shielding conductor 12Ca.
- the shield via electrode portion 81Ea is not positioned near the shield conductor 12Ca.
- the shielded via electrode portion 81Eb is located at an intermediate portion between the via electrode portion 20C and the shielded conductor 12Cb. That is, in the example shown in FIG. 31, the shield via electrode portion 81Eb is not positioned near the shield conductor 12Cb. The distance in the Y direction between the shielded via electrode portion 81Eb and the shielded conductor 12Cb is greater than the distance in the Y direction between the shielded via electrode portions 81B, 81C and the shielded conductor 12Cb. In this way, the shielded via electrode portion 81Ea may be located at an intermediate portion between the via electrode portion 20C and the shielded conductor 12Ca. Also, the shield via electrode portion 81Eb may be located at an intermediate portion between the via electrode portion 20C and the shield conductor 12Cb.
- the input/output terminals 22A and 22B are connected to the shield conductor 12B via the connection lines 32a and 32b
- the present invention is not limited to this.
- the input/output terminals 22A and 22B may be connected to the via electrode portions 20A and 20E via the input/output patterns 80A and 80B (see FIG. 19).
- the input/output terminals 22A and 22B are connected to the via electrode portions 20A and 20E through the input/output patterns 80A and 80B has been described as an example, but the present invention is not limited to this.
- the input/output terminals 22A, 22B may be connected to the shield conductor 12B via connection lines 32a, 32b (see FIG. 2).
- the input/output terminals 22A and 22B are connected to the shield conductor 12B via the connection lines 32a and 32b.
- the input/output terminals 22A and 22B may be connected to the via electrode portions 20A and 20E via the input/output patterns 80A and 80B (see FIG. 19).
- the filter (10) includes a dielectric substrate (14), and a plurality of resonators (11A to 11E) formed in the dielectric substrate and surrounded by shield conductors (12A, 12B, 12Ca, 12Cb). , a first input/output terminal (22A) and a second input/output terminal (22B) formed in a portion where the shield conductor is not formed, and the first input/output terminal of the plurality of resonators A first resonator (11A), which is the resonator closest to the terminal, and a second resonator (11E), which is the resonator closest to the second input/output terminal among the plurality of resonators, are arranged in plan view.
- a third resonator (11B) among the plurality of resonators and a third resonator (11B) among the plurality of resonators have a positional relationship of point symmetry about the center (C) of the dielectric substrate in the
- the four resonators (11D) are in a positional relationship of point symmetry with the center of the dielectric substrate in plan view as the center of symmetry, and the third resonance in the first direction that is the longitudinal direction of the dielectric substrate.
- the position of the resonator is between the position of the first resonator in the first direction and the position of the center of the dielectric substrate in the first direction, and the position of the fourth resonator in the first direction.
- the above filter further comprises a capacitive coupling structure (54) provided between the resonators, the capacitive coupling structure comprising a first electrode (50A) extending from one of the resonators and the other resonator.
- a second electrode (50B) extending from toward the first electrode and having a tip portion spaced from the first electrode in side view, one end overlapping the first electrode in plan view, and the other end being a plane and a third electrode (50C) that visually overlaps the second electrode.
- the capacitive coupling structure includes a fourth electrode (50Ab) extending from the one resonator and overlapping the first electrode (50Aa) in plan view, and a fourth electrode (50Ab) extending from the other resonator to the fourth electrode and a fifth electrode (50Bb) that overlaps the second electrode (50Ba) in a plan view and has a distal end spaced apart from the fourth electrode;
- One end (50Ca) is located between the first electrode and the fourth electrode in side view, and the other end (50Cb) of the third electrode is located between the second electrode and the fifth electrode in side view. may be located between
- the one end of the third electrode overlaps at least one corner of the first electrode in plan view, and the other end of the third electrode overlaps at least one corner of the second electrode. may overlap in plan view.
- a first electrode (50A) extending from one of the resonators and a second electrode (50A) extending from the other resonator toward the first electrode and having a tip portion overlapping the first electrode in plan view two electrodes (50B), a third electrode (50C) extending from one of the resonators, and extending from the other resonator toward the third electrode, the tip portion of which extends from the third electrode in plan view. and an overlapping fourth electrode (50D).
- the first electrode may overlap at least one corner of the second electrode in plan view
- the fourth electrode may overlap at least one corner of the third electrode in plan view. good.
- the above filter has capacitive coupling structures (61A to 61F) respectively provided between the plurality of resonators, the capacitive coupling structures including capacitive electrodes (60ac, 60ab) extending from one of the resonators, capacitive electrodes (60ca, 60ba) extending from the other resonator, and a part of the capacitive electrode extending from the one resonator and a part of the capacitive electrode extending from the other resonator are mutually connected. may be close.
- the distance (g2) between the capacitive electrodes (60ac, 60ca) in the first capacitive coupling structure (61A) among the plurality of capacitive coupling structures is the second among the plurality of capacitive coupling structures. It may be larger than the distance (g1) between the capacitive electrodes (60ab, 60ba) in the capacitive coupling structure (61C).
- the dielectric substrate has two main surfaces (14a, 14b) and four side surfaces (14c to 14f), the first side surface (14e) and the first side surface (14e) among the four side surfaces.
- 1 resonator is smaller than the distance between the first side surface and the third resonator, and is connected to the first resonator and projects toward the first side surface.
- a second capacitive coupling structure (76A4) connected to the first resonator and a fourth electrode pattern (76C3) connected to the third resonator 77C), a fifth electrode pattern (76C4) connected to the third resonator, and a sixth electrode pattern (76D4) connected to the fourth resonator.
- the first electrode pattern, the second electrode pattern, the third electrode pattern, the fourth electrode pattern, the fifth electrode pattern, and the sixth electrode pattern are formed in the same layer.
- the third electrode pattern, the fourth electrode pattern, the fifth electrode pattern, and the sixth electrode pattern may protrude along the longitudinal direction of the first electrode pattern.
- each of the plurality of resonators is provided with a via electrode section (20A, 20B, 20D, 20E), and a first electrode connected to one of the plurality of via electrode sections.
- the dimension difference (W11-W12), which is the value obtained by subtracting the dimension of the coupling capacitance electrode, is the distance between the coupling capacitance electrode and the first electrode pattern in the thickness direction of the coupling capacitance electrode. It may be 1.4 times or more the inter-electrode distance (d1).
- the dimensional difference may be 2.6 times or more the distance between the electrodes.
- the first shielding conductor (12A) among the plurality of shielding conductors is formed on one main surface side of the dielectric substrate, and the second shielding conductor among the plurality of shielding conductors is formed.
- (12B) is formed on the other main surface side of the dielectric substrate, and a third shield conductor (12Ca) among the plurality of shield conductors is formed on the first side surface of the dielectric substrate.
- a fourth shielding conductor (12Cb) among the plurality of shielding conductors is formed on a second side surface facing the first side surface, and each of the plurality of resonators is disposed within the dielectric substrate.
- the extended regions may be selectively formed in extension regions (84A, 84B, 84Ca, 84Cb, 84D, 84E) extending toward the third shielding conductor or the fourth shielding conductor.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
第1実施形態によるフィルタ10について図面を参照しながら説明する。図1は、本実施形態によるフィルタ10を示す斜視図である。図2は、本実施形態によるフィルタ10を示す平面図である。図1及び図2には、5つの共振器11A~11Eが備えられている場合の例が示されている。
[比較例1]
比較例1に係るフィルタ100には、図4Aに示すように、4つの共振器11A~11Dが備えられている。これらの共振器11A~11Dは、平面視における誘電体基板14の中心線を対称の軸として、線対称の位置に配されている。共振器11Aと共振器11Dとは互いに対応している。共振器11Bと共振器11Cとは互いに対応している。換言すれば、比較例1によるフィルタ100は、ビア電極部20Aとビア電極部20Bとの組み合わせと、ビア電極部20Cとビア電極部20Dとの組み合わせとを、線対称の位置に配置した構造を有する。
実施例1に係るフィルタには、図4Bに示すように、5つの共振器11A~11Eが備えられている。これらの共振器11A~11Eは、平面視における誘電体基板14の中心C(図2参照)を対称の中心として、点対称の位置に配されている。共振器11Aと共振器11Eとは互いに対応している。即ち、入出力端子22Aからの距離が最も小さい共振器11Aと、入出力端子22Bからの距離が最も小さい共振器11Eとが、点対称の位置に配されている。また、共振器11Bと共振器11Dとは互いに対応している。換言すれば、実施例1に係るフィルタは、一方の入出力に最も近いビア電極部20Aと、他方の入出力に最も近いビア電極部20Eとを、点対称の位置に配置した構造を有する。なお、ビア電極部20Bとビア電極部20Dも、点対称の位置に配置されている。
[比較例2]
比較例2に係るフィルタのビア電極部20間には、図7A~図7Cに示すように、容量結合構造52が備えられている。当該容量結合構造52においては、ビア電極部20Aに結合された平板電極50Aの先端部と、ビア電極部20Bに結合された平板電極50Bの先端部とが、側面視において互いに離間している。また、当該容量結合構造52においては、ビア電極部20Aに結合された平板電極50Aの先端部と、ビア電極部20Bに結合された平板電極50Bの先端部とが、平面視において互いに重なり合っている。即ち、平板電極50Aの先端部と、平板電極50Bの先端部とが、互いに対面している。平板電極一般について説明する際には、符号50を用い、個々の平板電極を説明する際には、符号50A~50Dを用いる。
実施例2に係るフィルタには、ビア電極部20間に容量結合構造54が備えられている。当該容量結合構造54は、互いに隣接するビア電極部20間にそれぞれ備えられている。ビア電極部20Aとビア電極部20Bとの間に備えられた容量結合構造54の例が、図9A~図9Cには示されている。図9A~図9Cに示す容量結合構造54は、ビア電極部20Aに結合された2つの平板電極50Aa、50Abと、ビア電極部20Bに結合された2つの平板電極50Ba、50Bbと、平板電極50Cとを有する。平板電極50Cの一方の先端部50Caは、側面視において、平板電極50Aaと平板電極50Abとの間に位置している。平板電極50Cの先端部50Caと、平板電極50Aaとは、側面視において互いに離間している。平板電極50Cの先端部50Caと、平板電極50Abとは、側面視において互いに離間している。平板電極50Cの先端部50Caと、平板電極50Aaとは、平面視において互いに重なり合っている。即ち、平板電極50Cの先端部50Caと、平板電極50Aaとは、互いに対面している。平板電極50Cの先端部50Caと、平板電極50Abとは、平面視において互いに重なり合っている。即ち、平板電極50Cの先端部50Caと、平板電極50Abとは、互いに対面している。平板電極50Cの他方の先端部50Cbは、側面視において、平板電極50Baと平板電極50Bbとの間に位置している。平板電極50Cの先端部50Cbと、平板電極50Baとは、側面視において互いに離間している。平板電極50Cの先端部50Cbと、平板電極50Bbとは、側面視において互いに離間している。平板電極50Cの先端部50Cbと、平板電極50Baとは、平面視において互いに重なり合っている。即ち、平板電極50Cの先端部50Cbと、平板電極50Baとは、互いに対面している。平板電極50Cの先端部50Cbと、平板電極50Bbとは、平面視において互いに重なり合っている。即ち、平板電極50Cの先端部50Cbと、平板電極50Bbとは、互いに対面している。
比較例3に係るフィルタには、図14に示すように、容量電極60ab、60ac、60ba、60bcが備えられている。また、第3実施例に係るフィルタには、図16に示すように、容量電極60ab、60ac、60ba、60bcが備えられている。ビア電極部20Aは、ビア電極部20Bに向かって延びる容量電極60abと、ビア電極部20Cに向かって延びる容量電極60acとを有する。ビア電極部20Bは、ビア電極部20Aに向かって延びる容量電極60baと、ビア電極部20Cに向かって延びる容量電極60bcとを有する。
比較例3では、図14に示すように、フィルタを構成する素子の感度にかかわらず、各容量電極60間の距離(容量電極60の延在方向に直交する方向における距離)g1は同じに設定されている。即ち、比較例3に係るフィルタでは、共振器11間の結合度にかかわらず、各容量電極60間の距離g1は同じに設定されている。比較例3では、容量電極60acと容量電極60caとの間の感度が相対的に高かった。即ち、比較例3では、共振器11Aと共振器11Cとの間の結合度が相対的に高かった。また、比較例3では、容量電極60ecと容量電極60ceとの間の感度が相対的に高かった。即ち、共振器11Cと共振器11Eとの間の結合度が相対的に高かった。
実施例3では、図16に示すように、フィルタ10を構成する素子の感度に応じて、各容量電極60間の距離を適切に設定した。即ち、実施例3では、共振器11間の結合度に応じて、各容量電極60間の距離を適切に設定した。図16では、容量電極60acと容量電極60caとの間の距離g2と、容量電極60ecと容量電極60ceとの間の距離g2とを、他の容量電極60間の距離g1よりも大きく設定した。即ち、実施例3では、容量結合構造61A、61Bにおける容量電極60間の距離g2を、容量結合構造61C~61Fにおける容量電極60間の距離g1より大きく設定した。
第2実施形態によるフィルタについて説明する。図18は、本実施形態によるフィルタを示す斜視図である。図19は、本実施形態によるフィルタを示す平面図である。図20A及び図20Bは、本実施形態によるフィルタの一部を示す断面図である。図21及び図22は、本実施形態によるフィルタを示す斜視図である。図23は、本実施形態によるフィルタを示す平面図である。図24は、本実施形態によるフィルタを示す斜視図である。図25は、本実施形態によるフィルタを示す平面図である。図26は、本実施形態によるフィルタを示す斜視図である。図27及び図28は、本実施形態によるフィルタを示す平面図である。簡略化を図るべく、図18~図28においては、一部の構成要素が適宜省略されている。
本発明は、上述の実施形態に限らず、本発明の要旨を逸脱することなく、種々の構成を採り得る。
Claims (13)
- 誘電体基板(14)と、
前記誘電体基板内に形成され、周囲が遮蔽導体(12A、12B、12Ca、12Cb)で囲まれた複数の共振器(11A~11E)と、
前記遮蔽導体が形成されていない部分に形成された第1入出力端子(22A)及び第2入出力端子(22B)と、を有し、
複数の前記共振器のうちの前記第1入出力端子に最も近い共振器である第1共振器(11A)と、複数の前記共振器のうちの前記第2入出力端子に最も近い共振器である第2共振器(11E)とが、平面視における前記誘電体基板の中心(C)を対称の中心として、点対称の位置関係にあり、
複数の前記共振器のうちの第3共振器(11B)と、前記複数の共振器のうちの第4共振器(11D)とが、平面視における前記誘電体基板の前記中心を対称の中心として、点対称の位置関係にあり、
前記誘電体基板の長手方向である第1方向における前記第3共振器の位置は、前記第1共振器の前記第1方向における位置と前記誘電体基板の前記中心の前記第1方向における位置との間であり、
前記第4共振器の前記第1方向における位置は、前記第2共振器の前記第1方向における位置と前記誘電体基板の前記中心の前記第1方向における位置との間である、フィルタ(10)。 - 請求項1記載のフィルタにおいて、
前記共振器間に備えられた容量結合構造(54)を更に有し、
前記容量結合構造は、
一方の前記共振器から延びる第1電極(50A)と、
他方の前記共振器から前記第1電極に向けて延び、且つ、先端部が側面視において前記第1電極から離間した第2電極(50B)と、
一端が平面視において前記第1電極に重なり合うとともに、他端が平面視において前記第2電極に重なり合う第3電極(50C)と、を有する、フィルタ。 - 請求項2に記載のフィルタにおいて、
前記容量結合構造は、
前記一方の共振器から延びるとともに、前記第1電極(50Aa)と平面視において重なり合う第4電極(50Ab)と、
前記他方の共振器から前記第4電極に向けて延びるとともに、前記第2電極(50Ba)と平面視において重なり合い、且つ、先端部が前記第4電極から離間した第5電極(50Bb)と、を更に有し、
前記第3電極の前記一端(50Ca)は、側面視において前記第1電極と前記第4電極との間に位置し、
前記第3電極の前記他端(50Cb)は、側面視において前記第2電極と前記第5電極との間に位置する、フィルタ。 - 請求項3に記載のフィルタにおいて、
前記第3電極の前記一端は、前記第1電極の少なくとも1つの角部と平面視において重なり合い、
前記第3電極の前記他端は、前記第2電極の少なくとも1つの角部と平面視において重なり合う、フィルタ。 - 請求項1に記載のフィルタにおいて、
一方の前記共振器から延びる第1電極(50A)と、
他方の前記共振器から前記第1電極に向けて延び、且つ、先端部が平面視において前記第1電極に重なり合う第2電極(50B)と、
前記一方の共振器から延びる第3電極(50C)と、
前記他方の共振器から前記第3電極に向けて延び、且つ、先端部が平面視において前記第3電極に重なり合う第4電極(50D)と、を有するフィルタ。 - 請求項5記載のフィルタにおいて、
前記第1電極は、前記第2電極の少なくとも1つの角部と平面視において重なり合い、
前記第4電極は、前記第3電極の少なくとも1つの角部と平面視において重なり合う、フィルタ。 - 請求項1記載のフィルタにおいて、
複数の前記共振器間にそれぞれ備えられた容量結合構造(61A~61F)を有し、
前記容量結合構造は、一方の前記共振器から延びる容量電極(60ac、60ab)と、他方の前記共振器から延びる容量電極(60ca、60ba)とを有し、
前記一方の共振器から延びる前記容量電極の一部と、前記他方の共振器から延びる前記容量電極の一部とが互いに近接する、フィルタ。 - 請求項7記載のフィルタにおいて、
複数の前記容量結合構造のうちの第1容量結合構造(61A)における前記容量電極(60ac、60ca)間の距離(g2)が、複数の前記容量結合構造のうちの第2容量結合構造(61C)における前記容量電極(60ab、60ba)間の距離(g1)よりも大きい、フィルタ。 - 請求項1に記載のフィルタにおいて、
前記誘電体基板は、2つの主面(14a、14b)と、4つの側面(14c~14f)とを備え、
前記4つの側面のうちの第1側面(14e)と前記第1共振器との間の距離は、前記第1側面と前記第3共振器との間の距離よりも小さく、
前記第1共振器に接続されているとともに前記第1側面に向かって突出する第1電極パターン(76A3)と、前記第4共振器に接続されているとともに前記第1側面に向かって突出する第2電極パターン(76D6)とを含む第1容量結合構造(77A)を更に備える、フィルタ。 - 請求項9に記載のフィルタにおいて、
前記第1共振器に接続されている第3電極パターン(76A4)と、前記第3共振器に接続されている第4電極パターン(76C3)とを含む第2容量結合構造(77C)と、
前記第3共振器に接続されている第5電極パターン(76C4)と、前記第4共振器に接続されている第6電極パターン(76D4)とを含む第3容量結合構造(77E)とを更に備え、
前記第1電極パターン、前記第2電極パターン、前記第3電極パターン、前記第4電極パターン、前記第5電極パターン、及び、前記第6電極パターンは、同一層に形成されており、
前記第3電極パターン、前記第4電極パターン、前記第5電極パターン、及び、前記第6電極パターンは、前記第1電極パターンの長手方向に沿うように突出している、フィルタ。 - 請求項1に記載のフィルタにおいて、
複数の前記共振器には、ビア電極部(20A、20B、20D、20E)がそれぞれ備えられており、
複数の前記ビア電極部のうちのいずれかに接続された第1電極パターン(70A3)と、複数の前記ビア電極部のうちのいずれかに接続された第2電極パターン(70C2)と、一端が平面視において前記第1電極パターンに重なり合うとともに、他端が平面視において前記第2電極パターンに重なり合う結合容量電極(72A)とを含む容量結合構造(71A)と、
を備え、
前記結合容量電極の幅方向における前記結合容量電極の寸法(W12)は、前記結合容量電極の前記幅方向における前記第1電極パターンの寸法(W11)よりも小さく、
前記結合容量電極と前記第1電極パターンとが重なり合っている第1領域(73A1)の両側には、前記結合容量電極が前記第1電極パターンと重なり合っていない第2領域(73A2、73A3)が存在しており、
前記結合容量電極の前記幅方向における前記第1電極パターンの寸法から前記結合容量電極の前記幅方向における前記結合容量電極の寸法を減算することによって得られる値である寸法差(W11-W12)は、前記結合容量電極の厚さ方向における前記結合容量電極と前記第1電極パターンとの間の距離である電極間距離(d1)の1.4倍以上である、フィルタ。 - 請求項11に記載のフィルタにおいて、
前記寸法差は、前記電極間距離の2.6倍以上である、フィルタ。 - 請求項1に記載のフィルタにおいて、
複数の前記遮蔽導体のうちの第1遮蔽導体(12A)が、前記誘電体基板の一方の主面側に形成されており、
複数の前記遮蔽導体のうちの第2遮蔽導体(12B)が、前記誘電体基板の他方の主面側に形成されており、
複数の前記遮蔽導体のうちの第3遮蔽導体(12Ca)が、前記誘電体基板の第1側面に形成されており、
複数の前記遮蔽導体のうちの第4遮蔽導体(12Cb)が、前記第1側面に対面する第2側面に形成されており、
複数の前記共振器の各々は、前記誘電体基板内に形成されたビア電極部(20A~20E)と、前記第1遮蔽導体に対面するとともに前記ビア電極部の一端に接続されたキャパシタ電極(18A~18E)とを備え、
前記第1遮蔽導体に一端が接続されているとともに、前記第2遮蔽導体に他端が接続されている遮蔽ビア電極部(81A~81D、81Ea、81Eb)を更に備え、
前記遮蔽ビア電極部は、前記ビア電極部が形成された領域を前記第3遮蔽導体又は前記第4遮蔽導体に向かって延長した延長領域(84A、84B、84Ca、84Cb、84D、84E)内に選択的に形成されている、フィルタ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280026028.5A CN117178429A (zh) | 2021-03-31 | 2022-02-28 | 滤波器 |
US18/552,488 US20240170825A1 (en) | 2021-03-31 | 2022-02-28 | Filter |
JP2023510684A JPWO2022209505A1 (ja) | 2021-03-31 | 2022-02-28 | |
DE112022001909.3T DE112022001909T5 (de) | 2021-03-31 | 2022-02-28 | Filter |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-062366 | 2021-03-31 | ||
JP2021062366 | 2021-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022209505A1 true WO2022209505A1 (ja) | 2022-10-06 |
Family
ID=83458371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/008133 WO2022209505A1 (ja) | 2021-03-31 | 2022-02-28 | フィルタ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240170825A1 (ja) |
JP (1) | JPWO2022209505A1 (ja) |
CN (1) | CN117178429A (ja) |
DE (1) | DE112022001909T5 (ja) |
WO (1) | WO2022209505A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024185425A1 (ja) * | 2023-03-09 | 2024-09-12 | 双信電機株式会社 | フィルタ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63283201A (ja) * | 1987-05-14 | 1988-11-21 | Murata Mfg Co Ltd | 一体成形型高周波フィルタ |
JPH0855758A (ja) * | 1994-08-10 | 1996-02-27 | Sumitomo Metal Ind Ltd | 積層コンデンサ |
JP2000004106A (ja) * | 1998-06-12 | 2000-01-07 | Yokowo Co Ltd | 誘電体フィルター |
WO2020026889A1 (ja) * | 2018-08-01 | 2020-02-06 | 双信電機株式会社 | フィルタ |
JP2020198482A (ja) * | 2019-05-31 | 2020-12-10 | 双信電機株式会社 | フィルタ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2068393A1 (en) | 2007-12-07 | 2009-06-10 | Panasonic Corporation | Laminated RF device with vertical resonators |
-
2022
- 2022-02-28 WO PCT/JP2022/008133 patent/WO2022209505A1/ja active Application Filing
- 2022-02-28 DE DE112022001909.3T patent/DE112022001909T5/de active Pending
- 2022-02-28 CN CN202280026028.5A patent/CN117178429A/zh active Pending
- 2022-02-28 US US18/552,488 patent/US20240170825A1/en active Pending
- 2022-02-28 JP JP2023510684A patent/JPWO2022209505A1/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63283201A (ja) * | 1987-05-14 | 1988-11-21 | Murata Mfg Co Ltd | 一体成形型高周波フィルタ |
JPH0855758A (ja) * | 1994-08-10 | 1996-02-27 | Sumitomo Metal Ind Ltd | 積層コンデンサ |
JP2000004106A (ja) * | 1998-06-12 | 2000-01-07 | Yokowo Co Ltd | 誘電体フィルター |
WO2020026889A1 (ja) * | 2018-08-01 | 2020-02-06 | 双信電機株式会社 | フィルタ |
JP2020198482A (ja) * | 2019-05-31 | 2020-12-10 | 双信電機株式会社 | フィルタ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024185425A1 (ja) * | 2023-03-09 | 2024-09-12 | 双信電機株式会社 | フィルタ |
Also Published As
Publication number | Publication date |
---|---|
JPWO2022209505A1 (ja) | 2022-10-06 |
CN117178429A (zh) | 2023-12-05 |
DE112022001909T5 (de) | 2024-01-18 |
US20240170825A1 (en) | 2024-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5172299A (en) | Multilayer capacitor | |
WO2022209505A1 (ja) | フィルタ | |
JPH0758512A (ja) | 無線周波数フィルタ | |
US6081174A (en) | Wave filter having two or more coaxial dielectric resonators in juxtaposition | |
EP1111707A2 (en) | Stacked type dielectric filter | |
CA2228321A1 (en) | Multilayer microelectronic circuit with trimmable capacitors | |
WO2023162630A1 (ja) | フィルタ | |
WO2023162631A1 (ja) | フィルタ | |
KR101382154B1 (ko) | 적층형 전자 부품 | |
US5170317A (en) | Multilayer capacitor | |
WO2023189530A1 (ja) | フィルタ | |
JP7465903B2 (ja) | フィルタ | |
JP4506759B2 (ja) | 複合電子部品 | |
WO2023248837A1 (ja) | フィルタ | |
WO2024185425A1 (ja) | フィルタ | |
JP3951960B2 (ja) | 誘電体フィルタ | |
WO2020080090A1 (ja) | フィルタ | |
KR102458942B1 (ko) | 캐비티 필터 및 이를 포함하는 전기 장치 | |
JP4291488B2 (ja) | 積層型誘電体共振器 | |
US20230327632A1 (en) | Filter and multiplexer | |
CN112997356B (zh) | 滤波器 | |
JPH06140863A (ja) | 積層型フィルタ | |
CN118116675A (zh) | 层叠变阻器 | |
JPH09331201A (ja) | ストリップラインフィルタ | |
JPH10209713A (ja) | 積層型電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22779730 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2023510684 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18552488 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 112022001909 Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22779730 Country of ref document: EP Kind code of ref document: A1 |