WO2022202405A1 - 処理装置及び位置決め方法 - Google Patents
処理装置及び位置決め方法 Download PDFInfo
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- WO2022202405A1 WO2022202405A1 PCT/JP2022/010937 JP2022010937W WO2022202405A1 WO 2022202405 A1 WO2022202405 A1 WO 2022202405A1 JP 2022010937 W JP2022010937 W JP 2022010937W WO 2022202405 A1 WO2022202405 A1 WO 2022202405A1
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- substrate
- positioning
- processing apparatus
- pick
- positioning table
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- 238000012545 processing Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 232
- 230000007723 transport mechanism Effects 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 5
- 238000007689 inspection Methods 0.000 description 60
- 238000010586 diagram Methods 0.000 description 37
- 239000000523 sample Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 10
- 230000032258 transport Effects 0.000 description 8
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 238000012937 correction Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012636 effector Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Definitions
- the present disclosure relates to a processing device and positioning method.
- a known technique is to position a substrate by movably supporting the substrate on a support member and sandwiching the substrate between a pressing member and a positioning member (see, for example, Patent Document 1).
- the present disclosure provides a technology capable of positioning rectangular substrates.
- a processing apparatus includes a transport mechanism for transporting a rectangular substrate, a positioning table for placing the substrate and positioning the substrate, and a rotating table for rotating the positioned substrate. and the transport mechanism includes a block portion that presses an end portion of the substrate placed on the positioning table to position the substrate.
- rectangular substrates can be positioned.
- FIG. 1 The front view which shows an example of the inspection apparatus of embodiment. 1 is a top view showing an example of an inspection apparatus according to an embodiment;
- FIG. Diagram showing an example of the loader part A diagram showing an example of a pick
- a diagram showing an example of a pick Diagram showing an example of a positioning table Diagram showing an example of a turntable Diagram showing an example of a turntable
- Flowchart showing an example of an inspection method according to an embodiment A diagram showing an example of the operation for positioning the board A diagram showing an example of the operation for positioning the board A diagram showing an example of the operation for positioning the board A diagram showing an example of the operation for positioning the board A diagram showing an example of the operation for positioning the board
- a diagram showing an example of the operation for positioning the board A diagram showing an example of the operation for positioning the board
- a diagram showing an example of the operation for positioning the board A diagram showing an example of the operation of rotating the substrate
- a diagram showing an example of the operation of rotating the substrate A diagram showing an example of the operation of rotating the substrate
- FIG. 1 is a front view showing an example of an inspection apparatus according to an embodiment
- FIG. 2 is a top view showing an example of the inspection device of the embodiment.
- FIG. 3 is a diagram illustrating an example of a loader section;
- the inspection device 1 has a loader section 10, an inspection section 20, a device controller 30, and the like.
- the inspection apparatus 1 conveys the substrate W to be inspected from the loader unit 10 to the inspection unit 20 under the control of the device controller 30, and transmits an electric signal to the device under test (DUT: Device Under Test) formed on the substrate W. to test various electrical properties.
- the substrate W may be, for example, a rectangular substrate. Examples of rectangular substrates include PLP (Panel Level Package).
- the loader section 10 has a load port 11, a positioning table 12, a rotary table 13, a rear table 14, a substrate transport mechanism 15, a position detection sensor 16, and the like.
- the load port 11 is provided on the front side (-Y direction) of the inspection apparatus 1.
- the load port 11 mounts a cassette C containing substrates W thereon.
- the positioning table 12 is provided on the back side (+Y direction) of the inspection device 1 .
- the positioning table 12 is a table for placing the substrate W thereon and positioning the substrate W thereon. Details of the positioning table 12 will be described later.
- the turntable 13 is provided on the back side of the inspection apparatus 1 and below the positioning table 12 (-Z direction). However, the turntable 13 may be provided above the positioning table 12 (+Z direction).
- the turntable 13 is a stand for holding the substrate W by suction and rotating the substrate W. As shown in FIG. Details of the turntable 13 will be described later.
- the back table 14 is provided on the back side of the inspection device 1 and above the positioning table 12 . However, the rear table 14 may be provided below the positioning table 12 .
- the rear table 14 is a table for setting a tray (not shown) on which the substrate W is placed. The tray can be removed from the back side of the inspection device 1 .
- the substrate transport mechanism 15 transports the substrates W between the cassette C placed on the load port 11, the positioning table 12, the rotating table 13, the tray of the rear table 14, and a mounting table 21, which will be described later.
- the substrate transfer mechanism 15 includes picks 151 and 152, a rotation drive mechanism 153, a vertical drive mechanism 154, and the like.
- the picks 151 and 152 are provided in two stages, upper and lower. Each pick 151, 152 holds a substrate W; The picks 151 and 152 are also called forks and end effectors. Details of the picks 151 and 152 will be described later.
- the rotation drive mechanism 153 is provided below the picks 151 and 152 and rotates the picks 151 and 152 .
- the rotation drive mechanism 153 includes, for example, a stepping motor.
- the vertical drive mechanism 154 is provided below the rotation drive mechanism 153 and vertically drives the picks 151 and 152 and the rotation drive mechanism 153 .
- the vertical drive mechanism 154 includes, for example, a stepping motor.
- the substrate transfer mechanism 15 is not limited to the form shown in FIG. 3, and may have, for example, a form having a multi-joint arm and a vertical drive mechanism.
- the position detection sensor 16 is provided on the transport path for storing the substrates W in the cassette C with the picks 151 and 152 and detects the positions of the substrates W held by the picks 151 and 152 .
- the position detection sensor 16 includes a light projecting section 161 and a light receiving section 162 .
- Two light projecting units 161 are provided above the vicinity of the entrance of the cassette C placed on the load port 11 with a predetermined interval in the horizontal direction (X direction).
- Two light-receiving portions 162 are provided at a lower portion near the entrance of the cassette C with a predetermined interval in the left-right direction.
- the predetermined interval is wider than the length of one side of the substrate W and narrower than the inner dimension of the cassette C. As shown in FIG.
- the predetermined interval may be 301-304 mm, preferably 303 mm.
- the light projecting unit 161 irradiates the light L toward the light receiving unit 162 .
- the light receiving unit 162 detects whether or not the light L emitted from the light projecting unit 161 is received. Note that the positional relationship between the light projecting section 161 and the light receiving section 162 may be reversed. That is, the light projecting section 161 may be provided at the lower portion near the inlet of the cassette C, and the light receiving section 162 may be provided at the upper portion near the inlet of the cassette C.
- the light receiving unit 162 emits light from the light projecting unit 161 . Receives the light L.
- the substrate W is positioned outside the predetermined range of the picks 151 and 152, the light L emitted from the light projecting portion 161 is blocked by the substrate W, so that the light receiving portion 162 receives the light emitted from the light projecting portion 161. does not receive L.
- the position detection sensor 16 is not limited to the illustrated example, and may be of another form.
- the inspection unit 20 is arranged adjacent to the loader unit 10 .
- the inspection unit 20 has a mounting table 21, an elevating mechanism 22, an XY stage 23, a probe card 24, an alignment mechanism 25, and the like.
- the mounting table 21 mounts and holds the substrate W.
- the mounting table 21 includes, for example, a vacuum chuck.
- the elevating mechanism 22 is provided below the mounting table 21 and elevates the mounting table 21 with respect to the XY stage 23 .
- the lifting mechanism 22 includes, for example, a stepping motor.
- the XY stage 23 is provided below the elevating mechanism 22, and moves the mounting table 21 and the elevating mechanism 22 in two axial directions (X direction and Y direction in the drawing).
- the XY stage 23 is fixed to the bottom of the inspection section 20 .
- the XY stage 23 includes, for example, a stepping motor.
- the probe card 24 is arranged above the mounting table 21 .
- a plurality of probes 24 a are formed on the mounting table 21 side of the probe card 24 .
- the probe card 24 is detachably attached to the head plate 24b.
- a tester (not shown) is connected to the probe card 24 via a test head T.
- the alignment mechanism 25 includes a camera 25a, a guide rail 25b, an alignment bridge 25c, and the like.
- the camera 25a is attached downward at the center of the alignment bridge 25c, and images the mounting table 21, the substrate W, and the like.
- the camera 25a is, for example, a CCD camera or a CMOS camera.
- the guide rail 25b supports the alignment bridge 25c so as to be movable in the horizontal direction (the Y direction in the figure).
- the alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves horizontally (Y direction in the figure) along the guide rails 25b.
- the camera 25a moves between the standby position and directly below the center of the probe card 24 (hereinafter referred to as "probe center") via the alignment bridge 25c.
- the camera 25a located at the probe center takes an image of the electrode pads of the substrate W on the mounting table 21 from above while the mounting table 21 is moving in the XY directions. display.
- the device controller 30 is provided below the mounting table 21 and controls the overall operation of the inspection device 1 .
- a CPU provided in the device controller 30 executes a desired inspection according to the product type parameters stored in a memory such as ROM or RAM.
- the product type parameter may be stored in a semiconductor memory other than a hard disk, ROM, or RAM.
- the product type parameter may be recorded in a computer-readable recording medium such as a CD-ROM, DVD, or the like, inserted into a predetermined position, and read out.
- FIGS. 4A and 4B are diagrams showing an example of the pick 151, showing a state in which the pick 151 holds the substrate W.
- FIG. 4A is a view of the pick 151 viewed from above
- FIG. 4B is a view of the pick 151 viewed from the side.
- the pick 152 may also have the same configuration as the pick 151 .
- the pick 151 includes a base 151a, a pad 151b, a block portion 151c, and the like.
- the base 151a is formed of a plate-like member.
- the base 151a has a substantially U shape in plan view.
- a plurality of (for example, eight) pads 151b are provided on the upper surface of the base 151a.
- the plurality of pads 151b includes at least two suction pads capable of suction independently. Each suction pad holds the substrate W by vacuum suction.
- the plurality of pads 151b may include a holding pad that holds the substrate W without being vacuum-sucked.
- the block part 151 c is provided on the base end of the pick 151 .
- the block portion 151c has a pressing surface 151d.
- the pressing surface 151 d is perpendicular to the movement direction of the pick 151 .
- the pressing surface 151 d extends from the upper surface of the pick 151 to a position higher than the upper surface of the substrate W held by the pick 151 .
- the block part 151 c presses the edge of the substrate W placed on the positioning table 12 with the pressing surface 151 d to position the substrate W with respect to the pick 151 .
- FIGS. 5A and 5B are diagrams showing an example of the positioning table 12, showing a state in which the pick 151 has entered above the positioning table 12.
- FIG. 5A is a view of the positioning table 12 viewed from above
- FIG. 5B is a view of the positioning table 12 viewed from the side.
- the positioning table 12 includes a base 121, holding pins 122, and the like.
- the base 121 is fixed to the loader section 10 .
- the base 121 is made of a plate-like member.
- the base 121 has a rectangular shape in plan view.
- a plurality of (for example, six) holding pins 122 are provided on the base 121 .
- Each holding pin 122 is provided at a position other than the entrance path of the pick 151 .
- Each holding pin 122 protrudes upward from the base 121 and slidably holds the lower surface of the substrate W at its upper end.
- Each holding pin 122 is made of, for example, a material with low frictional resistance.
- the number of holding pins 122 is preferably six or more. Thereby, the warped substrate W can be held accurately.
- FIGS. 6A and 6B are views showing an example of the turntable 13, showing a state in which the pick 151 has entered above the turntable 13.
- FIG. 6A is a top view of the turntable 13
- FIG. 6B is a side view of the turntable 13.
- the turntable 13 includes a stage 131, a speed reducer 132, a motor 133, and the like.
- the stage 131 holds the substrate W by vacuum suction with a plurality of (for example, three) suction pads 131a provided on its upper surface.
- the stage 131 is connected to a motor 133 via a speed reducer 132 and rotates the substrate W by the power of the motor 133 .
- the speed reducer 132 reduces the rotation speed of the power on the motor 133 side with a gear or the like and outputs the result to the stage 131 .
- the motor 133 rotates the stage 131 by outputting power to the stage 131 via the speed reducer 132 .
- FIG. 7 is a flow chart showing an example of the operation of the inspection device of the embodiment.
- step S1 the loader unit 10 positions the substrate W before inspection.
- 8A to 8E are diagrams showing an example of the operation of positioning the substrate W, and are diagrams of the positioning table 12 viewed from the side.
- 9A to 9D are diagrams showing an example of the operation of rotating the substrate W, and are diagrams of the turntable 13 viewed from the side.
- the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 above the positioning table 12, thereby moving the substrates W contained in the cassette C. It is transported above the positioning table 12 .
- the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the correction position, thereby placing the substrate W on the holding pins 122 .
- the corrected position is a position where the pad 151b is separated from the bottom surface of the substrate W and a position where the top surface of the block portion 151c is higher than the top surface of the substrate W.
- the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 positioned at the correction position by the first distance in the approach direction, thereby pressing the block part 151c.
- the surface 151d is pressed against the edge of the substrate W to press it.
- the first distance may be 30 mm, for example.
- the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 backward by a second distance, thereby moving the pressing surface 151d of the block portion 151c to the substrate W. away from the end of the This completes the positioning of the substrate W with respect to the pick 151 in the first direction.
- the first direction is the advancing/retreating direction of the pick 151 .
- the second distance may be 20 mm, for example.
- the apparatus controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby lifting the substrate W placed on the holding pins 122 with the pads 151b. Hold.
- the UP position is a position where the lower surface of the substrate W is separated from the holding pins 122 .
- the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 above the turntable 13, thereby moving the substrate W positioned in the first direction. It is conveyed above the turntable 13 .
- the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the DOWN position, thereby placing the substrate W on the stage 131 .
- the DOWN position is a position where the pad 151b is separated from the bottom surface of the substrate W.
- the apparatus controller 30 controls the turntable 13 to rotate the stage 131 by 90° while the substrate W is held by suction with the suction pads 131a. Rotate 90°. After rotating the substrate W by 90°, the device controller 30 controls the turntable 13 to stop the suction by the suction pad 131a.
- the device controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby holding the substrate W placed on the stage 131 with the pads 151b. do.
- the UP position is a position where the lower surface of the substrate W is separated from the stage 131 .
- the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W rotated by 90° to the positioning table 12 again.
- the apparatus controller 30 then positions the substrate W relative to the pick 151 in a second direction orthogonal to the first direction in the same manner as it positions the substrate W relative to the pick 151 in the first direction. positioning.
- the positioning of the substrate W before inspection with respect to the pick 151 in the first direction and the second direction is completed.
- step S2 the pre-inspection substrate W positioned in step S1 is transported to the inspection section 20.
- the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W positioned in the first direction and the second direction to the turntable 13 .
- the device controller 30 controls the turntable 13 to rotate the substrate W so that the substrate W is oriented in a predetermined direction. In other words, the turntable 13 can turn (rotate) the substrate W to be conveyed to the inspection section 20 at an arbitrary designated angle.
- the apparatus controller 30 controls the substrate transport mechanism 15 to transport the substrate W from the turntable 13 to the inspection section 20 and place it on the mounting table 21 .
- the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W to the inspection section 20 without transporting the substrate W to the turntable 13. , and may be placed on the placing table 21 .
- step S3 the inspection unit 20 inspects the substrate W.
- the apparatus controller 30 controls the alignment mechanism 25 to align the electrode pads of the device under test formed on the substrate W on the mounting table 21 with the plurality of probes 24a of the probe card 24.
- the device controller 30 controls the lifting mechanism 22 to lift the mounting table 21 and bring the plurality of probes 24a of the probe card 24 into contact with the corresponding electrode pads.
- the device controller 30 applies a test signal from the tester to the device under test formed on the substrate W via the test head T and the plurality of probes 24a of the probe card 24, thereby determining the electrical characteristics of the device under test. to inspect.
- the apparatus controller 30 controls the lifting mechanism 22 to lower the mounting table 21 and separate the probes 24a from the electrode pads.
- step S4 the loader unit 10 positions the substrate W after inspection.
- the positioning of the substrate W after inspection can be performed in the same manner as the positioning of the substrate W before inspection in step S1.
- step S5 the substrates W after inspection are accommodated in the cassette C.
- the device controller 30 controls the substrate transport mechanism 15 to transport the inspected substrates W positioned in the loader section 10 to the cassette C for storage therein.
- the device controller 30 determines whether or not the substrate W after inspection is positioned within a predetermined range of the pick 151 based on the detection value of the position detection sensor 16 . Then, when the device controller 30 determines that the substrate W after inspection is positioned within the predetermined range of the pick 151, the substrate W after inspection is transported to the cassette C and accommodated therein.
- the apparatus controller 30 determines that the inspected substrate W is outside the predetermined range of the pick 151, the apparatus controller 30 does not store the inspected substrate W in the cassette C.
- the device controller 30 controls the substrate transport mechanism 15 to stop the movement of the pick 151 .
- the apparatus controller 30 controls the substrate transport mechanism 15 to transport the inspected substrate W to the back table 14 and place it on a tray installed on the back table 14 .
- the device controller 30 may cause the display device 40 to display that the substrate W after inspection cannot be accommodated in the cassette C.
- the apparatus controller 30 may control each part of the loader section 10 so that the loader section 10 again positions the substrate W after the inspection.
- step S5 the device controller 30 does not store the substrate W after inspection in the cassette C when it is determined that the substrate W after inspection is positioned outside the predetermined range of the pick 151 . Thereby, the substrate W held by the pick 151 can be prevented from coming into contact with the cassette C.
- step S1 the case of positioning the substrate W before inspection (step S1) and positioning the substrate W after inspection (step S4) has been described, but the present invention is not limited to this.
- either the positioning of the substrate W before inspection (step S1) or the positioning of the substrate W after inspection (step S4) may be omitted.
- step S4 only when the device controller 30 determines in step S5 that the substrate W after inspection is positioned outside the predetermined range of the pick 151, the substrate W after inspection may be positioned (step S4). .
- the end portion of the substrate W slidably held by the holding pins 122 of the positioning table 12 is pressed by the block portion 151c of the pick 151 to move the substrate W against the pick 151. positioning.
- the substrate W can be positioned without sandwiching the substrate W from the side. Therefore, even when positioning a substrate W that is easily damaged, such as a resin substrate or a glass substrate, it is possible to prevent the substrate W from being damaged.
- the substrate W can be positioned without depending on the size of the substrate W. FIG. Therefore, even if the substrate W is warped, the substrate W can be positioned. Further, since the substrate W is positioned by moving the pick 151, fine adjustment of the center position of the substrate W is easy.
- FIGS. 10A and 10B are diagrams showing another example of the positioning table and the turntable, showing a state in which the pick 151 has entered above the positioning table and the turntable.
- 10A is a top view of the positioning table and the turntable
- FIG. 10B is a side view of the positioning table and the turntable.
- the positioning table 17 and the rotating table 18 according to the modified example are different from the positioning table 12 and the rotating table 13 described above in that they are integrally provided.
- the positioning table 17 includes a base 171, a holding pin 172, a support plate 173, an actuator 174 and the like.
- the base 171 is fixed to a support plate 173 via actuators 174 .
- the base 171 is made of a plate-like member.
- the base 171 has a rectangular shape in plan view.
- the holding pin 172 may have the same configuration as the holding pin 122 described above.
- the support plate 173 supports the base 171 so that it can move up and down via the actuator 174 .
- the support plate 173 is fixed to the loader section 10 .
- a plurality of (for example, two) actuators 174 are provided on the support plate 173 .
- the actuator 174 raises and lowers the base 171 with respect to the support plate 173 .
- a motor such as a DC motor, stepping motor, or linear motor
- an air drive mechanism such as an air cylinder, or a piezo actuator can be used.
- the turntable 18 may have the same configuration as the turntable 13 described above. That is, the turntable 18 includes a stage 181, a speed reducer 182, a motor 183, and the like.
- the rotary table 18 holds the substrate W by vacuum suction with a plurality of (for example, three) suction pads 181 a provided on the upper surface of the stage 181 , and transfers the power of the motor 183 to the stage 181 via the speed reducer 182 .
- the substrate W is rotated by outputting.
- FIGS. 11A to 13C an example of a method for positioning the substrate W before inspection in the loader section 10 of the inspection apparatus 1 having the positioning table 17 and the rotating table 18 according to the modification will be described.
- the positioning of the substrate W after inspection can be performed in the same manner as the positioning of the substrate W before inspection.
- 11A to 13C are diagrams showing an example of the operation for positioning the substrate W, and are diagrams of the positioning table 17 and the rotating table 18 as seen from the side.
- the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 above the positioning table 17, thereby moving the substrates W contained in the cassette C. It is transported above the positioning table 17 .
- the device controller 30 controls the actuator 174 to raise the base 171 to the UP position.
- the UP position is a position where the upper end of the holding pin 172 is higher than the upper surface of the stage 181 .
- the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the correction position, thereby placing the substrate W on the holding pins 172 .
- the corrected position is a position where the pad 151b is separated from the bottom surface of the substrate W and a position where the top surface of the block portion 151c is higher than the top surface of the substrate W.
- the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 located at the correction position by the first distance in the approach direction, thereby pressing the block part 151c.
- the surface 151d is pressed against the edge of the substrate W to press it.
- the first distance may be 30 mm, for example.
- the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 backward by a second distance, thereby moving the pressing surface 151d of the block portion 151c to the substrate W. away from the end of the This completes the positioning of the substrate W with respect to the pick 151 in the first direction.
- the first direction is the advancing/retreating direction of the pick 151 .
- the second distance may be 20 mm, for example.
- the apparatus controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby lifting the substrate W placed on the holding pins 172 with the pads 151b. Hold.
- the UP position is a position where the lower surface of the substrate W is separated from the holding pins 172 .
- the device controller 30 controls the actuator 174 to lower the base 171 to the DOWN position.
- the DOWN position is a position where the upper end of the holding pin 172 is lower than the upper surface of the stage 181 .
- the device controller 30 controls the substrate transport mechanism 15 so that the center of the pick 151 (substrate W) coincides with the center of the turntable 18 in the advance/retreat direction of the pick 151. Move the pick 151 .
- the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the DOWN position, thereby placing the substrate W on the stage 181 .
- the DOWN position is a position where the pad 151b is separated from the bottom surface of the substrate W.
- the apparatus controller 30 controls the turntable 18 to rotate the stage 181 by 90° while the substrate W is held by suction with the suction pads 181a. Rotate 90°. After rotating the substrate W by 90°, the apparatus controller 30 controls the turntable 18 to stop the suction by the suction pad 181a.
- the apparatus controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby holding the substrate W placed on the stage 181 with the pads 151b. do.
- the UP position is a position where the lower surface of the substrate W is separated from the stage 181 .
- the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 so that the center of the substrate W rotated by 90° coincides with the center of the positioning table 17 in the advancing/retreating direction of the pick 151 .
- the apparatus controller 30 positions the substrate W in the first direction with respect to the pick 151 in the same manner as it positions the substrate W in the first direction with respect to the pick 151. Positioning is performed in a second orthogonal direction.
- the positioning of the substrate W before inspection with respect to the pick 151 in the first direction and the second direction is completed.
- the holding pins 172 of the positioning table 17 can move up and down with respect to the stage 181 of the rotating table 18, but the present disclosure is not limited to this.
- the stage 181 of the rotating table 18 may be vertically movable with respect to the holding pins 172 of the positioning table 17 .
- both the holding pins 172 of the positioning table 17 and the stage 181 of the rotating table 18 may be vertically movable.
- the device controller 30 is an example of a control unit.
- the present disclosure is not limited to this.
- the present invention can also be applied to other processing apparatuses such as a film forming apparatus for forming a film on the substrate W, an etching apparatus for etching a film formed on the substrate W, and the like.
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Abstract
Description
図1~図3を参照し、実施形態の検査装置の一例について説明する。図1は、実施形態の検査装置の一例を示す正面図である。図2は、実施形態の検査装置の一例を示す上面図である。図3は、ローダ部の一例を示す図である。
図4A及び図4Bを参照し、ローダ部10が有する基板搬送機構15のピック151の一例について説明する。図4A及び図4Bは、ピック151の一例を示す図であり、ピック151が基板Wを保持した状態を示す。図4Aはピック151を上方から見た図であり、図4Bはピック151を側方から見た図である。なお、ピック152についてもピック151と同じ構成であってよい。
図5A及び図5Bを参照し、ローダ部10が有する位置決め台12の一例について説明する。図5A及び図5Bは、位置決め台12の一例を示す図であり、位置決め台12の上方にピック151が進入した状態を示す。図5Aは位置決め台12を上方から見た図であり、図5Bは位置決め台12を側方から見た図である。
図6A及び図6Bを参照し、ローダ部10が有する回転台13の一例について説明する。図6A及び図6Bは、回転台13の一例を示す図であり、回転台13の上方にピック151が進入した状態を示す。図6Aは回転台13を上方から見た図であり、図6Bは回転台13を側方から見た図である。
図7~図9Dを参照し、前述した検査装置1において基板Wを検査する場合の検査装置1の動作の一例について説明する。図7は、実施形態の検査装置の動作の一例を示すフローチャートである。
図10A及び図10Bを参照し、ローダ部10が有する位置決め台及び回転台の変形例について説明する。図10A及び図10Bは、位置決め台及び回転台の別の一例を示す図であり、位置決め台及び回転台の上方にピック151が進入した状態を示す。図10Aは位置決め台及び回転台を上方から見た図であり、図10Bは位置決め台及び回転台を側方から見た図である。
12,17 位置決め台
13,18 回転台
15 基板搬送機構
151,152 ピック
151c ブロック部
W 基板
Claims (14)
- 矩形状の基板を搬送する搬送機構と、
前記基板を載置して前記基板の位置決めを行うための位置決め台と、
位置決めされた前記基板を回転させる回転台と、
を有し、
前記搬送機構は、前記位置決め台に載置された前記基板の端部を押圧して前記基板の位置決めを行うブロック部を含む、
処理装置。 - 前記基板を前記位置決め台に載置し、前記基板の端部を前記ブロック部で押圧することにより、前記基板の第1方向の位置決めを行うステップと、
前記第1方向の位置決めが行われた前記基板を前記回転台に載置して90°回転させるステップと、
90°回転した前記基板を前記位置決め台に載置し、前記基板の端部を前記ブロック部で押圧することにより、前記基板の前記第1方向と直交する第2方向の位置決めを行うステップと、
を実行するように構成される制御部を有する、
請求項1に記載の処理装置。 - 前記ブロック部は、前記搬送機構のピックの基端に設けられている、
請求項1又は2に記載の処理装置。 - 前記ブロック部は、前記ピックの進退方向と直交し、前記基板の端部を押圧する押圧面を有する、
請求項3に記載の処理装置。 - 前記ピックは、前記基板を保持する複数のパッドを含む、
請求項3又は4に記載の処理装置。 - 前記複数のパッドは、独立して吸引可能な少なくとも2つの吸着パッドを含む、
請求項5に記載の処理装置。 - 前記基板を収容するカセットと、
前記ピックで前記基板を前記カセットに収容する搬送経路に設けられ、前記ピックに保持された前記基板の位置を検出する位置検出センサと、
を有する、
請求項3乃至6のいずれか一項に記載の処理装置。 - 前記位置決め台は、
板状に形成されたベースと、
前記ベースから上方に突出して上端で前記基板を摺動自在に保持する複数の保持ピンと、を含む、
請求項1乃至7のいずれか一項に記載の処理装置。 - 前記位置決め台は、前記ベースを昇降させる昇降機構を含む、
請求項8に記載の処理装置。 - 前記位置決め台は、前記回転台の上方又は下方に設けられている、
請求項1乃至9のいずれか一項に記載の処理装置。 - 前記位置決め台は、前記回転台と一体として設けられている、
請求項1乃至9のいずれか一項に記載の処理装置。 - 前記基板は、当該処理装置において処理が施される前の基板及び当該処理装置において処理が施された後の基板の少なくともいずれか一方である、
請求項1乃至11のいずれか一項に記載の処理装置。 - 前記処理は、前記基板を検査する処理である、
請求項12に記載の処理装置。 - 位置決め台に載置された矩形状の基板の端部を、前記基板を搬送する搬送機構に設けられたブロック部で押圧することにより、前記基板の第1方向の位置決めを行うステップと、
前記第1方向の位置決めが行われた前記基板を回転台に載置して90°回転させるステップと、
90°回転した前記基板を前記位置決め台に載置し、前記基板の端部を前記ブロック部で押圧することにより、前記基板の前記第1方向と直交する第2方向の位置決めを行うステップと、
を有する、位置決め方法。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08255824A (ja) * | 1988-02-12 | 1996-10-01 | Tokyo Electron Ltd | 処理装置 |
JPH11145248A (ja) * | 1997-11-12 | 1999-05-28 | Canon Inc | 基板搬送装置および露光装置 |
JP2018206877A (ja) * | 2017-05-31 | 2018-12-27 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005116878A (ja) | 2003-10-09 | 2005-04-28 | Toshiba Corp | 基板支持方法および基板支持装置 |
-
2021
- 2021-03-25 JP JP2021050980A patent/JP2022149046A/ja active Pending
-
2022
- 2022-03-11 CN CN202280020861.9A patent/CN116964724A/zh active Pending
- 2022-03-11 WO PCT/JP2022/010937 patent/WO2022202405A1/ja active Application Filing
- 2022-03-11 KR KR1020237035160A patent/KR20230156413A/ko unknown
- 2022-03-16 TW TW111109575A patent/TW202301538A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08255824A (ja) * | 1988-02-12 | 1996-10-01 | Tokyo Electron Ltd | 処理装置 |
JPH11145248A (ja) * | 1997-11-12 | 1999-05-28 | Canon Inc | 基板搬送装置および露光装置 |
JP2018206877A (ja) * | 2017-05-31 | 2018-12-27 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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