WO2022186310A1 - Composition de résine de polyester à cristaux liquides, film de polyester à cristaux liquides utilisant ladite composition, procédé de production dudit film, film stratifié métallique utilisant ledit film, carte de circuit imprimé - Google Patents
Composition de résine de polyester à cristaux liquides, film de polyester à cristaux liquides utilisant ladite composition, procédé de production dudit film, film stratifié métallique utilisant ledit film, carte de circuit imprimé Download PDFInfo
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- WO2022186310A1 WO2022186310A1 PCT/JP2022/008999 JP2022008999W WO2022186310A1 WO 2022186310 A1 WO2022186310 A1 WO 2022186310A1 JP 2022008999 W JP2022008999 W JP 2022008999W WO 2022186310 A1 WO2022186310 A1 WO 2022186310A1
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- WIPO (PCT)
- Prior art keywords
- film
- liquid crystal
- crystal polyester
- resin composition
- amorphous polymer
- Prior art date
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 62
- 239000000203 mixture Substances 0.000 title claims abstract description 22
- 229920001225 polyester resin Polymers 0.000 title claims abstract description 19
- 239000004645 polyester resin Substances 0.000 title claims abstract description 16
- 229920006267 polyester film Polymers 0.000 title claims description 42
- 229910052751 metal Inorganic materials 0.000 title claims description 33
- 239000002184 metal Substances 0.000 title claims description 33
- 239000005001 laminate film Substances 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920000728 polyester Polymers 0.000 claims abstract description 42
- 229920006125 amorphous polymer Polymers 0.000 claims abstract description 27
- 238000001125 extrusion Methods 0.000 claims abstract description 25
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 24
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 23
- 239000011342 resin composition Substances 0.000 claims abstract description 21
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 20
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 20
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 41
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 7
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 9
- 239000002253 acid Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 26
- 125000003118 aryl group Chemical group 0.000 description 8
- 238000004898 kneading Methods 0.000 description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- -1 polytetrafluoroethylene Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004695 Polyether sulfone Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920001230 polyarylate Polymers 0.000 description 4
- 229920006393 polyether sulfone Polymers 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical class CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920000491 Polyphenylsulfone Polymers 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 150000002443 hydroxylamines Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920012287 polyphenylene sulfone Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Definitions
- the present invention relates to a liquid crystalline polyester resin composition whose main component is a thermoplastic liquid crystalline polyester capable of forming an optically anisotropic melt phase (hereinafter referred to as thermoplastic liquid crystalline polyester or liquid crystalline polyester).
- the present invention also relates to a liquid crystal polyester film using the resin composition, a method for producing the film, a metal laminate film using the film, and a circuit board.
- thermoplastic liquid crystal polyester having a basic structure of p-hydroxybenzoic acid or the like and having various components linearly ester-bonded thereto is also known. Due to the advantages of the excellent electrical insulation and dielectric properties of liquid crystalline polyester, liquid crystalline polyester films are increasingly being used for circuit boards.
- liquid crystalline polyester containing p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid and terephthalic acid as constitutional units has a melting point of more than 300° C. and is capable of reflowing lead-free solder. Suitable for substrate applications.
- the liquid crystalline polyester has a property in which the molecular chains are very easily oriented in the direction of flow, so that it cannot be used simply by forming a film.
- Patent Document 1 is an invention (Patent Document 1 [Claim 1]) relating to an aromatic resin composition characterized by comprising a wholly aromatic copolyester (liquid crystal polyester) and polyetherimide. The mechanical properties and electrical properties of wholly aromatic polyester are improved by polyetherimide. Further, Patent Document 1 proposes a liquid crystalline polyester containing p-hydroxybenzoic acid, terephthalic acid and 4,4'-dihydroxybiphenyl as constitutional units as a wholly aromatic polyester (Patent Document 1 [claim 2]). . However, the examples of Patent Document 1 only disclose that the resin composition is press-molded into a test piece, and there is no disclosure of continuously molding it into a film.
- Patent Document 2 The object of Patent Document 2 is to provide a liquid crystal polymer (liquid crystal polyester) film having no anisotropy in the linear thermal expansion coefficient in the plane direction and a small thermal linear expansion coefficient in the thickness direction.
- a liquid crystal polymer is formed from a blend of at least one thermoplastic resin selected from polyethersulfone, polyetherimide, polyamideimide, polyetheretherketone, polyarylate and polyphenylene sulfide.
- the film wherein the proportion of the thermoplastic resin in the blend is 25 to 55% by weight, the linear thermal expansion coefficient of the film in both the MD and TD directions is 5 to 25 ppm, and the thickness direction of the film
- a liquid crystal polymer blend film is provided, characterized in that the linear thermal expansion coefficient of does not exceed 270 ppm (Patent Document 2 [Claim 1]).
- Patent Document 3 is an invention aimed at improving the edge tear strength without impairing the excellent properties of a thermoplastic liquid crystal polymer (liquid crystal polyester) capable of forming an optically anisotropic molten layer.
- Patent Document 3 describes a polymer alloy (Patent Document 3 [Claim 1]) composed of a thermoplastic polymer (liquid crystal polyester) capable of forming an optically anisotropic molten layer and an amorphous polymer, and the polymer A film made of an alloy is disclosed (Patent Document 3 [Claim 2]).
- amorphous polymers include polysulfone, polyethersulfone, polyphenylene sulfide, polycarbonate, polyethylene isophthalate, and polyarylate (Patent Document 3 [0026]).
- the T-die extrusion method and the inflation extrusion method are widely used as methods for forming films from thermoplastic resins.
- a film is formed by a T-die extrusion method in Examples.
- the physical properties of the obtained liquid crystalline polyester film differ greatly between the machine direction (length direction of the film) and the direction perpendicular thereto (width direction of the film).
- CTE coefficient of thermal expansion
- a film is formed by an inflation extrusion method in an example.
- the orientation of the molecular chains can be controlled to some extent by adjusting the blow-up ratio.
- the liquid crystalline polyester having a melting point exceeding 300° C. is heated to the vicinity of the melting point, the melt tension drops sharply.
- the present inventors added an amorphous polymer such as polyarylate to the liquid crystalline polyester in order to improve the film-forming properties in the inflation extrusion molding method, and found that a molten resin called "drop" appeared at the exit of the die. There was a problem that dregs adhered. The adhesion of die drool causes a reduction in the smoothness of the film surface and the formation of holes in the film.
- An object of the present invention is to provide a liquid crystalline polyester resin composition that can be formed into a film by an inflation extrusion molding method, and in which die build-up is less likely to occur at the outlet of the die during film formation.
- a further object of the present invention is to obtain a liquid crystal polyester film having less anisotropy of physical properties and no defects in appearance by using the resin composition.
- Polyester resin composition [2] The liquid crystal polyester resin composition of [1], wherein the thermoplastic liquid crystal polyester (A) further contains terephthalic acid as a structural unit. [3] The liquid crystalline polyester resin composition according to any one of [1] or [2], which is for inflation extrusion molding.
- liquid crystal polyester film comprising the resin composition according to any one of [1] to [3]. [5] 0.75 ⁇ F (TD)/F (MD) ⁇ 1.25, where F (MD) is the tensile strength in the machine direction of the film and F (TD) is the tensile strength in the width direction of the film.
- the liquid crystal polyester film according to [4] characterized by:
- the liquid crystal polyester-based resin composition of the present invention has solder reflowability because the melting point of the liquid crystal polyester (A), which is the main component, exceeds 300°C.
- the amorphous polymer (B) since it contains the amorphous polymer (B), it can be stably formed into a film by an inflation extrusion method.
- the main component of the amorphous polymer is polyetherimide, die build-up does not occur even after extrusion molding. Therefore, the resin composition of the present invention is suitable for use in inflation extrusion molding.
- the liquid crystalline polyester film of the present invention is excellent in surface smoothness because it is made of a resin composition that hardly causes die buildup. In particular, films produced by inflation extrusion have improved anisotropy of physical properties. Therefore, the metal laminate film obtained by laminating the liquid crystal polyester film of the present invention and the metal layer can be suitably used for applications such as laminates for circuit boards suitable for high-speed communication applications.
- the liquid crystal polyester-based resin composition of the present invention comprises a resin composition containing a thermoplastic liquid crystal polyester (A) and an amorphous polymer (B).
- a thermoplastic liquid crystalline polyester is a liquid crystalline polyester exhibiting melt anisotropy (polyester capable of forming an optically anisotropic melt phase). The properties of melt anisotropy can be confirmed by a conventional polarization inspection method using crossed polarizers.
- the melting anisotropy was measured by using a polarizing microscope (manufactured by Olympus Co., etc.), melting a sample placed on a hot stage (manufactured by Linkham Co., etc.), and exposing it to a 150-fold magnification in a nitrogen atmosphere. It can be confirmed by observation.
- a liquid crystalline resin exhibiting optical anisotropy when melted is optically anisotropic and transmits light when inserted between crossed polarizers. If the sample is optically anisotropic, polarized light will be transmitted, for example, even in the still molten liquid state.
- the thermoplastic liquid crystal polyester (A) used in the resin composition of the present invention is a resin having a melting point of over 300°C among thermoplastic liquid crystal polyesters. If the melting point is lower than 300° C., the reflowability of the solder is poor, so if it is used for printed circuit boards and the like, the processing method will be restricted. Specifically, it is a liquid crystalline aromatic polyester containing p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid as main structural units. Preferably, terephthalic acid is further used as a structural unit. The polymerization ratio of these structural units is not particularly limited. 2 to 25 mol % (preferably 3 to 10 mol %) of naphthoic acid and 0 to 40 mol % (preferably 13 to 30 mol %) of terephthalic acid.
- the melting point of the thermoplastic liquid crystal polyester (A) was determined by heating the sample at a rate of 10 ° C./min using a differential scanning calorimeter (DSC) to completely melt it, and then heating the melt at a rate of 10 ° C./min. is cooled to 30° C., and the temperature is again raised at a rate of 10° C./min.
- DSC differential scanning calorimeter
- liquid crystalline polyester (A) of the present invention may be aromatic or aliphatic dicarboxylic acids, aromatic or aliphatic dihydroxy compounds, aromatic hydroxycarboxylic acids, aromatic diamines, aromatic Components such as hydroxylamines or aromatic aminocarboxylic acids may also be included.
- aromatic or aliphatic dicarboxylic acids aromatic or aliphatic dihydroxy compounds
- aromatic hydroxycarboxylic acids aromatic diamines
- aromatic Components such as hydroxylamines or aromatic aminocarboxylic acids
- Specific examples include isophthalic acid, 6-naphthalene dicarboxylic acid, 4,4'-biphenol, bisphenol A, hydroquinone, ethylene terephthalate, and the like, and one or more of these can be used as structural units.
- an acylating agent for the above structural units and a terminal-activated monomer as an acid chloride derivative can be used in combination.
- the acylating agent includes acid anhydrides such as acetic anhydride.
- Amorphous polymers are resins that do not have a portion (crystalline portion) in which molecules are regularly arranged, and do not have a melting point.
- the amorphous polymer (B) used in the resin composition of the present invention contains polyetherimide as a main component.
- Polyetherimide is a resin having an ether bond and an imide bond, and polyetherimide represented by general formula (1) is widely known.
- Polyetherimide exhibits stable electrical insulation over a wide range of frequencies and temperature ranges. In addition, the mechanical properties are stable over a wide temperature range. Furthermore, general amorphous polymers are weak against chemicals, but polyetherimide can maintain its strength even when it comes into contact with acids and alkalis. In the present invention, attention is focused on such properties of polyetherimide, and it is used as a component for improving the workability of liquid crystal polyester (A) having a high melting point. Although the main component of the amorphous polymer (B) is polyetherimide, it may contain other amorphous polymers within the scope of the effects of the present invention.
- the blending ratio of the polyetherimide in the amorphous polymer (B) is desirably 70% by weight or more, more preferably 80% by weight or more, and particularly preferably 90% by weight or more. If the blending ratio of polyetherimide in the amorphous polymer (B) is less than the above range, die build-up occurs at the outlet of the die during film formation by inflation extrusion.
- the present invention also proposes a film comprising the above resin composition and a method for producing the film.
- the liquid crystalline polyester film of the present invention is obtained by blending the above-described liquid crystalline polyester (A) and the amorphous polymer (B) by a known method to form a film.
- the amount of the amorphous polymer (B) in the resin composition of the present invention is small, in order to provide a stable kneading state, a twin-screw kneading facility is used prior to film formation, or a kneading unit is used.
- the resin composition of the present invention can suppress the formation of drool at the die exit portion, it is desirable to form the film by an extrusion molding method such as a T-die extrusion molding method or an inflation extrusion molding method. According to these methods, films can be continuously formed industrially.
- the inflation extrusion method is particularly advantageous in consideration of the balance of mechanical strength of the film.
- the anisotropy difference between the length direction and the width direction
- the anisotropy difference between the length direction and the width direction
- the tensile elastic modulus and tensile strength of the obtained film can be eliminated to some extent by lowering the draw ratio, but stable It is difficult to fully resolve at the stretch ratio at which molding can be performed.
- the inflation molding method the anisotropy is largely eliminated by increasing the blow-up ratio (the ratio of the final tube diameter to the initial diameter).
- the above-mentioned resin composition is supplied to a melt-kneading extruder equipped with an annular slit die, and the cylinder setting temperature is usually 280 to 400 ° C., preferably 320 to 380 ° C. while melting.
- a tubular liquid crystalline polyester film is extruded upward or downward from the annular slit of the extruder.
- the interval of the annular slit is usually 0.1-5 mm, preferably 0.2-2 mm, and the diameter of the annular slit is usually 20-1000 mm, preferably 25-600 mm.
- the melt-extruded cylindrical molten resin film is drafted in the film flow direction (MD), and air or an inert gas such as nitrogen gas is blown from the inside of the cylindrical molten resin film.
- the film is expanded and stretched in a direction (width direction) (TD) perpendicular to .
- the blow-up ratio (the ratio of the final tube diameter to the initial diameter) is usually 1.5-10.0.
- the draw ratio (draft ratio) in the machine direction (MD) is usually 1.5 to 40.0. Within this range, a high-strength liquid crystal polyester film having a uniform thickness and no wrinkles can be obtained. .
- the expanded and stretched film is air-cooled or water-cooled, then passed through nip rolls and taken over.
- the blow-up ratio is more preferably 2.0 or more, more preferably 4.0 or more. , 4.5 or more.
- the blow ratio is, for example, 10.0 or less.
- the draw ratio in the machine direction (MD) is preferably 1.5 or more and 20 or less, more preferably 1.5 or more and 10 or less. If the blow ratio and the draw ratio in the machine direction (draft ratio) are within the ranges described above, the anisotropy of the molecular orientation is improved, and the electrical anisotropy is less likely to occur in the liquid crystal polyester film. It can be suitably used for the purpose of
- the thickness of the liquid crystalline polyester film of the present invention is usually 0.5 to 500 ⁇ m from the viewpoint of film formability and mechanical properties, and preferably 1 to 300 ⁇ m from the viewpoint of handleability. Since the liquid crystalline polyester film of the present invention has excellent surface smoothness, it can be laminated with a metal plate, which will be described later, with high accuracy. Further, the liquid crystalline polyester film of the present invention preferably has low anisotropy in the machine direction (MD) and width direction (TD) of the film.
- MD machine direction
- TD width direction
- the tensile strength F(TD) in the film width direction relative to the tensile strength F(MD) in the film machine direction is preferably 0.5 or more and 1.5 or less. Further, it is preferably from 0.70 to 1.25, particularly preferably from 0.75 to 1.20, and particularly preferably from 0.80 to 1.10. If F(TD)/F(MD) is out of the above range, the anisotropy of the strength of the film is large and the handleability is deteriorated.
- the liquid crystalline polyester film of the present invention may be used as a metal laminate film by laminating a metal layer thereon.
- the surface of the liquid crystalline polyester film on which the metal layer is to be laminated may be subjected to corona discharge treatment, ultraviolet irradiation treatment or plasma treatment in order to increase adhesive strength.
- Methods for laminating a metal layer on the liquid crystal polyester film of the present invention include, for example, (1) a method of attaching the liquid crystal polyester film to a metal foil by thermocompression bonding, and (2) bonding the liquid crystal polyester film and the metal foil. (3) a method of forming a metal layer on a liquid crystal polyester film by vapor deposition; Among them, the lamination method (1) is a method of press-bonding the liquid crystal polyester film to the metal foil near the flow initiation temperature using a press machine or a heating roll, and is recommended because it can be easily carried out. Examples of adhesives used in the lamination method (2) include hot-melt adhesives and polyurethane adhesives. Among them, an epoxy group-containing ethylene copolymer is preferably used as an adhesive.
- Examples of the lamination method (3) include an ion beam sputtering method, a high frequency sputtering method, a DC magnetron sputtering method, and a glow discharge method. Among them, the high frequency sputtering method is preferably used.
- the structure of the metal laminate film thus obtained includes, for example, a two-layer structure of a liquid crystal polyester film and a metal layer, a three-layer structure in which metal layers are laminated on both sides of the liquid crystal polyester film, and a liquid crystal polyester film and a metal layer. A five-layer structure in which metal layers are alternately laminated can be mentioned. For the purpose of developing high strength, the laminate may be subjected to heat treatment, if necessary.
- the thickness of the metal layer is not particularly limited, it is preferably 1.5 to 1000 ⁇ m, more preferably 2 to 500 ⁇ m, even more preferably 5 to 150 ⁇ m, particularly preferably 7 to 100 ⁇ m. If the thickness is less than the above range, the mechanical strength is inferior, and if the thickness is greater than the above range, the handleability and workability are inferior.
- the circuit board of the present invention includes at least one conductor layer and at least one insulator (or dielectric) layer. Its form is not particularly limited, and it can be used as various high-frequency circuit boards by known or common means. Also, the circuit board may be a circuit board (or a semiconductor element mounting board) on which a semiconductor element (for example, an IC chip) is mounted.
- the conductor layer used in the circuit board of the present invention is formed, for example, from at least a metal having conductivity, and a circuit pattern is formed on this conductor layer using a known circuit processing method.
- a circuit pattern is formed on the metal layer portion of the metal laminate film described above.
- Resins used in the following examples and comparative examples are as follows.
- LCP A liquid crystal polyester having a melting point of 320°C and containing p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, and terephthalic acid as structural units
- LAPEROS registered trademark
- C950RX manufactured by Polyplastics Co., Ltd.
- PEI Polyetherimide (SILTEM STM-1700 manufactured by SHPP Japan LLC) PAR: polyarylate (U polymer (registered trademark) U-100 manufactured by Unitika Ltd.)
- PSU Polysulfone (Ultrason (registered trademark) S2010 manufactured by BASF Japan)
- PPSU polyphenylene sulfone (Ultrason (registered trademark) P3010 manufactured by BASF Japan)
- PES Polyethersulfone (Ultrason (registered trademark) E2010 manufactured by BASF Japan)
- Example 1 99% by weight of LCP and 1% by weight of PEI are dry blended, and a 50 ⁇ m liquid crystal polyester film is formed by inflation extrusion molding.
- the blow-up ratio was 5 times, and the draw ratio in the machine direction (MD) of the film was 2 times.
- Table 1 shows the film formability and tensile strength of the obtained film.
- Examples 2 to 4 Liquid crystalline polyester films of Examples 2 to 4 and Comparative Examples 1 to 7 were obtained in the same manner as in Example 1, except that the liquid crystalline polyester resin composition was changed as shown in Table 1.
- Table 1 shows the film formability and tensile strength of the obtained film.
- the liquid crystalline polyester films of Examples 1 to 4 were excellent in surface smoothness without causing die build-up during film formation. Also, no holes were found.
- the films of Examples 1 and 2 had high values of tear strength and excellent mechanical properties.
- the films of Comparative Examples 4 and 5 die build-up was observed in the vicinity of the exit of the die, and the surfaces of the obtained films were greatly roughened.
- the films of Comparative Examples 1, 3, 5, 6, and 7 were found to have holes, albeit slightly.
- the film of Comparative Example 2 had large holes and could not be formed.
- the liquid crystalline polyester film obtained by the present invention is used for electrical insulation of motors and transformers, for flexible solar cell element forming films, etc., taking advantage of its excellent electrical properties, dimensional stability and heat resistance. . It can also be used for surface protective films and diaphragms in the acoustic field.
- the metal laminate film of the present invention can also be used for circuit boards, capacitors, electromagnetic shielding materials, and the like.
- the circuit board of the present invention may be used for various transmission lines and antennas (for example, microwave or millimeter wave antennas), and may be used for antenna devices in which an antenna and a transmission line are integrated.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Priority Applications (2)
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JP2023503934A JPWO2022186310A1 (fr) | 2021-03-05 | 2022-03-02 | |
CN202280017816.8A CN116940633A (zh) | 2021-03-05 | 2022-03-02 | 液晶聚酯系树脂组合物、使用该组合物的液晶聚酯系薄膜、该薄膜的制造方法、使用该薄膜的金属层合薄膜、电路基板 |
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JP2021-035077 | 2021-03-05 | ||
JP2021035077 | 2021-03-05 |
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PCT/JP2022/008999 WO2022186310A1 (fr) | 2021-03-05 | 2022-03-02 | Composition de résine de polyester à cristaux liquides, film de polyester à cristaux liquides utilisant ladite composition, procédé de production dudit film, film stratifié métallique utilisant ledit film, carte de circuit imprimé |
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JP (1) | JPWO2022186310A1 (fr) |
CN (1) | CN116940633A (fr) |
TW (1) | TW202246413A (fr) |
WO (1) | WO2022186310A1 (fr) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63215769A (ja) * | 1986-12-31 | 1988-09-08 | ゼネラル・エレクトリック・カンパニイ | ポリエーテルイミドー液晶ポリマーブレンド |
JPS641758A (en) * | 1987-06-24 | 1989-01-06 | Matsushita Electric Works Ltd | Aromatic resin composition |
JP2004175995A (ja) * | 2002-11-28 | 2004-06-24 | Japan Gore Tex Inc | 液晶ポリマーブレンドフィルム |
JP2007197714A (ja) * | 2005-12-28 | 2007-08-09 | Nippon Talc Co Ltd | 液晶性樹脂アロイ組成物及びフィルム |
JP2012097382A (ja) * | 2010-11-04 | 2012-05-24 | Kuraray Co Ltd | 耐熱性ブレンド繊維 |
JP2021004330A (ja) * | 2019-06-27 | 2021-01-14 | デンカ株式会社 | Lcptダイ押出未延伸フィルム、並びにこれを用いたフレキシブル積層体及びその製造方法 |
-
2022
- 2022-03-02 WO PCT/JP2022/008999 patent/WO2022186310A1/fr active Application Filing
- 2022-03-02 JP JP2023503934A patent/JPWO2022186310A1/ja active Pending
- 2022-03-02 CN CN202280017816.8A patent/CN116940633A/zh active Pending
- 2022-03-04 TW TW111107857A patent/TW202246413A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63215769A (ja) * | 1986-12-31 | 1988-09-08 | ゼネラル・エレクトリック・カンパニイ | ポリエーテルイミドー液晶ポリマーブレンド |
JPS641758A (en) * | 1987-06-24 | 1989-01-06 | Matsushita Electric Works Ltd | Aromatic resin composition |
JP2004175995A (ja) * | 2002-11-28 | 2004-06-24 | Japan Gore Tex Inc | 液晶ポリマーブレンドフィルム |
JP2007197714A (ja) * | 2005-12-28 | 2007-08-09 | Nippon Talc Co Ltd | 液晶性樹脂アロイ組成物及びフィルム |
JP2012097382A (ja) * | 2010-11-04 | 2012-05-24 | Kuraray Co Ltd | 耐熱性ブレンド繊維 |
JP2021004330A (ja) * | 2019-06-27 | 2021-01-14 | デンカ株式会社 | Lcptダイ押出未延伸フィルム、並びにこれを用いたフレキシブル積層体及びその製造方法 |
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JPWO2022186310A1 (fr) | 2022-09-09 |
TW202246413A (zh) | 2022-12-01 |
CN116940633A (zh) | 2023-10-24 |
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