WO2022186120A1 - 樹脂シートおよびその利用 - Google Patents
樹脂シートおよびその利用 Download PDFInfo
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- WO2022186120A1 WO2022186120A1 PCT/JP2022/008223 JP2022008223W WO2022186120A1 WO 2022186120 A1 WO2022186120 A1 WO 2022186120A1 JP 2022008223 W JP2022008223 W JP 2022008223W WO 2022186120 A1 WO2022186120 A1 WO 2022186120A1
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- 239000001294 propane Substances 0.000 description 1
- 125000006225 propoxyethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 235000010378 sodium ascorbate Nutrition 0.000 description 1
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 description 1
- 229960005055 sodium ascorbate Drugs 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- KGLSETWPYVUTQX-UHFFFAOYSA-N tris(4-isocyanatophenoxy)-sulfanylidene-$l^{5}-phosphane Chemical compound C1=CC(N=C=O)=CC=C1OP(=S)(OC=1C=CC(=CC=1)N=C=O)OC1=CC=C(N=C=O)C=C1 KGLSETWPYVUTQX-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2333/08—Homopolymers or copolymers of acrylic acid esters
Definitions
- the present invention relates to a resin sheet, an adhesive sheet including the resin sheet, a resin composition for forming the resin sheet, and a method for producing the resin sheet.
- pressure-sensitive adhesives also called pressure-sensitive adhesives; the same applies hereinafter
- pressure-sensitive adhesives are widely used in various fields, typically in the form of pressure-sensitive adhesive sheets containing pressure-sensitive adhesive layers.
- Patent Documents 1 to 17 are listed as technical documents related to pressure-sensitive adhesives.
- Patent Document 1 proposes a pressure-sensitive adhesive layer in which a so-called double network in which a second mesh is intricately formed in a first mesh is formed with respect to a pressure-sensitive adhesive sheet for semiconductor processing. It is said that adhesive residue is less likely to occur when peeling from a work such as a semiconductor wafer (Paragraph 0019, etc.).
- a resin film that can be used as an adhesive sheet or its component (typically an adhesive layer) and that stretches well and requires an appropriate amount of force for stretching, that is, a flexible and tough resin film is provided.
- the pressure-sensitive adhesive layer specifically disclosed in Patent Document 1 does not satisfy the level aimed at by the present inventors from the viewpoint of flexibility and toughness.
- the pressure-sensitive adhesive layers specifically disclosed in Patent Documents 2 to 17 are also not sufficiently flexible and tough at the level aimed at by the present inventors.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a flexible and tough resin sheet and a pressure-sensitive adhesive sheet containing the resin sheet. Another related object is to provide a resin composition for forming the resin sheet. Yet another related object is to provide a method of manufacturing a flexible and tough resin sheet.
- This specification provides a resin film having a stress integral value of greater than 10 MPa and less than or equal to 1000 MPa when uniaxially stretched at 25°C and at a tensile speed of 300 mm/min until it breaks. Since such a resin film is flexible and tough, it can be preferably used, for example, as an adhesive sheet or a component thereof.
- the resin film according to some embodiments has an elongation at break of 300% or more and 4500% or less when uniaxially stretched at 25°C and a tensile speed of 300 mm/min until it breaks.
- a resin film having an elongation at break within the above range is preferable from the viewpoint of achieving both flexibility (for example, flexibility suitable for a pressure-sensitive adhesive sheet or a component thereof) and supple and tough properties in a well-balanced manner.
- the resin films according to some aspects have a hysteresis of 1.2 or more and 20 or less obtained by the test described later.
- a resin film having a degree of hysteresis within the above range can suitably exhibit flexible and tough properties.
- Resin films according to some embodiments exhibit necking behavior in which the ratio (W min /W max ) based on the necking test described below is greater than 0 and 0.90 or less.
- a resin film in which necking is observed during stretching in this way tends to be more flexible and tough than a resin film in which necking is not observed during stretching.
- a resin film according to some aspects includes a first mesh and a second mesh that coexist in the same layer, and the first mesh and the second mesh are physically entangled with each other via the mesh. With such a structure, a flexible and tough resin film can be preferably realized.
- the first network is a cured product of the first material, and the first material contains a polymer (a1) having a reactive functional group (f1).
- the second network is a cured product of the second material, and the second material contains a polyfunctional monomer (b1) having two or more reactive functional groups (f2) in one molecule.
- an acrylic polymer can be preferably employed as the polymer (a1).
- the acrylic polymer preferably has a weight average molecular weight (Mw) of 80 ⁇ 10 4 or more.
- Mw weight average molecular weight
- a resin film having a first mesh formed from an acrylic polymer having such an Mw is suitable for realizing a supple and tough resin film because the first mesh is difficult to break and can be stretched well.
- composition numerical value Y1 may be, for example, 0.21 or more, 0.25 or more, 0.30 or more, 0.35 or more, or 0.40 or more. Also, the composition numerical value Y1 may be, for example, 0.75 or less, 0.70 or less, 0.65 or less, or 0.60 or less.
- the resin film disclosed herein can also be preferably implemented in a mode in which the polymer (a1) is a polyester-based polymer.
- the average functional group number A of all the monomers contained in the second material, the number of parts B [parts by weight] used with respect to 100 parts by weight of the polymer (a1) of all the monomers, and the weight average molecular weight C of all the monomers and the number average molecular weight D′ of the polymer (a1), and the composition numerical value Y2 calculated by the following formula (2): Y2 [(AB/C)/D′] ⁇ 10 7 (2); is preferably 6.0 or more and 7.0 or less.
- a pressure-sensitive adhesive sheet containing any of the resin films disclosed herein is provided.
- the adhesive sheet may be, for example, a substrateless or substrate-attached adhesive sheet containing the resin film as an adhesive layer, or may be a substrate-attached sheet containing the resin film as a substrate.
- the resin composition comprises, for example, a first material containing a polymer (a1) having a reactive functional group (f1), and a reactive functional group ( and a second material comprising a polyfunctional monomer (b1) having two or more f2) in one molecule.
- the resin composition contains a cross-linking agent that mainly reacts with either one of the reactive functional groups (f1) and (f2), and accelerates photocuring of one of the reactive functional groups (f1) and (f2).
- a photoinitiator for the photoinitiator may be further included, if desired.
- the first mesh which is the cured product of the first material
- the second mesh which is the cured product of the second material
- a structure can be formed, and a resin film having a stress integral value of more than 10 MPa and 1000 MPa or less can be preferably realized.
- Patent Document 1 As is clear from the breaking stress and breaking elongation shown in Table 1, the pressure-sensitive adhesive layer specifically disclosed in Patent Document 1 has a stress integral value much lower than 10 MPa.
- Patent Documents 2 to 7 disclose an adhesive having an interpenetrating polymer network structure, and the adhesive layers specifically disclosed in these patent documents form a network structure. The weight average molecular weight of the polymer to be used, the number of functional groups and functional group equivalents of the polyfunctional monomer, the balance of the amount used, etc. 1 or 2 or more selection is not appropriate, so neither satisfies the requirement of stress integral value exceeding 10 MPa .
- the pressure-sensitive adhesive layers according to the specific examples described in Patent Documents 8 to 17 also do not satisfy the stress integral exceeding 10 MPa.
- FIG. 1 is a cross-sectional view schematically showing one embodiment of a pressure-sensitive adhesive sheet containing a resin film
- FIG. 4 is a cross-sectional view schematically showing another aspect of a pressure-sensitive adhesive sheet containing a resin film.
- FIG. 4 is a cross-sectional view schematically showing another aspect of a pressure-sensitive adhesive sheet containing a resin film;
- the resin film disclosed by this specification may be adhesive, non-adhesive or low-adhesive.
- a SUS304 stainless steel plate is used as an adherend, and a 2 kg roller is reciprocated once in a measurement environment of 23 ° C. to press it against the adherend.
- Such an adhesive resin film can also be grasped as a pressure-sensitive adhesive layer or a pressure-sensitive adhesive sheet (substrate-less pressure-sensitive adhesive sheet).
- a non-adhesive or low-adhesive resin film refers to a resin film having a peel strength of less than 0.1 N/20 mm.
- a resin film that does not stick to a SUS304 stainless steel plate (a resin film that does not exhibit substantially adhesiveness) when pressed against a SUS304 stainless steel plate by reciprocating a 2 kg roller one time in a measurement environment at 23° C. It is a typical example included in the concept of tacky or low tack resin film.
- Stress integral value This specification provides a resin film having a stress integral of greater than 10 MPa to 1000 MPa.
- the stress integral value corresponds to the integrated stress applied in the process of uniaxially stretching the sample to the elongation at break.
- a resin film having such properties can be preferably used, for example, as a pressure-sensitive adhesive sheet containing the resin film as a pressure-sensitive adhesive layer.
- a pressure-sensitive adhesive layer with a high stress integral value can form flexible and tough threads in the stringing phenomenon that occurs when the layer is peeled off from the adherend. This can advantageously contribute to achieving both high peel strength and good non-sticky property, improved impact resistance, and the like.
- the resin film is a constituent element (for example, a base film, an adhesive or non-adhesive intermediate layer, etc.) other than the adhesive layer that constitutes the adhesive surface (contact surface with the adherend) in the adhesive sheet. It can also be used as such, thereby imparting flexibility and toughness to the pressure-sensitive adhesive sheet.
- the stress integral value is measured by a tensile test in which the measurement sample is uniaxially stretched at 25°C at a tensile speed of 300 mm/min until it breaks.
- a resin film to be evaluated was prepared in the form of a cylinder having a diameter of about 0.5 to 3 mm (preferably about 0.5 to 2 mm, for example about 1 mm) or a rod having an equivalent cross-sectional area. use stuff.
- the above sample was pulled at 25° C. using a tensile tester with a chuck length of 10 mm and a tensile speed of 300 mm/min until it broke, and during this time, a stress value was obtained for each predetermined elongation [%] of the sample.
- the stress integral value based on the obtained elongation [%]/stress [MPa] curve and the stress value at each elongation. For example, the stress value is obtained every 2.5% elongation from the initial length of the sample (10 mm), the total value of those stress values is obtained, and the total value [MPa] ⁇ 2.5 [%] / 100 Calculate the stress integral value by As a tensile tester, Shimazu EZ-S 500N or its equivalent can be used. More specifically, for example, the stress integral value is measured by the method described in Examples below.
- the shape of the measurement sample is such that at least the 10 mm portion disposed between the chucks has a substantially constant cross-sectional area and cross-sectional shape.
- the above samples can be prepared by appropriately combining operations such as cutting the resin film, winding (for example, rolling in one direction), stacking, folding, and the like. At that time, it is desirable to take care not to apply a load in the direction in which the sample is stretched. If necessary, the above winding, stacking, folding, etc. operations are performed under moderately heated conditions (for example, at a temperature of about 30° C. to 80° C.) in order to facilitate the forming of the sample into a rod shape. good too. In this case, the prepared sample is used for the above tensile test after being sufficiently acclimatized to the measurement environmental temperature.
- the above tensile test is preferably performed using a measurement sample consisting only of the resin film to be measured.
- another layer is laminated on the resin film to be measured, and it is difficult to separate the resin film and the other layer, and the stress required for stretching the other layer increases the stress required for stretching the resin film.
- the resin The stress integral value obtained by performing the tensile test using the measurement sample prepared from the laminated sheet of the film and the other layer is obtained using the measurement sample consisting only of the resin film to be measured. can be used as a substitute for the calculated stress integral value.
- the stress value obtained for each predetermined elongation [%] of the sample is obtained as a value per cross-sectional area of the resin film to be measured.
- Example 8 among the specific examples described in this specification, measurement prepared from a laminated sheet of a resin film to be measured (resin film of Example 8) and another layer (adhesive layer of Example 9) Each characteristic value was determined by performing a tensile test using a sample for
- the stress integral value is preferably 11 MPa or more, more preferably 13 MPa or more, 15 MPa or more, 18 MPa or more, 20 MPa or more, or 22 MPa or more.
- a more flexible and tough resin film can be realized by increasing the stress integral value.
- the stress integral value may be, for example, 30 MPa or higher, 45 MPa or higher, or 60 MPa or higher, 100 MPa or higher, 200 MPa or higher, 300 MPa or higher, or 400 MPa or higher.
- the stress integral value is suitably 1000 MPa or less, preferably 800 MPa or less, and more preferably 600 MPa or less.
- the stress integral value may be 500 MPa or less, 300 MPa or less, 100 MPa or less, 50 MPa or less, or 30 MPa or less.
- the stress integral value can be adjusted by selecting the structure of the resin film, selecting the constituent material, and the like. For example, in the double network structure in which the first network and the second network are intertwined to be described later, the type and molecular weight of the polymer used to form the first network, the cross-linking method and cross-linking density, the monomer used to form the second network
- the stress integral value can be adjusted by appropriately setting one or more factors such as the type, molecular weight, number of functional groups, weight ratio of the first network to the second network, and the like.
- the resin film exhibiting the preferable integrated stress value disclosed herein can be realized by performing the above setting in consideration of the composition numerical values Y1 and Y2 described later.
- the resin film disclosed by this specification includes the aspect without the limitation of the stress integral value, and in such an aspect, the resin film is not limited to what has the said characteristic.
- the stress integral value can be suitably realized by coexisting the first mesh and the second mesh in the same layer of the resin film. It is preferable that the first mesh and the second mesh form a double network structure in which they are physically entangled with each other through meshes. Moreover, it is preferable that the second mesh is formed so as to be finer than the first mesh. As the resin film having such a structure is stretched, the general tendency is that when the strain reaches a certain level, the second mesh begins to break, and as the strain increases, the second mesh breaks, and then the first. Mesh breakage progresses.
- a resin film having a double network structure can exhibit flexible and tough properties because the second network functions as a so-called sacrificial network against stretching.
- a resin film having a double network structure in which the second mesh functions as a sacrificial mesh is stretched to a length at which the breakage of the second mesh progresses to some extent (first stretching), once the stretching stress is relaxed, and then stretched again. (Second drawing) Then, since part of the second network has already been broken in the second drawing, the stress-strain curve up to the first drawing length is different from that in the first drawing, It comes to transition at a lower stress. Such a property is called hysteresis property. From this, it can be confirmed that a double network structure is formed.
- a resin film having an appropriate degree of hysteresis can preferably exhibit flexible and tough properties.
- the degree of hysteresis can be evaluated by the method described in Examples below using a measurement sample prepared in the same manner as the evaluation of the stress integral value described above. For example, when the elongation at break obtained by stretching sample A in the evaluation of the stress integral value is 1000% (X%), a measurement sample prepared in the same manner as sample A (hysteresis measurement Sample B) was first uniaxially stretched to 700% (0.7X) (first cycle stretching), held at the end point of stretching for 1 second, then pulled back to a chuck length of 10 mm and held for 10 seconds, and then 800%.
- the film is uniaxially stretched to (2nd cycle stretching), held at the end point of stretching for 1 second, and then pulled back to a chuck-to-chuck length of 10 mm to perform a cycle test. Then, the stress S1 when stretched to a length of 660% (0.7X [%]-40%) in the first cycle stretching, and the same length in the second cycle stretching (that is, up to 660% length) S1/S2 is obtained from the stress S2 at the time of elongation, and this value is defined as hysteresis.
- the hysteresis may be, for example, 1.2 or more, suitably more than 1.2, preferably 1.3 or more, It is more preferably 1.5 or more, may be 1.6 or more, or may be 1.7 or more.
- the hysteresis is preferably 1.9 or more, more preferably 2.0 or more, from the viewpoint of exhibiting a higher elongation at break and facilitating the realization of a flexible and tough resin film. is more preferable, and may be 2.2 or more, 2.4 or more, or 2.6 or more.
- the upper limit of hysteresis is not particularly limited.
- the hysteresis is suitably 20 or less, preferably 15 or less, and 10 from a practical point of view such as maintaining appropriate elasticity during the second and subsequent stretching. It is more preferably 8.0 or less, 6.0 or less, 4.0 or less, or 3.0 or less.
- the hysteresis can be adjusted by selecting the structure of the resin film, selecting the constituent materials, etc. For example, the type and molecular weight of the polymer used to form the first network, the cross-linking means and cross-linking density, the type and molecular weight of the monomer used to form the second network, the number of functional groups, the weight ratio of the first network to the second network. By appropriately setting one or more elements such as , etc., the stress integral value can be adjusted.
- the resin film exhibiting moderate hysteresis can be realized by performing the above setting in consideration of the composition numerical values Y1 and Y2 described later.
- the elongation at break of the resin film disclosed herein is not particularly limited, and may be, for example, about 100% to 5000% (preferably about 250% to 4000%). From the viewpoint of achieving a good balance between flexibility suitable as a pressure-sensitive adhesive sheet or a component thereof and supple and tough properties, in some embodiments, the elongation at break is preferably 300% or more, preferably 450%. More preferably, it may be 600% or more, 750% or more, 900% or more, or 1000% or more. Also, in some embodiments, The elongation at break of the resin film is suitably 4500% or less, preferably 3000% or less, 2400% or less, 2200% or less, 1700% or less, or 1500% or less.
- the elongation at break is not too large, for example, in the resin film used as the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive surface, from the viewpoint of suppressing adhesive residue on the adherend.
- the elongation at break is obtained by recording the elongation when the sample breaks in the measurement of the stress integral value described above.
- the elongation at break can be adjusted by selecting the structure of the resin film, selecting the constituent materials, and the like.
- the breaking stress of the resin film disclosed herein is not particularly limited. From the viewpoint of facilitating the realization of a flexible and tough resin film (for example, a resin film having a stress integral value of greater than 10 MPa), in some embodiments, the breaking stress of the resin film may be, for example, about 0.5 MPa to 100 MPa. .
- the preferred range of breaking stress may vary depending on the material and application of the resin film. For example, in a resin film in which the polymer (a1) described below is an acrylic polymer, the breaking stress is preferably about 2 MPa to 50 MPa, of which the resin film used as the adhesive layer is 2 MPa to 10 MPa (for example, 2 MPa to 6 MPa).
- the breaking stress is preferably about 10 MPa to 100 MPa.
- the breaking stress is obtained by recording the elongation when the sample breaks in the measurement of the stress integral value described above.
- the breaking stress can be adjusted by selecting the structure of the resin film, selecting the constituent materials, and the like.
- the resin film disclosed herein can be obtained by the following formula from the stress integral value [MPa], breaking stress [MPa] and elongation at break [%] obtained by the above-described method: (stress integral value x 100) / (breaking stress x elongation at break); is suitably greater than 30% (i.e. greater than 0.3), advantageously greater than 35%, preferably greater than 40%, 45 % is more preferred.
- stress integral value x 100 breaking stress x elongation at break
- the area ratio of the stress integration increases. Therefore, it can be said that a resin film having a larger stress integral area ratio is more flexible and tough.
- a resin film that satisfies a predetermined or more stress integral value, a predetermined or more elongation at break, and a predetermined or more stress integral area ratio is particularly preferable.
- the area fraction of the stress integral may be 50% or more or more than 50%, 55% or more or more than 55%, or 60% or more or more than 60%.
- the upper limit of the area ratio of the stress integral is suitably 95% or less, preferably 90% or less, and 85% or less. , or 80% or less.
- a resin film having a large stress integral area ratio can be preferably realized in a resin film having a double network structure in which the first mesh and the second mesh are physically entangled with each other through the mesh.
- the second network starts to break when a certain stress value is reached due to an increase in strain.
- the breakage of the second mesh is prevented from progressing rapidly and leading to breakage at an early stage, and the breakage of the second mesh gradually progresses while maintaining a relatively high stress value, so that the area of stress integration It is thought that the ratio is likely to increase.
- Resin films according to some preferred embodiments exhibit a behavior in which the sample is non-uniformly thinned in the longitudinal direction when the sample is uniaxially stretched. Such behavior is hereinafter referred to as necking.
- necking it is preferable to use a resin film in which necking is observed when a measurement sample prepared in the same manner as the evaluation of the stress integral value described above is uniaxially stretched under the conditions described later in Examples.
- Such properties can be preferably exhibited, for example, in the resin film having the double network structure. This is because when a resin film having an appropriate double network structure is stretched, even if the second mesh starts to break at one point in the sample, the stress is generated due to the deformation of the first mesh that is entangled with the second mesh.
- the presence or absence of necking can be specifically determined by the following necking test.
- necking test (1) Prepare sample A for elongation at break measurement and sample C for necking measurement. (2) Determine the elongation at break X [%] when the sample A is uniaxially stretched at 25° C. at a tensile speed of 300 mm/min until it breaks. (3) At 25° C., the sample C is uniaxially stretched from the initial chuck-to-chuck length to 0.5 ⁇ [%] at a tensile speed of 300 mm/min. At the end of stretching, a photograph of the stretched sample is taken with a digital camera within 1 second after the end of stretching. Photographing is performed from a direction orthogonal to the stretching direction of the sample.
- the ratio (W min /W max ) is preferably 0.85 or less, more preferably 0.80 or less, and 0.75 or less. , or 0.70 or less.
- the lower limit of the ratio (W min /W max ) may be, for example, 0.01 or more. More preferably, it may be 0.20 or more, 0.30 or more, or 0.40 or more.
- composition of a resin film capable of realizing the above properties will be described below, taking as a main example a resin film having a structure in which the first mesh and the second mesh that coexist in the same layer are physically entangled with each other through the mesh.
- the resin film disclosed by this specification is not limited to those having such a composition and structure.
- the first mesh is preferably a cured product of the first material.
- a first material comprising polymer (a1) can be crosslinked to cure the first material to form the first network.
- the type of polymer (a1) is not particularly limited, and a polymer suitable for realizing a flexible and tough resin film can be appropriately selected from among polymers that can be used as constituent materials of the pressure-sensitive adhesive sheet.
- materials that can be options for the polymer (a1) include acrylic polymers, rubber polymers, polyester polymers, urethane polymers, polyether polymers, silicone polymers, polyolefins, polyvinyl chloride, etc. It is not limited to these.
- Preferable examples of the polymer (a1) include acrylic polymers and polyester polymers.
- the weight average molecular weight (Mw) of the polymer (a1) may be, for example, 1 ⁇ 10 4 to 500 ⁇ 10 4 , preferably 2 ⁇ 10 4 to 300 ⁇ 10 4 . It is preferable that the Mw of the polymer (a1) is not too small from the viewpoint of suppressing premature breakage of the first mesh during stretching of the resin film. When the Mw of the polymer (a1) is not too large, it becomes easy to form a double network structure in which the first network and the second network are appropriately entangled.
- the weight average molecular weight (Mw) and number average molecular weight (Mn) of the polymer (a1) refer to standard polystyrene equivalent values obtained by gel permeation chromatography (GPC) unless otherwise specified.
- model name "HLC-8320GPC” (column: TSKgelGMH-H(S), manufactured by Tosoh Corporation) can be used. If a manufacturer or the like provides a nominal value, that value may be adopted.
- the polymer (a1) preferably has a reactive functional group (f1).
- reactive functional groups (f1) include carboxy group, acid anhydride group, hydroxyl group, sulfonic acid group, phosphoric acid group, amino group, amide group, epoxy group, cyano group, isocyanate group, alkoxysilyl group, ethylene polyunsaturated groups (eg, acryloyl group, methacryloyl group, vinyl group, allyl group, etc.), benzophenone structures, and the like, but are not limited thereto.
- the reactive functional group (f1) may be on the side chain of the polymer (a1), it may be on the terminal, or it may be on both positions.
- polymer (a1) is an acrylic polymer.
- the term "acrylic polymer” refers to a polymer derived from a monomer raw material containing more than 50% by weight (preferably more than 70% by weight, for example, more than 90% by weight) of an acrylic monomer.
- the acrylic monomer refers to a monomer having at least one (meth)acryloyl group in one molecule.
- (meth)acryloyl is meant to comprehensively refer to acryloyl and methacryloyl.
- “(meth)acrylate” is a generic term for acrylate and methacrylate
- “(meth)acrylic” is generic for acrylic and methacrylic.
- the acrylic polymer as the polymer (a1) is preferably a polymer of monomer raw materials containing an alkyl (meth)acrylate as a main monomer and further containing a sub-monomer copolymerizable with the main monomer.
- the term "main monomer” as used herein refers to a component that is contained in an amount exceeding 50% by weight in the raw material for the monomer.
- a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms at the ester end can be preferably used.
- (meth)acrylic acid alkyl ester having an alkyl group having X or more and Y or less carbon atoms at the ester end may be referred to as "(meth)acrylic acid CXY alkyl ester".
- (meth)acrylic acid C 1-20 alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, ( meth) n-butyl acrylate, isobutyl (meth) acrylate, s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, isopentyl (meth) acrylate, (meth) hexyl acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, (meth) ) Decyl acrylate, is
- the ratio of (meth)acrylic acid C 1-20 alkyl ester among the monomer raw materials used to prepare the acrylic polymer is suitably more than 40% by weight because it is easy to balance the properties. For example, it may be 45% by weight or more, 50% by weight or more, 55% by weight or more, or 60% by weight or more.
- the ratio of the (meth)acrylic acid C 1-20 alkyl ester in the monomer raw material may be 100% by weight, but since it is easy to balance the properties, it is usually appropriate that it is 98% by weight or less. For example, it may be 95% by weight or less, or 90% by weight or less.
- the proportion of the C 1-20 (meth)acrylic acid alkyl ester in the monomer raw material may be, for example, 85% by weight or less, and 80% by weight or less, from the viewpoint of improving the cohesiveness of the pressure-sensitive adhesive layer. 75% by weight or less, 70% by weight or less, 65% by weight or less, or 60% by weight or less.
- the resin film disclosed herein is assumed to be used as an adhesive layer, it is preferable to use at least a (meth)acrylic acid C 4-20 alkyl ester as the alkyl (meth)acrylate. , more preferably at least (meth)acrylic acid C 4-18 alkyl esters.
- Particularly preferred (meth)acrylic acid C 4-18 alkyl esters include n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA).
- (meth)acrylic acid C 4-20 alkyl esters that can be preferably used include isononyl acrylate, n-butyl methacrylate (BMA), 2-ethylhexyl methacrylate (2EHMA), isostearyl acrylate (iSTA) and the like. These (meth)acrylic acid C 4-20 alkyl esters can be used singly or in combination of two or more.
- the monomer raw material preferably contains, for example, one or both of BA and 2EHA. In some embodiments, the monomer raw material preferably contains at least BA.
- Examples of a monomer raw material containing at least BA include a monomer raw material having a composition containing BA and not containing 2EHA, or a monomer raw material containing BA and 2EHA, wherein the content of 2EHA is less than the content of BA (for example, the content of 2EHA is less than BA or less than 0.5 times or less than 0.3 times the content of ).
- the monomer raw material preferably contains 40% by weight or more of (meth)acrylic acid C 4-18 alkyl ester from the viewpoint of easily balancing adhesive properties.
- the proportion of the (meth)acrylic acid C 4-18 alkyl ester in the monomer raw material may be, for example, 50% by weight or more, 60% by weight or more, or 65% by weight or more.
- the ratio of the (meth)acrylic acid C4-18 alkyl ester in the monomer raw material is usually 99.5% by weight or less. Yes, it may be 98% by weight or less, or 96% by weight or less.
- the monomer raw materials used for the preparation of the acrylic polymer as the polymer (a1) are, together with the (meth)acrylic acid alkyl ester, optionally other monomers copolymerizable with the (meth)acrylic acid alkyl ester (copolymerization (monomer) may be included.
- a monomer having a polar group e.g., carboxyl group, hydroxyl group, nitrogen atom-containing ring, etc.
- a monomer containing a benzophenone structure e.g., a monomer containing a benzophenone structure
- a homopolymer having a relatively high glass transition temperature e.g., 10°C or higher
- a monomer having a polar group can be useful for introducing a cross-linking point (reactive functional group (f1)) into the acrylic polymer and increasing the cohesion of the resin film.
- the copolymerizable monomers may be used singly or in combination of two or more.
- copolymerizable monomers include the following.
- Carboxy group-containing monomers for example acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid and the like.
- Acid anhydride group-containing monomers for example maleic anhydride, itaconic anhydride.
- Hydroxyl group-containing monomers for example, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, (meth)acryl hydroxyalkyl (meth)acrylates such as 10-hydroxydecyl acid, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate; Monomers containing sulfonic or phosphoric acid groups: for example, styrenesulfonic acid, allylsulfonic acid, sodium vinylsulfonate, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfo propyl (meth)acrylate, (meth)acryloyloxynaphthalenesulfonic acid, 2-hydroxyethyl acryloyl phosphate
- Monomers having an epoxy group such as glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, allyl glycidyl ether, and the like.
- Cyano group-containing monomers for example acrylonitrile, methacrylonitrile and the like.
- Isocyanate group-containing monomers for example, 2-isocyanatoethyl (meth)acrylate, (meth)acryloyl isocyanate, m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate and the like.
- Amido group-containing monomers for example, (meth)acrylamide; N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N-dipropyl(meth)acrylamide, N,N-diisopropyl(meth) N,N-dialkyl(meth)acrylamides such as acrylamide, N,N-di(n-butyl)(meth)acrylamide, N,N-di(t-butyl)(meth)acrylamide; N-ethyl(meth)acrylamide , N-isopropyl (meth)acrylamide, N-butyl (meth)acrylamide, N-alkyl (meth)acrylamide such as Nn-butyl (meth)acrylamide; N-vinylcarboxylic acid amides such as N-vinylacetamide; In addition, N,N-dimethylaminopropyl (meth)acrylamide and the like.
- Amino group-containing monomers for example aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, t-butylaminoethyl (meth)acrylate.
- Monomers having a nitrogen atom-containing ring for example, N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperazine, N-vinylpyrazine, N- Vinylpyrrole, N-vinylimidazole, N-vinyloxazole, N-(meth)acryloyl-2-pyrrolidone, N-(meth)acryloylpiperidine, N-(meth)acryloylpyrrolidine, N-(meth)acryloylmorpholine, N- vinylmorpholine, N-vinyl-3-morpholinone, N-
- Monomers having a succinimide skeleton for example, N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, N-(meth)acryloyl-8-oxyhexamethylenesuccinimide and the like.
- Maleimides For example, N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, N-phenylmaleimide and the like.
- Itaconimides for example, N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexylitaconimide, N-lauryl itaconimide and the like.
- Aminoalkyl (meth)acrylates for example, aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, t (meth)acrylate - butylaminoethyl.
- Alkoxy group-containing monomers for example, 2-methoxyethyl (meth)acrylate, 3-methoxypropyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, propoxyethyl (meth)acrylate, (meth)acrylic acid Alkoxyalkyl (meth)acrylates (alkoxyalkyl (meth)acrylates) such as butoxyethyl and ethoxypropyl (meth)acrylate; methoxyethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, (meth)acrylate alkoxyalkylene glycol (meth)acrylates (for example, alkoxypolyalkylene glycol (meth)acrylates) such as methoxypolypropylene glycol acrylate; Alkoxysilyl group-containing monomers: such as 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropyltrieth
- Vinyl ethers For example, vinyl alkyl ethers such as methyl vinyl ether and ethyl vinyl ether.
- Aromatic vinyl compounds for example, styrene, ⁇ -methylstyrene, vinyltoluene and the like.
- Olefins For example, ethylene, butadiene, isoprene, isobutylene and the like.
- (Meth)acrylic acid esters having an alicyclic hydrocarbon group for example, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, adamantyl (meth)acrylate, etc.
- (Meth)acrylic acid esters having an aromatic hydrocarbon group For example, aromatic hydrocarbon group-containing (meth)acrylates such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate and benzyl (meth)acrylate.
- heterocycle-containing (meth)acrylates such as tetrahydrofurfuryl (meth)acrylate, halogen atom-containing (meth)acrylates such as vinyl chloride and fluorine atom-containing (meth)acrylates, silicon atom-containing such as silicone (meth)acrylates (meth)acrylates, (meth)acrylic acid esters obtained from terpene compound derivative alcohols, and the like.
- Monomers having a benzophenone structure (meth)acryloyloxybenzophenones such as 4-(meth)acryloyloxybenzophenone, 4-(meth)acryloyloxy-4′-methoxybenzophenone, 4-acryloyloxy-4′-bromobenzophenone, etc.
- the amount used is not particularly limited, but it is usually appropriate to use 0.01% by weight or more of the total monomer raw material. From the viewpoint of exhibiting the effect of using the copolymerizable monomer more effectively, the amount of the copolymerizable monomer used may be 0.1% by weight or more, or 0.5% by weight or more, based on the total monomer raw material. From the viewpoint of facilitating the balance of adhesive properties, the amount of the copolymerizable monomer to be used is generally 50% by weight or less, preferably 40% by weight or less, of the total amount of monomer raw materials.
- the amount of the monomer used is suitably 0.01 wt% or more, preferably 0.1 wt% or more, and 0.5 wt% 1% by weight or more, 3% by weight or more, or 4% by weight or more. It may be 20% by weight or less, 15% by weight or less, 10% by weight or less, or 8% by weight or less.
- the first network constituting the resin film uses an acrylic polymer prepared from a monomer raw material containing a carboxy group-containing monomer as the polymer (a1), and the carboxy group possessed by the acrylic polymer is reacted. It may be formed by cross-linking the polymer (a1) using the functional group (f1). From the viewpoint of facilitating control of the crosslinked structure and the degree of crosslinking, the monomer raw material in this embodiment does not contain a hydroxyl group-containing monomer, or the content of the hydroxyl group-containing monomer is carboxyl.
- the content of the carboxy group-containing monomer in the monomer raw material for preparing the polymer (a1) is, for example, 0.5% by weight or more of the monomer raw material. It is preferably 1% by weight or more, more preferably 2% by weight or more, may be 3% by weight or more, or may be 4% by weight or more. In some embodiments, the content of the carboxy group-containing monomer is advantageously 15% by weight or less, preferably 10% by weight or less, from the viewpoint of the flexibility and low-temperature resistance of the resin film. , is more preferably 8% by weight or less, may be 7% by weight or less, or may be 6% by weight or less.
- the acrylic polymer as the polymer (a1) may have a photocrosslinkable functional group as the reactive functional group (f1).
- photocrosslinkable functional groups include ethylenically unsaturated groups such as (meth)acryloyl groups, vinyl groups, and allyl groups; benzophenone structures; and the like.
- An acrylic polymer having a benzophenone structure as the reactive functional group (f1) can be obtained, for example, by using a monomer having a benzophenone structure as the copolymerizable monomer.
- An acrylic polymer having an ethylenically unsaturated group as a reactive functional group (f1) can be obtained, for example, by polymerizing a monomer raw material and then modifying the resulting polymer with a compound having an ethylenically unsaturated group. be done.
- a copolymer having a functional group A is used as the copolymerizable monomer, and the functional group A of the obtained polymer is reacted with a compound having an ethylenically unsaturated group and a functional group B.
- the copolymerizable monomer having the functional group A for example, hydroxyl group-containing monomers, carboxy group-containing monomers, epoxy group-containing monomers and isocyanate group-containing monomers are preferable, and hydroxyl group-containing monomers are particularly preferable.
- a hydroxyl group-containing monomer as a copolymerizable monomer, a polymer having a hydroxyl group can be obtained.
- the method for polymerizing the monomer raw material is not particularly limited, and conventionally known various polymerization methods can be appropriately employed.
- thermal polymerization such as solution polymerization, emulsion polymerization, bulk polymerization (typically performed in the presence of a thermal polymerization initiator); photopolymerization performed by irradiating light such as ultraviolet rays (typically, polymerization in the presence of a photopolymerization initiator); radiation polymerization by irradiating radiation such as ⁇ -rays and ⁇ -rays;
- Two or more polymerization methods may be combined (eg, stepwise).
- Solvents (polymerization solvents) for solution polymerization include, for example, aromatic compounds such as toluene (typically aromatic hydrocarbons); esters such as ethyl acetate and butyl acetate; alicyclic hydrocarbons; halogenated alkanes such as 1,2-dichloroethane; lower alcohols such as isopropyl alcohol (eg, monohydric alcohols having 1 to 4 carbon atoms); ethers such as tert-butyl methyl ether ketones such as methyl ethyl ketone; and the like, or a mixed solvent of two or more thereof.
- aromatic compounds such as toluene (typically aromatic hydrocarbons); esters such as ethyl acetate and butyl acetate; alicyclic hydrocarbons; halogenated alkanes such as 1,2-dichloroethane; lower alcohols such as isopropyl alcohol (eg, monohydric alcohols having 1 to 4 carbon
- thermal polymerization initiator or photopolymerization initiator can be used depending on the polymerization method, polymerization mode, etc.
- Such polymerization initiators can be used singly or in combination of two or more.
- thermal polymerization initiator is not particularly limited, for example, an azo polymerization initiator, a peroxide initiator, a redox initiator obtained by combining a peroxide and a reducing agent, and a substituted ethane initiator. etc. can be used.
- 2,2′-azobisisobutyronitrile AIBN
- 2,2′-azobis(2-methylpropionamidine) disulfate 2,2′-azobis(2-amidinopropane ) dihydrochloride
- 2,2′-azobis[2-(5-methyl-2-imidazolin-2-yl)propane]dihydrochloride 2,2′-azobis(N,N′-dimethyleneisobutyramidine)
- 2 2′-azobis[N-(2-carboxyethyl)-2-methylpropionamidine]hydrate
- azo initiators such as hydrate
- persulfates such as potassium persulfate and ammonium persulfate
- benzoyl peroxide t-butyl Peroxide-based initiators such as hydroperoxides, hydrogen peroxide; substituted ethane-based initiators such as phenyl-substituted ethane; e.g.
- Redox initiators such as; Thermal polymerization can be preferably carried out at a temperature of, for example, about 20 to 100° C. (typically 40 to 80° C.), but is not limited to this.
- the photopolymerization initiator is not particularly limited, for example, ketal photopolymerization initiator, acetophenone photopolymerization initiator, benzoin ether photopolymerization initiator, acylphosphine oxide photopolymerization initiator, ⁇ - Ketol photoinitiators, aromatic sulfonyl chloride photoinitiators, photoactive oxime photoinitiators, benzoin photoinitiators, benzyl photoinitiators, benzophenone photoinitiators, thioxanthone photoinitiators
- a polymerization initiator or the like can be used.
- the amount of the polymerization initiator to be used is not particularly limited and can be a normal amount depending on the polymerization method, polymerization mode, etc.
- about 0.001 to 5 parts by weight (typically about 0.01 to 2 parts by weight, for example about 0.01 to 1 part by weight) of a polymerization initiator is used with respect to 100 parts by weight of the monomer to be polymerized. can be done.
- chain transfer agents which can also be understood as molecular weight modifiers or polymerization degree modifiers
- Mercaptans such as n-dodecylmercaptan, t-dodecylmercaptan, thioglycolic acid and ⁇ -thioglycerol can be used as the chain transfer agent.
- a chain transfer agent containing no sulfur atom non-sulfur chain transfer agent may be used.
- non-sulfur chain transfer agents include anilines such as N,N-dimethylaniline and N,N-diethylaniline; terpenoids such as ⁇ -pinene and terpinolene; ⁇ -methylstyrene and ⁇ -methylstyrene dimer.
- styrenes such as dibenzylideneacetone, cinnamyl alcohol, compounds having a benzylidenyl group such as cinnamylaldehyde; hydroquinones such as hydroquinone and naphthohydroquinone; quinones such as benzoquinone and naphthoquinone; 2,3-dimethyl-2-butene , olefins such as 1,5-cyclooctadiene; alcohols such as phenol, benzyl alcohol and allyl alcohol; benzyl hydrogens such as diphenylbenzene and triphenylbenzene;
- a chain transfer agent can be used individually by 1 type or in combination of 2 or more types.
- the amount used is, for example, 0.005 parts by weight or more, 0.01 parts by weight or more, 0.05 parts by weight or more, or 0.07 parts by weight or more with respect to 100 parts by weight of the monomer raw material. and can be, for example, 0.5 parts by weight or less, 0.2 parts by weight or less, 0.1 parts by weight or less, or less than 0.1 parts by weight. Note that the technology disclosed herein can be preferably practiced even in a mode that does not use a chain transfer agent.
- the Mw of the acrylic polymer as the polymer (a1) may be, for example, about more than 20 ⁇ 10 4 , more than 40 ⁇ 10 4 , or more than 60 ⁇ 10 4 .
- Mw of the acrylic polymer is advantageously greater than 70 ⁇ 10 4 . and is preferably 80 ⁇ 10 4 or more (for example, more than 80 ⁇ 10 4 ), may be 90 ⁇ 10 4 or more, may be 100 ⁇ 10 4 or more, may be 120 ⁇ 10 4 or more, or may be 140 ⁇ 10 4 It can be more than that.
- the Mw of the acrylic polymer may be, for example, 500 ⁇ 10 4 or less, and from the viewpoint of facilitating the formation of a structure in which the first network and the second network are moderately entangled, it should be 300 ⁇ 10 4 or less. is preferably 200 ⁇ 10 4 or less, 180 ⁇ 10 4 or less, 150 ⁇ 10 4 or less, or 120 ⁇ 10 4 or less.
- the glass transition temperature (Tg) of the acrylic polymer as the polymer (a1) is not particularly limited.
- the Tg of the acrylic polymer is suitably 40° C. or less, preferably 30° C. or less, from the viewpoint of easily obtaining flexibility suitable for the pressure-sensitive adhesive sheet or its component. , more preferably 25° C. or lower, may be 20° C. or lower, or may be 15° C. or lower.
- the Tg of the acrylic polymer is preferably 10° C. or less from the viewpoint of the workability of attaching to the adherend.
- the Tg of the acrylic polymer is advantageously less than 0°C, preferably less than -10°C, more preferably less than -20°C.
- the Tg of the acrylic polymer may be less than -25°C, less than -30°C, less than -40°C, or less than -45°C.
- the Tg of the acrylic polymer is suitably ⁇ 80° C. or higher, preferably ⁇ 70° C. or higher, and even ⁇ 60° C. or higher. It may be -55°C or higher.
- the Tg of the acrylic polymer may be ⁇ 40° C. or higher, ⁇ 20° C. or higher, ⁇ 10° C.
- an acrylic polymer with a relatively high Tg (for example, Tg of ⁇ 20° C. or higher) can be preferably used from the viewpoint of handleability, processability, and the like.
- the Tg of a polymer refers to the Tg determined by Fox's formula based on the composition of the monomer raw materials used for the preparation of the polymer, unless otherwise specified.
- Tg is the glass transition temperature of the copolymer (unit: K)
- Wi is the weight fraction of the monomer i in the copolymer (weight-based copolymerization ratio)
- Tgi is the homopolymer of the monomer i. represents the glass transition temperature (unit: K).
- the glass transition temperature of the homopolymer used for calculating the Tg the value described in the known materials shall be used.
- the monomers listed below the following values are used as the glass transition temperatures of the homopolymers of the monomers.
- the stress integral value of the resin film may be, for example, 500 MPa or less, 300 MPa or less, 100 MPa or less, or 80 MPa or less.
- the integrated stress value is preferably 70 MPa or less from the viewpoint of workability in attaching to an adherend. and is preferably 60 MPa or less, may be 50 MPa or less, may be 40 MPa or less, or 30 MPa or less.
- polymer (a1) is a polyester-based polymer.
- Polyester-based polymers are typically composed of polyvalent carboxylic acids such as dicarboxylic acids and derivatives thereof (hereinafter also referred to as “polyvalent carboxylic acid monomers”), and polyhydric alcohols such as diols and derivatives thereof (hereinafter referred to as “polyhydric alcohol monomers”). ”) is a polymer having a condensed structure.
- polyvalent carboxylic acid monomers include, but are not limited to, isophthalic acid, terephthalic acid, orthophthalic acid, benzylmalonic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 4,4' - aromatic dicarboxylic acids such as dicarboxydiphenyl ether and naphthalenedicarboxylic acid; 1,2-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 4- Alicyclic dicarboxylic acids such as methyl-1,2-cyclohexanedicarboxylic acid, norbornanedicarboxylic acid, adamantanedicarboxylic acid; malonic acid, succinic acid, glutaric acid, dimethylglutaric acid, adipic acid,
- the polyvalent carboxylic acid derivatives include derivatives such as carboxylates, carboxylic acid anhydrides, carboxylic acid halides, and carboxylic acid esters.
- Polyvalent carboxylic acid monomers can be used singly or in combination of two or more. From the viewpoint of imparting an appropriate cohesive force to the resin film, it preferably contains an aromatic dicarboxylic acid, and particularly preferably contains either one or both of terephthalic acid and isophthalic acid.
- polyhydric alcohol monomers include, but are not limited to, ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propylene glycol, dipropylene glycol, 1,3-propanediol, 2-methyl-1,3-propane.
- diols 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 2-ethyl-2-butyl-1,3-propanediol, 2-ethyl-2-isobutyl-1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 2,2,4-trimethyl-1,5 -pentanediol, 1,6-hexanediol, 2-methyl-1,3-hexanediol, 2,2,4-trimethyl-1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol , 2-methyloctanediol, 1,10-decanediol; 1,2-cyclohe
- a polyhydric alcohol monomer can be used individually by 1 type or in combination of 2 or more types. It preferably contains an aliphatic diol and/or an alicyclic diol, and more preferably contains one or more of polytetramethylene glycol, neopentyl glycol and cyclohexanedimethanol.
- the method for obtaining the polyester-based polymer is not particularly limited, and polymerization methods known as methods for synthesizing polyester-based polymers can be appropriately employed.
- the monomer raw material used for the synthesis of the polyester polymer is blended so that the amount of the polyhydric alcohol monomer is 1 equivalent or more (for example, 1 to 2 equivalents) per 1 equivalent of the polyvalent carboxylic acid monomer. is appropriate from the viewpoint of In a preferred embodiment, the blending amount of the polyhydric alcohol monomer is more than 1 equivalent and not more than 1.8 equivalents (for example, 1.2 to 1.7 equivalents) with respect to 1 equivalent of the polyvalent carboxylic acid monomer.
- the polyester-based polymer used as the polymer (a1) can be obtained by polycondensation of a polyhydric carboxylic acid monomer and a polyhydric alcohol monomer, like general polyesters. More specifically, the reaction between the carboxyl group of the polyvalent carboxylic acid monomer and the hydroxyl group of the polyhydric alcohol monomer typically proceeds while removing water (generated water) and the like generated by the above reaction from the reaction system.
- a polyester-based polymer can be synthesized by As a method for removing the generated water from the reaction system, an inert gas is blown into the reaction system and the generated water is taken out of the reaction system together with the inert gas, and the generated water is distilled off from the reaction system under reduced pressure.
- a method (depressurization method) or the like can be used. The depressurization method can be preferably employed because it is suitable for shortening the synthesis time and improving productivity.
- the reaction temperature when performing the above reaction (including esterification and polycondensation) and the degree of pressure reduction (pressure in the reaction system) when adopting the pressure reduction method are the desired characteristics (e.g. molecular weight) polyester system It can be appropriately set so that the polymer can be efficiently obtained.
- the above reaction temperature is usually suitable to be 180°C to 260°C, for example, 200°C to 220°C. By setting the reaction temperature within the above range, a favorable reaction rate is obtained, productivity is improved, and deterioration of the produced polyester polymer can be easily prevented or suppressed.
- the degree of pressure reduction is usually 10 kPa or less (typically 10 kPa to 0.1 kPa), for example, 4 kPa to 0.1 kPa.
- 10 kPa or less typically 10 kPa to 0.1 kPa
- 4 kPa to 0.1 kPa By setting the pressure in the reaction system within the above range, the water produced by the reaction can be efficiently distilled out of the system, and a favorable reaction rate can be easily maintained.
- the reaction temperature is relatively high, by setting the pressure in the reaction system to the above lower limit or more, it is easy to prevent the polyhydric carboxylic acid monomer and the polyhydric alcohol monomer, which are raw materials, from being distilled out of the system. From the viewpoint of stably maintaining the pressure in the reaction system, it is usually appropriate to set the pressure in the reaction system to 0.1 kPa or more.
- a suitable amount of a known or commonly used catalyst can be used for esterification and condensation, as in general polyester synthesis.
- catalysts include various metal compounds such as titanium, germanium, antimony, tin, and zinc; strong acids such as p-toluenesulfonic acid and sulfuric acid; and the like.
- titanium-based metal compounds titanium compounds
- titanium compounds include titanium tetraalkoxides such as titanium tetrabutoxide, titanium tetraisopropoxide, titanium tetrapropoxide and titanium tetraethoxide; Alkyl titanates such as titanates; titanium acetate and the like.
- a solvent may or may not be used in the above process of synthesizing a polyester-based polymer by reacting a polyhydric carboxylic acid monomer and a polyhydric alcohol monomer.
- the above synthesis can be carried out substantially without using an organic solvent (for example, this means excluding a mode in which an organic solvent is intentionally used as a reaction solvent during the above reaction). Synthesizing a polyester polymer without substantially using an organic solvent in this way, and preparing a polyester pressure-sensitive adhesive using such a polyester polymer, avoid the use of organic solvents in the manufacturing process. It is preferable because it satisfies the demand.
- the hydroxyl value of the polyester-based polymer used as the polymer (a1) is not particularly limited, and may be 0 mgKOH/g, more than 0 mgKOH/g, or 1 mgKOH/g or more. In a design in which a polyester-based polymer having a hydroxyl group is used and the hydroxyl group is used as a reactive functional group (f1) to crosslink the polymer (a1) to form the first network, the hydroxyl group is greater than 1 mgKOH/g.
- a polyester-based polymer can be preferably employed. Crosslinking of a polyester-based polymer having hydroxyl groups can be performed using a compound having two or more functional groups capable of reacting with hydroxyl groups (for example, an isocyanate-based cross-linking agent).
- the hydroxyl value of the polyester-based polymer is, for example, 2 mgKOH/g or more. suitable, preferably 3 mg KOH/g or more, may be 4 mg KOH/g or more, or may be 6 mg KOH/g or more.
- the hydroxyl value of the polyester polymer is, for example, suitably less than 30 mgKOH/g, preferably less than 20 mgKOH/g, less than 15 mgKOH/g, and less than 12 mgKOH/g. , less than 10 mg KOH/g.
- the acid value of the polyester-based polymer used as the polymer (a1) is not particularly limited. In a design in which a polyester-based polymer having a carboxy group is used and the carboxy group is used as a reactive functional group (f1) to crosslink the polymer (a1) to form the first network, the acid value is greater than 1 mgKOH/g.
- a polyester-based polymer can be preferably employed. Crosslinking of a polyester-based polymer having a carboxy group can be performed using, for example, a compound having two or more functional groups capable of reacting with a carboxy group (for example, an epoxy-based cross-linking agent).
- the acid value of the polyester-based polymer is, for example, 0.1 mgKOH/g or more. 0.5 mgKOH/g or more, preferably 1.0 mgKOH/g or more, or 2.0 mgKOH/g or more.
- the acid value of the polyester polymer is, for example, suitably less than 30 mgKOH/g, preferably less than 20 mgKOH/g, less than 15 mgKOH/g, and less than 12 mgKOH/g. , less than 10 mg KOH/g.
- the acid value of the polyester-based polymer is the hydroxyl value of the polymer. It is suitably lower, for example, preferably 1/2 or less of the hydroxyl value, more preferably 1/3 or less.
- the hydroxyl value of the polyester polymer is For example, it is preferably 1/2 or less, more preferably 1/3 or less, of the acid value.
- the hydroxyl value and acid value of the polyester polymer can be measured according to JIS K0070:1992. If a manufacturer or the like provides a nominal value, that value may be adopted.
- the number average molecular weight (Mn) of the polyester-based polymer as the polymer (a1) is not particularly limited, and may be, for example, about 5000 or more. From the viewpoint of facilitating the realization of a supple and tough resin film (for example, a resin film having a stress integral value of greater than 10 MPa), in some embodiments, Mn of the polyester-based polymer is preferably about 7000 or more, more preferably about It may be 9,000 or more, for example, approximately 12,000 or more, approximately 15,000 or more, approximately 18,000 or more, or approximately 21,000 or more (for example, approximately 24,000 or more).
- the Mn of the polyester-based polymer is usually suitably about 10 ⁇ 10 4 or less, and from the viewpoint of facilitating the formation of a structure in which the first network and the second network are moderately entangled, preferably about 7 ⁇ It is 10 4 or less, more preferably about 5 ⁇ 10 4 or less, for example, about 4 ⁇ 10 4 or less, or about 3 ⁇ 10 4 or less.
- the Tg of the polyester-based polymer as the polymer (a1) is not particularly limited, and may be, for example, approximately 90°C or less. From the viewpoint of easily obtaining flexibility suitable for the pressure-sensitive adhesive sheet or its component, in some embodiments, the Tg of the polyester-based polymer is suitably about 80° C. or less, and preferably 60° C. or less. Preferably, it may be 50° C. or lower, or 40° C. or lower. In a resin film used as an adhesive layer (in particular, an adhesive layer constituting an adhesive surface), the Tg of the polyester-based polymer is about less than 15° C. from the viewpoint of the workability of attaching to the adherend.
- the Tg of the polyester-based polymer is suitably about ⁇ 70° C. or higher, preferably about ⁇ 60° C. or higher, more preferably about ⁇ 50° C. °C or higher, more preferably about -40°C or higher (eg -30°C or higher).
- the Tg of the polyester-based polymer can be measured using a commercially available differential scanning calorimeter (for example, manufactured by TA Instruments, model name "DSC Q20"). As the measurement conditions, a shear strain with a frequency of 1 Hz, a temperature range of -90° C. to 100° C., and a heating rate of 10° C./min are adopted. If a manufacturer or the like provides a nominal value, that value may be adopted.
- cross-linking agent A cross-linking agent may be used as necessary for the cross-linking for forming the first network from the polymer (a1) (eg acrylic polymer, polyester-based polymer).
- the cross-linking agent used for cross-linking the polymer (a1) is typically in the form after the cross-linking reaction (for example, in the form incorporated in the first network as a cross-linking residue). included in the sheet.
- cross-linking agents examples include epoxy cross-linking agents, isocyanate cross-linking agents, oxazoline cross-linking agents, aziridine cross-linking agents, carbodiimide cross-linking agents, melamine cross-linking agents, urea cross-linking agents, Examples include metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, metal salt-based cross-linking agents, hydrazine-based cross-linking agents, and amine-based cross-linking agents. These can be used individually by 1 type or in combination of 2 or more types.
- epoxy-based cross-linking agent a polyfunctional epoxy compound having two or more epoxy groups in one molecule can be used without particular limitation.
- An epoxy-based cross-linking agent having 3 to 5 epoxy groups in one molecule is preferred.
- Specific examples of epoxy-based cross-linking agents include N,N,N',N'-tetraglycidyl-m-xylenediamine, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, and 1,6-hexane.
- Commercially available epoxy-based cross-linking agents include products manufactured by Mitsubishi Gas Chemical Co., Ltd.
- a bifunctional or higher polyfunctional isocyanate compound can be used.
- aromatic isocyanates such as tolylene diisocyanate, xylene diisocyanate, polymethylene polyphenyl diisocyanate, tris(p-isocyanatophenyl) thiophosphate, diphenylmethane diisocyanate; alicyclic isocyanates such as isophorone diisocyanate; aliphatic isocyanates such as hexamethylene diisocyanate isocyanate; and the like.
- oxazoline-based cross-linking agent those having one or more oxazoline groups in one molecule can be used without particular limitation.
- aziridine-based cross-linking agents include trimethylolpropane tris [3-(1-aziridinyl) propionate], trimethylol propane tris [3-(1-(2-methyl) aziridinyl propionate)], and the like. be done.
- a low-molecular-weight compound or a high-molecular-weight compound having two or more carbodiimide groups can be used as the carbodiimide-based cross-linking agent.
- the amount of the cross-linking agent used is not particularly limited, and can be appropriately set so as to obtain a flexible and tough resin sheet.
- the amount of the cross-linking agent used relative to 100 parts by weight of the polymer (a1) can be selected, for example, from the range of 0.001 to 10 parts by weight (eg, 0.01 to 5 parts by weight).
- the amount of the cross-linking agent used increases, the first network becomes more dense, and the breaking stress of the resin film tends to increase.
- the amount of the cross-linking agent used decreases, the first network becomes more sparse, and the elongation at break of the resin film tends to increase.
- the amount of the epoxy-based cross-linking agent used relative to 100 parts by weight of the polymer (a1) may be, for example, 0.001 parts by weight or more, and may be 0.005 parts by weight or more. It may be at least 0.01 part by weight.
- the amount of the epoxy-based cross-linking agent used may be, for example, 1 part by weight or less, 0.5 parts by weight or less, 0.1 parts by weight or less, or 0.05 parts by weight or less.
- the amount of the isocyanate-based cross-linking agent used relative to 100 parts by weight of the polymer (a1) may be, for example, 1 part by weight or less, and 0.5 It may be not more than 0.1 part by weight, or not more than 0.05 part by weight.
- the resin film disclosed here can also be implemented in a mode that does not use a cross-linking agent for forming the first network.
- the polymer (a1) is crosslinked by a radical reaction, an addition reaction, a condensation reaction, or the like using the reactive functional group (f1) (which may be a plurality of different functional groups) of the polymer (a1) to form a first A mesh can be formed.
- a polymer (a1) having an ethylenically unsaturated group as the reactive functional group (f1) can be preferably employed.
- the second mesh is preferably a cured product of the second material.
- a second material containing a polyfunctional monomer (b1) and reacting the polyfunctional monomer (b1) the second material can be cured to form the second network.
- a compound having two or more reactive functional groups (f2) in one molecule can be used as the polyfunctional monomer (b1).
- the reactive functional group (f2) may be a different type of functional group from the reactive functional group (f1) that may be contained in the polymer (a1), or may be the same type of functional group.
- a polyfunctional monomer can be used individually by 1 type or in combination of 2 or more types.
- the polyfunctional monomer (b1) can be a compound having two or more ethylenically unsaturated groups as reactive functional groups (f2) in one molecule.
- Examples of such polyfunctional monomers (b1) include polyfunctional (meth)acrylates; polyfunctional vinyl compounds such as divinylbenzene; allyl (meth)acrylate, vinyl (meth)acrylate, butyldiol (meth)acrylate, hexyl compounds having a vinyl group and a (meth)acryloyl group in one molecule, such as diol di(meth)acrylate; and the like.
- polyfunctional (meth)acrylates are preferred.
- the polyfunctional monomer (b1) can be a compound having two or more reactive functional groups (f2) other than ethylenically unsaturated groups in one molecule.
- the reactive functional groups (f2) other than the ethylenically unsaturated groups include isocyanate groups, epoxy groups, alkoxysilyl groups, hydroxyl groups, carboxy groups, amino groups and the like.
- various polyfunctional isocyanate compounds, polyfunctional epoxy compounds, and the like described above can be used as the reactive functional group (f2). Among them, polyfunctional isocyanate compounds are preferred.
- polyfunctional monomer (b1) is a compound having an ethylenically unsaturated group and a reactive functional group other than the ethylenically unsaturated group in one molecule as a reactive functional group (f2). be done.
- the number of ethylenically unsaturated groups contained in one molecule of such a compound and the number of reactive functional groups other than the ethylenically unsaturated groups may each be one, or two or more.
- the reactive functional group (f1) possessed by the polymer (a1) contained in the first material and the reactive functional group (f2) possessed by the polyfunctional monomer (b1) contained in the second material are of the same type. may be of different types. In some embodiments, the reactive functional group (f1) and the reactive functional group (f2) are of different types from the viewpoint of controllability of formation of the first network and/or formation of the second network. can be adopted. Examples of the combination of the reactive functional group (f1) and the reactive functional group (f2) include, for example, the reactive functional group (f1) being a carboxy group and the reactive functional group (f2) being an ethylenically unsaturated group.
- the reactive functional group (f1) is a carboxy group and the reactive functional group (f2) is an isocyanate group; an embodiment in which the reactive functional group (f1) is an ethylenically unsaturated group and a reactive functional group Examples in which the group (f2) is an isocyanate group; Embodiments in which the reactive functional group (f1) is a hydroxyl group and the reactive functional group (f2) is an ethylenically unsaturated group; not.
- the number of reactive functional groups (f2) per molecule of the polyfunctional monomer (b1) is not particularly limited as long as it is 2 or more, and can be about 2 to 20, for example.
- the second network is suppressed from becoming locally overcrowded, and the first network and the second network There is a tendency for the stress distribution function to be effectively expressed by intertwining and coexisting. That is, it becomes easier to obtain a network structure suitable for realizing a flexible and tough resin film.
- the number of reactive functional groups (f2) per molecule of the polyfunctional monomer (b1) is suitably less than 6.0, and less than 4.5. preferably less than 4.0, and may be less than 3.5.
- the number of reactive functional groups (f2) per molecule of the polyfunctional monomer (b1) means, in an aspect in which only one type of compound is used as the polyfunctional monomer (b1), per molecule of the compound It means the number of reactive functional groups (f2) contained, and in an embodiment using two or more compounds having different reactive functional groups (f2) per molecule, it means the average number of functional groups. .
- the average number of functional groups is the number of reactive functional groups (f2) that each compound used as the polyfunctional monomer (b1) has in one molecule, and the weight of the compound in the entire polyfunctional monomer (b1). Calculated as the sum of products with the rate.
- the polyfunctional monomer (b1) has 6 or more reactive functional groups (f2) per molecule. It is preferably substantially free of compounds, and more preferably substantially free of compounds having 4 or more reactive functional groups (f2) per molecule.
- “substantially” refers to at least not to be used intentionally, and a small amount of a compound having a predetermined number or more of reactive functional groups (f2) as an impurity in the raw material is unintentionally mixed. not be prevented from doing so.
- the molecular weight of the polyfunctional monomer (b1) is not particularly limited, and can be selected so that the desired effects are suitably exhibited.
- the polyfunctional monomer (b1) those having a molecular weight in the range of about 100 to 20,000 can be used.
- the molecular weight of the polyfunctional monomer (b1) may be less than 16,000 or less than 10,000.
- the molecular weight of the polyfunctional monomer (b1) is preferably less than 5000, more preferably less than 3000, from the viewpoint of facilitating the formation of the second network that is moderately entangled with the first network. More preferably, it may be less than 1,500, less than 1,200, or less than 900.
- the molecular weight of the polyfunctional monomer (b1) is suitably 200 or more, It is preferably 300 or more, more preferably 400 or more, may be 500 or more, or may be 600 or more.
- the molecular weight of the polyfunctional monomer (b1) means the molecular weight of the compound in an embodiment in which only one compound is used as the polyfunctional monomer (b1), and two or more compounds having different molecular weights shall mean their average molecular weight.
- the average molecular weight is determined as the sum of the product of the molecular weight of each compound used as the polyfunctional monomer (b1) and the weight fraction of the compound in the entire polyfunctional monomer (b1).
- the molecular weight of the compound used as the polyfunctional monomer (b1) is calculated based on the chemical structure for a compound containing a repeating structure with a non-polymerized product or a low degree of polymerization (for example, about 2 to 5 mers).
- molecular weight (formula weight), or measurements based on matrix-assisted laser desorption/ionization time-of-flight mass spectrometry (MALDI-TOF-MS) can be used.
- the compound used as the polyfunctional monomer (b1) is a compound containing a repeating structure with a higher degree of polymerization
- the weight average molecular weight (Mw) based on GPC performed under appropriate conditions can be used.
- the nominal value of the molecular weight is provided by the manufacturer or the like, the nominal value can be adopted. The same applies to the molecular weight of the monofunctional monomer (b2) described later.
- the functional group equivalent of the polyfunctional monomer (b1) is not particularly limited, and can be selected so that the desired effects are suitably exhibited.
- the functional group equivalent of the polyfunctional monomer (b1) is calculated by dividing the molecular weight of the polyfunctional monomer (b1) by the number of reactive functional groups (f1) possessed by the polyfunctional monomer (b1). .
- the molecular weight of the polyfunctional monomer (b1) the values described above are used.
- the functional group equivalent of the polyfunctional monomer (b1) is suitably 100 or more, It is preferably 150 or more, more preferably 200 or more, may be 250 or more, or may be 300 or more.
- the functional group equivalent of the polyfunctional monomer (b1) may be, for example, less than 5000, and from the viewpoint of facilitating the formation of the second network that is moderately entangled with the first network, it is advantageously less than 2500, It is preferably less than 1000, more preferably less than 800, may be less than 600, may be less than 400, may be less than 350, or may be less than 250.
- the functional group equivalent of the polyfunctional monomer (b1) means the functional group equivalent of the compound in an embodiment in which only one type of compound is used as the polyfunctional monomer (b1). In embodiments using two or more different compounds, their average functional group equivalent weights shall be meant.
- polyfunctional (meth)acrylate In some embodiments, a difunctional or higher polyfunctional (meth)acrylate is used as the polyfunctional monomer (b1).
- polyfunctional (meth)acrylates include ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth) Acrylates, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate , trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, epoxy acrylate, polyester
- oxyalkylene units such as polyethylene glycol di(meth)acrylate and polypropylene glycol di(meth)acrylate are used because they are suitable for forming a second network suitable for realizing flexible and tough resin films.
- a polyfunctional (meth)acrylate having a repeating structure can be preferably employed. Among these, di(meth)acrylates having a polyoxyalkylene chain are preferable, and polyalkylene glycol diacrylate is more preferable from the viewpoint of reactivity and the like.
- the polyfunctional (meth)acrylate having a polyoxyalkylene chain one having a weight average molecular weight (Mw) of about 400 to 900 can be preferably used.
- the number of reactive functional groups (f2) ((meth)acryloyl groups) per molecule of the polyfunctional (meth)acrylate is not particularly limited as long as it is 2 or more, and may be, for example, about 2 to 10. From the viewpoint of easily obtaining a network structure suitable for realizing a flexible and tough resin film, in some embodiments, the number of reactive functional groups (f2) per molecule of the polyfunctional (meth)acrylate is 6. It is suitably less than 0, preferably less than 4.5, more preferably less than 4.0, may be less than 3.5, may be less than 3.0, or may be less than 2.5 good.
- the number of reactive functional groups (f2) per molecule of the polyfunctional (meth)acrylate refers to the number of the polyfunctional ( Meth) Means the number of reactive functional groups (f2) contained in one molecule of acrylate, and in an embodiment using two or more polyfunctional (meth)acrylates having different reactive functional groups (f2) per molecule, Product of the number of reactive functional groups (f2) each polyfunctional (meth)acrylate has in one molecule and the weight fraction of the polyfunctional (meth)acrylate in the entire polyfunctional (meth)acrylate used It means the number obtained as the sum.
- the polyfunctional monomer (b1) has 4 or more reactive functional groups (f2) per molecule. It is preferable not to substantially contain a polyfunctional (meth)acrylate, and it is more preferable to substantially not contain a polyfunctional (meth)acrylate having 3 or more reactive functional groups (f2) per molecule. .
- polyfunctional isocyanate compound In some aspects, a difunctional or higher polyfunctional isocyanate compound can be preferably used as the polyfunctional monomer (b1). Specific examples of the polyfunctional isocyanate compound are the same as those exemplified as the isocyanate-based cross-linking agent, so redundant description is omitted.
- the number of reactive functional groups (f2) (isocyanate groups) per molecule of the polyfunctional isocyanate compound is not particularly limited as long as it is 2 or more, and may be about 2 to 10, for example. From the viewpoint of easily obtaining a network structure suitable for realizing a flexible and tough resin film, in some embodiments, the number of reactive functional groups (f2) per molecule of the polyfunctional isocyanate compound is less than 6.0. is preferably less than 4.5, may be less than 4.0, or may be less than 3.5. For the same reason, in some aspects, the number of reactive functional groups (f2) per molecule of the polyfunctional isocyanate compound may be greater than 2.0, may be 2.5 or more, or may be 3.0 or more. good.
- the number of reactive functional groups (f2) per molecule of the polyfunctional isocyanate compound is, in an embodiment using only one type of polyfunctional isocyanate compound as a polyfunctional monomer, per molecule of the polyfunctional isocyanate compound It means the number of reactive functional groups (f2) contained, and in an embodiment using two or more polyfunctional isocyanate compounds having different reactive functional groups (f2) per molecule, each polyfunctional isocyanate compound has one molecule. The number obtained as the sum of the products of the number of reactive functional groups (f2) contained therein and the weight fraction of the polyfunctional isocyanate compound in the entire polyfunctional isocyanate compound used.
- the polyfunctional monomer (b1) has 3 or more reactive functional groups (f2) per molecule. It is preferred that substantially no polyfunctional isocyanate compound is contained.
- the second material may contain a monofunctional monomer (b1) in addition to the polyfunctional monomer (b1) as a monomer used to form the second network.
- the monofunctional monomer (b1) can be used for the purposes of, for example, improving the elongation at break of the resin film, imparting flexibility and low-temperature resistance, and improving adhesion to adherends.
- Monofunctional monomers (b2) can be used singly or in combination of two or more.
- the monofunctional monomer (b2) for example, a compound having one ethylenically unsaturated group per molecule as the reactive functional group (f2) can be used.
- Specific examples include alkyl (meth)acrylates and copolymerizable monomers exemplified as compounds that can be used as monomer raw materials for preparing an acrylic polymer as the polymer (a1).
- a polyfunctional (meth)acrylate as described above as the polyfunctional monomer (b1) a compound having one ethylenically unsaturated group per molecule is used as the monofunctional monomer (b2). be able to.
- the molecular weight of the monofunctional monomer (b2) (when using two or more monofunctional monomers (b2) with different molecular weights, their average molecular weight) is not particularly limited, and may be, for example, about 70 to 3000. . In some aspects, the molecular weight of the monofunctional monomer (b2) is preferably 80 or more, may be 100 or more, or may be 120 or more. In some aspects, the molecular weight of the monofunctional monomer (b2) is preferably 1000 or less, more preferably 700 or less, may be 500 or less, may be 400 or less, or may be 300 or less. .
- the amount of the monofunctional monomer (b2) to be used is not particularly limited, and can be selected so that the desired effects are suitably exhibited.
- the amount of monofunctional monomer (b2) used is, on a weight basis, 70 weight of the total amount of multifunctional monomer (b1) and monofunctional monomer (b2) contained in the second material. %, preferably less than 50% by weight, less than 40% by weight, or even less than 30% by weight.
- the average functional group number ( ⁇ (Ni ⁇ Wi)) of the above-mentioned polyfunctional monomer (b1) include all monomers contained in the second material (polyfunctional monomer (b1), and further It can also be applied to the average functionality A of the monofunctional monomer (b1)).
- the possible values and preferred ranges of the average molecular weight ( ⁇ (Mi ⁇ Wi)) of the polyfunctional monomer (b1) described above can also be applied to the average molecular weight C of all the monomers contained in the second material.
- the possible values and preferred ranges of the average functional group equivalent ( ⁇ ((Mi/Ni) ⁇ Wi) of the above-described multifunctional monomer (b1) are also the average functional group equivalent E of all the monomers contained in the second material.
- the monomer contained in the second material is only one or more polyfunctional monomers (b1), ⁇ ((Mi/Ni) ⁇ Wi) and ⁇ ((M'i/N'i) ⁇ W'i).
- a monofunctional monomer (b1) is used in addition to the polyfunctional monomer (b1) as a component of the second material, the viewpoint of forming a second network suitable for realizing a flexible and tough resin film. Therefore, it is preferable to set the type and usage amount of the monofunctional monomer (b1) so as to satisfy 1 or more, 2 or more, or 3 or more of the average functional group number A, average molecular weight C, and average functional group equivalent E. .
- the number of parts used B [parts by weight] of all the monomers contained in the second material with respect to 100 parts by weight of the polymer (a1) contained in the first material is not particularly limited, and is appropriately adjusted so as to realize a flexible and tough resin film. can be set.
- the number of parts B used may be, for example, 0.1 parts by weight or more, suitably 0.5 parts by weight or more, preferably more than 1 part by weight, and more than 3 parts by weight (for example, 3.0 parts by weight). 5 parts by weight or more), and may be 4 parts by weight or more.
- the toughness of the resin film generally tends to improve.
- the number of parts B used may be greater than 6 parts by weight, greater than 10 parts by weight, greater than 15 parts by weight, or greater than 15 parts by weight. Further, the number of parts B used may be, for example, less than 50 parts by weight, advantageously less than 40 parts by weight, preferably less than 30 parts by weight, may be less than 25 parts by weight, or 23 parts by weight. may be less than It is preferable from the viewpoint of imparting appropriate suppleness to the resin film that the number of copies B used is not too large.
- the second material preferably does not contain a monomer having a bisphenol structure (especially a polyfunctional monomer).
- a monomer having a bisphenol structure especially a polyfunctional monomer.
- the above formula (1) is preferably applied when the polymer (a1) is a polymer other than a polyester-based polymer.
- Application in which the polymer (a1) is an acrylic polymer is particularly preferred.
- the distance between the reactive functional groups (f2) in the second network tends to decrease.
- the weight of the second mesh per weight of the first mesh contained in the resin film increases.
- Higher AB/C means more fine secondary meshes.
- the degree of influence of the second network on the stretching behavior of the resin film varies depending on the weight average molecular weight D of the polymer (a1) contained in the first material, and the larger the (AB/C)/D, the more the second network. contribution tends to increase.
- composition value Y1 is in the range of 0.20 or more and 0.85 or less , a flexible and tough resin film (for example, a stress integral value greater than 10 MPa) can be preferably realized.
- the polymer (a1) is a polyester-based polymer
- the average functional group number A of all the monomers contained in the second material, and the number of used parts B [parts by weight] of all the monomers with respect to 100 parts by weight of the polymer (a1)
- the composition numerical value Y2 calculated by the following formula (2) based on the weight average molecular weight C of all the monomers and the number average molecular weight D' of the polymer (a1) is 6.0 or more and 7.0 or less. is preferred.
- Y2 [(AB/C)/D′] ⁇ 10 7 (2)
- the polymer (a1) is a polyester-based polymer
- a supple and tough For example, a resin film having a stress integral value of greater than 10 MPa can be preferably realized.
- photoinitiator curing of one or both of the first material, the second material described above may be performed by light irradiation.
- a photoinitiator may optionally be used to facilitate curing by photoirradiation.
- ketal photopolymerization initiators As the photoinitiator, ketal photopolymerization initiators, acetophenone photopolymerization initiators, benzoin ether photopolymerization initiators, acyl phosphine oxide-based photopolymerization initiator, ⁇ -ketol-based photopolymerization initiator, aromatic sulfonyl chloride-based photopolymerization initiator, photoactive oxime-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzyl-based photopolymerization initiator, Benzophenone-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, and the like can be used.
- a photoinitiator can be used individually by 1 type or in combination of 2 or more types as appropriate.
- ketal photopolymerization initiators include 2,2-dimethoxy-1,2-diphenylethan-1-one and the like.
- acetophenone-based photopolymerization initiators include 1-hydroxycyclohexyl-phenyl-ketone, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, 1-[4-(2-hydroxyethoxy)-phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, methoxyacetophenone, and the like.
- benzoin ether photoinitiators include benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, and benzoin isobutyl ether, and substituted benzoin ethers such as anisole methyl ether.
- acylphosphine oxide photopolymerization initiators include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-2,4-di-n-butoxy phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide and the like.
- ⁇ -ketol photopolymerization initiators include 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one, and the like.
- aromatic sulfonyl chloride photopolymerization initiators include 2-naphthalenesulfonyl chloride and the like.
- photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime and the like.
- benzoin-based photopolymerization initiator include benzoin and the like.
- benzyl-based photopolymerization initiators include benzyl and the like.
- benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3′-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, ⁇ -hydroxycyclohexylphenylketone, and the like.
- thioxanthone-based photopolymerization initiators include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and isopropylthioxanthone. , 2,4-diisopropylthioxanthone, dodecylthioxanthone, and the like.
- the amount of the photoinitiator to be used is not particularly limited, and can be set so that the desired effect is appropriately exhibited.
- the content of the photoinitiator is, for example, approximately 0.02 parts by weight to 2 parts by weight with respect to 100 parts by weight of the material to be cured (the first material or the second material). It can be, but is not limited to.
- crosslinking catalyst In the embodiment in which a cross-linking agent is used to cure the first material, a cross-linking catalyst may be used in order to promote the cross-linking reaction more effectively.
- Cross-linking catalysts include organometallic compounds such as organometallic complexes (chelates), compounds of metals and alkoxy groups, and compounds of metals and acyloxy groups; and tertiary amines.
- organometallic compounds are preferable from the viewpoint of suppressing the progress of the crosslinking reaction in a solution state at room temperature and securing the pot life of the resin composition used for forming the resin film disclosed herein.
- an organometallic compound that is liquid at room temperature is preferable as the cross-linking accelerator because it is easy to introduce a uniform cross-linked structure over the entire thickness direction of the resin film.
- the metals of the organometallic compounds include iron, tin, aluminum, zirconium, zinc, titanium, lead, cobalt, and zinc.
- Iron-based cross-linking accelerators include tris(acetylacetonate)iron, tris(hexane-2,4-dionate)iron, tris(heptane-2,4-dionate)iron, etc.
- tin-based cross-linking accelerators include dibutyl Tin dichloride, dibutyltin oxide, dibutyltin dibromide, etc.
- aluminum-based cross-linking accelerators include aluminum diisopropylate monosec-butylate, aluminum sec-butylate, aluminum isopropylate, aluminum trisacetylacetonate, aluminum trisethylacetoacetate , diisopropoxyaluminum ethylacetoacetate and the like
- zirconium-based cross-linking accelerators such as zirconium tetraacetylacet
- the amount of cross-linking accelerator used may be appropriately adjusted according to the type and amount of cross-linking agent used, and the type of cross-linking accelerator.
- the amount of the cross-linking accelerator used is generally about 0.001 to 2 parts by weight per 100 parts by weight of the polymer (a1).
- the amount of the cross-linking accelerator used is preferably about 0.001 to 0.1 parts by weight per 100 parts by weight of the polymer (a1).
- the amount of the cross-linking accelerator used is preferably about 0.01 to 2.0 parts by weight per 100 parts by weight of the polymer (a1). It is preferable to use a non-tin-based organic metal as a cross-linking accelerator for the epoxy-based cross-linking agent.
- the resin composition used to form the resin film disclosed herein may optionally contain a compound that causes keto-enol tautomerism as a cross-linking retarder.
- a compound that causes keto-enol tautomerism can be preferably used in a resin composition containing an isocyanate-based cross-linking agent (polyfunctional isocyanate compound). Thereby, the effect of extending the pot life of the resin composition can be exhibited.
- Various ⁇ -dicarbonyl compounds can be used as compounds that cause keto-enol tautomerism.
- ⁇ -diketones such as acetylacetone and 2,4-hexanedione
- acetoacetates such as methyl acetoacetate and ethyl acetoacetate
- propionyl acetates such as ethyl propionylacetate
- isobutyryl such as ethyl isobutyrylacetate.
- acetic acid esters malonic acid esters such as methyl malonate and ethyl malonate; and the like.
- acetylacetone and acetoacetates The compounds that cause keto-enol tautomerism can be used singly or in combination of two or more.
- the amount of the compound that causes keto-enol tautomerism can be, for example, 50 parts by weight or less, preferably 35 parts by weight or less, more preferably 25 parts by weight or less with respect to 100 parts by weight of the polymer (a1). Also, it can be, for example, 0.1 parts by weight or more, preferably 0.5 parts by weight or more, and more preferably 1 part by weight or more.
- the resin film disclosed herein or the resin composition used to form the resin film may optionally contain a tackifying resin (e.g., rosin-based, petroleum-based, terpene-based, phenol-based, ketone-based tackifier, etc.). resins), viscosity modifiers (e.g. thickeners), leveling agents, plasticizers, fillers, colorants such as pigments and dyes, stabilizers, preservatives, anti-aging agents, antistatic agents, fillers, slip agents, Various additives commonly used in the field of adhesives or resin films for adhesive sheets, such as anti-blocking agents, may be included as other optional components. As for such various additives, conventionally known ones can be used in a conventional manner, and since they do not particularly characterize the present invention, detailed description thereof will be omitted.
- a tackifying resin e.g., rosin-based, petroleum-based, terpene-based, phenol-based, ketone-based tackifier,
- the form of the resin composition used for forming the resin film disclosed herein is not particularly limited.
- a solvent-type resin composition containing a resin film-forming component in an organic solvent It can be in various conventionally known forms such as a water-dispersed resin composition in a dispersed form, and a photocurable resin composition that changes from a liquid to a viscoelastic body when cured by light (eg, UV) irradiation.
- a solvent-based resin composition can be preferably employed in some embodiments.
- the operation of forming a resin film from the resin composition is carried out using a conventional coater such as gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, spray coater, die coater and the like. be able to.
- the resin film may be formed by a method such as extrusion molding, inflation molding, T-die casting, calendar roll molding, or the like.
- the thickness of the resin film is not particularly limited, and can be, for example, about 3 ⁇ m to 500 ⁇ m.
- the thickness of the adhesive layer is It is suitably 5 ⁇ m or more, preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more (for example, 20 ⁇ m or more).
- the thickness of the adhesive layer may be, for example, 200 ⁇ m or less, 150 ⁇ m or less, 100 ⁇ m or less, 70 ⁇ m or less, 50 ⁇ m or less, or 35 ⁇ m or less.
- a pressure-sensitive adhesive layer having a thickness of about 15 ⁇ m to 70 ⁇ m, the effect of providing the resin film disclosed herein as the pressure-sensitive adhesive layer can be suitably exhibited.
- FIG. 1 shows one structural example of a pressure-sensitive adhesive sheet containing the resin film disclosed herein as a pressure-sensitive adhesive layer.
- This adhesive sheet 1 is a substrate-less double-sided adhesive sheet comprising an adhesive resin film (adhesive layer) 10 .
- the pressure-sensitive adhesive sheet 1 Before use (before being attached to an adherend), the pressure-sensitive adhesive sheet 1 has, for example, as shown in FIG. It may be in the form of a release liner-attached pressure-sensitive adhesive sheet 50 protected by release liners 31 and 32 formed of two layers.
- the back surface of the release liner 31 (the surface opposite to the adhesive side) serves as a release surface, and the adhesive surface is wound or laminated so that the adhesive surface 10B is in contact with the back surface of the release liner 31.
- 10A and 10B may be in protected form.
- the release liner is not particularly limited, and may be, for example, a release liner in which the surface of a liner substrate such as a plastic film or paper is release-treated, a fluorine-based polymer (polytetrafluoroethylene, etc.) or a polyolefin resin (polyethylene, polypropylene, etc.). ) can be used.
- a release treatment agent such as a silicone-based agent or a long-chain alkyl-based agent may be used.
- a release-treated resin film can be preferably employed as a release liner.
- FIG. 2 shows another configuration example of an adhesive sheet containing the resin film disclosed herein as an adhesive layer.
- This adhesive sheet 2 is laminated on an adhesive layer (adhesive resin film) 10 whose one surface 10A is a surface (adhesive surface) to be attached to an adherend and the other surface 10B of the adhesive layer 10.
- a single-sided adhesive sheet (single-sided adhesive sheet with a substrate) including a substrate (support) 20 coated with a substrate.
- the adhesive layer 10 is bonded to one surface 20A of the substrate 20 .
- a resin film such as a polyester film may be used.
- the pressure-sensitive adhesive sheet 2 before use is, for example, as shown in FIG. It may be in the form of a sheet 50.
- the second surface 20B of the substrate 20 (the surface opposite to the first surface 20A and also referred to as the back surface) is a release surface, and the adhesive surface 10A is on the second surface 20B of the substrate 20.
- a form in which the adhesive surface 10A is protected by being wound or laminated so as to be in contact with each other may be used.
- FIG. 3 shows a configuration example of a pressure-sensitive adhesive sheet containing the resin film disclosed herein as a base film.
- the pressure-sensitive adhesive sheet 3 includes a pressure-sensitive adhesive layer 110 having one surface 110A that is attached to an adherend (adhesive surface) and a base film (non Adhesive or weakly adhesive resin film) 120 and a single-sided adhesive adhesive sheet (single-sided adhesive sheet with base material).
- the adhesive layer 110 is bonded to one surface 120A of the base film 120 .
- the pressure-sensitive adhesive sheet 3 before use is, for example, as shown in FIG. It may be in the form of sheet 150 .
- the second surface (back surface) 120B of the base film 120 is a release surface, and the adhesive surface 110A is wound or laminated so that the adhesive surface 110A is in contact with the second surface 120B of the base film 120. may be in protected form.
- the pressure-sensitive adhesive sheet containing the resin film disclosed herein has a first pressure-sensitive adhesive layer laminated on one surface of a sheet-like base material, and a second pressure-sensitive adhesive layer laminated on the other surface of the base material.
- it may be in the form of a double-sided pressure-sensitive adhesive sheet with a substrate.
- one or more of the first pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer and the substrate can be composed of any of the resin films disclosed herein.
- the resin film disclosed herein is a pressure-sensitive adhesive that constitutes a pressure-sensitive adhesive sheet with a substrate (including a single-sided pressure-sensitive adhesive sheet with a substrate and a double-sided pressure-sensitive adhesive sheet with a substrate; hereinafter, unless otherwise specified, the same means).
- the material of the base material in the pressure-sensitive adhesive sheet with a base material is not particularly limited, and can be appropriately selected according to the intended use and mode of use of the pressure-sensitive adhesive sheet.
- Non-limiting examples of substrates that can be used include polyolefin films based on polyolefins such as polypropylene and ethylene-propylene copolymers, polyester films based on polyesters such as polyethylene terephthalate and polybutylene terephthalate, Plastic films such as polyvinyl chloride films containing polyvinyl chloride as the main component; Foam sheets made of foams such as polyurethane foam, polyethylene foam, polychloroprene foam; Synthetic fibers such as polyester and vinylon, semi-synthetic fibers such as acetate, etc.) Woven fabric and non-woven fabric by single or blended spinning; Paper such as Japanese paper, fine paper, kraft paper, crepe paper; Aluminum foil, copper metal foil such as foil; A base material having a structure in which these are combined may be used.
- Such composite structure substrates include metal layers (e.g., metal foil, continuous or discontinuous metal sputter layers, metal vapor deposition layers, metal plating layers, etc.), metal oxide layers and the above plastic films. and a plastic film reinforced with inorganic fibers such as glass cloth.
- the type of pressure-sensitive adhesive that constitutes the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet with a base material is not particularly limited. However, it can be selected as appropriate according to the purpose and mode of use of the pressure-sensitive adhesive sheet.
- the adhesive layer includes, for example, acrylic adhesives, rubber adhesives (natural rubber, synthetic rubber, mixtures thereof, etc.), silicone adhesives, polyester adhesives, urethane adhesives, polyether It may be a pressure-sensitive adhesive layer containing one or more pressure-sensitive adhesives selected from various known pressure-sensitive adhesives such as poly-based pressure-sensitive adhesives, polyamide-based pressure-sensitive adhesives, fluorine-based pressure-sensitive adhesives, and the like.
- the characteristics of the pressure-sensitive adhesive layer such as the stress integral value, hysteresis, stress integral area ratio, etc., are not particularly limited.
- the pressure-sensitive adhesive layer may be a resin film (adhesive resin film) that satisfies the stress integral value described above, or may be a layer having the stress integral value of 10 MPa or less (eg, 9 MPa or less).
- the thickness of the substrate is not particularly limited, and the purpose and mode of use of the pressure-sensitive adhesive sheet, etc. can be selected depending on
- the thickness of the substrate may be, for example, 1000 ⁇ m or less, 500 ⁇ m or less, 100 ⁇ m or less, 70 ⁇ m or less, 50 ⁇ m or less, 25 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less.
- the thickness of the substrate may be, for example, 2 ⁇ m or more, 4 ⁇ m or more, 7 ⁇ m or more, or 10 ⁇ m or more.
- the surface of the substrate that is to be bonded to the adhesive layer may be subjected to corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, primer application, and antistatic treatment, if necessary.
- corona discharge treatment plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, primer application, and antistatic treatment, if necessary.
- conventionally known surface treatment may be applied.
- Such a surface treatment can be a treatment for improving the adhesion between the substrate and the adhesive layer, in other words, the anchoring property of the adhesive layer to the substrate.
- the composition of the primer is not particularly limited, and can be appropriately selected from known ones.
- the thickness of the undercoat layer is not particularly limited, it is usually suitably about 0.01 ⁇ m to 1 ⁇ m, preferably about 0.1 ⁇ m to 1 ⁇ m.
- the surface of the substrate opposite to the side to be bonded to the pressure-sensitive adhesive layer (hereinafter also referred to as the back surface) may be subjected to release treatment, adhesiveness or adhesiveness as necessary.
- Conventionally known surface treatments such as improvement treatment and antistatic treatment may be applied.
- the unwinding force of the pressure-sensitive adhesive sheet wound into a roll can be reduced by surface-treating the back surface of the substrate with a release agent.
- release agents examples include silicone-based release agents, long-chain alkyl-based release agents, olefin-based release agents, fluorine-based release agents, fatty acid amide-based release agents, molybdenum sulfide, and silica powder. .
- the resin film provided by this specification can be preferably used as a pressure-sensitive adhesive sheet or its constituent elements (base film, etc.) as described above, taking advantage of its flexibility and toughness.
- the resin film according to some aspects has a large stress integral value, it is used as a pressure-sensitive adhesive layer that constitutes the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet.
- the thread can be flexible and strong. Therefore, it is suitable for achieving both high peel strength and good non-sticky property.
- the resin film according to some aspects has a network structure (double network structure) in which the first network and the second network coexisting in the same layer are physically entangled with each other through the network (double network structure).
- Excellent ability to disperse stress This is advantageous from the viewpoint of improving the impact resistance of the adhesive sheet.
- the pressure-sensitive adhesive layer is designed to be relatively hard depending on the application of the pressure-sensitive adhesive sheet, for example, the storage elastic modulus at 25 ° C. is 1 MPa or more, further 5 MPa or more. However, this prevents the pressure-sensitive adhesive layer from becoming brittle.
- the upper limit of the storage modulus of the pressure-sensitive adhesive layer at 25°C is not particularly limited, and may be, for example, 10 MPa or less.
- the storage modulus of the pressure-sensitive adhesive layer at 25° C. is measured by measuring a sheet of the pressure-sensitive adhesive layer to be measured having a thickness of about 1.5 mm (prepared by overlapping the above-mentioned pressure-sensitive adhesive layers as necessary).
- a measurement sample is prepared by punching into a disk shape of 7.9 mm, this measurement sample is sandwiched between parallel plates, and a viscoelasticity tester (for example, manufactured by TA Instruments, ARES or its equivalent) is used. It is obtained by performing dynamic viscoelasticity measurement in shear mode at a temperature range of -70 to 150°C and a heating rate of 5°C/min while applying a shear strain with a frequency of 1 Hz.
- a viscoelasticity tester for example, manufactured by TA Instruments, ARES or its equivalent
- the resin film according to some aspects has a characteristic that the hysteresis value is equal to or greater than a predetermined value.
- a resin film having such a large hysteresis value can be preferably used, for example, as a base material of an adhesive sheet to be attached to an adherend having a movable portion (eg, a human joint, a foldable display, etc.). Since the resin film exhibits the property that the stress required for stretching to the same length after the second time is significantly lower than that at the time of the first stretching, the movable part is deformed for the first time after the adhesive sheet is attached. When the resin film covering the movable portion is stretched, the second and subsequent deformations are less restricted by the adhesive sheet.
- the movement of the movable part is less likely to be hindered by hysteresis in the second and subsequent deformations, and the initial stretched portion (the portion attached around the movable portion) is not stretched.
- a reinforcing effect can be exhibited by making use of the strength.
- the elongation at break is 100% or more and 5000% or less (preferably 300% or more and 4500% or less) when uniaxially stretched at 25 ° C. and a tensile speed of 300 mm / min until it breaks.
- S1/S2 is calculated from the stress S2 [MPa] when stretched to a length of 7X-40)%, and this value is defined as hysteresis.
- [Necking test] (1) Prepare sample A for elongation at break measurement and sample C for necking measurement. (2) Determine the elongation at break X [%] when the sample A is uniaxially stretched at 25° C. at a tensile speed of 300 mm/min until it breaks.
- the sample C is uniaxially stretched from the initial chuck-to-chuck length to 0.5 ⁇ [%] at a tensile speed of 300 mm/min.
- a photograph of the stretched sample is taken with a digital camera within 1 second after the end of stretching. Photographing is performed from a direction orthogonal to the stretching direction of the sample.
- the minimum width W min and the maximum width W max of the sample are measured by the number of pixels of the image, and their ratio (W min /W max ).
- the first network is a cured product of the first material, the first material contains a polymer (a1) having a reactive functional group (f1), The above [6], wherein the second network is a cured product of the second material, and the second material contains a polyfunctional monomer (b1) having two or more reactive functional groups (f2) in one molecule.
- a pressure-sensitive adhesive sheet comprising the resin film according to any one of [1] to [12] above.
- a mixed solution of 100 parts of ethyl acetate, 95 parts of methyl acrylate (hereinafter referred to as MA), and 5 parts of AA was charged into a reactor equipped with a cooling tube, a nitrogen inlet tube, a thermometer, and a stirrer, and the air in the apparatus was purged with nitrogen gas. After the internal temperature was raised to 70° C. while replacing the atmosphere and making it free of oxygen, a solution obtained by dissolving 0.3 parts of AIBN in 10 parts of ethyl acetate was added to the entire amount. Thereafter, the internal temperature was maintained at 69 to 71° C. for 6 hours to complete the polymerization and obtain a solution of acrylic polymer P3.
- the weight average molecular weight (GPC, polystyrene conversion) was 100 ⁇ 10 4 .
- This resin composition was applied to the release-treated surface of a 38 ⁇ m-thick polyethylene terephthalate (PET) film (trade name “MRF38”, manufactured by Mitsubishi Chemical Corporation; hereinafter also referred to as “release film R1”) that had been subjected to silicone release treatment. It was applied so that the thickness afterward was 25 ⁇ m and dried at 120° C. for 2 minutes. This was laminated to the release-treated surface of a 38 ⁇ m silicone release-treated PET film (trade name “MRE38”, manufactured by Mitsubishi Chemical Corporation; hereinafter also referred to as “release film R2”), and aged at 40° C. for 3 days.
- PET polyethylene terephthalate
- UV treatment was performed using a UV irradiator (UM-810 manufactured by Nitto Seiki Co., Ltd.) at a dose of 3000 mJ/cm 2 .
- a laminate including the resin film (adhesive layer) according to this example was obtained.
- This laminate has a laminate structure of release film R1/adhesive layer (substrate-less adhesive sheet)/release film R2 (the same applies to Examples 2 to 7 and 9 to 12).
- Example 2 The same as Example 1 except that the type and amount of polyfunctional monomer used was changed to 22 parts of polypropylene glycol #700 diacrylate (trade name "APG-700", manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight 796, number of functional groups 2). Then, a resin composition was prepared and a resin film was produced to obtain a laminate including the resin film (adhesive layer).
- Example 3 A resin composition was prepared in the same manner as in Example 2, except that the solution of acrylic polymer P1 was changed to a solution of acrylic polymer P2, and the amount of APG-700 used relative to 100 parts of acrylic polymer was changed from 22 parts to 16 parts. A product was prepared and a resin film was produced to obtain a laminate including the resin film (adhesive layer).
- Example 4 A resin composition was prepared in the same manner as in Example 2, except that the amount of APG-700 used was 15 parts, and 2-methoxyethyl acrylate (molecular weight: 130, number of functional groups: 1; hereinafter referred to as "MEA") was added in 5 parts. was prepared and a resin film was produced to obtain a laminate containing the resin film (adhesive layer).
- the total number of used parts B of all the monomers (that is, APG-700 and MEA) contained in the second material is 20 parts
- the average functional group number A is 1.75
- the average molecular weight C is 630
- the average The functional group equivalent weight is 331.
- Example 5 To the solution of the acrylic polymer P1, 0.03 parts of TETRAD-C per 100 parts of the acrylic polymer P1 contained in the solution, a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation, as a polyfunctional monomer, A resin composition was prepared by adding 10 parts of 3) having a molecular weight of 672 and having a functional group number of 3 and uniformly mixing them. This resin composition was applied to the release-treated surface of the release film R1 so that the thickness after drying was 25 ⁇ m, and dried at 80° C. for 5 minutes. This was attached to the release-treated surface of the release film R2 and aged at 40° C. for 3 days to obtain a laminate containing the resin film (adhesive layer) according to this example.
- a polyisocyanate compound trade name "Coronate L"
- Example 6 A resin composition was prepared and a resin film was produced in the same manner as in Example 5, except that the solution of the acrylic polymer P1 was changed to the solution of the acrylic polymer P2, and a laminate containing the resin film (adhesive layer) was prepared. got
- Example 7 A resin composition was prepared and a resin film was produced in the same manner as in Example 6, except that the amount of Coronate L used was changed from 10 parts to 8 parts, to obtain a laminate containing the resin film (adhesive layer). rice field.
- Example 8 To the solution of the acrylic polymer P1, 0.03 part of TETRAD-C and 10 parts of Coronate L were added to 100 parts of the acrylic polymer P3 contained in the solution, and mixed uniformly to prepare a resin composition.
- This resin composition was applied to one side of the release film R1 so that the thickness after drying was 10 ⁇ m, and dried at 80° C. for 5 minutes.
- the adhesive layer exposed by removing film R2 ie, the adhesive layer of Example 9) was laminated. Then, it was stored at 25° C. for 72 hours to obtain a laminate containing a resin film (base film) formed from the above resin composition and a single-sided pressure-sensitive adhesive sheet with a base comprising the pressure-sensitive adhesive layer of Example 9.
- This laminate has a laminated structure of release film R1/base film/adhesive layer/release film R1.
- Example 9 A resin composition was prepared and a resin film was produced in the same manner as in Example 1, except that the amount of APG-400 used was changed from 21 parts to 5 parts, and a laminate containing the resin film (adhesive layer) was produced. Obtained.
- Example 10 A resin composition was prepared and a resin film was produced in the same manner as in Example 1, except that the amount of APG-400 used was changed from 21 parts to 30 parts, and a laminate containing the resin film (adhesive layer) was produced. Obtained.
- Polyester resin (trade name "Byron BX-1001", manufactured by Toyobo Co., Ltd., number average molecular weight 28000; hereinafter also referred to as polyester polymer P4) in ethyl acetate solution, with respect to 100 parts of the solid content of the solution, a crosslinking catalyst 0.066 parts of zirconium tetraacetylacetonate (trade name "Orgatics ZC-162") as a polyfunctional monomer, 4 parts of Coronate L as a polyfunctional monomer, and 20 parts of acetylacetone as a cross-linking retarder are blended and mixed uniformly.
- a resin composition was prepared.
- This resin composition was applied to the release-treated surface of the release film R1 so that the thickness after drying was 25 ⁇ m, and dried at 150° C. for 1 minute. This was attached to the release-treated surface of the release film R2 and aged at 40° C. for 3 days to obtain a laminate containing the resin film (adhesive layer) according to this example.
- Example 12 A resin composition was prepared and a resin film was produced in the same manner as in Example 11, except that the amount of Coronate L used was changed from 4 parts to 3 parts, to obtain a laminate containing the resin film (adhesive layer). rice field.
- Stress integral value A rectangular shape having a length of 30 mm and a width of 100 mm was cut out from the laminate obtained in each example. Next, one release film is removed to expose the surface of the adhesive layer, and the adhesive layer (single-sided adhesive sheet with substrate in Example 8) is wound around the length direction on the other release film. A cylindrical sample with a length of 30 mm, a diameter of about 1 mm, and a weight of about 0.1 g (in Example 8, the diameter of the entire sample is about 2 mm, and the weight is about 0.07 g) was prepared.
- the upper and lower parts of the sample are fixed by a chuck jig of a tensile tester (EZ-S 500N, manufactured by Shimazu), and the chuck length is 10 mm and the tensile speed is 300 mm / min in a 25 ° C. environment.
- the sample was pulled until it broke, during which stress values were taken at every 2.5% elongation from the initial length (10 mm).
- the sum of the stress values at each elongation was multiplied by 2.5 and divided by 100 to obtain the stress integral value [MPa].
- the obtained stress integral values are shown in Tables 1 and 2 together with the elongation at break X [%] of each sample.
- the pressure-sensitive adhesive sheets of Examples 1 and 9 were subjected to the following impact resistance test. That is, the adhesive sheet was cut into a window-frame shape (picture frame shape) of 59 mm in width, 113 mm in length and 1 mm in width to obtain a window-frame-shaped double-sided pressure-sensitive adhesive sheet. Using this window-frame-shaped double-sided adhesive sheet, a first PC plate (polycarbonate plate; width 70 mm, length 130 mm, thickness 2 mm) and a second PC plate (width 59 mm, length 113 mm, thickness 0.55 mm) were bonded together. A load of 5 kg was pressed for 10 seconds to bond them together to obtain a sample for evaluation.
- a first PC plate polycarbonate plate
- width 70 mm width 130 mm, thickness 2 mm
- a second PC plate width 59 mm, length 113 mm, thickness 0.55 mm
- a weight of 160 g was attached to the back surface of the first PC board (the surface opposite to the surface bonded to the second PC board) of these evaluation samples.
- a drop test was performed on the weighted evaluation samples by free-falling them 60 times from a height of 1.2 m onto a concrete plate at room temperature (about 23°C). At this time, the dropping direction was adjusted so that the six faces of the evaluation samples were sequentially downward. That is, 10 cycles of one drop pattern were performed for each of the six surfaces. Then, each time the first PC board and the second PC board are dropped, it is visually confirmed whether the bonding between the first PC board and the second PC board is maintained, and the first PC board and the second PC board are separated ( Separation) was evaluated as impact resistance against dropping at room temperature. As a result, in Example 1, no peeling was observed even after being dropped 60 times, whereas in Example 9, the first PC board and the second PC board were separated by the 30th drop.
- the resin films of Examples 1 to 8 all had high stress integral values and were flexible and tough. All of the resin films of Examples 1 to 8 have a large hysteresis, suggesting that they have a double network structure in which the first network and the harder second network are physically entangled with each other via the network. rice field. Moreover, the pressure-sensitive adhesive layer (resin film) of Example 1, which has a higher stress integral value, clearly exhibits better impact resistance than the pressure-sensitive adhesive layer (resin film) of Example 9, which has a low stress integral value.
- the breaking stress of the resin sheet (base film) of Example 8 was 14.5 MPa, and the stress integral area ratio was 70%.
- Table 2 summarizes the schematic configurations and evaluation results of Examples 11 and 12 in which a polyester-based polymer was used as the polymer (a1) of the first material. Similar to the examples shown in Table 1, the resin film of Example 11 with a low integrated stress value was more flexible and tough than the resin film of Example 12 with a low integrated stress value. The breaking stress of the resin sheet of Example 11 was 54.3 MPa, and the stress integral area ratio was 42%.
- Adhesive sheet 10 Adhesive layer (adhesive resin film) 10A One surface (adhesive surface) 10B other surface 20 substrate 20A first surface 20B second surface (back surface) 30, 31, 32 release liner 50 adhesive sheet with release liner 110 adhesive layer 110A one surface (adhesive surface) 110B Other surface 120 Base material (non-adhesive or weakly adhesive resin film) 120A First surface 120B Second surface (back surface)
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Abstract
Description
本出願は、2021年3月3日に出願された日本国特許出願2021-033311号に基づく優先権を主張しており、その出願の全内容は本明細書中に参照として組み入れられている。
Y1=[(AB/C)/D]×107 (1);
が0.20以上0.85以下であることが好ましい。組成数値Y1を上記範囲とすることにより、しなやかで強靭な樹脂フィルムが好ましく実現され得る。組成数値Y1は、例えば、0.21以上であってよく、0.25以上でもよく、0.30以上でもよく、0.35以上でもよく、0.40以上でもよい。また、組成数値Y1は、例えば0.75以下であってよく、0.70以下でもよく、0.65以下でもよく、0.60以下でもよい。
Y2=[(AB/C)/D’]×107 (2);
が6.0以上7.0以下であることが好ましい。組成数値Y2を上記範囲とすることにより、しなやかで強靭な樹脂フィルムが好ましく実現され得る。
(応力積分値)
この明細書により、応力積分値が10MPaより大きく1000MPaである樹脂フィルムが提供される。上記応力積分値は、サンプルを破断時伸びに至るまで一軸延伸する過程で加わった積算応力に相当する。伸びの良さと、該伸びに対する抵抗の強さとをバランスよく両立させることにより、10MPa超の応力積分値が好適に実現され、しなやかで強靭な性質が発揮される。このような性質を有する樹脂フィルムは、例えば該樹脂フィルムを粘着剤層として含む粘着シートとして好ましく用いられ得る。応力積分値の高い粘着剤層によると、被着体からの剥離時に生じる糸曳き現象においてしなやかで強靭な糸を形成することができる。このことは、高い剥離強度と良好な非糊残り性との両立、耐衝撃性の向上、等に有利に寄与し得る。また、上記樹脂フィルムは、粘着シートにおいて、粘着面(被着体との接触面)を構成する粘着剤層以外の構成要素(例えば、基材フィルム、粘着性または非粘着性の中間層等)として用いることもでき、これにより該粘着シートにしなやかで強靭な性質を付与し得る。
なお、本明細書により開示される樹脂フィルムは、応力積分値の制限のない態様を包含し、そのような態様において、樹脂フィルムは上記特性を有するものに限定されない。
上記応力積分値は、樹脂フィルムの同一層内に第1網目と第2網目とを共存させることにより好適に実現され得る。上記第1網目と上記第2網目とは、互いに網目を介して物理的に絡み合ったダブルネットワーク構造を形成していることが好ましい。また、上記第2網目は、上記第1網目よりも細かい網目となるように形成されていることが好ましい。かかる構造の樹脂フィルムを延伸していくと、全般的な傾向として、一定の歪みに到達した時点で第2網目の破断が始まり、歪みの増加につれて第2網目の破断が進行し、次いで第1網目の破断が進行する。ダブルネットワーク構造の樹脂フィルムは、このように延伸に対して第2網目がいわば犠牲網目として機能することにより、しなやかで強靭な性質を示すものとなり得る。
ここに開示される樹脂フィルムの破断時伸びは、特に限定されず、例えば100%~5000%程度(好ましくは250%~4000%程度)であり得る。粘着シートまたはその構成要素として適した柔軟性と、しなやかで強靭な性質とをバランスよく両立する観点から、いくつかの態様において、上記破断時伸びは、300%以上であることが好ましく、450%以上であることがより好ましく、600%以上でもよく、750%以上でもよく、900%以上でもよく、1000%以上でもよい。また、いくつかの態様において、
樹脂フィルムの破断時伸びは、4500%以下であることが適当であり、3000%以下であることが好ましく、2400%以下でもよく、2200%以下でもよく、1700%以下でもよく、1500%以下でもよい。破断時伸びが大きすぎないことは、例えば粘着面を構成する粘着剤層として用いられる樹脂フィルムにおいて、被着体への糊残りを抑制する観点から好ましい。
破断時伸びは、上述した応力積分値の測定において、サンプルが破断したときの伸びを記録することにより求められる。破断時伸びは、樹脂フィルムの構造の選択、構成材料の選択等により調節し得る。
ここに開示される樹脂フィルムの破断応力は、特に限定されない。しなやかで強靭な樹脂フィルム(例えば、応力積分値が10MPaより大きい樹脂フィルム)を実現しやすくする観点から、いくつかの態様において、樹脂フィルムの破断応力は、例えば0.5MPa~100MPa程度であり得る。破断応力の好ましい範囲は、樹脂フィルムの材質や用途によっても異なり得る。例えば、後述するポリマー(a1)がアクリル系ポリマーである樹脂フィルムでは、破断応力は2MPa~50MPa程度であることが好ましく、そのうち粘着剤層として用いられる樹脂フィルムでは2MPa~10MPa(例えば2MPa~6MPa)程度であることがより好ましく、基材フィルムとして用いられる樹脂フィルムでは5MPa~50MPa(例えば5MPa~25MPa)程度であることがより好ましい。また、後述するポリマー(a1)がポリエステル系ポリマーである樹脂フィルムでは、破断応力は10MPa~100MPa程度であることが好ましい。
破断応力は、上述した応力積分値の測定において、サンプルが破断したときの伸びを記録することにより求められる。破断応力は、樹脂フィルムの構造の選択、構成材料の選択等により調節し得る。
ここに開示される樹脂フィルムは、上述の方法により得られる応力積分値[MPa]、破断応力[MPa]および破断時伸び[%]から、以下の式:
(応力積分値×100)/(破断応力×破断時伸び);
により算出される応力積分の面積割合が、30%超(すなわち0.3超)であることが適当であり、35%超であることが有利であり、40%超であることが好ましく、45%超であることがより好ましい。サンプルを引張り延伸する際、応力値がある程度上昇してからサンプルが破断するまでの延伸長さが大きいと、応力積分の面積割合は大きくなる。したがって、より応力積分の面積割合が大きい樹脂フィルムは、よりしなやかで強靭であるといえる。所定以上の応力積分値と、所定以上の破断時伸びを満たし、かつ応力積分の面積割合が所定以上である樹脂フィルムが特に好ましい。いくつかの態様において、応力積分の面積割合は、50%以上または50%超でもよく、55%以上または55%超でもよく、60%以上または60%超でもよい。また、粘着シートまたはその構成要素として適した柔軟性を得る観点から、応力積分の面積割合の上限は、95%以下であることが適当であり、90%以下であることが好ましく、85%以下でもよく、80%以下でもよい。
いくつかの好ましい態様に係る樹脂フィルムは、サンプルを一軸延伸した際に、該サンプルが長手方向に対して不均一に細くなる挙動を示す。以下、このような挙動をネッキングという。例えば、上述した応力積分値の評価と同様にして調製した測定用サンプルを、後述する実施例に記載の条件で一軸延伸した場合に、ネッキングが観察される樹脂フィルムが好ましい。このような性質は、例えば、上記ダブルネットワーク構造を有する樹脂フィルムにおいて好ましく発現し得る。これは、適切なダブルネットワーク構造を有する樹脂フィルムを延伸していくと、サンプルの一箇所で第2網目の破断が始まっても、該第2網目と絡み合った第1網目の変形等により応力が分散されることで当該箇所におけるサンプルの早期破断が回避される結果、上記箇所が破断に至る前にサンプルの他の1または2以上の箇所において第2網目の破断が始まるためと考えられる。よって、ネッキングが観察される樹脂フィルムは、延伸時にネッキングが観察されない(すなわち、サンプルが長手方向に対して均一に細くなる)樹脂フィルムに比べて、応力積分値の高いものとなりやすく、しなやかで強靭であるといえる。
[ネッキング試験]
(1)破断時伸び測定用のサンプルAと、ネッキング測定用のサンプルCとを用意する。
(2)25℃において前記サンプルAを引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びX[%]を求める。
(3)25℃において、前記サンプルCを、引張速度300mm/分の条件で初期のチャック間長さから0.5X[%]まで一軸延伸する。延伸終点において、延伸終了から1秒以内に、延伸されたサンプルの写真をデジタルカメラで撮影する。撮影は、サンプルの延伸方向と直交する方向から行う。
(4)延伸されたサンプルの両端(すなわちチャック側)からそれぞれ20%を除いた中央60%の範囲について、サンプルの最小の横幅Wminおよび最大の横幅Wmaxを画像のピクセル数で計測し、それらの比(Wmin/Wmax)が0より大きく0.90以下の場合はネッキングあり、0.90より大きい場合はネッキングなしと判定する。
(ポリマー(a1))
上記第1網目は、好ましくは第1材料の硬化物である。例えば、ポリマー(a1)を含む第1材料を架橋させることにより、該第1材料を硬化させて第1網目を形成することができる。ポリマー(a1)の種類は特に限定されず、粘着シートの構成材料として用いられ得るポリマーのなかから、しなやかで強靭な樹脂フィルムの実現に適したものを適宜選択し得る。ポリマー(a1)の選択肢となり得る材料の例には、アクリル系ポリマー、ゴム系ポリマー、ポリエステル系ポリマー、ウレタン系ポリマー、ポリエーテル系ポリマー、シリコーン系ポリマー、ポリオレフィン、ポリ塩化ビニル等が含まれるが、これらに限定されない。ポリマー(a1)の好適例として、アクリル系ポリマーおよびポリエステル系ポリマーが挙げられる。
なお、ポリマー(a1)の重量平均分子量(Mw)および数平均分子量(Mn)とは、特記しない場合、ゲルパーミエーションクロマトグラフィ(GPC)により得られた標準ポリスチレン換算の値をいう。GPC装置としては、例えば機種名「HLC-8320GPC」(カラム:TSKgelGMH-H(S)、東ソー社製)を使用することができる。メーカー等により公称値が提供されている場合には、その値を採用してもよい。
いくつかの好ましい態様では、ポリマー(a1)はアクリル系ポリマーである。この明細書において「アクリル系ポリマー」とは、アクリル系モノマーを50重量%より多く(好ましくは70重量%より多く、例えば90重量%より多く)含むモノマー原料に由来する重合物をいう。上記アクリル系モノマーとは、1分子中に少なくとも1つの(メタ)アクリロイル基を有するモノマーのことをいう。また、この明細書において「(メタ)アクリロイル」とは、アクリロイルおよびメタクリロイルを包括的に指す意味である。同様に、「(メタ)アクリレート」とはアクリレートおよびメタクリレートを、「(メタ)アクリル」とはアクリルおよびメタクリルを、それぞれ包括的に指す意味である。
カルボキシ基含有モノマー:例えば、アクリル酸、メタクリル酸、カルボキシエチルアクリレート、カルボキシペンチルアクリレート、イタコン酸、マレイン酸、フマル酸、クロトン酸、イソクロトン酸等。
酸無水物基含有モノマー:例えば、無水マレイン酸、無水イタコン酸。
水酸基含有モノマー:例えば、(メタ)アクリル酸2-ヒドロキシエチル、(メタ)アクリル酸4-ヒドロキシブチル、(メタ)アクリル酸6-ヒドロキシヘキシル、(メタ)アクリル酸8-ヒドロキシオクチル、(メタ)アクリル酸10-ヒドロキシデシル、(メタ)アクリル酸12-ヒドロキシラウリル、(4-ヒドロキシメチルシクロへキシル)メチル(メタ)アクリレート等の(メタ)アクリル酸ヒドロキシアルキル等。
スルホン酸基またはリン酸基を含有するモノマー:例えば、スチレンスルホン酸、アリルスルホン酸、ビニルスルホン酸ナトリウム、2-(メタ)アクリルアミド-2-メチルプロパンスルホン酸、(メタ)アクリルアミドプロパンスルホン酸、スルホプロピル(メタ)アクリレート、(メタ)アクリロイルオキシナフタレンスルホン酸、2-ヒドロキシエチルアクリロイルホスフェート等。
エポキシ基を有するモノマー:例えばグリシジル(メタ)アクリレート、メチルグリシジル(メタ)アクリレート、アリルグリシジルエーテル等。
シアノ基含有モノマー:例えば、アクリロニトリル、メタクリロニトリル等。
イソシアネート基含有モノマー:例えば、2-イソシアナトエチル(メタ)アクリレート、(メタ)アクリロイルイソシアネート、m-イソプロペニル-α,α-ジメチルベンジルイソシアネート等。
アミド基含有モノマー:例えば、(メタ)アクリルアミド;N,N-ジメチル(メタ)アクリルアミド、N,N-ジエチル(メタ)アクリルアミド、N,N-ジプロピル(メタ)アクリルアミド、N,N-ジイソプロピル(メタ)アクリルアミド、N,N-ジ(n-ブチル)(メタ)アクリルアミド、N,N-ジ(t-ブチル)(メタ)アクリルアミド等のN,N-ジアルキル(メタ)アクリルアミド;N-エチル(メタ)アクリルアミド、N-イソプロピル(メタ)アクリルアミド、N-ブチル(メタ)アクリルアミド、N-n-ブチル(メタ)アクリルアミド等のN-アルキル(メタ)アクリルアミド;N-ビニルアセトアミド等のN-ビニルカルボン酸アミド類;その他、N,N-ジメチルアミノプロピル(メタ)アクリルアミド等。
アミノ基含有モノマー:例えばアミノエチル(メタ)アクリレート、N,N-ジメチルアミノエチル(メタ)アクリレート、t-ブチルアミノエチル(メタ)アクリレート。
窒素原子含有環を有するモノマー:例えば、N-ビニル-2-ピロリドン、N-メチルビニルピロリドン、N-ビニルピリジン、N-ビニルピペリドン、N-ビニルピリミジン、N-ビニルピペラジン、N-ビニルピラジン、N-ビニルピロール、N-ビニルイミダゾール、N-ビニルオキサゾール、N-(メタ)アクリロイル-2-ピロリドン、N-(メタ)アクリロイルピペリジン、N-(メタ)アクリロイルピロリジン、N-(メタ)アクリロイルモルホリン、N-ビニルモルホリン、N-ビニル-3-モルホリノン、N-ビニル-2-カプロラクタム、N-ビニル-1,3-オキサジン-2-オン、N-ビニル-3,5-モルホリンジオン、N-ビニルピラゾール、N-ビニルイソオキサゾール、N-ビニルチアゾール、N-ビニルイソチアゾール、N-ビニルピリダジン等(例えば、N-ビニル-2-カプロラクタム等のラクタム類)。
スクシンイミド骨格を有するモノマー:例えば、N-(メタ)アクリロイルオキシメチレンスクシンイミド、N-(メタ)アクリロイル-6-オキシヘキサメチレンスクシンイミド、N-(メタ)アクリロイル-8-オキシヘキサメチレンスクシンイミド等。
マレイミド類:例えば、N-シクロヘキシルマレイミド、N-イソプロピルマレイミド、N-ラウリルマレイミド、N-フェニルマレイミド等。
イタコンイミド類:例えば、N-メチルイタコンイミド、N-エチルイタコンイミド、N-ブチルイタコンイミド、N-オクチルイタコンイミド、N-2-エチルへキシルイタコンイミド、N-シクロへキシルイタコンイミド、N-ラウリルイタコンイミド等。
(メタ)アクリル酸アミノアルキル類:例えば、(メタ)アクリル酸アミノエチル、(メタ)アクリル酸N,N-ジメチルアミノエチル、(メタ)アクリル酸N,N-ジエチルアミノエチル、(メタ)アクリル酸t-ブチルアミノエチル。
アルコキシ基含有モノマー:例えば、(メタ)アクリル酸2-メトキシエチル、(メタ)アクリル酸3-メトキシプロピル、(メタ)アクリル酸2-エトキシエチル、(メタ)アクリル酸プロポキシエチル、(メタ)アクリル酸ブトキシエチル、(メタ)アクリル酸エトキシプロピル等の(メタ)アクリル酸アルコキシアルキル(アルコキシアルキル(メタ)アクリレート)類;(メタ)アクリル酸メトキシエチレングリコール、(メタ)アクリル酸メトキシポリエチレングリコール、(メタ)アクリル酸メトキシポリプロピレングリコール等の(メタ)アクリル酸アルコキシアルキレングリコール(例えばアルコキシポリアルキレングリコール(メタ)アクリレート)類。
アルコキシシリル基含有モノマー:例えば3-(メタ)アクリロキシプロピルトリメトキシシラン、3-(メタ)アクリロキシプロピルトリエトキシシラン、3-(メタ)アクリロキシプロピルメチルジメトキシシラン、3-(メタ)アクリロキシプロピルメチルジエトキシシラン等のアルコキシシリル基含有(メタ)アクリレートや、ビニルトリメトキシシラン、ビニルトリエトキシシラン等のアルコキシシリル基含有ビニル化合物等。
ビニルエステル類:例えば、酢酸ビニル、プロピオン酸ビニル等。
ビニルエーテル類:例えば、メチルビニルエーテルやエチルビニルエーテル等のビニルアルキルエーテル。
芳香族ビニル化合物:例えば、スチレン、α-メチルスチレン、ビニルトルエン等。
オレフィン類:例えば、エチレン、ブタジエン、イソプレン、イソブチレン等。
脂環式炭化水素基を有する(メタ)アクリル酸エステル:例えば、シクロペンチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、アダマンチル(メタ)アクリレート等の脂環式炭化水素基含有(メタ)アクリレート。
芳香族炭化水素基を有する(メタ)アクリル酸エステル:例えば、フェニル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、ベンジル(メタ)アクリレート等の芳香族炭化水素基含有(メタ)アクリレート。
その他、(メタ)アクリル酸テトラヒドロフルフリル等の複素環含有(メタ)アクリレート、塩化ビニルやフッ素原子含有(メタ)アクリレート等のハロゲン原子含有(メタ)アクリレート、シリコーン(メタ)アクリレート等のケイ素原子含有(メタ)アクリレート、テルペン化合物誘導体アルコールから得られる(メタ)アクリル酸エステル等。
ベンゾフェノン構造を有するモノマー:例えば、4-(メタ)アクリロイルオキシベンゾフェノン、4-(メタ)アクリロイルオキシ-4’-メトキシベンゾフェノン、4-アクリロイルオキシ-4’-ブロモベンゾフェノン等の、(メタ)アクリロイルオキシベンゾフェノン;4-[(2-(メタ)アクリロイルオキシ)エトキシ]ベンゾフェノン、4-[(2-(メタ)アクリロイルオキシ)エトキシ]-4’-ブロモベンゾフェノン等の、(メタ)アクリロイルオキシベンゾフェノン;4-ビニルベンゾフェノン、4’-ブロモ-3-ビニルベンゾフェノン等の、ビニルベンゾフェノン。
1/Tg=Σ(Wi/Tgi)
2-エチルヘキシルアクリレート -70℃
n-ブチルアクリレート -55℃
メチルメタクリレート 105℃
メチルアクリレート 8℃
2-ヒドロキシエチルアクリレート -15℃
2-ヒドロキシエチルメタクリレート 55℃
4-ヒドロキシブチルアクリレート -40℃
アクリル酸 106℃
メタクリル酸 228℃
いくつかの他の好ましい態様では、ポリマー(a1)はポリエステル系ポリマーである。 ポリエステル系ポリマーは、典型的にはジカルボン酸等の多価カルボン酸やその誘導体(以下「多価カルボン酸モノマー」ともいう)と、ジオール等の多価アルコールやその誘導体(以下「多価アルコールモノマー」)とが縮合した構造を有するポリマーである。
ポリマー(a1)(例えば、アクリル系ポリマー、ポリエステル系ポリマー)から第1網目を形成するための架橋には、必要に応じて架橋剤が用いられ得る。ここに開示される樹脂シートにおいて、ポリマー(a1)の架橋に用いられる架橋剤は、典型的には架橋反応後の形態(例えば、架橋残基として第1網目に組み込まれた形態)で該樹脂シートに含まれている。ポリマー(a1)の有する反応性官能基(f1)の種類および量に応じて、架橋剤の種類および使用量を適切に選択することにより、しなやかで強靭な樹脂シートの実現に適した第1網目を形成することができる。
アジリジン系架橋剤の例としては、トリメチロールプロパントリス[3-(1-アジリジニル)プロピオネート]、トリメチロールプロパントリス[3-(1-(2-メチル)アジリジニルプロピオネート)]等が挙げられる。
カルボジイミド系架橋剤としては、カルボジイミド基を2個以上有する低分子化合物または高分子化合物を用いることができる。
(多官能性モノマー(b1))
上記第2網目は、好ましくは第2材料の硬化物である。例えば、多官能性モノマー(b1)を含む第2材料を使用し、上記多官能性モノマー(b1)を反応させることにより、該第2材料を硬化させて第2網目を形成することができる。多官能性モノマー(b1)としては、1分子内に2以上の反応性官能基(f2)を有する化合物を用いることができる。上記反応性官能基(f2)は、ポリマー(a1)に含まれ得る反応性官能基(f1)とは異なる種類の官能基であってもよく、同種の官能基であってもよい。多官能性モノマーは、1種を単独でまたは2種以上を組み合わせて使用することができる。
平均官能基数=Σ(Ni×Wi);
により算出される。上記式において、Niは、多官能性モノマー(b1)として用いられる化合物iが1分子内に有する反応性官能基(f2)の数であり、Wiは、多官能性モノマー(b1)全体における上記化合物iの重量分率である。すなわち、平均官能基数は、多官能性モノマー(b1)として用いられる各化合物が1分子内に有する反応性官能基(f2)の数と、多官能性モノマー(b1)全体における該化合物の重量分率との積の総和として求められる。
平均分子量=Σ(Mi×Wi);
により算出される。上記式において、Miは、多官能性モノマー(b1)として用いられる化合物iの分子量であり、Wiは、多官能性モノマー(b1)全体における上記化合物iの重量分率である。すなわち、平均分子量は、多官能性モノマー(b1)として用いられる各化合物の分子量と、多官能性モノマー(b1)全体における該化合物の重量分率との積の総和として求められる。
また、多官能性モノマー(b1)として用いられる化合物の分子量としては、非重合物または低重合度(例えば2~5量体程度)の繰り返し構造を含む化合物については、化学構造に基づいて算出される分子量(化学式量)、もしくはマトリックス支援レーザー脱離イオン化飛行時間型質量分析法(MALDI-TOF-MS)に基づく測定値を用いることができる。多官能性モノマー(b1)として用いられる化合物が、より重合度の高い繰り返し構造を含む化合物である場合は、適切な条件で行われるGPCに基づく重量平均分子量(Mw)を用いることができる。メーカー等から分子量の公称値が提供されている場合は、その公称値を採用することができる。後述する単官能性モノマー(b2)の分子量についても同様である。
平均官能基当量=Σ((Mi/Ni)×Wi);
により算出される。上記式において、Miは、多官能性モノマー(b1)として用いられる化合物iの分子量であり、Niは、該化合物iが1分子内に有する反応性官能基(f2)の数であり、Wiは、多官能性モノマー(b1)全体における上記化合物iの重量分率である。すなわち、平均官能基当量は、多官能性モノマー(b1)として用いられる各化合物の官能基当量と、多官能性モノマー(b1)全体における該化合物の重量分率との積の総和として求められる。
いくつかの態様では、多官能性モノマー(b1)として、2官能以上の多官能(メタ)アクリレートを使用する。多官能(メタ)アクリレートの例としては、エチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、ペンタエリスリトールジ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、1,12-ドデカンジオールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、テトラメチロールメタントリ(メタ)アクリレート、エポキシアクリレート、ポリエステルアクリレート、ウレタンアクリレート等が挙げられる。多官能(メタ)アクリレートは、1種を単独でまたは2種以上を組み合わせて使用することができる。多官能(メタ)アクリレートと他の多官能性モノマーとを組み合わせて使用してもよい。
なお、多官能(メタ)アクリレートの1分子あたりの反応性官能基(f2)の数とは、多官能性モノマーとして1種類の多官能(メタ)アクリレートのみを使用する態様では、該多官能(メタ)アクリレート1分子に含まれる反応性官能基(f2)の数を意味し、1分子あたりの反応性官能基(f2)が異なる2種以上の多官能(メタ)アクリレートを使用する態様では、各多官能(メタ)アクリレートが1分子内に有する反応性官能基(f2)の数と、使用される多官能(メタ)アクリレート全体における該多官能(メタ)アクリレートの重量分率との積の総和として求められる数をいう。
いくつかの態様では、多官能性モノマー(b1)として、2官能以上の多官能イソシアネート化合物を好ましく使用し得る。多官能イソシアネート化合物の具体例は、イソシアネート系架橋剤として例示したものと同様であるので、重複する説明は省略する。
なお、多官能イソシアネート化合物の1分子あたりの反応性官能基(f2)の数とは、多官能性モノマーとして1種類の多官能イソシアネート化合物のみを使用する態様では、該多官能イソシアネート化合物1分子に含まれる反応性官能基(f2)の数を意味し、1分子あたりの反応性官能基(f2)が異なる2種以上の多官能イソシアネート化合物を使用する態様では、各多官能イソシアネート化合物が1分子内に有する反応性官能基(f2)の数と、使用される多官能イソシアネート化合物全体における該多官能イソシアネート化合物の重量分率との積の総和として求められる数をいう。
第2材料は、第2網目を構成に用いられるモノマーとして、多官能性モノマー(b1)に加えて単官能性モノマー(b1)を含んでいてもよい。単官能性モノマー(b1)は、例えば、樹脂フィルムの破断時伸びの向上、柔軟性や低温性の付与、被着体への密着性の向上、等の目的で用いられ得る。単官能性モノマー(b2)は、1種を単独でまたは2種以上を適宜組み合わせて用いることができる。
上述した多官能性モノマー(b1)の平均官能基数(Σ(Ni×Wi))のとり得る値および好適範囲は、第2材料に含まれる全モノマー(多官能性モノマー(b1)を含み、さらに単官能性モノマー(b1)を含み得る。)の平均官能基数Aにも適用され得る。ここで、第2材料に含まれる全モノマーの平均官能基数Aは、下記式:
平均官能基数A=Σ(N’i×W’i);
により算出される。上記式において、N’iは、第2材料においてモノマーとして用いられる化合物iが1分子内に有する反応性官能基(f2)の数であり、W’iは、第2材料に含まれる全モノマーにおける上記化合物iの重量分率である。第2材料に含まれるモノマーが1種または2種以上の多官能性モノマー(b1)のみである場合、Σ(Ni×Wi)とΣ(N’i×W’i)とは一致する。
平均分子量C=Σ(M’i×W’i);
により算出される。上記式において、N’iは、第2材料においてモノマーとして用いられる化合物iが1分子内に有する反応性官能基(f2)の数であり、W’iは、第2材料に含まれる全モノマーにおける上記化合物iの重量分率である。第2材料に含まれるモノマーが1種または2種以上の多官能性モノマー(b1)のみである場合、Σ(Ni×Wi)とΣ(N’i×W’i)とは一致する。
平均官能基当量E=Σ((M’i/N’i)×W’i);
により算出される。上記式において、M’iは、第2材料においてモノマーとして用いられる化合物iの分子量であり、N’iは、該化合物iが1分子内に有する反応性官能基(f2)の数であり、W’iは、第2材料に含まれる全モノマーにおける上記化合物iの重量分率である。第2材料に含まれるモノマーが1種または2種以上の多官能性モノマー(b1)のみである場合、Σ((Mi/Ni)×Wi)とΣ((M’i/N’i)×W’i)とは一致する。
ここに開示される樹脂フィルムのいくつかの好ましい態様では、第2材料に含まれる全モノマーの平均官能基数Aと、上記全モノマーの上記ポリマー(a1)100重量部に対する使用部数B[重量部]と、上記全モノマーの平均分子量Cと、第1材料に含まれるポリマー(a1)の重量平均分子量Dと、に基づいて以下の式(1)により算出される組成数値Y1が0.20以上0.85以下である。
Y1=[(AB/C)/D]×107 (1)
Y2=[(AB/C)/D’]×107 (2)
ポリマー(a1)がポリエステル系ポリマーである態様において、組成数値Y2が6.0以上7.0以下の範囲となるようにA,B,C,D’を設定することにより、しなやかで強靭な(例えば、応力積分値が10MPaより大きい)樹脂フィルムを好ましく実現することができる。
以下、ここに開示される樹脂フィルムまたは該樹脂フィルムの形成に用いられる樹脂組成物に用いられる任意成分について説明する。
いくつかの態様において、上述した第1材料、第2材料の一方または両方の硬化は、光照射により行われ得る。かかる態様では、光照射による硬化を促進するために、必要に応じて光開始剤が用いられ得る。光開始剤としては、ポリマー(a1)の合成に使用し得るものとして例示した光重合開始剤と同様、ケタール系光重合開始剤、アセトフェノン系光重合開始剤、ベンゾインエーテル系光重合開始剤、アシルホスフィンオキサイド系光重合開始剤、α-ケトール系光重合開始剤、芳香族スルホニルクロリド系光重合開始剤、光活性オキシム系光重合開始剤、ベンゾイン系光重合開始剤、ベンジル系光重合開始剤、ベンゾフェノン系光重合開始剤、チオキサントン系光重合開始剤等を用いることができる。光重合開始剤は、1種を単独でまたは2種以上を適宜組み合わせて用いることができる。
アセトフェノン系光重合開始剤の具体例には、1-ヒドロキシシクロヘキシル-フェニル-ケトン、4-フェノキシジクロロアセトフェノン、4-t-ブチル-ジクロロアセトフェノン、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン、メトキシアセトフェノン等が含まれる。
ベンゾインエーテル系光重合開始剤の具体例には、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインプロピルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル等のベンゾインエーテルおよびアニソールメチルエーテル等の置換ベンゾインエーテルが含まれる。
アシルホスフィンオキサイド系光重合開始剤の具体例には、ビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキシド、ビス(2,4,6-トリメチルベンゾイル)-2,4-ジ-n-ブトキシフェニルホスフィンオキシド、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキシド、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド等が含まれる。
α-ケトール系光重合開始剤の具体例には、2-メチル-2-ヒドロキシプロピオフェノン、1-[4-(2-ヒドロキシエチル)フェニル]-2-メチルプロパン-1-オン等が含まれる。芳香族スルホニルクロリド系光重合開始剤の具体例には、2-ナフタレンスルホニルクロライド等が含まれる。光活性オキシム系光重合開始剤の具体例には、1-フェニル-1,1-プロパンジオン-2-(o-エトキシカルボニル)-オキシム等が含まれる。ベンゾイン系光重合開始剤の具体例にはベンゾイン等が含まれる。ベンジル系光重合開始剤の具体例にはベンジル等が含まれる。
ベンゾフェノン系光重合開始剤の具体例には、ベンゾフェノン、ベンゾイル安息香酸、3,3’-ジメチル-4-メトキシベンゾフェノン、ポリビニルベンゾフェノン、α-ヒドロキシシクロヘキシルフェニルケトン等が含まれる。
チオキサントン系光重合開始剤の具体例には、チオキサントン、2-クロロチオキサントン、2-メチルチオキサントン、2,4-ジメチルチオキサントン、イソプロピルチオキサントン、2,4-ジクロロチオキサントン、2,4-ジエチルチオキサントン、イソプロピルチオキサントン、2,4-ジイソプロピルチオキサントン、ドデシルチオキサントン等が含まれる。
第1材料の硬化に架橋剤を用いる態様において、架橋反応をより効果的に進行させるために、架橋触媒を用いてもよい。架橋触媒としては、有機金属錯体(キレート)、金属とアルコキシ基との化合物、および金属とアシルオキシ基との化合物等の有機金属化合物;ならびに第三級アミン等が挙げられる。特に、常温の溶液状態での架橋反応の進行を抑制して、ここに開示される樹脂フィルムの形成に用いられる樹脂組成物のポットライフを確保する観点から、有機金属化合物が好ましい。また、樹脂フィルムの厚み方向全体にわたって均一な架橋構造を導入しやすいことから、架橋促進剤としては常温で液体である有機金属化合物が好ましい。
ここに開示される樹脂フィルムの形成に用いられる樹脂組成物には、所望により、架橋遅延剤として、ケト-エノール互変異性を生じる化合物を含有させることができる。例えば、イソシアネート系架橋剤(多官能イソシアネート化合物)を含む樹脂組成物において、ケト-エノール互変異性を生じる化合物を好ましく使用し得る。これにより、樹脂組成物のポットライフを延長する効果が発揮され得る。
ケト-エノール互変異性を生じる化合物としては、各種のβ-ジカルボニル化合物を用いることができる。具体例としては、アセチルアセトン、2,4-ヘキサンジオン等のβ-ジケトン類;アセト酢酸メチル、アセト酢酸エチル等のアセト酢酸エステル類;プロピオニル酢酸エチル等のプロピオニル酢酸エステル類;イソブチリル酢酸エチル等のイソブチリル酢酸エステル類;マロン酸メチル、マロン酸エチル等のマロン酸エステル類;等が挙げられる。なかでも好適な化合物として、アセチルアセトンおよびアセト酢酸エステル類が挙げられる。ケト-エノール互変異性を生じる化合物は、1種を単独でまたは2種以上を組み合わせて用いることができる。
ケト-エノール互変異性を生じる化合物の使用量は、ポリマー(a1)100重量部に対して、例えば50重量部以下、好ましくは35重量部以下、より好ましくは25重量部以下とすることができ、また、例えば0.1重量部以上、好ましくは0.5重量部以上、より好ましくは1重量部以上とすることができる。
ここに開示される樹脂フィルムまたは該樹脂フィルムの形成に用いられる樹脂組成物は、必要に応じて、粘着付与樹脂(例えば、ロジン系、石油系、テルペン系、フェノール系、ケトン系等の粘着付与樹脂)、粘度調整剤(例えば増粘剤)、レベリング剤、可塑剤、充填剤、顔料や染料等の着色剤、安定剤、防腐剤、老化防止剤、帯電防止剤、充填材、スリップ剤、アンチブロッキング剤等の、粘着剤または粘着シート用樹脂フィルムの分野において一般的な各種の添加剤を、その他の任意成分として含み得る。このような各種添加剤については、従来公知のものを常法により使用することができ、特に本発明を特徴づけるものではないので、詳細な説明は省略する。
ここに開示される樹脂フィルム形成に使用される樹脂組成物の形態は特に限定されず、例えば、有機溶媒中に樹脂フィルム形成成分を含む形態の溶剤型樹脂組成物、樹脂フィルム形成成分が水に分散した形態の水分散型樹脂組成物、光(例えばUV)照射により硬化することで液状から粘弾性体に変化する光硬化型樹脂組成物等の、従来公知の種々の形態であり得る。樹脂組成物の調製容易性や樹脂フィルムの形成容易性等の観点から、いくつかの態様において溶剤型樹脂組成物を好ましく採用し得る。
ここに開示される樹脂フィルムを粘着剤層として含む粘着シートの一構成例を図1に示す。この粘着シート1は、粘着性の樹脂フィルム(粘着剤層)10からなる基材レス両面粘着シートである。使用前(被着体への貼付け前)の粘着シート1は、例えば図1に示すように、粘着剤層10の各面10A,10Bが少なくとも該粘着剤層側が剥離性表面(剥離面)となっている剥離ライナー31,32で保護された、剥離ライナー付き粘着シート50の形態であり得る。あるいは、剥離ライナー31の背面(粘着剤側とは反対側の表面)が剥離面となっており、剥離ライナー31の背面に粘着面10Bが当接するように巻回または積層されることで粘着面10A,10Bが保護された形態であってもよい。
ここに開示される樹脂フィルムを、基材付き粘着シート(基材付き片面粘着シートおよび基材付き両面粘着シートを包含する。以下、特記しない場合は同様の意味である。)を構成する粘着剤層として利用する場合、上記基材付き粘着シートにおける基材の材質は特に限定されず、粘着シートの使用目的や使用態様等に応じて適宜選択することができる。使用し得る基材の非限定的な例としては、ポリプロピレンやエチレン-プロピレン共重合体等のポリオレフィンを主成分とするポリオレフィンフィルム、ポリエチレンテレフタレートやポリブチレンテレフタレート等のポリエステルを主成分とするポリエステルフィルム、ポリ塩化ビニルを主成分とするポリ塩化ビニルフィルム等のプラスチックフィルム;ポリウレタンフォーム、ポリエチレンフォーム、ポリクロロプレンフォーム等の発泡体からなる発泡体シート;各種の繊維状物質(麻、綿等の天然繊維、ポリエステル、ビニロン等の合成繊維、アセテート等の半合成繊維等であり得る。)の単独または混紡等による織布および不織布;和紙、上質紙、クラフト紙、クレープ紙等の紙類;アルミニウム箔、銅箔等の金属箔;等が挙げられる。これらを複合した構成の基材であってもよい。このような複合構造の基材の例として、例えば、金属層(例えば、金属箔や、連続または不連続の金属スパッタ層、金属蒸着層、金属メッキ層等)や金属酸化物層と上記プラスチックフィルムとが積層した構造の基材、ガラスクロス等の無機繊維で強化されたプラスチックフィルム等が挙げられる。
この明細書により提供される樹脂フィルムは、しなやかで強靭であるという特長を活かして、上述のように、粘着シートまたはその構成要素(基材フィルム等)として好ましく用いられ得る。
例えば、いくつかの態様に係る樹脂フィルムは、応力積分値が大きいことから、粘着シートの粘着面を構成する粘着剤層として用いられることにより、被着体からの剥離界面に生じる糸曳き現象において該糸がしなやかで強靭なものとなり得る。したがって、高い剥離強度と良好な非糊残り性との両立に適している。
また、このように応力分散性に優れることにより、粘着シートの用途に応じて粘着剤層を比較的硬く、例えば、25℃における貯蔵弾性率が1MPa以上、さらには5MPa以上となるように設計しても、これにより粘着剤層が脆くなることが抑制される。そのため、上記のように硬い粘着剤層を有する粘着シートの加工時等において、該粘着剤層の欠損(糊欠け)が生じにくいものとなり得る。粘着剤層の25℃における貯蔵弾性率の上限は、特に制限されず、例えば10MPa以下であり得る。なお、粘着剤層の25℃における貯蔵弾性率は、測定対象の粘着剤層からなる厚さ約1.5mmのシート(上記粘着剤層を必要に応じて重ね合わせることにより作製する。)を直径7.9mmの円盤状に打ち抜いて測定試料を作製し、この測定試料をパラレルプレートで挟み込み、粘弾性試験機(例えば、ティー・エー・インスツルメント社製、ARESまたはその相当品)を用いて周波数1Hzのせん断歪みを与えながら、温度領域-70~150℃、昇温速度5℃/分で、せん断モードにより動的粘弾性測定を行うことにより求められる。
〔1〕 25℃において引張速度300mm/分の条件で破断するまで一軸延伸したときの応力積分の値が10MPaより大きく1000MPa以下である、樹脂フィルム。
〔2〕 25℃において引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びが100%以上5000%以下(好ましくは300%以上4500%以下)である、上記〔1〕に記載の樹脂フィルム。
〔3〕 25℃において下記試験により得られるヒステリシスが1.2以上20以下(好ましくは1.2より大きく20以下)である、上記〔1〕に記載の樹脂フィルム。
[試験方法]
(1)破断時伸び測定用のサンプルAと、ヒステリシス測定用のサンプルBとを用意する。
(2)25℃において上記サンプルAを引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びX[%]を求める。
(3)25℃において、上記サンプルBを、引張速度300mm/分の条件で初期のチャック間長さから0.7X[%]まで一軸延伸する1サイクル目の延伸を行い、延伸終点で1秒保持した後、引き戻し速度300mm/分の条件で上記初期のチャック間長さまで引き戻して10秒間保持する。次いで、上記サンプルBを、引張速度300mm/分の条件で上記初期のチャック間長さから0.8X[%]まで一軸延伸する2サイクル目の延伸を行い、延伸終点で1秒保持した後、引き戻し速度300mm/分の条件で上記初期のチャック間長さまで引き戻して10秒間保持する。
(4)上記1サイクル目の延伸において上記サンプルBを(0.7X-40)%の長さまで伸長したときの応力S1[MPa]と、上記2サイクル目の延伸において上記サンプルBを(0.7X-40)%の長さまで伸長したときの応力S2[MPa]とから、S1/S2を算出し、この値をヒステリシスとする。
〔4〕 25℃において、下記ネッキング試験に基づく比(Wmin/Wmax)が0より大きく0.90以下となるネッキング挙動を示す、上記〔1〕に記載の樹脂フィルム。
[ネッキング試験]
(1)破断時伸び測定用のサンプルAと、ネッキング測定用のサンプルCとを用意する。
(2)25℃において前記サンプルAを引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びX[%]を求める。
(3)25℃において、前記サンプルCを、引張速度300mm/分の条件で初期のチャック間長さから0.5X[%]まで一軸延伸する。延伸終点において、延伸終了から1秒以内に、延伸されたサンプルの写真をデジタルカメラで撮影する。撮影は、サンプルの延伸方向と直交する方向から行う。
(4)延伸されたサンプルの両端からそれぞれ20%を除いた中央60%の範囲について、サンプルの最小の横幅Wminおよび最大の横幅Wmaxを画像のピクセル数で計測し、それらの比(Wmin/Wmax)を算出する。
〔5〕 以下の条件(I)~(IV)のうち少なくとも1つ(好ましくは2つ以上、より好ましくは3つ以上)を満たす、樹脂フィルム。
(I) 25℃において引張速度300mm/分の条件で破断するまで一軸延伸したときの応力積分の値が10MPaより大きく1000MPa以下である。
(II) 25℃において引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びが100%以上5000%以下(好ましくは300%以上4500%以下、例えば300%以上2400%以下)である。
(III) 25℃において、上記〔3〕に記載の試験により得られるヒステリシスが1.2以上20以下(好ましくは1.2より大きく20以下、例えば1.4より大きく20以下)である。
(IV) 25℃において、上記〔4〕に記載のネッキング試験に基づく比(Wmin/Wmax)が0より大きく0.90以下となるネッキング挙動を示す。
〔7〕 上記第1網目は第1材料の硬化物であり、上記第1材料は、反応性官能基(f1)を有するポリマー(a1)を含み、
上記第2網目は第2材料の硬化物であり、上記第2材料は、反応性官能基(f2)を1分子内に2つ以上有する多官能性モノマー(b1)を含む、上記〔6〕に記載の樹脂フィルム。
〔9〕 上記ポリマー(a1)の重量平均分子量は80×104以上である、上記〔8〕に記載の樹脂フィルム。
〔10〕 上記第2材料に含まれる全モノマーの平均官能基数Aと、上記全モノマーの上記ポリマー(a1)100重量部に対する使用部数B[重量部]と、上記全モノマーの平均分子量Cと、上記ポリマー(a1)の重量平均分子量Dと、に基づいて以下の式(1)により算出される組成数値Y1:
Y1=[(AB/C)/D]×107 (1);
が0.20以上0.85以下である、上記〔7〕または〔8〕に記載の樹脂フィルム。
〔12〕 上記第2材料に含まれる全モノマーの平均官能基数Aと、上記全モノマーの上記ポリマー(a1)100重量部に対する使用部数B[重量部]と、上記全モノマーの重量平均分子量Cと、前記ポリマー(a1)の数平均分子量D’と、に基づいて以下の式(2)により算出される組成数値Y2:
Y2=[(AB/C)/D’]×107 (2);
が6.0以上7.0以下である、上記〔11〕に記載の樹脂フィルム。
〔14〕 上記〔1〕~〔12〕のいずれかに記載の樹脂フィルムを形成するために用いられる、樹脂組成物。
(アクリル系ポリマーP1)
冷却管、窒素導入管、温度計、攪拌機を備えた反応器に、酢酸エチル100部、アクリル酸ブチル(BA)95部、アクリル酸(AA)5部の混合溶液を仕込み、窒素ガスで装置内の空気を置換し、酸素不含としながら、内温を65℃に昇温したのち、アゾビスイソブチロニトリル(AIBN)0.3部を酢酸エチル10部に溶かした溶液を全量添加した。その後、内温65℃で6時間保温し、重合を完結し、アクリル系ポリマーP1の溶液を得た。重量平均分子量(GPC、ポリスチレン換算)は100×104であった。
冷却管、窒素導入管、温度計、攪拌機を備えた反応器に、酢酸エチル100部、BA95部、AA5部の混合溶液を仕込み、窒素ガスで装置内の空気を置換し、酸素不含としながら、内温を70℃に昇温したのち、AIBN0.03部を酢酸エチル10部に溶かした溶液を全量添加した。その後、内温69~71℃で6時間保温し、重合を完結し、アクリルポリマーP2の溶液を得た。重量平均分子量(GPC、ポリスチレン換算)は160×104であった。
冷却管、窒素導入管、温度計、攪拌機を備えた反応器に、酢酸エチル100部、アクリル酸メチル(以下MAという)95部、AA5部の混合溶液を仕込み、窒素ガスで装置内の空気を置換し、酸素不含としながら、内温を70℃に昇温したのち、AIBN0.3部を酢酸エチル10部に溶かした溶液を全量添加した。その後、内温69~71℃で6時間保温し、重合を完結し、アクリルポリマーP3の溶液を得た。重量平均分子量(GPC、ポリスチレン換算)は100×104であった。
(例1)
アクリル系ポリマーP1の溶液に、該溶液に含まれるアクリルポリマーP1の100部あたり、エポキシ系架橋剤(商品名「TETRAD-C」、三菱ガス化学社製)0.03部、多官能性モノマーとしてポリプロピレングリコール#400ジアクリレート(商品名「APG-400」、新中村化学工業(株)製、分子量536、官能基数2)21部、および光開始剤(商品名「オムニラッド651」、IGM Resins社製)0.4部を加え、均一に混合して樹脂組成物を調製した。
この樹脂組成物を、シリコーン剥離処理した厚さ38μmのポリエチレンテレフタレート(PET)フィルム(商品名「MRF38」、三菱ケミカル社製;以下、「剥離フィルムR1」ともいう。)の剥離処理面に、乾燥後の厚さが25μmとなるように塗布し、120℃で2分間乾燥させた。これをシリコーン剥離処理した38μmのPETフィルム(商品名「MRE38」、三菱ケミカル社製;以下、「剥離フィルムR2」ともいう。)の剥離処理面に貼り合わせ、40℃で3日間のエージングを行った後、UV照射機(日東精機社製 UM-810)を用いて3000mJ/cm2の照射量でUV処理した。このようにして、本例に係る樹脂フィルム(粘着剤層)を含む積層体を得た。この積層体は、剥離フィルムR1/粘着剤層(基材レス粘着シート)/剥離フィルムR2の積層構造を有する(例2~7、9~12において同じ。)。
多官能性モノマーの種類および使用量をポリプロピレングリコール#700ジアクリレート(商品名「APG-700」、新中村化学工業社製、分子量796、官能基数2)22部に変えた他は例1と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、上記樹脂フィルム(粘着剤層)を含む積層体を得た。
アクリル系ポリマーP1の溶液をアクリル系ポリマーP2の溶液に変更し、かつアクリル系ポリマー100部に対するAPG-700の使用量を22部から16部に変更した他は例2と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、該樹脂フィルム(粘着剤層)を含む積層体を得た。
APG-700の使用量を15部とし、さらにアクリル酸2-メトキシエチル(分子量130、官能基数1;以下「MEA」と表記)を5部加えた他は例2と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、上記樹脂フィルム(粘着剤層)を含む積層体を得た。上記樹脂組成物において、第2材料に含まれる全モノマー(すなわち、APG-700およびMEA)の合計使用部数Bは20部であり、平均官能基数Aは1.75、平均分子量Cは630、平均官能基当量は331である。
アクリル系ポリマーP1の溶液に、該溶液に含まれるアクリルポリマーP1の100部あたり、TETRAD-Cを0.03部、多官能性モノマーとしてポリイソシアネート化合物(商品名「コロネートL」、東ソー社製、分子量672、官能基数3)を10部加え、均一に混合して樹脂組成物を調製した。
この樹脂組成物を、剥離フィルムR1の剥離処理面に、乾燥後の厚さが25μmとなるように塗布し、80℃で5分間乾燥させた。これを剥離フィルムR2の剥離処理面に貼り合わせ、40℃で3日間のエージングを行って、本例に係る樹脂フィルム(粘着剤層)を含む積層体を得た。
アクリル系ポリマーP1の溶液をアクリル系ポリマーP2の溶液に変更した他は例5と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、該樹脂フィルム(粘着剤層)を含む積層体を得た。
コロネートLの使用量を10部から8部に変更した他は例6と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、該樹脂フィルム(粘着剤層)を含む積層体を得た。
アクリル系ポリマーP1の溶液に、該溶液に含まれるアクリルポリマーP3の100部に対し、TETRAD-Cを0.03部、コロネートLを10部加え、均一に混合して樹脂組成物を調製した。
この樹脂組成物を、剥離フィルムR1の片面に、乾燥後の厚みが10μmとなるように塗布し、80℃で5分間乾燥させた後、その片面に、下記例9で作製した積層体から剥離フィルムR2を除去して露出した粘着剤層(すなわち、例9の粘着剤層)を貼り合わせた。その後、25℃で72時間保存して、上記樹脂組成物から形成された樹脂フィルム(基材フィルム)および例9の粘着剤層からなる基材付き片面粘着シートを含む積層体を得た。この積層体は、剥離フィルムR1/基材フィルム/粘着剤層/剥離フィルムR1の積層構造を有する。
APG-400の使用量を21部から5部に変更した他は例1と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、該樹脂フィルム(粘着剤層)を含む積層体を得た。
APG-400の使用量を21部から30部に変更した他は例1と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、該樹脂フィルム(粘着剤層)を含む積層体を得た。
ポリエステル樹脂(商品名「バイロンBX-1001」、東洋紡社製、数平均分子量28000;以下、ポリエステル系ポリマーP4ともいう。)の酢酸エチル溶液に、該溶液の固形分100部に対して、架橋触媒としてジルコニウムテトラアセチルアセトナート(商品名「オルガチックスZC-162」)を0.066部、多官能性モノマーとしてコロネートLを4部、架橋遅延剤としてアセチルアセトンを20部配合し、均一に混合して樹脂組成物を調製した。
この樹脂組成物を、剥離フィルムR1の剥離処理面に、乾燥後の厚さが25μmとなるように塗布し、150℃で1分間乾燥させた。これを剥離フィルムR2の剥離処理面に貼り合わせて、40℃で3日間のエージングを行って、本例に係る樹脂フィルム(粘着剤層)を含む積層体を得た。
コロネートLの使用量を4部から3部に変更した他は例11と同様にして、樹脂組成物の調製および樹脂フィルムの作製を行い、上記樹脂フィルム(粘着剤層)を含む積層体を得た。
(応力積分値)
各例により得られた積層体を長さ30mm、幅100mmの長方形状に切り出した。次いで、一方の剥離フィルムを除去して粘着剤層の表面を露出させ、他方の剥離フィルム上で粘着剤層(例8では基材付き片面粘着シート)をその長さ方向を軸として巻き取ることにより、長さ30mm、直径約1mm、重さ約0.1g(例8では、サンプル全体の直径が約2mm、重さ約0.07g)の円柱状のサンプルを作製した。上記サンプルの上下各10mmの部分を引張試験機(SHIMAZU製、EZ-S 500N)のチャック冶具で固定し、25℃環境下にて、チャック間長さ10mm、引張速度300mm/minの条件で上記サンプルが破断するまで引っ張り、その間、初期長さ(10mm)からの伸び2.5%ごとに応力値を取得した。得られた伸び[%]/応力[MPa]の曲線から、各伸びにおける応力値をすべて足し合わせたものに2.5を掛けてさらに100で割った値を応力積分値[MPa]とした。得られた応力積分値を、各サンプルの破断時伸びX[%]とともに表1、2に示した。
応力積分値の評価と同様にして円柱状のサンプルを作製し、同様にチャック間長さ10mmで引張試験機(SHIMAZU製、EZ-S 500N)のチャック冶具で固定した。次いで、応力積分値の評価において得られた破断時伸びX[%]に基づいて、まず0.7X[%]まで一軸延伸(1サイクル目の延伸)し、延伸終点で1秒保持した後、チャック間長さ10mmまで引き戻して10秒間保持し、次いで0.8X[%]まで一軸延伸(2サイクル目の延伸)し、延伸終点で1秒保持した後、チャック間長さ10mmまで引き戻すサイクル試験を行った。試験環境は25℃とし、延伸時の引張速度および引き戻し速度はいずれも300mm/minとした。そして、1サイクル目の延伸において0.7X[%]-40%の長さまで伸長したときの応力S1と、2サイクル目の延伸において0.7X[%]-40%の長さまで伸長したときの応力S2とから、応力S2に対する応力S1の比(すなわち、S1/S2)を求め、この値をヒステリシスとした。結果を表1、2に示した。
応力積分値の評価と同様にして円柱状のサンプルを作製し、同様にチャック間長さ10mmで引張試験機(SHIMAZU製、EZ-S 500N)のチャック冶具で固定した。25℃環境下にて、チャック間長さ10mm、引張速度300mm/minの条件で、応力積分値の評価において得られた破断時伸びX[%]に基づいて、上記サンプルを初期のチャック間長さから0.5X[%]まで一軸延伸し、このときサンプルが長手方向に対して不均一に細くなるものはネッキング「あり」、サンプルが長手方向に対して均一に細くなるものはネッキング「なし」と判定した。具体的には、上記0.5X[%]までの延伸の終点において、延伸終了から1秒以内に、延伸されたサンプルの写真をデジタルカメラで撮影した。撮影は、サンプルの延伸方向と直交する方向から行った。得られた画像データにおいて、延伸されたサンプルの両端からそれぞれ20%を除いた中央60%の範囲について、サンプルの最小の横幅Wminおよび最大の横幅Wmaxを画像のピクセル数で計測し、それらの比(Wmin/Wmax)が0より大きく0.90以下の場合はネッキングあり、0.90より大きい場合はネッキングなしと判定した。結果を表1、2に示した。
さらに、例1および例9の粘着シートについて、以下の耐衝撃性試験を行った。
すなわち、粘着シートを横59mm、縦113mm、幅1mmの窓枠状(額縁状)にカットして、窓枠状両面粘着シートを得た。この窓枠状両面粘着シートを用いて、第一のPC板(ポリカーボネート板;横70mm、縦130mm、厚み2mm)と第二のPC板(横59mm、縦113mm、厚み0.55mm)とを、5kgの荷重を10秒間かけて圧着することにより貼り合わせて、評価用サンプルを得た。
これらの評価用サンプルの、第一のPC板の背面(第二のPC板と貼り合わされた面とは反対側の面)に、160gの錘を取り付けた。上記錘付きの評価用サンプルにつき、常温(23℃程度)において、1.2mの高さからコンクリート板に60回自由落下させる落下試験を行った。このとき、上記評価用サンプルの6面が順次下方となるように、落下の向きを調節した。すなわち、6面につきそれぞれ1回の落下パターンを10サイクル行った。そして、1回落下させる毎に、第一のPC板と第二のPC板との接合が維持されているか否を目視で確認し、第一のPC板と第二のPC板とが剥がれる(分離する)までの落下回数を、常温での落下に対する耐衝撃性として評価した。
その結果、例1では60回落下させた後にも剥がれが認められなかったのに対し、例9では30回目の落下により第一のPC板と第二のPC板とが分離した。
10 粘着剤層(粘着性の樹脂フィルム)
10A 一方の表面(粘着面)
10B 他方の表面
20 基材
20A 第一面
20B 第二面(背面)
30,31,32 剥離ライナー
50 剥離ライナー付き粘着シート
110 粘着剤層
110A 一方の表面(粘着面)
110B 他方の表面
120 基材(非粘着性または弱粘着性の樹脂フィルム)
120A 第一面
120B 第二面(背面)
Claims (13)
- 25℃において引張速度300mm/分の条件で破断するまで一軸延伸したときの応力積分の値が10MPaより大きく1000MPa以下である、樹脂フィルム。
- 25℃において引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びが300%以上4500%以下である、請求項1に記載の樹脂フィルム。
- 25℃において下記試験により得られるヒステリシスが1.2以上20以下である、請求項1に記載の樹脂フィルム。
[試験方法]
(1)破断時伸び測定用のサンプルAと、ヒステリシス測定用のサンプルBとを用意する。
(2)25℃において前記サンプルAを引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びX[%]を求める。
(3)25℃において、前記サンプルBを、引張速度300mm/分の条件で初期のチャック間長さから0.7X[%]まで一軸延伸する1サイクル目の延伸を行い、延伸終点で1秒保持した後、引き戻し速度300mm/分の条件で前記初期のチャック間長さまで引き戻して10秒間保持する。次いで、前記サンプルBを、引張速度300mm/分の条件で前記初期のチャック間長さから0.8X[%]まで一軸延伸する2サイクル目の延伸を行い、延伸終点で1秒保持した後、引き戻し速度300mm/分の条件で前記初期のチャック間長さまで引き戻して10秒間保持する。
(4)前記1サイクル目の延伸において前記サンプルBを(0.7X-40)%の長さまで伸長したときの応力S1[MPa]と、前記2サイクル目の延伸において前記サンプルBを(0.7X-40)%の長さまで伸長したときの応力S2[MPa]とから、S1/S2を算出し、この値をヒステリシスとする。 - 25℃において、下記ネッキング試験に基づく比(Wmin/Wmax)が0より大きく0.90以下となるネッキング挙動を示す、請求項1に記載の樹脂フィルム。
[ネッキング試験]
(1)破断時伸び測定用のサンプルAと、ネッキング測定用のサンプルCとを用意する。
(2)25℃において前記サンプルAを引張速度300mm/分の条件で破断するまで一軸延伸したときの破断時伸びX[%]を求める。
(3)25℃において、前記サンプルCを、引張速度300mm/分の条件で初期のチャック間長さから0.5X[%]まで一軸延伸する。延伸終点において、延伸終了から1秒以内に、延伸されたサンプルの写真をデジタルカメラで撮影する。撮影は、サンプルの延伸方向と直交する方向から行う。
(4)延伸されたサンプルの両端からそれぞれ20%を除いた中央60%の範囲について、サンプルの最小の横幅Wminおよび最大の横幅Wmaxを画像のピクセル数で計測し、それらの比(Wmin/Wmax)を算出する。 - 前記樹脂フィルムは、同一層内に共存する第1網目と第2網目とを含み、前記第1網目と前記第2網目とは互いに網目を介して物理的に絡み合っている、請求項1~4のいずれか一項に記載の樹脂フィルム。
- 前記第1網目は第1材料の硬化物であり、前記第1材料は、反応性官能基(f1)を有するポリマー(a1)を含み、
前記第2網目は第2材料の硬化物であり、前記第2材料は、反応性官能基(f2)を1分子内に2つ以上有する多官能性モノマー(b1)を含む、請求項5に記載の樹脂フィルム。 - 前記ポリマー(a1)はアクリル系ポリマーである、請求項6に記載の樹脂フィルム。
- 前記ポリマー(a1)の重量平均分子量は80×104以上である、請求項7に記載の樹脂フィルム。
- 前記第2材料に含まれる全モノマーの平均官能基数Aと、前記全モノマーの前記ポリマー(a1)100重量部に対する使用部数B[重量部]と、前記全モノマーの平均分子量Cと、前記ポリマー(a1)の重量平均分子量Dと、に基づいて以下の式(1)により算出される組成数値Y1:
Y1=[(AB/C)/D]×107 (1);
が0.20以上0.85以下である、請求項7または8に記載の樹脂フィルム。 - 前記ポリマー(a1)はポリエステル系ポリマーである、請求項6に記載の樹脂フィルム。
- 前記第2材料に含まれる全モノマーの平均官能基数Aと、前記全モノマーの前記ポリマー(a1)100重量部に対する使用部数B[重量部]と、前記全モノマーの重量平均分子量Cと、前記ポリマー(a1)の数平均分子量D’と、に基づいて以下の式(2)により算出される組成数値Y2:
Y2=[(AB/C)/D’]×107 (2);
が6.0以上7.0以下である、請求項10に記載の樹脂フィルム。 - 請求項1~11のいずれか一項に記載の樹脂フィルムを含む、粘着シート。
- 請求項1~11のいずれか一項に記載の樹脂フィルムを形成するために用いられる、樹脂組成物。
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JP2016001317A (ja) * | 2008-07-01 | 2016-01-07 | エルジー・ケム・リミテッド | 粘着剤組成物、偏光板及び液晶表示装置 |
WO2018055859A1 (ja) * | 2016-09-20 | 2018-03-29 | リンテック株式会社 | 半導体加工用粘着シート |
WO2019131888A1 (ja) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
JP2020007181A (ja) * | 2018-07-05 | 2020-01-16 | 積水化学工業株式会社 | コンクリート表面保護材 |
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JP2016001317A (ja) * | 2008-07-01 | 2016-01-07 | エルジー・ケム・リミテッド | 粘着剤組成物、偏光板及び液晶表示装置 |
WO2018055859A1 (ja) * | 2016-09-20 | 2018-03-29 | リンテック株式会社 | 半導体加工用粘着シート |
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