WO2022179300A2 - 发热组件、雾化器及电子雾化装置 - Google Patents

发热组件、雾化器及电子雾化装置 Download PDF

Info

Publication number
WO2022179300A2
WO2022179300A2 PCT/CN2021/143267 CN2021143267W WO2022179300A2 WO 2022179300 A2 WO2022179300 A2 WO 2022179300A2 CN 2021143267 W CN2021143267 W CN 2021143267W WO 2022179300 A2 WO2022179300 A2 WO 2022179300A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
base body
heating element
micropores
micro
Prior art date
Application number
PCT/CN2021/143267
Other languages
English (en)
French (fr)
Other versions
WO2022179300A9 (zh
WO2022179300A3 (zh
WO2022179300A8 (zh
Inventor
赵月阳
吕铭
李光辉
张彪
Original Assignee
深圳麦克韦尔科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳麦克韦尔科技有限公司 filed Critical 深圳麦克韦尔科技有限公司
Priority to CN202190000266.XU priority Critical patent/CN220800052U/zh
Priority to PCT/CN2021/143267 priority patent/WO2022179300A2/zh
Priority to EP21927724.1A priority patent/EP4205582A4/en
Priority to CN202211045817.1A priority patent/CN116406859A/zh
Publication of WO2022179300A2 publication Critical patent/WO2022179300A2/zh
Priority to PCT/CN2022/125701 priority patent/WO2023124409A1/zh
Priority to CN202211269081.6A priority patent/CN116406860A/zh
Priority to CN202290000130.3U priority patent/CN220756580U/zh
Publication of WO2022179300A3 publication Critical patent/WO2022179300A3/zh
Priority to CN202211387650.7A priority patent/CN116406861A/zh
Priority to CN202222963660.2U priority patent/CN218921698U/zh
Priority to PCT/CN2022/143581 priority patent/WO2023125850A1/zh
Priority to US18/092,044 priority patent/US20230210183A1/en
Publication of WO2022179300A9 publication Critical patent/WO2022179300A9/zh
Publication of WO2022179300A8 publication Critical patent/WO2022179300A8/zh

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/44—Wicks
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/10—Devices using liquid inhalable precursors
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means

Definitions

  • the present application relates to the technical field of electronic atomization, and in particular, to a heating component, an atomizer and an electronic atomization device.
  • the electronic atomization device is composed of a heating element, a battery and a control circuit.
  • the heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and use experience of the electronic atomization device.
  • the cotton core heating element is mostly a structure in which a spring-shaped metal heating wire is wound around a cotton rope or a fiber rope.
  • the liquid aerosol generation matrix to be atomized is absorbed by both ends of the cotton rope or fiber rope, and then transferred to the central metal heating wire for heating and atomization. Due to the limited end area of the cotton rope or fiber rope, the adsorption and transmission efficiency of the aerosol-generating matrix is low.
  • cotton rope or fiber rope has poor structural stability, and is prone to dry burning, carbon deposition and burnt smell after multiple thermal cycles.
  • Another existing heating element is a ceramic heating element.
  • Most of the ceramic heating elements form a metal heating film on the surface of the porous ceramic body; the porous ceramic body plays the role of conducting liquid and storing liquid, and the metal heating film realizes the heating and atomization of the liquid aerosol-generating matrix.
  • it is difficult to precisely control the location distribution and dimensional accuracy of micropores for porous ceramics prepared by high temperature sintering.
  • it is necessary to reduce the pore size and porosity, but in order to achieve sufficient liquid supply, it is necessary to increase the pore size and porosity, which are contradictory to each other.
  • the liquid conductivity of the porous ceramic matrix is limited, and a burnt smell will appear under high power conditions.
  • a thin heating body is provided to improve the liquid supply capacity, but this thin heating body is easy to Bubbles are formed on the suction surface, blocking the liquid inlet, resulting in dry burning of the heating element.
  • the heating assembly, atomizer and electronic atomization device provided by the present application solve the technical problem that the thin heating body easily forms bubbles on the liquid absorbing surface in the prior art.
  • the first technical solution provided by the present application is to provide a heating component, including a first base body and a second base body; the first base body has a first surface and a second surface arranged opposite to each other, so the first surface is a liquid-absorbing surface; the first substrate has a plurality of first micropores, and the first micropores are used to guide the aerosol-generating substrate from the liquid-absorbing surface to the second surface;
  • the second substrate has a third surface and a fourth surface arranged oppositely, and the fourth surface is an atomized surface; the second surface is arranged opposite to the third surface; the second substrate is a dense substrate,
  • the second substrate is provided with a plurality of second micropores penetrating the third surface and the fourth surface, and the second micropores are used to guide the aerosol-generating substrate from the third surface. lead to the atomization surface; wherein, the first base body and/or the second base body form a flow channel, and the flow channel communicates with the first micropore
  • a gap is formed between the second surface and the third surface, and the gap serves as the flow channel.
  • the heating component further includes a spacer; the spacer is arranged between the second surface and the third surface, and is located at the edge of the first base and/or the second base, so that the The first base body and the second base body are spaced apart to form the gap.
  • the spacer is an independent gasket; or, the spacer is a support column or a support frame fixed on the second surface and/or the third surface; or, the spacer is a
  • the first base body and/or the second base body are integrally formed protrusions.
  • the heating component further includes a sealing member, and the sealing member has a lower liquid hole; a fixing structure is arranged on the hole wall of the lower liquid hole to fix the first base body and/or the second base body, The gap is formed by arranging the first base body and the second base body at intervals.
  • the heights of the gaps are the same.
  • the height of the gap gradually increases.
  • the height of the gap gradually increases from zero.
  • the heating component further includes a plurality of micro-pillars, and the plurality of the micro-pillars are arranged in the gap.
  • one end of the micro-pillar is in contact with the second surface, and the other end of the micro-pillar is spaced from the third surface; or, one end of the micro-pillar is in contact with the third surface, The other end of the micro-pillar is spaced from the second surface; or, one end of the micro-pillar is in abutment with the second surface, and the other end of the micro-pillar is in abutment with the third surface.
  • the third surface is provided with a plurality of first grooves extending along a first direction and a plurality of second grooves extending along a second direction, and the first grooves and the second grooves are arranged intersecting ; A plurality of the first grooves and a plurality of the second grooves form the flow channel.
  • each of the first grooves corresponds to one or more rows of the second microholes
  • each of the second grooves corresponds to one or more columns of the first Two micropores.
  • the ratio of the depth to the width of the first groove is 0-20, and the ratio of the depth to the width of the second groove is 0-20.
  • the second surface is provided with a plurality of third grooves extending along the third direction and a plurality of fourth grooves extending along the fourth direction, and the third grooves and the fourth grooves are arranged intersecting ;
  • a plurality of the first grooves, a plurality of the second grooves, a plurality of the third grooves and a plurality of the fourth grooves together form the flow channel.
  • the first matrix is a dense matrix
  • the first micropores penetrate through the first surface and the second surface; a plurality of the first micropores are distributed in an array, and each of the third grooves Corresponding to one or more rows of the first micro-holes, each of the fourth grooves corresponds to one or more columns of the first micro-holes.
  • the ratio of the depth to the width of the third groove is 0-20, and the ratio of the depth to the width of the fourth groove is 0-20.
  • the capillary force of the first groove and the second groove is greater than the capillary force of the third groove and the fourth groove.
  • the second surface and the third surface are spaced apart to form a gap.
  • the second surface is in contact with the third surface.
  • the depth of the first groove and the depth of the second groove are greater than the depth of the third groove and the depth of the fourth groove.
  • the central axis of the second micro-hole is perpendicular to the third surface.
  • the thickness of the second substrate is 0.1 mm-1 mm, and the diameter of the second micropores is 1 ⁇ m-100 ⁇ m.
  • the ratio of the thickness of the second matrix to the diameter of the second micropores is 20:1-3:1.
  • the ratio of the hole center distance of the adjacent second micro holes to the pore diameter of the second micro holes is 3:1-5:1.
  • the first matrix is a dense matrix, and the first micropores penetrate through the first surface and the second surface.
  • the capillary force of the second micropore is greater than the capillary force of the first micropore.
  • the diameter of the first micropore gradually increases; the constriction opening of the first micropore is located on the first surface, and the expansion opening of the first micropore is located on the first surface.
  • Second surface Second surface.
  • the projection of the region where the first micro-holes are arranged on the first substrate on the second substrate completely covers the region where the second micro-holes are arranged on the second substrate.
  • the pore diameter of the first micropores is 1 ⁇ m-100 ⁇ m.
  • the thickness of the first base body is smaller than the thickness of the second base body.
  • the heating component further includes a heating element, and the heating element is an independent element disposed on the atomizing surface; or, the second substrate has a conductive function.
  • the projection of the first substrate on the atomizing surface completely covers the heating element.
  • the second technical solution provided by the present application is: to provide a heating component, including a first base body and a second base body; the first base body has a first surface and a second surface arranged oppositely, so the first surface is a liquid-absorbing surface; the first substrate has a plurality of first micropores, the first micropores are used to guide the aerosol-generating substrate from the liquid-absorbing surface to the second surface;
  • the second substrate has a third surface and a fourth surface arranged oppositely, and the fourth surface is an atomized surface; the second surface is arranged opposite to the third surface; the second substrate has a plurality of second surfaces micropores, the second micropores for guiding the aerosol-generating matrix from the third surface to the atomizing surface; wherein the first matrix and/or the second matrix form a flow
  • the flow channel communicates with the first micropore and the second micropore.
  • the third technical solution provided by the present application is to provide an atomizer, which includes a liquid storage chamber and a heating element; the liquid storage chamber is used for storing an aerosol generating substrate; the heating element is combined with The liquid storage chamber is in fluid communication, and the heating component is used for atomizing the aerosol generating substrate; the heating component is the heating component described in any one of the above.
  • the fourth technical solution provided by the present application is to provide an electronic atomization device, including an atomizer and a main unit; the atomizer is the above-mentioned atomizer; It is used to provide electrical energy for the operation of the atomizer and to control the heating element to atomize the aerosol-generating substrate.
  • the heating component includes a first base body and a second base body; the first base body has a first surface and a second surface arranged oppositely, and the first surface is a liquid absorbing surface;
  • the first substrate has a plurality of first micropores, and the first micropores are used to guide the aerosol-generating substrate from the liquid-absorbing surface to the second surface;
  • the second substrate has a third surface and a fourth surface arranged oppositely, and the fourth surface is The surface is an atomized surface;
  • the second surface is arranged opposite to the third surface;
  • the second substrate is a dense substrate, and the second substrate is provided with a plurality of second micropores penetrating the third surface and the fourth surface, and the second micropores are used for In order to guide the aerosol-generating substrate from the third surface to the atomizing surface; wherein, the first substrate and/or the second substrate form a flow channel, the flow channel is connected with the first micropore and the second micropore, and the
  • FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application.
  • FIG. 2 is a schematic structural diagram of an atomizer provided by an embodiment of the present application.
  • FIG. 3a is a schematic structural diagram of the first embodiment of the heating assembly provided by the present application.
  • Figure 3b is a schematic structural diagram of the second substrate in the heating assembly provided in Figure 3a viewed from the side of the atomizing surface;
  • Fig. 3c is a schematic structural diagram of the first substrate in the heating assembly provided in Fig. 3a viewed from the liquid-absorbing surface side;
  • Figure 3d is a schematic structural diagram of another embodiment of the spacer in the heating assembly provided in Figure 3a;
  • FIG. 4 is a schematic structural diagram of a second embodiment of a heating assembly provided by the present application.
  • 5a is a schematic structural diagram of another embodiment of the sealing member in the second embodiment of the heating assembly provided by the present application.
  • Fig. 5b is a schematic diagram of the assembly structure of the seal provided in Fig. 5a, the first dense matrix, and the second matrix;
  • 6a is a schematic structural diagram of another embodiment of the sealing member in the second embodiment of the heating assembly provided by the present application.
  • Fig. 6b is a schematic diagram of the assembly structure of the seal provided in Fig. 6a, the first dense matrix, and the second matrix;
  • FIG. 7a is a schematic structural diagram of a third embodiment of a heating assembly provided by the present application.
  • Fig. 7b is a partial structural schematic diagram of the second substrate in the heating assembly provided in Fig. 7a viewed from the third surface side;
  • Fig. 7c is a partial structural schematic diagram of the first substrate in the heating assembly provided in Fig. 7a viewed from the side of the second surface;
  • FIG 8 is another schematic structural diagram of the third embodiment of the heating assembly provided by the present application.
  • 9a is a schematic top view of the structure of the fourth embodiment of the heating assembly provided by the present application.
  • Figure 9b is a schematic cross-sectional view of the heating assembly provided in Figure 9a along the B-B direction;
  • Figure 9c is a schematic cross-sectional view of the heating assembly provided in Figure 9a along the C-C direction;
  • 9d is a schematic structural diagram of another embodiment of the liquid inlet in the fourth embodiment of the heating assembly provided by the present application.
  • 9e is a schematic structural diagram of another embodiment of the liquid inlet in the fourth embodiment of the heating assembly provided by the present application.
  • 10a is a schematic top view of the structure of the fifth embodiment of the heating element provided by the present application.
  • 10b is a schematic structural diagram of another embodiment of the liquid inlet in the fifth embodiment of the heating assembly provided by the present application.
  • 10c is a schematic structural diagram of another embodiment of the liquid inlet in the fifth embodiment of the heating assembly provided by the present application.
  • 10d is a schematic structural diagram of the sixth embodiment of the heating assembly provided by the present application.
  • FIG. 11 is a schematic structural diagram of a seventh embodiment of a heating assembly provided by the present application.
  • Figure 12 is a schematic structural diagram of the first experimental piece
  • Fig. 13 is the structural schematic diagram of the second test piece
  • FIG. 14 is a schematic structural diagram of the third experimental piece.
  • first”, “second” and “third” in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as “first”, “second”, “third” may expressly or implicitly include at least one of said features.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear%) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings).
  • FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application.
  • an electronic atomization device 100 is provided.
  • the electronic atomization device 100 can be used for atomization of aerosol-generating substrates.
  • the electronic atomizer device 100 includes an atomizer 1 and a host 2 that are electrically connected to each other.
  • the atomizer 1 is used for storing the aerosol-generating substrate and atomizing the aerosol-generating substrate to form an aerosol that can be inhaled by a user.
  • the nebulizer 1 can be used in different fields, such as medical treatment, beauty, leisure smoking, etc.
  • the nebulizer 1 can be used in an electronic aerosolization device for atomizing aerosol generating substrates And generate aerosol for the smoker to smoke, the following embodiments are all taking leisure smoking as an example; Hairspray for styling hair; or in devices used to treat upper and lower respiratory ailments to aerosolize medical drugs.
  • the specific structure and function of the atomizer 1 can be referred to the specific structure and function of the atomizer 1 involved in any of the following embodiments, and can achieve the same or similar technical effects, which will not be repeated here.
  • the host 2 includes a battery (not shown) and a controller (not shown).
  • the battery is used to provide electrical energy for the operation of the atomizer 1 , so that the atomizer 1 can atomize the aerosol-generating substrate to form an aerosol; the controller is used to control the operation of the atomizer 1 .
  • the host 2 also includes other components such as a battery holder, an airflow sensor, and the like.
  • the atomizer 1 and the host 2 may be integrally provided or detachably connected, and may be designed according to specific needs.
  • FIG. 2 is a schematic structural diagram of an atomizer provided by an embodiment of the present application.
  • the atomizer 1 includes a housing 10 , an atomizing seat 11 and a heating component 12 .
  • the housing 10 has a liquid storage chamber 13 and an air outlet channel 14 .
  • the liquid storage chamber 13 is used for storing the liquid aerosol generating substrate, and the liquid storage chamber 13 is arranged around the air outlet channel 14 .
  • the end of the housing 10 also has a suction port 15 , and the suction port 15 communicates with the air outlet channel 14 ; specifically, a port of the air outlet channel 14 may form the suction port 15 .
  • the housing 10 has an accommodating cavity 16 on the side of the liquid storage cavity 13 away from the suction port 15 , and the atomizing seat 11 is arranged in the accommodating cavity 16 .
  • the atomizing seat 11 includes an atomizing top seat 111 and an atomizing base 112 .
  • the atomizing top seat 111 and the atomizing base 112 cooperate to form a accommodating cavity 113 ; that is, the atomizing seat 11 has a accommodating cavity 113 .
  • the heating element 12 is arranged in the accommodating cavity 113 , and is arranged in the accommodating cavity 16 together with the atomizing seat 11 .
  • Two fluid channels 114 are provided on the atomizing top seat 111 . Specifically, two fluid channels 114 are provided on the top wall of the atomizing top seat 111 , and the two fluid channels 114 are provided on both sides of the air outlet channel 14 .
  • One end of the fluid channel 114 is communicated with the liquid storage chamber 13, and the other end is communicated with the storage chamber 113, that is, the fluid channel 114 communicates the liquid storage chamber 13 with the storage chamber 113, so that the aerosol in the liquid storage chamber 13 generates a matrix channel fluid Channel 114 enters heat generating assembly 12 . That is to say, the heating element 12 is in fluid communication with the liquid storage chamber 13, and the heating element 12 is used for absorbing and heating the atomized aerosol generating substrate.
  • the controller of the host 2 controls the heating element 12 to atomize the aerosol-generating substrate.
  • the surface of the heating element 12 away from the liquid storage chamber 13 is an atomizing surface, and an atomizing chamber 115 is formed between the atomizing surface of the heating element 12 and the inner wall surface of the receiving chamber 113 , and the atomizing chamber 115 is connected to the air outlet channel. 14 Connected.
  • An air inlet 116 is provided on the atomizing base 112 to communicate the outside with the atomizing cavity 115 . The outside air enters the atomizing chamber 115 through the air inlet 116 , carries the aerosol atomized by the heating component 12 into the air outlet channel 14 , and finally reaches the suction port 15 to be sucked by the user.
  • the atomizer 1 further includes a conducting member 17 , and the conducting member 17 is fixed on the atomizing base 112 .
  • One end of the conducting member 17 is electrically connected to the heating element 12 , and the other end is electrically connected to the host 2 , so that the heating element 12 can work.
  • the nebulizer 1 also includes a sealing cap 18 .
  • the sealing top cover 18 is disposed on the surface of the atomizing top seat 111 close to the liquid storage chamber 13 , and is used to seal the liquid storage chamber 13 , the atomizing top seat 111 and the air outlet channel 14 to prevent liquid leakage.
  • the material of the sealing top cover 18 is silicone or fluororubber.
  • Figure 3a is a schematic structural diagram of the first embodiment of the heating assembly provided by the present application
  • Figure 3b is a schematic structural diagram of the second substrate of the heating assembly provided in Figure 3a viewed from the side of the atomizing surface
  • Fig. 3c is a schematic structural diagram of the first substrate in the heating assembly provided in Fig. 3a viewed from the liquid-absorbing surface side.
  • the heating element 12 includes a first base body 121 and a second base body 122 .
  • the first substrate 121 has a first surface 1211 and a second surface 1212 arranged opposite to each other, and the first surface 1211 is a liquid absorbing surface; the first substrate 121 has a plurality of first micropores 1213, and the first micropores 1213 are used for the aerosol
  • the generating substrate is directed from the first surface 1211 to the second surface 1212 , ie, the first micropores 1213 are used to guide the aerosol generating substrate from the suction surface to the second surface 1212 .
  • the second base 122 has a third surface 1221 and a fourth surface 1222 disposed opposite to each other, and the fourth surface 1222 is an atomizing surface; the second base 122 has a plurality of second micropores 1223, and the second micropores 1223 are used for the aerosol
  • the generating substrate is directed from the third surface 1221 to the fourth surface 1222, ie the second micropores 1223 are used to direct the aerosol generating substrate from the third surface 1221 to the atomizing surface.
  • the second surface 1212 is disposed opposite to the third surface 1221 .
  • the first base body 121 and/or the second base body 122 form a flow channel, and the flow channel communicates with the first micropores 1213 and the second micropores 1223 . Understandable.
  • the aerosol-generating substrate flows from the suction side to the atomizing side under the action of gravity and/or capillary forces.
  • the heating element 12 provided by the present application has a high liquid supply capacity, and the formation of large air bubbles on the liquid suction surface through the flow channel to block the liquid supply can be avoided, thereby avoiding dry burning.
  • a gap 123 is formed between the second surface 1212 and the third surface 1221 , and the gap 123 serves as the above-mentioned flow channel; that is, the second surface 1212 of the first substrate 121 and the second substrate 122
  • the third surface 1221 cooperates to form a flow channel.
  • the first matrix 121 may be a porous matrix, for example, a material of porous ceramic, cotton, quartz sand core, or foam structure; the first matrix 121 may also be a dense matrix.
  • the material of the first substrate 121 is glass, dense ceramic or silicon.
  • the material of the first substrate 121 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass.
  • the first substrate 121 is borosilicate glass.
  • the first substrate 121 is photosensitive lithium aluminosilicate glass.
  • the second matrix 122 can be a porous matrix, for example, a material of porous ceramic, cotton, quartz sand core, or foam structure; the second matrix 122 can also be a dense matrix.
  • the material of the second base 122 is glass, dense ceramic or silicon.
  • the material of the second substrate 122 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass.
  • the second substrate 122 is borosilicate glass.
  • the second substrate 122 is photosensitive lithium aluminosilicate glass.
  • the materials of the first base body 121 and the second base body 122 may be the same or different.
  • the first substrate 121 and the second substrate 122 can be combined arbitrarily, for example, the first substrate 121 is a porous ceramic, and the second substrate 122 is a dense substrate; for another example, the first substrate 121 is a porous ceramic, and the second substrate 122 is a porous ceramic Ceramic; for another example, the first matrix 121 is a dense matrix, and the second matrix 122 is a porous ceramic; in another example, the first matrix 121 is a dense matrix, and the second matrix 122 is a dense matrix.
  • the heating element 12 will be described in detail below by taking the first substrate 121 as a dense substrate and the second substrate 122 as a dense substrate as an example.
  • the first base body 121 is a dense base body, and the first base body 121 has a plurality of first micropores 1213 penetrating the first surface 1211 and the second surface 1212 .
  • the second base body 122 is a dense base body, and the second base body 122 has a plurality of second micropores 1223 penetrating the third surface 1221 and the fourth surface 1222 .
  • the first micropore 1213 and the second micropore 1223 both have capillary force.
  • the first micropore 1213 uses its capillary force to guide the aerosol-generating matrix from the liquid-absorbing surface of the first substrate 121 to the gap 123; the second micropore 1223 uses its capillary force to guide the aerosol-generating matrix from the gap 123 Guided to the atomizing surface of the second base body 122 .
  • the first substrate 121 when the first substrate 121 is a porous ceramic, the first substrate 121 uses its own capillary force to guide the aerosol-generating substrate from the liquid absorbing surface of the first substrate 121 to the gap 123; the second substrate 122 is a porous ceramic , the second substrate 122 uses its own capillary force to guide the aerosol-generating substrate from the gap 123 to the atomizing surface of the second substrate 122 .
  • the second substrate 122 is set as a dense substrate, and the second micropores 1223 penetrating the third surface 1221 and the fourth surface 1222 are provided on the second substrate 122, it is easier to conduct liquid to communicate with the first micropores of the first substrate 121.
  • the hole 1213 is beneficial to improve the liquid supply efficiency.
  • the height of the gap 123 is less than or equal to 200 ⁇ m, and the height of the gap 123 is the distance between the second surface 1212 and the third surface 1221 .
  • the height of the gap 123 is greater than 200 ⁇ m, there is a risk of liquid leakage from the first micro-holes 1213 and/or the second micro-holes 1223 , and there is a risk of lateral merger and growth of air bubbles.
  • the height of the gap 123 is too small, the gap 123 cannot effectively remove the air bubbles entering through the second micro-holes 1223 .
  • the height of the gap 123 is less than or equal to 50 ⁇ m. In another specific embodiment, the height of the gap 123 is less than or equal to 20 ⁇ m.
  • the gap 123 By setting the gap 123 , lateral fluid supplementation can be achieved, and even if the air bubbles adhere to the liquid absorbing surface of the first substrate 121 and cover part of the first micropores 1213 , the liquid supply of the second substrate 122 will not be affected. Further, setting the height of the gap 123 to the above range limits the growth range of the bubbles, and it is difficult to form bubbles detached from the second micropores 1223. When the bubbles collapse, they are discharged from the atomizing surface, thereby preventing large bubbles from adhering to the first substrate. The suction surface of 121 affects the liquid supply.
  • the heating component 12 further includes a heating element 124 , a positive electrode 128 and a negative electrode 129 , and both ends of the heating element 124 are electrically connected to the positive electrode 128 and the negative electrode 129 respectively. Both the positive electrode 128 and the negative electrode 129 are disposed on the atomizing surface of the second base 122 so as to be electrically connected to the host 2 .
  • the heating element 124 can be a heating sheet, a heating film, a heating net, etc., and can heat the atomized aerosol to generate a substrate.
  • the heating element 124 may be disposed on the atomizing surface of the second base body 122, or may be embedded in the inside of the second base body 122, which can be specifically designed as required.
  • the second substrate 122 has a conductive function and can generate heat by itself, for example, a self-heating conductive ceramic or a glass with a conductive function, and no additional heating element 124 is required at this time. That is, the heating element 124 is an optional structure.
  • the heating element 124 is a separate element, the projection of the first substrate 121 on the atomizing surface completely covers the heating element 124 to ensure that the liquid supply speed can meet the atomization speed of the heating element 124 and achieve a better atomization effect .
  • the first base body 121 can be insulated to a certain extent, preventing the heat on the second base body 122 from being conducted to the liquid storage cavity 13, which is beneficial to Guaranteed consistency of taste.
  • the second substrate 122 is provided with a micro-hole array area 1224 and a blank area 1225 arranged around the micro-hole array area 1224.
  • the micro-hole array area 1224 has a plurality of second micro-holes 1223; the heating element 124 is arranged in the micro-holes
  • the array area 1224 is used to heat the atomized aerosol to generate the matrix; the positive electrode 128 and the negative electrode 129 are arranged in the blank area 1225 of the atomizing surface (the fourth surface 1222 ) to ensure the stability of the electrical connection between the positive electrode 128 and the negative electrode 129 sex.
  • microhole array area 1224 and a blank area 1225 around the microhole array area 1224 on the second substrate 122 By providing a microhole array area 1224 and a blank area 1225 around the microhole array area 1224 on the second substrate 122, it can be understood that the second microhole 1223 is not provided on the blank area 1225, which reduces the number of second microholes 1223.
  • the number of the second micro-holes 1223 on the base body 122 increases the strength of the second base body 122 and reduces the production cost of disposing the second micro-holes 1223 on the second base body 122 .
  • the microporous array area 1224 in the second substrate 122 is used as an atomization area, covering the heating element 124 and the surrounding area of the heating element 124, that is, basically covering the area that reaches the temperature of the atomized aerosol generation substrate, making full use of thermal efficiency.
  • the size of the area around the microhole array area 1224 of the second substrate 122 in this application is larger than the diameter of the second microhole 1223, so it can be called the blank area 1225; that is, the blank area 1225 in this application It is the area where the second microholes 1223 can be formed but the second microholes 1223 are not formed, and is not the area around the microhole array area 1224 where the second microholes 1223 cannot be formed.
  • the distance between the second micro-hole 1223 closest to the edge of the second substrate 122 and the edge of the second substrate 122 is greater than the diameter of the second micro-hole 1223 .
  • the first substrate 121 is provided with a microwell array area 1214 and a blank area 1215 arranged around the microwell array area 1214 , and the microwell array area 1214 has a plurality of first microwells 1213 .
  • the shape of the first base body 121 and the second base body 122 can be flat, cylindrical, arc-shaped, etc., which can be designed according to needs; A gap 123 may be formed between the second base bodies 122 .
  • the first base body 121 and the second base body 122 of the heating element 12 provided in FIG. 3a are both flat plates.
  • the shape and size of the first base body 121 and the second base body 122 may be the same or different. In this embodiment, as shown in FIG. 3 a , the shapes and sizes of the first base body 121 and the second base body 122 are the same, and the projections are completely overlapped.
  • the first base body 121 and the second base body 122 may be provided in a regular shape, such as a rectangular plate shape, a circular plate shape, and the like.
  • the plurality of first micro-holes 1213 disposed on the first substrate 121 are arranged in an array; that is, the plurality of first micro-holes 1213 disposed on the first substrate 121 are regularly arranged, and the plurality of first micro-holes 1213 are arranged regularly.
  • the hole center distances between the adjacent first micro holes 1213 in the 1213 are the same.
  • the plurality of second microholes 1223 disposed on the second substrate 122 are arranged in an array; that is, the plurality of second microholes 1223 disposed on the second substrate 122 are regularly arranged, and the plurality of second microholes
  • the hole center distances between the adjacent second micro holes 1223 in the 1223 are the same.
  • the extending direction of the first micro-holes 1213 may be parallel to the thickness direction of the first base body 121 , or may form an included angle with the thickness direction of the first base body 121 , and the included angle ranges from 80 degrees to 90 degrees.
  • the cross section of the first microhole 1213 may be circular, and the longitudinal section may be rectangular.
  • the extending direction of the second micro-holes 1223 may be parallel to the thickness direction of the second substrate 122, or may form an included angle with the thickness direction of the second substrate 122, and the included angle ranges from 80 degrees to 90 degrees.
  • the cross section of the second micro-hole 1223 may be circular, and the longitudinal section may be rectangular or the like.
  • first microholes 1213 and the second microholes 1223 and their extending directions can be designed as required.
  • first micro-hole 1213 and the second micro-hole 1223 are both straight through holes parallel to the thickness direction of the first substrate 121 or the second substrate 122; that is, the central axis of the first micro-hole 1213 and the first surface 1211 Vertical, the central axis of the second microhole 1223 is vertical to the third surface 1221 .
  • the projection of the area where the first micro-holes 1213 are arranged on the first substrate 121 on the second substrate 122 completely covers the area where the second micro-holes 1223 are arranged on the second substrate 122 to ensure that the liquid supply speed can meet the
  • the atomization speed of the heating element 124 disposed on the atomization surface of the second base 122 can achieve a better atomization effect.
  • the diameter of the first micropores 1213 on the first substrate 121 is 1 ⁇ m-100 ⁇ m.
  • the pore size of the first micropores 1213 is less than 1 ⁇ m, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the first micropores 1213 is greater than 100 ⁇ m, the aerosol-generating matrix is likely to flow out from the first micropores 1213 and cause liquid leakage , resulting in a decrease in atomization efficiency.
  • the aperture of the first base body 121 is selected according to actual needs.
  • the diameter of the second micropores 1223 on the second substrate 122 is 1 ⁇ m-100 ⁇ m.
  • the pore size of the second micropores 1223 is less than 1 ⁇ m, the demand for liquid supply cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the second micropores 1223 is greater than 100 ⁇ m, the aerosol-generating matrix is likely to flow out of the second micropores 1223 , resulting in liquid leakage , resulting in a decrease in atomization efficiency.
  • the diameter of the second micropores 1223 is 20 ⁇ m-50 ⁇ m. It can be understood that the aperture of the second substrate 122 is selected according to actual needs.
  • the diameter of the first micropores 1213 is larger than the diameter of the second micropores 1223 (as shown in FIG. 3 a ), so that the capillary force of the second micropores 1223 is greater than the capillary force of the first micropores 1213 .
  • the sol-generating substrate can flow from the gap 123 to the atomizing surface of the second substrate 122 . Since the first micro-holes 1213 also have capillary force, when the suction port 15 is used downward, the backflow of the liquid can be prevented and the insufficient liquid supply can be prevented.
  • the thickness of the second base body 122 is 0.1 mm-1 mm.
  • the thickness of the second base body 122 is greater than 1 mm, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol, and the resulting heat loss is large, and the cost of arranging the second micropores 1223 is high; when the thickness of the second base body 122 is less than 0.1 mm, The strength of the second substrate 122 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device.
  • the thickness of the second base body 122 is 0.2mm-0.5mm. It can be understood that the thickness of the second base body 122 is selected according to actual needs.
  • the thickness of the first base body 121 is 0.1 mm-1 mm.
  • the thickness of the first base body 121 is smaller than the thickness of the second base body 122, wherein the thickness of the first base body 121 is the distance between the first surface 1211 and the second surface 1212, and the thickness of the second base body 122 is the third The distance between the surface 1221 and the fourth surface 1222.
  • the ratio of the thickness of the second substrate 122 to the diameter of the second micropores 1223 is 20:1-3:1, so as to improve the liquid supply capability.
  • the ratio of the thickness of the second matrix 122 to the diameter of the second micropores 1223 is greater than 20:1, the aerosol-generating matrix supplied by the capillary force of the second micropores 1223 is difficult to meet the atomization demand of the heating element 124, Not only is it easy to cause dry burning, but also the amount of aerosol generated by a single atomization decreases; when the ratio of the thickness of the second matrix 122 to the pore size of the second micropores 1223 is less than 3:1, the aerosol generation matrix is easily generated from the second micropore.
  • the flow out of the hole 1223 causes waste, resulting in a decrease in the atomization efficiency, thereby reducing the total amount of aerosol.
  • the ratio of the thickness of the second substrate 122 to the diameter of the second micropores 1223 is 15:1-5:1.
  • the ratio of the hole center distance between two adjacent second microholes 1223 to the diameter of the second microholes 1223 is 3:1-1.5:1, so that the second microholes 1223 on the second substrate 122 meet the supply requirements.
  • the strength of the second matrix 122 should be improved as much as possible; 2:1; further optionally, the ratio of the hole center distance between two adjacent second microholes 1223 to the diameter of the second microholes 1223 is 3:1-2.5:1.
  • the heating element 12 further includes a spacer 125 .
  • the spacer 125 is disposed between the second surface 1212 of the first base body 121 and the third surface 1221 of the second base body 122, and is located at the edge of the first base body 121 and/or the second base body 122, so that the first base body 121 and the second base body 122 are connected.
  • the two base bodies 122 are spaced apart to form a gap 123 .
  • the heights of the gaps 123 are the same; that is, the second surface 1212 and the third surface 1221 are arranged in parallel.
  • two equal-height spacers 125 are disposed between the second surface 1212 and the third surface 1221, and the two equal-height spacers 125 are located at the edges of opposite ends of the first base 121 and the second base 122 (eg, 3a); or between the second surface 1212 and the third surface 1221, an annular spacer 125 of equal height, such as a plastic frame, is arranged.
  • FIG. 3d is a schematic structural diagram of another embodiment of the spacer in the heating element provided in FIG. 3a.
  • the height of the gap 123 increases gradually along the direction parallel to the first base body 121 ; for example, the height of the gap 123 gradually increases along the length direction, width direction or diagonal direction of the first base body 121 . big. That is, the second surface 1212 and the third surface 1221 are not parallel to each other.
  • the height of the gap 123 increases gradually from zero.
  • only one spacer 125 is disposed between the second surface 1212 and the third surface 1221 , and the spacer 125 is located at one end of the first base 121 and the second base 122 . edge (as shown in FIG. 3d ), and the edges of the other ends of the first base body 121 and the second base body 122 are in contact.
  • two spacers 125 with different heights are located at the edges of opposite ends of the first base body 121 and the second base body 122 .
  • the gaps 123 can easily flow laterally between the gaps 123, which can prevent the air bubbles in the gap 123 from blocking the ports of the first micro-hole 1213 or the second micro-hole 1223, preferably It can discharge air bubbles and reduce the influence of air bubbles on the liquid supply speed.
  • the spacer 125 is located on the first base body 121 and the edge of the second base 122 (as shown in Figure 3a).
  • the projection of the first base body 121 on the second base body 122 completely covers the second base body 122 , that is, when the size of the first base body 121 is larger than that of the second base body 122 , the spacers 125 are located at the edge of the second base body 122 and the first base body 121 near the side.
  • the spacers 125 are located at the edge of the first base body 121 and the second base body 122 near the side. That is to say, the setting position of the spacer 125 can be determined according to the specific size setting of the first base body 121 and the second base body 122 , so that the first base body 121 , the second base body 122 and the spacer 125 can be surrounded to form a gap 123 . .
  • the spacer 125 may be disposed along the circumferential direction of the first base body 121 and the second base body 122 , that is, the spacer 125 is an annular structure, so as to avoid leakage of the aerosol-generating matrix in the gap 123 .
  • the spacers 125 may also be multiple and spaced along the circumferential direction of the first base body 121 and the second base body 122 , and the circumferential direction of the first base body 121 and the second base body 122 is sealed by the sealing member 126 .
  • the spacer 125 is an independently disposed gasket, the gasket is detachably connected with the first base body 121 and the second base body 122 , and the gasket is an annular structure.
  • the specific operation is as follows: forming the first micro-holes 1213 on the first base body 121, forming the second micro-holes 1223 on the second base body 122, and then disposing the gasket between the first base body 121 and the second base body 122, specifically , the spacer is disposed between the blank area 1215 of the first substrate 121 and the blank area 1225 of the second substrate 122 .
  • the spacer 125 can be a silicone frame or a plastic frame.
  • the spacer 125 is a support column or a support frame fixed on the second surface 1212 of the first base body 121 and/or the third surface 1221 of the second base body 122 , and the support column or support frame is clamped or It is fixed to the second surface 1212 of the first base body 121 and/or the third surface 1221 of the second base body 122 by welding.
  • the specific operation is as follows: forming the first micro-holes 1213 on the first base 121, forming the second micro-holes 1223 on the second base 122, and then connecting the support column or the support frame to the first base by welding or clamping. 121.
  • the second base body 122 is integrated.
  • the first base body 121 and the second base body 122 are glass plates, and glass frit is coated on the edge of the first base body 121, and after the second base body 122 is covered, the glass frit is sintered into glass with a laser to connect the support posts or supports The frame is fixed to the first base body 121 and the second base body 122 .
  • the spacer 125 is a protrusion integrally formed with the first base body 121 and/or the second base body 122 . If the spacer 125 is a protrusion integrally formed with the first base body 121 , the first micro-holes 1213 are formed on the first base body 121 , the second micro-holes 1223 are formed on the second base body 122 , and then the second base bodies 122 are overlapped. A gap 123 is formed on the protrusion.
  • first micro-holes 1213 are formed on the first base body 121
  • second micro-holes 1223 are formed on the second base body 122
  • a gap 123 is formed on the protrusion.
  • grooves are formed by etching on the second surface 1212 of the first base 121, the sidewalls of the grooves serve as spacers 125, and the first microholes 1213 are formed on the bottom walls of the grooves;
  • the third surface 1221 of the second base 122 is Plane, the third surface 1221 of the second base 122 overlaps the end surface of the side wall of the groove of the second surface 1212, that is, the third surface 1221 of the second base 122 and the second surface 1212 of the first base 121 fit together,
  • the third surface 1221 cooperates with the groove to form the gap 123 . If the bottom surface of the groove is interpreted as the second surface 1212 , the sidewall of the groove can be interpreted as the protrusion of the second surface 1212 .
  • the heating assembly 12 further includes a sealing member 126 , and the sealing member 126 has a lower liquid hole 1261 , and the lower liquid hole 1261 is in fluid communication with the liquid storage chamber 13 through the fluid channel 114 .
  • the first base body 121 and/or the second base body 122 are embedded in the lower liquid hole 1261 , that is, the sealing member 126 is used to seal the periphery of the first base body 121 and/or the second base body 122 to prevent liquid leakage.
  • the first base body 121 and the second base body 122 are provided in the lower liquid hole 1261 .
  • the sealing member 126 When the sealing member 126 covers the periphery of the second base body 122 , the sealing member 126 does not block the heating element 124 , and the lower liquid hole 1261 can completely expose the heating element 124 .
  • the hole wall of the lower liquid hole 1261 has an annular installation groove (not shown), and the edges of the first base body 121 and/or the second base body 122 are embedded in the annular installation groove.
  • FIG. 4 is a schematic structural diagram of a second embodiment of the heating element provided by the present application.
  • the difference between the second embodiment of the heating element 12 and the first embodiment of the heating element 12 is that the spacer 125 is used to maintain the gap between the first base body 121 and the second base body 122 in the first embodiment of the heating element 12 123, while in the second embodiment of the heating element 12, the gap 123 between the first base body 121 and the second base body 122 is maintained by the sealing member 126, and there is no need to provide a separate spacer 125.
  • the second embodiment of the heating element 12 is the same as the first embodiment of the heating element 12 except that the way of maintaining the gap 123 is different from that of the first embodiment of the heating element 12 , and will not be repeated here.
  • a fixing structure 1261a is provided on the hole wall of the lower liquid hole 1261 of the sealing member 126, so as to fix the first base body 121 and/or the second base body 122, and make the first base body 121 and the The second base bodies 122 are spaced apart to form gaps 123 .
  • the specific arrangement of the fixing structure 1261a is as follows.
  • the hole wall of the lower liquid hole 1261 is provided with a first installation groove 1261b and a second installation groove 1261c at intervals, the first installation groove 1261b and the second installation groove 1261c are both annular grooves, and the first installation groove 1261b and the second mounting groove 1261c as the fixing structure 1261a.
  • the first installation groove 1261b and the second installation groove 1261c have a common side wall.
  • the peripheral edge of the first base body 121 is embedded in the first installation groove 1261b, and the peripheral edge of the second base body 122 is embedded in the second installation groove 1261c.
  • the base body 121 and the second base body 122 are spaced apart and a gap 123 is formed therebetween (as shown in FIG. 4 ).
  • FIG. 5a is a schematic structural diagram of another embodiment of the sealing member in the second embodiment of the heating element provided by the present application.
  • FIG. 5b is the sealing member provided in FIG. Schematic diagram of the assembly structure of the base.
  • the lower liquid hole 1261 includes a first sub-lower liquid hole 1261d and a second sub-lower liquid hole 1261e that communicate with each other, and the aperture of the first sub-lower liquid hole 1261d is larger than that of the second sub-lower liquid hole 1261e, A stepped structure A is formed between the first sub-lower liquid hole 1261d and the second sub-lower liquid hole 1261e, and an annular protrusion B is provided on the hole wall of the second sub-lower liquid hole 1261e.
  • the stepped structure A and the annular protrusion B serve as the fixing structure 1261a.
  • the peripheral edge of the first base body 121 overlaps the step surface of the stepped structure, that is, the peripheral edge of the first base body 121 overlaps the connecting surface of the first sub-lower liquid hole 1261d and the second sub-sub-liquid hole 1261e; the second base body
  • the peripheral edge of 122 overlaps the annular protrusion B, and a gap 123 is formed between the first base body 121 and the second base body 122 .
  • the second base body 122 can also be fixed and the gap 123 can be formed by the interference fit between the second base body 122 and the second sub-lower liquid hole 1261e.
  • FIG. 6a is a schematic structural diagram of another embodiment of the seal in the second embodiment of the heating element provided by the present application.
  • FIG. 6b is the seal provided in FIG. Schematic diagram of the assembly structure of the base.
  • protrusions 1261f are provided on the hole wall of the lower liquid hole 1261 of the sealing member 126 to form a first stepped structure C and a second stepped structure D.
  • the protrusion 1261f and the sealing member 126 are integrally formed.
  • the first stepped structure C and the second stepped structure D serve as the fixing structure 1261a.
  • the first base body 121 is disposed on the stepped surface of the first stepped structure C
  • the second base body 122 is disposed on the stepped surface of the second stepped structure D
  • a gap 123 is formed between the first base body 121 and the second base body 122 .
  • FIG. 7a is a schematic structural diagram of the third embodiment of the heating element provided by the present application
  • FIG. 7b is a partial structural diagram of the second substrate in the heating element provided in FIG. 7a viewed from the third surface side.
  • the difference between the third embodiment of the heating element 12 and the first embodiment of the heating element 12 is that the first base body 121 and/or the second base body 122 form the flow channel in a different manner, and other structures are provided.
  • the methods are the same as those of the first embodiment of the heating element 12 , and are not repeated here.
  • the flow channel is formed by the gap 123.
  • the third surface 1221 is provided with a plurality of first grooves 1221a extending along the first direction and a plurality of A plurality of second grooves 1221b extending along the second direction, the first grooves 1221a and the second grooves 1221b are arranged to intersect, and the plurality of first grooves 1221a and the plurality of second grooves 1221b form the above-mentioned flow channels.
  • the first direction is perpendicular to the second direction.
  • first grooves 1221a extending in the first direction or only a plurality of second grooves 1221b extending in the second direction may be provided, that is, only one direction of communication The adjacent second microholes 1223 .
  • the first grooves 1221a and/or the second grooves 1221b have capillary action, which can guide the aerosol-generating matrix in the lateral direction, so that the aerosol-generating matrix uniformly enters the plurality of second micropores 1223, thereby playing the role of lateral fluid supplementation.
  • the lateral direction refers to a direction that is not parallel to the extending direction of the second micro-holes 1223 , for example, a direction perpendicular to the central axis of the second micro-holes 1223 .
  • the first groove 1221a and the second groove 1221b can also realize the lateral replenishment of the aerosol-generating matrix, and further avoid dry burning.
  • each first groove 1221a corresponds to one or more rows of second micro-holes 1223
  • each second groove 1221b corresponds to one or more columns of second micro-holes 1223, as required.
  • each first groove 1221a corresponds to a row of second microholes 1223
  • each second groove 1221b corresponds to a column of second microholes 1223 (as shown in FIG. 7b).
  • the ratio of the depth to the width of the first groove 1221a is 0-20; when the ratio of the depth to the width of the first groove 1221a is greater than 20, the capillary force of the first groove 1221a cannot achieve better lateral fluid replenishment Effect. In a specific embodiment, the ratio of the depth to the width of the first groove 1221a is 1-5.
  • the ratio of the depth to the width of the second groove 1221b is 0-20; when the ratio of the depth to the width of the second groove 1221b is greater than 20, the capillary force of the second groove 1221b cannot achieve better lateral fluid replenishment Effect. In a specific embodiment, the ratio of the depth to the width of the second groove 1221b is 1-5.
  • FIG. 7c is a partial structural schematic diagram of the first substrate in the heat generating assembly provided in FIG. 7a viewed from the second surface side.
  • a plurality of third grooves 1212a extending in the third direction and a plurality of fourth grooves 1212b extending in the fourth direction are provided on the second surface 1212, and the third grooves 1212a and the fourth grooves 1212b are arranged to intersect ;
  • a plurality of first grooves 1221a, a plurality of second grooves 1221b, a plurality of third grooves 1212a and a plurality of fourth grooves 1212b together form the above-mentioned flow channel.
  • the third direction is perpendicular to the fourth direction; the third direction is the same as the first direction, and the fourth direction is the same as the second direction.
  • only a plurality of third grooves 1212a extending in the third direction or only a plurality of fourth grooves 1212b extending in the fourth direction may be provided, that is, the communication in only one direction Adjacent first microholes 1213 .
  • the third groove 1212a and/or the fourth groove 1212b have capillary action, which can guide the aerosol-generating matrix in the lateral direction, so that the aerosol-generating matrix evenly enters the plurality of second micropores 1223, thereby playing the role of lateral fluid replenishment.
  • each third groove 1212a corresponds to one or more rows of first micro-holes 1213
  • each fourth groove 1212b corresponds to one or more columns of first micro-holes 1213, as required.
  • each third groove 1212a corresponds to a row of first micro holes 1213
  • each fourth groove 1212b corresponds to a column of first micro holes 1213 (as shown in FIG. 7c).
  • the ratio of the depth to the width of the third groove 1212a is 0-20; when the ratio of the depth to the width of the third groove 1212a is greater than 20, the capillary force of the third groove 1212a cannot achieve better lateral fluid replenishment Effect.
  • the ratio of the depth to the width of the third groove 1212a is 0-5.
  • the ratio of the depth to the width of the fourth groove 1212b is 0-20; when the ratio of the depth to the width of the fourth groove 1212b is greater than 20, the capillary force of the fourth groove 1212b cannot achieve better lateral fluid replenishment Effect.
  • the ratio of the depth to the width of the fourth groove 1212b is 0-5.
  • the capillary force of the first groove 1221a and the second groove 1221b on the third surface 1221 is greater than the capillary force of the third groove 1212a and the fourth groove 1212b on the second surface 1212 .
  • third groove 1212a and the fourth groove 1212b on the second surface 1212 are optional structures and can be designed according to requirements.
  • a gap 123 is formed between the second surface 1212 and the third surface 1221 (as shown in FIG. 7 a ).
  • the gap 123 can be formed by a spacer 125 (refer to the first embodiment of the heating element 12 )
  • the gap 123 may also be formed by the sealing member 126 (refer to the second embodiment of the heating element 12 ), which will not be repeated.
  • the height of the gap 123 is the distance between the second surface 1212 and the third surface 1221 .
  • the third groove 1212a and the fourth groove 1212b on the second surface 1212 are optional structures; when a plurality of intersecting third grooves 1212a and fourth grooves 1212b are provided on the second surface 1212 , the liquid storage capacity of the gap 123 can be increased.
  • the main function of the first base body 121 is to feed liquid and block air bubbles.
  • the height of the gap 123 may be the same, or may gradually increase; when along the direction parallel to the first base body 121, the height of the gap 123 gradually increases, along the gap 123 In the direction of gradually decreasing height of the gap 123, the capillary force of the gap 123 gradually increases, which is beneficial to the flow of the aerosol-generating matrix in the gap 123 and prevents the bubbles from staying in the gap 123, that is, the uneven gap 123 can be more This facilitates the lateral flow of the aerosol-generating matrix in the gap 123, so as to better laterally replenish fluids and discharge air bubbles.
  • first groove 1221a and the second groove 1221b have capillary force, they can supplement liquid laterally, and the combined gap 123 can ensure gas-liquid separation and reduce the influence of air bubbles on the liquid supply.
  • first grooves 1221a and second grooves 1221b are provided on the third surface 1221, it is beneficial to guide the aerosol-generating matrix in the gap 123 to the second micropores 1223, which is helpful for liquid supply .
  • the gas will enter the first groove 1221a and the second groove 1221b through the second micro holes 1223.
  • the gap 123 can prevent large air bubbles from reaching the liquid suction surface and then entering the liquid storage chamber 13, and the liquid storage function of the gap 123 can ensure that at least two suctions will not burn break.
  • FIG. 8 is another schematic structural diagram of the third embodiment of the heating element provided by the present application.
  • the second surface 1212 is in contact with the third surface 1221 (as shown in FIG. 8 ). That is, a plurality of first grooves 1221a, a plurality of second grooves 1221b, a plurality of third grooves 1212a and a plurality of fourth grooves 1212b jointly form a flow channel.
  • the depth of the first groove 1221a and the depth of the second groove 1221b are both greater than the depth of the third groove 1212a and the depth of the fourth groove 1212b; optionally, the ratio of the depth to the width of the first groove 1221a is 2-5, and the ratio of the depth to the width of the second groove 1221b is 2-5.
  • the depth of the first groove 1221a and the depth of the second groove 1221b are greater than the depth of the third groove 1212a and the depth of the fourth groove 1212b, the capillary force of the first groove 1221a and the second groove
  • the capillary force of 1221b is both greater than the capillary force of the third groove 1212a and the capillary force of the fourth groove 1212b.
  • the depth of the first groove 1221a and the depth of the second groove 1221b should not be too large, otherwise there will be a "stratification" phenomenon during the lateral replenishment, and the liquid close to the bottom of the groove flows fast, along the direction away from the bottom of the groove. The flow speed of the liquid is getting slower and slower, and there is a risk of trapping air bubbles, which may even cause the air bubbles to be stuck in the first groove 1221a.
  • the liquid storage volume between the first base body 121 and the second base body 122 can be increased, and the first base body 121 can also be prevented from being stored.
  • the first base body 121 blocks the second micropores 1223 .
  • the central axis of the first micro-hole 1213 and the central axis of the second micro-hole 1223 may be coincident, or the ports of the first micro-hole 1213 and the second micro-hole 1223 may be at least partially coincident.
  • the communication between the first micro-hole 1213 and the second micro-hole 1223 is realized, so as to prevent the first substrate 121 from blocking the second micro-hole 1223 when the first substrate 121 is in contact with the second substrate 122; 1212 is provided with a plurality of intersecting third grooves 1212a and fourth grooves 1212b.
  • FIG. 9a is a schematic top-view structure diagram of the fourth embodiment of the heating element provided by the present application
  • FIG. 9b is a schematic cross-sectional view of the heating element provided in FIG. 9a along the B-B direction
  • Figure 9c is a schematic cross-sectional view of the heating assembly provided in Figure 9a along the C-C direction
  • Figure 9d is a schematic structural diagram of another embodiment of the liquid inlet in the fourth embodiment of the heating assembly provided by the application
  • Figure 9e is a heating element provided by the application.
  • the fourth embodiment of the heating element 12 is different from the first embodiment of the heating element 12 in that the edge side of the first base body 121 of the fourth embodiment of the heating element 12 has a liquid inlet 1217 , and other
  • the arrangement of other structures is the same as that of the first embodiment of the heating element 12 , and details are not repeated here.
  • At least part of the edge of the first base body 121 is spaced from the hole wall of the lower liquid hole 1261 of the sealing member 126 to form a liquid inlet 1217;
  • the through hole 1216b forms the liquid inlet 1217 .
  • the second base body 122 spans the entire lower liquid hole 1261 .
  • two opposite long sides of the first base body 121 are spaced apart from the hole wall of the lower liquid hole 1261 to form two symmetrical liquid inlets 1217 (as shown in FIG. 9a ).
  • the edge of the first base body 121 is provided with a notch 1216a, and the notch 1216a cooperates with the hole wall of the lower liquid hole 1261 to form a liquid inlet 1217; the opening size and number of the notch 1216a are designed according to needs (as shown in FIG. 9d ). ).
  • a through hole 1216b is provided on the edge of the first base body 121 to form a liquid inlet 1217; the size, shape and quantity of the through hole 1216b are designed according to requirements (as shown in FIG. 9e ).
  • the projection of the first base body 121 on the atomizing surface completely covers the heating element 124 , and the liquid inlet 1217 is staggered from the heating element 124 .
  • the cross-sectional size of the liquid inlet 1217 is larger than the diameter of the first micropores 1213 , that is, the speed of the aerosol-generating substrate flowing from the liquid inlet 1217 is greater than that of the first micropores 1213 .
  • a fixing structure 1261a can also be provided on the hole wall of the lower liquid hole 1261 of the sealing member 126 to fix the first base body 121 and/or the second base body 122, and make The first base body 121 and the second base body 122 are spaced apart to form a gap 123 , which can be referred to in the second embodiment of the heating element 12 , and details are not repeated here.
  • the liquid inlet 1217 provided in the fourth embodiment of the heating element 12 can also be applied to other embodiments of the heating element 12, which can be specifically designed as required.
  • FIG. 10a is a schematic top view of the structure of the fifth embodiment of the heating element provided by the present application
  • FIG. 10b is another embodiment of the liquid inlet in the fifth embodiment of the heating element provided by the present application
  • 10c is a schematic structural diagram of another embodiment of the liquid inlet in the fifth embodiment of the heating component provided by the present application.
  • the fifth embodiment of the heating element 12 is different in that: in the fifth embodiment of the heating element 12 , the edge side of the first base body 121 has a liquid inlet 1217 , and the first base body 121 has a liquid inlet 1217 .
  • the first micro-holes 1213 are not provided, and other structures are provided in the same manner as in the first embodiment of the heating element 12 , and will not be repeated here.
  • the first micro-holes 1213 are not provided on the first base body 121 . At least part of the edge of the first base 121 is spaced apart from the wall of the lower liquid hole 1261 of the seal 126 to form a liquid inlet 1217 ; The second base body 122 spans the entire lower liquid hole 1261 .
  • two opposite long sides of the first base body 121 are spaced apart from the hole wall of the lower liquid hole 1261 to form two symmetrical liquid inlets 1217 (as shown in FIG. 10a ).
  • the edge of the first base body 121 is provided with a notch 1216a, and the notch 1216a cooperates with the hole wall of the lower liquid hole 1261 to form a liquid inlet 1217; the size and quantity of the opening of the notch 1216a are designed according to needs (as shown in FIG. 10b ). ).
  • the edge of the first base body 121 is provided with a through hole 1216b to form a liquid inlet 1217; the size, shape and quantity of the through hole 1216b are designed as required (as shown in FIG. 10c ).
  • the projection of the first base body 121 on the atomizing surface completely covers the heating element 124 , and the liquid inlet 1217 is staggered from the heating element 124 .
  • the liquid inlet 1217 By disposing the liquid inlet 1217 on the first base body 121, not only can the gap 123 be filled with liquid through the liquid inlet 1217, but also air bubbles can be eliminated through the liquid inlet 1217, so as to avoid the influence of the air bubbles entering the liquid storage chamber 13 on the liquid supply, and further Avoid dry burning.
  • FIG. 10d is a schematic structural diagram of the sixth embodiment of the heating element provided by the present application.
  • the difference between the sixth embodiment of the heating element 12 and the first embodiment of the heating element 12 is that the heating element 12 further includes a plurality of micro-pillars 127 , and the plurality of micro-pillars 127 are arranged in the gaps 123 .
  • the sixth embodiment of the heating element 12 is different from the first embodiment of the heating element 12 except that a plurality of micro-pillars 127 are arranged in the gap 123, and the arrangement of other structures is the same as that of the first embodiment of the heating element 12, and will not be repeated here. .
  • one end of the micro-pillars 127 abuts against the second surface 1212 of the first base 121 , and the other end of the micro-pillars 127 is spaced from the third surface 1221 of the second base 122 (the first method); or, the micro-pillars 127
  • One end of the micropillar 127 is in contact with the third surface 1221 of the second base 122, and the other end of the micropillar 127 is spaced from the second surface 1212 of the first substrate 121 (the second method); or, one end of the micropillar 127 is connected to the first substrate
  • the second surface 1212 of the 121 abuts, and the other end of the micro-pillar 127 abuts the third surface 1221 of the second base 122 (the third method).
  • the plurality of micro-columns 127 can be in the first mode; the plurality of micro-columns 127 can also be in the second mode; the plurality of micro-columns 127 can also be in the third mode; part of the plurality of micro-columns 127 can be in the first mode, and part of the plurality of micro-columns 127 It is the second way, and part is the third way.
  • the micro-pillars 127 may be wastes generated when the first substrate 121 and the second substrate 122 are processed.
  • the micro-pillars 127 may be micro-protrusions generated when the first base 121 and the second base 122 are punched; when the first base 121
  • the micro-pillars 127 may be slag remaining after drilling the first base 121 and the second base 122 .
  • micro-columns 127 By arranging the micro-columns 127 in the gap 123, after the aerosol-generating matrix enters the first micro-hole 1213, it can climb into the gap 123 along the micro-columns 127, so that the gap 123 is well filled with the aerosol-generating matrix; each micro-column 127 A liquid bridge-like effect can be generated between them to achieve the effect of lateral fluid supplementation, and the adhesion between the aerosol-generating matrix and the micro-pillars 127 can increase the flow resistance and effectively prevent backflow.
  • the structure of disposing a plurality of micro-pillars 127 in the gap 123 in the sixth embodiment of the heating element 12 can also be applied to other embodiments of the heating element 12, which can be specifically designed as required.
  • FIG. 11 is a schematic structural diagram of a seventh embodiment of the heating element provided by the present application.
  • the difference between the seventh embodiment of the heating element 12 and the first embodiment of the heating element 12 is that in the seventh embodiment of the heating element 12, along the thickness direction of the first base 121, the diameter of the first micropores 1213 gradually increases. When the size of the first micro-hole 1213 becomes larger, the constricted opening of the first micro-hole 1213 is located on the first surface 1211 , and the expansion opening of the first micro-hole 1213 is located on the second surface 1212 .
  • the seventh embodiment of the heating element 12 except that the longitudinal cross-sectional shape of the first micro-hole 1213 is different from that of the first embodiment of the heating element 12, the arrangement of other structures is the same as that of the first embodiment of the heating element 12, and will not be repeated.
  • the constriction opening of the first micropore 1213 By arranging the constriction opening of the first micropore 1213 on the first surface 1211 , the constriction opening is communicated with the liquid storage cavity 13 , and the expansion opening is communicated with the gap 123 , so that the first micropore 1213 on the first substrate 121 can be ensured to be stably under liquid. , the gap 123 can be fully filled; at the same time, the arrangement of the first micro-holes 1213 can prevent the aerosol generation matrix from flowing back from the gap 123 to the liquid storage cavity 13, and ensure that after the suction is completed, the gas will not enter the liquid storage cavity 13 .
  • the first micro-holes 1213 are along the thickness direction of the first base body 121 , and the longitudinal cross-sections of the first micro-holes 1213 are trapezoidal.
  • the longitudinal section of the first microhole 1213 is a rectangle and a trapezoid for comparison.
  • the arrangement of the first micro-holes 1213 in the seventh embodiment of the heating element 12 can also be applied to other embodiments of the heating element 12, which can be specifically designed as required.
  • FIG. 12 is a schematic structural diagram of a first experimental piece
  • FIG. 13 is a structural schematic diagram of a second experimental piece
  • FIG. 14 is a structural schematic diagram of a third experimental piece.
  • the first test piece includes a liquid collection chamber 30 and a pipeline 31, and the longitudinal section of the pipeline 31 is rectangular.
  • the second test piece includes a liquid collection chamber 30 and a pipeline 31 .
  • the longitudinal section of the pipeline 31 is a trapezoid, and the expansion port of the trapezoid is connected to the liquid collection chamber 30 .
  • the third test piece includes a liquid collecting chamber 30 and a pipeline 31 .
  • the longitudinal section of the pipeline 31 is a trapezoid, and the trapezoidal constriction port communicates with the liquid collecting chamber 30 .
  • the first micro-holes 1213 can be arranged along the thickness direction of the first substrate 121 , the diameter of the first micro-holes 1213 is gradually increased, the shrinkage openings of the first micro-holes 1213 are located on the first surface 1211 , and the first micro-holes 1213
  • the expansion opening of 1213 is located on the second surface 1212 , so that the aerosol-generating matrix protruding from the first micropores 1213 is more likely to contact the surface of the second substrate 122 , and then the aerosol-generating substrate communicates with the second micropores 1223 of the second substrate 122 , to speed up the drainage speed.

Landscapes

  • Special Spraying Apparatus (AREA)
  • Resistance Heating (AREA)
  • Nozzles (AREA)
  • Fuel-Injection Apparatus (AREA)

Abstract

本申请公开了一种发热组件、雾化器及电子雾化装置，发热组件包括第一基体和第二基体；第一基体具有相对设置的第一表面和第二表面，第一表面为吸液面；第一基体具有多个第一微孔，第一微孔用于将气溶胶生成基质从吸液面导引至第二表面；第二基体具有相对设置的第三表面和第四表面，第四表面为雾化面；第二表面与第三表面相对设置；第二基体为致密基体，第二基体上设有多个贯穿第三表面和第四表面的第二微孔，第二微孔用于将气溶胶生成基质从第三表面导引至雾化面；其中，第一基体和/或第二基体形成流道，流道连通第一微孔和第二微孔，通过流道可以排除气泡，避免了在吸液面上形成气泡阻塞供液，进而避免了干烧。

Description

发热组件、雾化器及电子雾化装置 技术领域
本申请涉及电子雾化技术领域，尤其涉及一种发热组件、雾化器及电子雾化装置。
背景技术
电子雾化装置由发热体、电池和控制电路等部分组成，发热体作为电子雾化装置的核心元件，其特性决定了电子雾化装置的雾化效果和使用体验。
现有的发热体一种是棉芯发热体。棉芯发热体大多为弹簧状的金属发热丝缠绕棉绳或纤维绳的结构。待雾化的液态气溶胶生成基质被棉绳或纤维绳的两端吸取，然后传输至中心金属发热丝处加热雾化。由于棉绳或纤维绳的端部面积有限，导致气溶胶生成基质吸附、传输效率较低。另外，棉绳或纤维绳结构稳定性差，多次热循环后易出现干烧、积碳和焦糊味等现象。
现有的发热体另一种是陶瓷发热体。陶瓷发热体大多为在多孔陶瓷体表面形成金属发热膜；多孔陶瓷体起到导液、储液的作用，金属发热膜实现液态气溶胶生成基质的加热雾化。然而，由高温烧结制备的多孔陶瓷难以精确控制微孔的位置分布和尺寸精度。为了降低漏液风险，需要减小孔径、孔隙率，但为了实现充足的供液，需要增大孔径、孔隙率，二者相互矛盾。目前，在满足低漏液风险的孔径、孔隙率条件下，多孔陶瓷基体导液能力受限，在高功率条件下会出现焦糊味。
随着技术的进步，用户对电子雾化装置的雾化效果的要求越来越高，为了满足用户的需求，提供一种薄的发热体以提高供液能力，但这种薄的发热体易在吸液面形成气泡，阻塞进液，导致发热体干烧。
发明内容
本申请提供的发热组件、雾化器及电子雾化装置，解决现有技术中薄的发热体易在吸液面形成气泡的技术问题。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种发热组件，包括第一基体和第二基体；所述第一基体具有相对设置的第一表面和第二表面，所述第一表面为吸液面；所述第一基体具有多个第一微孔，所述第一微孔用于将气溶胶生成基质从所述吸液面导引至所述第二表面；所述第二基体具有相对设置的第三表面和第四表面，所述第四表面为雾化面；所述第二表面与所述第三表面相对设置；所述第二基体为致密基体，所述第二基体上设有多个贯穿所述第三表面和所述第四表面的第二微孔，所述第二微孔用于将所述气溶胶生成基质从所述第三表面导引至所述雾化面；其中，所述第一基体和/或所述第二基体形成流道，所述流道连通所述第一微孔和所述第二微孔。
其中，所述第二表面与所述第三表面之间间隔设置形成间隙，所述间隙作为所述流道。
其中，所述发热组件还包括间隔件；所述间隔件设置于所述第二表面和所述第三表面之间，且位于所述第一基体和/或所述第二基体边缘，以使所述第一基体与所述第二基体间隔设置形成所述间隙。
其中，所述间隔件为独立设置的垫片；或，所述间隔件为固定在所述第二表面和/或所述第三表面的支撑柱或支撑框；或，所述间隔件为与所述第一基体和/或所述第二基体一体成型的凸起。
其中，所述发热组件还包括密封件，所述密封件具有下液孔；所述下液孔的孔壁上设置有固定结构，以固定所述第一基体和/或所述第二基体，使所述第一基体与所述第二基体间隔设置形成所述间隙。
其中，沿着平行于所述第一基体的方向，所述间隙的高度相同。
其中，沿着平行于所述第一基体发热组件的方向，所述间隙的高度逐渐增大。
其中，所述间隙的高度从零逐渐增大。
其中，所述发热组件还包括多个微柱，多个所述微柱设置于所述间隙中。
其中，所述微柱的一端与所述第二表面抵接，所述微柱的另一端与所述第三表面间隔设置；或，所述微柱的一端与所述第三表面抵接，所述微柱的另一端与所述第二表面间隔设置；或，所述微柱的一端与所述第二表面抵接，所述微柱的另一端与所述第三表面抵接。
其中，所述第三表面设有多个沿第一方向延伸的第一凹槽和多个沿第二方向延伸的第二凹槽，所述第一凹槽与所述第二凹槽交叉设置；多个所述第一凹槽和多个所述第二凹槽形成所述流道。
其中，多个所述第二微孔呈阵列分布，每个所述第一凹槽对应一行或多行所述第二微孔，每个所述第二凹槽对应一列或多列所述第二微孔。
其中，所述第一凹槽的深度与宽度的比值为0-20，所述第二凹槽的深度与宽度的比值为0-20。
其中，所述第二表面设有多个沿第三方向延伸的第三凹槽和多个沿第四方向延伸的第四凹槽，所述第三凹槽与所述第四凹槽交叉设置；多个所述第一凹槽、多个所述第二凹槽、多个所述第三凹槽以及多个所述第四凹槽共同形成所述流道。
其中，所述第一基体为致密基体，所述第一微孔贯穿所述第一表面和所述第二表面；多个所述第一微孔呈阵列分布，每个所述第三凹槽对应一行或多行所述第一微孔，每个所述第四凹槽对应一列或多列所述第一微孔。
其中，所述第三凹槽的深度与宽度的比值为0-20，所述第四凹槽的深度与宽度的比值为0-20。
其中，所述第一凹槽、所述第二凹槽的毛细作用力大于所述第三凹槽、所述第四凹槽的毛细作用力。
其中，所述第二表面与所述第三表面间隔设置形成间隙。
其中，所述第二表面与所述第三表面接触。
其中，所述第一凹槽的深度、所述第二凹槽的深度大于所述第三凹槽的深度、第四凹槽的深度。
其中，所述第二微孔的中轴线与所述第三表面垂直。
其中，所述第二基体的厚度为0.1mm-1mm，所述第二微孔的孔径为1μm-100μm。
其中，所述第二基体的厚度与所述第二微孔的孔径的比值为20:1-3:1。
其中，相邻的所述第二微孔的孔中心距与所述第二微孔的孔径的比值为3:1-5:1。
其中，所述第一基体为致密基体，所述第一微孔贯穿所述第一表面和所述第二表面。
其中，所述第二微孔的毛细作用力大于所述第一微孔的毛细作用力。
其中，沿着所述第一基体的厚度方向，所述第一微孔的孔径逐渐变大；所述第一微孔的收缩口位于第一表面，所述第一微孔的扩张口位于第二表面。
其中，所述第一基体上设置所述第一微孔的区域在所述第二基体上的投影完全覆盖所述第二基体上设置所述第二微孔的区域。
其中，所述第一微孔的孔径为1μm-100μm。
其中，所述第一基体的厚度小于所述第二基体的厚度。
其中，所述发热组件还包括发热元件，所述发热元件为设置于所述雾化面上的独立元件；或，所述第二基体具有导电功能。
其中，所述第一基体在所述雾化面上的投影完全覆盖所述发热元件。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种发热组件，包括第一基体和第二基体；所述第一基体具有相对设置的第一表面和第二表面，所述第一表面为吸液面；所述第一基体具有多个第一微孔所述第一微孔用于将气溶胶生成基质从所述吸液面导引至所述第二表面；所述第二基体具有相对设置的第三表面和第四表面，所述第四表面为雾化面；所述第二表面与所述第三表面相对设置；所述第二基体具有多个第二微孔，所述第二微孔用于将所述气溶胶生成基质从所述第三表面导引至所述雾化面；其中，所述第一基体和/或所述第二基体形成流道，所述流道连通所述第一微孔和所述第二微孔。
为了解决上述技术问题，本申请提供的第三个技术方案为：提供一种雾化器，包括储液腔和发热组件；所述储液腔用于储存气溶胶生成基质；所述发热组件与所述储液腔流体连通，所述发热组件用于雾化所述气溶胶生成基质；所述发热组件为上述任意一项所述的发热组件。
为了解决上述技术问题，本申请提供的第四个技术方案为：提供一种电子雾化装置，包括雾化器和主机；所述雾化器为上述所述的雾化器；所述主机用于为所述雾化器工作提供电 能和控制所述发热组件雾化所述气溶胶生成基质。
本申请提供的发热组件、雾化器及电子雾化装置，发热组件包括第一基体和第二基体；第一基体具有相对设置的第一表面和第二表面，第一表面为吸液面；第一基体具有多个第一微孔，第一微孔用于将气溶胶生成基质从吸液面导引至第二表面；第二基体具有相对设置的第三表面和第四表面，第四表面为雾化面；第二表面与第三表面相对设置；第二基体为致密基体，第二基体上设有多个贯穿第三表面和第四表面的第二微孔，第二微孔用于将气溶胶生成基质从第三表面导引至雾化面；其中，第一基体和/或第二基体形成流道，流道连通第一微孔和第二微孔，通过流道可以排除气泡，避免了在吸液面上形成气泡阻塞供液，进而避免了干烧。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请提供的电子雾化装置的一实施例的结构示意图；
图2是本申请一实施例提供的雾化器的结构示意图；
图3a是本申请提供的发热组件第一实施例的结构示意图；
图3b是图3a提供的发热组件中第二基体从雾化面一侧观看的结构示意图；
图3c是图3a提供的发热组件中第一基体从吸液面一侧观看的结构示意图；
图3d是图3a提供的发热组件中间隔件另一实施方式的结构示意图；
图4是本申请提供的发热组件第二实施例的结构示意图；
图5a是本申请提供的发热组件第二实施例中密封件另一实施方式的结构示意图；
图5b是图5a提供的密封件与第一致密基质、第二基体的装配结构示意图；
图6a是本申请提供的发热组件第二实施例中密封件又一实施方式的结构示意图；
图6b是图6a提供的密封件与第一致密基质、第二基体的装配结构示意图；
图7a是本申请提供的发热组件第三实施例的结构示意图；
图7b是图7a提供的发热组件中第二基体从第三表面一侧观看的局部结构示意图；
图7c是图7a提供的发热组件中第一基体从第二表面一侧观看的局部结构示意图；
图8是本申请提供的发热组件第三实施例的另一结构示意图；
图9a是本申请提供的发热组件第四实施例的俯视结构示意图；
图9b是图9a提供的发热组件沿B-B方向的截面示意图；
图9c是图9a提供的发热组件沿C-C方向的截面示意图；
图9d是本申请提供的发热组件第四实施例中进液口另一实施方式的结构示意图；
图9e是本申请提供的发热组件第四实施例中进液口又一实施方式的结构示意图；
图10a是本申请提供的发热组件第五实施例的俯视结构示意图；
图10b是本申请提供的发热组件第五实施例中进液口另一实施方式的结构示意图；
图10c是本申请提供的发热组件第五实施例中进液口又一实施方式的结构示意图；
图10d是本申请提供的发热组件第六实施例的结构示意图；
图11是本申请提供的发热组件第七实施例的结构示意图；
图12是第一实验件的结构示意图；
图13是第二实验件的结构示意图；
图14是第三实验件的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、接口、技术之类的具体细节，以便透彻理解本申请。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相 对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个所述特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果所述特定姿态发生改变时，则所述方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现所述短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
下面结合附图和实施例对本申请进行详细的说明。
请参阅图1，图1是本申请提供的电子雾化装置的一实施例的结构示意图。在本实施例中，提供一种电子雾化装置100。该电子雾化装置100可用于气溶胶生成基质的雾化。电子雾化装置100包括相互电连接的雾化器1和主机2。
其中，雾化器1用于存储气溶胶生成基质并雾化气溶胶生成基质以形成可供用户吸食的气溶胶。该雾化器1具体可用于不同的领域，比如，医疗、美容、休闲吸食等；在一具体实施例中，该雾化器1可用于电子气溶胶化装置，用于雾化气溶胶生成基质并产生气溶胶，以供抽吸者抽吸，以下实施例均以此休闲吸食为例；当然，在其他实施例中，该雾化器1也可应用于喷发胶设备，以雾化用于头发定型的喷发胶；或者应用于治疗上下呼吸系统疾病的设备，以雾化医用药品。
雾化器1的具体结构与功能可参见以下任一实施例所涉及的雾化器1的具体结构与功能，且可实现相同或相似的技术效果，在此不再赘述。
主机2包括电池(图未示)和控制器(图未示)。电池用于为雾化器1的工作提供电能，以使得雾化器1能够雾化气溶胶生成基质形成气溶胶；控制器用于控制雾化器1工作。主机2还包括电池支架、气流传感器等其他元件。
雾化器1与主机2可以是一体设置，也可以是可拆卸连接，可以根据具体需要进行设计。
请参阅图2，图2是本申请一实施例提供的雾化器的结构示意图。
雾化器1包括壳体10、雾化座11和发热组件12。壳体10具有储液腔13、出气通道14，储液腔13用于储存液态的气溶胶生成基质，储液腔13环绕出气通道14设置。壳体10的端部还具有抽吸口15，抽吸口15与出气通道14连通；具体地，可以是出气通道14的一端口形成抽吸口15。壳体10在储液腔13背离抽吸口15的一侧具有容置腔16，雾化座11设置于容置腔16中。雾化座11包括雾化顶座111和雾化底座112。雾化顶座111和雾化底座112配合形成收容腔113；即，雾化座11具有收容腔113。发热组件12设置于收容腔113中，同雾化座11一起设置于容置腔16中。
雾化顶座111上设置有两个流体通道114，具体的，雾化顶座111的顶壁上设置有两个流体通道114，两个流体通道114设置于出气通道14的两侧。流体通道114的一端与储液腔13连通，另一端与收容腔113连通，即，流体通道114使储液腔13与收容腔113连通，以使储液腔13中的气溶胶生成基质通道流体通道114进入发热组件12。也就是说，发热组件12与储液腔13流体相通，发热组件12用于吸收并加热雾化气溶胶生成基质。主机2的控制器控制发热组件12雾化气溶胶生成基质。
在本实施例中，发热组件12远离储液腔13的表面为雾化面，发热组件12的雾化面与收容腔113的内壁面之间形成雾化腔115，雾化腔115与出气通道14连通。雾化底座112上设置有进气口116，以使外界与雾化腔115连通。外界气体通过进气口116进入雾化腔115，携带发热组件12雾化好的气溶胶进入出气通道14，最终到达抽吸口15，被用户吸食。
雾化器1还包括导通件17，导通件17固定于雾化底座112。导通件17的一端于发热组件12电连接，另一端用于与主机2电连接，以使发热组件12能够工作。
雾化器1还包括密封顶盖18。密封顶盖18设置于雾化顶座111靠近储液腔13的表面，用于实现对储液腔13与雾化顶座111、出气通道14之间的密封，防止漏液。可选的，密封 顶盖18的材料为硅胶或氟橡胶。
请参阅图3a、3b、3c，图3a是本申请提供的发热组件第一实施例的结构示意图，图3b是图3a提供的发热组件中第二基体从雾化面一侧观看的结构示意图，图3c是图3a提供的发热组件中第一基体从吸液面一侧观看的结构示意图。
发热组件12包括第一基体121和第二基体122。第一基体121具有相对设置的第一表面1211和第二表面1212，第一表面1211为吸液面；第一基体121具有多个第一微孔1213，第一微孔1213用于将气溶胶生成基质从第一表面1211导引至第二表面1212，即，第一微孔1213用于将气溶胶生成基质从吸液面导引至第二表面1212。第二基体122具有相对设置的第三表面1221和第四表面1222，第四表面1222为雾化面；第二基体122具有多个第二微孔1223，第二微孔1223用于将气溶胶生成基质从第三表面1221导引至第四表面1222，即，第二微孔1223用于将气溶胶生成基质从第三表面1221导引至雾化面。其中，第二表面1212与第三表面1221相对设置。第一基体121和/或第二基体122形成流道，流道连通第一微孔1213和第二微孔1223。可以理解。气溶胶生成基质在重力和/或毛细作用力的作用下从吸液面流至雾化面。
通过上述设置，本申请提供的发热组件12具有较高的供液能力，且通过流道可以避免在吸液面上形成大气泡阻塞供液，进而避免了干烧。
在本实施例中，第二表面1212与第三表面1221之间间隔设置形成间隙123，该间隙123作为上述的流道；也就是说，第一基体121的第二表面1212与第二基体122的第三表面1221配合形成流道。通过在第一基体121和第二基体122之间形成间隙123，可以排除雾化过程中从雾化面进入的气泡，避免了在吸液面上形成气泡阻塞供液，防止气泡进入储液腔13阻碍供液，进而避免了干烧。
第一基体121可以是多孔基体，例如，多孔陶瓷、棉、石英砂芯、泡沫结构的材料；第一基体121也可以是致密基体。当第一基体121为致密基体时，第一基体121的材质为玻璃、致密陶瓷或硅。当第一基体121的材质为玻璃时，可以为普通玻璃、石英玻璃、硼硅玻璃、光敏铝硅酸锂玻璃中的一种。在一具体实施方式中，第一基体121为硼硅玻璃。在另一具体实施方式中，第一基体121为光敏铝硅酸锂玻璃。
第二基体122可以是多孔基体，例如，多孔陶瓷、棉、石英砂芯、泡沫结构的材料；第二基体122也可以是致密基体。当第二基体122为致密基体时，第二基体122的材质为玻璃、致密陶瓷或硅。当第二基体122的材质为玻璃时，可以为普通玻璃、石英玻璃、硼硅玻璃、光敏铝硅酸锂玻璃中的一种。在一具体实施方式中，第二基体122为硼硅玻璃。在另一具体实施方式中，第二基体122为光敏铝硅酸锂玻璃。
第一基体121和第二基体122的材料可以相同，也可以不同。第一基体121和第二基体122之间可以任意组合，例如，第一基体121为多孔陶瓷，第二基体122为致密基体；再例如，第一基体121为多孔陶瓷，第二基体122为多孔陶瓷；再例如，第一基体121为致密基体，第二基体122为多孔陶瓷；再例如，第一基体121为致密基体，第二基体122为致密基体。
下面以第一基体121为致密基体，第二基体122为致密基体为例，对发热组件12进行详细介绍。
第一基体121为致密基体，第一基体121具有多个贯穿第一表面1211和第二表面1212的第一微孔1213。第二基体122为致密基体，第二基体122具有多个贯穿第三表面1221和第四表面1222的第二微孔1223。其中，第一微孔1213和第二微孔1223均具有毛细作用力。第一微孔1213利用其毛细作用力，将气溶胶生成基质从第一基体121的吸液面导引至间隙123；第二微孔1223利用其毛细作用力，将气溶胶生成基质从间隙123导引至第二基体122的雾化面。
可以理解，第一基体121为多孔陶瓷时，第一基体121利用其自身的毛细作用力将气溶胶生成基质从第一基体121的吸液面导引至间隙123；第二基体122为多孔陶瓷时，第二基体122利用其自身的毛细作用力将气溶胶生成基质从间隙123导引至第二基体122的雾化面。
可以理解，将第二基体122设为致密基体，在第二基体122上设贯穿第三表面1221和第四表面1222的第二微孔1223，更容易导液连通第一基体121的第一微孔1213，利于提高供液效率。
间隙123的高度小于等于200μm，间隙123的高度为第二表面1212与第三表面1221 之间的距离。当间隙123的高度大于200μm，存在从第一微孔1213和/或第二微孔1223漏液的风险，且存在气泡横向合并长大的风险。当间隙123的高度过小，间隙123无法很好的实现排除经第二微孔1223进入的气泡。在一具体实施方式中，间隙123的高度小于等于50μm。在另一具体实施方式中，间隙123的高度小于等于20μm。
通过设置间隙123，可以实现横向补液，即使气泡粘附在第一基体121的吸液面上，覆盖了部分第一微孔1213，也不影响第二基体122的供液。进一步，间隙123的高度设置为上述范围限缩了气泡长大的范围，比较难形成脱离第二微孔1223的气泡，气泡塌缩时从雾化面排出，从而防止大气泡附着在第一基体121的吸液面上，影响供液。
在本实施例中，如图3b所示，发热组件12还包括发热元件124、正电极128和负电极129，发热元件124的两端分别与正电极128、负电极129电连接。正电极128和负电极129均设置于第二基体122的雾化面上，以便于与主机2电连接。发热元件124可以是发热片、发热膜、发热网等，能够加热雾化气溶胶生成基质即可。发热元件124可以设置在第二基体122的雾化面上，也可以埋设于第二基体122的内部，具体根据需要进行设计。在另一实施方式中，第二基体122具有导电功能，其本身可以发热，例如，自身发热的导电陶瓷或具有导电功能的玻璃，此时无需另设发热元件124。也就是说，发热元件124为可选结构。
当发热元件124为另设的元件时，第一基体121在雾化面上的投影完全覆盖发热元件124，以保证供液速度能够满足发热元件124的雾化速度，实现较好的雾化效果。
进一步，通过在第二基体122靠近储液腔13的一侧设置第一基体121，第一基体121可以在一定程度上隔热，防止第二基体122上的热量传导至储液腔13，利于保证口感的一致性。
参见图3b，本实施方式中，仅在第二基体122的部分表面以阵列排布的方式设置多个第二微孔1223。具体地，第二基体122设有微孔阵列区1224和围绕微孔阵列区1224一周设置的留白区1225，微孔阵列区1224具有多个第二微孔1223；发热元件124设置于微孔阵列区1224，以加热雾化气溶胶生成基质；正电极128和负电极129设置于雾化面(第四表面1222)的留白区1225，以保证正电极128和负电极129电连接的稳定性。
通过在第二基体122上设有微孔阵列区1224和围绕微孔阵列区1224一周设置的留白区1225，可以理解，留白区1225上并未设置第二微孔1223，减少了第二基体122上第二微孔1223的数量，以此提高第二基体122的强度，降低在第二基体122上设置第二微孔1223的生产成本。第二基体122中的微孔阵列区1224作为雾化区，覆盖发热元件124及发热元件124周边区域，也就是基本覆盖达到雾化气溶胶生成基质温度的区域，充分利用了热效率。
可以理解，本申请中的第二基体122的微孔阵列区1224周边的区域的尺寸大于第二微孔1223的孔径，才能称之为留白区1225；即，本申请中的留白区1225是可以形成第二微孔1223而没有形成第二微孔1223的区域，而非微孔阵列区1224周边的无法形成第二微孔1223的区域。在一个实施例中，距离第二基体122的边线最近的第二微孔1223与第二基体122的边线之间的间距大于第二微孔1223的孔径，才认为在微孔阵列区1224的周向上设有留白区1225。
第一基体121上是整个表面均设置有第一微孔1213还是仅在部分表面设置第一微孔1213可以根据需要进行设计。可选的，参见图3c，第一基体121设有微孔阵列区1214和围绕微孔阵列区1214一周设置的留白区1215，微孔阵列区1214具有多个第一微孔1213。
第一基体121和第二基体122的形状可以为平板状、圆筒状、弧状等，具体根据需要进行设计；第一基体121和第二基体122的形状配合设置，能够在第一基体121和第二基体122之间形成间隙123即可。例如，图3a提供的发热组件12的第一基体121和第二基体122均为平板状。第一基体121和第二基体122的形状和大小可以相同，也可以不同。本实施例中，如图3a所示，第一基体121和第二基体122的形状和大小均相同，且投影完全重叠设置。
第一基体121和第二基体122可以设置为规则的形状，如矩形板状、圆形板状等。设置于第一基体121上的多个第一微孔1213呈阵列排布；即，设置于第一基体121上的多个第一微孔1213之间呈规则排布，多个第一微孔1213中相邻的第一微孔1213之间的孔中心距相同。设置于第二基体122上的多个第二微孔1223呈阵列排布；即，设置于第二基体122 上的多个第二微孔1223之间呈规则排布，多个第二微孔1223中相邻的第二微孔1223之间的孔中心距相同。
第一微孔1213的延伸方向可以与第一基体121的厚度方向平行，也可以与第一基体121的厚度方向形成夹角，夹角的范围为80度-90度。第一微孔1213的横截面可以为圆形，纵截面可以为矩形。第二微孔1223的延伸方向可以与第二基体122的厚度方向平行，也可以与第二基体122的厚度方向形成夹角，夹角的范围为80度-90度。第二微孔1223的横截面可以为圆形，纵截面为可以矩形等。第一微孔1213和第二微孔1223的纵截面形状及其延伸方向可以根据需要进行设计。本实施例中，第一微孔1213和第二微孔1223均为平行于第一基体121或第二基体122厚度方向的直通孔；即，第一微孔1213的中轴线与第一表面1211垂直，第二微孔1223的中轴线与第三表面1221垂直。
在本实施方式中，第一基体121上设置第一微孔1213的区域在第二基体122上的投影完全覆盖第二基体122上设置第二微孔1223的区域，以保证供液速度能够满足设于第二基体122的雾化面上的发热元件124的雾化速度，实现较好的雾化效果。
第一基体121上第一微孔1213的孔径为1μm-100μm。第一微孔1213的孔径小于1μm时，无法满足供液需求，导致气溶胶量下降；第一微孔1213的孔径大于100μm时，气溶胶生成基质容易从第一微孔1213内流出造成漏液，导致雾化效率下降。可以理解的是，第一基体121的孔径根据实际需要进行选择。
第二基体122上第二微孔1223的孔径为1μm-100μm。第二微孔1223的孔径小于1μm时，无法满足供液需求，导致气溶胶量下降；第二微孔1223的孔径大于100μm时，气溶胶生成基质容易从第二微孔1223内流出造成漏液，导致雾化效率下降。可选的，第二微孔1223的孔径为20μm-50μm。可以理解的是，第二基体122的孔径根据实际需要进行选择。
可选的，第一微孔1213的孔径大于第二微孔1223的孔径(如图3a所示)，以使第二微孔1223的毛细作用力大于第一微孔1213的毛细作用力，气溶胶生成基质能够从间隙123流至第二基体122的雾化面。由于第一微孔1213也具有毛细作用力，抽吸口15朝下使用时，可以防止液体回流，防止供液不足。
第二基体122的厚度为0.1mm-1mm。第二基体122的厚度大于1mm时，无法满足供液需求，导致气溶胶量下降，且造成的热损失多，设置第二微孔1223的成本高；第二基体122的厚度小于0.1mm时，无法保证第二基体122的强度，不利于提高电子雾化装置的性能。可选的，第二基体122的厚度为0.2mm-0.5mm。可以理解的是，第二基体122的厚度根据实际需要进行选择。
第一基体121的厚度为0.1mm-1mm。可选的，第一基体121的厚度小于第二基体122的厚度，其中，第一基体121的厚度为第一表面1211与第二表面1212之间的距离，第二基体122的厚度为第三表面1221与第四表面1222之间的距离。
第二基体122厚度与第二微孔1223孔径的比例为20:1-3:1，以提升供液能力。当第二基体122的厚度与第二微孔1223的孔径的比例大于20:1时，通过第二微孔1223的毛细作用力供给的气溶胶生成基质难以满足发热元件124的雾化需求量，不仅容易导致干烧，且单次雾化产生的气溶胶量下降；当第二基体122的厚度与第二微孔1223的孔径的比例小于3:1时，气溶胶生成基质容易从第二微孔1223内流出造成浪费，导致雾化效率下降，进而使得总气溶胶量降低。可选的，第二基体122厚度与第二微孔1223孔径的比例为15:1-5:1。
相邻两个第二微孔1223之间的孔中心距与第二微孔1223的孔径的比例为3:1-1.5:1，以使第二基体122上的第二微孔1223在满足供液能力的前提下，尽可能提升第二基体122的强度；可选的，相邻两个第二微孔1223之间的孔中心距与第二微孔1223的孔径的比例为3:1-2:1；进一步可选的，相邻两个第二微孔1223之间的孔中心距与第二微孔1223的孔径的比例为3:1-2.5:1。
在本实施例中，发热组件12还包括间隔件125。间隔件125设置于第一基体121的第二表面1212和第二基体122的第三表面1221之间，且位于第一基体121和/或第二基体122边缘，以使第一基体121与第二基体122间隔设置形成间隙123。
在一实施方式中，沿着平行于第一基体121的方向，间隙123的高度相同；也就是说，第二表面1212与第三表面1221平行设置。例如，第二表面1212与第三表面1221之间设置了两个等高的间隔件125，且两个等高的间隔件125位于第一基体121和第二基体122的相 对两端的边缘(如图3a所示)；或者第二表面1212与第三表面1221之间设置等高的环形间隔件125，例如胶框。
请参阅图3d，图3d是图3a提供的发热组件中间隔件另一实施方式的结构示意图。
在另一实施方式中，沿着平行与第一基体121的方向，间隙123的高度逐渐增大；例如沿着第一基体121的长度方向、宽度方向或对角线方向间隙123的高度逐渐增大。也就是说，第二表面1212与第三表面1221非平行设置。可选的，间隙123的高度从零逐渐增大，例如，第二表面1212与第三表面1221之间仅设置了一个间隔件125，间隔件125位于第一基体121和第二基体122一端的边缘(如图3d所示)，而第一基体121和第二基体122另一端的边缘接触。再例如，两个不同高度的间隔件125位于第一基体121和第二基体122的相对两端的边缘。通过设置高度不均匀的间隙123，使得间隙123之间的液体容易在间隙123之间横向流动，可以防止间隙123中的气泡堵在第一微孔1213或第二微孔1223的端口，更好的排出气泡，降低气泡对供液速度的影响。
下面对沿着平行于第一基体121的方向，间隙123的高度相同的方案中的间隔件125的结构进行具体介绍。
具体地，当第一基体121在第二基体122上的投影与第二基体122完全重合，即，第一基体121与第二基体122的结构、尺寸完全相同时，间隔件125位于第一基体121和第二基体122的边缘(如图3a所示)。当第一基体121在第二基体122上的投影完全覆盖第二基体122，即，第一基体121的尺寸大于第二基体122时，间隔件125位于第二基体122的边缘及第一基体121靠近一侧边处。当第二基体122在第一基体121上的投影完全覆盖第一基体121，即，第二基体122的尺寸大于第一基体121时，间隔件125位于第一基体121的边缘及第二基体122靠近一侧边处。也就是说，间隔件125的设置位置可以根据第一基体121和第二基体122的具体尺寸设置来确定，能够使第一基体121、第二基体122和间隔件125围设形成间隙123即可。
其中，间隔件125可以沿着第一基体121和第二基体122的周向设置，即间隔件125为环状结构，以避免间隙123中的气溶胶生成基质漏出。间隔件125也可以为多个且沿着第一基体121和第二基体122的周向间隔设置，通过密封件126密封第一基体121和第二基体122的周向。
在一实施方式中，间隔件125为独立设置的垫片，垫片与第一基体121、第二基体122为可拆卸连接，垫片为环状结构。具体操作为：在第一基体121上形成第一微孔1213，在第二基体122上形成第二微孔1223，然后将垫片设置于第一基体121与第二基体122之间，具体地，垫片设置于第一基体121的留白区1215与第二基体122的留白区1225之间。例如，间隔件125可以为硅胶框或塑胶框。
在另一实施方式中，间隔件125为固定在第一基体121的第二表面1212和/或第二基体122的第三表面1221的支撑柱或支撑框，支撑柱或支撑框通过卡固或焊接的方式固定于第一基体121的第二表面1212和/或第二基体122第三表面1221。具体操作为：在第一基体121上形成第一微孔1213，在第二基体122上形成第二微孔1223，然后将通过焊接或卡固的方式，使支撑柱或支撑框与第一基体121、第二基体122成一体。例如，第一基体121和第二基体122为玻璃板，在第一基体121边缘涂敷玻璃粉，其后在盖上第二基体122后用激光将玻璃粉烧结为玻璃以将支撑柱或支撑框与第一基体121、第二基体122固定。
在又一实施方式中，间隔件125为与第一基体121和/或第二基体122一体成型的凸起。若间隔件125为与第一基体121一体成型的凸起，在第一基体121上形成第一微孔1213，在第二基体122上形成第二微孔1223，然后将第二基体122搭接于凸起上以形成间隙123。若间隔件125为与第二基体122一体成型的凸起，在第一基体121上形成第一微孔1213，在第二基体122上形成第二微孔1223，然后将第一基体121搭接于凸起上以形成间隙123。例如，在第一基体121的第二表面1212蚀刻形成凹槽，凹槽的侧壁作为间隔件125，第一微孔1213形成于凹槽的底壁；第二基体122的第三表面1221为平面，第二基体122的第三表面1221搭接于第二表面1212的凹槽的侧壁端面上，即第二基体122的第三表面1221与第一基体121的第二表面1212贴合，第三表面1221与凹槽配合形成间隙123。如果将凹槽的底面解释为第二表面1212，则凹槽的侧壁可以解释为第二表面1212的凸起。
发热组件12还包括密封件126，密封件126具有下液孔1261，下液孔1261通过流体通道114与储液腔13流体连通。第一基体121和/或第二基体122嵌设于下液孔1261中，即， 密封件126用于密封第一基体121和/或第二基体122的周边，防止漏液。可选的，第一基体121和第二基体122设于下液孔1261中。当密封件126包覆第二基体122的周边时，密封件126并未遮挡发热元件124，下液孔1261能够使发热元件124完全暴露。本实施例中，下液孔1261的孔壁具有环形安装槽(未图示)，第一基体121和/或第二基体122的边缘嵌设在环形安装槽中。
请参阅图4，图4是本申请提供的发热组件第二实施例的结构示意图。
发热组件12第二实施例与发热组件12第一实施例相比，不同之处在于：发热组件12第一实施例中通过间隔件125来保持第一基体121与第二基体122之间的间隙123，而发热组件12第二实施例中通过密封件126来保持第一基体121与第二基体122之间的间隙123，无需专门另设间隔件125。发热组件12第二实施例中除了实现保持间隙123的方式与发热组件12第一实施例不同，其他结构的设置方式均与发热组件12第一实施例相同，不再赘述。
在发热组件12的第二实施例中，密封件126的下液孔1261的孔壁上设置有固定结构1261a，以固定第一基体121和/或第二基体122，并使第一基体121与第二基体122间隔设置形成间隙123。固定结构1261a的具体设置方式如下。
在一实施方式中，下液孔1261的孔壁上间隔设置有第一安装槽1261b和第二安装槽1261c，第一安装槽1261b和第二安装槽1261c均为环形槽，第一安装槽1261b和第二安装槽1261c作为固定结构1261a。第一安装槽1261b与第二安装槽1261c有一共用的侧壁。第一基体121的周缘嵌设于第一安装槽1261b中，第二基体122的周缘嵌设于第二安装槽1261c中，第一安装槽1261b与第二安装槽1261c共用的侧壁使第一基体121与第二基体122保持间隔设置且使其之间形成间隙123(如图4所示)。
请参阅图5a和图5b，图5a是本申请提供的发热组件第二实施例中密封件另一实施方式的结构示意图，图5b是图5a提供的密封件与第一致密基质、第二基体的装配结构示意图。
在一实施方式中，下液孔1261包括相互连通的第一子下液孔1261d和第二子下液孔1261e，第一子下液孔1261d的孔径大于第二子下液孔1261e的孔径，使得第一子下液孔1261d与第二子下液孔1261e之间形成台阶结构A，第二子下液孔1261e的孔壁上设置有环形凸起B。该台阶结构A和环形凸起B作为固定结构1261a。第一基体121的周缘搭接于台阶结构的台阶面上，即，第一基体121的周缘搭接于第一子下液孔1261d与第二子下液孔1261e的连接面上；第二基体122的周缘搭接于环形凸起B上，第一基体121与第二基体122之间形成间隙123。可以理解，也可以通过第二基体122与第二子下液孔1261e的过盈配合实现对第二基体122的固定并形成间隙123。
请参阅图6a和图6b，图6a是本申请提供的发热组件第二实施例中密封件又一实施方式的结构示意图，图6b是图6a提供的密封件与第一致密基质、第二基体的装配结构示意图。
在一实施方式中，密封件126的下液孔1261的孔壁上设置有凸起1261f，形成第一台阶结构C和第二台阶结构D。凸起1261f与密封件126为一体成型结构。第一台阶结构C和第二台阶结构D作为固定结构1261a。第一基体121设于第一台阶结构C的台阶面，第二基体122设于第二台阶结构D的台阶面，第一基体121与第二基体122之间形成间隙123。
请参阅图7a和图7b，图7a是本申请提供的发热组件第三实施例的结构示意图，图7b是图7a提供的发热组件中第二基体从第三表面一侧观看的局部结构示意图。
发热组件12第三实施例与发热组件12第一实施例相比，不同之处在于：第一基体121和/或第二基体122形成流道的方式不同，除此之外的其他结构的设置方式均与发热组件12第一实施例相同，不再赘述。
不同于发热组件12的第一实施例，通过间隙123形成流道，在发热组件12第三实施例中，在第三表面1221设有多个沿第一方向延伸的第一凹槽1221a和多个沿第二方向延伸的第二凹槽1221b，第一凹槽1221a与第二凹槽1221b交叉设置，多个第一凹槽1221a和多个第二凹槽1221b形成上述的流道。在本实施例中，第一方向与第二方向垂直。
可以理解，在其他实施例中，也可以仅设置沿第一方向延伸的多个第一凹槽1221a或仅设置沿第二方向延伸的多个第二凹槽1221b，即，仅在一个方向连通相邻的第二微孔1223。第一凹槽1221a和/或第二凹槽1221b具有毛细作用，可以在横向导流气溶胶生成基质，使得气溶胶生成基质均匀进入多个第二微孔1223，从而起到横向补液作用。横向是指与第二微孔1223的延伸方向不平行的方向，例如垂直于第二微孔1223中轴线的方向。
进一步，通过在第三表面1221设置相互交叉的第一凹槽1221a和第二凹槽1221b，无 论第一基体121与第二基体122接触，还是第一基体121与第二基体122间隔设置，均能够避免第一基体121将第二基体122上的第二微孔1223覆盖，保证气溶胶生成基质能够流至雾化面，避免干烧。并且第一凹槽1221a和第二凹槽1221b还可以实现气溶胶生成基质的横向补液，进一步避免干烧。
多个第二微孔1223呈阵列分布，每个第一凹槽1221a对应一行或多行第二微孔1223，每个第二凹槽1221b对应一列或多列第二微孔1223，具体根据需要进行设计。在本实施例中，每个第一凹槽1221a对应一行第二微孔1223，每个第二凹槽1221b对应一列第二微孔1223(如图7b所示)。
第一凹槽1221a的深度与宽度的比值为0-20；当第一凹槽1221a的深度与宽度的比值大于20时，第一凹槽1221a所具有的毛细作用力无法实现较好的横向补液效果。在一具体实施方式中，第一凹槽1221a的深度与宽度的比值为1-5。
第二凹槽1221b的深度与宽度的比值为0-20；当第二凹槽1221b的深度与宽度的比值大于20时，第二凹槽1221b所具有的毛细作用力无法实现较好的横向补液效果。在一具体实施方式中，第二凹槽1221b的深度与宽度的比值为1-5。
请参阅图7c，图7c是图7a提供的发热组件中第一基体从第二表面一侧观看的局部结构示意图。
进一步，在第二表面1212设有多个沿第三方向延伸的第三凹槽1212a和多个沿第四方向延伸的第四凹槽1212b，第三凹槽1212a与第四凹槽1212b交叉设置；多个第一凹槽1221a、多个第二凹槽1221b、多个第三凹槽1212a以及多个第四凹槽1212b共同形成上述流道。在本实施例中，第三方向与第四方向垂直；第三方向与第一方向相同，第四方向与第二方向相同。
可以理解，在其他实施例中，也可以仅设置沿第三方向延伸的多个第三凹槽1212a或仅设置沿第四方向延伸的多个第四凹槽1212b，即，仅在一个方向连通相邻的第一微孔1213。第三凹槽1212a和/或第四凹槽1212b具有毛细作用，可以在横向导流气溶胶生成基质，使得气溶胶生成基质均匀进入多个第二微孔1223，从而起到横向补液作用。
多个第一微孔1213呈阵列分布，每个第三凹槽1212a对应一行或多行第一微孔1213，每个第四凹槽1212b对应一列或多列第一微孔1213，具体根据需要进行设计。在本实施例中，每个第三凹槽1212a对应一行第一微孔1213，每个第四凹槽1212b对应一列第一微孔1213(如图7c所示)。
第三凹槽1212a的深度与宽度的比值为0-20；当第三凹槽1212a的深度与宽度的比值大于20时，第三凹槽1212a所具有的毛细作用力无法实现较好的横向补液效果。在一具体实施方式中，第三凹槽1212a的深度与宽度的比值为0-5。
第四凹槽1212b的深度与宽度的比值为0-20；当第四凹槽1212b的深度与宽度的比值大于20时，第四凹槽1212b所具有的毛细作用力无法实现较好的横向补液效果。在一具体实施方式中，第四凹槽1212b的深度与宽度的比值为0-5。
第三表面1221上的第一凹槽1221a和第二凹槽1221b的毛细作用力大于第二表面1212上的第三凹槽1212a和第四凹槽1212b的毛细作用力。
可以理解，第二表面1212上的第三凹槽1212a和第四凹槽1212b为可选结构，根据需要进行设计。
在一实施方式中，第二表面1212与第三表面1221之间间隔设置形成间隙123(如图7a所示)，具体可以通过间隔件125形成间隙123(可参见发热组件12第一实施例)，也可以通过密封件126形成间隙123(可参见发热组件12的第二实施例)，不再赘述。也就是说，间隙123、多个第一凹槽1221a和多个第二凹槽1221b共同形成的流道；或间隙123、多个第一凹槽1221a、多个第二凹槽1221b、多个第三凹槽1212a和多个第四凹槽1212b共同形成的流道。其中，间隙123的高度为第二表面1212与第三表面1221之间的距离。
此时，在第二表面1212上的第三凹槽1212a和第四凹槽1212b为可选结构；当在第二表面1212上设有多个交叉的第三凹槽1212a和第四凹槽1212b，可以增加间隙123的储液量。第一基体121的主要作用是进液和阻挡气泡。其中，沿着平行于第一基体121的方向，间隙123的高度可以相同，也可以逐渐增大；当沿着平行于第一基体121的方向，间隙123的高度逐渐增大，沿着间隙123的高度逐渐减小的方向，间隙123的毛细作用力逐渐增大，利于气溶胶生成基质在间隙123中的流动，防止气泡滞留在间隙123中，也就是说，不均匀 的间隙123可以更有利于间隙123中的气溶胶生成基质的横向流动，从而更好地横向补液和排出气泡。
由于第一凹槽1221a和第二凹槽1221b具有毛细作用力，使其可以横向补液，结合间隙123可以保证气液分离，降低气泡对供液的影响。并且，通过在第三表面1221上设有多个交叉第一凹槽1221a和第二凹槽1221b，利于将间隙123中的气溶胶生成基质导引至第二微孔1223，有助于供液。具体地，在抽吸过程中，气体会通过第二微孔1223进入第一凹槽1221a和第二凹槽1221b，由于表面张力等原因，气泡更倾向于进入间隙123，从而使得第一凹槽1221a和第二凹槽1221b的畅通，进而保证供液；同时，通过间隙123可以防止大气泡到达吸液面进而进入储液腔13，间隙123的储液功能可以保证倒抽至少两口不会烧断。
请参阅图8，图8是本申请提供的发热组件第三实施例的另一结构示意图。
在另一实施方式中，第二表面1212与第三表面1221接触(如图8所示)。也就是说，多个第一凹槽1221a、多个第二凹槽1221b、多个第三凹槽1212a和多个第四凹槽1212b共同形成的流道。其中，第一凹槽1221a的深度和第二凹槽1221b的深度均大于第三凹槽1212a的深度和第四凹槽1212b的深度；可选的，第一凹槽1221a的深度与宽度的比值为2-5，第二凹槽1221b的深度与宽度的比值为2-5。可以理解，第一凹槽1221a的深度和第二凹槽1221b的深度均大于第三凹槽1212a的深度和第四凹槽1212b的深度，第一凹槽1221a的毛细作用力和第二凹槽1221b的毛细作用力均大于第三凹槽1212a的毛细作用力和第四凹槽1212b的毛细作用力。其中，第一凹槽1221a的深度和第二凹槽1221b的深度不能过大，否则在横向补液时会出现“分层”现象，贴近槽底的液体流动速度快，沿着远离槽底的方向液体的流动速度越来越慢，存在卡气泡的风险，甚至会导致气泡卡死在第一凹槽1221a中。
通过在第二表面1212上设有多个交叉的第三凹槽1212a和第四凹槽1212b，可以增加第一基体121与第二基体122之间的储液量，也可以防止第一基体121与第二基体122接触时，第一基体121将第二微孔1223堵住。
在其他实施方式中，可以通过使第一微孔1213的中轴线与第二微孔1223的中轴线重合的方式或第一微孔1213与第二微孔1223的端口至少部分重合的方式，来实现第一微孔1213与第二微孔1223的连通，以防止第一基体121与第二基体122接触时，第一基体121堵住第二微孔1223；此时，可以无需在第二表面1212上设多个交叉的第三凹槽1212a和第四凹槽1212b。
请参阅图9a、图9b、图9c、图9d、图9e，图9a是本申请提供的发热组件第四实施例的俯视结构示意图，图9b是图9a提供的发热组件沿B-B方向的截面示意图，图9c是图9a提供的发热组件沿C-C方向的截面示意图，图9d是本申请提供的发热组件第四实施例中进液口另一实施方式的结构示意图，图9e是本申请提供的发热组件第四实施例中进液口又一实施方式的结构示意图。
发热组件12第四实施例与发热组件12第一实施例相比，不同之处在于：发热组件12第四实施例中第一基体121的边缘一侧具有进液口1217，除此之外的其他结构的设置方式均与发热组件12第一实施例相同，不再赘述。
在发热组件12第四实施例中，第一基体121至少部分边缘与密封件126的下液孔1261的孔壁间隔设置形成进液口1217；或，第一基体121的边缘设置有缺口1216a或通孔1216b形成进液口1217。第二基体122横跨整个下液孔1261。
可选的，第一基体121相对的两条长边分别与下液孔1261的孔壁间隔设置形成两个对称设置的进液口1217(如图9a所示)。
可选的，第一基体121的边缘设置有缺口1216a，缺口1216a与下液孔1261的孔壁配合形成进液口1217；缺口1216a的开口大小及其数量根据需要进行设计(如图9d所示)。
可选的，第一基体121的边缘设置有通孔1216b形成进液口1217；通孔1216b的大小、形状及其数量根据需要进行设计(如图9e所示)。
第一基体121在雾化面上的投影完全覆盖发热元件124，进液口1217与发热元件124错位设置。进液口1217的截面尺寸大于第一微孔1213的孔径，即，气溶胶生成基质从进液口1217下液的速度大于从第一微孔1213下液的速度。通过在第一基体121上设置进液口1217，不仅可以通过进液口1217对间隙123进行补液，还可以通过进液口1217排除气泡，避免气泡进入储液腔13对供液的影响，进而避免干烧现象。
可以理解，在发热组件12第四实施例中，也可以通过密封件126的下液孔1261的孔壁 上设置有固定结构1261a，以固定第一基体121和/或第二基体122，并使第一基体121与第二基体122间隔设置形成间隙123，可参见发热组件12第二实施例，不再赘述。发热组件12第四实施例提供的进液口1217也可以应用于发热组件12的其他实施例，具体根据需要进行设计。
请参阅图10a、图10b、图10c，图10a是本申请提供的发热组件第五实施例的俯视结构示意图，图10b是本申请提供的发热组件第五实施例中进液口另一实施方式的结构示意图，图10c是本申请提供的发热组件第五实施例中进液口又一实施方式的结构示意图。
发热组件12第五实施例与发热组件12第一实施例相比，不同之处在于：发热组件12第五实施例中第一基体121的边缘一侧具有进液口1217，第一基体121上并未设置第一微孔1213，除此之外的其他结构的设置方式均与发热组件12第一实施例相同，不再赘述。
在发热组件12第五实施例中，第一基体121上并未设置第一微孔1213。第一基体121至少部分边缘与密封件126的下液孔1261的孔壁间隔设置形成进液口1217；或，第一基体121的边缘设置有缺口1216a或通孔1216b形成进液口1217。第二基体122横跨整个下液孔1261。
可选的，第一基体121相对的两条长边分别与下液孔1261的孔壁间隔设置形成两个对称设置的进液口1217(如图10a所示)。
可选的，第一基体121的边缘设置有缺口1216a，缺口1216a与下液孔1261的孔壁配合形成进液口1217；缺口1216a的开口大小及其数量根据需要进行设计(如图10b所示)。
可选的，第一基体121的边缘设置有通孔1216b形成进液口1217；通孔1216b的大小、形状及其数量根据需要进行设计(如图10c所示)。
第一基体121在雾化面上的投影完全覆盖发热元件124，进液口1217与发热元件124错位设置。通过在第一基体121上设置进液口1217，不仅可以通过进液口1217对间隙123进行补液，还可以通过进液口1217排除气泡，避免气泡进入储液腔13对供液的影响，进而避免干烧现象。
请参阅图10d，图10d是本申请提供的发热组件第六实施例的结构示意图。
发热组件12第六实施例与发热组件12第一实施例相比，不同之处在于：发热组件12还包括多个微柱127，多个微柱127设置于间隙123中。发热组件12第六实施例中除了在间隙123中还设置有多个微柱127与发热组件12第一实施例不同，其他结构的设置方式均与发热组件12第一实施例相同，不再赘述。
具体地，微柱127的一端与第一基体121的第二表面1212抵接，微柱127的另一端与第二基体122的第三表面1221间隔设置(第一方式)；或，微柱127的一端与第二基体122的第三表面1221抵接，微柱127的另一端与第一基体121的第二表面1212间隔设置(第二方式)；或，微柱127的一端与第一基体121的第二表面1212抵接，微柱127的另一端与第二基体122的第三表面1221抵接(第三方式)。
多个微柱127可以均第一方式；多个微柱127也可以均是第二方式；多个微柱127也可以均是第三方式；多个微柱127可以部分为第一方式，部分为第二方式，部分为第三方式。
微柱127可以是对第一基体121和第二基体122加工时产生的废料。例如，当第一基体121和第二基体122的材料为玻璃或硅时，微柱127可以是对第一基体121和第二基体122进行打孔时产生的微凸起；当第一基体121和第二基体122的材料为致密陶瓷时，微柱127可以是对第一基体121和第二基体122进行打孔后残留的熔渣。
通过在间隙123中设置微柱127，气溶胶生成基质进入第一微孔1213后，可以沿着微柱127爬进间隙123，从而很好的将间隙123充满气溶胶生成基质；各个微柱127之间可产生类似液桥的作用，实现横向补液的作用，且气溶胶生成基质与微柱127之间的粘附力可以增加流阻，有效防止回流。
可以理解，发热组件12第六实施例中的在间隙123中设置多个微柱127的结构也可以应用于发热组件12的其他实施例，具体根据需要进行设计。
请参阅图11，图11是本申请提供的发热组件第七实施例的结构示意图。
发热组件12第七实施例与发热组件12第一实施例相比，不同之处在于：发热组件12第七实施例中，沿着第一基体121的厚度方向，第一微孔1213的孔径逐渐变大，第一微孔1213的收缩口位于第一表面1211，第一微孔1213的扩张口位于第二表面1212。发热组件12第七实施例中除了在第一微孔1213的纵截面形状与发热组件12第一实施例不同，其他 结构的设置方式均与发热组件12第一实施例相同，不再赘述。
通过将第一微孔1213的收缩口设于第一表面1211，使得收缩口与储液腔13连通，扩张口与间隙123连通，可以保证第一基体121上的第一微孔1213下液稳定，能够充分填满间隙123；同时，第一微孔1213的该设置方式可以防止气溶胶生成基质从间隙123回流至储液腔13，且保证抽吸结束后，气体不会进入储液腔13。
在一实施方式中，第一微孔1213沿着第一基体121的厚度方向，第一微孔1213的纵截面为梯形。下面对第一微孔1213的纵截面为矩形和梯形进行对比。
可以理解，发热组件12第七实施例中的第一微孔1213的设置方式也可以应用于发热组件12的其他实施例，具体根据需要进行设计。
请参阅图12-图14，图12是第一实验件的结构示意图，图13是第二实验件的结构示意图，图14是第三实验件的结构示意图。
第一实验件包括集液腔30和管路31，管路31的纵截面为矩形。
第二实验件包括集液腔30和管路31，管路31的纵截面为梯形，梯形的扩张口连通集液腔30。
第三实验件包括集液腔30和管路31，管路31的纵截面为梯形，梯形的收缩口连通集液腔30。
通过对第一实验件、第二实验件和第三实验件进行实验，发现在表面张力的作用下，液体被封堵在管路31内，液面在管路31的开口处向下凸出(见图12-14)。在集液腔30相同液面高度的情况下，发现第三实验件中管路31开口处的液面向下凸出最多。因此，可以将第一微孔1213设置为沿着第一基体121的厚度方向，第一微孔1213的孔径逐渐变大，第一微孔1213的收缩口位于第一表面1211，第一微孔1213的扩张口位于第二表面1212，从而第一微孔1213凸出的气溶胶生成基质更容易接触到第二基体122的表面，进而气溶胶生成基质连通第二基体122的第二微孔1223，加快导液速度。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (35)

  1. 一种发热组件，其中，包括：
    第一基体，具有相对设置的第一表面和第二表面，所述第一表面为吸液面；所述第一基体具有多个第一微孔，所述第一微孔用于将气溶胶生成基质从所述吸液面导引至所述第二表面；
    第二基体，具有相对设置的第三表面和第四表面，所述第四表面为雾化面；所述第二表面与所述第三表面相对设置；所述第二基体为致密基体，所述第二基体上设有多个贯穿所述第三表面和所述第四表面的第二微孔，所述第二微孔用于将所述气溶胶生成基质从所述第三表面导引至所述雾化面；
    其中，所述第一基体和/或所述第二基体形成流道，所述流道连通所述第一微孔和所述第二微孔。
  2. 根据权利要求1所述的发热组件，其中，所述第二表面与所述第三表面之间间隔设置形成间隙，所述间隙作为所述流道。
  3. 根据权利要求2所述的发热体组件，其中，所述发热组件还包括间隔件；所述间隔件设置于所述第二表面和所述第三表面之间，且位于所述第一基体和/或所述第二基体边缘，以使所述第一基体与所述第二基体间隔设置形成所述间隙。
  4. 根据权利要求3所述的发热组件，其中，所述间隔件为独立设置的垫片；
    或，所述间隔件为固定在所述第二表面和/或所述第三表面的支撑柱或支撑框；
    或，所述间隔件为与所述第一基体和/或所述第二基体一体成型的凸起。
  5. 根据权利要求2所述的发热组件，其中，所述发热组件还包括密封件，所述密封件具有下液孔；所述下液孔的孔壁上设置有固定结构，以固定所述第一基体和/或所述第二基体，使所述第一基体与所述第二基体间隔设置形成所述间隙。
  6. 根据权利要求2所述的发热组件，其中，沿着平行于所述第一基体的方向，所述间隙的高度相同。
  7. 根据权利要求2所述的发热组件，其中，沿着平行于所述第一基体发热组件的方向，所述间隙的高度逐渐增大。
  8. 根据权利要求7所述的发热组件，其中，所述间隙的高度从零逐渐增大。
  9. 根据权利要求2所述的发热组件，其中，所述发热组件还包括多个微柱，多个所述微柱设置于所述间隙中。
  10. 根据权利要求9所述的发热组件，其中，所述微柱的一端与所述第二表面抵接，所述微柱的另一端与所述第三表面间隔设置；
    或，所述微柱的一端与所述第三表面抵接，所述微柱的另一端与所述第二表面间隔设置；
    或，所述微柱的一端与所述第二表面抵接，所述微柱的另一端与所述第三表面抵接。
  11. 根据权利要求1所述的发热组件，其中，所述第三表面设有多个沿第一方向延伸的第一凹槽和多个沿第二方向延伸的第二凹槽，所述第一凹槽与所述第二凹槽交叉设置；多个所述第一凹槽和多个所述第二凹槽形成所述流道。
  12. 根据权利要求11所述的发热组件，其中，多个所述第二微孔呈阵列分布，每个所述第一凹槽对应一行或多行所述第二微孔，每个所述第二凹槽对应一列或多列所述第二微孔。
  13. 根据权利要求11所述的发热组件，其中，所述第一凹槽的深度与宽度的比值为0-20，所述第二凹槽的深度与宽度的比值为0-20。
  14. 根据权利要求11所述的发热组件，其中，所述第二表面设有多个沿第三方向延伸的第三凹槽和多个沿第四方向延伸的第四凹槽，所述第三凹槽与所述第四凹槽交叉设置；多个所述第一凹槽、多个所述第二凹槽、多个所述第三凹槽以及多个所述第四凹槽共同形成所述流道。
  15. 根据权利要求14所述的发热组件，其中，所述第一基体为致密基体，所述第一微孔贯穿所述第一表面和所述第二表面；多个所述第一微孔呈阵列分布，每个所述第三凹槽对应一行或多行所述第一微孔，每个所述第四凹槽对应一列或多列所述第一微孔。
  16. 根据权利要求14所述的发热组件，其中，所述第三凹槽的深度与宽度的比值为0-20，所述第四凹槽的深度与宽度的比值为0-20。
  17. 根据权利要求14所述的发热组件，其中，所述第一凹槽、所述第二凹槽的毛细作用力大于所述第三凹槽、所述第四凹槽的毛细作用力。
  18. 根据权利要求11-17任意一项所述的发热组件，其中，所述第二表面与所述第三表面间隔设置形成间隙。
  19. 根据权利要求11-17任意一项所述的发热组件，其中，所述第二表面与所述第三表面接触。
  20. 根据权利要求19所述的发热组件，其中，所述第一凹槽的深度、所述第二凹槽的深度大于所述第三凹槽的深度、第四凹槽的深度。
  21. 根据权利要求1所述的发热组件，其中，所述第二微孔的中轴线与所述第三表面垂直。
  22. 根据权利要求1所述的发热组件，其中，所述第二基体的厚度为0.1mm-1mm，所述第二微孔的孔径为1μm-100μm。
  23. 根据权利要求1所述的发热组件，其中，所述第二基体的厚度与所述第二微孔的孔径的比值为20:1-3:1。
  24. 根据权利要求1所述的发热组件，其中，相邻的所述第二微孔的孔中心距与所述第二微孔的孔径的比值为3:1-5:1。
  25. 根据权利要求1所述的发热组件，其中，所述第一基体为致密基体，所述第一微孔贯穿所述第一表面和所述第二表面。
  26. 根据权利要求25所述的发热组件，其中，所述第二微孔的毛细作用力大于所述第一微孔的毛细作用力。
  27. 根据权利要求25所述的发热组件，其中，沿着所述第一基体的厚度方向，所述第一微孔的孔径逐渐变大；所述第一微孔的收缩口位于第一表面，所述第一微孔的扩张口位于第二表面。
  28. 根据权利要求25所述的发热组件，其中，所述第一基体上设置所述第一微孔的区域在所述第二基体上的投影完全覆盖所述第二基体上设置所述第二微孔的区域。
  29. 根据权利要求25所述的发热组件，其中，所述第一微孔的孔径为1μm-100μm。
  30. 根据权利要求1所述的发热组件，其中，所述第一基体的厚度小于所述第二基体的厚度。
  31. 根据权利要求1所述的发热组件，其中，所述发热组件还包括发热元件，所述发热元件为设置于所述雾化面上的独立元件；或，所述第二基体具有导电功能。
  32. 根据权利要求31所述的发热组件，其中，所述第一基体在所述雾化面上的投影完全覆盖所述发热元件。
  33. 一种发热组件，其中，包括：
    第一基体，具有相对设置的第一表面和第二表面，所述第一表面为吸液面；所述第一基体具有多个第一微孔所述第一微孔用于将气溶胶生成基质从所述吸液面导引至所述第二表面；
    第二基体，具有相对设置的第三表面和第四表面，所述第四表面为雾化面；所述第二表面与所述第三表面相对设置；所述第二基体具有多个第二微孔，所述第二微孔用于将所述气溶胶生成基质从所述第三表面导引至所述雾化面；
    其中，所述第一基体和/或所述第二基体形成流道，所述流道连通所述第一微孔和所述第二微孔。
  34. 一种雾化器，其中，包括：
    储液腔，用于储存气溶胶生成基质；
    发热组件，所述发热组件与所述储液腔流体连通，所述发热组件用于雾化所述气溶胶生成基质；所述发热组件为权利要求1-33任意一项所述的发热组件。
  35. 一种电子雾化装置，其中，包括：
    雾化器，所述雾化器为权利要求34所述的雾化器；
    主机，用于为所述雾化器工作提供电能和控制所述发热组件雾化所述气溶胶生成基质。
PCT/CN2021/143267 2021-12-30 2021-12-30 发热组件、雾化器及电子雾化装置 WO2022179300A2 (zh)

Priority Applications (11)

Application Number Priority Date Filing Date Title
CN202190000266.XU CN220800052U (zh) 2021-12-30 2021-12-30 发热组件、雾化器及电子雾化装置
PCT/CN2021/143267 WO2022179300A2 (zh) 2021-12-30 2021-12-30 发热组件、雾化器及电子雾化装置
EP21927724.1A EP4205582A4 (en) 2021-12-30 2021-12-30 HEATING ARRANGEMENT, ATOMIZER AND ELECTRONIC ATOMIZING DEVICE
CN202211045817.1A CN116406859A (zh) 2021-12-30 2022-08-26 发热组件、雾化器及电子雾化装置
CN202290000130.3U CN220756580U (zh) 2021-12-30 2022-10-17 发热组件、雾化器及电子雾化装置
PCT/CN2022/125701 WO2023124409A1 (zh) 2021-12-30 2022-10-17 发热组件、雾化器及电子雾化装置
CN202211269081.6A CN116406860A (zh) 2021-12-30 2022-10-17 发热组件、雾化器及电子雾化装置
CN202211387650.7A CN116406861A (zh) 2021-12-30 2022-11-07 发热体、雾化器及电子雾化装置
CN202222963660.2U CN218921698U (zh) 2021-12-30 2022-11-07 发热体、雾化器及电子雾化装置
PCT/CN2022/143581 WO2023125850A1 (zh) 2021-12-30 2022-12-29 发热体、雾化器及电子雾化装置
US18/092,044 US20230210183A1 (en) 2021-12-30 2022-12-30 Heating assembly, vaporizer, and electronic vaporization device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/143267 WO2022179300A2 (zh) 2021-12-30 2021-12-30 发热组件、雾化器及电子雾化装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/092,044 Continuation US20230210183A1 (en) 2021-12-30 2022-12-30 Heating assembly, vaporizer, and electronic vaporization device

Publications (4)

Publication Number Publication Date
WO2022179300A2 true WO2022179300A2 (zh) 2022-09-01
WO2022179300A3 WO2022179300A3 (zh) 2022-10-20
WO2022179300A9 WO2022179300A9 (zh) 2023-08-03
WO2022179300A8 WO2022179300A8 (zh) 2023-11-02

Family

ID=83050184

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2021/143267 WO2022179300A2 (zh) 2021-12-30 2021-12-30 发热组件、雾化器及电子雾化装置
PCT/CN2022/125701 WO2023124409A1 (zh) 2021-12-30 2022-10-17 发热组件、雾化器及电子雾化装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/125701 WO2023124409A1 (zh) 2021-12-30 2022-10-17 发热组件、雾化器及电子雾化装置

Country Status (4)

Country Link
US (1) US20230210183A1 (zh)
EP (1) EP4205582A4 (zh)
CN (3) CN220800052U (zh)
WO (2) WO2022179300A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024050719A1 (zh) * 2022-09-07 2024-03-14 深圳麦克韦尔科技有限公司 一种发热组件、雾化器及电子雾化装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4159057A4 (en) * 2022-05-13 2023-09-20 Shenzhen Smoore Technology Limited HEATING BODY, ATOMIZER AND ELECTRONIC ATOMIZATION DEVICE

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11141545B2 (en) * 2016-12-01 2021-10-12 Mark L. Anderson, Llc Sprayer technology
CN107006896B (zh) * 2017-05-05 2019-04-09 湖北中烟工业有限责任公司 一种复合的陶瓷雾化器及其制备方法
CN108158039B (zh) * 2018-01-03 2023-07-11 云南中烟工业有限责任公司 一种集成多个Pt温度传感器的MEMS发热芯片及其制造方法
CN108158040B (zh) * 2018-01-03 2023-11-21 云南中烟工业有限责任公司 一种均匀发热的mems电子烟芯片及其制造方法
EP3620070B1 (en) * 2018-08-22 2024-01-24 Shenzhen Innokin Technology Co., Ltd. Three-dimensional structure heating unit and e-liquid guiding unit for atomizer of e-cigarette and manufacturing method thereof
CN209498589U (zh) * 2019-01-05 2019-10-18 深圳市合元科技有限公司 雾化芯及电子烟
WO2021083130A1 (zh) * 2019-10-28 2021-05-06 深圳麦克韦尔科技有限公司 电子雾化装置、料筒及料筒基体
CN110934343A (zh) * 2019-11-25 2020-03-31 深圳麦克韦尔科技有限公司 发热体组件及其制作方法、电子雾化装置
CN215303052U (zh) * 2021-01-11 2021-12-28 深圳麦克韦尔科技有限公司 雾化芯及电子雾化装置
CN113662250B (zh) * 2021-09-02 2024-07-05 美满芯盛(杭州)微电子有限公司 一种mems硅基雾化芯及其制造方法
CN114794577A (zh) * 2021-12-30 2022-07-29 深圳麦克韦尔科技有限公司 发热组件、雾化器及电子雾化装置
CN114794579A (zh) * 2021-12-30 2022-07-29 深圳麦克韦尔科技有限公司 发热组件、雾化器及电子雾化装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024050719A1 (zh) * 2022-09-07 2024-03-14 深圳麦克韦尔科技有限公司 一种发热组件、雾化器及电子雾化装置

Also Published As

Publication number Publication date
WO2023124409A1 (zh) 2023-07-06
WO2022179300A9 (zh) 2023-08-03
WO2022179300A3 (zh) 2022-10-20
EP4205582A2 (en) 2023-07-05
CN220756580U (zh) 2024-04-12
CN220800052U (zh) 2024-04-19
CN116406860A (zh) 2023-07-11
US20230210183A1 (en) 2023-07-06
WO2022179300A8 (zh) 2023-11-02
EP4205582A4 (en) 2023-12-20

Similar Documents

Publication Publication Date Title
WO2023124515A1 (zh) 发热组件、雾化器及电子雾化装置
WO2022179300A2 (zh) 发热组件、雾化器及电子雾化装置
CN114794578A (zh) 发热组件、雾化器及电子雾化装置
WO2022179233A1 (zh) 发热体组件、雾化器及电子雾化装置
CN114794577A (zh) 发热组件、雾化器及电子雾化装置
WO2023040836A1 (zh) 电子雾化装置及其雾化器
WO2022179301A2 (zh) 发热体、雾化器及电子雾化装置
CN114916708A (zh) 发热组件、雾化器及电子雾化装置
WO2023123250A1 (zh) 发热组件、雾化器及电子雾化装置
WO2022179642A2 (zh) 发热组件、雾化器及电子雾化装置
WO2022179299A2 (zh) 发热组件、雾化器及电子雾化装置
CN218921694U (zh) 发热体、雾化器及电子雾化装置
CN218889286U (zh) 气溶胶发生组件及气溶胶发生装置
CN114794576A (zh) 发热体、雾化器及电子雾化装置
WO2023124162A1 (zh) 发热组件、雾化器及电子雾化装置
WO2022141550A1 (zh) 一种电子雾化装置及其雾化器、雾化芯
CN116406859A (zh) 发热组件、雾化器及电子雾化装置
WO2022179643A2 (zh) 发热组件、雾化器及电子雾化装置
WO2022179231A2 (zh) 发热体组件、雾化器及电子雾化装置
CN116406850A (zh) 发热组件、雾化器及电子雾化装置
WO2023097618A1 (zh) 雾化组件及电子雾化装置
WO2024193087A1 (zh) 雾化器及电子雾化装置
WO2022179232A2 (zh) 发热体、雾化组件及电子雾化装置
CN221449885U (zh) 雾化器及电子雾化装置
WO2023125850A1 (zh) 发热体、雾化器及电子雾化装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 202190000266.X

Country of ref document: CN

ENP Entry into the national phase

Ref document number: 2021927724

Country of ref document: EP

Effective date: 20230328

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21927724

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE