WO2022179229A1 - 发热体模组及其制备方法、封装模组和电子雾化装置 - Google Patents

发热体模组及其制备方法、封装模组和电子雾化装置 Download PDF

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Publication number
WO2022179229A1
WO2022179229A1 PCT/CN2021/134946 CN2021134946W WO2022179229A1 WO 2022179229 A1 WO2022179229 A1 WO 2022179229A1 CN 2021134946 W CN2021134946 W CN 2021134946W WO 2022179229 A1 WO2022179229 A1 WO 2022179229A1
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Prior art keywords
heating
heating element
module according
lead
pins
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PCT/CN2021/134946
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English (en)
French (fr)
Inventor
吕铭
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深圳麦克韦尔科技有限公司
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Priority to PCT/CN2021/134946 priority Critical patent/WO2022179229A1/zh
Publication of WO2022179229A1 publication Critical patent/WO2022179229A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor

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  • the present application relates to the technical field of semiconductors, and in particular, to a heating body module and a preparation method thereof, a packaging module and an electronic atomization device.
  • a typical electronic atomization device consists of a heating element, a battery and a control circuit.
  • the heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and user experience.
  • Rigid heating element substrates with liquid-conducting holes such as porous ceramics and dense substrates with through-holes, currently have thicker rigid heating element substrates, mainly to ensure that they are not easily broken during installation and transportation.
  • the rigid heating element base needs to use a high-conductivity copper thimble to directly contact the electrode area on the rigid heating element base when it is electrically connected, and apply a certain force. In the process of connecting with the thimble, it is also necessary to ensure that the rigid heating element is have a certain strength. Therefore, there is basically no thin rigid heating element matrix with liquid conducting holes in the products currently on the market. However, the thick rigid heating element matrix results in poor fluid-conducting ability.
  • the technical problem to be solved by the present application is to overcome the problems in the prior art that the liquid conducting capability is good and not easily broken, thereby providing a heating body module and a preparation method thereof, a packaging module and an electronic atomization device.
  • the application provides a heating body module, comprising: a heating body, the heating body includes a first area and an edge area surrounding the first area, the first area has an atomizing surface and a liquid absorbing surface arranged oppositely a lead, the lead has an opposite first end and a second end, and the first end is electrically connected to the heating body; a lead, the lead has an opposite third end and a fourth end, the The third end is connected to the second end of the lead; a plastic package, the plastic package covers the edge region, the lead and the third end of the pin, and the plastic package is exposed out the atomizing surface, the liquid absorbing surface and the fourth end of the pin.
  • the heating body includes a base body and a heating element, and the heating element is arranged on one side of the atomizing surface.
  • the substrate is an insulating ceramic substrate, a glass substrate or a silicon substrate;
  • the heating element is a heating film.
  • the matrix has a microporous array, and the microporous array penetrates the liquid absorbing surface, the atomizing surface and the heating film.
  • the heat generating body includes a base body, and the base body is a conductive heat generating base body.
  • the conductive heating substrate includes a conductive ceramic substrate, and the conductive ceramic substrate includes titanium nitride or titanium diboride.
  • the surface of the edge region of the base body is further provided with an electrode member, the first end of the lead is connected to the electrode member, and the plastic sealing body also covers the electrode member.
  • the material of the plastic encapsulation body includes epoxy resin or silica gel.
  • the thickness of the base body is 0.2 mm to 0.5 mm.
  • the pins are respectively located on both sides of the heating body; the leads are respectively located on both sides of the heating body.
  • a sensor the sensor is located on the surface of the edge area and/or the surface of the first area; an additional lead, the additional lead is connected to the sensor, and the plastic package is also covered section described additional leads.
  • the material of the pins is copper or a copper alloy
  • the copper alloy includes phosphorous copper, copper-iron-zinc-phosphorus alloy, copper-nickel-silicon alloy or copper-nickel alloy.
  • the plastic sealing body has a main groove running through the plastic sealing body, and part of the plastic sealing body on the side of the main groove has a limit groove, the limit groove is annular, and the limit groove is connected with the plastic seal body.
  • the main grooves communicate with each other, the edge region of the heating element is embedded in the limiting groove, and the first region of the heating element is located in the main groove.
  • the edge area has a first edge surface and a second edge surface that are oppositely arranged, the first edge surface and the atomizing surface are located on the same side, and the second edge surface and the liquid absorbing surface.
  • the thickness of the plastic sealing body covering the first edge surface is smaller than the thickness of the plastic sealing body covering the second edge surface.
  • the thickness of the plastic sealing body covering the first edge surface is less than or equal to 1 mm, and the thickness of the plastic sealing body covering the second edge surface is greater than or equal to 1.5 mm.
  • the width of the first edge surface is greater than or equal to 0.5 mm, and the width of the second edge surface is greater than or equal to 0.5 mm.
  • the present application also provides a method for preparing a heating element module, including: providing a heating element and pins; electrically connecting the heating element and the pins with leads; The edge area of the heating element is plastic-sealed to form the heating element module according to any one of claims 1 to 16 .
  • the number of the heating elements is multiple; the heating elements include electrode parts; the preparation method of the heating element module further includes: providing a lead frame, the lead frame includes a frame body and a several pins integrally formed with the frame body; fixing the positions of a plurality of the heating body and the lead frame; adopting a wire bonding process to connect the electrode parts of the heating body and the pins; using an in-mold The injection molding process plastic-encapsulates the lead, part of the pin and the edge region of the heating element to form a plurality of heating element modules connected to the frame body.
  • plasma surface treatment is performed on the surface of the heating element; oxygen plasma and hydrogen plasma are used for the plasma surface treatment.
  • the pins are disconnected from the frame body to obtain several discrete heating body modules.
  • the application also provides an electronic atomization device, comprising: the heating body module of the application.
  • the present application also provides a package module with a plurality of heating bodies fixed, including: the heating body module of the present application; a frame body; wherein, the pins and the frame body are integrally formed.
  • the heating body module can have a certain strength, and the plastic sealing body has a good protection ability for the heating body.
  • the end is electrically connected to the heating body, and the second end of the lead is connected to the third end of the pin, so that when the pin is electrically connected to the external structure, the heating body does not need to bear a large pressure, so that the heating body is not easily broken. Due to the arrangement of the plastic sealing body, the heating body can be made thinner, which improves the liquid-conducting ability of the heating body.
  • the frame body is connected with the plurality of heating body modules by leads, which facilitates automatic mass production, transportation and storage.
  • the thickness of the plastic sealing body covering the first edge surface is smaller than the thickness of the plastic sealing body covering the second edge surface, so that the thickness of the plastic sealing body covering the first edge surface is smaller, avoiding fog generated by the atomizing surface
  • the vaporizing gas forms a vortex on the inner side wall of the plastic sealing body, so as to avoid the influence of the transmission effect of the atomizing gas generated by the atomizing surface.
  • the better protection ability makes the heating element module withstand external mechanical collisions, so that the heating element is not easy to break.
  • FIG. 1 is a three-dimensional schematic diagram of a heating body module provided by an embodiment of the application.
  • FIG. 2 is a schematic cross-sectional view of the heating body module along the cutting line M-N in FIG. 1;
  • FIG. 3 is a schematic cross-sectional structure diagram of a heating body module in another embodiment
  • Fig. 4 is the schematic diagram of the heating element in Fig. 1;
  • Fig. 5 is the three-dimensional schematic diagram of the plastic sealing body in Fig. 1;
  • FIG. 6 is a schematic perspective view of a heating body module according to another embodiment of the application.
  • FIG. 7 is a schematic cross-sectional view of a heating body module according to another embodiment of the present application.
  • Fig. 8 is the schematic diagram of the heating element in Fig. 7;
  • FIG. 9 is a flowchart of a manufacturing process of a heating body module in another embodiment of the present application.
  • FIG. 10 is a detailed flow chart of a preparation process of a heating body module in another embodiment of the present application.
  • FIG. 11 is a detailed flow chart of a preparation process of a heating body module in another embodiment of the present application.
  • 12 to 14 are schematic structural diagrams of a manufacturing process of a heating body module in another embodiment of the present application.
  • FIG. 15 is a schematic structural diagram of an electronic atomization device provided by another embodiment of the present application.
  • the thinner the substrate of the heating element under the condition that other conditions remain unchanged, the thinner the substrate of the heating element, the stronger the liquid supply capacity; the rigid heating element substrate with liquid conducting holes, such as porous ceramics, dense substrates with through-holes , the thinner the heating element matrix, the lower the strength of the heating element matrix after opening, and it is easy to break during installation and transportation.
  • the rigid heating element when the heating element is electrically connected, it is necessary to use a copper thimble with high conductivity to directly contact the electrode area on the heating element, and apply a certain force to ensure the sealing performance of the heating element and reduce the contact resistance at the same time. Therefore, the rigid heating element needs to be relatively thick to ensure a certain strength.
  • the thick rigid heating element matrix results in poor fluid-conducting ability. How to take into account the good liquid conductivity and not easy to break is an urgent problem to be solved.
  • the present application provides a heating body module, which takes into account good liquid-conducting ability and is not easy to break.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection connection, or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components, which can be a wireless connection or a wired connection connect.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection connection, or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components, which can be a wireless connection or a wired connection connect.
  • An embodiment of the present application provides a heating body module, referring to FIG. 1 to FIG. 5 , including:
  • a heating element the heating element includes a first area 101 and an edge area 102 surrounding the first area 101, and the first area 101 has an atomizing surface A and a liquid absorbing surface B arranged oppositely;
  • the lead 110 has an opposite first end and a second end, the first end is electrically connected to the heating body;
  • the pin 111 has an opposite third end and a fourth end, and the third end is connected to the second end of the lead 110;
  • a plastic package 120 covers the edge region 102, the lead 110 and the third end of the lead 111, and the plastic package 120 exposes the atomizing surface A, suction Liquid level B and the fourth end of the pin 111 .
  • the plastic sealing body 120 has a main groove 121 penetrating the plastic sealing body 120 , and a part of the plastic sealing body 120 on the side of the main groove 121 has a limiting groove 122 .
  • the position slot 122 communicates with the main slot 121 , the edge region 102 of the heating element is embedded in the limiting slot 122 , and the first region 101 of the heating element is located in the main slot 121 .
  • the heating body includes a base body 100, the base body 100 is a conductive heating base body, the conductive heating base body includes a conductive ceramic base body, and the conductive ceramic base body includes titanium nitride or titanium diboride; the surface of the edge region 102 of the base body 100 is also provided with There is an electrode member 140 , the first end of the lead 110 is connected to the electrode member 140 , and the plastic sealing body 120 also covers the electrode member 140 .
  • the ceramic matrix is doped with conductive particles, such as carbon particles, to form the conductive ceramic matrix. When the substrate is a conductive heating substrate, no heating element is required.
  • the edge area 102 has a first edge surface and a second edge surface arranged oppositely, the first edge surface and the atomizing surface A are located on the same side, and the second edge surface and the liquid absorbing surface B are located on the same side. same side.
  • the electrode member 140 is located on the first edge surface.
  • the heating body includes a base body and a heating element, the heating element is arranged on one side of the atomization surface, the base body is an insulating ceramic base body, a glass base body or a silicon base body, and the silicon base body is not doped Miscellaneous conductive ions; the heating element is a heating film.
  • the heating element includes a heating film, a heating wire, a heating net or a heating sheet; the edge of the base body is also provided with an electrode piece, the electrode piece is connected with the heating element and the first end of the lead, and the plastic sealing body is also provided. cover the electrode pieces.
  • the heating element is arranged on one side of the atomizing surface, and the heating element may be arranged protruding from the atomizing surface, or the heating element may be embedded in the atomizing surface.
  • the electrode member 140a is located on the first edge surface, and the heating element 142a is located on the first edge surface.
  • the first end of the lead 110 is connected to the electrode member 140a, and the plastic sealing body 120 also covers the electrode member 140a.
  • the number of heating elements is one or more.
  • a heating element module is provided with a heating element and two pins 111 .
  • a heating element module is provided with a plurality of heating elements and a plurality of pins.
  • a heating element module is provided with three heating elements (not shown) and six heating elements. pins.
  • a heating body module is provided with two leads 110 ; referring to FIG. 5 , a heating body module is provided with two leads and six leads 110 .
  • the material of the lead 110 includes gold or aluminum.
  • the pins are respectively located on both sides of the heating body; the leads are respectively located on both sides of the heating body.
  • the pins pass through the outer sidewall of the molding body. Referring to FIG. 1 , FIG. 2 , FIG. 3 , FIG. 6 and FIG. 7 , the pins 111 pass through the outer sidewall of the plastic package 120 .
  • the pins 111 located outside the plastic package 120 are bent along part of the outer sidewall of the plastic package 120 and the surface of the plastic package 120 on the side of the atomized surface A, so that the pins 111 are easily electrically connected to the power supply.
  • the material of the pin is copper or copper alloy
  • the copper alloy includes phosphorous copper, copper-iron-zinc-phosphorus alloy, copper-nickel-silicon alloy or copper-nickel alloy.
  • the thickness H1 of the plastic package covering the first edge surface A is smaller than the thickness H2 of the plastic package covering the second edge surface B, so that the thickness of the plastic package 120 covering the first edge surface A is Smaller, to avoid the formation of eddy currents on the inner side wall of the plastic package by the atomized gas generated by the atomizing surface, and to prevent the transmission effect of the atomized gas generated by the atomizing surface from being affected.
  • the plastic package covering the second edge surface B The thickness of 120 is relatively thick, which ensures better protection ability of the plastic sealing body 120 for the heating body, so that the heating body module can withstand external mechanical collisions, so that the heating body is not easy to break.
  • the thickness of the plastic sealing body covering the first edge surface A is less than or equal to 1 mm, preferably 0.5 mm to 1 mm; the thickness of the plastic sealing body covering the second edge surface B is greater than or equal to 1 mm. or equal to 1.5 mm, preferably 1.5 mm to 2.5 mm.
  • the width of the first edge surface A is greater than or equal to 0.5 mm, and the width of the second edge surface B is greater than or equal to 0.5 mm.
  • the material of the plastic body 120 includes epoxy resin or silica gel.
  • the matrix 100 has a micropore array, and the micropore array penetrates the liquid suction surface B and the atomization surface A. Further, the micropore array penetrates the liquid absorbing surface B, the atomizing surface A and the heating film.
  • the material of the base body 100 is a porous material, and the base body is a porous base body, for example, the material of the base body is a porous ceramic material.
  • the thickness of the base body 100 is 0.2 mm to 0.5 mm, so that the thickness of the base body 100 is relatively thin, and the liquid conductivity of the base body 100 is better.
  • the heating body module further includes: a sensor (not shown), the sensor is located on the surface of the edge region and/or the surface of the first region.
  • the sensor includes one or more of a temperature sensor and a gas detection sensor, the temperature sensor is located on the atomization surface; the gas detection sensor is located on the atomization surface; if it is other sensors, it can also be Set the surface in the edge area.
  • the heating body module further includes: additional leads, the additional leads are connected to the sensor, and the plastic packaging body also wraps a part of the additional leads.
  • the heating body module can have a certain strength, and the plastic sealing body has a good protection ability for the heating body.
  • the first end of the lead is provided with the heating body
  • the edge area is electrically connected, and the second end of the lead is connected to the third end of the pin, so that when the pin is electrically connected to the external structure, the heating body does not need to bear a large pressure, so that the heating body is not easily broken. Due to the arrangement of the plastic sealing body, the heating body can be made thinner, which improves the liquid-conducting ability of the heating body.
  • FIG. 9 another embodiment of the present application also provides a method for preparing a heating body module, referring to FIG. 9 , including:
  • Step S1 provide heating body and pin
  • Step S2 adopt lead wire to electrically connect described heating element and described pin;
  • Step S5 plastic-encapsulating the lead, part of the pin and the edge region of the heating body to form a heating body module.
  • a heating body in step S1, includes a first area 101 and an edge area 102 surrounding the first area 101, and the first area 101 has an atomizing surface A and a liquid absorbing surface B arranged oppositely .
  • the edge area 102 has a first edge surface and a second edge surface arranged oppositely, the first edge surface and the atomizing surface A are located on the same side, and the second edge surface and the liquid absorbing surface B are located on the same side. same side.
  • the heating body includes a base body 100 , the base body 100 is a conductive heating base body, and an electrode member 140 is further provided on the surface of the edge region 102 of the base body 100 .
  • the heating body includes a base body and a heating element, the heating element is arranged on one side of the atomization surface, the base body is an insulating ceramic base body, a glass base body or a silicon base body, and the edge of the base body is also provided with electrode parts, The plastic sealing body also covers the electrode member.
  • the heating element refer to the content of the foregoing embodiments, and will not be described in detail again.
  • a plurality of heat generating bodies are provided.
  • the number of the heating bodies is plural; the heating bodies include electrode parts.
  • the specific process of the preparation method of the heating body module refers to FIG. 10, including:
  • Step S110 providing a plurality of heating bodies and lead frames, wherein the lead frames include a frame body and a plurality of pins integrally formed with the frame body; the heating bodies include electrode parts;
  • Step S120 fixing the positions of a plurality of the heating elements and the lead frame
  • Step S130 using a wire bonding process to connect the electrode parts of the heating element and the pins.
  • Step S140 using an in-mold injection molding process to plastic-encapsulate the leads, part of the pins, and edge regions of the heating element to form a plurality of heating element modules connected to the frame body.
  • a lead frame 310 is provided, the lead frame 310 includes a frame body 300 and a plurality of pins 111 integrally formed with the frame body 300 , and the fourth ends of the pins 111 are connected to the frame body 300 connect.
  • the lead frame 310 (including the pins) mainly plays the role of stabilizing the chip and conducting the signal, and needs to be in the strength, bending, electrical conductivity, thermal conductivity, heat resistance, thermal matching, corrosion resistance, stepability, coplanarity, stress Release and other aspects have reached a high standard.
  • the material of the lead frame 310 is usually copper or copper alloy, and the copper alloy includes phosphor bronze, copper iron zinc phosphor alloy, copper nickel silicon alloy or copper nickel alloy.
  • the frame body 300 includes a plurality of first frame areas and a second frame area adjacent to the first frame area, the first frame area is connected with the pins 111, and the second frame areas are spaced from the pins 111, so The thickness of the first frame region is smaller than the thickness of the second frame region.
  • the size of the connection between the fourth end of the pin 111 and the first frame area is small, which makes it easy to disconnect the fourth end of the pin 111 from the frame body 300 after the plastic encapsulation layer 120 is formed.
  • the positions of the plurality of heating bodies and the lead frame 310 are fixed.
  • the lead frame 310 is arranged to surround the plurality of heating bodies.
  • a wire bonding process is used to connect the electrode member of the heating body and the lead 111 .
  • a wire bonding process is used to form the lead 110 , the first end of the lead 110 is connected to the electrode member of the hair base, and the second end of the lead 110 is connected to the third end of the pin 111 .
  • the wire bonding process includes a thermocompression bonding process or an ultrasonic wire bonding process.
  • the specific process of using the thermocompression bonding process includes: using gold wire for the lead, passing the gold wire through a hollow capillary rivet, and forming a ball at one end of the gold wire through the action of an arc;
  • the heating substrate is heated to about 300°C, one end of the gold wire is in contact with the electrode piece on the heating substrate 100, and the bonding is realized under the action of sufficient force;
  • a ball is formed on the other end of the gold wire by the action of the arc;
  • the capillary rivet moves Go to the vicinity of the frame, feed the wire while the capillary knife moves, heat the frame to about 300°C, the other end of the gold wire is in contact with the third end of the pin 111, and the bonding is realized under the action of sufficient force;
  • the wire is clamped and torn above the bond point.
  • the specific process of the ultrasonic bonding process includes: using aluminum wire for the lead, using ultrasonic energy to vibrate the aluminum wire against the surface of the side wall of the third end of the pin 111, and attaching the surface of the third end of the pin 111 to the aluminum wire.
  • the resulting atomic lattices are combined together, and local heating is formed at the bonding interface through friction and through the auxiliary action of oxides on the aluminum wire, which promotes the formation of bonds, while the lead frame itself does not heat; ultrasonic energy is used to
  • the aluminum wire vibrates on the surface of the heating substrate 100, and the atomic lattices on the surface of the heating substrate 100 are combined together, and local heating is formed at the bonding interface through friction and the auxiliary action of oxides on the aluminum wire to promote the formation of bonding.
  • the heat-generating substrate 100 itself is not heated; the aluminum wire is then clamped and torn above the bond point.
  • the lead 110 , the partial area of the lead 111 and the edge area of the heat-generating base 100 are plastic-sealed by an in-mold injection process to form a plurality of heat-generating body molds connected to the frame body 300 Group.
  • the lead 110 , the third end of the lead, and the edge region of the heat generating base 100 are plastic-sealed by an in-mold injection molding process to form a plastic-sealed body 120 , and the plastic-sealed body 120 covers the edge area, the lead 110 and the third end, and the plastic sealing body 120 exposes the atomizing surface A, the liquid absorbing surface B and the fourth end.
  • the molding body 120 is spaced apart from the frame body 300 .
  • the heating element is placed on the lower mold of the injection molding machine to preheat; then the upper mold is pressed down, and the preheated plastic sealing compound is put into the feeding tank from the injection port; after the injection rod is pressurized, the molten
  • the molding compound flows into and fills the mold cavity, and the molding compound encapsulates the lead 110, the third end and the edge area of the heating element.
  • the air in the mold cavity is discharged through the air port. After the filled molding compound hardens, Open the mold and demould, and take out the sealed product.
  • Epoxy Molding Compound It is a thermosetting resin, the main components are epoxy resin and various additives (curing agent, modifier, release agent, dyeing agent, flame retardant, etc.), It is stored at low temperature and needs to be warmed before use. Its characteristics are: it is in a molten state at high temperature, and then its components undergo a cross-linking reaction and gradually harden, and finally take shape.
  • the preparation method of the heating body module further includes: step S150 : after forming the plastic sealing body, disconnect the pins 111 from the frame body 300 to obtain several discrete heating body models Group.
  • the fourth end of the pin 111 is disconnected from the frame body 300 .
  • Another embodiment of the present application also provides a method for preparing a heating element module.
  • the difference between this embodiment and the method of the previous embodiment is that: before performing plastic sealing, the surface of the heating element is subjected to plasma surface treatment;
  • the plasma surface treatment uses oxygen plasma and hydrogen plasma.
  • the plasma surface treatment adopts oxygen plasma and hydrogen plasma, so that OH- groups are formed on the surface of the heating element, the bonding force between the heating element and the plastic sealing body is increased, the reliability of the product is improved, and the service life is increased.
  • the radio frequency power used in the plasma surface treatment is 200 watts to 500 watts.
  • FIG. 15 another embodiment of the present application further provides an electronic atomization device, referring to FIG. 15 , which includes: the above heating body module.
  • Electronic atomization devices include atomizers and battery devices.
  • the battery device is electrically connected to the atomizer and supplies power to the atomizer.
  • a base 408 is provided in the atomizer.
  • the heating body module is located on the base 408 . Referring to the heating element module in FIG. 13 and referring to FIG. 3 , the pins 111 are bent along the outer surface of the plastic package 120 to the surface of the plastic package 120 on the same side as the atomizing surface A.
  • the base 408 has a thimble electrode 400 extending through the base 408 , one end of the thimble electrode 400 is connected to the fourth end of the pin 111 , and the other end of the thimble electrode 400 is connected to the battery device.
  • the atomizer has an air outlet channel 407 and a liquid storage chamber 406 for storing the liquid aerosol generation substrate 405.
  • the air outlet channel 407 and the liquid storage chamber 406 are located at one side of the liquid suction surface B of the heating body module. On the side, the liquid storage chamber 406 is spaced from the air outlet channel 407 .
  • the atomizer also has a liquid inlet cavity 404 located between the heating body module and the liquid storage cavity 406, and between the heating body module and the air outlet channel 407, and the liquid storage cavity 406 is connected to the liquid inlet cavity 404. Cavity 404 communicates.
  • An atomizing cavity 402 is provided on the side of the atomizing surface A of the heating body module, and an air inlet 401 is provided 401 on the side of the atomizing cavity 402 facing away from the heating body module.
  • the atomizer also has a sealing member 403 , and the sealing member 403 is arranged between the plastic sealing body 120 and the liquid inlet cavity 404 .
  • the usage power of the electronic atomization device is greater than or equal to 6.5W, and the usage current is greater than or equal to 2.5A.
  • FIG. 14 it includes:
  • the pins 111 are integrally formed with the frame body 300 .
  • the lead frame is connected to a plurality of heat generating substrates through leads, which is convenient for large-scale automated manufacturing, transportation, and storage.

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Abstract

一种发热体模组及其制备方法、封装模组和电子雾化装置，发热体模组包括：发热体，发热体包括第一区（101）和包围第一区（101）的边缘区（102），第一区具有相对设置的雾化面（A）和吸液面（B）；引线（110），引线（110）具有相对的第一端和第二端，第一端与发热体电学连接；引脚（111），引脚（111）具有相对的第三端和第四端，第三端与引线的第二端连接；塑封体（120），塑封体（120）包覆边缘区（102）、引线（110）和引脚（111）的第三端，且塑封体（120）暴露出雾化面（A）、吸液面（B）以及引脚（111）的第四端。发热体模组能兼顾导液能力较好且不易断裂。

Description

发热体模组及其制备方法、封装模组和电子雾化装置 技术领域
本申请涉及半导体技术领域，具体涉及一种发热体模组及其制备方法、封装模组和电子雾化装置。
背景技术
典型的电子雾化装置设备由发热体、电池和控制电路等部分组成，发热体作为电子雾化装置的核心元件，其特性决定了雾化效果和使用体验。具有导液孔的刚性发热体基体，例如多孔陶瓷、开设贯穿孔的致密基体，目前市面的产品中的刚性发热体基体较厚，主要是为了保证在安装、运输时不易断裂。此外，刚性发热体基体在实现电连接时需要采用高电导率的铜顶针与刚性发热体基体上的电极区域直接接触，并施加一定的力，在与顶针连接的过程中也需要保证刚性发热体具有一定的强度。因此，目前市面的产品中基本没有应用薄的具有导液孔的刚性发热体基体。然而，厚的刚性发热体基体导致导液能力较差。
目前，如何兼顾导液能力较好且不易断裂是亟待解决的问题。
发明内容
因此，本申请要解决的技术问题在于克服现有技术中无法兼顾导液能力较好且不易断裂的问题，从而提供一种发热体模组及其制备方法、封装模组和电子雾化装置。
本申请提供一种发热体模组，包括：发热体，所述发热体包括第一区和包围所述第一区的边缘区，所述第一区具有相对设置的雾化面和吸液面；引线，所述引线具有相对的第一端和第二端，所述第一端与所述发热体电学连接；引脚，所述引脚具有相对的第三端和第四端，所述第三端与所述引线的所述第二端连接；塑封体，所述塑封体包覆所述边缘区、所述引线和所述引脚的所述第三端，且所述塑封体暴露出所述雾化面、吸液面以及所述引脚的所述第四端。
可选的，所述发热体包括基体和发热元件，所述发热元件设置在所述 雾化面一侧。
可选的，所述基体为绝缘陶瓷基体、玻璃基体或硅基体；所述发热元件为发热膜。
可选的，所述基体中具有微孔阵列，所述微孔阵列贯穿所述吸液面、所述雾化面和所述发热膜。
可选的，所述发热体包括基体，所述基体为导电发热基体。
可选的，导电发热基体包括导电陶瓷基体，所述导电陶瓷基体包括氮化钛或二硼化钛。
可选的，所述基体的边缘区表面还设置有电极件，所述引线的第一端与所述电极件连接，所述塑封体还覆盖所述电极件。
可选的，所述塑封体的材料包括环氧树脂或硅胶。
可选的，所述基体的厚度为0.2mm至0.5mm。
可选的，所述引脚分别位于所述发热体的两侧；所述引线分别位于所述发热体的两侧。
可选的，还包括：传感器，所述传感器位于所述边缘区的表面和/或所述第一区的表面；附加引线，所述附加引线与所述传感器连接，所述塑封体还包覆部分所述附加引线。
可选的，所述引脚的材料为铜或者铜合金，所述铜合金包括磷铜、铜铁锌磷合金、铜镍硅合金或铜镍合金。
可选的，所述塑封体中具有贯穿所述塑封体的主槽，所述主槽侧部的部分塑封体中具有限位槽，所述限位槽呈环状，所述限位槽与所述主槽连通，所述发热体的边缘区嵌入所述限位槽中，所述发热体的第一区位于所述主槽中。
可选的，所述边缘区具有相对设置的第一边缘面和第二边缘面，所述第一边缘面与所述雾化面位于同一侧，所述第二边缘面与所述吸液面位于同一侧，覆盖所述第一边缘面的塑封体的厚度小于覆盖所述第二边缘面的塑封体的厚度。
可选的，覆盖所述第一边缘面的塑封体的厚度小于或等于1毫米，覆盖所述第二边缘面的塑封体的厚度大于或等于1.5毫米。
可选的，所述第一边缘面的宽度大于或等于0.5mm，所述第二边缘面的宽度大于或等于0.5mm。
本申请还提供一种发热体模组的制备方法，包括：提供发热体和引脚；采用引线电学连接所述发热体和所述引脚；对所述引线、所述引脚的部分 区域以及所述发热体的边缘区进行塑封，形成如权利要求1至16任意一项所述的发热体模组。
可选的，所述发热体的数量为多个；所述发热体包括电极件；所述发热体模组的制备方法还包括：提供引脚框架，所述引脚框架包括框架本体和与所述框架本体一体成型的若干引脚；固定多个所述发热体及所述引线框架的位置；采用引线键合工艺，连接所述发热体的所述电极件和所述引脚；采用模内注塑工艺对所述引线、所述引脚的部分区域以及所述发热体的边缘区进行塑封，形成连接在所述框架本体上的多个发热体模组。
可选的，在进行塑封之前，对所述发热体的表面进行等离子体表面处理；所述等离子体表面处理采用氧等离子体和氢等离子体。
可选的，形成所述塑封体之后，将所述引脚与所述框架本体断开，得到若干个分立的发热体模组。
本申请还提供一种电子雾化装置，包括：本申请的发热体模组。
本申请还提供一种固定有多个发热体的封装模组，包括：本申请的发热体模组；框架本体；其中，所述引脚与所述框架本体一体成型。
本申请具有以下有益效果：
本申请技术方案提供的发热体模组中，由于设置了塑封体，因此使得发热体模组中能够具有一定的强度，塑封体对发热体具有较好的保护能力，其次，设置引线的第一端与所述发热体电学连接，引线的第二端与引脚的第三端连接，这样引脚与外部结构进行电连接时，发热体无需承受较大的压力，使得发热体不易碎裂。由于塑封体的设置，因此发热体能做的较薄，提高发热体的导液能力。
本申请技术方案提供的固定有多个发热体的封装模组中，框架本体通过引线连接多个发热体模组，方便大批量自动化制造、运输、储存。
进一步，覆盖第一边缘面的塑封体的厚度小于覆盖所述第二边缘面的塑封体的厚度，这样使得盖所述第一边缘面的塑封体的厚度较小，避免雾化面产生的雾化气在塑封体的内侧壁形成涡流，避免雾化面产生的雾化气的传输效果受到影响，其次，使得覆盖所述第二边缘面的塑封体的厚度较厚,保证塑封体对发热体较好的保护能力，使得发热体模组耐受外界的力学碰撞，这样使得发热体不易断裂。
附图说明
为了更清楚地说明本申请具体实施方式或现有技术中的技术方案，下 面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请一实施例提供的发热体模组的立体示意图；
图2为图1中沿切割线M-N的发热体模组剖面示意图；
图3为另一实施例中发热体模组的剖面结构示意图；
图4为图1中发热体的示意图；
图5为图1中塑封体的立体示意图；
图6为本申请另一实施例的发热体模组的立体示意图；
图7为本申请另一实施例的发热体模组的剖面示意图；
图8为与图7中的发热体的示意图；
图9为本申请另一实施例中发热体模组的制备过程的流程图；
图10为本申请另一实施例中发热体模组的制备过程的详细流程图；
图11为本申请另一实施例中发热体模组的制备过程的详细流程图；
图12至图14为本申请另一实施例中发热体模组的制备过程的结构示意图；
图15为本申请另一实施例提供的电子雾化装置的结构示意图。
具体实施方式
对于电子雾化装置的发热体，其它条件不变的情况下，发热体的基体越薄，供液能力越强；具有导液孔的刚性发热体基体，例如多孔陶瓷、开设贯穿孔的致密基体，发热体基体越薄，发热体基体开孔后强度降低，在安装、运输时容易断裂。其次，发热体在实现电连接时需要采用高电导率的铜顶针与发热体上的电极区域直接接触，并施加一定的力，保证发热体的密封性能，同时降低接触电阻。因此需要刚性发热体相对较厚以保证具有一定的强度。然而，厚的刚性发热体基体导致导液能力较差。如何兼顾导液能力较好且不易断裂是亟待解决的问题。
本申请提供一种发热体模组，兼顾导液能力较好且不易断裂。
下面将结合附图对本申请的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，还可以是两个元件内部的连通，可以是无线连接，也可以是有线连接。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
此外，下面所描述的本申请不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
本申请一实施例提供一种发热体模组，参考图1至图5，包括：
发热体，所述发热体包括第一区101和包围所述第一区101的边缘区102，所述第一区101具有相对设置的雾化面A和吸液面B；
引线110，所述引线110具有相对的第一端和第二端，所述第一端与所述发热体电学连接；
引脚111，所述引脚111具有相对的第三端和第四端，所述第三端与所述引线110的所述第二端连接；
塑封体120，所述塑封体120包覆所述边缘区102、所述引线110和所述引脚111的所述第三端，且所述塑封体120暴露出所述雾化面A、吸液面B以及所述引脚111的所述第四端。
所述塑封体120中具有贯穿所述塑封体120的主槽121，所述主槽121侧部的部分塑封体120中具有限位槽122，所述限位槽122呈环状，所述限位槽122与所述主槽121连通，所述发热体的边缘区102嵌入所述限位槽122中，所述发热体的第一区101位于所述主槽121中。
本实施例中，发热体包括基体100，基体100为导电发热基体，导电发热基体包括导电陶瓷基体，所述导电陶瓷基体包括氮化钛或二硼化钛；基体100的边缘区102表面还设置有电极件140，引线110的第一端与电极件140连接，塑封体120还覆盖所述电极件140。在一个实施例中，陶瓷基体中掺杂有导电粒子而形成导电陶瓷基体，导电粒子例如碳粒子。当基体为 导电发热基体时，不需要设置发热元件。
所述边缘区102具有相对设置的第一边缘面和第二边缘面，所述第一边缘面与所述雾化面A位于同一侧，所述第二边缘面与所述吸液面B位于同一侧。图2和图3中，电极件140位于第一边缘面。
需要说明的是，在其他实施例中，发热体包括基体和发热元件，所述发热元件设置在所述雾化面一侧，基体为绝缘陶瓷基体、玻璃基体或硅基体,硅基体中未掺杂导电离子；所述发热元件为发热膜。所述发热元件包括发热膜、发热丝、发热网或发热片；所述基体的边缘还设置有电极件，所述电极件与所述发热元件和引线的第一端连接，所述塑封体还覆盖所述电极件。
需要说明的是，发热元件设置在所述雾化面一侧,可以是发热元件凸出设置在雾化面，可以是发热元件嵌入雾化面。
参考图7和图8，电极件140a位于第一边缘面，发热元件142a位于第一边缘面。参考图7，引线110的第一端与电极件140a连接，塑封体120还覆盖所述电极件140a。
发热元件的数量为一个或者多个。
结合参考图1和图8，一种发热体模组中设置有一个发热元件、两个引脚111。在其他实施例中，一种发热体模组中设置有多个发热元件和多个引脚，例如，参考图6，一种发热体模组中设置有三个发热元件(未图示)和六个引脚。
当引脚的数量为多个时，引线的数量也为多个。参考图2，一种发热体模组中设置有两个引线110；参考图5，一种发热体模组中设置有两个引线六条引线110。
所述引线110的材料包括金或铝。
在一个具体的实施例中，参考图1至图7，引脚分别位于发热体的两侧；引线分别位于发热体的两侧。
在一个实施例中，引脚穿过塑封体的外侧壁。参考图1、图2、图3、图6和图7，引脚111穿过塑封体120的外侧壁。
参考图3，位于塑封体120外部的引脚111沿着塑封体120的部分外侧壁以及位于雾化面A一侧的塑封体120的表面弯折，这样使得引脚111容易与电源电学连接。
在一个实施例中，所述引脚的材料为铜或者铜合金，所述铜合金包括磷铜、铜铁锌磷合金、铜镍硅合金或铜镍合金。
在一个实施例中，覆盖第一边缘面A的塑封体的厚度H1小于覆盖所述第二边缘面B的塑封体的厚度H2，这样使得盖所述第一边缘面A的塑封体120的厚度较小，避免雾化面产生的雾化气在塑封体的内侧壁形成涡流，避免雾化面产生的雾化气的传输效果受到影响，其次，使得覆盖所述第二边缘面B的塑封体120的厚度较厚,保证塑封体120对发热体较好的保护能力，使得发热体模组耐受外界的力学碰撞，这样使得发热体不易断裂。
在一个具体的实施例中，覆盖所述第一边缘面A的塑封体的厚度小于或等于1毫米，优选的为0.5毫米至1毫米；覆盖所述第二边缘面B的塑封体的厚度大于或等于1.5毫米，优选的为1.5毫米至2.5毫米。
在一个具体的实施例中，所述第一边缘面A的宽度大于或等于0.5mm，所述第二边缘面B的宽度大于或等于0.5mm。
所述塑封体120的材料包括环氧树脂或硅胶。
在一个实施例中，基体100中具有微孔阵列，所述微孔阵列贯穿所述吸液面B和所述雾化面A。进一步，所述微孔阵列贯穿所述吸液面B、所述雾化面A和所述发热膜。在一个实施例中，基体100的材料为多孔材料，基体为多孔基体，例如基体的材料为多孔陶瓷材料。
在一个实施例中，所述基体100的厚度为0.2mm至0.5mm，这样使得基体100的厚度较薄，基体100的导液能力较好。
所述发热体模组还包括：传感器(未图示)，所述传感器位于所述边缘区的表面和/或所述第一区的表面。所述传感器包括温度传感器、气体检测传感器中的一种或者多种，所述温度传感器位于所述雾化面上；所述气体检测传感器位于所述雾化面上；若是其他的传感器，也可以设置在边缘区的表面。所述发热体模组还包括：附加引线，所述附加引线与所述传感器连接，所述塑封体还包覆部分所述附加引线。
本实施例中，由于设置了塑封体，因此使得发热体模组中能够具有一定的强度，塑封体对发热体具有较好的保护能力，其次，设置引线的第一端与所述发热体的边缘区电学连接，引线的第二端与引脚的第三端连接，这样引脚与外部结构进行电连接时，发热体无需承受较大的压力，使得发热体不易碎裂。由于塑封体的设置，因此发热体能做的较薄，提高发热体的导液能力。
相应的，本申请另一实施例还提供一种发热体模组的制备方法，参考图9，包括：
步骤S1:提供发热体和引脚；
步骤S2:采用引线电学连接所述发热体和所述引脚；
步骤S5:对所述引线、所述引脚的部分区域以及所述发热体的边缘区进行塑封，形成发热体模组。
在步骤S1中，提供发热体，所述发热体包括第一区101和包围所述第一区101的边缘区102，所述第一区101具有相对设置的雾化面A和吸液面B。所述边缘区102具有相对设置的第一边缘面和第二边缘面，所述第一边缘面与所述雾化面A位于同一侧，所述第二边缘面与所述吸液面B位于同一侧。在一个实施例中，发热体包括基体100，基体100为导电发热基体，基体100的边缘区102表面还设置有电极件140。在另一个实施例中，发热体包括基体和发热元件，所述发热元件设置在所述雾化面一侧，基体为绝缘陶瓷基体、玻璃基体或硅基体，基体的边缘还设置有电极件，所述塑封体还覆盖所述电极件。关于发热体的其他描述参照前述实施例的内容，不再详述。本实施例中，提供多个发热体。
在一个实施例中，所述发热体的数量为多个；所述发热体包括电极件。所述发热体模组的制备方法的具体过程参考图10，包括：
步骤S110：提供多个发热体和引脚框架，其中，所述引脚框架包括框架本体和与所述框架本体一体成型的若干引脚；所述发热体包括电极件；
步骤S120：固定多个所述发热体及所述引线框架的位置；
步骤S130：采用引线键合工艺，连接所述发热体的所述电极件和所述引脚。
步骤S140：采用模内注塑工艺对所述引线、所述引脚的部分区域以及所述发热体的边缘区进行塑封，形成连接在所述框架本体上的多个发热体模组。
参考图12，提供引脚框架310，所述引脚框架310包括框架本体300和与所述框架本体300一体成型的若干引脚111，所述引脚111的第四端与所述框架本体300连接。
引脚框架310(包括引脚)主要起稳固芯片、传导信号的作用，需要在强度、弯曲、导电性、导热性、耐热性、热匹配、耐腐蚀、步进性、共面形、应力释放等方面达到较高的标准。引脚框架310的材料通常有铜或者铜合金，铜合金包括磷铜、铜铁锌磷合金、铜镍硅合金或铜镍合金。
进一步的，所述框架本体300包括若干第一框架区和与第一框架区邻接的第二框架区，第一框架区和所述引脚111连接，第二框架区与引脚111间隔，所述第一框架区的厚度小于所述第二框架区的厚度。引脚111的第 四端与第一框架区的连接处的尺寸较小，进而使得形成塑封层120之后，容易断开引脚111的第四端与框架本体300。
继续参考图12，固定多个所述发热体及所述引线框架310的位置。
具体的，将所述引脚框架310包围所述若干发热体设置。
参考图13，采用引线键合工艺，连接所述发热体的所述电极件和所述引脚111。
具体的，采用引线键合工艺形成引线110，引线110的第一端与所述发基体的所述电极件连接，所述引线110的第二端与所述引脚111的第三端连接。所述引线键合工艺包括热压焊键合工艺或超声引线键合工艺。
当采用热压焊键合工艺时，采用热压焊键合工艺的具体过程包括：引线采用金丝，将金丝穿过空心毛细管劈刀，通过电弧作用在金丝的一端形成一个球；把发热基体加热到大约300℃，金丝的一端与发热基体100上的电极件接触，在足够的力的作用下实现键合；通过电弧作用在金丝的另一端形成一个球；毛细管劈刀运动到框架附近，在毛细管劈刀运动的同时送丝，加热框架至大约300℃，金丝的另一端与引脚111的第三端接触，在足够的力的作用下实现键合；然后把金丝夹紧并在键合点的上方扯断。
当采用超声键合工艺时，超声键合工艺的具体过程包括：引线采用铝丝，利用超声波能量对着引脚111的第三端的侧壁表面振动铝丝，把引脚111的第三端表面出的原子晶格结合在一起，通过摩擦作用并通过在铝丝上的氧化物辅助作用在键合界面出形成局部加热，促进键合形成，而引脚框架本身并不加热；利用超声波能量对着发热基体100表面振动铝丝，把发热基体100表面的原子晶格结合在一起，通过摩擦作用并通过在铝丝上的氧化物辅助作用在键合界面出形成局部加热，促进键合形成，而发热基体100本身并不加热；然后把铝丝夹紧并在键合点的上方扯断。
参考图14，采用模内注塑工艺对所述引线110、所述引脚111的部分区域以及所述发热基体100的边缘区进行塑封，形成连接在所述框架本体300上的多个发热体模组。
具体的，采用模内注塑工艺对所述引线110、所述引脚的的第三端、以及所述发热基体100的边缘区进行塑封，形成塑封体120，所述塑封体120，包覆所述边缘区、所述引线110和所述第三端，且所述塑封体120暴露出所述雾化面A、吸液面B以及所述第四端。
塑封体120和框架本体300间隔。
具体的，将发热体放置在注塑机的下模上预热；之后将上模下压，并 将预热后的塑封料从注塑口投入到投料罐中；注塑杆加压后，熔化后的塑封料流入并充满模腔，塑封料将引线110、所述第三端以及所述发热体的边缘区包封起来，同时模腔内的空气经空气口排出，待填充的塑封料硬化后，开模脱模，取出封好的成品。
环氧塑封料(Epoxy Molding Compound，简称EMC)：是一种热固性树脂，主要成分为环氧树脂及各种添加剂(固化剂，改性剂，脱模剂，染色剂，阻燃剂等)，低温存储，使用前需先回温，其特性为：在高温下先处于熔融状态，然后其成分发生交联反应逐渐硬化，最终成型。
进一步的，参考图11，所述发热体模组的制备方法还包括：步骤S150：形成所述塑封体之后，将引脚111与所述框架本体300断开，得到若干个分立的发热体模组。
具体的，将引脚111的第四端与所述框架本体300断开。
本申请又一实施例还提供一种发热体模组的制备方法，本实施例与前一实施例的方法的区别在于：在进行塑封之前，对所述发热体的表面进行等离子体表面处理；所述等离子体表面处理采用氧等离子体和氢等离子体。所述等离子体表面处理采用氧等离子体和氢等离子体，这样使得发热体的表面形成OH-基，增加发热体与塑封体之间的结合力，提高产品的可靠度，增加使用寿命。所述等离子体表面处理采用的射频功率为200瓦至500瓦。
相应的，本申请又一实施例还提供一种电子雾化装置，参考图15，包括：上述的发热体模组。
电子雾化装置包括雾化器和电池装置。所述电池装置和雾化器电连接并为雾化器供电。雾化器中设置有基座408。发热体模组位于所述基座408上。参考图13中的发热体模组参考图3，引脚111沿着塑封体120的外表面弯折至塑封体120的与雾化面A同侧的表面。基座408中具有贯穿基座408的顶针电极400，顶针电极400的一端与引脚111的第四端连接，顶针电极400的另一端与电池装置连接。所述雾化器中具有出气通道407和用于存储液态气溶胶生成基质405的储液腔406，所述出气通道407和所述储液腔406位于发热体模组的吸液面B的一侧，储液腔406和所述出气通道407间隔。所述雾化器还具有位于所述发热体模组和储液腔406之间、以及所述发热体模组和出气通道407之间的进液腔404，储液腔406与所述进液腔404连通。发热体模组的雾化面A一侧设置有雾化腔402，雾化腔402背向所述发热体模组的一侧设置有401进气口401。雾化器中还具有密封件403，所述密封件403设置在所述塑封体120和进液腔404之间。
在一个实施例中，电子雾化装置的使用功率大于等于6.5w，使用电流大于等于2.5A。
相应的，本申请又一实施例还提供一种固定有多个发热体的封装模组，参考图14，包括：
上述实施例的发热体模组；
框架本体300；
其中，所述引脚111与所述框架本体300一体成型。本实施例提供的发热体封装单元中，引脚框架通过引线连接多个发热基体，方便大批量自动化制造、运输、储存。
显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。

Claims (22)

  1. 一种发热体模组，其特征在于，包括：
    发热体，所述发热体包括第一区和包围所述第一区的边缘区，所述第一区具有相对设置的雾化面和吸液面；
    引线，所述引线具有相对的第一端和第二端，所述第一端与所述发热体电学连接；
    引脚，所述引脚具有相对的第三端和第四端，所述第三端与所述引线的所述第二端连接；
    塑封体，所述塑封体包覆所述边缘区、所述引线和所述引脚的所述第三端，且所述塑封体暴露出所述雾化面、吸液面以及所述引脚的所述第四端。
  2. 根据权利要求1所述的发热体模组，其特征在于，所述发热体包括基体和发热元件，所述发热元件设置在所述雾化面一侧。
  3. 根据权利要求2所述的发热体模组，其特征在于，所述基体为绝缘陶瓷基体、玻璃基体或硅基体；所述发热元件为发热膜。
  4. 根据权利要求3所述的发热体模组，其特征在于，所述基体中具有微孔阵列，所述微孔阵列贯穿所述吸液面、所述雾化面和所述发热膜。
  5. 根据权利要求1所述的发热体模组，其特征在于，所述发热体包括基体，所述基体为导电发热基体。
  6. 根据权利要求5所述的发热体模组，其特征在于，导电发热基体包括导电陶瓷基体，所述导电陶瓷基体包括氮化钛或二硼化钛。
  7. 根据权利要求2或5所述的发热体模组，其特征在于，所述基体的边缘区表面还设置有电极件，所述引线的第一端与所述电极件连接，所述塑封体还覆盖所述电极件。
  8. 根据权利要求1所述的发热体模组，其特征在于，所述塑封体的材料包括环氧树脂或硅胶。
  9. 根据权利要求2或5所述的发热体模组，其特征在于，所述基体的厚度为0.2mm至0.5mm。
  10. 根据权利要求1所述的发热体模组，其特征在于，所述引脚分别位于所述发热体的两侧；所述引线分别位于所述发热体的两侧。
  11. 根据权利要求1所述的发热体模组，其特征在于，还包括：传感器，所述传感器位于所述边缘区的表面和/或所述第一区的表面；附加引线，所 述附加引线与所述传感器连接，所述塑封体还包覆部分所述附加引线。
  12. 根据权利要求1所述的发热体模组，其特征在于，所述引脚的材料为铜或者铜合金，所述铜合金包括磷铜、铜铁锌磷合金、铜镍硅合金或铜镍合金。
  13. 根据权利要求1所述的发热体模组，其特征在于，所述塑封体中具有贯穿所述塑封体的主槽，所述主槽侧部的部分塑封体中具有限位槽，所述限位槽呈环状，所述限位槽与所述主槽连通，所述发热体的边缘区嵌入所述限位槽中，所述发热体的第一区位于所述主槽中。
  14. 根据权利要求1或13所述的发热体模组，其特征在于，所述边缘区具有相对设置的第一边缘面和第二边缘面，所述第一边缘面与所述雾化面位于同一侧，所述第二边缘面与所述吸液面位于同一侧，覆盖所述第一边缘面的塑封体的厚度小于覆盖所述第二边缘面的塑封体的厚度。
  15. 根据权利要求14所述的发热体模组，其特征在于，覆盖所述第一边缘面的塑封体的厚度小于或等于1毫米，覆盖所述第二边缘面的塑封体的厚度大于或等于1.5毫米。
  16. 根据权利要求14所述的发热体模组，其特征在于，所述第一边缘面的宽度大于或等于0.5mm，所述第二边缘面的宽度大于或等于0.5mm。
  17. 一种发热体模组的制备方法，其特征在于，包括：
    提供发热体和引脚；
    采用引线电学连接所述发热体和所述引脚；
    对所述引线、所述引脚的部分区域以及所述发热体的边缘区进行塑封，形成如权利要求1至16任意一项所述的发热体模组。
  18. 根据权利要求17所述的发热体模组的制备方法，其特征在于，所述发热体的数量为多个；所述发热体包括电极件；
    所述发热体模组的制备方法还包括：提供引脚框架，所述引脚框架包括框架本体和与所述框架本体一体成型的若干引脚；
    固定多个所述发热体及所述引线框架的位置；
    采用引线键合工艺，连接所述发热体的所述电极件和所述引脚；
    采用模内注塑工艺对所述引线、所述引脚的部分区域以及所述发热体的边缘区进行塑封，形成连接在所述框架本体上的多个发热体模组。
  19. 根据权利要求18所述的发热体模组的制备方法，其特征在于，在进行塑封之前，对所述发热体的表面进行等离子体表面处理；所述等离子体表面处理采用氧等离子体和氢等离子体。
  20. 根据权利要求18所述的发热体模组的制备方法，其特征在于，形成所述塑封体之后，将所述引脚与所述框架本体断开，得到若干个分立的发热体模组。
  21. 一种电子雾化装置，其特征在于，包括：权利要求1至16任意一项所述的发热体模组。
  22. 一种固定有多个发热体的封装模组，其特征在于，包括：
    若干如权利要求1至16任一项所述的发热体模组；
    框架本体；
    其中，所述引脚与所述框架本体一体成型。
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CN110973708A (zh) * 2019-05-16 2020-04-10 深圳麦克韦尔科技有限公司 电子雾化装置及其雾化组件和雾化组件的制造方法
CN113115987A (zh) * 2021-04-21 2021-07-16 东莞市阿尔法电子科技有限公司 雾化芯及烟弹

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