WO2022173088A1 - 에폭시 접착제용 첨가제 및 이를 포함하는 구조용 에폭시 접착제 조성물 - Google Patents
에폭시 접착제용 첨가제 및 이를 포함하는 구조용 에폭시 접착제 조성물 Download PDFInfo
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- WO2022173088A1 WO2022173088A1 PCT/KR2021/015493 KR2021015493W WO2022173088A1 WO 2022173088 A1 WO2022173088 A1 WO 2022173088A1 KR 2021015493 W KR2021015493 W KR 2021015493W WO 2022173088 A1 WO2022173088 A1 WO 2022173088A1
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- WO
- WIPO (PCT)
- Prior art keywords
- epoxy adhesive
- additive
- brush
- bottle
- epoxy
- Prior art date
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- 229920006332 epoxy adhesive Polymers 0.000 title claims abstract description 72
- 239000000654 additive Substances 0.000 title claims abstract description 56
- 230000000996 additive effect Effects 0.000 title claims abstract description 50
- 239000000203 mixture Substances 0.000 title claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims description 42
- 229920000647 polyepoxide Polymers 0.000 claims description 42
- -1 cyclic alkene Chemical class 0.000 claims description 25
- 229920002125 Sokalan® Polymers 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- 229940126062 Compound A Drugs 0.000 claims description 14
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims description 14
- 150000001923 cyclic compounds Chemical class 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 11
- 125000000524 functional group Chemical group 0.000 claims description 10
- 238000006116 polymerization reaction Methods 0.000 claims description 10
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 5
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 4
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical class ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 150000001345 alkine derivatives Chemical class 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 claims description 4
- 239000004584 polyacrylic acid Substances 0.000 claims description 4
- DRAJWRKLRBNJRQ-UHFFFAOYSA-N Hydroxycarbamic acid Chemical group ONC(O)=O DRAJWRKLRBNJRQ-UHFFFAOYSA-N 0.000 claims description 3
- 125000002837 carbocyclic group Chemical group 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 26
- 230000001070 adhesive effect Effects 0.000 abstract description 26
- 229920001577 copolymer Polymers 0.000 description 39
- 241001264766 Callistemon Species 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 24
- 238000003786 synthesis reaction Methods 0.000 description 23
- 239000004593 Epoxy Substances 0.000 description 21
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 19
- 229920000642 polymer Polymers 0.000 description 18
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 16
- 238000001723 curing Methods 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- 229920002189 poly(glycerol 1-O-monomethacrylate) polymer Polymers 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 229920001400 block copolymer Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000035939 shock Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000004627 transmission electron microscopy Methods 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- 150000003673 urethanes Chemical class 0.000 description 5
- 239000002318 adhesion promoter Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000693 micelle Substances 0.000 description 4
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229920005684 linear copolymer Polymers 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 2
- ZRPAUEVGEGEPFQ-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2 ZRPAUEVGEGEPFQ-UHFFFAOYSA-N 0.000 description 2
- YJLUBHOZZTYQIP-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=N2 YJLUBHOZZTYQIP-UHFFFAOYSA-N 0.000 description 2
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 239000012267 brine Substances 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000569 multi-angle light scattering Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- KNDQHSIWLOJIGP-RNGGSSJXSA-N (3ar,4r,7s,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound C1[C@@H]2[C@@H]3C(=O)OC(=O)[C@@H]3[C@H]1C=C2 KNDQHSIWLOJIGP-RNGGSSJXSA-N 0.000 description 1
- VUZNLSBZRVZGIK-UHFFFAOYSA-N 2,2,6,6-Tetramethyl-1-piperidinol Chemical group CC1(C)CCCC(C)(C)N1O VUZNLSBZRVZGIK-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010511 deprotection reaction Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 235000019439 ethyl acetate Nutrition 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- VMGSQCIDWAUGLQ-UHFFFAOYSA-N n',n'-bis[2-(dimethylamino)ethyl]-n,n-dimethylethane-1,2-diamine Chemical compound CN(C)CCN(CCN(C)C)CCN(C)C VMGSQCIDWAUGLQ-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2400/00—Characteristics for processes of polymerization
- C08F2400/02—Control or adjustment of polymerization parameters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/35—Applications of adhesives in processes or use of adhesives in the form of films or foils for aeronautic or naval applications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the present invention relates to an additive for an epoxy adhesive and a structural epoxy adhesive composition comprising the same, and more particularly, to an additive for an epoxy adhesive having excellent dispersibility and mechanical properties, and a structural epoxy adhesive composition comprising the same.
- Epoxy resin has many excellent properties compared to other resins, such as adhesion to various substrates, heat resistance, chemical resistance, electrical properties, and mechanical properties, and is used in a wide range of industrial fields.
- Epoxy resin is an intermediate (prepolymer) of a thermosetting resin, and by reaction with a curing agent, a three-dimensional network structure is formed as a cured product of the epoxy resin, thereby exhibiting unique properties of epoxy.
- the cured product of the epoxy resin has low fracture toughness and exhibits very brittle properties.
- nanoparticles are mixed with the epoxy resin as an additive. That is, by mixing and curing the nanoparticles as an additive to the epoxy resin, tensile strength and adhesive shear strength can be improved.
- studies are underway to improve the mechanical properties of the epoxy resin, such as the adhesive strength and impact resistance, by introducing a method of introducing rubber or nano-inorganic particles and introducing block copolymer-based organic nanoparticles. is becoming
- FIG. 1 is a TEM (Transmission Electron Microscopy) photograph showing a block copolymer dispersed in an epoxy.
- nanostructures such as vesicles (vesicles), worm-like micelles (b), and spherical micelles (c) (spherical micelles) are It has been reported that these nanostructures serve to disperse the stress of epoxy when subjected to impact, and through this, various mechanical properties can be strengthened.
- the group used a hetero(di)-block copolymer of PEP-b-PEO (poly(ethylene propylene)-b-poly(ethylene oxide) as a block copolymer.
- Korean Patent No. 10-1893690 discloses that a polyacrylate having one end halogenated as an arm-polymer and a diacrylate-based compound or a dimethacrylate-based compound are atom-transferred radical polymerization as a cross-linker.
- ATRP atom-transferred radical polymerization
- a star-shaped molding polymer having a core/shell structure comprising a core formed by polymerization of the crosslinking agent and a shell formed by a part of the female-polymer is disclosed as an epoxy adhesive additive are doing
- One object of the present invention is to provide an additive for an epoxy adhesive.
- Another object of the present invention is to provide a structural epoxy adhesive composition comprising an additive for an epoxy adhesive.
- One embodiment of the present invention includes a core part comprising a cyclic compound A of the following formula (1) and a shell part connected to the core part, and is a bottle brush-type structure connected by polymerization by opening the ring of the cyclic compound A
- An additive for an epoxy adhesive is provided.
- A is a substituted or unsubstituted cyclic alkene
- R 1 and R 2 are each independently substituted or unsubstituted C 1 to C 10 alkyl, alkyne, nitroxide, ester, ether, amine, substituted or unsubstituted C 5 to C 12 carbon a ring, a substituted or unsubstituted C 3 to C 12 heterocyclic ring, or a combination thereof,
- B and D are each independently C 2 to C 10 alkyl acrylate, C 2 to C 10 alkyl methacrylate, acrylic acid, glycidyl acrylate, glycidyl methacrylate, or ethylene glycol ( However, B and D are both C 2 to C 10 Alkyl acrylate, C 2 to C 10 Except for the case of alkyl methacrylate),
- n and m are each independently an integer from 1 to 100.
- the cyclic compound A may have any one of the following formulas.
- R is halogen, hydroxy, carboxy, amine, or alkyl
- q is 0 or an integer from 1 to 6
- the dotted lines in formulas (2) and (8) are substituted or unsubstituted carbocyclic rings or hetero is a ring, means being connected to R 1 .
- any one of B and D may be C 2 to C 10 alkyl acrylate, and the other may be glycidyl acrylate.
- B and D may be acrylic acid.
- the additive for the epoxy adhesive having the bottle-brush type structure may include a unit represented by the following formula.
- k is an integer from 1 to 1000.
- the additive for the epoxy adhesive may have a molecular weight of 100 to 1000K Da.
- Another embodiment of the present invention includes a unit having a core portion and a shell portion, forms a main chain by polymerization of the core portion, and forms a side chain disposed in an outward direction by connecting the shell portion to the main chain, ,
- the side chain provides an additive for an epoxy adhesive having a bottle-brush-type structure having an epoxy affinity functional group.
- the side chain may include poly alkyl acrylate, poly alkyl methacrylate, polyacrylic acid, poly glycidyl acrylate, poly glycidyl methacrylate, or polyethylene glycol. .
- the core portion may include a substituted or unsubstituted cyclic alkene.
- Another embodiment of the present invention is an additive for an epoxy adhesive of a bottle brush-type structure according to an embodiment of the present invention; and an epoxy resin; provides a structural epoxy adhesive composition comprising.
- the additive for an epoxy adhesive according to an embodiment of the present invention has a bottle-brush-type structure, entanglement between polymer chains is significantly lower than that of a linear copolymer, and thus a viscosity may be low.
- the radius of gyration of the polymer chain may be small and the surface wettability may be excellent.
- the additive for an epoxy adhesive according to an embodiment of the present invention may have physical properties controlled according to the functional group of the side chain. Specifically, in the case of including an epoxy-affinity functional group, miscibility with the epoxy resin may be improved, dispersibility may be improved, and the epoxy resin may be stably chemically bonded. Thereby, the adhesive strength of an epoxy adhesive can be improved more. In addition, when a functional group serving as a buffer is included, the mechanical properties of the epoxy adhesive can be improved by absorbing external shock.
- Structural epoxy adhesive composition according to an embodiment of the present invention has excellent mechanical strength and impact resistance and high adhesive strength and can be used in fields requiring high performance, such as automobiles and aerospace industries.
- FIG. 2 is a schematic diagram schematically showing a bottle-brush type copolymer according to an embodiment of the present invention.
- 3 to 5 are 1 H NMR of a compound synthesized according to an embodiment of the present invention.
- FIG. 6 is a GPC graph of a compound synthesized according to an embodiment of the present invention.
- the present invention relates to an additive for an epoxy adhesive and an epoxy adhesive composition comprising the same.
- the additive for an epoxy adhesive includes a unit having a core portion and a shell portion, forms a backbone by polymerization of the core portion, and the shell portion is connected to the main chain to provide an external It can be understood as a bottle-brush-type copolymer that forms a side chain disposed in the direction.
- an additive for an epoxy adhesive may also be referred to as an 'additive' or a 'bottle-brush type copolymer'.
- the additive for an epoxy adhesive according to an embodiment of the present invention has a bottle-brush-type structure, entanglement between polymer chains is significantly lower than that of a linear copolymer, and thus a viscosity may be low.
- the radius of gyration of the polymer chain may be small and the surface wettability may be excellent.
- the compatibility with the epoxy resin is improved according to the functional group of the side chain of the bottle-brush type copolymer, so that the dispersibility in the epoxy resin can be improved, the epoxy resin can be stably chemically bonded, and the adhesive strength of the epoxy adhesive is improved. can do it
- a functional group serving as a buffer is included, the mechanical properties of the epoxy adhesive can be improved by absorbing external shock.
- FIG. 2 is a schematic diagram schematically showing an additive for an epoxy adhesive according to an embodiment of the present invention.
- the additive for an epoxy adhesive is a copolymer having an overall bottle brush structure, and is connected to the main chain and the main chain and is disposed toward the outside. It has multiple side chains.
- the bottle-bristle copolymer may be formed by polymerization of a unit having a core part and a shell part.
- the core portion of the unit may be polymerized to form a main chain, and the shell portion may form a side chain.
- the core part may include a cyclic alkene
- a main chain may be formed by Ring Opening Metathesis Polymerization (ROMP) of the cyclic alkene
- the side chain may have an epoxy-affinity functional group.
- the side chain may include polyalkyl acrylate, polyacrylic acid, polyglycidyl acrylate, polyglycidyl methacrylate, or polyethylene glycol.
- the unit having the core part and the shell part may be represented by the following Chemical Formula 1.
- Another embodiment of the present invention includes a core portion comprising a cyclic compound A of the following formula (1) and a shell portion connected to the core portion, wherein the cyclic compound A is polymerized and connected by ring opening.
- An additive for an epoxy adhesive is provided.
- A is a substituted or unsubstituted cyclic alkene
- R 1 and R 2 are each independently substituted or unsubstituted C 1 to C 10 alkyl, alkyne, nitroxide, ester, ether, amine, substituted or unsubstituted C 5 to C 12 carbon a ring, a substituted or unsubstituted C 3 to C 12 heterocyclic ring, or a combination thereof,
- B and D are each independently C 2 to C 10 alkyl acrylate, C 2 to C 10 alkyl methacrylate, acrylic acid, glycidyl acrylate, glycidyl methacrylate, or ethylene glycol (provided that , except when B and D are both C 2 to C 10 alkyl acrylate, C 2 to C 10 alkyl methacrylate),
- n and m are each independently an integer from 1 to 100.
- the main chain of the bottle brush-type copolymer may be formed by Ring Opening Metathesis Polymerization (ROMP) of the cyclic compound A.
- the cyclic compound A may be a substituted or unsubstituted cyclic alkene (cycloalkene).
- the cyclic compound A is not particularly limited as long as it is a compound capable of Ring Opening Metathesis Polymerization (ROMP), and may be, for example, any one of the following Chemical Formulas.
- R is halogen, hydroxy, carboxy, amine or alkyl
- q is 0 or an integer from 1 to 6.
- the dotted line in Formulas (2) and (8) means a substituted or unsubstituted carbocyclic or heterocyclic ring.
- the chemical formulas of the following Chemical Formulas (3) to (6) may also have a carbon ring or a hetero ring represented by a dotted line as in Chemical Formulas (2) and (8).
- the cyclic alkene may include one or more double bonds. In addition means being connected to R 1 .
- Chemical Formula (2) or Chemical Formula (8) may include the following Chemical Formula.
- the main chain formation by ROMP (Ring Opening Metathesis Polymerization) of the cyclic compound A may be represented by the following reaction scheme.
- the substituent R of the cyclic compound A and the rings indicated by dotted lines in the formulas (2) and (8) are omitted.
- R 1 and R 2 are each independently substituted or unsubstituted C 1 to C 10 alkyl, alkyne, nitroxide, ester, ether, amine, substituted or unsubstituted C 5 to C 12 carbon It may be a ring, a substituted or unsubstituted C 3 to C 12 heterocyclic ring, or a combination thereof.
- the R 1 and R 2 may be variously selected from the viewpoint of ease of synthesis of the bottle-brush type copolymer as a linking group or a terminal group.
- the cyclic compound A and the chain including R 1 and/or R 2 may be bonded by radical polymerization, and accordingly R 1 and R 2 may be appropriately selected.
- R 1 is -(CH 2 ) 5 COO-, 2,2,6,6-tetramethylpiperidine-N-oxyl (2,2,6,6-tetramethylpiperidine)-N-oxyl, TEMPO) and the like.
- B and D are each independently C 2 to C 10 alkyl acrylate, C 2 to C 10 alkyl methacrylate, acrylic acid, glycidyl acrylate, glycidyl methacrylate, or ethylene glycol; , n and m are each independently an integer from 1 to 100. If it is out of the above range, it may be difficult to form a bottle-brush-type structure.
- the carbon chain represented by p serves as a bridge connecting B and D, and may be 0 or an integer of 1 to 10.
- the B and D form a side chain of the bottle-brush type copolymer, and may be coupled to the main chain and arranged toward the outside in the form of a brush.
- a gap may be formed between the side chains and may have fluidity. The fluidity can be controlled by changing the chemical structure of the shell part, and thus various physical properties can be implemented.
- B or D may be C 2 to C 10 alkyl acrylate, or C 2 to C 10 alkyl methacrylate.
- C 2 to C 10 Alkyl (meth) acrylate is, for example, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, tertbutyl (meth) acrylate, It may be pentyl (meth) acrylate, hexyl (meth) acrylate, ethylhexyl (meth) acrylate, and the like.
- the polyalkyl (meth)acrylate block may have rubbery properties, and thus may efficiently absorb and disperse an impact applied from the outside. Accordingly, the bottle-bristle copolymer according to an embodiment of the present invention may have cavitation and crack bridging effects, and may serve as an effective buffer to improve the mechanical properties of the epoxy adhesive. In addition, such a shock absorbing effect may increase the cohesion of the epoxy matrix, thereby contributing to the improvement of the adhesion of the epoxy adhesive.
- B and D may have an epoxyphilic functional group.
- the side chain has an epoxy-affinity functional group, miscibility with the epoxy resin is improved, so that the bottle-brush type copolymer can have excellent dispersibility.
- B and D may be acrylic acid, glycidyl acrylate, glycidyl methacrylate, or ethylene glycol.
- any one of B and D may be a C 2 to C 10 alkyl acrylate, specifically butyl acrylate, and the other may be glycidyl acrylate.
- the polybutyl acrylate block has rubber properties and can serve to absorb and disperse an external shock, and the polyglycidyl acrylate block can improve the dispersibility of the bottle-brush type copolymer due to its excellent mixability with epoxy.
- the glycidyl group participates in the curing reaction of the epoxy resin to form a stable chemical bond with the epoxy resin.
- the bottle-brush type copolymer may be a random copolymer or a block copolymer.
- the polymerization ratio of the polyalkyl acrylate block and the polyglycidyl acrylate block may be 9:1 to 7:3.
- dispersibility and shock absorbing effect may exert a synergistic effect.
- B and/or D may be acrylic acid.
- the carboxylic acid group of the polyacrylic acid block may form a hydrogen bond with the adhesive member to improve the adhesion of the epoxy adhesive.
- the additive for an epoxy adhesive having a bottle brush-type structure may include a unit represented by the following formula.
- k may be an integer from 1 to 1000.
- the molecular weight of the bottle brush-type copolymer according to an embodiment of the present invention may be 100 to 1,000K Da, specifically 100 to 700K Da, or 100 to 400K Da. If the molecular weight of the bottle-brush type copolymer is less than 100K Da, the toughness strengthening effect due to the rubber properties may not be sufficient, and if it exceeds 1,000K Da, the tendency to aggregate with each other increases and dispersibility may decrease.
- the grafting density (grafting density) of the bottle brush-type copolymer may be 80 to 100%. If the grafting density is out of the above range, it may be difficult for the bottle-brush-type copolymer to behave like a single micelle in the epoxy matrix.
- the method for preparing the additive for an epoxy adhesive according to an embodiment of the present invention is not particularly limited, and may be synthesized by a method commonly used in the art. Although not limited thereto, for example, grafting-from ( Grafting-From), grafting-through (Grafting-Through), or grafting-to method may be synthesized. Grafting-From is a method of synthesizing the main chain first and then polymerizing the side chain, and Grafting-Through is a method of synthesizing a large monomer first and then ROMP (ring opening metathesis polymerization) It is a method of bonding the main chain through , and grafting-to is a method that can obtain high grafting density while overcoming steric interaction.
- Grafting-From is a method of synthesizing the main chain first and then polymerizing the side chain
- Grafting-Through is a method of synthesizing a large monomer first and then ROMP (ring opening metathesis polymerization) It is a
- a side chain is first synthesized through atom transfer radical polymerization (ATRP), and a macromonomer can be synthesized by combining the side chain and a cyclic alkene compound through a radical coupling reaction. Then, by opening the ring of the cyclic alkene through ROMP, the main chain can be synthesized to synthesize a bottle-brush type copolymer.
- ATRP atom transfer radical polymerization
- Another embodiment of the present invention relates to a structural epoxy adhesive composition.
- Structural epoxy adhesive composition may include an epoxy resin and an additive for an epoxy adhesive.
- the additive for the epoxy adhesive (hereinafter also referred to as 'additive') is a bottle-brush type copolymer according to an embodiment of the present invention, and specific characteristics are as described above.
- a structural epoxy adhesive is defined as a material having an adhesive strength exceeding 6.9 MPa (1,000 psi) at room temperature and capable of bonding high-strength materials such as wood, composite or metal. .
- Structural epoxy adhesives are used in fields requiring high performance, such as automobiles and aerospace industries, and the structural epoxy adhesive composition according to an embodiment of the present invention has excellent mechanical strength and impact resistance and high adhesive strength, so it can be widely used in the field. .
- a liquid epoxy resin may be used as the epoxy resin, and a bisphenol-A-derived epoxy resin may be included. Additionally, the epoxy resin may further include a chelate-substituted functional epoxy resin and/or a reactive diluent together with a bisphenol-A-derived epoxy resin. The functional epoxy resin may also be liquid.
- the additive for the epoxy adhesive may be mixed in an amount of 0.5 to 60 parts by weight based on 100 parts by weight of the epoxy resin. If the content is less than 0.5 parts by weight, the effect of absorbing shock and improving adhesive strength is not exerted, and if it exceeds 60 parts by weight, the adhesive strength may be rather reduced.
- the epoxy adhesive composition may further include an epoxy curing agent, rubber particles, a modified urethane resin, and a modified epoxy resin.
- the epoxy curing agent may be a curing agent capable of thermosetting the epoxy resin at medium and high temperatures.
- the epoxy curing agent may use a curing agent capable of thermosetting the epoxy resin at a temperature of at least 100 °C or higher.
- dicyan diamide may be used as the epoxy curing agent.
- the rubber particles may be acrylic rubber particles, and the size of the rubber particles may be different from the size of the additive. When rubber particles having different sizes from the additives are used, overall adhesive strength and impact resistance may be further improved.
- the modified urethane resin is a component that softens the medium of the epoxy resin while being mixed with the epoxy resin to improve adhesive strength.
- a liquid polyurethane having a phenol-functionalized terminal may be used as the modified urethane resin.
- the modified epoxy resin itself means a flexible epoxy resin and is a component that assists the function of the modified urethane resin.
- the structural epoxy adhesive composition according to an embodiment of the present invention may further include other fillers, adhesion promoters and/or catalysts.
- the filler may function as an adhesion promoter, for example, metal oxide particles may be used.
- an epoxy functionalized silane compound may be used as another adhesion promoter, and imidazole may be used as a catalyst.
- Structural epoxy adhesive composition contains 30 to 70% by weight of an epoxy resin, 1 to 45% by weight of additives, 2 to 15% by weight of rubber particles, 10 to 50% by weight of a modified urethane resin, 10% by weight of a modified epoxy resin to 50% by weight, adhesion promoter 0.1 to 1% by weight, filler 1 to 10% by weight, curing agent 1 to 10% by weight, and catalyst 0.1 to 1% by weight.
- Structural epoxy adhesive is prepared by mixing an additive for an epoxy adhesive having a bottle brush-type structure according to an embodiment of the present invention described above, an epoxy resin, an epoxy curing agent, a catalyst, etc. It can be used by curing by applying heat at 100 °C to 180 °C.
- the additive since the additive is mixed with the liquid epoxy resin in a solution state mixed with the organic solvent, 100 in a vacuum condition to remove the organic solvent in a state that is not mixed with the epoxy curing agent A heating process of °C to 150 °C may be performed.
- additives such as an epoxy curing agent and a catalyst are mixed in a state in which the molding polymer is mixed with the liquid epoxy resin, and the adhesive can be formed by thermal curing.
- Structural epoxy adhesive according to an embodiment of the present invention can be firmly bonded to the two substrates without a separate member by applying heat after being interposed between the two substrates.
- the two substrates may be formed of different materials, or may be formed of the same material.
- the substrates may be formed of a metal.
- the copolymer of the bottle brush-type structure added to the structural epoxy adhesive composition according to an embodiment of the present invention has very good compatibility and dispersibility with the epoxy resin, and has a shock absorbing effect to provide mechanical properties of the epoxy adhesive and adhesive strength can be improved. Therefore, the structural epoxy adhesive composition according to an embodiment of the present invention can be widely used in fields requiring high adhesion and impact resistance, such as automobiles and aviation industries.
- a bottle brush-type copolymer was synthesized through the grafting-from method as follows.
- Step 1 Synthesis of cyclic alkene (NB-functionalized nitroxide radical) compound
- the synthesized novoline (norbornene) was dissolved in dry DCM (dry DCM) together with EDC and DMAP catalyst, and argon purging was performed.
- dry DCM dry DCM
- the purging (norbornene) solution was added dropwise while stirring at room temperature. The reaction was carried out overnight at room temperature. After the reaction was completed, it was washed with deionized water and brine, and then water was removed with anhydrous MgSO 4 . After that, the solvent was removed, and the crude product t was purified through a silica column.
- the column was lowered with a 3/1 EtOAc/cyclohexane solution and dried in a vacuum oven after purification to obtain a pure product.
- 3 is a 1 H NMR result of the target compound in each step, and through this, it was confirmed that the target compound was synthesized in each step.
- poly butyl acrylate PBA
- poly tert butyl acrylate PtBA
- Poly butyl acrylate-b-Poly tert butyl acrylate PBA-b-PtBA
- PBA-b-PGMA was well synthesized through ATRP.
- the ratio of PBA to PGMA is 9:1, and it can be confirmed that the PGMA is 10% block copolymer.
- b, c, and d peaks are set to 1, all of them come out exactly as one protone, and in the case of a peak with two protons (a peak), the Integral value is 18, and the ratio of PBA and PGMA is 9: 1 person could be identified.
- BB bottle brush type copolymer
- the prepared NB-polymer of the second step was dissolved in distilled THF, and freeze pump thaw was performed three times to complete degassing. Thereafter, the ROMP reaction was carried out through a Grubbs tertiary catalyst in an argon chamber. After the reaction, the ROMP reaction was terminated through ethyl vinyl ether, and the solvent was blown off, the precipitate was collected, and dried in a vacuum oven. The polymerization degree of the main chain was controlled by the ratio of Grubbs' tertiary catalyst and NB-polymer.
- the molecular weight and conversion rate of the compound synthesized in Preparation Example were measured through MALS (Multi angle light scattering) equipment, NB-g-PBA, NB-g-PtBA, NB-g-(PBA-b-PGMA), NB -g-(PBA-b-PtBA) both confirmed that the conversion rate was 95% or more.
- the dn/dc value of the bottle-brush type copolymer (BB) was directly measured using a Refractive Index Detector (RI), and it is shown in Table 1 below.
- 6 is a GPC (Gel Permeation Chromatography) graph of the compound synthesized in Preparation Example. 6, 3K is a GPC graph of NB-PtBA (molecular weight 3K), 150K is a GPC graph of BB-g-PtBA (molecular weight 150K), 300K is a GPC graph of BB-g-PtBA (molecular weight 300K), 600K is BB It is a GPC graph of -g-PtBA (molecular weight 600K). Referring to FIG. 6 , it was confirmed that a well-defined bottle-brush type copolymer was synthesized.
- the glass transition temperature was measured through DSC to see if the bottle-brush type copolymer had rubber properties like the linear copolymer despite the structural change, and this is shown in FIG. 7 .
- the glass transition temperature (Tg) of the linear polymer PBA-b-PGMA is -4.3°C
- BB-g-(PBA-b-PGMA) is measured at -3.2°C.
- BB- It can be confirmed that g-(PBA-b-PGMA) does not significantly change the glass transition temperature.
- An epoxy adhesive sample was prepared using an epoxy resin (Epon 828), a curing agent (Jeffamine D230), and the linear polymer and bottle-brush-type copolymer prepared in the above synthesis example as additives, and an adhesion test was performed according to ASTM-D1002 standard, The thickness of the adhesive application was 0.08 mm ⁇ 0.02. Samples were prepared by different types, molecular weights, and content ratios of the linear polymer and the bottle brush copolymer, and the test results are shown in Tables 2 to 5 and FIG. 8 .
- Example 2 Example 3 BB-g-PBA (4K-400K) BB-g-PAA (3K-170K) BB-g-PAA (1K-100K) BB-g-(PBA-b-PGMA) (4K-400K_9:1) kgf 276 223 497 (180%) 485 (160%) 554 (200%) kgf/cm2 85.6 69 1504 (180%) 150 (160%) 172 (200%) MPa 8.39 6.76 15.1 (180%) 14.7 (160%) 16.8 (200%)
- the adhesive strength is improved when the bottle-brush type copolymer according to an embodiment of the present invention is used. Specifically, in Examples 1 to 3, it can be confirmed that the bottle-brush type copolymer has improved adhesive strength by 160 to 200% compared to the sample containing no additives including the PAA or PBA-b-PGMA block. In the case of Comparative Example 2, the adhesive strength was improved, but the improvement effect was not large compared to that of Example. In addition, in the case of Comparative Example 4, although a bottle-brush-type copolymer was used as an additive, it could be confirmed that the adhesive strength was rather reduced because only the PBA block was included.
- the adhesive strength is increased by about 200% when the bottle-brush copolymer BB-g-(PBA-r-PGMA) is used as an additive. This is considered to be because the PBA block has rubber properties, effectively absorbing external impact through cavitation, and improving adhesion by increasing cohesion in the epoxy matrix. Also, due to the PGMA block, the miscibility with the epoxy is improved, which is believed to be because the bottle-brush type copolymer is well mixed with the epoxy resin.
- the adhesive strength was slightly improved compared to the linear PBA sample, but it was confirmed that the adhesive strength was lower than that in the case of using only the epoxy resin.
- the amount of BB-g-PBA is increased, the adhesive force is rather decreased. That is, it can be seen that even if it is a bottle-brush type copolymer, it is difficult to exhibit the effect of dispersing and absorbing external impact when only the PBA block is included.
- sample 2 PBA-b-PGMA
- sample 5 BB-g-(PBA-b-PGMA)
- TEM transmission electron microscope
- sample 2 includes a PGMA block, but there are many partially aggregated parts.
- Sample 5 is well dispersed without clumping due to the bottle-brush-type structure despite having the same proportion of PGMA blocks.
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Abstract
Description
Mn (Side Chain) |
Mn (공중합체) |
dn/dc | ||
합성예 1 | NB-g-PtBA | 1K | 1K | 0.045~0.052 |
합성예 6 | BB-g-PtBA | 3K | 170K | 0.065 |
BB-g-PtBA | 1K | 100K | 0.065 | |
BB-g-PtBA | 1K | 700K | 0.065 | |
BB-g-PtBA | 4K | 400K | 0.055 | |
합성예 7 | BB-g-PBA-b-PGMA | 4K(8:2) | 400K | 0.052 |
BB-g-PBA-b-PGMA | 4K(9:1) | 400K | 0.052 |
Lap shear strength | Neat | 비교예 1 | 비교예 2 | 비교예 3 |
PBA(분자량 4K) | PAA(분자량 3K) | PBA-b-PGMA (분자량 4K_9:1) |
||
kgf | 276 | 123 | 363 (130%) |
157 |
kgf/㎠ | 85.6 | 38.1 | 112(130%) | 48.5 |
MPa | 8.39 | 3.73 | 11.0(130%) | 4.76 |
Neat | 비교예 4 | 실시예 1 | 실시예 2 | 실시예 3 | |
BB-g-PBA (4K-400K) |
BB-g-PAA (3K-170K) |
BB-g-PAA (1K-100K) |
BB-g-(PBA-b-PGMA) (4K-400K_9:1) |
||
kgf | 276 | 223 | 497 (180%) |
485 (160%) |
554 (200%) |
kgf/㎠ | 85.6 | 69 | 1504(180%) | 150 (160%) |
172 (200%) |
MPa | 8.39 | 6.76 | 15.1(180%) | 14.7 (160%) |
16.8 (200%) |
번호 | 첨가제 | 분자량(곁사슬) | 블록중합비 | 함량(중량%) |
샘플 1 | PBA | 4K | - | 0.5 |
샘플 2 | PBA-b-PGMA | 4K | 7:3 | 0.5 |
샘플 3 | BB-g-PBA | 400K(4K) | - | 0.5 |
샘플 4 | BB-g-PBA | 400K(4K) | - | 1 |
샘플 5 | BB-g-(PBA-b-PGMA) | 400K(4K) | 7:3 | 0.5 |
번호 | 첨가제 | 분자량(곁사슬) | 함량(중량%) |
샘플 6 | PAA | 3K | 0.5 |
샘플 7 | BB-g-PAA | 3K(1K) | 0.5 |
샘플 8 | BB-g-PAA | 100K(1K) | 0.5 |
샘플 9 | BB-g-PAA | 700K(1K) | 0.5 |
샘플 10 | BB-g-PAA | 700K(1K) | 2.5 |
Claims (10)
- 하기 화학식 1의 고리형 화합물 A를 포함하는 코어부와 상기 코어부에 연결되는 쉘부를 포함하고, 상기 고리형 화합물 A의 고리 오픈에 의해 중합되어 연결되는 병솔형 구조의 에폭시 접착제용 첨가제;[화학식 1]상기 화학식 1에서,상기 A는 치환 또는 비치환된 고리형 알켄이고,상기 R1 및 R2은 각각 독립적으로 치환 또는 비치환된 C1 내지 C10의 알킬, 알킨(alkyne), 니트록시드, 에스테르, 에테르, 아민, 치환 또는 비치환된 C5 내지 C12 의 탄소 고리, 치환 또는 비치환된 C3 내지 C12의 헤테로 고리, 또는 이들의 조합이며,상기 B 및 D는 각각 독립적으로 C2 내지 C10의 알킬 아크릴레이트, C2 내지 C10의 알킬 메타크릴레이트, 아크릴산, 글리시딜 아크릴레이트, 글리시딜 메타크릴레이트, 또는 에틸렌 글리콜이며(단, B 및 D가 모두 C2 내지 C10의 알킬 아크릴레이트, C2 내지 C10의 알킬 메타크릴레이트인 경우는 제외),p는 0 또는 1 내지 10의 정수이고, n 및 m는 각각 독립적으로 1 내지 100의 정수이다.
- 제1 항에 있어서,상기 B 및 D 중 어느 하나는 C2 내지 C10의 알킬 아크릴레이트이고, 다른 하나는 글리시딜 아크릴레이트인 병솔형 구조의 에폭시 접착제용 첨가제.
- 제1항에 있어서,상기 B 및 D는 아크릴산인 병솔형 구조의 에폭시 접착제용 첨가제.
- 제1항에 있어서,상기 에폭시 접착제용 첨가제는 분자량이 100 내지 1,000K Da인 병솔형 구조의 에폭시 접착제용 첨가제.
- 코어부 및 쉘부를 가지는 단위체를 포함하고, 상기 코어부의 중합에 의해 주사슬을 형성하며, 상기 쉘부가 상기 주사슬에 연결되어 외부를 향하는 방향으로 배치되는 곁사슬을 형성하고, 상기 곁사슬은 에폭시 친화성 작용기을 가지는 병솔형 구조의 에폭시 접착제용 첨가제.
- 제7항에 있어서,상기 곁사슬은 폴리 알킬 아크릴레이트, 폴리 알킬 메타크릴레이트, 폴리 아크릴산, 폴리 글리시딜 아크릴레이트, 폴리 글리시딜 메타크릴레이트, 또는 폴리 에틸렌 글리콜을 포함하는 병솔형 구조의 에폭시 접착제용 첨가제.
- 제7항에 있어서,상기 코어부는 치환 또는 비치환된 고리형 알켄을 포함하는 병솔형 구조의 에폭시 접착제용 첨가제.
- 제 1항 내지 제9항 중 어느 한 항에 따른 병솔형 구조의 에폭시 접착제용 첨가제; 및에폭시 수지;를 포함하는 구조용 에폭시 접착제 조성물.
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