WO2022172795A1 - Mode d'alimentation en feuille conductrice thermique, et corps de feuille thermoconductrice - Google Patents

Mode d'alimentation en feuille conductrice thermique, et corps de feuille thermoconductrice Download PDF

Info

Publication number
WO2022172795A1
WO2022172795A1 PCT/JP2022/003506 JP2022003506W WO2022172795A1 WO 2022172795 A1 WO2022172795 A1 WO 2022172795A1 JP 2022003506 W JP2022003506 W JP 2022003506W WO 2022172795 A1 WO2022172795 A1 WO 2022172795A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive sheet
thermally conductive
heat conductive
heat
main body
Prior art date
Application number
PCT/JP2022/003506
Other languages
English (en)
Japanese (ja)
Inventor
慶輔 荒巻
勇磨 佐藤
佑介 久保
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=81291782&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2022172795(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Publication of WO2022172795A1 publication Critical patent/WO2022172795A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This technology relates to the supply form of the heat conductive sheet and the body of the heat conductive sheet.
  • This application claims priority based on Japanese Patent Application No. 2021-018765 filed on February 9, 2021 in Japan, and this application is hereby incorporated by reference. Incorporated.
  • an electronic component is attached to a heat sink such as a heat dissipating fan or a heat dissipating plate via a heat conductive sheet.
  • a heat conductive sheet for example, a silicone resin containing (dispersing) a filler such as an inorganic filler is widely used. A further improvement in thermal conductivity is required for a heat dissipating member such as this heat conductive sheet.
  • the thermal conductivity of the thermally conductive sheet it is being studied to increase the filling rate of the inorganic filler blended in the matrix such as the binder resin.
  • increasing the filling rate of the inorganic filler impairs the flexibility of the thermal conductive sheet or causes powder to fall off, so there is a limit to increasing the filling rate of the inorganic filler.
  • inorganic fillers include alumina, aluminum nitride, and aluminum hydroxide.
  • the matrix may be filled with scaly particles such as boron nitride or graphite, carbon fibers, or the like. This is due to the anisotropy of the thermal conductivity of the scaly particles and the like.
  • carbon fibers are known to have a thermal conductivity of about 600 to 1200 W/m ⁇ K in the fiber direction.
  • Boron nitride has a thermal conductivity of about 110 W/m ⁇ K in the plane direction and a thermal conductivity of about 2 W/m ⁇ K in the direction perpendicular to the plane direction.
  • the surface direction of the carbon fibers and scale-like particles is made to be the same as the thickness direction of the sheet, which is the heat transfer direction. A dramatic improvement in conductivity can be expected.
  • Patent Document 1 describes a thermally conductive sheet in which boron nitride is oriented in the thickness direction.
  • the anisotropic material can be oriented in the thickness direction of the thermally conductive sheet by forming a molded block from the resin composition for forming the thermally conductive sheet and slicing it.
  • a heat conductive sheet is produced by slicing a molded block in this way, there is a problem that the surface of the heat conductive sheet lacks tackiness. In this way, if the surface of the heat conductive sheet does not have tackiness, there is a risk that the heat conductive sheet will be misaligned when mounted.
  • This technology has been proposed in view of such conventional circumstances, and provides a heat conductive sheet having a tacky surface.
  • This technology is a supply form of a heat conductive sheet sandwiched between release films, and the surface of the heat conductive sheet main body has tackiness immediately after the release film is peeled off from the heat conductive sheet main body.
  • the heat conductive sheet body according to the present technology contains a binder resin and scaly boron nitride, the scaly boron nitride is oriented in the thickness direction of the conductive sheet body, and both sides of the heat conductive sheet body have tackiness.
  • FIG. 1 is a cross-sectional view showing an example of a supply form of a heat conductive sheet.
  • FIG. 2 is a cross-sectional view showing an example of a heat conductive sheet main body that constitutes a supply form of the heat conductive sheet.
  • FIG. 3 is a perspective view schematically showing scale-like boron nitride having a hexagonal crystal shape, which is an example of a thermally conductive material having shape anisotropy.
  • FIG. 4 is a cross-sectional view showing an example of a heat conductive sheet main body.
  • FIG. 5 is a cross-sectional view showing an example of a semiconductor device to which a heat conductive sheet body is applied.
  • FIG. 6 is a diagram for explaining a method of evaluating whether or not the heat conductive sheet slips off the aluminum plate when the heat conductive sheet body is placed on the aluminum plate and shifted by 90°.
  • the average particle size (D50) of the thermally conductive material is the cumulative curve of the particle size value from the small particle size side of the particle size distribution when the entire particle size distribution of the thermally conductive material is 100%. is the particle diameter when the cumulative value is 50%.
  • the particle size distribution (particle size distribution) in this specification is determined by volume. Examples of the method for measuring the particle size distribution include a method using a laser diffraction particle size distribution analyzer.
  • a heat conductive sheet body is sandwiched between peeling films (films subjected to peeling treatment), and the heat conductive sheet body immediately after peeling the peeling film from the heat conductive sheet body.
  • This is a supply form of a heat conductive sheet having a tacky surface.
  • the surface of the heat conductive sheet body immediately after peeling the release film from the heat conductive sheet body has tackiness, so the position at the time of mounting of the heat conductive sheet body Displacement can be suppressed.
  • the tack force of the heat conductive sheet main body immediately after peeling off the release film may be 75 gf or more, or may be 80 gf or more in the following measurement method.
  • Measurement method Immediately after peeling off the release film from the supply form of the heat conductive sheet, a probe with a diameter of 5.1 mm is pushed into the heat conductive sheet body by 50 ⁇ m at 2 mm/sec and pulled out at 10 mm/sec.
  • immediately after peeling off the release film from the main body of the heat conductive sheet is not particularly limited, but means, for example, within 5 minutes after peeling off the release film.
  • the tack force of the heat conductive sheet main body sandwiched between the release films is increased compared to the tack force of the heat conductive sheet not sandwiched between the release films.
  • the tack force of the heat conductive sheet main body sandwiched between the release films is increased compared to the tack force of the heat conductive sheet not sandwiched between the release films.
  • the tack force of the surface of the heat conductive sheet main body (the tack force of the heat conductive sheet main body sandwiched between the release films) and the surface of the heat conductive sheet produced without being sandwiched between the release films and left for 7 days.
  • the tack force of the heat conductive sheet (the tack force of the heat conductive sheet not sandwiched between the release films) is compared with the tack force of the former, it means that the tack force of the former is large.
  • the tack force can be measured by the method described in Examples below.
  • FIG. 1 is a cross-sectional view showing an example of the supply form of the heat conductive sheet according to the present technology.
  • a thermally conductive sheet supply form 1 includes a thermally conductive sheet main body 3 sandwiched between release films 2 . That is, the supply form 1 of the heat conductive sheet is, for example, a laminate including the release film 2A, the heat conductive sheet main body 3, and the release film 2B in this order.
  • the release films 2 are provided on both sides of one heat conductive sheet main body 3 .
  • the release films 2 may be provided on both sides of a plurality of heat conductive sheet bodies 3 arranged at predetermined intervals in the vertical and horizontal directions. Further, in the supply mode 1 of the heat conductive sheet, the heat conductive sheet body 3 may be arranged between the release films 2 .
  • the release film 2 examples include PET (polyethylene terephthalate), PEN (polyethylene naphthalate), polyolefin, polymethylpentene, glassine paper, and the like.
  • the thickness of the release film 2 is not particularly limited and can be appropriately selected according to the purpose, and can be, for example, 5 to 200 ⁇ m.
  • the release film 2 is preferably a thin PET film.
  • the release film 2A and the release film 2B may be made of the same material or may be made of different materials.
  • the thickness of the release film 2A and the release film 2B may be the same or may be different.
  • the thickness of the heat conductive sheet main body 3 is not particularly limited, and can be appropriately selected according to the purpose.
  • the thickness of the heat conductive sheet main body 3 can be 0.05 mm or more, and can be 0.1 mm or more.
  • the upper limit of the thickness of the heat conductive sheet body 3 may be 5 mm or less, may be 4 mm or less, or may be 3 mm or less.
  • the thickness of the heat-conducting sheet main body 3 is preferably 0.1 to 4 mm from the viewpoint of handleability.
  • the thickness of the heat conductive sheet body 3 can be obtained, for example, by measuring the thickness of the heat conductive sheet body 3 at arbitrary five points and calculating the arithmetic average value thereof.
  • the heat conductive sheet main body 3 may have a specific gravity of 2.7 or less, 2.6 or less, 2.5 or less, or 2.4 or less. , 2.3 or less.
  • the heat conductive sheet body 3 may have a specific gravity of 2.0 or more, 2.1 or more, or 2.2 or more. The specific gravity of the heat conductive sheet main body 3 can be measured by the method described in Examples below.
  • FIG. 2 is a cross-sectional view showing an example of a heat conductive sheet main body that constitutes the supply form of the heat conductive sheet.
  • the heat conductive sheet main body 3 includes a binder resin 4 and a heat conductive material 5 having shape anisotropy. Oriented.
  • the thermally conductive sheet body 3 may further include a thermally conductive material 6 other than the thermally conductive material 5 having shape anisotropy. Specific examples of the constituent elements of the heat conductive sheet main body 3 will be described below.
  • the binder resin 4 is for holding the heat conductive material 5 having shape anisotropy and another heat conductive material 6 in the heat conductive sheet main body 3 .
  • the binder resin 4 is selected according to characteristics such as mechanical strength, heat resistance, and electrical properties required for the heat conductive sheet main body 3 .
  • the binder resin 4 can be selected from thermoplastic resins, thermoplastic elastomers, and thermosetting resins.
  • thermoplastic resins include polyethylene, polypropylene, ethylene- ⁇ -olefin copolymers such as ethylene-propylene copolymers, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, ethylene-vinyl acetate copolymers, Fluorinated polymers such as polyvinyl alcohol, polyvinyl acetal, polyvinylidene fluoride and polytetrafluoroethylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer Polymer (ABS) resin, polyphenylene-ether copolymer (PPE) resin, modified PPE resin, aliphatic polyamides, aromatic polyamides, polyimide, polyamideimide, polymeth
  • Thermoplastic elastomers include styrene-butadiene block copolymers or hydrogenated products thereof, styrene-isoprene block copolymers or hydrogenated products thereof, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, and vinyl chloride-based thermoplastic elastomers. , polyester-based thermoplastic elastomers, polyurethane-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, and the like.
  • Thermosetting resins include crosslinked rubbers, epoxy resins, phenolic resins, polyimide resins, unsaturated polyester resins, diallyl phthalate resins, and the like.
  • Specific examples of crosslinked rubber include natural rubber, acrylic rubber, butadiene rubber, isoprene rubber, styrene-butadiene copolymer rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene-propylene copolymer rubber, chlorinated polyethylene rubber, Chlorosulfonated polyethylene rubber, butyl rubber, halogenated butyl rubber, fluororubber, urethane rubber, and silicone rubber.
  • a silicone resin is preferable in consideration of the adhesion between the heat generating surface of the electronic component and the heat sink surface.
  • the silicone resin for example, a two-component addition reaction type silicone resin composed of a silicone having an alkenyl group as a main component, a main agent containing a curing catalyst, and a curing agent having a hydrosilyl group (Si—H group).
  • the alkenyl group-containing silicone for example, a vinyl group-containing polyorganosiloxane can be used.
  • the curing catalyst is a catalyst for promoting the addition reaction between the alkenyl group in the alkenyl group-containing silicone and the hydrosilyl group in the hydrosilyl group-containing curing agent.
  • the curing catalyst well-known catalysts used for hydrosilylation reaction can be used.
  • platinum group curing catalysts such as platinum group metals such as platinum, rhodium and palladium, and platinum chloride can be used.
  • the curing agent having hydrosilyl groups for example, polyorganosiloxane having hydrosilyl groups can be used.
  • the binder resin 4 may be used individually by 1 type, and may be used in combination of 2 or more types.
  • the content of the binder resin 4 in the heat conductive sheet main body 3 is not particularly limited, and can be appropriately selected according to the purpose.
  • the content of the binder resin 4 in the heat conductive sheet body 3 may be 20% by volume or more, may be 25% by volume or more, or may be 30% by volume, from the viewpoint of the flexibility of the heat conductive sheet body 3. It may be vol % or more, and may be 33 vol % or more.
  • the content of the binder resin 4 in the heat conductive sheet body 3 can be 70% by volume or less from the viewpoint of the flexibility of the heat conductive sheet body 3, and may be 60% by volume or less, or 50% by volume. It may be vol% or less, 40 vol% or less, or 37 vol% or less.
  • the content of the binder resin 4 in the heat conductive sheet body 3 is preferably 25 to 60% by volume, and can be 30 to 40% by volume, for example, from the viewpoint of the flexibility of the heat conductive sheet body 3. , 33 to 37% by volume.
  • the thermally conductive sheet main body 3 includes a thermally conductive material 5 having shape anisotropy.
  • Shape anisotropy means that the shape is not constant in each direction, such as a sphere, or nearly constant in each direction, such as a cube or octahedron. It means that the shape differs depending on the direction, such as being longer or shorter than the other.
  • Shape anisotropy includes, for example, scale-like and fibrous shapes.
  • the scaly thermally conductive material is a thermally conductive material having a long axis, a short axis, and a thickness, has a high aspect ratio (long axis/thickness), and is isotropic in the plane direction including the long axis. It has a good thermal conductivity.
  • the short axis is a direction that intersects the long axis at approximately the center of the particles of the scale-like heat conductive material in a plane containing the long axis of the scale-like heat conductive material, and is the direction that intersects the long axis of the scale-like heat conductive material. Refers to the length of the short part.
  • the thickness is an average value obtained by measuring ten thicknesses of the surface including the long axis of the scale-like thermally conductive material.
  • thermally conductive material 5 having shape anisotropy boron nitride (BN), mica, alumina, aluminum nitride, silicon carbide, silica, zinc oxide, molybdenum disulfide, etc.
  • BN boron nitride
  • mica mica
  • alumina aluminum nitride
  • silicon carbide silicon carbide
  • silica zinc oxide
  • molybdenum disulfide etc.
  • thermally conductive material 5 having shape anisotropy include scaly boron nitride and carbon fiber.
  • the thermally conductive material 5 having shape anisotropy may be used singly or in combination of two or more.
  • FIG. 3 is a perspective view schematically showing scale-like boron nitride 5A having a hexagonal crystal shape, which is an example of a thermally conductive material having shape anisotropy.
  • a represents the long axis of the scale-like boron nitride 5A
  • b represents the thickness of the scale-like boron nitride 5A
  • c represents the short axis of the scale-like boron nitride 5A.
  • the heat conductive material 5 having shape anisotropy from the viewpoint of the heat conductivity of the heat conductive sheet main body 3, it is possible to use scale-like boron nitride 5A having a hexagonal crystal shape as shown in FIG. preferable.
  • the average particle size (D50) of the thermally conductive material 5 having shape anisotropy is not particularly limited, and can be appropriately selected according to the purpose.
  • the average particle size of the thermally conductive material 5 having shape anisotropy may be 10 ⁇ m or more, may be 20 ⁇ m or more, may be 30 ⁇ m or more, or may be 35 ⁇ m or more.
  • the upper limit of the average particle size of the thermally conductive material 5 having shape anisotropy may be 150 ⁇ m or less, may be 100 ⁇ m or less, may be 90 ⁇ m or less, or may be 80 ⁇ m or less. 70 ⁇ m or less, 50 ⁇ m or less, or 45 ⁇ m or less.
  • the average particle size of the heat conductive material 5 having shape anisotropy is preferably 20 to 100 ⁇ m.
  • the aspect ratio of the thermally conductive material 5 having shape anisotropy is not particularly limited, and can be appropriately selected according to the purpose.
  • the aspect ratio of the thermally conductive material 5 having shape anisotropy can be in the range of 10-100.
  • the average value of the ratio of the long axis to the short axis (major axis/minor axis) of the heat conductive material 5 having shape anisotropy can be, for example, in the range of 0.5 to 10, and 1 to 5. It can be a range, it can be a range of 1-3.
  • the content of the thermally conductive material 5 having shape anisotropy in the thermally conductive sheet main body 3 is not particularly limited, and can be appropriately selected according to the purpose.
  • the content of the heat conductive material 5 having shape anisotropy in the heat conductive sheet body 3 can be 15% by volume or more, and 20% by volume from the viewpoint of the thermal conductivity of the heat conductive sheet body 3. or more, or 23% by volume or more.
  • the upper limit of the content of the thermally conductive material 5 having shape anisotropy in the thermally conductive sheet body 3 can be, for example, 45% by volume or less from the viewpoint of the flexibility of the thermally conductive sheet body 3. , 40% by volume or less, 35% by volume or less, or 30% by volume or less.
  • the content of the heat conductive material 5 having shape anisotropy in the heat conductive sheet body 3 is preferably 20 to 35% by volume, and 20 to 30% by volume. %, more preferably 23 to 27% by volume.
  • the other thermally conductive material 6 is a thermally conductive material other than the thermally conductive material 5 having shape anisotropy described above. That is, the other thermally conductive material 6 is a thermally conductive material that does not have shape anisotropy.
  • the shape of the other thermally conductive material 6 may be, for example, spherical, powdery, or the like.
  • the material of the other thermally conductive material 6 is not particularly limited, and may be the same as or different from the thermally conductive material 5 having shape anisotropy, for example.
  • heat conductive materials 6 may be made of, for example, aluminum nitride, aluminum oxide (alumina, sapphire), zinc oxide, aluminum hydroxide, or the like. can.
  • Other thermally conductive materials 6 may be used singly or in combination of two or more.
  • the other heat conductive material 6 is a combination of aluminum nitride particles and alumina particles, or a combination of aluminum nitride particles, alumina particles, zinc oxide, and aluminum hydroxide. is preferably used in combination.
  • the average particle size (D50) of the aluminum nitride particles may be, for example, 1-5 ⁇ m, may be 1-3 ⁇ m, or may be 1-2 ⁇ m.
  • the average particle diameter (D50) of the alumina particles may be, for example, 0.1 to 10 ⁇ m, may be 0.1 to 8 ⁇ m, may be 0.1 to 7 ⁇ m, or may be 0.1 to 8 ⁇ m.
  • the average particle size (D50) of the zinc oxide particles can be, for example, 0.1 to 5 ⁇ m, may be 0.5 to 3 ⁇ m, or may be 0.5 to 2 ⁇ m.
  • the average particle diameter (D50) of the aluminum hydroxide particles can be, for example, 1 to 10 ⁇ m, may be 2 to 9 ⁇ m, or may be 6 to 8 ⁇ m.
  • the content of the other thermally conductive material 6 in the thermally conductive sheet main body 3 is not particularly limited, and can be appropriately selected according to the purpose.
  • the content of the other thermally conductive material 6 in the thermally conductive sheet body 3 can be 10% by volume or more, and may be 15% by volume or more, from the viewpoint of the thermal conductivity of the thermally conductive sheet body 3. , 20% by volume or more, 25% by volume or more, 30% by volume or more, or 35% by volume or more.
  • the content of the other thermally conductive material 6 in the thermally conductive sheet body 3 can be 50% by volume or less from the viewpoint of the flexibility of the thermally conductive sheet body 3, and even if it is 45% by volume or less. It may be 40% by volume or less.
  • the content of alumina particles in the thermally conductive sheet main body 3 is preferably 10 to 25% by volume, and the content of aluminum nitride particles is preferably 10 to 25% by volume.
  • the content of the alumina particles in the thermally conductive sheet main body 3 is 10 to 25% by volume.
  • the content of aluminum nitride particles is preferably 10 to 25% by volume
  • the content of zinc oxide particles is preferably 0.1 to 3% by volume
  • the content of aluminum hydroxide particles is preferably is preferably 0.1 to 3% by volume.
  • the heat-conducting sheet main body 3 may further contain components other than the components described above within a range that does not impair the effects of the present technology.
  • examples of other components include silane coupling agents (coupling agents), dispersants, curing accelerators, retarders, tackifiers, plasticizers, flame retardants, antioxidants, stabilizers, colorants, and the like. be done.
  • the heat conductive sheet body 3 further improves the dispersibility of the heat conductive material 5 having shape anisotropy and the other heat conductive material 6, and from the viewpoint of further improving the flexibility of the heat conductive sheet body 3,
  • a thermally conductive material 5 having shape anisotropy treated with a silane coupling agent and/or another thermally conductive material 6 treated with a silane coupling agent may be used.
  • the manufacturing method of supply form 1 of the thermally conductive sheet includes a step of preparing a thermally conductive composition (hereinafter also referred to as step A) and a step of forming a molded block from the thermally conductive composition (hereinafter also referred to as step B).
  • step A a step of slicing the molded block into sheets to obtain a heat conductive sheet
  • step D a step of arranging the surface of the heat conductive sheet between release films
  • a thermally conductive composition containing a binder resin 4, a thermally conductive material 5 having shape anisotropy, and another thermally conductive material 6 is prepared.
  • the thermally conductive composition comprises binder resin 4, thermally conductive material 5 having shape anisotropy, other thermally conductive material 6, and, if necessary, various additives and volatile solvents by known methods. You may mix more uniformly.
  • a thermally conductive composition is prepared by dispersing a thermally conductive material 5 having shape anisotropy and another thermally conductive material 6 in a binder resin 4 .
  • a molded block is formed from the thermally conductive composition prepared in step A.
  • methods for forming the molded block include an extrusion molding method and a mold molding method.
  • the extrusion molding method and the mold molding method are not particularly limited, and various known extrusion molding methods and mold molding methods can be selected depending on the viscosity of the heat conductive composition and the properties required for the heat conductive sheet main body 3. It can be adopted as appropriate.
  • the binder resin 4 flows and forms along the flow direction.
  • An anisotropic thermal conductive material 5 is oriented.
  • the size and shape of the molded block can be determined according to the required size of the heat conductive sheet main body 3. For example, a rectangular parallelepiped having a cross-sectional length of 0.5 to 15 cm and a width of 0.5 to 15 cm can be used. The length of the rectangular parallelepiped may be determined as required.
  • step C the molded block is sliced into sheets to obtain heat conductive sheets.
  • the thermally conductive material 5 having shape anisotropy is exposed on the surface (sliced surface) of the sheet obtained by slicing.
  • the slicing method is not particularly limited, and can be appropriately selected from known slicing devices (preferably an ultrasonic cutter) according to the size and mechanical strength of the compact block.
  • the molding method is extrusion molding
  • the slicing direction of the molded block is 60 to 120 with respect to the extrusion direction, because the thermally conductive material 5 having shape anisotropy is oriented in the extrusion direction. degrees, more preferably in a direction of 70-100 degrees, and even more preferably in a direction of 90 degrees (perpendicular).
  • the molded block is preferably sliced in a direction substantially perpendicular to the length direction.
  • step D by placing the surface of the heat conductive sheet between the release films 2, the supply form 1 of the heat conductive sheet as shown in FIG. A laminated body provided with and in this order is obtained.
  • step D for example, the heat conductive sheet is sandwiched between the release films 2A and 2B, so that the binder resin 4 forming the heat conductive sheet body 3 spreads over the surface of the heat conductive sheet body 3 (heat conductive sheet body 3 and the release film 2), and the heat conductive sheet main body 3 comes to have tackiness.
  • the binder resin 4 that seeps out onto the surface of the heat conductive sheet main body 3 may be in an uncured state or in a state in which curing has progressed by several percent.
  • step D from the viewpoint of more effectively expressing the tackiness of the heat conductive sheet main body 3, it is preferable to leave the surface of the heat conductive sheet to stand between the release films 2 for a predetermined period of time.
  • the leaving time is not particularly limited, but can be, for example, 1 day or more, 2 days or more, 3 days or more, 4 days or more, or 5 days or more. , 6 days or more, or 7 days or more.
  • the separation film 2 from the supply form 1 of the thermally conductive sheet is Since the surface of the heat conductive sheet main body 3 immediately after peeling has tackiness, the degree of freedom in the manufacturing process is large.
  • the method for manufacturing the thermally conductive sheet supply form 1 is not limited to the above example, and may further include a step of pressing the sliced surface between steps C and D, for example.
  • a step of pressing the sliced surface between steps C and D for example.
  • the surface of the heat conductive sheet obtained in step C is made smoother, and the adhesion between other members and the heat conductive sheet can be further improved.
  • the manufacturing method of supply form 1 of the heat conductive sheet for example, after placing the surface of the heat conductive sheet between the release films 2 in step D, the heat conductive sheet main body 3 sandwiched between the release films 2 is pressed. You may have a process.
  • the heat conductive sheet body 3 sandwiched between the release films 2 is pressed, the heat conductive sheet body 3 sandwiched between the release films 2 is removed after pressing from the viewpoint of more effectively exhibiting the tackiness of the heat conductive sheet body 3. is preferably left for a predetermined period of time.
  • a pair of pressing devices comprising a flat plate and a press head having a flat surface can be used.
  • the pressure during pressing may be, for example, in the range of 0.1 to 100 MPa, may be in the range of 0.1 to 1 MPa, or may be in the range of 0.1 to 0.5 MPa. .
  • Press times can range, for example, from 10 seconds to 5 minutes, and may range from 30 seconds to 3 minutes.
  • the pressing temperature can be from 0 to 180.degree. C., can be within the temperature range of room temperature (eg, 25.degree. C.) to 100.degree.
  • the release film 2 is peeled off from the supply form 1 of the heat conductive sheet.
  • some of the components of the thermally conductive sheet main body 3 (the binder resin 4, the thermally conductive material 5 having shape anisotropy, and other thermally conductive materials 6) is transferred to the release film 2.
  • the surface of the heat conductive sheet main body 3 immediately after peeling off the release film 2 from the heat conductive sheet supply form 1 has tackiness, so that the heat conductive sheet main body 3 can be prevented from being displaced during mounting.
  • a second embodiment of the present technology is, for example, as shown in FIGS. is oriented in the thickness direction B of the heat conductive sheet body 3A, and both surfaces of the heat conductive sheet body 3A have tackiness.
  • the surface direction of the scale-like boron nitride 5A (for example, the major axis a of the boron nitride 5A) may be oriented in the thickness direction B of the thermally conductive sheet body 3A.
  • the heat conductive sheet body 3A has tackiness on both sides, it is possible to suppress the positional deviation during mounting of the heat conductive sheet body 3A.
  • the present invention is not limited to this example, and only one side of the heat conductive sheet body 3A has tackiness. may be
  • the heat conductive sheet main body 3A is the heat conductive sheet except that the heat conductive composition containing the binder resin 4 and the scale-like boron nitride 5A is used in the step A of the manufacturing method of the heat conductive sheet supply form 1 described above. It can be produced by the same method as the production method of the supply form 1 of .
  • the heat conductive sheet main body 3A includes a step A1 of preparing a heat conductive composition containing a binder resin 4 and scale-like boron nitride 5A, a step B1 of forming a molded block from the heat conductive composition, and a molding It can be obtained by a manufacturing method comprising a step C1 of slicing a body block into sheets to obtain a thermally conductive sheet, and a step D1 of arranging the surface of the thermally conductive sheet between the release films 7 .
  • the heat conductive sheet main body 3A is sandwiched between the release films 7. As shown in FIG.
  • the thermally conductive sheet body 3A was pushed by 50 ⁇ m at 2 mm/sec using a probe with a diameter of 5.1 mm, and the surface tack force when peeled off at 10 mm/sec. It is preferably 20 gf or more, more preferably 75 gf or more, and even more preferably 80 gf or more.
  • the preferable range of the specific gravity of the heat conductive sheet body 3A is the same as that of the heat conductive sheet body 3 described above.
  • the heat conductive sheet main body 3 from which the release film 2 is peeled off from the heat conductive sheet supply form 1 described above is arranged, for example, between a heat generating body and a radiator, so that the heat generated by the heat generating body is transferred to the heat radiator.
  • It can be an electronic device (thermal device) with a structure arranged between them for escape.
  • the electronic device has at least a heating element, a radiator, and a thermally conductive sheet main body 3, and may further have other members as necessary.
  • the heat conductive sheet main body 3 shall also include the heat conductive sheet main body 3A.
  • the heating element is not particularly limited. and electronic components that generate heat in.
  • the heating element also includes components for receiving optical signals, such as optical transceivers in communication equipment.
  • the radiator is not particularly limited, and examples include those used in combination with integrated circuit elements, transistors, optical transceiver housings, such as heat sinks and heat spreaders.
  • the radiator in addition to the heat spreader and the heat sink, any material can be used as long as it conducts the heat generated from the heat source and dissipates it to the outside.
  • a heat pipe, a metal cover, a housing, and the like can be mentioned.
  • FIG. 5 is a cross-sectional view showing an example of a semiconductor device to which the heat conductive sheet body according to the present technology is applied.
  • the heat conductive sheet main body 3 is mounted on a semiconductor device 50 built in various electronic devices, and sandwiched between a heat generator and a radiator.
  • a semiconductor device 50 shown in FIG. 5 includes an electronic component 51 , a heat spreader 52 , and a heat conductive sheet body 3 .
  • the heat conductive sheet main body 3 is sandwiched between the heat spreader 52 and the heat sink 53 , thereby forming a heat dissipation member for dissipating the heat of the electronic component 51 together with the heat spreader 52 .
  • the mounting location of the heat conductive sheet main body 3 is not limited to between the heat spreader 52 and the electronic component 51 or between the heat spreader 52 and the heat sink 53, but can be appropriately selected according to the configuration of the electronic device or semiconductor device.
  • Example 1 In Example 1, 33% by volume of silicone resin, 27% by volume of scaly boron nitride having a hexagonal crystal shape (D50 is 40 ⁇ m), 20% by volume of aluminum nitride (D50 is 1.2 ⁇ m), and alumina A resin composition for forming a heat conductive sheet was prepared by uniformly mixing 19% by volume of particles (D50 of 1 ⁇ m) and 1% by volume of a silane coupling agent. By extrusion molding, the resin composition for forming the heat conductive sheet is poured into a mold (opening: 50 mm ⁇ 50 mm) having a rectangular parallelepiped internal space, and heated in an oven at 60 ° C. for 4 hours to form a molded block.
  • a mold opening: 50 mm ⁇ 50 mm
  • a release PET film was attached to the inner surface of the mold so that the release-treated surface faced the inside.
  • a thermally conductive sheet in which scale-like boron nitride was oriented in the thickness direction of the sheet was obtained.
  • the obtained thermally conductive sheet was sandwiched between release-treated PET films to obtain a supply form of the thermally conductive sheet. This supply form of the heat conductive sheet was left for one week (7 days).
  • Example 2 In Example 2, 37% by volume of silicone resin, 23% by volume of scaly boron nitride (D50 is 40 ⁇ m) having a hexagonal crystal shape, 20% by volume of aluminum nitride (D50 is 1.5 ⁇ m), and alumina A resin composition for forming a heat conductive sheet is prepared by uniformly mixing 17% by volume of particles (D50 of 1 ⁇ m), 1% by volume of aluminum hydroxide (8 ⁇ m of D50), and 1% by volume of a silane coupling agent. A heat conductive sheet was obtained in the same manner as in Example 1 except for the preparation. The obtained thermally conductive sheet was sandwiched between release-treated PET films to obtain a supply form of the thermally conductive sheet. This supply form of the heat conductive sheet was left for one week (7 days).
  • Comparative Example 1 a thermally conductive sheet obtained in the same manner as in Example 1 was allowed to stand for 7 days without being sandwiched between release-treated PET films.
  • Comparative Example 2 In Comparative Example 2, 37% by volume of silicone resin, 23% by volume of scaly boron nitride (D50 is 40 ⁇ m) having a hexagonal crystal shape, 20% by volume of aluminum nitride (D50 is 1.5 ⁇ m), and alumina A resin composition for forming a heat conductive sheet was prepared by uniformly mixing 19% by volume of particles (D50 of 1 ⁇ m) and 1% by volume of a silane coupling agent. A heat conductive sheet was obtained in the same manner as in Example 1 using this resin composition for forming a heat conductive sheet. It was allowed to stand for 7 days without being sandwiched between release-treated PET films.
  • Thermal conductivity in the thickness direction of the thermally conductive sheets obtained in Comparative Examples 1 and 2 were measured respectively. Specifically, using a thermal resistance measuring device conforming to ASTM-D5470, a load of 1 kgf/cm 2 was applied, and the thermal conductivity of the heat conductive sheet main body or the heat conductive sheet immediately after production and after leaving for 7 days after production was measured. Table 1 shows the results.
  • FIG. 6 is a diagram for explaining a method of evaluating whether or not the heat conductive sheet slips off the aluminum plate when the heat conductive sheet body is placed on the aluminum plate and shifted by 90°.
  • Examples 1 and 2 as shown in FIG. 6(A), after placing the heat conductive sheet body 3 (3A) on the horizontally placed aluminum plate 8, as shown in FIG. 6(B), Second, it was evaluated whether or not the heat conductive sheet body 3 (3A) slipped down from the aluminum plate 8 when the aluminum plate 8 was tilted 90° while holding the heat conductive sheet body 3 (3A). Table 1 shows the results.
  • Comparative Examples 1 and 2 since the thermally conductive sheets that were not sandwiched between the release films were used, the surfaces of the thermally conductive sheets did not have tackiness compared to the supply forms of the thermally conductive sheets of Examples 1 and 2. I found out. Moreover, it was found that the heat conductive sheets in Comparative Examples 1 and 2 were not fixed when the heat conductive sheets were placed on the aluminum plate. This suggests that it is difficult for the thermally conductive sheets in Comparative Examples 1 and 2 to suppress misalignment during mounting of the thermally conductive sheets.
  • thermally conductive sheet 1 Supply form of thermally conductive sheet, 2 Release film, 3, 3A Thermally conductive sheet body, 4 Binder resin, 5 Thermally conductive material having shape anisotropy, 5A Scale-like boron nitride, a Major axis, b Thickness, c Short axis, 6 Other thermally conductive material, 7 Release film, 8 Aluminum plate, 50 Semiconductor device, 51 Electronic component, 52 Heat spreader, 53 Heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une feuille thermoconductrice dont la surface est collante.　L'invention concene un mode d'alimentation en feuille thermoconductrice (1) dans lequel un corps de feuille thermoconductrice (3) est pris en sandwich entre des films de décollement (2), et la surface du corps de feuille thermoconductrice (3) est collante immédiatement après le décollement des films de décollement (2) du corps de feuille thermoconductrice (3).
PCT/JP2022/003506 2021-02-09 2022-01-31 Mode d'alimentation en feuille conductrice thermique, et corps de feuille thermoconductrice WO2022172795A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-018765 2021-02-09
JP2021018765A JP7057845B1 (ja) 2021-02-09 2021-02-09 熱伝導シートの供給形態及び熱伝導シート本体

Publications (1)

Publication Number Publication Date
WO2022172795A1 true WO2022172795A1 (fr) 2022-08-18

Family

ID=81291782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/003506 WO2022172795A1 (fr) 2021-02-09 2022-01-31 Mode d'alimentation en feuille conductrice thermique, et corps de feuille thermoconductrice

Country Status (2)

Country Link
JP (1) JP7057845B1 (fr)
WO (1) WO2022172795A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355654A (ja) * 1999-06-15 2000-12-26 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体及びその用途
JP2015029075A (ja) * 2013-07-01 2015-02-12 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材
JP2017038086A (ja) * 2014-10-31 2017-02-16 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
WO2019160004A1 (fr) * 2018-02-14 2019-08-22 積水ポリマテック株式会社 Feuille thermoconductrice
JP2020013871A (ja) * 2018-07-18 2020-01-23 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2020129628A (ja) * 2019-02-09 2020-08-27 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの実装方法、電子機器の製造方法
JP2020198334A (ja) * 2019-05-31 2020-12-10 三菱製紙株式会社 熱伝導性シート
JP2020196828A (ja) * 2019-06-04 2020-12-10 リンテック株式会社 粘着性放熱シート

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355654A (ja) * 1999-06-15 2000-12-26 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体及びその用途
JP2015029075A (ja) * 2013-07-01 2015-02-12 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材
JP2017038086A (ja) * 2014-10-31 2017-02-16 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
WO2019160004A1 (fr) * 2018-02-14 2019-08-22 積水ポリマテック株式会社 Feuille thermoconductrice
JP2020013871A (ja) * 2018-07-18 2020-01-23 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2020129628A (ja) * 2019-02-09 2020-08-27 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの実装方法、電子機器の製造方法
JP2020198334A (ja) * 2019-05-31 2020-12-10 三菱製紙株式会社 熱伝導性シート
JP2020196828A (ja) * 2019-06-04 2020-12-10 リンテック株式会社 粘着性放熱シート

Also Published As

Publication number Publication date
JP7057845B1 (ja) 2022-04-20
JP2022121838A (ja) 2022-08-22

Similar Documents

Publication Publication Date Title
JP5752299B2 (ja) 熱伝導シートの製造方法、熱伝導シート、及び放熱部材
KR101681861B1 (ko) 열전도 시트의 제조 방법, 열전도 시트, 및 방열 부재
US20170309542A1 (en) Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device
WO2020153346A1 (fr) Procédé de production d'une feuille thermoconductrice
JP2020013872A (ja) 熱伝導性シートの製造方法
WO2020162164A1 (fr) Feuille thermoconductrice, procédé de montage de feuille thermoconductrice et procédé de production d'équipement électronique
WO2022044724A1 (fr) Feuille thermo-conductrice, et procédé de fabrication de celle-ci
WO2022172795A1 (fr) Mode d'alimentation en feuille conductrice thermique, et corps de feuille thermoconductrice
WO2022172782A1 (fr) Mode d'alimentation en feuille thermoconductrice, et feuille thermoconductrice
JP6999003B1 (ja) 熱伝導性シート及び熱伝導性シートの製造方法
JP6307288B2 (ja) 熱伝導性部材、及び半導体装置
WO2022264895A1 (fr) Feuille thermoconductrice et procédé de production de feuille thermoconductrice
JP6987941B1 (ja) 熱伝導性シート及び熱伝導性シートの製造方法
WO2022181171A1 (fr) Feuille thermoconductrice et son procédé de fabrication
JP2022192025A (ja) 熱伝導シート及び熱伝導シートの製造方法
WO2021230047A1 (fr) Feuille thermo-conductrice et son procédé de fabrication
JP6976393B2 (ja) 熱伝導性シート及び熱伝導性シートの製造方法
JP6862601B1 (ja) 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
CN117480600A (zh) 导热片及导热片的制造方法
CN114174435B (zh) 导热片及其制造方法以及散热结构体和电子设备
JP2022129325A (ja) 熱伝導シート及び熱伝導シートの製造方法
JP2014216399A (ja) 熱伝導シート及び熱伝導シートの製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22752624

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22752624

Country of ref document: EP

Kind code of ref document: A1