WO2022172782A1 - 熱伝導シートの供給形態及び熱伝導シート - Google Patents
熱伝導シートの供給形態及び熱伝導シート Download PDFInfo
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- WO2022172782A1 WO2022172782A1 PCT/JP2022/003281 JP2022003281W WO2022172782A1 WO 2022172782 A1 WO2022172782 A1 WO 2022172782A1 JP 2022003281 W JP2022003281 W JP 2022003281W WO 2022172782 A1 WO2022172782 A1 WO 2022172782A1
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- Prior art keywords
- conductive sheet
- thermally conductive
- precursor
- heat
- supply form
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Definitions
- This technology relates to the supply form of the thermally conductive sheet and the thermally conductive sheet.
- This application claims priority based on Japanese Patent Application No. 2021-020252 filed on February 10, 2021 in Japan, and this application is hereby incorporated by reference. Incorporated.
- an electronic component is attached to a heat sink such as a heat dissipating fan or a heat dissipating plate via a heat conductive sheet.
- a heat conductive sheet for example, a silicone resin containing (dispersing) a filler such as an inorganic filler is widely used. A further improvement in thermal conductivity is required for a heat dissipating member such as this heat conductive sheet.
- the thermal conductivity of the thermally conductive sheet it is being studied to increase the filling rate of the inorganic filler blended in the matrix such as the binder resin.
- increasing the filling rate of the inorganic filler impairs the flexibility of the thermal conductive sheet or causes powder to fall off, so there is a limit to increasing the filling rate of the inorganic filler.
- inorganic fillers include alumina, aluminum nitride, and aluminum hydroxide.
- the matrix may be filled with scaly particles such as boron nitride or graphite, carbon fibers, or the like. This is due to the anisotropy of the thermal conductivity of the scaly particles and the like.
- carbon fibers are known to have a thermal conductivity of about 600 to 1200 W/m ⁇ K in the fiber direction.
- Boron nitride has a thermal conductivity of about 110 W/m ⁇ K in the plane direction and a thermal conductivity of about 2 W/m ⁇ K in the direction perpendicular to the plane direction. Are known.
- Patent Document 1 describes a thermally conductive sheet containing boron nitride.
- a thermally conductive sheet can be obtained, for example, by producing a molded block from a resin composition for forming a thermally conductive sheet and slicing it.
- a heat conductive sheet is produced by slicing a molded block in this way, there is a problem that the surface of the heat conductive sheet lacks tackiness.
- the thermally conductive sheet cannot be attached to the adherend, and there is a possibility that the thermally conductive sheet will be misaligned when mounted.
- This technology has been proposed in view of such conventional circumstances, and provides a heat conductive sheet having a tacky surface.
- the thermally conductive sheet according to the present technology contains a binder resin and scaly boron nitride, the scaly boron nitride is oriented in the thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet have tackiness. .
- a method for manufacturing a thermally conductive sheet according to the present technology includes a step A of preparing a thermally conductive composition containing a binder resin and scale-like boron nitride, a step B of forming a molded block from the thermally conductive composition, and molding. There are a step C of slicing the body block into sheets to obtain a thermally conductive sheet precursor, and a step D of pressing the thermally conductive sheet precursor to obtain a thermally conductive sheet.
- FIG. 1 is a cross-sectional view showing an example of a heat conductive sheet.
- FIG. 2 is a perspective view schematically showing scale-like boron nitride having a hexagonal crystal shape.
- FIG. 3 is a cross-sectional view showing an example of a supply form of the heat conductive sheet.
- FIG. 4 is a cross-sectional view for explaining an example of Step D of pressing a thermally conductive sheet precursor to obtain a thermally conductive sheet in the method for manufacturing a thermally conductive sheet.
- FIG. 5 is a cross-sectional view for explaining an example of Step D of pressing a thermally conductive sheet precursor to obtain a thermally conductive sheet in the method for manufacturing a thermally conductive sheet.
- FIG. 1 is a cross-sectional view showing an example of a heat conductive sheet.
- FIG. 2 is a perspective view schematically showing scale-like boron nitride having a hexagonal crystal shape.
- FIG. 3 is a cross-sectional
- FIG. 6 is a cross-sectional view showing an example of a semiconductor device to which a heat conductive sheet is applied.
- FIG. 7 is a diagram for explaining a method of evaluating whether or not the heat conductive sheet slips off the aluminum plate when the heat conductive sheet is placed on the aluminum plate and shifted by 90°.
- the average particle size (D50) of scaly boron nitride or a thermally conductive material is, for example, when the entire particle size distribution of scaly boron nitride or a thermally conductive material is 100%, the particle diameter It is the particle diameter at which the cumulative value is 50% when the cumulative curve of the particle diameter values is obtained from the small particle diameter side of the distribution.
- the particle size distribution (particle size distribution) in this specification is determined by volume. Examples of the method for measuring the particle size distribution include a method using a laser diffraction particle size distribution analyzer.
- the thermally conductive sheet according to the present technology contains a binder resin and scaly boron nitride, the scaly boron nitride is oriented in the thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet have tackiness. .
- the thermally conductive sheet according to the present technology since the surface of the thermally conductive sheet according to the present technology has tackiness, the thermally conductive sheet can be attached to the adherend, and misalignment during mounting of the thermally conductive sheet can be suppressed. can.
- FIG. 1 is a cross-sectional view showing an example of a heat conductive sheet.
- the thermally conductive sheet 1 contains a binder resin 2 and scaly boron nitride 3 , and the scaly boron nitride 3 is oriented in the thickness direction B of the thermally conductive sheet 1 .
- the surface direction of the scale-like boron nitride 3 (for example, the long axis of the boron nitride 3 ) may be oriented in the thickness direction B of the thermally conductive sheet 1 .
- the thermally conductive sheet 1 may further include a thermally conductive material 4 other than the scaly boron nitride 3 . Specific examples of the components of the thermally conductive sheet 1 will be described below.
- the binder resin 2 is for holding the scaly boron nitride 3 and other thermally conductive material 4 in the thermally conductive sheet 1 .
- the binder resin 2 is selected according to properties such as mechanical strength, heat resistance, and electrical properties required for the heat conductive sheet 1 .
- the binder resin 2 can be selected from thermoplastic resins, thermoplastic elastomers, and thermosetting resins.
- thermoplastic resins include polyethylene, polypropylene, ethylene- ⁇ -olefin copolymers such as ethylene-propylene copolymers, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, ethylene-vinyl acetate copolymers, Fluorinated polymers such as polyvinyl alcohol, polyvinyl acetal, polyvinylidene fluoride and polytetrafluoroethylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer Polymer (ABS) resin, polyphenylene-ether copolymer (PPE) resin, modified PPE resin, aliphatic polyamides, aromatic polyamides, polyimide, polyamideimide, polymeth
- Thermoplastic elastomers include styrene-butadiene block copolymers or hydrogenated products thereof, styrene-isoprene block copolymers or hydrogenated products thereof, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, and vinyl chloride-based thermoplastic elastomers. , polyester-based thermoplastic elastomers, polyurethane-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, and the like.
- Thermosetting resins include crosslinked rubbers, epoxy resins, phenolic resins, polyimide resins, unsaturated polyester resins, diallyl phthalate resins, and the like.
- Specific examples of crosslinked rubber include natural rubber, acrylic rubber, butadiene rubber, isoprene rubber, styrene-butadiene copolymer rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene-propylene copolymer rubber, chlorinated polyethylene rubber, Chlorosulfonated polyethylene rubber, butyl rubber, halogenated butyl rubber, fluororubber, urethane rubber, and silicone rubber.
- a silicone resin is preferable in consideration of the adhesion between the heat generating surface of the electronic component and the heat sink surface.
- the silicone resin for example, a two-component addition reaction type silicone resin composed of a silicone having an alkenyl group as a main component, a main agent containing a curing catalyst, and a curing agent having a hydrosilyl group (Si—H group).
- the alkenyl group-containing silicone for example, a vinyl group-containing polyorganosiloxane can be used.
- the curing catalyst is a catalyst for promoting the addition reaction between the alkenyl group in the alkenyl group-containing silicone and the hydrosilyl group in the hydrosilyl group-containing curing agent.
- the curing catalyst include well-known catalysts used in hydrosilylation reactions, and examples include platinum group curing catalysts, such as platinum group metals such as platinum, rhodium and palladium, and platinum chloride.
- platinum group curing catalysts such as platinum group metals such as platinum, rhodium and palladium, and platinum chloride.
- the curing agent having hydrosilyl groups for example, polyorganosiloxane having hydrosilyl groups can be used.
- the binder resin 2 may be used individually by 1 type, and may use 2 or more types together.
- the content of the binder resin 2 in the heat conductive sheet 1 is not particularly limited, and can be appropriately selected according to the purpose.
- the content of the binder resin 2 in the thermally conductive sheet 1 can be 20% by volume or more, may be 25% by volume or more, or 30% by volume from the viewpoint of the flexibility of the thermally conductive sheet 1. or more, or 33% by volume or more.
- the content of the binder resin 2 in the heat conductive sheet 1 can be 70% by volume or less from the viewpoint of the thermal conductivity of the heat conductive sheet 1, and may be 60% by volume or less, or 50% by volume. % or less, 40 volume % or less, or 37 volume % or less.
- the content of the binder resin 2 in the thermally conductive sheet 1 is preferably 25 to 60% by volume, and may be 30 to 40% by volume, for example, from the viewpoint of the flexibility of the thermally conductive sheet 1. It can also be ⁇ 37% by volume.
- the thermally conductive sheet 1 contains scaly boron nitride 3 .
- the scaly boron nitride 3 is a boron nitride having a long axis, a short axis and a thickness, has a high aspect ratio (long axis/thickness), and exhibits isotropic heat conduction in the plane including the long axis.
- the short axis is a direction that intersects the long axis at approximately the center of the particles of the scale-like boron nitride 3 in the plane containing the long axis of the scale-like boron nitride 3, and is the most of the scale-like boron nitride 3.
- the thickness is an average value obtained by measuring the thickness of 10 points of the plane containing the long axis of the scale-like boron nitride 3 .
- the scale-like boron nitride 3 may be used singly or in combination of two or more.
- FIG. 2 is a perspective view schematically showing scale-like boron nitride 3A having a hexagonal crystal shape, which is an example of scale-like boron nitride.
- a represents the long axis of the scaly boron nitride 3A
- b represents the thickness of the scaly boron nitride 3A
- c represents the short axis of the scaly boron nitride 3A.
- the scale-like boron nitride 3 from the viewpoint of the thermal conductivity of the heat conductive sheet 1, it is preferable to use scale-like boron nitride 3A having a hexagonal crystal shape as shown in FIG.
- the average particle size (D50) of the scale-like boron nitride 3 is not particularly limited, and can be appropriately selected according to the purpose.
- the average particle size of the scale-like boron nitride 3 can be 10 ⁇ m or more, may be 20 ⁇ m or more, may be 30 ⁇ m or more, or may be 35 ⁇ m or more.
- the upper limit of the average particle diameter of the scale-like boron nitride 3 can be 150 ⁇ m or less, may be 100 ⁇ m or less, may be 90 ⁇ m or less, may be 80 ⁇ m or less, or may be 70 ⁇ m. It may be less than or equal to 50 ⁇ m, or less than or equal to 45 ⁇ m.
- the average particle size of the scale-like boron nitride 3 is preferably 20 to 100 ⁇ m.
- the aspect ratio of the scale-like boron nitride 3 is not particularly limited, and can be appropriately selected according to the purpose.
- the aspect ratio of the scaly boron nitride 3 can be in the range of 10-100.
- the average value of the ratio of the long axis to the short axis (major axis/minor axis) of the scale-like boron nitride 3 can be, for example, in the range of 0.5 to 10, preferably in the range of 1 to 5. can also be in the range of 1-3.
- the content of the scale-like boron nitride 3 in the thermal conductive sheet 1 is not particularly limited, and can be appropriately selected according to the purpose.
- the content of the scale-like boron nitride 3 in the heat conductive sheet 1 can be 15% by volume or more, and may be 20% by volume or more, from the viewpoint of the thermal conductivity of the heat conductive sheet 1. , 23% by volume or more.
- the upper limit of the content of the scale-like boron nitride 3 in the thermally conductive sheet 1 can be, for example, 45% by volume or less from the viewpoint of the flexibility of the thermally conductive sheet 1, and 40% by volume or less. It may be present, may be 35% by volume or less, or may be 30% by volume or less.
- the content of the scale-like boron nitride 3 in the heat conductive sheet 1 is preferably 20 to 35% by volume, more preferably 20 to 30% by volume. It is preferably 23 to 27% by volume, and more preferably 23 to 27% by volume.
- the other thermally conductive material 4 is a thermally conductive material other than the scale-like boron nitride 3 described above.
- Other shapes of the heat-conducting material 4 include, for example, spherical, powdery, granular, flat, fibrous, and the like.
- Other thermally conductive materials 4 may be used singly or in combination of two or more.
- the other heat conductive material 4 may be a combination of aluminum nitride particles and alumina particles, or a combination of aluminum nitride particles, alumina particles, zinc oxide, and aluminum hydroxide. A mode in which they are used in combination is preferred.
- the average particle size (D50) of the aluminum nitride particles may be, for example, 1-5 ⁇ m, may be 1-3 ⁇ m, or may be 1-2 ⁇ m.
- the average particle diameter (D50) of the alumina particles may be, for example, 0.1 to 10 ⁇ m, may be 0.1 to 8 ⁇ m, may be 0.1 to 7 ⁇ m, or may be 0.1 to 8 ⁇ m. It may be 1-2 ⁇ m.
- the average particle size (D50) of the zinc oxide particles can be, for example, 0.1 to 5 ⁇ m, may be 0.5 to 3 ⁇ m, or may be 0.5 to 2 ⁇ m.
- the average particle diameter (D50) of the aluminum hydroxide particles can be, for example, 1 to 10 ⁇ m, may be 2 to 9 ⁇ m, or may be 6 to 8 ⁇ m.
- the content of the other thermally conductive material 4 in the thermally conductive sheet 1 is not particularly limited, and can be appropriately selected according to the purpose. From the viewpoint of the thermal conductivity of the heat conductive sheet 1, the content of the other heat conductive material 4 in the heat conductive sheet 1 can be 10% by volume or more, and may be 15% by volume or more. It may be vol % or more, 25 vol % or more, 30 vol % or more, or 35 vol % or more. In addition, the content of the other thermally conductive material 4 in the thermally conductive sheet 1 can be 50% by volume or less, and may be 45% by volume or less, from the viewpoint of the flexibility of the thermally conductive sheet 1. It may be 40% by volume or less.
- the content of alumina particles in the thermally conductive sheet 1 is preferably 10 to 25% by volume, and the content of aluminum nitride particles is It is preferably 10 to 25% by volume.
- the content of the alumina particles in the thermally conductive sheet 1 is set to 10 to 25% by volume.
- the content of aluminum nitride particles is preferably 10 to 25% by volume
- the content of zinc oxide particles is preferably 0.1 to 3% by volume
- the content of aluminum hydroxide particles is preferably It is preferably 0.1 to 3% by volume.
- the heat conductive sheet 1 may further contain components other than the components described above within a range that does not impair the effects of the present technology.
- examples of other components include silane coupling agents (coupling agents), dispersants, curing accelerators, retarders, tackifiers, plasticizers, flame retardants, antioxidants, stabilizers, colorants, and the like. be done.
- the heat conductive sheet 1 is treated with a silane coupling agent from the viewpoint of further improving the dispersibility of the scale-like boron nitride 3 and other heat conductive material 4 and further improving the flexibility of the heat conductive sheet 1.
- Scaly boron nitride 3 and/or other thermally conductive material 4 treated with a silane coupling agent may also be used.
- the thickness of the heat conductive sheet 1 is not particularly limited, and can be appropriately selected according to the purpose.
- the thickness of the heat conductive sheet 3 can be 0.05 mm or more, and can also be 0.1 mm or more.
- the upper limit of the thickness of the heat conductive sheet 1 may be 5 mm or less, may be 4 mm or less, or may be 3 mm or less.
- the heat conductive sheet 1 preferably has a thickness of 0.1 to 4 mm.
- the thickness of the thermally conductive sheet 3 can be obtained, for example, from the arithmetic mean value of the thickness of the thermally conductive sheet 1 measured at five arbitrary points.
- the heat conductive sheet 1 may have a specific gravity of 2.7 or less, 2.6 or less, 2.5 or less, or 2.4 or less. It may be 2.3 or less.
- the heat conductive sheet 1 may have a specific gravity of 2.0 or more, 2.1 or more, or 2.2 or more. The specific gravity of the heat conductive sheet 1 can be measured by the method described in Examples below.
- the heat conductive sheet 1 may have a regular pattern on its surface.
- the thermally conductive sheet 1 has a regular pattern on the surface, so that the thermally conductive sheet 1 can be easily distinguished from other thermally conductive sheets in terms of appearance.
- the heat conductive sheet 1 has a regular pattern on the surface, for example, when it is attached to an adherend, air is included between the heat conductive sheet and the adherend. can be suppressed, and the heat conductive sheet can be attached more reliably to the adherend. Therefore, it is possible to improve the adhesion when mounting the heat conductive sheet.
- a pattern having regularity is a visible pattern, for example, a geometric pattern such as a polygonal shape having sides that are not perpendicular to each other, a pattern in which a plurality of circles or ellipses are continuous, or these geometric patterns and a circle, A pattern in which elliptical patterns are mixed is mentioned.
- FIG. 3 is a cross-sectional view showing an example of the supply form of the heat conductive sheet.
- the thermally conductive sheet 1 can be supplied in a thermally conductive sheet supply form 5 sandwiched between release films 6 .
- the supply form 5 of the thermally conductive sheet is, for example, a laminate including the release film 6A, the thermally conductive sheet 1, and the release film 6B in this order.
- release films 6 are provided on both sides of one thermally conductive sheet 1 .
- the release films 6 may be provided on both sides of the plurality of thermally conductive sheets 1 arranged at predetermined intervals in the vertical and horizontal directions.
- the tack force measured under the following conditions is preferably 20 gf or more, may be 75 gf or more, or may be 80 gf or more.
- Measurement method The heat conductive sheet 1 sandwiched between the release films 6 (supply form 5 of the heat conductive sheet) is pressed at 0.5 MPa for 30 seconds, and within 3 minutes after peeling the release film 6 from the heat conductive sheet 1 , and a probe having a diameter of 5.1 mm pushes the heat conductive sheet 1 by 50 ⁇ m at 2 mm/sec and pulls it out at 10 mm/sec.
- the release film 6 examples include PET (polyethylene terephthalate), PEN (polyethylene naphthalate), polyolefin, polymethylpentene, glassine paper, and the like.
- the thickness of the release film 6 is not particularly limited, and can be appropriately selected according to the purpose. Also, the thinner the release film 6 is, the better the followability (adhesion) to the heat conductive sheet 1 is, and the more effectively the tack force of the heat conductive sheet 1 can be exhibited.
- the release film 6 is preferably a thin PET film.
- the release film 6A and the release film 6B may be made of the same material or may be made of different materials. Moreover, the thickness of the release film 6A and the release film 6B may be the same or may be different.
- the method for producing the thermally conductive sheet 1 includes a step A of preparing a thermally conductive composition, a step B of forming a molded block from the thermally conductive composition, and slicing the molded block into sheets to obtain a thermally conductive sheet precursor. and a step D of pressing the thermally conductive sheet precursor to obtain a thermally conductive sheet.
- a thermally conductive composition containing binder resin 2 and scaly boron nitride 3 is prepared.
- the thermally conductive composition may further contain another thermally conductive material 4 in addition to the binder resin 2 and the scale-like boron nitride 3 .
- the thermally conductive composition may be uniformly mixed with various additives and volatile solvents by known methods.
- a thermally conductive composition is prepared by dispersing scale-like boron nitride 3 and another thermally conductive material 4 in binder resin 2 .
- a molded block is formed from the thermally conductive composition prepared in step A.
- methods for forming the molded block include an extrusion molding method and a mold molding method.
- the extrusion molding method and the mold molding method are not particularly limited, and can be selected from various known extrusion molding methods and mold molding methods depending on the viscosity of the heat conductive composition and the properties required for the heat conductive sheet. It can be adopted as appropriate.
- the binder resin 2 flows and scales along the flow direction.
- shaped boron nitride 3 is oriented.
- the size and shape of the molded block can be determined according to the required size of the heat conductive sheet 1. For example, a rectangular parallelepiped having a cross-sectional length of 0.5 to 15 cm and a width of 0.5 to 15 cm can be used. The length of the rectangular parallelepiped may be determined as required.
- a columnar molded block is formed from a cured product of the thermally conductive composition, in which the surface direction of the scale-like boron nitride 3 (long axis a of the scale-like boron nitride 3) is oriented in the extrusion direction. It's easy to do.
- step C the molded block is sliced into sheets to obtain the thermally conductive sheet precursor 7 .
- the scaly boron nitride 3 is exposed on the surface (sliced surface) of the thermally conductive sheet precursor obtained by slicing.
- the slicing method is not particularly limited, and can be appropriately selected from known slicing devices (preferably an ultrasonic cutter) according to the size and mechanical strength of the compact block.
- the slicing direction of the molded block is preferably 60 to 120 degrees, more preferably 70 to 100 degrees, because some are oriented in the extrusion direction when the molding method is extrusion molding. more preferably in the direction of , and even more preferably in the direction of 90 degrees (perpendicular).
- the molded block is preferably sliced in a direction substantially perpendicular to the length direction.
- step D the thermally conductive sheet precursor 7 is pressed to obtain the thermally conductive sheet 1 .
- step D the sliced surface of the thermal conductive sheet precursor 7 is pressed.
- the binder resin 2 and the scaly boron nitride 3 are included, and the scaly boron nitride 3 is the thickness of the thermally conductive sheet 1.
- a thermally conductive sheet 1 oriented in the direction B and having tackiness on both sides is obtained.
- the thermally conductive sheet 1 obtained in the step D has tackiness on both sides, so that the thermally conductive sheet 1 can be prevented from being displaced when mounted.
- step D the thermally conductive sheet precursor 7 obtained in step C is pressed to convert the binder resin 2 constituting the thermally conductive sheet precursor 7 into the thermally conductive sheet 1 (the thermally conductive sheet precursor 7 after pressing). , and the heat conductive sheet 1 comes to have tackiness.
- the binder resin 2 that oozes out onto the surface of the heat conductive sheet 1 may be in an uncured state or in a state in which curing has progressed by several percent.
- the thermally conductive sheet 1 obtained in step D has a smoother surface, and the adhesion between the thermally conductive sheet 1 and other members can be further improved.
- a pair of press devices consisting of a flat plate and a press head with a flat surface can be used to press the heat conductive sheet precursor 7 .
- the heat conductive sheet precursor 7 may be pressed with pinch rolls.
- the pressure during pressing may be, for example, in the range of 0.1 to 100 MPa, may be in the range of 0.1 to 1 MPa, or may be in the range of 0.1 to 0.5 MPa.
- pressing may be performed at a temperature higher than the glass transition temperature (Tg) of the binder resin 2 constituting the thermally conductive sheet precursor 7 .
- the pressing temperature may range, for example, from 0 to 180°C, may range from room temperature (eg, 25°C) to 100°C, or may range from 30 to 100°C. Press times can range, for example, from 10 seconds to 5 minutes, and may range from 30 seconds to 3 minutes. From the viewpoint of more effectively expressing the tackiness of the heat conductive sheet 1, for example, the pressure during pressing is preferably in the range of 0.3 to 0.6 MPa, and the pressing temperature is preferably in the range of 60 to 100.degree.
- step D is cross-sectional views for explaining an example of step D of pressing a thermally conductive sheet precursor to obtain a thermally conductive sheet in the method for manufacturing a thermally conductive sheet.
- the arrows in FIGS. 4 and 5 represent the direction of pressing.
- step D as shown in FIG. 4, the state in which the thermally conductive sheet precursor 7 is sandwiched between the release films 6, that is, the laminate of the release film 6A, the thermally conductive sheet precursor 7, and the release film 6B is pressed. good too. This can prevent the thermally conductive sheet precursor 7 from adhering to the pressing device when the thermally conductive sheet precursor 7 is pressed.
- step D a film having regular irregularities on its surface may be used as the release film 6 shown in FIG.
- the thermally conductive sheet 1 having a regular pattern formed on the surface as described above can be obtained, and the followability (adherence) of the release film 6 to the thermally conductive sheet 1 is improved. 1 can be more effectively expressed.
- the irregularities with regularity refer to shapes that can form a pattern having the regularity described above in the heat conductive sheet 1, for example, the shape of the recesses or protrusions in a plan view has a geometry such as a polygonal shape having sides that are not orthogonal to each other.
- the regular unevenness may be linear or wavy in the shape of the concave portion or the convex portion in a plan view.
- a specific example of the release film 6 having regular unevenness on the surface is the product name NEF (embossed film having diamond-shaped unevenness on the surface) manufactured by Ishijima Kagaku Kogyo.
- step D as shown in FIG. 5, the thermally conductive sheet precursor 7 is sandwiched between release films 6A and 6B, and a rubber cushion 8 having a regular pattern is placed outside the release films 6A and 6B.
- a laminated body in which the rubber cushion 8A, the release film 6A, the heat conductive sheet precursor 7, the release film 6B and the rubber cushion 8B are arranged in this order may be pressed.
- the heat conductive sheet 1 having a regular pattern formed on the surface as described above can be obtained, and the followability (adhesion) of the release film 6 to the heat conductive sheet 1 is improved, and heat is applied.
- the tack force of the conductive sheet 1 can be exhibited more effectively.
- the rubber cushion 8 having a regular pattern means, for example, that the pattern of the rubber cushion 8 in a plan view is similar to the above-described regular unevenness.
- a specific example of the rubber cushion 8 having a regular pattern is YOM-F01 FDRR (rubber cushion having a diamond-shaped pattern on its surface) manufactured by Yamauchi Corporation.
- step D as shown in FIGS. 4 and 5 , the heat conductive sheet precursor 7 sandwiched between the release films 6 is pressed, whereby the heat conductive sheet 1 sandwiched between the release films 6 shown in FIG. A supply form 5 of conductive sheet is obtained.
- the heat conductive sheet 1 from which the release film 6 is peeled off from the heat conductive sheet supply form 5 has tackiness on both sides, so that it can be attached to an adherend and positional displacement during mounting can be suppressed.
- the method of pressing the thermally conductive sheet precursor 7 in step D is not limited to the method shown in FIGS. A mode of pressing only from the upper side may be used. Such a method can also obtain the thermally conductive sheet 1 in the same manner as the method shown in FIGS.
- the thermally conductive sheet supply form 5 shown in FIG. can do. That is, when the thermal conductive sheet supply form 5 is pressed at 90° C. and 0.5 MPa for 3 minutes, the tack force of the thermal conductive sheet 1 (thermal conductive sheet precursor 7 after pressing) is equal to that of the thermal conductive sheet precursor before pressing. It can be four times or more the tack force of the body 7 . As described above, the tack force of the heat conductive sheet 1 is four times or more the tack force of the heat conductive sheet precursor 7 before pressing, so that the heat conductive sheet 1 and the adherend (eg, IC) are bonded together.
- the adherend eg, IC
- Adhesion is further improved, and misalignment between the heat conductive sheet 1 and the adherend can be more effectively suppressed. Further, since the tack force of the heat conductive sheet 1 is four times or more the tack force of the heat conductive sheet precursor 7 before pressing, a certain amount of vibration is applied to the heat conductive sheet 1 once attached. Also, the positional deviation of the heat conductive sheet 1 is less likely to occur, which is preferable from the viewpoint of improving workability, productivity, yield, and the like.
- the thermally conductive sheet 1 is, for example, an electronic device (thermal device) having a structure arranged between a heat generating body and a radiator so that the heat generated by the heat generating body is released to the heat radiator.
- An electronic device has at least a heating element, a radiator, and a thermally conductive sheet 1, and may further have other members as necessary.
- the heating element is not particularly limited. and electronic components that generate heat in.
- the heating element also includes components for receiving optical signals, such as optical transceivers in communication equipment.
- the radiator is not particularly limited, and examples include those used in combination with integrated circuit elements, transistors, optical transceiver housings, such as heat sinks and heat spreaders.
- the radiator in addition to the heat spreader and the heat sink, any material can be used as long as it conducts the heat generated from the heat source and dissipates it to the outside.
- a heat pipe, a metal cover, a housing, and the like can be mentioned.
- FIG. 6 is a cross-sectional view showing an example of a semiconductor device to which a heat conductive sheet according to the present technology is applied.
- the heat conductive sheet 1 is mounted on a semiconductor device 50 built in various electronic devices, and sandwiched between a heat generator and a radiator.
- a semiconductor device 50 shown in FIG. 6 includes an electronic component 51 , a heat spreader 52 , and a heat conductive sheet 1 .
- sandwiching the heat conductive sheet 1 between the heat spreader 52 and the heat sink 53 , together with the heat spreader 52 a heat dissipation member for dissipating the heat of the electronic component 51 is configured.
- the mounting location of the heat conductive sheet 1 is not limited to between the heat spreader 52 and the electronic component 51 or between the heat spreader 52 and the heat sink 53, but can be appropriately selected according to the configuration of the electronic device or semiconductor device.
- Example 1 In Example 1, 33% by volume of silicone resin, 27% by volume of scaly boron nitride having a hexagonal crystal shape (D50 is 40 ⁇ m), 20% by volume of aluminum nitride (D50 is 1.2 ⁇ m), and alumina A resin composition for forming a heat conductive sheet was prepared by uniformly mixing 19% by volume of particles (D50 of 1 ⁇ m) and 1% by volume of a silane coupling agent. By extrusion molding, the resin composition for forming the heat conductive sheet is poured into a mold (opening: 50 mm ⁇ 50 mm) having a rectangular parallelepiped internal space, and heated in an oven at 60 ° C. for 4 hours to form a molded block.
- a mold opening: 50 mm ⁇ 50 mm
- a release PET film was attached to the inner surface of the mold so that the release-treated surface faced the inside.
- a thermally conductive sheet precursor in which scaly boron nitride was oriented in the thickness direction of the sheet was obtained.
- the obtained thermally conductive sheet precursor was sandwiched between release-treated PET films and pressed under the conditions of 90° C., 0.5 MPa, and 3 minutes. As a result, a thermally conductive sheet of Example 1 (supply form of a thermally conductive sheet sandwiched between PET films) was obtained.
- Example 2 In Example 2, 37% by volume of silicone resin, 23% by volume of scaly boron nitride (D50 is 40 ⁇ m) having a hexagonal crystal shape, 20% by volume of aluminum nitride (D50 is 1.5 ⁇ m), and alumina A resin composition for forming a heat conductive sheet is prepared by uniformly mixing 17% by volume of particles (D50 of 1 ⁇ m), 1% by volume of aluminum hydroxide (8 ⁇ m of D50), and 1% by volume of a silane coupling agent. A thermal conductive sheet precursor was obtained in the same manner as in Example 1 except for the preparation.
- thermally conductive sheet precursor was sandwiched between release-treated PET films and pressed under the conditions of 90° C., 0.5 MPa, and 3 minutes.
- a thermally conductive sheet of Example 2 supplied form of a thermally conductive sheet in which the thermally conductive sheet is sandwiched between PET films.
- Example 3 In Example 3, the same resin composition for forming a thermally conductive sheet as in Example 1 was used to obtain a thermally conductive sheet precursor. The obtained thermally conductive sheet precursor was sandwiched between embossed films of PET having regular irregularities that had been peeled off, and pressed under the conditions of 90° C., 0.5 MPa, and 3 minutes. As a result, a thermally conductive sheet of Example 3 (supply form of a thermally conductive sheet sandwiched between PET films) was obtained.
- Example 4 In Example 4, the same resin composition for forming a thermally conductive sheet as in Example 1 was used to obtain a thermally conductive sheet precursor. The resulting thermally conductive sheet precursor was sandwiched between release-treated PET films, and a rubber cushion with a regular pattern was placed on the outer side of the PET film. pressed with As a result, a thermally conductive sheet of Example 4 (supply form of a thermally conductive sheet sandwiched between PET films) was obtained.
- Comparative Example 1 a heat conductive sheet precursor was obtained in the same manner as in Example 1. Then, in Comparative Example 1, the obtained thermally conductive sheet precursor was sandwiched between release-treated PET films. However, in Comparative Example 1, unlike in Example 1, the obtained thermal conductive sheet precursor was not pressed.
- the thermal conductivity (W/m ⁇ K) in the thickness direction of each thermal conductive sheet was measured. Specifically, using a thermal resistance measuring device conforming to ASTM-D5470, a load of 1 kgf/cm 2 was applied to measure the thermal conductivity of the thermal conductive sheet before and after pressing (immediately after pressing). In Examples 1 to 4, the thermal conductivity of the thermally conductive sheet supply form (thermally conductive sheet precursor) before pressing and the thermal conductivity of the thermally conductive sheet obtained by peeling the PET film from the thermally conductive sheet supply form after pressing rate was measured. In Comparative Examples 1 and 2, the thermal conductivity of the thermally conductive sheet precursor was measured before pressing. Table 1 shows the results. In Table 1, "-" for the thermal conductivity immediately after pressing means that the measurement was not performed because the pressing was not performed.
- FIG. 7 is a diagram for explaining a method of evaluating whether or not the heat conductive sheet slips off the aluminum plate when the heat conductive sheet is placed on the aluminum plate and shifted by 90°.
- FIG. 7(A) after placing the thermally conductive sheet 1 on the horizontally placed aluminum plate 9, as shown in FIG. 7(B), while holding the thermally conductive sheet 1, the aluminum plate 9 was tilted by 90°, it was evaluated whether or not the heat conductive sheet 1 slipped down from the aluminum plate 9.
- Table 1 shows the results. In Table 1, "fixed just by placing” means that the thermal conductive sheet 1 did not slip off the aluminum plate 9, and “not fixed” means that the thermal conductive sheet 1 slipped off the aluminum plate 9. .
- thermoelectric sheet 1 in FIG. 7 As the heat conductive sheet 1 in FIG. 7, in Examples 1 to 4, a heat conductive sheet obtained by removing the PET film from the supply form of the heat conductive sheet was used, and in Comparative Examples 1 and 2, a heat conductive sheet precursor was used. It was used.
- the tack force (gf) of the surface of the thermally conductive sheet (the thermally conductive sheet precursor immediately after pressing) obtained in Examples 1 to 4 was measured by the following method. After the supply form of the thermally conductive sheet obtained in Examples 1 to 4 was pressed under the conditions described above, the thermally conductive sheet supply form was further press-treated at 0.5 MPa for 30 seconds to obtain a thermally conductive sheet. Within 3 minutes after peeling off the PET film from the supply form, the thermal conductive sheet was pushed by 50 ⁇ m at 2 mm/sec with a probe having a diameter of 5.1 mm, and the tack force on the surface of the thermal conductive sheet was measured when it was pulled out at 10 mm/sec. . Table 1 shows the results. In Table 1, "-" for the tack force after pressing means that the measurement was not performed because the pressing was not performed.
- the thermally conductive sheets obtained in Examples 1 to 4 contained a binder resin and scaly boron nitride, and the scaly boron nitride was oriented in the thickness direction of the thermally conductive sheet. It was also found that the heat conductive sheets obtained in Examples 1 to 4 had tackiness on both sides of the heat conductive sheet. It was also found that the heat conductive sheets obtained in Examples 1 to 4 were fixed when placed on an aluminum plate. This suggests that the thermally conductive sheets in Examples 1 to 4 can suppress misalignment during mounting of the thermally conductive sheets.
- Thermally conductive sheet 2 Binder resin 3 Scale-like boron nitride 3A Scale-like boron nitride a Major axis b Thickness c Minor axis 4 Other thermally conductive materials 5 Supply form of thermally conductive sheet 6 Release film, 7 Thermal conductive sheet precursor, 8 Rubber cushion, 9 Aluminum plate, 50 Semiconductor device, 51 Electronic component, 52 Heat spreader, 53 Heat sink
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Abstract
Description
バインダ樹脂2は、鱗片状の窒化ホウ素3と他の熱伝導材料4とを熱伝導シート1内に保持するためのものである。バインダ樹脂2は、熱伝導シート1に要求される機械的強度、耐熱性、電気的性質等の特性に応じて選択される。バインダ樹脂2としては、熱可塑性樹脂、熱可塑性エラストマー、熱硬化性樹脂の中から選択することができる。
熱伝導シート1は、鱗片状の窒化ホウ素3を含む。鱗片状の窒化ホウ素3とは、長軸と短軸と厚みとを有する窒化ホウ素であって、高アスペクト比(長軸/厚み)であり、長軸を含む面方向に等方的な熱伝導率を有する窒化ホウ素である。短軸とは、鱗片状の窒化ホウ素3の長軸を含む面において、鱗片状の窒化ホウ素3の粒子の略中央部で長軸に交差する方向であって、鱗片状の窒化ホウ素3の最も短い部分の長さをいう。厚みとは、鱗片状の窒化ホウ素3の長軸を含む面の厚みを10点測定して平均した値をいう。鱗片状の窒化ホウ素3は、1種単独で用いてもよいし、2種以上を併用してもよい。
他の熱伝導材料4は、上述した鱗片状の窒化ホウ素3以外の熱伝導材料である。他の熱伝導材料4の形状は、例えば、球状、粉末状、顆粒状、扁平状、繊維状等が挙げられる。他の熱伝導材料4は、1種単独で用いてもよいし、2種以上を併用してもよい。
測定方法:剥離フィルム6で挟んだ熱伝導シート1(熱伝導シートの供給形態5)を0.5MPaで30秒プレス処理し、熱伝導シート1から剥離フィルム6を剥離してから3分以内に、直径5.1mmのプローブにより2mm/秒で熱伝導シート1を50μm押し込み、10mm/秒で引き抜く。
熱伝導シート1は、例えば、発熱体と放熱体との間に配置させることにより、発熱体で生じた熱を放熱体に逃がすためにそれらの間に配された構造の電子機器(サーマルデバイス)とすることができる。電子機器は、発熱体と放熱体と熱伝導シート1とを少なくとも有し、必要に応じて、その他の部材をさらに有していてもよい。
実施例1では、シリコーン樹脂33体積%と、結晶形状が六方晶型である鱗片状の窒化ホウ素(D50が40μm)27体積%と、窒化アルミニウム(D50が1.2μm)20体積%と、アルミナ粒子(D50が1μm)19体積%と、シランカップリング剤1体積%とを均一に混合することにより、熱伝導シート形成用の樹脂組成物を調製した。押出成形法により、熱伝導シート形成用の樹脂組成物を、直方体状の内部空間を有する金型(開口部:50mm×50mm)中に流し込み、60℃のオーブンで4時間加熱させて成形体ブロックを形成した。なお、金型の内面には、剥離処理面が内側となるように剥離PETフィルムを貼り付けておいた。得られた成形体ブロックをスライサーで1mm厚のシート状にスライスすることにより、鱗片状の窒化ホウ素がシートの厚み方向に配向した熱伝導シート前駆体を得た。得られた熱伝導シート前駆体を剥離処理したPETフィルムの間に挟み、90℃、0.5MPa、3分の条件でプレスした。これにより、実施例1の熱伝導シート(熱伝導シートがPETフィルムで挟持された熱伝導シートの供給形態)を得た。
実施例2では、シリコーン樹脂37体積%と、結晶形状が六方晶型である鱗片状の窒化ホウ素(D50が40μm)23体積%と、窒化アルミニウム(D50が1.5μm)20体積%と、アルミナ粒子(D50が1μm)17体積%と、水酸化アルミニウム(D50が8μm)1体積%と、シランカップリング剤1体積%とを均一に混合することにより、熱伝導シート形成用の樹脂組成物を調製したこと以外は、実施例1と同様の方法で熱伝導シート前駆体を得た。得られた熱伝導シート前駆体を剥離処理したPETフィルムの間に挟み、90℃、0.5MPa、3分の条件でプレスした。これにより、実施例2の熱伝導シート(熱伝導シートがPETフィルムで挟持された熱伝導シートの供給形態)を得た。
実施例3では、実施例1と同様の熱伝導シート形成用の樹脂組成物を用いて熱伝導性シート前駆体を得た。得られた熱伝導シート前駆体を剥離処理した規則性の凹凸があるPETのエンボスフィルムの間に挟み、90℃、0.5MPa、3分の条件でプレスした。これにより、実施例3の熱伝導シート(熱伝導シートがPETフィルムで挟持された熱伝導シートの供給形態)を得た。
実施例4では、実施例1と同様の熱伝導シート形成用の樹脂組成物を用いて熱伝導性シート前駆体を得た。得られた熱伝導シート前駆体を剥離処理したPETフィルムの間に挟み、さらに、このPETフィルムの外側に規則性の模様があるラバークッションを配置し、90℃、0.5MPa、3分の条件でプレスした。これにより、実施例4の熱伝導シート(熱伝導シートがPETフィルムで挟持された熱伝導シートの供給形態)を得た。
比較例1では、実施例1と同様の方法で熱伝導シート前駆体を得た。そして、比較例1では、得られた熱伝導シート前駆体を剥離処理したPETフィルムの間に挟んだ。しかし、比較例1では、実施例1のように、得られた熱伝導シート前駆体をプレスしなかった。
比較例2では、シリコーン樹脂37体積%と、結晶形状が六方晶型である鱗片状の窒化ホウ素(D50が40μm)23体積%と、窒化アルミニウム(D50が1.5μm)20体積%と、アルミナ粒子(D50が1μm)19体積%と、シランカップリング剤1体積%とを均一に混合することにより、熱伝導シート形成用の樹脂組成物を調製した。この熱伝導シート形成用の樹脂組成物を用いて、実施例1と同様の方法で熱伝導シート前駆体を得た。そして、比較例2では、得られた熱伝導シート前駆体を剥離処理したPETフィルムの間に挟んだ。しかし、比較例2では、実施例1のように、得られた熱伝導シート前駆体をプレスしなかった。
熱伝導シートの厚み方向の熱伝導率(W/m・K)をそれぞれ測定した。具体的には、ASTM-D5470に準拠した熱抵抗測定装置を用いて、荷重1kgf/cm2をかけて、プレス前およびプレス後(プレス直後)の熱伝導シートの熱伝導率を測定した。実施例1~4では、プレス前の熱伝導シートの供給形態(熱伝導シート前駆体)の熱伝導率と、プレス後の熱伝導シートの供給形態からPETフィルムを剥がした熱伝導シートの熱伝導率を測定した。比較例1,2では、プレス前の熱伝導シート前駆体の熱伝導率を測定した。結果を表1に示す。表1中、プレス直後の熱伝導率が「-」とは、プレスを行わなかったため測定しなかったことを意味する。
実施例1~4で得られた熱伝導シート及び比較例1,2で得られた熱伝導シート前駆体について、シートの縦、横の長さと厚みから求めた体積と熱伝導シートの重量を測定することにより、熱伝導シート又は熱伝導シート前駆体の比重を求めた。結果を表1に示す。
図7は、熱伝導シートをアルミ板の上に載せ、90°ずらしたときに、アルミ板から熱伝導シートがずり落ちるかどうかの評価方法を説明するための図である。図7(A)に示すように、水平に置いたアルミ板9の上に熱伝導シート1を載せた後、図7(B)に示すように、熱伝導シート1を保持しながらアルミ板9を90°傾けたときに、アルミ板9から熱伝導シート1がずり落ちるかどうかを評価した。結果を表1に示す。表1中、「置くだけで固定」とはアルミ板9から熱伝導シート1がずり落ちなかったことを表し、「固定されない」とはアルミ板9から熱伝導シート1がずり落ちたことを表す。なお、図7中の熱伝導シート1として、実施例1~4では、熱伝導シートの供給形態からPETフィルムを剥がした熱伝導シートを使用し、比較例1,2では、熱伝導シート前駆体を使用した。
実施例1~4で得られたプレス後の熱伝導シートの供給形態を、0.5MPaで30秒プレス処理し、この熱伝導シートの供給形態からPETフィルムを剥がした際に、このPETフィルムに、熱伝導シートの跡(白色)が付着したかどうかを目視で確認した。また、比較例1,2で得られたPETフィルムで挟持された熱伝導シート前駆体を、0.5MPaで30秒プレス処理し、このPETフィルムで挟持された熱伝導シート前駆体からPETフィルムを剥がした際に、このPETフィルムに、熱伝導シート前駆体の跡(白色)が付着したかどうかを目視で確認した。結果を表1に示す。
実施例1~4で得られた熱伝導シートの表面を目視により評価した。結果を表1に示す。表1中、シート表面が「-」とは、プレスを行わなかったため評価しなかったことを意味する。
得られた熱伝導シート前駆体について、直径5.1mmのプローブにより熱伝導シート前駆体を2mm/秒で50μm押し込み、10mm/秒で引き抜いた際の熱伝導シート前駆体の表面のタック力(gf)を求めた。なお、実施例1~4では、スライス後プレス前の熱伝導シート前駆体を対象とした。結果を表1に示す。
実施例1~4で得られた熱伝導シート(プレス直後の熱伝導シート前駆体)表面のタック力(gf)を、次の方法で測定した。実施例1~4で得られた熱伝導シートの供給形態を上述した条件でプレス処理した後、さらに、この熱伝導シートの供給形態を、0.5MPaで30秒プレス処理し、熱伝導シートの供給形態からPETフィルムを剥離して3分以内に、直径5.1mmのプローブにより2mm/秒で熱伝導シートを50μm押し込み、10mm/秒で引き抜いた際の熱伝導シート表面のタック力を測定した。結果を表1に示す。表1中、プレス後のタック力が「-」とは、プレスを行わなかったため測定しなかったことを意味する。
Claims (16)
- バインダ樹脂と、鱗片状の窒化ホウ素とを含み、
上記鱗片状の窒化ホウ素が当該熱伝導シートの厚み方向に配向しており、
当該熱伝導シートの両面がタック性を有する、熱伝導シート。 - 当該熱伝導シートの表面に、規則性を有するパターンを有する、請求項1に記載の熱伝導シート。
- 請求項1または2に記載の熱伝導シートが剥離フィルムで挟持された、熱伝導シートの供給形態。
- 以下の条件で測定したタック力が80gf以上である、請求項3に記載の熱伝導シートの供給形態。
測定方法:当該熱伝導シートの供給形態を0.5MPaで30秒プレス処理し、上記熱伝導シートから剥離フィルムを剥離してから3分以内に、直径5.1mmのプローブにより2mm/秒で上記熱伝導シートを50μm押し込み、10mm/秒で引き抜く。 - 上記剥離フィルムを上記熱伝導シートから剥離した際に、上記熱伝導シートを構成する上記バインダ樹脂及び上記鱗片状の窒化ホウ素の一部が上記剥離フィルムに転着する、請求項3または4に記載の熱伝導シートの供給形態。
- 上記熱伝導シートが、アルミナ、窒化アルミニウム、酸化亜鉛および水酸化アルミニウムの少なくとも1種をさらに含む、請求項3~5のいずれか1項に記載の熱伝導シートの供給形態。
- 上記剥離フィルムが、1枚の熱伝導シートの両面に設けられている、請求項3~6のいずれか1項に記載の熱伝導シートの供給形態。
- 上記剥離フィルムが、縦横に所定の間隔で配置された複数の上記熱伝導シートの両面に設けられている、請求項3~6のいずれか1項に記載の熱伝導シートの供給形態。
- 請求項3~8のいずれか1項に記載の熱伝導シートの供給形態から、上記剥離フィルムが剥離された、熱伝導シート。
- 請求項1、2、9のいずれか1項に記載の熱伝導シートを備える、電子機器。
- 請求項1または2に記載の熱伝導シートに用いられる、熱伝導シートの前駆体であって、
90℃、0.5MPaで3分間プレスする前後のタック力の差が4倍以上である、熱伝導シートの前駆体。 - 請求項3~8のいずれか1項に記載の熱伝導シートの供給形態における熱伝導シートに用いられる、熱伝導シートの前駆体であって、
90℃、0.5MPaで3分間プレスする前後のタック力の差が4倍以上である、熱伝導シートの前駆体。 - バインダ樹脂と鱗片状の窒化ホウ素とを含む熱伝導組成物を調製する工程Aと、
上記熱伝導組成物から成形体ブロックを形成する工程Bと、
上記成形体ブロックをシート状にスライスして熱伝導シート前駆体を得る工程Cと、
上記熱伝導シート前駆体をプレスして熱伝導シートを得る工程Dと
を有する熱伝導シートの製造方法。 - 上記工程Dでは、上記熱伝導シート前駆体をプレスすることで、プレス前の上記熱伝導シート前駆体と比べて4倍以上のタック力を有する上記熱伝導シートを得る、請求項13に記載の熱伝導シートの製造方法。
- 上記工程Bでは、押出形成法により、上記熱伝導組成物から成形体ブロックを形成する、請求項13または14に記載の熱伝導シートの製造方法。
- 上記工程Dでは、剥離フィルムで挟持された上記熱伝導シート前駆体をプレスすることで、上記剥離フィルムで熱伝導シートが挟持された熱伝導シートの供給形態を得る、請求項13~15のいずれか1項に記載の熱伝導シートの製造方法。
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