WO2022168641A1 - 基板処理装置、基板処理方法、及び記憶媒体 - Google Patents

基板処理装置、基板処理方法、及び記憶媒体 Download PDF

Info

Publication number
WO2022168641A1
WO2022168641A1 PCT/JP2022/002242 JP2022002242W WO2022168641A1 WO 2022168641 A1 WO2022168641 A1 WO 2022168641A1 JP 2022002242 W JP2022002242 W JP 2022002242W WO 2022168641 A1 WO2022168641 A1 WO 2022168641A1
Authority
WO
WIPO (PCT)
Prior art keywords
foreign matter
unit
liquid
supply
section
Prior art date
Application number
PCT/JP2022/002242
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
広 西畑
Original Assignee
東京エレクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Priority to KR1020237028824A priority Critical patent/KR20230141805A/ko
Priority to JP2022579442A priority patent/JPWO2022168641A1/ja
Publication of WO2022168641A1 publication Critical patent/WO2022168641A1/ja

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/94Investigating contamination, e.g. dust
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Definitions

  • the present disclosure relates to substrate processing apparatuses, substrate processing methods, and storage media.
  • Patent Document 1 discloses a coating device equipped with a particle measuring device for measuring particles in a resist liquid supplied from a sampling pipe.
  • the present disclosure provides a substrate processing apparatus, a substrate processing method, and a storage medium capable of easily ascertaining the cause of an event that causes foreign matter detection.
  • a substrate processing apparatus includes a nozzle capable of ejecting a processing liquid, a supply source of the processing liquid, and a supply channel connecting between the nozzle and the supply source.
  • a processing liquid supply unit that supplies the processing liquid, and a light receiving signal obtained by receiving emitted light emitted from the supply channel along with light irradiation, which are arranged at a plurality of positions different from each other along the supply channel.
  • a source estimator for estimating the compartment where the event occurred.
  • a substrate processing apparatus a substrate processing method, and a storage medium that can easily ascertain the cause of an event that causes foreign matter detection.
  • FIG. 1 is a schematic perspective view showing an example of a substrate processing system.
  • FIG. 2 is a schematic side view showing an example of the coating and developing apparatus.
  • FIG. 3 is a schematic diagram showing an example of a liquid processing unit.
  • FIG. 4 is a schematic diagram showing an example of a processing liquid supply section.
  • FIG. 5 is a schematic diagram showing an example of a foreign object detection unit.
  • FIG. 6 is a block diagram showing an example of the functional configuration of the control system.
  • FIG. 7 is a graph showing an example of a received light signal used for foreign object detection.
  • FIG. 8 is a graph showing an example of accumulated data in each foreign object detection unit.
  • FIG. 9 is a block diagram showing an example of the hardware configuration of the control system.
  • FIG. 9 is a block diagram showing an example of the hardware configuration of the control system.
  • FIG. 10 is a flow chart showing an example of a series of processes executed by the control system.
  • FIG. 11 is a graph showing an example of measurement results of the flow velocity of the treatment liquid.
  • FIG. 12 is a graph showing an example of the relationship between the type of chemical solution and the intensity of background light.
  • FIG. 13 is a graph showing an example of accumulated data in each foreign object detection unit.
  • a substrate processing apparatus includes a nozzle capable of ejecting a processing liquid, a supply source of the processing liquid, and a supply channel connecting between the nozzle and the supply source.
  • a processing liquid supply unit that supplies a processing liquid to a processing liquid supply unit, and a light receiving unit that is disposed at a plurality of positions different from each other along the supply flow path and obtains light emitted from the supply flow path along with light irradiation.
  • a plurality of foreign matter detectors for detecting foreign matter contained in the treatment liquid based on the signal, and the cause of detection of the foreign matter in the supply flow path based on the detection results at each of the plurality of locations by the plurality of foreign matter detectors.
  • a source estimating unit for estimating a section where an event has occurred.
  • a conceivable method is to detect foreign matter in the processing liquid by arranging a foreign matter detection unit at one location in the supply channel between the nozzle and the supply source. With this method, it is possible to ascertain the presence of foreign matter in the processing liquid, but it is not possible to ascertain from the detection results the factors causing the occurrence of the foreign matter in the processing liquid.
  • the processing liquid supply section includes a filter for collecting foreign matter contained in the processing liquid in the supply channel, a liquid feeding section including a pump for feeding the processing liquid toward the nozzle, and a liquid feeding section in the supply channel. and a discharge valve that opens and closes the flow path between the nozzle and the supply source, and a replenishment unit that replenishes the processing liquid from the supply source to the liquid delivery unit.
  • the plurality of foreign matter detection units include a first foreign matter detection unit arranged in the flow path between the nozzle and the ejection valve, and a second foreign matter detection unit arranged in the flow path between the ejection valve and the liquid sending unit. , and a third foreign object detection unit arranged in a flow path between the replenishment unit and the liquid supply unit.
  • the section in which the event that causes the detection of the foreign matter is assumed to occur is the section including the ejection valve, It is possible to estimate either the section containing the liquid feeding section or the section containing the replenishment section.
  • the substrate processing apparatus may further include a factor estimating section for estimating the cause of the occurrence of the event according to the section estimated by the source estimating section.
  • a factor estimating section for estimating the cause of the occurrence of the event according to the section estimated by the source estimating section.
  • the substrate processing apparatus may further include a flow rate measuring unit that measures the flow rate of the processing liquid flowing through the channel that guides the processing liquid to the nozzle.
  • the factor estimator may narrow down the factor of occurrence of the event based on the result of measurement by the flow velocity measurement unit. In this case, the cause of the occurrence of the event is narrowed down, so that the cause of the occurrence of the event can be more easily grasped.
  • the factor estimating unit may narrow down the cause of the occurrence of the event based on the frequency of supplying the processing liquid to the substrate when the event occurs. In this case, the cause of the occurrence of the event is narrowed down, so that the cause of the occurrence of the event can be more easily grasped.
  • Each of the plurality of foreign matter detection units may detect another chemical liquid contained in the treatment liquid as a foreign matter based on intensity information indicating the intensity of background light included in the emitted light.
  • the intensity of the background light differs depending on the type of liquid such as the processing liquid. In the above configuration, by using the intensity information, it is possible to easily determine whether or not another chemical liquid is contained as a foreign substance in the treatment liquid.
  • a substrate processing method includes: supplying a processing liquid to a substrate from a nozzle capable of discharging the processing liquid; Detecting foreign matter contained in the treatment liquid based on a light reception signal obtained by receiving light emitted from the supply channel along with light irradiation at a plurality of positions different from each other along the estimating a section of the supply channel where an event leading to the detection of the foreign object occurred based on the detection results of the foreign object at each location.
  • this substrate processing method it is possible to easily grasp the cause of the occurrence of the phenomenon as in the case of the substrate processing apparatus described above.
  • a storage medium is a computer-readable storage medium storing a program for causing an apparatus to execute the substrate processing method.
  • FIG. 1 A substrate processing system 1 (substrate processing apparatus) shown in FIG. 1 is a system for forming a photosensitive film on a work W, exposing the photosensitive film, and developing the photosensitive film.
  • the workpiece W to be processed is, for example, a substrate, or a substrate on which a film, a circuit, or the like is formed by performing a predetermined process.
  • the substrate is, for example, a silicon wafer.
  • the workpiece W (substrate) may be circular.
  • the work W may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like.
  • a photosensitive film is, for example, a resist film.
  • the substrate processing system 1 includes a coating and developing device 2, an exposure device 3, and a control device 20.
  • the coating and developing device 2 applies a resist (chemical solution) to the surface of the workpiece W to form a resist film before the exposure processing by the exposure device 3, and develops the resist film after the exposure processing.
  • the exposure device 3 is a device that exposes a resist film (photosensitive film) formed on a work W (substrate). Specifically, the exposure device 3 irradiates an exposure target portion of the resist film with an energy beam by a method such as liquid immersion exposure.
  • the coating and developing apparatus 2 includes a carrier block 4 , a processing block 5 and an interface block 6 .
  • the carrier block 4 introduces the work W into the coating and developing device 2 and takes out the work W from the coating and developing device 2 .
  • the carrier block 4 can support a plurality of carriers C for works W, and incorporates a transfer device A1 including a transfer arm.
  • the carrier C accommodates a plurality of circular works W, for example.
  • the transport device A1 takes out the work W from the carrier C, delivers it to the processing block 5, receives the work W from the processing block 5, and returns it to the carrier C.
  • the processing block 5 has processing modules 11 , 12 , 13 , 14 .
  • the processing module 11 incorporates a liquid processing unit U1, a thermal processing unit U2, and a transport device A3 that transports the work W to these units.
  • the processing module 11 forms a lower layer film on the surface of the workpiece W using the liquid processing unit U1 and the heat processing unit U2.
  • the liquid processing unit U1 coats the workpiece W with a processing liquid for forming a lower layer film.
  • the heat treatment unit U2 performs various heat treatments associated with the formation of the lower layer film.
  • the processing module 12 incorporates a liquid processing unit U1, a thermal processing unit U2, and a transport device A3 that transports the work W to these units.
  • the processing module 12 forms a resist film on the lower layer film by the liquid processing unit U1 and the thermal processing unit U2.
  • the liquid processing unit U1 applies a processing liquid for forming a resist film onto the lower layer film.
  • the heat treatment unit U2 performs various heat treatments associated with the formation of the resist film.
  • the processing module 13 incorporates a liquid processing unit U1, a thermal processing unit U2, and a transport device A3 that transports the work W to these units.
  • the processing module 13 forms an upper layer film on the resist film using the liquid processing unit U1 and the thermal processing unit U2.
  • the liquid processing unit U1 applies a processing liquid for forming an upper layer film onto the resist film.
  • the heat treatment unit U2 performs various heat treatments associated with the formation of the upper layer film.
  • the processing module 14 incorporates a liquid processing unit U1, a thermal processing unit U2, and a transport device A3 that transports the work W to these units.
  • the processing module 14 uses the liquid processing unit U1 and the thermal processing unit U2 to develop the resist film subjected to the exposure processing and to perform heat processing associated with the development processing.
  • the liquid processing unit U1 applies a developer to the surface of the workpiece W that has been exposed, and then rinses the developer with a rinsing liquid to develop the resist film.
  • the thermal processing unit U2 performs various types of thermal processing associated with development processing. Specific examples of heat treatment include heat treatment before development (PEB: Post Exposure Bake) and heat treatment after development (PB: Post Bake).
  • a shelf unit U10 is provided on the side of the carrier block 4 in the processing block 5.
  • the shelf unit U10 is partitioned into a plurality of vertically aligned cells.
  • a transport device A7 including an elevating arm is provided in the vicinity of the shelf unit U10. The transport device A7 raises and lowers the work W between the cells of the shelf unit U10.
  • a shelf unit U11 is provided on the interface block 6 side in the processing block 5.
  • the shelf unit U11 is partitioned into a plurality of vertically aligned cells.
  • the interface block 6 exchanges the workpiece W with the exposure apparatus 3.
  • the interface block 6 incorporates a transfer device A8 including a transfer arm and is connected to the exposure device 3.
  • FIG. The transport device A8 transfers the work W placed on the shelf unit U11 to the exposure device 3.
  • the transport device A8 receives the work W from the exposure device 3 and returns it to the shelf unit U11.
  • the control device 20 controls the coating and developing device 2 so as to execute the coating and developing process according to the following procedure, for example.
  • the control device 20 controls the transport device A1 to transport the work W in the carrier C to the shelf unit U10, and controls the transport device A7 to place the work W in the cell for the processing module 11.
  • control device 20 controls the transfer device A3 to transfer the work W on the shelf unit U10 to the liquid processing unit U1 and heat treatment unit U2 in the processing module 11. Further, the control device 20 controls the liquid processing unit U1 and the thermal processing unit U2 so as to form a lower layer film on the surface of the work W. As shown in FIG. After that, the control device 20 controls the transfer device A3 to return the work W on which the lower layer film is formed to the shelf unit U10, and controls the transfer device A7 to arrange this work W in the cell for the processing module 12. .
  • control device 20 controls the transfer device A3 so as to transfer the work W on the shelf unit U10 to the liquid processing unit U1 and heat treatment unit U2 in the processing module 12. Further, the control device 20 controls the liquid processing unit U1 and the thermal processing unit U2 so as to form a resist film on the surface of the work W. FIG. After that, the control device 20 controls the transport device A3 to return the work W to the shelf unit U10, and controls the transport device A7 to place the work W in the cell for the processing module 13. FIG.
  • control device 20 controls the transport device A3 to transport the work W on the shelf unit U10 to each unit in the processing module 13. Further, the control device 20 controls the liquid processing unit U1 and the thermal processing unit U2 so as to form an upper layer film on the resist film of the work W. FIG. After that, the control device 20 controls the transport device A3 so as to transport the work W to the shelf unit U11.
  • control device 20 controls the transport device A8 so that the workpiece W on the shelf unit U11 is delivered to the exposure device 3. After that, the control device 20 controls the transport device A8 so that the work W subjected to the exposure processing is received from the exposure device 3 and arranged in the cell for the processing module 14 in the shelf unit U11.
  • control device 20 controls the transport device A3 to transport the work W on the shelf unit U11 to each unit in the processing module 14, and controls the liquid processing unit U1 to develop the resist film of the work W. and heat treatment unit U2.
  • the control device 20 controls the transport device A3 to return the work W to the shelf unit U10, and controls the transport devices A7 and A1 to return the work W to the carrier C.
  • FIG. thus, the coating and developing process for one work W is completed.
  • the control device 20 causes the coating and developing device 2 to perform the coating and developing process on each of the subsequent works W in the same manner as described above.
  • the specific configuration of the substrate processing apparatus is not limited to the configuration of the substrate processing system 1 illustrated above. Any substrate processing apparatus may be used as long as it includes a liquid processing unit that supplies a processing liquid to a substrate to perform liquid processing, and a control device that can control the same.
  • the liquid processing unit U1 includes a rotation holding section 22 and a processing liquid supply section 28, as shown in FIG.
  • the rotation holding part 22 holds and rotates the work W based on the operation instruction from the control device 20 .
  • the rotation holding portion 22 has a holding portion 24 and a driving portion 26 .
  • the holding portion 24 supports the central portion of the horizontally arranged work W with the surface Wa facing upward, and holds the work W by suction (for example, vacuum suction) or the like.
  • the drive unit 26 is a rotary actuator including a power source such as an electric motor, and rotates the holding unit 24 around a vertical rotation axis. Thereby, the work W rotates around the vertical rotation axis.
  • the treatment liquid supply unit 28 supplies the workpiece W with the treatment liquid.
  • the treatment liquid supply unit 28 has a nozzle 30 capable of ejecting the treatment liquid, and a supply channel 29 for guiding the treatment liquid from a treatment liquid source (supply source 52 described later) to the nozzle 30.
  • a processing liquid is supplied to Wa.
  • the processing liquid supply section 28 has a nozzle 30, a liquid feeding pipe 32, a discharge valve 34, a liquid feeding section 40, a liquid feeding pipe 36, and a replenishing section 50. .
  • upstream and downstream are used with reference to the flow of processing liquid.
  • the nozzle 30 ejects the processing liquid onto the workpiece W.
  • the nozzle 30 is arranged, for example, above the work W, and ejects the processing liquid downward (see also FIG. 3).
  • the processing liquid is applied (supplied) to the surface Wa of the work W by discharging the processing liquid from the nozzle 30 toward the work W.
  • the liquid-sending pipe 32 connects between the nozzle 30 and the liquid-sending section 40 and forms a channel for guiding the processing liquid to the nozzle 30 .
  • the downstream end of the liquid feeding tube 32 is connected to the nozzle 30 , and the upstream end of the liquid feeding tube 32 is connected to the liquid feeding section 40 .
  • the discharge valve 34 is provided in the processing liquid flow path formed by the liquid transfer pipe 32 .
  • the discharge valve 34 opens and closes the flow path in the liquid transfer tube 32 (the flow path between the liquid transfer section 40 and the nozzle 30) based on an operation instruction from the control device 20.
  • FIG. When the ejection valve 34 is open, the treatment liquid is ejected from the nozzle 30 toward the surface Wa of the workpiece W, and when the ejection valve 34 is closed, ejection of the treatment liquid from the nozzle 30 is stopped.
  • the discharge valve 34 is, for example, an air operation valve.
  • the liquid sending unit 40 sends the processing liquid to the nozzle 30 via the liquid sending pipe 32 . Specifically, the liquid sending unit 40 sends the processing liquid toward the nozzle 30 at a predetermined pressure.
  • the liquid sending section 40 has, for example, a pump 42 , a connection pipe 44 and a filter 46 .
  • the pump 42 receives the processing liquid replenished from the replenishment unit 50 , pressurizes the received processing liquid, and sends it out toward the nozzle 30 .
  • the pump 42 has a storage chamber that stores the processing liquid and a contraction section that expands and contracts the storage chamber.
  • the pump 42 expands the containing chamber by the contracting portion to receive the processing liquid, and contracts the containing chamber by the contracting portion to deliver the processing liquid.
  • a tube diaphragm pump, diaphragm pump, or bellows pump may be used as the pump 42 .
  • a connection pipe 44 connects the pump 42 and the filter 46 .
  • the downstream end of the connecting pipe 44 is connected to the pump 42 , and the upstream end of the connecting pipe 44 is connected to the filter 46 .
  • the connection pipe 44 forms part of a flow path that guides the processing liquid replenished from the replenishment unit 50 to the pump 42 .
  • the filter 46 collects foreign matter contained in the processing liquid flowing through the flow path from the replenishment section 50 to the pump 42 .
  • the liquid feed pipe 36 connects between the filter 46 and the replenishment section 50 .
  • the downstream end of the liquid feeding tube 36 is connected to the liquid feeding section 40 (filter 46 ), and the upstream end of the liquid feeding tube 36 is connected to the refilling section 50 .
  • a processing liquid flow path from the replenishment unit 50 to the pump 42 is formed by the liquid feed pipe 36 and the connection pipe 44 .
  • the replenishing unit 50 replenishes the liquid sending unit 40 with the treatment liquid to be sent toward the nozzle 30 .
  • the liquid transfer pipe 36 and the connection pipe 44 form a processing liquid flow path, and the filter 46 is provided in the flow path.
  • the replenishment unit 50 has, for example, a supply source 52 , a liquid feeding pipe 54 , a storage tank 56 and a pump 58 .
  • the supply source 52 is a supply source of the treatment liquid to be replenished to the liquid feeding section 40 .
  • the supply source 52 is, for example, a bottle containing a processing liquid.
  • a supply source 52 supplies processing liquid to a pump 58 via a liquid feed tube 54 .
  • a storage tank 56 is provided in the liquid transfer pipe 54 and temporarily stores the processing liquid to be supplied to the pump 58 .
  • the pump 58 receives the processing liquid from the storage tank 56, pressurizes the received processing liquid, and delivers it to the liquid delivery section 40 through the liquid delivery tube 36 (delivers it to the pump 42 through the liquid delivery tube 36 and the connection tube 44). ).
  • the pump 58 has a storage chamber that stores the processing liquid and a contraction section that expands and contracts the storage chamber.
  • the pump 58 expands the containing chamber by the contracting portion to receive the processing liquid, and contracts the containing chamber by the contracting portion to send out the processing liquid.
  • a tube diaphragm pump, diaphragm pump, or bellows pump may be used as the pump 58 .
  • the liquid supply tube 54 and the liquid supply tube 36 of the replenishment unit 50 , the connection tube 44 of the liquid supply unit 40 , and the liquid supply tube 32 provide a space between the supply source 52 and the nozzle 30 .
  • a supply channel 29 is formed to connect the .
  • various components (parts) that can be sources of foreign matter contained in the processing liquid discharged from the nozzle 30 are provided. These various parts constitute the processing liquid supply unit 28 .
  • the supply source 52, the storage tank 56, the pump 58, the filter 46, the pump 42, and the discharge valve 34 correspond to various parts that can be sources of foreign matter.
  • the coating and developing apparatus 2 includes a plurality of foreign matter detection units 70 (a plurality of foreign matter detection sections). Each foreign matter detection unit 70 is configured to detect foreign matter (particles) contained in the processing liquid flowing through the supply channel 29 .
  • "foreign matter" in the treatment liquid includes gaseous foreign matter such as bubbles in addition to solid foreign matter such as dirt and dust. Detecting a foreign substance means detecting that a foreign substance is contained in the treatment liquid (determining that a foreign substance is contained).
  • the foreign matter detection unit 70 receives light (emitted light) generated when light (irradiation light) from the light source is applied to the treatment liquid flowing in the supply channel 29, and outputs a signal corresponding to the received light. Foreign matter is detected based on
  • a plurality of foreign matter detection units 70 are arranged at a plurality of positions different from each other along the supply channel 29 .
  • the supply channel 29 is divided into a plurality of sections (areas) by a plurality of foreign matter detection units 70 .
  • the foreign matter detection units 70 that are adjacent to each other in the supply channel 29 are arranged so that at least one of the components is included in the section between the units.
  • the most upstream foreign matter detection unit 70 is arranged so that at least one of the components is positioned in the upstream section of that unit.
  • Each foreign matter detection unit 70 detects foreign matter contained in the processing liquid in the supply channel 29 at the location where the foreign matter detection unit 70 is arranged.
  • the coating and developing apparatus 2 includes, for example, a plurality of foreign matter detection units 70, including a foreign matter detection unit 70A, a foreign matter detection unit 70B, and a foreign matter detection unit 70C.
  • a foreign matter detection unit 70A a foreign matter detection unit 70A
  • a foreign matter detection unit 70B a foreign matter detection unit 70C
  • a case will be described below in which the foreign matter detection units 70A to 70C are provided at different positions on the supply channel 29 along the direction in which the processing liquid flows.
  • the foreign matter detection units 70A to 70C are provided along the supply channel 29 from the nozzle 30 in this order.
  • the foreign object detection unit 70A (first foreign object detection section) is arranged in the flow path between the discharge valve 34 and the nozzle 30 in the supply flow path 29 .
  • the foreign matter detection unit 70B (second foreign matter detection section) is arranged in the flow path between the discharge valve 34 and the liquid sending section 40 in the supply flow path 29 .
  • the foreign matter detection unit 70 ⁇ /b>C (third foreign matter detection section) is arranged in the flow path between the liquid feeding section 40 and the replenishment section 50 in the supply flow path 29 .
  • a discharge valve 34 is arranged as a component in the section between the foreign object detection unit 70A and the foreign object detection unit 70B.
  • a pump 42 and a filter 46 are arranged as components in a section between the foreign object detection unit 70B and the foreign object detection unit 70C.
  • a supply source 52 (bottle), a storage tank 56, and a pump 58 are present as components in the upstream section of the foreign object detection unit 70C.
  • the foreign matter detection units 70A to 70C are arranged along the supply flow path 29, if a foreign matter occurs in the processing liquid in the section upstream of the foreign matter detection unit 70C, the foreign matter will be detected. It passes through units 70C, 70B, and 70A in this order.
  • Examples of the case where foreign matter is generated in the processing liquid include the case where foreign matter such as dust existing inside a part is mixed into the processing liquid, and the case where foreign matter such as bubbles are formed in the processing liquid. There are cases.
  • the discharge amount (supply amount) of the processing liquid from the nozzle 30 per time is set to a value smaller than the pipe volume of each section divided by the foreign matter detection units 70A to 70C of the supply channel 29 .
  • the amount by which the foreign matter moves downstream in the supply channel 29 during one supply of the processing liquid is shorter than the length of each section.
  • there is a difference in the number of times that foreign matter generated in the treatment liquid in any one of the sections can be detected by the foreign matter detection units 70A to 70C.
  • Events that cause detection of foreign matter include, for example, the inclusion of foreign matter in the processing liquid and the generation of bubbles in the processing liquid.
  • the foreign object detection unit 70A when a foreign object is detected by the foreign object detection unit 70A, if the foreign object has not been detected in the foreign object detection units 70B and 70C in the past, it is assumed that the above event occurred in the section between the foreign object detection units 70A and 70B. be done. In this case, it can be estimated that the discharge valve 34 is the source of the foreign matter.
  • the space between the foreign object detection units 70B and 70C is determined. It is presumed that the above event occurred in the compartment. In this case, it can be estimated that at least one of the pump 42 and the filter 46 included in the liquid feeding section 40 is the source of the foreign matter.
  • the foreign matter detection units 70A to 70C may be configured similarly to each other.
  • Each of the foreign matter detection units 70A to 70C forms a channel (hereinafter referred to as "detection channel") through which the processing liquid flowing through the supply channel 29 flows.
  • Each of the foreign matter detection units 70A to 70C receives light generated by irradiating the corresponding detection flow path with irradiation light (for example, laser light), and detects foreign matter in the processing liquid flowing through the detection flow path.
  • irradiation light for example, laser light
  • each of the foreign object detection units 70A to 70C has, for example, a housing 71, a flow path forming section 72, an irradiation section 76, a light receiving section 78, and a control section .
  • the housing 71 accommodates the flow path forming section 72, the irradiation section 76, the light receiving section 78, and the control section 80.
  • the housing 71 may be formed in a rectangular parallelepiped shape.
  • the channel forming part 72 is a member that forms the detection channel in the supply channel 29 .
  • the channel forming part 72 includes, for example, a block body in which a detection channel 74 is formed.
  • the block body is formed in a rectangular parallelepiped shape, and is made of a material that can transmit laser light used for foreign object detection.
  • upstream supply flow path 29a the flow path located upstream of the detection flow path 74 formed by the foreign object detection unit among the supply flow paths 29
  • downstream supply flow path 29b the flow path located downstream of the detection flow path 74
  • An inflow port 74a and an outflow port 74b of the detection flow path 74 are formed on a surface of the block body of the flow path forming portion 72 that faces one side surface of the housing 71 .
  • the inlet 74a is connected to the end of the upstream supply channel 29a located upstream of the detection channel 74 in the supply channel 29.
  • the outlet 74b is connected to the end of the downstream supply channel 29b located downstream of the detection channel 74 in the supply channel 29.
  • the pipes forming the ends of the upstream supply channel 29 a and the downstream supply channel 29 b pass through the side wall of the housing 71 located in the vicinity of the channel forming portion 72 .
  • the processing liquid sent from the supply source 52 is divided into the detection flow path 74 formed by the foreign object detection unit 70C, the detection flow path 74 formed by the foreign object detection unit 70B, and the detection flow path formed by the foreign object detection unit 70A. 74 in that order to nozzle 30 .
  • the processing liquid that has passed through the detection channel 74 of the foreign matter detection unit 70C is supplied a plurality of times after that. It reaches the detection channel 74 of the foreign object detection unit 70B.
  • the processing liquid that has passed through the detection channel 74 of the foreign object detection unit 70B reaches the detection channel 74 of the foreign object detection unit 70A after being supplied with the treatment liquid a plurality of times.
  • the irradiation unit 76 is configured to irradiate the detection flow path 74 with irradiation light for detecting foreign matter in the treatment liquid.
  • the irradiation unit 76 includes, for example, a light source that generates laser light as irradiation light.
  • the light source generates laser light with a wavelength of approximately 400 nm to 600 nm and an output of approximately 600 mW to 1000 mW.
  • the irradiation unit 76 may irradiate the detection flow path 74 with irradiation light from below.
  • the light receiving section 78 is configured to receive light (output light) emitted from the detection flow path 74 along with the irradiation light from the irradiation section 76 .
  • the light receiving portion 78 is arranged, for example, on the side of the detection channel 74 (at the same height as the channel forming portion 72).
  • the light receiving section 78 includes an optical component (lens) that collects light emitted from the detection channel 74, and a light receiving element that generates an electrical signal (hereinafter referred to as a "light receiving signal") corresponding to the received light. may contain.
  • the light receiving unit 78 receives part of the light (scattered light) generated by scattering the irradiation light from the irradiation unit 76 in the detection channel 74 .
  • the light receiving section 78 outputs a light reception signal obtained by receiving light emitted from the detection flow path 74 to the control section 80 .
  • the control section 80 controls each element included in each of the foreign matter detection units 70A to 70C, and determines whether or not foreign matter is contained in the treatment liquid based on the received light signal received by the light receiving section 78.
  • the control unit 80 will be described together with the above-described control device 20 that controls the liquid processing unit U1 and the like.
  • Control unit 80 of each of foreign object detection units 70A, 70B, and 70C and control device 20 constitute control system 100 . That is, the substrate processing system 1 includes a control system 100 including the control device 20 and the control section 80 .
  • An output device 19 may be connected to the control device 20 .
  • the output device 19 is a device for outputting information output from the control device 20 to an operator such as a worker.
  • Output device 19 is, for example, a monitor. Any monitor can be used as long as it can display information on the screen, and a specific example thereof is a liquid crystal panel.
  • the control system 100 at least supplies the processing liquid from the nozzle 30 to the workpiece W, and at a plurality of locations at different positions along the supply flow path 29, emits from the detection flow path 74 as the light is irradiated. Foreign matter contained in the treatment liquid is detected based on the received light signal obtained by receiving the light, and foreign matter is detected in the supply channel 29 based on the detection results of the foreign matter at each of the plurality of locations. and estimating the compartment where the event causing the has occurred.
  • the control unit 80 of the control system 100 includes, for example, a light projection control unit 102, a signal acquisition unit 104, and a foreign object determination unit as functional components (hereinafter referred to as "functional modules"). a portion 106; The processes executed by the light projection control unit 102, the signal acquisition unit 104, and the foreign object determination unit 106 correspond to the processes executed by the control unit 80 (control system 100).
  • FIG. 6 shows one controller 80 out of the plurality of controllers 80 of the plurality of foreign object detection units 70 .
  • the light projection control unit 102 controls the irradiation unit 76 so that the detection flow path 74 formed by the flow path forming unit 72 is irradiated with the irradiation light in the corresponding foreign object detection unit among the foreign object detection units 70A to 70C. .
  • the light projection control unit 102 controls the detection channel 74 to be irradiated with irradiation light in accordance with the supply period each time the processing liquid is supplied to the workpiece W to be processed (each time the processing liquid is supplied).
  • the irradiation unit 76 may be controlled.
  • the light projection control unit 102 causes the irradiation unit 76 to start irradiating the irradiation light at the timing when the treatment liquid from the nozzle 30 to the workpiece W starts to be discharged. Then, the light projection control unit 102 causes the irradiation unit 76 to stop the irradiation of the irradiation light at the timing when the discharge of the processing liquid from the nozzle 30 to the work W is stopped.
  • the signal acquisition unit 104 receives the scattered light (emitted light) emitted from the detection channel 74 along with the irradiation of the irradiation light in the corresponding foreign matter detection unit among the foreign matter detection units 70A to 70C. A signal is obtained from the light receiving portion 78 . Each time the processing liquid is supplied to the workpiece W to be processed (each time the processing liquid is supplied), the signal acquisition unit 104 generates a light reception signal corresponding to the light received from the detection flow path 74 in accordance with the supply period. may be obtained from the light receiving unit 78 .
  • the signal acquisition unit 104 acquires a light receiving signal from the light receiving unit 78 each time the treatment liquid is supplied according to the irradiation timing (irradiation period) of the irradiation light by the light projection control unit 102 .
  • the foreign object determination unit 106 determines the presence or absence of a foreign object based on the received light signal acquired by the signal acquisition unit 104 in the corresponding foreign object detection unit among the foreign object detection units 70A to 70C. Specifically, based on the received light signal acquired by the corresponding foreign matter detection unit, the foreign matter determination unit 106 determines whether or not the treatment liquid that has passed through the corresponding location contains a foreign matter. The foreign matter determination unit 106 may determine the presence or absence of foreign matter at the corresponding location each time the treatment liquid is supplied.
  • the foreign matter determination unit 106 may determine the presence or absence of foreign matter according to the evaluation value obtained by analyzing the time change of the signal intensity of the received light signal.
  • FIG. 7 shows an example of temporal changes in the signal intensity of the received light signal acquired by the signal acquisition unit 104 .
  • FIG. 7 shows the received light signal obtained during one supply period Ta of the treatment liquid, and the signal intensity exceeds the predetermined intensity threshold value Th1 at times t1, t2, and t3.
  • the foreign object determination unit 106 calculates a value obtained by counting the number of times the signal intensity exceeds a predetermined threshold value Th1 as an evaluation value, and then determines whether the evaluation value (count value) exceeds a predetermined evaluation threshold value Th2. may be determined. For example, when the number of times the signal intensity exceeds the intensity threshold value Th1 exceeds the evaluation threshold value Th2, the foreign object determination unit 106 determines that the event has occurred at that location (where the foreign object detection unit is arranged). You may It should be noted that the foreign matter determination unit 106 may calculate the evaluation value in any manner as long as it determines the presence or absence of the foreign matter based on the light reception signal (according to the evaluation value obtained from the light reception signal). The presence or absence may be determined.
  • the control device 20 of the control system 100 includes, as functional modules, for example, as shown in FIG. and an output unit 122 .
  • the processes executed by these functional modules correspond to the processes executed by the control device 20 (control system 100).
  • the liquid processing control unit 112 controls the processing liquid supply unit 28 so that the processing liquid is supplied to the workpiece W to be processed. For example, when ejection from the nozzle 30 is started, the liquid processing control unit 112 is opened from a closed state in a state in which the processing liquid is replenished in the pump 42 of the liquid feeding unit 40 and the processing liquid is pressurized.
  • the discharge valve 34 is controlled so as to transition to the state.
  • the liquid processing control unit 112 changes the state from the open state to the closed state in order to stop ejection from the nozzles 30 when the preset supply period Ta has elapsed after the start of supply of the processing liquid. , the discharge valve 34 is controlled.
  • the processing liquid By supplying the processing liquid to the work W during the supply period Ta, one supply of the processing liquid (one supply of the processing liquid to one work W) is performed.
  • the judgment result accumulation unit 114 accumulates the detection results (judgment results) of the foreign matter at each of the plurality of locations by the foreign matter detection units 70A to 70C.
  • the determination result accumulating unit 114 acquires the determination results at each of the plurality of locations by the foreign matter determination units 106 of the plurality of control units 80 each time the treatment liquid is supplied, and then accumulates the determination results.
  • the judgment result accumulation unit 114 may accumulate the judgment result by the foreign matter judgment unit 106 in association with the number of supply times of the processing liquid (the number of workpieces W to be processed). In this case, the judgment result accumulating section 114 associates and accumulates the number of supply times of the treatment liquid and the judgment result by the foreign matter judgment section 106 for each of the foreign matter detection units 70A to 70C.
  • the generation source estimating unit 116 estimates a section in the supply channel 29 where an event causing the detection of foreign matter has occurred, based on the detection results at each of the plurality of locations by the foreign matter detection units 70A to 70C.
  • the generation source estimating unit 116 may identify (estimate) the component that is the source of the foreign matter by estimating the section where the event is assumed to have occurred.
  • the generation source estimating unit 116 determines the section where the above event is assumed to have occurred (when the occurrence of the foreign matter continues). , the section where the above event occurs) may be estimated.
  • An example of a method for estimating a block in which the above event is supposed to have occurred will be described below with reference to FIG. 8 as well.
  • FIG. 8 shows a graph representing the transition of the evaluation value for detecting foreign matter with respect to the number of times of supply for each of the foreign matter detection units 70A to 70C.
  • “70A” indicates the transition of the evaluation value (for example, the number of times the intensity threshold value Th1 is exceeded) acquired by the foreign object detection unit 70A.
  • “70B” indicates the transition of the evaluation value obtained by the foreign object detection unit 70B, and
  • “70C” indicates the transition of the evaluation value obtained by the foreign object detection unit 70C.
  • the evaluation value obtained by the foreign matter detection unit 70A exceeds the evaluation threshold Th2 when the processing liquid is supplied to the workpiece W to be processed "tc" times. In this case, when the treatment liquid is supplied tc times, the controller 80 of the foreign matter detection unit 70A detects foreign matter at the location where the foreign matter detection unit 70A is arranged.
  • the source estimating unit 116 refers to the past judgment results regarding the presence or absence of a foreign object by the foreign object detection units 70B and 70C.
  • the generation source estimating section 116 refers to the judgment results of the other detection units at the point in time a predetermined number of times before, for example, the number of times of supply when the foreign matter is detected by the foreign matter detection unit 70A.
  • the predetermined number of times refer to the determination result at the time when it is assumed that the foreign matter in the processing liquid passed through the detection channel 74 of the foreign matter detection unit 70B in the past when the foreign matter was detected by the foreign matter detection unit 70A. is set to allow
  • the predetermined number of times is determined based on the relationship between the discharge amount in one supply of processing liquid and the volume of piping between the foreign matter detection unit 70A and the foreign matter detection unit 70B.
  • the predetermined number of times is set to "b" times, and the generation source estimating section 116 determines that the foreign matter detection units 70B and 70C perform the supply operation "tc-b" times. Refer to judgment results.
  • the generation source estimation unit 116 determines whether the foreign object detection unit 70A and the foreign object detection unit 70B It is assumed that the above event occurred in the section between. In this case, the generation source estimator 116 estimates that the discharge valve 34 included in the section of the supply channel 29 located between the foreign matter detection unit 70A and the foreign matter detection unit 70B is the source of the foreign matter. good too.
  • the generation source estimating unit 116 performs the foreign object detection unit 70B and the foreign object detection unit 70C. Assume that the above event occurs in the section between unit 70C. In this case, the generation source estimating unit 116 determines that at least one of the pump 42 and the filter 46 included in the section located between the foreign matter detection unit 70B and the foreign matter detection unit 70C in the supply channel 29 is the foreign matter generation source. It can be assumed that there are FIG. 8 exemplifies determination results in the case of such estimation.
  • the generation source estimating unit 116 determines that the event has occurred in a section upstream of the foreign object detection unit 70C.
  • the generation source estimating unit 116 determines that at least one of the supply source 52, the storage tank 56, and the pump 58 included in the section located upstream of the foreign matter detection unit 70C in the supply channel 29 is the generation source of the foreign matter. It may be assumed that
  • the generation source estimating unit 116 determines the ejection amount of the treatment liquid from the (tc-b) times to the foreign matter detection unit 70C, and the difference between the foreign matter detection unit 70B and the foreign matter detection unit 70C. You may refer to the determination result at the time of going back a predetermined number of times, which is determined from the relationship with the pipe volume between the pipes. As exemplified above, the generation source estimating unit 116 estimates which part is the source of the foreign matter by estimating the section where the event is assumed to have occurred (has occurred). may
  • the factor estimating unit 118 estimates the factor of occurrence of the event according to the section estimated by the source estimating unit 116 .
  • the cause of the occurrence of the event is the action or phenomenon that caused the event.
  • the factor estimating unit 118 refers to a table in which a section in which the event is estimated to have occurred (estimated source of the foreign matter) and a factor of the occurrence of the foreign matter are associated in advance, thereby estimating the factor of the occurrence of the event. presume.
  • the factor estimation unit 118 replaces the pump or filter, stagnates the processing liquid, and changes the operating conditions of the pump when it is estimated that the above event has occurred in the section containing the pump 42 and the filter 46. Presumed to be the cause of the above events.
  • estimating the cause of the occurrence of the event does not only mean identifying one factor, but also includes identifying a plurality of factors (candidate factors).
  • the output unit 122 outputs information indicating the section estimated by the generation source estimation unit 116 when a foreign object is detected in the supply channel 29 .
  • the output section 122 may output information indicating the estimated section to the output device 19 when a foreign object is detected by the foreign object detection unit 70A.
  • the output device 19 may display information indicating that a foreign object has been detected and the estimated section.
  • the output unit 122 may also output information indicating factors (candidate factors) for the occurrence of the event estimated by the factor estimation unit 118 .
  • FIG. 9 is a block diagram showing an example of the hardware configuration of the control unit 80 and the control device 20.
  • One control unit 80 is composed of one or more computers.
  • the controller 80 has a circuit 150 .
  • Circuitry 150 includes one or more processors 152 , memory 154 , storage 156 , input/output ports 158 , timers 162 and communication ports 164 .
  • the storage 156 has a computer-readable storage medium such as a hard disk.
  • the storage medium stores a program for causing the controller 80 to execute the foreign matter detection method executed in the foreign matter detection units 70A to 70C.
  • the storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk and an optical disk.
  • the memory 154 temporarily stores the program loaded from the storage medium of the storage 156 and the calculation result by the processor 152 .
  • Processor 152 configures each functional module of control unit 80 by executing the above program in cooperation with memory 154 .
  • the input/output port 158 inputs and outputs electrical signals to and from the irradiation unit 76 and the light receiving unit 78 according to instructions from the processor 152 .
  • the timer 162 measures the elapsed time by, for example, counting reference pulses of a constant cycle.
  • the communication port 164 communicates with the control device 20 wirelessly, by wire, or via a network line or the like in accordance with instructions from the processor 152 .
  • each functional module may be realized by an individual computer.
  • each of these functional modules may be implemented by a combination of two or more computers.
  • a plurality of computers may be communicably connected to each other and execute the foreign object detection method in cooperation.
  • the control device 20 is composed of one or more computers. Controller 20 has, for example, circuitry 170 . Circuitry 170 includes one or more processors 172 , memory 174 , storage 176 , input/output ports 178 , timers 182 and communication ports 184 .
  • the storage 176 has a computer-readable storage medium such as a hard disk. The storage medium stores a program for causing the coating and developing apparatus 2 to execute a substrate processing method, which will be described later.
  • the storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk and an optical disk.
  • the memory 174 temporarily stores the program loaded from the storage medium of the storage 176 and the calculation result by the processor 172 .
  • the processor 172 configures each functional module of the control device 20 by executing the program in cooperation with the memory 174 .
  • the input/output port 178 inputs/outputs electric signals to/from the treatment liquid supply unit 28, the output device 19, and the like according to instructions from the processor 172.
  • the timer 182 measures the elapsed time by, for example, counting reference pulses of a constant cycle.
  • the communication port 184 communicates with the control unit 80 (communication port 164 described above) wirelessly, by wire, or via a network line or the like in accordance with a command from the processor 172 .
  • each functional module may be realized by an individual computer.
  • each of these functional modules may be implemented by a combination of two or more computers.
  • the plurality of computers may be connected to each other so as to be able to communicate with each other, and cooperate to execute the substrate processing method described below.
  • each functional module of the control unit 80 and the control device 20 is not necessarily limited to configuring each functional module by a program.
  • each functional module of the control unit 80 and the control device 20 may be composed of a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrated with this.
  • FIG. 10 is a flow chart showing a series of processes that are executed in response to the supply of the processing liquid to one work W. As shown in FIG.
  • step S11 the control unit 80 waits until the supply of the processing liquid to the workpiece W to be processed is completed. Until the supply of the treatment liquid is completed, the signal acquisition section 104 of the control section 80 continues acquiring the light reception signal in each foreign substance detection unit.
  • step S12 the foreign matter determination unit 106 of the control unit 80 in each foreign matter detection unit determines whether or not a foreign matter is generated in the treatment liquid.
  • the foreign matter determination unit 106 calculates an evaluation value (for example, the number of times the signal intensity exceeds the intensity threshold Th1) from the received light signal obtained during the period in which the supply of the treatment liquid is continued, and sets the evaluation value to the evaluation threshold. By comparing with Th2, it is determined whether or not foreign matter is generated in the processing liquid.
  • an evaluation value for example, the number of times the signal intensity exceeds the intensity threshold Th1
  • step S13 for example, the determination result accumulation unit 114 of the control device 20 accumulates (stores) the determination result in step S12 for each foreign object detection unit.
  • the judgment result accumulating section 114 may accumulate the number of supply times of the treatment liquid (the number of processed workpieces W) and the judgment result by each foreign matter detection unit in association with each other.
  • step S14 for example, the generation source estimating unit 116 of the control device 20 selects the foreign object detection unit (in the above example, the foreign object detection unit) arranged at the most downstream of the plurality of foreign object detection units provided in the supply channel 29. For the unit 70A), it is determined whether or not a foreign object is detected in step S12.
  • the generation source estimating unit 116 of the control device 20 selects the foreign object detection unit (in the above example, the foreign object detection unit) arranged at the most downstream of the plurality of foreign object detection units provided in the supply channel 29. For the unit 70A), it is determined whether or not a foreign object is detected in step S12.
  • step S14 when it is determined that a foreign object is detected in the most downstream foreign object detection unit (step S14: YES), the control system 100 executes step S15.
  • step S15 for example, the generation source estimating unit 116 refers to the past determination results regarding the presence or absence of foreign matter in foreign matter detection units other than the most downstream foreign matter detection unit. Estimate the compartment where the event that caused the detection of the foreign object occurred.
  • the generation source estimating unit 116 determines that the processing liquid that has passed through the foreign object detection unit positioned most downstream during step S11 may pass through the other foreign object detection units (the foreign object detection units 70B and 70C in the above example). The section is estimated by referring to the determination result based on the number of times of supply passed in the past.
  • step S16 the factor estimator 118 of the control device 20 estimates factors (candidate factors) for the occurrence of the event according to the partitions estimated in step S15.
  • the factor estimating unit 118 estimates the factor of occurrence of the event by referring to a table in which the partition and the factor of occurrence of the event are associated in advance.
  • step S17 the control system 100 executes step S17.
  • step S ⁇ b>17 the output unit 122 of the control device 20 outputs to the output device 19 information indicating that a foreign object has been detected and the section estimated in step S ⁇ b>15 .
  • the output unit 122 may also output information indicating the factors estimated in step S16 to the output device 19 .
  • the processing liquid supply unit 28 may perform a treatment to remove the foreign matter in accordance with an instruction from an operator or the like according to the information output to the output device 19 .
  • step S14 determines whether foreign matter is detected in the most downstream foreign matter detection unit (step S14: NO)
  • the control system 100 does not execute steps S15 to S17.
  • the control system 100 may repeat the series of processes of steps S11 to S17 (S14) each time the processing liquid is supplied to each of a plurality of subsequent works W.
  • control system 100 may execute one step and the next step in parallel, or may execute each step in an order different from the example described above.
  • the control system 100 may omit any step, or perform processing different from the above example in any step.
  • the method of estimating the section where the event that causes foreign object detection is assumed to have occurred is not limited to the above example.
  • the section is estimated when a foreign object is detected by the foreign object detection unit positioned most downstream.
  • the estimation of the compartment may be performed.
  • the generation source estimation unit 116 estimates that the event has occurred in a section adjacent to and upstream of that foreign object detection unit.
  • the generation source estimating section 116 determines that the above event occurred in the section including the supply source 52, the storage tank 56, and the pump 58 included in the replenishment section 50 when foreign matter is detected by the foreign matter detection unit 70C. presume.
  • the generation source estimating section 116 estimates that the above event has occurred in the section including the pump 42 and the filter 46 included in the liquid feeding section 40 when foreign matter is detected by the foreign matter detection unit 70B. Even when the above event occurs in the replenishment unit 50, the foreign object can be detected by the foreign object detection unit 70B as the number of supplies is accumulated. , it is possible to deduce the compartment containing the source of the foreign object.
  • Occurrence source estimating section 116 estimates that the above event has occurred in the section including discharge valve 34 when a foreign object is detected by foreign object detection unit 70A.
  • the factor estimation unit 118 may use other information in addition to the results of detection by each foreign object detection unit to narrow down the factors of the occurrence of the above events.
  • the coating and developing apparatus 2 may further include a flow rate measuring section 60 as shown in FIG.
  • the flow velocity measurement unit 60 measures the flow velocity of the processing liquid flowing through the flow path that guides the processing liquid to the nozzle 30 (for example, the amount of liquid passing through per unit time).
  • the flow velocity measurement unit 60 may measure the flow velocity of the treatment liquid by any method.
  • the flow velocity measuring section 60 is provided in the flow path between the discharge valve 34 and the foreign object detection unit 70B in the supply flow path 29.
  • FIG. 11 shows an example of the change over time of the flow velocity measured by the flow velocity measurement unit 60.
  • FIG. Each pulse in the graph shown in FIG. 11 corresponds to one supply of processing liquid.
  • the change in the flow velocity over time during the period in which the supply of the treatment liquid is continued is substantially constant.
  • bubbles are contained in the treatment liquid passing through the flow velocity measuring unit 60
  • the flow velocity fluctuates during the period in which the supply of the treatment liquid is continued, as shown in the enlarged graph in FIG. . 11 are measured values detected when the treatment liquid that has passed through the foreign matter detection unit 70B in (tc-b) times illustrated in FIG. . From the above, it is possible to estimate whether or not bubbles are contained as foreign matter by detecting fluctuations in the flow velocity of the treatment liquid containing bubbles when it passes through the flow velocity measuring unit 60 .
  • the factor estimating unit 118 may narrow down the factors for the occurrence of the above events based on the measurement result of the flow velocity measuring unit 60. For example, when the factor estimating unit 118 estimates that a component in the liquid feeding unit 40 is the source of foreign matter, the flow velocity of the processing liquid after passing through the foreign matter detection unit 70B when passing through the flow velocity measuring unit 60 is calculated. According to the degree of fluctuation of the flow velocity measured by the measuring unit 60, the factors causing the above phenomena may be narrowed down.
  • the factor estimating unit 118 determines the factors (candidate factors) for the occurrence of the above event when the flow velocity fluctuation is greater than a predetermined level, such as the occurrence of bubbles due to replacement of the pump or filter, It is narrowed down to the generation of foam and the generation of foam accompanying changes in the operating conditions of the pump. In this case, measures such as defoaming around the pump or filter may be taken based on instructions from the operator or the like.
  • the factor estimating unit 118 may estimate that the generation of bubbles is not the factor when the fluctuation of the flow velocity is smaller than a predetermined level.
  • the measurement result obtained by the flow velocity measurement unit 60 may be used to confirm whether or not the flow velocity is stable each time the treatment liquid is supplied.
  • the information used to narrow down the causes of the occurrence of the above events is not limited to the above fluctuations in flow velocity.
  • the factor estimator 118 may narrow down the factor of occurrence of the phenomenon based on the supply frequency (ejection frequency) of the treatment liquid to the workpiece W when the foreign matter is detected. If the supply frequency of the treatment liquid is low during the predetermined period immediately before the detection of the foreign matter, it can be estimated that the treatment liquid is stagnant in the supply channel 29 .
  • the factor estimating unit 118 may narrow down the factor of occurrence of the event according to the supply frequency within a predetermined period immediately before including the point at which the foreign object is detected.
  • the factor estimating unit 118 determines the supply frequency within the predetermined period including the time when the foreign matter is detected by the foreign matter detection unit 70B. Accordingly, the factors for the occurrence of the above events may be narrowed down. In one example, the factor estimating unit 118 may narrow down the cause of the occurrence of the event to be the stagnation of the treatment liquid when the supply frequency within the predetermined period is less than a predetermined threshold. If the supply frequency within the predetermined period is greater than a predetermined threshold, the factor estimator 118 may narrow down the cause of the occurrence of the event to be pump or filter replacement and change in operating conditions of the pump. .
  • the liquid processing unit U1 has one processing liquid supply section 28, but may have a plurality of processing liquid supply sections 28.
  • the liquid processing unit U1 has a plurality of nozzles 30 and a plurality of supply channels 29 for supplying the processing liquid to the plurality of nozzles 30, respectively.
  • the foreign matter detection units 70A to 70C may detect foreign matter at a plurality of locations in each of the plurality of supply channels 29.
  • FIG. The control system 100 may estimate the section where the event is assumed to have occurred (the section assumed to contain the source of foreign matter) in each of the plurality of supply channels 29 .
  • a single foreign matter detection unit may have members for detecting foreign matter at a plurality of different positions along one supply channel 29 .
  • one foreign matter detection unit includes a detection channel 74 located between the nozzle 30 and the ejection valve 34, a detection channel 74 located between the ejection valve 34 and the liquid sending section 40, and the liquid sending section 40. and the replenishment section 50, each of which forms a detection flow path 74.
  • the foreign matter detection unit may have a plurality of irradiation sections 76 and a plurality of light reception sections 78 corresponding to these detection channels 74 .
  • one foreign object detection unit has a plurality of foreign object detection units that detect foreign objects in a plurality of detection channels 74 provided at a plurality of locations on the supply channel 29 .
  • the coating and developing device 2 may have two foreign matter detection units that detect foreign matter at different positions on the supply channel 29, or may have four or more foreign matter detection units.
  • the arrangement of the plurality of foreign matter detection units (foreign matter detection units 70A to 70C) is not limited to the example described above, and may be any different positions on the supply channel 29 .
  • Parts that can be the source of foreign matter are not limited to the above examples, and may include, for example, a valve that opens and closes the flow path at a position different from the ejection valve 34, and a pipe that forms the flow path of the treatment liquid.
  • the liquid sending unit 40 is not limited to the above example, and may be configured in any way as long as it has a filter and a pump.
  • the replenishing unit 50 is not limited to the above example, and may be configured in any way as long as the processing liquid can be replenished to the liquid feeding unit 40 .
  • the control device 20 may have a functional module that determines the presence or absence of foreign matter at each of a plurality of locations on the supply channel 29 .
  • the control unit 80 may not have the foreign object determination unit 106 .
  • a control section 80 of any one of the foreign matter detection units 70A to 70C has a functional module for estimating the section where the event is assumed to have occurred, a functional module for estimating the factor of the occurrence of the foreign matter, and a functional module for outputting the estimation result. may have
  • the controllers 80 of the foreign object detection units 70A to 70C may be communicably connected to each other, and the controller 20 may not have some of the functional modules described above.
  • the substrate processing system 1 includes the nozzle 30 capable of ejecting the processing liquid, the processing liquid supply source 52, and the supply channel 29 connecting between the nozzle 30 and the supply source 52. and a processing liquid supply unit 28 for supplying the processing liquid to the workpiece W, and a plurality of positions different from each other along the supply channel 29.
  • a plurality of foreign matter detection units foreign matter detection units 70A to 70C) that detect foreign matter contained in the treatment liquid based on light reception signals obtained by receiving the emitted light, and a plurality of foreign matter detection units at a plurality of locations.
  • a generation source estimating unit 116 for estimating a section in the supply channel 29 in which an event causing detection of a foreign object has occurred, based on the detection result of .
  • the nozzle and the discharge valve in the supply flow path between the nozzle and the processing liquid supply source are separated from each other.
  • a conceivable method is to arrange a foreign matter detection unit at one location and detect foreign matter in the processing liquid. With this method, it is possible to ascertain that a foreign object has occurred in the processing liquid, but it is not possible to ascertain from the detection result what factors have caused the phenomenon upstream of the foreign object detection unit. .
  • the substrate processing system 1 from the detection results of foreign matter at a plurality of locations on the supply channel 29 , the section where the above event occurred is estimated. Therefore, by using the estimation result, it is possible to easily grasp the cause of the occurrence of the phenomenon in the treatment liquid supply unit 28 .
  • the treatment liquid supply unit 28 includes a filter 46 that collects foreign matter contained in the treatment liquid in the supply channel 29, a liquid sending part 40 that includes a pump 42 that sends the treatment liquid toward the nozzle 30, and a supply channel.
  • a discharge valve 34 that opens and closes the flow path between the liquid sending part 40 and the nozzle 30 of 29 may be provided.
  • the plurality of foreign matter detection units includes a first foreign matter detection unit (foreign matter detection unit 70A) disposed in the flow path between the nozzle 30 and the discharge valve 34, and a flow path between the discharge valve 34 and the liquid sending unit 40. and a second foreign matter detection section (foreign matter detection unit 70B) disposed in the .
  • the section in which the above event is assumed to occur is either the section including the discharge valve 34 or the other section including the pump 42 of the liquid feeding section 40 and the It is possible to extrapolate to any of the compartments containing the filter 46 .
  • the processing liquid supply unit 28 may further include a replenishing unit 50 that replenishes the processing liquid from the supply source 52 to the liquid feeding unit 40 .
  • the plurality of foreign matter detection sections may further include a third foreign matter detection section (foreign matter detection unit 70 ⁇ /b>C) arranged in the channel between the replenishment section 50 and the liquid feeding section 40 .
  • the section where the above event is assumed to occur in the section that does not include the discharge valve 34 (the section upstream of the second foreign matter detection section) It is possible to estimate either the section containing the liquid feeding section 40 or the section containing the replenishment section 50 .
  • the substrate processing system 1 may further include a factor estimator 118 that estimates the factor of the occurrence of the event according to the section estimated by the source estimator 116 .
  • a factor estimator 118 that estimates the factor of the occurrence of the event according to the section estimated by the source estimator 116 .
  • the substrate processing system 1 may further include a flow velocity measurement unit 60 that measures the flow velocity of the processing liquid flowing through the channel that guides the processing liquid to the nozzle 30 .
  • the factor estimator 118 may narrow down the factor of occurrence of the above phenomenon based on the measurement result by the flow velocity measurement unit 60 . In this case, the estimated result of the factor of occurrence of the event is narrowed down, so that the factor of occurrence of the event can be more easily grasped.
  • the factor estimating unit 118 may narrow down the cause of the occurrence of the event based on the frequency of supplying the processing liquid to the workpiece W when the event occurs. In this case, the estimated result of the factor of occurrence of the event is narrowed down, so that the factor of occurrence of the event can be more easily grasped.
  • a substrate processing system 1 according to the second embodiment is configured similarly to the substrate processing system 1 according to the first embodiment.
  • other chemical liquids mixed in the processing liquid are detected as foreign matter instead of particles such as dust, dirt, and bubbles. That is, in the present disclosure, "foreign matter" in the treatment liquid includes not only particles such as dust, dirt, and bubbles, but also chemical liquids having components different from those of the treatment liquid.
  • particles or the like are detected based on the evaluation value. To do this, we use the intensity of the background light.
  • the background light is light emitted (for example, scattered) from the detection channel 74 as the treatment liquid is irradiated with light, regardless of the presence or absence of particles.
  • the degree of scattering of the irradiation light in the detection channel 74 (within the treatment liquid) changes depending on the presence or absence of particles such as dust, so the magnitude of the signal intensity changes depending on the presence or absence of particles.
  • the received signal corresponding to the scattered light includes the signal Ib corresponding to the background light when no particles are included and the signal Is corresponding to the scattered light from the particles when the particles are included. . More specifically, the signal Is is a signal corresponding to background light and scattered light scattered by particles.
  • the signal Ib corresponding to background light may include a component corresponding to scattered light from substances normally contained in the treatment liquid and a component corresponding to disturbance.
  • a base resin base polymer
  • the foreign matter detection unit 70 acquires the intensity of the background light contained in the light emitted from the detection channel 74 from the above-described light reception signal.
  • the foreign matter detection unit 70 detects another chemical mixed in the treatment liquid as a foreign matter by utilizing the fact that the intensity of the background light changes according to the type of the chemical such as the treatment liquid.
  • processing liquid Lr a processing liquid for forming a resist film
  • FIG. 12 shows the measurement results of the intensity of the background light when the treatment liquid Lr and the cleaning liquid Lc are supplied.
  • the vertical axis indicates the background light intensity [mW].
  • the intensity of the background light is obtained by calculating the time average of the intensity in a predetermined period in the received light signal. From the graph shown in FIG. 12, it can be seen that the intensity of background light differs depending on the type of chemical solution. Specifically, it can be seen that the intensity of the background light differs between when the treatment liquid Lr is supplied and when the cleaning liquid Lc is supplied. Also, it can be seen that the intensity of the background light has a substantially constant level if the types of chemical solutions are the same.
  • the liquid processing unit U1 continues to supply the processing liquid Lr to each work W while the processing of the work W in the coating and developing apparatus 2 is continued. While the processing of the workpiece W continues, there is a case where the processing is interrupted and maintenance is performed in the liquid processing unit U1.
  • An example of maintenance includes replacement of parts such as the filter 46 included in the processing liquid supply unit 28 .
  • the inside of the supply channel 29 is replaced with the cleaning liquid Lc from the processing liquid Lr. Then, when the processing is restarted after the maintenance is completed, the inside of the supply channel 29 is again replaced with the processing liquid Lr. For example, if the cleaning liquid Lc is not sufficiently replaced with the processing liquid Lr when the processing is restarted, part of the cleaning liquid Lc may be mixed with the processing liquid Lr during the processing of the workpiece W.
  • the horizontal axis indicates the number of times of supply.
  • the replacement with the cleaning liquid Lc is performed at the number of times of supply of "tc1", and the replacement with the treatment liquid Lr is performed again at the number of times of supply of "tc2".
  • the reason why the intensity of the background light is not stable in the period immediately after tc1 and tc2 is considered to be that the treatment liquid Lr and the cleaning liquid Lc are mixed and the replacement of the chemical solution is not completed.
  • the intensity of the background light is measured after the replacement of the chemical solution is completed (after the supply number of times assumed to have completed replacement), Insufficient replacement of the chemical solution can be detected.
  • each of the plurality of foreign matter detection units 70A to 70C detects foreign matter in the treatment liquid Lr based on the intensity information indicating the intensity of the background light contained in the light (for example, scattered light) emitted from the supply channel 29. is included.
  • the foreign object determination unit 106 of the control unit 80 of each foreign object detection unit acquires intensity information indicating the intensity of the background light contained in the scattered light in the corresponding detection flow path 74 from the received light signal (background light intensity information). strength).
  • the foreign matter determination unit 106 determines whether or not the intensity of the background light indicated by the intensity information is at a level corresponding to the treatment liquid Lr.
  • the foreign matter determination unit 106 determines that the cleaning liquid Lc is mixed as a foreign matter in the corresponding detection flow path 74 when the intensity of the background light is out of a predetermined level (predetermined range) according to the processing liquid Lr.
  • the foreign matter determination unit 106 determines that replacement has been completed in the entire supply channel 29 based on an input from another control device or a user input. You may obtain a signal indicating
  • the foreign matter determination unit 106 may detect the foreign matter based on the background light in the number of supply times after obtaining the signal indicating that the replacement has been completed in the entire supply channel 29 . For example, after replacing the liquid source (bottle) of the liquid medicine, it may be determined that the replacement is completed when the liquid medicine is discharged from the nozzle 30 a predetermined number of times.
  • the generation source estimating unit 116 selects a section in the supply channel 29 where the cleaning liquid Lc is mixed based on the detection result using the background light intensity information at each of a plurality of locations by the foreign matter detection units 70A to 70C. to estimate When the foreign matter detection unit 70A arranged at the position closest to the nozzle 30 detects the presence of the cleaning liquid Lc, the generation source estimating unit 116 determines the section where the cleaning liquid Lc is mixed (the event causing the foreign matter detection). generated partitions) may be estimated.
  • An example of a method for estimating a section where it is assumed that the cleaning liquid Lc is mixed will be described below with reference to FIG. 13 .
  • FIG. 13 shows a graph representing the transition of background light intensity with respect to the number of times of supply for each of the foreign matter detection units 70A to 70C.
  • 70A indicates the transition of the background light intensity acquired by the foreign object detection unit 70A.
  • 70B indicates the transition of the background light intensity obtained by the foreign object detection unit 70B, and
  • 70C indicates the transition of the background light intensity obtained by the foreign object detection unit 70C.
  • TLv is the intensity level (range) of the background light when the detection channel 74 is filled with the cleaning liquid Lc.
  • “RLv” is the intensity level (range) of the background light when the detection channel 74 is filled with the treatment liquid Lr.
  • the background light intensity levels TLv and RLv corresponding to the cleaning liquid Lc or the processing liquid Lr are measured in advance.
  • the replacement of the cleaning liquid Lc with the processing liquid Lr is started when the number of times the cleaning liquid Lc or the processing liquid Lr is supplied is "tc2" times.
  • the measured value of the intensity of the background light gradually changes from the intensity level TLv corresponding to the cleaning liquid Lc to the intensity level RLv corresponding to the treatment liquid Lr.
  • the control section 80 (foreign matter determination section 106) acquires a signal indicating that the replacement has been completed.
  • the intensity of the background light reaches the intensity level RLv corresponding to the treatment liquid Lr at the time ts, as indicated by the dotted line in the graph.
  • the generation source estimating unit 116 It is assumed that the cleaning liquid Lc is (occurred) mixed in the section between the foreign object detection unit 70A and the foreign object detection unit 70B.
  • the generation source estimation unit 116 It is presumed that the cleaning liquid Lc is (occurred) mixed in the section between the foreign object detection unit 70B and the foreign object detection unit 70C.
  • FIG. 13 exemplifies determination results in the case of such estimation.
  • the generation source estimating unit 116 detects the cleaning liquid Lc in the section upstream of the foreign matter detection unit 70C. It is estimated that the mixture of The factor estimator 118 estimates the cause of the event based on the detection result based on the intensity of the background light by the foreign object determiner 106 and the section estimated by the source estimator 116 .
  • the source estimating unit 116 estimates that insufficient replacement of the chemical solution in the filter 46 or the pump 42 is the cause of the event that causes foreign matter detection. may
  • the following events are conceivable as events in which the chemical solution is mixed in the filter 46.
  • the cleaning liquid Lc passed through to clean the inside of the pipe of the supply flow path 29 before the start of the processing using the processing liquid Lr passes through a narrow area inside the filter 46 (not shown but an internal flow of a material that collects foreign matter). There is a possibility that the accumulated cleaning liquid Lc may not be discharged. In this case, the processing liquid Lr is filled in the pipe of the supply flow path 29 while part of the cleaning liquid Lc is not discharged. In the narrow area inside the filter 46, the pressure loss tends to be higher than in the other flow paths in the supply flow path 29. Therefore, when the processing liquid Lr is filled, it is not eluted immediately, and the flow rate of the liquid during actual processing is reduced. The cleaning liquid Lc may be eluted at an unexpected timing in the pressure control for cleaning.
  • the example shown in the first embodiment may be applied to the substrate processing system 1 according to the second embodiment.
  • the foreign matter detection unit 70 may detect particles based on the evaluation value obtained from the received light signal, and detect the presence of other chemicals based on intensity information indicating the intensity of background light. In the detection based on the evaluation value, a foreign object is detected based on fluctuations in the instantaneous value of the received light signal. . If a foreign substance is detected in at least one of the detection based on the evaluation value and the detection based on the intensity information, the foreign substance detection unit 70 determines that the processing liquid in the corresponding detection channel 74 contains the foreign substance. good.
  • the factor estimating unit 118 determines the occurrence of the event based on the measurement result of the flow velocity of the processing liquid flowing through the supply channel 29, as in the above example. You can narrow down the factors.
  • the factor estimating unit 118 determines the occurrence of the event based on the supply frequency of the processing liquid to the workpiece W when the event occurs, as in the above example. You may narrow down the factor of generation
  • treatment may be performed to discharge other chemical liquid (cleaning liquid Lc) based on instructions from the operator or the like.
  • cleaning liquid Lc chemical liquid
  • the feeding state of the treatment liquid Lr is maintained until the intensity of the background light reaches an intensity level corresponding to the treatment liquid (treatment liquid Lr).
  • the dummy discharge on the standby bus capable of discharging the liquid may be repeatedly performed in a state in which the continuous pressurization time is shortened compared to when the processing liquid Lr is actually supplied to the work W.
  • the detection of foreign matter caused by the generation of bubbles and the detection of foreign matter caused by insufficient replacement of the chemical liquid are performed at approximately the same timing. For example, it may be estimated that a foreign substance is generated in the treatment liquid at approximately the same timing by detection based on the evaluation value and detection based on the intensity information between the liquid feeding unit 40 and the ejection valve 34 . In this case, the factor estimator 118 may estimate that there are two factors: the existence of bubbles in the filter 46 or the pump 42 and the retention of other chemical liquid in the filter 46 .
  • the factor estimator 118 determines whether a treatment operation such as dummy ejection or another operation in the substrate processing system 1 after estimation progresses.
  • factor estimating section 118 may sequentially determine which of the plurality of events has stabilized, that is, which event has eliminated its influence, based on the received light signals in foreign object detection units 70A to 70C. good.
  • the factor estimating unit 118 (control device 20) sequentially determines whether the events have stabilized and determines the necessary action to be taken in response to the events that have not yet stabilized at a certain point in time. Efficient stabilization can be achieved.
  • the substrate processing system 1 As in the first embodiment, it is possible to easily grasp the cause of the phenomenon that causes the detection of the foreign matter in the processing liquid supply section 28 . It becomes possible. Also, based on the intensity information indicating the intensity of the background light contained in the emitted light, it is possible to easily detect insufficient replacement of chemicals such as the treatment liquid by detecting other chemicals in the treatment liquid as foreign matter. becomes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
PCT/JP2022/002242 2021-02-03 2022-01-21 基板処理装置、基板処理方法、及び記憶媒体 WO2022168641A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020237028824A KR20230141805A (ko) 2021-02-03 2022-01-21 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP2022579442A JPWO2022168641A1 (zh) 2021-02-03 2022-01-21

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021015733 2021-02-03
JP2021-015733 2021-02-03
JP2021-128413 2021-08-04
JP2021128413 2021-08-04

Publications (1)

Publication Number Publication Date
WO2022168641A1 true WO2022168641A1 (ja) 2022-08-11

Family

ID=82741730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/002242 WO2022168641A1 (ja) 2021-02-03 2022-01-21 基板処理装置、基板処理方法、及び記憶媒体

Country Status (4)

Country Link
JP (1) JPWO2022168641A1 (zh)
KR (1) KR20230141805A (zh)
TW (1) TW202245103A (zh)
WO (1) WO2022168641A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016084927A1 (ja) * 2014-11-28 2016-06-02 東京エレクトロン株式会社 基板処理方法及び基板処理装置
WO2019117043A1 (ja) * 2017-12-12 2019-06-20 東京エレクトロン株式会社 液供給装置及び液供給方法
WO2019202962A1 (ja) * 2018-04-18 2019-10-24 東京エレクトロン株式会社 薬液の異常検出装置、液処理装置、基板処理装置、薬液の異常検出方法、液処理方法及び基板処理方法
JP2020119996A (ja) * 2019-01-24 2020-08-06 東京エレクトロン株式会社 基板処理装置、基板処理システム及び基板処理方法。

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100209024B1 (ko) 1996-07-10 1999-07-15 정몽규 동절기 엔진시동초기의 히터가동장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016084927A1 (ja) * 2014-11-28 2016-06-02 東京エレクトロン株式会社 基板処理方法及び基板処理装置
WO2019117043A1 (ja) * 2017-12-12 2019-06-20 東京エレクトロン株式会社 液供給装置及び液供給方法
WO2019202962A1 (ja) * 2018-04-18 2019-10-24 東京エレクトロン株式会社 薬液の異常検出装置、液処理装置、基板処理装置、薬液の異常検出方法、液処理方法及び基板処理方法
JP2020119996A (ja) * 2019-01-24 2020-08-06 東京エレクトロン株式会社 基板処理装置、基板処理システム及び基板処理方法。

Also Published As

Publication number Publication date
TW202245103A (zh) 2022-11-16
KR20230141805A (ko) 2023-10-10
JPWO2022168641A1 (zh) 2022-08-11

Similar Documents

Publication Publication Date Title
US9631963B2 (en) Solution processing apparatus, solution processing method, and non-transitory computer-readable recording medium
US5938847A (en) Method and apparatus for coating a film on an object being processed
TWI652736B (zh) 基板處理裝置
US10500617B2 (en) Substrate liquid treatment apparatus, tank cleaning method and non-transitory storage medium
US9649577B2 (en) Bubble removing method, bubble removing apparatus, degassing apparatus, and computer-readable recording medium
JP4923062B2 (ja) パルス薬液分配システム
JP6924846B2 (ja) 液供給装置及び液供給方法
WO2001002106A1 (en) Chemical solutions system for processing semiconductor materials
WO2022168641A1 (ja) 基板処理装置、基板処理方法、及び記憶媒体
JP6308141B2 (ja) 基板処理装置、基板処理方法、及び記憶媒体
WO2021182117A1 (ja) 異物検出装置、基板処理装置、異物検出方法、及び記憶媒体
JP7107362B2 (ja) 液処理装置及び液処理方法
JP5095570B2 (ja) 濃度制御系の故障検知方法及びそれを用いた基板処理装置
JP7267088B2 (ja) タンク、基板処理装置、及びタンクの使用方法
JPH08145300A (ja) 基板処理装置
JP5290837B2 (ja) 基板処理装置及び基板処理方法
JP7126927B2 (ja) 基板処理装置および基板処理方法
JP7253961B2 (ja) 基板処理装置及び異常検出方法
JP2010062314A (ja) 処理液供給機構および液処理装置ならびに処理液供給方法
KR102295545B1 (ko) 웨이퍼 세정 장치 및 방법
JP2013202605A (ja) 洗浄装置及び方法
JP7203975B2 (ja) 基板処理システム及び処理液調製方法
KR20020010474A (ko) 웨이퍼 세정장비의 화학약품 유량제어 장치 및 방법
CN115335686A (zh) 异物检测装置、基板处理装置以及异物检测装置的动作确认方法
WO2023105907A1 (ja) 自動分析装置の制御方法、および自動分析装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22749516

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022579442

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20237028824

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22749516

Country of ref document: EP

Kind code of ref document: A1