JPWO2022168641A1 - - Google Patents
Info
- Publication number
- JPWO2022168641A1 JPWO2022168641A1 JP2022579442A JP2022579442A JPWO2022168641A1 JP WO2022168641 A1 JPWO2022168641 A1 JP WO2022168641A1 JP 2022579442 A JP2022579442 A JP 2022579442A JP 2022579442 A JP2022579442 A JP 2022579442A JP WO2022168641 A1 JPWO2022168641 A1 JP WO2022168641A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Aviation & Aerospace Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021015733 | 2021-02-03 | ||
JP2021128413 | 2021-08-04 | ||
PCT/JP2022/002242 WO2022168641A1 (ja) | 2021-02-03 | 2022-01-21 | 基板処理装置、基板処理方法、及び記憶媒体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022168641A1 true JPWO2022168641A1 (zh) | 2022-08-11 |
Family
ID=82741730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022579442A Pending JPWO2022168641A1 (zh) | 2021-02-03 | 2022-01-21 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022168641A1 (zh) |
KR (1) | KR20230141805A (zh) |
TW (1) | TW202245103A (zh) |
WO (1) | WO2022168641A1 (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100209024B1 (ko) | 1996-07-10 | 1999-07-15 | 정몽규 | 동절기 엔진시동초기의 히터가동장치 |
JP2016103590A (ja) * | 2014-11-28 | 2016-06-02 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
US11433420B2 (en) * | 2017-12-12 | 2022-09-06 | Tokyo Electron Limited | Solution supply apparatus and solution supply method |
JP6954459B2 (ja) * | 2018-04-18 | 2021-10-27 | 東京エレクトロン株式会社 | 薬液の異常検出装置、液処理装置、基板処理装置、薬液の異常検出方法、液処理方法及び基板処理方法 |
JP7318212B2 (ja) * | 2019-01-24 | 2023-08-01 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システム及び基板処理方法。 |
-
2022
- 2022-01-20 TW TW111102349A patent/TW202245103A/zh unknown
- 2022-01-21 JP JP2022579442A patent/JPWO2022168641A1/ja active Pending
- 2022-01-21 WO PCT/JP2022/002242 patent/WO2022168641A1/ja active Application Filing
- 2022-01-21 KR KR1020237028824A patent/KR20230141805A/ko unknown
Also Published As
Publication number | Publication date |
---|---|
TW202245103A (zh) | 2022-11-16 |
KR20230141805A (ko) | 2023-10-10 |
WO2022168641A1 (ja) | 2022-08-11 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230721 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240521 |