JPWO2022168641A1 - - Google Patents

Info

Publication number
JPWO2022168641A1
JPWO2022168641A1 JP2022579442A JP2022579442A JPWO2022168641A1 JP WO2022168641 A1 JPWO2022168641 A1 JP WO2022168641A1 JP 2022579442 A JP2022579442 A JP 2022579442A JP 2022579442 A JP2022579442 A JP 2022579442A JP WO2022168641 A1 JPWO2022168641 A1 JP WO2022168641A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022579442A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022168641A1 publication Critical patent/JPWO2022168641A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/94Investigating contamination, e.g. dust
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022579442A 2021-02-03 2022-01-21 Pending JPWO2022168641A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021015733 2021-02-03
JP2021128413 2021-08-04
PCT/JP2022/002242 WO2022168641A1 (ja) 2021-02-03 2022-01-21 基板処理装置、基板処理方法、及び記憶媒体

Publications (1)

Publication Number Publication Date
JPWO2022168641A1 true JPWO2022168641A1 (zh) 2022-08-11

Family

ID=82741730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022579442A Pending JPWO2022168641A1 (zh) 2021-02-03 2022-01-21

Country Status (4)

Country Link
JP (1) JPWO2022168641A1 (zh)
KR (1) KR20230141805A (zh)
TW (1) TW202245103A (zh)
WO (1) WO2022168641A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100209024B1 (ko) 1996-07-10 1999-07-15 정몽규 동절기 엔진시동초기의 히터가동장치
JP2016103590A (ja) * 2014-11-28 2016-06-02 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US11433420B2 (en) * 2017-12-12 2022-09-06 Tokyo Electron Limited Solution supply apparatus and solution supply method
JP6954459B2 (ja) * 2018-04-18 2021-10-27 東京エレクトロン株式会社 薬液の異常検出装置、液処理装置、基板処理装置、薬液の異常検出方法、液処理方法及び基板処理方法
JP7318212B2 (ja) * 2019-01-24 2023-08-01 東京エレクトロン株式会社 基板処理装置、基板処理システム及び基板処理方法。

Also Published As

Publication number Publication date
TW202245103A (zh) 2022-11-16
KR20230141805A (ko) 2023-10-10
WO2022168641A1 (ja) 2022-08-11

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Legal Events

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A621 Written request for application examination

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Effective date: 20230721

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