WO2022166936A1 - 一种接口板间互连装置 - Google Patents

一种接口板间互连装置 Download PDF

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Publication number
WO2022166936A1
WO2022166936A1 PCT/CN2022/075252 CN2022075252W WO2022166936A1 WO 2022166936 A1 WO2022166936 A1 WO 2022166936A1 CN 2022075252 W CN2022075252 W CN 2022075252W WO 2022166936 A1 WO2022166936 A1 WO 2022166936A1
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WO
WIPO (PCT)
Prior art keywords
interconnection device
pin
interface boards
hole
connection hole
Prior art date
Application number
PCT/CN2022/075252
Other languages
English (en)
French (fr)
Inventor
曹树钊
胡彬
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2023547131A priority Critical patent/JP2024505290A/ja
Priority to EP22749215.4A priority patent/EP4270669A1/en
Publication of WO2022166936A1 publication Critical patent/WO2022166936A1/zh
Priority to US18/228,790 priority patent/US20230378669A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Definitions

  • the embodiments of the present application relate to the technical field of connectors, and in particular, to an interconnection device between interface boards.
  • the connector is a bridge of communication between the blocked or isolated circuits in the circuit, so that the current flows and the circuit achieves the predetermined function.
  • Gbps switching bandwidth
  • 112Gbps+ printed circuit boards
  • PCB Printed circuit board
  • the pins of the connector can be as shown in the crimp terminal.
  • the crimp terminal includes areas 1 to 10, and area 1 is the "fisheye".
  • the tip part of the terminal, the crimping process enters the hole first;
  • the area 2 is the distal part of the "fisheye” terminal, which fits with the crimping hole;
  • the area 3 is the lower part of the "fisheye” terminal, and the crimping process starts to contact the hole;
  • area 4 is the structural part of the "fisheye” terminal beam, which elastically contacts the crimping hole and deforms;
  • area 5 is the opening of the "fisheye” terminal, providing space for the elastic deformation of the beam;
  • area 6 is the inverted "fisheye” terminal.
  • area 7 is the upper edge of the "fisheye” terminal, which is not fully elastically contacted with the hole after being pressed into the board;
  • area 8 is the neck of the "fisheye” terminal;
  • area 9 is the “fisheye” terminal shoulder;
  • area 10 is the “fisheye” mid-position. Small aperture crimping is achieved through the cooperation of the "fisheye" terminal structure and the crimping hole.
  • the "fisheye” holding force of the "fisheye” crimp terminal is insufficient, that is, the holding force is less than 2.0 N/pin (N/pin), and the connector has the risk of unreliable signal transmission.
  • the present application provides an interconnection device between interface boards, which is used to improve the signal transmission reliability of the connector.
  • a first aspect of the present application provides an interconnection device between interface boards, the device includes a connector and a printed circuit board PCB, the connector is provided with pins, the PCB is provided with connection holes, and the pins are connected with the connection holes;
  • a fusible conductive solid is arranged on the pin, and the fusible conductive solid is used to melt and solidify when the pin is placed in the connection hole, so as to fix the pin and the connection hole; Dissolved conductive solids are used to melt and solidify when the pins are placed in the connection holes to secure the pins and connection holes.
  • the fusible conductive solid is pre-set on the pin or the fusible conductive solid is pre-set in the connection hole, and the molten fusible conductive solid is made to fill the gap between the pin and the connection hole at a preset temperature, Fixing the pins and connection holes after cooling can avoid the problem of insufficient connection strength of the "fish-eye" crimp terminals, and also avoid the damage to the connector structure caused by direct welding of the pins and connection holes, which can improve the connector's reliability. Signal transmission reliability.
  • the fusible conductive solid is solder paste or conductive glue.
  • the conductive adhesive is a colloidal material containing copper, silver or gold.
  • the conductive adhesive may contain metal material, so as to electrically connect the connector and the PCB.
  • the solder paste is low temperature solder paste, medium temperature solder paste or high temperature solder paste.
  • the diameter of the connection hole is less than 0.30 mm.
  • the fusible conductive solid is melted at low, medium or high temperature.
  • the pin is a curved structure, a spring structure or a conical structure.
  • the bending structure can improve the bonding force between the pin and the fusible conductive solid, and the bent part of the pin can also interfere with the hole wall, thereby improving the connection strength between the connector and the PCB.
  • the spring structure can provide a strong bonding force between the lead and the fusible conductive solid.
  • the tapered structure can be used for connecting holes with smaller diameters.
  • connection hole is a middle through hole or a stepped hole.
  • the cross section of the pin is any one of a circle, an ellipse, a waist drum, a square, a rectangle, and a teardrop shape.
  • the pins are provided with barbs.
  • the above implementation manner can improve the bonding ability of the pin and the fusible conductive solid.
  • FIG. 1 is a schematic structural diagram of a crimp terminal of a “fish eye” provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a connector and a PCB provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of a device for interconnecting interface boards according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a fixing process of a connector and a PCB according to an embodiment of the present application
  • FIG. 5 is a schematic diagram of another device for interconnecting interface boards provided by an embodiment of the present application.
  • FIG. 6 is another schematic diagram of the fixing process of the connector and the PCB provided by the embodiment of the present application.
  • FIG. 7 is a schematic diagram of a stepped hole structure provided in an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a bending structure provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of a spring structure provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a tapered structure provided by an embodiment of the present application.
  • the present application provides an interconnection device between interface boards, which is used to improve the signal transmission reliability of the connector.
  • FIG. 2 is a schematic diagram of the structure of the connector and the PCB
  • the structure includes a connector 21 and a printed circuit board (printed circuit board, PCB) 22, wherein the connector 21 further includes pins 211, and the PCB 22 also includes
  • the connection hole 221 can realize that the pin 211 is inserted into the PCB 22 with the connection hole 221, and by connecting the connection hole 221 and the pin 211, the connector 21 is communicated with the PCB 22.
  • the transmission rate of the connector needs to be continuously improved, which must be realized by a higher-density connector assembly method, that is, the size of the above-mentioned pins and connection holes
  • the pore size needs to be made smaller.
  • the tolerance of the mass production and processing capacity of the key fisheye dimension has been increased from ⁇ 0.03mm to more than ⁇ 0.015mm.
  • an embodiment of the present application provides an interconnection device between interface boards, which is specifically described as follows.
  • FIG. 3 is a schematic diagram of a device for interconnecting interface boards provided by the present application.
  • fusible conductive solids 2111 are provided on the pins 211 by means of assembly or adhesion, and conductive materials 2211 are provided in the connection holes 221.
  • the conductive material 2211 is used to melt and connect the fusible conductive solid 2111 on the pin 211 after the above-mentioned pin 211 is inserted into the connection hole 221, so as to fix the pin 211 by the molten fusible conductive solid 2111, and also can communicate with the lead 211.
  • the above-mentioned connector 21 is a novel high-speed connector.
  • the fixing process of the connector 21 and the PCB 22 can be shown in FIG. 4 .
  • the pin 211 and the connecting hole 221 are used as an example.
  • the first step is to generate a The connection hole 221 is then provided with a conductive material 2211 in the connection hole 221.
  • the conductive material 2211 can be metal such as copper or gold, and a layer of metal material such as copper or gold is arranged in the connection hole 221 by means of copper immersion and gold plating;
  • the second The step or the step that can be performed in parallel with the first step is to pre-configure the fusible conductive solid 2111 on the pin 211.
  • the fusible conductive solid 2111 can be solder paste or conductive glue, etc.
  • the third step is to insert the pins 211 pre-configured with the fusible conductive solid 2111 into the connection holes 221 .
  • the fourth step can be to put the assembled connector and the PCB together at a preset temperature, so that the fusible conductive solid 2111 is melted, and the gap between the pins 211 and the conductive material 2211 is fully filled to realize the pins 211 and the connection holes.
  • the sufficient bonding of 221 enables the connector and the PCB to achieve electrical interconnection and obtain sufficient connection strength.
  • the preset temperature may be a low temperature, a medium temperature, or a high temperature that can be realized later.
  • the interconnection device between interface boards in this embodiment can be applied not only to connection holes with a small diameter (less than 0.30 mm), but also to connection holes with a diameter larger than 0.30 mm.
  • the above-mentioned solder paste can be low-temperature solder paste or medium-temperature solder paste.
  • the preset temperature of the reflow oven is about 40°C higher than the melting point of the solder paste, and correspondingly, different preset temperatures are used to melt the above-mentioned solder paste.
  • the solder paste may also be a high temperature solder paste.
  • the conductive adhesive may be a colloidal material containing metals such as copper, silver or gold.
  • the fusible conductive solids may also be pre-preset in the connection holes, as described below for details.
  • FIG. 5 is a schematic diagram of another device for interconnecting interface boards provided by the present application.
  • the fusible conductive solid 2212 is pre-melted into the connection hole 221, and the pins 211 are inserted into the molten fusible conductive solid 2212 at a preset temperature, and then fixed on the fusible conductive solid 2212 after cooling down. inside, so that the connector 21 communicates with the PCB 22.
  • the fixing process of the connector 21 and the PCB 22 can be shown in FIG. 6 .
  • the pin 211 and the connection hole 221 are used as an example.
  • the connection hole 221 and the conductive material 2211 can refer to the relevant description of the first step in FIG. 4 , which will not be repeated here.
  • the fusible conductive solid 2212 can be melted in the connection hole 221.
  • tin/conductive glue can be dispensed in the connection hole 221 through a tin/glue device, and the connection hole 221 can be filled with tin and conductive glue. most of the space.
  • the pins 211 can be pierced and inserted into the connection holes 221 .
  • the fourth step is to put the assembled connector and PCB together at a preset temperature, so that the fusible conductive solid 2111 is melted, and the molten fusible conductive solid 2212 can be fully adhered to the pins, so that the connector and the PCB can be electrically interconnected. .
  • the embodiment of the present application can avoid the damage to the connector structure easily caused by the solder, and at the same time, the PCB is also damaged due to the problem of thermal capacity.
  • connection hole 221 may be a middle through hole as shown in FIG. 3 to FIG. 6 , and the middle through hole may have the risk of solder paste or conductive glue flowing out from the back side, but the PCB processing is simple and the connection hole 221 can also be other types of holes, such as stepped holes.
  • the stepped holes 71 adopt a large and small hole structure, that is, through holes with wide tops and narrow bottoms are made on the PCB by drilling holes, which can volatilize the flux.
  • solder paste or conductive glue can fill most of the space of the through hole, and the narrow through hole below is small enough (for example, less than 0.1mm), and can be exhausted, but can protect the solder paste or conductive glue It will not flow out.
  • the stepped hole is provided with a conductive material 711 .
  • the cross section of the pin can be any one of a circle, an oval, a waist drum, a square, a rectangle, and a teardrop shape, but is not limited to this, and the pin can be processed according to actual production and process requirements.
  • the structure is flexible and changeable.
  • the pins may also be provided with barbs, which may be provided in the middle or the bottom, so as to improve the bonding force between the pins and solder paste or conductive glue.
  • the structure of the pin may also adopt a curved structure, a spring structure or a conical structure.
  • the maximum width of the curved structure is smaller than the diameter of the middle through hole or smaller than the diameter of the large hole in the stepped hole.
  • the curved shape is conducive to improving the bonding strength between the pin and the solder paste or conductive glue. At the same time, it can also be designed so that the curved part of the pin interferes with the hole wall to improve the connection strength. Double insurance design.
  • the maximum width of the spring structure is smaller than the diameter of the middle through hole or smaller than the diameter of the large hole in the stepped hole.
  • the spring structure can provide stronger connection strength than the bending structure in FIG. 8 , that is, the spring bending structure greatly improves the bonding force between the pins and the solder paste or conductive glue.
  • the maximum width of the tapered structure is smaller than the diameter of the middle through hole or smaller than the diameter of the large hole in the stepped hole.
  • the tapered structure can be applied to connecting holes with finer diameters.
  • the disclosed system, apparatus and method may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.

Abstract

一种接口板间互连装置，用于提高连接器的信号传输可靠性。该装置包括：在连接器(21)的引脚(211)上或PCB(22)的连接孔(221)内设置的可熔导电固体(2111)，该可熔导电固体(2111)经过熔化和凝固可以将引脚(211)与PCB(22)的连接孔(221)进行固定。

Description

一种接口板间互连装置
本申请要求于2021年02月03日提交中国专利局、申请号为202110150101.7、申请名称为“一种接口板间互连装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及连接器技术领域，尤其涉及一种接口板间互连装置。
背景技术
连接器是在电路内被阻断处或孤立不通的电路之间，架起沟通的桥梁，从而使电流流通，使电路实现预定的功能。随着通讯产品容量越来越大，不同电路间交换的信息量也越来越多，需要连接器的传输速率也不断提升，从56交换带宽(Gbps)逐步提升到112Gbps+，印制电路板(printed circuit board，PCB)封装串扰变成了速率提升的重要矛盾，必须通过更高密的连接器组装方式实现，随着连接器引脚与PCB的压接孔径减小，如压接孔径减小到0.30毫米(mm)以下，会带来连接器引脚与PCB保持力不足的问题，造成连接器掉件甚至出现与PCB电气连接可靠性降低的问题。
可以参考图1所示的“鱼眼”的压接端子结构示意图，连接器的引脚可以如该压接端子所示，该压接端子包括区域1到10组成，区域1为“鱼眼”端子尖端部分，压接过程先入孔；区域2为“鱼眼”端子远端部分，与压接孔间隙配合；区域3为“鱼眼”端子下沿部分，压接过程与孔开始接触；区域4为“鱼眼”端子梁结构部分，与压接孔弹性接触，发生变形；区域5为“鱼眼”端子的开口，为梁发生弹性变形提供空间；区域6为“鱼眼”端子的倒角，可以降低压入的力量，并防止破坏孔铜；区域7为“鱼眼”端子上沿部分，压入板后与孔非完全弹性接触；区域8为“鱼眼”端子颈部；区域9为“鱼眼”端子肩部；区域10为“鱼眼”中间位置。通过“鱼眼”端子结构与压接孔的配合实现小孔径的压接。
但是“鱼眼”的压接端子的“鱼眼”保持力不足，即保持力小于2.0牛/引脚(N/pin)，连接器有信号传输不可靠的风险。
发明内容
本申请提供了一种接口板间互连装置，用于提高连接器的信号传输可靠性。
本申请第一方面提供了一种接口板间互连装置，该装置包括连接器和印制电路板PCB，连接器上设置有引脚，PCB上设置有连接孔，引脚与连接孔连接；引脚上设置有可熔导电固 体，可熔导电固体用于当引脚置于连接孔内时熔化和凝固，以固定引脚和连接孔；或，连接孔内设置有可熔导电固体，可溶导电固体用于当引脚置于连接孔内时熔化和凝固，以固定引脚和连接孔。
上述第一方面中，在引脚上预设置可熔导电固体或者在连接孔内预设置可熔导电固体，通过预设温度下使得熔融的可熔导电固体充满引脚和连接孔间的空隙，在降温后固定引脚和连接孔，可以避免“鱼眼”的压接端子连接强度不够的问题，同时也可以避免直接对引脚和连接孔进行焊接导致连接器结构损坏，可以提高连接器的信号传输可靠性。
在一种可能的实现方式中，可熔导电固体为锡膏或导电胶。
在一种可能的实现方式中，导电胶为包含铜、银或金的胶体材料。
上述实现方式中，导电胶可以包含金属材料，以便使得连接器和PCB电连接。
在一种可能的实现方式中，锡膏为低温锡膏、中温锡膏或高温锡膏。
在一种可能的实现方式中，连接孔的孔径小于0.30mm。
在一种可能的实现方式中，可熔导电固体在低温、中温或高温进行熔化。
在一种可能的实现方式中，引脚为弯曲结构、弹簧结构或锥形结构。
上述实现方式中，弯曲结构可以提高引脚与可熔导电固体之间的结合力量，引脚弯曲部分也可以与孔壁干涉，提高连接器与PCB的连接强度。弹簧结构能提供较强的引脚与可熔导电固体之间的结合力量。锥形结构可以适用更小孔径的连接孔。
在一种可能的实现方式中，连接孔为中通孔或阶梯孔。
上述实现方式中，中通孔加工简单，但有漏锡/导电胶的风险；阶梯孔更容易排气，有利于焊点形成，但PCB加工困难。
在一种可能的实现方式中，引脚的截面为圆形、椭圆形、腰鼓形、正方形、长方形以及泪滴形中的任一种。
在一种可能的实现方式中，引脚上设置有倒刺。
上述实现方式可以提高引脚与可熔导电固体的结合能力。
附图说明
图1为本申请实施例提供的“鱼眼”的压接端子结构示意图；
图2为本申请实施例提供的连接器和PCB的架构示意图；
图3为本申请实施例提供的一种接口板间互连装置的示意图；
图4为本申请实施例提供的连接器与PCB的固定过程一示意图；
图5为本申请实施例提供的另一种接口板间互连装置的示意图；
图6为本申请实施例提供的连接器与PCB的固定过程另一示意图；
图7为本申请实施例提供的阶梯孔结构示意图；
图8为本申请实施例提供的弯曲结构示意图；
图9为本申请实施例提供的弹簧结构示意图；
图10为本申请实施例提供的锥形结构示意图。
具体实施方式
本申请提供了一种接口板间互连装置，用于提高连接器的信号传输可靠性。
下面结合附图，对本申请的实施例进行描述，显然，所描述的实施例仅仅是本申请一部分的实施例，而不是全部的实施例。本领域普通技术人员可知，随着技术的发展和新场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
在这里专用的词“示例性”意为“用作例子、实施例或说明性”。这里作为“示例性”所说明的任何实施例不必解释为优于或好于其它实施例。
另外，为了更好的说明本申请，在下文的具体实施方式中给出了众多的具体细节。本领域技术人员应当理解，没有某些具体细节，本申请同样可以实施。在一些实例中，对于本领域技术人员熟知的方法、手段、元件和电路未作详细描述，以便于凸显本申请的主旨。
如图2所示的连接器和PCB的架构示意图，该架构包括连接器21和印制电路板(printed circuit board，PCB)22，其中，连接器21还包括引脚211，PCB 22上还包括连接孔221，能够实现引脚211插装至带连接孔221的PCB 22内，通过将连接孔221与引脚211的连接关系，以使得连接器21与PCB 22连通。
随着通讯产品容量越来越大，交换的信息量也越来越多，需要连接器的传输速率也不断提升，必须通过更高密的连接器组装方式实现，即上述引脚的大小和连接孔的孔径需要变得更小。当连接孔的孔径减小到0.30mm以下，会带来引脚与连接孔的保持力不足的问题，造成连接器掉件甚至出现与PCB电气连接可靠性降低的问题，并且“鱼眼”的压接端子冲压困难，精度要求高，鱼眼关键尺寸量产加工能力的公差从±0.03mm提升到±0.015mm以上。
为解决上述问题，本申请实施例提供了一种接口板间互连装置，具体如下所述。
图3为本申请提供的一种接口板间互连装置的示意图。如图3所示，通过组装或者沾连 的方式在引脚211上设置有可熔导电固体2111，连接孔221中设置有导电材料2211。该导电材料2211用于在上述引脚211插入该连接孔221后，与引脚211上的可熔导电固体2111熔融连接，既通过熔融的可熔导电固体2111固定引脚211，也可以连通引脚211和PCB 22。上述连接器21为新型高速连接器。
具体的，连接器21与PCB 22的固定过程可以如图4所示，本实施例以引脚211和连接孔221为例，如图4所示,第一步为PCB上通过钻孔生成一个连接孔221，然后在连接孔221内设置导电材料2211，该导电材料2211可以是铜或金等金属，通过沉铜镀金等方式在连接孔221内设置一层铜或金等金属材料；第二步或者说可以与第一步并行执行的步骤为在引脚211上预先配置好可熔导电固体2111，可选的，该可熔导电固体2111可以是锡膏或者是导电胶等，也可以是其他可熔的导电固体，具体此处不作限定。第三步为将预置有可熔导电固体2111的引脚211插至连接孔221内。第四步可以是将组装好的连接器和PCB一起在预设温度下，使得可熔导电固体2111熔融，并充分填满引脚211和导电材料2211间的空隙，实现引脚211和连接孔221的充分粘接，使连接器和PCB实现电气互连，并得到足够的连接强度。可选的，该预设温度可以是低温、中温或者以后能实现的高温。
可选的，本实施例的接口板间互连装置不仅可以应用于小孔径(小于0.30mm)的连接孔，也可以应用于大于0.30mm孔径的连接孔。
可选的，上述锡膏可以采用低温锡膏或中温锡膏，一般回流炉的预设温度要比锡膏熔点高40℃左右，相应的采用不同的预设温度对上述锡膏进行熔化。可选的，在以后高温环境不影响连接器和PCB结构的情况下，锡膏还可以是高温锡膏。
可选的，导电胶可以是包含铜、银或金等金属的胶体材料。
本申请实施例中除了前述的可以在引脚上预置可熔导电固体外，还可以是在连接孔内预置可熔导电固体，具体可以参照如下所描述。
图5为本申请提供的另一种接口板间互连装置的示意图。如图5所示，将可熔导电固体2212预先熔融到连接孔221中，引脚211通过在预设温度下插入熔融的可熔导电固体2212内，并在降温后固定在可熔导电固体2212内，使得连接器21与PCB 22连通。
具体的，连接器21与PCB 22的固定过程可以如图6所示，本实施例以引脚211和连接孔221为例，如图6所示，第一步，该连接孔221和导电材料2211可以参照图4中第一步的相关描述，此处不再赘述。第二步，可以在该连接孔221内熔融可熔导电固体2212，可选的，可以通过点锡/胶设备在连接孔221中点锡/导电胶，锡和导电胶充满该连接孔221内的大部分空间。第三步中，由于该可熔导电固体2212为容易穿透的膏状或胶状物体，则可以将引脚211穿刺插入连接孔221内。第四步是将组装好的连接器和PCB一起在预设温度下，使得可熔导电固体2111熔融，熔融的可熔导电固体2212可以与引脚充分粘连，使连接器和PCB实 现电气互连。本申请实施例可以避免焊锡容易出现连接器结构损坏，同时PCB也因为热容量问题出现损坏。
可选的，本实施例中，连接孔221可以是如图3至图6中的中通孔，中通孔可能有锡膏或者导电胶从背面流出的风险，但在PCB加工简单，连接孔221还可以是其他类型的孔，例如阶梯孔，如图7所示，该阶梯孔71采用大小孔结构，即通过钻孔在PCB上制作上面宽，下面窄的通孔，可以给助焊剂挥发提供通道，确保焊点顺利形成，锡膏或导电胶可以充满通孔的大部分空间，下面窄的通孔足够小(例如小于0.1mm)，并且能够排气，但是能保障锡膏或导电胶不会流出，同样，该阶梯孔内设置有导电材料711。
可选的，引脚的截面示例性的可为圆形、椭圆形、腰鼓形、正方形、长方形以及泪滴形中的任一种，但不限于此，引脚能够根据实际生产和工艺需要加工为各种所需形状，结构灵活多变。
可选的，引脚上还可以设置有倒刺，具体可以在中部或底部设置，以提高引脚与锡膏或导电胶之间的结合力量。
可选的，引脚的结构除了图3至图6中的直线型的引脚结构，还可以采用弯曲结构、弹簧结构或锥形结构。
具体的，如图8所示的弯曲结构，该弯曲结构的最大宽度小于中通孔的直径或小于阶梯孔中大孔的直径。弯曲的形状有利于提升引脚与锡膏或导电胶之间的结合力量，与此同时也可以设计成引脚弯曲部分与孔壁干涉，提高连接强度，加上锡膏和引脚结合提供了双保险设计。
如图9所示的弹簧结构，该弹簧结构的最大宽度小于中通孔的直径或小于阶梯孔中大孔的直径。该弹簧结构可以提供比图8的弯曲结构更强力的连接强度，即弹簧弯曲结构极大地提高了引脚与锡膏或导电胶之间的结合力量。
如图10所示的锥形结构，该锥形结构的最大宽度小于中通孔的直径或小于阶梯孔中大孔的直径。该锥形结构可以适用于更细小孔径的连接孔。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统，装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
以上所述，以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (10)

  1. 一种接口板间互连装置，其特征在于，包括：连接器和印制电路板PCB，所述连接器上设置有引脚，所述PCB上设置有连接孔，所述引脚与所述连接孔连接；
    所述引脚上设置有可熔导电固体，所述可熔导电固体用于当所述引脚置于所述连接孔内时熔化和凝固，以固定所述引脚和所述连接孔；或，
    所述连接孔内设置有可熔导电固体，所述可溶导电固体用于当所述引脚置于所述连接孔内时熔化和凝固，以固定所述引脚和所述连接孔。
  2. 根据权利要求1所述的接口板间互连装置，其特征在于，所述可熔导电固体为锡膏或导电胶。
  3. 根据权利要求2所述的接口板间互连装置，其特征在于，所述导电胶为包含铜、银或金的胶体材料。
  4. 根据权利要求2-3任一项所述的接口板间互连装置，其特征在于，所述锡膏为低温锡膏、中温锡膏或高温锡膏。
  5. 根据权利要求1-3任一项所述的接口板间互连装置，其特征在于，所述连接孔的孔径小于0.30mm。
  6. 根据权利要求1-3任一项所述的接口板间互连装置，其特征在于，所述可熔导电固体在低温、中温或高温进行熔化。
  7. 根据权利要求1-3任一项所述的接口板间互连装置，其特征在于，所述引脚为弯曲结构、弹簧结构或锥形结构。
  8. 根据权利要求1-3任一项所述的接口板间互连装置，其特征在于，所述连接孔为中通孔或阶梯孔。
  9. 根据权利要求1-3任一项所述的接口板间互连装置，其特征在于，所述引脚的截面为圆形、椭圆形、腰鼓形、正方形、长方形以及泪滴形中的任一种。
  10. 根据权利要求1-3任一项所述的接口板间互连装置，其特征在于，所述引脚上设置有倒刺。
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