WO2022131337A1 - セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 - Google Patents

セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 Download PDF

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Publication number
WO2022131337A1
WO2022131337A1 PCT/JP2021/046552 JP2021046552W WO2022131337A1 WO 2022131337 A1 WO2022131337 A1 WO 2022131337A1 JP 2021046552 W JP2021046552 W JP 2021046552W WO 2022131337 A1 WO2022131337 A1 WO 2022131337A1
Authority
WO
WIPO (PCT)
Prior art keywords
main surface
scribe line
ceramic plate
ceramic
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/046552
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English (en)
French (fr)
Japanese (ja)
Inventor
利貴 山縣
大樹 藤吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to JP2022542066A priority Critical patent/JPWO2022131337A1/ja
Publication of WO2022131337A1 publication Critical patent/WO2022131337A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • This disclosure relates to a ceramic plate and its manufacturing method, a composite substrate and its manufacturing method, and a circuit board and its manufacturing method.
  • the ceramic plate may have one or a plurality of compartments partitioned by a plurality of scribe lines, and an outer peripheral portion including an outer edge of a main surface surrounding the one or a plurality of compartments.
  • the outer peripheral portion can be used as a handle, for example.
  • the compartment can be used, for example, as a ceramic member of a circuit board.
  • the ceramic member included in the circuit board described above is obtained by dividing the ceramic plate described above. Therefore, it is possible to sufficiently suppress the occurrence of cracks, chips and burrs of the ceramic member. Further, since a part of the inner wall surface of the through hole forms a corner portion of the ceramic member, chamfering can be omitted. Therefore, it is possible to suppress the occurrence of cracks, chips and burrs due to chamfering.
  • the present disclosure discloses, in one aspect, a step of joining a ceramic plate manufactured by the above manufacturing method and a metal plate, and a step of removing a part of the metal plate to form a conductor portion on the main surface of the ceramic plate.
  • a method for manufacturing a composite substrate is provided.
  • the circuit board obtained by this manufacturing method is obtained by dividing the above-mentioned ceramic plate. Therefore, it is possible to sufficiently suppress the occurrence of cracks, chips and burrs of the ceramic member. Further, since a part of the inner wall surface of the through hole forms a corner portion of the ceramic member, chamfering can be omitted. Therefore, it is possible to suppress the occurrence of cracks, chips and burrs due to chamfering.
  • FIG. 2, FIGS. 3 and 4 show an example in which the first scribe line L1 and the second scribe line L2 are formed only on one main surface 100A of the ceramic plate 100, but the present invention is not limited thereto. .. That is, the first scribe line L1 and the second scribe line L2 may also be formed on the main surface 100B on the opposite side of the main surface 100A of the ceramic plate 100.
  • FIG. 6 is a plan view of the ceramic plate according to another embodiment.
  • the ceramic plate 105 shown in FIG. 6 has a flat plate shape.
  • the main surface 105A of the ceramic plate 105 is rectangular and is divided into a plurality of parts by a first scribe line L1 and a second scribe line L2 extending in different directions from each other.
  • the main surface 105A is formed with three first scribe lines L1 extending in the first direction and three second scribe lines L2 extending in the second direction orthogonal to the first direction. ..
  • the three first scribe lines L1 are parallel to each other, and the three second scribe lines L2 are also parallel to each other.
  • the first scribe line L1 and the second scribe line L2 are orthogonal to each other.
  • the first through hole 50 which penetrates in the direction orthogonal to the main surface 105A (thickness direction of the ceramic plate 105),
  • the second through hole 50A and the third through hole 50B are formed.
  • the first through hole 50 is formed in the corner portion 102 of the ceramic plate 105.
  • a second through hole 50A is formed between the two first through holes 50 provided in the two adjacent corner portions 102.
  • the edge of the second through hole 50A on the main surface 105A has a triangular shape (isosceles triangle shape).
  • the main surface may be partitioned by a first scribe line L1 and a second scribe line L2 so that six or more ceramic members can be obtained.
  • the thickness of the ceramic plates 100 and 105 may be 0.1 to 0.5 mm, and may be 0.15 to 0.4 mm. If the thickness becomes too large, it tends to take time to form the first through hole 50, the second through hole 50A, and the third through hole 50B. On the other hand, if the thickness becomes too small, the strength of the ceramic plates 100 and 105 tends to decrease.
  • the opening area of the first through hole 50 may be, for example, 3 to 30 mm 2 or 5 to 20 mm 2 .
  • the opening area of the second through hole 50A may be, for example, 6 to 60 mm 2 or 10 to 40 mm 2 .
  • the opening area of the third through hole 50B may be, for example, 12 to 120 mm 2 or 20 to 80 mm 2 .
  • the bonding substrate 200 includes a pair of metal plates 110 arranged so as to face each other, and a ceramic plate 105 between the pair of metal plates 110.
  • the pair of metal plates 110 are joined to the ceramic plate 105 so as to cover the main surface 105A and the main surface 105B of the ceramic plate 105.
  • Examples of the metal plate 110 include a copper plate.
  • the shape and size of the ceramic plate 105 and the metal plate 110 may be the same or different.
  • the bonded substrate 200 can be manufactured by the above-mentioned manufacturing method.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2021/046552 2020-12-17 2021-12-16 セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 Ceased WO2022131337A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022542066A JPWO2022131337A1 (https=) 2020-12-17 2021-12-16

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020209383 2020-12-17
JP2020-209383 2020-12-17

Publications (1)

Publication Number Publication Date
WO2022131337A1 true WO2022131337A1 (ja) 2022-06-23

Family

ID=82059572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/046552 Ceased WO2022131337A1 (ja) 2020-12-17 2021-12-16 セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Country Status (2)

Country Link
JP (1) JPWO2022131337A1 (https=)
WO (1) WO2022131337A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348259U (https=) * 1989-09-18 1991-05-08
JPH0566999U (ja) * 1992-02-21 1993-09-03 昭和電工株式会社 回路用基板
JP2000114411A (ja) * 1998-10-09 2000-04-21 Sumitomo Metal Electronics Devices Inc セラミックパッケ−ジの製造方法
JP2005136172A (ja) * 2003-10-30 2005-05-26 Kyocera Corp 多数個取り配線基板
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4795573B2 (ja) * 2001-07-16 2011-10-19 株式会社東芝 セラミックス回路基板
JP5574804B2 (ja) * 2010-04-27 2014-08-20 京セラ株式会社 多数個取り配線基板
JP6317115B2 (ja) * 2014-01-21 2018-04-25 京セラ株式会社 多数個取り配線基板、配線基板および多数個取り配線基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348259U (https=) * 1989-09-18 1991-05-08
JPH0566999U (ja) * 1992-02-21 1993-09-03 昭和電工株式会社 回路用基板
JP2000114411A (ja) * 1998-10-09 2000-04-21 Sumitomo Metal Electronics Devices Inc セラミックパッケ−ジの製造方法
JP2005136172A (ja) * 2003-10-30 2005-05-26 Kyocera Corp 多数個取り配線基板
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法

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