JPWO2022131337A1 - - Google Patents

Info

Publication number
JPWO2022131337A1
JPWO2022131337A1 JP2022542066A JP2022542066A JPWO2022131337A1 JP WO2022131337 A1 JPWO2022131337 A1 JP WO2022131337A1 JP 2022542066 A JP2022542066 A JP 2022542066A JP 2022542066 A JP2022542066 A JP 2022542066A JP WO2022131337 A1 JPWO2022131337 A1 JP WO2022131337A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022542066A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022131337A1 publication Critical patent/JPWO2022131337A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2022542066A 2020-12-17 2021-12-16 Pending JPWO2022131337A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020209383 2020-12-17
PCT/JP2021/046552 WO2022131337A1 (ja) 2020-12-17 2021-12-16 セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022131337A1 true JPWO2022131337A1 (ja) 2022-06-23

Family

ID=82059572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542066A Pending JPWO2022131337A1 (ja) 2020-12-17 2021-12-16

Country Status (2)

Country Link
JP (1) JPWO2022131337A1 (ja)
WO (1) WO2022131337A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348259U (ja) * 1989-09-18 1991-05-08
JPH0566999U (ja) * 1992-02-21 1993-09-03 昭和電工株式会社 回路用基板
JP2003031731A (ja) * 2001-07-16 2003-01-31 Toshiba Corp セラミックス基板、その製造方法およびセラミックス回路基板
JP2011233687A (ja) * 2010-04-27 2011-11-17 Kyocera Corp 多数個取り配線基板
JP2015138828A (ja) * 2014-01-21 2015-07-30 京セラ株式会社 多数個取り配線基板、配線基板および多数個取り配線基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114411A (ja) * 1998-10-09 2000-04-21 Sumitomo Metal Electronics Devices Inc セラミックパッケ−ジの製造方法
JP2005136172A (ja) * 2003-10-30 2005-05-26 Kyocera Corp 多数個取り配線基板
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348259U (ja) * 1989-09-18 1991-05-08
JPH0566999U (ja) * 1992-02-21 1993-09-03 昭和電工株式会社 回路用基板
JP2003031731A (ja) * 2001-07-16 2003-01-31 Toshiba Corp セラミックス基板、その製造方法およびセラミックス回路基板
JP2011233687A (ja) * 2010-04-27 2011-11-17 Kyocera Corp 多数個取り配線基板
JP2015138828A (ja) * 2014-01-21 2015-07-30 京セラ株式会社 多数個取り配線基板、配線基板および多数個取り配線基板の製造方法

Also Published As

Publication number Publication date
WO2022131337A1 (ja) 2022-06-23

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