WO2022130670A1 - 圧電振動子及び圧電振動子の製造方法 - Google Patents

圧電振動子及び圧電振動子の製造方法 Download PDF

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Publication number
WO2022130670A1
WO2022130670A1 PCT/JP2021/026991 JP2021026991W WO2022130670A1 WO 2022130670 A1 WO2022130670 A1 WO 2022130670A1 JP 2021026991 W JP2021026991 W JP 2021026991W WO 2022130670 A1 WO2022130670 A1 WO 2022130670A1
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WIPO (PCT)
Prior art keywords
holding member
conductive holding
piezoelectric
fillet
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/026991
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English (en)
French (fr)
Japanese (ja)
Inventor
裕之 山本
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Priority to JP2022569697A priority Critical patent/JP7411169B2/ja
Publication of WO2022130670A1 publication Critical patent/WO2022130670A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Definitions

  • the present invention relates to a piezoelectric vibrator and a method for manufacturing a piezoelectric vibrator.
  • the piezoelectric vibrating element in order to reduce the occurrence of positional deviation of the crystal vibrating element due to physical impact such as dropping, the piezoelectric vibrating element is provided with conductive adhesives at four diagonal points of the piezoelectric vibrating element.
  • a four-point holding structure was used to hold.
  • the four-point holding structure hinders the vibration of the piezoelectric vibration plate. Therefore, by providing conductive adhesives at two places on one end side of the piezoelectric vibration element, the piezoelectric vibration is vibrated.
  • a two-point holding structure for holding an element has become the mainstream.
  • the joint area of the two-point holding structure is smaller than that of the four-point holding structure, and it becomes difficult to secure impact resistance. Therefore, the piezoelectric vibrator that adopts the two-point holding structure is required to have improved impact resistance.
  • Patent Document 1 in order to fix the crystal piece to the substrate, a conductive holding member is provided on the longitudinal end side of the crystal piece and between the crystal piece and the substrate with respect to the through hole of the crystal piece.
  • the crystal oscillator which adopted the two-point holding structure is disclosed.
  • the conductive holding member is located on the longitudinal end side of the crystal piece with respect to the through hole of the crystal piece and between the mount portion and the substrate.
  • a crystal oscillator having a two-point holding structure provided in the above is disclosed.
  • the conductive holding member disclosed in Patent Documents 1 and 2 can absorb the impact on the crystal piece from the thickness direction, but the direction intersecting the thickness direction, for example, the longitudinal direction or the lateral direction of the crystal piece. It may not be possible to absorb the impact on the crystal piece. Therefore, the quartz piece held by the conductive holding member disclosed in Patent Documents 1 and 2 may not sufficiently obtain impact resistance in the longitudinal direction and the lateral direction of the quartz piece. As a result, the impact from the longitudinal direction or the lateral direction causes the crystal piece to be displaced with respect to the substrate, which may cause the electrical characteristics of the crystal oscillator to fluctuate.
  • the present invention has been invented in view of such circumstances, and an object of the present invention is to provide a piezoelectric vibrator capable of obtaining good impact resistance and electrical characteristics while realizing miniaturization. Is.
  • the piezoelectric vibrator includes a piezoelectric piece having a main surface, an excitation electrode formed on the main surface of the piezoelectric piece, and a first direction and the first direction in a plan view of the main surface of the piezoelectric piece.
  • a conductive holding member provided between the connection electrode of the element and the substrate and holding the piezoelectric vibrating element on the substrate is provided, and the region of the piezoelectric piece between the peripheral edge portion in the first direction and the excitation electrode is provided.
  • a through hole penetrating the piezoelectric piece is provided, and the conductive holding member is provided so as to straddle the peripheral edge portion along the first direction, and is both side surfaces of the peripheral edge portion in the first direction. It has a fillet formed on each of the first side surface and the first wall surface of the through hole.
  • FIG. 2 is a sectional view taken along line II-II of FIG. It is a top view for demonstrating the structure of the crystal oscillator which concerns on 1st Embodiment. It is a flowchart for demonstrating the manufacturing method of the crystal oscillator which concerns on 1st Embodiment. It is a top view for demonstrating the structure of the crystal oscillator which concerns on 2nd Embodiment. It is a figure for demonstrating the structure of the conductivity holding member which concerns on a modification. It is a figure for demonstrating the structure of the conductivity holding member which concerns on a modification. It is a figure for demonstrating the structure of the conductivity holding member which concerns on a modification. It is a figure for demonstrating the structure of the conductivity holding member which concerns on a modification.
  • FIG. 1 is a perspective view showing the appearance of the crystal oscillator 1 according to the first embodiment.
  • FIG. 2 is a sectional view taken along line II-II of FIG. In the following description, the state of the crystal oscillator 1 shown in FIG. 2 may be referred to as an “assembled state”.
  • the crystal oscillator 1 is an example of a piezoelectric vibrator that employs a two-point holding structure.
  • the crystal oscillator 1 includes a crystal vibration element (Quartz Crystal Resonator) 10, a lid member 20, and a substrate 30. Further, the crystal oscillator 1 includes a conductive holding member 50, a sealing frame 37, and a joining member 40.
  • the crystal vibrating element 10 is mounted on the substrate 30 via a conductive holding member 50 provided on one end side in the longitudinal direction of the crystal vibrating element 10.
  • the lid member 20 is joined to the substrate 30 so as to cover the crystal vibrating element 10 via the sealing frame 37 and the joining member 40. In this way, the crystal vibrating element 10 is sealed in the internal space of the sealing container composed of the lid member 20 and the substrate 30.
  • the thickness direction, the longitudinal direction, and the lateral direction of each of the crystal oscillator 1, the crystal vibrating element 10, and the crystal piece 11 of the crystal vibrating element 10 described later are Z shown in FIG. It coincides with the'axis direction, X-axis direction, and Y'axis direction.
  • FIG. 3 is a plan view for explaining the configuration of the crystal oscillator 1 according to the first embodiment.
  • the lid member 20 and some electrodes are not shown.
  • the crystal vibrating element 10 is an example of a piezoelectric vibrating element and has a plate shape. Further, the crystal vibrating element 10 includes a crystal piece 11 and a plurality of electrodes provided on the crystal piece 11. The plurality of electrodes of the crystal vibrating element 10 include excitation electrodes 14a and 14b, connection electrodes 16a and 16b, and extraction electrodes 15a and 15b.
  • the crystal piece 11 is an example of a piezoelectric piece, for example, an AT-cut crystal substrate.
  • the AT-cut crystal substrate has the Y-axis and Z-axis around the X-axis at 35 degrees 15 minutes ⁇ 1 minute in the direction from the Y-axis to the Z-axis.
  • the axes rotated for 30 seconds are the Y'axis and the Z'axis, respectively, the plane parallel to the plane specified by the X-axis and the Y'axis (hereinafter referred to as "XY'plane" is specified by another axis.
  • the crystal vibrating element 10 that employs the AT-cut crystal piece 11 has a thickness slip vibration mode as the main vibration.
  • the cut angle of the crystal piece 11 is not limited, and for example, a BT cut, a GT cut, an SC cut, or the like can be applied.
  • the crystal piece 11 is a plate-shaped member. In the example shown in FIG. 2, the crystal piece 11 forms a rectangular parallelepiped.
  • the shape of the crystal piece 11 is not limited to a rectangular parallelepiped, and may have, for example, a mesa structure having a thick central portion and a thin peripheral portion.
  • the crystal piece 11 has two main surfaces 12a and 12b on both sides in the thickness direction.
  • the plan view shapes of the main surfaces 12a and 12b are rectangular.
  • a pair of excitation electrodes 14a and 14b are provided at the center of the main surfaces 12a and 12b.
  • the longitudinal direction is an example of the "first direction”
  • the lateral direction is an example of the "second direction”.
  • the crystal piece 11 has a peripheral edge portion 110 located on the end side in the longitudinal direction.
  • the peripheral edge portion 110 has a first side surface 111, a second side surface 112, and a third side surface 113.
  • the peripheral edge portion 110 is provided with a conductive holding member 50 for holding the crystal vibrating element 10 on the substrate 30.
  • a through hole 120 penetrating the crystal piece 11 is provided in the region between the peripheral edge portion 110 in the longitudinal direction and the excitation electrode 14.
  • the peripheral edge portion 110 can support the vibrating portion of the crystal piece 11, and the peripheral portion 110 can reduce the binding force applied to the vibration of the vibrating portion of the crystal piece 11.
  • the through hole 120 has a first wall surface 121, a second wall surface 122, a third wall surface 123, and a fourth wall surface 124.
  • the first wall surface 121 of the through hole 120, together with the first side surface 111 of the peripheral edge portion 110, constitutes both side surfaces of the peripheral edge portion 110 in the longitudinal direction of the crystal piece 11.
  • the excitation electrodes 14a and 14b are electrodes for causing the crystal piece 11 to slide and vibrate in thickness when a voltage is applied. Further, the excitation electrodes 14a and 14b are metal films made of the same material. For example, the excitation electrodes 14a and 14b are composed of a chromium (Cr) layer and a gold (Au) layer on the surface of the chromium layer. Further, the other electrodes (excluding the via electrodes 34a and 34b) of the crystal oscillator 1 described later are also made of the same material as the excitation electrodes 14a and 14b.
  • connection electrodes 16a and 16b are terminals for electrically connecting the crystal vibrating element 10 to the substrate 30. Further, the connection electrodes 16a and 16b are provided on the main surface 12b side of the peripheral edge portion 110.
  • the extraction electrodes 15a and 15b are electrodes for electrically connecting the excitation electrodes 14a and 14b to the connection electrodes 16a and 16b. The extraction electrodes 15a and 15b are provided on the peripheral edge portion 110.
  • the substrate 30 is an example of a substrate on which the crystal vibrating element 10 is mounted, and has a plate shape.
  • the substrate 30 has a substrate 31 and a plurality of electrodes provided on the substrate 31.
  • the plurality of electrodes of the substrate 30 include connection electrodes 33a, 33b, via electrodes 34a, 34b, and external electrodes 35a, 35b, 35c, 35d.
  • the substrate 31 is made of a light-transmitting material, for example, glass. Further, the substrate 31 has two main surfaces 32a and 32b on both sides in the thickness direction and two via holes 32c penetrating the substrate 31 in the thickness direction.
  • the main surface 32a is a surface for mounting the crystal vibrating element 10.
  • Connection electrodes 33a and 33b are provided on the main surface 32a.
  • the connection electrodes 33a and 33b are terminals for electrically connecting to the connection electrodes 16a and 16b of the crystal vibrating element 10.
  • the main surface 32b is a surface facing an external mounting board (not shown).
  • External electrodes 35a, 35b, 35c, 35d are provided at the four corners of the main surface 32b.
  • the external electrodes 35a to 35d are terminals for electrically connecting to an external mounting board.
  • the external electrodes 35a and 35b are input / output electrodes to which the input / output signals of the crystal vibrating element 10 are supplied, and the external electrodes 35c and 35d are electrodes to which the input / output signals of the crystal vibrating element 10 are not supplied. be.
  • Via electrodes 34a and 34b are provided in the two via holes 32c.
  • the via electrodes 34a and 34b are electrodes for connecting the connection electrodes 33a and 33b and the external electrodes 35a and 35b. Further, the via electrodes 34a and 34b are formed by filling, for example, a via hole 32c with a metal material such as molybdenum.
  • the conductive holding member 50 is an adhesive for electrically connecting the connection electrodes 16a and 16b of the crystal vibrating element 10 and the connection electrodes 33a and 33b of the substrate 30. Further, the conductive holding member 50 is formed by, for example, thermosetting a conductive adhesive.
  • the conductive holding member 50 is provided between the crystal vibrating element 10 and the substrate 30 in the Z'axis direction, and is provided at two locations along the lateral direction of the crystal piece 11 in the Y'axis direction. It is provided. Further, the fillet 55 of the conductive holding member 50 is formed on each of the first side surface 111 of the peripheral edge portion 110 and the first wall surface 121 of the through hole 120, which are both side surfaces of the peripheral edge portion 110 in the X-axis direction in the X-axis direction. Has been done.
  • the crystal vibrating element 10 is oscillatedly held by the substrate 30 by the conductive holding member 50 thus formed.
  • the crystal vibrating element 10 can obtain impact resistance in the Z'axis direction, the X axis direction, and the Y'axis direction by the conductive holding member 50, the Z'axis direction of the crystal vibrating element 10 can be obtained. It is possible to maintain the posture in the X-axis direction and the Y'axis direction.
  • the holding and effect of the conductive holding member 50 on the quartz vibration element 10 will be described in detail after explaining the formation of the conductive holding member 50 in the manufacture of the crystal oscillator 1.
  • the lid member 20 has a box shape in which an opening is formed on the side to be joined to the substrate 30.
  • the material of the lid member 20 is made of a conductive material such as metal.
  • the inner surface of the lid member 20 and the main surface 32a of the substrate 30 form an internal space for accommodating the crystal vibrating element 10.
  • the sealing frame 37 and the joining member 40 are configured to metal-bond the lid member 20 and the substrate 30.
  • the sealing frame 37 is provided on the peripheral edge of the main surface 32a.
  • the material of the sealing frame 37 is a conductive metal.
  • the joining member 40 is provided on the sealing frame 37.
  • the joining member 40 is a brazing member made of, for example, a gold (Au) -tin (Sn) eutectic alloy or the like.
  • FIG. 4 is a flowchart for explaining the method for manufacturing the crystal oscillator 1 according to the first embodiment.
  • the crystal vibrating element 10 is prepared (S10).
  • Step S10 is an example of the preparation process. Specifically, as described above, the crystal vibrating element 10 in which the excitation electrodes 14a and 14b, the connection electrodes 16a and 16b, the extraction electrodes 15a and 15b, and the through hole 120 are formed is prepared.
  • the crystal vibrating element 10 is mounted on the substrate 30 via the conductive holding member 50 (S20).
  • the crystal vibrating element is provided by a step of providing a conductive adhesive between the connection electrodes 16a and 16b of the crystal vibrating element 10 and the substrate 30, and a conductive holding member 50 obtained by curing the conductive adhesive.
  • a joining step of joining 10 to the substrate 30 Specifically, a conductive adhesive, that is, a conductive holding member 50 before being thermally cured is provided on the connection electrodes 33a and 33b provided on the main surface 32a of the substrate 30.
  • the crystal vibrating element 10 is placed on the conductive adhesive so that the connection electrodes 16a and 16b of the crystal vibrating element 10 come into contact with the electric adhesive. Subsequently, the conductive adhesive is thermally cured. In this way, the quartz vibration element 10 is joined to the substrate 30 by the conductive holding member 50 obtained by thermosetting the conductive adhesive, specifically, the first conductive holding member 50a and the second conductive holding member 50b. do.
  • placing the crystal vibrating element 10 on the conductive adhesive causes the conductive adhesive to adhere to the first side surface 111 and the first wall surface 121, which are both side surfaces of the peripheral edge portion 110 in the X-axis direction.
  • the peripheral portion 110 of the crystal vibrating element 10 is pushed into the conductive adhesive along the thickness direction of the crystal piece 11.
  • the pushing depth in other words, the height of adhesion of the conductive adhesive on the first side surface 111 and the first wall surface 121 in the positive direction of the Z'axis is such that the main surface 12b of the crystal piece 11 is used as a reference surface. It is 1/3 or more of the thickness of the crystal piece 11.
  • the conductive holding member 50 thus obtained by thermosetting the conductive adhesive has fillets 55 formed on each of the first side surface 111 and the first wall surface 121. Further, the height of the fillet 55 in the thickness direction of the crystal piece 11, that is, the height of adhesion on the first side surface 111 and the first wall surface 121 of the fillet 55 in the positive direction of the Z'axis is the main surface of the crystal piece 11. With 12b as a reference plane, it is 1/3 or more of the thickness of the crystal piece 11.
  • the crystal vibrating element 10 is sealed by joining the lid member 20 to the substrate 30 (S30).
  • a joining member 40 is provided on the sealing frame 37 of the substrate 30, and the sealing frame 37 and the joining member 40 are interposed between the upper surface of the opening of the lid member 20 and the main surface 32a of the substrate 30. .. Then, the lid member 20 is joined to the substrate 30 by heating the joining member 40. In this way, the crystal vibrating element 10 is sealed in the internal space by the lid member 20 and the substrate 30.
  • connection electrodes 16a and 16b In the Z'axis direction, the conductive holding member 50 is connected to the connection electrodes 16a and 16b so as to electrically connect the connection electrodes 16a and 16b of the crystal vibrating element 10 and the connection electrodes 33a and 33b of the substrate 30. It is provided between 33a and 33b.
  • the crystal vibrating element 10 and the substrate 30 are electrically connected by the conductive holding member 50 provided between the crystal vibrating element 10 and the substrate 30, and the Z'axis of the crystal vibrating element 10 is formed.
  • the attitude to the direction is maintained.
  • the conductive holding member 50 allows the crystal vibrating element 10 to withstand impacts from both positive and negative directions in the Z'axis direction, so that the position of the crystal vibrating element 10 in both the positive and negative directions in the Z'axis direction. The occurrence of deviation is suppressed.
  • the crystal oscillator 1 using such a crystal vibrating element 10 can withstand impacts from both positive and negative directions in the Z'axis direction, and has good impact resistance in the Z'axis direction.
  • the conductive holding member 50 is a fillet 55 formed on both side surfaces of the peripheral edge portion 110 in the X-axis direction, that is, the first side surface 111 of the peripheral edge portion 110 and the first wall surface 121 of the through hole 120.
  • the height of the fillet 55 is set in the thickness direction of the crystal piece 11 with the main surface 12b of the crystal piece 11 as a reference plane. It is 1/3 or more of the thickness.
  • the attitude of the crystal vibrating element 10 with respect to the X-axis direction is maintained by the fillets 55 of the conductive holding member 50 formed on both side surfaces of the peripheral edge portion 110 in the X-axis direction and having a constant height.
  • the fillet 55 formed on the first side surface 111 of the peripheral edge portion 110 and the fillet 55 formed on the first wall surface 121 of the through hole 120 allow the crystal vibrating element 10 to move from the positive and negative directions in the X-axis direction. It is designed to withstand impact. Therefore, the occurrence of the positional deviation of the crystal vibrating element 10 is suppressed in both the positive and negative directions in the X-axis direction.
  • the crystal oscillator 1 using such a crystal vibrating element 10 can withstand impacts from both positive and negative directions in the X-axis direction, and has good impact resistance in the X-axis direction.
  • the conductivity holding member 50 has a first conductivity holding member 50a and a second conductivity provided on the peripheral edge portion 110 so as to be separated from each other along the lateral direction of the crystal piece 11. It has a sex-retaining member 50b. Both the first conductive holding member 50a and the second conductive holding member 50b are crystal pieces 11 rather than the second side surface 112 and the third side surface 113, which are both side surfaces of the peripheral edge portion 110 in the Y'axis direction in the Y'axis direction. It is provided inside.
  • the distance between the outer edges of the first conductive holding member 50a and the second conductive holding member 50b in the Y'direction is the width of the crystal piece 11 in the Y'direction and the Y'direction of the excitation electrodes 14a and 14b. Is smaller than either the width of the through hole 120 or the width of the through hole 120 in the Y'direction.
  • such a first conductive holding member 50a and a second conductive holding member 50b ensure a bonding length between the crystal vibrating element 10 and the substrate 30 in the Y'axis direction.
  • the joint area between the crystal vibrating element 10 and the substrate 30 is sufficiently secured. Therefore, the posture of the crystal vibrating element 10 with respect to the Y'axis direction is maintained.
  • the first conductive holding member 50a and the second conductive holding member 50b allow the crystal vibrating element 10 to withstand impacts from both positive and negative directions in the Y'axis direction, so that the crystal vibrating element 10 can withstand impacts in both the positive and negative directions in the Y'axis direction.
  • the occurrence of positional deviation of the crystal vibrating element 10 is suppressed in both the positive and negative directions.
  • the crystal oscillator 1 using such a crystal vibrating element 10 can withstand impacts from both positive and negative directions in the Y'axis direction, and has obtained impact resistance in the Y'axis direction.
  • the conductive holding member 50 As described above, according to the conductive holding member 50 according to the first embodiment, it is possible to provide the crystal vibrating element 10 and the crystal oscillator 1 capable of obtaining good impact resistance while realizing miniaturization. It is possible. Further, since the positional deviation of the crystal vibrating element 10 can be suppressed, the electrical conductivity between the crystal vibrating element 10 and the substrate 30 can be ensured. As a result, good electrical characteristics of the crystal unit 1 can be obtained.
  • FIG. 5 is a plan view for explaining the configuration of the crystal oscillator 1 according to the second embodiment.
  • the lid member 20 and some electrodes are not shown.
  • the difference between the crystal oscillator 1 according to the second embodiment and the crystal oscillator 1 according to the first embodiment is the position where the fillet 55 of the conductive holding member 50 is formed, and the other configurations are the same. ..
  • the description of the matters common to the first embodiment of the second embodiment will be omitted, and the contents relating to the different points will be described. In particular, the same action and effect due to the same configuration are not mentioned.
  • the conductive holding member 50 according to the second embodiment has the first side surface 111 and the first wall surface 121 which are both side surfaces of the peripheral edge portion 110 in the X-axis direction, and the Y'axis of the through hole 120. It has fillets 55 formed on each of the second wall surface 122 and the third wall surface 123, which are both wall surfaces in the direction. In other words, the conductive holding member 50 according to the second embodiment further has fillets 55 formed on both wall surfaces of the through hole 120 in the Y'axis direction as compared with the conductive holding member 50 according to the first embodiment. Have.
  • the conductive holding member 50 in addition to the first conductive holding member 50a and the second conductive holding member 50b in the Y'axis direction, the conductive holding members formed on both wall surfaces of the through hole 120 in the Y'direction.
  • the fillet 55 of the 50 is adapted to hold the posture of the crystal vibrating element 10 with respect to the Y'axis direction. Therefore, as compared with the first embodiment, the conductive holding member 50 according to the second embodiment can further improve the impact resistance of the quartz vibration element 10 in the Y'axis direction, and is positive or negative in the Y'axis direction. It is possible to more reliably suppress the occurrence of positional deviation of the crystal vibrating element 10 in both directions. As a result, the impact resistance of the crystal oscillator 1 using the crystal vibration element 10 in the Y'axis direction is further improved.
  • the same effect as that of the first embodiment can be exhibited, and better impact resistance in the Y'axis direction can be obtained.
  • FIGS. 6A to 6C are diagrams for explaining the configuration of the conductive holding member 50 according to the modified example.
  • the lid member 20 and some electrodes are not shown.
  • the configuration of the conductive holding member 50 and the fillet 55 of the conductive holding member 50 is not limited to the above embodiment, and the impact resistance in the Z'axis direction, the X axis direction, and the Y'axis direction is ensured. Can be modified and applied in various ways as much as possible.
  • the fillet 55 of the conductive holding member 50 has both side surfaces of the peripheral edge portion 110 in the X-axis direction.
  • the first side surface 111 and the first wall surface 121 may be formed on each of the second side surface 112 and the third side surface 113, which are both side surfaces of the peripheral edge portion 110 in the Y'axis direction.
  • the fillet 55 of the conductive holding member 50 is in the X-axis direction of the peripheral edge portion 110.
  • the first side surface 111 and the first wall surface 121 which are both side surfaces of the above, the second wall surface 122 and the third wall surface 123 which are both wall surfaces of the through hole 120 in the Y'axis direction, and both sides of the peripheral portion 110 in the Y'axis direction. It may be formed on each of the second side surface 112 and the third side surface 113, which are surfaces. According to such a conductive holding member 50, the same effect as the example shown in FIG. 6A can be exhibited, and the impact resistance of the crystal oscillator 1 in the Y'axis direction can be further improved.
  • At least the first conductive holding member 50a of the conductive holding member 50 is formed with respect to the formation position of the fillet 55 of the conductive holding member 50 according to the first embodiment.
  • the first side surface 111 and the first wall surface 121 which are both side surfaces of the peripheral portion 110 in the X-axis direction, and the third side surface 113 and the third wall surface 123 which are both side surfaces of the peripheral portion 110 on the negative direction side of the Y'axis. It may be formed in each. According to such a conductive holding member 50, the same effect as that of the first embodiment can be exhibited, and better impact resistance of the crystal oscillator 1 in the Y'axis direction can be obtained.
  • the conductive holding member 50 has been described as two-point holding, the conductive holding member 50 is not limited to two-point holding.
  • it may be a four-point holding including the two-point holding according to the first embodiment, the second embodiment, and the examples shown in FIGS. 6A to 6C.
  • the four-point holding conductive holding member 50 the same effects as those shown in the first embodiment, the second embodiment, and FIGS. 6A to 6C can be exhibited.
  • the crystal piece 11 having the main surfaces 12a and 12b, the excitation electrodes 14a and 14b formed on the main surfaces 12a and 12b of the crystal piece 11, and the crystal piece 11 It is provided on the peripheral edge portion 110 located on the end side in the longitudinal direction among the longitudinal direction which is the first direction in the plan view of the main surfaces 12a and 12b and the short direction which is the second direction intersecting the first direction.
  • the crystal vibrating element 10 having connection electrodes 16a and 16b electrically connected to the excitation electrodes 14a and 14b is provided between the substrate 30 and the connection electrodes 16a and 16b of the crystal vibrating element 10 and the substrate 30.
  • a conductive holding member 50 for holding the crystal vibrating element 10 is provided on the substrate 30, and the crystal piece 11 penetrates the region of the crystal piece 11 between the peripheral edge portion 110 in the longitudinal direction and the excitation electrode 14a.
  • a through hole 120 is provided, and the conductive holding member 50 is provided so as to straddle the peripheral edge portion 110 along the longitudinal direction, and is a peripheral edge which is both side surfaces of the peripheral edge portion 110 in the longitudinal direction of the crystal piece 11. It has a fillet 55 formed on each of the first side surface 111 of the portion 110 and the first wall surface 121 of the through hole 120.
  • the height of the fillet 55 of the conductive holding member 50 may be 1/3 or more of the thickness of the crystal piece 11 in the thickness direction of the crystal piece 11. According to the above configuration, since the holding force of the conductive holding member by the fillet can be improved, the holding force by the fillet on the crystal piece can be ensured.
  • the conductivity holding member 50 includes a first conductivity holding member 50a and a second conductivity holding member 50b, and the first conductivity holding member 50a and the second conductivity holding member 50b are Peripheral portions 110 may be provided so as to be separated from each other along the lateral side, which is the second direction. According to the above configuration, it is possible to increase the joint area by the conductive holding member, and it is possible to improve the stability of the joint and the impact resistance in the lateral direction.
  • the through hole 120 has a second wall surface 122 on one side in the lateral direction, which is the second direction, and a third wall surface 123, which is on the other side in the lateral direction.
  • the conductive holding member 50a may further have a fillet 55 formed on the second wall surface 122
  • the second conductive holding member 50b may further have a fillet 55 formed on the third wall surface 123.
  • the first side surface 112 on one side in the lateral direction, which is the second direction, and the third side surface 113 on the other side in the lateral direction are provided, and the first conductive holding member 50a is provided. Further has a fillet 55 formed on the second side surface 112, and the second conductive holding member 50b may further have a fillet 55 formed on the third side surface 113. According to the above configuration, better impact resistance in the lateral direction of the crystal oscillator can be obtained as compared with the case where fillets are not formed on the second side surface and the third side surface, and the crystal oscillator can be obtained. The electrical characteristics can be improved.
  • the first conductive holding member 50a and the second conductive holding member 50b at least the first conductive holding member 50a is located on one side of the through hole 120 in the lateral direction, which is the second direction. It may further have a fillet 55 formed on a second wall surface 122 and a fillet formed on a second side surface 112 on one side of the peripheral edge 110 in the lateral direction. According to the above configuration, it is possible to improve the impact resistance of the crystal oscillator in the lateral direction as compared with the case where the fillet is not formed on the second wall surface and the second side surface, and the conductive holding member can be freely installed. The degree can be increased.
  • the crystal vibrating element 10 and the through hole 120 each have a rectangular shape, and the longitudinal direction of the crystal vibrating element 10 is along the first direction. It extends, and the longitudinal direction of the through hole 120 may extend along the second direction. According to the above configuration, it becomes possible to obtain a crystal oscillator having good impact resistance.
  • the material of the crystal piece 11 may be quartz. According to the above configuration, it is possible to provide a miniaturized crystal unit capable of improving impact resistance and electrical characteristics.
  • the crystal piece 11 having the main surfaces 12a and 12b, and the excitation electrodes 14a and 14b formed on the main surfaces 12a and 12b of the crystal piece 11 are used.
  • the longitudinal direction which is the first direction in the plan view of the main surfaces 12a and 12b of the crystal piece 11 and the short direction which is the second direction intersecting the first direction the peripheral edge portion located on the end side in the longitudinal direction.
  • the region of the crystal piece 11 provided in the 110 and having the connection electrodes 16a and 16b electrically connected to the excitation electrodes 14a and 14b and between the peripheral edge portion 110 in the longitudinal direction and the excitation electrode 14a A preparatory step for preparing the crystal vibrating element 10 having a through hole 120 penetrating the crystal piece 11, and a step for providing a conductive adhesive between the connection electrodes 16a and 16b of the crystal vibrating element 10 and the substrate 30.
  • the bonding step includes a joining step of joining the crystal vibrating element 10 to the substrate 30 by the conductive holding member 50 obtained by curing the conductive adhesive, and the joining step includes the fillet 55 of the conductive holding member 50.
  • each of the first side surface 111 of the peripheral edge 110 and the first wall surface 121 of the through hole 120 which are both side surfaces in the longitudinal direction of the peripheral edge portion 110. According to the above method, it is possible to obtain a quartz oscillator having good impact resistance and electrical characteristics while realizing miniaturization.
  • the joining step may include forming the height of the fillet 55 of the conductive holding member 50 to 1/3 or more of the thickness of the quartz piece 11 in the thickness direction of the quartz piece 11. According to the above method, it is possible to form a fillet of a conductive holding member having a high holding force, and it is possible to improve the impact resistance of the crystal oscillator.
  • the joining step is performed between the connection electrodes 16a and 16b of the crystal vibrating element 10 and the substrate 30 along the short side direction which is the second direction intersecting the longitudinal direction which is the first direction. It may include forming the first conductive holding member 50a and the second conductive holding member 50b separated from the first conductive holding member 50a. According to the above method, it is possible to increase the joint area by the conductive holding member, and it is possible to improve the stability of the joint and the impact resistance in the lateral direction.
  • the fillet 55 of the first conductive holding member 50a is further formed on the second wall surface 122 on one side in the lateral direction which is the second direction of the through hole 120. It may include further forming a fillet 55 of the second conductive holding member 50b on the third wall surface 123 on the other side in the lateral direction which is the second direction of the through hole 120. According to the above method, the impact resistance of the crystal oscillator in the lateral direction can be improved and the size of the crystal oscillator can be reduced as compared with the case where the fillet is not formed on the second wall surface and the third wall surface. Can be realized.
  • the fillet 55 of the first conductive holding member 50a is further formed on the second side surface 112 on one side in the lateral direction which is the second direction of the peripheral edge portion 110. It may include further forming a fillet 55 of the second conductive holding member 50b on the third side surface 113 on the other side of the peripheral edge portion 110 in the lateral direction. According to the above method, better impact resistance in the lateral direction of the crystal oscillator can be obtained as compared with the case where fillets are not formed on the second side surface and the third side surface, and the crystal oscillator can be obtained. Good electrical characteristics can be obtained.
  • the joining step is performed at least on the second wall surface 122 on one side in the lateral direction of the through hole 120 and the second side surface on one side in the lateral direction of the peripheral edge portion 110.
  • 112 may include further forming the fillet 55 of the first conductivity holding member 50a. According to the above method, it is possible to improve the impact resistance of the crystal oscillator in the lateral direction as compared with the case where the fillet is not formed on the second wall surface and the second side surface, and the conductive holding member can be freely installed. The degree can be increased.
  • each of the embodiments described above is for facilitating the understanding of the present invention, and is not for limiting the interpretation of the present invention.
  • the present invention can be modified / improved without departing from the spirit thereof, and the present invention also includes an equivalent thereof. That is, those skilled in the art with appropriate design changes to each embodiment are also included in the scope of the present invention as long as they have the features of the present invention.
  • each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those exemplified, and can be appropriately changed.
  • each embodiment is an example, and it goes without saying that partial substitutions or combinations of the configurations shown in different embodiments are possible, and these are also included in the scope of the present invention as long as the features of the present invention are included. ..

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
PCT/JP2021/026991 2020-12-14 2021-07-19 圧電振動子及び圧電振動子の製造方法 Ceased WO2022130670A1 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024023711A1 (en) * 2022-07-26 2024-02-01 Rakon Limited Stress isolated quartz crystal resonating element and quartz crystal resonator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009105776A (ja) * 2007-10-25 2009-05-14 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス
JP2013042425A (ja) * 2011-08-18 2013-02-28 Seiko Epson Corp 圧電振動片、圧電モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009105776A (ja) * 2007-10-25 2009-05-14 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス
JP2013042425A (ja) * 2011-08-18 2013-02-28 Seiko Epson Corp 圧電振動片、圧電モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024023711A1 (en) * 2022-07-26 2024-02-01 Rakon Limited Stress isolated quartz crystal resonating element and quartz crystal resonator

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