WO2022118826A1 - 高周波誘電加熱用接着剤、構造体及び構造体の製造方法 - Google Patents
高周波誘電加熱用接着剤、構造体及び構造体の製造方法 Download PDFInfo
- Publication number
- WO2022118826A1 WO2022118826A1 PCT/JP2021/043772 JP2021043772W WO2022118826A1 WO 2022118826 A1 WO2022118826 A1 WO 2022118826A1 JP 2021043772 W JP2021043772 W JP 2021043772W WO 2022118826 A1 WO2022118826 A1 WO 2022118826A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- dielectric heating
- frequency dielectric
- frequency
- adhesive
- heating adhesive
- Prior art date
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 365
- 239000000853 adhesive Substances 0.000 title claims abstract description 363
- 238000010438 heat treatment Methods 0.000 title claims abstract description 317
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 32
- 230000005684 electric field Effects 0.000 claims abstract description 74
- 239000000945 filler Substances 0.000 claims abstract description 51
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 40
- 238000005304 joining Methods 0.000 claims abstract description 18
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 17
- 239000000155 melt Substances 0.000 claims description 15
- 238000000197 pyrolysis Methods 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 description 46
- 239000011347 resin Substances 0.000 description 46
- 239000000463 material Substances 0.000 description 32
- 229920005672 polyolefin resin Polymers 0.000 description 26
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 21
- 239000002245 particle Substances 0.000 description 16
- -1 polyethylene Polymers 0.000 description 15
- 238000005259 measurement Methods 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 150000001336 alkenes Chemical class 0.000 description 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 10
- 239000011787 zinc oxide Substances 0.000 description 10
- 101100389235 Arabidopsis thaliana ELD1 gene Proteins 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229920001684 low density polyethylene Polymers 0.000 description 5
- 239000004702 low-density polyethylene Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 229920006324 polyoxymethylene Polymers 0.000 description 5
- 239000010734 process oil Substances 0.000 description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical group 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229930182556 Polyacetal Natural products 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101100117388 Arabidopsis thaliana DPA gene Proteins 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 101100389815 Caenorhabditis elegans eva-1 gene Proteins 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 101100424903 Homo sapiens GTF2B gene Proteins 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- KMJPKUVSXFVQGZ-UHFFFAOYSA-N TF2B Natural products OC1CC2=C(O)C=C(O)C=C2OC1C(C1=C2)=CC(O)=C(O)C1=C(O)C(=O)C=C2C1OC2=CC(O)=CC(O)=C2CC1OC(=O)C1=CC(O)=C(O)C(O)=C1 KMJPKUVSXFVQGZ-UHFFFAOYSA-N 0.000 description 1
- 102100033662 Transcription initiation factor IIB Human genes 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- JZQOJFLIJNRDHK-CMDGGOBGSA-N alpha-irone Chemical compound CC1CC=C(C)C(\C=C\C(C)=O)C1(C)C JZQOJFLIJNRDHK-CMDGGOBGSA-N 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229940100539 dibutyl adipate Drugs 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- YPTLFOZCUOHVFO-SREVYHEPSA-N diethyl (z)-2-methylbut-2-enedioate Chemical compound CCOC(=O)\C=C(\C)C(=O)OCC YPTLFOZCUOHVFO-SREVYHEPSA-N 0.000 description 1
- ZEFVHSWKYCYFFL-UHFFFAOYSA-N diethyl 2-methylidenebutanedioate Chemical compound CCOC(=O)CC(=C)C(=O)OCC ZEFVHSWKYCYFFL-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- WQEXBUQDXKPVHR-PLNGDYQASA-N dimethyl (z)-2-methylbut-2-enedioate Chemical compound COC(=O)\C=C(\C)C(=O)OC WQEXBUQDXKPVHR-PLNGDYQASA-N 0.000 description 1
- ZWWQRMFIZFPUAA-UHFFFAOYSA-N dimethyl 2-methylidenebutanedioate Chemical compound COC(=O)CC(=C)C(=O)OC ZWWQRMFIZFPUAA-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/46—Dielectric heating
- H05B6/54—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/05—5 or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
- B32B2264/1025—Zinc oxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/30—Particles characterised by physical dimension
- B32B2264/303—Average diameter greater than 1µm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/737—Dimensions, e.g. volume or area
- B32B2307/7375—Linear, e.g. length, distance or width
- B32B2307/7376—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
Definitions
- the present invention relates to a high-frequency dielectric heating adhesive, a structure, and a method for manufacturing the structure.
- Patent Document 1 a surface layer and a back layer made of a glass plate and an intermediate layer made of a plurality of plastic sheets are laminated with an ethylene-vinyl acetate copolymer resin sheet (EVA sheet) interposed therebetween.
- EVA sheet ethylene-vinyl acetate copolymer resin sheet
- Patent Document 2 a motor core material in which 50 electromagnetic steel sheets are laminated via an insulating coating having adhesive ability is pressurized by a pressure cylinder of a high-frequency dielectric heating device, and a high frequency is applied between electrodes at the same time.
- the laminated iron core (laminated body) to be manufactured is described.
- the insulating film having this adhesive ability contains an organic resin such as an epoxy resin as a main component.
- Patent Document 1 describes a method in which a glass plate, an EVA sheet, and a polycarbonate sheet are laminated, placed in an oven-type vacuum chamber, heated from room temperature to 130 ° C., and reduced to 70 cmHg to produce composite glass. Have been described.
- the composite glass (laminated body) described in Patent Document 1 it is necessary to join the glass plate and the polycarbonate sheet after raising the temperature and reducing the pressure in the vacuum chamber. It is difficult to join each other in a short time.
- the application time of the high frequency when manufacturing the laminated iron core (laminated body) described in Patent Document 2 is 2 minutes or 4 minutes, and the steel plates (adhesions) cannot be joined to each other in a short time.
- the adherends in the structure may be displaced from each other. rice field.
- An object of the present invention is to provide an adhesive for high-frequency dielectric heating that can bond three or more adherends at a time in a short time and suppress the occurrence of displacement between adherends, and the high-frequency dielectric heating. It is an object of the present invention to provide a structure in which three or more adherends are joined by an adhesive for use, and a method for manufacturing the structure.
- the present invention is a high-frequency dielectric heating adhesive for joining three or more adherends, and the high-frequency dielectric heating adhesive is obtained by applying a thermoplastic resin and a high-frequency electric field.
- the melt volume rate at the lower limit temperature TL and the upper limit temperature TU is 1 cm 3/10 min or more and 300 cm 3/10 min or less, including the dielectric filler that generates heat, and the lower limit temperature TL (unit: ° C.) is the following formula.
- An adhesive for high-frequency dielectric heating which is defined by (Equation 11) and whose upper limit temperature TU (unit: ° C.) is defined by the following formula (Equation 12), is provided.
- TL Softening temperature TM + 10 ° C.
- the three or more adherends are either adherends having no flow start temperature or adheres having a flow start temperature. It is a body, and it is preferable that the flow start temperature TF2 (° C.) of the adherend and the flow start temperature TF1 (° C.) of the high-frequency dielectric heating adhesive satisfy the relationship of the following formula (Equation 2). -5 ⁇ TF2-TF1 ... (Equation 2)
- the flow start temperature TF1 of the high-frequency dielectric heating adhesive is preferably 80 ° C. or higher and 200 ° C. or lower.
- the adherend having the flow start temperature when at least one of the three or more adherends is an adherend having a flow start temperature, the adherend having the flow start temperature.
- the flow start temperature TF2 of the above is preferably 90 ° C. or higher.
- the dielectric property DP1 of the high-frequency dielectric heating adhesive and the dielectric property DP2 of each of the three or more adherends are expressed by the following formula (Equation 1). ) Satisfying the relationship. 0 ⁇ DP1-DP2 ... (number 1) (The dielectric property DP1 and the dielectric property DP2 are the values of the dielectric properties (tan ⁇ / ⁇ 'r) of the high-frequency dielectric heating adhesive and the three or more adherends, respectively. tan ⁇ is a dielectric loss tangent at 23 ° C. and a frequency of 40.68 MHz. ⁇ 'r is the relative permittivity at 23 ° C. and a frequency of 40.68 MHz. )
- the dielectric property DP2 of each of the three or more adherends is preferably 0.015 or less.
- the dielectric property DP1 of the high-frequency dielectric heating adhesive is preferably 0.005 or more.
- the high-frequency dielectric heating adhesive is preferably an adhesive sheet.
- the thickness TS1 of the adhesive sheet and the thickness TS2 of each of the three or more adherends satisfy the relationship of the following mathematical formula (Equation 3). Is preferable. TS1 ⁇ TS2 ... (number 3)
- the thickness TS1 of the adhesive sheet is preferably 5 ⁇ m or more and 2000 ⁇ m or less.
- the thickness accuracy of the adhesive sheet is preferably within ⁇ 10%.
- a step of arranging the high-frequency dielectric heating adhesive according to the above-mentioned one aspect of the present invention between the three or more adherends, and a high-frequency frequency on the high-frequency dielectric heating adhesive is provided.
- a method for manufacturing a structure which comprises a step of applying an electric field to join the three or more adherends.
- the three or more adherends and the high-frequency dielectric heating adhesive are arranged between the electrodes of the dielectric heating device, and the three or more adherends are adhered. It is preferable to apply a high-frequency electric field while pressurizing the body and the high-frequency dielectric heating adhesive with the electrodes.
- an adhesive for high frequency dielectric heating that can join three or more adherends at a time in a short time and can suppress the occurrence of displacement between the adherends. Further, according to one aspect of the present invention, it is possible to provide a structure in which three or more adherends are bonded by the high-frequency dielectric heating adhesive and a method for manufacturing the structure.
- the high-frequency dielectric heating adhesive includes a thermoplastic resin and a dielectric filler that generates heat by applying a high-frequency electric field.
- a high frequency electric field is an electric field whose direction is reversed at a high frequency.
- thermoplastic resin contained in the high-frequency dielectric heating adhesive may be referred to as a thermoplastic resin (A), and the dielectric filler may be referred to as a dielectric filler (B).
- the high-frequency dielectric heating adhesive is a high-frequency dielectric heating adhesive for joining three or more adherends.
- the melt volume rate at the lower limit temperature TL and the upper limit temperature TU is 1 cm 3/10 min or more and 300 cm 3/10 min or less.
- the lower limit temperature TL (unit: ° C.) is defined by the following formula (Equation 11)
- the upper limit temperature TU unit: ° C.
- TL Softening temperature TM + 10 ° C. of the high-frequency dielectric heating adhesive ...
- TU Thermal decomposition temperature of the high-frequency dielectric heating adhesive TD-10 ° C ... (Equation 12)
- the measured load of the melt volume rate at the lower limit temperature TL is 20 kg.
- the measured load of the melt volume rate at the upper limit temperature TU is 5 kg.
- melt volume rate (MVR) the melt volume rate (hereinafter, may be referred to as MVR) of the high-frequency dielectric heating adhesive is measured at a softening temperature TM + 10 ° C. and a thermal decomposition temperature TD-10 ° C. The value is within the range of 1 cm 3/10 min or more and 300 cm 3/10 min or less.
- the softening temperature TM + 10 ° C. is considered to represent the temperature at which the high-frequency dielectric heating adhesive begins to melt and the adhesiveness with the adherend begins to develop.
- the thermal decomposition of the thermoplastic resin in the high-frequency dielectric heating adhesive does not start, and the thermal decomposition in the high-frequency dielectric heating adhesive causes the bondability with the adherend. It represents a temperature that is unlikely to affect. That is, these temperatures are temperatures at which the adhesiveness for high-frequency dielectric heating and the adherend are surely generated, and temperatures that are unlikely to affect the deterioration of the bonding strength between the adhesive for high-frequency dielectric heating and the adherend. And represents.
- “min” in the unit is an abbreviation for "minute”.
- the MVR of the high-frequency dielectric heating adhesive according to the present embodiment is less than 1 cm 3/10 min at each of the above measured temperatures, the fluidity of the high-frequency dielectric heating adhesive is too low, and the anchor effect is difficult to be exhibited. , It becomes difficult to obtain characteristics such as wettability to the adherend. Specifically, even if a high-frequency electric field is applied to the high-frequency dielectric heating adhesive, the MVR of the high-frequency dielectric heating adhesive is too low, so that the high-frequency dielectric heating adhesive spreads wet on the surface of the adherend. It is considered difficult. Therefore, it takes time for the high-frequency dielectric heating adhesive to wet and spread on the surface of the adherend. Moreover, it is difficult to obtain an anchor effect.
- the MVR of the high-frequency dielectric heating adhesive according to the present embodiment is less than 1 cm 3/10 min, it takes a joining time, it becomes difficult to join in a short time, and the joining strength tends to be weakened. If the MVR of the high-frequency dielectric heating adhesive according to the present embodiment exceeds 300 cm / 3/10 min at each of the above measurement temperatures, the fluidity of the high-frequency dielectric heating adhesive becomes too high, so that three or more are adhered. When the bodies are joined at once, the adherends are likely to be displaced from each other.
- the MVR of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 2 cm 3/10 min or more, preferably 3 cm 3/10 min or more, at a softening temperature TM + 10 ° C. and a thermal decomposition temperature TD-10 ° C. More preferably, it is 4 cm 3/10 min or more, and even more preferably.
- the MVR of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 275 cm 3/10 min or less, preferably 250 cm 3/10 min or less, at a softening temperature TM + 10 ° C. and a thermal decomposition temperature TD-10 ° C.
- the MVR of the high-frequency dielectric heating adhesive according to the present embodiment is 2 cm 3/10 min or more, three or more adherends can be bonded at one time in a shorter time, and more sufficient bonding strength can be obtained. It will be easier to get rid of.
- the MVR of the high-frequency dielectric heating adhesive according to the present embodiment is 275 cm 3/10 min or less, the occurrence of misalignment between adherends is more likely to be suppressed.
- MVR (cm 3/10 min) is a value measured using a flow tester.
- the MVR of the high-frequency dielectric heating adhesive can be measured by the method described in the item of Examples described later.
- the softening temperature TM of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 70 ° C. or higher, more preferably 80 ° C. or higher, and even more preferably 90 ° C. or higher.
- the softening temperature TM of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 200 ° C. or lower, more preferably 180 ° C. or lower, and even more preferably 160 ° C. or lower.
- the structure manufactured by using the high-frequency dielectric heating adhesive can easily obtain heat resistance in general life. If the softening temperature TM of the high-frequency dielectric heating adhesive is 200 ° C or lower, it is easy to prevent the time required for melting the high-frequency dielectric heating adhesive during joining from becoming long, and the high-frequency dielectric heating adhesive and the adherend can be easily prevented. It is easy to obtain the bonding strength with.
- the softening temperature can be measured by the method described in the item of Examples described later.
- the thermal decomposition temperature TD of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 180 ° C. or higher, more preferably 200 ° C. or higher, and even more preferably 220 ° C. or higher.
- the thermal decomposition temperature TD of the high-frequency dielectric heating adhesive is 180 ° C. or higher, the structure manufactured by using the high-frequency dielectric heating adhesive can easily obtain heat resistance in general life. Further, since a sufficient output can be applied when a high-frequency electric field is applied, it is easy to bond the high-frequency dielectric heating adhesive and the adherend in a short time.
- the upper limit of the thermal decomposition temperature TD of the high-frequency dielectric heating adhesive according to the present embodiment is not particularly limited, and may be, for example, 600 ° C. or lower, 500 ° C. or lower, or 400 ° C. or lower. May be good.
- the pyrolysis temperature can be measured according to JIS K 7120: 1987.
- the thermal decomposition temperature of the high-frequency dielectric heating adhesive according to the present embodiment is, for example, a temperature corresponding to the peak top of the exothermic peak observed on the low temperature side of the DTA curve. Specifically, it can be measured by the method described in the item of the embodiment described later.
- the flow start temperature TF1 of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 80 ° C. or higher, more preferably 90 ° C. or higher, and even more preferably 100 ° C. or higher.
- the flow start temperature TF1 of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 200 ° C. or lower, more preferably 180 ° C. or lower, further preferably 160 ° C. or lower, and 140 ° C. or lower. Is even more preferable.
- the flow start temperature TF1 of the high-frequency dielectric heating adhesive is 80 ° C. or higher, the occurrence of misalignment between the adherends is likely to be suppressed.
- the structure manufactured by using the high-frequency dielectric heating adhesive can easily obtain heat resistance in general life.
- the flow start temperature TF1 of the high-frequency dielectric heating adhesive is 200 ° C. or lower, it is easy to prevent the time required for melting the high-frequency dielectric heating adhesive from becoming long at the time of joining, and the adhesive and the high-frequency dielectric heating adhesive are adhered. It is easy to obtain the bonding strength with the body.
- the flow start temperature can be measured by the method described in the item of Examples described later.
- the difference (TF2-TF1) between the flow start temperature TF2 (° C.) of the adherend and the flow start temperature TF1 (° C.) of the high-frequency dielectric heating adhesive can satisfy the relationship of the following mathematical formula (Equation 2-1). It is more preferable to satisfy the relationship of the following mathematical formula (Equation 2-2), further preferably to satisfy the relationship of the following mathematical formula (Equation 2-3), and to satisfy the relationship of the following mathematical formula (Equation 2-4). It is even more preferable to satisfy the relationship of the following formula (Equation 2-5), further preferably to satisfy the relationship of the following formula (Equation 2-6), and the following formula (Equation 2-7). It is even more preferable to satisfy the relationship of. 0 ⁇ TF2-TF1 ...
- the difference (TF2-TF1) between the flow start temperature TF2 (° C.) of the adherend and the flow start temperature TF1 (° C.) of the high-frequency dielectric heating adhesive can satisfy the relationship of the following mathematical formula (Equation 2-8). It is more preferable to satisfy the relationship of the following mathematical formula (Equation 2-9), further preferably satisfy the relationship of the following mathematical formula (Equation 2-10), and satisfy the relationship of the following mathematical formula (Equation 2-11). Even more preferable.
- the flow start temperature TF2 of the adherend having the flow start temperature is preferably 90 ° C. or higher. It is more preferably 100 ° C. or higher, further preferably 110 ° C. or higher, further preferably 120 ° C. or higher, and even more preferably 130 ° C. or higher.
- the flow start temperature TF2 of the adherend having the flow start temperature is preferably 1200 ° C. or lower, more preferably 400 ° C. or lower.
- the adherend is made of, for example, ceramic or a curable resin, there is no upper limit of the flow start temperature TF2 of the adherend.
- the flow start temperature TF2 of the adherend is 90 ° C. or higher, it becomes easy to join the adherend without damaging the shape of the adherend.
- the dielectric property DP1 of the high-frequency dielectric heating adhesive is a mathematical formula with respect to the dielectric property DP2 of each of the three adherends. It is preferable to satisfy the relationship (Equation 1). 0 ⁇ DP1-DP2 ...
- dielectric property DP1 and dielectric property DP2 are values of the dielectric properties (tan ⁇ / ⁇ 'r) of the adhesive for high-frequency dielectric heating and three or more adherends, respectively, and tan ⁇ is 23 ° C. and a frequency. It is a dielectric loss tangent at 40.68 MHz, and ⁇ 'r is a relative permittivity at 23 ° C. and a frequency of 40.68 MHz.)
- the high-frequency dielectric heating adhesive is the following mathematical formula (Equation 1A), (Equation 1B), and number (Equation 1C). ) Satisfying. 0 ⁇ DP1-DP2A ... (number 1A) 0 ⁇ DP1-DP2B ... (number 1B) 0 ⁇ DP1-DP2C ... (number 1C)
- the difference (DP1-DP2) between the dielectric property DP1 of the high-frequency dielectric heating adhesive and the dielectric property DP2 of the adherend preferably satisfies the relationship of the following formula (Equation 1-1), and the following formula (Formula 1-). It is more preferable to satisfy the relationship of 2). 0.005 ⁇ DP1-DP2 ... (Equation 1-1) 0.01 ⁇ DP1-DP2 ... (Equation 1-2)
- the difference (DP1-DP2) between the dielectric property DP1 of the high-frequency dielectric heating adhesive and the dielectric property DP2 of the adherend usually preferably satisfies the relationship of the following formula (Equation 1-3), and the following formula (number). It is more preferable to satisfy the relationship of 1-4).
- the dielectric property DP1 of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 0.005 or more, more preferably 0.008 or more, and further preferably 0.01 or more.
- the dielectric property DP1 of the high-frequency dielectric heating adhesive according to the present embodiment is preferably 0.1 or less, more preferably 0.08 or less, further preferably 0.05 or less, and 0. It is particularly preferable that it is 0.03 or less.
- the dielectric property DP1 of the high-frequency dielectric heating adhesive is 0.005 or more, the high-frequency dielectric heating adhesive does not generate a predetermined heat when subjected to the dielectric heating treatment, and the high-frequency dielectric heating adhesive and the cover are covered. It is possible to prevent a problem that it becomes difficult to firmly bond the body to the body.
- the dielectric property DP1 of the high-frequency dielectric heating adhesive is 0.1 or less, overheating can be easily prevented, and damage to the portion of the adherend in contact with the high-frequency dielectric heating adhesive is unlikely to occur.
- the dielectric property DP2 of each of the three or more adherends is preferably 0.015 or less, more preferably 0.01 or less, and 0.005 or less. Is even more preferable.
- the dielectric property DP2 of the adherend is 0.015 or less, heat generation of the adherend can be suppressed, so that it becomes easy to join without damaging the shape of the adherend at the time of joining.
- the dielectric property DP2 of the adherend is usually 0 or more.
- the dielectric property (tan ⁇ / ⁇ 'r) is a value obtained by dividing the dielectric loss tangent (tan ⁇ ) measured using an impedance material device or the like by the relative permittivity ( ⁇ 'r) measured using an impedance material device or the like. Is.
- the dielectric loss tangent (tan ⁇ ) and the relative permittivity ( ⁇ 'r) as the dielectric properties of the high-frequency dielectric heating adhesive and the adherend can be easily and accurately measured using an impedance material analyzer.
- the details of the high-frequency dielectric heating adhesive and the method for measuring the dielectric properties of the adherend are as follows. First, a high-frequency dielectric heating adhesive and a sheet for measuring an adherend are obtained.
- a measuring sheet having a uniform thickness is obtained by cutting out or cutting out from the structure.
- a measurement sheet is obtained by making a sheet with a hot press machine or the like.
- the thickness of the measuring sheet is, for example, 10 ⁇ m or more and 2 mm or less.
- the sheet thus obtained was subjected to a relative permittivity ( ⁇ 'r) and a dielectric loss tangent (tan ⁇ ) under the condition of a frequency of 40.68 MHz at 23 ° C. using an RF impedance material analyzer E4991A (manufactured by Agent). Each is measured and the value of the dielectric property (tan ⁇ / ⁇ 'r) is calculated.
- the shape of the high-frequency dielectric heating adhesive according to the present embodiment is not particularly limited, but is preferably a sheet shape. That is, the high-frequency dielectric heating adhesive according to the present embodiment is preferably an adhesive sheet (sometimes referred to as a high-frequency dielectric heating adhesive sheet). Since the high-frequency dielectric heating adhesive is an adhesive sheet, the time required for the manufacturing process of the structure can be further shortened.
- the thickness TS1 of the adhesive sheet according to the present embodiment and the thickness TS2 of each of the three or more adherends satisfy the relationship of the following mathematical formula (Equation 3).
- TS1 ⁇ TS2 ... (number 3) When the high-frequency dielectric heating adhesive according to the present embodiment is an adhesive sheet, by satisfying the relationship of the above formula (Equation 3), the heat generated from the adhesive sheet does not become excessive when a high-frequency electric field is applied, and the adhesive is adhered. The heat damage to the body can be further suppressed.
- the thickness TS1 of the adhesive sheet according to the present embodiment is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, further preferably 30 ⁇ m or more, and particularly preferably 50 ⁇ m or more.
- the upper limit of the thickness TS1 of the adhesive sheet is not particularly limited. As the thickness of the adhesive sheet increases, the weight of the entire structure obtained by adhering the adhesive sheet and the adherend also increases. Therefore, the thickness of the adhesive sheet is preferably within a range that does not cause any problem in actual use. .. Considering the practicality and moldability of the adhesive sheet, the thickness TS1 of the adhesive sheet according to the present embodiment is preferably 2000 ⁇ m or less, more preferably 1000 ⁇ m or less, and further preferably 600 ⁇ m or less. ..
- the thickness accuracy of the adhesive sheet according to the present embodiment is preferably within ⁇ 10%, more preferably within ⁇ 8%, and even more preferably within ⁇ 5%.
- the thickness accuracy of the adhesive sheet according to the present embodiment is within ⁇ 10%, the laminated body can be stably installed in the joining device when joining. Further, since the pressure is uniformly applied to the adhesive sheet surface when the high frequency electric field is applied, it is possible to suppress the displacement and deformation of the laminated body.
- the thickness accuracy of the adhesive sheet can be calculated by the method described in the item of Examples described later.
- the thickness accuracy of the adhesive sheet is usually 0% or more.
- the adhesive sheet as a high-frequency dielectric heating adhesive is easier to handle and improves workability at the time of joining with an adherend, as compared with the case of using a liquid adhesive that needs to be applied.
- the adhesive sheet as a high-frequency dielectric heating adhesive can appropriately control the sheet thickness and the like. Therefore, the adhesive sheet can be applied to the roll-to-roll method, and the adhesive sheet can be applied to an arbitrary area and an arbitrary area according to the adhesion area with the adherend and the shape of the adherend by punching or the like. Can be processed into a shape. Therefore, the adhesive sheet as the adhesive for high-frequency dielectric heating has a great advantage from the viewpoint of the manufacturing process.
- thermoplastic resin (A) The type of the thermoplastic resin (A) is not particularly limited.
- the thermoplastic resin (A) is, for example, a polyolefin resin, a styrene resin, a polyacetal resin, a polycarbonate resin, an acrylic resin, a polyamide resin, from the viewpoint of being easily melted and having a predetermined heat resistance. It is preferably at least one selected from the group consisting of a polyimide resin, a polyvinyl acetate resin, a phenoxy resin and a polyester resin.
- the thermoplastic resin (A) is preferably a polyolefin-based resin or a styrene-based resin, and more preferably a polyolefin-based resin. If the thermoplastic resin (A) is a polyolefin resin or a styrene resin, the high-frequency dielectric heating adhesive is likely to melt when a high-frequency electric field is applied, and the high-frequency dielectric heating adhesive and the adherend according to the present embodiment are used. Can be easily bonded.
- the polyolefin-based resin includes a polyolefin-based resin having a polar moiety and a polyolefin-based resin having no polar moiety, and when specifying the presence or absence of a polar moiety, the polyolefin-based resin having a polar moiety or the polar moiety is specified. It is described as a polyolefin-based resin that does not have.
- thermoplastic resin (A) is a polyolefin resin having a polar moiety.
- the thermoplastic resin (A) may be a polyolefin resin having no polar moiety.
- the polyolefin-based resin as the thermoplastic resin (A) is composed of, for example, a resin made of a homopolymer such as polyethylene, polypropylene, polybutene and polymethylpentene, and ethylene, propylene, butene, hexene, octene and 4-methylpentene and the like. Examples thereof include ⁇ -olefin resins made of a copolymer of monomers selected from the group.
- the polyolefin-based resin as the thermoplastic resin (A) may be a single resin or a combination of two or more resins.
- the polar moiety in the polyolefin-based resin having a polar moiety is not particularly limited as long as it is a moiety that can impart polarity to the polyolefin-based resin. Polyolefin-based resins having polar moieties are preferable because they exhibit high adhesive strength to the adherend.
- the polyolefin-based thermoplastic resin having a polar moiety may be a copolymer of an olefin-based monomer and a monomer having a polar moiety.
- the polyolefin-based thermoplastic resin having a polar moiety may be a resin obtained by introducing a polar moiety into an olefin-based polymer obtained by polymerization of an olefin-based monomer by modification such as an addition reaction.
- the type of the olefin-based monomer constituting the polyolefin-based resin having a polar moiety is not particularly limited.
- the olefin-based monomer include ethylene, propylene, butene, hexene, octene, 4-methyl-1-pentene and the like.
- the olefin-based monomer may be used alone or in combination of two or more.
- the olefin-based monomer is preferably at least one of ethylene and propylene from the viewpoint of excellent mechanical strength and stable adhesive properties.
- the olefin-derived structural unit in the polyolefin-based resin having a polar moiety is preferably ethylene or a structural unit derived from propylene.
- Examples of the polar moiety include a hydroxyl group, a carboxy group, a vinyl acetate structure, an acid anhydride structure, and the like.
- Examples of the polar moiety include an acid-modified structure introduced into the polyolefin resin by acid modification.
- the acid-modified structure as a polar site is a site introduced by acid-modifying a thermoplastic resin (for example, a polyolefin resin).
- the compound used for acid modification of a thermoplastic resin is an unsaturated carboxylic acid derived from any of an unsaturated carboxylic acid, an acid anhydride of an unsaturated carboxylic acid, and an ester of an unsaturated carboxylic acid. Acid derivative components can be mentioned.
- a polyolefin-based resin having an acid-modified structure may be referred to as an acid-modified polyolefin-based resin.
- Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid and citraconic acid.
- Examples of the acid anhydride of the unsaturated carboxylic acid include acid anhydrides of unsaturated carboxylic acids such as maleic anhydride, itaconic anhydride and citraconic anhydride.
- ester of unsaturated carboxylic acid examples include methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, dimethyl maleate, monomethyl maleate, dimethyl fumarate, diethyl fumarate, and dimethyl itaconate.
- Esters of unsaturated carboxylic acids such as diethyl itaconate, dimethyl citraconate, diethyl citraconate and dimethyl tetrahydrohydride phthalate.
- the melt flow rate (hereinafter, may be referred to as MFR) of the thermoplastic resin (A) is preferably 0.5 g / 10 min or more, preferably 1.0 g. It is more preferably / 10 min or more, and further preferably 2.0 g / 10 min or more. In the high-frequency dielectric heating adhesive according to the present embodiment, the melt flow rate of the thermoplastic resin (A) is preferably 100 g / 10 min or less, more preferably 90 g / 10 min or less, and 80 g / 10 min or less.
- the MFR of the high-frequency dielectric heating adhesive is 0.5 g / 10 min or more, the fluidity can be maintained and the film thickness accuracy can be easily obtained. For example, the film film accuracy when the film is formed by extrusion molding can be easily obtained. ..
- the MFR of the high-frequency dielectric heating adhesive is 100 g / 10 min or less, film-forming property can be easily obtained. For example, when the MFR is 50 g / 10 min or less, the film-forming property when a film is formed by extrusion molding is likely to be improved.
- the MFR of the thermoplastic resin (A) can be measured at a predetermined test temperature and load according to, for example, JIS K 7210-1: 2014 or JIS K 6924-1: 1997.
- the test conditions are, for example, when the structural unit derived from the olefin in the thermoplastic resin (A) is polyethylene, the test temperature is 190 ° C. and the load is 2.16 kg.
- the structural unit derived from olefin is ethylene-vinyl acetate copolymer
- the test temperature is 190 ° C. and the load is 2.16 kg.
- the dielectric filler (B) is a filler that generates heat when a high frequency electric field is applied.
- the dielectric filler (B) is preferably a filler that generates heat when a high frequency electric field having a frequency range of 3 MHz or more and 300 MHz or less is applied.
- the dielectric filler (B) is preferably a filler that generates heat by applying a high frequency electric field having a frequency range of 3 MHz or more and 300 MHz or less, for example, a frequency of 13.56 MHz, 27.12 MHz or 40.68 MHz.
- the dielectric filler (B) includes zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, barium titanate, barium titanate, lead titanate, potassium niobate, rutyl-type titanium oxide, and aluminum hydrated aluminum silicate. It is preferable to use one kind or a combination of two or more kinds of an inorganic material having crystalline water such as hydrated aluminosilicate of an alkali metal or an inorganic material having crystalline water such as hydrated aluminosilicate of an alkaline earth metal.
- the dielectric filler (B) preferably contains at least one selected from the group consisting of zinc oxide, silicon carbide, barium titanate and titanium oxide.
- the dielectric filler (B) has a wide variety of types, can be selected from various shapes and sizes, and the adhesive properties and mechanical properties of the high-frequency dielectric heating adhesive can be improved according to the application. It is more preferably zinc oxide.
- zinc oxide As the dielectric filler (B), a colorless high-frequency dielectric heating adhesive can be obtained.
- Zinc oxide has the lowest density among the dielectric fillers, so when the adherend is bonded using a high-frequency dielectric heating adhesive containing zinc oxide as the dielectric filler (B), an adhesive containing another dielectric filler. It is difficult to increase the total weight of the bonded body as compared with the case of using.
- Zinc oxide is not too hard among ceramics, so it does not easily damage the equipment for manufacturing high-frequency dielectric heating adhesives. Since zinc oxide is an inert oxide, it causes little damage to the thermoplastic resin even when blended with the thermoplastic resin.
- the titanium oxide as the dielectric filler (B) is preferably at least one of anatase-type titanium oxide and rutile-type titanium oxide, and more preferably anatase-type titanium oxide from the viewpoint of excellent dielectric properties. ..
- the volume content of the dielectric filler (B) in the high-frequency dielectric heating adhesive is preferably 5% by volume or more, more preferably 8% by volume or more, and further preferably 10% by volume or more. ..
- the volume content of the dielectric filler (B) in the high-frequency dielectric heating adhesive is preferably 50% by volume or less, more preferably 40% by volume or less, and further preferably 35% by volume or less. , 25% by volume or less is more preferable.
- the volume content of the dielectric filler (B) in the high-frequency dielectric heating adhesive is 5% by volume or more, the heat generation property is improved, and it is easy to firmly bond the high-frequency dielectric heating adhesive and the adherend. ..
- the volume content of the dielectric filler (B) in the high-frequency dielectric heating adhesive is 50% by volume or less, it is possible to prevent the strength of the adhesive from decreasing, and as a result, the bonding strength is increased by using the adhesive. Can be prevented from decreasing.
- the high-frequency dielectric heating adhesive according to the present embodiment is an adhesive sheet
- the volume content of the dielectric filler (B) in the adhesive sheet is 50% by volume or less, so that flexibility as a sheet is obtained. Since it is easy to prevent a decrease in toughness, it is easy to process a high-frequency dielectric heating adhesive sheet into a desired shape in a subsequent step.
- the total volume of the thermoplastic resin (A) and the dielectric filler (B) is contained.
- the volume content of the dielectric filler (B) is preferably 5% by volume or more, more preferably 8% by volume or more, and further preferably 10% by volume or more.
- the volume content of the dielectric filler (B) is preferably 50% by volume or less, more preferably 40% by volume or less, based on the total volume of the thermoplastic resin (A) and the dielectric filler (B). , 35% by volume or less, more preferably 25% by volume or less.
- the volume average particle size of the dielectric filler (B) is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and further preferably 3 ⁇ m or more.
- the volume average particle size of the dielectric filler (B) is preferably 30 ⁇ m or less, more preferably 25 ⁇ m or less, and further preferably 20 ⁇ m or less.
- the high-frequency dielectric heating adhesive exhibits high heat generation performance when a high-frequency electric field is applied, and the adhesive layer is strong with the adherend in a short time. Can be glued to.
- the high-frequency dielectric heating adhesive exhibits high heat generation performance when a high-frequency electric field is applied, and the adhesive layer is strong with the adherend in a short time. Can be glued to. Further, when the high-frequency dielectric heating adhesive according to the present embodiment is an adhesive sheet, the volume average particle diameter of the dielectric filler (B) is 30 ⁇ m or less, so that the strength of the high-frequency dielectric heating adhesive sheet can be prevented from decreasing.
- the volume average particle size of the dielectric filler (B) is measured by the following method.
- the particle size distribution of the dielectric filler (B) is measured by the laser diffraction / scattering method, and the volume average particle size is calculated from the result of the particle size distribution measurement according to JIS Z 8819-2: 2001.
- the high-frequency dielectric heating adhesive according to the present embodiment is an adhesive sheet
- the relationship between the average particle size DF of the dielectric filler (B) and the thickness TS1 of the adhesive sheet is 1 ⁇ TS1 / DF ⁇ 2500. It is preferable to meet.
- TS1 / DF is preferably 1 or more, more preferably 2 or more, further preferably 5 or more, further preferably 10 or more, and even more preferably 20 or more. preferable.
- TS1 / DF is 1 or more, it is possible to prevent a decrease in bonding strength due to contact between the dielectric filler (B) and the adherend during bonding.
- TS1 / DF is preferably 2500 or less, more preferably 2000 or less, further preferably 1750 or less, further preferably 1000 or less, and even more preferably 500 or less. It is more preferably 100 or less, and even more preferably 50 or less.
- TS1 / DF is 2500 or less, the load on the sheet manufacturing apparatus can be suppressed when the high-frequency dielectric heating adhesive sheet is manufactured.
- the high-frequency dielectric heating adhesive according to the present embodiment may or may not contain an additive.
- the additive may be, for example, a tackifier, a plasticizer, a wax, a colorant, an antioxidant, an ultraviolet absorber, an antibacterial agent, or a coupling.
- Agents, viscosity modifiers, organic fillers, inorganic fillers and the like can be mentioned.
- Organic fillers and inorganic fillers as additives are different from dielectric fillers.
- the tackifier and the plasticizer can improve the melting characteristics and the adhesive characteristics of the high-frequency dielectric heating adhesive.
- the tackifier include rosin derivatives, polyterpene resins, aromatic-modified terpene resins, hydrides of aromatic-modified terpene resins, terpene phenol resins, kumaron inden resins, aliphatic petroleum resins, aromatic petroleum resins, and aromatics.
- Examples include hydrides of group petroleum resins.
- the plasticizer include petroleum-based process oils, natural oils, dialkyl dibasates, and low molecular weight liquid polymers.
- the petroleum-based process oil include paraffin-based process oils, naphthen-based process oils, aromatic process oils, and the like.
- Examples of the natural oil include castor oil, tall oil and the like.
- Examples of the dialkyl dibasic acid include dibutyl phthalate, dioctyl phthalate, and dibutyl adipate.
- Examples of the low molecular weight liquid polymer include liquid polybutene and liquid polyisoprene.
- the content of the additive in the high-frequency dielectric heating adhesive is usually 0.01 based on the total amount of the high-frequency dielectric heating adhesive. It is preferably 0% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more.
- the content of the additive in the high-frequency dielectric heating adhesive is preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 10% by mass or less.
- the high-frequency dielectric heating adhesive according to this embodiment preferably does not contain a solvent. According to the high-frequency dielectric heating adhesive that does not contain a solvent, the problem of VOC (Volatile Organic Compounds) caused by the adhesive used for adhesion to the adherend is unlikely to occur.
- VOC Volatile Organic Compounds
- the high-frequency dielectric heating adhesive according to the present embodiment does not contain carbon or a carbon compound containing carbon as a main component (for example, carbon black or the like) and a conductive substance such as metal.
- the high-frequency dielectric heating adhesive according to the present embodiment is, for example, carbon steel, ⁇ -iron, ⁇ -iron, ⁇ -iron, copper, iron oxide, brass, aluminum, iron-nickel alloy, iron-nickel-chromium alloy, carbon fiber. And preferably do not contain carbon black.
- the content of the conductive substance in the adhesive is independently 20% by mass or less based on the total amount of the adhesive. It is preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 1% by mass or less, and further preferably 0.1% by mass or less. preferable.
- the content of the conductive substance in the adhesive is particularly preferably 0% by mass.
- the total content of the thermoplastic resin (A) and the dielectric filler (B) in the high-frequency dielectric heating adhesive according to the present embodiment is preferably 80% by mass or more, and more preferably 90% by mass or more. It is preferably 99% by mass or more, and more preferably 99% by mass or more.
- the high-frequency dielectric heating adhesive according to the present embodiment can be produced, for example, by mixing the above-mentioned components.
- the high-frequency dielectric heating adhesive according to the present embodiment is an adhesive sheet, for example, each of the above components is premixed, kneaded using a known kneading device such as an extruder and a heat roll, and extruded. It can be manufactured by a known molding method such as calendar molding, injection molding, and casting molding. Among these exemplified molding methods, extrusion molding is preferable.
- the material of the adherend is not particularly limited.
- the material of the adherend may be any material of an organic material and an inorganic material (including a metal material and the like), and may be a composite material of an organic material and an inorganic material.
- the material of the adherend is preferably an organic material.
- the organic material as the material of the adherend include a plastic material and a rubber material.
- the plastic material include polypropylene resin, polyethylene resin, epoxy resin, polyurethane resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), polycarbonate resin (PC resin), polyamide resin (nylon 6 and nylon 66, etc.). , Polyester resin (polyethylene terephthalate (PET resin) and polybutylene terephthalate resin (PBT resin), etc.), polyacetal resin (POM resin), polymethylmethacrylate resin, polystyrene resin and the like.
- the rubber material examples include styrene-butadiene rubber (SBR), ethylene propylene rubber (EPR), and silicone rubber.
- the adherend may be a foaming material made of an organic material.
- the material of the adherend is a thermoplastic resin
- it is preferable that the thermoplastic resin contained in the adherend and the thermoplastic resin (A) contained in the high-frequency dielectric heating adhesive are different resins. In this case, it becomes easy to prevent damage to the adherend, so that the joining can be performed in a shorter time.
- the adherend examples include glass material, cement material, ceramic material, metal material and the like.
- the adherend may be a fiber reinforced resin (FRP) which is a composite material of the fiber and the above-mentioned plastic material.
- FRP fiber reinforced resin
- the plastic material in this fiber reinforced resin is, for example, polypropylene resin, polyethylene resin, polyurethane resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), polycarbonate resin (PC resin), polyamide resin (nylon 6 and nylon 66, etc.).
- Polyester resin polyethylene terephthalate (PET resin) and polybutylene terephthalate resin (PBT resin), etc.
- POM resin polyacetal resin
- polymethylmethacrylate resin epoxy resin, polystyrene resin, etc. It is a kind.
- fiber in the fiber reinforced resin include glass fiber, Kevlar fiber, carbon fiber and the like.
- the adherend has low conductivity.
- the plurality of adherends are made of the same material or different materials from each other.
- the shape of the adherend is not particularly limited.
- the adherend preferably has a surface on which the adhesive sheet can be bonded, and is preferably in the form of a sheet or a plate.
- the shapes and dimensions of the adherends may be the same or different from each other. It is preferable that the thickness of the adherend independently satisfies the relationship of the above-mentioned mathematical formula (Equation 3).
- the structure according to the present embodiment includes the high-frequency dielectric heating adhesive according to the present embodiment and three or more adherends. In the structure according to the present embodiment, three or more adherends are joined by the high-frequency dielectric heating adhesive according to the present embodiment.
- the structure according to the present embodiment is preferably a structure (for example, a laminated body) in which three or more adherends are laminated via a high-frequency dielectric heating adhesive.
- adherends may be bonded to each other with an adhesive having the same composition (adhesive for high frequency dielectric heating) or bonded to each other with an adhesive having a different composition (adhesive for high frequency dielectric heating).
- the composition of the high-frequency dielectric heating adhesive is appropriately selected from the viewpoints of the material of the adherend to which the high-frequency dielectric heating adhesive is in contact, the adhesive strength to the adherend, the bonding time, and the like. Is preferable.
- FIG. 1 shows a schematic cross-sectional view of the structure 1 as an example of the present embodiment.
- the structure 1 is between the first adherend 110, the second adherend 120 and the third adherend 130 as the three adherends, and the first adherend 110 and the second adherend 120.
- the first high-frequency dielectric heating adhesive 11 arranged and the second high-frequency dielectric heating adhesive 12 arranged between the second adherend 120 and the third adherend 130 are included.
- the first adherend 110, the first high-frequency dielectric heating adhesive 11, the second adherend 120, the second high-frequency dielectric heating adhesive 12, and the third adherend 130 are laminated in this order. It is a laminated body.
- the material of the adherend as the outermost layer in the laminated body is preferably an organic material.
- the material of the first adherend 110 and the third adherend 130 as the outermost layer is an organic material.
- the position and thickness of the high-frequency dielectric heating adhesive are not limited to the position and thickness shown in FIG.
- the shape, size, number, etc. of the adherend are not limited to the shape, size, number, etc. shown in FIG.
- the shape of the adherend may be a rectangular shape of the cut surface in the direction of gravity, or may be a shape having an inclination such as a triangle.
- the structure according to the present embodiment is not limited to a structure in which a plurality of adherends as shown in FIG. 1 are laminated via a high-frequency dielectric heating adhesive.
- the method for manufacturing the structure according to the present embodiment includes a step of arranging the high-frequency dielectric heating adhesive according to the present embodiment between three or more adherends and applying a high-frequency electric field to the high-frequency dielectric heating adhesive.
- the process includes joining three or more adherends.
- three or more adherends and a high-frequency dielectric heating adhesive are arranged between electrodes of a dielectric heating device, and three or more adherends and high-frequency dielectric heating are arranged. It is preferable to apply a high frequency electric field while pressurizing the adhesive with the electrode. By applying a high-frequency electric field while pressurizing with the electrodes in this way, it becomes easier to manufacture the structure in a shorter time.
- the manufacturing method using the high-frequency dielectric heating adhesive according to the present embodiment only a predetermined portion can be locally heated from the outside by the dielectric heating device. Therefore, even when the adherend is a large and complicated three-dimensional structure or a large and complicated three-dimensional structure and higher dimensional accuracy is required, the high-frequency dielectric heating adhesive according to the present embodiment is required.
- the production method using an agent is effective.
- the joining method according to one aspect of the present embodiment includes the following steps P1 and P2.
- Step P1 is a step of arranging the high-frequency dielectric heating adhesive according to the present embodiment between three or more adherends.
- the adherend and the high-frequency dielectric heating adhesive are alternately arranged, and the adherend is interposed via the high-frequency dielectric heating adhesive.
- the high-frequency dielectric heating adhesive may be sandwiched between a part of the adherends, at a plurality of locations between the adherends, or across the entire surface between the adherends. From the viewpoint of improving the adhesive strength between the adherends, it is preferable to sandwich the high-frequency dielectric heating adhesive over the entire joint surface between the adherends. Further, as one aspect of sandwiching the high-frequency dielectric heating adhesive in a part between the adherends, the high-frequency dielectric heating adhesive is arranged in a frame shape along the outer periphery of the joint surface between the adherends. An embodiment of sandwiching between adherends can be mentioned.
- the bonding strength between the adherends can be obtained, and the structure is compared with the case where the high-frequency dielectric heating adhesive is arranged over the entire joint surface. Can be made lighter. Further, according to one aspect in which the high-frequency dielectric heating adhesive is sandwiched between a part of the adherends, the amount of the high-frequency dielectric heating adhesive used can be reduced or the size can be reduced, so that the entire joint surface can be reduced. The high-frequency dielectric heating treatment time can be shortened as compared with the case where the high-frequency dielectric heating adhesive is arranged.
- Step P2 is a step of applying a high-frequency electric field to the high-frequency dielectric heating adhesive arranged between the adherends in step P1 to join three or more adherends.
- the frequency of the high frequency electric field to be applied is, for example, 3 MHz or more and 300 MHz or less.
- a high frequency electric field can be applied to the high frequency dielectric heating adhesive.
- FIG. 2 shows a schematic diagram illustrating a high-frequency dielectric heating process using the high-frequency dielectric heating adhesive and the dielectric heating device according to the present embodiment.
- the dielectric heating device 50 shown in FIG. 2 includes a first high frequency electric field application electrode 51, a second high frequency electric field application electrode 52, and a high frequency power supply 53.
- the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 are arranged so as to face each other.
- the first high frequency electric field application electrode 51 and the second high frequency electric field application electrode 52 have a pressing mechanism.
- first high frequency electric field application electrode 51 and second high frequency electric field application electrode 52 three or more adherends arranged between the electrodes and an adhesive for high frequency dielectric heating. It is also possible to apply a high frequency electric field while pressurizing and.
- FIG. 2 shows an example of a method of manufacturing the structure 1 (see FIG. 1) using the dielectric heating device 50.
- the dielectric heating device 50 By the dielectric heating device 50, the first adherend 110, the first high-frequency dielectric heating adhesive 11, the second adherend 120, and the second adherend are placed between the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52. 2
- the high-frequency dielectric heating adhesive 12 and the third adherend 130 can be pressure-treated.
- the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 form a pair of flat plate electrodes parallel to each other, such an electrode arrangement type may be referred to as a parallel plate type.
- a parallel plate type high frequency dielectric heating device for applying a high frequency electric field.
- the entire high frequency dielectric heating adhesive can be heated, and the adherend and the high frequency dielectric can be heated. Can be bonded to the heating adhesive in a short time.
- the dielectric heating device 50 has a first high-frequency dielectric heating adhesive 11 and a second sandwiched between the first adherend 110, the second adherend 120, and the third adherend 130. Dielectric heating treatment is performed via the high-frequency dielectric heating adhesive 12.
- the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 pressurize the first adherend 110, the second adherend 120, and the dielectric heating device 50.
- the third dielectric 130 is joined. It should be noted that, for example, three or more adherends may be joined by pressing only with the high-frequency dielectric heating adhesive and the weight of the adherend without performing the pressure treatment.
- the dispersed dielectric filler (not shown) absorbs high frequency energy.
- the dielectric filler functions as a heat generating source, and the heat generated by the dielectric filler melts the thermoplastic resin component, and even if the treatment is performed for a short time, the first adherend 110 and the second adherend are finally adhered.
- the body 120 and the third dielectric 130 can be firmly joined.
- first high frequency electric field application electrode 51 and the second high frequency electric field application electrode 52 have a press mechanism, they also function as a press device. Therefore, by pressurizing in the compression direction by the first high frequency electric field application electrode 51 and the second high frequency electric field application electrode 52, and by heating and melting the first high frequency dielectric heating adhesive 11 and the second high frequency dielectric heating adhesive 12.
- the first adherend 110, the second adherend 120, and the third adherend 130 can be joined more firmly.
- the case where the structure 1 shown in FIG. 1 is manufactured is described as an example, but the present invention is not limited to this example.
- the high-frequency dielectric heating conditions can be changed as appropriate, but the following conditions are preferable.
- the output of the high frequency electric field is preferably 10 W or more, more preferably 30 W or more, further preferably 50 W or more, and even more preferably 80 W or more.
- the output of the high frequency electric field is preferably 50,000 W or less, more preferably 20,000 W or less, further preferably 15,000 W or less, still more preferably 10,000 W or less. It is even more preferable that it is 1,000 W or less. If the output of the high-frequency electric field is 10 W or more, it is possible to prevent the problem that the temperature does not easily rise during the dielectric heating treatment, so that it is easy to obtain good bonding strength. If the output of the high-frequency electric field is 50,000 W or less, it is easy to prevent a problem that temperature control by dielectric heating treatment becomes difficult.
- the application time of the high frequency electric field is preferably 1 second or longer.
- the application time of the high frequency electric field is preferably 300 seconds or less, more preferably 240 seconds or less, further preferably 180 seconds or less, further preferably 120 seconds or less, and 90 seconds or less. Is even more preferable. If the application time of the high-frequency electric field is 1 second or more, it is possible to prevent the problem that the temperature does not easily rise during the dielectric heating treatment, so that it is easy to obtain a good adhesive force. If the application time of the high-frequency electric field is 300 seconds or less, it is easy to prevent problems such as a decrease in the manufacturing efficiency of the structure, an increase in the manufacturing cost, and further thermal deterioration of the adherend.
- the frequency of the high frequency electric field to be applied is preferably 1 kHz or more, more preferably 1 MHz or more, more preferably 3 MHz or more, further preferably 5 MHz or more, and more preferably 10 MHz or more. More preferred.
- the frequency of the high frequency electric field to be applied is preferably 300 MHz or less, more preferably 100 MHz or less, further preferably 80 MHz or less, and even more preferably 50 MHz or less.
- the industrial frequency bands 13.56 MHz, 27.12 MHz or 40.68 MHz assigned by the International Telecommunication Union are also used in the manufacturing method and joining method by high frequency dielectric heating of the present embodiment.
- the high-frequency dielectric heating adhesive of the present embodiment satisfies the melt volume rate of 1 cm 3/10 min or more and 300 cm 3/10 min or less within the above-mentioned lower limit temperature TL or more and upper limit temperature TU or less.
- the heating adhesive can obtain appropriate fluidity. Therefore, three or more adherends can be joined at one time in a short time, and the occurrence of misalignment between the adherends can be suppressed.
- Adhesives for high-frequency dielectric heating are superior in water resistance and moisture resistance to general adhesives.
- the high-frequency dielectric heating adhesive according to this embodiment is locally heated by applying a high-frequency electric field. Therefore, according to the high-frequency dielectric heating adhesive according to the present embodiment, it is easy to prevent a problem that the entire adherend is damaged at the time of joining with the adherend.
- the high-frequency dielectric heating treatment is not limited to the dielectric heating device in which the electrodes described in the above embodiment are arranged to face each other, and a lattice electrode type high-frequency dielectric heating device may be used.
- the lattice electrode type high-frequency dielectric heating device has lattice electrodes in which electrodes of the first polarity and electrodes of the second polarity opposite to the electrodes of the first polarity are alternately arranged on the same plane at regular intervals. ..
- an embodiment using a dielectric heating device in which electrodes are arranged facing each other is exemplified for simplification.
- thermoplastic resin (A) and the dielectric filler (B) shown in Table 1 were premixed.
- the premixed material was supplied to the hopper of a 30 mm ⁇ twin-screw extruder, the cylinder set temperature and the die temperature were appropriately adjusted according to the type of the thermoplastic resin (A), and the premixed material was melt-kneaded. After cooling the melt-kneaded material, the material was cut to prepare granular pellets.
- the prepared granular pellets were put into the hopper of a single-screw extruder equipped with a T-die, and the cylinder temperature and the die temperature were appropriately adjusted according to the type of the thermoplastic resin (A), and the film was transferred from the T-die.
- the sheet-shaped high-frequency dielectric heating adhesive (high-frequency dielectric heating adhesive sheet) having a thickness of 400 ⁇ m according to Examples 1 to 6 and Comparative Examples 1 to 3 is used. Each was made.
- thermoplastic resin (A), the dielectric filler (B) and the adherend shown in Table 1 is as follows.
- LDPE-1 Low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., trade name "Sumikasen L420", MFR: 3.5 g / 10 min (based on JIS K 7210-1: 2014))
- LDPE-2 Low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., trade name "Sumikasen L705", MFR: 7.0 g / 10 min (based on JIS K 7210-1: 2014))
- LDPE-3 Low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., trade name "Sumikasen G801", MFR: 20 g / 10 min (based on JIS K 7210-1: 2014))
- LDPE-4 Low density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., trade name "Sumikasen G807”, MFR: 75g
- volume average particle size of dielectric filler The particle size distribution of the dielectric filler was measured by the laser diffraction / scattering method. From the results of the particle size distribution measurement, the volume average particle size was calculated according to JIS Z 8819-2: 2001. The calculated volume average particle size of zinc oxide (ZnO) was 11 ⁇ m.
- a plate-shaped adherend having a length of 75 mm, a width of 25 mm, and a thickness of 2 mm was produced using a glass fiber polypropylene resin plate.
- the flow start temperature TF2 of this adherend is 183 ° C.
- the dielectric property DP2 of this adherend is 0.000.
- the softening temperature and the flow start temperature of the high-frequency dielectric heating adhesive were measured using a descent type flow tester (manufactured by Shimadzu Corporation, model number "CFT-100D"). Using a die with a hole shape of ⁇ 2.0 mm, a length of 5.0 mm, and a cylinder with an inner diameter of 11.329 mm with a load of 5.0 kg, while raising the temperature of the measurement sample at a heating rate of 10 ° C./min, The stroke displacement rate (mm / min) that fluctuates with the temperature rise was measured to obtain a temperature-dependent chart of the stroke displacement rate of the sample. In this chart, the temperature of the peak obtained on the low temperature side was defined as the softening temperature.
- the flow start temperature of the adherend was measured in the same manner as described above by cutting the adherend into pieces having a size of about 2 mm ⁇ 2 mm ⁇ 2 mm to prepare a measurement sample.
- the thermal decomposition temperature of the adhesive for high frequency dielectric heating was measured using a thermal analysis measuring device (manufactured by Shimadzu Corporation, thermal analyzer TG-DTA simultaneous measuring device, model number "DTG-60"). The measurement conditions were heating from 30 ° C. to 500 ° C. at a heating rate of 10 ° C./min under an air atmosphere. The temperature at the peak top of the exothermic peak appearing on the low temperature side of the DTA curve was defined as the thermal decomposition temperature (unit: ° C.) in the vicinity of the temperature at which the weight loss appearing in the obtained TG curve began to occur.
- MVR melt volume rate
- the melt volume rate (MVR) of the high-frequency dielectric heating adhesive was measured using a descent type flow tester (manufactured by Shimadzu Corporation, model number "CFT-100D").
- the measurement conditions were a die with a hole shape of ⁇ 2.0 mm, a length of 5.0 mm, and a cylinder with an inner diameter of 11.329 mm, and the measurement load was as follows.
- the measured load at a temperature 10 ° C higher than the softening temperature of the high-frequency dielectric heating adhesive (lower limit temperature TL: softening temperature (° C) + 10 ° C) is 20 kg, which is 10 ° C higher than the thermal decomposition temperature of the high-frequency dielectric heating adhesive.
- the measured load at a low temperature (upper limit temperature TU: thermal decomposition temperature (° C.) -10 ° C.) was 5 kg.
- MVR was measured at the lower limit temperature TL and the upper limit temperature TU.
- the thickness of 25 randomly selected high-frequency dielectric heating adhesive sheets was measured under the condition of 23 ° C.
- the thickness was measured using a constant pressure thickness measuring instrument manufactured by Teclock Co., Ltd. (model number: "PG-02J", standard: JIS K 6783, JIS Z 1702, and JIS Z 1709). Based on the measurement results, the average thickness T ave , the maximum thickness T max , and the minimum thickness T min were calculated.
- the thickness accuracy on the plus side was calculated by the following formula (Equation 4A), and the thickness accuracy on the minus side was calculated by the following formula (Equation 4B). The thickness accuracy is displayed based on the larger value of the thickness accuracy on the plus side and the thickness accuracy on the minus side.
- the thickness accuracy on the plus side is + 3% and the value of the thickness accuracy on the minus side is -2%
- the thickness accuracy is displayed as ⁇ 3%.
- the adhesive sheet was cut into a size of 30 mm ⁇ 30 mm.
- the dielectric material test fixture 16453A manufactured by Agent
- the RF impedance material analyzer E4991A manufactured by Agent
- the parallel plate method was used under the condition of a frequency of 40.68 MHz at 23 ° C.
- the relative permittivity ( ⁇ 'r) and the dielectric loss tangent (tan ⁇ ) were measured, respectively. Based on the measurement results, the value of the dielectric property (tan ⁇ / ⁇ 'r) was calculated.
- a structure ST was produced by laminating three adherends WK1, WK2, and WK3.
- a part of the electrode and the adhesive sheet is shaded so that the electrode and the adhesive sheet can be easily distinguished.
- the produced high-frequency dielectric heating adhesive adheresive sheet
- a plate-shaped adherend WK1 and WK3 having a length of 75 mm, a width of 25 mm and a thickness of 2 mm and a plate-shaped adherend WK2 having a length of 55 mm, a width of 25 mm and a thickness of 2 mm were laminated.
- the adherend is the above-mentioned glass fiber polypropylene resin plate.
- the adhesive sheets AS1 and AS2 are positioned at the end portions of the adherends WK1 and WK3 in the length direction and in the center of the adherend WK2 in the length direction. Placed in.
- the materials of the adherends WK1, WK2, and WK3 were all the same.
- the adherend and the adhesive sheet laminated in this way were fixed between the electrodes ELD1 and ELD2 of the high-frequency dielectric heating device (manufactured by Yamamoto Vinita, product name "YRP-400T-A").
- the shape of the pressing surface of the electrodes ELD1 and ELD2 was a square having a size of 25 mm ⁇ 25 mm.
- the adhesive sheets AS1 and AS2 and the electrodes ELD1 and ELD2 were fixed so as to overlap each other.
- the adhesiveness of the prepared test piece for adhesiveness evaluation was evaluated according to the following criteria.
- the tensile shear force (unit: MPa) as the adhesive force was measured using the test piece for adhesiveness evaluation prepared by using the high-frequency dielectric heating adhesive of each example.
- a universal tensile tester manufactured by Instron, product name "Instron 5581" was used for the measurement of the tensile shear force.
- the tensile speed in the measurement of the tensile shear force was 10 mm / min.
- the adherend WK1 and the adherend WK3 were sandwiched between chucks of a testing machine, and the tensile shear force was measured according to JIS K 6850: 1999.
- adherend B a plate-shaped adherend having a length of 12.5 mm, a width of 25 mm, and a thickness of 2 mm was prepared.
- the adherend B was cut in half diagonally of the above-mentioned length and thickness when viewed from the side surface to obtain the adherend WK4 and the adherend WK5.
- the adherend WK4 and the adherend WK5 obtained by halving have an inclined surface and an inclination angle of about 9.1 °.
- the adherend A and the adherend B are made of the same material, and are the above-mentioned glass fiber polypropylene resin plate.
- the adherend WK6, the adhesive sheet AS4, the adherend WK5, the adhesive sheet AS3, and the adherend WK4 were stacked in this order.
- both ends of the adherends WK4, WK5, and WK6 in the length direction and both ends of the adhesive sheets AS3 and AS4 in the length direction were arranged at the same positions. Further, the adhesive sheet AS3 was superposed on the inclined surface of the adherend WK5, and the inclined surface of the adherend WK4 was laminated on the adhesive sheet AS3 so as to face the inclined surface of the adherend WK5. The adherend and the adhesive sheet laminated in this way were fixed between the electrodes ELD1 and ELD2 of the high-frequency dielectric heating device (manufactured by Yamamoto Vinita, product name "YRP-400T-A").
- the shape of the pressing surface of the electrodes ELD1 and ELD2 was a square having a size of 25 mm ⁇ 25 mm.
- the adhesive sheets AS3 and AS4 and the electrodes ELD1 and ELD2 were fixed so as to overlap each other.
- a high-frequency electric field is applied by the high-frequency power supply HF connected to the electrodes ELD1 and ELD2 under the following high-frequency electric field application conditions to bond the adhesive sheet and the adherend, and a test piece for adhesiveness evaluation. (Structure ST2) was produced.
- the pressing pressure when a high-frequency electric field is applied is the pressure applied to the joint portion of the adherend.
- ⁇ High frequency electric field application condition Frequency: 40.68MHz Output: 50W Application time: 20 seconds Pressing pressure: 0.75 MPa
- the total was set to (L1 + L2).
- the horizontal distances L1 and L2, which represent the deviations between the adherends, were measured as follows. As shown in FIG.
- the high-frequency dielectric heating adhesives of Examples 1 to 6 were able to bond three adherends at once in a short time, and were able to suppress displacement between the adherends.
- three adherends are bonded with a bonding strength of 1 MPa or more, and there is little deviation between the adherends.
- Comparative Examples 1 and 3 since the MVR of the high-frequency dielectric heating adhesive exceeds 300 cm 3/10 min, the fluidity of the adhesive when dielectric heating is bonded is too large. Therefore, it is considered that the adherends were displaced from each other when the adherends were joined using the adhesives of Comparative Examples 1 and 3.
- the glass fiber polypropylene resin plate of the adherend has a flow start temperature TF2 of 183 and a dielectric property DP2 of 0.000. Therefore, the flow start temperature difference TF2-TF1 is the difference between the flow start temperature TF2 of the adherend and the flow start temperature TF1 of the high-frequency dielectric heating adhesive of each example. For example, in Example 1, from Table 1, since the flow start temperature TF1 of the high-frequency dielectric heating adhesive is 121 ° C., the flow start temperature difference TF2-TF1 is 62 ° C. Further, the difference in dielectric properties DP1-DP2 becomes the same value as the value of the high-frequency dielectric heating adhesive as a result.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
また、特許文献2に記載の積層鉄芯(積層体)を製造する際の高周波の印加時間が、2分又は4分であり、鋼板(被着体)同士を短時間で接合できていない。
TL=前記高周波誘電加熱用接着剤の軟化温度TM+10℃ …(数11)
TU=前記高周波誘電加熱用接着剤の熱分解温度TD-10℃ …(数12)
但し、前記下限温度TLでのメルトボリュームレートの測定荷重は20kgであり、
前記上限温度TUでのメルトボリュームレートの測定荷重は5kgである。
-5≦TF2-TF1 …(数2)
0<DP1-DP2 …(数1)
(誘電特性DP1、及び誘電特性DP2は、それぞれ、前記高周波誘電加熱用接着剤、及び前記3つ以上の被着体の誘電特性(tanδ/ε’r)の値であり、
tanδは、23℃かつ周波数40.68MHzにおける誘電正接であり、
ε’rは、23℃かつ周波数40.68MHzにおける比誘電率である。)
TS1<TS2 …(数3)
本実施形態に係る高周波誘電加熱用接着剤は、熱可塑性樹脂と、高周波電界の印加により発熱する誘電フィラーとを含む。高周波電界とは、高周波で向きが反転する電界である。
TL=前記高周波誘電加熱用接着剤の軟化温度TM+10℃ …(数11)
TU=前記高周波誘電加熱用接着剤の熱分解温度TD-10℃ …(数12)
但し、前記下限温度TLでのメルトボリュームレートの測定荷重は20kgであり、
前記上限温度TUでのメルトボリュームレートの測定荷重は5kgである。
本実施形態に係る高周波誘電加熱用接着剤において、高周波誘電加熱用接着剤のメルトボリュームレート(以下、MVRと称する場合がある)は、軟化温度TM+10℃、および熱分解温度TD-10℃において測定した値が、1cm3/10min以上、300cm3/10min以下の範囲内を満たしている。軟化温度TM+10℃は、高周波誘電加熱用接着剤が溶融し始め、被着体との接合性が発現し始める温度を表していると考えられる。熱分解温度TD-10℃は、高周波誘電加熱用接着剤中における熱可塑性樹脂の熱分解が開始せず、高周波誘電加熱用接着剤中の熱分解によって、被着体との接合性に対して影響を及ぼし難い温度を表している。つまり、これらの温度は、高周波誘電加熱用接着剤と被着体との接合性が確実に発生する温度と、高周波誘電加熱用接着剤と被着体との接合強度の劣化に影響し難い温度とを表している。本明細書において、単位中の「min」は、「分」の略称である。
上記各測定温度において、本実施形態に係る高周波誘電加熱用接着剤のMVRが、300cm3/10minを超えると、高周波誘電加熱用接着剤の流動性が高くなりすぎるため、3つ以上の被着体を一度に接合したときに、被着体同士にズレが発生しやすくなる。
本実施形態に係る高周波誘電加熱用接着剤のMVRは、軟化温度TM+10℃、および熱分解温度TD-10℃において、275cm3/10min以下であることが好ましく、250cm3/10min以下であることがより好ましく、225cm3/10min以下であることがさらに好ましく、200cm3/10min以下であることがよりさらに好ましく、150cm3/10min以下であることがよりさらに好ましく、100cm3/10min以下であることがよりさらに好ましく、50cm3/10min以下であることがよりさらに好ましく、20cm3/10min以下であることがよりさらに好ましく、10cm3/10min以下であることが特に好ましい。
本実施形態に係る高周波誘電加熱用接着剤のMVRが、2cm3/10min以上であれば、より短時間で、3つ以上の被着体を一度に接合できるとともに、より十分な接合強度が得られやすくなる。
本実施形態に係る高周波誘電加熱用接着剤のMVRが、275cm3/10min以下であれば、被着体同士のズレの発生がより抑制されやすくなる。
本実施形態に係る高周波誘電加熱用接着剤の軟化温度TMは、70℃以上であることが好ましく、80℃以上であることがより好ましく、90℃以上であることがさらに好ましい。
本実施形態に係る高周波誘電加熱用接着剤の軟化温度TMは、200℃以下であることが好ましく、180℃以下であることがより好ましく、160℃以下であることがさらに好ましい。
高周波誘電加熱用接着剤の軟化温度TMが70℃以上であれば(好ましくは80℃以上であれば)、被着体同士のズレの発生がより抑制されやすくなる。また、当該高周波誘電加熱用接着剤を用いて製造した構造体は、一般生活における耐熱性を得やすい。
高周波誘電加熱用接着剤の軟化温度TMが200℃以下であれば、接合時に高周波誘電加熱用接着剤を溶融させるための時間が長くなることを防ぎやすく、高周波誘電加熱用接着剤と被着体との接合強度も得やすい。
軟化温度は、後述する実施例の項目において説明する方法により測定できる。
本実施形態に係る高周波誘電加熱用接着剤の熱分解温度TDは、180℃以上であることが好ましく、200℃以上であることがより好ましく、220℃以上であることがさらに好ましい。
高周波誘電加熱用接着剤の熱分解温度TDが180℃以上であれば、当該高周波誘電加熱用接着剤を用いて製造した構造体は、一般生活における耐熱性を得やすい。また、高周波電界印加時に十分な出力を印加できるため、高周波誘電加熱用接着剤と被着体とを短時間で接合しやすい。
本実施形態に係る高周波誘電加熱用接着剤の熱分解温度TDの上限は特に限定されず、例えば、600℃以下であってもよく、500℃以下であってもよく、400℃以下であってもよい。
熱分解温度は、JIS K 7120:1987に準拠して測定することができる。本実施形態に係る高周波誘電加熱用接着剤の熱分解温度は、例えば、DTA曲線の低温側で観測される発熱ピークのピークトップに相当する温度である。具体的には、後述する実施例の項目において説明する方法により測定できる。
本実施形態に係る高周波誘電加熱用接着剤の流動開始温度TF1は、80℃以上であることが好ましく、90℃以上であることがより好ましく、100℃以上であることがさらに好ましい。
本実施形態に係る高周波誘電加熱用接着剤の流動開始温度TF1は、200℃以下であることが好ましく、180℃以下であることがより好ましく、160℃以下であることがさらに好ましく、140℃以下であることがよりさらに好ましい。
高周波誘電加熱用接着剤の流動開始温度TF1が80℃以上であれば、被着体同士のズレの発生が抑制されやすくなる。また、当該高周波誘電加熱用接着剤を用いて製造した構造体は、一般生活における耐熱性を得やすい。
高周波誘電加熱用接着剤の流動開始温度TF1が200℃以下であれば、接合時に高周波誘電加熱用接着剤を溶融させるための時間が長くなることを防ぎやすく、高周波誘電加熱用接着剤と被着体との接合強度も得やすい。
流動開始温度は、後述する実施例の項目において説明する方法により測定できる。
高周波誘電加熱用接着剤の流動開始温度TF1と、被着体の流動開始温度TF2との関係について説明する。
3つ以上の被着体がいずれも流動開始温度を有する場合、それぞれの被着体の流動開始温度と、高周波誘電加熱用接着剤の流動開始温度とが前記数式(数2)の関係を満たすことが好ましい。例えば、いずれも流動開始温度を有する3つの被着体を接合させる場合は、当該3つの被着体のそれぞれの流動開始温度が、数式(数2)の関係を満たすことが好ましい。例えば、3つの被着体の流動開始温度TF2が、互いに異なるTF2A(℃)、TF2B(℃)、及びTF2C(℃)の場合は、下記数式(数2A)、(数2B)及び数(数2C)を満たすことが好ましい。
-5≦TF2A-TF1 …(数2A)
-5≦TF2B-TF1 …(数2B)
-5≦TF2C-TF1 …(数2C)
また、3つ以上の被着体の少なくともいずれかが流動開始温度を有さない場合、高周波誘電加熱用接着剤は、当該流動開始温度を有さない被着体に対して数式(数2)の関係を満たさなくてよい。
0≦TF2-TF1 …(数2-1)
5≦TF2-TF1 …(数2-2)
10≦TF2-TF1 …(数2-3)
15≦TF2-TF1 …(数2-4)
20≦TF2-TF1 …(数2-5)
30≦TF2-TF1 …(数2-6)
40≦TF2-TF1 …(数2-7)
TF2-TF1≦1100 …(数2-8)
TF2-TF1≦300 …(数2-9)
TF2-TF1≦200 …(数2-10)
TF2-TF1≦100 …(数2-11)
流動開始温度を有する被着体の流動開始温度TF2は、1200℃以下であることが好ましく、400℃以下であることがより好ましい。
被着体が、例えば、セラミック又は硬化性樹脂などで構成されている場合には、被着体の流動開始温度TF2の上限値がない。
被着体の流動開始温度TF2が90℃以上であれば、被着体の接合時に、被着体の形状を損なうことなく接合し易くなる。
高周波誘電加熱用接着剤の誘電特性DP1と、被着体の誘電特性DP2との関係について説明する。例えば、高周波誘電加熱用接着剤を用いて3つの被着体を接合させる場合、高周波誘電加熱用接着剤の誘電特性DP1は、当該3つの被着体のそれぞれの誘電特性DP2に対して、数式(数1)の関係を満たすことが好ましい。
0<DP1-DP2 …(数1)
(誘電特性DP1、及び誘電特性DP2は、それぞれ、高周波誘電加熱用接着剤、及び3つ以上の被着体の誘電特性(tanδ/ε’r)の値であり、tanδは、23℃かつ周波数40.68MHzにおける誘電正接であり、ε’rは、23℃かつ周波数40.68MHzにおける比誘電率である。)
0<DP1-DP2A …(数1A)
0<DP1-DP2B …(数1B)
0<DP1-DP2C …(数1C)
0.005≦DP1-DP2 …(数1-1)
0.01≦DP1-DP2 …(数1-2)
DP1-DP2≦0.1 …(数1-3)
DP1-DP2≦0.05 …(数1-4)
本実施形態に係る高周波誘電加熱用接着剤の誘電特性DP1は、0.1以下であることが好ましく、0.08以下であることがより好ましく、0.05以下であることがさらに好ましく、0.03以下であることが特に好ましい。
高周波誘電加熱用接着剤の誘電特性DP1が、0.1以下であれば、過熱を防ぎ易くなり、被着体の高周波誘電加熱用接着剤と接する部分の損傷が起き難い。
被着体の誘電特性DP2が、0.015以下であれば、被着体の発熱を抑制できるため、接合する際に被着体の形状を損なうことなく接合し易くなる。
被着体の誘電特性DP2は、通常、0以上である。
高周波誘電加熱用接着剤及び被着体の誘電特性としての誘電正接(tanδ)、及び比誘電率(ε’r)は、インピーダンスマテリアルアナライザを用いて、簡便かつ正確に測定することができる。
なお、高周波誘電加熱用接着剤及び被着体の誘電特性の測定方法の詳細は、次のとおりである。まず、高周波誘電加熱用接着剤及び被着体の測定用シートを得る。構造体から測定用シートを得る必要がある場合は、構造体から切り出したり、削り出したりすることにより、均一な厚さの測定用シートを得る。シート化されていない高周波誘電加熱用接着剤、例えば、ペレット状の高周波誘電加熱用接着剤については、熱プレス機などでシート化することにより測定用シートを得る。測定用シートの厚さは、例えば、10μm以上、2mm以下である。このようにして得たシートについて、RFインピーダンスマテリアルアナライザE4991A(Agilent社製)を用いて、23℃における周波数40.68MHzの条件下、比誘電率(ε’r)、及び誘電正接(tanδ)をそれぞれ測定し、誘電特性(tanδ/ε’r)の値を算出する。
TS1<TS2 …(数3)
本実施形態に係る高周波誘電加熱用接着剤が接着シートである場合、前記数式(数3)の関係を満たすことにより、高周波電界の印加時に接着シートから発生する熱が過剰にならず、被着体への熱ダメージをより抑えることができる。
接着シートの厚さTS1が5μm以上であれば、被着体と接着する際に、接着シートが被着体の凹凸に追従しやすく、接着強度が発現しやすくなる。
接着シートの厚さTS1の上限は、特に限定されない。接着シートの厚さが増すほど、接着シートと被着体とを接着して得られる構造体全体の重量も増加するため、接着シートは、実使用上問題ない範囲の厚さであることが好ましい。接着シートの実用性及び成形性も考慮すると、本実施形態に係る接着シートの厚さTS1は、2000μm以下であることが好ましく、1000μm以下であることがより好ましく、600μm以下であることがさらに好ましい。
本実施形態に係る接着シートの厚さ精度が±10%以内であることにより、接合を行う際に積層体を接合装置に安定して設置することができる。
また、高周波電界の印加時に接着シート面に圧力が均一に加わるため、積層体のずれや変形を抑えることができる。
接着シートの厚さ精度は、後述する実施例の項目において説明する方法により算出できる。
接着シートの厚さ精度は、通常、0%以上である。
(熱可塑性樹脂)
熱可塑性樹脂(A)の種類は、特に制限されない。
熱可塑性樹脂(A)は、例えば、融解し易いとともに、所定の耐熱性を有する等の観点から、ポリオレフィン系樹脂、スチレン系樹脂、ポリアセタール系樹脂、ポリカーボネート系樹脂、アクリル系樹脂、ポリアミド系樹脂、ポリイミド系樹脂、ポリ酢酸ビニル系樹脂、フェノキシ系樹脂及びポリエステル系樹脂からなる群から選択される少なくとも一種であることが好ましい。
本明細書において、ポリオレフィン系樹脂は、極性部位を有するポリオレフィン系樹脂及び極性部位を有さないポリオレフィン系樹脂を含み、極性部位の有無を特定する場合に、極性部位を有するポリオレフィン系樹脂又は極性部位を有さないポリオレフィン系樹脂のように記載される。
熱可塑性樹脂(A)としてのポリオレフィン系樹脂は、例えば、ポリエチレン、ポリプロピレン、ポリブテン及びポリメチルペンテン等のホモポリマーからなる樹脂、並びにエチレン、プロピレン、ブテン、ヘキセン、オクテン及び4-メチルペンテン等からなる群から選択されるモノマーの共重合体からなるα-オレフィン樹脂等が挙げられる。熱可塑性樹脂(A)としてのポリオレフィン系樹脂は、一種単独の樹脂でもよいし、二種以上の樹脂の組み合わせでもよい。
極性部位を有するポリオレフィン系樹脂における極性部位は、ポリオレフィン系樹脂に対して極性を付与できる部位であれば特に限定されない。極性部位を有するポリオレフィン系樹脂は、被着体に対して高い接着力を示すので好ましい。
極性部位を有するポリオレフィン系熱可塑性樹脂は、オレフィン系モノマーと極性部位を有するモノマーとの共重合体であってもよい。また、極性部位を有するポリオレフィン系熱可塑性樹脂は、オレフィン系モノマーの重合によって得られたオレフィン系ポリマーに極性部位を付加反応等の変性により導入させた樹脂でもよい。
オレフィン系モノマーは、機械的強度に優れ、安定した接着特性が得られるという観点から、エチレン及びプロピレンの少なくともいずれかであることが好ましい。
極性部位を有するポリオレフィン系樹脂におけるオレフィン由来の構成単位は、エチレン又はプロピレンに由来する構成単位であることが好ましい。
本実施形態に係る高周波誘電加熱用接着剤において、熱可塑性樹脂(A)のメルトフローレートは、100g/10min以下であることが好ましく、90g/10min以下であることがより好ましく、80g/10min以下であることがさらに好ましく、50g/10min以下であることがよりさらに好ましく、30g/10min以下であることがよりさらに好ましく、15g/10min以下であることが特に好ましい。
高周波誘電加熱用接着剤のMFRが0.5g/10min以上であれば、流動性が維持でき、膜厚精度が得られ易く、例えば、押出成形により成膜したときの膜厚精度が得られ易い。高周波誘電加熱用接着剤のMFRが100g/10min以下であれば、造膜性が得られやすい。例えば、MFRが50g/10min以下であれば、押出成形により成膜したときの造膜性がより向上しやすい。
誘電フィラー(B)は、高周波電界の印加により発熱するフィラーである。
誘電フィラー(B)は、周波数域が3MHz以上、300MHz以下の高周波電界を印加した時に発熱するフィラーであることが好ましい。誘電フィラー(B)は、周波数域3MHz以上、300MHz以下のうち、例えば、周波数13.56MHz、27.12MHz又は40.68MHz等の高周波電界の印加により発熱するフィラーであることが好ましい。
誘電フィラー(B)は、酸化亜鉛、炭化ケイ素(SiC)、アナターゼ型酸化チタン、チタン酸バリウム、チタン酸ジルコン酸バリウム、チタン酸鉛、ニオブ酸カリウム、ルチル型酸化チタン、水和ケイ酸アルミニウム、アルカリ金属の水和アルミノケイ酸塩等の結晶水を有する無機材料又はアルカリ土類金属の水和アルミノケイ酸塩等の結晶水を有する無機材料等の一種単独又は二種以上の組み合わせが好適である。
また、誘電フィラー(B)としての酸化チタンは、アナターゼ型酸化チタン及びルチル型酸化チタンの少なくともいずれかであることが好ましく、誘電特性に優れるという観点から、アナターゼ型酸化チタンであることがより好ましい。
高周波誘電加熱用接着剤中の誘電フィラー(B)の体積含有率は、5体積%以上であることが好ましく、8体積%以上であることがより好ましく、10体積%以上であることがさらに好ましい。
高周波誘電加熱用接着剤中の誘電フィラー(B)の体積含有率は、50体積%以下であることが好ましく、40体積%以下であることがより好ましく、35体積%以下であることがさらに好ましく、25体積%以下であることがよりさらに好ましい。
高周波誘電加熱用接着剤中の誘電フィラー(B)の体積含有率が5体積%以上であることで、発熱性が向上し、高周波誘電加熱用接着剤と被着体とを強固に接合し易い。
高周波誘電加熱用接着剤中の誘電フィラー(B)の体積含有率が50体積%以下であることで、接着剤の強度低下を防ぐことができ、その結果、当該接着剤を用いることにより接合強度の低下を防ぐことができる。また、本実施形態に係る高周波誘電加熱用接着剤が接着シートである場合、接着シート中の誘電フィラー(B)の体積含有率が50体積%以下であることで、シートとしてのフレキシブル性を得やすく、靱性の低下も防止しやすくなるので、後工程で高周波誘電加熱接着シートを所望の形状に加工しやすい。
誘電フィラー(B)の体積平均粒子径は、1μm以上であることが好ましく、2μm以上であることがより好ましく、3μm以上であることがさらに好ましい。
誘電フィラー(B)の体積平均粒子径は、30μm以下であることが好ましく、25μm以下であることがより好ましく、20μm以下であることがさらに好ましい。
誘電フィラー(B)の体積平均粒子径が1μm以上であることで、高周波誘電加熱用接着剤は、高周波電界の印加時に高い発熱性能を発現し、接着層は、被着体と短時間で強固に接着できる。
誘電フィラー(B)の体積平均粒子径が30μm以下であることで、高周波誘電加熱用接着剤は、高周波電界の印加時に高い発熱性能を発現し、接着層は、被着体と短時間で強固に接着できる。また、本実施形態に係る高周波誘電加熱用接着剤が接着シートである場合、誘電フィラー(B)の体積平均粒子径が30μm以下であることで、高周波誘電加熱接着シートの強度低下を防止できる。
TS1/DFは、1以上であることが好ましく、2以上であることがより好ましく、5以上であることがさらに好ましく、10以上であることがよりさらに好ましく、20以上であることがさらになお好ましい。TS1/DFが1以上であれば、接着時に誘電フィラー(B)と被着体とが接触することに起因する接合強度の低下を防止できる。
TS1/DFは、2500以下であることが好ましく、2000以下であることがより好ましく、1750以下であることがさらに好ましく、1000以下であることがよりさらに好ましく、500以下であることがよりさらに好ましく、100以下であることがよりさらに好ましく、50以下であることがさらになお好ましい。TS1/DFが2500以下であれば、高周波誘電加熱接着シートの作製時に、シート製造装置への負荷を抑制できる。
本実施形態に係る高周波誘電加熱用接着剤は、添加剤を含んでいてもよいし、添加剤を含んでいなくてもよい。
粘着付与剤としては、例えば、ロジン誘導体、ポリテルペン樹脂、芳香族変性テルペン樹脂、芳香族変性テルペン樹脂の水素化物、テルペンフェノール樹脂、クマロン・インデン樹脂、脂肪族石油樹脂、芳香族石油樹脂、及び芳香族石油樹脂の水素化物が挙げられる。
可塑剤としては、例えば、石油系プロセスオイル、天然油、二塩基酸ジアルキル、及び低分子量液状ポリマーが挙げられる。石油系プロセスオイルとしては、例えば、パラフィン系プロセスオイル、ナフテン系プロセスオイル、及び芳香族系プロセスオイル等が挙げられる。天然油としては、例えば、ひまし油、及びトール油等が挙げられる。二塩基酸ジアルキルとしては、例えば、フタル酸ジブチル、フタル酸ジオクチル、及びアジピン酸ジブチル等が挙げられる。低分子量液状ポリマーとしては、例えば、液状ポリブテン、及び液状ポリイソプレン等が挙げられる。
接着剤中の導電性物質の含有率は、0質量%であることが特に好ましい。
接着剤中の導電性物質の含有率が20質量%以下であれば、誘電加熱処理した際に電気絶縁破壊して接着部及び被着体の炭化という不具合を防止し易くなる。
本実施形態に係る高周波誘電加熱用接着剤は、例えば、上述の各成分を混合することにより製造できる。本実施形態に係る高周波誘電加熱用接着剤が接着シートである場合、例えば、上述の各成分を予備混合し、押出機、及び熱ロール等の公知の混練装置を用いて混練し、押出成形、カレンダー成形、インジェクション成形、及びキャスティング成形等の公知の成形方法により製造できる。これら例示した成形方法の中でも、押出成形が好ましい。
被着体の材質は、特に限定されない。被着体の材質は、有機材料、及び無機材料(金属材料等を含む。)のいずれの材料でもよく、有機材料と無機材料との複合材料でもよい。
本実施形態に係る構造体は、本実施形態に係る高周波誘電加熱用接着剤と、3つ以上の被着体とを含む。本実施形態に係る構造体において、3つ以上の被着体が本実施形態に係る高周波誘電加熱用接着剤により接合されている。本実施形態に係る構造体は、3つ以上の被着体が高周波誘電加熱用接着剤を介して積層された構造体(例えば、積層体)であることが好ましい。
構造体1は、3つの被着体としての第1被着体110、第2被着体120及び第3被着体130と、第1被着体110及び第2被着体120の間に配置された第1高周波誘電加熱用接着剤11と、第2被着体120及び第3被着体130の間に配置された第2高周波誘電加熱用接着剤12と、を含む。構造体1は、第1被着体110、第1高周波誘電加熱用接着剤11、第2被着体120、第2高周波誘電加熱用接着剤12及び第3被着体130が、この順に積層された積層体である。
本実施形態に係る構造体において、被着体の形状、サイズ及び数等は、図1に示された形状、サイズ及び数等に限定されない。例えば、被着体の形状は、重力方向の切断面の形状が矩形であってもよく、三角形等の傾斜を有する形状であってもよい。
本実施形態に係る構造体は、図1に示されたような複数の被着体が高周波誘電加熱用接着剤を介して積層された構造体に限定されない。
本実施形態に係る構造体の製造方法は、3つ以上の被着体の間に本実施形態に係る高周波誘電加熱用接着剤を配置する工程と、高周波誘電加熱用接着剤に高周波電界を印加して、3つ以上の被着体を接合する工程と、を含む。
工程P1は、3つ以上の被着体の間に本実施形態に係る高周波誘電加熱用接着剤を配置する工程である。本実施形態に係る構造体として積層体を製造する場合、工程P1においては、例えば、被着体と高周波誘電加熱用接着剤とを交互に配置して、高周波誘電加熱用接着剤を介して3つ以上の被着体を積層させる。
また、被着体間の一部において高周波誘電加熱用接着剤を挟持する一態様としては、被着体同士の接合面の外周に沿って高周波誘電加熱用接着剤を枠状に配置して、被着体間で挟持する態様が挙げられる。このように高周波誘電加熱用接着剤を枠状に配置することで、被着体同士の接合強度を得るとともに、接合面全体に亘って高周波誘電加熱用接着剤を配置した場合に比べて構造体を軽量化できる。
また、被着体間の一部に高周波誘電加熱用接着剤を挟持する一態様によれば、用いる高周波誘電加熱用接着剤の量を減らしたり、サイズを小さくできるため、接合面全体に亘って高周波誘電加熱用接着剤を配置した場合に比べて高周波誘電加熱処理時間を短縮できる。
工程P2は、工程P1において被着体間に配置した高周波誘電加熱用接着剤に高周波電界を印加して、3つ以上の被着体を接合する工程である。印加する高周波電界の周波数は、例えば、3MHz以上、300MHz以下である。例えば、誘電加熱装置を用いることにより、高周波電界を高周波誘電加熱用接着剤に印加することができる。
図2には、本実施形態に係る高周波誘電加熱用接着剤及び誘電加熱装置を用いた高周波誘電加熱処理を説明する概略図が示されている。
図2に示された誘電加熱装置50は、第1高周波電界印加電極51と、第2高周波電界印加電極52と、高周波電源53と、を備えている。
第1高周波電界印加電極51と、第2高周波電界印加電極52とは、互いに対向配置されている。第1高周波電界印加電極51及び第2高周波電界印加電極52は、プレス機構を有している。誘電加熱装置50の電極(第1高周波電界印加電極51及び第2高周波電界印加電極52)のプレス機構により、当該電極の間に配置された3つ以上の被着体と高周波誘電加熱用接着剤とを加圧しながら高周波電界を印加することもできる。
高周波電界の印加には平行平板タイプの高周波誘電加熱装置を用いることも好ましい。平行平板タイプの高周波誘電加熱装置であれば、高周波電界が電極間に位置する高周波誘電加熱用接着剤を貫通するので、高周波誘電加熱用接着剤全体を温めることができ、被着体と高周波誘電加熱用接着剤とを短時間で接合できる。また、構造体としての積層体を製造する場合には、平行平板タイプの高周波誘電加熱装置を用いることが好ましい。
誘電加熱装置50は、図2に示すように、第1被着体110、第2被着体120及び第3被着体130の間に挟持した第1高周波誘電加熱用接着剤11及び第2高周波誘電加熱用接着剤12を介して、誘電加熱処理する。さらに、誘電加熱装置50は、誘電加熱処理に加えて、第1高周波電界印加電極51及び第2高周波電界印加電極52による加圧処理によって、第1被着体110、第2被着体120及び第3被着体130を接合する。なお、加圧処理を行わずに、例えば、高周波誘電加熱用接着剤及び被着体の自重のみによる押圧により3つ以上の被着体を接合してもよい。
そして、誘電フィラーは、発熱源として機能し、誘電フィラーの発熱によって、熱可塑性樹脂成分を溶融させ、短時間処理であっても、最終的には、第1被着体110、第2被着体120及び第3被着体130を強固に接合できる。
高周波誘電加熱条件は、適宜変更できるが、以下の条件であることが好ましい。
高周波電界の出力は、50,000W以下であることが好ましく、20,000W以下であることがより好ましく、15,000W以下であることがさらに好ましく、10,000W以下であることがよりさらに好ましく、1,000W以下であることがさらになお好ましい。
高周波電界の出力が10W以上であれば、誘電加熱処理時に温度が上昇し難いという不具合を防止できるので、良好な接合強度を得やすい。
高周波電界の出力が50,000W以下であれば、誘電加熱処理による温度制御が困難となる不具合を防ぎ易い。
高周波電界の印加時間は、300秒以下であることが好ましく、240秒以下であることがより好ましく、180秒以下であることがさらに好ましく、120秒以下であることがよりさらに好ましく、90秒以下であることがさらになお好ましい。
高周波電界の印加時間が1秒以上であれば、誘電加熱処理時に温度が上昇し難いという不具合を防止できるので、良好な接着力を得やすい。
高周波電界の印加時間が300秒以下であれば、構造体の製造効率が低下したり、製造コストが高くなったり、さらには、被着体が熱劣化するといった不具合を防ぎ易い。
印加する高周波電界の周波数は、300MHz以下であることが好ましく、100MHz以下であることがより好ましく、80MHz以下であることがさらに好ましく、50MHz以下であることがよりさらに好ましい。具体的には、国際電気通信連合により割り当てられた工業用周波数帯13.56MHz、27.12MHz又は40.68MHzが、本実施形態の高周波誘電加熱による製造方法や接合方法にも利用される。
本実施形態の高周波誘電加熱用接着剤は、前述の下限温度TL以上、上限温度TU以下の範囲内における、メルトボリュームレートが、1cm3/10min以上、300cm3/10min以下を満たすため、高周波誘電加熱用接着剤は、適度な流動性が得られる。このため、3つ以上の被着体を一度に短時間で接合できるとともに、被着体同士のズレの発生が抑制できる。また、本実施形態によれば、当該高周波誘電加熱用接着剤により3つ以上の被着体が接合された構造体及び当該構造体の製造方法を提供することができる。当該構造体の製造方法によれば、3つ以上の被着体が接合された構造体を短時間で製造できるとともに、被着体同士のズレの発生が抑制された構造体を製造することができる。
本発明は、前記実施形態に限定されない。本発明は、本発明の目的を達成できる範囲での変形及び改良等を含むことができる。
(実施例1~6及び比較例1~3)
表1に示す熱可塑性樹脂(A)と誘電フィラー(B)を予備混合した。予備混合した材料を30mmφ二軸押出機のホッパーに供給し、シリンダー設定温度、およびダイス温度を熱可塑性樹脂(A)の種類にあわせて適宜調整し、予備混合した材料を溶融混練した。溶融混練した材料を冷却した後に、当該材料をカットすることにより、粒状のペレットを作製した。次いで、作製した粒状ペレットを、Tダイを設置した単軸押出機のホッパーに投入し、シリンダー温度、およびダイス温度を熱可塑性樹脂(A)の種類にあわせて適宜調整し、Tダイから、フィルム状溶融混練物を押出し、冷却ロールにて冷却させることにより、実施例1~6及び比較例1~3に係る厚さ400μmのシート状の高周波誘電加熱用接着剤(高周波誘電加熱接着シート)のそれぞれを作製した。
LDPE-1:低密度ポリエチレン(住友化学株式会社製、商品名「スミカセンL420」、MFR:3.5g/10min(JIS K 7210-1:2014に準拠))
LDPE-2:低密度ポリエチレン(住友化学株式会社製、商品名「スミカセンL705」、MFR:7.0g/10min(JIS K 7210-1:2014に準拠))
LDPE-3:低密度ポリエチレン(住友化学株式会社製、商品名「スミカセンG801」、MFR:20g/10min(JIS K 7210-1:2014に準拠))
LDPE-4:低密度ポリエチレン(住友化学株式会社製、商品名「スミカセンG807」、MFR:75g/10min(JIS K 7210-1:2014に準拠))
LDPE-5:低密度ポリエチレン(住友化学株式会社製、商品名「スミカセンF101-1」、MFR:0.3g/10min(JIS K 7210-1:2014に準拠))
EVA-1:エチレン-酢酸ビニル共重合樹脂(三井・ダウポリケミカル株式会社製、商品名「エバフレックスEV560」、MFR:3.5g/10min(JIS K 7210-1:2014に準拠))
EVA-2:エチレン-酢酸ビニル共重合樹脂(東ソー株式会社製、商品名「ウルトラセン685」、MFR:2500g/10min(JIS K 6924-1:1997に準拠))
EVA-3:エチレン-酢酸ビニル共重合樹脂(東ソー株式会社製、商品名「ウルトラセン722」、MFR:400g/10min(JIS K 6924-1:1997に準拠))
ZnO:酸化亜鉛(堺化学工業株式会社製、製品名「LP-ZINC11」)。
レーザー回折・散乱法により、誘電フィラーの粒度分布を測定した。粒度分布測定の結果からJIS Z 8819-2:2001に準じて体積平均粒子径を算出した。算出した酸化亜鉛(ZnO)の体積平均粒子径は、11μmであった。
ガラス繊維ポリプロピレン樹脂板を用いて、長さ75mm、幅25mm、厚さ2mmの板状の被着体を作製した。この被着体の流動開始温度TF2は183℃である。また、この被着体の誘電特性DP2は、0.000である。
高周波誘電加熱用接着剤の軟化温度および流動開始温度は、降下式フローテスター(株式会社島津製作所製,型番「CFT-100D」)を用いて測定した。荷重5.0kgとし、穴形状がφ2.0mm、長さが5.0mmのダイ、内径が11.329mmのシリンダーを使用し、測定試料の温度を昇温速度10℃/minで上昇させながら、昇温とともに変動するストローク変位速度(mm/min)を測定して、試料のストローク変位速度の温度依存性チャートを得た。このチャートにおいて、低温側に得られるピークの温度を軟化温度とした。また、軟化温度のピークを経過した後、再度ストローク変位速度が上昇し始める温度を流動開始温度とした。被着体の流動開始温度は、被着体を2mm×2mm×2mm程度の大きさに刻んで、測定試料を作製し、上述と同様に測定した。
高周波誘電加熱用接着剤の熱分解温度は、熱分析測定装置(株式会社島津製作所製,熱分析計TG-DTA同時測定装置,型番「DTG-60」)を用いて測定した。測定条件は、大気雰囲気下、10℃/分の昇温速度で30℃から500℃まで加熱を行った。得られたTG曲線に現れる重量減少が生じ始める温度付近において、DTA曲線の低温側に現れる発熱ピークのピークトップの温度を熱分解温度(単位:℃)とした。
高周波誘電加熱用接着剤のメルトボリュームレート(MVR)は、降下式フローテスター(株式会社島津製作所製,型番「CFT-100D」)を用いて測定した。測定条件は、穴形状がφ2.0mm、長さが5.0mmのダイ、内径が11.329mmのシリンダーを使用し、測定荷重は次のとおりとした。高周波誘電加熱用接着剤の軟化温度よりも10℃高い温度(下限温度TL:軟化温度(℃)+10℃)での測定荷重は20kgとし、高周波誘電加熱用接着剤の熱分解温度よりも10℃低い温度(上限温度TU:熱分解温度(℃)-10℃)での測定荷重は5kgとした。前記下限温度TL、及び前記上限温度TUで、MVRを測定した。
高周波誘電加熱接着シートの無作為に選んだ25箇所の厚さを23℃の条件下で測定した。厚さ測定は、株式会社テクロック製の定圧厚さ測定器(型番:「PG-02J」、標準規格:JIS K 6783、JIS Z 1702、及びJIS Z 1709に準拠)を用いて行った。測定結果に基づいて厚さの平均値Tave、厚さの最大値Tmax、及び厚さの最小値Tminを算出した。プラス側の厚さ精度は、下記数式(数4A)により算出し、マイナス側の厚さ精度は、下記数式(数4B)により算出した。厚さ精度は、プラス側の厚さ精度及びマイナス側の厚さ精度のどちらか大きい値に基づき表示する。例えば、プラス側の厚さ精度の値が+3%であり、マイナス側の厚さ精度の値が-2%の場合は、厚さ精度は、±3%と表示する。
{(Tmax-Tave)/Tave}×100 …(数4A)
{(Tmin-Tave)/Tave}×100 …(数4B)
接着シートを、30mm×30mmの大きさに切断した。切断した接着シートについて、RFインピーダンスマテリアルアナライザE4991A(Agilent社製)に、誘電材料テスト・フィクスチャー 16453A(Agilent社製)を取り付け、平行板法にて、23℃における周波数40.68MHzの条件下、比誘電率(ε’r)及び誘電正接(tanδ)をそれぞれ測定した。測定結果に基づき、誘電特性(tanδ/ε’r)の値を算出した。
以下に示すとおり高周波誘電加熱用接着剤(接着シート)を評価した。評価結果を表1に示す。
図3に示すように、3枚の被着体WK1,WK2,WK3を積層させて構造体STを作製した。なお、図3においては、電極と接着シートとを区別し易いように、電極及び接着シートの一部に斜線を付している。
まず、作製した高周波誘電加熱用接着剤(接着シート)を長さ25mm、幅25mmに切断し、2枚の接着シートAS1,AS2を準備した。長さ75mm、幅25mm、厚さ2mmの板状の被着体WK1,WK3と、長さ55mm、幅25mm、厚さ2mmの板状の被着体WK2を積層した。被着体は、前述のガラス繊維ポリプロピレン樹脂板である。被着体WK1,WK2,WK3を積層させる際に、接着シートAS1,AS2を、被着体WK1,WK3の長さ方向の端部に、被着体WK2の長さ方向の中央に位置するように配置した。被着体WK1,WK2,WK3の材質は、3枚とも同じとした。このように積層した被着体及び接着シートを、高周波誘電加熱装置(山本ビニター社製、製品名「YRP-400T-A」)の電極ELD1,ELD2の間に固定した。電極ELD1,ELD2の押し付け面の形状は、大きさが25mm×25mmである正方形とした。図3にも示すように、接着シートAS1,AS2及び電極ELD1,ELD2が重なり合うように固定した。このように固定した状態で、電極ELD1,ELD2に接続された高周波電源HFにより高周波電界を下記高周波電界印加条件で印加して接着シートと被着体とを接合し、接着性評価用の試験片(構造体ST)を作製した。高周波電界印加時の押し付け圧力は、被着体の接合部に加えた圧力である。
・高周波電界印加条件
周波数 :40.68MHz
出力 :250W
印加時間 :20秒
押し付け圧力:0.16MPa
A:3枚の被着体共に1MPa以上の接合強度が得られていた。
F:3枚の被着体共に1MPa未満の接合強度であった。
各例の高周波誘電加熱用接着剤を用いて作製した接着性評価用の試験片を用いて、接着力としての引張せん断力(単位:MPa)を測定した。
引張せん断力の測定には、万能引張試験機(インストロン社製、製品名「インストロン5581」)を用いた。引張せん断力の測定における引張速度は、10mm/minとした。被着体WK1と被着体WK3とを試験機のチャックで挟み、JIS K 6850:1999に準じて引張せん断力を測定した。
図4に示すように、3枚の被着体WK4,WK5,WK6を積層させて構造体ST2を作製した。なお、図4においては、電極と接着シートとを区別し易いように、図3と同様に、電極及び接着シートに斜線を付している。
まず、作製した高周波誘電加熱用接着剤(接着シート)を長さ12.5mm、幅25mmに切断し、2枚の接着シートAS3,AS4を準備した。被着体Aとして、長さ12.5mm、幅25mm、厚さ2mmの板状の被着体を準備し、被着体WK6とした。被着体Bとして、長さ12.5mm、幅25mm、厚さ2mmの板状の被着体を準備した。被着体Bを、側面から見て、前述の長さと厚さの対角線上に半裁して、被着体WK4及び被着体WK5とした。半裁して得られた被着体WK4及び被着体WK5は、傾斜面を有し、傾斜角が約9.1°である。被着体A及び被着体Bは同じ材質であり、前述のガラス繊維ポリプロピレン樹脂板である。
次に、被着体WK6,接着シートAS4,被着体WK5,接着シートAS3,被着体WK4の順に重ねて積層した。積層する際に、被着体WK4,WK5,及びWK6のそれぞれの長さ方向の両端部と、接着シートAS3及びAS4のそれぞれの長さ方向の両端部とが揃う位置に配置した。また、被着体WK5の傾斜面上に、接着シートAS3を重ね、被着体WK4の傾斜面を被着体WK5の傾斜面と対向するように、接着シートAS3上に重ねた。
このように積層した被着体及び接着シートを、高周波誘電加熱装置(山本ビニター社製、製品名「YRP-400T-A」)の電極ELD1,ELD2の間に固定した。電極ELD1,ELD2の押し付け面の形状は、大きさが25mm×25mmである正方形とした。図4にも示すように、接着シートAS3,AS4及び電極ELD1,ELD2が重なり合うように固定した。このように固定した状態で、電極ELD1,ELD2に接続された高周波電源HFにより高周波電界を下記高周波電界印加条件で印加して接着シートと被着体とを接合し、接着性評価用の試験片(構造体ST2)を作製した。高周波電界印加時の押し付け圧力は、被着体の接合部に加えた圧力である。
・高周波電界印加条件
周波数 :40.68MHz
出力 :50W
印加時間 :20秒
押し付け圧力:0.75MPa
A:(L1+L2)が、2.0mm以下であった。
F:(L1+L2)が2.0mmを超えていた。
被着体同士のズレを表す水平方向距離L1及びL2は、以下のように測定した。図5に示すように、まず、被着体WK6の長さ方向の第1端面E6Aと、この第1端面E6A側に位置する被着体WK5の端面E5との水平方向距離L1を測定した。同様に、被着体WK6の長さ方向の第2端面E6Bと、この第2端面E6B側に位置する被着体WK4の端面E4までの水平方向距離L2を測定した。
比較例1および3では、高周波誘電加熱用接着剤のMVRが、300cm3/10minを超えているため、誘電加熱接着したときの接着剤の流動性が大きすぎる。このため、比較例1および3の接着剤を用いて被着体を接合する際に、被着体同士にズレが生じたと考えられる。
比較例2では、高周波誘電加熱用接着剤のMVRが1cm3/10min未満であるため、誘電加熱接着したときの接着剤の流動性が低すぎる。このため、アンカー効果が発現し難く、被着体に対する濡れ性が低く、短時間での接着性が低いと考えられる。
Claims (14)
- 3つ以上の被着体を接合させるための高周波誘電加熱用接着剤であって、
前記高周波誘電加熱用接着剤は、熱可塑性樹脂と、高周波電界の印加により発熱する誘電フィラーとを含み、
下限温度TL、および上限温度TUにおける、メルトボリュームレートが、1cm3/10min以上、300cm3/10min以下であり、
前記下限温度TL(単位:℃)は、下記数式(数11)で規定され、
前記上限温度TU(単位:℃)は、下記数式(数12)で規定される、
高周波誘電加熱用接着剤。
TL=前記高周波誘電加熱用接着剤の軟化温度TM+10℃ …(数11)
TU=前記高周波誘電加熱用接着剤の熱分解温度TD-10℃ …(数12)
但し、前記下限温度TLでのメルトボリュームレートの測定荷重は20kgであり、
前記上限温度TUでのメルトボリュームレートの測定荷重は5kgである。 - 前記3つ以上の被着体は、それぞれ、流動開始温度を有さない被着体であるか、又は、流動開始温度を有する被着体であり、前記被着体の流動開始温度TF2(℃)と、前記高周波誘電加熱用接着剤の流動開始温度TF1(℃)とが、下記数式(数2)の関係を満たす、
請求項1に記載の高周波誘電加熱用接着剤。
-5≦TF2-TF1 …(数2) - 前記高周波誘電加熱用接着剤の流動開始温度TF1は、80℃以上、200℃以下である、
請求項2に記載の高周波誘電加熱用接着剤。 - 前記3つ以上の被着体のうち少なくともいずれかが流動開始温度を有する被着体である場合、前記流動開始温度を有する被着体の流動開始温度TF2は、90℃以上である、
請求項2又は請求項3に記載の高周波誘電加熱用接着剤。 - 前記高周波誘電加熱用接着剤の誘電特性DP1と、前記3つ以上の被着体のそれぞれの誘電特性DP2とが、下記数式(数1)の関係を満たす、
請求項1から請求項4のいずれか一項に記載の高周波誘電加熱用接着剤。
0<DP1-DP2 …(数1)
(誘電特性DP1、及び誘電特性DP2は、それぞれ、前記高周波誘電加熱用接着剤、及び前記3つ以上の被着体の誘電特性(tanδ/ε’r)の値であり、
tanδは、23℃かつ周波数40.68MHzにおける誘電正接であり、
ε’rは、23℃かつ周波数40.68MHzにおける比誘電率である。) - 前記3つ以上の被着体のそれぞれの誘電特性DP2は、いずれも、0.015以下である、
請求項5に記載の高周波誘電加熱用接着剤。 - 前記高周波誘電加熱用接着剤の誘電特性DP1は、0.005以上である、
請求項5又は請求項6に記載の高周波誘電加熱用接着剤。 - 前記高周波誘電加熱用接着剤は、接着シートである、
請求項1から請求項7のいずれか一項に記載の高周波誘電加熱用接着剤。 - 前記接着シートの厚さTS1と、前記3つ以上の被着体のそれぞれの厚さTS2が、下記数式(数3)の関係を満たす、
請求項8に記載の高周波誘電加熱用接着剤。
TS1<TS2 …(数3) - 前記接着シートの厚さTS1は、5μm以上、2000μm以下である、
請求項8又は請求項9に記載の高周波誘電加熱用接着剤。 - 前記接着シートの厚さ精度は、±10%以内である、
請求項8から請求項10のいずれか一項に記載の高周波誘電加熱用接着剤。 - 請求項1から請求項11のいずれか一項に記載の高周波誘電加熱用接着剤により前記3つ以上の被着体が接合されている、
構造体。 - 前記3つ以上の被着体の間に請求項1から請求項11のいずれか一項に記載の高周波誘電加熱用接着剤を配置する工程と、
前記高周波誘電加熱用接着剤に高周波電界を印加して、前記3つ以上の被着体を接合する工程と、を含む、
構造体の製造方法。 - 誘電加熱装置の電極の間に前記3つ以上の被着体と前記高周波誘電加熱用接着剤とを配置し、
前記3つ以上の被着体と前記高周波誘電加熱用接着剤とを前記電極で加圧しながら高周波電界を印加する、
請求項13に記載の構造体の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21900579.0A EP4257354A1 (en) | 2020-12-04 | 2021-11-30 | Adhesive for high-frequency dielectric heating, structure, and method for manufacturing structure |
CN202180080954.6A CN116547145A (zh) | 2020-12-04 | 2021-11-30 | 高频介电加热用粘接剂、结构体及结构体的制造方法 |
JP2022566928A JPWO2022118826A1 (ja) | 2020-12-04 | 2021-11-30 | |
US18/039,901 US20240052206A1 (en) | 2020-12-04 | 2021-11-30 | Adhesive for high-frequency dielectric heating, structure, and method for manufacturing structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-202036 | 2020-12-04 | ||
JP2020202036 | 2020-12-04 | ||
JP2021-061708 | 2021-03-31 | ||
JP2021061708 | 2021-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022118826A1 true WO2022118826A1 (ja) | 2022-06-09 |
Family
ID=81853214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/043772 WO2022118826A1 (ja) | 2020-12-04 | 2021-11-30 | 高周波誘電加熱用接着剤、構造体及び構造体の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240052206A1 (ja) |
EP (1) | EP4257354A1 (ja) |
JP (1) | JPWO2022118826A1 (ja) |
WO (1) | WO2022118826A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7563612B2 (ja) | 2022-08-26 | 2024-10-08 | 株式会社レゾナック | 金属材の連結体及び金属材の連結方法 |
JP7563611B2 (ja) | 2022-07-27 | 2024-10-08 | 株式会社レゾナック | 金属材の連結体及び金属材の連結方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11187626A (ja) | 1997-12-22 | 1999-07-09 | Nippon Steel Corp | 積層鉄芯製造方法 |
JP2003252658A (ja) | 2002-02-27 | 2003-09-10 | Haishiito Kogyo Kk | 防犯防弾用複合ガラス |
JP2010006908A (ja) * | 2008-06-25 | 2010-01-14 | Denso Corp | 接着剤、接着構造体及び高周波誘電加熱接着装置 |
JP2014213524A (ja) * | 2013-04-25 | 2014-11-17 | 日本電気硝子株式会社 | 積層体の製造方法 |
WO2018079354A1 (ja) * | 2016-10-27 | 2018-05-03 | リンテック株式会社 | 誘電加熱接着フィルム、及び誘電加熱接着フィルムを用いてなる接合方法 |
JP2018177825A (ja) * | 2017-04-03 | 2018-11-15 | リンテック株式会社 | 誘電加熱接着フィルムを用いてなる接着構造体の製造方法 |
JP2020070365A (ja) * | 2018-10-31 | 2020-05-07 | リンテック株式会社 | 高周波誘電加熱接着シート及び断熱構造体 |
WO2020203206A1 (ja) * | 2019-03-29 | 2020-10-08 | リンテック株式会社 | 接合方法及び高周波誘電加熱接着シート |
WO2021200686A1 (ja) * | 2020-03-31 | 2021-10-07 | リンテック株式会社 | 高周波誘電加熱接着シート |
-
2021
- 2021-11-30 US US18/039,901 patent/US20240052206A1/en active Pending
- 2021-11-30 EP EP21900579.0A patent/EP4257354A1/en active Pending
- 2021-11-30 JP JP2022566928A patent/JPWO2022118826A1/ja active Pending
- 2021-11-30 WO PCT/JP2021/043772 patent/WO2022118826A1/ja active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11187626A (ja) | 1997-12-22 | 1999-07-09 | Nippon Steel Corp | 積層鉄芯製造方法 |
JP2003252658A (ja) | 2002-02-27 | 2003-09-10 | Haishiito Kogyo Kk | 防犯防弾用複合ガラス |
JP2010006908A (ja) * | 2008-06-25 | 2010-01-14 | Denso Corp | 接着剤、接着構造体及び高周波誘電加熱接着装置 |
JP2014213524A (ja) * | 2013-04-25 | 2014-11-17 | 日本電気硝子株式会社 | 積層体の製造方法 |
WO2018079354A1 (ja) * | 2016-10-27 | 2018-05-03 | リンテック株式会社 | 誘電加熱接着フィルム、及び誘電加熱接着フィルムを用いてなる接合方法 |
JP2018177825A (ja) * | 2017-04-03 | 2018-11-15 | リンテック株式会社 | 誘電加熱接着フィルムを用いてなる接着構造体の製造方法 |
JP2020070365A (ja) * | 2018-10-31 | 2020-05-07 | リンテック株式会社 | 高周波誘電加熱接着シート及び断熱構造体 |
WO2020203206A1 (ja) * | 2019-03-29 | 2020-10-08 | リンテック株式会社 | 接合方法及び高周波誘電加熱接着シート |
WO2021200686A1 (ja) * | 2020-03-31 | 2021-10-07 | リンテック株式会社 | 高周波誘電加熱接着シート |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7563611B2 (ja) | 2022-07-27 | 2024-10-08 | 株式会社レゾナック | 金属材の連結体及び金属材の連結方法 |
JP7563612B2 (ja) | 2022-08-26 | 2024-10-08 | 株式会社レゾナック | 金属材の連結体及び金属材の連結方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2022118826A1 (ja) | 2022-06-09 |
US20240052206A1 (en) | 2024-02-15 |
EP4257354A1 (en) | 2023-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018147352A1 (ja) | 誘電加熱接着フィルム、及び誘電加熱接着フィルムを用いた接着方法 | |
JP6648300B2 (ja) | 誘電加熱接着フィルム、及び誘電加熱接着フィルムを用いた接着方法 | |
WO2022118826A1 (ja) | 高周波誘電加熱用接着剤、構造体及び構造体の製造方法 | |
WO2021200686A1 (ja) | 高周波誘電加熱接着シート | |
WO2021200685A1 (ja) | 高周波誘電加熱接着シート | |
JP2020070365A (ja) | 高周波誘電加熱接着シート及び断熱構造体 | |
WO2021200684A1 (ja) | 高周波誘電加熱接着シート | |
JP6796744B1 (ja) | 接合方法 | |
JP2018177825A (ja) | 誘電加熱接着フィルムを用いてなる接着構造体の製造方法 | |
JP7312539B2 (ja) | 高周波誘電加熱接着シート | |
WO2022118825A1 (ja) | 高周波誘電加熱用接着剤、構造体及び構造体の製造方法 | |
WO2021200687A1 (ja) | 高周波誘電加熱接着シートを用いた接着方法 | |
JP7223553B2 (ja) | 高周波誘電加熱接着シート、管の接合方法及び管接合体 | |
CN116547145A (zh) | 高频介电加热用粘接剂、结构体及结构体的制造方法 | |
WO2021201173A1 (ja) | 高周波誘電加熱用接着剤、構造体及び構造体の製造方法 | |
WO2022004604A1 (ja) | 高周波誘電加熱接着シート | |
WO2022004605A1 (ja) | 高周波誘電加熱接着シート、接合方法及び接合体 | |
WO2022004606A1 (ja) | 高周波誘電加熱用接着剤 | |
WO2023013651A1 (ja) | 接合方法 | |
JP2022045334A (ja) | 接着方法 | |
WO2022045156A1 (ja) | 成型体、接合方法、及び成型体の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21900579 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2022566928 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202180080954.6 Country of ref document: CN Ref document number: 18039901 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2021900579 Country of ref document: EP Effective date: 20230704 |