WO2022117042A1 - 一种印刷电路板的制作方法及印刷电路板 - Google Patents

一种印刷电路板的制作方法及印刷电路板 Download PDF

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Publication number
WO2022117042A1
WO2022117042A1 PCT/CN2021/135113 CN2021135113W WO2022117042A1 WO 2022117042 A1 WO2022117042 A1 WO 2022117042A1 CN 2021135113 W CN2021135113 W CN 2021135113W WO 2022117042 A1 WO2022117042 A1 WO 2022117042A1
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WO
WIPO (PCT)
Prior art keywords
slot
bonding
circuit board
substrate
printed circuit
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Application number
PCT/CN2021/135113
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English (en)
French (fr)
Inventor
王俊
陈晓青
陈前
张佳
胡新星
Original Assignee
景旺电子科技(珠海)有限公司
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Publication of WO2022117042A1 publication Critical patent/WO2022117042A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • the present application relates to the technical field of circuit boards, and in particular, to a manufacturing method of a printed circuit board and a printed circuit board.
  • PCB printed circuit board Circuit Board
  • COB Chip On Board
  • the purpose of the present application is to provide a method for manufacturing a printed circuit board and a printed circuit board, so as to solve the technical problems of poor consistency between bonding pads and slot edges and waste of bonding gold wires when the existing PCB board grooves are processed.
  • the present application provides a method for manufacturing a printed circuit board, comprising:
  • a pattern circuit is fabricated on the substrate, the pattern circuit includes a bonding pad, and the bonding pad includes a bonding portion and an extension portion disposed at one end of the bonding portion;
  • Alkaline etching is performed on the extension portion of the bonding pad to remove the extension portion.
  • the extension part includes an extension section and a compensation section, one end of the extension section is connected to the bonding section, and the other end is connected to the compensation section, wherein the length of the extension section is the same as the bonding section
  • the opening of the slot on the substrate includes: using a double-edged helical gong knife to create the slot on the substrate.
  • the default cutting speed of the double-edged helical gong knife is V 0
  • the actual cutting speed of the double-edged helical gong knife is V 1
  • the knife speed is the running speed of the double-edged helical gong knife in the normal working state.
  • the manufacturing method further includes: covering a phenolic resin cover above the substrate and below the substrate.
  • the fabrication method further includes: determining the compensation amount of the pattern circuit according to the thickness of the bottom copper of the substrate and the preset distance from the bonding portion to the slot. .
  • the thickness of the bottom copper of the substrate denotes the thickness of the bottom copper of the substrate as D
  • the preset distance from the bonding end of the bonding portion to the slot denote the compensation amount of the pattern circuit as L
  • the substrate denote the substrate as L.
  • the etching rate of the alkaline etching treatment for the extension of the bonding pad is the conventional etching rate, when 0.05 When mm ⁇ B ⁇ 0.08mm, 45 ⁇ m ⁇ D ⁇ 60 ⁇ m and B ⁇ 0.05mm, 30 ⁇ m ⁇ D ⁇ 45 ⁇ m, the etching rate of alkaline etching treatment for the extension of the bonding pad is 1.2 times the conventional etching rate.
  • the fabrication method further includes: plating a tin layer on the bottom copper of the substrate.
  • the fabricating method further includes: covering a part of the area where the slot is preset with auxiliary copper, and connecting the auxiliary copper to the bonding pad.
  • the extension part is away from the side of the bonding part.
  • the present application provides a printed circuit board, which is manufactured by the method for manufacturing a printed circuit board described in the first aspect.
  • a slot and a bonding pad are arranged on the substrate of the printed circuit board, the bonding pad is arranged around the slot, and the spacing between the bonding pad and the slot is equal.
  • the manufacturing method of the printed circuit board and the printed circuit board provided by the present application need to open a slot on the substrate first, and then use an alkaline solution to etch the extension of the bonding pad, because the alkaline solution etches the graphic circuit
  • the etching speed is basically the same in all directions, it can ensure that the spacing from the bonding pad to the slot in each direction after etching treatment is the same or similar, that is, the spacing between the bonding pad and the slot has a high consistency.
  • the bonding pad by designing the bonding part and the extension part connected to the slot, it can ensure that the distance between the etched bonding pad and the slot meets the preset requirements, and effectively avoids bonding welding.
  • 1 is a schematic structural diagram of an existing printed circuit board
  • FIG. 2 is a flowchart of a method for manufacturing a printed circuit board provided by an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a printed circuit board provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a printed circuit board with auxiliary copper added on a substrate provided by an embodiment of the present application;
  • Fig. 5 is the sectional view of the pattern circuit on the printed circuit board shown in Fig. 3;
  • FIG. 6 is a cross-sectional view of a printed circuit board provided with a substrate provided with a pattern circuit according to an embodiment of the present application
  • FIG. 7 is a cross-sectional view of a printed circuit board with slots provided on a substrate according to an embodiment of the present application.
  • FIG. 8 is a cross-sectional view of the printed circuit board after the substrate provided by the embodiment of the present application is subjected to defilming treatment;
  • FIG. 9 is a cross-sectional view of a printed circuit board after alkaline etching is performed on the substrate provided by the embodiment of the present application;
  • FIG. 10 is a cross-sectional view of the printed circuit board after the substrate provided by the embodiment of the present application is subjected to tin stripping treatment.
  • an embodiment of the present application provides a method for manufacturing a printed circuit board, including the following steps:
  • Step S1 fabricating a pattern circuit on the substrate 1 , the pattern circuit includes a bonding pad 2 , and the bonding pad 2 includes a bonding portion 21 and an extension portion 22 disposed at one end of the bonding portion 21 .
  • the substrate 1 has a multi-layer structure, and substrates 1 with different numbers of layers can be selected according to actual needs.
  • the bonding pads 2 may be designed only above or below the substrate 1 , or the bonding pads 2 may be designed above and below the substrate 1 at the same time.
  • the four-layer substrate 1 is used as an example for description.
  • the substrate 1 includes four copper layers (for example, the structure shown in E in FIG. 6 ) and an insulating dielectric layer disposed between two adjacent copper layers (for example, the structure shown in F in FIG. 6 ) , wherein the bonding pads 2 are designed only on the upper surface of the substrate 1 .
  • the graphics circuit also includes other preset circuits.
  • Step S2 a slot 3 is formed on the substrate 1 , and the slot 3 penetrates a part of the extending portion 22 of the bonding pad 2 .
  • the slot 3 is a non-metallized through slot penetrating the copper layer and the insulating medium layer of the substrate 1 , and can be used for assembling a semiconductor chip.
  • the slot 3 penetrates part of the extension part 22 , that is, part of the extension part 22 is removed when the slot 3 is opened, and the remaining extension part 22 is connected to the edge of the slot 3 .
  • Step S3 performing alkaline etching on the extension portion 22 of the bonding pad 2 to remove the extension portion 22 .
  • an alkaline etching process is performed on the extension portion 22 of the bonding pad 2 by using an alkaline solution to remove the remaining extension portion 22 .
  • the bonding portion 21 of the bonding pad 2 is left on the substrate 1.
  • the semiconductor chip is connected to the bonding pad 2 through the bonding gold wire. On Bonding 21.
  • the extension part 22 includes an extension part and a compensation part, one end of the extension part is connected to the bonding part 21 and the other end is connected to the compensation part, wherein the length of the extension part is the same as that of the bonding end of the bonding part 21 to the slot 3
  • the preset spacing is equal.
  • A denote the length of the extension portion 22 as A
  • B denote the preset distance between the bonding end of the bonding portion 21 and the slot 3
  • B denote the compensation amount of the extension portion 22 as C ( For example, as shown by arrows and symbols in Figure 4)
  • A B+C, where 0.15mm ⁇ C ⁇ 0.2mm.
  • the bonding end of the bonding portion 21 is an end close to the slot 3 .
  • step S2 includes: opening the slot 3 on the substrate 1 by using a double-edged helical gong knife.
  • the double-edged spiral gong knife has high cutting efficiency and can quickly complete the slot 3 cutting.
  • the default cutting speed of the double-edged helical gong knife is V 0
  • the actual running speed of the double-edged helical gong is V 1
  • V 1 0.8 is controlled.
  • V 0 where the default cutting speed is the running speed of the double-edged helical gong knife in normal working state. Setting the actual cutting speed of the gong knife to 0.8 times the normal speed can relatively reduce the drape formed during the gong groove process, and at the same time, it can also ensure the cutting efficiency of the gong knife and ensure the gong groove effect.
  • the default cutting speed of the gong knife is also different, which can be determined according to the actual situation.
  • the manufacturing method further includes the following steps: covering a phenolic resin cover above the substrate 1 and below the substrate 1 . After the phenolic resin cover plate is covered on the substrate 1, it has a certain protective effect on the substrate 1, and when the slot 3 is opened by a gong knife, it can reduce the sharp edge formed in the process of chip removal.
  • the phenolic resin cover plate is directly placed on the substrate 1, and can be directly removed after the gong groove is completed.
  • the manufacturing method further includes the following steps: determining the compensation amount of the pattern circuit according to the thickness of the bottom copper of the substrate 1 and the preset distance between the bonding portion 21 and the slot 3 .
  • the bottom copper is a copper layer laid between the pattern circuit and the surface of the substrate 1 .
  • the copper layer shown in G in FIG. 6 is the bottom copper.
  • the compensation amount of the pattern circuit is designed according to the difference of the thickness of the bottom copper and the preset spacing, which can eliminate the influence of the different thickness of the bottom copper on the etching, thereby further ensuring that the line width of the pattern circuit after etching meets the preset requirements.
  • the thickness of the bottom copper of the substrate 1 denotes the thickness of the bottom copper of the substrate 1 as D
  • the preset distance from the bonding end of the bonding portion 21 to the slot 3 denotes the compensation amount of the pattern circuit as L (for example, the arrows and symbols in FIG. shown)
  • the thickness of the bottom copper of the substrate 1, the preset distance from the bonding end of the bonding part 21 to the slot 3 and the compensation amount of the pattern circuit satisfy the following relationship:
  • the above data is the data obtained by the inventor with reference to the etching rate and the thickness of the bottom copper and after many experiments. In practical applications, according to different actual conditions, the data may fluctuate in a small range.
  • the etching speed of the alkaline etching treatment for the extension part 22 of the bonding pad 2 is the conventional etching speed, when 0.05mm ⁇ B ⁇ 0.08mm, 45 ⁇ m ⁇ D ⁇ 60 ⁇ m and B ⁇ 0.05mm, 30 ⁇ m ⁇
  • the etching speed of the alkaline etching process on the extension portion 22 of the bonding pad 2 is 1.2 times that of the conventional etching speed.
  • etching speed is directly controlled by the center console that controls the etching machine.
  • the manufacturing method further includes the following steps: thickening the copper layer of the substrate 1, and plating a tin layer 4 on the copper layer.
  • the tin layer 4 is arranged above the pattern circuit. The provision of the tin layer 4 can protect the copper layer from being eroded by the alkaline etching solution, thereby ensuring the quality of the printed circuit board.
  • the manufacturing method provided in the embodiment of the present application also includes steps such as film stripping.
  • the printed circuit obtained after the stripping process is plate.
  • the fabrication method further includes the following steps: covering a part of the area where the slot 3 is preset to be covered with auxiliary copper 5 , and connect the auxiliary copper 5 to the side of the extension part 22 of the bonding pad 2 away from the bonding part 21 .
  • the auxiliary copper 5 By adding the auxiliary copper 5 , the surface of the substrate 1 can be filled to make the thickness of all parts of the substrate 1 equal, thereby ensuring the flatness of the surface of the substrate 1 and the uniformity of electroplating.
  • the manufacturing method of the printed circuit board further includes steps such as tin stripping and defect inspection, which belong to the prior art and will not be described in detail here.
  • an embodiment of the present application further provides a printed circuit board, which is manufactured by using the method for manufacturing a printed circuit board in the first aspect.
  • the etching speed in all directions is basically the same, so as to ensure that the distance between the bonding pad 2 and the slot 3 in each direction after the etching treatment is the same or similar, that is, the bonding pad 2 is separated from the socket.
  • the pitch of the grooves 3 has a high consistency.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

本申请涉及电路板技术领域，公开了一种印刷电路板的制作方法及印刷电路板。所述制作方法包括：在基板（1）上制作图形线路，图形线路包括邦定焊盘（2），邦定焊盘（2）包括邦定部（21）及延伸部（22）；在基板（1）上开设插槽（3），插槽（3）贯穿部分延伸部（22）；对延伸部（22）进行碱性蚀刻处理。本申请能够解决现有印刷电路板上邦定焊盘（2）距插槽（3）间距不一致及邦定焊盘（2）距插槽（3）间距过大的技术问题。

Description

一种印刷电路板的制作方法及印刷电路板
本申请要求于2020年12月04日提交中国专利局，申请号为202011403603.8，发明名称为“一种印刷电路板的制作方法及印刷电路板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电路板技术领域，尤其涉及一种印刷电路板的制作方法及印刷电路板。
 背景技术
印刷电路板（Printed Circuit Board，PCB）是电子元器件电气连接的提供者。对于含插槽设计且插槽周围设定邦定焊盘的PCB板，要采用COB（Chip On Board）方式将半导体芯片封装到插槽内，其中，半导体芯片通过邦定金线实现与邦定焊盘的导通。
相关技术中，在印刷电路板上制作图形线路及插槽时，通常包括以下步骤：基板制作、图形线路制作、酸性蚀刻、CCD锣槽、退膜等。然而，在制作过程中，印刷电路板受温度和湿度影响，会发生不同程度的涨缩，因此，采用CCD锣机锣槽时，如图1所示，会出现插槽偏离预设位置、各方向邦定焊盘到插槽间距不一致的问题，这样，后序利用邦定机邦线时，需要不断调整邦定机的参数，影响邦定效率。另外，CCD锣槽过程中还容易出现邦定焊盘与插槽间距过大的问题，这样会导致邦定金线浪费，增加制作成本。
 技术问题
本申请的目的在于提供一种印刷电路板的制作方法及印刷电路板，以解决现有PCB板锣槽处理时容易出现邦定焊盘与插槽边缘一致性差及邦定金线浪费的技术问题。
 技术解决方案
第一方面，本申请提供一种印刷电路板的制作方法，包括：
在基板上制作图形线路，所述图形线路包括邦定焊盘，所述邦定焊盘包括邦定部及设于所述邦定部一端的延伸部；
在所述基板上开设插槽，所述插槽贯穿所述邦定焊盘的部分延伸部；
对所述邦定焊盘的延伸部进行碱性蚀刻处理，以去除所述延伸部。
进一步地，所述延伸部包括延长段及补偿段，所述延长段的一端连接至所述邦定部、另一端连接至所述补偿段，其中，所述延长段的长度与所述邦定部的邦定端到插槽的预设间距相等；记所述延伸部的长度为A，记所述邦定部的邦定端到插槽的预设间距为B，记所述延伸部的补偿量为C，则A＝B+C，其中0.15mm≤C≤0.2mm。
进一步地，在基板上开设插槽包括：利用双刃螺旋锣刀在所述基板上开设插槽。
进一步地，记所述双刃螺旋锣刀的默认行刀速度为V 0，记所述双刃螺旋锣刀的实际行刀为V 1，控制V 1=0.8V 0，其中，所述默认行刀速度为双刃螺旋锣刀正常工作状态下的运行速度。
进一步地，在所述基板上开设插槽前，所述制作方法还包括：在所述基板上方及所述基板下方覆盖酚醛树脂盖板。
进一步地，在基板上制作图形线路之前，所述制作方法还包括：根据所述基板的底铜厚度及所述邦定部到所述插槽的预设间距，确定所述图形线路的补偿量。
进一步地，记所述基板的底铜厚度为D，记所述邦定部的邦定端到所述插槽的预设间距为B，记所述图形线路的补偿量为L，所述基板的底铜厚度、所述邦定部的邦定端到插槽的预设间距及所述图形线路的补偿量满足以下关系：
0.05mm＜B≤0.08mm时，
1），当D＜18μm，L=0.015mm；
2），当18μm≤D＜30μm，L=0.02mm；
3），当30μm≤D＜45μm，L=0.03mm；
4），当45μm≤D＜60μm，L=0.04mm；
B≤0.05mm时，
1），当D＜18μm，L=0.015mm；
2），当18μm≤D＜30μm，L=0.02mm；
3），当30μm≤D＜45μm，L=0.027mm。
进一步地，记0.05mm＜B≤0.08mm、D＜45μm及B≤0.05mm、D＜30μm条件下，对邦定焊盘的延伸部进行碱性蚀刻处理的蚀刻速度为常规蚀刻速度，当0.05mm＜B≤0.08mm、45μm≤D＜60μm及B≤0.05mm、30μm≤D＜45μm时，对邦定焊盘的延伸部进行碱性蚀刻处理的蚀刻速度为常规蚀刻速度的1.2倍。
进一步地，在基板上制作图形线路之前，所述制作方法还包括：在所述基板的底铜上镀锡层。
进一步地，在基板上制作图形线路的步骤中，所述制作方法还包括：在预设开设所述插槽的部分区域覆盖辅助铜，并使所述辅助铜连接至所述邦定焊盘的延伸部远离所述邦定部的一侧。
第二方面，本申请提供了一种印刷电路板，采用第一方面所述的印刷电路板的制作方法所制成。
进一步地，所述印刷电路板的基板上设有插槽及邦定焊盘，所述邦定焊盘围绕所述插槽设置且所述邦定焊盘至所述插槽的间距相等。
 有益效果
本申请提供的印刷电路板的制作方法及印刷电路板，制作时需要先在基板上开设插槽，而后利用碱性溶液对邦定焊盘的延伸部进行蚀刻处理，由于碱性溶液蚀刻图形线路时，各个方向的蚀刻速度基本相同，从而能够保证经蚀刻处理后的各个方向的邦定焊盘至插槽的间距相同或相近，即邦定焊盘距插槽的间距具有较高的一致性。同时，在制作邦定焊盘时，通过设计邦定部及连接至插槽的延伸部，能够确保经蚀刻处理后的邦定焊盘距插槽的间距满足预设要求，有效避免邦定焊盘距插槽间距过大引起的邦定金线浪费问题。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例或示范性技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有印刷电路板的结构示意图；
图2为本申请实施例提供的印刷电路板的制作方法的流程图；
图3为本申请实施例提供的印刷电路板的结构示意图；
图4为本申请实施例提供的基板上添加有辅助铜的印刷电路板的结构示意图；
图5为图3所示印刷电路板上图形线路的剖视图；
图6为本申请实施例提供的基板上制作有图形线路的印刷电路板的剖视图；
图7为本申请实施例提供的基板上开设有插槽的印刷电路板的剖视图；
图8为本申请实施例提供的基板进行退膜处理后的印刷电路板的剖视图；
图9为本申请实施例提供的基板进行碱性蚀刻后的印刷电路板的剖视图；
图10为本申请实施例提供的基板进行退锡处理后的印刷电路板的剖视图。
图中标记的含义为：
1、基板；2、邦定焊盘；21、邦定部；22、延伸部；3、插槽；4、锡层；5、辅助铜。
 本发明的实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图即实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
需说明的是，当部件被称为“固定于”或“设置于”另一个部件，它可以是直接或者间接在该另一个部件上。当一个部件被称为是“连接于”另一个部件，它可以是直接或者间接连接至该另一个部件上。术语“上”、“下”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对专利的限制。术语“第一”、“第二”仅用于便于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明技术特征的数量。“多个”的含义是两个或两个以上，除非另有明确具体的限定。
为了说明本申请所述的技术方案，下面结合具体附图及实施例来进行说明。
第一方面，如图2和图4所示，本申请实施例提供了一种印刷电路板的制作方法，包括以下步骤：
步骤S1：在基板1上制作图形线路，图形线路包括邦定焊盘2，邦定焊盘2包括邦定部21及设于所述邦定部21一端的延伸部22。
需要说明的是，基板1为多层结构，根据实际需要，可以选择不同层数的基板1。另外，在制作图形线路时，可以仅在基板1的上方或下方设计邦定焊盘2，或者，也可以在基板1的上方和下方同时设计邦定焊盘2。
本实施例中，以四层基板1为例进行说明。如图3和图6所示，基板1包括四层铜层（例如图6中E所示结构）及设置于相邻两层铜层间的绝缘介质层（例如图6中F所示结构），其中，仅在基板1的上表面设计邦定焊盘2。
另外，根据实际需要，图形线路还包括其它预设的线路。
步骤S2：在基板1上开设插槽3，插槽3贯穿邦定焊盘2的部分延伸部22。
具体地，如图7所示，插槽3为贯穿基板1铜层及绝缘介质层的非金属化通槽，可用于装配半导体芯片。
其中，插槽3贯穿部分延伸部22，即在开设插槽3时去除了部分延伸部22，余下的延伸部22与插槽3的边缘相连。
步骤S3：对邦定焊盘2的延伸部22进行碱性蚀刻处理，以去除延伸部22。
具体地，利用碱性溶液对邦定焊盘2的延伸部22进行碱性蚀刻处理，以去除剩余延伸部22。蚀刻完成后，如图3和图10所示，基板1上剩下邦定焊盘2的邦定部21，在安装半导体芯片时，通过邦定金线将半导体芯片连接至邦定焊盘2的邦定部21上。
采用上述步骤制作印刷电路板时，如图6-9所示，需要先在基板1上开设插槽3，而后利用碱性溶液对邦定焊盘2的延伸部22进行蚀刻处理，由于碱性溶液蚀刻图形线路时，各个方向的蚀刻速度基本相同，从而能够保证经蚀刻处理后的各个方向的邦定焊盘2至插槽3的间距相同或相近，即邦定焊盘2距插槽3的间距具有较高的一致性。同时，在制作邦定焊盘2时，通过设计邦定部21及连接至插槽3位置处的延伸部22，能够确保经蚀刻处理后的邦定焊盘2距插槽3的间距满足预设要求，有效避免邦定焊盘2距插槽3间距过大引起的邦定金线浪费问题。
进一步地，延伸部22包括延长段及补偿段，延长段的一端连接至邦定部21、另一端连接至补偿段，其中，延长段的长度与邦定部21的邦定端到插槽3的预设间距相等。记延伸部22的长度为A，记邦定部21的邦定端到插槽3的预设间距为B（例如图3中箭头及标号所示），记延伸部22的补偿量为C（例如图4中箭头及标号所示），则A＝B+C，其中0.15mm≤C≤0.2mm。通过对邦定焊盘2的延伸部22进行补偿，能够避免由于印刷电路板涨缩变形及锣槽误差引起的邦定部21距插槽3间距过大的问题，进而避免引起邦定金线浪费问题。
其中，邦定部21的邦定端为靠近插槽3的一端。
为保证插槽3切割效果，在本申请的一个实施例中，步骤S2包括：利用双刃螺旋锣刀在基板1上开设插槽3。双刃螺旋锣刀切割效率高，能够快速完成插槽3切割。
其中，利用双刃螺旋锣刀开设插槽3时，由于锣刀行进速度较快，排屑过程中容易在插槽3位置处形成披锋，不利用后续邦线。为了解决上述问题，在本申请提供的一个实施例中，记双刃螺旋锣刀的默认行刀速度为V 0，记双刃螺旋锣刀的实际行刀速度为V 1，控制V 1=0.8 V 0，其中，默认行刀速度为双刃螺旋锣刀正常工作状态下的运行速度。将锣刀的实际行刀速度设定为常规速度的0.8倍，能够相对减小锣槽过程中形成的披锋，同时还能保证锣刀的切割效率，确保锣槽效果。
需要说明的是，根据板材及切割要求不同，锣刀的默认行刀速度也不同，具体可根据实际情况而定。
为了进一步减小插槽3边缘的披锋，本申请提供的一个实施例中，在步骤S2之前，制作方法还包括以下步骤：在基板1上方及基板1下方覆盖酚醛树脂盖板。酚醛树脂盖板覆盖到基板1上后，对基板1具有一定的保护作用，利用锣刀开设插槽3时，能够减少排屑过程中形成的披锋。
需要说明的是，酚醛树脂盖板直接放置于基板1上，在锣槽完成后，直接取下即可。
印刷电路板在进行蚀刻处理时，会同时侵蚀基板1上的底铜及图形线路的侧边，即对图形线路进行侧蚀，为避免侧蚀过度，保证蚀刻后图形线路的线宽能达到预设要求，在步骤S1之前，制作方法还包括以下步骤：根据基板1的底铜厚度及邦定部21到插槽3的预设间距，确定图形线路的补偿量。其中，底铜为铺设于图形线路与基板1表面之间的铜层，例如图6中G所示铜层即为底铜。
如图8和图9所示，碱性溶液在蚀刻图形线路时，会同时咬蚀基板1上的底铜及图形线路的侧边，底铜越厚，蚀刻时间越久，侧蚀量也会越大。上述步骤中，根据底铜厚度及预设间距的不同来设计图形线路的补偿量，能够消除底铜厚度不同对蚀刻产生的影响，从而进一步确保蚀刻后图形线路的线宽满足预设要求。
进一步地，记基板1的底铜厚度为D，记邦定部21的邦定端到插槽3的预设间距为B，记图形线路的补偿量为L（例如图5中箭头及标号所示），基板1的底铜厚度、邦定部21的邦定端到插槽3的预设间距及图形线路的补偿量满足以下关系：
0.05mm＜B≤0.08mm时，
1），当D＜18μm，L=0.015mm；
2），当18μm≤D＜30μm，L=0.02mm；
3），当30μm≤D＜45μm，L=0.03mm；
4），当45μm≤D＜60μm，L=0.04mm；
B≤0.05mm时，
1），当D＜18μm，L=0.015mm；
2），当18μm≤D＜30μm，L=0.02mm；
3），当30μm≤D＜45μm，L=0.027mm。
需要说明的是，上述数据是发明人参考蚀刻速度及底铜厚度、经多次试验得出的数据，在实际应用中，根据实际情况不同，数据可能存在小范围波动。
为了进一步确保蚀刻后邦定焊盘2到插槽3的间距满足预设要求，在本申请提供的一个实施例中，记0.05mm＜B≤0.08mm、D＜45μm及B≤0.05mm、D＜30μm条件下，对邦定焊盘2的延伸部22进行碱性蚀刻处理的蚀刻速度为常规蚀刻速度，当0.05mm＜B≤0.08mm、45μm≤D＜60μm及B≤0.05mm、30μm≤D＜45μm时，对邦定焊盘2的延伸部22进行碱性蚀刻处理的蚀刻速度为常规蚀刻速度的1.2倍。
需要说明的是，蚀刻速度由控制蚀刻机的中控台直接进行控制。
本申请提供的一个实施例中，在步骤S1后，制作方法还包括以下步骤：加厚基板1的铜层，并在铜层上镀锡层4。其中，如图6所示，锡层4设置于图形线路上方。设置锡层4，能够保护铜层免受碱性蚀刻溶液浸蚀，从而确保印刷电路板质量。
需要说明的是，为保证印刷电路板能够正常使用，完成上述步骤后，本申请实施例提供的制作方法还包括退膜等步骤，例如图8所示，为经退膜处理后得到的印刷电路板。
由于基板1上预设开设插槽3的位置处没有设计图形线路，因此，相比于其他位置，预设开设插槽3的位置处基板1厚度较小，为了提升基板1表面的平整性以及电镀的均匀性，本申请提供的一个实施例中，如图4所示，在基板1上制作图形线路的步骤中，制作方法还包括以下步骤：在预设开设插槽3的部分区域覆盖辅助铜5，并使辅助铜5连接至邦定焊盘2的延伸部22远离邦定部21的一侧。通过增设辅助铜5，能够填平基板1表面，使基板1上各处厚度相等，从而能够保证基板1表面的平整性以及电镀的均匀性。
为了保证印刷电路板能够正常工作，在步骤S3之后，该印刷电路板的制作方法还包括退锡、缺陷检查等步骤，此部分属于现有技术，在此不再详细赘述。
第二方面，本申请实施例还提供了一种印刷电路板，该印刷电路板采用第一方面中的印刷电路板的制作方法制成。
参照图3-9，本申请实施例提供的印刷电路板在制作时，需要先在基板1上开设插槽3，而后利用碱性溶液对邦定焊盘2的延伸部22进行蚀刻处理，由于碱性溶液蚀刻图形线路时，各个方向的蚀刻速度基本相同，从而能够保证经蚀刻处理后的各个方向的邦定焊盘2至插槽3的间距相同或相近，即邦定焊盘2距插槽3的间距具有较高的一致性。同时，上述印刷电路板在制作时，通过设计邦定部21及连接至插槽3的延伸部22，能够确保经蚀刻处理后的邦定焊盘2距插槽3的间距满足预设要求，有效避免邦定焊盘2距插槽3间距过大引起的邦定金线浪费问题。
以上所述实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围，均应包含在本申请的保护范围之内。

Claims (12)

  1. 一种印刷电路板的制作方法，其特征在于，包括：
    在基板（1）上制作图形线路，所述图形线路包括邦定焊盘（2），所述邦定焊盘（2）包括邦定部（21）及设于所述邦定部（21）一端的延伸部（22）；
    在所述基板（1）上开设插槽（3），所述插槽（3）贯穿所述邦定焊盘（2）的部分延伸部（22）；
    对所述邦定焊盘（2）的延伸部（22）进行碱性蚀刻处理，以去除所述延伸部（22）。
  2. 根据权利要求1所述的印刷电路板的制作方法，其特征在于，所述延伸部（22）包括延长段及补偿段，所述延长段的一端连接至所述邦定部（21）、另一端连接至所述补偿段，其中，所述延长段的长度与所述邦定部（21）的邦定端到插槽（3）的预设间距相等；
    记所述延伸部（22）的长度为A，记所述邦定部（21）的邦定端到插槽（3）的预设间距为B，记所述延伸部（22）的补偿量为C，则A＝B+C，其中0.15mm≤C≤0.2mm。
  3. 根据权利要求1所述的印刷电路板的制作方法，其特征在于，在所述基板（1）上开设插槽（3）包括：
    利用双刃螺旋锣刀在所述基板（1）上开设插槽（3）。
  4. 根据权利要求3所述的印刷电路板的制作方法，其特征在于，记所述双刃螺旋锣刀的默认行刀速度为V 0，记所述双刃螺旋锣刀的实际行刀速度为V 1，控制V 1=0.8V 0，其中，所述默认行刀速度为双刃螺旋锣刀正常工作状态下的运行速度。
  5. 根据权利要求1所述的印刷电路板的制作方法，其特征在于，在所述基板（1）上开设插槽（3）前，所述制作方法还包括：
    在所述基板（1）上方及所述基板（1）下方覆盖酚醛树脂盖板。
  6. 根据权利要求1所述的印刷电路板的制作方法，其特征在于，在基板（1）上制作图形线路之前，所述制作方法还包括：
    根据所述基板（1）的底铜厚度及所述邦定部（21）到所述插槽（3）的预设间距，确定所述图形线路的补偿量。
  7. 根据权利要求6所述的印刷电路板的制作方法，其特征在于，记所述基板（1）的底铜厚度为D，记所述邦定部（21）的邦定端到所述插槽（3）的预设间距为B，记所述图形线路的补偿量为L，所述基板（1）的底铜厚度、所述邦定部（21）的邦定端到插槽（3）的预设间距及所述图形线路的补偿量满足以下关系：
    0.05mm＜B≤0.08mm时，
    1），当D＜18μm，L=0.015mm；
    2），当18μm≤D＜30μm，L=0.02mm；
    3），当30μm≤D＜45μm，L=0.03mm；
    4），当45μm≤D＜60μm，L=0.04mm；
    B≤0.05mm时，
    1），当D＜18μm，L=0.015mm；
    2），当18μm≤D＜30μm，L=0.02mm；
    3），当30μm≤D＜45μm，L=0.027mm。
  8. 根据权利要求7所述的印刷电路板的制作方法，其特征在于，记0.05mm＜B≤0.08mm、D＜45μm及B≤0.05mm、D＜30μm条件下，对所述邦定焊盘（2）的延伸部（22）进行碱性蚀刻处理的蚀刻速度为常规蚀刻速度，当0.05mm＜B≤0.08mm、45μm≤D＜60μm及B≤0.05mm、30μm≤D＜45μm时，对所述邦定焊盘（2）的延伸部（22）进行碱性蚀刻处理的蚀刻速度为常规蚀刻速度的1.2倍。
  9. 根据权利要求1所述的印刷电路板的制作方法，其特征在于，在基板（1）上制作图形线路之前，所述制作方法还包括：在所述基板（1）的底铜上镀锡层（4）。
  10. 根据权利要求1所述的印刷电路板的制作方法，其特征在于，在基板（1）上制作图形线路的步骤中，所述制作方法还包括：
    在预设开设所述插槽（3）的部分区域覆盖辅助铜（5），并使所述辅助铜（5）连接至所述邦定焊盘（2）的延伸部（22）远离所述邦定部（21）的一侧。
  11. 一种印刷电路板，其特征在于，采用如权利要求1至10中任一项所述的印刷电路板的制作方法所制成。
  12. 根据权利要求11所述的印刷电路板，其特征在于，所述印刷电路板的基板（1）上设有插槽（3）及邦定焊盘（2），所述邦定焊盘（2）围绕所述插槽（3）设置且所述邦定焊盘（2）至所述插槽（3）的间距相等。
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