WO2022114192A1 - 焼結体及び切削工具 - Google Patents
焼結体及び切削工具 Download PDFInfo
- Publication number
- WO2022114192A1 WO2022114192A1 PCT/JP2021/043683 JP2021043683W WO2022114192A1 WO 2022114192 A1 WO2022114192 A1 WO 2022114192A1 JP 2021043683 W JP2021043683 W JP 2021043683W WO 2022114192 A1 WO2022114192 A1 WO 2022114192A1
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- WIPO (PCT)
- Prior art keywords
- sintered body
- diamond particles
- mass
- group
- binder
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims description 103
- 239000002245 particle Substances 0.000 claims abstract description 92
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 85
- 239000010432 diamond Substances 0.000 claims abstract description 85
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000011230 binding agent Substances 0.000 claims abstract description 54
- 229910052796 boron Inorganic materials 0.000 claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 23
- 230000000737 periodic effect Effects 0.000 claims description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000010941 cobalt Substances 0.000 claims description 15
- 229910017052 cobalt Inorganic materials 0.000 claims description 15
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910021480 group 4 element Inorganic materials 0.000 claims description 6
- 229910021478 group 5 element Inorganic materials 0.000 claims description 6
- 229910021476 group 6 element Inorganic materials 0.000 claims description 6
- 229910000765 intermetallic Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 239000006104 solid solution Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 27
- 238000005245 sintering Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 9
- 238000001878 scanning electron micrograph Methods 0.000 description 9
- 238000010998 test method Methods 0.000 description 9
- 238000010306 acid treatment Methods 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 238000001226 reprecipitation Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- LVXIMLLVSSOUNN-UHFFFAOYSA-N fluorine;nitric acid Chemical compound [F].O[N+]([O-])=O LVXIMLLVSSOUNN-UHFFFAOYSA-N 0.000 description 1
- 238000001036 glow-discharge mass spectrometry Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/528—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from carbonaceous particles with or without other non-organic components
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
- B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
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- C—CHEMISTRY; METALLURGY
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/6303—Inorganic additives
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/40—Carbon, graphite
- B22F2302/406—Diamond
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2200/00—Details of cutting inserts
- B23B2200/04—Overall shape
- B23B2200/049—Triangular
- B23B2200/0495—Triangular rounded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2226/00—Materials of tools or workpieces not comprising a metal
- B23B2226/31—Diamond
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/148—Composition of the cutting inserts
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/422—Carbon
- C04B2235/427—Diamond
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/72—Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
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- C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
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- C04B2235/786—Micrometer sized grains, i.e. from 1 to 100 micron
Definitions
- Patent Document 1 Japanese Unexamined Patent Publication No. 2008-133172 describes a sintered body.
- the sintered body described in Patent Document 1 is formed by mixing a boron-doped diamond powder and a carbonate powder, and heating and pressurizing the mixture.
- Patent Document 2 Japanese Unexamined Patent Publication No. 58-19977 describes a sintered body.
- the sintered body described in Patent Document 2 is formed by mixing diamond powder and catalyst metal powder, and heating and pressurizing the mixture.
- the catalyst metal powder contains a boron carbide powder and a metal powder (iron, nickel, cobalt, etc.).
- the sintered body of the present disclosure includes diamond particles and a binder.
- the boron concentration in the diamond particles is 0.001% by mass or more and 0.9% by mass or less.
- the boron concentration in the binder is 0.5% by mass or more and 40% by mass or less.
- FIG. 1 is a plan view of the cutting insert 100.
- FIG. 2 is a perspective view of the cutting insert 100.
- FIG. 3 is a process diagram showing a method of manufacturing a sintered body constituting the cutting edge portion 20.
- the tool life can be improved when applied to a cutting tool.
- the sintered body according to one embodiment includes diamond particles and a binder.
- the boron concentration in the diamond particles is 0.001% by mass or more and 0.9% by mass or less.
- the boron concentration in the binder is 0.5% by mass or more and 40% by mass or less.
- the tool life can be improved when applied to a cutting tool.
- the boron concentration in the diamond particles may be 0.005% by mass or more and 0.1% by mass or less.
- the boron concentration in the binder may be 0.6% by mass or more and 33% by mass or less.
- the tool life can be further improved when applied to a cutting tool.
- the average particle size of diamond particles may be 0.1 ⁇ m or more and 50 ⁇ m or less.
- the proportion of diamond particles in the sintered body may be 80% by volume or more and 99% by volume or less.
- the binder may contain at least one selected from the group consisting of elemental metals, alloys and intermetallic compounds.
- Single metals, alloys and intermetal compounds were selected from the group consisting of Group 4 elements of the Periodic Table, Group 5 elements of the Periodic Table, Group 6 elements of the Periodic Table, iron, aluminum, silicon, cobalt and nickel. It may contain at least one metal element.
- the binder may contain at least one selected from the group consisting of a compound and a solid solution derived from the compound.
- the compound may consist of at least one selected from the group consisting of elemental metals, alloys and intermetallic compounds and at least one selected from the group consisting of nitrogen, carbon and oxygen.
- Single metals, alloys and intermetal compounds were selected from the group consisting of Group 4 elements of the Periodic Table, Group 5 elements of the Periodic Table, Group 6 elements of the Periodic Table, iron, aluminum, silicon, cobalt and nickel. It may contain at least one metal element.
- the binder may contain at least cobalt.
- the cutting tool according to the embodiment includes a cutting edge portion.
- the cutting edge portion is formed by the sintered body of the above (1) to (6).
- the cutting tool according to the embodiment is, for example, a cutting insert 100.
- the cutting tool according to the embodiment is not limited to the cutting insert 100, but the cutting insert 100 will be described below as an example of the cutting tool according to the embodiment.
- FIG. 1 is a plan view of the cutting insert 100.
- FIG. 2 is a perspective view of the cutting insert 100.
- the cutting insert 100 has a base material 10 and a cutting edge portion 20.
- the cutting insert 100 has a polygonal shape (for example, a triangular shape) in a plan view.
- the polygonal shape does not have to be a strict polygonal shape (triangular shape). More specifically, the corners of the cutting insert 100 in a plan view may be rounded.
- the base material 10 has a polygonal shape (for example, a triangular shape) in a plan view.
- the base material 10 has a top surface 10a, a bottom surface 10b, and a side surface 10c.
- the top surface 10a and the bottom surface 10b are end faces of the base material 10 in the thickness direction.
- the bottom surface 10b is the opposite surface of the top surface 10a in the thickness direction of the base material 10.
- the side surface 10c is a surface connected to the top surface 10a and the bottom surface 10b.
- the top surface 10a has a mounting portion 10d.
- the mounting portion 10d is located at the corner of the top surface 10a in a plan view.
- the distance between the top surface 10a and the bottom surface 10b in the mounting portion 10d is smaller than the distance between the top surface 10a and the bottom surface 10b other than the mounting portion 10d. That is, there is a step between the mounting portion 10d and the portion of the top surface 10a other than the mounting portion 10d.
- a through hole 11 is formed in the base material 10.
- the through hole 11 penetrates the base material 10 in the thickness direction.
- the through hole 11 is formed in the center of the base material 10 in a plan view.
- the cutting insert 100 is subjected to cutting, for example, by inserting a fixing member (not shown) into the through hole 11 and fastening the fixing member to a tool holder (not shown).
- the base material 10 may not have a through hole 11.
- the base material 10 is formed of, for example, a cemented carbide.
- Cemented carbide is a composite material obtained by sintering carbide particles and a binder.
- the carbide particles are, for example, particles such as tungsten carbide, titanium carbide, and tantalum carbide.
- the binder is, for example, cobalt, nickel, iron or the like.
- the base material 10 may be formed of a material other than the cemented carbide.
- the cutting edge portion 20 is attached to the attachment portion 10d.
- the cutting edge portion 20 is attached to the base material 10 by, for example, brazing.
- the cutting edge portion 20 has a rake surface 20a, a flank surface 20b, and a cutting edge 20c.
- the rake face 20a is connected to a portion of the top surface 10a other than the mounting portion 10d.
- the flank 20b is connected to the side surface 10c.
- the cutting edge 20c is formed on the ridgeline between the rake surface 20a and the flank surface 20b.
- the back metal 21 may be arranged on the bottom surface of the cutting edge portion 20 (the surface opposite to the rake surface 20a).
- the back metal 21 is formed of, for example, a cemented carbide.
- the cutting edge portion 20 is formed of a sintered body containing diamond particles and a binder.
- the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20 is preferably 0.1 ⁇ m or more and 50 ⁇ m or less.
- the ratio (volume ratio) of diamond particles in the sintered body constituting the cutting edge portion 20 is preferably 80% by volume or more and 99% by volume or less.
- the binder contains, for example, cobalt.
- the binder may contain titanium in addition to cobalt.
- the component with the highest content in the binder is preferably cobalt.
- the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20 is calculated by the following method.
- a sample including a cross section is cut out from an arbitrary position of the cutting edge portion 20. This sample is cut out using, for example, a focused ion beam device, a cross polisher device, or the like.
- the cross section of the cut out sample is observed with a scanning electron microscope (SEM).
- SEM image a backscattered electron image (hereinafter referred to as "SEM image") in the cross section of the cut out sample is obtained.
- the magnification is adjusted so that 100 or more diamond particles are included in the measurement field of view.
- SEM images are acquired at five locations within the cross section of the cut sample.
- the distribution of the particle size of the diamond particles contained in the measurement field of view is acquired.
- This image processing is performed by, for example, Win ROOF ver. Manufactured by Mitani Corporation. 7.4.5, WinROOF2018 and the like are used.
- the particle size of each diamond particle is obtained by calculating the equivalent circle diameter from the area of each diamond particle obtained as a result of image processing.
- the diamond particles whose part is outside the measurement field of view are not taken into consideration.
- the median diameter of the diamond particles contained in the measurement field of view is determined from the distribution of the particle size of the diamond particles contained in the measurement field of view obtained as described above.
- the value obtained by averaging the determined median diameters for the five SEM images is considered to be the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20.
- the ratio of diamond particles in the sintered body constituting the cutting edge portion 20 is calculated by the following method.
- a sample including a cross section is cut out from an arbitrary position of the cutting edge portion 20. This sample is cut out using, for example, a focused ion beam device, a cross polisher device, or the like.
- the cross section of the cut out sample is observed by SEM. This observation gives an SEM image of the cross section of the cut out sample. In the observation by SEM, the magnification is adjusted so that 100 or more diamond particles are included in the measurement field of view. SEM images are acquired at five locations within the cross section of the cut sample.
- the proportion of diamond particles contained in the measurement field of view is calculated by performing image processing on the SEM image.
- This image processing is performed by, for example, Win ROOF ver. Manufactured by Mitani Corporation. It is performed by performing a binarization process of the SEM image using 7.4.5, WinROOF2018 or the like.
- the dark field in the SEM image after the binarization process corresponds to the region where the diamond particles are present.
- the value obtained by dividing the area of the dark field by the area of the measurement region is considered to be the volume ratio of the diamond particles in the sintered body constituting the cutting edge portion 20.
- the boron concentration in the diamond particles is 0.001% by mass or more and 0.9% by mass or less.
- the boron concentration in the binder is 0.5% by mass or more and 40% by mass or less.
- the boron concentration in the binder is preferably equal to or higher than the boron concentration in the diamond particles (that is, the value obtained by subtracting the boron concentration in the diamond particles from the boron concentration in the binder is 0% by mass or more. preferable).
- the value obtained by subtracting the boron concentration in the diamond particles from the boron concentration in the binder is preferably 30% by mass or less.
- the boron concentration in the diamond particles may be 0.005% by mass or more and 0.1% by mass or less. It may be 0.6% by mass or more and 33% by mass or less. In this case, the value obtained by subtracting the boron concentration in the diamond particles from the boron concentration in the binder is preferably 0.5% by mass or more and 25% by mass or less.
- the boron concentration in the diamond particles and the boron concentration in the binder are measured by the following methods.
- the sample is cut out from an arbitrary position of the cutting edge portion 20.
- the cut out sample is acid treated.
- this acid treatment substantially all the components of the binder contained in the sample are dissolved in the acid. That is, the sample after this acid treatment is substantially composed of only diamond particles.
- the above acid treatment is performed using an aqueous solution of fluorinated nitric acid.
- This aqueous solution of fluorine nitric acid is produced by mixing a 50% aqueous solution of hydrogen fluoride and a 60% aqueous solution of nitric acid at a ratio of 1: 1.
- the acid treatment is carried out by immersing the sample in the aqueous solution of fluorinated nitric acid and holding it at 200 ° C. for 48 hours.
- the concentration of boron in the diamond particles is measured by performing glow discharge mass spectrometry on the sample after the acid treatment. Further, the concentration of boron in the binder is measured by performing inductively coupled plasma analysis on the acid used for the acid treatment.
- FIG. 3 is a process diagram showing a method of manufacturing a sintered body constituting the cutting edge portion 20.
- the method for manufacturing the sintered body constituting the cutting edge portion 20 includes a powder preparation step S1, a powder mixing step S2, and a sintering step S3.
- diamond powder, binder powder and boron powder are prepared.
- the diamond powder is a diamond powder
- the binder powder is a powder formed by the materials constituting the binder.
- Boron powder is a boron powder.
- the ratio of the diamond powder, the binder powder and the boron powder is appropriately selected according to the volume ratio of the diamond particles in the sintered body constituting the cutting edge portion 20 and the boron concentration in the diamond particles and the binder.
- the powder mixing step S2 diamond powder, binder powder and boron powder are mixed. This mixing is performed, for example, using an attritor or a ball mill. However, the mixing method is not limited to these. In the following, a mixture of diamond powder, binder powder and boron powder will be referred to as “mixed powder”.
- the mixed powder is sintered.
- This sintering is performed by arranging the mixed powder in a container and holding the mixed powder at a predetermined sintering temperature at a predetermined sintering pressure.
- This container is made of a refractory metal such as tantalum and niobium in order to prevent impurities from being mixed into the mixed powder (sintered body).
- the sintering pressure is controlled to increase with the passage of holding time.
- the sintering step S3 may be divided into a plurality of steps.
- the plurality of steps include, for example, a first step and a second step.
- the second step is performed after the first step.
- the sintering pressure in the second step is higher than the sintering pressure in the first step.
- the sintering temperature in the second step is higher than the sintering temperature in the first step.
- the holding time in the second step is shorter than the holding time in the first step.
- the sintering pressure in the first step is, for example, 3 GPa.
- the sintering pressure in the second step is, for example, 7 GPa.
- the sintering temperature in the first step is, for example, 1200 ° C.
- the sintering temperature in the second step is, for example, 1500 ° C.
- the holding time in the first step is appropriately selected according to the boron concentration in the diamond particles contained in the sintered body constituting the cutting edge portion 20 and the boron concentration in the binder contained in the sintered body. As the holding time in the first step becomes longer, the boron concentration in the diamond particles contained in the sintered body constituting the cutting edge portion 20 increases, and the boron concentration in the binder contained in the sintered body decreases. do.
- the holding time in the second step is, for example, 1 minute.
- the presence of boron in the diamond particles improves the oxidation resistance of the diamond particles, and as a result, the wear resistance of the cutting edge portion 20 is improved.
- the boron concentration in the diamond particles is less than 0.001% by mass, the effect of boron on improving the oxidation resistance of the diamond particles is poor.
- the boron concentration in the diamond particles exceeds 0.9% by mass, the amount of boron in the diamond particles becomes excessive, the hardness of the diamond particles decreases, and the wear resistance of the cutting edge portion 20 decreases.
- the binder powder is melted, and the boron powder is melted in the melted binder. Then, a part of the diamond powder is dissolved in the molten binder, and the diamond particles are reprecipitated, so that the bonding (necking) between the diamond particles proceeds. Since the boron in the dissolved binder acts as a nucleus at the time of this reprecipitation, when the boron concentration in the binder is less than 0.5% by mass, the diamond particles are less likely to be necked.
- the boron concentration in the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 0.001% by mass or more and 0.9% by mass or less, the hardness of the diamond particles is maintained. However, the oxidation resistance of the diamond particles is improved. Further, in the cutting insert 100, since the boron concentration in the binder contained in the sintered body constituting the cutting edge portion 20 is 0.5% by mass or more and 40% by mass or less, the gloss neck strength between the diamond particles is increased. Can be secured. As described above, according to the cutting insert 100, the wear resistance of the cutting edge portion 20 is improved.
- Table 1 shows the samples subjected to the cutting test. As shown in Table 1, Samples 1 to 22 were provided for the cutting test. In Samples 1 to 8, the boron concentration in the binder contained in the sintered body constituting the cutting edge portion 20 is kept constant (10% by mass), and then in the diamond particles contained in the sintered body. The boron concentration was changed.
- Condition A1 is that the boron concentration in the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 0.001% by mass or more and 0.9% by mass or less.
- Condition B1 is that the boron concentration in the binder contained in the sintered body constituting the cutting edge portion 20 is 0.5% by mass or more and 40% by mass or less.
- Condition A2 is that the boron concentration in the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 0.005% by mass or more and 0.1% by mass or less.
- Condition B2 is that the boron concentration in the binder contained in the sintered body constituting the cutting edge portion 20 is 0.6% by mass or more and 33% by mass or less.
- condition A1 condition A2
- condition B1 condition B2 was also satisfied.
- condition A1 condition A2
- condition B1 was satisfied, but the condition B1 was not satisfied.
- the average particle size of the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 0.5 ⁇ m, and the ratio of the diamond particles contained in the sintered body is 90% by volume. Was done.
- any of the average particle size and the ratio of the diamond particles contained in the sintered body constituting the cutting edge portion 20 is different from that of Samples 1 to 16.
- condition A1 (condition A2) and condition B1 (condition B2) were satisfied.
- the first test method, the second test method and the third test method were used for the cutting test.
- the first test method was used for the evaluation of samples 1 to 8
- the second test method was used for the evaluation of samples 9 to 16.
- the third test method was used to evaluate Samples 17-22. Table 2 shows the details of the first test method, the second test method, and the third test method.
- Table 3 shows the results of the cutting test. As shown in Table 3, Samples 1 to 6 and Samples 9 to 14 showed long tool life. On the other hand, in Samples 7 and 8, and in Samples 15 and 16, the cutting edge portion 20 was chipped at the initial stage of cutting (hereinafter referred to as "initial chipping").
- the conditions A1 and B1 are satisfied in the samples 1 to 6 and the samples 9 to 14, while one of the conditions A1 and B1 is satisfied in the samples 7 and 8 and the samples 15 and 16. I wasn't. From this comparison, it was clarified that the tool life of the cutting insert 100 is improved by satisfying both the condition A1 and the condition B1.
- Samples 2 to 5 showed a longer tool life than Samples 1 and 6.
- Samples 10 to 13 showed a longer tool life than Samples 9 and 14.
- Samples 17 to 22 all showed a long tool life. As described above, the samples 17 to 22 satisfy the condition A1 (condition A2) and the condition B1 (condition B2).
- Condition C is that the volume ratio of the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 80% or more and 99% or less.
- Condition D is that the average particle size of the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 0.1 ⁇ m or more and 50 ⁇ m or less. While the conditions C and D were satisfied in the samples 17 to 19, one of the conditions C and D was not satisfied in the samples 20 to 22.
- Samples 17 to 19 showed a longer tool life than samples 20 to 22. From this comparison, it became clear that the tool life of the cutting insert 100 is further improved by further satisfying the conditions C and D.
- the binder contained in the sintered body constituting the cutting edge portion 20 may contain at least one selected from the group consisting of elemental metals, alloys and intermetallic compounds.
- the single metals, alloys and intermetal compounds are Group 4 elements of the Periodic Table (eg titanium, zirconium, hafnium), Group 5 elements of the Periodic Table (eg vanadium, tantalum, niob), Group 6 elements of the Periodic Table. It contains at least one metal element selected from the group consisting of (eg, chromium, molybdenum, tungsten), aluminum, iron, silicon, cobalt and nickel.
- the above-mentioned periodic table means a so-called long-periodic table.
- the binder contained in the sintered body constituting the cutting edge portion 20 may contain at least one selected from the group consisting of a compound and a solid solution derived from the compound.
- This compound comprises at least one selected from the group consisting of elemental metals, alloys and intermetallic compounds and at least one selected from the group consisting of nitrogen, carbon and oxygen.
- This single metal, alloy and intermetal compound is selected from the group consisting of Group 4 elements of the Periodic Table, Group 5 elements of the Periodic Table, Group 6 elements of the Periodic Table, aluminum, iron, silicon, cobalt and nickel. It contains at least one metallic element.
- the cutting insert 100 has the base material 10
- the cutting insert 100 may be formed of the same sintered body as the cutting edge portion 20 other than the cutting edge portion 20.
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Abstract
Description
本発明者らが鋭意検討した結果、特許文献1に記載の焼結体及び特許文献2に記載の焼結体を切削工具に適用した場合に、工具寿命に改善の余地があることがわかった。本開示は、切削工具に適用した場合に工具寿命を改善可能な焼結体を提供するものである。
本開示の焼結体によると、切削工具に適用した場合に工具寿命を改善可能である。
まず、本開示の実施形態を列記して説明する。
(2)上記(1)の焼結体では、ダイヤモンド粒子中における硼素濃度が、0.005質量パーセント以上0.1質量パーセント以下であってもよい。結合材中における硼素濃度は、0.6質量パーセント以上33質量パーセント以下であってもよい。
[本開示の実施形態の詳細]
本開示の実施形態の詳細を、図面を参照しながら説明する。以下の図面においては、同一又は相当する部分に同一の参照符号を付し、重複する説明は繰り返さないものとする。
切削インサート100の構成を説明する。
図1は、切削インサート100の平面図である。図2は、切削インサート100の斜視図である。図1及び図2に示されるように、切削インサート100は、基材10と、刃先部20とを有している。切削インサート100は、平面視において多角形形状(例えば、三角形形状)である。多角形形状(三角形形状)は、厳密な多角形形状(三角形形状)でなくてもよい。より具体的には、切削インサート100の平面視におけるコーナは、丸まっていてもよい。
刃先部20は、ダイヤモンド粒子と、結合材とを含む焼結体により形成されている。刃先部20を構成している焼結体中におけるダイヤモンド粒子の平均粒径は、0.1μm以上50μm以下であることが好ましい。刃先部20を構成している焼結体中におけるダイヤモンド粒子の割合(体積比率)は、80体積パーセント以上99体積パーセント以下であることが好ましい。結合材は、例えば、コバルトを含んでいる。結合材は、コバルトに加え、チタンを含んでいてもよい。結合材中において最も含有量の多い成分は、コバルトであることが好ましい。
図3は、刃先部20を構成している焼結体の製造方法を示す工程図である。図3に示されるように、刃先部20を構成している焼結体の製造方法は、粉末準備工程S1と、粉末混合工程S2と、焼結工程S3とを有している。
以下に、切削インサート100の効果を説明する。
切削インサート100の効果を確認するために行った切削試験を説明する。
上記においては刃先部20を構成している焼結体に含まれる結合材がコバルトである場合を例として説明したが、刃先部20を構成している焼結体に含まれる結合材は、コバルトに限られない。
Claims (7)
- ダイヤモンド粒子と、結合材とを備え、
前記ダイヤモンド粒子中における硼素濃度は、0.001質量パーセント以上0.9質量パーセント以下であり、
前記結合材中における硼素濃度は、0.5質量パーセント以上40質量パーセント以下である、焼結体。 - 前記ダイヤモンド粒子中における硼素濃度は、0.005質量パーセント以上0.1質量パーセント以下であり、
前記結合材中における硼素濃度は、0.6質量パーセント以上33質量パーセント以下である、請求項1に記載の焼結体。 - 前記ダイヤモンド粒子の平均粒径は、0.1μm以上50μm以下であり、
前記焼結体中における前記ダイヤモンド粒子の割合は、80体積パーセント以上99体積パーセント以下である、請求項1又は請求項2に記載の焼結体。 - 前記結合材は、単体金属、合金及び金属間化合物からなる群より選択される少なくとも1種を含み、
前記単体金属、前記合金及び前記金属間化合物は、周期表の第4族元素、周期表の第5族元素、周期表の第6属元素、鉄、アルミニウム、珪素、コバルト及びニッケルからなる群より選択された少なくとも1種の金属元素を含む、請求項1から請求項3のいずれか1項に記載の焼結体。 - 前記結合材は、化合物及び前記化合物由来の固溶体からなる群から選択される少なくとも1種を含み、
前記化合物は、単体金属、合金及び金属間化合物からなる群から選択される少なくとも1種と窒素、炭素及び酸素からなる群から選択される少なくとも1種とからなり、
前記単体金属、前記合金及び前記金属間化合物は、周期表の第4族元素、周期表の第5族元素、周期表の第6属元素、鉄、アルミニウム、珪素、コバルト及びニッケルからなる群より選択された少なくとも1種の金属元素を含む、請求項1から請求項3のいずれか1項に記載の焼結体。 - 前記結合材は、少なくともコバルトを含む、請求項1から請求項5のいずれか1項に記載の焼結体。
- 刃先部を備え、
前記刃先部は、請求項1から請求項6のいずれか1項に記載の前記焼結体により形成されている、切削工具。
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JP7359522B2 (ja) | 2023-10-11 |
JPWO2022114192A1 (ja) | 2022-06-02 |
KR20230111194A (ko) | 2023-07-25 |
CN116529004A (zh) | 2023-08-01 |
EP4252941A4 (en) | 2024-04-24 |
US20240091862A1 (en) | 2024-03-21 |
EP4252941A1 (en) | 2023-10-04 |
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