WO2022114144A1 - 逆止弁用ボール - Google Patents

逆止弁用ボール Download PDF

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Publication number
WO2022114144A1
WO2022114144A1 PCT/JP2021/043463 JP2021043463W WO2022114144A1 WO 2022114144 A1 WO2022114144 A1 WO 2022114144A1 JP 2021043463 W JP2021043463 W JP 2021043463W WO 2022114144 A1 WO2022114144 A1 WO 2022114144A1
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WO
WIPO (PCT)
Prior art keywords
check valve
sphere
valve ball
film
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/043463
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English (en)
French (fr)
Japanese (ja)
Inventor
翔一 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2022565462A priority Critical patent/JPWO2022114144A1/ja
Priority to US18/038,879 priority patent/US20230417334A1/en
Publication of WO2022114144A1 publication Critical patent/WO2022114144A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K25/00—Details relating to contact between valve members and seats
    • F16K25/005—Particular materials for seats or closure elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00—Check valves
    • F16K15/02—Check valves with guided rigid valve members
    • F16K15/04—Check valves with guided rigid valve members shaped as balls
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00—Check valves
    • F16K15/02—Check valves with guided rigid valve members
    • F16K15/04—Check valves with guided rigid valve members shaped as balls
    • F16K15/048—Ball features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
    • G01N30/02—Column chromatography
    • G01N30/26—Conditioning of the fluid carrier; Flow patterns
    • G01N30/28—Control of physical parameters of the fluid carrier
    • G01N30/32—Control of physical parameters of the fluid carrier of pressure or speed

Definitions

  • the present invention relates to a check valve ball.
  • Liquid pumps used in analytical equipment such as liquid chromatography require precise flow rate control.
  • a precise check valve (check valve) in which a ball is lifted by a flow of liquid has been conventionally used (for example, Patent Document 1).
  • the ball used for such a check valve is made of ruby or the like, and the ball sheet is made of sapphire or the like.
  • the check valve ball according to the present disclosure includes a sphere containing tungsten or platinum as a main component and a film containing a metal compound located on the surface of the sphere as a main component.
  • the check valve according to the present disclosure includes the above-mentioned check valve ball and a ball sheet that can be contacted and separated from the check valve ball.
  • the liquid feeding device according to the present disclosure is provided with the above-mentioned check valve, and the liquid chromatography device according to the present disclosure is provided with the above-mentioned liquid feeding device.
  • the ball formed of conventional ruby has a small specific gravity. Therefore, there is a problem that it takes time to stop the backflow.
  • the ball is made of a metal having a specific density higher than that of ruby, there is a problem that the surface of the ball is easily corroded in a short time depending on the type of fluid.
  • the check valve ball according to the present disclosure includes a sphere containing tungsten or platinum having a large specific gravity as a main component, and a film having an oxide or non-oxide as a main component on the surface of the sphere. Therefore, according to the check valve ball according to the present disclosure, the responsiveness when the fluid flows back is excellent, so that the backflow can be efficiently prevented. Further, since the check valve ball according to the present disclosure has a film containing an oxide or a non-oxide as a main component, it is not easily corroded by a fluid.
  • FIG. 1 is a cross-sectional view showing a check valve provided with a check valve ball according to an embodiment of the present disclosure.
  • the check valve 1 according to the embodiment shown in FIG. 1 includes a check valve ball 2, a ball sheet 3, and a casing 4.
  • the check valve ball 2 according to the embodiment provided in the check valve 1 includes a sphere 21 and a film 22 located on the surface of the sphere 21.
  • the sphere 21 is made of a metal containing tungsten or platinum as a main component. Tungsten and platinum have a high specific density, which improves the responsiveness to the backflow of the liquid.
  • the metal containing tungsten or platinum as a main component means a metal containing tungsten or platinum in a proportion of 50.5% by mass or more.
  • the main component When the main component is tungsten, other components include molybdenum, iron, nickel and copper, and may be a tungsten-based sintered alloy.
  • the main component When the main component is platinum, the other components are, for example, palladium, iridium, and ruthenium, and examples thereof include Pt999, Pt950, Pt900, Pt850, Pt ⁇ Pm (Pt750), Pt650, Pt585, and Pt505.
  • the tungsten-based sintered alloy includes WC-Co-based, WC-Cr 3C 2 -Co-based, WC-TaC-Co-based, WC-TiC-Co-based, and WC.
  • WC-TaC-NbC-Co system WC-TaC-NbC-Co system, WC-TiC-TaC-NbC-Co system, WC-TiC-TaC-Co system, WC-ZrC-Co system, WC-TiC-ZrC-Co system , WC-TaC-VC-Co system, WC-Cr 3 C 2 -Co system, WC-TiC-Cr 3 C 2 -Co system, WC-Ni system, WC-Co-Ni system, WC-Cr 3 C 2 -Mo 2 C-Ni system, WC-Ti (C, N) -TaC system, WC-Ti (C, N) system and the like can be mentioned.
  • the relative density of the sphere 21 is preferably 99.5% by mass or more and 99.99% by mass or less. When the relative density of the sphere 21 is in this range, the substantial mass of the sphere 21 becomes large, so that the responsiveness to the backflow of the liquid is further improved.
  • the relative density of the sphere 21 is a percentage of the theoretical density of the sphere 21 with respect to the apparent density of the sphere 21 determined in accordance with JIS R 1634: 1998.
  • the content of the components constituting the sphere 21 is determined by ICP (Inductively Coupled Plasma) emission spectroscopic analysis method or fluorescent X-ray analysis method. Each component is identified by X-ray diffraction method using CuK ⁇ ray. For example, if the identified component is tungsten carbide (WC), it is converted to tungsten carbide (WC) using the value of the W content determined by ICP emission spectroscopic analysis or fluorescent X-ray analysis.
  • the components constituting the sphere 21 are, for example, tungsten carbide (WC) and cobalt (Co) and their contents are a mass% and b mass%, respectively.
  • the theoretical densities of the respective components are taken.
  • the average diameter of the crystal particles constituting the main component of the sphere 21 may be 0.15 ⁇ m or less (however, excluding 0 ⁇ m).
  • the surface of the sphere 21 can be easily made into a mirror surface by polishing described later, and the sphere can be made into a sphere having excellent sphericity.
  • the sphericity of the sphere 21 is 20 ⁇ m or less, and this sphericity can be obtained in accordance with JIS B 1501: 2009.
  • the average diameter is measured by using a scanning electron microscope to measure the polishing marks obtained by the spherical polishing method using a ball coated with a paste containing diamond abrasive grains or the polished surface obtained by polishing the cross section of a sphere. Is required. Specifically, the magnification is 1000 times, the length in the horizontal direction is 112 ⁇ m, and the length in the vertical direction is 80 ⁇ m, and four straight lines having the same length are drawn. The average diameter of the crystal particles constituting the main component of the sphere 21 can be obtained by dividing the number of crystals existing on these four straight lines by the total length of these straight lines. The length per straight line may be 20 ⁇ m.
  • the average coefficient of linear expansion of the sphere 21 from 40 ° C. to 400 ° C. is, for example, 5 ⁇ 10 -6 / K or more and 12.5 ⁇ 10 -6 / K. If the average linear expansion coefficient of the sphere 21 is within this range, the difference from the average linear expansion coefficient of the film 22 containing a metal compound as a main component, which will be described later, is small, and even if it is used in an environment exposed to a fluid having a large temperature difference. The film 22 does not easily peel off.
  • the size of the sphere 21 is not limited.
  • the sphere 21 has a diameter of, for example, about 1 mm or more and 5 mm or less, and is appropriately set according to the size of the check valve 1.
  • a film 22 is formed on the sphere 21 so as to cover the surface.
  • the film 22 is a film containing a metal compound as a main component.
  • the film containing a metal compound as a main component means a film containing a metal compound in a proportion of 90% by mass or more.
  • the film 22 contains metal components other than the main component, for example, Al is 30 mass ppm or less, Fe is 2 mass ppm or less, Ti is 3 mass ppm or less, Mg is 3 mass ppm or less, and K is 1 mass ppm or less. May be good. In particular, the film 22 is preferably contained in an amount of 99.9% by mass or more of the metal compound.
  • the components constituting the film 22 are identified by using an X-ray diffractometer (XRD) using CuK ⁇ rays, and then using a fluorescent X-ray analyzer (XRF) or an ICP emission spectroscopic analyzer (ICP) to identify the elements. The content may be determined and converted into the content of the identified component. If the element content is too low to be determined by a fluorescent X-ray analyzer (XRF) or an ICP emission spectroscopic analyzer (ICP), it may be determined by using the Rietveld method.
  • XRD X-ray diffractometer
  • XRF fluorescent
  • the metal compound used for the film 22 is not limited, and examples thereof include metal oxides, metal carbides, metal nitrides, and metal carbonitrides.
  • the metal oxide include aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, tungsten oxide and the like.
  • Examples of the metal carbide include titanium carbide, silicon carbide and the like.
  • Examples of the metal nitride include titanium nitride, silicon nitride, sialon, and tungsten silicate.
  • Examples of the metal carbonitride include titanium carbonitride.
  • a metal oxide such as aluminum oxide, silicon oxide, titanium oxide, and zirconium oxide as the material of the film 22.
  • the film 22 can be formed at low cost.
  • the Vickers hardness of the film 22 should be, for example, 1.5 GPa or more. When the Vickers hardness of the film 22 is 1.5 GPa or more, it has excellent wear resistance. Further, since it is less likely to be scratched by mechanical contact from the outside, it can be used for a long period of time. For the Vickers hardness of the film 22, the indentation hardness obtained by the nanoindentation method based on ISO14577 may be converted into the Vickers hardness.
  • the thickness of the film 22 is not limited, and is preferably about 0.5 ⁇ m or more and 5 ⁇ m or less, for example.
  • the thickness of the film 22 may be determined by photographing the polishing marks of the check valve ball 2 obtained by the spherical polishing method or the cross section of the check valve ball 2 with an optical microscope and using the obtained image.
  • a paste containing diamond abrasive grains is applied to the balls used in the spherical polishing method in advance.
  • the average diameter of the diamond abrasive grains (D 50 ) may be 2 ⁇ m or less, and the average diameter of the diamond abrasive grains (D 50 ) may be selected so that the film 22 can be easily distinguished from the sphere 21.
  • the sphere 21 whose main component is tungsten for example, powders of tungsten carbide, cobalt, vanadium carbide, chromium carbide and carbon are used.
  • the average particle size of the tungsten carbide powder should be 0.12 ⁇ m or less, particularly 0.1 ⁇ m or less.
  • the above powder is weighed, mixed and pulverized with an organic solvent such as acetone or propanol, and then a binder, for example, a paraffin wax is added, and then granules are obtained using a spray drying device.
  • the obtained granules are filled in a molding die equipped with a heater, and then pressure-molded while heating the molding die. By pressure molding while heating the molding die, the pressure is transmitted substantially evenly to the entire molded body, and a molded body having few voids can be obtained.
  • the heating temperature is higher than the melting temperature of the binder and lower than the evaporation temperature.
  • the heating temperature is preferably 40 ° C. or higher and 80 ° C. or lower, which is equivalent to the melting temperature. If the heating temperature is lower than 40 ° C., the paraffin is not sufficiently melted, so that the pressure is not evenly transmitted and pores are likely to be included. On the other hand, if the heating temperature is higher than 80 ° C., bubbles that serve as pore sources are likely to be generated due to evaporation of paraffin.
  • the heat-molded compact is held at a maximum temperature of 1300 ° C. or higher and 1390 ° C.
  • the sintering method is, for example, a non-pressure sintering method such as a thermal plasma sintering method, a microwave sintering method, or a millimeter wave sintering method.
  • a non-pressure sintering method such as a thermal plasma sintering method, a microwave sintering method, or a millimeter wave sintering method.
  • hot press sintering method discharge plasma sintering method
  • ultra-high voltage sintering method hot isotropic pressure sintering method.
  • a pressure sintering method such as a method or a high pressure gas reaction sintering method.
  • the rate of temperature rise from 1200 ° C to the maximum temperature may be 5 ° C / min or higher.
  • OH groups are adsorbed on the surface of the powder. Some of the adsorbed OH groups evaporate as water at 500 ° C. or lower, but some remain on the surface of the powder and easily oxidize vanadium and chromium. Oxides of vanadium and chromium react with carbon to generate CO gas at 1200 ° C or higher.
  • the method of forming the film 22 on the surface of the sphere 21 is not limited, and is formed by, for example, the following method.
  • a neutral detergent, an alkaline detergent or an organic solvent water is sufficiently removed from the sphere 21 by heating to 60 ° C. or higher.
  • the reason for removing the water is to suppress the hydrolysis caused by the reaction of the water with the polysilazane solution described later.
  • a dense film is obtained.
  • a coating material containing a metal compound is applied to the surface of the sphere 21 using a brush or a waste cloth. Alternatively, the coating material may be sprayed on the surface of the sphere 21 or the sphere 21 may be immersed in the coating material.
  • the metal compound is, for example, a polysilazane compound.
  • the polysilazane compound is a polymer of silazane ((SiH 2 NH) n- ) in which hydrogen is bonded as a side chain to the —Si—N— bond of the main chain.
  • a polysilazane solution obtained by diluting a polysilazane compound with an organic solvent such as xylene or dibutyl ether to 5% by mass or more and 25% by mass or less is an example of a coating material. After coating, the organic solvent is evaporated under an atmospheric atmosphere (relative humidity at room temperature of 10% or more and 90% or less) with a temperature of room temperature or more and 120 ° C.
  • firing is performed in an electric furnace at a temperature of 350 ° C. or higher and 600 ° C. or lower and a holding time of 0.5 hours or longer and 3 hours or lower.
  • the nitrogen compound contained in the polysilazane compound is burned down and the corrosion resistance is improved.
  • the generation of microcracks is suppressed, so that the oxidation of the surface of the sphere 21 is suppressed.
  • the adhesion between the sphere and the film becomes high, and excellent thermal shock resistance is exhibited. Further, it can be said that the heat resistance and the oxidation resistance are high because almost no change in appearance is observed even when heated at a high temperature of about 800 ° C.
  • liquid subject to corrosion resistance examples include inorganic acids such as hydrochloric acid, sulfuric acid and nitric acid, organic acids such as acetic acid, salt water and alkaline solutions having a pH of 11 or higher.
  • Gases subject to corrosion resistance are SO 2 , SO 3 , NO x , HCl, Cl 2 , O 2 , O 3 , and the like.
  • the film 22 is formed so as to cover the surface of the sphere 21.
  • the main component of this film 22 is amorphous silicon oxide, and the surface is smooth. Since the film 22 is amorphous, there is little unevenness in the film quality due to the eccentric growth of the crystals, and voids that are likely to occur between the crystals are suppressed, so that high density is obtained and corrosion resistance is excellent.
  • the crystal structure of silicon oxide may be identified using, for example, Fourier transform infrared spectroscopy.
  • the thickness of the film formed by one coating and one firing is 0.01 ⁇ m or more and 0.5 ⁇ m or less, and after several cycles (for example, 5 cycles or more and 10 cycles or less), the final film is formed.
  • the target thickness may be 0.05 ⁇ m or more and 5 ⁇ m or less.
  • the thickness of the film 22 is 0.05 ⁇ m or more, the corrosion resistance to the liquid and the gas is sufficiently maintained.
  • the thickness of the film 22 is 5 ⁇ m or less, the generation of microcracks that are likely to occur inside the film 22 is suppressed. As a result, the possibility that the liquid or the gas comes into contact with the sphere 21 via the membrane 22 is reduced, so that the corrosion resistance is sufficiently maintained.
  • the average value of the arithmetic mean roughness (Ra) in the roughness curve of the surface of the film 22 is not limited, and is preferably 0.05 ⁇ m or more and 0.15 ⁇ m or less, for example.
  • the contact angle with pure water becomes small.
  • stains such as bacteria and microorganisms adhering to the surface of the membrane 22 can be quickly washed away together with pure water.
  • it is 0.15 ⁇ m or less, it becomes difficult for large particles to be detached from the surface of the film 22. Therefore, it becomes difficult for large particles to be caught between the check valve ball 2 and the ball sheet 3 described later. As a result, the backflow prevention effect of the liquid can be further improved.
  • the average value of the root mean square slope (R ⁇ q) in the roughness curve of the surface of the film 22 is not limited, and is preferably 0.004 or more and 0.2 or less, for example.
  • the contact angle with pure water becomes small.
  • stains such as bacteria and microorganisms adhering to the surface of the membrane 22 can be quickly washed away together with pure water.
  • it if it is 0.2 or less, it becomes difficult for large particles to be detached from the surface of the film 22. Therefore, it becomes difficult for large particles to be caught between the check valve ball 2 and the ball sheet 3 described later. As a result, the backflow prevention effect of the liquid can be further improved.
  • the arithmetic mean roughness (Ra) on the surface roughness curve of the film 22 and the square root mean square root inclination (R ⁇ q) on the surface roughness curve of the film 22 conform to JIS B 0601: 2001, for example, a shape analysis laser. It can be measured using a microscope (VK-X1100 or its successor model manufactured by Keyence Co., Ltd.).
  • the measurement conditions are coaxial epi-illumination for the illumination method, 480 times the measurement magnification, no cutoff value ⁇ s, 0.08 mm for the cutoff value ⁇ c, no cutoff value ⁇ f, and correction of the termination effect in one place.
  • the hit measurement range may be 710 ⁇ m ⁇ 563 ⁇ m, and measurement may be performed at two locations.
  • the line roughness may be measured by drawing four lines to be measured at substantially equal intervals along the longitudinal direction of the measurement range.
  • the length of one line to be measured is 560 ⁇ m.
  • the average values of the arithmetic mean roughness (Ra) and the square mean square root slope (R ⁇ q) are the arithmetic mean of a total of eight lines to be measured.
  • the arithmetic mean roughness (Ra) and the root mean square slope (R ⁇ q) of the surface of the film 22 are strongly influenced by the surface of the sphere 21. Therefore, the surface of the sphere 21 may be adjusted in advance according to the required arithmetic average roughness (Ra) and root mean square slope (R ⁇ q) of the surface of the film 22. For example, in order to make the average value of the arithmetic mean roughness (Ra) of the surface of the film 0.05 ⁇ m or more and 0.15 ⁇ m or less, the arithmetic mean roughness of the surface of the sphere 21 is performed in advance by lap polishing using diamond abrasive grains.
  • the average value of (Ra) may be 0.05 ⁇ m or more and 0.15 ⁇ m or less.
  • the diamond abrasive grains are used in a state of being contained in the slurry or paste, and the average diameter (D 50 ) of the diamond abrasive grains is, for example, 2 ⁇ m or more and 4 ⁇ m or less.
  • the squared average of the surface of the sphere 21 is previously subjected to lap polishing using diamond abrasive grains.
  • the average value of the square root inclination (R ⁇ q) may be 0.004 or more and 0.2 or less.
  • the adjustment may be made by polishing the surface of the film 22. Polishing is performed by, for example, magnetic fluid polishing, brush polishing, buffing and the like.
  • the diamond abrasive grains are used in a state of being contained in the slurry or paste, and the average diameter (D 50 ) of the diamond abrasive grains is, for example, 0.5 ⁇ m or more and less than 2 ⁇ m.
  • a film 22 containing silicon oxide as a main component is formed on the surface of a sphere 21 made of tungsten having a diameter of 3.175 mm so as to cover the surface with a thickness of 1 ⁇ m.
  • a check valve ball 2 was obtained. With respect to the surface of the obtained check valve ball 2, the arithmetic mean roughness (Ra) on the roughness curve and the squared average square root slope (R ⁇ q) on the roughness curve were measured at any two points under the above-mentioned measurement conditions. did. The average value of the arithmetic mean roughness (Ra) at the two locations was 0.0978 ⁇ m, and the mean value of the square mean square root slope (R ⁇ q) at the two locations was 0.0918.
  • the check valve 1 according to the embodiment of the present disclosure comprises a check valve ball 2 according to the embodiment and a ball sheet 3 that can come into contact with the check valve ball 2.
  • the check valve 1 according to the embodiment is accommodated in the internal space of the casing 4 so that the check valve ball 2 can move, and the ball sheet 3 is placed at one end of the casing 4. It is provided so that it can come into contact with the check valve ball 2.
  • the ball sheet 3 is made of, for example, metal, sapphire, silicon nitride, or the like.
  • the size of the ball sheet 3 is not limited, and is appropriately set according to the size of the casing 4. As shown in FIG. 2, when the ball sheet 3 has a cylindrical shape, the ball sheet 3 has, for example, a diameter of about 4 mm or more and 12 mm or less, and a height (thickness) of about 1 mm or more and 15 mm or less. There is.
  • the ball sheet 3 is formed with a through hole 31 that serves as a flow path for the liquid.
  • the size of the through hole 31 is appropriately set according to the size and application of the check valve 1, the type of liquid, the flow rate, and the like, and has a diameter of, for example, about 1 mm or more and 5 mm or less.
  • the casing 4 is made of, for example, metal.
  • a through hole 41, which serves as a flow path for the liquid, is also formed at the other end of the casing 4, that is, the end facing the ball sheet 3.
  • the liquid flows from the direction of arrow A shown in FIG. 1, and when the liquid is flowing, the check valve ball 2 floats from the ball sheet 3 due to the pressure of the liquid, as shown in FIG. As a result, the liquid flows through the internal space of the casing 4 and is discharged from the through hole 41 of the casing 4.
  • the floating check valve ball 2 lands on the ball sheet 3.
  • the check valve ball 2 and the ball sheet 3 come into contact with each other so that the check valve ball 2 closes the through hole 31 (flow path) formed in the ball sheet 3. do. Since the flow path is blocked when the flow of the liquid is stopped, the responsiveness when the fluid flows back is excellent, and the backflow can be efficiently prevented.
  • the check valve 1 is provided in, for example, a liquid feeding device.
  • a liquid feeding device is provided in a device that requires liquid feeding.
  • Such devices include, for example, a liquid chromatography device, a coating device for discharging a viscous fluid, a brake hydraulic pressure control device for controlling the hydraulic pressure of a working liquid supplied to a cylinder, and fuel injection and stopping.
  • Examples include a fuel injection device.
  • Examples of the device other than the liquid feeding device include a atomizing device that collides a sample such as powder under high pressure to make the sample finer.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
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  • Check Valves (AREA)
  • Taps Or Cocks (AREA)
PCT/JP2021/043463 2020-11-27 2021-11-26 逆止弁用ボール Ceased WO2022114144A1 (ja)

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JP2022565462A JPWO2022114144A1 (https=) 2020-11-27 2021-11-26
US18/038,879 US20230417334A1 (en) 2020-11-27 2021-11-26 Ball for check valves

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JP2020-197302 2020-11-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU213157U1 (ru) * 2022-04-05 2022-08-29 Федеральное Государственное Унитарное Предприятие "Всероссийский Научно-Исследовательский Институт Автоматики Им.Н.Л.Духова" (Фгуп "Внииа") Обратный клапан

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