WO2022110818A1 - 锡膏、led 与焊盘的焊接方法、led 显示单元及其制作方法 - Google Patents
锡膏、led 与焊盘的焊接方法、led 显示单元及其制作方法 Download PDFInfo
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- WO2022110818A1 WO2022110818A1 PCT/CN2021/105236 CN2021105236W WO2022110818A1 WO 2022110818 A1 WO2022110818 A1 WO 2022110818A1 CN 2021105236 W CN2021105236 W CN 2021105236W WO 2022110818 A1 WO2022110818 A1 WO 2022110818A1
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- WIPO (PCT)
- Prior art keywords
- powder
- solder paste
- led
- solder
- display unit
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000003466 welding Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 67
- 238000003756 stirring Methods 0.000 claims abstract description 9
- 238000004043 dyeing Methods 0.000 claims description 16
- 230000004907 flux Effects 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 12
- 239000011324 bead Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 10
- 238000004040 coloring Methods 0.000 description 4
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
Definitions
- the invention relates to the technical field of LEDs, in particular to a solder paste, a welding method for LEDs and pads, an LED display unit and a manufacturing method thereof.
- LED display screen With the continuous development of LED display technology, the display effect of LED display screen has been rapidly improved, and both pixel pitch and display effect have been greatly improved. With the advent of the 5G era, the promotion of the Internet of Things and artificial intelligence, as an important information display window for interaction, the LED display screen will be further widely used with its technical advantages of seamless splicing and large-screen display.
- LED display In the field of indoor small spacing, LED display is developing towards higher definition and more perfect picture quality.
- the indoor small-pitch LED display has started the original P1.0 and above-pitch products, and has developed to below P1.0. Display clarity has been a qualitative leap. At the pitch below P1.0, Mini-LED display technology is the main technology.
- the reduction of the pixel pitch also makes people watch the display screen closer and closer, so that people's attention and requirements on the display screen are not only the display effect itself, but also the appearance effect of the screen. From the original single-scale application, it has gradually entered the multi-application stage of specialization and individualization. However, the current LED display screen has the problem of poor display effect.
- the technical problem to be solved by the present invention is to provide a solder paste, a welding method for LEDs and pads, an LED display unit and a manufacturing method thereof, so as to solve the problem of poor display effect of the LED display screen.
- the present invention solves the above-mentioned technical problems, and on the one hand, proposes a welding method for an LED and a pad, including:
- solder paste for soldering LEDs including flux and solder powder;
- the flux includes an activator, a thixotropic agent, a resin, and a solvent;
- the resin includes a mass fraction of 1%-10% , Dark dyeing powder with powder diameter less than 100 nanometers.
- Yet another aspect provides a method for manufacturing an LED display unit, comprising:
- solder the LED and the solder paste on the PCB Solder the LED and the solder paste on the PCB. During this process, the solder powder is transformed from solid particles to liquid and accumulated together, and the dyed powder in the solder paste is evenly wrapped around at least the outside of the solder beads;
- the LED display unit will take on the color of dyed powder as a whole.
- an LED display unit including a PCB board, the PCB board includes pads, and the LEDs are soldered on the pads; wherein, the solder paste on the pads includes flux and solder powder ;
- the flux includes an activator, a thixotropic agent, a resin, and a solvent;
- the resin includes a dark coloring powder with a mass fraction of 1%-10% and a powder diameter of less than 100 nanometers;
- the solder paste is used in LEDs and PCBs.
- the solder powder changes from solid particles to liquid and accumulates together.
- the dyed powder in the solder paste is evenly wrapped around the solder balls at least, so that the LED display unit can be cooled after the temperature drops and the soldering is completed.
- the overall color is dyed powder.
- the solder paste, the welding method of LED and pad, the LED display unit and the manufacturing method thereof realized by the present invention by adding a kind of dark dyeing powder in the solder paste, so that after the LED lamp beads are welded through the solder paste, the deep color
- the color material covers the pad and the tin surface, improves the contrast ratio of the module, improves the LED display effect, and has the advantages of simple method, low cost, and large-scale production.
- FIG. 1 is a state before a PCB board is to be soldered in at least one embodiment of the present invention.
- FIG. 2 is another state before the PCB board is to be soldered in at least one embodiment of the present invention.
- FIG. 3 is a state of a PCB board after it is to be soldered in at least one embodiment of the present invention.
- LED display is developing towards a smaller pixel spacing, mainly based on Mini-LED display technology. Due to the increase in pixel density, the density of PCB pads increases, and the PCB welding area accounts for the relative area of the entire PCB. After the module completes the LED lamp welding, the relative area of exposed tin at the pad is relatively large, and because the pad and tin have metallic luster, the LED light board looks brighter and has a lower contrast when the screen is black.
- the following embodiments of the present invention can better solve this problem.
- the LEDs in the following embodiments are light emitting diodes (abbreviated as light emitting diodes). It is a display method by controlling semiconductor light-emitting diodes. It is a diode made of gallium (Ga) and arsenic (As), phosphorus (P), nitrogen (N), and indium (In) compounds. When electrons and holes It can radiate visible light when recombined, so it can be used to make light-emitting diodes. Used as indicator lights in circuits and instruments, or composed of text or digital displays. Gallium arsenide phosphide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and indium gallium nitride diodes emit blue light.
- the first embodiment of the present invention provides a method for welding an LED and a pad, including:
- the dark dyeing powder has conductive properties. More preferably, the dark dyeing powder is black toner.
- a plurality of pads 2 are provided on the PCB board 4, and the pads are the lead holes on the PCB board and the surrounding copper foil, and the components pass through the PCB. The lead holes are fixed on the PCB with solder paste, and the printed wires connect the pads to realize the electrical connection of the components in the circuit.
- the pad is used to realize the electrical connection between the LED and the PCB board.
- the solder paste 3 used to solder the LED on the pad 2 is added with carbon powder with a mass fraction of 1%-10% and a powder diameter of less than 100 nanometers. After stirring evenly, this solder paste 3 is spot welded to the PCB board.
- the pad 2 of 4 On the pad 2 of 4, the state shown in Figure 2 is formed. It can be seen that after the solder powder in the solder paste 3 is converted from solid particles to liquid and accumulated together, the carbon powder in the solder paste is evenly wrapped in the solder beads. outside, forming a black appearance. After the LED is welded on this basis, a black background LED will be formed, which improves the contrast of the LED module and improves the display effect.
- the second embodiment of the present invention provides a solder paste for soldering LEDs
- the solder paste includes flux and solder powder
- the flux includes an activator, a thixotropic agent, a resin, and a solvent
- the resin includes mass Dark dyeing powder with a fraction of 1%-10% and a powder diameter of less than 100 nanometers.
- the mass fraction is preferably 4%, 5%, and 6%.
- the dark dyeing powder is a black toner with conductive properties.
- the dark coloring powder may be a coloring agent without conductivity, such as a dark blue, dark gray common coloring agent, and the like.
- a third embodiment of the present invention provides a method for manufacturing an LED display unit, including:
- solder the LED and the solder paste on the PCB Solder the LED and the solder paste on the PCB. During this process, the solder powder is transformed from solid particles to liquid and accumulated together, and the dyed powder in the solder paste is evenly wrapped around at least the outside of the solder beads;
- the LED display unit will take on the color of dyed powder as a whole.
- the dark dyeing powder is black toner.
- a plurality of pads 2 are provided on the PCB board 4 to be welded shown in FIG. 1, and the pads are the lead holes on the PCB board and the surrounding Copper foil, the components are fixed on the PCB by solder paste welding through the lead holes on the PCB, and the printed wires connect the pads to realize the electrical connection of the components in the circuit.
- the pad is used to realize the electrical connection between the LED and the PCB board.
- the solder paste 3 used to solder the LED on the pad 2 is added with carbon powder with a mass fraction of 1%-10% and a powder diameter of less than 100 nanometers. After stirring evenly, this solder paste 3 is spot welded to the PCB board.
- the state shown in Figure 2 is formed. It can be seen that after the solder powder in the solder paste 3 is converted from solid particles to liquid and accumulated together, the dyed powder in the solder paste is evenly wrapped in the solder beads. Then, before the solder paste 3 shown in FIG. 2 is not solidified, set the LED 1 on the solder paste 3 shown in FIG. 2 to weld it with the pad 2, and wait for the solder paste to cool down. , the state shown in Figure 3 is formed.
- the driver IC 5 is soldered on the back of the PCB board 4 . On this basis, the LED display will form a black background LED, which improves the contrast of the LED module and improves the display effect.
- the above process can also be simply set as: first, print black solder paste on the PCB lamp surface pads; then paste LED lamp beads or LED lamp beads on the PCB lamp surface. Chip; then pass the reflow oven to the PCB, and solder the LED lamp beads or the chip to the PCB board; finally solder the back driver IC.
- a fourth embodiment of the present invention provides an LED display unit, which includes a PCB board, and the PCB board includes pads on which LEDs are soldered; the solder paste on the pads includes flux and solder powder;
- the flux includes an activator, a thixotropic agent, a resin, and a solvent;
- the resin includes a dark coloring powder with a mass fraction of 1%-10% and a powder diameter of less than 100 nanometers; preferably, the dark coloring powder is black
- the carbon powder is produced by the production method of the third embodiment, and will not be repeated here.
- the solder paste, the welding method of LED and pad, the LED display unit and the manufacturing method thereof realized by the present invention by adding a kind of dark dyeing powder in the solder paste, so that after the LED lamp beads are welded through the solder paste, the deep color
- the color substance covers the pad and the tin surface, improves the contrast ratio of the module, and thus improves the LED display effect.
- the method is simple, low-cost, and can be mass-produced. Therefore, it has industrial applicability.
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- Engineering & Computer Science (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种锡膏（3）、LED（1）与焊盘（2）的焊接方法、LED显示单元及其制作方法，焊接方法包括：在锡膏（3）中添加质量分数为1％-10％、粉径小于100纳米的深色染色粉，搅拌均匀；将锡膏（3）点焊于PCB板（4）的焊盘（2）并焊接LED（1），使得LED显示单元整体呈深色染色粉的颜色。
Description
本发明涉及LED技术领域，尤其涉及一种锡膏、LED与焊盘的焊接方法、LED显示单元及其制作方法。
随着LED显示技术的不断发展，LED显示屏的显示效果得到快速的提升，不论是像素间距、还是显示效果都有了巨大的进步。而随着5G时代的来临，物联网、人工智能的推广，作为交互的重要信息显示窗口，LED显示屏以其无缝拼接，大屏幕显示的技术优势，将进一步得到广泛的应用。在户内小间距领域，LED显示正向着更高清，更完美的画质体现发展。目前在LED户内小间距显示已经开始原来的P1.0以上间距产品，发展到P1.0以下。显示清晰度得到了质的飞跃。而在P1.0以下间距，主要以Mini-LED显示技术为主。像素间距的缩减也使人们观看显示屏的距离越来越近，使的人们对显示屏的关注和要求已经不只是显示效果本身，更延伸到屏幕的外观效果。从原来的单一规模化应用，逐步进入专业化和个性化的多元应用阶段。但是目前的LED显示屏存在显示效果不佳的问题。
有鉴于此，本发明要解决的技术问题是提供一种锡膏、LED与焊盘的焊接方法、LED显示单元及其制作方法,以解决LED显示屏显示效果不佳的问题。
本发明解决上述技术问题，一方面提出一种LED与焊盘的焊接方法，包括：
在锡膏中添加质量分数为1%-10%、粉径小于100纳米的深色染色粉，搅拌均匀；
将此锡膏点焊于PCB板的焊盘并焊接LED。
另一个方面提出一种用于焊接LED的锡膏，包括助焊剂和焊料粉；所述助焊剂包括活化剂、触变剂、树脂、溶剂；所述树脂中包括质量分数为1%-10%、粉径小于100纳米的深色染色粉。
又一个方面提出一种LED显示单元的制作方法，包括：
在锡膏中添加质量分数为1%-10%、粉径小于100纳米的深色染色粉，搅拌均匀；
用此锡膏点焊于PCB板的预定焊接位置；
将LED与PCB板上的所述锡膏焊接，在此过程中，焊料粉由固态颗粒转变成液态并聚积在一起，锡膏内的染色粉均匀的至少包裹在锡珠的外面；
等待温度下降、焊接结束，LED显示单元整体呈染色粉的颜色。
以及再一个方面还提出一种LED显示单元，包括PCB板，所述PCB板上包括焊盘，所述焊盘上焊接有LED；其中，所述焊盘上的锡膏包括助焊剂和焊料粉；所述助焊剂包括活化剂、触变剂、树脂、溶剂；所述树脂中包括质量分数为1%-10%、粉径小于100纳米的深色染色粉；所述锡膏在LED与PCB板上的焊盘焊接的过程中，焊料粉由固态颗粒转变成液态并聚积在一起，锡膏内的染色粉均匀的至少包裹在锡珠的外面，使LED显示单元在温度下降、焊接结束后整体呈染色粉的颜色。
本发明实现的锡膏、LED与焊盘的焊接方法、LED显示单元及其制作方法，通过在锡膏中添加一种深色染色粉，使通过该锡膏对LED灯珠进行焊接后，深色物质覆盖住焊盘及锡表面，提高了模组对比度，改善了LED显示效果，具有方法简单、低成本、可以规模化生产的优点。
图1为本发明至少一个实施例中PCB板待焊接之前的状态。
图2为本发明至少一个实施例中PCB板待焊接之前的又一个状态。
图3为本发明至少一个实施例中PCB板待焊接之后的状态。
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚、明白，以下结合附图和实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
随着LED显示技术的不断发展，在户内小间距领域，LED显示正向更小的像素点间距发展，主要以Mini-LED显示技术为主。由于像素点密集的增大，随之PCB焊盘密度增加，PCB焊接面积占整块PCB相对面积也随之增加。使得模组在完成LED灯焊接后，焊盘处锡裸露相对面积较多，又由于焊盘及锡具有金属光泽，使得LED灯板在黑屏时整体看上去偏亮、对比度较低。本发明的以下实施例可以较好的解决本问题。
以下实施例中的LED，即发光二极管（light emitting diode缩写）。它是一种通过控制半导体发光二极管的显示方式，由镓（Ga）与砷（As）、磷（P）、氮（N）、铟（In）的化合物制成的二极管，当电子与空穴复合时能辐射出可见光，因而可以用来制成发光二极管。在电路及仪器中作为指示灯，或者组成文字或数字显示。磷砷化镓二极管发红光，磷化镓二极管发绿光，碳化硅二极管发黄光，铟镓氮二极管发蓝光。
实施例一
本发明第一实施例提出一种LED与焊盘的焊接方法，包括：
在锡膏中添加质量分数为1%-10%、粉径小于100纳米的深色染色粉，搅拌均匀；将此锡膏点焊于PCB板的焊盘并焊接LED。优选的，深色染色粉具有导电特性。更优选的，所述深色染色粉为黑色的碳粉。结合图1和图2所示的待进行焊接的PCB板，其中PCB板4上设置有多个焊盘2，所述焊盘为PCB板上的引线孔及周围的铜箔，元件通过PCB上的引线孔，用锡膏焊接固定在PCB上，印制导线把焊盘连接起来，实现元件在电路中的电气连接。本实施例中，焊盘用于实现LED与PCB板的电气连接。其中用于将LED焊接于焊盘2上的锡膏3中添加了质量分数为1%-10%、粉径小于100纳米的碳粉，搅拌均匀后，将此锡膏3点焊于PCB板4的焊盘2上，形成如图2所示的状态，可以看到在锡膏3中的焊料粉由固态颗粒转变成液态并聚积在一起后，锡膏内的碳粉均匀包裹在锡珠的外面，形成黑色的外观。在此基础上进行LED的焊接后，就会形成黑色底色的LED，提高了LED模组对比度，改善了显示效果。
实施例二
本发明第二实施例提供一种用于焊接LED的锡膏，所述锡膏包括助焊剂和焊料粉；所述助焊剂包括活化剂、触变剂、树脂、溶剂；所述树脂中包括质量分数为1%-10%、粉径小于100纳米的深色染色粉。质量分数优选4%、5%、6%。
所述深色染色粉是具有导电特性的黑色碳粉。在其他一些实施例中，所述深色染色粉可以为不具有导电性的染色剂，例如深蓝色、深灰色的普通染色剂等。
实施例三
本发明第三实施例提出一种LED显示单元的制作方法，包括：
在锡膏中添加质量分数为1%-10%、粉径小于100纳米的深色染色粉，搅拌均匀；
用此锡膏点焊于PCB板的预定焊接位置；
将LED与PCB板上的所述锡膏焊接，在此过程中，焊料粉由固态颗粒转变成液态并聚积在一起，锡膏内的染色粉均匀的至少包裹在锡珠的外面；
等待温度下降、焊接结束，LED显示单元整体呈染色粉的颜色。
优选的，所述深色染色粉为黑色碳粉。
结合图1、图2、图3所示的结构，在图1所示的待进行焊接的PCB板4上设置有多个焊盘2，所述焊盘为PCB板上的引线孔及周围的铜箔，元件通过PCB上的引线孔，用锡膏焊接固定在PCB上，印制导线把焊盘连接起来，实现元件在电路中的电气连接。本实施例中，焊盘用于实现LED与PCB板的电气连接。其中用于将LED焊接于焊盘2上的锡膏3中添加了质量分数为1%-10%、粉径小于100纳米的碳粉，搅拌均匀后，将此锡膏3点焊于PCB板4的焊盘2上，形成如图2所示的状态，可以看到在锡膏3中的焊料粉由固态颗粒转变成液态并聚积在一起后，锡膏内的染色粉均匀包裹在锡珠的外面，形成黑色的外观，然后在图2所示的锡膏3未凝固之前，将LED 1设置于图2所示的锡膏3之上使其与焊盘2焊接，待锡膏冷却之后，就形成图3所示的状态。在所述PCB板4的背面焊接驱动IC 5。在此基础上进行LED显示屏，就会形成黑色底色的LED，提高了LED模组对比度，改善了显示效果。在自动化的表面贴装或集成封装模组焊接过程中，上述的过程还可以简单设置为：首先在PCB灯面焊盘处，印刷好黑色锡膏；然后在PCB灯面贴上LED灯珠或芯片；然后对PCB过回流焊炉，LED灯珠或芯片与PCB板实现焊接；最后焊接背面驱动IC。
实施例四
本发明第四实施例提出一种LED显示单元，包括PCB板，所述PCB板上包括焊盘，所述焊盘上焊接有LED；所述焊盘上的锡膏包括助焊剂和焊料粉；所述助焊剂包括活化剂、触变剂、树脂、溶剂；所述树脂中包括质量分数为1%-10%、粉径小于100纳米的深色染色粉；优选的，深色染色粉为黑色碳粉，通过实施例三的制作方法制作，在此不再赘述。
以上参照附图说明了本发明的优选实施例，并非因此局限本发明的权利范围。本领域技术人员不脱离本发明的范围和实质，可以有多种变型方案实现本发明，比如作为一个实施例的特征可用于另一实施例而得到又一实施例。凡在运用本发明的技术构思之内所作的任何修改、等同替换和改进，均应在本发明的权利范围之内。
本发明实现的锡膏、LED与焊盘的焊接方法、LED显示单元及其制作方法，通过在锡膏中添加一种深色染色粉，使通过该锡膏对LED灯珠进行焊接后，深色物质覆盖住焊盘及锡表面，提高模组对比度，从而改善了LED显示效果，方法简单、低成本、可以规模化生产。因此，具有工业实用性。
Claims (10)
- 一种LED与焊盘的焊接方法，包括：在锡膏中添加质量分数为1%-10%、粉径小于100纳米的深色染色粉，搅拌均匀；用此锡膏点焊于PCB板的焊盘并焊接LED。
- 根据权利要求1所述的LED与焊盘的焊接方法，其中，所述深色染色粉具有导电特性。
- 根据权利要求1或2所述的LED与焊盘的焊接方法，其中，所述深色染色粉为碳粉。
- 一种用于焊接LED的锡膏，所述锡膏包括助焊剂和焊料粉；所述助焊剂包括活化剂、触变剂、树脂、溶剂；所述树脂中包括质量分数为1%-10%、粉径小于100纳米的深色染色粉。
- 根据权利要求4所述焊接LED的锡膏，其中，所述深色染色粉具有导电特性。
- 根据权利要求4或5所述焊接LED的锡膏，其中，所述深色染色粉为碳粉。
- 一种LED显示单元的制作方法，包括：在锡膏中添加质量分数为1%-10%、粉径小于100纳米的深色染色粉，搅拌均匀；用此锡膏点焊于PCB板的预定焊接位置；将LED与PCB板上的所述锡膏进行焊接，在此过程中，焊料粉由固态颗粒转变成液态并聚积在一起，锡膏内的染色粉均匀的至少包裹在锡珠的外面；等待温度下降、焊接结束，LED显示单元整体呈染色粉的颜色。
- 根据权利要求7所述的LED显示单元的制作方法，其中，所述深色染色粉为碳粉。
- 一种LED显示单元，包括PCB板，所述PCB板上包括焊盘，所述焊盘上焊接有若干LED；所述焊盘上的锡膏包括助焊剂和焊料粉；所述助焊剂包括活化剂、触变剂、树脂、溶剂；所述树脂中包括质量分数为1%-10%、粉径小于100纳米的深色染色粉；所述锡膏在LED与PCB板上的焊盘焊接的过程中，焊料粉由固态颗粒转变成液态并聚积在一起，锡膏内的染色粉均匀的至少包裹在锡珠的外面，使LED显示单元在温度下降、焊接结束后整体呈染色粉的颜色。
- 根据权利要求9所述的LED显示单元，其中，所述深色染色粉为碳粉。
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