WO2022107473A1 - エポキシ樹脂組成物、ガスバリア性積層体及び包装材 - Google Patents
エポキシ樹脂組成物、ガスバリア性積層体及び包装材 Download PDFInfo
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- WO2022107473A1 WO2022107473A1 PCT/JP2021/036946 JP2021036946W WO2022107473A1 WO 2022107473 A1 WO2022107473 A1 WO 2022107473A1 JP 2021036946 W JP2021036946 W JP 2021036946W WO 2022107473 A1 WO2022107473 A1 WO 2022107473A1
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- Prior art keywords
- epoxy resin
- gas barrier
- resin composition
- layer
- curing agent
- Prior art date
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- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/14—Gas barrier composition
Definitions
- the present invention relates to an epoxy resin composition, a gas barrier laminate using the epoxy resin composition, and a packaging material.
- Packaging materials used in foods, pharmaceuticals, cosmetics, precision electronic components, etc. are required to have high oxygen barrier properties and water vapor barrier properties in order to prevent deterioration of the contents. Since the oxygen barrier property of a thermoplastic plastic film is generally not so high, various gas barrier layers such as a polyvinylidene chloride (PVDC) layer and a polyvinyl alcohol (PVA) layer are formed as a means for imparting gas barrier property to the film. Or a method of depositing an inorganic substance such as alumina (Al 2 O 3 ) or silica (SiO 2 ) has been studied.
- PVDC polyvinylidene chloride
- PVA polyvinyl alcohol
- the film on which the PVDC layer is formed as the gas barrier layer is transparent and exhibits good barrier properties. However, since harmful substances such as acid gas are generated when incinerated as general waste, it is desired to switch to other materials from the viewpoint of environmental consideration.
- the film on which the PVA layer is formed exhibits excellent gas barrier properties under low humidity, but has a problem of high hygroscopicity and a sharp decrease in gas barrier properties when the relative humidity is about 70% or more.
- the inorganic vapor-deposited film obtained by depositing an inorganic substance such as alumina or silica on a thermoplastic plastic film is transparent and has good gas barrier properties, and the above problem does not occur.
- an inorganic substance such as alumina or silica
- thermoplastic plastic film is transparent and has good gas barrier properties, and the above problem does not occur.
- the inorganic thin-film film is bent, there is a problem that cracks are generated in the inorganic-deposited layer and the gas barrier property is remarkably lowered.
- Patent Documents 1 to 3 As a method for improving the bending resistance of a gas barrier film or a laminate containing a layer on which an inorganic substance is vapor-deposited, a cured product of an epoxy resin composition containing a predetermined epoxy resin and a predetermined amine-based epoxy resin curing agent as main components.
- Patent Documents 1 to 3 A method for forming a layer is proposed (Patent Documents 1 to 3).
- Patent Document 4 has a predetermined base film having an inorganic vapor deposition layer and a predetermined resin cured layer composed of an epoxy resin, a predetermined epoxy resin curing agent, and a cured product of an epoxy resin composition containing non-spherical inorganic particles. It is disclosed that the layered gas barrier film has improved gas barrier properties and is also excellent in bending resistance as compared with the conventional gas barrier film having an inorganic vapor deposition layer.
- Patent Document 5 covers a wide range of gas barrier resin compositions containing an epoxy resin, an epoxy resin curing agent, and a specific curing accelerator, and containing a predetermined amount of a predetermined skeleton structure derived from an amine in the cured product formed. It has been reported that high gas barrier properties are exhibited under the curing conditions of.
- Patent Document 6 describes a primer composition containing a specific polyester resin in a laminated film in which at least a substrate, a primer layer, an adhesive layer, and a sealant layer are laminated in this order.
- Patent Documents 1 to 6 disclose epoxy resin compositions using an amine-based epoxy resin curing agent, but according to recent studies by the present inventors, an epoxy resin using an amine-based epoxy resin curing agent has been disclosed. It was found that the cured product of the composition had unstable adhesion to the inorganic material.
- the epoxy resin composition When the epoxy resin composition is applied as an intermediate layer of a gas barrier laminate, the epoxy resin composition may have a performance as an adhesive in addition to the gas barrier property.
- the performance suitable for the coating composition is important. For example, it is required that the drying is quick, there is little sticking (blocking) after coating, and the appearance of the formed coating film is good.
- the addition of a lubricant or the like is effective in suppressing blocking.
- the cured product of the epoxy resin composition containing the additive tends to have a lower gas barrier property than that of the non-added epoxy resin composition.
- the cured coating film obtained by applying the epoxy resin composition to a base material or the like may have uneven coating or the gloss may be deteriorated, resulting in deterioration of the appearance.
- the subject of the present invention is an epoxy resin composition having high gas barrier properties and sufficient adhesiveness for practical use, and capable of forming a cured coating film having a good appearance, a gas barrier laminate and a packaging material using the epoxy resin composition. Is to provide.
- the present inventors have found that the above problems can be solved by using an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an epoxy resin composition containing polyalkylene glycol. That is, the present invention relates to the following [1] to [3].
- [3] A packaging material containing the gas barrier laminate according to the above [2].
- the epoxy resin composition of the present invention it is particularly useful as a coating composition, has high gas barrier properties and practically sufficient adhesiveness, and can form a cured coating film having a good appearance.
- a gas barrier laminate having a base material and a cured product layer of the epoxy resin composition is suitable for various packaging material applications.
- the epoxy resin composition of the present invention is an epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and polyalkylene glycol.
- the epoxy resin composition of the present invention has high gas barrier properties and practically sufficient adhesiveness, and can form a cured coating film having a good appearance. The reason for this is not clear, but it is thought to be due to the leveling action of the polyalkylene glycol.
- the epoxy resin composition of the present invention improves the drying rate, facilitates application to a substrate having low heat resistance, suppresses blocking, and imparts properties suitable for a coating composition, and cure coating. From the viewpoint of improving the adhesiveness of the film to inorganic substances, it is preferable to further contain an unsaturated fatty acid amide having 14 to 24 carbon atoms. It is considered that when an unsaturated fatty acid amide having 14 to 24 carbon atoms is contained in the epoxy resin composition, it exerts a function as a lubricant and contributes to improvement of drying rate and suppression of blocking.
- the unsaturated fatty acid amide having 14 to 24 carbon atoms is considered to have an effect of relaxing the stress generated in the cured epoxy resin, and the amine-based epoxy resin curing agent is compared with the saturated fatty acid amide and the like. Highly compatible with the epoxy resin composition contained. Therefore, it is presumed that the cured product of the epoxy resin composition containing the unsaturated fatty acid amide has good adhesiveness to the inorganic substance.
- the epoxy resin used in the epoxy resin composition of the present invention may be either a saturated or unsaturated aliphatic compound, an alicyclic compound, an aromatic compound, or a heterocyclic compound, but exhibits high gas barrier properties.
- an epoxy resin containing an aromatic ring or an alicyclic structure in the molecule is preferable.
- Specific examples of the epoxy resin include an epoxy resin having a glycidylamino group derived from metaxylylene diamine, an epoxy resin having a glycidylamino group derived from paraxylylene diamine, and 1,3-bis (aminomethyl).
- Epoxy resin with glycidylamino group derived from cyclohexane epoxy resin with glycidylamino group derived from 1,4-bis (aminomethyl) cyclohexane, epoxy resin with glycidylamino group derived from diaminodiphenylmethane, paraamino From phenol-derived glycidylamino and / or glycidyloxy group-derived epoxy resin, bisphenol A-derived glycidyloxy group-derived epoxy resin, bisphenol F-derived glycidyloxy group-derived epoxy resin, phenol novolac Included is at least one resin selected from an epoxy resin having an derived glycidyloxy group and an epoxy resin having an derived glycidyloxy group derived from resorcinol.
- the epoxy resin is from an epoxy resin having a glycidylamino group derived from metaxylylene diamine, an epoxy resin having a glycidylamino group derived from paraxylylene diamine, and bisphenol F. It is preferable that the main component is at least one selected from the group consisting of the derived epoxy resin having a glycidyloxy group, and the main component is an epoxy resin having an glycidylamino group derived from a metaxylylene diamine. More preferred.
- main component means that other components may be contained within a range that does not deviate from the gist of the present invention, preferably 50 to 100% by mass, more preferably 70 to 100% by mass. , More preferably 90 to 100% by mass.
- the epoxy resin curing agent used in the epoxy resin composition of the present invention contains an amine-based curing agent from the viewpoint of exhibiting high gas barrier properties.
- the amine-based curing agent polyamine or a modified product thereof, which has been conventionally used as an epoxy resin curing agent, can be used.
- the amine-based curing agent is preferably a modified product of polyamine, and is at least one selected from the group consisting of the following amine-based curing agent (i) and amine-based curing agent (ii). It is more preferable to have the following amine-based curing agent (i).
- R 1 and R 2 independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms.
- the amine-based curing agent (i) is a reaction product of the following component (A) and component (B).
- component (A) At least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine
- B At least one selected from the group consisting of unsaturated carboxylic acid represented by the following general formula (1) and its derivatives.
- R 1 and R 2 independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms.
- the component (A) is used from the viewpoint of gas barrier property, and m-xylylenediamine is preferable from the viewpoint of gas barrier property.
- the component (A) one type may be used alone, or two types may be mixed and used.
- the component (B) is at least one selected from the group consisting of unsaturated carboxylic acids represented by the general formula (1) and derivatives thereof, and from the viewpoint of gas barrier properties, R 1 in the general formula (1).
- R 1 in the general formula (1) Is preferably a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, further preferably a hydrogen atom or a methyl group, and a hydrogen atom. Is even more preferable.
- R 2 in the general formula (1) is preferably a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and is preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. It is more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.
- Examples of the derivative of the unsaturated carboxylic acid represented by the general formula (1) include esters, amides, acid anhydrides, and acid anhydrides of the unsaturated carboxylic acid.
- the unsaturated carboxylic acid ester is preferably an alkyl ester, and the number of alkyl carbon atoms is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of obtaining good reactivity.
- Examples of the unsaturated carboxylic acid represented by the general formula (1) and its derivatives include acrylic acid, methacrylic acid, ⁇ -ethylacrylic acid, ⁇ -propylacrylic acid, ⁇ -isopropylacrylic acid and ⁇ -n-butylacrylic acid.
- Acid ⁇ -t-butylacrylic acid, ⁇ -pentylacrylic acid, ⁇ -phenylacrylic acid, ⁇ -benzylacrylic acid, crotonic acid, 2-pentenoic acid, 2-hexenoic acid, 4-methyl-2-pentenoic acid, 2-Heptenoic acid, 4-methyl-2-hexenoic acid, 5-methyl-2-hexenoic acid, 4,4-dimethyl-2-pentenic acid, 4-phenyl-2-butenoic acid, katsura acid, o-methyl katsura Examples thereof include unsaturated carboxylic acids such as acid, m-methyl cinnamic acid, p-methyl cinnamic acid and 2-octenoic acid, and esters, amides, acid anhydrides, acidified products and the like thereof.
- the component (B) is preferably at least one selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid and derivatives thereof, and acrylic acid, methacrylic acid and crotonic acid are preferable. At least one selected from the group consisting of acids and alkyl esters thereof is more preferred, more preferably at least one selected from the group consisting of acrylic acid, methacrylic acid, and alkyl esters thereof, and alkyl esters of acrylic acid are more preferred. More preferably, methyl acrylate is even more preferred.
- the component (B) one type may be used alone, or two or more types may be used in combination.
- the reaction between the component (A) and the component (B) is at 0 to 100 ° C., more preferably 0 to 70 ° C. when an unsaturated carboxylic acid, ester or amide is used as the component (B).
- the component (A) and the component (B) are mixed, and under the conditions of 100 to 300 ° C., preferably 130 to 250 ° C., a Michael addition reaction and an amide group forming reaction by dehydration, dealcoholization and deamine are carried out. It will be carried out by.
- the inside of the reaction apparatus in order to complete the reaction, can be subjected to a reduced pressure treatment at the final stage of the reaction, if necessary. It can also be diluted with a non-reactive solvent, if desired.
- a catalyst such as phosphite esters can be added as a dehydrating agent and a dealcoholizing agent.
- the Michael addition reaction and the amide are performed. It is carried out by performing a group formation reaction.
- the inside of the reaction apparatus in order to complete the reaction, can be subjected to a reduced pressure treatment at the final stage of the reaction, if necessary. It can also be diluted with a non-reactive solvent, if desired. Further, tertiary amines such as pyridine, picoline, lutidine and trialkylamine can be added.
- the epoxy which is a reaction product between the component (A) and the component (B).
- the cured product layer formed by using the resin curing agent has high gas barrier properties and good adhesiveness.
- the reaction molar ratio [(B) / (A)] of the component (B) to the component (A) is preferably in the range of 0.3 to 1.0.
- the reaction molar ratio is 0.3 or more, a sufficient amount of amide groups are generated in the epoxy resin curing agent, and a high level of gas barrier property and adhesiveness are exhibited.
- the reaction molar ratio is in the range of 1.0 or less, the amount of amino groups required for the reaction with the epoxy group in the epoxy resin is sufficient, the heat resistance is excellent, and the solubility in an organic solvent or water is sufficient. Also excellent.
- the reaction molar ratio [(B) / (A)] of the component (B) to the component (A) is 0. More preferably, it is in the range of 6.6 to 1.0.
- the amine-based curing agent may be a reaction product consisting of only the component (A) and the component (B), the component (A) and the component (B), and the components (C), (D) and the following. It may be a reaction product with at least one compound selected from the group consisting of (E) components.
- R 3 is a hydrogen atom, an alkyl having 1 to 7 carbon atoms which may have a hydroxyl group). Represents a group or an aryl group having 6 to 12 carbon atoms.
- R 3 represents a hydrogen atom, an alkyl group having 1 to 7 carbon atoms or an aryl group having 6 to 12 carbon atoms which may have a hydroxyl group, and R 3 is preferably an alkyl group having 1 to 3 carbon atoms or phenyl. It is the basis.
- Examples of the derivative of the monovalent carboxylic acid represented by R3 - COOH include esters, amides, acid anhydrides and acidified compounds of the carboxylic acid.
- the ester of the carboxylic acid is preferably an alkyl ester, and the alkyl carbon number is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2.
- the component (C) include monovalent carboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, lactic acid, glycolic acid, and benzoic acid, and derivatives thereof.
- the component (C) may be used alone or in combination of two or more.
- the cyclic carbonate which is the component (D)
- the cyclic carbonate is used as necessary from the viewpoint of reducing the reactivity between the epoxy resin curing agent and the epoxy resin and improving the workability, and is used with the component (A).
- a cyclic carbonate having a 6-membered ring or less is preferable.
- at least one selected from the group consisting of ethylene carbonate, propylene carbonate and glycerin carbonate is preferable from the viewpoint of gas barrier property.
- the component (D) may be used alone or in combination of two or more.
- the monoepoxy compound as the component (E) is a monoepoxy compound having 2 to 20 carbon atoms, and is necessary from the viewpoint of reducing the reactivity between the epoxy resin curing agent and the epoxy resin and improving workability. Used. From the viewpoint of gas barrier properties, it is preferably a monoepoxy compound having 2 to 10 carbon atoms, and more preferably a compound represented by the following formula (2).
- R 4 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group, or R 5 -O—CH 2-
- R 5 represents a phenyl group or a benzyl group.
- Examples of the monoepoxy compound represented by the formula (2) include ethylene oxide, propylene oxide, 1,2-butylene oxide, styrene oxide, phenylglycidyl ether, and benzyl glycidyl ether.
- the component (E) may be used alone or in combination of two or more.
- One kind of compound may be used alone, or two or more kinds may be used in combination.
- the amine-based curing agent may be a reaction product obtained by further reacting with other components as long as the effects of the present invention are not impaired.
- other components referred to here include aromatic dicarboxylic acids or derivatives thereof.
- the amount of the "other component" used is preferably 30% by mass or less, more preferably 10% by mass or less, and 5% by mass of the total amount of the reaction components constituting the amine-based curing agent. It is more preferably% or less.
- the reaction product of the components (A) and (B) and at least one compound selected from the group consisting of the components (C), (D) and (E) is the above (C). It is obtained by reacting at least one compound selected from the group consisting of a component, a component (D) and a component (E) with the component (A) which is a polyamine compound in combination with the component (B).
- the components (B) to (E) may be added in any order and reacted with the component (A), or the components (B) to (E) may be mixed and the component (A) may be mixed. It may be reacted with the component.
- the reaction between the component (A) and the component (C) can be carried out under the same conditions as the reaction between the component (A) and the component (B).
- the component (C) When the component (C) is used, the component (B) and the component (C) may be mixed and reacted with the component (A).
- the component (A) and the component (B) are combined. May be reacted and then the component (C) may be reacted.
- the component (D) and / or the component (E) is used, the component (A) and the component (B) are first reacted, and then the component (D) and / or the component (E) are used. It is preferable to react with the components.
- the component (A) and the component (D) and / or the component (E) are mixed under the condition of 25 to 200 ° C.
- the addition reaction is carried out under the conditions of 30 to 180 ° C., preferably 40 to 170 ° C.
- catalysts such as sodium methoxide, sodium ethoxide, and potassium t-butoxide can be used.
- the component (D) and / or the component (E) may be melted or diluted with a non-reactive solvent, if necessary.
- the amine-based curing agent is a reaction product of at least one compound selected from the group consisting of the components (A) and (B) and the components (C), (D) and (E).
- the reaction molar ratio [(B) / (A)] of the component (B) to the component (A) is in the range of 0.3 to 1.0 for the same reason as described above. Is preferable, and the range is more preferably in the range of 0.6 to 1.0.
- the reaction molar ratio of the component (C), the component (D) and the component (E) to the component (A) [ ⁇ (C) + (D) + (E) ⁇ / (A)] is 0.
- reaction molar ratio of the components (B) to (E) to the component (A) [ ⁇ (B) + (C) + (D) + (E) ⁇ / (A)] is preferably in the range of 0.35 to 2.5, and more preferably in the range of 0.35 to 2.0.
- the amine-based curing agent (ii) is a reaction product of epichlorohydrin and at least one selected from the group consisting of methoxylylenediamine and paraxylylenediamine.
- the amine-based curing agent (ii) preferably contains a compound represented by the following general formula (3) as a main component.
- the term "main component” as used herein means a component having a content of 50% by mass or more when all the constituents in the amine-based curing agent (ii) are 100% by mass.
- A is a 1,3-phenylene group or a 1,4-phenylene group.
- N is a number of 1 to 12.
- A is a 1,3-phenylene group.
- the content of the compound represented by the above general formula (3) in the amine-based curing agent (ii) and the composition of the compound represented by the above general formula (3) are determined by GC analysis and gel filtration chromatography (GPC) analysis. Can be obtained by.
- the amine-based curing agent (ii) is obtained by subjecting epichlorohydrin and at least one selected from the group consisting of methoxylylenediamine and paraxylylenediamine to a ring-opening addition reaction and a condensation reaction by a conventional method. ..
- the epoxy resin curing agent used in the present invention may contain a curing agent component other than the amine-based curing agent, but it is preferable that the content of the amine-based curing agent is high from the viewpoint of obtaining high gas barrier properties.
- the content of the amine-based curing agent in the epoxy resin curing agent is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, still more preferably 80% by mass or more, from the viewpoint of obtaining high gas barrier properties. It is 90% by mass or more.
- the upper limit is 100% by mass.
- the epoxy resin curing agent used in the present invention may further contain a coupling agent from the viewpoint of improving adhesiveness.
- the coupling agent include a silane coupling agent, a titanate-based coupling agent, an aluminate-based coupling agent, and the like, and a silane coupling agent is preferable from the viewpoint of improving the adhesiveness to an inorganic substance.
- the silane coupling agent include a silane coupling agent having a vinyl group, a silane coupling agent having an amino group, a silane coupling agent having an epoxy group, a silane coupling agent having a (meth) acrylic group, and a mercapto group. Examples thereof include a silane coupling agent having a above.
- the content of the coupling agent in the epoxy resin curing agent is preferably 0.1 to 10 parts by mass, more preferably 1 part by mass with respect to 100 parts by mass of the curing agent component in the epoxy resin curing agent. ⁇ 8 parts by mass.
- the compounding ratio of the epoxy resin and the epoxy resin curing agent in the epoxy resin composition may be generally within the standard compounding range when the epoxy resin reactant is produced by the reaction between the epoxy resin and the epoxy resin curing agent.
- the ratio of the number of active amine hydrogens in the epoxy resin curing agent to the number of epoxy groups in the epoxy resin is 0. It is preferably in the range of 2 to 12.0.
- the number of active amine hydrogens in the epoxy resin curing agent / the number of epoxy groups in the epoxy resin is more preferably 0.4 to 10.0, still more preferably 0. It is in the range of 6 to 8.0, more preferably more than 1.0 and 5.0 or less, still more preferably 1.1 to 3.5.
- the epoxy resin composition of the present invention contains polyalkylene glycol.
- polyalkylene glycol when polyalkylene glycol is used, even in an epoxy resin composition containing an unsaturated fatty acid amide having 14 to 24 carbon atoms, deterioration of gas barrier property and gloss is suppressed, and high gas barrier property and practically sufficient adhesiveness are obtained. Moreover, an epoxy resin composition capable of forming a cured coating film having a good appearance can be obtained.
- polyalkylene glycol examples include homopolymers or copolymers of alkylene glycols having 2 to 8 carbon atoms.
- the alkylene glycol may be either a linear alkylene glycol or a branched alkylene glycol.
- homopolymers of alkylene glycols having 2 to 8 carbon atoms include polyethylene glycol (PEG), polypropylene glycol (PPG), poly (oxytrimethylene) glycol [polytrimethylene ether glycol], and poly (oxybutylene).
- PEG polyethylene glycol
- PPG polypropylene glycol
- poly (oxytrimethylene) glycol polytrimethylene ether glycol
- poly (oxybutylene) poly (oxybutylene).
- Glycol poly (oxytetramethylene) glycol [polytetramethylene ether glycol: PTMG]
- poly (oxypentamethylene) glycol poly (oxyhexamethylene) glycol
- poly (oxyoctamethylene) glycol and the like can be mentioned.
- copolymer of alkylene glycol having 2 to 8 carbon atoms examples include polyoxyethylene-polyoxypropylene glycol (PEG-PPG), polyoxyethylene-polyoxytrimethylene glycol, and polyoxyethylene-polyoxybutylene glycol.
- Polyoxyethylene-Polyoxytetramethylene Glycol PEG-PTMG
- Polyoxyethylene-Polyoxyhexamethylene Glycol Polyoxypropylene-Polyoxytrimethylene Glycol
- Polyoxypropylene-Polyoxybutylene Glycol Polyoxypropylene-Poly Oxytetramethylene glycol (PPG-PTMG)
- PPG-PTMG Polyoxytrimethylene-polyoxytetramethylene glycol
- polyoxytetramethylene-polyoxyhexamethylene glycol polyoxyethylene-polyoxypropylene-polyoxybutylene glycol
- polyoxyethylene-poly Examples thereof include oxypropylene-polyoxytetramethylene glycol.
- the polyalkylene glycol one kind or two or more kinds can be used. From the viewpoint of improving the gas barrier property and the appearance of the cured coating film, the polyalkylene glycol is preferably a homopolymer or a copolymer of alkylene glycol having 2 to 6 carbon atoms, and is preferably an alkylene glycol having 2 to 4 carbon atoms.
- Polyethylene glycol polypropylene glycol, poly (oxytrimethylene) glycol, poly (oxybutylene) glycol, poly (oxytetramethylene) glycol, polyoxyethylene-polyoxypropylene glycol, At least one selected from the group consisting of polyoxyethylene-polyoxytrimethylene glycol, polyoxyethylene-polyoxytetramethylene glycol, polyoxypropylene-polyoxytetramethylene glycol, and polyoxytrimethylene-polyoxytetramethylene glycol.
- polyethylene glycol is even more preferable, and at least one selected from the group consisting of polyethylene glycol, polypropylene glycol, and poly (oxytetramethylene) glycol is even more preferable, from the viewpoint of improving gas barrier properties, from the viewpoint of improving the appearance of the cured coating film, and to inorganic substances. From the viewpoint of improving adhesiveness, polyethylene glycol is even more preferable.
- the weight average molecular weight (Mw) of the polyalkylene glycol is preferably 150 to 10,000, more preferably 200 to 10,000, still more preferably 200, from the viewpoint of improving the gas barrier property and the appearance of the cured coating film. It is 5,000, more preferably 200 to 3,000, and even more preferably from the viewpoint of improving the gas barrier property, improving the appearance of the cured coating film, suppressing blocking, and improving the adhesiveness to inorganic substances. It is 200 to 2,000, more preferably 200 to 1,500, even more preferably 200 to 1,000, and even more preferably 200 to 500.
- the content of polyalkylene glycol in the epoxy resin composition is 100 parts by mass in total of the epoxy resin and the non-volatile content in the epoxy resin curing agent from the viewpoint of improving the gas barrier property and the appearance of the cured coating film.
- it is preferably 0.1 to 5.0 parts by mass, more preferably 0.2 to 5.0 parts by mass, still more preferably 0.3 to 3.0 parts by mass, and even more preferably 0.5 to 2 parts.
- the epoxy resin composition of the present invention preferably contains an unsaturated fatty acid amide having 14 to 24 carbon atoms (hereinafter, also simply referred to as “unsaturated fatty acid amide”).
- unsaturated fatty acid amide has 14 to 24 carbon atoms, and is preferably 16 to 24, more preferably 18 to 22, from the viewpoint of imparting properties suitable for the coating composition and improving the adhesiveness to the inorganic substance. be.
- the unsaturated fatty acid constituting the unsaturated fatty acid amide may be a fatty acid having at least one unsaturated bond and having 14 to 24 carbon atoms.
- the number of unsaturated bonds in the unsaturated fatty acid is preferably 1 to 6, more preferably 1 to 4, and even more preferably 1 to 2.
- Examples of unsaturated fatty acids constituting unsaturated fatty acid amides include monounsaturated ones such as myristoleic acid, sapienoic acid, palmitoleic acid, oleic acid, ellagic acid, baxenoic acid, gadrain acid, eicosenoic acid, erucic acid, and nervonic acid.
- Fatty acids such as linoleic acid, eicosadienoic acid, docosadienoic acid; triunsaturated fatty acids such as linolenic acid, pinolenic acid, eleostearic acid, meadic acid, eikosatrienic acid; stearidonic acid, arachidonic acid, eikosa Tetra fatty acids such as tetraenoic acid and adrenic acid; and one or a combination of two or more of these can be used.
- diunsaturated fatty acids such as linoleic acid, eicosadienoic acid, docosadienoic acid
- triunsaturated fatty acids such as linolenic acid, pinolenic acid, eleostearic acid, meadic acid, eikosatrienic acid; stearidonic acid, arachidonic acid, eikosa Tetra fatty acids such as tetraenoic acid
- At least selected from the group consisting of monounsaturated fatty acids and diunsaturated fatty acids having 14 to 24 carbon atoms from the viewpoint of imparting properties suitable for the coating composition and improving the adhesiveness to inorganic substances.
- monounsaturated fatty acids having 14 to 24 carbon atoms are more preferable, monounsaturated fatty acids having 16 to 24 carbon atoms are more preferable, and monounsaturated fatty acids having 18 to 22 carbon atoms are more preferable.
- the unsaturated fatty acid amide used in the present invention is preferably palmitreic acid amide, oleic acid amide, eicosenoic acid amide, and erucic acid from the viewpoint of imparting properties suitable for the coating composition and improving the adhesiveness to inorganic substances. At least one selected from the group consisting of amides, more preferably at least one selected from the group consisting of oleic acid amides and erucic acid amides, and even more preferably erucic acid amides from the viewpoint of blocking inhibitory effect. ..
- the epoxy resin composition has erucic acid amide solubility in an epoxy resin composition containing an amine-based curing agent, but is not too soluble in the epoxy resin composition as compared with oleic acid amide and the like. Alternatively, it bleeds out to the surface layer of the cured product and acts as a lubricant. Therefore, it is presumed that the epoxy resin composition containing the erucic acid amide has an improved drying rate and the above-mentioned blocking suppressing effect can be obtained.
- the content of unsaturated fatty acid amide in the epoxy resin composition is preferably 0.1 with respect to 100 parts by mass of the total amount of the epoxy resin and the non-volatile content in the epoxy resin curing agent. ⁇ 20.0 parts by mass, more preferably 0.2 to 15.0 parts by mass, still more preferably 0.5 to 15.0 parts by mass, still more preferably 1.0 to 15.0 parts by mass, still more preferable. Is 3.0 to 10.0 parts by mass.
- the content of the unsaturated fatty acid amide is 0.1 part by mass or more with respect to 100 parts by mass of the total amount of the epoxy resin in the epoxy resin composition and the non-volatile content in the epoxy resin curing agent, the adhesiveness to the inorganic substance is improved. It is preferable from the viewpoint of obtaining the blocking suppressing effect. Further, if it is 20.0 parts by mass or less, high gas barrier property and transparency can be maintained, and elution of the unsaturated fatty acid amide can be suppressed.
- the epoxy resin composition of the present invention can further contain non-spherical inorganic particles.
- non-spherical inorganic particles By containing non-spherical inorganic particles in the epoxy resin composition of the present invention, a blocking suppressing effect can be obtained when used for forming a cured product layer of a gas barrier laminated body described later, and gas barrier properties and bending resistance are obtained. Sex can also be improved.
- the shape of the non-spherical inorganic particles may be a three-dimensional shape other than a spherical shape (substantially a perfect circular sphere), and examples thereof include a plate shape, a scale shape, a columnar shape, a chain shape, and a fibrous shape.
- a plurality of plate-shaped and scaly-shaped inorganic particles may be laminated to form a layer.
- plate-shaped, scaly, columnar, or chain-shaped inorganic particles are preferable, and plate-shaped, scaly, or columnar inorganic particles are more preferable, and plate-shaped.
- scaly inorganic particles are more preferable.
- Examples of the inorganic substance constituting the non-spherical inorganic particles include silica, alumina, mica, talc, aluminum, bentonite, smectite and the like. Among these, at least one selected from the group consisting of silica, alumina, and mica is preferable, and at least one selected from the group consisting of silica and alumina is more preferable from the viewpoint of improving gas barrier property and bending resistance. Silica is even more preferred.
- the non-spherical inorganic particles may be surface-treated, if necessary, for the purpose of enhancing the dispersibility in the epoxy resin composition and improving the transparency of the cured product.
- the non-spherical inorganic particles are preferably coated with an organic material, and when the epoxy resin composition is used for forming the cured product layer of the gas barrier laminate, the gas barrier property, bending resistance and transparency are improved.
- the epoxy resin composition is used for forming the cured product layer of the gas barrier laminate, the gas barrier property, bending resistance and transparency are improved.
- at least one selected from the group consisting of silica and alumina coated with an organic material is more preferable.
- silica coated with an organic material is more preferable, and from the viewpoint of transparency, alumina coated with an organic material is further preferable.
- the average particle size of the non-spherical inorganic particles is preferably 1 to 2,000 nm, more preferably 1 to 1,500 nm, still more preferably 1 to 1,000 nm, still more preferably 1 to 800 nm, still more preferably 1 to 1 to 1. It is in the range of 500 nm, more preferably 5 to 300 nm, even more preferably 5 to 200 nm, even more preferably 5 to 100 nm, and even more preferably 8 to 70 nm.
- the average particle size is 1 nm or more, the inorganic particles can be easily prepared, and when the average particle size is 2,000 nm or less, the epoxy resin composition has a gas barrier property when used for forming a cured product layer of the gas barrier property. Both bending resistance and transparency are improved.
- the average particle size is the average particle size of the primary particles.
- the aspect ratio of the non-spherical inorganic particles is preferably 2 to 700, more preferably 3 to 500. When the aspect ratio is 2 or more, good gas barrier properties are likely to be exhibited.
- the average particle size and aspect ratio of the non-spherical inorganic particles are observed using, for example, a scanning electron microscope (SEM) or a transmission electron microscope (TEM), and are obtained from the average of three or more measured values.
- the average particle size and aspect ratio of the non-spherical inorganic particles present in the cured product layer for example, after embedding a gas barrier laminate described later with an epoxy resin, ions in the cross section of the laminate are used using an ion milling device. It can be obtained by performing milling to prepare a cross-section observation sample, and observing and measuring the cross-section of the cured product layer portion of the obtained sample by the same method as described above.
- the average particle size of the non-spherical inorganic particles is less than 100 nm and it is difficult to measure the average particle size by the above method, the average particle size can be measured by, for example, the BET method.
- the content of the non-spherical inorganic particles in the epoxy resin composition is preferably 0.5 to 10.0 with respect to 100 parts by mass of the total amount of the epoxy resin and the epoxy resin curing agent. It is by mass, more preferably 1.0 to 8.0 parts by mass, still more preferably 1.5 to 7.5 parts by mass, and even more preferably 3.0 to 7.0 parts by mass.
- the epoxy resin composition is used as a gas barrier laminate. When used for forming a cured product layer, the gas barrier property and the bending resistance improving effect are improved. Further, when the content is 10.0 parts by mass or less, the transparency is also good.
- the epoxy resin composition may contain a thermosetting resin, a wetting agent, a tackifier, a defoaming agent, a curing accelerator, a rust preventive additive, a pigment, and oxygen scavenger, if necessary, as long as the effects of the present invention are not impaired. Additives such as agents may be added.
- the total content of the above additives in the epoxy resin composition is preferably 20.0 parts by mass or less, more preferably 0.001 to 15 parts by mass, based on 100 parts by mass of the total amount of the epoxy resin and the epoxy resin curing agent. It is 0.0 parts by mass.
- the total content of the epoxy resin, the epoxy resin curing agent, and the polyalkylene glycol in the solid content of the epoxy resin composition is preferably 60% by mass or more, more preferably 70% by mass.
- the above is more preferably 80% by mass or more, still more preferably 85% by mass or more, and the upper limit is 100% by mass.
- the "solid content of the epoxy resin composition” means the components in the epoxy resin composition excluding water and the organic solvent.
- the epoxy resin composition may contain an organic solvent.
- the organic solvent is preferably a non-reactive solvent. Specific examples thereof include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methoxyethanol, 2-ethoxyethanol, 2-propanol, 2-butoxyethanol, 1-methoxy-.
- Use one or more protonic polar solvents such as 2-propanol, 1-ethoxy-2-propanol, 1-propanol, 1-propanol, ethyl acetate, butyl acetate, methylisobutylketone, toluene and the like. Can be done.
- At least one selected from the group consisting of methanol, ethanol and ethyl acetate is preferable, and at least one selected from the group consisting of ethanol and ethyl acetate is preferable. More preferred.
- the epoxy resin composition includes, for example, an epoxy resin, an epoxy resin curing agent, a polyalkylene glycol, an unsaturated fatty acid amide having 14 to 24 carbon atoms used as necessary, a dispersion of non-spherical inorganic particles, and other additives. It can be prepared by blending a predetermined amount of each solvent and then stirring and mixing using a known method and apparatus.
- the cured product of the epoxy resin composition of the present invention has excellent gas barrier properties, and also has good appearance and adhesiveness to inorganic substances.
- the cured product layer made of the cured product functions as a gas barrier layer having excellent gas barrier properties. Therefore, the epoxy resin composition of the present invention can be used for a gas barrier coating composition, a gas barrier adhesive, and the like, in addition to the gas barrier laminate described later.
- the method of curing the epoxy resin composition of the present invention to form the cured product is not particularly limited, and a known method can be used. One embodiment will be described in the method for manufacturing a gas barrier laminate.
- the gas barrier laminate of the present invention (hereinafter, also simply referred to as “laminate”) has a base material and a cured product layer of the epoxy resin composition (hereinafter, also simply referred to as “cured product layer”). It is a feature.
- the gas-barrier laminate of the present invention has a high gas barrier property, a good appearance, and a laminate having a high interlayer adhesiveness between the base material and the cured product layer.
- the materials constituting the gas barrier laminate of the present invention will be described.
- Base material As the base material constituting the gas barrier laminate of the present invention, either an inorganic base material or an organic base material can be used.
- the inorganic base material include metal foils such as aluminum foils.
- a transparent plastic film is preferable.
- the transparent plastic film include polyolefin films such as low-density polyethylene, high-density polyethylene, linear low-density polyethylene, and polypropylene; polyester films such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; nylon 6, nylon.
- Polyamide-based film such as polymethoxylen adipamide (N-MXD6); polyimide-based film; biodegradable film such as polylactic acid; polyacrylonitrile-based film; poly (meth) acrylic-based film; polystyrene-based film Polycarbonate-based film; ethylene-vinyl acetate copolymer saponified (EVOH) -based film, polyvinyl alcohol-based film and the like can be mentioned.
- N-MXD6 polymethoxylen adipamide
- biodegradable film such as polylactic acid; polyacrylonitrile-based film; poly (meth) acrylic-based film; polystyrene-based film
- Polycarbonate-based film ethylene-vinyl acetate copolymer saponified (EVOH) -based film, polyvinyl alcohol-based film and the like can be mentioned.
- EVOH ethylene-vinyl acetate copolymer saponified
- the organic substrate is preferably a film selected from the group consisting of a polyolefin-based film, a polyester-based film, a polyamide-based film, and a polyimide-based film, and a polyolefin-based film and a film.
- a film selected from the group consisting of polyester films is more preferable, and a polypropylene film or a polyethylene terephthalate (PET) film is further preferable.
- PET polyethylene terephthalate
- the film may be stretched in a uniaxial or biaxial direction.
- the thickness of the base material can be appropriately selected depending on the intended use, and is not particularly limited, but is preferably 5 to 300 ⁇ m, more preferably 5 to 100 ⁇ m, still more preferably 5 to 50 ⁇ m, and more, from the viewpoint of gas barrier properties and strength. More preferably, it is 5 to 40 ⁇ m.
- the base material is an organic base material
- the thickness of the organic base material is more preferably 8 to 50 ⁇ m, still more preferably 10 to 40 ⁇ m from the viewpoint of gas barrier property and strength.
- the cured product layer in the gas barrier laminate of the present invention is made of a cured product of the epoxy resin composition.
- the curing method of the epoxy resin composition is not particularly limited, and it is carried out by a known method at a concentration and temperature of the epoxy resin composition sufficient to obtain the cured product.
- the curing temperature can be selected, for example, in the range of 10 to 140 ° C.
- the thickness of the cured product layer is preferably 0.05 ⁇ m or more, more preferably 0.08 ⁇ m or more, still more preferably 0.1 ⁇ m or more, from the viewpoint of gas barrier properties and bending resistance. Further, from the viewpoint of adhesiveness to inorganic substances and transparency, it is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, still more preferably 5.0 ⁇ m or less, still more preferably 2.0 ⁇ m or less, still more preferably 1.0 ⁇ m. Below, it is even more preferably 0.5 ⁇ m or less, and even more preferably 0.4 ⁇ m or less. The above thickness is the thickness per layer of the cured product layer.
- the gas barrier laminate of the present invention may have a base material and at least one cured product layer. From the viewpoint of obtaining high gas barrier properties, it is preferable that the laminate of the present invention has at least one layer composed of an inorganic substance. Specifically, it is preferable that the layer made of an inorganic substance is the inorganic base material or an inorganic thin film layer.
- the inorganic thin film layer is provided to impart gas barrier properties to the gas barrier laminated body, and can exhibit high gas barrier properties even if the thickness is thin.
- the inorganic thin film layer include those made of a metal foil and those formed by a vapor deposition method, but from the viewpoint of obtaining high transparency, an inorganic thin film layer formed by a vapor deposition method is preferable.
- the inorganic substance constituting the inorganic thin film layer is not particularly limited as long as it is an inorganic substance capable of forming a gas barrier thin film on the base material or the cured product layer, and is silicon, aluminum, magnesium, calcium, zinc, tin, nickel.
- at least one selected from the group consisting of silicon oxide (silica), aluminum, and aluminum oxide (alumina) is preferable from the viewpoint of gas barrier properties.
- the above-mentioned inorganic substances may be used alone or in combination of two or more.
- the thickness of the inorganic thin film layer is preferably 5 nm or more from the viewpoint of obtaining high gas barrier properties. Further, from the viewpoint of transparency and bending resistance, it is preferably 100 nm or less, more preferably 50 nm or less. The above thickness is the thickness per layer of the inorganic thin film layer.
- the method for forming the inorganic thin film layer is not particularly limited.
- the vapor deposition method includes a physical vapor deposition method such as a vacuum vapor deposition method, a sputtering method, and an ion plating method, or a plasma chemical vapor deposition method or a thermochemical vapor deposition method.
- a physical vapor deposition method such as a vacuum vapor deposition method, a sputtering method, and an ion plating method
- a plasma chemical vapor deposition method or a thermochemical vapor deposition method examples thereof include known vapor deposition methods such as a chemical vapor deposition method such as a method and a photochemical vapor deposition method.
- a metal foil such as an aluminum foil can be bonded to the base material to form an inorganic thin film layer.
- the inorganic thin film layer can be formed on, for example, an organic base material or a cured product layer.
- the gas barrier laminate of the present invention may further have one layer or two or more thermoplastic resin layers depending on the intended use.
- the thermoplastic resin layer it is preferable to use a thermoplastic resin film, and the same transparent plastic film as that exemplified in the organic substrate can be used.
- the transparent plastic films at least one selected from the group consisting of polyolefin-based films and polyamide-based films is preferable, and polypropylene films and nylon 6 films are selected from the viewpoint of transparency, heat resistance, and suitability for packaging foods and the like. At least one selected from the group is more preferable.
- the surface of the thermoplastic resin film may be subjected to surface treatment such as flame treatment or corona discharge treatment.
- thermoplastic resin film a film containing an ultraviolet absorber, a colorant, or the like, or a film having a primer layer, an ink layer, a surface protection layer, a vapor deposition layer, or the like on the surface can also be used.
- the thickness of the thermoplastic resin layer is preferably 10 to 300 ⁇ m, more preferably 10 to 100 ⁇ m. The above thickness is the thickness per layer of the thermoplastic resin layer.
- the gas barrier laminate of the present invention may further have an adhesive layer for laminating the thermoplastic resin layer.
- the adhesive constituting the adhesive layer known adhesives such as urethane-based adhesives, acrylic-based adhesives, and epoxy-based adhesives can be used.
- the thickness of the adhesive layer is not particularly limited, but is preferably 0.1 to 30 ⁇ m, more preferably 1 to 20 ⁇ m, and even more preferably 2 to 20 ⁇ m from the viewpoint of achieving both adhesiveness and transparency. The above thickness is the thickness per layer of the adhesive layer.
- the gas barrier laminate of the present invention may have a structure having the base material and at least one cured product layer.
- the gas barrier laminate of the present invention preferably has a layer composed of an inorganic substance, and from the viewpoint of economy, the cured product layer is preferably one or two layers. Is preferably configured to have only one layer. Further, it is preferable that the layer made of an inorganic substance and the cured product layer are adjacent to each other.
- the following is exemplified as a layer structure of a gas barrier laminate having a base material and a layer having one or two cured products and having a layer composed of an inorganic substance.
- a structure having a base material and a cured product layer, and the base material being an inorganic base material (2) A structure having a base material, an inorganic thin film layer, and a cured product layer in order (3) A base material and a cured product layer (4) A structure having a base material, a cured product layer, an inorganic thin film layer, and a cured product layer in order (4)
- the base material in the above (2), (3) and (4) is an organic base material. Is preferable. Further, it is preferable that the layer made of an inorganic substance and the cured product layer are adjacent to each other, and from the viewpoint of gas barrier properties, any of the above (1), (2) or (4) is preferable. , The configuration of (1) or (2) above is more preferable.
- the epoxy resin composition of the present invention can form a cured coating film having a good appearance, and particularly when it contains the unsaturated fatty acid amide, it has improved drying speed, less blocking, and properties suitable for a coating composition. .. From the viewpoint of the effectiveness of this effect, the configuration of (2) or (4) above is more preferable, and the configuration of (2) is further preferable.
- the gas barrier laminated body of the present invention has any of the above-mentioned layer configurations (1) to (4), and may further have one or two or more layers of the above-mentioned thermoplastic resin layer. However, from the viewpoint of the effectiveness of the above effects of the epoxy resin composition of the present invention, it is more preferable that the epoxy resin composition does not have a thermoplastic resin layer other than the base material.
- Examples of the layer structure of the gas barrier laminate include the structures shown in FIGS. 1 to 9.
- a laminated body having no thermoplastic resin layer other than the base material is referred to as “laminated body (I)”
- a laminated body having a total number of laminated base materials and thermoplastic resin layers of 2 is “laminated”.
- the body (II) "and 3 are called” laminated body (III) ". From the viewpoint of the effectiveness of the effect of the present invention, the laminated body (I) is more preferable.
- FIG. 1 and 2 are schematic cross-sectional views showing an embodiment of the gas barrier laminate (I) of the present invention.
- the gas barrier laminate 100 in FIG. 1 has a structure in which an inorganic thin film layer 2 and a cured product layer 3 are sequentially provided on a base material 1.
- the inorganic thin film layer 2 and the cured product layer 3 are adjacent to each other.
- the gas barrier laminate 100a in FIG. 2 has a structure in which a cured product layer 3 and an inorganic thin film layer 2 are sequentially provided on a base material 1.
- FIGS. 3 to 6 are schematic cross-sectional views showing an embodiment of the gas barrier laminate (II) of the present invention.
- the gas barrier laminates of FIGS. 3 to 6 have one base material and one thermoplastic resin layer (two layers in total), and the thermoplastic resin layer may be directly laminated or via an adhesive layer. May be laminated.
- the gas barrier laminate 200 in FIG. 3 has a structure in which a thermoplastic resin layer 4 is directly laminated without an adhesive layer, and is a base material 1, an inorganic thin film layer 2, a cured product layer 3, and a thermoplastic resin layer 4. Is a structure in which is laminated in this order.
- the gas barrier laminate 300 in FIG. 4 has a configuration in which a base material 1, an inorganic thin film layer 2, a cured product layer 3, an adhesive layer 5, and a thermoplastic resin layer 4 are laminated in this order.
- the gas barrier laminated body 300a in FIG. 5 has a structure in which a base material 1, a cured product layer 3, an inorganic thin film layer 2, an adhesive layer 5, and a thermoplastic resin layer 4 are laminated in this order.
- the gas barrier laminated body 300b in FIG. 6 has a structure in which a base material 1, a cured product layer 3, an inorganic thin film layer 2, a cured product layer 3, an adhesive layer 5, and a thermoplastic resin layer 4 are laminated in this order.
- FIGS. 7 to 9 are schematic cross-sectional views showing an embodiment of the gas barrier laminate (III) of the present invention.
- the gas barrier laminate of FIGS. 7 and 8 has one base material and two thermoplastic resin layers (three layers in total), and the gas barrier laminate of FIG. 9 has two base materials and is thermoplastic. It has one resin layer (three layers in total).
- the base material 1, the inorganic thin film layer 2, the cured product layer 3, the adhesive layer 5, the thermoplastic resin layer 4, the adhesive layer 5, and the thermoplastic resin layer 4 are laminated in this order. It is a configuration.
- the gas barrier laminate 400c of FIG. 9 has a configuration in which a base material 1, an adhesive layer 5, a base material 1c, a cured product layer 3, an adhesive layer 5, and a thermoplastic resin layer 4 are laminated in this order.
- At least one of the base materials is preferably an inorganic base material, and examples thereof include those in which the base material 1c is an inorganic base material.
- the thermoplastic resin layers 4 constituting the gas barrier laminate 400 or 400a may all be the same resin layer or may be different resin layers from each other.
- the adhesive layer 5 may be a layer made of the same adhesive or a layer made of different adhesives.
- the gas barrier laminate of the present invention is not limited to the layer structure shown in FIGS. 1 to 9. Further, the laminate of the present invention may be further laminated with an arbitrary layer such as a primer layer, an ink layer such as a printing layer, an adhesive layer, a surface protection layer, and a vapor deposition layer.
- the method for producing the gas barrier laminate of the present invention is not particularly limited, and a known method can be used.
- a method for producing the gas barrier laminate 100 having the configuration shown in FIG. 1 an inorganic thin film layer is formed on one side of a base material, and the epoxy resin composition for forming a cured product layer is formed on the surface on the inorganic thin film layer side.
- examples thereof include a method of applying to a desired thickness and then curing the epoxy resin composition to form a cured product layer.
- a cured product layer may be formed on the surface of the inorganic thin film layer by using a film in which the inorganic thin film layer is previously formed on the transparent plastic film.
- the epoxy resin composition is applied to one side of a base material, and then the epoxy resin composition is cured to form a cured product layer, and then the cured product is formed.
- Examples thereof include a method of forming an inorganic thin film layer on the layer.
- Examples of the coating method for applying the epoxy resin composition include bar coat, Mayer bar coat, air knife coat, gravure coat, reverse gravure coat, micro gravure coat, micro reverse gravure coat, die coat, slot die coat, and vacuum die coat. Dip coat, spin coat, roll coat, spray coat, brush coat and the like can be mentioned.
- a bar coat, a roll coat or a spray coat is preferable, and industrially, a gravure coat, a reverse gravure coat, a micro gravure coat, or a micro reverse gravure coat is preferable.
- a step (drying step) of volatilizing the solvent is performed if necessary.
- the conditions in the drying step can be appropriately selected, and for example, the drying step can be performed under the conditions of a drying temperature of 40 to 180 ° C. and a drying time of 5 to 180 seconds.
- the drying rate is improved, so that the drying temperature can be lowered.
- the drying temperature is preferably 40 to 120 ° C, more preferably 40 to 100 ° C, still more preferably 50 to 90 ° C.
- the epoxy resin composition is cured to form a cured product layer.
- the curing temperature can be selected, for example, in the range of 10 to 140 ° C, preferably in the range of 10 to 80 ° C.
- the curing time can be selected, for example, in the range of 0.5 to 200 hours, preferably in the range of 2 to 100 hours.
- an inorganic thin film layer is formed on a base material, the above-mentioned epoxy resin composition is applied to the inorganic thin film layer surface, and then heat is immediately applied to the coated surface.
- examples thereof include a method in which the thermoplastic resin films constituting the plastic resin layer are bonded together by a nip roll or the like, and then the epoxy resin composition is cured by the above-mentioned method.
- the epoxy resin composition constituting the cured product layer serves as an adhesive layer for adhering the inorganic thin film layer in the gas barrier laminate 200 and the thermoplastic resin film.
- an adhesive constituting the adhesive layer is applied to the cured product layer surface of the gas barrier laminate 100 having the configuration shown in FIG. 1 or one surface of the thermoplastic resin film. Then, there is a method of laminating both.
- the gas barrier laminate 300a having the configuration shown in FIG. 5 can be manufactured by the same method using the gas barrier laminate 100a having the configuration shown in FIG.
- a method for manufacturing the gas barrier laminate 300b having the configuration shown in FIG. 6 a cured product layer is formed on the inorganic thin film layer surface of the gas barrier laminate 100a having the configuration shown in FIG. 2, and the cured product layer surface or the thermoplastic resin film is formed. Examples thereof include a method in which an adhesive constituting an adhesive layer is applied to one side, and then the two are laminated.
- the gas barrier laminated body 400 having the configuration shown in FIG. 7 is manufactured by repeating the steps of forming the gas barrier laminated body 300 having the configuration shown in FIG. 4, applying an adhesive, attaching a thermoplastic resin film, and laminating. can.
- the gas barrier laminate 400a having the configuration shown in FIG. 8 can be manufactured by the same method using the gas barrier laminate 300a having the configuration shown in FIG. In the gas barrier laminate 400c having the configuration of FIG.
- the base material 1, the adhesive layer 5, and the base material 1c are laminated in this order, and then a cured product layer is formed on the surface of the base material 1c, and then the cured product layer surface,
- a method of applying an adhesive constituting an adhesive layer to one side of a thermoplastic resin film and then laminating both thereof can be mentioned.
- the gas barrier laminate of the present invention has excellent gas barrier properties.
- the oxygen permeability of the gas barrier laminate (I) at 23 ° C. and 60% relative humidity varies depending on the barrier property of the substrate used, but is preferably 10 cc / (m 2 ⁇ day ⁇ atm) or less. It is preferably 2 cc / (m 2 ⁇ day ⁇ atm) or less, more preferably 1 cc / (m 2 ⁇ day ⁇ atm) or less.
- the oxygen permeability and the water vapor permeability of the gas barrier laminate are specifically determined by the method described in Examples.
- the gas barrier laminate of the present invention has a good appearance by having the cured product layer. Specifically, the epoxy resin composition of the present invention is less likely to cause uneven coating when the cured product layer is formed, and the surface of the cured product layer is highly glossy. The appearance (presence or absence of coating unevenness and gloss) of the gas barrier laminate can be specifically evaluated by the method described in Examples.
- the packaging material of the present invention contains the gas barrier laminate.
- the gas barrier laminate of the present invention has excellent gas barrier properties and bending resistance, and has a good appearance, and is therefore suitable for use as a packaging material for protecting foods, pharmaceuticals, cosmetics, precision electronic parts, and the like.
- the packaging material of the present invention may be one in which the gas barrier laminate is used as it is as a packaging material, or another layer or a film may be further laminated.
- the form of the packaging material can be appropriately selected depending on the article to be stored and stored, and examples thereof include a packaging film; a packaging container such as a packaging bag and a bottle; and a lid material and a sealing material for the packaging container. ..
- the capacity of the packaging material is not particularly limited, and can be appropriately selected depending on the articles to be stored and stored.
- ⁇ Thickness of cured product layer> The thickness of the cured product layer was measured using a multilayer film thickness measuring device (“DC-8200” manufactured by Gunze Corporation).
- the reflectance of the surface of the cured product layer of the gas barrier laminate (I) formed in each example was measured according to JIS K5600-4-7: 1999. Incident light when light is incident on the surface of the cured product layer of the gas barrier laminate (I) at a scan mode and an incident angle of 60 ° using a gloss meter (“Elcometer 480” manufactured by elcometer Co., Ltd.). The ratio of the intensity of the reflected light to the light (reflectance;%) was measured. The higher the reflectance, the higher the gloss on the surface of the cured product layer. For the aluminum-deposited PET and the aluminum-deposited OPP of the reference example, the reflectance of the aluminum-deposited surface was measured.
- the urethane adhesive was applied to the aluminum-deposited surface, and in the gas barrier laminates obtained in each example, the urethane adhesive was applied to the surface on the cured product layer side. No. 12 was applied and dried at 80 ° C. for 10 seconds to form an adhesive layer (thickness after drying: about 3 ⁇ m).
- the urethane adhesive was prepared by adding 0.8 g of the curing agent "CAT-RT37” and 38.7 g of the solvent ethyl acetate to 17 g of the main agent "TM-569" manufactured by Toyo Morton Co., Ltd. and stirring well. I used the one.
- a polypropylene film having a thickness of 50 ⁇ m (“P1146” manufactured by Toyobo Co., Ltd.) was bonded onto this with a nip roll and heated at 40 ° C. for 2 days to obtain a laminate for a peel strength test.
- a T-type peeling test was performed at a peeling rate of 300 mm / min according to the method specified in JIS K6854-3: 1999, and the peeling strength (g / 15 mm) was measured. If the peel strength is 100 g / 15 mm or more, it is considered as acceptable.
- Production Example 2 (Preparation of Epoxy Resin Hardener Solution B) A solution was prepared in the same manner as in Production Example 1 except that erucic acid amide was not added in Production Example 1 to obtain an epoxy resin curing agent solution B.
- Example A (Preparation of Epoxy Resin Composition) To 3.75 g of the epoxy resin curing agent solution A obtained in Production Example 1, 29.0 g of ethanol as a diluting solvent was added and stirred well.
- 0.10 g (the number of active amine hydrogens in the epoxy resin curing agent) 0.10 g (“TETRAD-X” manufactured by Mitsubishi Gas Chemicals Co., Ltd.) having a glycidylamino group derived from metaxylylene diamine as an epoxy resin /
- the number of epoxy groups in the epoxy resin 3.0) and 0.007 g of polyethylene glycol (“PEG1000” manufactured by Fuji Film Wako Pure Chemical Industries, Ltd., Mw 1,000) were added and stirred to prepare an epoxy resin composition. ..
- the total amount of the epoxy resin in the epoxy resin composition and the non-volatile content in the epoxy resin curing agent solution A is 100 parts by mass, the amount of polyethylene glycol is 1.0 part by mass, and the amount of erucic acid amide is 5. It is 0.0 parts by mass.
- Example B In Example A, the same method as in Example A was used except that the epoxy resin curing agent solution B obtained in Production Example 2 was used instead of the epoxy resin curing agent solution A obtained in Production Example 1. An epoxy resin composition was prepared.
- Example C Epoxy resin in the same manner as in Example A, except that polytetramethylene ether glycol (PTMG, manufactured by Mitsubishi Chemical Corporation, Mw1,000) was used in place of polyethylene glycol "PEG1000" in Example A.
- PTMG polytetramethylene ether glycol
- Mw1,000 polytetramethylene ether glycol
- Example D Epoxy resin composition in the same manner as in Example A, except that polyethylene glycol "PEG200” (manufactured by Fuji Film Wako Pure Chemical Industries, Ltd., Mw200) was used in place of polyethylene glycol "PEG1000" in Example A. The thing was prepared.
- polyethylene glycol "PEG200” manufactured by Fuji Film Wako Pure Chemical Industries, Ltd., Mw200
- Example E the epoxy resin composition was prepared by the same method as in Example A except that the blending amount of polyethylene glycol was changed to 0.014 g.
- Example F the epoxy resin composition was prepared by the same method as in Example A except that the blending amount of polyethylene glycol was changed to 0.021 g.
- Comparative Example A An epoxy resin composition was prepared in the same manner as in Example A except that polyethylene glycol was not blended in Example A.
- Comparative Example B Epoxy resin composition in the same manner as in Example A, except that dipropylene glycol monomethyl ether (DPGME, manufactured by Tokyo Chemical Industry Co., Ltd., Mw148) was used in place of polyethylene glycol "PEG1000" in Example A. The thing was prepared.
- DPGME dipropylene glycol monomethyl ether
- the composition of the epoxy resin composition is shown in Table 1.
- the blending amounts in Table 1 are the blending amounts (parts by mass) as effective components.
- Example 1 (Preparation and evaluation of gas barrier laminate (I))
- the epoxy resin composition obtained in Example A was applied to an aluminum-deposited surface of an aluminum-deposited PET (“MLPET” manufactured by Mitsui Chemicals Tohcello Corporation, thickness: 12 ⁇ m) in which aluminum was vapor-deposited on one side of the PET. 3 was applied.
- the epoxy resin composition was heated in a drying oven at 80 ° C. for 30 seconds to dry (thickness after drying: 0.1 ⁇ m), and further aged at 40 ° C. for 2 days to obtain the gas barrier laminate having the configuration shown in FIG. I) was prepared.
- Various evaluations were carried out by the above method using the obtained gas barrier laminate. The results are shown in Table 2.
- Example 7 Except for the fact that in Example 1, the base material was changed to an aluminum-deposited OPP (“MLOP102” manufactured by Mitsui Chemicals Tohcello Corporation, thickness: 25 ⁇ m) in which aluminum was vapor-deposited on one side of biaxially stretched polypropylene (OPP).
- OPP aluminum-deposited OPP
- a gas barrier laminate was prepared and evaluated in the same manner as in Example 1. The results are shown in Table 2.
- Example 8 In Example 7, the epoxy resin composition used is changed to the epoxy resin composition shown in Table 2, and the epoxy resin composition is applied to the aluminum vapor-deposited OPP, and then heated and dried in a drying furnace at 80 ° C. for 60 seconds. A gas barrier laminated body was prepared and evaluated by the same method as in Example 7 except that it was allowed to be prepared. The results are shown in Table 2.
- Example 9 Comparative Examples 3-4 In Example 7, a gas barrier laminate was prepared and evaluated in the same manner as in Example 7 except that the epoxy resin composition used was changed to the epoxy resin composition shown in Table 2. The results are shown in Table 2.
- Table 2 shows the evaluation results of aluminum-deposited PET alone as "Reference Example 1". Further, as “Reference Example 2", the evaluation result of the aluminum-deposited OPP alone is shown.
- the gas barrier laminate obtained by using the epoxy resin composition of this example did not show uneven coating of the epoxy resin composition, and the cured product layer was more than the gas barrier laminate of Comparative Example. Since the surface has a high reflectance, the gloss is improved, and it can be seen that the appearance is good. Further, the gas barrier laminate of this example has a good barrier property of oxygen and water vapor. Furthermore, the peel strength is also at the acceptable level.
- Example 10 (Preparation and evaluation of gas barrier laminate (II))
- the epoxy resin composition obtained in Example B is an aluminum-deposited OPP (“MLOP102” manufactured by Mitsui Chemicals Tosero Co., Ltd., thickness: 25 ⁇ m) in which aluminum is vapor-deposited on one side of biaxially stretched polypropylene (OPP). Bar coater No. on the surface. 8 was applied.
- the epoxy resin composition was heated at 80 ° C. for 30 seconds to dry (thickness after drying: about 3 ⁇ m).
- a polypropylene film having a thickness of 50 ⁇ m (“P1146” manufactured by Toyobo Co., Ltd.) was immediately bonded onto this with a nip roll and aged at 40 ° C.
- gas barrier laminate (II) having the configuration shown in FIG. rice field.
- oxygen permeability, water vapor permeability, and peel strength were measured by the above method.
- peel strength a T-type peeling test was performed at a peeling rate of 300 mm / min using the gas barrier laminate (II) according to the method specified in JIS K6854-3: 1999, and the peel strength (g / 15 mm). ) was measured. The results are shown in Table 3.
- Example 10 instead of the epoxy resin composition obtained in Example B, a urethane adhesive was applied to the aluminum-deposited surface of the aluminum-deposited OPP. No. 12 was applied and dried at 80 ° C. for 10 seconds to form an adhesive layer (thickness after drying: about 3 ⁇ m).
- the urethane adhesive was prepared by adding 0.8 g of the curing agent "CAT-RT37" and 38.7 g of the solvent ethyl acetate to 17 g of the main agent "TM-569" manufactured by Toyo Morton Co., Ltd. and stirring well. I used the one.
- the epoxy resin composition of the present invention exhibits high gas barrier properties even when used for forming an adhesive layer of a laminated film. Furthermore, the peel strength is also at the acceptable level.
- Example 11 (Preparation and evaluation of gas barrier laminate (I))
- the epoxy resin composition obtained in Example A was applied to a biaxially stretched polypropylene film (“FOR” manufactured by Futamura Chemical Co., Ltd., thickness: 20 ⁇ m) on one side of a bar coater No. 3 was applied.
- the epoxy resin composition was heated in a drying oven at 80 ° C. for 30 seconds to dry (thickness after drying: 0.1 ⁇ m), and further aged at 40 ° C. for 2 days to form a cured product layer.
- an aluminum-deposited layer having a thickness of 40 nm was formed on the surface of the cured product layer by a vacuum-deposited method to prepare a gas-barrier laminated body (I) having the configuration shown in FIG.
- the oxygen permeability and the peel strength were measured by the above method. The results are shown in Table 4.
- Example 11 the epoxy resin composition obtained in Example A was not used, and an aluminum vapor deposition layer having a thickness of 40 nm was formed on one side of a biaxially stretched polypropylene film having a thickness of 20 ⁇ m by a vacuum vapor deposition method to form a vapor deposition film.
- the oxygen permeability and the peel strength were measured by the above method. The results are shown in Table 4.
- Example 12 The epoxy resin composition obtained in Example A was applied to a biaxially stretched polypropylene film (“FOR” manufactured by Futamura Chemical Co., Ltd., thickness: 20 ⁇ m) on one side of a bar coater No. 3 was applied.
- the epoxy resin composition was heated in a drying oven at 80 ° C. for 30 seconds to dry (thickness after drying: 0.1 ⁇ m), and further aged at 40 ° C. for 2 days to form a cured product layer.
- an alumina-deposited layer having a thickness of 20 nm was formed on the surface of the cured product layer by a vacuum vapor deposition method to prepare a gas barrier laminated body (I) having the configuration shown in FIG.
- the oxygen permeability and the peel strength were measured by the above method.
- the results are shown in Table 4.
- 1.05 g of the curing agent "CAT-RT85” and 25 g of the solvent ethyl acetate were added to 15 g of the main agent "AD-502" manufactured by Toyo Morton Co., Ltd. as the urethane adhesive.
- the one prepared by stirring well was used.
- Example 12 the epoxy resin composition obtained in Example A was not used, and an alumina vapor deposition layer having a thickness of 20 nm was formed on one side of a biaxially stretched polypropylene film having a thickness of 20 ⁇ m by a vacuum vapor deposition method to form a vapor deposition film.
- the oxygen transmittance and the peel strength were measured by the same method as in Example 12. The results are shown in Table 4.
- Example 13 The epoxy resin composition obtained in Example A was applied to a biaxially stretched polypropylene film (“FOR” manufactured by Futamura Chemical Co., Ltd., thickness: 20 ⁇ m) on one side of a bar coater No. 3 was applied.
- the epoxy resin composition was heated in a drying oven at 80 ° C. for 30 seconds to dry (thickness after drying: 0.1 ⁇ m), and further aged at 40 ° C. for 2 days to form a cured product layer.
- a silica-deposited layer having a thickness of 20 nm was formed on the surface of the cured product layer by a sputtering method to prepare a gas barrier laminated body (I) having the configuration shown in FIG.
- the oxygen permeability and the peel strength were measured by the above method.
- the results are shown in Table 4.
- 1.05 g of the curing agent "CAT-RT85” and 25 g of the solvent ethyl acetate were added to 15 g of the main agent "AD-502" manufactured by Toyo Morton Co., Ltd. as the urethane adhesive.
- the one prepared by stirring well was used.
- Example 13 a silica-deposited layer having a thickness of 20 nm was formed on one side of a biaxially stretched polypropylene film having a thickness of 20 ⁇ m by a sputtering method without using the epoxy resin composition obtained in Example A to form a vapor-deposited film. Obtained. Using the obtained thin-film film, the oxygen transmittance and the peel strength were measured by the same method as in Example 13. The results are shown in Table 4.
- the epoxy resin composition of the present invention can exhibit high gas barrier properties and adhesiveness as compared with the reference example even when used in the gas barrier laminate (I) having the configuration shown in FIG. Recognize.
- the epoxy resin composition of the present invention it is particularly useful as a coating composition, has high gas barrier properties and practically sufficient adhesiveness, and can form a cured coating film having a good appearance.
- a gas barrier laminate having a base material and a cured product layer of the epoxy resin composition is suitable for various packaging material applications.
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Abstract
Description
一般に熱可塑性プラスチックフィルムの酸素バリア性はそれほど高いものではないことから、当該フィルムにガスバリア性を付与する手段として、ポリ塩化ビニリデン(PVDC)層やポリビニルアルコール(PVA)層などの各種ガスバリア層を形成する方法、又は、アルミナ(Al2O3)やシリカ(SiO2)などの無機物を蒸着する方法が検討されてきた。
特許文献4には、無機蒸着層を有する基材フィルムと、エポキシ樹脂、所定のエポキシ樹脂硬化剤、及び非球状無機粒子を含むエポキシ樹脂組成物の硬化物からなる樹脂硬化層とを有する所定の層構成のガスバリア性フィルムが、無機蒸着層を有する従来のガスバリア性フィルムよりもガスバリア性が向上し、かつ耐屈曲性にも優れることが開示されている。
さらに、積層構造を有するガスバリア性フィルム、又はガスバリア性積層体においては、良好なガスバリア性を安定して発現するため、層間接着性が高いことも重要である。これに関して、例えば特許文献6には、少なくとも、基材、プライマー層、接着剤層、及びシーラント層がこの順に積層されたラミネートフィルムにおいて、特定のポリエステル系樹脂を含有するプライマー組成物を用いてプライマー層を形成し、及び、エポキシ樹脂組成物を主成分とする接着剤を用いて接着剤層を形成することで、長期間保存しても優れたラミネート強度及びヒートシール強度を維持できる、経時接着性に優れたラミネートフィルムが得られることが開示されている。
一般に、ブロッキングの抑制には滑剤の添加等が有効である。しかしながら、添加剤を配合したエポキシ樹脂組成物の硬化物は未添加のものと比較してガスバリア性が低下する傾向があった。また、該エポキシ樹脂組成物を基材等に塗工して得られる硬化塗膜に塗工ムラが生じたり、光沢が低下したりして外観が悪化するおそれもある。
すなわち本発明は、下記[1]~[3]に関する。
[1]エポキシ樹脂、アミン系硬化剤を含むエポキシ樹脂硬化剤、及びポリアルキレングリコールを含有するエポキシ樹脂組成物。
[2]基材と、上記[1]に記載のエポキシ樹脂組成物の硬化物層とを有するガスバリア性積層体。
[3]上記[2]に記載のガスバリア性積層体を含む包装材。
本発明のエポキシ樹脂組成物は、エポキシ樹脂、アミン系硬化剤を含むエポキシ樹脂硬化剤、及びポリアルキレングリコールを含有するエポキシ樹脂組成物である。
本発明のエポキシ樹脂組成物は上記構成を有することにより、高いガスバリア性及び実用上十分な接着性を有し、且つ外観良好な硬化塗膜を形成できる。この理由については定かではないが、ポリアルキレングリコールのレベリング作用によるものと考えられる。
炭素数14~24の不飽和脂肪酸アミドをエポキシ樹脂組成物に含有させると、滑剤としての機能を発揮して、乾燥速度の向上及びブロッキングの抑制に寄与すると考えられる。また炭素数14~24の不飽和脂肪酸アミドは、エポキシ樹脂硬化物中で生じる応力を緩和する作用を奏していると考えられ、且つ飽和脂肪酸アミド等と比較して、アミン系エポキシ樹脂硬化剤を含むエポキシ樹脂組成物への相溶性が高い。そのため、該不飽和脂肪酸アミドを含有するエポキシ樹脂組成物の硬化物は、無機物に対する接着性が良好になると推察される。
<エポキシ樹脂>
本発明のエポキシ樹脂組成物に用いられるエポキシ樹脂は、飽和又は不飽和の脂肪族化合物や脂環式化合物、芳香族化合物、あるいは複素環式化合物のいずれであってよいが、高いガスバリア性の発現を考慮した場合には、芳香環又は脂環式構造を分子内に含むエポキシ樹脂が好ましい。
当該エポキシ樹脂の具体例としては、メタキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、パラキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、1,3-ビス(アミノメチル)シクロヘキサンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、1,4-ビス(アミノメチル)シクロヘキサンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、ジアミノジフェニルメタンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、パラアミノフェノールから誘導されたグリシジルアミノ基及び/又はグリシジルオキシ基を有するエポキシ樹脂、ビスフェノールAから誘導されたグリシジルオキシ基を有するエポキシ樹脂、ビスフェノールFから誘導されたグリシジルオキシ基を有するエポキシ樹脂、フェノールノボラックから誘導されたグリシジルオキシ基を有するエポキシ樹脂及びレゾルシノールから誘導されたグリシジルオキシ基を有するエポキシ樹脂から選ばれる少なくとも1つの樹脂が挙げられる。柔軟性や耐衝撃性、耐湿熱性などの諸性能を向上させるために、上記のエポキシ樹脂を適切な割合で2種以上混合して用いることもできる。
上記の中でも、ガスバリア性の観点から、エポキシ樹脂としてはメタキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、パラキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂、及びビスフェノールFから誘導されたグリシジルオキシ基を有するエポキシ樹脂からなる群から選ばれる少なくとも1種を主成分とするものが好ましく、メタキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂を主成分とするものがより好ましい。
なお、ここでいう「主成分」とは、本発明の趣旨を逸脱しない範囲で他の成分を含みうることを意味し、好ましくは全体の50~100質量%、より好ましくは70~100質量%、さらに好ましくは90~100質量%を意味する。
本発明のエポキシ樹脂組成物に用いられるエポキシ樹脂硬化剤は、高いガスバリア性を発現する観点から、アミン系硬化剤を含むものである。
アミン系硬化剤としては、従来エポキシ樹脂硬化剤として用いられているポリアミン又はその変性物を用いることができる。高いガスバリア性を得る観点から、アミン系硬化剤はポリアミンの変性物であることが好ましく、下記のアミン系硬化剤(i)及びアミン系硬化剤(ii)からなる群から選ばれる少なくとも1種であることがより好ましく、下記アミン系硬化剤(i)であることがさらに好ましい。
(i)下記の(A)成分と(B)成分との反応生成物:
(A)メタキシリレンジアミン及びパラキシリレンジアミンからなる群から選ばれる少なくとも1種
(B)下記一般式(1)で表される不飽和カルボン酸及びその誘導体からなる群から選ばれる少なくとも1種
(式(1)中、R1、R2はそれぞれ独立に、水素原子、炭素数1~8のアルキル基、炭素数6~12のアリール基、又は炭素数7~13のアラルキル基を表す。)
(ii)エピクロロヒドリンと、メタキシリレンジアミン及びパラキシリレンジアミンからなる群から選ばれる少なくとも1種との反応生成物
アミン系硬化剤(i)は、下記の(A)成分と(B)成分との反応生成物である。
(A)メタキシリレンジアミン及びパラキシリレンジアミンからなる群から選ばれる少なくとも1種
(B)下記一般式(1)で表される不飽和カルボン酸及びその誘導体からなる群から選ばれる少なくとも1種
(式(1)中、R1、R2はそれぞれ独立に、水素原子、炭素数1~8のアルキル基、炭素数6~12のアリール基、又は炭素数7~13のアラルキル基を表す。)
前記(A)成分はガスバリア性の観点から用いられ、ガスバリア性の点からメタキシリレンジアミンが好ましい。(A)成分は、1種を単独で用いてもよく、2種類を混合して用いてもよい。
また、ガスバリア性の観点から、前記一般式(1)におけるR2は水素原子又は炭素数1~8のアルキル基であることが好ましく、水素原子又は炭素数1~3のアルキル基であることがより好ましく、水素原子又はメチル基であることがさらに好ましく、水素原子であることがよりさらに好ましい。
上記の中でも、良好なガスバリア性を得る観点から、前記(B)成分はアクリル酸、メタクリル酸、クロトン酸及びこれらの誘導体からなる群から選ばれる少なくとも1種が好ましく、アクリル酸、メタクリル酸、クロトン酸及びこれらのアルキルエステルからなる群から選ばれる少なくとも1種がより好ましく、アクリル酸、メタクリル酸、及びこれらのアルキルエステルからなる群から選ばれる少なくとも1種がさらに好ましく、アクリル酸のアルキルエステルがよりさらに好ましく、アクリル酸メチルがよりさらに好ましい。
(B)成分は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
この場合、アミド基形成反応の際には、反応を完結させるために、必要に応じて反応の最終段階において反応装置内を減圧処理することもできる。また、必要に応じて非反応性の溶剤を使用して希釈することもできる。さらに脱水剤、脱アルコール剤として、亜リン酸エステル類などの触媒を添加することもできる。
得られるエポキシ樹脂硬化物の高いガスバリア性、優れた塗膜性能を特に考慮する場合には、前記(A)成分に対する前記(B)成分の反応モル比[(B)/(A)]が0.6~1.0の範囲であることがより好ましい。
(C)R3-COOHで表される一価のカルボン酸及びその誘導体からなる群から選ばれる少なくとも1種(R3は水素原子、水酸基を有していてもよい炭素数1~7のアルキル基又は炭素数6~12のアリール基を表す。)
(D)環状カーボネート
(E)炭素数2~20のモノエポキシ化合物
R3は水素原子、水酸基を有していてもよい炭素数1~7のアルキル基又は炭素数6~12のアリール基を表し、R3は、好ましくは炭素数1~3のアルキル基又はフェニル基である。
またR3-COOHで表される一価のカルボン酸の誘導体としては、例えば当該カルボン酸のエステル、アミド、酸無水物、酸塩化物が挙げられる。当該カルボン酸のエステルとしてはアルキルエステルが好ましく、当該アルキル炭素数は、好ましくは1~6、より好ましくは1~3、さらに好ましくは1~2である。
前記(C)成分としては、蟻酸、酢酸、プロピオン酸、酪酸、乳酸、グリコール酸、安息香酸等の一価のカルボン酸及びその誘導体が挙げられる。
前記(C)成分は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
前記(D)成分は1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
(式(2)中、R4は水素原子、炭素数1~8のアルキル基、アリール基、又はR5-O-CH2-を表し、R5はフェニル基又はベンジル基を表す。)
前記式(2)で示されるモノエポキシ化合物としては、例えば、エチレンオキシド、プロピレンオキシド、1,2-ブチレンオキシド、スチレンオキシド、フェニルグリシジルエーテル、及びベンジルグリシジルエーテル等が挙げられる。前記(E)成分は1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
但し、該「他の成分」の使用量は、上記アミン系硬化剤を構成する反応成分の合計量の30質量%以下であることが好ましく、10質量%以下であることがより好ましく、5質量%以下であることがさらに好ましい。
前記(A)成分と前記(C)成分との反応は、前記(A)成分と(B)成分との反応と同様の条件で行うことができる。前記(C)成分を用いる場合には、前記(B)成分及び(C)成分を混合して前記(A)成分と反応させてもよく、初めに前記(A)成分と(B)成分とを反応させてから前記(C)成分を反応させてもよい。
一方、前記(D)成分及び/又は(E)成分を用いる場合には、初めに前記(A)成分と(B)成分とを反応させてから、前記(D)成分及び/又は(E)成分と反応させることが好ましい。
前記(A)成分と前記(D)成分及び/又は(E)成分との反応は、25~200℃の条件下で(A)成分と(D)成分及び/又は(E)成分とを混合し、30~180℃、好ましくは40~170℃の条件下で付加反応を行うことにより実施される。また、必要に応じナトリウムメトキシド、ナトリウムエトキシド、カリウムt-ブトキシドなどの触媒を使用することができる。
上記反応の際には、反応を促進するために、必要に応じて(D)成分及び/又は(E)成分を溶融させるか、もしくは非反応性の溶剤で希釈して使用することもできる。
ただし、ガスバリア性及び塗工性の観点から、前記(A)成分に対する、前記(B)~(E)成分の反応モル比[{(B)+(C)+(D)+(E)}/(A)]は、0.35~2.5の範囲であることが好ましく、0.35~2.0の範囲であることがより好ましい。
アミン系硬化剤(ii)は、エピクロロヒドリンと、メタキシリレンジアミン及びパラキシリレンジアミンからなる群から選ばれる少なくとも1種との反応生成物である。
アミン系硬化剤(ii)は、下記一般式(3)で表される化合物を主成分として含むことが好ましい。ここでいう「主成分」とは、アミン系硬化剤(ii)中の全構成成分を100質量%とした場合、その含有量が50質量%以上である成分をいう。
(式(3)中、Aは1,3-フェニレン基又は1,4-フェニレン基である。nは1~12の数である。)
Aは1,3-フェニレン基であることがより好ましい。
アミン系硬化剤(ii)中、上記一般式(3)で示される化合物の含有量は、好ましくは60質量%以上、より好ましくは70質量%以上、さらに好ましくは75質量%以上、よりさらに好ましくは85質量%以上である。また、上限は100質量%である。
硬化剤としての良好な硬化性能を得る観点からは、上記一般式(3)で表される化合物の中でも、n=1の化合物が占める割合が高いことが好ましい。アミン系硬化剤(ii)中の、上記一般式(3)で表されるn=1の化合物の含有量としては、好ましくは15質量%以上、より好ましくは20質量%以上、さらに好ましくは25質量%以上である。また、上限は100質量%である。
アミン系硬化剤(ii)中の上記一般式(3)で表される化合物の含有量、及び上記一般式(3)で示される化合物の組成は、GC分析及びゲルろ過クロマトグラフィー(GPC)分析により求めることができる。
シランカップリング剤としては、例えば、ビニル基を有するシランカップリング剤、アミノ基を有するシランカップリング剤、エポキシ基を有するシランカップリング剤、(メタ)アクリル基を有するシランカップリング剤、メルカプト基を有するシランカップリング剤等が挙げられる。これらの中でも、接着性向上の観点からはアミノ基を有するシランカップリング剤及びエポキシ基を有するシランカップリング剤からなる群から選ばれる少なくとも1種が好ましい。
カップリング剤を用いる場合、エポキシ樹脂硬化剤中のカップリング剤の含有量は、エポキシ樹脂硬化剤中の硬化剤成分100質量部に対し、好ましくは0.1~10質量部、より好ましくは1~8質量部である。
本発明のエポキシ樹脂組成物は、ポリアルキレングリコールを含有する。ポリアルキレングリコールを用いると、炭素数14~24の不飽和脂肪酸アミドを含有するエポキシ樹脂組成物においてもガスバリア性の低下及び光沢の低下を抑え、高いガスバリア性及び実用上十分な接着性を有し、且つ外観良好な硬化塗膜を形成できるエポキシ樹脂組成物が得られる。
本発明のエポキシ樹脂組成物は、炭素数14~24の不飽和脂肪酸アミド(以下、単に「不飽和脂肪酸アミド」ともいう)を含有することが好ましい。これにより、乾燥速度を向上させ、耐熱性の低い基材にも適用しやすくすると共にブロッキングを抑制してコーティング用組成物に適した性状を付与できる。また、硬化塗膜の無機物に対する接着性もより向上する。
不飽和脂肪酸アミドの炭素数は14~24であり、コーティング用組成物に適した性状を付与する観点、及び無機物に対する接着性向上の観点から、好ましくは16~24、より好ましくは18~22である。
不飽和脂肪酸アミドを構成する不飽和脂肪酸としては、例えば、ミリストレイン酸、サピエン酸、パルミトレイン酸、オレイン酸、エライジン酸、バクセン酸、ガドレイン酸、エイコセン酸、エルカ酸、ネルボン酸等のモノ不飽和脂肪酸;リノール酸、エイコサジエン酸、ドコサジエン酸等のジ不飽和脂肪酸;リノレン酸、ピノレン酸、エレオステアリン酸、ミード酸、エイコサトリエン酸等のトリ不飽和脂肪酸;ステアリドン酸、アラキドン酸、エイコサテトラエン酸、アドレン酸等のテトラ脂肪酸;が挙げられ、これらのうち1種又は2種以上を組み合わせて用いることができる。これらの中でも、コーティング用組成物に適した性状を付与する観点、及び無機物に対する接着性向上の観点から、炭素数14~24の、モノ不飽和脂肪酸及びジ不飽和脂肪酸からなる群から選ばれる少なくとも1種が好ましく、炭素数14~24のモノ不飽和脂肪酸がより好ましく、炭素数16~24のモノ不飽和脂肪酸がより好ましく、炭素数18~22のモノ不飽和脂肪酸がより好ましい。
本発明に用いる不飽和脂肪酸アミドは、コーティング用組成物に適した性状を付与する観点、及び無機物に対する接着性向上の観点から、好ましくはパルミトレイン酸アミド、オレイン酸アミド、エイコセン酸アミド、及びエルカ酸アミドからなる群から選ばれる少なくとも1種であり、より好ましくはオレイン酸アミド及びエルカ酸アミドからなる群から選ばれる少なくとも1種であり、ブロッキング抑制効果の観点から、さらに好ましくはエルカ酸アミドである。
エルカ酸アミドは、アミン系硬化剤を含むエポキシ樹脂組成物への溶解性を有する一方、オレイン酸アミド等と比較すると該エポキシ樹脂組成物への溶解性が高すぎないことから、エポキシ樹脂組成物又はその硬化物の表層にブリードアウトして滑剤としても作用する。そのため、エルカ酸アミドを配合したエポキシ樹脂組成物は乾燥速度が向上し、上記ブロッキング抑制効果が得られると推察される。
本発明のエポキシ樹脂組成物には、さらに非球状無機粒子を含有することができる。本発明のエポキシ樹脂組成物に非球状無機粒子を含有させることで、後述するガスバリア性積層体の硬化物層の形成に用いた際にはブロッキング抑制効果が得られ、且つ、ガスバリア性及び耐屈曲性も向上させることができる。
非球状無機粒子の形状は、球状(略真円球状)以外の三次元形状であればよく、例えば、板状、鱗片状、柱状、鎖状、繊維状等が挙げられる。板状、鱗片状の無機粒子は複数積層されて層状になっていてもよい。これらの中でも、ガスバリア性及び耐屈曲性向上の観点からは、板状、鱗片状、柱状、又は鎖状の無機粒子が好ましく、板状、鱗片状、又は柱状の無機粒子がより好ましく、板状又は鱗片状の無機粒子がさらに好ましい。
上記非球状無機粒子は、エポキシ樹脂組成物への分散性を高め、硬化物の透明性を向上させることを目的として、必要に応じ表面処理されていてもよい。中でも、非球状無機粒子は有機系材料でコーティングされていることが好ましく、エポキシ樹脂組成物をガスバリア性積層体の硬化物層の形成に用いた際にガスバリア性及び耐屈曲性、透明性を向上させる観点からは、有機系材料でコーティングされたシリカ及びアルミナからなる群から選ばれる少なくとも1種がより好ましい。ガスバリア性及び耐屈曲性向上の観点からは、有機系材料でコーティングされたシリカがさらに好ましく、透明性の観点からは、有機系材料でコーティングされたアルミナがさらに好ましい。
非球状無機粒子の平均粒径が100nm未満であって上記方法による平均粒径の測定が困難である場合は、当該平均粒径は例えばBET法により測定することもできる。
エポキシ樹脂組成物中の上記添加剤の合計含有量は、エポキシ樹脂及びエポキシ樹脂硬化剤の合計量100質量部に対し20.0質量部以下であることが好ましく、より好ましくは0.001~15.0質量部である。
上記の中でも、硬化塗膜の外観を良好にする観点からは、メタノール、エタノール、及び酢酸エチルからなる群から選ばれる少なくとも1種が好ましく、エタノール及び酢酸エチルからなる群から選ばれる少なくとも1種がより好ましい。
エポキシ樹脂組成物は、例えばエポキシ樹脂、エポキシ樹脂硬化剤、ポリアルキレングリコール、及び、必要に応じ用いられる炭素数14~24の不飽和脂肪酸アミド、非球状無機粒子の分散液、その他の添加剤並びに溶剤をそれぞれ所定量配合した後、公知の方法及び装置を用いて攪拌、混合することにより調製できる。
本発明のガスバリア性積層体(以下、単に「積層体」ともいう)は、基材と、前記エポキシ樹脂組成物の硬化物層(以下、単に「硬化物層」ともいう)とを有することを特徴とする。
本発明のガスバリア性積層体はガスバリア性が高く、外観が良好であり、さらに、基材と硬化物層との層間接着性が高い積層体となる。以下、本発明のガスバリア性積層体を構成する材料について説明する。
本発明のガスバリア性積層体を構成する基材としては、無機基材、有機基材のいずれも用いることができる。
無機基材としては、例えば、アルミニウム箔等の金属箔が挙げられる。
上記フィルムは一軸ないし二軸方向に延伸されているものでもよい。
本発明のガスバリア性積層体における硬化物層は前記エポキシ樹脂組成物の硬化物からなる。エポキシ樹脂組成物の硬化方法は特に制限されず、その硬化物を得るのに十分なエポキシ樹脂組成物の濃度及び温度において公知の方法により行われる。硬化温度は、例えば10~140℃の範囲で選択できる。
無機薄膜層は、ガスバリア性積層体にガスバリア性を付与するために設けられ、厚みが薄くても高いガスバリア性を発現することができる。無機薄膜層は、金属箔からなるもの、蒸着法により形成されたもの等を挙げることができるが、高い透明性を得る観点からは蒸着法により形成された無機蒸着層であることが好ましい。
無機薄膜層を構成する無機物は、前記基材上、又は硬化物層上にガスバリア性の薄膜を形成しうる無機物であれば特に制限はなく、ケイ素、アルミニウム、マグネシウム、カルシウム、亜鉛、錫、ニッケル、チタン、ジルコニウム、炭素、又はこれらの酸化物、炭化物、窒化物、酸窒化物等が挙げられる。これらの中でも、ガスバリア性の点からはケイ素酸化物(シリカ)、アルミニウム、及びアルミニウム酸化物(アルミナ)からなる群から選ばれる少なくとも1種が好ましい。上記無機物は、1種単独で用いてもよく、2種以上組み合わせて用いてもよい。
無機薄膜層の厚みは、高いガスバリア性を得る観点から、好ましくは5nm以上である。また、透明性及び耐屈曲性の観点からは、好ましくは100nm以下、より好ましくは50nm以下である。上記厚みは、無機薄膜層の1層あたりの厚みである。
無機薄膜層は、例えば、有機基材上、硬化物層上に形成することができる。
本発明のガスバリア性積層体は、用途に応じて、さらに1層又は2層以上の熱可塑性樹脂層を有することができる。
熱可塑性樹脂層としては、熱可塑性樹脂フィルムを用いることが好ましく、前記有機基材において例示した透明プラスチックフィルムと同様のものを用いることができる。透明プラスチックフィルムの中でも、ポリオレフィン系フィルム及びポリアミド系フィルムからなる群から選ばれる少なくとも1種が好ましく、透明性、耐熱性、及び食品等の包装に適するという観点からは、ポリプロピレンフィルム及びナイロン6フィルムからなる群から選ばれる少なくとも1種がより好ましい。
熱可塑性樹脂フィルムの表面には火炎処理やコロナ放電処理などの表面処理が施されていてもよい。また熱可塑性樹脂フィルムとして、紫外線吸収剤や着色剤等を含むフィルムや、表面にプライマー層、インキ層、表面保護層、蒸着層等を有するフィルムを用いることもできる。
熱可塑性樹脂層の厚みは、好ましくは10~300μm、より好ましくは10~100μmである。上記厚みは、熱可塑性樹脂層の1層あたりの厚みである。
本発明のガスバリア性積層体は、前記熱可塑性樹脂層を積層するために、さらに接着剤層を有していてもよい。
接着剤層を構成する接着剤としては、ウレタン系接着剤、アクリル系接着剤、エポキシ系接着剤等の公知の接着剤を用いることができる。接着剤層の厚みは特に限定されないが、接着性と透明性とを両立させる観点からは、好ましくは0.1~30μm、より好ましくは1~20μm、さらに好ましくは2~20μmである。上記厚みは、接着剤層の1層あたりの厚みである。
本発明のガスバリア性積層体は、前記基材と、少なくとも1層の前記硬化物層とを有する構成であればよい。高いガスバリア性を得る観点からは、本発明のガスバリア性積層体は無機物で構成された層を有することが好ましく、且つ、経済性の観点からは、前記硬化物層を1層又は2層、好ましくは1層のみ有する構成が好ましい。また、無機物で構成された層と、前記硬化物層とは隣接していることが好ましい。
基材及び1層又は2層の硬化物層を有し、且つ無機物で構成された層を有するガスバリア性積層体の層構成としては、下記が例示される。
(1)基材及び硬化物層を有し、該基材が無機基材である構成
(2)基材、無機薄膜層、及び硬化物層を順に有する構成
(3)基材、硬化物層、及び無機薄膜層を順に有する構成
(4)基材、硬化物層、無機薄膜層、及び硬化物層を順に有する構成
上記(2)、(3)及び(4)における基材は有機基材であることが好ましい。また、無機物で構成された層と、前記硬化物層とは隣接していることが好ましく、ガスバリア性の観点からは、上記(1)、(2)又は(4)のいずれかの構成が好ましく、上記(1)又は(2)の構成がより好ましい。
本発明のエポキシ樹脂組成物は外観良好な硬化塗膜を形成でき、特に前記不飽和脂肪酸アミドを含有する場合には乾燥速度が向上し、ブロッキングが少なく、コーティング用組成物に適した性状を有する。この効果の有効性の観点からは、上記(2)又は(4)の構成がより好ましく、(2)の構成がさらに好ましい。
本発明のガスバリア性積層体は、上記(1)~(4)のいずれかの層構成を有し、さらに、前述した熱可塑性樹脂層を1層又は2層以上有していてもよい。但し、本発明のエポキシ樹脂組成物による上記効果の有効性の観点からは、基材以外の熱可塑性樹脂層を有さない構成であることがより好ましい。
図2におけるガスバリア性積層体100aは、基材1上に硬化物層3及び無機薄膜層2が順に設けられた構成である。
図3におけるガスバリア性積層体200は、熱可塑性樹脂層4を接着剤層を介さずに直接積層した構成であり、基材1、無機薄膜層2、硬化物層3、及び熱可塑性樹脂層4がこの順に積層された構成である。
図4~6におけるガスバリア性積層体300、300a、300bは、熱可塑性樹脂層4を接着剤層5を介して積層した構成である。図4におけるガスバリア性積層体300は、基材1、無機薄膜層2、硬化物層3、接着剤層5、及び熱可塑性樹脂層4がこの順に積層された構成である。
図5におけるガスバリア性積層体300aは、基材1、硬化物層3、無機薄膜層2、接着剤層5、及び熱可塑性樹脂層4がこの順に積層された構成である。
図6におけるガスバリア性積層体300bは、基材1、硬化物層3、無機薄膜層2、硬化物層3、接着剤層5、及び熱可塑性樹脂層4がこの順に積層された構成である。
図7のガスバリア積層体400は、基材1、無機薄膜層2、硬化物層3、接着剤層5、熱可塑性樹脂層4、接着剤層5、及び熱可塑性樹脂層4がこの順に積層された構成である。
図8のガスバリア積層体400aは、基材1、硬化物層3、無機薄膜層2、接着剤層5、熱可塑性樹脂層4、接着剤層5、及び熱可塑性樹脂層4がこの順に積層された構成である。
図9のガスバリア積層体400cは、基材1、接着剤層5、基材1c、硬化物層3、接着剤層5、及び熱可塑性樹脂層4がこの順に積層された構成である。基材のうち少なくとも1つは無機基材であることが好ましく、例えば、基材1cが無機基材であるものが挙げられる。
ガスバリア性積層体400又は400aを構成する熱可塑性樹脂層4はすべて同一の樹脂層でもよく、互いに異なる樹脂層でもよい。また接着剤層5は、すべて同一の接着剤からなる層でもよく、異なる接着剤からなる層でもよい。
本発明のガスバリア性積層体の製造方法は特に限定されず、公知の方法を用いることができる。
例えば図1の構成のガスバリア性積層体100の製造方法としては、基材の片面に無機薄膜層を形成し、該無機薄膜層側の面に、硬化物層形成用の前記エポキシ樹脂組成物を所望の厚みとなるよう塗布し、次いでエポキシ樹脂組成物を硬化させて硬化物層を形成する方法が挙げられる。なお、透明プラスチックフィルム上に予め無機薄膜層が形成されたフィルムを用いて、該無機薄膜層面に硬化物層を形成してもよい。
図2の構成のガスバリア性積層体100aの製造方法としては、基材の片面に前記エポキシ樹脂組成物を塗布し、次いでエポキシ樹脂組成物を硬化させて硬化物層を形成した後、該硬化物層上に無機薄膜層を形成する方法が挙げられる。
エポキシ樹脂組成物を塗布する際の塗布方法としては、例えば、バーコート、メイヤーバーコート、エアナイフコート、グラビアコート、リバースグラビアコート、マイクログラビアコート、マイクロリバースグラビアコート、ダイコート、スロットダイコート、バキュームダイコート、ディップコート、スピンコート、ロールコート、スプレーコート、はけ塗り等が挙げられる。これらの中でもバーコート、ロールコート又はスプレーコートが好ましく、工業的にはグラビアコート、リバースグラビアコート、マイクログラビアコート、又はマイクロリバースグラビアコートが好ましい。
エポキシ樹脂組成物を塗布した後、必要に応じて溶剤を揮発させる工程(乾燥工程)を行う。乾燥工程における条件は適宜選択できるが、例えば、乾燥温度40~180℃、乾燥時間5~180秒間の条件で行うことができる。
本発明のエポキシ樹脂組成物が炭素数14~24の不飽和脂肪酸アミドを含有する場合、乾燥速度が向上することから、乾燥温度を低下させることができる。耐熱性の低い基材の使用を可能にする観点からは、該乾燥温度は、好ましくは40~120℃、より好ましくは40~100℃、さらに好ましくは50~90℃である。
乾燥工程を行った後、エポキシ樹脂組成物を硬化させて硬化物層を形成する。硬化温度は、例えば10~140℃の範囲で選択でき、好ましくは10~80℃の範囲である。また硬化時間は、例えば0.5~200時間の範囲で選択でき、好ましくは2~100時間の範囲である。
図4の構成のガスバリア性積層体300の製造方法としては、図1の構成のガスバリア性積層体100の硬化物層面、又は、熱可塑性樹脂フィルムの片面に接着剤層を構成する接着剤を塗布し、次いで両者を積層する方法が挙げられる。図5の構成のガスバリア性積層体300aは、図2の構成のガスバリア性積層体100aを用いて同様の方法で製造できる。
図6の構成のガスバリア性積層体300bの製造方法としては、図2の構成のガスバリア性積層体100aの無機薄膜層面に硬化物層を形成し、該硬化物層面、又は、熱可塑性樹脂フィルムの片面に接着剤層を構成する接着剤を塗布し、次いで両者を積層する方法が挙げられる。
図7の構成のガスバリア性積層体400は、図4の構成のガスバリア性積層体300を形成した後に、接着剤を塗布し、熱可塑性樹脂フィルムを貼付して積層する工程を繰り返し行うことにより製造できる。図8の構成のガスバリア性積層体400aは、図5の構成のガスバリア性積層体300aを用いて同様の方法で製造できる。
図9の構成のガスバリア性積層体400cは、基材1、接着剤層5、及び基材1cを順に積層した後、基材1c面に硬化物層を形成し、次いで、該硬化物層面、又は、熱可塑性樹脂フィルムの片面に接着剤層を構成する接着剤を塗布し、次いで両者を積層する方法が挙げられる。
本発明のガスバリア性積層体は優れたガスバリア性を有する。例えば、ガスバリア性積層体(I)の23℃、相対湿度60%における酸素透過率は、使用する基材のバリア性によっても異なるが、好ましくは10cc/(m2・day・atm)以下、より好ましくは2cc/(m2・day・atm)以下、さらに好ましくは1cc/(m2・day・atm)以下である。
ガスバリア性積層体(I)の40℃、相対湿度90%における水蒸気透過率についても、使用する基材のバリア性によって異なるが、好ましくは1g/(m2・day)以下、より好ましくは0.8g/(m2・day)以下、さらに好ましくは0.5g/(m2・day)以下である。
ガスバリア性積層体の酸素透過率及び水蒸気透過率は、具体的には実施例に記載の方法で求められる。
本発明の包装材は、前記ガスバリア性積層体を含むものである。
本発明のガスバリア性積層体は、ガスバリア性及び耐屈曲性に優れ、外観が良好であることから、食品、医薬品、化粧品、精密電子部品等を保護するための包装材用途に好適である。本発明の包装材は、前記ガスバリア性積層体をそのまま包装材として用いたものでもよく、他の層やフィルムをさらに積層したものでもよい。
包装材の形態は、収納、保存する物品に応じて適宜選択することができ、例えば、包装用フィルム;包装用袋、ボトル等の包装容器;並びに包装容器の蓋材、シール材等が挙げられる。
包装材の容量についても特に限定されず、収納、保存する物品に応じて適宜選択することができる。
本実施例における測定及び評価は以下の方法で行った。
硬化物層の厚みは、多層膜厚測定装置(グンゼ(株)製「DC-8200」)を用いて測定した。
各例のガスバリア性積層体(I)の製造において、エポキシ樹脂組成物を、各例で使用したアルミニウム蒸着PET又はアルミニウム蒸着OPPに対し塗布した。該塗布面に対して垂直に、80℃に設定した熱風乾燥機(エスペック(株)製「SAFETY OVEN SPHH-201」)の熱風を、15cmの距離から30秒間当てた際の塗膜表面の外観を目視観察した。外観変化が見られない場合は「良好」、外観変化(塗工ムラ)が生じた場合は「不良」とした。
各例で形成したガスバリア性積層体(I)の硬化物層表面の反射率は、JIS K5600-4-7:1999に準拠して測定した。光沢度計(elcometer(株)製「Elcometer 480」)を用いて、ガスバリア性積層体(I)の硬化物層表面に対し、スキャンモード、入射角60°で光を入射させた際の入射光に対する反射光の強度の割合(反射率;%)を測定した。反射率が高いほど、硬化物層表面の光沢が高いことを意味する。参考例のアルミニウム蒸着PET及びアルミニウム蒸着OPPについては、アルミニウム蒸着面の反射率を測定した。
各例で使用したアルミニウム蒸着PET、アルミニウム蒸着OPP、及び各例で得られたガスバリア性積層体について、酸素透過率測定装置(モダンコントロール社製「OX-TRAN2/21」)を使用して、23℃、相対湿度60%の条件下で酸素透過率を測定した。
各例で使用したアルミニウム蒸着PET、アルミニウム蒸着OPP、及び各例で得られたガスバリア性積層体について、水蒸気透過率測定装置(MOCON社製「PERMATRAN-W 1/50」)を用いて、40℃、相対湿度90%の条件下で水蒸気透過率を測定した。
各例で使用したアルミニウム蒸着PET、アルミニウム蒸着OPP、及び各例で得られたガスバリア性積層体(I)の剥離強度は、以下の方法で測定した。
アルミニウム蒸着PET、アルミニウム蒸着OPPにおいてはアルミニウム蒸着面に、各例で得られたガスバリア性積層体においては硬化物層側の面に、ウレタン接着剤をバーコーターNo.12を使用して塗布し、80℃で10秒間乾燥させて接着剤層を形成した(乾燥後の厚み:約3μm)。ウレタン接着剤は、東洋モートン(株)製の主剤「TM-569」17gに、硬化剤の「CAT-RT37」0.8gと、溶剤の酢酸エチル38.7gを加え、よく撹拌して調製したものを用いた。この上に、厚み50μmのポリプロピレンフィルム(東洋紡(株)製「P1146」)をニップロールにて貼り合わせ、40℃で2日加熱して、剥離強度試験用の積層体を得た。
この積層体を用いて、JIS K6854-3:1999に指定されている方法に従い、300mm/minの剥離速度でT型剥離試験を行って剥離強度(g/15mm)を測定した。剥離強度が100g/15mm以上であれば合格とする。
反応容器に1molのメタキシリレンジアミン(MXDA)を仕込んだ。窒素気流下60℃に昇温し、0.93molのアクリル酸メチルを1時間かけて滴下した。生成するメタノールを留去しながら165℃に昇温し、2.5時間165℃を保持することで、アミン系硬化剤を得た。そこに、エタノールを1.5時間かけて滴下して、アミン系硬化剤が65.0質量%、エタノールが35.0質量%の溶液を得た。
希釈溶剤であるエタノール166.8g、酢酸エチル200.2g、及び、上記溶液94.9gを加えて撹拌した。ここに、エルカ酸アミド(日油(株)製「アルフローP-10」)4.64gとシランカップリング剤である3-アミノプロピルトリエトキシシラン(信越化学工業(株)製「KBE-903」)を添加して撹拌し、エポキシ樹脂硬化剤溶液Aを得た。
製造例1においてエルカ酸アミドを添加しなかったこと以外は、製造例1と同様の方法で溶液を調製し、エポキシ樹脂硬化剤溶液Bを得た。
製造例1で得られたエポキシ樹脂硬化剤溶液A 3.75gに対し、希釈溶剤であるエタノール29.0gを加え、よく撹拌した。ここに、エポキシ樹脂としてメタキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂(三菱瓦斯化学(株)製「TETRAD-X」)0.10g(エポキシ樹脂硬化剤中の活性アミン水素数/エポキシ樹脂中のエポキシ基の数=3.0)、ポリエチレングリコール(富士フィルム和光純薬(株)製「PEG1000」、Mw1,000)0.007gを加えて撹拌し、エポキシ樹脂組成物を調製した。エポキシ樹脂組成物中のエポキシ樹脂と、エポキシ樹脂硬化剤溶液A中の不揮発分との合計量100質量部に対し、ポリエチレングリコールの配合量は1.0質量部、エルカ酸アミドの配合量は5.0質量部である。
実施例Aにおいて、製造例1で得られたエポキシ樹脂硬化剤溶液Aに替えて、製造例2で得られたエポキシ樹脂硬化剤溶液Bを用いたこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aにおいて、ポリエチレングリコール「PEG1000」に替えて、ポリテトラメチレンエーテルグリコール(PTMG、三菱ケミカル(株)製、Mw1,000)を用いたこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aにおいて、ポリエチレングリコール「PEG1000」に替えて、ポリエチレングリコール「PEG200」(富士フィルム和光純薬(株)製、Mw200)を用いたこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aにおいて、ポリエチレングリコールの配合量を0.014gに変更したこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aにおいて、ポリエチレングリコールの配合量を0.021gに変更したこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aにおいて、ポリエチレングリコールを配合しなかったこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aにおいて、ポリエチレングリコール「PEG1000」に替えて、ジプロピレングリコールモノメチルエーテル(DPGME、東京化成工業(株)製、Mw148)を用いたこと以外は、実施例Aと同様の方法でエポキシ樹脂組成物を調製した。
実施例Aで得られたエポキシ樹脂組成物を、PETの片面にアルミニウムが蒸着されたアルミニウム蒸着PET(三井化学東セロ(株)製「MLPET」、厚み:12μm)のアルミニウム蒸着面にバーコーターNo.3を使用して塗布した。該エポキシ樹脂組成物を80℃の乾燥炉で30秒間加熱して乾燥させ(乾燥後の厚み:0.1μm)、さらに40℃で2日エージングして、図1の構成のガスバリア性積層体(I)を作製した。
得られたガスバリア性積層体を用いて、前記方法で各種評価を行った。結果を表2に示す。
実施例1において、使用するエポキシ樹脂組成物を表2に示すエポキシ樹脂組成物に変更したこと以外は、実施例1と同様の方法でガスバリア性積層体を作製し、評価を行った。結果を表2に示す。
実施例1において、基材を、二軸延伸ポリプロピレン(OPP)の片面にアルミニウムが蒸着されたアルミニウム蒸着OPP(三井化学東セロ(株)製「MLOP102」、厚み:25μm)に変更したこと以外は、実施例1と同様の方法でガスバリア性積層体を作製し、評価を行った。結果を表2に示す。
実施例7において、使用するエポキシ樹脂組成物を表2に示すエポキシ樹脂組成物に変更し、且つアルミニウム蒸着OPPにエポキシ樹脂組成物を塗布した後、80℃の乾燥炉で60秒間加熱して乾燥させたこと以外は、実施例7と同様の方法でガスバリア性積層体を作製し、評価を行った。結果を表2に示す。
実施例7において、使用するエポキシ樹脂組成物を表2に示すエポキシ樹脂組成物に変更したこと以外は、実施例7と同様の方法でガスバリア性積層体を作製し、評価を行った。結果を表2に示す。
実施例Bで得られたエポキシ樹脂組成物を、二軸延伸ポリプロピレン(OPP)の片面にアルミニウムが蒸着されたアルミニウム蒸着OPP(三井化学東セロ(株)製「MLOP102」、厚み:25μm)のアルミニウム蒸着面にバーコーターNo.8を使用して塗布した。該エポキシ樹脂組成物を80℃で30秒間加熱して乾燥させた(乾燥後の厚み:約3μm)。この上に、厚み50μmのポリプロピレンフィルム(東洋紡(株)製「P1146」)を直ちにニップロールにて貼り合わせ、40℃で2日エージングして、図3の構成のガスバリア性積層体(II)を得た。
このガスバリア性積層体(II)を用いて、前記方法で酸素透過率、水蒸気透過率、及び剥離強度の測定を行った。剥離強度については、ガスバリア性積層体(II)を用いて、JIS K6854-3:1999に指定されている方法に従い、300mm/minの剥離速度でT型剥離試験を行って剥離強度(g/15mm)を測定した。結果を表3に示す。
実施例10において、実施例Bで得られたエポキシ樹脂組成物に替えて、アルミニウム蒸着OPPのアルミニウム蒸着面にウレタン接着剤をバーコーターNo.12を使用して塗布し、80℃で10秒間乾燥させて接着剤層を形成した(乾燥後の厚み:約3μm)。ウレタン接着剤は、東洋モートン(株)製の主剤「TM-569」17gに、硬化剤の「CAT-RT37」0.8gと、溶剤の酢酸エチル38.7gを加え、よく撹拌して調製したものを用いた。この上に、厚み50μmのポリプロピレンフィルム(東洋紡(株)製「P1146」)をニップロールにて貼り合わせ、40℃で2日エージングして、積層体を得た。
この積層体を用いて、前記方法で酸素透過率、水蒸気透過率、及び剥離強度の測定を行った。結果を表3に示す。
実施例Aで得られたエポキシ樹脂組成物を、二軸延伸ポリプロピレンフィルム(フタムラ化学(株)製「FOR」、厚み:20μm)の片面にバーコーターNo.3を使用して塗布した。該エポキシ樹脂組成物を80℃の乾燥炉で30秒間加熱して乾燥させ(乾燥後の厚み:0.1μm)、さらに40℃で2日エージングして硬化物層を形成した。次いで、該硬化物層面に、真空蒸着法にて厚み40nmのアルミニウム蒸着層を形成して、図2の構成のガスバリア性積層体(I)を作製した。
得られたガスバリア性積層体を用いて、前記方法で酸素透過率及び剥離強度の測定を行った。結果を表4に示す。
実施例11において、実施例Aで得られたエポキシ樹脂組成物を使用せず、厚み20μmの二軸延伸ポリプロピレンフィルムの片面に、真空蒸着法にて厚み40nmのアルミニウム蒸着層を形成して蒸着フィルムを得た。得られた蒸着フィルムを用いて、前記方法で酸素透過率及び剥離強度の測定を行った。結果を表4に示す。
実施例Aで得られたエポキシ樹脂組成物を、二軸延伸ポリプロピレンフィルム(フタムラ化学(株)製「FOR」、厚み:20μm)の片面にバーコーターNo.3を使用して塗布した。該エポキシ樹脂組成物を80℃の乾燥炉で30秒間加熱して乾燥させ(乾燥後の厚み:0.1μm)、さらに40℃で2日エージングして硬化物層を形成した。次いで、該硬化物層面に、真空蒸着法にて厚み20nmのアルミナ蒸着層を形成して、図2の構成のガスバリア性積層体(I)を作製した。
得られたガスバリア性積層体を用いて、前記方法で酸素透過率及び剥離強度の測定を行った。結果を表4に示す。なお剥離強度の測定においては、ウレタン接着剤として、東洋モートン(株)製の主剤「AD-502」15gに、硬化剤の「CAT-RT85」1.05gと、溶剤の酢酸エチル25gを加え、よく撹拌して調製したものを用いた。
実施例12において、実施例Aで得られたエポキシ樹脂組成物を使用せず、厚み20μmの二軸延伸ポリプロピレンフィルムの片面に、真空蒸着法にて厚み20nmのアルミナ蒸着層を形成して蒸着フィルムを得た。得られた蒸着フィルムを用いて、実施例12と同様の方法で酸素透過率及び剥離強度の測定を行った。結果を表4に示す。
実施例Aで得られたエポキシ樹脂組成物を、二軸延伸ポリプロピレンフィルム(フタムラ化学(株)製「FOR」、厚み:20μm)の片面にバーコーターNo.3を使用して塗布した。該エポキシ樹脂組成物を80℃の乾燥炉で30秒間加熱して乾燥させ(乾燥後の厚み:0.1μm)、さらに40℃で2日エージングして硬化物層を形成した。次いで、該硬化物層面に、スパッタリング法にて厚み20nmのシリカ蒸着層を形成して、図2の構成のガスバリア性積層体(I)を作製した。
得られたガスバリア性積層体を用いて、前記方法で酸素透過率及び剥離強度の測定を行った。結果を表4に示す。なお剥離強度の測定においては、ウレタン接着剤として、東洋モートン(株)製の主剤「AD-502」15gに、硬化剤の「CAT-RT85」1.05gと、溶剤の酢酸エチル25gを加え、よく撹拌して調製したものを用いた。
実施例13において、実施例Aで得られたエポキシ樹脂組成物を使用せず、厚み20μmの二軸延伸ポリプロピレンフィルムの片面に、スパッタリング法にて厚み20nmのシリカ蒸着層を形成して蒸着フィルムを得た。得られた蒸着フィルムを用いて、実施例13と同様の方法で酸素透過率及び剥離強度の測定を行った。結果を表4に示す。
1 基材
2 無機薄膜層
3 硬化物層
4 熱可塑性樹脂フィルム(熱可塑性樹脂層)
5 接着剤層
Claims (12)
- エポキシ樹脂、アミン系硬化剤を含むエポキシ樹脂硬化剤、及びポリアルキレングリコールを含有するエポキシ樹脂組成物。
- さらに、炭素数14~24の不飽和脂肪酸アミドを含有する、請求項1に記載のエポキシ樹脂組成物。
- 前記ポリアルキレングリコールの重量平均分子量(Mw)が200~10,000である、請求項1~3のいずれか1項に記載のエポキシ樹脂組成物。
- 前記不飽和脂肪酸アミドがオレイン酸アミド及びエルカ酸アミドからなる群から選ばれる少なくとも1種である、請求項2~4のいずれか1項に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂組成物中の前記ポリアルキレングリコールの含有量が、前記エポキシ樹脂と、前記エポキシ樹脂硬化剤中の不揮発分との合計量100質量部に対し0.1~5.0質量部である、請求項1~5のいずれか1項に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂組成物中の前記不飽和脂肪酸アミドの含有量が、前記エポキシ樹脂と、前記エポキシ樹脂硬化剤中の不揮発分との合計量100質量部に対し0.1~20.0質量部である、請求項2~6のいずれか1項に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂中のエポキシ基数に対する前記エポキシ樹脂硬化剤中の活性アミン水素数の比が1.0超5.0以下である、請求項1~7のいずれか1項に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂がメタキシリレンジアミンから誘導されたグリシジルアミノ基を有するエポキシ樹脂を主成分とする、請求項1~8のいずれか1項に記載のエポキシ樹脂組成物。
- 基材と、請求項1~9のいずれか1項に記載のエポキシ樹脂組成物の硬化物層とを有するガスバリア性積層体。
- 無機物で構成された層を少なくとも1層有する、請求項10に記載のガスバリア性積層体。
- 請求項10又は11に記載のガスバリア性積層体を含む包装材。
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Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60163916A (ja) * | 1984-02-02 | 1985-08-26 | Toray Ind Inc | エポキシ系微粒子の製造方法 |
JPH09176292A (ja) * | 1995-12-26 | 1997-07-08 | Asahi Denka Kogyo Kk | 水性エポキシ樹脂硬化性組成物 |
JP2003300271A (ja) | 2002-04-10 | 2003-10-21 | Mitsubishi Gas Chem Co Inc | 耐屈曲性に優れたガスバリア性積層フィルム |
JP2005028835A (ja) | 2003-07-11 | 2005-02-03 | Mitsubishi Gas Chem Co Inc | ガスバリア性コートフィルム |
JP2009101684A (ja) | 2007-10-05 | 2009-05-14 | Mitsubishi Gas Chem Co Inc | ガスバリア性積層体 |
JP2010202753A (ja) | 2009-03-03 | 2010-09-16 | Mitsubishi Gas Chemical Co Inc | ガスバリア性樹脂組成物、塗料および接着剤 |
JP2013203023A (ja) | 2012-03-29 | 2013-10-07 | Mitsubishi Gas Chemical Co Inc | ラミネートフィルム |
WO2018105282A1 (ja) | 2016-12-09 | 2018-06-14 | 三菱瓦斯化学株式会社 | ガスバリア性フィルム |
WO2018159566A1 (ja) * | 2017-02-28 | 2018-09-07 | 積水化学工業株式会社 | ガスバリア材及び熱硬化性樹脂組成物 |
WO2020110601A1 (ja) * | 2018-11-26 | 2020-06-04 | 三菱瓦斯化学株式会社 | 水系エポキシ樹脂組成物及びその硬化物 |
CN111777922A (zh) * | 2020-07-22 | 2020-10-16 | 增城市惠顺化工有限公司 | 一种防腐防霉的水性环氧固化剂及其制备方法 |
WO2021157376A1 (ja) * | 2020-02-04 | 2021-08-12 | 三菱瓦斯化学株式会社 | エポキシ樹脂組成物、ガスバリア性積層体、レトルト食品用包装材、防臭用又は保香用包装材、熱収縮性ラベル及びその製造方法、熱収縮ラベル及びこれを有するボトル |
-
2021
- 2021-10-06 WO PCT/JP2021/036946 patent/WO2022107473A1/ja active Application Filing
- 2021-10-06 EP EP21894348.8A patent/EP4249248A4/en active Pending
- 2021-10-06 KR KR1020237016297A patent/KR20230109139A/ko unknown
- 2021-10-06 US US18/036,944 patent/US20230416520A1/en active Pending
- 2021-10-06 CN CN202180075148.XA patent/CN116529084A/zh active Pending
- 2021-10-06 JP JP2022563617A patent/JPWO2022107473A1/ja active Pending
- 2021-10-08 TW TW110137460A patent/TW202229395A/zh unknown
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60163916A (ja) * | 1984-02-02 | 1985-08-26 | Toray Ind Inc | エポキシ系微粒子の製造方法 |
JPH09176292A (ja) * | 1995-12-26 | 1997-07-08 | Asahi Denka Kogyo Kk | 水性エポキシ樹脂硬化性組成物 |
JP2003300271A (ja) | 2002-04-10 | 2003-10-21 | Mitsubishi Gas Chem Co Inc | 耐屈曲性に優れたガスバリア性積層フィルム |
JP2005028835A (ja) | 2003-07-11 | 2005-02-03 | Mitsubishi Gas Chem Co Inc | ガスバリア性コートフィルム |
JP2009101684A (ja) | 2007-10-05 | 2009-05-14 | Mitsubishi Gas Chem Co Inc | ガスバリア性積層体 |
JP2010202753A (ja) | 2009-03-03 | 2010-09-16 | Mitsubishi Gas Chemical Co Inc | ガスバリア性樹脂組成物、塗料および接着剤 |
JP2013203023A (ja) | 2012-03-29 | 2013-10-07 | Mitsubishi Gas Chemical Co Inc | ラミネートフィルム |
WO2018105282A1 (ja) | 2016-12-09 | 2018-06-14 | 三菱瓦斯化学株式会社 | ガスバリア性フィルム |
WO2018159566A1 (ja) * | 2017-02-28 | 2018-09-07 | 積水化学工業株式会社 | ガスバリア材及び熱硬化性樹脂組成物 |
WO2020110601A1 (ja) * | 2018-11-26 | 2020-06-04 | 三菱瓦斯化学株式会社 | 水系エポキシ樹脂組成物及びその硬化物 |
WO2021157376A1 (ja) * | 2020-02-04 | 2021-08-12 | 三菱瓦斯化学株式会社 | エポキシ樹脂組成物、ガスバリア性積層体、レトルト食品用包装材、防臭用又は保香用包装材、熱収縮性ラベル及びその製造方法、熱収縮ラベル及びこれを有するボトル |
CN111777922A (zh) * | 2020-07-22 | 2020-10-16 | 增城市惠顺化工有限公司 | 一种防腐防霉的水性环氧固化剂及其制备方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP4249248A4 |
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JPWO2022107473A1 (ja) | 2022-05-27 |
TW202229395A (zh) | 2022-08-01 |
US20230416520A1 (en) | 2023-12-28 |
EP4249248A1 (en) | 2023-09-27 |
KR20230109139A (ko) | 2023-07-19 |
CN116529084A (zh) | 2023-08-01 |
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