WO2022092249A1 - 積層体および表示装置 - Google Patents
積層体および表示装置 Download PDFInfo
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- WO2022092249A1 WO2022092249A1 PCT/JP2021/039948 JP2021039948W WO2022092249A1 WO 2022092249 A1 WO2022092249 A1 WO 2022092249A1 JP 2021039948 W JP2021039948 W JP 2021039948W WO 2022092249 A1 WO2022092249 A1 WO 2022092249A1
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- 239000011521 glass Substances 0.000 claims abstract description 346
- 239000000758 substrate Substances 0.000 claims abstract description 242
- 239000010410 layer Substances 0.000 claims description 1014
- 239000000463 material Substances 0.000 claims description 341
- 239000002131 composite material Substances 0.000 claims description 137
- 238000005452 bending Methods 0.000 claims description 128
- 238000003860 storage Methods 0.000 claims description 94
- 239000000853 adhesive Substances 0.000 claims description 78
- 230000001070 adhesive effect Effects 0.000 claims description 78
- 230000003287 optical effect Effects 0.000 claims description 65
- 239000012790 adhesive layer Substances 0.000 claims description 58
- 239000000203 mixture Substances 0.000 claims description 57
- 230000009477 glass transition Effects 0.000 claims description 31
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 23
- 238000005336 cracking Methods 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 15
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 12
- 229920001225 polyester resin Polymers 0.000 claims description 11
- 239000004645 polyester resin Substances 0.000 claims description 11
- 239000005341 toughened glass Substances 0.000 claims description 6
- 229920005672 polyolefin resin Polymers 0.000 claims description 5
- 239000002245 particle Substances 0.000 description 85
- 229920005989 resin Polymers 0.000 description 78
- 239000011347 resin Substances 0.000 description 78
- 238000012360 testing method Methods 0.000 description 78
- 238000000034 method Methods 0.000 description 75
- 239000011342 resin composition Substances 0.000 description 58
- 239000002313 adhesive film Substances 0.000 description 55
- 150000001875 compounds Chemical class 0.000 description 43
- 229920001721 polyimide Polymers 0.000 description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 40
- 206010017076 Fracture Diseases 0.000 description 38
- 208000010392 Bone Fractures Diseases 0.000 description 37
- 239000002519 antifouling agent Substances 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 33
- 238000005259 measurement Methods 0.000 description 33
- 239000004642 Polyimide Substances 0.000 description 32
- 239000003795 chemical substances by application Substances 0.000 description 31
- -1 polypropylene Polymers 0.000 description 31
- 239000004962 Polyamide-imide Substances 0.000 description 28
- 229920002312 polyamide-imide Polymers 0.000 description 28
- 239000002904 solvent Substances 0.000 description 27
- 229920002799 BoPET Polymers 0.000 description 26
- 238000000576 coating method Methods 0.000 description 26
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- 229910052731 fluorine Inorganic materials 0.000 description 24
- 230000007423 decrease Effects 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 21
- 239000010954 inorganic particle Substances 0.000 description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 239000006096 absorbing agent Substances 0.000 description 19
- 239000011737 fluorine Substances 0.000 description 19
- 239000007787 solid Substances 0.000 description 19
- 238000007789 sealing Methods 0.000 description 18
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 17
- 150000004985 diamines Chemical class 0.000 description 17
- 229920001187 thermosetting polymer Polymers 0.000 description 17
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 17
- 125000000524 functional group Chemical group 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- 239000002346 layers by function Substances 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 239000006087 Silane Coupling Agent Substances 0.000 description 14
- 239000000654 additive Substances 0.000 description 14
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 14
- 239000011230 binding agent Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000000178 monomer Substances 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 125000004427 diamine group Chemical group 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 12
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 11
- 238000007373 indentation Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000005345 chemically strengthened glass Substances 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 238000005304 joining Methods 0.000 description 10
- 239000003505 polymerization initiator Substances 0.000 description 10
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 10
- 125000003700 epoxy group Chemical group 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000009719 polyimide resin Substances 0.000 description 9
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000011112 polyethylene naphthalate Substances 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 7
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical group C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000005227 gel permeation chromatography Methods 0.000 description 7
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000000565 sealant Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 230000003373 anti-fouling effect Effects 0.000 description 6
- 239000012964 benzotriazole Substances 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 6
- 238000009863 impact test Methods 0.000 description 6
- 125000003566 oxetanyl group Chemical group 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 6
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 5
- 238000010538 cationic polymerization reaction Methods 0.000 description 5
- 125000006159 dianhydride group Chemical group 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000011146 organic particle Substances 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 4
- 229920002284 Cellulose triacetate Polymers 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 229920006332 epoxy adhesive Polymers 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 230000035807 sensation Effects 0.000 description 4
- 239000013464 silicone adhesive Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 3
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 3
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 3
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical class CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 150000004703 alkoxides Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000001055 blue pigment Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000004292 cyclic ethers Chemical group 0.000 description 3
- RZIPTXDCNDIINL-UHFFFAOYSA-N cyclohexane-1,1,2,2-tetracarboxylic acid Chemical group OC(=O)C1(C(O)=O)CCCCC1(C(O)=O)C(O)=O RZIPTXDCNDIINL-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000012757 flame retardant agent Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 3
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000001057 purple pigment Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 241000894007 species Species 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- RPOHXHHHVSGUMN-UHFFFAOYSA-N 1-n,4-n-bis(4-aminophenyl)benzene-1,4-dicarboxamide Chemical group C1=CC(N)=CC=C1NC(=O)C1=CC=C(C(=O)NC=2C=CC(N)=CC=2)C=C1 RPOHXHHHVSGUMN-UHFFFAOYSA-N 0.000 description 2
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical group C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical group C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 2
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical group C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- FQEHXKKHEIYTQS-UHFFFAOYSA-N 4-[4-[2-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 FQEHXKKHEIYTQS-UHFFFAOYSA-N 0.000 description 2
- LACZRKUWKHQVKS-UHFFFAOYSA-N 4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenoxy]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F LACZRKUWKHQVKS-UHFFFAOYSA-N 0.000 description 2
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical group C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 2
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical group C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 241000283070 Equus zebra Species 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- STZIXLPVKZUAMV-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarboxylic acid Chemical group OC(=O)C1(C(O)=O)CCCC1(C(O)=O)C(O)=O STZIXLPVKZUAMV-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical group OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 150000003457 sulfones Chemical group 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- FJGQBLRYBUAASW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)phenol Chemical class OC1=CC=CC=C1N1N=C2C=CC=CC2=N1 FJGQBLRYBUAASW-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical group OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- UNIBAJHMJGXVHL-UHFFFAOYSA-N 3-phenylbenzene-1,2,4,5-tetracarboxylic acid Chemical group OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C=2C=CC=CC=2)=C1C(O)=O UNIBAJHMJGXVHL-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- LEBRCVXHIFZXEM-UHFFFAOYSA-N 4-(benzotriazol-2-yl)benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1N1N=C2C=CC=CC2=N1 LEBRCVXHIFZXEM-UHFFFAOYSA-N 0.000 description 1
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical group C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- SVNVHGHDXCGYEQ-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)-4-phenylcyclohexa-1,5-dien-1-yl]oxyaniline Chemical group C1=CC(N)=CC=C1OC(C=C1)=CCC1(C=1C=CC=CC=1)OC1=CC=C(N)C=C1 SVNVHGHDXCGYEQ-UHFFFAOYSA-N 0.000 description 1
- IWFSADBGACLBMH-UHFFFAOYSA-N 4-[4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]phenoxy]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)C=C1 IWFSADBGACLBMH-UHFFFAOYSA-N 0.000 description 1
- UEUIKXVPXLWUDU-UHFFFAOYSA-N 4-diazoniobenzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=C([N+]#N)C=C1 UEUIKXVPXLWUDU-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- 102100024089 Aldo-keto reductase family 1 member C2 Human genes 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 101000856234 Clostridium acetobutylicum (strain ATCC 824 / DSM 792 / JCM 1419 / LMG 5710 / VKM B-1787) Butyrate-acetoacetate CoA-transferase subunit A Proteins 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 101000690303 Homo sapiens Aldo-keto reductase family 1 member C2 Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- 229910013368 LiBr-NMP Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- YUMDYXQPBMXWQT-UHFFFAOYSA-N NC=1C=C(C=CC1OO)C(C)(C)C1=CC(=C(C=C1)OO)N Chemical compound NC=1C=C(C=CC1OO)C(C)(C)C1=CC(=C(C=C1)OO)N YUMDYXQPBMXWQT-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000012951 Remeasurement Methods 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 208000013201 Stress fracture Diseases 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000005400 gorilla glass Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000002507 tricarboxylic acid group Chemical group 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical group OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10128—Treatment of at least one glass sheet
- B32B17/10137—Chemical strengthening
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/737—Dimensions, e.g. volume or area
- B32B2307/7375—Linear, e.g. length, distance or width
- B32B2307/7376—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
Definitions
- the present disclosure relates to a laminate having a glass base material and a display device using the same.
- Patent Document 1 proposes a laminated body having a structure in which a glass plate having a thickness of 150 ⁇ m or less and a resin film are laminated via an adhesive layer and having a bending durability of 10 or more according to the following test. ing. Bending durability test: From the stretched state of the laminated body, bend 180 ° so that the bending radius is 3 mm in the direction in which the surface of the glass plate becomes concave, and stretch it again as one set, and the speed is 43 sets per minute. The number of sets until cracks occur in the laminated body when the above operation is performed is used as an index of bending durability.
- Patent Document 2 has a structure in which a glass plate having a thickness of 150 ⁇ m or less and a resin film are laminated via an adhesive layer, and the adhesive layer is measured by using a dynamic viscoelasticity measuring device.
- a laminated body having a storage elastic modulus of 10 MPa or more at 20 ° C. and a bending durability of 10 or more according to the following test has been proposed. Bending durability test: From the stretched state of the laminated body, bend 180 ° so that the bending radius is 3 mm in the direction in which the surface of the glass plate becomes concave, and stretch it again as one set, and the speed is 43 sets per minute. The number of sets until cracks occur in the laminated body when the above operation is performed is used as an index of bending durability.
- Patent Document 3 describes a chemically strengthened ultrathin glass article having a thickness of 0.4 mm or less, which is a value obtained by multiplying the thickness (t) (t (mm)) of the glass article by 50.
- a glass article has been proposed that has a fracture bending radius (indicated by mm) less than the value divided by and further comprises a bonded polymer layer.
- Glass can be bent by making it thinner, which improves bending resistance, but making it thinner makes it easier to break, and impact resistance deteriorates dramatically. If the glass breaks due to an external impact, not only will the function of the display device deteriorate when glass is used as the cover member of the display device, but also the generated debris and sharp end faces will cause the user's fingertips, etc. to be damaged. There is a risk of damaging it.
- the present disclosure has been made in view of the above circumstances, and its main purpose is to provide a laminated body having good bending resistance and impact resistance and improved safety.
- One embodiment of the present disclosure includes a glass base material, a bonding layer, and a hard coat film in this order, and the hard coat film has a base material layer and a hard coat layer from the bonding layer side.
- the bonding layer is a layer for bonding the glass base material and the base material layer, the thickness of the glass base material is 10 ⁇ m or more and 100 ⁇ m or less, and the thickness of the hard coat layer is A.
- a laminate in which the ratio of (A + B) to C is 3.0 or more and 500 or less, where B is the thickness of the base material layer and C is the thickness of the bonding layer.
- the composite elastic modulus of the bonding layer is 1 MPa or more and 6000 MPa or less.
- the glass transition temperature of the bonding layer is ⁇ 40 ° C. or higher and 150 ° C. or lower.
- the composite elastic modulus of the base material layer is 5.7 GPa or more.
- the glass base material is chemically tempered glass.
- the bonding layer is a pressure-sensitive adhesive layer, a heat-sensitive adhesive layer, or contains a cured product of a curable adhesive composition.
- the bonding layer contains at least one selected from the group consisting of polyester resin, polyolefin resin, and urethane resin.
- the laminate in the present disclosure can have an antireflection layer on the surface side of the hardcoat layer opposite to the base material layer.
- the surface of the laminated body on the glass substrate side is on the outside
- the surface of the laminated body on the hard coat layer side is on the inner side
- the opposite sides of the laminated body are opposed to each other. It is preferable that cracking, breaking, or peeling does not occur when the operation of bending the laminated body by 180 ° so as to have an interval of 10 mm is repeated 200,000 times.
- Another embodiment of the present disclosure is a laminate having a hard coat layer, a base material layer, a bonding layer, a glass substrate, and a second bonding layer in this order, and the bonding layer is a laminate.
- the layer for joining the glass base material and the base material layer, the second joining layer is a layer for joining the laminate and other members, and the thickness of the glass base material is 10 ⁇ m or more.
- a laminated body having a thickness of 100 ⁇ m or less and satisfying the following formula (1).
- E 1 is the composite elastic modulus (GPa) of the hard coat layer
- D 1 is the thickness (mm) of the hard coat layer
- E 2 is the composite elastic modulus (GPa) of the base material layer.
- D 2 is the thickness of the base material layer (mm)
- E 3 is the composite elastic modulus of the joint layer (GPa)
- D 3 is the thickness of the joint layer (mm)
- E 4 is the glass base material.
- Composite elastic modulus (GPa) is the thickness of the glass substrate (mm)
- E 5 is the storage elastic modulus (GPa) of the second bonding layer
- D 5 is the thickness of the second bonding layer.
- another embodiment of the present disclosure is a laminate having a base material layer, a bonding layer, a glass base material, and a second bonding layer in this order, and the bonding layer is the glass base.
- the layer for joining the material and the base material layer, the second joining layer is a layer for joining the laminate and other members, and the thickness of the glass base material is 10 ⁇ m or more and 100 ⁇ m or less.
- E 2 is the composite elastic modulus (GPa) of the base material layer
- D 2 is the thickness (mm) of the base material layer
- E 3 is the composite elastic modulus (GPa) of the joint layer.
- D 3 is the thickness of the bonding layer (mm)
- E 4 is the composite elastic modulus of the glass substrate (GPa)
- D 4 is the thickness of the glass substrate (mm)
- E 5 is the second The storage elastic modulus (GPa) of the bonded layer, D5, indicates the thickness ( mm) of the second bonded layer.
- the glass transition temperature of the second bonding layer is ⁇ 50 ° C. or higher and 30 ° C. or lower.
- the laminate of the present disclosure may have a protective film on the surface side of the hard coat layer opposite to the base material layer.
- Another embodiment of the present disclosure comprises a display panel and the above-mentioned laminate arranged on the observer side of the above-mentioned display panel, and the above-mentioned laminate has a surface on the glass substrate side of the above-mentioned display panel.
- a display device arranged adjacent to.
- the display device in the present disclosure is preferably a foldable display.
- the member in expressing the aspect of arranging another member on one member, when the term “above” or “below” is simply used, the member should be in contact with the member unless otherwise specified. Including the case where another member is arranged directly above or directly below, and the case where another member is arranged above or below one member via another member. Further, in the present specification, when expressing the mode of arranging another member on the surface of a certain member, when simply expressing “on the surface side" or “on the surface”, unless otherwise specified, the certain member is used. It includes both the case where another member is arranged directly above or directly below the member so as to be in contact with the member, and the case where another member is arranged above or below one member via another member.
- Laminates The laminates in the present disclosure have three embodiments. Hereinafter, each embodiment will be described separately.
- the inventors of the present disclosure have diligently studied a laminate having a glass substrate, arranged a resin layer on the surface of a thin glass substrate, and further increased the thickness of the resin layer. It has been found that the cracking of the glass substrate can be suppressed and the impact resistance can be improved.
- the resin composition is applied to the surface of the glass substrate to form a relatively thick resin layer, the influence of the shrinkage difference between the glass substrate and the resin layer during heating or curing after the application of the resin composition has an effect. It turned out that it became large and curled in some cases.
- the inventors of the present disclosure further studied, and by forming the resin layer into a film in advance and adhering the resin film to the surface of the thin glass substrate via the bonding layer, curling is suppressed and further resistance is achieved. It was found that the impact resistance can be increased. However, it has been found that in such a laminated body, the surface hardness of the surface of the laminated body on the resin film side is lowered, and the scratch resistance may be lowered.
- the present embodiment has been made in view of the above circumstances, and an object thereof is to provide a laminated body having good bending resistance, impact resistance and scratch resistance, and also having improved safety.
- the first embodiment of the laminate in the present disclosure includes a glass base material, a bonding layer, and a hard coat film in this order, and the hard coat film has a base material layer and a hard coat from the bonding layer side. It has a coat layer, and the thickness of the glass substrate is 10 ⁇ m or more and 100 ⁇ m or less, the thickness of the hard coat layer is A, the thickness of the substrate layer is B, and the thickness of the bonding layer is C. When, the thickness ratio (A + B) / C is 3.0 or more and 500 or less.
- the laminate of the present embodiment has a glass base material, a bonding layer, and a hard coat film in this order, and the hard coat film has a base material layer and a hard coat layer from the bonding layer side.
- the bonding layer is a layer for bonding the glass base material and the base material layer, and the thickness of the glass base material is 10 ⁇ m or more and 100 ⁇ m or less, and the thickness of the hard coat layer is adjusted.
- the ratio of (A + B) to C is 3.0 or more and 500 or less.
- FIG. 1 is a schematic cross-sectional view showing an example of a laminated body in this embodiment.
- the laminate 1 has a glass base material 2 having a predetermined thickness, a bonding layer 3, and a hard coat film 4 in this order, and the hard coat film 4 is on the bonding layer 3 side. Therefore, it has a base material layer 5 and a hard coat layer 6. Further, when the thickness of the hard coat layer 6 is A, the thickness of the base material layer 5 is B, and the thickness of the bonding layer 3 is C, the thickness ratio (A + B) / C is within a predetermined range. ..
- the glass base material has a thickness of a predetermined value or less and is thin, so that bending resistance can be improved.
- the glass base material has a thickness of a predetermined value or less and is thin, there is a concern that it is easily broken and has low impact resistance.
- the present embodiment by arranging the hard coat film on one surface of the glass base material via the bonding layer, the impact resistance is improved while maintaining good bending resistance. be able to.
- the thickness ratio (A + B) / C is.
- the surface hardness of the surface of the laminated body on the hard coat film side can be increased, and the scratch resistance can be improved. The reason for this is inferred as follows.
- the thickness ratio (A + B) / C is 3.0 or more, and the thickness of the bonding layer is relatively thin as compared with the total thickness of the hard coat layer and the base material layer.
- the bonding layer is usually lower in hardness than the glass substrate and the hardcourt layer, but the relatively thin thickness of the bonding layer can reduce the influence of the hardness of the bonding layer, and the hardness of the laminated body can be reduced.
- the surface hardness of the surface on the coat film side can be increased. As a result, it is possible to improve the scratch resistance.
- the thickness of the bonding layer is relatively thin, that is, the above-mentioned thickness ratio (A + B) / C is set to a predetermined value or more. It was found that it is important to do so.
- the laminate in this embodiment can be bent and can be used for a wide variety of applications.
- the laminate in this embodiment can be used, for example, in a wide variety of display devices, and specifically, can be used as a member for a foldable display.
- the thickness ratio (A + B) / C is It is 3.0 or more, preferably 4.0 or more, and more preferably 5 or more.
- the thickness ratio (A + B) / C is 500 or less, preferably 150 or less, more preferably 100 or less, still more preferably 70 or less, and particularly preferably 40 or less.
- the thickness ratio (A + B) / C is 3.0 or more and 500 or less, preferably 4.0 or more and 150 or less, more preferably 5 or more and 100 or less, still more preferably 5 or more and 70 or less, and particularly preferably 5 or more. It is 40 or less.
- the thickness of the hard coat layer is not particularly limited as long as it satisfies the above-mentioned thickness ratio, but is appropriately selected depending on the function of the hard coat layer and the use of the laminate.
- the thickness of the hard coat layer is, for example, 1 ⁇ m or more, preferably 3 ⁇ m or more, more preferably 5 ⁇ m or more, still more preferably 10 ⁇ m or more.
- the thickness of the hard coat layer is within the above range, the surface hardness of the surface of the laminated body on the hard coat film side can be increased and the scratch resistance can be improved.
- the thickness of the hard coat layer is, for example, 50 ⁇ m or less, preferably 30 ⁇ m or less, more preferably 25 ⁇ m or less, still more preferably 20 ⁇ m or less.
- the thickness of the hardcoat layer is, for example, 1 ⁇ m or more and 50 ⁇ m or less, preferably 3 ⁇ m or more and 30 ⁇ m or less, more preferably 5 ⁇ m or more and 25 ⁇ m or less, and further preferably 10 ⁇ m or more and 20 ⁇ m or less.
- the thickness of the base material layer is not particularly limited as long as it satisfies the above-mentioned thickness ratio, but is, for example, 10 ⁇ m or more, preferably 15 ⁇ m or more, more preferably 20 ⁇ m or more, still more preferably 30 ⁇ m or more. When the thickness of the base material layer is within the above range, the impact resistance can be enhanced. On the other hand, the thickness of the base material layer is, for example, 150 ⁇ m or less, preferably 125 ⁇ m or less, more preferably 100 ⁇ m or less, and further preferably 80 ⁇ m or less. When the thickness of the base material layer is within the above range, good bending resistance can be obtained.
- the thickness of the base material layer is, for example, 10 ⁇ m or more and 150 ⁇ m or less, preferably 15 ⁇ m or more and 125 ⁇ m or less, more preferably 20 ⁇ m or more and 100 ⁇ m or less, and further preferably 25 ⁇ m or more and 85 ⁇ m or less.
- the thickness of the bonding layer is not particularly limited as long as it satisfies the above-mentioned thickness ratio, but is, for example, 25 ⁇ m or less, preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and further preferably 10 ⁇ m or less.
- the thickness of the bonding layer is within the above range, the surface hardness of the surface of the laminated body on the hard coat film side can be increased, and the scratch resistance can be improved. Further, since the thickness of the bonding layer is relatively thin as in the above range, the texture and tactile sensation of the glass due to the glass substrate can be maintained.
- the thickness of the bonding layer is, for example, 0.2 ⁇ m or more, preferably 0.5 ⁇ m or more, more preferably 1.0 ⁇ m or more, still more preferably 1.5 ⁇ m or more, and particularly preferably 2.0 ⁇ m or more. .. If the thickness of the joint layer is too thin, the adhesiveness may be weakened, which may reduce the bending resistance, particularly the dynamic bending resistance, or the impact resistance.
- the thickness of the bonding layer is, for example, 0.2 ⁇ m or more and 25 ⁇ m or less, preferably 0.5 ⁇ m or more and 20 ⁇ m or less, more preferably 1.0 ⁇ m or more and 15 ⁇ m or less, still more preferably 1.5 ⁇ m or more and 10 ⁇ m or less, and particularly preferably. It is 2.0 ⁇ m or more and 10 ⁇ m or less.
- the thickness of each layer may be an arithmetic mean value of the thickness of any 10 points obtained by measuring from the cross section in the thickness direction of the laminated body observed by a scanning electron microscope (SEM). can.
- SEM scanning electron microscope
- a specific method for taking a cross-sectional photograph is shown below. First, the laminate is cut into a size of 2 cm ⁇ 2 cm, a block in which the laminate is embedded with an embedding resin is produced, and a cross section is produced using a polishing machine. As the polishing machine, TegraPol-35 manufactured by Struers can be used. Then, a cross-sectional photograph of the measurement sample is taken using a scanning electron microscope. As the scanning electron microscope, S-4800 manufactured by Hitachi High-Technologies Corporation can be used.
- the bonding layer in this embodiment is arranged between the glass base material and the hard coat film, and is a layer for bonding the glass base material and the hard coat film.
- the material used for the bonding layer is not particularly limited as long as it is a material capable of bonding a glass base material and a hard coat film, and for example, a feeling of an optical transparent adhesive (OCA; Optical Clear Adhesive) or the like.
- OCA optical transparent adhesive
- Examples thereof include pressure-sensitive adhesives, heat-sensitive adhesives such as heat sealants, and curable adhesives. These may be used alone or in combination of two or more.
- Examples of the pressure-sensitive adhesive such as an optical transparent adhesive (OCA) include acrylic adhesive, urethane adhesive, silicone adhesive, epoxy adhesive, vinyl acetate adhesive, polyvinyl butyral (PVB) and the like. Examples thereof include polyvinyl acetal-based adhesives.
- OCA optical transparent adhesive
- PVB polyvinyl butyral
- thermoplastic resin is not particularly limited, and for example, acrylic resin, vinyl chloride-vinyl acetate copolymer, polyamide resin, polyester resin, polyester urethane resin, chlorinated polypropylene, chlorinated rubber, urethane resin, and epoxy.
- examples thereof include resins, styrene resins, polyolefin resins, silicone resins, polyvinyl acetal resins such as polyvinyl butyral (PVB), and polyether urethane resins.
- PVB polyvinyl butyral
- thermoplastic resins may be used alone or in combination of two or more.
- the heat-sensitive adhesive composition can further contain a curing agent. This makes it possible to improve heat resistance and adhesiveness. Further, by adding a curing agent, the composite elastic modulus of the joint layer described later can be adjusted. In order to obtain a bonded layer having a desired composite elastic modulus, for example, it is preferable to appropriately add a curing agent according to the characteristics of the thermoplastic resin. Examples of the curing agent include isocyanate-based curing agents, epoxy-based curing agents, melamine-based curing agents, and the like. The curing agent may be used alone or in combination of two or more. When the heat-sensitive adhesive composition contains a curing agent, the bonding layer will contain the cured product of the heat-sensitive adhesive composition.
- the heat-sensitive adhesive composition may contain an additive if necessary.
- Additives include, for example, light stabilizers, UV absorbers, infrared absorbers, antioxidants, plasticizers, coupling agents, defoamers, fillers, inorganic or organic particles for adjusting refraction, and charged. Examples thereof include preventive agents, colorants such as blue pigments and purple pigments, leveling agents, surfactants, lubricants, various sensitizers, flame retardant agents, adhesion-imparting agents, polymerization inhibitors, surface modifiers and the like. These additives can be appropriately selected from the commonly used ones and used. The content of the additive can be appropriately set.
- the heat-sensitive adhesive composition preferably contains a silane coupling agent in order to enhance the adhesion to the glass substrate.
- curable adhesive examples include a thermosetting adhesive, an ultraviolet curable adhesive, and the like.
- Thermosetting adhesive is an adhesive that cures by heating.
- examples of the thermosetting adhesive include epoxy adhesives, acrylic adhesives, urethane adhesives, polyester adhesives, silicone adhesives and the like.
- the ultraviolet curable adhesive is an adhesive that cures when irradiated with ultraviolet rays.
- Examples of the ultraviolet curable adhesive include epoxy-based adhesives, acrylic-based adhesives, urethane acrylate-based adhesives, and the like.
- the curable adhesive composition may contain an additive if necessary.
- Additives include, for example, light stabilizers, UV absorbers, infrared absorbers, antioxidants, plasticizers, coupling agents, defoamers, fillers, inorganic or organic particles for adjusting refraction, and charged. Examples thereof include preventive agents, colorants such as blue pigments and purple pigments, leveling agents, surfactants, lubricants, various sensitizers, flame retardant agents, adhesion-imparting agents, polymerization inhibitors, surface modifiers and the like. These additives can be appropriately selected from the commonly used ones and used. The content of the additive can be appropriately set.
- the material used for the bonding layer is preferably a heat-sensitive adhesive or a curable adhesive, and more preferably a heat sealant, an ultraviolet curable adhesive or a thermosetting adhesive. That is, the bonding layer is preferably a heat-sensitive adhesive layer or contains a cured product of a curable adhesive composition, is a heat seal layer, or is a cured product or a thermosetting type of an ultraviolet curable adhesive composition. It is more preferable to contain a cured product of the adhesive composition.
- a heat sealant an ultraviolet curable adhesive or a thermosetting adhesive, a bonded layer satisfying the composite elastic modulus described later can be obtained, and the glass transition temperature of the bonded layer described later is set to 0 ° C. or higher.
- OCA optical transparent adhesive
- an OCA film is used, but some OCA films have irregularities on the surface, and when such an OCA film is used, the screen fluctuates due to the irregularities. May occur, and the texture and tactile sensation of the glass due to the glass substrate may be impaired.
- a heat-sensitive adhesive or a curable adhesive it is possible to suppress the occurrence of such a problem.
- the bonding layer preferably contains at least one selected from the group consisting of polyester resin, polyolefin resin, and urethane resin. Above all, it is more preferable that the bonding layer contains a polyester resin.
- the urethane resin also includes a polyester urethane resin and a polyether urethane resin. The bonding layer containing such a material can easily adjust the composite elastic modulus described later to a preferable range.
- the composite elastic modulus of the bonded layer is, for example, preferably 1 MPa or more, more preferably 10 MPa or more, and even more preferably 20 MPa or more.
- the composite elastic modulus of the bonded layer is within the above range and has a certain degree of hardness, the surface hardness of the surface of the laminated body on the hard coat film side can be increased, the scratch resistance can be improved, and the impact resistance can be improved. Can be improved.
- the composite elastic modulus of the bonded layer is, for example, preferably 6000 MPa or less, more preferably 5500 MPa or less, and further preferably 4500 MPa or less.
- the composite elastic modulus of the joint layer is, for example, preferably 1 MPa or more and 6000 MPa or less, more preferably 10 MPa or more and 5500 MPa or less, further preferably 20 MPa or more and 4500 MPa or less, and more preferably 25 MPa or more and 4000 MPa or less. Especially preferable.
- the composite elastic modulus of the joint layer shall be calculated using the contact projection area Ap obtained when measuring the indentation hardness ( HIT ) of the joint layer.
- the "indentation hardness” is a value obtained from the load-displacement curve from the load to the unloading of the indenter obtained by the hardness measurement by the nanoindentation method.
- the composite elastic modulus of the joint layer is the elastic modulus including the elastic deformation of the joint layer and the elastic deformation of the indenter.
- the measurement of indentation hardness shall be performed using "TI950 TriboIndenter" manufactured by BRUKER Co., Ltd. for the measurement sample. Specifically, first, a block in which a laminate cut out to 1 mm ⁇ 10 mm is embedded with an embedding resin is prepared, and a uniform thickness of 50 nm or more and 100 nm without holes or the like is produced from this block by a general section preparation method. Cut out the following sections. "Ultra Microtome EM UC7" (manufactured by Leica Microsystems, Inc.) or the like can be used for preparing the sections. Then, the remaining block from which a uniform section having no holes or the like is cut out is used as a measurement sample.
- a Berkovich indenter (triangular pyramid, TI-0039 manufactured by BRUKER) was bonded as the indenter under the following measurement conditions. Push vertically to the center of the cross section for 10 seconds up to a maximum pushing load of 25 ⁇ N.
- the Berkovich indenter is 500 nm away from the interface between the glass substrate and the junction layer to the center side of the junction layer in order to avoid the influence of the glass substrate and the hard coat film and to avoid the influence of the side edges of the junction layer.
- the contact projection area is a contact projection area in which the curvature of the indenter tip is corrected by the Oliver-Charr method using fused silica (5-00098 manufactured by BRUKER Co., Ltd.) as a standard sample.
- the indentation hardness ( HIT ) shall be the arithmetic mean value of the values obtained by measuring at 10 points. If any of the measured values deviates by ⁇ 20% or more from the arithmetic mean value, the measured value shall be excluded and remeasurement shall be performed. Whether or not any of the measured values deviates by ⁇ 20% or more from the arithmetic mean value is determined by (AB) / B ⁇ 100 when the measured value is A and the arithmetic mean value is B. Judgment shall be made based on whether the required value (%) is ⁇ 20% or more.
- the measurement shall be performed by changing to the following measurement condition 2. ..
- the maximum load is 25 ⁇ N under the measurement condition 1 and 5 ⁇ N under the measurement condition 2.
- the composite elastic modulus Er of the bonded layer is obtained by the following mathematical formula (3) using the contact projection area Ap obtained when measuring the indentation hardness.
- the indentation hardness is measured at 10 points, the composite elastic modulus is obtained each time, and the obtained composite elastic modulus is used as the arithmetic mean value of the obtained 10 points.
- the composite elastic modulus of the joint layer can be adjusted, for example, by the type and composition of the material contained in the joint layer.
- the glass transition temperature of the bonding layer is, for example, preferably ⁇ 40 ° C. or higher, more preferably ⁇ 30 ° C. or higher, further preferably ⁇ 10 ° C. or higher, and more preferably 0 ° C. or higher. Is more preferable, and it is particularly preferable that the temperature is 20 ° C. or higher.
- the glass transition temperature of the bonded layer is within the above range, it becomes easy to obtain a bonded layer satisfying the above-mentioned composite elastic modulus. Further, when the glass transition temperature of the bonding layer is 0 ° C. or higher, scratch resistance and impact resistance can be further improved.
- the glass transition temperature of the bonding layer is, for example, preferably 150 ° C.
- the glass transition temperature of the bonded layer is, for example, preferably ⁇ 40 ° C. or higher and 150 ° C. or lower, more preferably ⁇ 30 ° C. or higher and 150 ° C. or lower, and further preferably ⁇ 10 ° C. or higher and 140 ° C. or lower. , 0 ° C. or higher and 130 ° C. or lower is particularly preferable, and 0 ° C. or higher and 120 ° C. or lower is most preferable.
- the glass transition temperature of the bonding layer is, for example, ⁇ 40 ° C. or higher and 25 ° C. or lower and 50 ° C. or higher and 150 ° C. or lower. It is possible to obtain a laminate that can withstand use in a high temperature and high humidity and low temperature environment.
- the glass transition temperature of the bonded layer means a value measured by a method (DMA method) based on the peak top value of the loss tangent (tan ⁇ ).
- DMA method dynamic viscoelasticity measuring device
- the joint layer is punched out to 15 mm ⁇ 200 mm.
- a test piece of the bonding layer is prepared by dissolving the material of the bonding layer or melting the material of the bonding layer, applying the solution on the substrate, drying, and then peeling the film from the substrate.
- the solvent can be appropriately selected depending on the material of the bonding layer, and examples thereof include ethyl acetate.
- the material of the bonding layer is appropriately heated and dissolved.
- a Naflon (registered trademark) sheet 300 mm ⁇ 300 mm ⁇ 1 mm thickness
- the bonding layer is formed into a columnar shape having a diameter of about 5 mm and a height of about 5 mm.
- the columnar shape can be formed by winding the joint layer.
- the above columnar measurement sample is attached between the compression jigs (parallel plate ⁇ 8 mm) of the dynamic viscoelasticity measuring device.
- Measurement conditions for glass transition temperature ⁇ Measurement sample: ⁇ 5 mm ⁇ height 5 mm columnar ⁇ Measurement jig: compression (parallel plate) -Measurement mode: Temperature dependence (Temperature range: -50 ° C to 200 ° C, temperature rise rate: 5 ° C / min) ⁇ Frequency: 1Hz
- the bonding layer has transparency.
- the total light transmittance of the bonding layer is preferably 80% or more, more preferably 85% or more, and further preferably 88% or more.
- the total light transmittance of the bonding layer can be measured according to JIS K7361-1, and can be measured by, for example, a haze meter HM150 manufactured by Murakami Color Technology Research Institute.
- a haze meter HM150 manufactured by Murakami Color Technology Research Institute.
- the same can be applied to the method for measuring the total light transmittance of other layers.
- the haze of the bonding layer is preferably, for example, 2% or less, more preferably 1.5% or less, and further preferably 1% or less.
- the haze of the bonding layer can be measured in accordance with JIS K-7136, for example, by a haze meter HM150 manufactured by Murakami Color Technology Research Institute.
- the same can be applied to the method for measuring the haze of other layers.
- the method of joining the glass substrate and the hard coat film via the joining layer is appropriately selected according to the material used for the joining layer and the like.
- a pressure-sensitive adhesive such as an optical transparent adhesive (OCA)
- OCA optical transparent adhesive
- a film-shaped pressure-sensitive adhesive layer can be used, and a hardcourt film and a glass substrate can be bonded via the film-shaped pressure-sensitive adhesive layer.
- a heat-sensitive adhesive such as a heat sealant
- the heat-sensitive adhesive composition is applied to the surface of the hard coat film on the substrate layer side or one surface of the glass substrate, dried, and the heat-sensitive adhesive layer is applied.
- the hard coat film and the glass substrate are laminated via the heat-sensitive adhesive layer, heated, and heat-welded by the heat-sensitive adhesive layer to bond them.
- the heating temperature is preferably equal to or higher than the glass transition temperature of the heat-sensitive adhesive layer.
- the thermosetting adhesive composition is applied to the surface of the hard coat film on the substrate layer side or one surface of the glass substrate, dried, and then thermosetting adhesive is applied.
- the agent layer the hard coat film and the glass substrate are laminated via the thermosetting adhesive layer and heated to cure the thermosetting adhesive layer, whereby the adhesive can be adhered.
- the ultraviolet curable adhesive composition is applied to the surface of the hard coat film on the substrate layer side or one surface of the glass substrate, dried, and then ultraviolet curable adhesive is applied.
- the agent layer the hard coat film and the glass substrate are laminated via the ultraviolet curable adhesive layer, and the ultraviolet curable adhesive layer is cured by irradiating with ultraviolet rays to adhere the adhesive layer.
- a solid resin such as a pellet or a sheet may be used as the resin.
- the resin and the solvent may be heated in advance to dissolve the resin in the solvent, a resin solution may be prepared, and then the resin solution may be used for preparing the adhesive composition.
- the hardcoat film in this embodiment has a base material layer and a hardcoat layer from the bonding layer side.
- Hardcoat layer The hardcoat layer in this embodiment is a layer for increasing the surface hardness. By arranging the hard coat layer, scratch resistance can be improved.
- the "hard coat layer” is a member for increasing the surface hardness, and specifically, in the configuration in which the laminate in the present embodiment has the hard coat layer, JIS When the pencil hardness test specified in K 5600-5-4 (1999) is performed, it means a hardness of "H" or higher.
- the pencil hardness of the surface of the laminated body on the hard coat layer side in this embodiment is preferably H or more, more preferably 2H or more, further preferably 3H or more, and 4H or more. It is particularly preferable, and 5H or more is most preferable.
- the pencil hardness is measured by the pencil hardness test specified in JIS K5600-5-4 (1999). Specifically, using a test pencil specified by JIS-S-6006, a pencil hardness test specified by JIS K5600-5-4 (1999) was performed on the surface of the laminate on the hard coat layer side, and scratches were found. It can be done by evaluating the highest pencil hardness that does not stick.
- the measurement conditions can be an angle of 45 °, a load of 1 kg, a speed of 0.5 mm / sec or more and 1 mm / sec or less, and a temperature of 23 ⁇ 2 ° C.
- the pencil hardness tester for example, a pencil scratch coating film hardness tester manufactured by Toyo Seiki Co., Ltd. can be used.
- the hard coat layer may be a single layer or may have a multi-layer structure of two or more layers.
- the hard coat layer in order to improve the surface hardness and to have a good balance between bending resistance and elastic modulus, the hard coat layer is dynamically combined with a layer for satisfying the pencil hardness. It may have a layer for satisfying the bending test (a layer for satisfying scratch resistance).
- (C) Material of hard coat layer examples include a cured resin product.
- the hard coat layer preferably contains a cured product of a resin composition containing a polymerizable compound.
- the cured product of the resin composition containing the polymerizable compound can be obtained by subjecting the polymerizable compound to a polymerization reaction by a known method using a polymerization initiator, if necessary.
- a polymerizable compound has at least one polymerizable functional group in the molecule.
- the polymerizable compound for example, at least one of a radically polymerizable compound and a cationically polymerizable compound can be used.
- the radically polymerizable compound is a compound having a radically polymerizable group.
- the radically polymerizable group contained in the radically polymerizable compound may be any functional group capable of causing a radical polymerization reaction, and is not particularly limited, and examples thereof include a group containing a carbon-carbon unsaturated double bond. Examples thereof include a vinyl group and a (meth) acryloyl group.
- these radically polymerizable groups may be the same or different from each other.
- the number of radically polymerizable groups contained in one molecule of the radically polymerizable compound is preferably two or more, and more preferably three or more, from the viewpoint of improving the hardness of the hard coat layer.
- a compound having a (meth) acryloyl group is preferable from the viewpoint of high reactivity, and for example, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate, and melamine (Polyfunctional (meth) acrylate monomer having several (meth) acryloyl groups in a molecule called meth) acrylate, polyfluoroalkyl (meth) acrylate, silicone (meth) acrylate, etc. and having a molecular weight of hundreds to thousands.
- oligomers can be preferably used, and polyfunctional (meth) acrylate polymers having two or more (meth) acryloyl groups in the side chains of the acrylate polymer can also be preferably used.
- a polyfunctional (meth) acrylate monomer having two or more (meth) acryloyl groups in one molecule can be preferably used.
- the hardness of the hard coat layer can be improved, and the adhesion can be further improved.
- a polyfunctional (meth) acrylate oligomer or polymer having two or more (meth) acryloyl groups in one molecule can also be preferably used.
- the hardness and bending resistance of the hard coat layer can be improved, and the adhesion can be further improved.
- (meth) acryloyl represents each of acryloyl and methacryloyl
- (meth) acrylate represents each of acrylate and methacrylate
- polyfunctional (meth) acrylate monomer examples include those described in JP-A-2019-132930. Among them, those having 3 or more and 6 or less (meth) acryloyl groups in one molecule are preferable from the viewpoint of high reactivity, improvement of the hardness of the hard coat layer, and adhesion, for example, pentaerythritol.
- Triacrylate PETA
- Dipentaerythritol Hexaacrylate DPHA
- Pentaerythritol Tetraacrylate PETTA
- Dipentaerythritol Pentaacrylate DPPA
- Trimethylol Propantri meth) Acrylate
- Trypentaerythritol Octa Metal Acrylate
- Tetrapentaerythritol deca (meth) acrylates and the like can be preferably used, and in particular, pentaerythritol tri (meth) acrylates, dipentaerythritol penta (meth) acrylates, and dipentaerythritol hexaacrylates, which are PO, EO, or At least one selected from those modified with caprolactone is preferable.
- the resin composition may contain a monofunctional (meth) acrylate monomer as a radically polymerizable compound in order to adjust hardness, viscosity, improve adhesion, and the like.
- a monofunctional (meth) acrylate monomer as a radically polymerizable compound in order to adjust hardness, viscosity, improve adhesion, and the like.
- Specific examples of the monofunctional (meth) acrylate monomer include those described in JP-A-2019-132930.
- the cationically polymerizable compound is a compound having a cationically polymerizable group.
- the cationically polymerizable group contained in the cationically polymerizable compound may be any functional group capable of causing a cationic polymerization reaction, and is not particularly limited, and examples thereof include an epoxy group, an oxetanyl group, and a vinyl ether group.
- these cationically polymerizable groups may be the same or different from each other.
- the number of cationically polymerizable groups contained in one molecule of the cationically polymerizable compound is preferably two or more, and more preferably three or more, from the viewpoint of improving the hardness of the hard coat layer.
- the cationically polymerizable compound is preferably a compound having at least one of an epoxy group and an oxetanyl group as a cationically polymerizable group, and a compound having at least one of an epoxy group and an oxetanyl group in one molecule is preferable. More preferred.
- a cyclic ether group such as an epoxy group or an oxetanyl group is preferable because the shrinkage associated with the polymerization reaction is small. Further, among the cyclic ether groups, compounds having an epoxy group are easily available, compounds having various structures are easily available, the durability of the obtained hard coat layer is not adversely affected, and compatibility with radically polymerizable compounds is easily controlled. There is an advantage.
- the oxetanyl group has a higher degree of polymerization than the epoxy group and has low toxicity, and when the obtained hard coat layer is combined with a compound having an epoxy group, it is contained in the coating film.
- Examples of the cationically polymerizable compound having an epoxy group include polyglycidyl ether of a polyhydric alcohol having an alicyclic ring, or a cyclohexene ring or cyclopentene ring-containing compound with an appropriate oxidizing agent such as hydrogen peroxide or peracid.
- Alicyclic epoxy resin obtained by epoxidation polyglycidyl ether of aliphatic polyhydric alcohol or its alkylene oxide adduct, polyglycidyl ester of aliphatic long chain polybasic acid, homopolymer of glycidyl (meth) acrylate, An aliphatic epoxy resin such as a copolymer; a glycidyl ether produced by reacting bisphenols such as bisphenol A, bisphenol F and hydrogenated bisphenol A, or derivatives such as alkylene oxide adducts and caprolactone adducts thereof with epichlorohydrin. And novolak epoxy resin and the like, and examples thereof include glycidyl ether type epoxy resin derived from bisphenols.
- alicyclic epoxy resin the glycidyl ether type epoxy resin, and the cationically polymerizable compound having an oxetanyl group
- alicyclic epoxy resin the glycidyl ether type epoxy resin
- cationically polymerizable compound having an oxetanyl group can be mentioned, for example, those described in JP-A-2018-104682.
- the cured product of the resin composition containing the polymerizable compound contained in the hard coat layer includes a Fourier transform infrared spectrophotometer (FTIR), a thermal decomposition gas chromatograph device (GC-MS), and a decomposition product of the polymer.
- FTIR Fourier transform infrared spectrophotometer
- GC-MS thermal decomposition gas chromatograph device
- decomposition product of the polymer includes a Fourier transform infrared spectrophotometer (FTIR), a thermal decomposition gas chromatograph device (GC-MS), and a decomposition product of the polymer.
- FTIR Fourier transform infrared spectrophotometer
- GC-MS thermal decomposition gas chromatograph device
- the resin composition may contain a polymerization initiator, if necessary.
- a radical polymerization initiator, a cationic polymerization initiator, a radical, a cationic polymerization initiator and the like can be appropriately selected and used.
- These polymerization initiators are decomposed by at least one of light irradiation and heating to generate radicals or cations to promote radical polymerization and cation polymerization. In some cases, the polymerization initiator is completely decomposed and does not remain in the hard coat layer.
- radical polymerization initiator and the cationic polymerization initiator include those described in JP-A-2018-104682.
- the hard coat layer preferably contains inorganic or organic particles, and more preferably contains inorganic fine particles.
- the hardness can be improved by containing the particles in the hard coat layer.
- the inorganic particles include metal oxides such as silica (SiO 2 ), aluminum oxide, zirconia, titania, zinc oxide, germanium oxide, indium oxide, tin oxide, indium tin oxide (ITO), antimony oxide, and cerium oxide.
- metal oxides such as silica (SiO 2 ), aluminum oxide, zirconia, titania, zinc oxide, germanium oxide, indium oxide, tin oxide, indium tin oxide (ITO), antimony oxide, and cerium oxide.
- metal fluoride particles such as magnesium fluoride and sodium fluoride
- metal particles, metal sulfide particles, and metal nitride particles are preferable, at least one selected from silica particles and aluminum oxide particles is more preferable, and silica particles are even more preferable. This is because excellent hardness can be obtained.
- the inorganic particles have at least a reactive functional group having a photoreactivity capable of forming a covalent bond by cross-linking the inorganic particles with each other or with at least one of the polymerizable compounds on the surface of the inorganic particles. It is preferable that it is a reactive inorganic particle contained in a part of the above.
- the hardness of the hard coat layer can be further improved by performing a cross-linking reaction between the reactive inorganic particles or between the reactive inorganic particles and at least one of the radically polymerizable compound and the cationically polymerizable compound.
- Reactive inorganic particles are coated with an organic component at least a part of the surface thereof, and have a reactive functional group introduced by the organic component on the surface.
- a reactive functional group for example, a polymerizable unsaturated group is preferably used, and more preferably a photocurable unsaturated group.
- the reactive functional group include an ethylenically unsaturated bond such as a (meth) acryloyl group, a vinyl group and an allyl group, and an epoxy group.
- the reactive silica particles are not particularly limited, and conventionally known ones can be used, and examples thereof include the reactive silica particles described in JP-A-2008-165040.
- Examples of commercially available products of the reactive silica particles include those manufactured by Nissan Chemical Industries, Ltd .; MIBK-SD, MIBK-SDMS, MIBK-SDL, MIBK-SDZL, and JGC Catalysts and Chemicals Co., Ltd .; V8802, V8803 and the like.
- the silica particles may be spherical silica particles, but are preferably atypical silica particles. Spherical silica particles and atypical silica particles may be mixed.
- the atypical silica particles mean silica particles having a potato-like random unevenness on the surface. Since the surface area of the atypical silica particles is larger than that of the spherical silica particles, the inclusion of such atypical silica particles increases the contact area with the resin component and the like, and makes the hardness of the hard coat layer more excellent. Can be.
- the particles are atypical silica particles can be confirmed by observing the cross section of the hardcourt layer with an electron microscope.
- the average particle size of the inorganic particles is preferably 5 nm or more, more preferably 10 nm or more, from the viewpoint of improving hardness. If the average particle size of the inorganic particles is too small, it is difficult to produce the particles, and the particles may easily aggregate with each other. Further, the average particle size of the inorganic particles is preferably 200 nm or less, more preferably 100 nm or less, and further preferably 50 nm or less from the viewpoint of transparency. If the average particle size of the inorganic particles is too large, large irregularities may be formed on the hard coat layer and haze may increase.
- the average particle size of the inorganic particles can be measured by observing the cross section of the hard coat layer with an electron microscope, and the average particle size of 10 arbitrarily selected particles is taken as the average particle size.
- the average particle size of the atypical silica particles is the average value of the maximum value (major axis) and the minimum value (minor axis) of the distance between two points on the outer periphery of the atypical silica particles that appeared by observing the cross section of the hard coat layer with a microscope. be.
- the hardness of the hardcoat layer can be controlled by adjusting the size and content of the inorganic particles.
- the content of the silica particles is preferably 25 parts by mass or more, more preferably 30 parts by mass or more, and further preferably 50 parts by mass or more with respect to 100 parts by mass of the polymerizable compound. preferable.
- the hardness of the hard coat layer can be increased.
- the content of the silica particles is preferably 150 parts by mass or less, more preferably 120 parts by mass or less, and further preferably 100 parts by mass or less with respect to 100 parts by mass of the polymerizable compound. preferable.
- good bending resistance can be obtained.
- the content of the silica particles is, for example, preferably 25 parts by mass or more and 150 parts by mass or less, more preferably 30 parts by mass or more and 120 parts by mass or less, and 50 parts by mass with respect to 100 parts by mass of the polymerizable compound. It is more preferably part by mass or more and 100 parts by mass or less.
- the hard coat layer may contain an ultraviolet absorber. Deterioration of the base material layer due to ultraviolet rays can be suppressed. Above all, when the base material layer contains polyimide, it is possible to suppress the color change of the base material layer containing polyimide with time. Further, in a display device including a laminated body, deterioration of members arranged on the display panel side of the laminated body, such as a polarizing element, due to ultraviolet rays can be suppressed.
- the ultraviolet absorber contained in the hard coat layer preferably has a peak absorption wavelength of 300 nm or more and 390 nm or less, more preferably 320 nm or more and 370 nm or less, and more preferably 330 nm or more and 370 nm or less. More preferred.
- Such an ultraviolet absorber can efficiently absorb ultraviolet rays in the UVA region, while inhibiting the curing of the hard coat layer by shifting the absorption wavelength of the initiator for curing the hard coat layer to 250 nm and the peak wavelength. This is because a hard coat layer having an ultraviolet absorbing ability can be formed without causing the above.
- the peak of the absorption wavelength is 380 nm or less because coloring by the ultraviolet absorber can be suppressed.
- the absorbance of the ultraviolet absorber can be measured using, for example, an ultraviolet-visible near-infrared spectrophotometer (for example, JASCO Corporation V-7100).
- an ultraviolet-visible near-infrared spectrophotometer for example, JASCO Corporation V-7100.
- the ultraviolet absorber examples include triazine-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers such as hydroxybenzophenone-based ultraviolet absorbers, and benzotriazole-based ultraviolet absorbers.
- one or more ultraviolet absorbers selected from the group consisting of hydroxybenzophenone-based ultraviolet absorbers and benzotriazole-based ultraviolet absorbers are preferable from the viewpoint of suppressing deterioration of the substrate layer due to ultraviolet rays, and hydroxybenzophenone-based ultraviolet rays are preferable. More preferably, one or more UV absorbers selected from the group consisting of absorbers.
- hydroxybenzophenone-based ultraviolet absorber examples include those described in JP-A-2019-132930.
- hydroxybenzophenone-based ultraviolet absorber a 2-hydroxybenzophenone-based ultraviolet absorber is preferable, and one or more selected from the group consisting of benzophenone-based ultraviolet absorbers having the following general formula (A) is more preferable. preferable. It is possible to suppress deterioration of the base material layer due to ultraviolet rays and improve durability.
- X 1 and X 2 independently represent a hydroxyl group, ⁇ OR a , or a hydrocarbon group having 1 to 15 carbon atoms, and Ra is a hydrocarbon having 1 to 15 carbon atoms. Represents a group.
- the hydrocarbon groups having 1 to 15 carbon atoms in X 1 , X 2 and Ra are methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group and octyl. Examples thereof include a group, a dodecyl group, an allyl group, a benzyl group and the like.
- Each of the aliphatic hydrocarbon groups having 3 or more carbon atoms may be linear or branched.
- the hydrocarbon group preferably has 1 to 12 carbon atoms, and more preferably 1 to 8 carbon atoms.
- the hydrocarbon group is preferably an aliphatic hydrocarbon group, and more preferably a methyl group or an allyl group, from the viewpoint of easily improving transparency.
- X 1 and X 2 are independently hydroxyl groups or ⁇ OR a .
- benzophenone-based ultraviolet absorbers having the general formula (A) 2,2', 4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4, It is preferably at least one selected from the group consisting of 4'-dimethoxybenzophenone and 2,2'-dihydroxy-4,4'-diallyloxybenzophenone, preferably 2,2', 4,4'-tetrahydroxy. More preferably, it is at least one selected from the group consisting of benzophenone and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone.
- benzotriazole-based ultraviolet absorber examples include those described in JP-A-2019-132930.
- benzotriazole-based ultraviolet absorber 2- (2-hydroxyphenyl) benzotriazoles are preferable, and one or more selected from the group consisting of benzotriazole-based ultraviolet absorbers having the following general formula (B). It is more preferable to have. It is possible to suppress deterioration of the base material layer due to ultraviolet rays and improve durability.
- Y 1 , Y 2 and Y 3 independently represent a hydrogen atom, a hydroxyl group, ⁇ OR b , or a hydrocarbon group having 1 to 15 carbon atoms, and R b is a carbon atom.
- R b is a carbon atom.
- the hydrocarbon groups having 1 to 15 carbon atoms in Y 1 , Y 2 , Y 3 and R b are methyl group, ethyl group, propyl group, butyl group, pentyl group and hexyl group. , Heptyl group, octyl group, dodecyl group and the like.
- Each of the aliphatic hydrocarbon groups having 3 or more carbon atoms may be linear or branched.
- the hydrocarbon group preferably has 1 to 12 carbon atoms, and more preferably 1 to 8 carbon atoms.
- the hydrocarbon group is preferably an aliphatic hydrocarbon group, preferably a linear or branched alkyl group, and above all, a methyl group, a t-butyl group, or t-, from the viewpoint of easily improving transparency. It is preferably a pentyl group, an n-octyl group, or a t-octyl group.
- examples of the halogen atom in Y4 include a chlorine atom, a fluorine atom, a bromine atom and the like, and a chlorine atom is preferable.
- Y 1 and Y 3 are hydrogen atoms and Y 2 is a hydroxyl group or ⁇ OR b , and 2- (2-hydroxy-4-octyloxyphenyl) -2H. More preferably, it is one or more selected from the group consisting of -benzotriazole and 2- (2,4-dihydroxyphenyl) -2H-benzotriazole. It is possible to suppress deterioration of the base material layer due to ultraviolet rays and improve durability.
- the content of the ultraviolet absorber in the hard coat layer is preferably, for example, 10% by mass or less, more preferably 7% by mass or less, from the viewpoint of suppressing haze due to mixing with the ultraviolet absorber. .. Further, from the viewpoint of suppressing deterioration of the base material layer due to ultraviolet rays and improving durability, the content of the ultraviolet absorber in the hard coat layer is preferably 1% by mass or more and 6% by mass or less, preferably 2% by mass. It is more preferably 5% by mass or less.
- the hardcoat layer may contain an antifouling agent. Antifouling property can be imparted to the laminated body.
- the antifouling agent is not particularly limited, and examples thereof include a silicone-based antifouling agent, a fluorine-based antifouling agent, and a silicone-based and fluorine-based antifouling agent. Further, the antifouling agent may be an acrylic antifouling agent. As the antifouling agent, one type may be used alone, or two or more types may be mixed and used.
- the hard coat layer containing silicone-based antifouling agent and fluorine-based antifouling agent is hard to get fingerprints (not noticeable) and has good wiping property. Further, when a silicone-based antifouling agent or a fluorine-based antifouling agent is contained, the surface tension at the time of applying the curable resin composition for the hard coat layer can be lowered, so that the leveling property is good and the obtained hard coat layer can be obtained. The appearance of is good.
- the hard coat layer containing a silicone-based antifouling agent has good slipperiness and scratch resistance.
- the slipperiness when contacted with a finger, a pen, or the like is improved, so that the tactile sensation is improved.
- the antifouling agent preferably has a reactive functional group in order to enhance the durability of the antifouling performance.
- the antifouling agent does not have a reactive functional group, the hardcourt layer side of the laminated body when the laminated body is laminated, regardless of whether the laminated body is in the form of a roll or a sheet.
- the antifouling agent is transferred to the surface opposite to the surface of the laminated body, and when the other layer is attached or applied to the surface opposite to the surface of the hard coat layer side of the laminate, the other layer is peeled off.
- the antifouling agent has a reactive functional group, the performance sustainability of the antifouling performance becomes good.
- the number of reactive functional groups contained in the antifouling agent may be 1 or more, preferably 2 or more.
- the antifouling agent preferably has a weight average molecular weight of 5000 or less.
- the weight average molecular weight of the antifouling agent can be measured by gel permeation chromatography (GPC).
- the antifouling agent may be uniformly dispersed in the hardcoat layer, but from the viewpoint of obtaining sufficient antifouling property with a small amount of addition and suppressing a decrease in the strength of the hardcoat layer, the antifouling agent is placed on the surface side of the hardcoat layer. It is preferable that they are unevenly distributed.
- the coating film of the curable resin composition for the hard coat layer is dried and before being cured.
- the antifouling agent is unevenly distributed on the surface side of the hard coat layer, or an antifouling agent with low surface tension is used. Examples thereof include a method in which the antifouling agent is floated on the surface of the coating film without applying heat when the coating film is dried, and then the coating film is cured so that the antifouling agent is unevenly distributed on the surface side of the hard coat layer.
- the content of the antifouling agent is preferably 0.01 parts by mass or more and 3.0 parts by mass or less with respect to 100 parts by mass of the resin component. If the content of the antifouling agent is too small, it may not be possible to impart sufficient antifouling property to the hardcoat layer, and if the content of the antifouling agent is too large, the hardness of the hardcoat layer may decrease. be.
- the hardcourt layer may further contain additives, if desired.
- the additive is appropriately selected depending on the function to be imparted to the hard coat layer, and is not particularly limited.
- Antistatic agents, colorants such as blue pigments and purple pigments, leveling agents, surfactants, lubricants, various sensitizers, flame retardant agents, adhesive enhancers, polymerization inhibitors, antioxidants, light stabilizers examples include surface modifiers.
- (D) Method for Forming Hard Court Layer As a method for forming the hard coat layer, for example, a method of applying a curable resin composition for a hard coat layer containing the above-mentioned polymerizable compound or the like on a base material layer and curing the hard coat layer or the like. Can be mentioned.
- the curable resin composition for the hard coat layer contains a polymerizable compound, and may further contain a polymerization initiator, particles, an ultraviolet absorber, a solvent, an additive and the like, if necessary.
- the method for applying the curable resin composition for a hard coat layer on the base material layer is not particularly limited as long as it can be applied to a desired thickness, for example, a gravure coat method, a gravure reverse coat method, or a gravure.
- General coating methods such as an offset coating method, a spin coating method, a roll coating method, a reverse roll coating method, a blade coating method, a dip coating method, a spray coating method, a die coating method, and a screen printing method can be mentioned.
- a transfer method can also be used as a method for forming a coating film of the resin composition for a hard coat layer.
- the coating film of the curable resin composition for the hard coat layer is dried as necessary to remove the solvent.
- the drying method include vacuum drying, heat drying, and a method of combining these drying methods. For example, it can be dried by heating at a temperature of 30 ° C. or higher and 120 ° C. or lower for 10 seconds or longer and 180 seconds or lower.
- the coating film of the curable resin composition for the hard coat layer it is appropriately selected depending on the polymerizable group of the polymerizable compound, and for example, at least one of light irradiation and heating can be used.
- UV rays emitted from light rays such as an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc, a xenon arc, and a metal halide lamp can be used.
- the irradiation amount of the energy radiation source can be, for example, about 50 mJ / cm 2 or more and 5000 mJ / cm 2 or less as the integrated exposure amount at the ultraviolet wavelength of 365 nm.
- heating for example, it can be treated at a temperature of 40 ° C. or higher and 120 ° C. or lower. Further, the reaction may be carried out by leaving it at room temperature (25 ° C.) for 24 hours or more.
- Base material layer The base material layer in this embodiment is a member that supports the hard coat layer.
- the composite elastic modulus of the base material layer is, for example, preferably 5.7 GPa or more, more preferably 6.5 GPa or more, and 7.5 GPa or more. It is more preferable to have.
- the composite elastic modulus of the base material layer is within the above range, the surface hardness of the surface of the laminated body on the hard coat film side can be increased, and the scratch resistance can be improved.
- the composite elastic modulus of the substrate layer is preferably, for example, 40 GPa or less, preferably 30 GPa or less. Is more preferable, and 20 GPa or less is further preferable.
- the composite elastic modulus of the base material layer is, for example, preferably 5.7 GPa or more and 40 GPa or less, more preferably 6.5 GPa or more and 30 GPa or less, and further preferably 7.5 GPa or more and 20 GPa or less.
- the method for measuring the composite elastic modulus of the base material layer can be the same as the method for measuring the composite elastic modulus of the joint layer described above.
- the composite elastic modulus of the base material layer can be adjusted, for example, by the type and composition of the material contained in the base material layer.
- the base material layer preferably has transparency.
- the total light transmittance of the base material layer is preferably 80% or more, more preferably 85% or more, and further preferably 88% or more.
- the haze of the base material layer is preferably, for example, 2% or less, more preferably 1.5% or less, and further preferably 1% or less.
- (B) Material of base material layer As the base material layer, for example, a resin base material can be used.
- the resin constituting the resin base material preferably satisfies the above-mentioned composite elastic modulus and has transparency.
- resins include polyimide resins, polyamide resins, polyester resins, cellulose resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins and the like.
- polyimide-based resin include polyimide, polyamide-imide, polyetherimide, polyesterimide and the like.
- the polyester resin include polyethylene terephthalate (PET), polypropylene terephthalate, polybutylene terephthalate, polyethylene naphthalate (PEN) and the like.
- the cellulosic resin examples include triacetyl cellulose (TAC) and the like.
- the acrylic resin examples include methyl poly (meth) acrylate and ethyl poly (meth) acrylate.
- the resin base material may be a single layer or a multilayer such as a coextruded film. Among them, a polyimide resin is preferable because it has bending resistance, excellent hardness and transparency.
- the polyimide-based resin is not particularly limited as long as it satisfies the above-mentioned composite elastic modulus and has transparency, but among the above, polyimide and polyamide-imide are preferably used.
- Polyimide is obtained by reacting a tetracarboxylic acid component with a diamine component.
- the polyimide is not particularly limited as long as it satisfies the above-mentioned composite elastic modulus and has transparency, but for example, from the viewpoint of having excellent transparency and excellent rigidity, the following general formula (1) It is preferable to have at least one structure selected from the group consisting of the structures represented by the following general formula (3).
- R 5 is a tetravalent group which is a tetracarboxylic acid residue
- R 6 is a trans-cyclohexanediamine residue, trans-1,4-bismethylenecyclohexanediamine residue, 4,4.
- .. n represents the number of repeating units and is 1 or more.
- R 7 and R 8 independently represent a hydrogen atom, an alkyl group, or a perfluoroalkyl group, respectively.
- R 9 is a cyclohexanetetracarboxylic acid residue, a cyclopentanetetracarboxylic acid residue, a dicyclohexane-3,4,3', 4'-tetracarboxylic acid residue, and 4,4'.
- -At least one tetravalent group selected from the group consisting of (hexafluoroisopropyridene) diphthalic acid residues R10 represents a divalent group which is a diamine residue.
- n' represents the number of repeating units and is 1 or more.
- tetracarboxylic acid residue refers to a residue obtained by removing four carboxyl groups from the tetracarboxylic acid, and has the same structure as the residue obtained by removing the acid dianhydride structure from the tetracarboxylic acid dianhydride. show.
- diamine residue means a residue obtained by removing two amino groups from a diamine.
- R5 is a tetracarboxylic acid residue, and can be a residue obtained by removing the acid dianhydride structure from the tetracarboxylic acid dianhydride.
- examples of the tetracarboxylic acid dianhydride include those described in International Publication No. 2018/070523.
- the R5 in the above general formula (1) includes 4,4'-(hexafluoroisopropyridene) diphthalic acid residues, 3,3', 4 from the viewpoint of improving transparency and rigidity.
- R5 it is preferable to contain 50 mol% or more, more preferably 70 mol% or more, and further preferably 90 mol% or more of these suitable residues in total.
- R5 is composed of a group consisting of 3,3', 4,4' - biphenyltetracarboxylic acid residues, 3,3', 4,4'-benzophenone tetracarboxylic acid residues, and pyromellitic acid residues.
- the content ratio of the tetracarboxylic acid residue group (group A) suitable for improving the rigidity and the tetracarboxylic acid residue group (group B) suitable for improving the transparency is , 1 mol of tetracarboxylic acid residue group (group B) suitable for improving transparency, 0.05 mol of tetracarboxylic acid residue group (group A) suitable for improving rigidity. It is preferably 9 mol or more, more preferably 0.1 mol or more and 5 mol or less, and further preferably 0.3 mol or more and 4 mol or less.
- the R6 in the above general formula ( 1 ) includes 4,4'-diaminodiphenyl sulfone residues, 3,4'-diaminodiphenyl sulfone residues, among others, from the viewpoint of improving transparency and rigidity. And at least one divalent group selected from the group consisting of the divalent group represented by the above general formula (2) is preferable, and further, 4,4'-diaminodiphenyl sulfone residue, 3, At least one divalent group selected from the group consisting of a 4'-diaminodiphenyl sulfone residue and a divalent group represented by the above general formula (2) in which R7 and R8 are perfluoroalkyl groups. It is preferably a group.
- the R9 in the above general formula (3) includes 4,4'-(hexafluoroisopropyridene) diphthalic acid residues, 3,3', 4 from the viewpoint of improving transparency and rigidity. , 4'-Diphenylsulfone tetracarboxylic acid residues, and oxydiphthalic acid residues are preferred.
- these suitable residues are preferably contained in an amount of 50 mol% or more, more preferably 70 mol% or more, still more preferably 90 mol% or more.
- R 10 in the above general formula (3) is a diamine residue, and can be a residue obtained by removing two amino groups from a diamine.
- the diamine include those described in International Publication No. 2018/070523.
- R10s in the above general formula (3) 2,2'-bis (trifluoromethyl) benzidine residue and bis [4- (4- (4- (4- (4- (4- (4-) Aminophenoxy) phenyl] sulfone residue, 4,4'-diaminodiphenyl sulfone residue, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane residue, bis [4- (3-amino) Phenoxy) phenyl] sulfone residue, 4,4'-diamino-2,2'-bis (trifluoromethyl) diphenyl ether residue, 1,4-bis [4-amino-2- (trifluoromethyl) phenoxy] benzene Resi
- It preferably contains a divalent group of species, in addition a 2,2'-bis (trifluoromethyl) benzidine residue, a bis [4- (4-aminophenoxy) phenyl] sulfone residue, and a 4,4'. -Preferably contains at least one divalent group selected from the group consisting of diaminodiphenyl sulfone residues.
- R 10 it is preferable that these suitable residues are contained in a total amount of 50 mol% or more, further preferably 70 mol% or more, and further preferably 90 mol% or more.
- R 10 a bis [4- (4-aminophenoxy) phenyl] sulfone residue, a 4,4'-diaminobenzanilide residue, an N, N'-bis (4-aminophenyl) terephthalamide residue,
- a group of diamine residues suitable for improving rigidity such as at least one selected from the group consisting of paraphenylenediamine residues, metaphenylenediamine residues, and 4,4'-diaminodiphenylmethane residues.
- the content ratio of the diamine residue group (group C) suitable for improving the rigidity and the diamine residue group (group D) suitable for improving the transparency determines the transparency.
- the diamine residue group (group C) suitable for improving rigidity should be 0.05 mol or more and 9 mol or less with respect to 1 mol of the diamine residue group (group D) suitable for improvement. It is preferable, more preferably 0.1 mol or more and 5 mol or less, and more preferably 0.3 mol or more and 4 mol or less.
- n and n'independently represent the number of repeating units and are 1 or more.
- the number of repeating units n in the polyimide may be appropriately selected depending on the structure, and is not particularly limited.
- the average number of repeating units can be, for example, 10 or more and 2000 or less, and preferably 15 or more and 1000 or less.
- the polyimide may contain a polyamide structure as a part thereof.
- the polyamide structure examples include a polyamide-imide structure containing a tricarboxylic acid residue such as trimellitic acid anhydride and a polyamide structure containing a dicarboxylic acid residue such as terephthalic acid.
- the tetravalent group which is a tetracarboxylic acid residue of R 5 and R 9 and the divalent group which is a diamine residue of R 6 and R 10 At least one of the groups contains an aromatic ring, and (i) a fluorine atom, (ii) an aliphatic ring, and (iii) an aromatic ring may be substituted with a sulfonyl group or fluorine. It is preferable to include at least one selected from the group consisting of the structures concatenated with.
- the polyimide contains at least one selected from a tetracarboxylic acid residue having an aromatic ring and a diamine residue having an aromatic ring
- the molecular skeleton becomes rigid, the orientation is enhanced, and the surface hardness is improved, but the polyimide is rigid.
- the aromatic ring skeleton tends to have an absorption wavelength extending to a long wavelength, and the transmittance in the visible light region tends to decrease.
- the polyimide contains (i) a fluorine atom, the transparency is improved in that the electronic state in the polyimide skeleton can be made difficult to transfer charge.
- the polyimide contains (ii) an aliphatic ring
- transparency is improved in that the transfer of charges in the skeleton can be inhibited by breaking the conjugation of ⁇ electrons in the polyimide skeleton.
- the polyimide contains a structure in which (iii) aromatic rings are linked to each other with a sulfonyl group or an alkylene group which may be substituted with fluorine, the ⁇ electron in the polyimide skeleton is cut off from the conjugation of the charge in the skeleton. Transparency is improved in that it can inhibit movement.
- a tetravalent group which is a tetracarboxylic acid residue of R 5 and R 9 and a diamine residue of R 6 and R 10 are 2 from the viewpoint of improving transparency and surface hardness. It is preferable that at least one of the valent groups contains an aromatic ring and a fluorine atom, and the divalent group which is a diamine residue of R 6 and R 10 contains an aromatic ring and a fluorine atom. preferable.
- polyimide examples include those having a specific structure described in International Publication No. 2018/070523.
- Polyimide can be synthesized by a known method. Further, as the polyimide, a commercially available one may be used. Examples of commercially available polyimide products include Neoprim (registered trademark) manufactured by Mitsubishi Gas Chemical Company, Inc.
- the weight average molecular weight of the polyimide is, for example, preferably 3,000 or more and 500,000 or less, more preferably 5,000 or more and 300,000 or less, and further preferably 10,000 or more and 200,000 or less. If the weight average molecular weight is too small, sufficient strength may not be obtained, and if the weight average molecular weight is too large, the viscosity increases and the solubility decreases, resulting in a substrate layer having a smooth surface and a uniform thickness. It may not be obtained.
- the weight average molecular weight of polyimide can be measured by gel permeation chromatography (GPC). Specifically, polyimide is used as an N-methylpyrrolidone (NMP) solution having a concentration of 0.1% by mass, and a 30 mmol% LiBr-NMP solution having a water content of 500 ppm or less is used as a developing solvent. 8120, column used: GPC LF-804 manufactured by SHODEX), measurement is performed under the conditions of a sample injection amount of 50 ⁇ L, a solvent flow rate of 0.4 mL / min, and 37 ° C. The weight average molecular weight is determined based on a polystyrene standard sample having the same concentration as the sample.
- the polyamide-imide is not particularly limited as long as it satisfies the above-mentioned composite elastic coefficient and has transparency, and includes, for example, a structural unit derived from dianhydride and a structural unit derived from diamine. Examples thereof include those having a first block and a second block containing a structural unit derived from an aromatic dicarbonyl compound and a structural unit derived from an aromatic diamine.
- the dianhydride can include, for example, biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA).
- the diamine can contain bistrifluoromethylbenzidine (TFDB). That is, the above-mentioned polyamide-imide includes a first block in which a monomer containing dianhydride and a diamine is copolymerized, and a second block in which a monomer containing an aromatic dicarbonyl compound and an aromatic diamine is copolymerized. It has a structure in which the polyamide-imide precursor to have is imidized. Since the polyamide-imide has a first block containing an imide bond and a second block containing an amide bond, the polyamide-imide is excellent not only in optical properties but also in thermal and mechanical properties.
- TFDB bistrifluoromethylbenzidine
- TFDB bistrifluoromethylbenzidine
- BPDA biphenyltetracarboxylic acid dianhydride
- the dianhydrides forming the first block contain two types of dianhydrides, namely 6FDA and BPDA.
- the first block may contain a polymer to which TFDB and 6FDA are bound and a polymer to which TFDB and BPDA are bound, respectively, separately based on different repeating units, and may be contained within the same repeating unit. It may be regularly arranged in, or it may be completely randomly arranged and included.
- BPDA and 6FDA are contained as dianhydrides in a molar ratio of 1: 3 to 3: 1. This is because not only the optical characteristics can be ensured, but also the mechanical characteristics and the deterioration of heat resistance can be suppressed, and excellent birefringence can be obtained.
- the molar ratio of the first block and the second block is preferably 5: 1 to 1: 1. If the content of the second block is extremely low, the effect of the second block on improving thermal stability and mechanical properties may not be sufficiently obtained. Further, when the content of the second block is higher than the content of the first block, the thermal stability and the mechanical properties can be improved, but the optical properties such as the decrease in yellowness and the transmittance are deteriorated. , The birefringence characteristic may also be enhanced.
- the first block and the second block may be random copolymers or block copolymers. The repeating unit of the block is not particularly limited.
- aromatic dicarbonyl compound forming the second block examples include terephthaloyl chloride (TPC), terephthalic acid, isophthaloyl dichloride and 4,4.
- TPC terephthaloyl chloride
- terephthalic acid terephthalic acid
- isophthaloyl dichloride 4,4.
- One or more species selected from the group consisting of'-benzoyl dichloride (4,4'-benzoyl chloride) can be mentioned.
- it may be one or more selected from terephthaloyl chloride (TPC) and isophthaloyl dichloride (Iso-phthaloyl chloride).
- diamine forming the second block examples include 2,2-bis (4- (4-aminophenoxy) phenyl) hexafluoropropane (HFBAPP) and bis (4- (4-aminophenoxy) phenyl) sulfone (BAPS).
- HFBAPP 2,2-bis (4- (4-aminophenoxy) phenyl) hexafluoropropane
- BAPS bis (4- (4-aminophenoxy) phenyl) sulfone
- BASPM Bis (4- (3-aminophenoxy) phenyl) sulfone
- 4DDS 4,4'-diaminodiphenyl sulfone
- 3DDS 3,3'-diaminodiphenyl sulfone
- BAPP 4,4'-diaminodiphenylpropane
- 6HDA 4,4'-diaminodiphenylpropane
- 1,3-bis (4-aminophenoxy) benzene 134APB
- 1,3-bis (3-amino) Phenoxy) Benzene 133APB
- BABP 1,4-bis (4-aminophenoxy) biphenyl
- 6FAPBP 4,4'-bis (4-amino-2-trifluoromethylphenoxy) biphenyl
- DABS 3,3- Diamino-4,4-dihydroxydiphenylsulfone
- DABS 3,3- Diamino-4,4-dihydroxydipheny
- the diamines are bis (4- (3-aminophenoxy) phenyl) sulfone (BASPM), 4,4'-diaminodiphenyl sulfone (4DDS) and 2,2-bis (4- (4-aminophenoxy).
- Phenyl) Hexafluoropropane is more preferably one or more diamines selected.
- the polyamideimide precursor containing the copolymerized first block and the second block in which the aromatic dicarbonyl compound and the aromatic diamine are copolymerized in the molecular structure has a weight average molecular weight of, for example, 200 as measured by GPC. It is preferably 000 or more and 215,000 or less, and the viscosity is preferably, for example, 2400 poise or more and 2600 poise or less.
- Polyamideimide can be obtained by imidizing a polyamide-imide precursor. Further, a polyamide-imide film can be obtained by using polyamide-imide. For a method for imidizing a polyamide-imide precursor and a method for producing a polyamide-imide film, for example, Japanese Patent Laid-Open No. 2018-506611 can be referred to.
- the thickness of the glass substrate in this embodiment is 100 ⁇ m or less, preferably 90 ⁇ m or less, more preferably 80 ⁇ m or less, and further preferably 70 ⁇ m or less.
- the thickness of the glass base material is as thin as the above range, good bending resistance can be obtained and sufficient hardness can be obtained. In addition, curling of the laminated body can be suppressed. Further, it is preferable in terms of weight reduction of the laminated body.
- the thickness of the glass substrate is, for example, preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, still more preferably 20 ⁇ m or more, and particularly preferably 30 ⁇ m or more. When the thickness of the glass base material is within the above range, good impact resistance can be obtained.
- the thickness of the glass substrate is 10 ⁇ m or more and 100 ⁇ m or less, preferably 15 ⁇ m or more and 90 ⁇ m or less, more preferably 20 ⁇ m or more and 80 ⁇ m or less, and further preferably 25 ⁇ m or more and 75 ⁇ m or less.
- the ratio of the thickness of the glass base material to the total thickness of the laminate is preferably, for example, 30% or more, more preferably 40% or more, still more preferably 50% or more.
- the thickness of the glass base material can be made relatively thick, and the texture and tactile sensation of the glass due to the glass base material can be maintained.
- the ratio of the thickness of the glass base material to the total thickness of the laminate is preferably, for example, 90% or less, more preferably 80% or less, still more preferably 70% or less.
- the thickness of the hard coat film can be made relatively thick, and the impact resistance can be improved.
- the ratio of the thickness of the glass substrate to the total thickness of the laminate is preferably, for example, 30% or more and 90% or less, more preferably 40% or more and 80% or less, and further preferably 50% or more and 70% or less. Is.
- the glass constituting the glass base material is not particularly limited, but it is particularly preferable that it is chemically tempered glass.
- Chemically tempered glass has excellent mechanical strength and is preferable in that it can be made thinner accordingly.
- Chemically tempered glass is typically glass whose mechanical properties have been strengthened by a chemical method by partially exchanging ionic species such as replacing sodium with potassium near the surface of the glass. It has a compressive stress layer.
- the glass constituting the chemically strengthened glass base material examples include aluminosilicate glass, soda lime glass, borosilicate glass, lead glass, alkaline barium glass, and aluminohousilicate glass.
- the chemically strengthened glass substrate may be made of crystallized glass.
- Examples of commercially available chemically strengthened glass base materials include Gorilla Glass from Corning, Dragontrail from AGC, and chemically strengthened glass from Shot.
- Functional layer The laminate in this embodiment is formed on the opposite side of the hard coat layer from the base material layer, between the hard coat layer and the base material layer, between the base material layer and the bonding layer, and bonded to the glass base material. Further functional layers can be provided between the layers or on the side opposite to the bonding layer of the glass substrate.
- the functional layer may be a single layer or may have a plurality of layers. Further, the functional layer may be a layer having a single function, or may have a plurality of layers having different functions from each other.
- Examples of the functional layer arranged on the surface side opposite to the base material layer of the hard coat layer include an antireflection layer, an antiglare layer, a protective layer and the like. Further, examples of the functional layer arranged between the hard coat layer and the base material layer include a primer layer, a shatterproof layer, and a shock absorbing layer. Examples of the functional layer arranged between the base material layer and the bonding layer include a decorative layer, a primer layer, a toning layer, a shatterproof layer, and a shock absorbing layer. Further, examples of the functional layer arranged between the glass base material and the bonding layer include electrodes such as ITO, antenna wiring, and the like. Further, examples of the functional layer arranged on the surface side opposite to the bonding layer of the glass substrate include an adhesive layer, a decorative layer, a shock absorbing layer, and the like.
- the laminate in this embodiment may have the antireflection layer 7 on the surface side of the hardcoat layer 6 opposite to the base material layer 5.
- the antireflection layer 7 may be a layer constituting the hard coat film 4, for example, as shown in FIG.
- the antireflection layer may be composed of a single layer or may be composed of multiple layers.
- a general antireflection layer can be applied, for example, a single-layer film containing a material having a lower refractive index than the hard coat layer, or a high refractive index layer and a low refractive index layer from the hard coat layer side.
- the material contained in the single-layer film may be any material having a refractive index lower than that of the hardcoat layer, and examples thereof include magnesium fluoride.
- the refractive index of the low refractive index layer is, for example, preferably 1.45 or less, and more preferably 1.40 or less. By setting the refractive index of the low refractive index layer within the above range, the antireflection property becomes good. Further, the lower limit of the refractive index of the low refractive index layer is practically 1.10 or more.
- Examples of the low refractive index layer include those containing a hydrolyzed polycondensate of metal alkoxide, those containing a low refractive index resin, those containing low refractive index particles, those containing a binder resin and low refractive index particles. And so on.
- the hydrolyzed polycondensate of the metal alkoxide can be obtained, for example, by the sol-gel method.
- Examples of the resin having a low refractive index include fluororesin.
- the low refractive index particles are not particularly limited, and for example, either inorganic or organic particles such as silica and magnesium fluoride can be used. Above all, particles having voids are preferable from the viewpoint of reducing the reflectance of the antireflection layer.
- the particles having voids have fine voids inside and contain air in the voids, so that the refractive index is low. Examples of the particles having voids include porous particles and hollow particles. Of these, hollow particles are preferable.
- Hollow particles refer to particles that have an outer shell layer, the inside of the particles surrounded by the outer shell layer is hollow, and the inside of the particles contains air.
- the outer shell layer of the hollow particles may be an inorganic substance or an organic substance, and examples thereof include those made of metal, metal oxide, resin, silica and the like. Of these, hollow silica particles in which the outer shell layer is silica are preferable. When the outer shell layer is silica, the silica may be in a crystalline, sol-like, or gel-like state.
- the shape of the hollow particles may be a substantially spherical shape such as a true sphere, a spheroid shape, or a polyhedral shape that can be approximated to a sphere, a chain shape, a needle shape, a plate shape, a piece shape, a rod shape, a fibrous shape, or the like. Among them, it is preferably a true sphere and a substantially spherical shape, and more preferably a spheroid or a true sphere.
- the low refractive index particles are preferably surface-treated.
- the surface treatment of the low refractive index particles is preferably a surface treatment using a silane coupling agent. Of these, surface treatment using a silane coupling agent having a (meth) acryloyl group is preferable.
- silane coupling agent preferably used in the surface treatment of low refractive index particles examples include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-.
- the average particle size of the low refractive index particles is, for example, preferably 5 nm or more and 200 nm or less, and more preferably 10 nm or more and 150 nm or less.
- the average particle diameter is, for example, preferably 5 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, and further preferably 50 nm or more and 110 nm or less. ..
- the average particle size is in the above range, the thickness of the low refractive index layer can be easily made uniform.
- the average particle diameter is set to 5 nm or more, it is possible to easily suppress the aggregation of particles, and in the case of hollow particles, it is possible to sufficiently reduce the refractive index of the low refractive index layer. Further, by setting the average particle diameter to 200 nm or less, it is possible to easily suppress the deterioration of visibility due to whitening due to the diffusion of particles.
- the average particle diameter of the low refractive index particles and the high refractive index particles described later can be calculated by the following operations (1) to (3).
- the cross section of the antireflection layer is imaged by TEM or STEM.
- the acceleration voltage of TEM or STEM is preferably, for example, 10 kv or more and 30 kV or less, and the magnification is preferably, for example, 50,000 times or more and 300,000 times or less.
- Arbitrary 10 particles are extracted from the observation image, and the particle diameter of each particle is calculated. The particle diameter is measured as the distance between straight lines in a combination of two straight lines such that the distance between the two straight lines is maximized when the cross section of the particle is sandwiched between two arbitrary parallel straight lines.
- (3) The same operation is performed 5 times on the observation image on another screen of the same sample, and the value obtained from the number average of a total of 50 particles is taken as the average particle diameter of the particles.
- the content of the low refractive index particles shall be 20 parts by mass or more and 250 parts by mass or less with respect to 100 parts by mass of the binder resin of the low refractive index layer. Is more preferable, and it is more preferably 30 parts by mass or more and 230 parts by mass or less, and further preferably 40 parts by mass or more and 200 parts by mass or less.
- the content of the low refractive index particles is within the above range, the balance between the antireflection property and the scratch resistance can be improved.
- the ratio of the hollow particles to the total amount of the low refractive index particles contained in the low refractive index layer is preferably 40% by mass or more, more preferably 50% by mass or more.
- binder resin contained in the low refractive index layer examples include a cured product of a curable resin composition.
- the curable resin composition the same one as exemplified for the hard coat layer can be used, and a photocurable resin composition is suitable.
- the curable resin composition forming the binder resin preferably contains a fluorine-containing oligomer having a photocurable functional group and / or a fluorine-containing compound such as a monomer.
- a fluorine-containing oligomer having a photocurable functional group and / or a fluorine-containing compound such as a monomer By containing the fluorine compound, the refractive index of the low refractive index layer can be easily lowered, and the low refractive index layer can be imparted with antifouling property and slipperiness.
- the thickness of the low refractive index layer is preferably about 1/4 of the wavelength range of visible light (around 100 nm), for example, it is preferably 80 nm or more and 120 nm or less, and 85 nm or more and 110 nm or less. More preferably, it is more preferably 90 nm or more and 105 nm.
- Examples of the method for forming the low refractive index layer include a wet method and a dry method.
- a wet method a method of forming by a sol-gel method using a metal alkoxide or the like, a method of applying a resin having a low refractive index to form the method, and a composition for a low refractive index layer containing a binder resin and low refractive index particles are applied.
- Examples of the dry method include a method of forming by a physical vapor deposition method or a chemical vapor deposition method using low refractive index particles. The wet method is excellent in terms of production efficiency, and among them, a method of applying a composition for a low refractive index layer containing a binder resin and low refractive index particles is preferable.
- the refractive index of the high refractive index layer is, for example, preferably 1.55 or more and 1.85 or less, and more preferably 1.56 or more and 1.70 or less.
- the refractive index of the high refractive index layer is practically 1.85 or less.
- Examples of the high refractive index layer include those containing a binder resin and high refractive index particles.
- high refractive index particles examples include antimony pentoxide, zinc oxide, titanium oxide, cerium oxide, tin-doped indium oxide, antimonated tin oxide, yttrium oxide and zirconium oxide.
- the average particle size of the high-refractive index particles is, for example, preferably 5 nm or more and 200 nm or less, more preferably 5 nm or more and 100 nm or less, and further preferably 10 nm or more and 80 nm or less.
- the average particle size is, for example, preferably 5 nm or more and 200 nm or less, more preferably 5 nm or more and 100 nm or less, and further preferably 10 nm or more and 80 nm or less.
- the content of the high refractive index particles is preferably 50 parts by mass or more and 500 parts by mass or less with respect to 100 parts by mass of the binder resin from the viewpoint of increasing the refractive index of the coating film and balancing the strength of the coating film. It is more preferably 2 parts by mass or more and 450 parts by mass or less, and further preferably 200 parts by mass or more and 430 parts by mass or less.
- binder resin contained in the high refractive index layer examples include a cured product of a curable resin composition.
- the curable resin composition the same one as exemplified for the hard coat layer can be used, and a photocurable resin composition is suitable.
- the thickness of the high refractive index layer is preferably, for example, 200 nm or less, more preferably 50 nm or more and 180 nm or less, and further preferably 90 nm or more and 160 nm or less.
- Examples of the method for forming the high refractive index layer include a method of applying a composition for a high refractive index layer containing a binder resin and high refractive index particles.
- the thickness of the antireflection layer can be the same as the thickness of a general antireflection layer, and is appropriately selected according to the layer structure of the antireflection layer.
- Examples of the method for forming the antireflection layer include a coating method and a vapor deposition method, which are appropriately selected depending on the material of the antireflection layer and the like.
- the second bonding layer 10 may be arranged on the surface side of the glass substrate 2 opposite to the bonding layer 3. ..
- the second joining layer is a layer for joining the laminated body and other members. Examples of other members include display panels in display devices described later.
- the second bonding layer is usually arranged on the outermost surface of the laminated body.
- the bonding layer arranged between the glass substrate and the substrate layer is simply referred to as a "bonding layer", and the surface opposite to the bonding layer of the glass substrate.
- the bonding layer arranged in is referred to as a "second bonding layer”.
- one of the impact fractures of the glass substrate is bending fracture.
- Bending fracture is a phenomenon in which the glass base material bends due to the impact received by the glass base material, and the glass base material breaks when the amount of bending reaches the limit.
- the glass substrate When an impact is applied to the surface of the glass substrate instantaneously and locally, the glass substrate is deformed instantaneously and locally, and tensile stress is generated instantaneously and locally on the back surface of the glass substrate, resulting in the glass substrate.
- the back surface of the material cannot withstand the above tensile stress and cracks or breaks occur.
- the inventors of the present disclosure have a laminated body having a glass base material, a bonding layer, and a hard coat film in this order, in which the laminated body has a second bonding layer on the surface side opposite to the bonding layer of the glass substrate. Furthermore, the impact resistance and bending resistance when having it were investigated diligently. Since the second bonding layer is usually softer than the glass substrate, the substrate layer and the hard coat layer, it is easily deformed by an impact. Therefore, if the degree of deformation of the second bonding layer is large when an impact is applied to the laminated body, it is considered that momentary and local deformation is likely to occur in the glass substrate. In this case, bending fracture is likely to occur in the glass substrate, and there is a concern that the impact resistance may be lowered.
- the impact resistance greatly changes depending on the hardness, thickness, and the like of the second bonding layer. It has been found. Further, even when the laminate further has the second bonding layer on the surface side opposite to the bonding layer of the glass substrate, the second bonding layer has a thickness ( ⁇ m).
- the ratio of the storage elastic modulus (MPa) of the bonded layer at 20 ° C. is within a predetermined range, bending fracture of the glass substrate is suppressed and good bending resistance is obtained without impairing impact resistance. I found that I could do it.
- the ratio of the storage elastic modulus (MPa) of the second bonding layer at 20 ° C. to the thickness ( ⁇ m) of the second bonding layer is preferably 0.001 or more and 0.4 or less, for example. It is more preferably 0.002 or more and 0.35 or less, further preferably 0.003 or more and 0.3 or less, and particularly preferably 0.004 or more and 0.2 or less.
- MPa storage elastic modulus
- the second bonding layer is usually softer than the glass substrate and the substrate layer and the hard coat layer of the hard coat film, it is easily deformed by an impact, and the thickness of the second bonding layer is increased. The thicker it is, the greater the degree of deformation due to impact tends to be.
- the ratio of the storage elastic modulus to the thickness of the second joint layer is too small, the thickness of the second joint layer becomes relatively thick, and the impact resistance may decrease. Further, when the ratio of the storage elastic modulus to the thickness of the second joint layer becomes large, the effect of improving the impact resistance is saturated. Further, if the ratio of the storage elastic modulus to the thickness of the second joint layer is too large, the thickness of the second joint layer is relatively thin and the storage elastic modulus of the second joint layer is relatively thin. It may become large and the bending resistance may decrease.
- the glass transition temperature and the composite elastic coefficient of the bonded layer can be easily adjusted within a preferable range, and the impact resistance can be improved. Therefore, in such a case, when the second joint layer is further arranged, the ratio of the storage elastic modulus to the thickness of the second joint layer is in the above range so that the impact resistance is not impaired. It is preferably inside.
- the thickness of the second bonding layer is not particularly limited as long as it satisfies the ratio of the storage elastic modulus to the thickness of the second bonding layer, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, and is preferably 10 ⁇ m or more. It is more preferably 50 ⁇ m or less, and further preferably 15 ⁇ m or more and 50 ⁇ m or less.
- the thickness of the second bonding layer is equal to or greater than a predetermined value, the adhesiveness is good. Above all, when the thickness of the second bonding layer is 15 ⁇ m or more, the adhesiveness is good, so that the bending resistance, particularly the dynamic bending property can be improved.
- the second bonding layer is usually softer than the glass substrate and the substrate layer and the hard coat layer of the hard coat film, it is easily deformed by impact and the thickness of the second bonding layer is high. The thicker it is, the greater the degree of deformation due to impact tends to be. Therefore, when the thickness of the second bonding layer is not more than a predetermined value, it is possible to suppress the decrease in impact resistance due to the second bonding layer. Above all, when the thickness of the second bonding layer is 50 ⁇ m or less, good impact resistance can be obtained.
- the storage elastic modulus of the second bonding layer at 20 ° C. is not particularly limited as long as it satisfies the ratio of the storage elastic modulus to the thickness of the second bonding layer, but is, for example, 0.10 MPa or more and 10 MPa or less. It is more preferable, it is more preferably 0.10 MPa or more and 5 MPa or less, and further preferably 0.10 MPa or more and 3 MPa or less.
- the storage elastic modulus of the second joint layer is at least a predetermined value and has a certain degree of hardness, good impact resistance can be maintained. Further, when the storage elastic modulus of the second joint layer is not more than a predetermined value, the bending resistance, particularly the dynamic bending property can be improved.
- the storage elastic modulus E'at 20 ° C. of the second joint layer is a value measured by a dynamic viscoelasticity measuring device (DMA).
- DMA dynamic viscoelasticity measuring device
- the solution is prepared by melting, the solution is applied onto the substrate, dried, and then the film is peeled off from the substrate to obtain a test piece of the second bonding layer.
- the solvent is appropriately selected depending on the material of the second bonding layer, and examples thereof include ethyl acetate.
- a Naflon (registered trademark) sheet 300 mm ⁇ 300 mm ⁇ 1 mm thickness
- Nichias Corporation a Naflon (registered trademark) sheet (300 mm ⁇ 300 mm ⁇ 1 mm thickness) manufactured by Nichias Corporation can be used.
- a columnar shape having a diameter of 5 mm and a height of about 5 mm is formed.
- the above-mentioned columnar measurement sample is attached between the compression jigs (parallel plate ⁇ 8 mm) of the dynamic viscoelasticity measuring device.
- a compressive load is applied, a longitudinal vibration with a frequency of 1 Hz is applied, a dynamic viscoelastic modulus is measured in the range of -50 ° C or higher and 200 ° C or lower, and the storage elastic modulus E of the second bonding layer at each temperature is E. 'Measure.
- the dynamic viscoelasticity measuring device for example, RSAIII manufactured by TA Instruments can be used. The specific measurement conditions in the above method are shown below.
- Measurement conditions for storage elastic modulus E' ⁇ Measurement sample: ⁇ 5 mm ⁇ height 5 mm columnar ⁇ Measurement jig: compression (parallel plate) -Measurement mode: Temperature dependence (Temperature range: -50 ° C to 200 ° C, temperature rise rate: 5 ° C / min) ⁇ Frequency: 1Hz
- the storage elastic modulus of the second joint layer can be adjusted, for example, by the type and composition of the material contained in the second joint layer.
- an optically transparent pressure-sensitive adhesive is used for the second bonding layer
- a known method for adjusting the elastic modulus can be used as a method for adjusting the storage elastic modulus of the pressure-sensitive adhesive, for example, the cross-linking density.
- the elastic modulus can be adjusted by the type of the functional group-containing monomer and the like. For example, as the crosslink density increases, the storage elastic modulus tends to increase.
- the glass transition temperature of the second bonding layer is, for example, preferably ⁇ 50 ° C. or higher and 30 ° C. or lower, more preferably ⁇ 50 ° C. or higher and 25 ° C. or lower, and ⁇ 50 ° C. or higher and 0 ° C. or lower. More preferably, it is more preferably ⁇ 45 ° C. or higher and ⁇ 5 ° C. or lower, and more preferably ⁇ 40 ° C. or higher and ⁇ 5 ° C. or lower.
- the glass transition temperature of the second bonding layer is in the above range, it becomes easy to obtain a second bonding layer satisfying the above-mentioned storage elastic modulus. Further, when the glass transition temperature of the second bonding layer is ⁇ 40 ° C. or higher, the low temperature flexibility can be improved. Further, when the glass transition temperature of the second bonding layer is 25 ° C. or lower, the room temperature flexibility can be improved.
- the method for measuring the glass transition temperature of the second bonding layer can be the same as the method for measuring the glass transition temperature of the bonding layer.
- the thickness ( ⁇ m) of the second bonding layer is T 1
- the storage elastic modulus (MPa) of the second bonding layer at 20 ° C. is E'1
- the thickness of the glass substrate ( ⁇ m) is T 2 .
- the left side of the above formula (4) is preferably 0.1 or more and 30 or less.
- the second bonding layer has transparency.
- the total light transmittance of the second bonding layer is preferably 80% or more, more preferably 85% or more, and further preferably 88% or more.
- the haze of the second bonding layer is preferably, for example, 2% or less, more preferably 1.5% or less, and further preferably 1% or less.
- the material used for the second bonding layer is preferably a material that satisfies the ratio of the storage elastic modulus to the thickness of the second bonding layer described above, and for example, an optical transparent pressure-sensitive adhesive (OCA) is used. Can be mentioned.
- OCA optical transparent pressure-sensitive adhesive
- optical transparent adhesive examples include acrylic adhesives, urethane adhesives, silicone adhesives, epoxy adhesives, vinyl acetate adhesives and the like. Among them, an acrylic pressure-sensitive adhesive is preferable from the viewpoint of bending resistance, adhesion, and transparency. Further, as the optical transparent adhesive, a commercially available product can also be used.
- a method of arranging the second bonding layer for example, a method of applying an adhesive on a glass substrate or a film-shaped second bonding layer is used, and the second bonding layer is bonded onto the glass substrate.
- the method can be mentioned.
- the glass base material 2 side is on the side opposite to the joint layer 3 of the glass base material 2. Therefore, the third bonding layer 8 and the second base material layer 9 may be arranged.
- the bonding layer arranged between the glass substrate and the substrate layer is simply referred to as a "bonding layer”, and the glass substrate and the second substrate layer are referred to.
- the bonding layer arranged between them is referred to as a "third bonding layer”. Further, the third bonding layer is not included in the second bonding layer.
- the inventors of the present disclosure have diligently studied the cracking and breaking of the glass substrate due to the impact, and when the surface of the glass substrate is momentarily and locally impacted, the glass substrate is momentarily and locally subjected to the impact. It was newly found that the back surface of the glass substrate was deformed to cause momentary and local tensile stress, and the back surface of the glass substrate could not withstand the above tensile stress and cracked or broken.
- the second base material layer is arranged on the surface (back surface) opposite to the bonding layer of the glass substrate via the third bonding layer, the surface of the laminate on the hardcourt film side. It is possible to suppress the momentary and local deformation of the glass base material due to the impact from the glass base material, and it is possible to suppress the momentary and local generation of tensile stress on the back surface of the glass base material. Therefore, it is possible to improve the impact resistance.
- the second base material layer in the present embodiment is arranged on the surface side opposite to the joint layer of the glass base material via the third joint layer, and is a glass base material due to impact. It is a layer for suppressing the momentary and local deformation of.
- the laminate in the present embodiment is arranged, for example, on the observer side of the display panel of the display device, the laminate is arranged so that the surface on the second base material layer side faces the display panel.
- the laminate in the present embodiment is arranged on the surface of the resin molded product, for example, the laminate is arranged so that the surface on the second base material layer side faces the resin molded product.
- the composite elastic modulus of the second base material layer is, for example, preferably 7.0 GPa or more, more preferably 7.3 GPa or more, and further preferably 7.5 GPa or more. ..
- the composite elastic modulus of the second base material layer is within the above range, it is possible to suppress momentary and local deformation of the glass base material due to impact, and to suppress cracking of the glass base material due to impact. Impact resistance can be improved.
- the composite elastic modulus of the second base material layer may be, for example, 100 GPa or less, 90 GPa or less, or 80 GPa or less.
- the composite elastic modulus of the second base material layer is, for example, preferably 7.0 GPa or more and 100 GPa or less, more preferably 7.3 GPa or more and 90 GPa or less, and further preferably 7.5 GPa or more and 80 GPa or less. preferable.
- the method for measuring the composite elastic modulus of the second base material layer can be the same as the method for measuring the composite elastic modulus of the bonded layer described above.
- the composite elastic modulus of the second base material layer can be adjusted, for example, depending on the type and composition of the material contained in the second base material layer.
- the second base material layer has transparency.
- the total light transmittance of the second base material layer is preferably 80% or more, more preferably 85% or more, and further preferably 88% or more.
- the haze of the second base material layer is preferably, for example, 2% or less, more preferably 1.5% or less, and further preferably 1% or less.
- the thickness of the second base material layer is not particularly limited as long as it can suppress momentary and local deformation of the glass base material due to impact, and is, for example, 25 ⁇ m or more. Is more preferable, and it is more preferably 27 ⁇ m or more, and further preferably 29 ⁇ m or more. The thicker the second base material layer, the better the impact resistance. On the other hand, the thickness of the second base material layer is preferably not more than or equal to the thickness of the glass base material, for example, preferably 100 ⁇ m or less, more preferably 90 ⁇ m or less, and 80 ⁇ m or less. Is even more preferable. If the thickness of the second base material layer is too thick, the bending resistance may decrease.
- the thickness of the second base material layer is, for example, preferably 25 ⁇ m or more and 100 ⁇ m or less, more preferably 27 ⁇ m or more and 90 ⁇ m or less, and further preferably 29 ⁇ m or more and 80 ⁇ m or less.
- the second base material layer is not particularly limited as long as it satisfies the above-mentioned composite elastic modulus, and examples thereof include a glass layer and a resin layer containing a polyimide resin or an aramid resin. Above all, the second base material layer is preferably a glass layer. Since the glass layer usually has a higher composite elastic modulus than the resin layer, the impact resistance can be improved.
- the glass constituting the glass layer can be the same as the glass constituting the above-mentioned glass base material.
- the resin contained in the resin layer examples include a polyimide resin and an aramid resin.
- the polyimide-based resin is not particularly limited as long as it satisfies the above-mentioned composite elastic modulus, and examples thereof include polyimide and polyamide-imide.
- examples thereof include polyimide and polyamide-imide.
- the polyimide and the polyamide-imide when the above-mentioned base material layer is a resin base material, the same can be applied to the polyimide and the polyamide-imide contained in the resin base material.
- the aramid resin is not particularly limited as long as it satisfies the above-mentioned composite elastic modulus.
- the resin layer can further contain additives, if necessary.
- Additives include, for example, UV absorbers, light stabilizers, antioxidants, inorganic particles, silica fillers for smooth winding, surfactants to improve film formation and defoaming properties, and adhesion improvement. Agents and the like can be mentioned.
- a method of arranging the second base material layer for example, a method of laminating the second base material layer on the surface side opposite to the joint layer of the glass base material via the third joint layer can be mentioned.
- the third bonding layer in the present embodiment is arranged between the glass base material and the second base material layer, and joins the glass base material and the second base material layer. It is a layer for.
- the thickness of the third bonding layer is preferably thinner than the thickness of the glass substrate, for example, preferably less than 100 ⁇ m, more preferably 50 ⁇ m or less, and further preferably 25 ⁇ m or less. If the thickness of the third joint layer is too thick, the bending resistance may be impaired. Further, since the third bonding layer is usually softer than the glass substrate and the second substrate layer, it is easily deformed by impact, and the thicker the thickness of the third bonding layer, the more the degree of deformation due to impact. Tends to increase. Therefore, if the thickness of the third bonding layer is too thick, the degree of deformation of the third bonding layer becomes large when an impact is applied to the laminated body, so that the glass substrate is instantaneously and locally formed.
- the thickness of the third bonding layer is, for example, preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, and further preferably 5 ⁇ m or more. If the thickness of the third bonding layer is too thin, the adhesiveness may be weakened and the third bonding layer may be peeled off.
- the thickness of the third bonding layer is, for example, preferably 0.5 ⁇ m or more and less than 100 ⁇ m, more preferably 1 ⁇ m or more and 50 ⁇ m or less, and further preferably 5 ⁇ m or more and 25 ⁇ m or less.
- the composite elastic modulus of the third bonding layer is, for example, preferably 1.0 MPa or more, more preferably 2.0 MPa or more, and even more preferably 3.0 MPa or more.
- the composite elastic modulus of the third joint layer is in the above range, and the impact resistance can be enhanced by having a certain degree of hardness. Further, as described above, since the third bonding layer is usually softer than the glass substrate and the second substrate layer, it is easily deformed by an impact, and the smaller the composite elastic modulus of the third bonding layer is, the more easily it is deformed. , The degree of deformation due to impact tends to increase.
- the composite elastic modulus of the third joint layer is, for example, preferably 1.9 GPa or less, more preferably 1.8 GPa or less, and further preferably 1.5 GPa or less.
- the composite elastic modulus of the third bonding layer is within the above range, it is softer than the glass substrate and the second substrate layer, so that it can absorb impact and enhance impact resistance.
- the composite elastic modulus of the third joint layer is, for example, preferably 1.0 MPa or more and 1.9 GPa or less, more preferably 2.0 MPa or more and 1.8 GPa or less, and 3.0 MPa or more and 1.5 GPa or less. Is more preferable.
- the method for measuring the composite elastic modulus of the third joint layer can be the same as the method for measuring the composite elastic modulus of the joint layer described above.
- the composite elastic modulus of the third joint layer can be adjusted, for example, by the type of material contained in the joint layer.
- an optically transparent pressure-sensitive adhesive is used for the third bonding layer
- a known method for adjusting the elastic modulus can be used as a method for adjusting the composite elastic modulus of the pressure-sensitive adhesive, for example, the crosslink density.
- the elastic modulus can be adjusted by the type of the functional group-containing monomer and the like. For example, as the crosslink density increases, the composite elastic modulus tends to increase.
- the third bonding layer has transparency.
- the total light transmittance of the third bonding layer is preferably 80% or more, more preferably 85% or more, and further preferably 88% or more.
- the haze of the third bonding layer is preferably, for example, 2% or less, more preferably 1.5% or less, and further preferably 1% or less.
- the material used for the third bonding layer is not particularly limited as long as it can bond the glass substrate and the second substrate layer, but is a material satisfying the above-mentioned composite elastic modulus and transparency. It is preferable, for example, an optical transparent adhesive (OCA; Optical Clear Adaptive), a curable adhesive and the like can be mentioned.
- OCA optical transparent adhesive
- curable adhesive a curable adhesive and the like
- optical transparent adhesive examples include acrylic adhesives, urethane adhesives, silicone adhesives, epoxy adhesives, vinyl acetate adhesives and the like.
- acrylic pressure-sensitive adhesive is preferable from the viewpoint of bending resistance, adhesion, and transparency.
- the optical transparent pressure-sensitive adhesive preferably satisfies the above-mentioned composite elastic modulus.
- an optical transparent adhesive a commercially available product can be used. Specific examples thereof include “8146-2” manufactured by 3M Corporation, “MO-3018C”, “F619” and “N632” manufactured by Lintec Corporation.
- the curable adhesive can be the same as the curable adhesive used for the above-mentioned bonding layer.
- the protective film may be arranged on the surface side opposite to the bonding layer of the hard coat film.
- the protective film can protect the laminated body and enhance the impact resistance.
- the ratio (A + B) / C of the thickness A of the hard coat layer, the thickness B of the base material layer, and the thickness C of the bonding layer is set to a predetermined value or more.
- the surface hardness of the surface of the laminated body on the hard coat film side can be increased, and the scratch resistance can be improved.
- scratches or dents may occur on the protective film itself, but the hard coat film has high surface hardness, so that it has good scratch resistance.
- the hard coat film may be scratched or dented even when the protective film is arranged. ..
- the laminated body in the present embodiment preferably has transparency when used in a display device.
- the total light transmittance of the laminated body in this embodiment is preferably, for example, 80% or more, more preferably 85% or more, and further preferably 88% or more. Due to the high total light transmittance as described above, a laminated body having good transparency can be obtained.
- the total light transmittance of the laminated body can be measured according to JIS K7361-1, and can be measured by, for example, a haze meter HM150 manufactured by Murakami Color Technology Research Institute.
- the haze of the laminated body in this embodiment is, for example, preferably 2% or less, more preferably 1.5% or less, still more preferably 1% or less. Due to the low haze as described above, a laminated body having good transparency can be obtained.
- the haze of the laminated body can be measured according to JIS K-7136, and can be measured by, for example, a haze meter HM150 manufactured by Murakami Color Technology Research Institute.
- the laminate in this embodiment preferably has bending resistance. Specifically, in the laminated body of the present embodiment, it is preferable that the laminated body does not crack, break, or peel off when the dynamic bending test described below is performed on the laminated body.
- the laminate may be folded so that the glass substrate is on the outside, or the laminate may be folded so that the glass substrate is on the inside. In either case, the laminate may be folded. It is preferable that the body does not crack, break or peel off.
- the dynamic bending test is performed as follows. As shown in FIG. 5A, in the dynamic bending test, first, the short side portion 1C of the laminated body 1 having a size of 20 mm ⁇ 100 mm and the short side portion 1D facing the short side portion 1C are parallel to each other. Each is fixed by the fixing portion 21 arranged in. Further, as shown in FIG. 5A, the fixed portion 21 is slidable in the horizontal direction. Next, as shown in FIG. 5 (b), the fixing portions 21 are moved so as to be close to each other to deform the laminated body 1 so as to be folded, and further, as shown in FIG. 5 (c), the laminated body 1 is deformed.
- the fixed portion 21 After moving the fixed portion 21 to a position where the distance d between the two opposing short side portions 1C and 1D fixed by the fixed portion 21 of the body 1 becomes a predetermined value, the fixed portion 21 is moved in the opposite direction. The deformation of the laminated body 1 is eliminated.
- the laminated body 1 By moving the fixing portion 21 as shown in FIGS. 5A to 5C, the laminated body 1 can be folded by 180 °. Further, by performing a dynamic bending test so that the bent portion 1E of the laminated body 1 does not protrude from the lower end of the fixed portion 21, and controlling the interval d when the fixed portions 21 are closest to each other, the laminated body 1
- the distance d between the two short side portions 1C and 1D facing each other can be set to a predetermined value. For example, when the distance d between the two short side portions 1C and 1D facing each other is 10 mm, the outer diameter of the bent portion 1E is regarded as 10 mm.
- cracking, breaking, or peeling does not occur when the test of folding 180 ° so that the distance d between the opposing short side portions 1C and 1D of the laminated body 1 is 10 mm is repeated 200,000 times. Is preferable, and above all, cracking, breaking, or peeling does not occur when the test of folding 180 ° so that the distance d between the opposing short side portions 1C and 1D of the laminated body 1 is 8 mm is repeated 200,000 times. Is more preferable.
- cracks means a phenomenon in which cracks occur in the laminated body.
- breaking means a phenomenon in which the laminated body is completely split in two.
- peeling refers to a phenomenon in which any of the layers constituting the laminated body is peeled off or floats.
- the opening angle ⁇ after the static bending test of the laminated body is 100 ° or more. It is preferably 130 ° or more, and more preferably 130 ° or more.
- the static bending test is performed as follows. First, as shown in FIG. 6A, the short side portion 1C of the laminated body 1 having a size of 20 mm ⁇ 100 mm and the short side portion 1D facing the short side portion 1C are formed into short sides. Each is fixed by a fixing portion 22 arranged in parallel so that the distance d between the portion 1C and the short side portion 1D is 10 mm. Then, a static bending test is performed in which the laminated body 1 is allowed to stand at 23 ° C. for 240 hours in a folded state. Then, as shown in FIG. 6B, by removing the fixed portion 22 from the short side portion 1D after the static bending test, the folded state is released, and the laminated body 1 naturally opens after 30 minutes at room temperature. The opening angle ⁇ , which is an angle, is measured. The larger the opening angle ⁇ , the better the stability, and the maximum is 180 °.
- the laminate may be folded so that the glass substrate is on the inside, or the laminate may be folded so that the glass substrate is on the outside.
- the angle ⁇ is preferably 100 ° or more, and more preferably 130 ° or more.
- the piercing breaking force is preferably 16 N or more, more preferably 19 N or more, for example. It is more preferably 25 N or more.
- the impact resistance is good.
- the piercing test is performed as follows. First, a PET having a thickness of 100 ⁇ m is interposed on the surface of the laminate on the glass substrate side via an optical transparent adhesive film (OCA) having a thickness of 50 ⁇ m (“8146-2” manufactured by 3M, composite elastic modulus of 9.6 MPa). A film (“A4160 (current product number)” (“A4100 (old product number)” manufactured by Toyobo Co., Ltd.), composite elastic modulus 6.9 GPa) is bonded to prepare a test laminate.
- OCA optical transparent adhesive film
- a Tensilon universal material tester (RTC-1310A) manufactured by A & D was used to obtain the test laminate under the conditions of a radius of curvature of the needle tip of 0.5 mm and a piercing speed of 50 mm / min.
- a piercing test is performed from the surface on the hard coat film side toward the surface on the PET film side.
- the stroke and load on the surface of the test laminate are set to zero for measurement.
- the maximum stress at the time when the glass substrate is broken is pierced and used as the breaking force.
- the use of the laminated body in this embodiment is not particularly limited, and can be used, for example, as a member arranged on the observer side of the display panel in a display device.
- the laminate in this embodiment can be used for display devices such as smartphones, tablet terminals, wearable terminals, personal computers, televisions, digital signage, public information displays (PIDs), and in-vehicle displays.
- the laminated body in this embodiment has good bending resistance and impact resistance, it can be suitably used as a member that can handle curved surfaces.
- the laminate in the present disclosure can be preferably used for flexible displays such as foldable displays, rollable displays, bendable displays, and slidable displays, and can be preferably used for foldable displays.
- the laminated body in the present embodiment can be used, for example, as a surface material of a resin molded product having a curved surface, and can give design and aesthetics.
- the laminate in this embodiment is arranged on the surface of a display device, a resin molded product, or the like, the laminate is arranged so that the surface on the glass substrate side is on the inside and the surface on the hard coat film side is on the outside.
- the method of arranging the laminate in the present embodiment on the surface of a display device, a resin molded product, or the like is not particularly limited, and examples thereof include a method via an adhesive layer.
- the adhesive layer a known adhesive layer used for adhering the laminated body can be used.
- Second Embodiment The inventors of the present disclosure have diligently studied a laminate having a glass substrate, arranged a resin layer on the surface of a thin glass substrate, and further increased the thickness of the resin layer. It has been found that the cracking of the glass substrate can be suppressed and the impact resistance can be improved. However, when the resin composition is applied to the surface of the glass substrate to form a relatively thick resin layer, the influence of the shrinkage difference between the glass substrate and the resin layer during heating or curing after the application of the resin composition has an effect. It turned out that it became large and curled in some cases.
- the inventors of the present disclosure further studied, and by forming the resin layer into a film in advance and adhering the resin film to the surface of the thin glass substrate via the bonding layer, curling is suppressed and further resistance is achieved. It was found that the impact resistance can be increased.
- the second bonding layer can be arranged on the surface side opposite to the bonding layer of the glass base material in the laminated body.
- the inventors of the present disclosure further examined a laminate having a second bonding layer, a glass substrate, a bonding layer, and a resin film in this order. Then, it has been found that in such a laminated body, the impact resistance may be lowered depending on the type of the second bonding layer.
- the present embodiment has been made in view of the above circumstances, and an object thereof is to provide a laminated body capable of achieving both bending resistance and impact resistance.
- the second embodiment of the laminate in the present disclosure is a laminate having a hard coat layer, a base material layer, a bonding layer, a glass substrate, and a second bonding layer in this order, and the bonding is described above.
- the layer is a layer for joining the glass base material and the base material layer
- the second joining layer is a layer for joining the laminated body and other members, and the thickness of the glass base material. Is 10 ⁇ m or more and 100 ⁇ m or less, and satisfies the following formula (1).
- E 1 is the composite elastic modulus (GPa) of the hard coat layer
- D 1 is the thickness (mm) of the hard coat layer
- E 2 is the composite elastic modulus (GPa) of the base material layer.
- D 2 is the thickness of the base material layer (mm)
- E 3 is the composite elastic modulus of the joint layer (GPa)
- D 3 is the thickness of the joint layer (mm)
- E 4 is the glass base material.
- Composite elastic modulus (GPa) is the thickness of the glass substrate (mm)
- E 5 is the storage elastic modulus (GPa) of the second bonding layer
- D 5 is the thickness of the second bonding layer.
- FIG. 7 is a schematic cross-sectional view showing an example of the laminated body in this embodiment.
- the laminated body 1 has a hard coat layer 6, a base material layer 5, a bonding layer 3, a glass base material 2, and a second bonding layer 10 in this order.
- the glass substrate 2 has a predetermined thickness.
- the composite elastic modulus E 1 and the thickness D 1 of the hard coat layer 6, the composite elastic modulus E 2 and the thickness D 2 of the base material layer 5, and the composite elastic modulus E 3 and the thickness D 3 of the bonding layer 3 The composite elastic modulus E 4 and the thickness D 4 of the glass substrate 2 and the storage elastic modulus E 5 and the thickness D 5 of the second bonding layer 10 satisfy the above formula (1).
- the glass base material has a thickness of a predetermined value or less and is thin, so that bending resistance can be improved.
- the glass base material has a thickness of a predetermined value or less and is thin, there is a concern that it is easily broken and has low impact resistance.
- the hard coat layer, the base material layer, the bonding layer, the glass substrate, and the second bonding layer are arranged in this order, and the elastic modulus and thickness of each layer are arranged in this order.
- the impact resistance can be improved while maintaining good bending resistance. The reason for this is inferred as follows.
- Hertz fracture is also called concentrated stress fracture. Bending fracture occurs on the surface opposite the impact surface of the glass. Hertz fracture, on the other hand, occurs on the impact surface of the glass.
- the inventors of the present disclosure describe the impact resistance and bending resistance of a laminate having a hard coat layer, a base material layer, a bonding layer, a glass base material, and a second bonding layer in this order. Diligently examined. Since the second bonding layer is usually softer than the glass substrate, the substrate layer and the hard coat layer, it is easily deformed by an impact. Therefore, if the degree of deformation of the second bonding layer is large when an impact is applied to the laminated body, it is considered that momentary and local deformation is likely to occur in the glass substrate. In this case, there is a concern that bending fracture is likely to occur in the glass substrate.
- the thickness of the second bonding layer is relatively thin, it is considered that bending fracture of the glass substrate can be suppressed. Further, it is considered that bending fracture of the glass substrate can be suppressed even when the hardness of the second bonding layer is relatively hard. However, even if the bending fracture of the glass substrate can be suppressed by making the thickness of the second joint layer relatively thin or making the hardness of the second joint layer relatively hard, Hertz fracture of the glass substrate cannot be suppressed. In order to suppress Hertz fracture of the glass substrate, the thickness of the hard coat layer, the substrate layer, and the bonding layer should be relatively thick, or the hardness of the hard coat layer, the substrate layer, and the bonding layer should be increased. It is preferable to make it relatively hard.
- the impact fracture of the glass substrate is most affected by the thickness of the glass substrate among the thicknesses of each layer.
- the glass Even if the Hertz fracture of the base material can be suppressed, the bending resistance may decrease. Further, even if the impact fracture of the glass substrate can be suppressed by increasing the thickness of the glass substrate, the bending resistance may decrease. Based on the influence of the thickness and hardness of each layer on such impact resistance and bending resistance, and the experimental results as described in Examples and Comparative Examples described later, the thickness and elastic modulus of each layer are determined.
- the above equation (1) which shows the correlation with impact resistance and bending resistance, was derived.
- the thickness of the second joint layer becomes relatively thick, or the storage elastic modulus of the second joint layer becomes relatively low. Therefore, bending fracture is likely to occur in the glass base material, and the impact resistance may be lowered. Further, if the value of the middle side of the above formula (1) is too large, the thickness of the glass base material, the hard coat layer, the base material layer, and the bonding layer becomes relatively thick, or the hard coat layer and the base material layer become relatively thick. , And the composite elastic modulus of the bonding layer becomes relatively high. Therefore, the bending resistance may decrease. Therefore, in the present embodiment, by satisfying the elastic modulus and the thickness of each layer in the above formula (1), it is possible to improve the impact resistance while maintaining good bending resistance.
- the laminate in this embodiment can be bent and can be used for a wide variety of applications.
- the laminate in this embodiment can be used, for example, in a wide variety of display devices, and specifically, can be used as a member for a foldable display.
- the laminated body in this embodiment satisfies the following formula (1). 0.001 ⁇ ⁇ (E 1 x D 1 2 + E 2 x D 2 2 + E 3 x D 3 2 ) x E 4 x D 4 2 x E 5 x 1000 ⁇ / D 5 ⁇ 3.0 (1)
- E 1 is the composite elastic modulus (GPa) of the hard coat layer
- D 1 is the thickness (mm) of the hard coat layer
- E 2 is the composite elastic modulus (GPa) of the base material layer.
- D 2 is the thickness of the base material layer (mm)
- E 3 is the composite elastic modulus of the joint layer (GPa)
- D 3 is the thickness of the joint layer (mm)
- E 4 is the glass base material.
- Composite elastic modulus (GPa) D 4 is the thickness of the glass substrate (mm)
- E 5 is the storage elastic modulus (GPa) of the second bonding layer
- D 5 is the thickness of the second bonding layer.
- the value of the middle side of the above formula (1) is 0.001 or more and 3 or less, preferably 0.0015 or more and 1.5 or less, more preferably 0.003 or more and 1 or less, and 0. It is more preferably 005 or more and 0.7 or less, and particularly preferably 0.01 or more and 0.4 or less. As described above, if the value of the middle side of the above formula (1) is too small, the thickness of the second joint layer becomes relatively thick, or the storage elastic modulus of the second joint layer becomes relatively thick. It gets lower. Therefore, bending fracture is likely to occur in the glass base material, and the impact resistance may be lowered.
- the thickness of the glass base material, the hard coat layer, the base material layer, and the bonding layer becomes relatively thick, or the hard coat layer and the base material layer become relatively thick.
- the composite elastic modulus of the bonding layer becomes relatively high. Therefore, the bending resistance may decrease.
- the thickness of the second bonding layer relatively thin and the hardness of the second bonding layer relatively hard by making the thickness of the second bonding layer relatively thin and the hardness of the second bonding layer relatively hard, bending fracture of the glass substrate is suppressed. Even if it can be done, the Hertz fracture of the glass substrate cannot be suppressed. Therefore, when the value on the middle side of the above formula (1) becomes a predetermined value or more, the effect of suppressing bending fracture of the glass substrate is saturated. Therefore, the value on the middle side of the above formula (1) is preferably 0.4 or less.
- the thickness of the hard coat layer, the thickness of the base material layer, the thickness of the joint layer, the thickness of the glass base material, and the thickness of the second joint layer are the same as the thickness of each layer in the laminate of the first embodiment. The same is true.
- the composite elastic modulus of the hard coat layer is, for example, preferably 4 GPa or more and 10 GPa or less, more preferably 5 GPa or more and 9 GPa or less, and further preferably 6 GPa or more and 8 GPa or less. If the composite modulus of the hardcourt layer is too small, sufficient scratch resistance may not be obtained. Further, if the composite elastic modulus of the hard coat layer is too large, the hardness becomes too high and it becomes difficult to bend, which may reduce the bending resistance, particularly the dynamic bending property.
- the method for measuring the composite elastic modulus of the hard coat layer is the same as the method for measuring the composite elastic modulus of the bonded layer in the first embodiment.
- the composite elastic modulus of the hard coat layer can be adjusted, for example, by the type and composition of the material contained in the hard coat layer.
- the composite elastic modulus of the base material layer is the same as the composite elastic modulus of the base material layer in the first embodiment.
- the composite elastic modulus of the joint layer is the same as the composite elastic modulus of the joint layer in the first embodiment.
- the composite elastic modulus of the glass substrate is, for example, preferably 40 GPa or more and 100 GPa or less, more preferably 50 GPa or more and 90 GPa or less, and further preferably 60 GPa or more and 80 GPa or less.
- the storage elastic modulus of the second joint layer is the storage elastic modulus at 20 ° C.
- the storage elastic modulus of the second bonding layer is the same as the storage elastic modulus of the second bonding layer in the first embodiment.
- the hard coat layer, the base material layer, the bonding layer, the glass substrate, and the second bonding layer in the present embodiment are the same as the respective layers in the first embodiment.
- the laminate of the present embodiment has a surface side opposite to the base material layer of the hard coat layer, between the hard coat layer and the base material layer, between the base material layer and the bonding layer, and between the glass base material and the bonding layer.
- Further functional layers can be provided between the spaces or between the glass substrate and the second bonding layer.
- the functional layer is the same as the functional layer in the first embodiment.
- the protective film may be arranged on the surface side of the hard coat layer opposite to the base material layer.
- the protective film is the same as the protective film in the first embodiment.
- the characteristics and uses of the laminate of this embodiment are the same as the characteristics and uses of the laminate of the first embodiment.
- a third embodiment of the laminate in the present disclosure is a laminate having a base material layer, a bonding layer, a glass substrate, and a second bonding layer in this order, and the bonding layer is the glass.
- the layer for joining the base material and the base material layer, the second joining layer is a layer for joining the laminate and other members, and the thickness of the glass base material is 10 ⁇ m or more and 100 ⁇ m or less. And satisfies the following equation (2).
- E 2 is the composite elastic modulus (GPa) of the base material layer
- D 2 is the thickness (mm) of the base material layer
- E 3 is the composite elastic modulus (GPa) of the joint layer.
- D 3 is the thickness of the bonding layer (mm)
- E 4 is the composite elastic modulus of the glass substrate (GPa)
- D 4 is the thickness of the glass substrate (mm)
- E 5 is the second The storage elastic modulus (GPa) of the bonded layer, D5, indicates the thickness ( mm) of the second bonded layer.
- FIG. 8 is a schematic cross-sectional view showing an example of the laminated body in this embodiment.
- the laminated body 1 has a base material layer 5, a bonding layer 3, a glass base material 2, and a second bonding layer 10 in this order.
- the glass substrate 2 has a predetermined thickness.
- the storage elastic modulus E 5 and the thickness D 5 of the second bonding layer 10 satisfy the above formula (2).
- the glass base material has a thickness of a predetermined value or less and is thin, so that bending resistance can be improved.
- the glass base material has a thickness of a predetermined value or less and is thin, there is a concern that it is easily broken and has low impact resistance.
- the base material layer, the bonding layer, the glass base material, and the second bonding layer are arranged in this order, and the elastic modulus and thickness of each layer are determined by the above formula (2). ), It is possible to improve the impact resistance while maintaining good bending resistance. The reason for this is inferred as follows.
- the inventors of the present disclosure have diligently studied the impact resistance and bending resistance of a laminate having a base material layer, a bonding layer, a glass substrate, and a second bonding layer in this order. .. Since the second bonding layer is usually softer than the glass substrate and the substrate layer, it is easily deformed by impact. Therefore, if the degree of deformation of the second bonding layer is large when an impact is applied to the laminated body, it is considered that momentary and local deformation is likely to occur in the glass substrate. In this case, there is a concern that bending fracture is likely to occur in the glass substrate. On the other hand, when the thickness of the second bonding layer is relatively thin, it is considered that bending fracture of the glass substrate can be suppressed.
- bending fracture of the glass substrate can be suppressed even when the hardness of the second bonding layer is relatively hard.
- the bending fracture of the glass substrate can be suppressed by making the thickness of the second joint layer relatively thin or making the hardness of the second joint layer relatively hard, Hertz fracture of the glass substrate cannot be suppressed.
- the impact fracture of the glass substrate is most affected by the thickness of the glass substrate among the thicknesses of each layer.
- the Hertz fracture of the glass substrate could be suppressed by making the thickness of the base material layer and the bonding layer relatively thick and the hardness of the base material layer and the bonding layer relatively hard.
- the bending resistance may decrease.
- the thickness and elastic modulus of each layer are determined. The above equation (2), which shows the correlation with impact resistance and bending resistance, was derived.
- the thickness of the second joint layer becomes relatively thick, or the storage elastic modulus of the second joint layer becomes relatively low. Therefore, bending fracture is likely to occur in the glass base material, and the impact resistance may be lowered. Further, if the value on the middle side of the above formula (2) is too large, the thickness of the glass base material, the base material layer, and the bonding layer becomes relatively thick, or the composite elastic modulus of the base material layer and the bonding layer becomes relatively large. It can be relatively high. Therefore, the bending resistance may decrease. Therefore, in the present embodiment, by satisfying the elastic modulus and the thickness of each layer in the above formula (2), it is possible to improve the impact resistance while maintaining good bending resistance.
- the laminate in this embodiment can be bent and can be used for a wide variety of applications.
- the laminate in this embodiment can be used, for example, in a wide variety of display devices, and specifically, can be used as a member for a foldable display.
- the laminated body in this embodiment satisfies the following formula (2). 0.001 ⁇ ⁇ (E 2 x D 2 2 + E 3 x D 3 2 ) x E 4 x D 4 2 x E 5 x 1000 ⁇ / D 5 ⁇ 3.0 (2)
- E 2 is the composite elastic modulus (GPa) of the base material layer
- D 2 is the thickness (mm) of the base material layer
- E 3 is the composite elastic modulus (GPa) of the joint layer.
- D 3 is the thickness of the bonding layer (mm)
- E 4 is the composite elastic modulus of the glass substrate (GPa)
- D 4 is the thickness of the glass substrate (mm)
- E 5 is the second The storage elastic modulus (GPa) of the bonded layer, D5, indicates the thickness ( mm) of the second bonded layer.)
- the value of the middle side of the above formula (2) is 0.001 or more and 3 or less, preferably 0.0015 or more and 1.5 or less, more preferably 0.003 or more and 1 or less, and 0. It is more preferably 005 or more and 0.7 or less, and particularly preferably 0.01 or more and 0.4 or less. As described above, if the value of the middle side of the above formula (2) is too small, the thickness of the second joint layer becomes relatively thick, or the storage elastic modulus of the second joint layer becomes relatively large. It gets lower. Therefore, bending fracture is likely to occur in the glass base material, and the impact resistance may be lowered.
- the thickness of the glass base material, the base material layer, and the bonding layer becomes relatively thick, or the composite elastic modulus of the base material layer and the bonding layer is increased. Is relatively high. Therefore, the bending resistance may decrease.
- the thickness of the second bonding layer relatively thin and the hardness of the second bonding layer relatively hard by making the thickness of the second bonding layer relatively thin and the hardness of the second bonding layer relatively hard, bending fracture of the glass substrate is suppressed. Even if it can be done, the Hertz fracture of the glass substrate cannot be suppressed. Therefore, when the value on the middle side of the above formula (2) becomes a predetermined value or more, the effect of suppressing bending fracture of the glass substrate is saturated. Therefore, the value on the middle side of the above equation (2) is preferably 0.4 or less.
- the thickness of the base material layer, the thickness of the joint layer, the thickness of the glass base material, and the thickness of the second joint layer are the same as the thickness of each layer in the laminate of the first embodiment.
- the composite elastic modulus of the base material layer is the same as the composite elastic modulus of the base material layer in the first embodiment.
- the composite elastic modulus of the joint layer is the same as the composite elastic modulus of the joint layer in the first embodiment.
- the composite elastic modulus of the glass base material is the same as the composite elastic modulus of the glass base material in the second embodiment.
- the storage elastic modulus of the second joint layer is the storage elastic modulus at 20 ° C.
- the storage elastic modulus of the second bonding layer is the same as the storage elastic modulus of the second bonding layer in the first embodiment.
- the base material layer, the bonding layer, the glass substrate, and the second bonding layer in this embodiment are the same as the respective layers in the first embodiment.
- the laminate of the present embodiment is the surface side of the base material layer opposite to the joint layer, between the base material layer and the joint layer, between the glass base material and the joint layer, or between the glass base material and the second joint. Further functional layers can be provided between the layers.
- the functional layer is the same as the functional layer in the first embodiment.
- the protective film may be arranged on the surface side opposite to the bonding layer of the base material layer.
- the protective film is the same as the protective film in the first embodiment.
- the characteristics and uses of the laminate of this embodiment are the same as the characteristics and uses of the laminate of the first embodiment.
- the display device in the present disclosure includes a display panel and the above-mentioned laminated body arranged on the observer side of the above-mentioned display panel.
- the surface on the glass substrate side is the above-mentioned display panel. It is arranged so as to face the. That is, the display device in the present disclosure includes a display panel and the above-mentioned laminated body arranged on the observer side of the above-mentioned display panel, and in the above-mentioned laminated body, the surface on the glass substrate side is the above-mentioned display panel. It is arranged so as to be adjacent to.
- FIG. 9 is a schematic cross-sectional view showing an example of the display device in the present disclosure.
- the display device 30 includes a display panel 31 and a laminated body 1 arranged on the observer side of the display panel 31.
- the laminated body 1 is arranged so that the surface on the glass base material 2 side is adjacent to the display panel 31.
- the laminated body 1 is used as a member arranged on the surface of the display device 30, and an adhesive layer 32 is arranged between the laminated body 1 and the display panel 31.
- the laminated body in the present disclosure can be the same as the above-mentioned laminated body.
- Examples of the display panel in the present disclosure include display panels used in display devices such as liquid crystal displays, organic EL display devices, and LED display devices.
- the display device in the present disclosure can have a touch panel member between the display panel and the laminated body.
- the display device in the present disclosure is preferably a flexible display.
- the display device in the present disclosure is preferably foldable. That is, the display device in the present disclosure is more preferably a foldable display. Since the display device in the present disclosure has the above-mentioned laminated body, it is excellent in impact resistance and bending resistance, and is suitable as a flexible display and further as a foldable display.
- Example 1 (1) Preparation of Hard Coat Film (1-1) Preparation of Base Material Layer With reference to Synthesis Example 1 of International Publication No. 2014/046180, a tetracarboxylic acid dianhydride represented by the following chemical formula was synthesized.
- TMPBPTME tetracarboxylic acid dianhydride
- TPC terephthalic acid dichloride
- 6.66 g (84.2 mmol) of pyridine and 8.60 g (84.2 mmol) of acetic anhydride were added as catalysts, and the mixture was stirred at 25 ° C. for 30 minutes to confirm that the solution was uniform.
- the mixture was heated to ° C. and stirred for 1 hour.
- 174.26 g of 2-propyl alcohol (IPA) was gradually added to the solution cooled to room temperature to obtain a solution in which slight turbidity was observed.
- IPA435.64 g was added to the turbid solution at once to obtain a white slurry.
- the above slurry was filtered and washed with IPA 5 times, and then dried in an oven heated to 100 ° C. under reduced pressure for 6 hours to obtain a polyamide-imide powder (37.1 g).
- the weight average molecular weight of polyamide-imide measured by GPC was 62000.
- DMAc was added to the polyamide-imide so that the solid content concentration of the polyamide-imide was 19% by mass to prepare a polyamide-imide varnish having a polyamide-imide of 19% by mass in the varnish.
- the viscosity of the polyamide-imide varnish (solid content concentration 19% by mass) at 25 ° C. was 4000 mPa ⁇ s.
- Polyamide-imide varnish (solid content concentration 19% by mass) was applied onto a glass plate so that the film film thickness after drying in a circulation oven described later was the film thickness shown in Table 1. Then, after drying in a circulation oven at 120 ° C. for 10 minutes, the mixture was cooled to 25 ° C. and the polyimide resin coating film was peeled off.
- the peeled polyimide resin coating film was cut out to a size of 150 mm ⁇ 200 mm.
- Two metal frames (outer dimensions 150 mm ⁇ 200 mm, inner dimensions 130 mm ⁇ 180 mm) were used to sandwich the cut out polyimide-based resin coating film, and the metal frame and the polyimide-based resin coating film were fixed with a fixing jig.
- the fixed polyimide resin coating film is heated to 300 ° C. at a heating rate of 10 ° C./min in a circulation oven under a nitrogen stream (oxygen concentration 100 ppm or less), held at 300 ° C. for 1 hour, and then to 25 ° C. It was cooled to prepare a single-layer polyimide resin film.
- the composition for the hard coat layer was applied onto the base material layer so that the film thickness after curing was 10 ⁇ m, dried at 70 ° C. for 1 minute, and then irradiated at an irradiation rate of 200 mJ / cm 2 . It was cured by irradiating with ultraviolet rays to form a hard coat layer. As a result, a hard-coated film was obtained.
- Laminate A bonding layer (acrylic adhesive sheet, OCA) with a thickness of 25 ⁇ m (“8146-1” manufactured by 3M) is applied to the surface of the hard coat film on the substrate layer side using a hand roller. By laminating, a hard coat film with a bonding layer was obtained. Next, the surface of the hard coat film with a bonding layer on the bonding layer side was bonded to a chemically strengthened glass substrate having a thickness of 70 ⁇ m using a hand roller to obtain a laminated body.
- OCA acrylic adhesive sheet
- Example 2 to 9 and Comparative Examples 2 to 4 If the thickness of the base material layer of the hard coat film is changed as shown in Table 1 below, and if the thickness of the bonding layer is 15 ⁇ m, 10 ⁇ m or 5 ⁇ m, Panac is used as the bonding layer (acrylic adhesive sheet, OCA). A laminated body was obtained in the same manner as in Example 1 except that "Panaclean PD-S1" manufactured by the same company was used.
- Example 10 (1) Preparation of hard-coated film A hard-coated film was produced in the same manner as in Example 7.
- a heat-sealable resin composition was prepared by blending each component so as to have the composition shown below.
- the heat-sealable resin composition was applied to the surface of the hard coat film on the substrate layer side so that the film thickness after drying was 5 ⁇ m, dried at 70 ° C. for 1 minute, and heat-sensitively adhered. A layer was formed to obtain a hard coat film with a heat-sensitive adhesive layer.
- the hard coat film with the heat-sensitive adhesive layer is arranged so that the surface on the heat-sensitive adhesive layer side is in contact with the chemically reinforced glass base material having a thickness of 70 ⁇ m, and the heat-sensitive adhesive layer of the glass base material is placed.
- Hard coat with hard coat A glass support substrate with a thickness of 2 mm is placed on the opposite side of the film, and a roll laminator (manufactured by Aco Brands Japan, trade name: desktop roll laminator B35A3) is used to hard with a heat-sensitive adhesive layer.
- the coat film and the glass substrate were bonded to each other while heating to obtain a laminated body. At this time, the roll temperature was 140 ° C. to 149 ° C., and the feed rate was 0.3 m / min. Then, the laminate was aged at 70 ° C. for 2 days.
- Example 11 to 14 and Comparative Example 5 A laminated body was obtained in the same manner as in Example 10 except that the thickness of the bonded layer was changed as shown in Table 1 below.
- Example 15 A laminate was obtained in the same manner as in Example 10 except that the pressure-sensitive adhesive layer was formed instead of the heat-sensitive adhesive layer and the roll temperature was set to 20 ° C to 30 ° C in the preparation of the laminate.
- a pressure-sensitive adhesive composition was prepared by blending each component so as to have the composition shown below.
- the pressure-sensitive adhesive composition is applied to the surface of the hard coat film on the substrate layer side so that the film thickness after drying is 5 ⁇ m, and dried at 70 ° C. for 1 minute to form a pressure-sensitive adhesive layer. bottom.
- Example 16 A laminated body was obtained in the same manner as in Example 7 except that an optical transparent adhesive film (OCA) (“D692” manufactured by Lintec Corporation) having a thickness of 5 ⁇ m was used as the bonding layer.
- OCA optical transparent adhesive film
- Example 17 A laminate was obtained in the same manner as in Example 10 except that the heat-sealing resin composition shown below was used.
- Example 18 A laminate was obtained in the same manner as in Example 10 except that the heat-sealing resin composition shown below was used.
- Example 19 A laminate was obtained in the same manner as in Example 10 except that the heat-sealing resin composition shown below was used.
- Example 20 A laminate was obtained in the same manner as in Example 10 except that the heat-sealing resin composition shown below was used.
- Example 21 A laminate was obtained in the same manner as in Example 10 except that the heat-sealing resin composition shown below was used.
- Example 22 (1) Preparation of hard-coated film A hard-coated film was produced in the same manner as in Example 7.
- UV curable resin composition > -Urethane acrylate (product name "UV-3310B", manufactured by Mitsubishi Chemical Co., Ltd.): 35 parts by mass-Pentaerythritol tetraacrylate ethoxylated (product name "ATM-35E”, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.): 10 parts by mass -Phenoxyethyl acrylate (product name "Viscort # 192", manufactured by Osaka Organic Chemical Industry Co., Ltd.): 5 parts by mass-Mixed mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (product name "KAYARAD PET-30", Nippon Kayaku Co., Ltd.) (Manufactured by the company): 50 parts by mass ⁇ Photopolymerization initiator (1-hydroxycyclohexylphenylketone, product name “Omnirad184”, manufactured by IGM Resins VV)
- the ultraviolet curable resin composition was applied to the surface of the hard coat film on the substrate layer side so that the cured film had a thickness of 5 ⁇ m, and dried at 70 ° C. for 1 minute to form an adhesive. A layer was formed to obtain a hardcourt film with an adhesive layer.
- Example 23 (1) Preparation of hard-coated film A hard-coated film was produced in the same manner as in Example 7.
- thermosetting resin composition was prepared by blending each component so as to have the composition shown below.
- thermosetting resin composition > ⁇ Special novolak type epoxy resin (jER157S65 manufactured by Mitsubishi Chemical) 25 parts by mass ⁇ Bis A / bis F mixed type epoxy resin (jER4250 manufactured by Mitsubishi Chemical) 75 parts by mass ⁇ 2-ethyl-4-methylimidazole (manufactured by Tokyo Chemical Industry) 6 .5 parts by mass, silane coupling agent (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) 5 parts by mass, fluorine-based leveling agent (F568, manufactured by DIC) 0.2 parts by mass (solid conversion) ⁇ Solvent (MEK) 600 parts by mass
- thermosetting resin composition was applied to the surface of the hard coat film on the substrate layer side so that the cured film had a thickness of 5 ⁇ m, and dried at 70 ° C. for 1 minute to form an adhesive. A layer was formed to obtain a hard coat film with an adhesive layer.
- Example 24 A laminate was obtained in the same manner as in Example 23, except that the thermosetting resin composition shown below was used.
- thermosetting resin composition > ⁇ Special novolak type epoxy resin (jER157S65 manufactured by Mitsubishi Chemical) 50 parts by mass ⁇ Bis A type epoxy resin (jER1256 manufactured by Mitsubishi Chemical) 50 parts by mass ⁇ 2-ethyl-4-methylimidazole (manufactured by Tokyo Chemical Industry) 6.5 parts by mass ⁇ Silane coupling agent (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) 5 parts by mass ⁇ Fluorine leveling agent (F568, manufactured by DIC) 0.2 parts by mass (solid conversion) ⁇ Solvent (MEK) 600 parts by mass
- Example 25 (1) Preparation of hard coat film A TAC film with a thickness of 60 ⁇ m (“TG60UL” manufactured by FUJIFILM Corporation) was used as the base material layer, except that the thickness of the hard coat layer was changed as shown in Table 1 below. , A hard coat film was produced in the same manner as in Example 10.
- Example 26 (1) Preparation of hard coat film A PET film with a thickness of 50 ⁇ m (“A4360 (current product number)” (“A4300 (old product number)”) manufactured by Toyobo Co., Ltd.) is used as the base material layer to determine the thickness of the hard coat layer. A hard-coated film was produced in the same manner as in Example 10 except that the changes were made as shown in Table 1 below.
- Example 27 A laminate was produced in the same manner as in Example 26, except that a PEN film (manufactured by Teijin Limited) having a thickness of 50 ⁇ m was used as the base material layer.
- a PEN film manufactured by Teijin Limited
- Example 28 to 30 and Comparative Example 6 A laminated body was obtained in the same manner as in Example 10 except that the thickness of the glass substrate was changed as shown in Table 3 below.
- the pencil hardness on the surface of the test laminate on the glass substrate side was measured.
- the pencil hardness was measured according to JIS K5600-5-4 (1999).
- a pencil hardness tester product name "pencil scratch coating hardness tester (electric type)", manufactured by Toyo Seiki Seisakusho Co., Ltd.
- the measurement conditions were an angle of 45 °, a load of 1 kg, and a speed of 0.5 mm /.
- the temperature was 23 ⁇ 2 ° C. and 1 mm / sec or less.
- the pencil hardness was evaluated according to the following criteria.
- 2A Pencil hardness is 5H or more.
- the pencil hardness was evaluated according to the following criteria.
- 2A Pencil hardness is 5H or more.
- the test laminate was placed on the metal plate so that the surface of the test laminate on the PET film side was in contact with the metal plate having a thickness of 30 mm.
- the pen was dropped onto the test laminate with the tip of the pen facing down from the test height with respect to the central portion of the test laminate.
- Bren 0.5BAS88-BK weight 12 g, pen tip 0.5 mm ⁇ manufactured by Zebra was used. Tables 1 to 3 show the maximum test height at which the glass substrate was not cracked. The larger the value, the higher the impact resistance.
- Glass transition temperature (Tg) For the laminates of Examples 1 to 30 and Comparative Examples 2 to 6, the glass transition temperature of the bonded layer was measured by the above-mentioned method for measuring the glass transition temperature.
- Example 31 A second bonding layer (optical transparent adhesive film (OCA), storage elastic modulus 0.10 MPa) having a thickness of 100 ⁇ m was bonded to the surface of the laminate of Example 10 on the glass substrate side using a hand roller. A laminate was obtained.
- OCA optical transparent adhesive film
- storage elastic modulus 0.10 MPa storage elastic modulus 0.10 MPa
- Example 32 Laminated in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (“8146-4” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 100 ⁇ m was used as the second bonding layer. The body was made.
- OCA optical transparent adhesive film
- Example 33 Laminated in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) having a thickness of 50 ⁇ m (“8146-2” manufactured by 3M, storage elastic modulus 0.23 MPa) was used as the second bonding layer. The body was made.
- OCA optical transparent adhesive film
- Example 34 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.10 MPa) having a thickness of 50 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 35 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.12 MPa) having a thickness of 55 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 36 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.12 MPa) having a thickness of 30 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 37 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.32 MPa) having a thickness of 25 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 38 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.15 MPa) having a thickness of 25 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 39 The laminate was prepared in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) having a thickness of 25 ⁇ m (“F619” manufactured by Lintec Corporation, storage elastic modulus of 0.19 MPa) was used as the second bonding layer. Made.
- OCA optical transparent adhesive film
- Example 40 As the second bonding layer, the laminated body was prepared in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) having a thickness of 25 ⁇ m (“N632” manufactured by Lintec Corporation, storage elastic modulus 0.20 MPa) was used. Made.
- OCA optical transparent adhesive film
- Example 41 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.57 MPa) having a thickness of 25 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 42 A laminated body was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 1.17 MPa) having a thickness of 25 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 43 A laminate was prepared in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) having a thickness of 25 ⁇ m (“D692, storage elastic modulus 2.33 MPa) manufactured by Lintec Corporation was used as the second bonding layer). bottom.
- OCA optical transparent adhesive film
- Example 44 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 2.22 MPa) having a thickness of 25 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 45 A laminate was prepared in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) having a thickness of 15 ⁇ m (“D692, storage elastic modulus 2.14 MPa) manufactured by Lintec Corporation was used as the second bonding layer. bottom.
- OCA optical transparent adhesive film
- Example 46 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.12 MPa) having a thickness of 15 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 47 A laminate was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.91 MPa) having a thickness of 5 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 48 A laminated body was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 2.22 MPa) having a thickness of 10 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 49 A laminated body was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 1.95 MPa) having a thickness of 5 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 7 A laminated body was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 2.22 MPa) having a thickness of 5 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 8 A laminated body was produced in the same manner as in Example 31 except that an optical transparent adhesive film (OCA) (storage elastic modulus 12.74 MPa) having a thickness of 15 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 50 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 18 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 51 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 19 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 52 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 20 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 53 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 21 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 54 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 22 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 55 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 23 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 56 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 28 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 57 A laminated body was produced in the same manner as in Example 26 except that the thickness of the hard coat layer was 10 ⁇ m.
- OCA optically transparent adhesive film
- Example 58 An optical transparent adhesive film (OCA) (“8146-2” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 50 ⁇ m was attached to the surface of the laminate of Example 26 on the glass substrate side using a hand roller. Then, a laminated body was obtained.
- OCA optical transparent adhesive film
- Example 59 A laminate was produced in the same manner as in Example 57, except that the thickness of the glass substrate was 50 ⁇ m.
- Example 60 A laminate was produced in the same manner as in Example 33, except that an optical transparent adhesive film (OCA) (composite elastic modulus 0.0096 GPa) having a thickness of 25 ⁇ m was used as the bonding layer.
- OCA optical transparent adhesive film
- Example 61 A laminate was produced in the same manner as in Example 59, except that an optical transparent adhesive film (OCA) (composite elastic modulus 0.0096 GPa) having a thickness of 50 ⁇ m was used as the bonding layer.
- OCA optical transparent adhesive film
- Example 62 The thickness of the glass substrate was 50 ⁇ m, and as the second bonding layer, an optical transparent adhesive film (OCA) with a thickness of 100 ⁇ m (“8146-4” manufactured by 3M, storage elastic modulus 0.23 MPa) was used. A laminated body was produced in the same manner as in Example 33 except that it was used.
- OCA optical transparent adhesive film
- Example 63 A laminate was produced in the same manner as in Example 62, except that a PEN film (manufactured by Teijin Limited) having a thickness of 50 ⁇ m was used as the base material layer.
- a PEN film manufactured by Teijin Limited
- Example 64 A laminate was produced in the same manner as in Example 62, except that a PET film having a thickness of 50 ⁇ m (“A4360” manufactured by Toyobo Co., Ltd.) was used as the base material layer.
- Example 65 The thickness of the glass substrate was 30 ⁇ m, and as the second bonding layer, an optical transparent adhesive film (OCA) with a thickness of 100 ⁇ m (“8146-4” manufactured by 3M, storage elastic modulus 0.23 MPa) was used. A laminated body was produced in the same manner as in Example 33 except that it was used.
- OCA optical transparent adhesive film
- Example 66 A laminate was produced in the same manner as in Example 65, except that a PEN film (manufactured by Teijin Limited) having a thickness of 50 ⁇ m was used as the base material layer.
- a PEN film manufactured by Teijin Limited
- Example 67 A laminate was produced in the same manner as in Example 65, except that a PET film having a thickness of 50 ⁇ m (“A4360” manufactured by Toyobo Co., Ltd.) was used as the base material layer.
- Example 68 An optically transparent adhesive film (OCA) (composite elastic modulus 0.0096 GPa) having a thickness of 25 ⁇ m was used as the bonding layer, and an optically transparent adhesive film (OCA) (composite) having a thickness of 25 ⁇ m was used as the second bonding layer.
- OCA optically transparent adhesive film
- OCA composite elastic modulus 0.0096 GPa
- OCA optically transparent adhesive film
- Example 69 A laminate was produced in the same manner as in Example 33, except that the thickness of the base material layer was 80 ⁇ m and the thickness of the glass base material was 50 ⁇ m.
- Example 70 The laminate was prepared in the same manner as in Example 59, except that a PET film having a thickness of 23 ⁇ m (“U403” manufactured by Toray Industries, Inc.) was used as the base material layer and the thickness of the glass base material was set to 30 ⁇ m. Made.
- a PET film having a thickness of 23 ⁇ m (“U403” manufactured by Toray Industries, Inc.) was used as the base material layer and the thickness of the glass base material was set to 30 ⁇ m. Made.
- Example 9 Laminated in the same manner as in Example 68, except that an optical transparent adhesive film (OCA) (“8146-4” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 100 ⁇ m was used as the second bonding layer. The body was made.
- OCA optical transparent adhesive film
- Comparative Example 11 A laminated body was produced in the same manner as in Comparative Example 10 except that the thickness of the glass substrate was 50 ⁇ m.
- Comparative Example 12 A laminated body was produced in the same manner as in Comparative Example 10 except that the thickness of the glass substrate was 30 ⁇ m.
- Example 71 In the same manner as in Example 1, a base material layer made of a polyimide resin film having a thickness of 80 ⁇ m was prepared. A heat-sensitive adhesive layer was formed on one surface of the base material layer in the same manner as in Example 10 to obtain a base material layer with a heat-sensitive adhesive layer. The base material layer with the heat-sensitive adhesive layer is arranged so that the surface on the heat-sensitive adhesive layer side is in contact with the chemically strengthened glass base material having a thickness of 70 ⁇ m, and the side opposite to the base material layer with the heat-sensitive adhesive layer of the glass base material.
- a glass support substrate with a thickness of 2 mm is placed on the surface of the glass, and a roll laminator (manufactured by Aco Brands Japan, trade name: desktop roll laminator B35A3) is used to separate the base material layer with a heat-sensitive adhesive layer and the glass base material.
- the laminate was obtained by laminating while heating. At this time, the roll temperature was 140 ° C. to 149 ° C., and the feed rate was 0.3 m / min. Then, the laminate was aged at 70 ° C. for 2 days.
- OCA optically transparent adhesive film
- Example 72 A laminated body was produced in the same manner as in Example 71, except that the thickness of the base material layer was 50 ⁇ m.
- Example 73 A laminate was produced in the same manner as in Example 71, except that the thickness of the base material layer was 50 ⁇ m and the thickness of the glass base material was 50 ⁇ m.
- Example 74 A laminate was produced in the same manner as in Example 71, except that the thickness of the base material layer was 50 ⁇ m and the thickness of the glass base material was 30 ⁇ m.
- Example 75 A laminated body was produced in the same manner as in Example 71, except that the thickness of the base material layer was 30 ⁇ m.
- Example 76 A laminate was produced in the same manner as in Example 71, except that a PET film having a thickness of 75 ⁇ m (“A4360” manufactured by Toyobo Co., Ltd.) was used as the base material layer.
- Example 77 A laminate was produced in the same manner as in Example 71, except that a PET film having a thickness of 50 ⁇ m (“A4360” manufactured by Toyobo Co., Ltd.) was used as the base material layer.
- A4360 manufactured by Toyobo Co., Ltd.
- Example 78 A laminate was produced in the same manner as in Example 77, except that the thickness of the glass substrate was 50 ⁇ m.
- Example 79 A laminate was produced in the same manner as in Example 77, except that the thickness of the glass substrate was 30 ⁇ m.
- Example 80 A laminate was produced in the same manner as in Example 71, except that a PET film having a thickness of 23 ⁇ m (“U403” manufactured by Toray Industries, Inc.) was used as the base material layer.
- a PET film having a thickness of 23 ⁇ m (“U403” manufactured by Toray Industries, Inc.) was used as the base material layer.
- Example 81 A laminate was produced in the same manner as in Example 71, except that a TAC film having a thickness of 60 ⁇ m (“TG60UL” manufactured by FUJIFILM Corporation) was used as the base material layer.
- TG60UL a TAC film having a thickness of 60 ⁇ m
- Example 82 A laminate was produced in the same manner as in Example 71, except that a PEN film (manufactured by Teijin Limited) having a thickness of 50 ⁇ m was used as the base material layer.
- a PEN film manufactured by Teijin Limited
- Example 83 The thickness of the glass substrate was 50 ⁇ m, and as the second bonding layer, an optical transparent adhesive film (OCA) with a thickness of 100 ⁇ m (“8146-4” manufactured by 3M, storage elastic modulus 0.23 MPa) was used. A laminated body was produced in the same manner as in Example 71 except that it was used.
- OCA optical transparent adhesive film
- Example 84 A laminate was produced in the same manner as in Example 83, except that a PEN film (manufactured by Teijin Limited) having a thickness of 50 ⁇ m was used as the base material layer.
- a PEN film manufactured by Teijin Limited
- Example 85 A laminate was produced in the same manner as in Example 83, except that a PET film having a thickness of 50 ⁇ m (“A4360” manufactured by Toyobo Co., Ltd.) was used as the base material layer.
- Example 86 The thickness of the glass substrate was 30 ⁇ m, and as the second bonding layer, an optical transparent adhesive film (OCA) with a thickness of 100 ⁇ m (“8146-4” manufactured by 3M, storage elastic modulus 0.23 MPa) was used. A laminated body was produced in the same manner as in Example 71 except that it was used.
- OCA optical transparent adhesive film
- Example 87 A laminate was produced in the same manner as in Example 86, except that a PEN film (manufactured by Teijin Limited) having a thickness of 50 ⁇ m was used as the base material layer.
- a PEN film manufactured by Teijin Limited
- Example 88 A laminate was produced in the same manner as in Example 86, except that a PET film having a thickness of 50 ⁇ m (“A4360” manufactured by Toyobo Co., Ltd.) was used as the base material layer.
- Example 89 An optically transparent adhesive film (OCA) (composite elastic modulus 0.0096 GPa) having a thickness of 25 ⁇ m was used as the bonding layer, and an optically transparent adhesive film (OCA) (3M) having a thickness of 100 ⁇ m was used as the second bonding layer.
- OCA optically transparent adhesive film
- 3M optically transparent adhesive film
- a laminate was obtained in the same manner as in Example 88, except that “8146-4” manufactured by the same company and a storage elastic modulus of 0.23 MPa) were used.
- Example 90 A laminate was obtained in the same manner as in Example 72, except that an optical transparent adhesive film (OCA) (storage elastic modulus 2.14 MPa) having a thickness of 15 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 91 A laminate was obtained in the same manner as in Example 72, except that an optical transparent adhesive film (OCA) (storage elastic modulus 0.91 MPa) having a thickness of 5 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 92 A laminated body was obtained in the same manner as in Example 72, except that an optical transparent adhesive film (OCA) (storage elastic modulus 2.22 MPa) having a thickness of 10 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 93 A laminate was obtained in the same manner as in Example 72, except that an optical transparent adhesive film (OCA) (storage elastic modulus 1.95 MPa) having a thickness of 5 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 94 The laminate was prepared in the same manner as in Example 71, except that a PET film having a thickness of 23 ⁇ m (“U403” manufactured by Toray Industries, Inc.) was used as the base material layer and the thickness of the glass base material was set to 30 ⁇ m. Made.
- a PET film having a thickness of 23 ⁇ m (“U403” manufactured by Toray Industries, Inc.) was used as the base material layer and the thickness of the glass base material was set to 30 ⁇ m. Made.
- Example 13 A laminated body was obtained in the same manner as in Example 72, except that an optical transparent adhesive film (OCA) (storage elastic modulus 2.22 MPa) having a thickness of 5 ⁇ m was used as the second bonding layer.
- OCA optical transparent adhesive film
- Example 14 Laminated in the same manner as in Example 94, except that an optical transparent adhesive film (OCA) (“8146-4” manufactured by 3M Co., Ltd., storage elastic modulus 0.23 MPa) having a thickness of 100 ⁇ m was used as the second bonding layer. I got a body.
- OCA optical transparent adhesive film
- Bren 0.5BAS88-BK weight 12 g, pen tip 0.5 mm ⁇
- Tables 4 to 6 show the maximum test height at which the glass substrate did not crack. The larger the value, the higher the impact resistance.
- FIG. 10 shows a graph showing the relationship between the value on the middle side of the above equation (1) and the test height of the pen drop test. Further, FIG. 11 shows a graph showing the relationship between the value on the middle side of the above equation (2) and the test height of the pen drop test.
- Glass transition temperature (Tg) of the bonding layer and the second bonding layer The glass transition temperature of the bonding layer and the second bonding layer was measured by the above-mentioned method for measuring the glass transition temperature.
- Example 95 A PET film having a thickness of 50 ⁇ m (“A4160” manufactured by Toyobo Co., Ltd.) was prepared, and the curable resin composition for the hard coat layer used in Example 1 was applied onto the PET film with a bar coater to complete the coating film. I let you. Then, the coating film was dried at 100 ° C. for 3 minutes and then cured by irradiation with ultraviolet rays of 200 mJ to form a hard coat layer having a thickness of 10 ⁇ m. Next, a pressure-sensitive adhesive layer was formed on the surface of the PET film opposite to the hard coat layer in the same manner as in Example 15. From this, a laminated film was obtained. Next, the surface of the laminated film on the bonding layer side was bonded to a chemically strengthened glass substrate having a thickness of 30 ⁇ m to obtain a laminated body.
- A4160 manufactured by Toyobo Co., Ltd.
- Example 96 A laminated body was produced in the same manner as in Example 95, except that an optical transparent adhesive film (OCA) having a thickness of 5 ⁇ m (“D692” manufactured by Lintec Corporation, composite elastic modulus of 19 MPa) was used as the bonding layer.
- OCA optical transparent adhesive film
- Example 95 Example 95 and Example 95 except that an optical transparent adhesive film (acrylic adhesive sheet, OCA) having a thickness of 5 ⁇ m (“Panaclean PD-S1” manufactured by Panac Co., Ltd., composite elastic modulus of 13.7 MPa) was used as the bonding layer.
- OCA optical transparent adhesive film
- a laminate was produced in the same manner.
- Example 98 A hard coat layer was formed on the PET film in the same manner as in Example 95.
- Example 17 the heat-sealing resin composition used in Example 17 was applied to the surface of the PET film opposite to the hard coat layer so that the film thickness after drying was 5 ⁇ m, and the temperature was 70 ° C. for 1 minute. It was dried to form a heat-sensitive adhesive layer, and a laminated film was obtained.
- the laminated film is arranged so that the surface on the heat-sensitive adhesive layer side is in contact with the chemically strengthened glass base material having a thickness of 30 ⁇ m, and the surface on the side opposite to the laminated film of the glass base material has a thickness of 2 mm.
- a glass support substrate was placed, and the laminated film and the glass substrate were bonded together while heating using a roll laminator (manufactured by Aco Brands Japan, trade name: desktop roll laminator B35A3) to obtain a laminated body. ..
- the roll temperature was 140 ° C. to 149 ° C.
- the feed rate was 0.3 m / min.
- the laminate was aged at 70 ° C. for 2 days.
- Example 99 A laminate was produced in the same manner as in Example 98, except that the heat-sealing resin composition used in Example 10 was used.
- Example 100 A laminate was produced in the same manner as in Example 98, except that the heat-sealing resin composition used in Example 18 was used.
- Example 101 A laminate was produced in the same manner as in Example 98, except that the heat-sealing resin composition used in Example 19 was used.
- Example 102 A laminate was produced in the same manner as in Example 98, except that the heat-sealing resin composition used in Example 21 was used.
- Example 103 A laminate was produced in the same manner as in Example 98, except that the heat-sealing resin composition used in Example 20 was used.
- Example 104 A hard coat layer was formed on the PET film in the same manner as in Example 95.
- the ultraviolet curable resin composition used in Example 22 was applied to the surface of the PET film opposite to the hard coat layer so that the film thickness after curing was 5 ⁇ m, and the film thickness was 70 ° C. for 1 minute. It was dried to form an adhesive layer to obtain a laminated film.
- the surface of the laminated film on the adhesive layer side was bonded to a chemically reinforced glass substrate having a thickness of 30 ⁇ m using a hand roller.
- the adhesive layer was cured by irradiating ultraviolet rays with an irradiation amount of 400 mJ / cm 2 from the hard coat layer side to obtain a laminated body.
- Example 105 A laminate was produced in the same manner as in Example 98, except that the following heat-sealable resin composition was used.
- Example 106 A hard coat layer was formed on the PET film in the same manner as in Example 95.
- thermosetting resin composition used in Example 23 was applied to the surface of the PET film opposite to the hard coat layer so that the cured film thickness was 5 ⁇ m, and the temperature was 70 ° C. for 1 minute. After drying, an adhesive layer was formed, and a hard coat film with an adhesive layer was obtained.
- the surface of the hard coat film with an adhesive layer on the adhesive layer side was bonded to a chemically reinforced glass substrate having a thickness of 30 ⁇ m using a hand roller.
- the adhesive layer was cured by heating at 130 ° C. for 60 minutes to obtain a laminate.
- Pencil hardness In the same manner as in Evaluation 1 above, the pencil hardness on the surface of the laminated body on the hard coat layer side was measured. Pencil hardness was evaluated according to the following criteria. 2A: Pencil hardness is 2H or more. A: The pencil hardness is H. B: The pencil hardness is F. C: Pencil hardness is HB or less.
- Dynamic bending test A dynamic bending test was performed in the same manner as in the above evaluation 1, and the bending resistance was evaluated. At this time, a dynamic bending test was performed under three conditions of (a) temperature 23 ° C., (b) temperature 60 ° C. and humidity 90% RH, and (c) temperature ⁇ 20 ° C.
- the preferable range of the glass transition temperature of the bonded layer is -40 ° C or higher and 150 ° C or lower, but the glass transition temperature of the bonded layer is -40 ° C from the viewpoint of dynamic flexibility in a high temperature and high humidity or low temperature environment. It was suggested that it is more preferable that the temperature is 25 ° C. or lower and 50 ° C. or higher and 150 ° C. or lower.
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Abstract
Description
屈曲耐久性試験:積層体を伸ばした状態から、ガラス板の面が凹となる方向に屈曲半径が3mmとなるように180°折り曲げ、再び伸ばす動作を1セットとし、1分間に43セットの速さで上記動作を行った際における、積層体にクラックが生じるまでのセット数を屈曲耐久性の指標とする。
屈曲耐久性試験:積層体を伸ばした状態から、ガラス板の面が凹となる方向に屈曲半径が3mmとなるように180°折り曲げ、再び伸ばす動作を1セットとし、1分間に43セットの速さで上記動作を行った際における、積層体にクラックが生じるまでのセット数を屈曲耐久性の指標とする。
0.001≦{(E1×D1 2+E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (1)
(上記式(1)中、E1は上記ハードコート層の複合弾性率(GPa)、D1は上記ハードコート層の厚さ(mm)、E2は上記基材層の複合弾性率(GPa)、D2は上記基材層の厚さ(mm)、E3は上記接合層の複合弾性率(GPa)、D3は上記接合層の厚さ(mm)、E4は上記ガラス基材の複合弾性率(GPa)、D4は上記ガラス基材の厚さ(mm)、E5は上記第2の接合層の貯蔵弾性率(GPa)、D5は上記第2の接合層の厚さ(mm)を示す。)
0.001≦{(E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (2)
(上記式(2)中、E2は上記基材層の複合弾性率(GPa)、D2は上記基材層の厚さ(mm)、E3は上記接合層の複合弾性率(GPa)、D3は上記接合層の厚さ(mm)、E4は上記ガラス基材の複合弾性率(GPa)、D4は上記ガラス基材の厚さ(mm)、E5は上記第2の接合層の貯蔵弾性率(GPa)、D5は上記第2の接合層の厚さ(mm)を示す。)
本開示における積層体は、3つの実施態様を有する。以下、各実施態様に分けて説明する。
本開示の発明者らは、ガラス基材を有する積層体について鋭意検討を行い、薄いガラス基材の表面に樹脂層を配置し、さらに樹脂層の厚さを厚くすることにより、ガラス基材の割れを抑制し、耐衝撃性を高めることができることを見出した。しかし、ガラス基材の表面に樹脂組成物を塗布して比較的厚い樹脂層を形成する場合、樹脂組成物の塗布後の加熱または硬化時に、ガラス基材と樹脂層との収縮差の影響が大きくなり、カールが生じてしまう場合があることが判明した。そして、本開示の本発明者らはさらに検討を重ね、予め樹脂層をフィルム化し、薄いガラス基材の表面に接合層を介して樹脂フィルムを貼り合わせることにより、カールを抑制しつつ、さらに耐衝撃性を高めることができることを見出した。しかし、このような積層体においては、積層体の樹脂フィルム側の面の表面硬度が低くなり、耐傷性が低下する場合があることを知見した。
本実施態様においては、ハードコート層の厚さをA、基材層の厚さをB、接合層の厚さをCとしたとき、厚さの比率(A+B)/Cは、3.0以上であり、好ましくは4.0以上であり、より好ましくは5以上である。上記の厚さの比率が上記範囲であることにより、積層体のハードコートフィルム側の面の表面硬度を高くし、耐傷性を向上させることができる。一方、厚さの比率(A+B)/Cは、500以下であり、好ましくは150以下、より好ましくは100以下、さらに好ましくは70以下、特に好ましくは40以下である。上記の厚さの比率が大きすぎると、接合層の厚さが相対的に極めて薄くなるため、接着性が弱くなり耐屈曲性、特に動的屈曲性が低下するおそれや、耐衝撃性が低下するおそれがある。厚さの比率(A+B)/Cは、3.0以上500以下であり、好ましくは4.0以上150以下、より好ましくは5以上100以下、さらに好ましくは5以上70以下、特に好ましくは5以上40以下である。
本実施態様における接合層は、ガラス基材とハードコートフィルムとの間に配置され、ガラス基材とハードコートフィルムとを接合するための層である。
・荷重速度:2.5μN/秒
・保持時間:5秒
・荷重除荷速度:2.5μN/秒
・測定温度:25℃
・荷重速度:0.5μN/秒
・保持時間:5秒
・荷重除荷速度:0.5μN/秒
・測定温度:25℃
・測定サンプル:φ5mm×高さ5mmの円柱状
・測定治具:圧縮(パラレルプレート)
・測定モード:温度依存性(温度範囲:-50℃~200℃、昇温速度:5℃/min)
・周波数:1Hz
本実施態様におけるハードコートフィルムは、上記接合層側から、基材層と、ハードコート層とを有する。
本実施態様におけるハードコート層は、表面硬度を高めるための層である。ハードコート層が配置されていることにより、耐傷性を向上させることができる。
ここで、「ハードコート層」とは、表面硬度を高めるための部材であり、具体的には、本実施態様における積層体がハードコート層を有する構成において、JIS K 5600-5-4(1999)で規定される鉛筆硬度試験を行った場合に、「H」以上の硬度を示すものをいう。
ハードコート層は、単層であってもよく、2層以上の多層構造を有していてもよい。ハードコート層が多層構造を有する場合、表面硬度を向上し、かつ、耐屈曲性および弾性率のバランスを良好にするために、ハードコート層は、鉛筆硬度を充足させるための層と、動的屈曲試験を充足させるための層(耐擦傷性を充足させるための層)とを有していてもよい。
ハードコート層の材料としては、例えば、樹脂硬化物が挙げられる。具体的には、ハードコート層は、重合性化合物を含む樹脂組成物の硬化物を含むことが好ましい。重合性化合物を含む樹脂組成物の硬化物は、重合性化合物を、必要に応じて重合開始剤を用い、公知の方法で重合反応させることにより得ることができる。
重合性化合物は、分子内に重合性官能基を少なくとも1つ有するものである。重合性化合物としては、例えば、ラジカル重合性化合物およびカチオン重合性化合物の少なくとも1種を用いることができる。
樹脂組成物は、必要に応じて重合開始剤を含有していてもよい。重合開始剤としては、ラジカル重合開始剤、カチオン重合開始剤、ラジカル及びカチオン重合開始剤等を適宜選択して用いることができる。これらの重合開始剤は、光照射及び加熱の少なくとも一種により分解されて、ラジカルもしくはカチオンを発生してラジカル重合とカチオン重合を進行させるものである。なお、ハードコート層中には、重合開始剤が全て分解されて残留していない場合もある。
ハードコート層は、無機又は有機粒子を含有することが好ましく、無機微粒子を含有することがより好ましい。ハードコート層が粒子を含有することにより、硬度を向上させることができる。
ハードコート層は、紫外線吸収剤を含有していてもよい。基材層の紫外線による劣化を抑制することができる。中でも、基材層がポリイミドを含有する場合には、ポリイミドを含有する基材層の経時的な色変化を抑制することができる。また、積層体を備える表示装置において、積層体よりも表示パネル側に配置されている部材、例えば偏光子等の紫外線による劣化を抑制することができる。
ハードコート層は、防汚剤を含有していてもよい。積層体に防汚性を付与することができる。
ハードコート層は、必要に応じて、添加剤をさらに含有することができる。添加剤としては、ハードコート層に付与する機能に応じて適宜選択され、特に限定はされないが、例えば、屈折率を調整するための無機又は有機粒子、赤外線吸収剤、防眩剤、防汚剤、帯電防止剤、青色色素や紫色色素等の着色剤、レベリング剤、界面活性剤、易滑剤、各種増感剤、難燃剤、接着付与剤、重合禁止剤、酸化防止剤、光安定化剤、表面改質剤等が挙げられる。
ハードコート層の形成方法としては、例えば、基材層上に、上記重合性化合物等を含むハードコート層用硬化性樹脂組成物を塗布し、硬化させる方法等が挙げられる。
本実施態様における基材層は、ハードコート層を支持する部材である。
本実施態様において、基材層の複合弾性率は、例えば、5.7GPa以上であることが好ましく、6.5GPa以上であることがより好ましく、7.5GPa以上であることがさらに好ましい。基材層の複合弾性率が上記範囲であることにより、積層体のハードコートフィルム側の面の表面硬度を高めることができ、耐傷性を向上させることができる。
基材層としては、例えば、樹脂基材を用いることができる。樹脂基材を構成する樹脂は、上述の複合弾性率を満たし、透明性を有することが好ましい。このような樹脂としては、例えば、ポリイミド系樹脂、ポリアミド系樹脂、ポリエステル系樹脂、セルロース系樹脂、アクリル系樹脂、ポリカーボネート系樹脂、ポリエチレンナフタラート系樹脂等が挙げられる。ポリイミド系樹脂としては、例えば、ポリイミド、ポリアミドイミド、ポリエーテルイミド、ポリエステルイミド等が挙げられる。ポリエステル系樹脂としては、例えば、ポリエチレンテレフタレート(PET)、ポリプロピレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート(PEN)等が挙げられる。セルロース系樹脂としては、例えば、トリアセチルセルロース(TAC)等が挙げられる。アクリル系樹脂としては、例えば、ポリ(メタ)アクリル酸メチル、ポリ(メタ)アクリル酸エチル等が挙げられる。なお、樹脂基材は、単層であってもよく、共押出フィルム等の多層であってもよい。中でも、耐屈曲性を有し、優れた硬度および透明性を有することから、ポリイミド系樹脂が好ましい。
ポリイミドは、テトラカルボン酸成分とジアミン成分とを反応させて得られるものである。ポリイミドとしては、上述の複合弾性率を満たし、透明性を有するものであれば特に限定されるものではないが、例えば、優れた透明性および優れた剛性を有する点から、下記一般式(1)および下記一般式(3)で表される構造からなる群から選ばれる少なくとも1種の構造を有することが好ましい。
ポリアミドイミドとしては、上述の複合弾性率を満たし、透明性を有するものであれば特に限定されるものではなく、例えば、ジアンヒドリド由来の構成単位およびジアミン由来の構成単位を含む第1ブロックと、芳香族ジカルボニル化合物由来の構成単位および芳香族ジアミン由来の構成単位を含む第2ブロックと、を有するものを挙げることができる。上記ポリアミドイミドにおいて、上記ジアンヒドリドは、例えば、ビフェニルテトラカルボン酸二無水物(BPDA)および2-ビス(3,4-ジカルボキシフェニル)ヘキサフルオロプロパン二無水物(6FDA)を含むことができる。また、上記ジアミンは、ビストリフルオロメチルベンジジン(TFDB)を含むことができる。すなわち、上記ポリアミドイミドは、ジアンヒドリドおよびジアミンを含む単量体が共重合された第1ブロックと、芳香族ジカルボニル化合物および芳香族ジアミンを含む単量体が共重合された第2ブロックとを有するポリアミドイミド前駆体をイミド化させた構造を有するものである。上記ポリアミドイミドは、イミド結合を含む第1ブロックとアミド結合を含む第2ブロックとを有することにより、光学特性だけでなく、熱的、機械的特性に優れたものとなる。特に、第1ブロックを形成するジアミンとして、ビストリフルオロメチルベンジジン(TFDB)を使用することにより、熱安定性および光学特性を向上させることができる。また、第1ブロックを形成するジアンヒドリドとして、2-ビス(3,4-ジカルボキシフェニル)ヘキサフルオロプロパン二無水物(6FDA)およびビフェニルテトラカルボン酸二無水物(BPDA)を使用することにより、複屈折の向上および耐熱性の確保を図ることができる。
本実施態様におけるガラス基材の厚さは、100μm以下であり、好ましくは90μm以下、より好ましくは80μm以下、さらに好ましくは70μm以下である。ガラス基材の厚さが上記範囲のように薄いことにより、良好な耐屈曲性を得ることができるともに、十分な硬度を得ることができる。また、積層体のカールを抑制することもできる。さらに、積層体の軽量化の面で好ましい。一方、ガラス基材の厚さは、例えば、好ましくは10μm以上、より好ましくは15μm以上、さらに好ましくは20μm以上、特に好ましくは30μm以上である。ガラス基材の厚さが上記範囲であることにより、良好な耐衝撃性を得ることができる。ガラス基材の厚さは、10μm以上100μm以下であり、好ましくは15μm以上90μm以下、より好ましくは20μm以上80μm以下、さらに好ましくは25μm以上75μm以下である。
本実施態様における積層体は、ハードコート層の基材層とは反対の面側、ハードコート層と基材層との間、基材層と接合層との間、ガラス基材と接合層との間、あるいはガラス基材の接合層とは反対の面側に、機能層をさらに有することができる。
本実施態様における積層体は、例えば図2に示すように、ハードコート層6の基材層5とは反対の面側に反射防止層7を有していてもよい。また、反射防止層7は、例えば図2に示すようにハードコートフィルム4を構成する層であってもよい。
(1)反射防止層の断面をTEMまたはSTEMで撮像する。TEMまたはSTEMの加速電圧は、例えば10kv以上30kV以下、倍率は、例えば5万倍以上30万倍以下とすることが好ましい。
(2)観察画像から任意の10個の粒子を抽出し、個々の粒子の粒子径を算出する。粒子径は、粒子の断面を任意の平行な2本の直線で挟んだとき、該2本の直線間距離が最大となるような2本の直線の組み合わせにおける直線間距離として測定される。
(3)同じサンプルの別画面の観察画像において同様の作業を5回行って、合計50個分の数平均から得られる値を粒子の平均粒子径とする。
本実施態様における積層体においては、例えば図4に示すように、ガラス基材2の接合層3とは反対の面側に第2の接合層10が配置されていてもよい。第2の接合層は、積層体と他の部材とを接合するための層である。他の部材としては、例えば、後述の表示装置における表示パネル等が挙げられる。また、第2の接合層は、通常、積層体の最表面に配置される。
・測定サンプル:φ5mm×高さ5mmの円柱状
・測定治具:圧縮(パラレルプレート)
・測定モード:温度依存性(温度範囲:-50℃~200℃、昇温速度:5℃/min)
・周波数:1Hz
T2×E’1/T1≧0.1 (4)
上記式(4)を満たす場合には、例えば、ガラス基材の厚さが比較的薄い場合であっても、第2の接合層の貯蔵弾性率が大きく、第2の接合層がある程度の硬さを有する場合には、耐衝撃性を良好にすることができる。上記式(4)の左辺は、0.1以上30以下であることが好ましい。
本実施態様における積層体においては、例えば図3に示すように、ガラス基材2の接合層3とは反対の面側に、ガラス基材2側から、第3の接合層8および第2の基材層9が配置されていてもよい。
本実施態様における第2の基材層は、ガラス基材の接合層とは反対の面側に第3の接合層を介して配置され、衝撃によるガラス基材の瞬間的かつ局所的な変形を抑制するための層である。本実施態様における積層体を例えば表示装置の表示パネルの観察者側に配置する場合には、積層体は、第2の基材層側の面が表示パネルに対向するように配置される。また、本実施態様における積層体を例えば樹脂成型品の表面に配置する場合には、積層体は、第2の基材層側の面が樹脂成型品に対向するように配置される。
本実施態様における第3の接合層は、ガラス基材と第2の基材層との間に配置され、ガラス基材と第2の基材層とを接合するための層である。
本実施態様における積層体においては、ハードコートフィルムの接合層とは反対の面側に保護フィルムが配置されていてもよい。保護フィルムにより、積層体を保護するとともに、耐衝撃性を高めることができる。
本実施態様における積層体は、表示装置に用いる場合には、透明性を有することが好ましい。具体的には、本実施態様における積層体の全光線透過率は、例えば、80%以上であることが好ましく、85%以上であることがより好ましく、88%以上であることがさらに好ましい。このように全光線透過率が高いことにより、透明性が良好な積層体とすることができる。
本実施態様における積層体の用途は、特に限定されるものではなく、例えば、表示装置において、表示パネルの観察者側に配置される部材として用いることができる。本実施態様における積層体は、例えば、スマートフォン、タブレット端末、ウェアラブル端末、パーソナルコンピュータ、テレビジョン、デジタルサイネージ、パブリックインフォメーションディスプレイ(PID)、車載ディスプレイ等の表示装置に用いることができる。
本開示の発明者らは、ガラス基材を有する積層体について鋭意検討を行い、薄いガラス基材の表面に樹脂層を配置し、さらに樹脂層の厚さを厚くすることにより、ガラス基材の割れを抑制し、耐衝撃性を高めることができることを見出した。しかし、ガラス基材の表面に樹脂組成物を塗布して比較的厚い樹脂層を形成する場合、樹脂組成物の塗布後の加熱または硬化時に、ガラス基材と樹脂層との収縮差の影響が大きくなり、カールが生じてしまう場合があることが判明した。そして、本開示の本発明者らはさらに検討を重ね、予め樹脂層をフィルム化し、薄いガラス基材の表面に接合層を介して樹脂フィルムを貼り合わせることにより、カールを抑制しつつ、さらに耐衝撃性を高めることができることを見出した。
0.001≦{(E1×D1 2+E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (1)
(上記式(1)中、E1は上記ハードコート層の複合弾性率(GPa)、D1は上記ハードコート層の厚さ(mm)、E2は上記基材層の複合弾性率(GPa)、D2は上記基材層の厚さ(mm)、E3は上記接合層の複合弾性率(GPa)、D3は上記接合層の厚さ(mm)、E4は上記ガラス基材の複合弾性率(GPa)、D4は上記ガラス基材の厚さ(mm)、E5は上記第2の接合層の貯蔵弾性率(GPa)、D5は上記第2の接合層の厚さ(mm)を示す。)
0.001≦{(E1×D1 2+E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (1)
(上記式(1)中、E1は上記ハードコート層の複合弾性率(GPa)、D1は上記ハードコート層の厚さ(mm)、E2は上記基材層の複合弾性率(GPa)、D2は上記基材層の厚さ(mm)、E3は上記接合層の複合弾性率(GPa)、D3は上記接合層の厚さ(mm)、E4は上記ガラス基材の複合弾性率(GPa)、D4は上記ガラス基材の厚さ(mm)、E5は上記第2の接合層の貯蔵弾性率(GPa)、D5は上記第2の接合層の厚さ(mm)を示す。)
本実施態様は、上記第2実施態様と同様に、耐屈曲性および耐衝撃性を両立することが可能な積層体を提供することを目的とする。
0.001≦{(E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (2)
(上記式(2)中、E2は上記基材層の複合弾性率(GPa)、D2は上記基材層の厚さ(mm)、E3は上記接合層の複合弾性率(GPa)、D3は上記接合層の厚さ(mm)、E4は上記ガラス基材の複合弾性率(GPa)、D4は上記ガラス基材の厚さ(mm)、E5は上記第2の接合層の貯蔵弾性率(GPa)、D5は上記第2の接合層の厚さ(mm)を示す。)
0.001≦{(E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (2)
(上記式(2)中、E2は上記基材層の複合弾性率(GPa)、D2は上記基材層の厚さ(mm)、E3は上記接合層の複合弾性率(GPa)、D3は上記接合層の厚さ(mm)、E4は上記ガラス基材の複合弾性率(GPa)、D4は上記ガラス基材の厚さ(mm)、E5は上記第2の接合層の貯蔵弾性率(GPa)、D5は上記第2の接合層の厚さ(mm)を示す。)
本開示における表示装置は、表示パネルと、上記表示パネルの観察者側に配置された、上述の積層体と、を備え、上記積層体は、上記ガラス基材側の面が上記表示パネルと対向するように配置されている。すなわち、本開示における表示装置は、表示パネルと、上記表示パネルの観察者側に配置された、上述の積層体と、を備え、上記積層体は、上記ガラス基材側の面が上記表示パネルに隣接するように配置されている。
厚さ70μmの化学強化されたガラス基材を用いた。
(1)ハードコートフィルムの作製
(1-1)基材層の作製
国際公開2014/046180号公報の合成例1を参照して、下記化学式で表されるテトラカルボン酸二無水物を合成した。
下記に示す組成となるように各成分を配合して、ハードコート層用硬化性樹脂組成物を調製した。
・ジペンタエリスリトールペンタアクリレートとジペンタエリスリトールヘキサアクリレートの混合物(M403、東亜合成社製) 25質量部
・ジペンタエリスリトールEO変性ヘキサアクリレート(A-DPH-6E、新中村化学社製) 25質量部
・異型シリカ微粒子(平均粒径25nm、日揮触媒化成社製) 50質量部(固形換算)
・光重合開始剤(1-ヒドロキシシクロヘキシルフェニルケトン、製品名「Omnirad184」、IGM Resins B.V.社製) 4質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・紫外線吸収剤1(DAINSORB P6、大和化成製) 3質量部
・溶剤(MIBK) 150質量部
上記ハードコートフィルムの基材層側の面に、厚さ25μmの接合層(アクリル系粘着シート、OCA)(3M社製「8146-1」)をハンドローラを用いて貼合し、接合層付きハードコートフィルムを得た。次いで、接合層付きハードコートフィルムの接合層側の面を、厚さ70μmの化学強化されたガラス基材に、ハンドローラを用いて貼合し、積層体を得た。
ハードコートフィルムの基材層の厚さを下記表1に示すように変更したこと、および接合層の厚さが15μm、10μmまたは5μmの場合は、接合層(アクリル系粘着シート、OCA)としてパナック社製「パナクリーンPD-S1」を用いたこと以外は、実施例1と同様にして積層体を得た。
(1)ハードコートフィルムの作製
実施例7と同様にしてハードコートフィルムを作製した。
下記に示す組成となるように各成分を配合して、ヒートシール性樹脂組成物を調製した。
・非晶性ポリエステル系樹脂(バイロン560、東洋紡社製) 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 310質量部
・溶剤(トルエン) 310質量部
上記感熱接着層付きハードコートフィルムを、感熱接着層側の面が、厚さ70μmの化学強化されたガラス基材と接するように配置し、ガラス基材の感熱接着層付きハードコートフィルムとは反対側の面に厚さ2mmのガラス支持基板を配置して、ロールラミネータ(アコ・ブランズ・ジャパン社製、商品名:デスクトップロールラミネーター B35A3)を用いて感熱接着層付きハードコートフィルムとガラス基材とを加熱しながら貼合し、積層体を得た。この際、ロール温度は140℃~149℃、送り速度は0.3m/minとした。その後、積層体を、70℃で2日間エージングした。
接合層の厚さを、下記表1に示すように変更したこと以外は、実施例10と同様にして積層体を得た。
感熱接着層に変えて、感圧接着層を形成したこと、および積層体の作製において、ロール温度を20℃~30℃としたこと以外は、実施例10と同様にして積層体を得た。
下記に示す組成となるように各成分を配合して、感圧接着剤組成物を調製した。
・ポリエーテルウレタン系樹脂 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 310質量部
・溶剤(トルエン) 310質量部
接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(リンテック社製「D692」)を用いたこと以外は、実施例7と同様にして積層体を得た。
下記に示すヒートシール性樹脂組成物を用いたこと以外は、実施例10と同様にして積層体を得た。
・変性ポリオレフィン系樹脂 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 310質量部
・溶剤(トルエン) 310質量部
下記に示すヒートシール性樹脂組成物を用いたこと以外は、実施例10と同様にして積層体を得た。
・ポリエステルウレタン系樹脂(UR-8300、固形分30%、東洋紡社製) 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 1.5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 1.5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 58質量部
・溶剤(トルエン) 58質量部
下記に示すヒートシール性樹脂組成物を用いたこと以外は、実施例10と同様にして積層体を得た。
・ポリエステルウレタン系樹脂(UR-5537、固形分30%、東洋紡社製) 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 1.5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 1.5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 58質量部
・溶剤(トルエン) 58質量部
下記に示すヒートシール性樹脂組成物を用いたこと以外は、実施例10と同様にして積層体を得た。
・非晶性ポリエステル系樹脂(バイロン240、東洋紡社製) 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 310質量部
・溶剤(トルエン) 310質量部
下記に示すヒートシール性樹脂組成物を用いたこと以外は、実施例10と同様にして積層体を得た。
・非晶性ポリエステル系樹脂(バイロン600、東洋紡社製) 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 310質量部
・溶剤(トルエン) 310質量部
(1)ハードコートフィルムの作製
実施例7と同様にしてハードコートフィルムを作製した。
下記に示す組成となるように各成分を配合して、紫外線硬化型樹脂組成物を調製した。
・ウレタンアクリレート(製品名「UV-3310B」、三菱ケミカル株式会社製):35質量部
・エトキシ化ペンタエリスリトールテトラアクリレート(製品名「ATM-35E」、新中村化学工業株式会社製):10質量部
・フェノキシエチルアクリレート(製品名「ビスコート#192」、大阪有機化学工業社製):5質量部
・ペンタエリスリトールトリアクリレートおよびペンタエリスリトールテトラアクリレートの混合物(製品名「KAYARAD PET-30」、日本化薬株式会社製):50質量部
・光重合開始剤(1-ヒドロキシシクロヘキシルフェニルケトン、製品名「Omnirad184」、IGM Resins B.V.社製):5質量部
・メチルイソブチルケトン:10質量部
上記接着剤層付きハードコートフィルムの接着剤層側の面を、厚さ70μmの化学強化されたガラス基材に、ハンドローラを用いて貼合した。次に、ハードコートフィルム側から、照射量400mJ/cm2で紫外線を照射して接着剤層を硬化させ、積層体を得た。
(1)ハードコートフィルムの作製
実施例7と同様にしてハードコートフィルムを作製した。
下記に示す組成となるように各成分を配合して、熱硬化型樹脂組成物を調製した。
・特殊ノボラック型エポキシ樹脂(jER157S65 三菱ケミカル製) 25質量部
・ビスA/ビスF混合タイプエポキシ樹脂(jER4250 三菱ケミカル製) 75質量部
・2-エチル-4-メチルイミダゾール(東京化成工業製) 6.5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 600質量部
上記接着剤層付きハードコートフィルムの接着剤層側の面を、厚さ70μmの化学強化されたガラス基材に、ハンドローラを用いて貼合した。次に、130℃で60分間加熱して、接着剤層を硬化させ、積層体を得た。
下記に示す熱硬化型樹脂組成物を用いたこと以外は、実施例23と同様にして積層体を得た。
・特殊ノボラック型エポキシ樹脂(jER157S65 三菱ケミカル製) 50質量部
・ビスAタイプエポキシ樹脂(jER1256 三菱ケミカル製) 50質量部
・2-エチル-4-メチルイミダゾール(東京化成工業製) 6.5質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 5質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 600質量部
(1)ハードコートフィルムの作製
基材層として、厚さ60μmのTACフィルム(富士フイルム社製「TG60UL」)を用い、ハードコート層の厚さを下記表1に示すように変更したこと以外は、実施例10と同様にしてハードコートフィルムを作製した。
実施例10と同様にして、感熱接着層付きハードコートフィルムを得た。
実施例10と同様にして、積層体を得た。
(1)ハードコートフィルムの作製
基材層として、厚さ50μmのPETフィルム(東洋紡社製「A4360(現品番)」(「A4300(旧品番)」))を用い、ハードコート層の厚さを下記表1に示すように変更したこと以外は、実施例10と同様にしてハードコートフィルムを作製した。
実施例10と同様にして、感熱接着層付きハードコートフィルムを得た。
実施例10と同様にして、積層体を得た。
基材層として、厚さ50μmのPENフィルム(帝人社製)を用いたこと以外は、実施例26と同様にして積層体を作製した。
ガラス基材の厚さを、下記表3に示すように変更したこと以外は、実施例10と同様にして積層体を得た。
(1)鉛筆硬度
まず、実施例1~30および比較例2~6については積層体のガラス基材側の面に、比較例1についてはガラス基材に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、複合弾性率9.6MPa)を介して、厚さ100μmのPETフィルム(東洋紡社製「A4160(現品番)」(「A4100(旧品番)」)、複合弾性率6.9GPa)を貼り合わせて、試験用積層体を作製した。実施例1~30および比較例2~6の積層体については、試験用積層体のハードコートフィルム側の表面における鉛筆硬度を測定した。また、比較例1のガラス基材については、試験用積層体のガラス基材側の表面における鉛筆硬度を測定した。この際、鉛筆硬度は、JIS K5600-5-4(1999)に準拠して測定した。また、鉛筆硬度試験機(製品名「鉛筆引っかき塗膜硬さ試験機(電動式)」、株式会社東洋精機製作所製)を用い、測定条件は、角度45°、荷重1kg、速度0.5mm/秒以上1mm/秒以下、温度23±2℃とした。
2A:鉛筆硬度が5H以上である。
A:鉛筆硬度が4Hである。
B:鉛筆硬度が3Hである。
C:鉛筆硬度がHである。
D:鉛筆硬度がH未満である。
2A:鉛筆硬度が5H以上である。
A:鉛筆硬度が4Hである。
B:鉛筆硬度が3Hである。
C:鉛筆硬度が3H未満である。
実施例1~30および比較例2~6の積層体ならびに比較例1のガラス基材に対して、衝撃試験として、ペンドロップ試験を行った。まず、実施例1~30および比較例2~6については積層体のガラス基材側の面に、比較例1についてはガラス基材に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、複合弾性率9.6MPa)を介して、厚さ100μmのPETフィルム(東洋紡社製「A4160(現品番)」(「A4100(旧品番)」)、複合弾性率6.9GPa)を貼り合わせて、試験用積層体を作製した。この試験用積層体のPETフィルム側の面が厚さ30mmの金属プレートに接するように、金属プレート上に試験用積層体を置いた。次に、試験用積層体の中央部に対して、試験高さより、ペンをその先端を下にして試験用積層体上に落下させた。ペンには、ゼブラ社製のブレン0.5BAS88-BK(重量12g、ペン先0.5mmφ)を用いた。表1~3に、ガラス基材に割れが生じなかった最大の試験高さを示す。なお、数値が大きいほど、耐衝撃性が高いことを示す。
実施例10の積層体および比較例1のガラス基材に対して、上述の突き刺し試験を行い、突き刺し破断力を測定した。なお、数値が大きいほど、耐衝撃性が高いことを示す。
実施例1~30および比較例2~6の積層体ならびに比較例1のガラス基材に対して、上述の動的屈曲試験を行い、耐屈曲性を評価した。この際、積層体またはガラス基材の対向する2つの短辺部の間隔dは3mm、4mm、6mm、8mmまたは10mmとした。また、積層体は、ガラス基材側の面が外側、ハードコートフィルム側の面が内側になるように20万回屈曲させた。動的屈曲試験の結果は、下記の基準で評価した。
4A:間隔dが3mmでも積層体またはガラス基材に割れ、破断、および剥がれがないこと
3A:間隔dが4mmでも積層体またはガラス基材に割れ、破断、および剥がれがないこと
2A:間隔dが6mmでも積層体またはガラス基材に割れ、破断、および剥がれがないこと
A:間隔dが8mmでも積層体またはガラス基材に割れ、破断、および剥がれがないこと
B:間隔dが10mmで積層体またはガラス基材に割れ、破断、および剥がれがないこと
C:間隔dが10mmで積層体またはガラス基材に割れ、破断、および剥がれが発生した
実施例1~30および比較例2~6の積層体について、上述の複合弾性率の測定方法により、基材層および接合層の複合弾性率を測定した。
実施例1~30および比較例2~6の積層体について、上述のガラス転移温度の測定方法により、接合層のガラス転移温度を測定した。
実施例10の積層体のガラス基材側の面に、厚さ100μmの第2の接合層(光学透明粘着フィルム(OCA)、貯蔵弾性率0.10MPa)をハンドローラを用いて貼合し、積層体を得た。
第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ50μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.10MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ55μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.12MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ30μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.12MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.32MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.15MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(リンテック社製「F619」、貯蔵弾性率0.19MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(リンテック社製「N632」、貯蔵弾性率0.20MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.57MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(貯蔵弾性率1.17MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(リンテック社製「D692、貯蔵弾性率2.33MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(貯蔵弾性率2.22MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ15μmの光学透明粘着フィルム(OCA)(リンテック社製「D692、貯蔵弾性率2.14MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ15μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.12MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.91MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ10μmの光学透明粘着フィルム(OCA)(貯蔵弾性率2.22MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(貯蔵弾性率1.95MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(貯蔵弾性率2.22MPa)とを用いたこと以外は、実施例31と同様にして積層体を作製した。
第2の接合層として、厚さ15μmの光学透明粘着フィルム(OCA)(貯蔵弾性率12.74MPa)を用いたこと以外は、実施例31と同様にして積層体を作製した。
実施例18の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例19の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例20の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例21の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例22の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例23の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例28の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
ハードコート層の厚さを10μmとしたこと以外は、実施例26と同様にして積層体を作製した。この積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
実施例26の積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
ガラス基材の厚さを50μmとしたこと以外は、実施例57と同様にして積層体を作製した。
接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(複合弾性率0.0096GPa)を用いたこと以外は、実施例33と同様にして積層体を作製した。
接合層として、厚さ50μmの光学透明粘着フィルム(OCA)(複合弾性率0.0096GPa)を用いたこと以外は、実施例59と同様にして積層体を作製した。
ガラス基材の厚さを50μmとしたこと、および、第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例33と同様にして積層体を作製した。
基材層として、厚さ50μmのPENフィルム(帝人社製)を用いたこと以外は、実施例62と同様にして積層体を作製した。
基材層として、厚さ50μmのPETフィルム(東洋紡社製「A4360」)を用いたこと以外は、実施例62と同様にして積層体を作製した。
ガラス基材の厚さを30μmとしたこと、および、第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例33と同様にして積層体を作製した。
基材層として、厚さ50μmのPENフィルム(帝人社製)を用いたこと以外は、実施例65と同様にして積層体を作製した。
基材層として、厚さ50μmのPETフィルム(東洋紡社製「A4360」)を用いたこと以外は、実施例65と同様にして積層体を作製した。
接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(複合弾性率0.0096GPa)を用いたこと、および、第2の接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(複合弾性率0.23MPa)を用いたこと以外は、実施例67と同様にして積層体を作製した。
基材層の厚さを80μmとしたこと、および、ガラス基材の厚さを50μmとしたこと以外は、実施例33と同様にして積層体を作製した。
基材層として、厚さ23μmのPETフィルム(東レ社製「U403」)を用いたこと、および、ガラス基材の厚さを30μmとしたこと以外は、実施例59と同様にして積層体を作製した。
第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例68と同様にして積層体を作製した。
厚さ70μmの化学強化されたガラス基材の一方の面に、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
ガラス基材の厚さを50μmとしたこと以外は、比較例10と同様にして積層体を作製した。
ガラス基材の厚さを30μmとしたこと以外は、比較例10と同様にして積層体を作製した。
実施例1と同様にして、厚さ80μmのポリイミド系樹脂フィルムからなる基材層を作製した。基材層の一方の面に、実施例10と同様にして感熱接着層を形成し、感熱接着層付き基材層を得た。感熱接着層付き基材層を、感熱接着層側の面が、厚さ70μmの化学強化されたガラス基材と接するように配置し、ガラス基材の感熱接着層付き基材層とは反対側の面に厚さ2mmのガラス支持基板を配置して、ロールラミネータ(アコ・ブランズ・ジャパン社製、商品名:デスクトップロールラミネーター B35A3)を用いて感熱接着層付き基材層とガラス基材とを加熱しながら貼合し、積層体を得た。この際、ロール温度は140℃~149℃、送り速度は0.3m/minとした。その後、積層体を、70℃で2日間エージングした。次に、積層体のガラス基材側の面に、厚さ50μmの光学透明粘着フィルム(OCA)(3M社製「8146-2」、貯蔵弾性率0.23MPa)をハンドローラを用いて貼合し、積層体を得た。
基材層の厚さを50μmとしたこと以外は、実施例71と同様にして積層体を作製した。
基材層の厚さを50μmとしたこと、および、ガラス基材の厚さを50μmとしたこと以外は、実施例71と同様にして積層体を作製した。
基材層の厚さを50μmとしたこと、および、ガラス基材の厚さを30μmとしたこと以外は、実施例71と同様にして積層体を作製した。
基材層の厚さを30μmとしたこと以外は、実施例71と同様にして積層体を作製した。
基材層として、厚さ75μmのPETフィルム(東洋紡社製「A4360」)を用いたこと以外は、実施例71と同様にして積層体を作製した。
基材層として、厚さ50μmのPETフィルム(東洋紡社製「A4360」)を用いたこと以外は、実施例71と同様にして積層体を作製した。
ガラス基材の厚さを50μmとしたこと以外は、実施例77と同様にして積層体を作製した。
ガラス基材の厚さを30μmとしたこと以外は、実施例77と同様にして積層体を作製した。
基材層として、厚さ23μmのPETフィルム(東レ社製「U403」)を用いたこと以外は、実施例71と同様にして積層体を作製した。
基材層として、厚さ60μmのTACフィルム(富士フイルム社製「TG60UL」)を用いたこと以外は、実施例71と同様にして積層体を作製した。
基材層として、厚さ50μmのPENフィルム(帝人社製)を用いたこと以外は、実施例71と同様にして積層体を作製した。
ガラス基材の厚さを50μmとしたこと、および、第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例71と同様にして積層体を作製した。
基材層として、厚さ50μmのPENフィルム(帝人社製)を用いたこと以外は、実施例83と同様にして積層体を作製した。
基材層として、厚さ50μmのPETフィルム(東洋紡社製「A4360」)を用いたこと以外は、実施例83と同様にして積層体を作製した。
ガラス基材の厚さを30μmとしたこと、および、第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例71と同様にして積層体を作製した。
基材層として、厚さ50μmのPENフィルム(帝人社製)を用いたこと以外は、実施例86と同様にして積層体を作製した。
基材層として、厚さ50μmのPETフィルム(東洋紡社製「A4360」)を用いたこと以外は、実施例86と同様にして積層体を作製した。
接合層として、厚さ25μmの光学透明粘着フィルム(OCA)(複合弾性率0.0096GPa)を用いたこと、および、第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例88と同様にして積層体を得た。
第2の接合層として、厚さ15μmの光学透明粘着フィルム(OCA)(貯蔵弾性率2.14MPa)を用いたこと以外は、実施例72と同様にして積層体を得た。
第2の接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(貯蔵弾性率0.91MPa)を用いたこと以外は、実施例72と同様にして積層体を得た。
第2の接合層として、厚さ10μmの光学透明粘着フィルム(OCA)(貯蔵弾性率2.22MPa)を用いたこと以外は、実施例72と同様にして積層体を得た。
第2の接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(貯蔵弾性率1.95MPa)を用いたこと以外は、実施例72と同様にして積層体を得た。
基材層として、厚さ23μmのPETフィルム(東レ社製「U403」)を用いたこと、および、ガラス基材の厚さを30μmとしたこと以外は、実施例71と同様にして積層体を作製した。
第2の接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(貯蔵弾性率2.22MPa)を用いたこと以外は、実施例72と同様にして積層体を得た。
第2の接合層として、厚さ100μmの光学透明粘着フィルム(OCA)(3M社製「8146-4」、貯蔵弾性率0.23MPa)を用いたこと以外は、実施例94と同様にして積層体を得た。
(1)衝撃試験(ペンドロップ試験)
積層体に対して、衝撃試験として、ペンドロップ試験を行った。まず、積層体の第2の接合層側の面に、厚さ100μmのPETフィルム(東洋紡社製「A4160」複合弾性率6.9GPa)を貼り合わせて、試験用積層体を作製した。この試験用積層体のPETフィルム側の面が厚さ30mmの金属プレートに接するように、金属プレート上に試験用積層体を置いた。次に、試験用積層体の中央部に対して、試験高さより、ペンをその先端を下にして試験用積層体上に落下させた。ペンには、ゼブラ社製のブレン0.5BAS88-BK(重量12g、ペン先0.5mmφ)を用いた。表4~6に、ガラス基材に割れが生じなかった最大の試験高さを示す。なお、数値が大きいほど、耐衝撃性が高いことを示す。
まず、積層体の第2の接合層側の面に、厚さ38μmのPETフィルム(東洋紡社製「A4360」)をハンドローラで貼り合わせて、試験用積層体を作製した。上記の評価1と同様にして、動的屈曲試験を行い、耐屈曲性を評価した。この際、試験用積層体は、第2の接合層側の面が外側、ハードコート層または基材層側の面が内側になるように20万回屈曲させた。
上述の複合弾性率の測定方法により、ガラス基材、接合層、基材層およびハードコートの複合弾性率を測定した。
上述の第2の接合層の貯蔵弾性率の測定方法により、第2の接合層の20℃における貯蔵弾性率を測定した。
上述のガラス転移温度の測定方法により、接合層および第2の接合層のガラス転移温度を測定した。
厚さ50μmのPETフィルム(東洋紡社製「A4160」)を準備し、PETフィルム上に、バーコーターで、実施例1で用いたハードコート層用硬化性樹脂組成物を塗布し、塗膜を完成させた。その後、塗膜を100℃で3分間乾燥させた後、200mJの紫外線照射にて硬化させ、厚さ10μmのハードコート層を形成した。次いで、PETフィルムのハードコート層とは反対側の面に、実施例15と同様にして感圧接着層を形成した。これより、積層フィルムを得た。次に、厚さ30μmの化学強化されたガラス基材に、上記積層フィルムの接合層側の面を貼合し、積層体を得た。
接合層として、厚さ5μmの光学透明粘着フィルム(OCA)(リンテック社製「D692」、複合弾性率19MPa)を用いたこと以外は、実施例95と同様にして積層体を作製した。
接合層として、厚さ5μmの光学透明粘着フィルム(アクリル系粘着シート、OCA)(パナック社製「パナクリーンPD-S1」、複合弾性率13.7MPa)を用いたこと以外は、実施例95と同様にして積層体を作製した。
実施例95と同様にして、PETフィルム上にハードコート層を形成した。
実施例10で用いたヒートシール性樹脂組成物を用いたこと以外は、実施例98と同様にして積層体を作製した。
実施例18で用いたヒートシール性樹脂組成物を用いたこと以外は、実施例98と同様にして積層体を作製した。
実施例19で用いたヒートシール性樹脂組成物を用いたこと以外は、実施例98と同様にして積層体を作製した。
実施例21で用いたヒートシール性樹脂組成物を用いたこと以外は、実施例98と同様にして積層体を作製した。
実施例20で用いたヒートシール性樹脂組成物を用いたこと以外は、実施例98と同様にして積層体を作製した。
実施例95と同様にして、PETフィルム上にハードコート層を形成した。
下記のヒートシール性樹脂組成物を用いたこと以外は、実施例98と同様にして積層体を作製した。
・非晶性ポリエステル系樹脂(TP-235S20TM、固形分20%、三菱ケミカル社製) 100質量部
・ヘキサンメチレンジイソシアネート(コロネート2203、日本ポリウレタン工業社製) 1質量部
・シランカップリング剤(KBM-403、信越化学工業社製) 1質量部
・フッ素系レベリング剤(F568、DIC社製) 0.2質量部(固形換算)
・溶剤(MEK) 34質量部
・溶剤(トルエン) 10質量部
実施例95と同様にして、PETフィルム上にハードコート層を形成した。
(1)鉛筆硬度
上記の評価1と同様にして、積層体のハードコート層側の面における鉛筆硬度を測定した。鉛筆硬度は、下記の基準で評価した。
2A:鉛筆硬度が2H以上である。
A:鉛筆硬度がHである。
B:鉛筆硬度がFである。
C:鉛筆硬度がHB以下である。
上記の評価1と同様にして、積層体に対して、衝撃試験として、ペンドロップ試験を行った。表7に、ガラス基材に割れが生じなかった最大の試験高さを示す。なお、数値が大きいほど、耐衝撃性が高いことを示す。
上記の評価1と同様にして、動的屈曲試験を行い、耐屈曲性を評価した。この際、(a)温度23℃、(b)温度60℃湿度90%RH、(c)温度-20℃の3つの条件で、動的屈曲試験を行った。
2 … ガラス基材
3 … 接合層
4 … ハードコートフィルム
5 … 基材層
6 … ハードコート層
7 … 反射防止層
10 … 第2の接合層
11 … 保護フィルム
12 … 樹脂基材
13 … 粘着層
14 … 第2のハードコート層
30 … 表示装置
31 … 表示パネル
Claims (16)
- ガラス基材と、接合層と、ハードコートフィルムと、をこの順に有し、
前記ハードコートフィルムが、前記接合層側から、基材層と、ハードコート層とを有し、
前記接合層は、前記ガラス基材と前記基材層とを接合する層であり、
前記ガラス基材の厚さが10μm以上100μm以下であり、
前記ハードコート層の厚さをA、前記基材層の厚さをB、前記接合層の厚さをCとしたとき、Cに対する(A+B)の比が3.0以上500以下である、積層体。 - ハードコート層と、基材層と、接合層と、ガラス基材と、第2の接合層と、をこの順に有する積層体であって、
前記接合層は、前記ガラス基材と前記基材層とを接合する層であり、
前記第2の接合層は、前記積層体と他の部材とを接合する層であり、
前記ガラス基材の厚さが10μm以上100μm以下であり、
下記式(1)を満たす、積層体。
0.001≦{(E1×D1 2+E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (1)
(上記式(1)中、E1は前記ハードコート層の複合弾性率(GPa)、D1は前記ハードコート層の厚さ(mm)、E2は前記基材層の複合弾性率(GPa)、D2は前記基材層の厚さ(mm)、E3は前記接合層の複合弾性率(GPa)、D3は前記接合層の厚さ(mm)、E4は前記ガラス基材の複合弾性率(GPa)、D4は前記ガラス基材の厚さ(mm)、E5は前記第2の接合層の貯蔵弾性率(GPa)、D5は前記第2の接合層の厚さ(mm)を示す。) - 基材層と、接合層と、ガラス基材と、第2の接合層と、をこの順に有する積層体であって、
前記接合層は、前記ガラス基材と前記基材層とを接合する層であり、
前記第2の接合層は、前記積層体と他の部材とを接合する層であり、
前記ガラス基材の厚さが10μm以上100μm以下であり、
下記式(2)を満たす、積層体。
0.001≦{(E2×D2 2+E3×D3 2)×E4×D4 2×E5×1000}/D5≦3.0 (2)
(上記式(2)中、E2は前記基材層の複合弾性率(GPa)、D2は前記基材層の厚さ(mm)、E3は前記接合層の複合弾性率(GPa)、D3は前記接合層の厚さ(mm)、E4は前記ガラス基材の複合弾性率(GPa)、D4は前記ガラス基材の厚さ(mm)、E5は前記第2の接合層の貯蔵弾性率(GPa)、D5は前記第2の接合層の厚さ(mm)を示す。) - 前記第2の接合層のガラス転移温度が-50℃以上30℃以下である、請求項2または請求項3に記載の積層体。
- 前記第2の接合層が、光学透明粘着剤を含有する、請求項2から請求項4までのいずれかの請求項に記載の積層体。
- 前記接合層の複合弾性率が1MPa以上6000MPa以下である、請求項1から請求項5までのいずれかの請求項に記載の積層体。
- 前記接合層のガラス転移温度が-40℃以上150℃以下である、請求項1から請求項6までのいずれかの請求項に記載の積層体。
- 前記基材層の複合弾性率が5.7GPa以上である、請求項1から請求項7までのいずれかの請求項に記載の積層体。
- 前記ガラス基材が化学強化ガラスである、請求項1から請求項8までのいずれかの請求項に記載の積層体。
- 前記接合層が、感圧接着層である、または感熱接着層である、または硬化型接着剤組成物の硬化物を含有する、請求項1から請求項9までのいずれかの請求項に記載の積層体。
- 前記接合層が、ポリエステル樹脂、ポリオレフィン樹脂、およびウレタン樹脂からなる群から選択される少なくとも1種を含有する、請求項1から請求項10までのいずれかの請求項に記載の積層体。
- 前記ハードコート層の前記基材層とは反対の面側に反射防止層を有する、請求項1から請求項11までのいずれかの請求項に記載の積層体。
- 前記積層体の前記ガラス基材側の面が外側、前記積層体の前記ハードコート層側の面が内側となり、かつ、前記積層体の対向する辺部の間隔が10mmとなるように前記積層体を180°折り曲げる動作を20万回繰り返し行った場合に、割れ、破断、または剥がれが生じない、請求項1から請求項12までのいずれかの請求項に記載の積層体。
- 前記ハードコート層の前記基材層とは反対の面側に保護フィルムを有する、請求項1から請求項13までのいずれかの請求項に記載の積層体。
- 表示パネルと、
前記表示パネルの観察者側に配置された、請求項1から請求項14までのいずれかの請求項に記載の積層体と、
を備え、前記積層体は、前記ガラス基材側の面が前記表示パネルに隣接するように配置されている、表示装置。 - フォルダブルディスプレイである、請求項15に記載の表示装置。
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WO2024014458A1 (ja) * | 2022-07-13 | 2024-01-18 | 大日本印刷株式会社 | 光学フィルム、光学作用フィルム、易接着性フィルム、光学積層体、表面板、画像表示装置および偏光板 |
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