WO2022089041A1 - 包边式散热片及电子设备 - Google Patents

包边式散热片及电子设备 Download PDF

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Publication number
WO2022089041A1
WO2022089041A1 PCT/CN2021/117751 CN2021117751W WO2022089041A1 WO 2022089041 A1 WO2022089041 A1 WO 2022089041A1 CN 2021117751 W CN2021117751 W CN 2021117751W WO 2022089041 A1 WO2022089041 A1 WO 2022089041A1
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layer
edge
wrapped
filling
bonding
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PCT/CN2021/117751
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English (en)
French (fr)
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钟镭
靳林芳
陈丘
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华为技术有限公司
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Publication of WO2022089041A1 publication Critical patent/WO2022089041A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

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  • the present application relates to the field of heat dissipation of electronic devices, and in particular, to an edge-wrapped heat sink that can be used for heat dissipation of electronic devices and an electronic device including the heat sink.
  • thermally conductive graphite sheets are often used for heat dissipation of electronic devices due to their good thermal conductivity.
  • the thermally conductive graphite sheet needs to be processed before application, and the current main processing methods include back glue processing, lamination processing and edge wrapping processing.
  • thermally conductive graphite sheet in order to better adhere to the integrated circuits and electronic component circuit boards, it is necessary to carry out adhesive processing on the surface of the thermally conductive graphite sheet, which can be divided into two processing methods: double-sided adhesive and single-sided adhesive. Because some electronic products require insulation in circuit design, and the thermally conductive graphite sheet itself is conductive, it is necessary to perform film coating processing on the surface of the thermally conductive graphite sheet to achieve insulation on the surface of the thermally conductive graphite sheet after coating. The conductive graphite sheet needs to be cut into the required size after coating, but the edge of the thermal conductive graphite sheet is prone to powder drop and fracture during the die-cutting process.
  • FIG. 1a and 1b show the structure of an edge-wrapped heat sink according to the prior art, which includes a heat-dissipating base layer 10 and a first edge-wrapping layer 20 and a second edge-wrapping layer 20 located on both sides of the heat-dissipating base layer 10 in the thickness direction
  • the edging layer 30 .
  • the heat dissipation base layer 10 is a single-layer graphite layer
  • the first edge wrapping layer 20 is a PET layer
  • the second edge wrapping layer 30 is a double-sided adhesive layer.
  • the first edge wrapping layer 20 and the second edge wrapping layer 30 wrap the heat dissipation base layer 10 in a manner of sealing the peripheral edge of the heat dissipation base layer 10 .
  • Figures 2a and 2b show the structure of another edging type heat sink according to the prior art, which includes a heat dissipation base layer 10 and a first edge cladding layer 20 and a first edge cladding layer 20 located on both sides of the heat dissipation base layer 10 in the thickness direction.
  • the second wrapping layer 30 The heat dissipation base layer 10 includes a first heat dissipation layer 101 and a second heat dissipation layer 102 made of graphite and a double-sided adhesive layer 103 between the two heat dissipation layers.
  • the first edge wrapping layer 20 is a PET layer
  • the second edge wrapping layer 30 is the double-sided adhesive layer.
  • the first edge wrapping layer 20 and the second edge wrapping layer 30 wrap the heat dissipation base layer 10 by enclosing the peripheral portions of the first heat dissipation layer 101 and the second heat dissipation layer 102 of the heat dissipation base layer 10 .
  • the double-sided adhesive layer 103 of the heat dissipation base layer 10 protrudes from the periphery of the two layers of graphite layers, and the protruding part of the double-sided adhesive layer 103 extends to both the first edge wrapping layer 20 and the second edge wrapping layer 30 .
  • the first edge wrapping layer 20, the second edge wrapping layer 30 and the protruding parts of the double-sided adhesive layer 103 are pressed together to form a bonded closed state. It can be seen from the edging type heat sink in the assembled state shown in FIG. 2b that although the double-sided adhesive layer 103 of the heat dissipation base layer 10 is filled with the first edging layer 20 and the second edging layer 30, the two are not joined.
  • the effective bonding area between the first edging layer 20 and the second edging layer 30 is still small, and the first edging layer There is still a large gap S between the unjoined parts of the edge layer 20 and the second edge cladding layer 30, so the part with the gap S is subjected to stress, and the defect that the part is easy to crack or generate air bubbles still exists.
  • the edging structure shown in FIG. 2a and FIG. 2b is only applicable to the edging of the heat dissipation base layer 10 of the multi-layer laminated structure, and the scope of application is limited.
  • an edge-wrapped heat sink which can effectively increase the bonding area between the two edge-wrapped layers of the edge-wrapped structure, and greatly reduce the remaining space between the unbonded parts of the two edge-wrapped layers. Thereby reducing the risk of cracking or generating air bubbles at the joint part of the edging layer after being stressed.
  • An electronic device including the edge-wrapped heat sink is also proposed.
  • embodiments of the present application provide an edge-wrapped heat sink, the heat sink includes a heat dissipation base layer and an edge-wrapped structure surrounding the heat-dissipation base layer, and the edge-wrapped structure includes:
  • a first edge wrapping layer which is located on one side of the heat dissipation base layer in the thickness direction of the heat sink and includes a first main body part overlapping with the heat dissipation base layer and a first main body part extending from the first main body part. joint;
  • a second edge cladding layer which is located on the other side of the heat dissipation base layer in the thickness direction and includes a second body portion overlapping with the heat dissipation base layer and a second joint portion extending from the second body portion ;as well as
  • the first engaging portion and the second engaging portion are engaged together in a spatial manner.
  • the entire thickness of the filling and bonding layer is the same.
  • the filling and bonding layer is formed in a stepped structure whose thickness increases from the outer peripheral side toward the inner peripheral side.
  • the thickness of the filling and bonding layer gradually increases from the outer peripheral side toward the inner peripheral side.
  • the filler-bonding layer in a cross-section of the filler-bonding layer, the filler-bonding
  • the contour lines on both sides in the thickness direction of the layer are straight lines and/or curved lines.
  • the maximum thickness of the filling and bonding layer is less than or equal to the The thickness of the heat sink base.
  • the filling and bonding layer in the thickness direction, has The center position is aligned with the center position of the heat dissipation base layer.
  • the heat dissipation base layer has a single-layer structure or has a multi-layer stack structure.
  • the first edging layer and the second enveloping layer At least one of the side layers is an adhesive layer.
  • the filling and bonding layer is a double-sided adhesive layer, so that The filling bonding layer is bonded with the first bonding portion of the first edging layer and the second bonding portion of the second edging layer.
  • embodiments of the present application further provide an electronic device, where the electronic device includes the edge-wrapped heat sink described in the first aspect or any one of the possible implementation methods of the first aspect above.
  • the present application provides a new type of edging type heat sink, which includes a heat dissipation base layer, a first edge cladding layer and a second edge cladding layer located on both sides of the heat dissipation base layer in the thickness direction, and a joint for bonding
  • the filling and bonding layers of the two edging layers, the first edging layer and the second edging layer extending from the peripheral edge of the heat dissipation base layer are joined to each other through the filling and bonding layers, and the filling and bonding layers can fill the two edgings at the same time.
  • the space between the junctions of the layers is not limited to the space between the junctions of the layers.
  • the edging type heat sink according to the present application can effectively increase the joint area between the joint parts of the two edging layers, greatly reduce the gap left after the joint parts of the two edging layers are joined, and enhance the edging Structural strength of the structure, thereby reducing the risk of cracking or bubble generation at the joints of the edging layer after being stressed.
  • the wrapping structure of the wrapping heat sink according to the present application is suitable for a heat dissipation base layer having a single-layer or multi-layer structure, and has a wide range of applications.
  • the present application also provides an electronic device including the above-mentioned edge-wrapped heat sink.
  • Fig. 1a is a schematic cross-sectional view showing an edge-wrapped heat sink according to the prior art in a disassembled state
  • Fig. 1b is a cross-sectional schematic view showing the edge-wrapped heat sink in Fig. 1a in an assembled state .
  • Fig. 2a is a schematic cross-sectional view showing another edging type heat sink according to the prior art in a disassembled state
  • Fig. 2b is a cross-sectional view showing the edging type heat sink in Fig. 2a in an assembled state Schematic.
  • Fig. 3a is a schematic cross-sectional view showing an edge-wrapped heat sink according to an exemplary embodiment of the present application in a disassembled state
  • Fig. 3b is a schematic view showing the edge-wrapped heat sink in Fig. 3a in an assembled state Cutaway schematic.
  • Fig. 4a is a schematic cross-sectional view showing an edge-wrapped heat sink according to another exemplary embodiment of the present application in an exploded state
  • Fig. 4b is a schematic view showing the edge-wrapped heat sink in an assembled state in Fig. 4a Cutaway schematic.
  • Fig. 5a is a cross-sectional view showing a filled bonding layer of the edge-wrapped heat sink in Fig. 4a;
  • Fig. 5b is a cross-sectional view showing a first modification of the filled bonding layer;
  • Fig. 5c is a cross-sectional view showing a filled bonding layer Figure 5d is a cross-sectional view showing a third modification of the filling bonding layer;
  • Figure 5e is a cross-sectional view showing a fourth modification filling the bonding layer;
  • Fig. 5h is a cross-sectional view showing a seventh modification of the filled bonding layer.
  • the "thickness direction” refers to the thickness direction of the entire edging type heat sink.
  • “filling up” not only includes the case where the filling bonding layer completely fills the space between the bonding parts of the two edging layers without any residue, but also includes the possibility that the filling bonding layer can be understood by those skilled in the art due to filling the bonding layer. Influenced by factors such as the size, shape and processing means, the filling bonding layer does not completely fill the space between the bonding parts of the two edge wrapping layers, but fills most of the space.
  • the filling and bonding layer filling the space between the first bonding portion and the second bonding portion is not limited to completely filling the space, and the filling bonding layer can fill the first bonding portion. At least 80%, preferably at least 90%, of the space between the junction and the second junction is filled.
  • an edge-wrapped heat sink includes a heat-dissipating base layer 1 and an edge-wrapping structure for wrapping the heat-dissipating base layer 1 .
  • the heat dissipation base layer 1 has a single-layer structure and includes graphite, and the heat dissipation base layer 1 has a sheet shape extending in a planar form.
  • the hemming structure includes a first hemming layer 2 , a second hemming layer 3 and a filling bonding layer 4 which are joined to each other.
  • the entire first hemming layer 2 has the same thickness and is made of, for example, PET.
  • the first edge cladding layer 2 is located on one side of the heat dissipation base layer 1 in the thickness direction T (the upper side in FIGS. 3 a and 3 b ).
  • the first edge wrapping layer 2 includes a first main body portion 21 overlapping with the heat dissipation base layer 1 and a first joint portion 22 extending from the first main body portion 21 (or the peripheral portion of the heat dissipation base layer 1 ).
  • the thickness of the entire second edge wrapping layer 3 is the same and is, for example, a double-sided adhesive layer.
  • the second edge cladding layer 3 is located on the other side of the heat dissipation base layer 1 in the thickness direction T (the lower side in FIGS. 3 a and 3 b ).
  • the second edge cladding layer 3 includes a second main body portion 31 overlapping with the heat dissipation base layer 1 and a second joint portion 32 extending from the second main body portion 31 (or the peripheral edge portion of the heat dissipation base layer 1 ).
  • the first bonding portions 22 are opposed to each other in the thickness direction T so that the two can be bonded together via the filling bonding layer 4 .
  • the thickness of the entire filling bonding layer 4 is the same and the thickness of the filling bonding layer 4 is slightly smaller than that of the heat dissipation base layer 1 .
  • the filling bonding layer 4 is a double-sided adhesive layer, and the filling bonding layer 4 is located between the first bonding portion 22 and the second bonding portion 32 in the thickness direction T. As shown in FIG. When the first bonding portion 22 of the first edging layer 2 and the second bonding portion 32 of the second edging layer 3 are bonded together via the filling bonding layer 4, the bonding layer 4 is filled to fill the first bonding portion 22 and the second bonding portion 32. The first body portion 21 and the second body portion 31 are bonded together in the manner of the space between the joint portions 32 .
  • the first edging layer 2 and the first edging layer 2 and the second edging structure of the edging structure of the heat sink in this embodiment becomes larger, and there is almost no gap between the first joining part 22 of the first edging layer 2 and the second joining part 32 of the second edging layer 3 after they are joined, so that the effective The strength of the junction between the first edging layer 2 and the second edging layer 3 is enhanced, and the risk of easy rupture and generation of air bubbles and the like under stress is reduced.
  • the center position of the filling bonding layer 4 in the thickness direction T and the center position of the heat dissipation base layer 1 in the thickness direction T are in the thickness direction T. are aligned in the direction T, and the outer peripheries of the first hemming layer 2 , the second hemming layer 3 and the filling bonding layer 4 are aligned with each other. In this way, the overall shape of the entire edge-wrapped heat sink is more flat and tidy.
  • the basic structure of the edge-wrapped heat sink according to another exemplary embodiment of the present application is roughly the same as that of the above-mentioned edge-wrapped heat sink according to an exemplary embodiment of the present application. The same, the following will mainly focus on the differences between the two.
  • the thickness of the entire filling and bonding layer 4 is not the same.
  • the filling bonding layer 4 includes an outer peripheral portion 41 and an inner peripheral portion 42 that are formed integrally.
  • the thickness of the outer peripheral portion 41 is uniform and the thickness of the inner peripheral portion 42 is uniform.
  • the portion 42 forms a stepped structure.
  • the filling engaging portion having the above-mentioned structure can still be engaged with the first engaging portion 22 and the second engaging portion 32 in such a manner as to fill the space between the first engaging portion 22 and the second engaging portion 32, whereby according to the present invention
  • the edge-wrapped heat sink of another exemplary embodiment of the application has the same effect as that of the edge-wrapped heat sink according to an exemplary embodiment of the present application.
  • FIG. 5 a shows the structure of the filling bonding layer 4 of the edge-wrapped heat sink according to another exemplary embodiment of the present application.
  • Figures 5b to 5h show seven variants of the filled bonding layer.
  • the outer peripheral portion 41 of the filling bonding layer 4 in FIG. 5b has the same structure as the outer peripheral portion 41 of the filling bonding layer 4 in FIG. 5a, but the The thickness of the inner peripheral portion 42 of the filling bonding layer 4 gradually increases from the outer peripheral side toward the inner peripheral side (from the left toward the right in FIG. 5 b ). Further, in the cross section of the filling bonding layer 4 shown in FIG.
  • the contour lines on both sides of the thickness direction of both the outer peripheral portion 41 and the inner peripheral portion 42 of the filling bonding layer 4 are straight lines, so the filling bonding layer
  • the outer peripheral portion 41 of 4 is formed in a rectangular shape, and the inner peripheral portion 42 is formed in a horizontal isosceles trapezoid shape.
  • the thickness of the entire filling bonding layer 4 is gradually increased from the outer peripheral side toward the inner peripheral side (from the left side toward the right side in FIG. 5 c ). Further, in the cross-section of the filling and bonding layer 4 shown in FIG. 5 c , the contour lines on both sides of the filling and bonding layer 4 in the thickness direction are straight lines, so the filling and bonding layer 4 is formed in a horizontal isosceles triangle shape as a whole. .
  • the thickness of the entire filling bonding layer 4 is gradually increased from the outer peripheral side toward the inner peripheral side (from the left side toward the right side in FIG. 5d ). Further, in the cross section of the filling and bonding layer 4 shown in FIG. 5d , the contour lines of the filling and bonding layer 4 on both sides in the thickness direction are arcs, so the filling and bonding layer 4 is formed as a horizontal arc side as a whole. Isosceles triangle shape. In the fourth modification shown in FIG. 5e, the thickness of the entire filling bonding layer 4 gradually increases from the outer peripheral side toward the inner peripheral side (from the left side toward the right side in FIG. 5e).
  • the contour lines on both sides of the filling and bonding layer 4 in the thickness direction are straight lines, so the filling and bonding layer 4 is formed in a horizontal isosceles trapezoid shape as a whole. .
  • the thickness of the entire filling bonding layer 4 is gradually increased from the outer peripheral side toward the inner peripheral side (from the left side toward the right side in FIG. 5f ). Further, in the cross section of the filling and bonding layer 4 shown in FIG. 5f , the contour lines of the filling and bonding layer 4 on both sides in the thickness direction are arcs, so the filling and bonding layer 4 is formed as a transverse arc side as a whole. The isosceles trapezoid shape of the sides.
  • the thickness of the entire filling bonding layer 4 is gradually increased from the outer peripheral side toward the inner peripheral side (from the left side toward the right side in FIG. 5g ). Further, in the cross section of the filling and bonding layer 4 shown in FIG. 5g , the outlines of the filling and bonding layer 4 on both sides in the thickness direction are straight lines, and the filling and bonding layer 4 is formed as a transverse right-angled trapezoid as a whole.
  • the thickness of the entire filling bonding layer 4 is gradually increased from the outer peripheral side toward the inner peripheral side (from the left side toward the right side in FIG. 5h).
  • the contour line of the filling bonding layer 4 on one side in the thickness direction (the upper side in the figure) is an arc
  • the contour line on the other side in the thickness direction (the upper side in the figure) is an arc.
  • the contour line of the lower side) is a straight line
  • the filling and bonding layer 4 is formed as a whole in a right-angled trapezoid shape with one side of the horizontal side being an arc.
  • the edging structure according to the present application is applied to the edging of the heat dissipation base layer 1 having a single-layer structure
  • the present application is not limited thereto. It can be understood that the edging technical solution of the present application can be applied to the edging of a heat dissipation base layer with a multi-layer structure, and can achieve the same effect.
  • the double-sided adhesive layer 103 may not protrude from the first heat dissipation layer 101 and the second heat dissipation layer 102 .
  • the double-sided adhesive layer 103 protrudes from the first heat dissipation layer 101 and the second heat dissipation layer 102 , between the first edge wrapping layer 20 and the double-sided tape layer 103 and between the second edge wrapping layer 30 and the double-sided tape between the layers 103.
  • a filled bonding layer 4 eg the filled bonding layer 4 of the variant in Fig. 5g and Fig. 5h
  • the filling bonding layer 4 may have a shape compatible with (similar in shape) to the gap between the first edge wrapping layer 20 and the double-sided adhesive layer 103 and the gap between the second edge wrapping layer 30 and the double-sided tape layer 103 .
  • the filling bonding layer 4 can fill the space between the first edging layer 2 and the second edging layer 3 at the same time as it is bonded to the joints of the first edging layer 2 and the second edging layer 3, The filling and bonding layer 4 can then have any shape.
  • the thickness of the filling bonding layer 4 increases from the outer peripheral side toward the inner peripheral side and the maximum thickness of the filling bonding layer 4 is not greater than the thickness of the heat dissipation base layer 1 , and in the cross section of the filling bonding layer 4 , the thickness of the filling bonding layer 4 is The contour lines in the thickness direction T are straight and/or curved.
  • the material filling the bonding layer 4 may be a material that will not deform and overflow during the bonding process, and the material should not affect the performance of the product.
  • the filling and bonding layer in the present application makes the hemming structure thicker, and the filling and bonding layer is an independent part, and the material includes but not limited to double-sided tape, which acts as a spacer.
  • the materials of the first edge wrapping layer 2 , the second edge wrapping layer 3 and the filling and bonding layer 4 may be materials with double-sided adhesive/single-sided adhesive/non-adhesive.
  • the thicknesses of the respective joint portions 22 and 23 of the first edging layer 2 and the second edging layer 3 can be changed to match the filling of the joint layer 4. to better achieve the effect of this application.
  • the technical solution of the present application is applicable to a wider thickness range (20 ⁇ m to 200 ⁇ m) of the heat dissipation base layer 1, even more than 200 ⁇ m. Since the filling bonding layer 4 is arranged between the two edging layers 2 and 3 according to the edging structure of the present application, regardless of the thickness of the heat dissipation base layer 1 , the bonding strength of the joint of the two edging layers 2 and 3 can be guaranteed. , to avoid the risk of peeling and cracking. In addition, for products such as graphite sheets that need to be wrapped, when the width of the wrapping is limited, the bonding strength is improved and the risk of cracking of the product wrapping is reduced.
  • the edging structure of the present application can be applied to artificial graphite heat dissipation films, metal films, insulating films, etc., and the edging type heat sink formed by such a technology can be applied to heat dissipation of heating devices in electronic devices such as mobile phones , the present application also provides an electronic device, which includes an edge-wrapped heat sink with the above structure.
  • the gap between the bonding portion 32 and the filled bonding layer 4 does not actually exist, but the gap appears to exist only for the reason of the illustration.
  • the filled bonding layer 4 having the stepped shape fills the first bonding portion 22 and the second bonding portion 32
  • the filling bonding layer 4 may be connected with the first bonding portion 22 and the second bonding portion 32 .

Abstract

本申请涉及一种包边式散热片及电子设备。该包边式散热片包括散热基层、在厚度方向上位于散热基层两侧的第一包边层和第二包边层以及用于接合两个包边层的填充接合层，第一包边层和第二包边层从散热基层的周缘部伸出的接合部经由填充接合层彼此接合的同时，填充接合层能够充满两个包边层的接合部之间的空间。这样，根据本申请的包边式散热片能够有效增大两个包边层的接合部之间的接合面积，大幅减小两个包边层的接合部接合之后留下的空隙，增强包边结构的结构强度，从而降低包边层的接合部位受到应力作用之后容易裂开或产生气泡的风险。而且，本申请的包边式散热片的包边结构适用于具有单层或多层结构的散热基层，适用范围广。

Description

包边式散热片及电子设备
本申请要求于2020年10月26日提交中国专利局、申请号为202011157507.X、发明名称为“包边式散热片及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备的散热领域，尤其涉及一种能够用于电子设备散热的包边式散热片及包括该散热片的电子设备。
背景技术
当今，电子设备中使用的电子器件的工作功率越来越大，发热量随之增大，电子器件的散热成为重要问题。在现有技术中，由于导热石墨片具有良好的导热性能，因而经常被用于电子设备的散热。导热石墨片在应用之前需要进行加工处理，目前的主要加工方式包括背胶加工、覆膜加工和包边加工。
具体地，为了能更好粘附到集成电路及电子元件电路板，需在导热石墨片的表面进行背胶加工，可分为双面背胶和单面背胶两种加工方式。因为一些电子产品在电路设计中需要绝缘，而导热石墨片本身是导电的，因而需要在导热石墨片的表面进行覆膜加工处理，以使得经过覆膜之后的导热石墨片的表面实现绝缘。导电石墨片在覆膜之后需要被裁切成所需尺寸，但是导热石墨片在模切过程中，边缘容易出现掉粉和断裂的现象。如果被用在电子产品内部进行热传导，掉落的石墨微粒较多，在使用的过程中会导致电子器件短路，从而可能导致电子器件的损坏，所以大多数导热石墨片在应用之前都需要进行包边加工。在对导电石墨片进行包边加工的过程中，现有的包边结构是利用两层包边层的周缘部接合在一起，使得导电石墨片的周缘部被包边结构封闭而不外露。
图1a和图1b示出了根据现有技术的一种包边式散热片的结构，其包括散热基层10以及在厚度方向上位于散热基层10的两侧的第一包边层20和第二包边层30。散热基层10为单层的石墨层，第一包边层20为PET层，第二包边层30为双面胶层。第一包边层20和第二包边层30以封闭散热基层10的周缘部的方式实现对散热基层10的包边。具体地，第一包边层20和第二包边层30两者的从散热基层10的周缘部伸出的部分之间添加胶粘剂并进行压合后，形成粘结封闭状态。从图1b所示的处于组装状态下的该包边式散热片可以看出，如果散热基层10的厚度较大，第一包边层20和第二包边层30彼此接合的面积较小，两者之间未接合的部分之间存在较大的空隙S，当存在空隙S的部分受到应力作用之后该部分容易裂开或产生气泡，从而影响生产加工和组装制造。
图2a和图2b示出了根据现有技术的另一种包边式散热片的结构，其包括散热基层10以及在厚度方向上位于散热基层10的两侧的第一包边层20和第二包边层30。散热基层10包括由石墨制成的第一散热层101和第二散热层102以及位于两层散热层 之间的双面胶层103，第一包边层20为PET层，第二包边层30为双面胶层。第一包边层20和第二包边层30以封闭散热基层10的第一散热层101和第二散热层102的周缘部的方式实现对散热基层10的包边。具体地，散热基层10的双面胶层103从两层石墨层的周缘部伸出，双面胶层103的伸出部分延伸到第一包边层20和第二包边层30两者的从散热基层10的周缘部伸出的部分之间，通过对第一包边层20和第二包边层30以及双面胶层103的伸出部分压合后，形成粘结封闭状态。从图2b所示的处于组装状态下的该包边式散热片可以看出，虽然散热基层10的双面胶层103填充了第一包边层20和第二包边层30两者未接合的部分之间的空隙S的一部分，但是与图1a和图1b所示的结构相比，第一包边层20和第二包边层30之间的有效接合面积仍然较小，第一包边层20和第二包边层30两者未接合的部分之间仍然存在较大的空隙S，因而存在空隙S的部分受到应力作用之后该部分容易裂开或产生气泡的缺陷依然存在。而且图2a和图2b中所示的包边结构仅适用于多层层叠结构的散热基层10的包边，适用范围受限。
发明内容
有鉴于此，提出了一种包边式散热片，其能够有效增大包边结构的两个包边层之间的接合面积，大幅减小两个包边层的未接合部位之间留下的空隙，从而降低包边层的接合部位受到应力作用之后容易裂开或产生气泡的风险。还提出了一种包括该包边式散热片的电子设备。
第一方面，本申请的实施例提供了一种包边式散热片，所述散热片包括散热基层以及包围所述散热基层的包边结构，所述包边结构包括：
第一包边层，其在所述散热片的厚度方向上位于所述散热基层的一侧且包括与所述散热基层重叠的第一主体部和从所述第一主体部延展出的第一接合部；
第二包边层，其在所述厚度方向上位于所述散热基层的另一侧且包括与所述散热基层重叠的第二主体部和从所述第二主体部延展出的第二接合部；以及
填充接合层，其在所述厚度方向上位于所述第一接合部和所述第二接合部之间，所述填充接合层以充满所述第一接合部和所述第二接合部之间的空间的方式与所述第一接合部和所述第二接合部接合在一起。
根据第一方面，在所述包边式散热片的第一种可能的实现方式中，整个所述填充接合层的厚度相同。
根据第一方面，在所述包边式散热片的第二种可能的实现方式中，所述填充接合层形成为厚度从外周侧朝向内周侧增大的阶梯结构。
根据第一方面，在所述包边式散热片的第三种可能的实现方式中，所述填充接合层的厚度从外周侧朝向内周侧逐渐增大。
根据第一方面的第二种或第三种可能的实现方式，在所述包边式散热片的第四种可能的实现方式中，在所述填充接合层的横截面中，所述填充接合层的厚度方向两侧的轮廓线为直线和/或曲线。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在所述包边式散热片的第五种可能的实现方式中，所述填充接合层的最大厚度小于或等于所述散热基层 的厚度。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在所述包边式散热片的第六种可能的实现方式中，在所述厚度方向上,所述填充接合层的中心位置与所述散热基层的中心位置对齐。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在所述包边式散热片的第七种可能的实现方式中，所述散热基层具有单层结构或者具有多层层叠结构。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在所述包边式散热片的第八种可能的实现方式中，所述第一包边层和所述第二包边层中的至少一层为带胶层。
根据第一方面，或以上第一方面的任意一种可能的实现方式，在所述包边式散热片的第九种可能的实现方式中，所述填充接合层为双面带胶层，使得所述填充接合层与所述第一包边层的第一接合部和所述第二包边层的第二接合部粘结在一起。
第二方面，本申请的实施例还提供了一种电子设备，所述电子设备包括第一方面或以上第一方面的任意一种可能的实现方法所述的包边式散热片。
通过采用上述技术方案，本申请提供了一种新型的包边式散热片，其包括散热基层、在厚度方向上位于散热基层两侧的第一包边层和第二包边层以及用于接合两个包边层的填充接合层，第一包边层和第二包边层从散热基层的周缘部伸出的接合部经由填充接合层彼此接合的同时，填充接合层能够充满两个包边层的接合部之间的空间。这样，根据本申请的包边式散热片能够有效增大两个包边层的接合部之间的接合面积，大幅减小两个包边层的接合部接合之后留下的空隙，增强包边结构的结构强度，从而降低包边层的接合部位受到应力作用之后容易裂开或产生气泡的风险。而且，根据本申请的包边式散热片的包边结构适用于具有单层或多层结构的散热基层，适用范围广。另外，本申请还提供了一种包括上述包边式散热片的电子设备。
本申请的这些和其他方面在以下(多个)实施例的描述中会更加简明易懂。
附图说明
包含在说明书中并且构成说明书的一部分的附图与说明书一起示出了本申请的示例性实施例、特征和方面，并且用于解释本申请的原理。
图1a是示出了根据现有技术的一种包边式散热片在分解状态下的剖视示意图；图1b是示出了图1a中的包边式散热片在组装状态下的剖视示意图。
图2a是示出了根据现有技术的另一种包边式散热片在分解状态下的剖视示意图；图2b是示出了图2a中的包边式散热片在组装状态下的剖视示意图。
图3a是示出了根据本申请的一示例性实施例的包边式散热片在分解状态下的剖视示意图；图3b是示出了图3a中的包边式散热片在组装状态下的剖视示意图。
图4a是示出根据本申请的另一示例性实施例的包边式散热片在分解状态下的剖视示意图；图4b是示出了图4a中的包边式散热片在组装状态下的剖视示意图。
图5a是示出了图4a中的包边式散热片的填充接合层的截面图；图5b是示出了填充接合层的第一变型例的截面图；图5c是示出了填充接合层的第二变型例的截面图；图5d是示出了填充接合层的第三变型例的截面图；图5e是示出了填充接合层的第四 变型例的截面图；图5f是示出了填充接合层的第五变型例的截面图；图5g是示出了填充接合层的第六变型例的截面图；图5h是示出了填充接合层的第七变型例的截面图。
附图标记说明
10散热基层 101第一散热层 102第二散热层 103双面胶层 20第一包边层 30第二包边层 S空隙
1散热基层 2第一包边层 21第一主体部 22第一接合部 3第二包边层 31第二主体部 32第二接合部 4填充接合层 41外周部 42内周部
T厚度方向。
具体实施方式
以下将参考附图详细说明本申请的各种示例性实施例、特征和方面。附图中相同的附图标记表示功能相同或相似的元件。尽管在附图中示出了实施例的各种方面，但是除非特别指出，不必按比例绘制附图。
在这里专用的词“示例性”意为“用作例子、实施例或说明性”。这里作为“示例性”所说明的任何实施例不必解释为优于或好于其它实施例。
另外，为了更好的说明本申请，在下文的具体实施方式中给出了众多的具体细节。本领域技术人员应当理解，没有某些具体细节，本申请同样可以实施。在一些实例中，对于本领域技术人员熟知的方法、手段、元件未作详细描述，以便于凸显本申请的主旨。
在本申请中，如无其它说明，“厚度方向”是指包边式散热片整体的厚度方向。另外，在本申请中，“充满”不仅包括填充接合层毫无剩余地完全填充两个包边层的接合部之间的空间的情况，而且包括本领域技术人员能够理解的可能由于填充接合层的尺寸、形状以及加工手段等因素影响，导致填充接合层未完全填充两个包边层的接合部之间的空间而填充了该空间的绝大部分的情况。因此，可以理解，在本申请中，所述填充接合层充满所述第一接合部和所述第二接合部之间的空间不限于完全充满该空间，可以是填充接合层充填第一接合部和第二接合部之间的空间的至少80％，优选地，充填至少90％。
以下结合说明书附图说明本申请的一示例性实施例的包边式散热片的具体结构。
(本申请的一示例性实施例的包边式散热片的结构)
如图3a和图3b所示，根据本申请的一示例性实施例的包边式散热片包括散热基层1以及实现对散热基层1包边的包边结构。
在本实施例中，散热基层1具有单层结构并且包括石墨，散热基层1具有以平面形式延展的片状。
在本实施例中，包边结构包括彼此接合在一起的第一包边层2、第二包边层3和填充接合层4。
具体地，整个第一包边层2的厚度相同且由例如PET制成。第一包边层2在厚度方向T上位于散热基层1的一侧(图3a和图3b中的上侧)。第一包边层2包括与散热基层1重叠的第一主体部21和从第一主体部21(或者说散热基层1的周缘部)延展出的第一接合部22。
整个第二包边层3的厚度相同且例如为双面胶层。第二包边层3在厚度方向T上位于散热基层1的另一侧(图3a和图3b中的下侧)。第二包边层3包括与散热基层1重叠的第二主体部31和从第二主体部31(或者说散热基层1的周缘部)延展出的第二接合部32，第二接合部32与第一接合部22在厚度方向T上彼此相对，使得两者能够经由填充接合层4接合在一起。
整个填充接合层4的厚度相同并且填充接合层4的厚度比散热基层1的厚度略小。填充接合层4为双面胶层，并且填充接合层4在厚度方向T上位于第一接合部22和第二接合部32之间。当第一包边层2的第一接合部22和第二包边层3的第二接合部32经由填充接合层4接合在一起时，填充接合层4以充满第一接合部22和第二接合部32之间的空间的方式与第一主体部21和第二主体部31粘结在一起。这样，与如图1a和图1b以及图2a和图2b所示的现有的散热片的包边结构相比，本实施例中的散热片的包边结构的第一包边层2和第二包边层3彼此接合的面积变大，第一包边层2的第一接合部22和第二包边层3的第二接合部32接合之后两者之间几乎不存在空隙，从而有效增强了第一包边层2和第二包边层3两者的接合部位的强度，降低了在应力作用下易于破裂和产生气泡等的风险。
另外，如图3b所示，在处于组装状态下的该包边式散热片中，填充接合层4的在厚度方向T上的中心位置与散热基层1的在厚度方向T上的中心位置在厚度方向T上对齐，并且第一包边层2、第二包边层3和填充接合层4三者的外周缘彼此对齐。这样，有利于整个包边式散热片整体形状更平整和整齐。
以下结合说明书附图说明本申请的另一示例性实施例的包边式散热片的具体结构。
(本申请的另一示例性实施例的包边式散热片的结构)
如图4a和图4b所示，根据本申请的另一示例性实施例的包边式散热片的基本结构与上述的根据本申请的一示例性实施例的包边式散热片的基本结构大致相同，以下将主要针对两者之间的不同之处进行说明。
如图5a所示，在根据本申请的另一示例性实施例的包边式散热片中，整个填充接合层4的厚度并不完全相同。具体地，填充接合层4包括形成为一体的外周部41和内周部42。外周部41的厚度均一且内周部42的厚度均一，外周部41的厚度小于内周部42的厚度且内周部42的厚度小于或等于散热基层1的厚度，使得外周部41和内周部42形成台阶结构。
如图4b所示，当第一包边层2的第一接合部22和第二包边层3的第二接合部32经由该填充接合层4彼此接合时，第一接合部22和第二接合部32两者的靠外周侧的部分与填充接合层4的外周部41接合，第一接合部22和第二接合部32两者的靠内周侧的部分与填充接合层4的内周部42接合。因此，具有上述结构的填充接合部仍然能够以充满第一接合部22和第二接合部32之间的空间的方式与第一接合部22和第二接合部32接合在一起，由此根据本申请的另一示例性实施例的包边式散热片具有与根据本申请的一示例性实施例的包边式散热片同样的效果。
以下结合说明书附图说明本申请的另一示例性实施例的包边式散热片的填充接合层4的多个变型例。
(填充接合层的变型例的结构)
图5a中示出了根据本申请的另一示例性实施例的包边式散热片的填充接合层4的结构。图5b至图5h示出了填充接合层的七个变型例。
具体地，在图5b所示的第一变型例中，图5b中的填充接合层4的外周部41具有与图5a中的填充接合层4的外周部41同样的结构，但是图5b中的填充接合层4的内周部42的厚度从外周侧朝向内周侧(从图5b中的左侧朝向右侧)逐渐增大。进一步地，在图5b所示的填充接合层4的横截面中，填充接合层4的外周部41和内周部42两者的在厚度方向两侧的轮廓线均为直线，因而填充接合层4的外周部41形成为矩形形状，且内周部42形成为横置的等腰梯形形状。
在图5c所示的第二变型例中，填充接合层4整体的厚度从外周侧朝向内周侧(从图5c中的左侧朝向右侧)逐渐增大。进一步地，在图5c所示的填充接合层4的横截面中，填充接合层4的在厚度方向两侧的轮廓线均为直线，因而填充接合层4整体形成为横置的等腰三角形形状。
在图5d所示的第三变型例中，填充接合层4整体的厚度从外周侧朝向内周侧(从图5d中的左侧朝向右侧)逐渐增大。进一步地，在图5d所示的填充接合层4的横截面中，填充接合层4的在厚度方向两侧的轮廓线均为弧线，因而填充接合层4整体形成为横置的弧形边等腰三角形形状。在图5e所示的第四变型例中，填充接合层4整体的厚度从外周侧朝向内周侧(从图5e中的左侧朝向右侧)逐渐增大。进一步地，在图5e所示的填充接合层4的横截面中，填充接合层4的在厚度方向两侧的轮廓线均为直线，因而填充接合层4整体形成为横置的等腰梯形形状。
在图5f所示的第五变型例中，填充接合层4整体的厚度从外周侧朝向内周侧(从图5f中的左侧朝向右侧)逐渐增大。进一步地，在图5f所示的填充接合层4的横截面中，填充接合层4的在厚度方向两侧的轮廓线均为弧线，因而填充接合层4整体形成为横置的弧形侧边的等腰梯形形状。
在图5g所示的第六变型例中，填充接合层4整体的厚度从外周侧朝向内周侧(从图5g中的左侧朝向右侧)逐渐增大。进一步地，在图5g所示的填充接合层4的横截面中，填充接合层4的在厚度方向两侧的轮廓线均为直线，填充接合层4整体形成为横置的直角梯形形状。
在图5h所示的第七变型例中，填充接合层4整体的厚度从外周侧朝向内周侧(从图5h中的左侧朝向右侧)逐渐增大。进一步地，在图5h所示的填充接合层4的横截面中，填充接合层4的在厚度方向一侧(图中上侧)的轮廓线为弧线，在厚度方向另一侧(图中下侧)的轮廓线为直线，填充接合层4整体形成为横置的一侧边为弧形的直角梯形形状。
虽然在图5b至图5h中所示的变型例中的填充接合层4具有不同的形状，但是可以理解，在将这些填充接合层4应用于根据本申请的包边式散热片的情况下均能够实现与根据本申请的一实施例的包边式散热片同样的效果。
以上内容对本申请的具体实施方式的示例性实施例及相关的变型例进行了阐述，以下进行补充说明。
i.虽然在以上的具体实施方式中的示例性实施例说明了根据本申请的包边结构应用于具有单层结构的散热基层1的包边，但是本申请不限于此。可以理解，本申请 的包边技术方案可以应用于具有多层结构的散热基层的包边，并且能够实现同样的效果。
参照图2a和图2b，在例如散热基层具有两层的情况下，双面胶层103可以不突出于第一散热层101和第二散热层102。在双面胶层103从第一散热层101和第二散热层102突出的情况下，可以在第一包边层20和双面胶层103之间以及第二包边层30和双面胶层103之间分别设置一个填充接合层4(例如图5g和图5h中的变型例的填充接合层4)。填充接合层4可以具有与第一包边层20和双面胶层103之间的空隙以及第二包边层30和双面胶层103之间空隙相适应(形状类似)的形状。
ii.虽然在以上的示例性实施例及其变型例中说明了填充接合层4的多种具体实现方案，但是本申请不限于此。只要填充接合层4在与第一包边层2和第二包边层3两者的接合部接合在一起同时，能够充满第一包边层2和第二包边层3之间的空间，则填充接合层4可以具有任意的形状。优选地，填充接合层4的厚度从外周侧朝向内周侧增大并且填充接合层4的最大厚度不大于散热基层1的厚度，并且在填充接合层4的横截面中，填充接合层4的厚度方向T上的轮廓线为直线和/或曲线。
iii.虽然在以上的示例性实施例中没有明确说明，但是应当理解第一包边层2和第二包边层3中的至少一层为带胶层，从而有利于两个包边层2、3与填充接合层4之间的接合。另外，填充接合层4的材料可以是不会在接合过程中产生变形溢出的材料，该材料应当不会影响产品性能。实际上，本申请中的填充接合层使得包边结构加厚，该填充接合层为独立部件，材料包括但不限于与双面胶，起垫块作用。更进一步地，第一包边层2、第二包边层3和填充接合层4的材料可以为两面带胶/单面带胶/不带胶的材质。
iv.虽然在以上的示例性实施例中没有明确说明，但是应当理解，可以改变第一包边层2和第二包边层3各自的接合部22、23的厚度，从而配合填充接合层4来更好地实现本申请的效果。
v.虽然在以上的示例性实施例中没有明确说明，但是应当理解，与现有技术相比，本申请的技术方案适用散热基层1的厚度范围更广(20μm至200μm)，甚至超过200μm。由于根据本申请的包边结构在两层包边层2、3之间设置填充接合层4，因而无论散热基层1的厚度如何，都能够保证两层包边层2、3接合部位的接合强度，避免发生剥离开裂的风险。而且对石墨片等需要包边的产品，包边宽度受限较窄的情况下，提升接合强度，降低产品包边开裂风险。
vi.本申请的包边结构可以应用于人工石墨散热膜、金属薄膜、隔热膜等，而通过这样的技术形成的包边式散热片可以应用于例如手机的电子设备中的发热器件的散热，本申请还提供了一种电子设备，其包括具有如上结构的包边式散热片。
vii.另外，可以理解，在图1b中示出的第一包边层20和第二包边层30在周缘部之间的间隙以及在图3b中示出的第一接合部22和第二接合部32与填充接合层4之间的间隙实际上并不存在，仅是图示的原因看起来存在上述间隙。而且，在图4b中，具有阶梯形状的填充接合层4在填充第一接合部22和第二接合部32的情况下，该填充接合层4可能与第一接合部22和第二接合部32发生干涉(图中重叠的部分)，因而填充接合层4可以产生相应的变形并且/或者第一接合部22和第二接合部32可以 产生相应的变形，以使得填充接合层4与第一接合部22和第二接合部32的形状适配。
尽管在此结合各实施例对本申请进行了描述，然而，在实施所要求保护的本申请过程中，本领域技术人员通过查看附图、公开内容、以及所附权利要求书，可理解并实现所公开实施例的其它变化。在权利要求中，“包括”(comprising)一词不排除其他组成部分或步骤，“一”或“一个”不排除多个的情况。相互不同的从属权利要求中记载了某些措施，但这并不表示这些措施不能组合起来产生良好的效果。
以上已经描述了本申请的各实施例，上述说明是示例性的，并非穷尽性的，并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下，对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择，旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进，或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。

Claims (11)

  1. 一种包边式散热片，所述散热片包括散热基层以及包围所述散热基层的包边结构，其特征在于，所述包边结构包括：
    第一包边层，其在所述散热片的厚度方向上位于所述散热基层的一侧且包括与所述散热基层重叠的第一主体部和从所述第一主体部延展出的第一接合部；
    第二包边层，其在所述厚度方向上位于所述散热基层的另一侧且包括与所述散热基层重叠的第二主体部和从所述第二主体部延展出的第二接合部；以及
    填充接合层，其在所述厚度方向上位于所述第一接合部和所述第二接合部之间，所述填充接合层以充满所述第一接合部和所述第二接合部之间的空间的方式与所述第一接合部和所述第二接合部接合在一起。
  2. 根据权利要求1所述的包边式散热片，其特征在于，整个所述填充接合层的厚度相同。
  3. 根据权利要求1所述的包边式散热片，其特征在于，所述填充接合层形成为厚度从外周侧朝向内周侧增大的阶梯结构。
  4. 根据权利要求1所述的包边式散热片，其特征在于，所述填充接合层的厚度从外周侧朝向内周侧逐渐增大。
  5. 根据权利要求3或4所述的包边式散热片，其特征在于，在所述填充接合层的横截面中，所述填充接合层的厚度方向两侧的轮廓线为直线和/或曲线。
  6. 根据权利要求1至4中任一项所述的包边式散热片，其特征在于，所述填充接合层的最大厚度小于或等于所述散热基层的厚度。
  7. 根据权利要求1至4中任一项所述的包边式散热片，其特征在于，在所述厚度方向上,所述填充接合层的中心位置与所述散热基层的中心位置对齐。
  8. 根据权利要求1至4中任一项所述的包边式散热片，其特征在于，所述散热基层具有单层结构或者具有多层层叠结构。
  9. 根据权利要求1至4中任一项所述的包边式散热片，其特征在于，所述第一包边层和所述第二包边层中的至少一层为带胶层。
  10. 根据权利要求1至4中任一项所述的包边式散热片，其特征在于，所述填充接合层为双面带胶层，使得所述填充接合层与所述第一包边层的第一接合部和所述第二包边层的第二接合部粘结在一起。
  11. 一种电子设备，其特征在于，所述电子设备包括权利要求1至10中任一项所 述的包边式散热片。
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